JP6183529B1 - Optical waveguide film and optical component - Google Patents

Abstract

An optical waveguide film excellent in manufacturing stability and yield is provided. An optical waveguide film of the present invention comprises a lower clad layer, a plurality of patterned core portions provided on the lower clad layer, and an upper clad layer provided on the core portion. An optical connector insertion region provided at least at one end of the optical waveguide film, and the degree of freedom in the longitudinal direction of the core portion measured under predetermined conditions is X, orthogonal to the longitudinal direction X / Y (where X> 0 and Y> 0) is 120 or more and 1200 or less, where Y is the degree of freedom in the short direction where the core portions are adjacent to each other. [Selection] Figure 1

Description

  The present invention relates to an optical waveguide film and an optical component.

  So far, in optical waveguide films, studies have been made to reduce film distortion during the manufacturing process. As such a technique, for example, a technique described in Patent Document 1 is cited. In this document, a polyimide film having a smaller difference in thermal expansion coefficient than that of the silicon substrate without using a silicon substrate having a larger difference in thermal expansion coefficient from the core layer in heat treatment at 300 ° C. or higher. It is described that an optical waveguide film with a small distortion can be produced by using as a support (paragraph 0005 of Patent Document 1). According to this document, in a linear optical waveguide film having a width of 10 mm and a length of 50 mm, it is described that the warp is 1 mm or less with respect to the length of 50 mm (claim 8, paragraph 0064 of Patent Document 1). ).

JP 2003-103738 A

  As a result of studies by the present inventors, the linear optical waveguide film described in the above-mentioned literature has room for improvement in terms of manufacturing stability when inserted into an optical connector, although the distortion in the longitudinal direction is small. Turned out to be.

  The present inventor examined an optical component manufacturing process in which a long optical waveguide film is transported while grasping one end thereof and the other end is inserted into an insertion port of an optical connector. I came to focus on the time.

  In the optical waveguide film at the time of conveyance, since deformation occurs due to its own weight or the like, the insertion operation into the optical connector may be difficult.

  The present inventor further examined that, in a long optical waveguide film, the rigidity of the optical waveguide film can be increased by appropriately setting the structural freedom between the lateral direction and the longitudinal direction. It has been found that the deformation in can be suppressed. That is, the rigidity due to the arch structure can be evaluated from the structural freedom degree Y in the short direction, and the degree of suppression of deformation due to its own weight can be evaluated from the structural freedom degree X in the longitudinal direction. Furthermore, as a result of earnest examination about such degrees of freedom Y and degrees of freedom X, the lower limit of X / Y is determined by using X / Y combining them as an index. It was found that the overall mechanical properties can be evaluated, and the upper limit of X / Y can evaluate the yield of the optical waveguide film.

  As a result of further diligent research based on such knowledge, in a long optical waveguide film, the lower limit value of the index X / Y is set to a predetermined value or more, thereby improving manufacturing stability at the time of insertion into an optical connector. It has been found that by setting the upper limit value of the index X / Y to a predetermined value or less, it is possible to improve the fall-off prevention property of the optical waveguide film, and the present invention has been completed.

According to the present invention,
A long optical waveguide film comprising a lower clad layer, a plurality of patterned core portions provided on the lower clad layer, and an upper clad layer provided on the core portion,
It is used for forming an optical component in which at least one end of the optical waveguide film is inserted into an optical connector,
When the degree of freedom in the longitudinal direction of the core part measured under the following conditions is X, and the degree of freedom in the short direction in which the core parts are adjacent to each other in a direction perpendicular to the longitudinal direction is Y,
X / Y (provided that, X> 0, and, Y> 0) is state, and are 120 to 1200 or less,
An optical waveguide film is provided that satisfies 0.86 mm ≦ X ≦ 3.1 mm and 2.6 μm ≦ Y ≦ 7.2 μm .
(Measurement condition)
・ Temperature: Room temperature 25 ℃
-Degree of freedom X in the longitudinal direction:
A support base having a mounting surface horizontal to the ground is prepared, and the optical waveguide film is installed on the mounting surface of the support base so that the one end of the optical waveguide film is a free end. On the other hand, a position of 25 mm from the one end is fixed so that the optical waveguide film is bent on the lower surface side in the vertical direction . With the fixed position as a reference, the amount of displacement of the one end in the direction perpendicular to the mounting surface is defined as the degree of freedom X.
・ Degree of freedom Y in the short direction:
Prepared with a support base having a mounting surface horizontal to the ground, and installed the optical waveguide film on the mounting surface of the support base so that the one end of the optical waveguide film is a free end, 7 mm from the one end The position of is fixed. Light is incident on the core portion from the other end opposite to the one end, and position information of the core portion at the one end is acquired. From the position information of the core part, the first core part located on the outermost side in the short side direction and the second core part nearest to the center in the short side direction in the direction perpendicular to the short side direction and the long side direction. The amount of positional deviation is calculated, and the degree of freedom is Y.

Also according to the invention,
An optical component comprising an optical connector and the optical waveguide film having one end inserted into the optical connector is provided.

  According to the present invention, an optical waveguide film excellent in production stability and yield and an optical component using the same are provided.

