JP2018173547A - Optical waveguide film and optical component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical waveguide film whose deformation is suppressed.SOLUTION: An optical waveguide film 100 is an elongated optical waveguide film which includes a lower base material layer 150; a lower clad layer 130; a plurality of pattern-like core parts 112; an upper clad layer 120; and an upper base material layer 140 in this order. The upper base material layer has lib structures 160, 162 protruding than the top surface 142 of the upper base material layer.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an optical waveguide film and an optical component.

  Various studies have been made on optical waveguide films. As such a technique, for example, a technique described in Patent Document 1 is known. In this document, in order to reduce the stress applied to the core pattern and the upper clad layer, and to suppress the interfacial peeling, the core pattern is formed so that a part or all of the periphery is inside the substrate. And an optical waveguide film in which an upper clad layer is formed on a substrate is described (claim 1, paragraph 0014 of Patent Document 1). Further, from the viewpoint that the shape processing of the cover material is not necessary again after being bonded to the upper cladding layer, the outer shape processed cover material shown in FIG. 8C is replaced with the upper cladding material as shown in FIG. It is described that they are bonded to a layer (paragraph 0037 of Patent Document 1).

JP 2014-115480 A

  When this inventor examined, it turned out that the optical waveguide film described in said literature has room for improvement at the point of deformation | transformation of a film.

  The present inventor further examined that the deformation of the optical waveguide film can be suppressed by forming a rib structure protruding from the top surface of the upper base material layer on the upper base material layer in the optical waveguide film. The headline and the present invention were completed.

According to the present invention,
A long optical waveguide film comprising a lower substrate layer, a lower cladding layer, a plurality of patterned core portions, an upper cladding layer and an upper substrate layer in this order,
The upper base material layer is provided with an optical waveguide film having a rib structure protruding from the top surface of the upper base material layer.

Also according to the invention,
An optical component comprising an optical connector and the optical waveguide film having one end inserted into the optical connector is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the optical waveguide film by which the deformation | transformation of the film was suppressed and an optical component using the same are provided.

It is a schematic diagram which shows the structure of an optical waveguide film. It is a schematic diagram which shows the process of cutting out an optical waveguide film from an optical waveguide sheet. It is a figure which shows the rib structure of an optical waveguide sheet. It is a figure for demonstrating the evaluation method of an optical waveguide film.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate. In the present embodiment, description will be made by defining the front-rear, left-right, up-down directions as shown. However, this is provided for the sake of convenience in order to briefly explain the relative relationship between the components. Therefore, the direction at the time of manufacture and use of the product which implements the present invention is not limited.

The outline | summary of the optical waveguide film of this embodiment is demonstrated.
The optical waveguide film of this embodiment has a laminated structure in which a lower base layer, a lower clad layer, a plurality of patterned core parts, an upper clad layer, and an upper base layer are laminated in this order, and is long. It can comprise with a resin film.
In such an optical waveguide film, the upper base material layer is configured to have a rib structure protruding from the top surface of the upper base material layer.

The optical waveguide film of the present embodiment has a multilayer structure in which these are sandwiched between the lower base layer and the upper base layer so as to protect the lower clad layer and the upper clad layer. Are better.
With respect to such a multilayer structure, the present inventors have newly found that the deformation of the optical waveguide film can be suppressed by forming a rib structure protruding from the top surface of the upper base material layer on the upper base material layer. As a result, the detailed mechanism is not clear, but it is possible to suppress unintentional warpage deformation, which is thought to be caused by residual stress at the time of waveguide film production, so that the optical loss of the optical waveguide film can be reduced. Is possible.

Moreover, the optical waveguide film of this embodiment can be used for the use which comprises some optical components. Such an optical component can include an optical connector and an optical waveguide film having one end inserted in the optical connector. The optical connector and the optical waveguide film can be joined via an adhesive. When the optical waveguide film of the present embodiment is used for inserting an optical connector, the rib structure prevents the adhesive formed on the top surface of the upper base layer of the optical waveguide film from flowing from the top surface to the end surface or side surface. can do.
Therefore, according to the optical waveguide film of the present embodiment, since contamination of the end face of the optical waveguide can be suppressed, the manufacturing stability of the optical component can be improved, and a structure excellent in optical connection reliability can be realized.

Hereinafter, the structure of the optical waveguide film of this embodiment will be described in detail.
FIG. 1 is a perspective view showing an example of the structure of the optical waveguide film 100.

  As shown in FIG. 1, the optical waveguide film 100 of the present embodiment includes a lower clad layer 130, a patterned core portion 112 provided on the lower clad layer 130, and an upper portion provided on the core portion 112. The clad layer 120 may have a laminated structure in which the clad layer 120 is laminated. In this laminated structure, the lower base material layer 150 is disposed on the lower surface side of the lower clad layer 130, and the upper base material layer 140 is disposed on the upper surface side of the upper clad layer 120. Thereby, the mechanical characteristics and durability of the optical waveguide film 100 can be improved.

  In the optical waveguide film 100 of the present embodiment, as shown in FIG. 1, rib structures 160 and 162 are formed on the top surface 142 of the upper base material layer 140 opposite to the surface on which the upper cladding layer 120 is disposed. Can have different structures. Thereby, deformation of the optical waveguide film 100 can be suppressed.

  In the optical waveguide film 100 of this embodiment, the rib structures 160 and 162 may be formed on the upper base material layer 140 on the waveguide end surface 101 side of the optical waveguide film 100, and on the side surface 104 side of the optical waveguide film 100. It may be formed on the upper base material layer 140 or may be formed on both sides. The rib structures 160 and 162 are integrally formed with the upper base material layer 140.

  As shown in FIG. 1, the rib structure 160 is formed on the upper base material layer 140 on the waveguide end face 101 side. That is, the rib structure 160 is formed on the end surface 144 of the upper base material layer 140 and has a structure protruding from the top surface 142 of the upper base material layer 140. Here, the waveguide end face 101 through which light is input and output is formed at one end of the optical waveguide film 100 in the longitudinal direction. Due to the rib structure 160 formed on the end surface 144 side of the upper base material layer 140, deformation in the lateral direction can be suppressed on the waveguide end surface 101 of the optical waveguide film 100. Moreover, it can suppress that an adhesive agent flows out from the top surface 142 of the upper base material layer 140 through the end surface 144, and the waveguide end surface 101 of the core layer 110 is contaminated. Thereby, the optical reliability of the optical waveguide film 100 can be improved.

On the other hand, the rib structure 162 is formed on the side surface 104 side along the longitudinal direction of the optical waveguide film 100. That is, the rib structure 162 is formed on the side surface 146 side of the upper base material layer 140 and has a structure protruding from the top surface 142 of the upper base material layer 140. The rib structure 162 formed on the side surface 146 of the upper base material layer 140 can suppress deformation in the longitudinal direction of the optical waveguide film 100 and can reduce light loss. Further, the adhesive flowed out from the top surface 142 of the upper base material layer 140 through the side surface 146 contaminates the waveguide end surface 101 of the core layer 110 when the optical waveguide film 100 is inserted into the optical connector. Can be suppressed. Thereby, the optical reliability of the optical waveguide film 100 can be improved.
Moreover, when it has the rib structure 162 and the rib structure 160, these may be formed independently, respectively, without continuing.

