JP2018192502A - Solder suction device - Google Patents

Abstract

To provide a solder suction device which enables a worker to cut a suction material without interrupting soldering work and enables improvement of workability of soldering.SOLUTION: A solder suction device includes a body 3, a box part 2, and a storage part 1. The box part 2 includes: a suction material protrusion port 3a oriented in a longitudinal direction of the body 3; a communication port 27 which allows the suction material protrusion port 3a and the outside of the box part 2 to communicate with each other through a communication passage 26; a roller 22 disposed between the suction material protrusion port 3a and the communication port 27; and a cutting mechanism 23 provided between the roller 22 and the suction material protrusion port 3a. The cutting mechanism 23 includes: a cutting mechanism internal communication passage 45 forming a part of the communication passage 26; a blade tool 42 provided at an end part of the cutting mechanism internal communication passage 45; a biasing member 43; and a protruding part 44. When the protruding part 44 is pushed into the box part 2, the suction material SB is cut by the blade tool 42.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a solder suction device that sucks excess solder in a soldered portion.

  For example, a cylindrical main body, a storage unit that is attached to one end of the main body and stores the suction material in a wound state, a guide groove that is provided at the other end of the main body and restricts the direction of the suction material, and a cylindrical main body A solder suction device including a suction material moving mechanism for moving the suction material and a blade portion disposed so as to be adjacent to the guide groove is disclosed (for example, see Patent Document 1).

  In the solder suction device described in Patent Document 1, the suction material is sent out from the front end portion of the main body by operating the suction material moving mechanism during the solder suction operation. When excess solder is sucked by the sucked material sent out, the suction material is cut by the blade portion.

JP-A-8-215835

  However, in the solder suction device described in Patent Document 1, when cutting the used suction material, the operator presses the sent suction material against the cutter plate and pushes the blade portion to cut the suction material. doing. For this reason, every time an attempt is made to cut the suction material, the soldering operation is interrupted and a cutting operation on the cutter plate is required, resulting in a problem that the soldering workability is lowered.

  The present invention has been made to solve such a problem, and a solder suction device capable of cutting a suction material without interrupting a soldering operation and improving the soldering workability. The issue is to provide.

  A solder suction device according to the present invention includes a rod-shaped main body, a box portion provided at one end of the main body, and a storage portion that is provided at the other end of the main body and stores the suction material in a wound state. In the solder suction device, the box portion includes a suction material protruding port oriented in a direction along the longitudinal direction of the main body, and a communication port for communicating the suction material protruding port and the outside of the box portion through a communication path. A roller disposed between the suction material projecting port and the communication port and partially projecting both inside and outside the communication path, and provided between the roller and the suction material projecting port. A cutting mechanism, and the cutting mechanism includes a cutting mechanism communication path that forms a part of the communication path, a cutting tool provided at an end of the cutting mechanism communication path, and the cutting tool. An urging member that pushes out the box portion toward the outside; A protrusion projecting outward from the box portion on the opposite side of the biasing member in a state of being biased by the biasing member, and when the projecting portion is pushed into the box portion In addition, the suction member is sandwiched between an end portion of the communication path in the cutting mechanism and an end portion of the communication path adjacent to the end portion, and is cut by the cutting tool.

  In the solder suction device according to the present invention, the box portion includes a suction material protrusion opening in a direction along the longitudinal direction of the main body, and a communication port for communicating the suction material protrusion and the outside of the box portion through the communication path. ing. With this configuration, the suction material stored in the storage portion enters the box portion from the communication port, passes through the communication passage, and protrudes from the suction material protruding port at the tip.

  In addition, the solder suction device according to the present invention includes a roller that is disposed between the suction material projecting port and the communication port and partially protrudes both inside and outside the communication path. With this configuration, the suction material passing through the communication path is sent out from the suction material protrusion by the rotation of the roller.

  Moreover, the solder suction device according to the present invention includes a cutting mechanism communication path that forms a part of the communication path, a cutting tool provided at an end of the cutting mechanism communication path, and the cutting tool toward the outside of the box section. An urging member to be pushed out and a protruding portion protruding outward from a box portion on the opposite side of the urging member in a state of being urged by the urging member. And a suction material is inserted | pinched between the edge part of the communicating path in a cutting mechanism, and the edge part of the communicating path adjacent to the edge part, and is cut | disconnected by a cutter.

  According to the present invention, it is possible to provide a solder suction device capable of cutting the suction material without interrupting the soldering operation and improving the soldering workability.