It is a schematic diagram which shows the structure of the optical waveguide film of this embodiment. It is a figure for demonstrating the measuring method of the freedom degree X. FIG. It is a figure for demonstrating the measuring method of the freedom degree Y. FIG. It is a schematic diagram which shows the structure of the optical waveguide sheet of this embodiment. It is a schematic diagram which shows the process of cutting out an optical waveguide film from the optical waveguide sheet of this embodiment. It is a schematic diagram which shows the modification of the cutting process of the optical waveguide film of this embodiment.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate. In the present embodiment, description will be made by defining the front-rear, left-right, up-down directions as shown. However, this is provided for the sake of convenience in order to briefly explain the relative relationship between the components. Therefore, the direction at the time of manufacture and use of the product which implements the present invention is not limited.

The outline | summary of the optical waveguide film 100 of this embodiment is demonstrated.
FIG. 1 is a top view for explaining an outline of the optical waveguide film 100 (FIG. 1A), a front view showing a waveguide end face 101 (FIG. 1B), and a side view (FIG. 1C). FIG. 1 is a perspective view (FIG. 1D).

  The optical waveguide film 100 of the present embodiment includes a lower clad layer 130, a patterned core portion 112 provided on the lower clad layer 130, and an upper clad layer 120 provided on the core portion 112. It is possible to have a laminated structure. The optical waveguide film 100 is a long resin film and can itself stand alone. The optical waveguide film 100 has toughness and can be used in a bent state or not. The optical waveguide film 100 of the present embodiment can have an optical connector insertion region 106 at least at one end, and can be used for an optical component in which the one end (optical connector insertion region 106) is inserted into the optical connector.

  As shown in the top view of FIG. 1A, the optical waveguide film 100 of the present embodiment can be a long plate member with respect to the longitudinal direction of the core portion 112 in a top view. That is, the length in the longitudinal direction of the optical waveguide film 100 is longer than the width in the short direction of the optical waveguide film 100. In the present embodiment, in the top view of the optical waveguide film 100, the direction in which the core portion 112 extends is the longitudinal direction, the direction is orthogonal to the longitudinal direction, and the plurality of core portions 112 are arranged side by side. Is the short direction.

  An optical connector insertion region 106 may be formed at one end of the optical waveguide film 100. A waveguide end face 101 is formed on the end face of the optical waveguide film 100 in the optical connector insertion region 106. The waveguide end surface 101 functions as a light incident surface. For example, light can be input and output on the waveguide end face 101 of the optical waveguide film 100 via an optical connector.

  On the other hand, at the other end of the optical waveguide film 100, an optical connector insertion region may be formed in the same manner, but a light conversion region 107 may be formed as shown in FIG. For example, a groove 109 may be formed on the surface 102 of the light conversion region 107. The groove portion 109 functions as a mirror that performs optical path conversion of an optical signal that passes through the core portion 112.

  In the optical waveguide film 100 of the present embodiment, the core portion 112 may extend from the optical connector insertion region 106 to the light conversion region 107. Moreover, the core part 112 may extend from the waveguide end face 101 at one end to the end face in the light conversion region 107 at the other end. However, when the groove 109 is formed in the light conversion region 107, the core portion 112 in the light conversion region 107 may be divided by the groove 109.

  As shown in the front view of FIG. 1B, the waveguide end face 101 of the optical waveguide film 100 has a laminated structure in which, for example, a lower cladding layer 130, a core layer 110, and an upper cladding layer 120 are laminated in this order. Can do. In addition, the cross-sectional structure of the optical waveguide film 100 can have the above laminated structure in a cross-sectional view parallel to the optical waveguide film 100. In the present embodiment, the upper surface of the upper cladding layer 120 may be covered with the upper base material layer 140. The lower surface of the lower cladding layer 130 may be covered with the lower base material layer 150. Thereby, the mechanical characteristics and durability of the optical waveguide film 100 can be improved.

  Further, in the short direction of the optical waveguide film 100, the core layer 110 has a plurality of core portions 112 spaced apart from each other. A clad portion 114 is formed between the core portions 112. Thus, in the present embodiment, the core portion 112 is covered with the clad layer (upper clad layer 120, lower clad layer 130) or the clad portion 114 on the upper, lower, left and right sides, so that excellent optical characteristics can be realized. it can.

  As shown in the side view of FIG. 1C, the optical waveguide film 100 of this embodiment can have a laminated structure of a lower clad layer 130, a core layer 110, and an upper clad layer 120. The core layer 110 on the side surface has a structure in which the core portion 112 is covered with the clad portion 114. That is, the plurality of core portions 112 can have a structure in which both side surfaces are covered with the cladding portions 114.

As shown in the perspective view of FIG. 1D, the optical waveguide film 100 of the present embodiment can have a convex shape toward the upper surface side in the short side direction, and the upper surface side in the longitudinal direction. It can have a convex shape toward the lower surface side opposite to. Here, the upper surface in FIG. 1D is the surface 102 of the optical waveguide film 100, which is a light input / output surface (for example, a mounting surface such as a lens).
In addition, in FIG. 1 (a)-FIG.1 (c), since it is a figure for understanding the outline of the optical waveguide film 100, about the convex structure as shown in FIG.1 (d) is not shown. .

  The optical waveguide film 100 of the present embodiment can have a degree of freedom X in the longitudinal direction and a degree of freedom Y in the lateral direction. The degree of freedom in the present embodiment means an initial structural state when no load is applied, and as shown in FIGS. 2 and 3, the amount of displacement based on a state without warping. It is expressed by 2A and 2B are diagrams for explaining a method for measuring the degree of freedom X, and FIGS. 3A and 3B are diagrams for explaining a method for measuring the degree of freedom Y. FIG. 2A is a side view of the optical waveguide film 100 of FIG. FIG. 3A is a front view showing the waveguide end face 101 of the optical waveguide film 100 of FIG.

