JP2018189920A - Color filter and method of manufacturing color filter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a color filter and a method of manufacturing a color filter with reduced manufacturing cost.SOLUTION: A color filter 10 comprises a translucent substrate 11, a black matrix part 12 laminated on the substrate 11 and having a plurality of penetration holes 121R, 121G and 121B penetrating in a thickness direction, a red coloring part 131R selectively transmitting light of a red wavelength band different from a wavelength band of blue light made incident, a green coloring part 131G selectively transmitting light of a green wavelength band different from a wavelength band of blue light made incident, and a color conversion part 132 provided on the inner side of the penetration holes 121R and 121G where the red coloring part 131R and the green coloring part 131G are provided, on the substrate 11, and including red quantum dots converting blue light made incident to light of a red wavelength band and green quantum dots converting blue light made incident to light of a green wavelength band.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a color filter and a method for manufacturing a color filter.

  There has been proposed a color filter that converts light emitted from a backlight device of a display device into red, green, and blue light at a colored portion (see, for example, Patent Document 1). In general, this type of color filter reduces the loss of light in the color filter by increasing the ratio of the colored portions as much as possible in order to reduce the loss of light emitted from the backlight device as much as possible. .

  However, as the ratio of the colored portion increases, the proportion of light that enters the color filter from the outside and is reflected by the colored portion increases. If it does so, contrast ratio will fall and the quality of a display image will fall. Therefore, in order to improve the contrast of the display image, it is desired to reduce the proportion of the colored portion in the color filter. However, simply reducing the proportion of the colored portion in the color filter reduces the amount of light emitted from the backlight device and passing through the color filter, thereby reducing the brightness of the display image.

  On the other hand, by increasing the amount of light transmitted through the colored portion using an LED or the like as a light source, a display device that suppresses a decrease in luminance of the display image while reducing the proportion of the colored portion in the color filter. Proposed. As this type of display device, a display device has been proposed that includes a color filter in which a color conversion unit that emits light of different colors according to the color of the coloring unit is stacked on the coloring unit. That is, a color conversion unit including green quantum dots that emit green light is stacked on the green coloring unit, and a color conversion unit including red quantum dots that emit red light is stacked on the red coloring unit.

JP 2009-236982 A

  However, when manufacturing a color filter having a color conversion unit as described above, it is necessary to stack color conversion units that emit light of different colors depending on the color of the coloring unit. In particular, when a color conversion part is manufactured using a photolithography method, the composition coating process, the exposure process, and the development process are repeated as many times as the number of types of color conversion parts that emit light of different colors. There is a need. Here, in the composition application step, a composition containing quantum dots is applied to the entire surface of the substrate that is the basis of the color filter. In this case, when the size of the color filter to be manufactured is increased, a large amount of the composition is consumed and the manufacturing cost is increased.

  This invention is made | formed in view of the said reason, and it aims at providing the manufacturing method of the color filter which can reduce manufacturing cost, and a color filter.

In order to achieve the above object, the color filter according to the present invention comprises:
A translucent substrate;
A partition wall having a plurality of through holes stacked in the substrate and penetrating in the thickness direction,
One wavelength band of a plurality of types of wavelength bands different from a wavelength band of incident light provided inside a plurality of through holes equal to or less than the total number of the through holes provided in the partition wall on the substrate. A colored portion that selectively transmits light of
A color conversion material that is provided inside the through-hole provided with the coloring portion on the substrate and converts incident light into light in any one of the plurality of types of wavelength bands. A color conversion unit including a plurality of types.

The method for producing a color filter according to the present invention includes:
A light-transmitting substrate, a partition wall portion having a plurality of through holes stacked on the substrate and penetrating in a thickness direction, and a plurality of through holes less than or equal to the total number of the through holes provided in the partition wall portion on the substrate A color filter that is provided inside a hole and includes a coloring unit that selectively transmits light in any one of a plurality of types of wavelength bands different from the wavelength band of incident light, and a color conversion unit A manufacturing method comprising:
A composition containing a plurality of types of color conversion substances for converting incident light into light of any one of a plurality of types of wavelength bands different from the wavelength band of the incident light is applied from an ejection port of the coating head. It includes a composition application step of discharging and applying the inside of the through hole provided with the colored portion.

  According to the present invention, the color conversion unit includes a plurality of types of color conversion substances that convert incident light into light of any one of a plurality of types of wavelength bands. Thereby, the same kind of color conversion part can be provided in all of the through holes provided with a plurality of kinds of coloring parts having different colors. Therefore, after providing a colored portion in each through-hole, it is only necessary to apply a composition that is the basis of the same type of color conversion portion, so that the amount of the composition to be used is reduced and the manufacturing cost is reduced accordingly. There is an advantage of being.

1 is a schematic configuration diagram of a display device according to an embodiment of the present invention. It is a cross-sectional arrow line view in the AA line of FIG. 1 of the display apparatus which concerns on embodiment. It is a flowchart which shows an example of the flow of the manufacturing method of the color filter which concerns on embodiment. It is a figure for demonstrating the manufacturing method of the color filter which concerns on embodiment, (A) is a liquid repellent layer formation process, (B) is an exposure process, (C) is a image development process, (D) is colored part formation. It is sectional drawing of the color filter in after a process. (A) is a figure which shows the mode of application | coating which concerns on embodiment, (B) is a cross-sectional arrow view in the BB line of (A), (C) is the CC line of (A). FIG. It is sectional drawing of the display apparatus which concerns on a comparative example. It is a flowchart which shows an example of the flow of the manufacturing method of the color filter which concerns on a comparative example. (A) is a figure which shows the application | coating state of the application | coating head which concerns on a modification, (B) is an enlarged view of the part enclosed with the dashed-dotted line of (A). It is sectional drawing of the color filter in the color conversion part formation process which concerns on a modification. It is sectional drawing of the display apparatus which concerns on a modification. It is a flowchart which shows an example of the flow of the manufacturing method of the color filter which concerns on a modification. It is a figure for demonstrating the manufacturing method of the color filter which concerns on a modification, (A) is sectional drawing of the color filter in a (B) color conversion part formation process after a coloring part formation process. It is sectional drawing of the display apparatus which concerns on a modification. It is sectional drawing of the color filter in the color conversion part formation process which concerns on a modification. It is a schematic block diagram of the display apparatus which concerns on a modification. It is sectional drawing of the display apparatus which concerns on a modification.

  Hereinafter, a display device according to an embodiment of the present invention will be described with reference to the drawings.