The perspective view of the solder suction device concerning the embodiment of the present invention. 1 is an exploded perspective view of a solder suction device according to an embodiment of the present invention. The perspective view of the roller of the solder suction device concerning the embodiment of the present invention. It is a perspective view of the cutting mechanism of the box part of the solder suction device concerning the embodiment of the present invention, and Drawing 4 (a) shows the state before cutting of the suction material by a cutting mechanism, and Drawing 4 (b) is a cutting. The state after cutting of the suction material by the mechanism is shown. It is sectional drawing of the cutting mechanism of the box part of the solder suction device which concerns on embodiment of this invention, Fig.5 (a) shows the state before cutting | disconnection of the suction material by a cutting mechanism, FIG.5 (b) is cutting | disconnection. FIG. 5C shows a state immediately before the suction material is cut by the mechanism, and FIG. 5C shows a state after the suction material is cut by the cutting mechanism. The perspective view of the solder suction device which concerns on the modification 1 which comprised the guide ring of the 1st housing of the solder suction device which concerns on embodiment of this invention with the cylindrical guide. It is a fragmentary sectional view of the cutting mechanism of the box part of the solder suction device concerning the modification 2 which constituted the cutting mechanism of the box part of the solder suction device concerning the embodiment of the present invention by the cutting mechanism of other structures, and is shown in FIG. FIG. 7A shows a state before the suction material is cut by the cutting mechanism, and FIG. 7B shows a state after the suction material is cut by the cutting mechanism. And FIG. 8 is a partial perspective view of the box mechanism of the solder suction device according to Modification 2 in which the cutting mechanism of the box portion of the solder suction device according to the embodiment of the present invention is configured by a cutting mechanism of another structure. FIG. 8 (b) shows a state immediately before the cutting of the suction material by the cutting mechanism, and FIG. 8 (c) shows the state of the suction material by the cutting mechanism. The state after cutting is shown. The perspective view of the roller of the solder suction apparatus concerning the modification 3 which comprised the roller of the box part of the solder suction apparatus which concerns on embodiment of this invention with the roller of another structure. The perspective view of the roller of the solder suction apparatus which concerns on the modification 4 which comprised the roller of the box part of the solder suction apparatus which concerns on embodiment of this invention with the roller of another structure. The perspective view of the solder suction apparatus which concerns on the modification 5 of embodiment of this invention. The disassembled perspective view of the solder suction apparatus which concerns on the modification 5 of embodiment of this invention. It is a perspective view of the box area | region of the solder suction apparatus which concerns on the modification 5 of embodiment of this invention, Fig.13 (a) shows the perspective view seen from the communicating path side of the box area | region, FIG.13 (b) is FIG. The perspective view seen from the side opposite to the communicating path of a box area | region is shown. It is a perspective view of the roller of the solder suction device concerning the modification 5 of an embodiment of the present invention, Drawing 14 (a) shows the roller seen from the front side, and Drawing 14 (b) was seen from the back side. Indicates a roller. FIG. 15A is a partial cross-sectional view of a box region of a solder suction device according to a fifth modification of the embodiment of the present invention, and FIG. 15A shows a state before the suction material is cut by the cutting mechanism, and FIG. Shows a state during the cutting operation of the suction material by the cutting mechanism, and FIG. 15C shows a state after the suction material is cut by the cutting mechanism. The perspective view of the solder suction apparatus which concerns on the modification 6 of embodiment of this invention. The disassembled perspective view of the solder suction apparatus which concerns on the modification 6 of embodiment of this invention. The perspective view of the box area | region of the solder suction apparatus which concerns on the modification 6 of embodiment of this invention. FIG. 19A is a partial cross-sectional view of a box region of a solder suction device according to Modification 6 of the embodiment of the present invention. FIG. 19A shows a state before the suction material is cut by the cutting mechanism, and FIG. Shows a state during the cutting operation of the suction material by the cutting mechanism, and FIG. 19C shows a state after the suction material is cut by the cutting mechanism.

  A solder suction device 10 according to an embodiment to which a solder suction device according to the present invention is applied will be described with reference to the drawings.

  As shown in FIG. 1, the solder suction device 10 according to the embodiment includes a storage unit 1 that stores the suction material SB in a wound state, a box unit 2, and a main body 3. The suction material SB stored in the storage unit 1 is sent out from the main body 3 via the box unit 2.

  Note that the suction material SB is formed by braiding copper fibers into a string shape, and sucks excess solder in a molten state using a capillary phenomenon.

  The storage unit 1 is formed in the holding reel 11 that holds the wound suction material SB and the holding reel 11 so as to protrude from both side surfaces at the center of the holding reel 11, and is attached to the main body 3 in a detachable manner. And a pin 12. Both end portions of the mounting pin 12 are rotated relative to the main body 3 by the feeding operation of the suction material SB when mounted on the main body 3. As shown in FIG. 2, the box unit 2 has a box main body 21, a roller 22 provided in the box main body 21, and a feeding direction in which the suction material SB is sent to the roller 22 (hereinafter simply referred to as a feeding direction). And a cutting mechanism 23 provided on the downstream side.

  The box body 21 is formed in a divided structure having a first box body 21a and a second box body 21b divided into two along the feed direction, and the roller 22 and the cutting mechanism 23 are incorporated and integrated. The

  The box main body 21 includes a roller storage chamber 24 that stores the roller 22, a cutting mechanism storage chamber 25 that stores the cutting mechanism 23, and a suction material protrusion 3 a that is formed in the main body 3 and protrudes the suction material SB from the main body 3. And a communication port 27 for communicating with the outside of the box body 21 through the communication passage 26.

  Accordingly, the suction material SB is inserted into the box body 21 from the communication port 27 and protrudes from the suction material protrusion 3 a through the communication path 26. The box main body 21 is formed with an adjacent communication path 28 adjacent to a later-described cutting mechanism communication path 45 on the downstream side in the feed direction. The adjacent communication path 28 forms a part of the communication path 26 together with the communication path 45 in the cutting mechanism.

  As shown in FIG. 3, the roller 22 has a feed roller 31 and a guide roller 32. The feed roller 31 is rotatably provided in the box main body 21 in the roller accommodating chamber 24, and a part of the feed roller 31 protrudes into the communication path 26, and a part of the side facing the part protrudes outside the box main body 21 to rotate. Thus, the suction material SB is sent out. The roller 31 is formed with a plurality of claws 31a that help feed the suction material SB at regular intervals protruding from the outer peripheral surface.

  Like the roller 31, the guide roller 32 is rotatably provided in the box body 21 in the roller accommodating chamber 24. The guide roller 32 faces the feed roller 31 with the communication path 26 interposed therebetween, and the feed roller 31 with the suction material SB sandwiched therebetween. The rotation of the suction material SB guides the feeding of the suction material SB.

  As shown in FIGS. 2 and 4A, the cutting mechanism 23 includes a mechanism main body 41, a cutting tool 42 for cutting the suction material SB, and a biasing member that pushes the mechanism main body 41 toward the outside of the box main body 21. 43 and a projecting portion 44 projecting to the outside of the box main body 21.

  The mechanism main body 41 is formed in a divided structure having a first mechanism main body 41a and a second mechanism main body 41b divided into two along the feed direction, and is integrated by fastening of the bolt 41c to be integrated into the box main body 21. Is accommodated in the cutting mechanism accommodating chamber 25.

  The mechanism main body 41 is provided with a cutting mechanism communication passage 45 that forms a part of the communication passage. The in-cutting-mechanism communication path 45 has a configuration that penetrates the mechanism main body 41 from the upstream side to the downstream side in the feeding direction of the suction material SB between the urging member 43 and the cutting tool 42. The in-cutting mechanism communication passage 45 is formed by the cooperation of the first mechanism body 41a and the second mechanism body 41b.

  The cutting tool 42 is provided at the end of the cutting mechanism internal passage 45. The cutting tool 42 is exposed to both the first mechanism main body 41a and the second mechanism main body 41b in the lateral direction orthogonal to the feeding direction of the suction material SB exposed to the cutting mechanism communication path 45 on the downstream side of the cutting mechanism communication path 45. Is formed, and the suction material SB fed through the cutting mechanism internal passage 45 is cut in the lateral direction. The suction member SB is sandwiched between the end portion of the cutting mechanism internal passage 45 and the end portion of the adjacent communication passage 28 adjacent to the end portion when the protruding portion 44 is pushed into the box portion 2. Is cut off.