  In the optical waveguide film 100 of the present embodiment, the degree of freedom in the longitudinal direction of the core portion 112 measured under the following conditions is X, and in the short direction where the core portions 112 are adjacent to each other in a direction orthogonal to the longitudinal direction. When the degree of freedom is Y, X / Y (where X> 0 and Y> 0) can be 120 or more and 1200 or less.

The measurement conditions for the degree of freedom X in the longitudinal direction are as follows.
As shown in FIG. 2B, a support base 200 having a mounting surface 210 that is horizontal to the ground is prepared, and the mounting surface 210 of the support base 200 is arranged so that one end of the optical waveguide film 100 becomes a free end 220. The optical waveguide film 100 is installed, and a position 25 mm from one end (free end 220) is fixed. With this fixed position as a reference, the amount of displacement of one end (free end 220) in the direction perpendicular to the mounting surface 210 is defined as the degree of freedom X. The measurement is performed at room temperature of 25 ° C.

  Further, as the more detailed conditions, the following may be mentioned. In FIG. 2, one end (free end) of the optical waveguide film 100 has a waveguide end face 101. Further, the surface 102 (upper surface) of the optical waveguide film 100 is fixed so as to face the mounting surface 210 of the support base 200. Further, as a result of the study by the present inventor, as shown in FIG. 2, if the length of the free end is about 25 mm, it is measured how much the free end 220 floats without being affected by the deformation of its own weight due to gravity. I understood that I could do it.

The measurement conditions of the degree of freedom Y in the short direction are as follows.
As shown in FIG. 3B, a support base 200 having a mounting surface 210 that is horizontal to the ground is prepared, and the mounting surface 210 of the support base 200 is arranged so that one end of the optical waveguide film 100 becomes a free end 220. The optical waveguide film 100 is installed, and a position 7 mm from one end (free end 220) is fixed. Light is incident on the core 112 from the other end opposite to the one end (free end 220), and position information of the core 112 at the free end 220 is acquired. Subsequently, as illustrated in FIG. 3A, from the position information of the core portion 112, the first core portion 240 located on the outermost side in the short-side direction and the second core portion 250 nearest to the center in the short-side direction. And the degree of freedom Y is calculated. The measurement is performed at room temperature of 25 ° C.

Further, as the more detailed conditions, the following may be mentioned. In FIG. 3B, one end (free end) of the optical waveguide film 100 has a waveguide end face 101. In addition, the back surface of the optical waveguide film 100 (the surface opposite to the surface 102 having the groove 109 through which light can be input and output) is not fixed by applying a load so as to face the mounting surface 210 of the support base 200. Leave still. The light incident on the core 112 from the other end may be the end face of the waveguide formed at the other end, but the light is irradiated from the groove 109 on the other end, passes through the core 112, and passes through the waveguide at the free end 220. You may output from the end surface 101. FIG. Subsequently, as illustrated in FIG. 3A, the position information of the core portion 112 is acquired from the light irradiation position on the waveguide end face 101. The position information of the core unit 112 is measured by a camera. The position information of the core part 112 obtained in this way is plotted on the plane coordinates composed of the X axis and the Y axis. Then, on a plane coordinate, a straight line L connecting two points of the core part 112 (second core part 250) located on the outermost side is drawn, and the core part 112 (first core part) closest to the center is drawn from the straight line L. 240) is the degree of freedom Y. The distance D of the coordinates indicating 240) (when the core portion 112 has a symmetric structure and there are two first core portions 240, the larger one of the distances D). .
Further, the inventor found that the degree of freedom Y in the short direction is difficult to directly measure with a microscope, and can be detected by using the position information (position table) of the core portion 112 by light input / output. I found it.

  In the optical waveguide film 100 of the present embodiment, the lower limit value of X / Y, which is the ratio of the degree of freedom X to the degree of freedom Y, is, for example, 120 or more, preferably 125 or more, more preferably 130 or more. . Thereby, the rigidity of the entire optical waveguide film 100 can be increased. For this reason, since the ease of insertion to an optical connector and the ease of conveyance of the optical waveguide film 100 can be improved, the manufacturing stability of an optical connector can be improved. On the other hand, the upper limit of the above X / Y is, for example, 1200 or less, preferably 1100 or less, and more preferably 1000 or less. Thereby, the fall-off prevention property of the optical waveguide film 100 after insertion to an optical connector can be improved.

  Further, the lower limit value of the degree of freedom X is, for example, 0.5 mm or more, preferably 0.6 mm or more, and more preferably 0.7 mm or more. Thereby, since it becomes easy to grasp the optical waveguide film 100 in a state of being arranged on a plane, the handling property of the optical waveguide film 100 can be improved. In addition, the visibility of the surface of the optical waveguide film 100 is improved even when the optical connector is inserted. For this reason, it becomes easy to discriminate the mounting surface of the optical element in the optical waveguide film 100. In addition, deformation of the optical waveguide film 100 due to its own weight can be suppressed. For this reason, the deformation of the optical waveguide film 100 during conveyance can be suppressed.