  In the present embodiment, the lower limit value of the rib height from the top surface 142 of the upper base material layer 140 to the upper ends of the rib structures 160 and 162 in the vertical direction may be, for example, 1 μm or more, preferably 1.5 μm or more. More preferably, it is good also as 2 micrometers or more. Thereby, a deformation | transformation of the optical waveguide film 100 and the flow-out of the above-mentioned adhesive agent can be suppressed. On the other hand, the upper limit of the rib height is, for example, 50 μm or less, preferably 30 μm or less, more preferably 20 μm or less, and further preferably 10 μm or less. Thereby, the structure of the optical waveguide film 100 excellent in optical connector insertion property is realizable.

  The rib structures 160 and 162 may have a curl shape. The specific curl shape may be, for example, a curved shape (a shape at the time of the shape) in which at least a part is curved so that the tips of the rib structures 160 and 162 face the surface opposite to the top surface 142. The winding shape may be such that the tips of 160 and 162 are wound toward the top surface 142 side of the upper base material layer 140 or the inner wall surfaces of the rib structures 160 and 162. Thereby, since the mechanical strength of the rib structures 160 and 162 can be increased, the deformation of the optical waveguide film 100 can be further suppressed.

In the present embodiment, the rib structure 160 formed on the end surface 144 side may be formed over at least a part or the entire surface of the upper base material layer 140. The width of the rib structure 160 in the short direction may be, for example, 1 / 3L ₁ or more, or 1 / 2L ₁ or more, and 2 / 3L, where L ₁ is the width of the upper base material layer 140 in the short direction. _It may be ₁ or more, and may be L ₁ or less. By increasing the width of the rib structure 160 in the short direction, the mechanical strength of the optical waveguide film 100 can be increased.

In the present embodiment, the rib structure 162 formed on the side surface 104 side may be formed on at least a part of the upper base material layer 140. The rib structure 162 may be formed over a predetermined length from a corner where the end surface 144 and the side surface 104 intersect, for example.
The width of the rib structure 162 in the longitudinal direction, when the length of the upper base layer 140 in the longitudinal direction is _{L 2,} for example, may be 1 / 30L ₂ or more, may be a 4 / 30L ₂ or more, 6 / 30L ₂ may be above, on the other hand, it may be L ₂ below. By increasing the width of the rib structure 162 in the longitudinal direction, the mechanical strength of the optical waveguide film 100 can be increased. Further, the end surface 144 and the side surface 104 can be prevented from being contaminated by the adhesive.

  The rib structures 160 and 162 can be made of the same material as that of the upper base layer 140. For example, polyolefins such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethylene, and polypropylene, polyimide, polyamide, It may be composed of polyetherimide, polycarbonate, or polyethersulfone. These may be used alone or in combination of two or more. Among these, from the viewpoint of mechanical strength, the rib structures 160 and 162 may be made of polyimide.

  In this embodiment, for example, the height and shape of the rib structures 160 and 162 can be controlled by appropriately selecting the constituent material of the optical waveguide film 100, the method of making the optical waveguide film 100, and the like. Among these, for example, the rotational speed, cutting speed, blade type, bond (bonding material) type, roughness of the blade surface such as the particle size and concentration of the grinding wheel, and the degree of protrusion of the grinding wheel on the blade surface such as the amount of protrusion of the grinding wheel, etc. The ribs are adjusted by adjusting the protrusion amount of the grindstone by dicing the plastic film or dressboard, appropriately controlling the material, elastic modulus, thickness, etc. of the upper base material layer 140. The presence / absence and height of the structures 160 and 162 can be cited as elements for setting the desired numerical range.

  The optical waveguide film 100 is a long resin film and can itself stand alone. The optical waveguide film 100 has toughness and can be used in a bent state or not.

  The optical waveguide film 100 of the present embodiment can be a long plate member with respect to the longitudinal direction of the core portion 112. That is, the length in the longitudinal direction of the optical waveguide film 100 is longer than the width in the short direction of the optical waveguide film 100. Here, in the present embodiment, in the top view of the optical waveguide film 100, the direction in which the core portion 112 extends is defined as the longitudinal direction, the direction orthogonal to the longitudinal direction, and the plurality of core portions 112 are The side-by-side direction is the short direction.

  Further, an optical connector insertion region 106 may be formed at one end of the optical waveguide film 100. The optical connector insertion region 106 is formed from one end of the optical waveguide film 100 to a predetermined position. A waveguide end face 101 is formed on the end face of the optical waveguide film 100 in the optical connector insertion region 106. The waveguide end surface 101 functions as a light incident surface. For example, light can be input and output on the waveguide end face 101 of the optical waveguide film 100 via an optical connector.

  Such an optical waveguide film 100 can have an optical connector insertion region 106 at least at one end, and can be used for an optical component in which the one end (optical connector insertion region 106) is inserted into the optical connector.

  On the other hand, at the other end of the optical waveguide film 100, an optical connector insertion region may be formed in the same manner, but an optical conversion region 107 may be formed. For example, a groove (not shown) may be formed on the surface (the top surface 142) of the light conversion region 107. The groove functions as a mirror that performs optical path conversion of an optical signal that passes through the core 112.

  In the optical waveguide film 100 of the present embodiment, the core portion 112 may extend from the optical connector insertion region 106 to the light conversion region 107. Moreover, the core part 112 may extend from the waveguide end face 101 at one end to the end face in the light conversion region 107 at the other end. However, when the groove part is formed in the light conversion area 107, the core part 112 in the light conversion area 107 may be divided by the groove part.

  Further, in the short direction of the optical waveguide film 100, the core layer 110 has a plurality of core portions 112 spaced apart from each other. A clad portion 114 is formed between the core portions 112. Thus, in the present embodiment, the core portion 112 is covered with the clad layer (upper clad layer 120, lower clad layer 130) or the clad portion 114 on the upper, lower, left and right sides, so that excellent optical characteristics can be realized. it can.

  On the other hand, on the side surface of the optical waveguide film 100, the core layer 110 has a structure in which the core portion 112 is covered with the clad portion 114. That is, the plurality of core portions 112 can have a structure in which both side surfaces are covered with the cladding portions 114. Thereby, the core part 112 can be protected.

  The outer shape of the optical waveguide film 100 is not limited to an example of a rectangular shape, and may be, for example, a bifurcated shape or a tridental shape.

  The core layer 110 of the optical waveguide film 100 may be a single layer, but a plurality of core layers may be formed with a cladding layer interposed therebetween.

Next, the manufacturing method of the optical waveguide film 100 of this embodiment is demonstrated.
FIG. 2 is a diagram illustrating an example of a manufacturing process of the optical waveguide film 100 of the present embodiment. FIG. 2A is a top view of the optical waveguide sheet 10 of the present embodiment. FIG. 2B is a cross-sectional view taken along the line AA ′ in FIG. 2A, showing a laminated structure of the optical waveguide sheet 10 of the present embodiment.

  As a manufacturing method of the optical waveguide film 100 of the present embodiment, the lower base layer 150, the lower clad layer 130, the patterned core portion 112, the upper clad layer 120, and the upper base layer 140 were laminated in this order. A preparation process for preparing the optical waveguide sheet 10 and a cutting process for cutting out the optical waveguide film 100 that is long in the longitudinal direction of the core portion 112 from the optical waveguide sheet 10 can be provided.