  The protruding portion 44 is formed on both the first mechanism main body 41a and the second mechanism main body 41b, and protrudes from the box main body 21 to the outside. The protruding top is flat so that it can be easily pressed with a finger.

  The biasing member 43 is made of an elastic material such as a compression coil spring, and is incorporated between the mechanism main body 41 and the bottom surface portion of the cutting mechanism accommodation chamber 25 of the box main body 21. The urging member 43 urges the mechanism main body 41 in the direction of pushing out the mechanism main body 41 toward the outside of the box main body 21 so that pressure acts. The mechanism main body 41 is in contact with a restriction wall 25a formed in the cutting mechanism accommodation chamber 25 of the box main body 21, and is restricted from protruding outward from the box main body 21.

  As shown in FIG. 2, the main body 3 is formed in a rod shape and divided in the longitudinal direction, and has a divided structure including a first housing 51 and a second housing 52 facing the first housing 51. . The first housing 51 and the second housing 52 are fastened and integrated with a bolt 53.

  A box portion accommodation chamber 54 is formed by the first housing 51 and the second housing 52 on the downstream side in the feed direction of the main body 3, and the box portion 2 is accommodated in the box portion accommodation chamber 54. .

  On the upstream side in the feed direction of the main body 3, a storage portion accommodation chamber 55 is formed by the first housing 51 and the second housing 52, and the storage portion 1 is accommodated in the storage portion accommodation chamber 55. .

  Bolt holes 51a and 51b are formed in the first housing 51 in the central portion on the upstream side and the downstream side in the feed direction, and the bolts 53 are inserted through the first housing 51 so that they can be screwed into nuts (not shown). Yes. Further, the first housing 51 is provided with a cylindrical guide portion 51d formed with a guide passage 51c penetrating in a direction along the longitudinal direction of the main body 3, and a cylindrical guide portion 51f formed with a guide passage 51e. It has been. The guide part 51 d and the guide part 51 f are formed to protrude from the first housing 51.

  The guide part 51d is located on the storage part 1 side, and the guide part 51f is located on the box part 2 side. Further, the end portions of the guide passage 51 c and the guide passage 51 e open toward the communication port 27. The feeding of the suction material SB is guided by the guide portion 51d and the guide portion 51f.

  In the second housing 52, through holes 52a and 52b are formed in the central portions on the upstream side and the downstream side in the feeding direction, and the bolts 53 are inserted therein. Further, the first housing 51 and the second housing 52 are formed with a suction material projecting port 3a that opens at the downstream end in the feeding direction, and the adjacent communication path formed in the suction material projecting port 3a and the box body 21. A housing communication path 56 that communicates with 28 is formed.

  The communication passage 26, the adjacent communication passage 28, the cutting mechanism internal passage 45, and the housing communication passage 56 of the solder suction device 10 according to this embodiment constitute a communication passage of the solder suction device according to the present invention.

  The operation of the solder suction operation by the solder suction device 10 according to the embodiment configured as described above will be briefly described.

  As shown in FIG. 1, when the storage unit 1 is accommodated in the storage unit accommodation chamber 55 of the main body 3 of the solder suction device 10, the solder suction operation by the solder suction device 10 is started. First, when the tip of the suction material SB wound around the storage unit 1 is pulled in the feed direction by the operator, the mounting pin 12 of the storage unit 1 rotates in the feed direction. Further, the tip of the suction material SB is sent and sequentially passed through the guide passage 51c of the guide portion 51d of the first housing 51 and the guide passage 51e of the guide portion 51f.

The tip of the suction material SB that has passed through the guide passage 51e is inserted into the communication port 27 of the box body 21 and abuts between the feed roller 31 and the guide roller 32 through the communication passage 26.
Next, when the feed roller 31 is rotated in the feed direction, the tip of the suction material SB is fed by the feed roller 31 and the guide roller 32. Then, as shown in FIG. 4 (a), it enters the cutting mechanism communication passage 45, passes through the lower portion of the blade 42, passes through the adjacent communication passage 28, and further passes through the housing communication passage 56, and the suction material protrusion 3a. Protrude from.

  When excess solder in the soldering portion is sucked at the tip portion of the suction material SB, the protruding portion 44 of the cutting mechanism 23 is pushed, and the urging member 43 is compressed, as shown in FIG. The cutting edge of the cutting tool 42 moves in the direction of the part where the communication path 45 in the cutting mechanism and the adjacent communication path 28 communicate with each other.

  Further, as shown in FIG. 5 (b), when the projecting portion 44 is pushed in, the cutting edge of the cutting tool 42 comes into contact with the suction material SB, and as shown in FIGS. 4 (b) and 5 (c), the suction material. The SB is cut at the end surface portion of the adjacent communication path 28. The leading end portion of the cut suction material SB is discarded.

  Then, in order to prepare for the next soldering operation, the feed roller 31 shown in FIG. 4A is rotated, the tip portion of the suction material SB protrudes from the suction material protrusion 3a, and the preparation of the solder suction operation is completed. The operation of the solder suction operation by the solder suction device 10 ends.

  The effect of the solder suction device 10 according to the embodiment configured as described above will be described.

  In the first housing 51 of the solder suction device 10 according to the embodiment, a cylindrical guide part 51d located on the storage part 1 side and a guide part 51f located on the box part 2 side are formed so as to protrude from the first housing 51. Has been. The end portions of the guide passage 51c of the guide portion 51d and the guide passage 51e of the guide portion 51f open toward the communication port 27.

  With this configuration, when a new suction material SB is replaced in the storage portion 1, the tip portion of the suction material SB can be easily inserted into the box portion 2 from the communication port 27 through the guide passage 51c and the guide passage 51e. Further, the tip of the suction material SB inserted from the communication port 27 is in direct contact with the roller 22 through the communication path 26, is sent by the roller 22, and passes through the communication path 26 from the suction material protrusion 3 a. Since the tip portion protrudes, the workability of replacing the suction material SB can be improved.

  Further, the suction material SB enters the box portion 2 from the communication port 27 and its tip portion projects from the suction material protrusion 3a, so that the upstream side in the feeding direction of the suction material SB heated by the solder suction is directly touched by hand. Therefore, the solder suction operation can be performed safely.