  On the other hand, the upper limit value of the degree of freedom X is, for example, 4 mm or less, preferably 3.8 mm or less, and more preferably 3.5 mm or less. Thereby, even when it uses in the state which is not bent in a longitudinal direction, the optical characteristic of the optical waveguide film 100 can be improved. Moreover, the insertion property to the insertion port of the optical connector can be improved.

  The lower limit value of the degree of freedom Y is, for example, 1 μm or more, preferably 1.5 μm or more, and more preferably 2 μm or more. Thereby, when it inserts in the insertion port of an optical connector, the end of the optical waveguide film 100 can be temporarily fixed to an optical connector. For this reason, before fixing with an adhesive etc., position shift with an optical connector and the optical waveguide film 100 can be prevented. Moreover, rigidity can be improved by the arch structure. For this reason, a deformation | transformation of the optical waveguide film 100 at the time of conveyance can be suppressed.

  On the other hand, the upper limit value of the degree of freedom Y is, for example, 10 μm or less, preferably 9 μm or less, and more preferably 8 μm or less. Thereby, the insertion property to the insertion port of the optical connector can be improved. Moreover, even when it is used in a state where it is not bent in the hand direction, the optical characteristics of the optical waveguide film 100 can be improved.

  In the present embodiment, for example, by appropriately selecting the type and amount of each component contained in the optical waveguide film 100, the layer structure and the manufacturing method of the optical waveguide film 100, the degrees of freedom X and degrees of freedom Y are set as described above. It is possible to control. Among these, for example, in the outer layers of the optical waveguide film 100 such as the upper base layer 140 and the lower base layer 150 (for example, layers outside the upper clad layer 120 and the lower clad layer 130), the upper surface side and the lower surface side Using a material having a different elastic modulus, using a material such as polyimide having a high elastic modulus, and not laminating these layers in a stretched state. It is mentioned as an element to make it a numerical range.

  Although the detailed mechanism is not clear, since each layer is laminated without pulling at the time of producing the optical waveguide film 100, the optical waveguide film 100 is caused by the residual stress of the upper base material layer 140 and the lower base material layer 150. It is considered to have degrees of freedom X and degrees of freedom Y. For this reason, the optical waveguide film 100 of this embodiment is between each layer (for example, between the upper base material layer 140 and the upper clad layer 120, or between the lower base material layer 150 and the lower clad layer 130). Since interface stress hardly occurs, it is presumed that the optical characteristics are excellent.

  As described above, the optical waveguide film 100 of the present embodiment is a flexible resin film that can be bent, and can have a degree of freedom X in the longitudinal direction and a degree of freedom Y in the lateral direction. According to the optical waveguide film 100 of the present embodiment, the operability for insertion into the optical connector can be enhanced, and the manufacturing stability of the optical component can be improved. In addition, the optical properties of the optical waveguide film 100 can be improved even when the optical waveguide film 100 is attached to the optical connector.

  In addition, as shown in the perspective view of FIG. 1D, the optical waveguide film 100 of the present embodiment can have a convex shape toward the upper surface side in the short side direction, and in the longitudinal direction, It can have a convex shape toward the lower surface side opposite to the upper surface side. For this reason, since the deformation | transformation by dead weight can be suppressed at the time of conveyance, the insertability of the optical waveguide film 100 to the insertion port of an optical connector can be improved. In addition, it is easy to hold | grip the optical waveguide film 100 from the mounted state, and can improve conveyance efficiency.

Next, the manufacturing method of the optical waveguide film 100 of this embodiment is demonstrated.
As a manufacturing method of the optical waveguide film 100 of the present embodiment, there are a lower clad layer 130, a patterned core portion 112 provided on the lower clad layer 130, and an upper clad layer 120 provided on the core portion 112. It is possible to have a preparation process for preparing the laminated optical waveguide sheet 10 and a cutting process for cutting out the optical waveguide film 100 that is long in the longitudinal direction of the core portion 112 from the optical waveguide sheet 10. The cutting step in the method for manufacturing the optical waveguide film 100 includes a first cutting step of cutting the waveguide end face 101 of the optical waveguide film 100 with a dicing blade, and a remaining region other than the region cut with the dicing blade. A second cutting step of cutting out by a kind of processing method selected from the group consisting of cutting with a laser, a router, an ultrasonic cutter or a water jet, and punching with a blade mold.

  According to the method for manufacturing the optical waveguide film 100 of the present embodiment, the waveguide end face 101 of the optical waveguide film 100 can be cut out by a precision cutting means. As a result, the waveguide end face 101 can have a mirror structure, and light attenuation due to scattering can be sufficiently suppressed at the coupling surface of the optical waveguide. On the other hand, the productivity of the optical waveguide film 100 can be improved by cutting out the region other than the region cut out by the precision cutting unit by the high processing cutting unit having a cutting speed superior to the precision processing.

  Here, in the optical waveguide film cut only by the same processing means without using different cutting means together, the optical properties and productivity on the other side of the waveguide are in a trade-off relationship, and if one is improved, The other resulted in a decline.

  On the other hand, according to the present embodiment, the optimum means is selected according to the required characteristics of the cutting surface from the processing means of the precision cutting means and the high processing cutting means, and by using these together, in the optical waveguide The productivity of the optical waveguide film 100 can be improved while improving optical characteristics such as suppression of light attenuation.