  The display device according to the present embodiment includes a color filter and a light emitting module on which a plurality of light emitting elements are mounted and disposed on the rear surface side of the color filter. The light emitting module includes a substrate on which a circuit pattern is formed and a plurality of light emitting units mounted on the substrate. The color filter includes a translucent substrate, a black matrix portion that is a partition portion having a plurality of through holes stacked on the substrate and penetrating in the thickness direction, and a red colored portion provided inside the through holes on the substrate. , A green coloring portion and a blue coloring portion, and a color conversion portion. The color filter is arranged with the color conversion unit facing the light emitting module. The color conversion part is provided inside the through hole provided with the red coloring part and the green coloring part on the substrate, and converts the incident blue light into the red wavelength band and the incident blue light. And a color conversion material that converts light into a green wavelength band. As this color conversion substance, for example, red quantum dots that emit light in the red wavelength band by being excited by light in the blue wavelength band, and green wavelengths that are excited by the light in the blue wavelength band are used. And green quantum dots that emit light in a band.

  In the display device according to the present embodiment, light emitted from the light emitting unit of the light emitting module to the color conversion unit is converted into light in the red wavelength band and light in the green wavelength band with high conversion efficiency. As such a display device, for example, a display including a color filter 10 as illustrated in FIG. 1 and a light emitting module 20 disposed on the rear surface side (−Z direction side) of the color filter 10 as illustrated in FIG. 2. An apparatus 1 is mentioned. The light emitting module 20 includes a circuit board 21 on which a circuit pattern (not shown) is formed, a plurality of light emitting units 22 mounted on the circuit board 21, a partition wall 23 surrounding each of the plurality of light emitting units 22, Have

  The circuit board 21 is composed of, for example, a TFT substrate in which a plurality of TFTs (thin film transistors) are arranged in a lattice pattern. The plurality of light emitting units 22 are arranged in a grid pattern on the circuit board 21, for example. The light emitting unit 22 includes a blue LED (Light Emitting Diode) and a blue OLED (Organic Light Emitting Diode). As the blue LED, for example, one using a nitride-based semiconductor can be adopted. The light emitting unit 22 is constituted by, for example, a surface mount type light emitting device. The partition wall 23 is made of, for example, a photosensitive resin or a thermosetting resin containing a black pigment. Examples of the black pigment include a mixture of a red pigment and a blue or violet pigment, fine particles composed of titanium black, carbon black, metal oxide, and the like.

  The color filter 10 includes a translucent substrate 11, a red coloring portion 131R, a green coloring portion 131G, and a blue coloring portion 131B, a black matrix portion 12, and a color conversion portion 132. The substrate 11 is made of transparent glass or transparent resin. Examples of the glass include soda glass, alkali-free glass, and borosilicate glass. The substrate 11 may be a flexible substrate having translucency.

  The black matrix portion 12 is stacked on the first main surface 11a of the substrate 11, and has a plurality of through holes 121R, 121G, and 121B that penetrate in the thickness direction. The plurality of through holes 121R, 121G, and 121B are provided in each of the plurality of pixel regions G in the black matrix portion 12, as shown in FIG. The black matrix portion 12 has a two-layer structure including a light shielding portion 122 having a light shielding function and a liquid repellent portion 123 having liquid repellency. The light shielding part 122 is made of, for example, a photosensitive resin or a thermosetting resin containing a black pigment. Examples of the black pigment include a mixture of a red pigment and a blue or violet pigment, fine particles composed of titanium black, carbon black, metal oxide, and the like, as in the partition wall 23. The thickness T2 of the black matrix portion 12 is thicker than the thickness T1 of the red coloring portion 131R, the green coloring portion 131G, and the blue coloring portion 131B. The thickness T2 of the black matrix portion 12 is set to about 10 μm, for example. The liquid repellent portion 123 is provided in a state of being exposed on the surface of the black matrix portion 12 opposite to the substrate 11 side.

  As shown in FIG. 2, the red coloring portion 131 </ b> R is provided inside the through hole 121 </ b> R of the black matrix portion 12 on the substrate 11. The red colored portion 131R selectively transmits light in the red wavelength band. The red colored portion 131R has a characteristic of not transmitting light in a wavelength band of 550 nm or less, for example. The red colored portion 131R is formed from a thermosetting resin containing a red pigment. As the red pigment, a red dye or a red pigment can be used. Examples of the red pigment include Pigment Red 9, 97, 122, 123, 144, 149, 166, 168, 177, 190, 192, 209, 215, 216, 224, and 254. Examples of the thermosetting resin include polyimide resin, epoxy resin, acrylic resin, melamine resin, phenol resin, oxetane resin, siloxane resin, and benzoxazine resin.

  The green coloring portion 131G is provided inside the through hole 121G of the black matrix portion 12 on the substrate 11. The green coloring portion 131G selectively transmits light in the green wavelength band. The green colored portion 131G has a characteristic of transmitting light in a wavelength band of 475 nm to 600 nm, for example. The green coloring part 131G is formed from a green thermosetting resin containing a green pigment. As the green pigment, a green dye or a green pigment can be used. Examples of the green pigment include Pigment Green 7, 10, 36, 47, and the like. The red colored portion 131R and the green colored portion 131G are provided inside a plurality of through holes equal to or less than the total number of through holes 121R, 121G, and 121B provided in the black matrix portion 12. The sum of the total number of through holes 121R and the total number of through holes 121G corresponds to 2/3 of the total number of through holes 121R, 121G, and 121B provided in the black matrix portion 12.

  The blue coloring portion 131 </ b> B is provided inside the through hole 121 </ b> B of the black matrix portion 12 on the substrate 11. The blue coloring portion 131B selectively transmits light in the blue wavelength band. The blue colored portion 131B has a characteristic of not transmitting light having a wavelength band of, for example, 550 nm or more. The blue coloring portion 131B is formed from a thermosetting resin containing a blue pigment. As the blue pigment, a blue dye or a blue pigment can be used. Examples of the blue pigment include pigment blue 15: 3, 15: 4, 15: 6, 21, 22, 60, 64, and the like. Here, the red colored portion 131R and the green colored portion 131G are colored portions that selectively transmit light having a wavelength band different from the wavelength band of incident light (hereinafter, appropriately referred to as “different colored portions”). . On the other hand, the blue coloring portion 131B is a coloring portion that selectively transmits light in the same wavelength band as the wavelength band of incident light (hereinafter referred to as “same color coloring portion” as appropriate). The thickness T1 of the red colored portion 131R, the green colored portion 131G, and the blue colored portion 131B is set to about 2 to 3 μm, for example. Each of the plurality of pixel regions G on the substrate 11 includes three regions SBG, and a red coloring portion 131R, a green coloring portion 131G, and a blue coloring portion 131B are arranged in each region SBG. In addition, colored portions 131R (131G, 131B) of the same color are provided inside through holes provided in each of the plurality of regions SBG arranged in the column direction (Y-axis direction).