(Preparation process of optical waveguide sheet 10)
First, an optical waveguide sheet 10 as shown in FIG. 2 is prepared. The preparation process of the present embodiment includes a lower base layer 150, a lower clad layer 130 formed on the lower base layer 150, a patterned core portion 112 provided on the lower clad layer 130, and the core portion 112. A step of forming a film structure (optical waveguide sheet 10) in which the upper clad layer 120 provided and the upper base material layer 140 formed on the upper clad layer 120 are laminated can be included.

  The optical waveguide sheet 10 of the present embodiment has a film shape, may be a single wafer shape, or may be a rollable roll shape. Moreover, you may cut | judge the optical waveguide sheet 10 of this embodiment in the some block (partition) which has a predetermined area before the said cutting process. Thereby, the handleability of the optical waveguide sheet 10 can be improved. Each block may have an area equivalent to a plurality of optical waveguide films 100 from the viewpoint of productivity. Each section can be rectangular.

  The optical waveguide sheet 10 has a predetermined shape in a top view, but may be rectangular or square. From the viewpoint of productivity, the optical waveguide sheet 10 may extend so as to be longer in the longitudinal direction in which the core portion 112 extends than in the short direction perpendicular to the longitudinal direction.

  As shown in FIG. 2A, the optical waveguide sheet 10 according to the present embodiment only needs to have at least one area of the optical waveguide film 100 in a top view. It is preferable to have the total area of the waveguide film 100. For example, the width of the optical waveguide sheet 10 in the longitudinal direction may have an area where one or more of the optical waveguide films 100 can be cut off, and the width of the optical waveguide sheet 10 in the lateral direction is One or two or more optical waveguide films 100 may have an area from which a short portion can be cut off.

  The preparation step may include a step of forming the lower clad layer 130 on the upper surface side of the lower base material layer 150 and a step of forming the upper base material layer 140 on the upper surface side of the upper clad layer 120. As a specific example, first, the lower cladding layer 130 is formed on the surface of the substrate (lower substrate layer 150). Subsequently, the core portion 112 having a pattern shape is formed on the surface of the lower cladding layer 130. Subsequently, the upper clad layer 120 is formed so as to cover the core portion 112. Thereafter, the upper base material layer 140 is formed on the surface of the upper cladding layer 120.

  In the present embodiment, a method for forming the core portion 112 having the above-described pattern shape is not particularly limited. For example, various optical waveguide processing methods such as an exposure method, an etching method, and a replication method can be used.

In the case of an optical waveguide processing method using an exposure method, for example, a first step that does not require a development step by a photolithography method and a second step that requires a development step can be employed as follows.
First, a lower clad layer and a core layer are formed on a substrate. Subsequently, a core pattern is formed on the core layer by photolithography. For example, an exposure process of irradiating the core layer with actinic rays is performed through a photomask having a core pattern.
Here, in the case of a 1st process, the core part patterned in the exposure area | region is formed among core layers, and a clad part is formed in an unexposed area | region. On the other hand, in the case of the second step, a cured portion (core portion) is formed in the exposed region of the core layer, and an uncured portion is formed in the unexposed region. Then, the uncured portion is removed in a development process using a developing solution such as various solvents and an alkaline solution, and the core portion patterned is formed by leaving the cured portion. Thereafter, an upper clad layer is formed on the core portion.
Further, after forming the core layer, a lower clad layer and an upper clad layer may be laminated on both sides of the obtained core layer, respectively.

  Moreover, in the case of the optical waveguide processing method by an etching method, the following processes can be employed, for example. First, a lower clad layer and a core layer are formed on a substrate. A photoresist having a pattern is formed on the core layer. The underlying core layer is patterned using the photoresist as a mask. For the patterning, for example, various etching methods such as reactive ion etching are used. Then, after removing the mask, an upper clad layer is formed so as to embed the patterned core portion.

  Moreover, in the case of the optical waveguide processing method by the replication method, the following processes can be employed, for example. First, a lower clad layer is formed on a substrate. A mold having a core pattern is pressed against the lower clad layer to form a core pattern-shaped hole in the inner direction of the lower clad layer. A varnish-like resin composition for forming a core layer is injected into the formed hole to form a patterned core. Then, an upper clad layer is formed on the core portion.

  In the present embodiment, a varnish-like resin composition is applied as a method for forming a cladding layer (upper cladding layer 120, upper cladding layer 120) or core layer 110 on a substrate (lower substrate layer 150). A method or a method of laminating a resin film made of a varnish-like resin composition is used.

Examples of the coating method include a direct coating method using various coaters such as a pin coater, a die coater, a comma coater, and a curtain coater, and a printing method such as screen printing. It can be partially applied by a printing method.
Moreover, as a method of forming said resin film, the method of drying the obtained coating film after apply | coating a varnish-like resin composition on a base material can be used, for example.
Moreover, as said lamination | stacking method, it is using the method of laminating | stacking a film-form resin film, for example using roll lamination, vacuum roll lamination, flat plate lamination, vacuum flat plate lamination, an atmospheric pressure press, a vacuum press, etc. it can.

  In the present embodiment, for example, a layer such as the lower cladding layer 130 may be once formed on the base material (lower base material layer 150), and then the base material may be peeled off. In this case, the lower clad layer 130 may be cured before the core layer 110 is formed. Thereby, the strength of the lower cladding layer 130 can be improved.

  Next, each component of the core layer 110 (or the core portion 112), the clad layer (the upper clad layer 120 and the lower clad layer 130), and the base material layer (the upper base material layer 140 and the lower base material layer 150) will be described.

(Core layer forming resin composition)
The core layer forming resin composition of the present embodiment can include, for example, polymer A, monomer A, and polymerization initiator A.

  Examples of the polymer A include, for example, acrylic resins, methacrylic resins, polycarbonates, polystyrenes, cyclic ether resins such as epoxy resins and oxetane resins, polyamides, polyimides, polybenzoxazoles, polysilanes, polysilazanes, and silicone resins. Fluorine resin, polyurethane, polyolefin resin, polybutadiene, polyisoprene, polychloroprene, polyester such as PET and PBT, polyethylene succinate, polysulfone, polyether, and cyclic such as benzocyclobutene resin and norbornene resin Olefin-based resin, phenoxy resin, etc. may be mentioned, and one or more of these may be used in combination as a polymer alloy, polymer blend (mixture), copolymer, etc. It can be.

Among these, acrylic resins, phenoxy resins, cyclic olefin resins, and the like can be used.
As the acrylic resin, for example, one kind selected from the group consisting of monofunctional acrylate, polyfunctional acrylate, monofunctional methacrylate, polyfunctional methacrylate, urethane acrylate, urethane methacrylate, epoxy acrylate, epoxy methacrylate, polyester acrylate, or urea acrylate Examples thereof include polymers of acrylic compounds containing the above. The acrylic resin may have a polyester skeleton, a polypropylene glycol skeleton, a bisphenol skeleton, a fluorene skeleton, a tricyclodecane skeleton, a dicyclopentadiene skeleton, or the like.
Examples of the phenoxy resin include those containing bisphenol A, a bisphenol A type epoxy compound or a derivative thereof, and bisphenol F, a bisphenol F type epoxy compound or a derivative thereof as a constituent unit of a copolymer component.