Hereinafter, the manufacturing method of the optical waveguide film 100 of this embodiment is explained in full detail.
The manufacturing method of the optical waveguide film 100 according to the present embodiment includes a preparation step of preparing the optical waveguide sheet 10 and a cutting step of cutting out the long optical waveguide film 100 from the optical waveguide sheet 10.

  FIG. 4 is a schematic diagram showing the structure of the optical waveguide sheet 10. FIG. 4A is a top view of the optical waveguide sheet 10 of the present embodiment. FIG. 4B is a cross-sectional view taken along the line AA ′ of FIG. 4A, showing a laminated structure of the optical waveguide sheet 10 of the present embodiment. FIG. 4C is a cross-sectional view showing a laminated structure in a modified example of the optical waveguide sheet 10. FIG. 5 is a diagram for explaining a process of cutting out the optical waveguide film 100 from the optical waveguide sheet 10.

(Preparation process of optical waveguide sheet 10)
First, an optical waveguide sheet 10 as shown in FIG. 4 is prepared. The preparatory process of this embodiment includes a film structure in which a lower clad layer 130, a patterned core portion 112 provided on the lower clad layer 130, and an upper clad layer 120 provided on the core portion 112 are laminated. A step of forming (optical waveguide sheet 10) can be included.

  The optical waveguide sheet 10 of the present embodiment has a film shape, may be a single wafer shape, or may be a rollable roll shape. Moreover, you may cut | judge the optical waveguide sheet 10 of this embodiment in the some block (partition) which has a predetermined area before the said cutting process. Thereby, the handleability of the optical waveguide sheet 10 can be improved. Each block may have an area equivalent to a plurality of optical waveguide films 100 from the viewpoint of productivity. Each section can be rectangular.

  The optical waveguide sheet 10 has a predetermined shape in a top view, but may be rectangular or square. From the viewpoint of productivity, the optical waveguide sheet 10 has a longitudinal direction in which the core portion 112 shown in FIG. 4B or FIG. You may extend so that it may become long.

  As shown in FIGS. 4A and 5, the optical waveguide sheet 10 of the present embodiment only needs to have at least one area of the optical waveguide film 100 in a top view, from the viewpoint of productivity. It is preferable to have the total area of the plurality of optical waveguide films 100. For example, the width of the optical waveguide sheet 10 in the longitudinal direction may have an area where one or more of the optical waveguide films 100 can be cut off, and the width of the optical waveguide sheet 10 in the lateral direction is One or two or more optical waveguide films 100 may have an area from which a short portion can be cut off.

  The optical waveguide sheet 10 of the present embodiment can have a lower cladding layer 130, a patterned core portion 112, and an upper cladding layer 120, as shown in FIG. 4B. As shown in FIG. 4C, the optical waveguide sheet 10 may have a lower base layer 150 formed on the lower surface side of the lower cladding layer 130. Further, the upper base material layer 140 may be formed on the upper surface side of the upper cladding layer 120.

  In the present embodiment, as an example, a process for manufacturing the optical waveguide sheet 10 shown in FIG. 4C will be described. In this case, the preparation step includes a step of forming the lower clad layer 130 on the upper surface side of the lower base material layer 150 and a step of forming the upper base material layer 140 on the upper surface side of the upper clad layer 120. Can do. As a specific example, first, the lower cladding layer 130 is formed on the surface of the substrate (lower substrate layer 150). Subsequently, the core portion 112 having a pattern shape is formed on the surface of the lower cladding layer 130. Subsequently, the upper clad layer 120 is formed so as to cover the core portion 112. Thereafter, the upper base material layer 140 is formed on the surface of the upper cladding layer 120.

  In the present embodiment, a method for forming the core portion 112 having the above-described pattern shape is not particularly limited. For example, various optical waveguide processing methods such as an exposure method, an etching method, and a replication method can be used.

In the case of an optical waveguide processing method using an exposure method, for example, a first step that does not require a development step by a photolithography method and a second step that requires a development step can be employed as follows.
First, a lower clad layer and a core layer are formed on a substrate. Subsequently, a core pattern is formed on the core layer by photolithography. For example, an exposure process of irradiating the core layer with actinic rays is performed through a photomask having a core pattern.
Here, in the case of a 1st process, the core part patterned in the exposure area | region is formed among core layers, and a clad part is formed in an unexposed area | region. On the other hand, in the case of the second step, a cured portion (core portion) is formed in the exposed region of the core layer, and an uncured portion is formed in the unexposed region. Then, the uncured portion is removed in a development process using a developing solution such as various solvents and an alkaline solution, and the core portion patterned is formed by leaving the cured portion. Thereafter, an upper clad layer is formed on the core portion.
Further, after forming the core layer, a lower clad layer and an upper clad layer may be laminated on both sides of the obtained core layer, respectively.

  Moreover, in the case of the optical waveguide processing method by an etching method, the following processes can be employed, for example. First, a lower clad layer and a core layer are formed on a substrate. A photoresist having a pattern is formed on the core layer. The underlying core layer is patterned using the photoresist as a mask. For the patterning, for example, various etching methods such as reactive ion etching are used. Then, after removing the mask, an upper clad layer is formed so as to embed the patterned core portion.

  Moreover, in the case of the optical waveguide processing method by the replication method, the following processes can be employed, for example. First, a lower clad layer is formed on a substrate. A mold having a core pattern is pressed against the lower clad layer to form a core pattern-shaped hole in the inner direction of the lower clad layer. A varnish-like resin composition for forming a core layer is injected into the formed hole to form a patterned core. Then, an upper clad layer is formed on the core portion.