  The color conversion unit 132 is provided inside the through holes 121R, 121G, and 121B of the black matrix unit 12 on the substrate 11. The color conversion unit 132 is stacked on the red coloring unit 131R, the green coloring unit 131G, and the blue coloring unit 131B, and converts the blue wavelength band light into the green wavelength band light and the red wavelength band different from the blue wavelength band. Convert to light. The color conversion unit 132 includes red quantum dots that emit light in the red wavelength band when excited by light in the blue wavelength band, and light in the green wavelength band that is excited by light in the blue wavelength band. A green quantum dot that emits light. Here, the red quantum dots and the green quantum dots included in the color conversion unit 132 are color conversion substances that convert incident blue wavelength band light into red wavelength band light and green wavelength band light. Equivalent to. The color conversion unit 132 converts light in the blue wavelength band incident from the light emitting unit 22 of the light emitting module 20 into light in the red wavelength band and light in the green wavelength band, and thereby the second main surface 11b of the substrate 11. Radiates to.

  The red quantum dots are semiconductor fine particles that emit red light having a wavelength band of 600 nm to 650 nm when excited by light having a blue wavelength band incident from the light emitting unit 22. The red quantum dots have a structure including, for example, a core portion formed from a compound semiconductor and a shell portion formed from a compound semiconductor different from the core portion. Examples of compound semiconductors that form the core include MgS, MgSe, MgTe, CaS, CaSe, SrS, SrSe, SrTe, BaS, BaSe, BaTe, ZnS, ZnSe, ZnTe, CdS, CdSe, CdTe, HgSe, HgTe, etc. II-VI group compound semiconductors, or III-V group compound semiconductors such as AlN, AlP, AlAs, AlSb, GaAs, GaP, GaN, GaSb, InN, InP, InSb, TiN, TiP, TiAs, and TiSb. Moreover, the core part may be formed from the compound semiconductor containing 3 or more elements like InGaP.

  The shell part is formed of a semiconductor having a larger band gap than the compound semiconductor that forms the core part. Examples of the combination of the compound semiconductor of the core part and the shell part include CdSe / ZnS, CdSe / ZnSe, CdSe / CdS, CdTe / CdS, InP / ZnS, GaP / ZnS, Si / ZnS, InN / GaN, InP / CdSSe. InP / ZnSeTe, InGaP / ZnSe, InGaP / ZnS, Si / AlP, InP / ZnSTe, InGaP / ZnSTe, InGaP / ZnSSe, and the like. The average particle size of the core portion of the red quantum dots is, for example, 5.0 nm to 8.0 nm.

  The green quantum dots are semiconductor fine particles that emit green light having a wavelength band of 520 nm to 545 nm when excited by light having a blue wavelength band incident from the light emitting unit 22. Similarly to the red quantum dots, the green quantum dots also have a structure including, for example, a core portion formed from a compound semiconductor and a shell portion formed from a compound semiconductor different from the core portion. The material forming the core part and the shell part of the green quantum dot is the same as that of the red quantum dot. The average particle size of the core portion of the green quantum dots is, for example, 1.0 nm to 4.0 nm.

  Next, a method for manufacturing the color filter 10 according to the present embodiment will be described with reference to FIGS. In the manufacturing method of this color filter 10, as shown in FIG. 3, the light-shielding part formation process, the liquid repellent part formation process, the coloring part formation process, the composition application | coating process which apply | coats the thermosetting resin composition containing a quantum dot, and A removal process is performed in order. Here, the light shielding portion forming step and the liquid repellent portion forming step correspond to a black matrix portion forming step for forming a black matrix portion. Moreover, the composition application process and the removal process for removing the organic solvent contained in the thermosetting resin composition correspond to a color conversion part forming process for forming a color conversion part.

  First, a light shielding part forming step is performed (step S101). In this light shielding part forming step, first, the black photosensitive resin composition is applied to the substrate 11 so that the film thickness after drying and baking becomes about 10 μm. As a method for applying the black photosensitive resin composition to the substrate 11, a method using a spin coater, bar coater, blade coater, roll coater or die coater, a method using a capillary coater, or a screen printing method is used. The method of apply | coating, the method of immersing the board | substrate 11 in a black photosensitive resin composition, the method of spraying the black photosensitive resin composition on the board | substrate 11, etc. are mentioned.

  Next, a black photosensitive resin layer is formed by performing a removal process for removing the organic solvent contained in the black photosensitive resin composition applied to the substrate 11. Examples of the removal treatment method include air drying, reduced pressure drying, and heat drying. Next, ultraviolet light is irradiated using an exposure apparatus in a state where a photomask is disposed on the black photosensitive resin layer. Subsequently, for example, after developing using an alkaline developer, the light shielding part 122 is formed by performing a removal process.

  Next, a liquid repellent part forming step for forming a liquid repellent part on the light shielding part 122 is performed (step S102). In this liquid repellent portion forming step, first, a photosensitive resin composition that is a base of the liquid repellent portion is applied to the substrate 11. Examples of the photosensitive resin composition on which the liquid repellent part is based include negative resists and positive resists. Examples of the positive resist include those containing at least a binder resin, a photosensitive agent, an organic solvent, and a fluorosurfactant. Examples of the binder resin include polyamic acid, polyimide or a precursor thereof, polyamideimide, acrylic resin, novolac resin, and a mixture thereof. Examples of the photosensitive agent include naphthoquinone diazide compounds. Examples of the organic solvent include ketone solvents, aliphatic alcohol solvents, aliphatic ester solvents, alkylene glycol ether solvents, amide polar solvents, and aromatic hydrocarbons.

  Fluorosurfactants include nonionic fluorosurfactants such as perfluoroalkyl polyalkylene oxide and perfluoroalkylamine oxide, perfluoroalkyl carboxylic acid ammonium salt, perfluoroalkyl carboxylic acid sodium salt, and perfluoroalkyl. Examples include anionic fluorine-based surfactants such as phosphate esters, cationic fluorine-based surfactants such as perfluoroalkyltrimethylammonium salts, and amphoteric fluorine-based surfactants such as perfluoroalkylbetaine.

  As a method for applying the photosensitive resin composition to the substrate 11, a method using a spin coater, a bar coater, a blade coater, a roll coater or a die coater, a method using a capillary coater, or a screen printing method is used. For example, a method of immersing the substrate 11 in a photosensitive resin composition serving as a base of the liquid repellent portion, and a method of spraying the photosensitive resin composition serving as a base of the liquid repellent portion onto the substrate 11.