  In addition, the solder suction device 10 according to the embodiment is disposed between the suction material protruding port 3a and the communication port 27, and a feed roller 31 and a guide roller partially protruding both inside and outside the communication path 26. 32. With this configuration, the operator can rotate the feed roller 31 and the guide roller 32 only by turning the protruding portion of the feed roller 31, and can cause the suction material SB to protrude from the suction material protrusion 3a.

  In addition, the solder suction device 10 according to the embodiment includes a cutting mechanism internal passage 45, a cutting tool 42 provided at an end of the cutting mechanism internal passage 45, and a tool 42 that pushes the cutting tool 42 toward the outside of the box portion 2. A biasing member 43 and a projecting portion 44 projecting outward from the box portion 2 on the opposite side of the biasing member 43 in a state of being biased by the biasing member 43 are provided.

  With this configuration, the operator can cut the suction material SB with the cutting tool 42 only by pushing the protruding portion 44 into the box portion 2 with one hand after finishing the solder suction operation. Therefore, in the solder suction device 10 according to the embodiment, the operator can cut the suction material SB without interrupting the soldering work, and can improve the soldering workability.

  You may make it comprise the solder suction apparatus 10 which concerns on embodiment of this invention with the solder suction apparatus of another structure. For example, the guide portions 51d and 51f of the first housing 51 of the solder suction device 10 may be configured by the solder suction device 20 according to Modification 1 in which the guide portions 59 are formed in a cylindrical shape.

  As shown in FIG. 6, the cylindrical guide portion 59 is formed to protrude from the first housing 51 at the upstream and downstream central portions in the feeding direction. In the solder suction device 20 according to the first modification, the suction material SB enters from the inlet 59a of the guide portion 59, passes through the guide passage 59b, and exits from the outlet 59c, and feeding of the suction material SB is performed in the guide portion 59. Guided by. An outlet 59 c of the guide part 59 opens toward the communication port 27.

  With the configuration described above, the solder suction device 20 according to the first modification can obtain the same effect as the solder suction device 10 according to the embodiment of the present invention, and the suction material SB fed on the first housing 51 can be reduced. It is protected by the guide part 59.

  As a result, it is possible to prevent the suction material SB sent on the first housing 51 from being caught and extended during the solder suction operation. Further, when the new suction material SB is replaced in the storage unit 1, the tip of the suction material SB can be easily inserted into the box portion 2 from the communication port 27 through the guide passage 59b, and the suction material SB can be replaced. Workability can be improved.

  Moreover, you may make it comprise with the solder suction apparatus 30 which concerns on the modification 2 which formed the cutting mechanism 23 of the box part 2 of the solder suction apparatus 10 which concerns on embodiment of this invention with another structure.

  As shown in FIGS. 7A and 8A, the solder suction device 30 according to the second modification is replaced with a cutting mechanism 23 of the box portion 2 of the solder suction device 10 according to the embodiment. It comprises a cutting mechanism 23A. The box portion 2A and the cutting mechanism 23A are accommodated in the main body 3A. The structure of the solder suction device 30 according to the modification 2 other than the cutting mechanism 23 of the box portion 2 and the main body 3A is configured in the same manner as the solder suction device 10 according to the embodiment.

  The box part 2A includes a box main body 61 and a cutting mechanism 23A provided in the box main body 61. Other structures in the box part 2A are the same as those of the box part 2 of the solder suction device 10 according to the embodiment. It is configured.

  The box body 61 is formed in a divided structure having a first box body 61a divided in the feed direction and a second box body (not shown), and the roller 22 and the cutting mechanism 23A are incorporated and integrated.

  The box main body 61 has a cutting mechanism accommodating chamber 25A for accommodating the cutting mechanism 23A, and a biasing member accommodating chamber 71 for accommodating the biasing member 43. Other structures in the box main body 61 are the same as those in the embodiment. It is comprised similarly to the box main body 21 of the solder suction apparatus 10 which concerns. The adjacent communication path 28 formed in the box body 21 of the solder suction device 10 according to the embodiment is not formed in the box body 61.

  The cutting mechanism 23A includes a mechanism main body 41A, a cutting tool 42A for cutting the suction material SB, a biasing member 43 that pushes the mechanism main body 41A toward the outside of the box main body 21, and a protrusion 44A that protrudes outside the box main body 61. And have.

  The cutting tool 42A is exposed to the housing communication path 56A, which will be described later, on the downstream side of the communication path 26, and has a cutting edge formed at the exposed end of the mechanism main body 41A in the lateral direction perpendicular to the feeding direction of the suction material SB. The suction material SB fed through the passage 26 and the housing communication passage 56A is cut in the lateral direction. The suction material SB is sandwiched and cut between the cutting edge of the cutting tool 42A and the downstream end of the communication passage 26.

  The protruding portion 44A is formed in the cutting mechanism 23A and protrudes from the box body 61 to the outside. The protruding top is flat so that it can be easily pressed with a finger.

  The urging member 43 is incorporated in the urging member accommodating chamber 71 of the box body 61. The urging member 43 urges the mechanism main body 41 </ b> A in the direction of pushing the mechanism main body 41 A toward the outside of the box main body 61 so as to act on the pressure. The mechanism main body 41A is restricted by a restriction wall 72 formed in the cutting mechanism accommodation chamber 25A of the box main body 61, and does not protrude outward from the box main body 61.

  As shown in FIGS. 7A and 8A, the main body 3A is formed in a rod shape and divided in the longitudinal direction, like the solder suction device 10 according to the embodiment. It is comprised by the division structure which consists of the 2nd housing (not shown) facing 1 housing. The first housing 51A and the second housing are integrated.

  A box housing chamber 54A is formed by the first housing 51A and the second housing on the downstream side in the feed direction of the main body 3A, and the box 2A is housed in the box housing chamber 54A. A discharge port 73 is formed through the first housing 51A and the second housing at the bottom portion of the box portion accommodating chamber 54A facing the cutting tool 42A, and the suction material SB cut from the discharge port 73 is discharged. It has come to be.

  The first housing 51A and the second housing are formed with a suction material projecting port 74 that opens at the downstream end in the feed direction, and the suction material projecting port 74 communicates with the communication passage 26 formed in the box body 61. A housing communication path 56A is formed.

  The communication path 26 and the housing communication path 56A of the solder suction device 30 according to the second modification constitute a communication path of the solder suction device according to the present invention.