  In the present embodiment, a varnish-like resin composition is applied as a method for forming a cladding layer (upper cladding layer 120, upper cladding layer 120) or core layer 110 on a substrate (lower substrate layer 150). A method or a method of laminating a resin film made of a varnish-like resin composition is used.

Examples of the coating method include a direct coating method using various coaters such as a pin coater, a die coater, a comma coater, and a curtain coater, and a printing method such as screen printing. It can be partially applied by a printing method.
Moreover, as a method of forming said resin film, the method of drying the obtained coating film after apply | coating a varnish-like resin composition on a base material can be used, for example.
Moreover, as said lamination | stacking method, it is using the method of laminating | stacking a film-form resin film, for example using roll lamination, vacuum roll lamination, flat plate lamination, vacuum flat plate lamination, an atmospheric pressure press, a vacuum press, etc. it can.

  In the present embodiment, for example, a layer such as the lower cladding layer 130 may be once formed on the base material (lower base material layer 150), and then the base material may be peeled off. In this case, the lower clad layer 130 may be cured before the core layer 110 is formed. Thereby, the strength of the lower cladding layer 130 can be improved.

  Next, each component of the core layer 110 (or the core portion 112), the clad layer (the upper clad layer 120 and the lower clad layer 130), and the base material layer (the upper base material layer 140 and the lower base material layer 150) will be described.

(Core layer forming resin composition)
The core layer forming resin composition of the present embodiment can include, for example, polymer A, monomer A, and polymerization initiator A.

  Examples of the polymer A include, for example, acrylic resins, methacrylic resins, polycarbonates, polystyrenes, cyclic ether resins such as epoxy resins and oxetane resins, polyamides, polyimides, polybenzoxazoles, polysilanes, polysilazanes, and silicone resins. Fluorine resin, polyurethane, polyolefin resin, polybutadiene, polyisoprene, polychloroprene, polyester such as PET and PBT, polyethylene succinate, polysulfone, polyether, and cyclic such as benzocyclobutene resin and norbornene resin Olefin-based resin, phenoxy resin, etc. may be mentioned, and one or more of these may be used in combination as a polymer alloy, polymer blend (mixture), copolymer, etc. It can be.

Among these, acrylic resins, phenoxy resins, cyclic olefin resins, and the like can be used.
As the acrylic resin, for example, one kind selected from the group consisting of monofunctional acrylate, polyfunctional acrylate, monofunctional methacrylate, polyfunctional methacrylate, urethane acrylate, urethane methacrylate, epoxy acrylate, epoxy methacrylate, polyester acrylate, or urea acrylate Examples thereof include polymers of acrylic compounds containing the above. The acrylic resin may have a polyester skeleton, a polypropylene glycol skeleton, a bisphenol skeleton, a fluorene skeleton, a tricyclodecane skeleton, a dicyclopentadiene skeleton, or the like.
Examples of the phenoxy resin include those containing bisphenol A, a bisphenol A type epoxy compound or a derivative thereof, and bisphenol F, a bisphenol F type epoxy compound or a derivative thereof as a constituent unit of a copolymer component.

  The content of the polymer A is, for example, preferably 15% by mass or more, preferably 40% by mass or more, and 60% by mass or more with respect to the entire solid content of the core layer forming resin composition. Is more preferable. Thereby, mechanical characteristics are improved. Further, the content of the polymer contained in the core layer forming resin composition is, for example, preferably 95% by mass or less, and 90% by mass or less, based on the entire solid content of the core layer forming resin composition. Is more preferable. Thereby, optical characteristics are improved.

  In the present embodiment, the entire solid content of the resin composition refers to the non-volatile content in the composition resin and refers to the remainder excluding volatile components such as water and solvent. Moreover, in this embodiment, content with respect to the whole resin composition refers to content with respect to the whole solid content except the solvent of a resin composition, when a solvent is included.

  The monomer A is not particularly limited as long as it is a compound having a polymerizable site in the molecular structure, and examples thereof include acrylic acid (methacrylic acid) monomers, epoxy monomers, oxetane monomers, norbornene monomers, A vinyl ether monomer, a styrene monomer, a photodimerization monomer and the like can be mentioned, and one or more of these can be used in combination.

Among these, acrylic acid (methacrylic acid) monomers and epoxy monomers may be used.
As an acrylic acid (methacrylic acid) monomer, for example, a compound having two or more ethylenically unsaturated groups may be used, or a bifunctional or trifunctional or higher (meth) acrylate may be used. For example, aliphatic (meth) acrylate, alicyclic (meth) acrylate, aromatic (meth) acrylate, heterocyclic (meth) acrylate, or ethoxylated, propoxylated, ethoxylated propoxylated, caprolactone thereof Examples include modified products. In addition, the molecule may have a bisphenol skeleton, a urethane skeleton, or the like.
As an epoxy-type monomer, an alicyclic epoxy compound, an aromatic epoxy compound, an aliphatic epoxy compound, etc. are mentioned.

  As said monomer A, you may use the photopolymerizable monomer which reacts in an irradiation area | region and produces | generates a reaction material by irradiation of active rays, such as visible light, an ultraviolet-ray, infrared rays, a laser beam, an electron beam, and an X-ray. The monomer A is movable in an in-plane direction perpendicular to the film thickness in the core layer during irradiation with active light, and the refractive index difference between the active light irradiation region and the non-irradiation region in the core layer. May be generated.