  Next, the photosensitive resin composition applied on the substrate 11 is dried to remove the organic solvent contained in the photosensitive resin composition, thereby forming a base of the liquid repellent portion as shown in FIG. A photosensitive resin layer 1123 is formed. Examples of the method for drying the photosensitive resin composition include air drying, reduced pressure drying, and heat drying.

  Subsequently, as shown in FIG. 4B, ultraviolet light UVL is irradiated to the photosensitive resin layer 1123 that is the base of the liquid repellent portion from the side opposite to the photosensitive resin layer 3121 in the substrate 11 using an exposure device. .

  Thereafter, for example, development is performed using an alkaline developer, and then removal treatment is performed. The removal process is the same as the removal process in the above-described light shielding part forming step. As a result, as shown in FIG. 4C, the black matrix portion 12 having the light shielding portion 122 provided on the substrate 11 and the liquid repellent portion 123 laminated on the light shielding portion 122 and having liquid repellency is formed. The In the black matrix portion 12, through holes 121R, 121G, and 121B are formed.

  Returning to FIG. 3, subsequently, a colored portion forming step for forming the red colored portion 131R, the green colored portion 131G, and the blue colored portion 131B is performed (step S103). In this colored portion forming step, for example, as shown in FIG. 4D, by using a photolithography method, a red colored portion 131R, a green colored portion 131G, and an inner portion of each of the through holes 121R, 121G, and 121B A blue colored portion 131B is formed. Specifically, first, a blue photosensitive resin composition is applied to the substrate 11 and the black matrix portion 12. This blue photosensitive resin composition contains a blue pigment, a photosensitive resin, and an organic solvent. Next, a blue photosensitive resin layer is formed by performing a removal treatment for removing the organic solvent contained in the applied blue photosensitive resin composition. The removal process is the same as the removal process in the above-described light shielding part forming step. Subsequently, ultraviolet light UVL is irradiated using an exposure apparatus in a state where a photomask that covers only a portion corresponding to the through hole 121B in the blue photosensitive resin layer is disposed. Subsequently, for example, development is performed using an alkaline developer, and then a removal process is performed to form the blue colored portion 131B.

  Next, the green photosensitive resin composition is applied to the substrate 11, the black matrix portion 12, and the blue coloring portion 131B. This green photosensitive resin composition contains a green pigment, a photosensitive resin, and an organic solvent. Then, the green photosensitive resin layer is formed by performing the removal process which removes the organic solvent contained in the apply | coated green photosensitive resin composition. Thereafter, ultraviolet light UVL is irradiated using an exposure apparatus in a state in which a photomask covering only a portion corresponding to the through hole 121G in the green photosensitive resin layer is disposed. Next, for example, development is performed using an alkaline developer, and then removal processing is performed to form the green colored portion 131G.

  Subsequently, a red photosensitive resin composition is applied to the substrate 11, the black matrix portion 12, the blue coloring portion 131B, and the green coloring portion 131G. This red photosensitive resin composition contains a red pigment, a photosensitive resin, and an organic solvent. Next, a red photosensitive resin layer is formed by removing the organic solvent contained in the applied red photosensitive resin composition. Thereafter, ultraviolet light UVL is irradiated using an exposure apparatus in a state where a photomask that covers only the portion corresponding to the through hole 121R in the red photosensitive resin layer is disposed. Next, for example, after developing using an alkaline developer, a removal process is performed to form the red colored portion 131R.

  Returning to FIG. 3, thereafter, a composition application step of applying a thermosetting resin composition including red quantum dots and green quantum dots to the black matrix portion 12 is performed (step S <b> 104). In this composition application process, for example, a thermosetting resin composition containing quantum dots is applied to the black matrix portion 12 using a die coater having a long application head 1050 as shown in FIG. . The substrate 11 is moved relative to the coating head 1050 in the direction perpendicular to the longitudinal direction of the coating head 1050 while the thermosetting resin composition is allowed to flow out from the coating head 1050, thereby thermosetting the black matrix portion 12. A functional resin composition is applied.

  The coating head 1050 includes a long front lip 1051 and a long rear lip 1052. A manifold 1053 for supplying a thermosetting resin composition in the longitudinal direction of the coating head 1050 is formed inside the coating head 1050 as shown in FIG. The rear lip 1052 is formed with a slit 1054 that communicates with the manifold 1053 and extends to the edge of the rear lip 1052 in the lateral direction. And the lower end part of the slit 1054 comprises the discharge outlet 1055 which discharges a thermosetting resin composition. The discharge port 1055 is extended in a direction orthogonal to the moving direction (Y-axis direction) of the substrate 11.

  In the composition coating step, a thermosetting resin composition containing red quantum dots and green quantum dots is ejected from the discharge port 1055 of the coating head 1050 held in a state separated from the black matrix portion 12 by a preset distance. Discharge. Then, the substrate 11 is relatively moved in one preset direction (see arrow AR1 in FIG. 5B) while discharging the thermosetting resin composition from the discharge port 1055 of the coating head 1050. Then, a coating bead B1 made of a thermosetting resin composition as shown in FIG. 5 (B) is formed between the black matrix portion 12 and the coating head 1050, and the thermosetting resin composition becomes a black matrix portion. 12 is applied to the surface opposite to the substrate 11 side. At this time, as shown in FIG. 5C, a part of the coating bead B <b> 1 enters the through holes 121 </ b> R, 121 </ b> G, 121 </ b> B of the black matrix portion 12. Then, the thermosetting resin composition is provided in the through holes 121R, 121G, and 121B of the black matrix portion 12 through the coating bead B1. At this time, the thermosetting resin composition flows into the through holes 121R, 121G, and 121B of the black matrix portion 12 without remaining on the liquid repellent portion 123 due to the presence of the liquid repellent portion 123.

  Returning to FIG. 3, next, the removal process which removes the organic solvent contained in the thermosetting resin composition containing a quantum dot is performed (step S105). Thereby, the organic solvent contained in the thermosetting resin composition containing a quantum dot is removed, and the color conversion part 132 as shown in FIG. 2 is formed.

  Next, features of the method for manufacturing the color filter 10 according to the present embodiment will be described in comparison with the method for manufacturing the color filter according to the comparative example. As shown in FIG. 6, the display device 9001 according to the comparative example is different in the structure of the color filter 9010 from the structure according to this embodiment. In FIG. 6, the same reference numerals are given to the same configurations as the configurations according to the present embodiment. The color filter 9010 according to the comparative example has a structure in which a green color conversion unit 9132G including only green quantum dots is stacked on the green coloring unit 131G, and a red color conversion unit 9132R including only red quantum dots is stacked on the red coloring unit 131R. Have The color filter 9010 includes a light diffusing unit 9132B that diffuses blue light emitted from the light emitting unit 22. The light diffusion portion 9132B is made of, for example, a transparent resin base material in which transparent fine particles having a refractive index different from that of the resin base material are dispersed.