  The content of the polymer A is, for example, preferably 15% by mass or more, preferably 40% by mass or more, and 60% by mass or more with respect to the entire solid content of the core layer forming resin composition. Is more preferable. Thereby, mechanical characteristics are improved. Further, the content of the polymer contained in the core layer forming resin composition is, for example, preferably 95% by mass or less, and 90% by mass or less, based on the entire solid content of the core layer forming resin composition. Is more preferable. Thereby, optical characteristics are improved.

  In the present embodiment, the entire solid content of the resin composition refers to the non-volatile content in the composition resin and refers to the remainder excluding volatile components such as water and solvent. Moreover, in this embodiment, content with respect to the whole resin composition refers to content with respect to the whole solid content except the solvent of a resin composition, when a solvent is included.

  The monomer A is not particularly limited as long as it is a compound having a polymerizable site in the molecular structure, and examples thereof include acrylic acid (methacrylic acid) monomers, epoxy monomers, oxetane monomers, norbornene monomers, A vinyl ether monomer, a styrene monomer, a photodimerization monomer and the like can be mentioned, and one or more of these can be used in combination.

Among these, acrylic acid (methacrylic acid) monomers and epoxy monomers may be used.
As an acrylic acid (methacrylic acid) monomer, for example, a compound having two or more ethylenically unsaturated groups may be used, or a bifunctional or trifunctional or higher (meth) acrylate may be used. For example, aliphatic (meth) acrylate, alicyclic (meth) acrylate, aromatic (meth) acrylate, heterocyclic (meth) acrylate, or ethoxylated, propoxylated, ethoxylated propoxylated, caprolactone thereof Examples include modified products. In addition, the molecule may have a bisphenol skeleton, a urethane skeleton, or the like.
As an epoxy-type monomer, an alicyclic epoxy compound, an aromatic epoxy compound, an aliphatic epoxy compound, etc. are mentioned.

  As said monomer A, you may use the photopolymerizable monomer which reacts in an irradiation area | region and produces | generates a reaction material by irradiation of active rays, such as visible light, an ultraviolet-ray, infrared rays, a laser beam, an electron beam, and an X-ray. The monomer A is movable in an in-plane direction perpendicular to the film thickness in the core layer during irradiation with active light, and the refractive index difference between the active light irradiation region and the non-irradiation region in the core layer. May be generated.

  The content of the monomer A is preferably 1% by mass or more and 70% by mass or less, and more preferably 10% by mass or more and 60% by mass or less with respect to 100% by mass of the polymer A. Thereby, refractive index modulation can be caused more reliably.

(Polymerization initiator)
The polymerization initiator A is appropriately selected according to the type of polymerization reaction or crosslinking reaction of the monomer A. Examples of the polymerization initiator A include radical polymerization initiators such as acrylic acid (methacrylic acid) monomers and styrene monomers, and cationic polymerization initiators such as epoxy monomers, oxetane monomers, and vinyl ether monomers. it can.

  Examples of the radical polymerization initiator include benzophenones and acetophenones. Specifically, Irgacure 651, Irgacure 819, Irgacure 2959, Irgacure 184 (above, manufactured by BASF Japan) and the like can be mentioned.

  Examples of the cationic polymerization initiator include a Lewis acid generating type such as a diazonium salt and a Bronsted acid generating type such as an iodonium salt and a sulfonium salt. Specifically, Adekaoptomer SP-170 (manufactured by ADEKA), Sun-Aid SI-100L (manufactured by Sanshin Chemical Industry), Rhodorsil 2074 (manufactured by Rhodia Japan) and the like can be mentioned.

  The content of the polymerization initiator A is preferably 0.01% by mass to 5% by mass and more preferably 0.05% by mass to 3% by mass with respect to 100% by mass of the polymer A. preferable. Thereby, a monomer can be made to react rapidly, without reducing the optical characteristic and mechanical characteristic of a core layer.

(Other)
The resin composition for forming the core layer includes, for example, a crosslinking agent, a sensitizer (photosensitizer), a catalyst precursor, a cocatalyst, an antioxidant, an ultraviolet absorber, a light stabilizer, a silane coupling agent, and a coating surface. It further contains improvers, thermal polymerization inhibitors, leveling agents, surfactants, colorants, storage stabilizers, plasticizers, lubricants, fillers, inorganic particles, deterioration inhibitors, wettability improvers, antistatic agents, etc. Also good.

(solvent)
Examples of the solvent contained in the core layer forming resin composition include acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, cyclohexane, heptane, cyclohexane, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethyl sulfoxide, ethylene glycol, Ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, cellosolve, carbitol, anisole, and N-methyl Organic solvents such as pyrrolidone It can include one or more selected from.

(Clad layer forming resin composition)
The resin composition for forming a clad layer of the present embodiment can include, for example, polymer B, monomer B, and polymerization initiator B.

  Examples of the polymer B include, for example, acrylic resins, methacrylic resins, polycarbonate, polystyrene, cyclic ether resins such as epoxy resins and oxetane resins, polyamides, polyimides, polybenzoxazoles, polysilanes, polysilazanes, and silicone resins. Fluorine resin, polyurethane, polyolefin resin, polybutadiene, polyisoprene, polychloroprene, polyester such as PET and PBT, polyethylene succinate, polysulfone, polyether, and cyclic such as benzocyclobutene resin and norbornene resin Olefin-based resin, phenoxy resin, etc. may be mentioned, and one or more of these may be used in combination as a polymer alloy, polymer blend (mixture), copolymer, etc. It can be.

Among these, acrylic resins, phenoxy resins, cyclic olefin resins, and the like can be used.
As the acrylic resin, for example, one kind selected from the group consisting of monofunctional acrylate, polyfunctional acrylate, monofunctional methacrylate, polyfunctional methacrylate, urethane acrylate, urethane methacrylate, epoxy acrylate, epoxy methacrylate, polyester acrylate, or urea acrylate Examples thereof include polymers of acrylic compounds containing the above. The acrylic resin may have a polyester skeleton, a polypropylene glycol skeleton, a bisphenol skeleton, a fluorene skeleton, a tricyclodecane skeleton, a dicyclopentadiene skeleton, or the like.
Examples of the phenoxy resin include those containing bisphenol A, a bisphenol A type epoxy compound or a derivative thereof, and bisphenol F, a bisphenol F type epoxy compound or a derivative thereof as a constituent unit of a copolymer component.

  Further, the polymer B may contain a thermosetting resin as necessary. As thermosetting resins, for example, amino resins, isocyanate compounds, blocked isocyanate compounds, maleimide compounds, benzoxazine compounds, oxazoline compounds, carbodiimide compounds, cyclocarbonate compounds, polyfunctional oxetane compounds, episulfide resins, epoxy resins, etc. The thermosetting resin can be used.

  The content of the polymer B is, for example, preferably 15% by mass or more, preferably 40% by mass or more, and 60% by mass or more with respect to the entire solid content of the resin composition for forming a cladding layer. Is more preferable. Thereby, mechanical characteristics are improved. Further, the content of the polymer contained in the core layer forming resin composition is, for example, preferably 95% by mass or less, and 90% by mass or less, based on the entire solid content of the core layer forming resin composition. Is more preferable. Thereby, optical characteristics are improved.

  The monomer B is not particularly limited as long as it is a compound having a polymerizable site in the molecular structure, and examples thereof include acrylic acid (methacrylic acid) monomers, epoxy monomers, oxetane monomers, norbornene monomers, A vinyl ether monomer, a styrene monomer, a photodimerization monomer and the like can be mentioned, and one or more of these can be used in combination.