  The operation of the cutting mechanism 23A of the solder suction device 30 according to the second modification configured as described above will be briefly described.

  When the feed roller 31 is rotated in the feed direction, the tip of the suction material SB is fed by the feed roller 31 and the guide roller. Then, as shown in FIGS. 7A and 8A, the communication path 26 passes through the lower part of the cutting tool 42A, and protrudes from the suction material protruding port 74 through the housing communication path 56A.

  When excess solder in the soldering portion is sucked at the tip portion of the suction material SB, the protruding portion 44A of the cutting mechanism 23A is pushed, the urging member 43 is compressed, and FIGS. 7 (a) and 8 (b). ), The cutting edge of the cutting tool 42 </ b> A moves toward the downstream end of the communication path 26.

  Further, as shown in FIGS. 7B and 8C, when the projecting portion 44A is pushed in, the cutting edge of the cutting tool 42A comes into contact with the suction material SB, and the suction material SB is at the downstream end of the communication path 26. Cut at the part. The leading end portion of the cut suction material SB is discharged from the discharge port 73.

  Since the solder suction device 30 according to the modified example 2 is configured as described above, the same effects as the solder suction device 10 according to the embodiment of the present invention can be obtained, and the first housing 51A and the second housing 51 The tip of the suction material SB cut from the discharge port 73 formed in the housing is discharged. As a result, the front end portion of the cut suction material SB can be easily recovered. If a container such as a collection box is connected to the suction material protruding port 74, it can be automatically collected in the container every time the tip of the cut suction material SB is cut.

  You may make it comprise the solder suction apparatus 10 which concerns on embodiment of this invention with the solder suction apparatus of another structure. For example, the roller 22 of the solder suction device 10 may be configured by the solder suction device 40 according to the third modification formed by the roller 22A having the outer peripheral surface portion 81 of an elastic material such as rubber.

  As shown in FIG. 9, the roller 22A has a feed roller 31A and a guide roller 32A. Similarly to the feed roller 31 of the roller 22 of the solder suction device 10, the feed roller 31 </ b> A is rotatably provided in the box body 21 in the roller housing chamber 24, and a part of the feed roller 31 </ b> A protrudes into the communication path 26 and faces this part. A part of the side to be projected protrudes to the outside of the box body 21, and the suction material SB is sent out by rotation. The outer peripheral surface portion 81 of the roller 31A is formed of an elastic material such as rubber so as to assist the feeding of the suction material SB.

  As with the roller 31A, the outer peripheral surface portion 81 of the guide roller 32A is formed of an elastic material such as rubber so as to assist the feeding of the suction material SB. The guide roller 32A is rotatably provided to the box main body 21 in the roller accommodating chamber 24. The guide roller 32A is opposed to the feed roller 31A with the communication path 26 interposed therebetween, and rotates with the rotation of the feed roller 31A, thereby feeding the suction material SB. Is to guide you.

  With this configuration, the solder suction device 40 according to the third modification can be made difficult to slip by utilizing the stretchability and frictional force of an elastic material such as rubber, and the suction material SB can be sent out satisfactorily without slipping. it can.

  You may make it comprise the solder suction apparatus 10 which concerns on embodiment of this invention with the solder suction apparatus of another structure. For example, you may make it comprise the roller 22 of the solder suction apparatus 10 with the solder suction apparatus 50 which concerns on the modification 4 formed with the roller 22B which has uneven | corrugated shaped outer peripheral surface parts 91, such as a knurl.

  As shown in FIG. 10, the roller 22B has a feed roller 31B and a guide roller 32B. Similarly to the feed roller 31 of the roller 22 of the solder suction device 10, the feed roller 31 </ b> B is rotatably provided on the box body 21 in the roller accommodating chamber 24, and a part of the feed roller 31 </ b> B protrudes into the communication path 26 and faces this part. A part of the side to be projected protrudes to the outside of the box body 21, and the suction material SB is sent out by rotation. The outer peripheral surface portion 91 of the roller 31B is formed of an elastic material such as rubber so as to assist the feeding of the suction material SB.

  As with the roller 31A, the outer peripheral surface portion of the guide roller 32B is formed in a concavo-convex shape such as a knurling so as to assist the feeding of the suction material SB. Further, the guide roller 32B is rotatably provided to the box body 21 in the roller accommodating chamber 24. The guide roller 32B is opposed to the feed roller 31B with the communication path 26 interposed therebetween, and rotates with the rotation of the feed roller 31B to feed the suction material SB. Is to guide you.

  With this configuration, the solder suction device 50 according to the modified example 4 has a concavo-convex shape such as a knurl, can be made difficult to slip, and can efficiently feed the suction material SB without slipping.

  As described above, in the solder suction device 10 according to the embodiment of the present invention, the box portion 2 and the main body 3 are separated and each has a separate structure. In the apparatus, the box portion 2 and the main body 3 may be configured as an integral structure, and the box portion 2 may be configured as the box area 100 in the main body 3.

  Hereinafter, a solder suction device 60 according to Modification 5 in which the box portion 2 of the solder suction device 10 according to the embodiment of the present invention is configured as the box region 100 in the main body 3 will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same structure as the solder suction apparatus 10 which concerns on embodiment, and description is abbreviate | omitted.

  As shown in FIG. 11, the solder suction device 60 according to the modified example 5 includes a storage unit 1, a main body 5, a roller 6, and a cutting mechanism 7. The suction material SB stored in the storage unit 1 is sent out from the main body 5 via the roller 6 and the cutting mechanism 7.

  As shown in FIGS. 11 and 12, the main body 5 is formed in a rod shape, like the solder suction device 10 according to the embodiment of the present invention, and a first housing 111 that can be divided along the longitudinal direction, A divided structure including a second housing 112 facing the first housing 111 is provided.

  Bolt holes 51a, 51b, 51g are formed in the first housing 111 on the upstream side, the central portion, and the downstream side in the feed direction, and the bolts 53, 53a can be inserted and screwed into nuts (not shown). It is like that.

  In the second housing 112, through holes 52a, 52b, and 52g are formed on the upstream side, the central portion, and the downstream side in the feeding direction, and bolts 53 and 53a are inserted therein. Further, the first housing 111 and the second housing 112 are formed with a suction material protruding port 5a that opens at the tip on the downstream side in the feed direction.