  The content of the monomer A is preferably 1% by mass or more and 70% by mass or less, and more preferably 10% by mass or more and 60% by mass or less with respect to 100% by mass of the polymer A. Thereby, refractive index modulation can be caused more reliably.

(Polymerization initiator)
The polymerization initiator A is appropriately selected according to the type of polymerization reaction or crosslinking reaction of the monomer A. Examples of the polymerization initiator A include radical polymerization initiators such as acrylic acid (methacrylic acid) monomers and styrene monomers, and cationic polymerization initiators such as epoxy monomers, oxetane monomers, and vinyl ether monomers. it can.

  Examples of the radical polymerization initiator include benzophenones and acetophenones. Specifically, Irgacure 651, Irgacure 819, Irgacure 2959, Irgacure 184 (above, manufactured by BASF Japan) and the like can be mentioned.

  Examples of the cationic polymerization initiator include a Lewis acid generating type such as a diazonium salt and a Bronsted acid generating type such as an iodonium salt and a sulfonium salt. Specifically, Adekaoptomer SP-170 (manufactured by ADEKA), Sun-Aid SI-100L (manufactured by Sanshin Chemical Industry), Rhodorsil 2074 (manufactured by Rhodia Japan) and the like can be mentioned.

  The content of the polymerization initiator A is preferably 0.01% by mass to 5% by mass and more preferably 0.05% by mass to 3% by mass with respect to 100% by mass of the polymer A. preferable. Thereby, a monomer can be made to react rapidly, without reducing the optical characteristic and mechanical characteristic of a core layer.

(Other)
The resin composition for forming the core layer includes, for example, a crosslinking agent, a sensitizer (photosensitizer), a catalyst precursor, a cocatalyst, an antioxidant, an ultraviolet absorber, a light stabilizer, a silane coupling agent, and a coating surface. It further contains improvers, thermal polymerization inhibitors, leveling agents, surfactants, colorants, storage stabilizers, plasticizers, lubricants, fillers, inorganic particles, deterioration inhibitors, wettability improvers, antistatic agents, etc. Also good.

(solvent)
Examples of the solvent contained in the core layer forming resin composition include acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, cyclohexane, heptane, cyclohexane, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethyl sulfoxide, ethylene glycol, Ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, cellosolve, carbitol, anisole, and N-methyl Organic solvents such as pyrrolidone It can include one or more selected from.

(Clad layer forming resin composition)
The resin composition for forming a clad layer of the present embodiment can include, for example, polymer B, monomer B, and polymerization initiator B.

  Examples of the polymer B include, for example, acrylic resins, methacrylic resins, polycarbonate, polystyrene, cyclic ether resins such as epoxy resins and oxetane resins, polyamides, polyimides, polybenzoxazoles, polysilanes, polysilazanes, and silicone resins. Fluorine resin, polyurethane, polyolefin resin, polybutadiene, polyisoprene, polychloroprene, polyester such as PET and PBT, polyethylene succinate, polysulfone, polyether, and cyclic such as benzocyclobutene resin and norbornene resin Olefin-based resin, phenoxy resin, etc. may be mentioned, and one or more of these may be used in combination as a polymer alloy, polymer blend (mixture), copolymer, etc. It can be.

Among these, acrylic resins, phenoxy resins, cyclic olefin resins, and the like can be used.
As the acrylic resin, for example, one kind selected from the group consisting of monofunctional acrylate, polyfunctional acrylate, monofunctional methacrylate, polyfunctional methacrylate, urethane acrylate, urethane methacrylate, epoxy acrylate, epoxy methacrylate, polyester acrylate, or urea acrylate Examples thereof include polymers of acrylic compounds containing the above. The acrylic resin may have a polyester skeleton, a polypropylene glycol skeleton, a bisphenol skeleton, a fluorene skeleton, a tricyclodecane skeleton, a dicyclopentadiene skeleton, or the like.
Examples of the phenoxy resin include those containing bisphenol A, a bisphenol A type epoxy compound or a derivative thereof, and bisphenol F, a bisphenol F type epoxy compound or a derivative thereof as a constituent unit of a copolymer component.

  Further, the polymer B may contain a thermosetting resin as necessary. As thermosetting resins, for example, amino resins, isocyanate compounds, blocked isocyanate compounds, maleimide compounds, benzoxazine compounds, oxazoline compounds, carbodiimide compounds, cyclocarbonate compounds, polyfunctional oxetane compounds, episulfide resins, epoxy resins, etc. The thermosetting resin can be used.

  The content of the polymer B is, for example, preferably 15% by mass or more, preferably 40% by mass or more, and 60% by mass or more with respect to the entire solid content of the resin composition for forming a cladding layer. Is more preferable. Thereby, mechanical characteristics are improved. Further, the content of the polymer contained in the core layer forming resin composition is, for example, preferably 95% by mass or less, and 90% by mass or less, based on the entire solid content of the core layer forming resin composition. Is more preferable. Thereby, optical characteristics are improved.

  The monomer B is not particularly limited as long as it is a compound having a polymerizable site in the molecular structure, and examples thereof include acrylic acid (methacrylic acid) monomers, epoxy monomers, oxetane monomers, norbornene monomers, A vinyl ether monomer, a styrene monomer, a photodimerization monomer and the like can be mentioned, and one or more of these can be used in combination.