  In the manufacturing method of the color filter 9010 according to the comparative example, as shown in FIG. 7, the light shielding part forming step, the liquid repellent part forming step, the light diffusing part / coloring part forming process, the green color converting part forming process, and the red color converting part A formation process is performed in order. And in a color conversion part formation process, the composition application | coating process for forming the green color conversion part 9132G, the composition application | coating process for forming the red color conversion part 9132R, and a removal process are performed in order. First, a light shielding part forming process for forming the light shielding part 122 on the substrate 11 is performed (step S901), and then a liquid repellent part forming process for forming the liquid repellent part 123 on the light shielding part 122 is performed (step S902). The light shielding part forming process and the liquid repellent part forming process are the same as the above-described light shielding part forming process and the liquid repellent part forming process. Next, a light diffusing portion / colored portion forming step for forming the light diffusing portion 9132B, the green colored portion 131G, and the red colored portion 131R is performed using a photolithography method (step S903). The light diffusion portion / colored portion forming step is the same as the above-described colored portion forming step.

  Next, using the photolithography method, a green color conversion portion forming process is performed in which the green color conversion portion 9132G including only the green quantum dots is formed in the through hole 121G corresponding to the green coloring portion 131G (step S904). ). In this green color conversion portion forming step, a resin composition containing only green quantum dots is applied to the surface of the black matrix portion 12 opposite to the substrate 11 side, and the resin composition containing only green quantum dots is passed through the through-hole 121R. , 121 G is flown into the inside of the substrate, and then development exposure is performed.

  Subsequently, using the photolithography method, a red color conversion portion forming process is performed in which the red color conversion portion 9132R including only the red quantum dots is formed in the through hole 121R corresponding to the red coloring portion 131R (step S905). ). In this red color conversion portion forming step, a resin composition containing only red quantum dots is applied to the surface of the black matrix portion 12 opposite to the substrate 11 side, and the resin composition containing only red quantum dots is applied to the through holes 121R. Then, development exposure is performed. Thereby, the red color conversion unit 9132R and the green color conversion unit 9132G shown in FIG. 6 are formed.

  As described above, in the method of manufacturing the color filter 9010 according to the comparative example, the resin composition containing only the green quantum dots is applied to the surface of the black matrix portion 12 opposite to the substrate 11 side, and only the green quantum dots are applied. After allowing the resin composition to be contained to flow inside the through holes 121R and 121G, development exposure is performed. And the resin composition containing only red quantum dots was applied to the surface opposite to the substrate 11 side of the black matrix portion 12, and the resin composition containing only red quantum dots was allowed to flow inside the through-hole 121R. Thereafter, development exposure is performed. Thus, it is necessary to apply each of the resin composition containing only red quantum dots and the resin composition containing only green quantum dots to the surface of the black matrix portion 12 opposite to the substrate 11 side. The usage-amount of a composition will increase. On the other hand, in the manufacturing method of the color filter 10 according to the present embodiment, the resin composition containing the red quantum dots and the green quantum dots is once applied to the surface opposite to the substrate 11 side of the black matrix portion 12. Therefore, the amount of the resin composition to be used can be reduced as compared with the case where the color filter 9010 according to the comparative example is manufactured using a photolithography method.

  As described above, according to the color filter 10 according to the present embodiment, the color conversion unit 132 converts the incident blue light into the red wavelength band light, and the green wavelength band. A green quantum dot that converts the light into the light. Thereby, the same kind of color conversion part 132 can be provided in all of the through holes 121R and 121G provided with the red coloring part 131R and the green coloring part 131G having different colors. Therefore, after providing the red coloring portion 131R and the green coloring portion 131G in each of the through holes 121R and 121G, the resin composition containing the red quantum dots and the green quantum dots that form the basis of the color conversion portion 132 is simply applied once. Good. Therefore, the amount of the resin composition to be used can be reduced, the manufacturing process is reduced, and the manufacturing time and the cost of the manufacturing apparatus are reduced, so that there is an advantage that the manufacturing cost is reduced.

  By the way, the color filter 10 according to the present embodiment can be manufactured even if an ink jet apparatus is used. However, the type of resin composition that can be used in an inkjet apparatus is limited by its viscosity and the like. Moreover, the inkjet head needs to maintain an inkjet head so that the quantity of the resin composition discharged from the inkjet nozzle may become constant. On the other hand, in the manufacturing method of the color filter 10 according to the present embodiment, a die coater is used instead of the ink jet apparatus. There are many types of resin compositions that can be used in a die coater compared to resin compositions that can be used in an inkjet apparatus. Therefore, the room for selection of the type of resin composition to be used is expanded. Further, the die coater can reduce the maintenance cost as compared with the ink jet apparatus. That is, the manufacturing method of the color filter 10 according to the present embodiment has an advantage that the maintenance cost of the apparatus used for manufacturing can be reduced as compared with the manufacturing method of the color filter 9010 according to the comparative example.

  Furthermore, the thickness T2 of the black matrix portion 12 according to the present embodiment is thicker than the thickness T1 of the red coloring portion 131R, the green coloring portion 131G, and the blue coloring portion 131B. Thereby, the leakage of the blue light emitted from the light emitting unit 22 corresponding to each pixel region G to other adjacent pixel regions G is suppressed.

(Modification)
Although the embodiment of the present invention has been described above, the present invention is not limited to the configuration of the above-described embodiment. For example, in the composition coating process in the method for manufacturing the color filter 10 according to the embodiment, the discharge port is depressurized on the side opposite to the direction in which the substrate 11 moves as viewed from the coating head, that is, on the upstream side of the discharge port. You may use the die-coater provided with the coating head which has a pressure reduction part. For example, as shown in FIG. 8A, the coating head 2050 according to this modification is configured so that the substrate 11 moves in the ejection port 1055 when viewed from the coating head 2050 (arrows in FIGS. 8A and 8B). A rear lip (decompression unit) 2052 having a function of depressurizing the region A1 on the side opposite to the AR1 side) is provided. Note that in FIG. 8A, the same reference numerals as those in FIG. 5B are assigned to the same configurations as those of the die coater according to the embodiment. The rear lip 2052 has a suction port 2056 connected to a vacuum pump (not shown). The rear lip 2052 draws air existing in the region A1 upstream of the discharge port 1055 through the suction port 2056, thereby making the region A1 a reduced pressure atmosphere. As a result, the application bead B2 is drawn to the upstream side of the discharge port 1055, and as shown by an arrow AR3 in FIG. 8B, the application bead B2 moves to the inside of the through hole (for example, the through hole 121G) of the black matrix portion 12. It becomes easy to flow in.