  A box region 100 is formed by the first housing 111 and the second housing 112 on the downstream side of the main body 5 in the feeding direction. The box area 100 has a roller accommodation area 101 and a cutting mechanism accommodation area 102. The roller accommodation area 101 accommodates the roller 6, and the cutting mechanism accommodation area 102 accommodates the cutting mechanism 7. After the roller 6 and the cutting mechanism 7 are assembled, the first housing 111 and the second housing 112 are fastened and integrated with bolts 53 and 53a.

  The box area 100 includes a communication path 104 formed in the roller accommodation area 101 and a cutting mechanism communication path 105 formed in the cutting mechanism accommodation area 102. The communication path 104 communicates with a communication port 106 that opens to the base end portion of the box area 100, and the in-cutting mechanism communication path 105 communicates with the suction material protrusion 5 a that opens at the distal end portion of the box area 100. The communication path 104 and the cutting mechanism internal path 105 communicate with each other.

  Therefore, as shown in FIGS. 13A and 13B, the suction material SB is inserted into the box region 100 from the communication port 106 and sucked through the communication path 104 and the communication path 105 in the cutting mechanism. It can be made to protrude from the material protrusion 5a.

  The communication path 104 and the cutting mechanism communication path 105 of the solder suction device 60 according to the fifth modified example communicate with the suction material protruding port 5a and the communication port 106, and the communication path of the solder suction device according to the present invention is communicated. Configure.

  As shown in FIGS. 13A, 13B, 14A, and 14B, the roller 6 includes a first feed roller 121, a second feed roller 122, an operation roller 123, and the like. have. The first feed roller 121 has a roller main body 131, a shaft 132 fixed to the roller main body 131, and a gear 133 fixed to the shaft 132, and one end of the shaft 132 is rotatable to the first housing 111. The other end is rotatably supported by the second housing 112.

  Similar to the first feed roller 121, the second feed roller 122 has a roller main body 141, a shaft 142 fixed to the roller main body 141, and a gear 143 fixed to the shaft 142. Is rotatably supported by the first housing 111, and the other end is rotatably supported by the second housing 112. The second feed roller 122 is opposed to the first feed roller 121 with the communication path 104 interposed therebetween, and can rotate with the rotation of the first feed roller 121 and feed the suction material SB with the suction material SB sandwiched therebetween. .

  Similar to the first feed roller 121, the operation roller 123 includes a roller body 151, a shaft 152 fixed to the roller body 151, and a gear 153 fixed to the shaft 152, and one end of the shaft 152 is the first. The first housing 111 is rotatably supported, and the other end is rotatably supported by the second housing 112. A part of the operation roller 123 protrudes from the first housing 111 to the outside as shown in FIG.

  The gears 133, 143, and 153 are meshed with each other, and when the gear 153 rotates, the gear 143 rotates via the gear 133. That is, as shown in FIG. 14A, when the roller body 151 rotates in the direction of arrow a, the gear 133 rotates in the direction of arrow b via the gear 153 and the roller body 131 rotates in the direction of arrow c.

  When the gear 133 rotates in the arrow b direction, the gear 143 rotates in the arrow d direction and the roller body 141 rotates in the arrow e direction. The suction material SB sandwiched between the roller body 131 and the roller body 141 is sent in the direction of the arrow f by the rotation of the roller body 131 and the roller body 141.

  When the roller main body 151 rotates in the direction opposite to the arrow a direction shown in FIG. 14A, the gear 133 rotates in the direction opposite to the arrow b direction via the gear 153 and the roller main body 131 changes to the arrow c direction. Rotate in the opposite direction. When the gear 133 rotates in the direction opposite to the arrow b direction, the gear 143 rotates in the opposite direction to the arrow d direction and the roller body 141 rotates in the opposite direction to the arrow e direction. By this rotation, the suction material SB is pulled back in the direction opposite to the arrow f direction.

  The gears 133 and 143 are formed with the same specifications, but the gear 153 and the gear 133 may be formed with the same specifications, or may be formed with different specifications. In the fifth modification, a gear 153 that meshes with the gear 133 is incorporated, and by adjusting the gear ratio between the gear 133 and the gear 153, the force for operating the operation roller 123 is reduced by the action of the moment.

  In addition, the gear 133 of the first feed roller 121 has a gear A that meshes with the same size as the gear 143 of the second feed roller 122 and the gear a that meshes with the gear 153 of the operation roller 123 and smaller than the gear A. You may make it comprise a stepped gear. With this configuration, the force for operating the operation roller 123 is further reduced by the action of the moment.

  The operation roller 123 has a structure separate from the first feed roller 121 and the second feed roller, but a portion corresponding to the roller body 151 of the operation roller 123 is directly connected to the gear 133 or the gear 143. The structure without the operation roller 123 may be configured so that the gear 133 or the gear 143 rotates directly by rotating the portion corresponding to the roller main body 151. Also in this configuration, a part of the portion corresponding to the operation roller 123 is formed so as to protrude from the first housing 111 to the outside.

  As shown in FIGS. 13A and 13B, the cutting mechanism 7 includes a blade 161 that cuts the suction material SB and a push button 162 that presses the blade 161. The blade 161 has a first blade portion 171, a second blade portion 172, and an attachment portion 173.

  The first blade portion 171 is formed of a plate-like member that is elastically deformed by being pushed by the push button 162, and a blade edge 171a is formed at the tip in the feed direction. A through hole 171b is formed in the first blade portion 171 on the side opposite to the blade edge 171a in the feed direction, and the suction material SB is passed through the through hole 171b.

  Similarly to the first blade portion 171, the second blade portion 172 is formed of a plate-like member, is positioned facing the first blade portion 171, has a blade edge 172a formed at the tip in the feed direction, and the first housing 111. And held by the second housing 112.

  The attachment portion 173 is formed of a plate-like member, connects the upstream sides in the feed direction of the first blade portion 171 and the second blade portion 172, and is fixed to the first housing 111 and the second housing 112. .

  The push button 162 is housed in the cutting mechanism housing region 102 so as to be able to reciprocate, and has a projecting part 162a that presses the first blade part 171 and an uneven part 162b formed on the surface opposite to the projecting part 162a. doing. The uneven portion 162b is gradually lowered from the end toward the center so that it can be easily pressed with a finger.

  When the uneven portion 162b is pressed and the push button 162 moves, the convex portion 162a presses the first blade portion 171, the first blade portion 171 is elastically deformed, the blade edge 171a and the blade edge 172a abut, the blade edge 171a and the blade edge 172a The suction material SB passing between the two is cut.