Among these, acrylic acid (methacrylic acid) monomers and epoxy monomers may be used.
As an acrylic acid (methacrylic acid) monomer, for example, a compound having two or more ethylenically unsaturated groups may be used, or a bifunctional or trifunctional or higher (meth) acrylate may be used. For example, aliphatic (meth) acrylate, alicyclic (meth) acrylate, aromatic (meth) acrylate, heterocyclic (meth) acrylate, or ethoxylated, propoxylated, ethoxylated propoxylated, caprolactone thereof Examples include modified products. In addition, the molecule may have a bisphenol skeleton, a urethane skeleton, or the like.
As an epoxy-type monomer, an alicyclic epoxy compound, an aromatic epoxy compound, an aliphatic epoxy compound, etc. are mentioned.

  The content of the monomer B is preferably 1% by mass or more and 70% by mass or less, and more preferably 10% by mass or more and 60% by mass or less with respect to 100% by mass of the polymer B. Thereby, refractive index modulation can be caused more reliably.

(Polymerization initiator)
The polymerization initiator B is appropriately selected according to the type of polymerization reaction or crosslinking reaction of the monomer B. Examples of the polymerization initiator B include radical polymerization initiators such as acrylic acid (methacrylic acid) monomers and styrene monomers, and cationic polymerization initiators such as epoxy monomers, oxetane monomers, and vinyl ether monomers. it can.

  Examples of the radical polymerization initiator include benzophenones and acetophenones. Specifically, Irgacure 651, Irgacure 819, Irgacure 2959, Irgacure 184 (above, manufactured by BASF Japan) and the like can be mentioned.

  Examples of the cationic polymerization initiator include a Lewis acid generating type such as a diazonium salt and a Bronsted acid generating type such as an iodonium salt and a sulfonium salt. Specifically, Adekaoptomer SP-170 (manufactured by ADEKA), Sun-Aid SI-100L (manufactured by Sanshin Chemical Industry), Rhodorsil 2074 (manufactured by Rhodia Japan) and the like can be mentioned.

  The content of the polymerization initiator B is preferably 0.01% by mass to 5% by mass and more preferably 0.05% by mass to 3% by mass with respect to 100% by mass of the polymer B. preferable. Thereby, a monomer can be made to react rapidly, without reducing the optical characteristic and mechanical characteristic of a core layer.

(Other)
The clad layer forming resin composition includes, for example, a crosslinking agent, a sensitizer (photosensitizer), a catalyst precursor, a cocatalyst, an antioxidant, an ultraviolet absorber, a light stabilizer, a silane coupling agent, and a coating surface. It further contains improvers, thermal polymerization inhibitors, leveling agents, surfactants, colorants, storage stabilizers, plasticizers, lubricants, fillers, inorganic particles, deterioration inhibitors, wettability improvers, antistatic agents, etc. Also good.

(solvent)
Examples of the solvent contained in the resin composition for forming a cladding layer include acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, cyclohexane, heptane, cyclohexane, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethyl sulfoxide, ethylene glycol, Ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, cellosolve, carbitol, anisole, and N-methyl Existence of pyrrolidone, etc. It can include one or more selected from solvents.

  The resin composition for forming a varnish-like core layer or the resin composition for forming a clad layer is prepared by, for example, adding a solution obtained by adding each of the above components to a solvent and stirring the solution using, for example, a PTFE filter having a pore size of 0.2 μm. It can be obtained by filtration. In this case, for example, various mixers such as an ultrasonic dispersion method, a high-pressure collision dispersion method, a high-speed rotation dispersion method, a bead mill method, a high-speed shear dispersion method, and a rotation and revolution dispersion method can be used.

  The core part 112 in the core layer 110 of this embodiment may be comprised with the above-mentioned resin composition for core layer formation. Further, the upper clad layer 120 and the lower clad layer 130 may each be composed of the same or different kind of the above-mentioned resin composition for forming a clad layer.

(Base material layer)
As a constituent material of the base material layer (upper base material layer 140, lower base material layer 150), for example, polyolefin such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethylene, polypropylene, polyimide, polyamide, poly Examples include ether imide, polycarbonate, and polyether sulfone. As the base material layer, films made of these constituent materials can be used.

  In this embodiment, the upper base material layer 140 and the lower base material layer 150 may be made of the same kind of material. For example, the upper base material layer 140 and the lower base material layer 150 may be composed of a polyimide layer containing polyimide.

In the present embodiment, the lower limit values of the film thicknesses of the upper base material layer 140 and the lower base material layer 150 may be, for example, 5 μm or more, preferably 10 μm or more. On the other hand, the upper limit of the film thickness of the upper base material layer 140 and the lower base material layer 150 may be, for example, 50 μm or less, preferably 30 μm or less, and more preferably 25 μm or less.
In the present embodiment, the film thickness of the lower base material layer 150 may be the same as the film thickness of the upper base material layer 140.

In the present embodiment, the lower limit of the elastic modulus of the upper base material layer 140 and the lower base material layer 150 may be, for example, 1 GPa or more, preferably 2 GPa or more, more preferably 3 GPa or more. On the other hand, the upper limit of the elastic modulus of the upper base material layer 140 and the lower base material layer 150 may be, for example, 12 GPa or less, preferably 11 GPa or less, and more preferably 10 GPa or less.
In the present embodiment, the elastic modulus of the lower base material layer 150 may be different from the elastic modulus of the upper base material layer 140. In the present embodiment, the elastic modulus is a tensile elastic modulus.

  In the present embodiment, the lower limit values of the film thicknesses of the upper cladding layer 120 and the lower cladding layer 130 may be, for example, 1 μm or more, preferably 3 μm or more, more preferably 5 μm or more. On the other hand, the upper limit values of the film thicknesses of the upper cladding layer 120 and the lower cladding layer 130 may be, for example, 50 μm or less, preferably 30 μm or less, and more preferably 15 μm or less. The film thickness of the upper clad layer 120 may be the film thickness of the upper clad layer 120 on the core portion 112, for example.

  In the present embodiment, the lower limit value of the total film thickness of the optical waveguide sheet 10 (optical waveguide film 100) may be, for example, 50 μm or more, preferably 60 μm or more, and more preferably 70 μm or more. On the other hand, the upper limit of the total film thickness of the optical waveguide sheet 10 (optical waveguide film 100) may be, for example, 300 μm or less, preferably 200 μm or less, and more preferably 150 μm or less.

(Cutting process of optical waveguide film 100)
Next, the optical waveguide film 100 is cut out from the optical waveguide sheet 10.
As shown in FIG. 2A, the optical waveguide film 100 of the present embodiment can be obtained by the cutting process of cutting the optical waveguide sheet 10 along the cut region indicated by the dotted line.

  In the present embodiment, the cutting step can be performed with the lower base material layer 150 side of the optical waveguide sheet 10 fixed to a dicing tape. As the dicing tape, for example, a type of tape whose adhesive strength is reduced by irradiation with ultraviolet rays (UV) may be used. In this case, the optical waveguide film 100 separated by the cutting process can be separated from the dicing tape by UV irradiation after the cutting process.