  According to this configuration, the coating bead B2 is likely to flow into the inside of the through hole (for example, the through hole 121G) of the black matrix portion 12, so that a coating defect of the thermosetting resin composition is less likely to occur. Therefore, the quality of the color filter 10 is improved.

  In the embodiment, the example in which the die coater is used in the composition coating process has been described. However, the present invention is not limited to this, and the resin composition is applied using, for example, a stripe coater having a stripe coating nozzle instead of the die coater. May be.

  In the method for manufacturing the color filter 10 according to the present modification, for example, a stripe coater having a long coating head 3050 as shown in FIG. It apply | coats inside 121R, 121G, 121B. A manifold 3053 for supplying the thermosetting resin composition in the longitudinal direction of the coating head 3050 and a plurality of grooves 3054 communicating with the manifold 3053 are formed inside the coating head 3050. And the lower end part of the some groove | channel 3054 comprises the discharge outlet 3055 which discharges a resin composition. The plurality of ejection ports 3055 are arranged in a direction orthogonal to the moving direction (Y-axis direction) of the substrate 11.

  According to this configuration, a stripe coater is used in the composition coating process. Thereby, in the case of a groove-shaped through-hole, the resin composition can be applied to the inside of the through-holes 121R, 121G, and 121B without having a liquid repellent portion.

  In the embodiment, the example of the color filter 10 in which the color conversion unit 132 including both the red quantum dots and the green quantum dots is provided in all the through holes 121R, 121G, and 121B of the black matrix unit 12 has been described. However, the present invention is not limited to the configuration in which the color conversion unit 132 is provided in all the through holes 121R, 121G, and 121B of the black matrix unit 12. For example, as in the color filter 2010 provided in the display device 2 illustrated in FIG. 10, the color conversion unit 132 is provided only in the through holes 121R and 121G provided with the red coloring unit 131R and the green coloring unit 131G, and the through hole 121B is provided. May have a configuration in which a light diffusion portion 2132 is provided. The light diffusion part 2132 is made of, for example, a transparent resin base material in which transparent fine particles having a refractive index different from that of the resin base material are dispersed.

  Here, a manufacturing method of the color filter 2010 according to the present modification will be described with reference to FIGS. As shown in FIG. 11, the manufacturing method of the color filter 2010 is different from the manufacturing method according to the embodiment in that a light diffusion portion forming step is included.

  First, after performing a light shielding part forming step (step S201), a liquid repellent part forming step of forming a liquid repellent part on the light shielding part 122 is performed (step S202). The light shielding part forming process and the liquid repellent part forming process are the same as the light shielding part forming process and the liquid repellent part forming process described in the embodiment.

  Next, a colored part forming step for forming the red colored part 131R and the green colored part 131G is performed (step S203). In this colored portion forming step, as in the embodiment, using the photolithography method, as shown in FIG. 12A, the red colored portion 131R and the green colored portion 131G are placed inside the through holes 121R and 121G, respectively. Form.

  Returning to FIG. 11, subsequently, a light diffusion portion forming step for forming the light diffusion portion 2132 is performed (step S <b> 204). In this light diffusing portion forming step, for example, as shown in FIG. 12A, the light diffusing portion 2132 is formed inside the through hole 121B by using photolithography. Specifically, first, a photosensitive resin composition serving as a base of the light diffusion portion 2132 is applied to the substrate 11, the black matrix portion 12, the red coloring portion 131R, and the green coloring portion 131G. This photosensitive resin composition contains transparent particles, a photosensitive resin, and an organic solvent. As a photosensitive resin, the thing similar to the photosensitive resin contained in the photosensitive resin composition used as the base of the liquid-repellent part 123 demonstrated in embodiment, for example can be employ | adopted. Next, the photosensitive resin layer is formed by performing the removal process which removes the organic solvent contained in the apply | coated photosensitive resin composition. The removal process is the same as the removal process described in the embodiment. Subsequently, ultraviolet light UVL is irradiated using an exposure apparatus in a state where a photomask covering only a portion corresponding to the through hole 121B in the photosensitive resin layer is disposed. Subsequently, for example, development is performed using an alkaline developer, and then a removal process is performed to form the light diffusion portion 2132.

  Returning to FIG. 11, thereafter, a composition application step of applying a thermosetting resin composition including red quantum dots and green quantum dots to the black matrix portion 12 is performed (step S <b> 205). In this composition application process, for example, a thermosetting resin composition including quantum dots is applied to the black matrix portion 12 using a die coater including an application head 1050 as shown in FIG. Note that in FIG. 12B, components similar to those in the embodiment are denoted with the same reference numerals as in FIG. At this time, a part of the coating bead B1 enters the through holes 121R and 121G of the black matrix portion 12. And a thermosetting resin composition is provided in the through-holes 121R and 121G of the black matrix portion 12 through the coating bead B1. At this time, the thermosetting resin composition is not left on the liquid repellent part 123 and the light diffusing part 2132 due to the presence of the liquid repellent part 123 and the light diffusing part 2132 having liquid repellency. It flows into the 12 through holes 121R and 121G.

  Returning to FIG. 12, next, the removal process which removes the organic solvent contained in the thermosetting resin composition containing a quantum dot is performed (step S206). As a result, a color conversion unit 132 as shown in FIG. 10 is formed.

  According to this configuration, since the amount of the thermosetting resin composition necessary for forming the color conversion unit 132 can be reduced, the material cost necessary for manufacturing the color filter 2010 can be reduced accordingly.

  In the embodiment, the configuration in which the black matrix portion 12 includes the liquid repellent portion 123 having liquid repellency has been described, but the configuration of the black matrix portion 12 is not limited to the configuration having liquid repellency. For example, a configuration including a black matrix portion 3012 formed of a material having low liquid repellency, such as a color filter 3010 included in the display device 3 illustrated in FIG. In FIG. 13, the same reference numerals as those in FIG. In the method for manufacturing the color filter 3010, when a resin composition that can use an ink jet device is selected in the composition application step, the color conversion unit 132 is formed using the ink jet device as shown in FIG. What is necessary is just to form. The ink jet apparatus includes an ink jet head 50 having a head main body 51, a vibration plate 52 fixed to the head main body 51, and a piezo element 53 joined to the vibration plate 52, for example, as shown in FIG. 14. The head main body 51 includes a plurality of inkjet nozzles 51b from which ink droplets are ejected, and an ink containing portion 51a that communicates with the inkjet nozzles 51b. Here, the composition containing the quantum dots filled in the ink containing portion 51a is applied to the red colored portion 131R, the green colored portion 131G, and the blue colored portion 131B by discharging from the inkjet nozzle 51b.