  The operation of the solder suction operation by the solder suction device 60 according to the modified example 5 configured as described above will be briefly described.

  As shown in FIG. 11, when the storage unit 1 is stored in the storage unit storage chamber 55 of the main body 5 of the solder suction device 60, the solder suction operation by the solder suction device 60 starts. First, when the tip of the suction material SB wound around the storage unit 1 is pulled in the feed direction by the operator, the mounting pin 12 of the storage unit 1 rotates in the feed direction. Further, the tip of the suction material SB is fed and sequentially passed through the guide passage 51c of the guide portion 51d of the first housing 111 and the guide passage 51e of the guide portion 51f.

  The tip of the suction material SB that has passed through the guide passage 51e is inserted into the communication port 106 of the box region 100 shown in FIG. 13A, and passes through the communication passage 104 between the first feed roller 121 and the second feed roller 122. Inserted between.

  Next, as shown in FIG. 14A, when the operation roller 123 is rotated in the direction of arrow a, the tip of the suction material SB is fed in the direction of arrow f by the first feed roller 121 and the second feed roller 122. It is done. And as shown in FIG.13 (b), it inserts in the through-hole 171b of the 1st blade part 171, and protrudes from the suction material protrusion port 5a through the cutting mechanism internal communication path 105. As shown in FIG.

  When the tip portion of the suction material SB is pressed against the soldered portion in the molten state and excess solder is sucked, the push button 162 of the cutting mechanism 7 is pushed and the arrow is moved as shown in FIG. The first blade portion 171 is pushed by the push button 162 and elastically deformed as shown in FIG. Subsequently, when the push button 162 is pressed, the blade edge 171a comes into contact with the suction material SB, and when the push button 162 is further pressed strongly, suction is performed by the blade edge 171a and the blade edge 172a as shown in FIG. The material SB is cut.

  When the push button 162 is released after the suction material SB is cut, the push button 162 is pushed up by the restoring force of the first blade portion 171 and returns to the original position. The leading end portion of the cut suction material SB is discarded. Then, in order to prepare for the next soldering operation, the feed roller 123 shown in FIG. 14A is rotated in the direction of the arrow a, and the tip portion of the suction material SB protrudes from the suction material protrusion 5a. Is completed, and the operation of the solder suction operation by the solder suction device 60 is completed.

  The effect of the solder suction device 60 according to Modification Example 5 configured as described above will be described.

  Similar to the solder suction device 10 according to the embodiment, the first housing 111 of the solder suction device 60 according to the modified example 5 has a cylindrical guide portion 51d located on the storage portion 1 side and a box region 100 side. A guide part 51 f is formed so as to protrude from the first housing 111. The end portions of the guide passage 51c of the guide portion 51d and the guide passage 51e of the guide portion 51f open toward the communication port 106.

  With this configuration, when a new suction material SB is replaced in the storage unit 1, the tip of the suction material SB can be easily inserted into the box region 100 from the communication port 106 through the guide passage 51c and the guide passage 51e. . Further, the tip of the suction material SB inserted from the communication port 106 is sandwiched between the roller 121 and the roller 122 through the communication path 104, is sent by the roller 121, and passes through the communication path 105 in the cutting mechanism. Since the tip part protrudes from the suction material protrusion 5a, the workability of replacing the suction material SB can be improved.

  Similarly to the solder suction device 10 according to the embodiment, the suction member SB enters the box region 100 from the communication port 106 and protrudes from the suction member protrusion 5a, so that the suction member heated by the solder suction is used. The upstream side of the SB feeding direction is not directly touched by hand, and the solder suction operation can be performed safely.

  Further, the solder suction device 60 according to the modification 5 includes a first feed roller 121, a second feed roller 122, and an operation roller 123. With this configuration, the operator simply rotates the portion of the operation roller 123 protruding from the first housing 111 and the second housing 112, and the driving force generated by the rotation of the operation roller 123 via the gears 133, 143, and 153 that mesh with each other. Is transmitted to the first feed roller 121 and the second feed roller 122, and the suction material SB can be reliably projected from the suction material protrusion 5a by the rotation of the first feed roller 121 and the second feed roller 122.

  Further, since the first feed roller 121, the second feed roller 122, and the operation roller 123 are configured to operate via gears 133, 143, and 153, the suction material SB can be finely fed. The effect that the suction material SB can be returned in the direction opposite to the feeding direction is obtained. Further, by adjusting the gear ratios of the gears 133, 143, and 153, the force for rotating the operation roller 123 when the suction material SB is sent out can be reduced.

  Further, since the solder suction device 60 according to the modified example 5 includes the cutting mechanism 7, the operator simply pushes the push button 162 into the box region 100 with one hand after the solder suction work, and the blade edge 171 a is pressed. Further, the suction material SB can be cut by the cutting edge 172a.

  Further, since the blade edge 171a and the blade edge 172a are in contact with each other at the time of cutting, the suction material SB passing through the cutting mechanism 7 does not enter the cutting mechanism 7 after cutting, and the suction material SB can be prevented from being clogged. . Therefore, in the solder suction device 60 according to the modified example 5, the operator can cut the suction material SB without interrupting the soldering work, and the workability of soldering can be improved.

  Further, in the solder suction device 60 according to the modified example 5, since the box portion 2 of the solder suction device 10 according to the embodiment is the box region 100 and the box portion 2 and the main body 3 are integrated, the number of parts is reduced. The production cost including assembly man-hours can be reduced. In addition, it is easy to disassemble and the effect of improving maintainability can be obtained. And the effect that productivity (replication becomes easy) of jig itself improves is also acquired.

  In the solder suction device 60 according to the modified example 5, the cutting mechanism 7 may be configured with another structure. Hereinafter, a solder suction device 70 according to Modification 6 in which the cutting mechanism 7 is configured in another structure will be described with reference to the drawings.

  As shown in FIGS. 16 and 17, the solder suction device 70 according to the modification 6 is configured by a cutting mechanism 8 except that the cutting mechanism 7 of the solder suction device 60 according to the modification 5 is used. It is comprised similarly to the solder suction apparatus 60 concerning. In addition, the same code | symbol is attached | subjected to the same structure as the solder suction apparatus 60 which concerns on the modification 5, and description is abbreviate | omitted.