  In the present embodiment, the dicing condition may be, for example, the state in which the upper base material layer 140 is exposed, an upper base material layer that is thicker than the upper clad layer 120 and has a relatively higher elastic modulus than the upper clad layer 120. 140 may be used, the direction of the dicing blade may be set so as to be perpendicular to the film thickness direction of the optical waveguide sheet 10, and the periphery of the optical waveguide film 100 may be set in a certain direction (for example, clockwise) In addition, dicing may be performed so as to make two rounds. In addition, conditions such as the number of rotations and moving speed of the dicing blade can be appropriately selected. Moreover, you may perform air washing | cleaning using gas, such as an inert gas, with respect to the cut surface after the said cutting process.

  In the present embodiment, for example, a dicing blade can be used as the cutting means used in the cutting process. At least one surface or both surfaces of the waveguide end surface 101 or the side surface 104 of the optical waveguide film 100 may be cut out by a dicing blade. A region other than the region cut out by the dicing blade may be cut out by other cutting means. Examples of the other cutting means include one or more selected from the group consisting of cutting with a cutting saw, laser, router, ultrasonic cutter or water jet, and punching with a blade shape.

  According to this embodiment, for example, by cutting out the waveguide end surface 101 by a precision cutting means using a dicing blade, it is possible to suppress light attenuation due to light scattering at the waveguide end surface 101 of the optical waveguide film 100. it can. Further, for example, by cutting out the side surface 104 of the optical waveguide film 100 by a high processing cutting means using other cutting means, the processing speed is improved and the curve processing becomes easy.

  Moreover, you may perform the cutting-out process of the optical waveguide film 100, after forming a groove part not shown. For example, a dicing blade may be used to form the groove.

  As described above, the optical waveguide film 100 is obtained from the optical waveguide sheet 10.

The manufacturing method of the optical component of this embodiment can have the process of inserting the end (optical connector insertion area | region 106) of the optical waveguide film 100 obtained by the manufacturing method of the above-mentioned optical waveguide film 100 in an optical connector. For example, the optical connector and the optical waveguide film can be bonded via an adhesive. A known adhesive can be used as the adhesive, but for example, a photo-curable adhesive may be used. At this time, the optical connector and the optical waveguide film 100 can be fixed by irradiating energy rays such as UV to cure the photocurable adhesive.
As described above, the optical component of the present embodiment is obtained.

  In the optical component of the present embodiment, an optical connector may be formed on at least one end (optical connector insertion region 106) of the optical waveguide film 100, but an optical connector may be formed on each of both ends of the optical waveguide film 100. Good.

  In the present embodiment, the optical connector is not particularly limited. For example, an MT connector, an MPO connector, an MPX connector, a PMT connector, a PT connector, or the like can be used.

  As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

  EXAMPLES Hereinafter, although this invention is demonstrated in detail with reference to an Example, this invention is not limited to description of these Examples at all.

1. 6. Production of Optical Waveguide Sheet (1) Synthesis of polyolefin-based resin having a leaving group Both hexyl norbornene (HxNB) in a glove box whose moisture and oxygen concentrations are controlled to 1 ppm or less and filled with dry nitrogen. 2 g (40.1 mmol) and 12.9 g (40.1 mmol) of diphenylmethylnorbornenemethoxysilane were weighed into a 500 mL vial, 60 g of dehydrated toluene and 11 g of ethyl acetate were added, and the top was sealed with a silicon sealer.

  Next, 1.56 g (3.2 mmol) of Ni catalyst and 10 mL of dehydrated toluene were weighed in a 100 mL vial, and a stirrer chip was placed and sealed, and the catalyst was thoroughly stirred to dissolve completely. When 1 mL of this Ni catalyst solution was accurately weighed with a syringe, and quantitatively injected into the vial bottle in which the two kinds of norbornene were dissolved and stirred for 1 hour at room temperature, a marked increase in viscosity was confirmed. At this point, the stopper was removed, 60 g of tetrahydrofuran (THF) was added, and the mixture was stirred to obtain a reaction solution.

  In a 100 mL beaker, 9.5 g of acetic anhydride, 18 g of hydrogen peroxide (concentration 30%) and 30 g of ion-exchanged water were added and stirred to prepare an aqueous solution of peracetic acid on the spot. Next, the total amount of the aqueous solution was added to the reaction solution, and the mixture was stirred for 12 hours to reduce Ni.

  Next, the treated reaction solution was transferred to a separatory funnel, the lower aqueous layer was removed, and then 100 mL of a 30% aqueous solution of isopropyl alcohol was added and vigorously stirred. The aqueous layer was removed after standing and completely separating the two layers. After repeating this water washing process three times in total, the oil layer was dropped into a large excess of acetone to reprecipitate the polymer produced and separated from the filtrate by filtration, and then in a vacuum dryer set at 60 ° C. Polymer # 1 was obtained by heating and drying for 12 hours.

  The molecular weight distribution of polymer # 1 was Mw = 100,000 and Mn = 40,000 as a result of GPC measurement. The molar ratio of each structural unit in polymer # 1 was 50 mol% for the hexylnorbornene structural unit and 50 mol% for the diphenylmethylnorbornenemethoxysilane structural unit as a result of identification by NMR measurement.

(2) Production of composition for forming core layer 10 g of the purified polymer # 1 was weighed into a 100 mL glass container, and 40 g of mesitylene, 0.01 g of an antioxidant Irganox 1076 (manufactured by Ciba Geigy), cyclohexyloxetane monomer ( CHOX manufactured by Toagosei Co., CAS # 48333-3-25-9, molecular weight 186, boiling point 125 ° C./1.33 kPa) 2 g, polymerization initiator (photoacid generator) “Rhodorsil Photoinitiator 2074” (manufactured by Rhodia, CAS # 178233-72- 2) (0.0125 g, in 0.1 mL of ethyl acetate) was added and dissolved uniformly, and then filtered through a 0.2 μm PTFE filter to obtain a clean core layer forming composition.

(3) Production of cladding layer Norbornene-based resin composition containing a cyclic olefin-based resin (20 wt% 2-heptanone solution, 10 g of Avatrel 2590 manufactured by Promelas), 2-undecylmethylimidazole (manufactured by Shikoku Chemical Industries, Part No. C11Z) (0.06 g) was added and mixed to obtain a coating solution for forming a cladding layer. The clad layer forming coating solution was uniformly applied onto two polyimide films with a doctor blade, and then dried for 15 minutes in a dryer at 45 ° C. After completely removing the solvent, the coating film is cured by heating at 160 ° C. for 2 hours in a dryer to form two optical waveguide forming films (thickness: 5 μm clad layer and thickness: 25 μm base material layer). did.

(4) Preparation of core layer The composition for core layer formation was uniformly apply | coated with the doctor blade on the mold release process PET film, Then, it injected | threw-in to the dryer of 40 degreeC for 5 minutes. After completely removing the solvent to form a film, a photomask having a linear pattern of lines and spaces drawn on the entire surface was pressure-bonded onto the obtained film. Then, ultraviolet rays were irradiated from above the photomask with a parallel exposure machine. The integrated light quantity of ultraviolet rays was 1300 mJ / cm ² .

  Next, the photomask was removed and placed in an oven at 150 ° C. for 30 minutes. When taken out from the oven, it was confirmed that a clear waveguide pattern (a plurality of core portions) having a rectangular cross section appeared on the coating. The thickness of the obtained core layer was 40 μm.

(5) Production of optical waveguide sheet A clad layer of the optical waveguide forming film obtained in (3) was laminated on each side of the core layer obtained in (4) with a laminator to obtain a laminate. The obtained laminate was heat-treated at 160 ° C. for 2 hours to obtain an optical waveguide sheet as shown in FIG. The thickness of the obtained laminate was 100 μm.