  By selecting a resin composition that can use an ink jet device for this configuration, the resin composition can be applied to the inside of the through holes 121R, 121G, and 121B without having a liquid repellent portion.

  In the embodiment, a plurality of through holes 121R, 121G, and 121B of the black matrix portion 12 are provided in each pixel region G. As shown in FIG. 1, each of the three regions SBG that constitute each pixel region G is an abbreviation. The example of the color filter 10 located in the center has been described. In the color filter 10, coloring portions 131 </ b> R, 131 </ b> G, and 131 </ b> B are provided inside the three through holes 121 </ b> R, 121 </ b> G, and 121 </ b> B provided in each of the plurality of pixel regions G arranged in the Y-axis direction. However, the arrangement of the through holes 121R, 121G, and 121B is not necessarily limited to the arrangement shown in FIG. For example, as in the display device 4 shown in FIG. 15, through-holes 121 </ b> R (121 </ b> G, 121 </ b> B) provided with colored portions 131 </ b> R (131 </ b> G, 131 </ b> B) of the same color in each of two pixel regions G adjacent in the Y-axis direction are The configuration may be shifted from each other in the X-axis direction (second direction). That is, the plurality of through holes 121R (121G, 121B) are substantially linear in at least one direction (for example, the Y-axis direction) in a direction orthogonal to the thickness direction of the black matrix portion 12, and a direction orthogonal to the linear direction. They are arranged so as to vary (for example, in the X-axis direction).

  Here, at least through-holes 121R (121G, 121B) provided with colored portions 131R (131G, 131B) of the same color arranged in a substantially straight line in the Y-axis direction have variations in the X-axis direction. It only has to be arranged. The through holes 121R, 121G, and 121B provided with colored portions of different colors arranged in a substantially straight line in the X-axis direction may be arranged so as to have variations in the Y-axis direction. In FIG. 15, a plurality of through holes 121R (121G, 121B) arranged in the Y-axis direction are arranged so as to vary in the X-axis direction, and a plurality of through holes 121R, 121G, 121B arranged in the X-axis direction are arranged. In the above description, the linear arrangement extending in the X-axis direction has been described. However, not limited to this, for example, a plurality of through holes 121R (121G, 121B) arranged in the Y-axis direction are arranged in a straight line extending in the Y-axis direction, and a plurality of through-holes 121R, 121G, arranged in the X-axis direction. 121B may be arranged so as to have variations in the Y-axis direction.

  Further, if the through holes 121R (121G, 121B) arranged in a substantially straight line in the Y-axis direction are arranged so as to have variations in the X-axis direction, it has an effect of preventing color spots. Further, even if the through holes 121R, 121G, and 121B arranged in a substantially linear shape in the X-axis direction are arranged so as to have variations in the Y-axis direction, it has an effect of preventing color spots. Even though the plurality of through holes 121R, 121G, and 121B are arranged in a so-called staggered pattern, the through holes 121R (121G, 121G, 121B) having the above-mentioned characteristics has the effect of preventing color spots. In the embodiment and the modification, the case where the pixel region G is rectangular has been described, but the shape of the pixel region G is not limited to the rectangular shape.

  According to this configuration, the color spots are less noticeable by shifting the positions of the red coloring portion 131R, the green coloring portion 131G, and the blue coloring portion 131B provided inside the through holes 121R, 121G, and 121B. The quality of the displayed image is improved.

  The black matrix portion 12 is not limited to a configuration in which the sizes of the through holes 121R, 121G, and 121B are all the same. The black matrix portion may have a configuration in which the size of the through hole is different depending on the color of the colored portion provided in the through hole, for example. Further, the quantities of the through holes 121R, 121G, and 121B are not necessarily the same.

  In the embodiment, an example of the color filter 10 having a structure in which the color conversion unit 132 is stacked on the red coloring unit 131R, the green coloring unit 131G, and the blue coloring unit 131B has been described. However, the present invention is not limited to this, for example, a color conversion unit 5132R formed of a resin in which red quantum dots, green quantum dots, and red pigments are dispersed, such as a color filter 5010 provided in the display device 5 illustrated in FIG. The color conversion part 5132G formed from resin in which a red quantum dot, a green quantum dot, and a green pigment | dye were disperse | distributed may be sufficient. In FIG. 16, the same reference numerals as those in FIG. 10 are assigned to configurations similar to those of the modification described with reference to FIG. 10. In this case, the color conversion unit 5132R has the same function as the red coloring unit that absorbs light in the green wavelength band emitted from the green quantum dots. The color conversion unit 5132G has the same function as the green coloring unit that absorbs light in the red wavelength band emitted from the red quantum dots.

  In the embodiment, the height of the partition wall 23 surrounding the light emitting unit 22 is high enough to reduce the amount of light emitted from the light emitting unit 22 to other pixel regions G to a predetermined level or less. May be set.

  In the embodiment, an example has been described in which the red coloring portion 131R, the green coloring portion 131G, and the blue coloring portion 131B have the same thickness. However, the present invention is not limited thereto, and the red coloring portion 131R, the green coloring portion 131G, and the blue coloring portion 131B The thickness may be different from each other. Alternatively, the thicknesses of the red coloring portion 131R, the green coloring portion 131G, and the blue coloring portion 131B may be equal to each other and different from the remaining one.

  In the manufacturing method of the color filter 10 according to the embodiment, the example using the thermosetting resin composition containing the thermosetting resin has been described. However, the present invention is not limited thereto, and for example, instead of the thermosetting resin, for example, ultraviolet rays are used. A photosensitive resin composition containing a photosensitive resin that cures when irradiated may be used.

  In the embodiment, an example in which the red colored portion 131R, the green colored portion 131G, and the blue colored portion 131B are each provided with a so-called stripe-type color filter 10 arranged in a row has been described. However, the structure of the color filter is not limited to this. For example, the color filter may include a color filter in which a red colored portion, a green colored portion, and a blue colored portion are arranged in a so-called staggered shape.

  In the embodiment, an example in which the black matrix portion 12 has a two-layer structure including a light shielding portion 122 having a light shielding function and a liquid repellent portion 123 having liquid repellency has been described. However, the black matrix portion 12 is not limited to one having a two-layer structure, and may have a single-layer structure having both light-shielding properties and liquid repellency, for example.

  In the embodiment, the example in which the color conversion unit 132 includes red quantum dots and green quantum dots has been described. However, the color conversion material included in the color conversion unit 132 is not limited to quantum dots. For example, instead of quantum dots, the color conversion unit 132 converts an organic material into light having a wavelength band different from the wavelength band of incident light (for example, light in the blue wavelength band to light in the red wavelength band or green wavelength band). The organic material that converts the light into the light may be included. Alternatively, instead of the quantum dots, the color conversion unit 132 may be a phosphor (for example, a phosphor that emits light in the red wavelength band when excited by light in the blue wavelength band, or light in the blue wavelength band). And a phosphor that emits light in a green wavelength band when excited.