  As shown in FIG. 18, the cutting mechanism 8 of the solder suction device 70 according to the modification 6 is similar to the cutting mechanism 7 of the solder suction device 60 according to the modification 5, and the cutting tool 161 for cutting the suction material SB and the cutting tool 161. And an operation lever 181 for pressing the.

  The operation lever 181 is rotatably accommodated in the cutting mechanism accommodation region 102, and includes a pressing portion 181a that presses the first blade portion 171; a rotation fulcrum 181b that is formed on the downstream side in the feed direction of the pressing portion 181a; And an operating portion 181c protruding from the first housing 111 and the second housing 112. The operation lever 181 is supported by the first housing 111 and the second housing 112 so as to rotate about the rotation fulcrum 181b.

  Next, the operation of the cutting mechanism 8 will be briefly described.

  After the tip portion of the suction material SB is pressed against the soldered portion in the molten state and excess solder is sucked, the end portion of the operation lever 181 of the cutting mechanism 8 is moved to an arrow as shown in FIG. When pushed in the direction, the operation lever 181 rotates in the arrow direction about the rotation fulcrum 181b.

  When the operation lever 181 rotates, as shown in FIG. 19B, the end portion of the pressing portion 181a pushes down the first blade portion 171, and the first blade portion 171 is elastically deformed in the arrow direction. Subsequently, when the operation lever 181 is pressed, the blade edge 171a comes into contact with the suction material SB, and when the operation lever 181 is pressed strongly, suction is performed by the blade edge 171a and the blade edge 172a as shown in FIG. The material SB is cut.

  After the suction material SB is cut, when the push-down of the operation lever 181 is released, the operation lever 181 is pushed up by the restoring force of the first blade portion 171 and the pressing portion 181a is pushed up, and the rotation fulcrum 181b is used as a fulcrum. Rotate in the direction and return to the original position. The leading end portion of the cut suction material SB is discarded. Then, in order to prepare for the next soldering operation, the feed roller 123 shown in FIG. 14A is rotated in the direction of arrow a, and as shown in FIG. 15A, the tip portion of the suction material SB protrudes from the suction material. Projects from the mouth 5a.

  Since the solder suction device 70 according to Modification 6 is configured in substantially the same manner as the solder suction device 60 according to Modification 5, the same effects as those of the solder suction device 60 according to Modification 5 can be obtained.

That is, in the solder suction device 70 according to the modified example 6, the workability of replacing the suction material SB can be improved, and the upstream side in the feeding direction of the suction material SB heated by the solder suction is directly touched by hand. The solder suction operation can be performed safely, and the roller 6
The suction material SB can be reliably protruded from the suction material protrusion 5a.

  In addition, since the solder suction device 70 according to the modified example 6 includes the cutting mechanism 8, after the solder suction operation, the operator can cut the cutting edge 171 a and the blade edge 171 a with a relatively light force by simply pressing the operation lever 181 with one hand. The suction material SB can be cut by the blade edge 172a. Therefore, in the solder suction device 60 according to the modified example 5, the operator can cut the suction material SB without interrupting the soldering work, and the workability of soldering can be improved.

  Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various designs can be made without departing from the spirit of the present invention described in the claims. It can be changed.

  DESCRIPTION OF SYMBOLS 1 ... Storage part, 2, 2A ... Box part, 3, 3A, 5 ... Main body, 3a, 5a, 74 ... Suction material protrusion, 6, 22 ... Roller, 7, 8 , 23, 23A ... cutting mechanism, 11 ... holding reel, 12 ... mounting pin, 20, 30, 40, 50, 60, 70 ... solder suction device, 21, 61 ... box body 21a ... first box main body, 21b ... second box main body, 24 ... roller accommodating chamber, 25,25A ... cutting mechanism accommodating chamber, 25a, 72 ... regulating wall, 26,104 ... Communication path, 27, 106 ... Communication port, 28 ... Adjacent communication path, 31 ... Feed roller, 31a ... Nail, 32 ... Guide roller, 41, 41A ... Mechanism Main body, 41a ... first mechanism main body, 41b ... second mechanism main body, 41c, 53, 53 ... Bolts, 42, 42A, 161 ... Cutting tools, 43 ... Biasing members, 44, 44A, 162a ... Projections, 45, 105 ... Communication paths in the cutting mechanism, 51, 51A, 111 ... 1st housing, 51a, 51b, 51g ... Bolt hole, 51c, 51e, 59b ... Guide passage, 51d, 51f, 59 ... Guide part, 52, 112 ... 2nd housing , 52a, 52b, 52g, 171b ... through-hole, 54, 54A ... box portion accommodation chamber, 55 ... storage portion accommodation chamber, 56, 56A ... housing communication path, 59a ... inlet, 59c ... outlet, 71 ... biasing member accommodation chamber, 73 ... discharge port, 81, 91 ... outer peripheral surface, 100 ... box region, 101 ... roller accommodation region, 102 ... -Cutting mechanism accommodation area, 12 ... 1st feed roller, 122 ... 2nd feed roller, 123 ... Operation roller, 131, 141, 151 ... Roller body, 132, 142, 152 ... Shaft, 133, 143, 153 ... Gear, 162 ... Push button, 162b ... Concavity and convexity, 171 ... First blade part, 171a, 172a ... Blade edge, 172 ... Second blade part, 173 ... Attachment Part, 181 ... operating lever, 181a ... pressing part, 181b ... rotating fulcrum, 181c ... operating part, SB ... suction material

Claims (1)

A solder suction device comprising: a rod-shaped main body; a box portion provided at one end of the main body; and a storage portion that is provided at the other end of the main body and stores the wound suction material.
The box portion includes a suction material projection port oriented in a direction along the longitudinal direction of the main body, a communication port communicating the suction material projection port and the outside of the box portion through a communication path, and the suction material projection port. A roller disposed between the communication port and partially protruding both inside and outside the communication path; and a cutting mechanism provided between the roller and the suction material protruding port. Prepared,
The cutting mechanism includes: a cutting mechanism internal passage that forms a part of the communication passage; a cutting tool provided at an end of the cutting mechanism internal passage; and the blade tool that pushes the cutting tool toward the outside of the box portion. An urging member, and a protruding portion protruding outward from the box portion on the opposite side of the urging member in a state of being urged by the urging member,
When the projecting portion is pushed into the box portion, the suction material is sandwiched between an end portion of the communication path in the cutting mechanism and an end portion of the communication path adjacent to the end portion. A solder suction device cut by a cutting tool.

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