Example 1
2. About manufacture of an optical waveguide film (6) External shape processing The lower surface side (lower base material layer 150 of FIG.2 (b)) of the optical waveguide sheet obtained by (5) was affixed on the dicing tape. Subsequently, using a dicing blade A (abrasive grain protrusion amount from the blade surface is an average of 0.5 μm or less, grain size: # 5000) under the condition of processing speed: 0.1 mm / s, it is shown in FIG. End surfaces (the waveguide end surface 101 of the optical connector insertion region 106 and the end surface of the light conversion region 107) are processed, and then a dicing blade B (abrasive grain protrusion from the blade surface) under a processing speed of 0.1 mm / s. The other side surfaces (the optical connector insertion region 106, the connection path region 108, and the side surface 104 of the light conversion region 107) were processed using an average amount of 4 μm and particle size: # 5000. Such processing was performed twice clockwise. Thereafter, air cleaning was performed on the entire cut surface of the optical waveguide sheet, and the cutting water was completely blown away.

Next, the dicing tape was irradiated with ultraviolet rays by a UV irradiator to obtain an individualized optical waveguide film (FIG. 1). The shape of the optical waveguide film was rectangular when viewed from above. The width of the optical waveguide film in the lateral direction (end face side) was 3 mm, the length in the longitudinal direction (side face side) was 30 mm, and the thickness was 100 μm. The cumulative amount of ultraviolet light was 500 mJ / cm ² .

(Example 2)
End face (light) shown in FIG. 2 (a) using a dicing blade A (abrasive grain protrusion amount from the blade surface is an average of 0.5 μm or less, grain size: # 5000) under the condition of processing speed: 0.1 mm / s. Example 1 except that the waveguide end surface 101 of the connector insertion region 106 and the end surface of the light conversion region 107) and side surfaces (the optical connector insertion region 106, the connection path region 108, and the side surface 104 of the light conversion region 107) are processed. The same was done.

(Example 3)
Using a dicing blade A (abrasive grain protrusion amount from the blade surface is 0.5 μm or less on average, particle size: # 5000) under the condition of processing speed: 1.0 mm / s, the end face (light) shown in FIG. Example 1 except that the waveguide end surface 101 of the connector insertion region 106 and the end surface of the light conversion region 107) and side surfaces (the optical connector insertion region 106, the connection path region 108, and the side surface 104 of the light conversion region 107) are processed. The same was done.

Example 4
Using the dicing blade A (abrasive grain protrusion amount from the blade surface is an average of 0.5 μm or less, grain size: # 5000) under the condition of a processing speed of 10.0 mm / s, the end face (light) shown in FIG. Example 1 except that the waveguide end surface 101 of the connector insertion region 106 and the end surface of the light conversion region 107) and side surfaces (the optical connector insertion region 106, the connection path region 108, and the side surface 104 of the light conversion region 107) are processed. The same was done.

(Example 5)
Using a dicing blade A (abrasive grain protrusion amount from the blade surface is 0.5 μm or less on average, particle size: # 5000) under the condition of processing speed: 30.0 mm / s, the end face (light) shown in FIG. Example 1 except that the waveguide end surface 101 of the connector insertion region 106 and the end surface of the light conversion region 107) and side surfaces (the optical connector insertion region 106, the connection path region 108, and the side surface 104 of the light conversion region 107) are processed. I made it.

(Example 6)
Using a dicing blade A (abrasive grain protrusion amount from the blade surface is 0.5 μm or less on average, particle size: # 5000) under the condition of processing speed: 100.0 mm / s, the end face (light) shown in FIG. Example 1 except that the waveguide end surface 101 of the connector insertion region 106 and the end surface of the light conversion region 107) and side surfaces (the optical connector insertion region 106, the connection path region 108, and the side surface 104 of the light conversion region 107) are processed. I made it.

(Comparative Example 1)
Dicing tape on the upper surface side (upper base material layer 140 in FIG. 2 (b)) and the lower surface side (lower base material layer 150 in FIG. 2 (b)) (5) of the optical waveguide sheet obtained in (5). The end face shown in FIG. 2 (a) using a dicing blade B (average amount of protrusion of abrasive grains from the blade surface is 4 μm, grain size: # 5000) under the conditions of pasting and processing speed: 0.1 mm / s Example except that the waveguide end face 101 of the optical connector insertion area 106 and the end face of the light conversion area 107 and the side faces (the optical connector insertion area 106, the connection path area 108, and the side face 104 of the light conversion area 107) are processed. Same as 1.

3. Evaluation of Optical Waveguide Film The optical waveguide films obtained in the examples and comparative examples were evaluated as follows. The evaluation results are shown in Table 1.

(Rib structure)
About the end surface and side surface of the obtained optical waveguide film, the SEM image which inclined 45 degrees was image | photographed using the scanning electron microscope. The shape of the rib structure was judged from the obtained SEM image, and the rib height was calculated. A U-shaped rib is shown in FIG. 3 (a), and a wound rib is shown in FIG. 3 (b). Moreover, the rib height was set to the height H from the top surface 142 of the upper base material layer 140 to the upper end of the rib structure 160 as shown in FIG. The shape and height of the rib structure 162 were also measured in the same manner as the rib structure 160. The results are shown in Table 1.
In addition, the rib structure 160 in the short direction of Examples 1 to 6 was formed on the entire surface of the upper base material layer 140 on the end surface 144 side. The rib structure 162 in the longitudinal direction of Examples 2 to 6 is formed from the corner where the end surface 144 and the side surface 104 intersect, that is, the edge of the side surface 104, and the entire surface of the upper base material layer 140 on the side surface 146 side. Was formed. Moreover, the structure of the rib structure 162 of Examples 2-6 had the same shape as the shape of each rib structure 160. Moreover, in Example 1, the rib structure 160 was not formed, and in the comparative example 1, neither the rib structure 160 nor the rib structure 162 was formed.

(Evaluation of film deformation)
As shown to Fig.4 (a), the support stand 1 which has the mounting surface 2 horizontal with respect to the ground was prepared. Subsequently, the optical waveguide film 100 was placed on the support base 1 so that one main surface 4 of the obtained optical waveguide film 100 was in contact with the mounting surface 2. At this time, the distance d between the corner portion 3 present at the boundary between the end surface 6 and the side surface 7 of the optical waveguide film 100 and the mounting surface 2 was measured.
The distances d1 to d4 between the four corners 3 of the optical waveguide film 100 and the mounting surface 2 were measured as described above. Four total values (total D) of d1, d2, d3, d4 in the optical waveguide film 100 of each example obtained by measurement are calculated, and d1, d2, d3, d4 in the optical waveguide film 100 of Comparative Example 1 are calculated. 4 total values (total D0) were calculated and compared.
In the total sum D of each Example, the case where it was smaller than the total sum D0 of the comparative example 1 was set as (circle), and the case where it was equal or larger was set as x. The results are shown in Table 1.