  In the embodiment, an example in which a thermosetting resin composition including quantum dots is applied in the composition application step has been described, but the composition including quantum dots is not limited to a composition including a resin.

  In the embodiment, the example in which the red coloring portion 131R, the green coloring portion 131G, and the blue coloring portion 131B are circular in plan view has been described. However, the planar shape of the red coloring portion 131R, the green coloring portion 131G, and the blue coloring portion 131B is as follows. It is not limited to a circle. For example, the red coloring portion 131R, the green coloring portion 131G, and the blue coloring portion 131B may be rectangular in plan view or may be oval.

  In the embodiment, the light emitting unit 22 emits blue light, and the different colored portion is a red colored portion 131R that selectively transmits red light or a green colored portion 131G that selectively transmits green light, and the same colored portion The example in which is the blue coloring portion 131B that selectively transmits blue light has been described. However, the light selectively transmitted by the different colored portions is not limited to red light or green light. Further, the light selectively transmitted by the colored portion of the same color is not limited to blue light. For example, in the case of violet light from the light emitting unit 22, the different colored portion selectively transmits light in the red, green, and yellow wavelength bands, and the same colored portion selectively transmits light in the purple wavelength band. It may be a thing. Moreover, the light source of the light emission part 22 is not restricted to LED. For example, an ultraviolet light source (hereinafter referred to as “UV light source”) is used as the light source of the light emitting unit 22, and a color conversion unit that converts ultraviolet light emitted from the UV light source into red light, green light, and blue light is provided. May be.

  In the embodiment, the example in which the black matrix portion 12 is formed of a photosensitive resin or a thermosetting resin containing a black pigment has been described. However, the material forming the black matrix portion 12 is not limited thereto. The black matrix part 12 may be comprised from metal book films or oxide book films, such as chromium, titanium, aluminum, etc., and those laminated films, for example.

  In the embodiment, the photolithography method is used for the colored portion forming step, but the method that can be used for the colored portion forming step is not limited thereto. For example, a spin coater, a bar coater, a blade coater, a roll coater, a die coater, a stripe coater, a capillary coater, or an ink jet apparatus may be used, or a colored portion may be formed by a screen printing method.

  In the modification, the photolithography method is used for the light diffusion portion forming step, but the method that can be used for the light diffusion portion forming step is not limited to this. For example, the light diffusing portion may be formed using a spin coater, bar coater, blade coater, roll coater, die coater, stripe coater, capillary coater, or ink jet apparatus.

  As mentioned above, although embodiment of this invention and the modification (Including what was written in the description, the following is the same) were demonstrated, this invention is not limited to these. The present invention includes a combination of the embodiments and modifications as appropriate, and a modification appropriately added thereto.

  The present invention can be widely used for manufacturing color filters for displays.

1, 2, 3, 4, 5, 9001: display device 10, 2010, 3010, 4010, 5010, 9010: color filter, 11: substrate, 11a: first main surface, 11b: second main surface, 12, 3012: Black matrix part, 20: Light emitting module, 21: Circuit board, 22: Light emitting part, 23: Partition, 50: Inkjet head, 51: Head body, 51a: Ink containing part, 51b: Nozzle, 52: Diaphragm, 53: Piezo element, 121B, 121G, 121R, 3121B, 3121G, 3121R: Through hole, 122: Light shielding part, 123: Liquid repellent part, 131B: Blue colored part, 131G: Green colored part, 131R: Red colored part, 132 , 5132R, 5132G: color conversion unit, 1050, 2050, 3050: coating head, 1051: front lip, 105 , 2052: rear lip, 1053, 3053: manifold, 1054: slit, 1055, 3055: discharge port, 1123: photosensitive resin layer, 2056: suction port, 2132, 9132B: light diffusion portion, 3054: groove, 9132G: green color Conversion unit, 9132R: red color conversion unit, UVL: ultraviolet ray

Claims (8)

A translucent substrate;
A partition wall having a plurality of through holes stacked in the substrate and penetrating in the thickness direction,
One wavelength band of a plurality of types of wavelength bands different from a wavelength band of incident light provided inside a plurality of through holes equal to or less than the total number of the through holes provided in the partition wall on the substrate. A colored portion that selectively transmits light of
A color conversion material that is provided inside the through-hole provided with the coloring portion on the substrate and converts incident light into light in any one of the plurality of types of wavelength bands. A color conversion unit including a plurality of types,
Color filter. The plurality of through holes are arranged so as to be substantially linear in at least one direction in a direction orthogonal to the thickness direction of the partition wall and to have a variation in a direction orthogonal to the linear direction.
The color filter according to claim 1. The partition wall is thicker than the colored part,
The color filter according to claim 1. The partition wall portion has a liquid repellency, and has a liquid repellent portion provided in a state exposed at least on the surface of the partition wall portion opposite to the substrate side.
The color filter according to claim 1. The color converter is
Red quantum dots that emit light in the red wavelength band by being excited with light in the blue wavelength band;
A green quantum dot that emits light in the green wavelength band by being excited with light in the blue wavelength band,
The color filter of any one of Claims 1 thru | or 4. A light-transmitting substrate, a partition wall portion having a plurality of through holes stacked on the substrate and penetrating in a thickness direction, and a plurality of through holes less than or equal to the total number of the through holes provided in the partition wall portion on the substrate A color filter that is provided inside a hole and includes a coloring unit that selectively transmits light in any one of a plurality of types of wavelength bands different from the wavelength band of incident light, and a color conversion unit A manufacturing method comprising:
A composition containing a plurality of types of color conversion substances for converting incident light into light of any one of a plurality of types of wavelength bands different from the wavelength band of the incident light is applied from an ejection port of the coating head. Including a composition application step of discharging and applying to the inside of the through hole provided with the colored portion,
A method for producing a color filter. The partition wall has liquid repellency, and has at least a liquid repellent portion provided exposed on the surface of the partition wall opposite to the substrate side,
In the composition application step, the application head or the substrate is set in advance while discharging the composition from the discharge port of the application head held in a state separated from the partition wall by a predetermined distance. By relatively moving in one direction, the composition is applied to the surface of the partition wall portion opposite to the substrate side.
The manufacturing method of the color filter of Claim 6. The coating head has a decompression unit that decompresses a region on the opposite side to the direction in which the substrate moves as viewed from the coating head at the discharge port.
The manufacturing method of the color filter of Claim 6 or 7.