(Evaluation of adhesive flow)
[End face side evaluation]
As shown in FIG.4 (b), the support stand 1 which has the mounting surface 2 horizontal with respect to the ground was prepared. Subsequently, the optical waveguide film 100 was placed on the support base 1 so that one main surface 4 of the optical waveguide film 100 was in contact with the mounting surface 2.
Subsequently, 0.03 ml of the epoxy adhesive 9 is dropped on the other main surface 5 of the optical waveguide film 100 at a position 25 mm away from the end surface 6 on one end side, and the end surface 8 on the other end side is lifted in the vertical direction. The angle formed between the main surface 5 on the other end side and the mounting surface 2 was fixed at a position where the angle was 30 °.
From the time of fixing at the above position, the epoxy adhesive 9 flows from the main surface 5 on the other end side to the one end side, and the flow time A until the epoxy adhesive 9 contacts the end surface 6 on the one end side was measured. .
In the optical waveguide film 100 of each example and comparative example, the flow time A was measured in the same manner.
Regarding the flow time A of each example, when the flow time A of Comparative Example 1 was used as a reference, the case where it was longer than the time of Comparative Example 1 was marked with ◎, and the case where it was equivalent or short was marked with ×.

[Side evaluation]
As shown in FIG. 4 (c), a support base 1 having a mounting surface 2 that is horizontal to the ground is prepared, and an optical waveguide film is formed so that one main surface 4 of the optical waveguide film 100 is in contact with the mounting surface 2. 100 was placed on the support 1.
On the other main surface 5 of the optical waveguide film 100, 0.03 ml of an epoxy-based adhesive 9 is dropped at a position 25 mm away from the end surface 6 on one end side, and the corner 3 starts as shown in FIG. The angle between the other main surface 5 and the mounting surface 2 was fixed at a position where the angle was 30 °.
From the time of fixing at the above position, the epoxy adhesive 9 flows from the main surface 5 on the other end side to the side surface 7 on the one end side, and the flow time B until the epoxy adhesive material 9 contacts the side surface 7 on the one end side is It was measured.
In the optical waveguide film 100 of each example and comparative example, the flow time B was measured in the same manner.
Regarding the flow time B of each example, when the flow time B of the comparative example 1 is used as a reference, the case where the time is longer than the time of the comparative example 1 is marked with ◎, and the case where it is equal or short is marked with x.

(Ease of insertion into optical connector)
50 samples of optical waveguide test pieces were produced in the same manner as the optical waveguide films obtained in the examples and comparative examples.
By inserting the optical waveguide test piece of Example and Comparative Example into a jig having an opening of thickness: 125 μm × width: 3.2 mm, and observing the end of the optical waveguide test piece with an optical microscope before and after insertion The increase in wounds due to insertion was investigated. Of the 50 samples, ◎ indicates that no scratch is observed at the end of the inserted optical waveguide test piece, ○ indicates that scratch is confirmed in a test piece exceeding 0% and less than 20%, and scratch is confirmed in 20% or more of the test pieces. The case was marked with x.

DESCRIPTION OF SYMBOLS 1 Support stand 2 Mounting surface 3 Corner | angular part 4 Main surface 5 Main surface 6 End surface 7 Side surface 8 End surface 9 Epoxy adhesive material 10 Optical waveguide sheet 100 Optical waveguide film 101 Waveguide end surface 104 Side surface 106 Optical connector insertion area 107 Optical conversion area 108 Connection path region 110 Core layer 112 Core portion 114 Cladding portion 120 Upper cladding layer 130 Lower cladding layer 140 Upper base layer 142 Top surface 144 End surface 146 Side surface 150 Lower base layer 152 Back surface 160 Rib structure 162 Rib structure

According to the present invention,
A long optical waveguide film comprising a lower substrate layer, a lower cladding layer, a plurality of patterned core portions, an upper cladding layer and an upper substrate layer in this order,
The upper base material layer has a rib structure protruding from the top surface of the upper base material layer, and an optical waveguide film in which the rib structure has a curl shape is provided.

As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.
Hereinafter, examples of the reference form will be added.
1.
A long optical waveguide film comprising a lower substrate layer, a lower cladding layer, a plurality of patterned core portions, an upper cladding layer and an upper substrate layer in this order,
The said upper base material layer is an optical waveguide film which has the rib structure which protruded from the top | upper surface of the said upper base material layer.
2.
1. An optical waveguide film according to claim 1,
An optical waveguide film in which a waveguide end face for inputting and outputting light is formed at one end of the optical waveguide film in the longitudinal direction, and the rib structure is formed in the upper base material layer on the waveguide end face side.
3.
1. Or 2. An optical waveguide film according to claim 1,
The optical waveguide film whose rib height from the top | upper surface of the said upper base material layer to the upper end of the said rib structure is 1 micrometer or more and 50 micrometers or less.
4).
1. To 3. An optical waveguide film according to any one of
An optical waveguide film in which the rib structure is formed on a side surface along the longitudinal direction of the optical waveguide film.
5).
1. To 4. An optical waveguide film according to any one of
An optical waveguide film in which the rib structure has a curl shape.
6).
1. To 5. An optical waveguide film according to any one of
The said lower base material layer and the said upper base material layer are optical waveguide films comprised by the polyimide layer.
7).
1. To 6. An optical waveguide film according to any one of
The film thickness of the said lower base material layer and the said upper base material layer is an optical waveguide film which are 5 micrometers or more and 50 micrometers or less.
8).
1. To 7. An optical waveguide film according to any one of
The optical waveguide film has a thickness of 50 μm or more and 300 μm or less.
9.
1. To 8. An optical waveguide film according to any one of
The optical waveguide film, wherein the upper cladding layer and the lower cladding layer have a thickness of 1 μm or more and 50 μm or less.
10.
An optical connector and one end inserted into the optical connector; To 9. An optical component comprising: the optical waveguide film according to any one of the above.

Claims (10)

A long optical waveguide film comprising a lower substrate layer, a lower cladding layer, a plurality of patterned core portions, an upper cladding layer and an upper substrate layer in this order,
The said upper base material layer is an optical waveguide film which has the rib structure which protruded from the top | upper surface of the said upper base material layer. The optical waveguide film according to claim 1,
An optical waveguide film in which a waveguide end face for inputting and outputting light is formed at one end of the optical waveguide film in the longitudinal direction, and the rib structure is formed in the upper base material layer on the waveguide end face side. The optical waveguide film according to claim 1 or 2,
The optical waveguide film whose rib height from the top | upper surface of the said upper base material layer to the upper end of the said rib structure is 1 micrometer or more and 50 micrometers or less. The optical waveguide film according to any one of claims 1 to 3,
An optical waveguide film in which the rib structure is formed on a side surface along the longitudinal direction of the optical waveguide film. The optical waveguide film according to any one of claims 1 to 4,
An optical waveguide film in which the rib structure has a curl shape. The optical waveguide film according to any one of claims 1 to 5,
The said lower base material layer and the said upper base material layer are optical waveguide films comprised by the polyimide layer. The optical waveguide film according to any one of claims 1 to 6,
The film thickness of the said lower base material layer and the said upper base material layer is an optical waveguide film which are 5 micrometers or more and 50 micrometers or less. The optical waveguide film according to any one of claims 1 to 7,
The optical waveguide film has a thickness of 50 μm or more and 300 μm or less. The optical waveguide film according to any one of claims 1 to 8,
The optical waveguide film, wherein the upper cladding layer and the lower cladding layer have a thickness of 1 μm or more and 50 μm or less.   An optical component comprising: an optical connector; and the optical waveguide film according to claim 1, wherein one end is inserted into the optical connector.

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