Among these, acrylic acid (methacrylic acid) monomers and epoxy monomers may be used.
As an acrylic acid (methacrylic acid) monomer, for example, a compound having two or more ethylenically unsaturated groups may be used, or a bifunctional or trifunctional or higher (meth) acrylate may be used. For example, aliphatic (meth) acrylate, alicyclic (meth) acrylate, aromatic (meth) acrylate, heterocyclic (meth) acrylate, or ethoxylated, propoxylated, ethoxylated propoxylated, caprolactone thereof Examples include modified products. In addition, the molecule may have a bisphenol skeleton, a urethane skeleton, or the like.
As an epoxy-type monomer, an alicyclic epoxy compound, an aromatic epoxy compound, an aliphatic epoxy compound, etc. are mentioned.

  The content of the monomer B is preferably 1% by mass or more and 70% by mass or less, and more preferably 10% by mass or more and 60% by mass or less with respect to 100% by mass of the polymer B. Thereby, refractive index modulation can be caused more reliably.

(Polymerization initiator)
The polymerization initiator B is appropriately selected according to the type of polymerization reaction or crosslinking reaction of the monomer B. Examples of the polymerization initiator B include radical polymerization initiators such as acrylic acid (methacrylic acid) monomers and styrene monomers, and cationic polymerization initiators such as epoxy monomers, oxetane monomers, and vinyl ether monomers. it can.

  Examples of the radical polymerization initiator include benzophenones and acetophenones. Specifically, Irgacure 651, Irgacure 819, Irgacure 2959, Irgacure 184 (above, manufactured by BASF Japan) and the like can be mentioned.

  Examples of the cationic polymerization initiator include a Lewis acid generating type such as a diazonium salt and a Bronsted acid generating type such as an iodonium salt and a sulfonium salt. Specifically, Adekaoptomer SP-170 (manufactured by ADEKA), Sun-Aid SI-100L (manufactured by Sanshin Chemical Industry), Rhodorsil 2074 (manufactured by Rhodia Japan) and the like can be mentioned.

  The content of the polymerization initiator B is preferably 0.01% by mass to 5% by mass and more preferably 0.05% by mass to 3% by mass with respect to 100% by mass of the polymer B. preferable. Thereby, a monomer can be made to react rapidly, without reducing the optical characteristic and mechanical characteristic of a core layer.

(Other)
The clad layer forming resin composition includes, for example, a crosslinking agent, a sensitizer (photosensitizer), a catalyst precursor, a cocatalyst, an antioxidant, an ultraviolet absorber, a light stabilizer, a silane coupling agent, and a coating surface. It further contains improvers, thermal polymerization inhibitors, leveling agents, surfactants, colorants, storage stabilizers, plasticizers, lubricants, fillers, inorganic particles, deterioration inhibitors, wettability improvers, antistatic agents, etc. Also good.

(solvent)
Examples of the solvent contained in the resin composition for forming a cladding layer include acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, cyclohexane, heptane, cyclohexane, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, dimethyl sulfoxide, ethylene glycol, Ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol dimethyl ether, ethylene glycol monomethyl ether acetate, propylene glycol monomethyl ether acetate, cellosolve, carbitol, anisole, and N-methyl Existence of pyrrolidone, etc. It can include one or more selected from solvents.

  The resin composition for forming a varnish-like core layer or the resin composition for forming a clad layer is prepared by, for example, adding a solution obtained by adding each of the above components to a solvent and stirring the solution using, for example, a PTFE filter having a 0.2 μm pore size. It can be obtained by filtration. In this case, for example, various mixers such as an ultrasonic dispersion method, a high-pressure collision dispersion method, a high-speed rotation dispersion method, a bead mill method, a high-speed shear dispersion method, and a rotation and revolution dispersion method can be used.

  The core part 112 in the core layer 110 of this embodiment may be comprised with the above-mentioned resin composition for core layer formation. Further, the upper clad layer 120 and the lower clad layer 130 may each be composed of the same or different kind of the above-mentioned resin composition for forming a clad layer.

(Base material layer)
As a constituent material of the base material layer (upper base material layer 140, lower base material layer 150), for example, polyolefin such as polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyethylene, polypropylene, polyimide, polyamide, poly Examples include ether imide, polycarbonate, and polyether sulfone. As the base material layer, films made of these constituent materials can be used.

  In this embodiment, the upper base material layer 140 and the lower base material layer 150 may be made of the same kind of material. For example, the upper base material layer 140 and the lower base material layer 150 may be formed of a resin layer made of polyimide.

In the present embodiment, the lower limit values of the film thicknesses of the upper base material layer 140 and the lower base material layer 150 may be, for example, 5 μm or more, preferably 10 μm or more. On the other hand, the upper limit of the film thickness of the upper base material layer 140 and the lower base material layer 150 may be, for example, 50 μm or less, preferably 30 μm or less, and more preferably 25 μm or less.
In the present embodiment, the film thickness of the lower base material layer 150 may be the same as the film thickness of the upper base material layer 140.

In the present embodiment, the lower limit of the elastic modulus of the upper base material layer 140 and the lower base material layer 150 may be, for example, 1 GPa or more, preferably 2 GPa or more, more preferably 3 GPa or more. On the other hand, the upper limit of the elastic modulus of the upper base material layer 140 and the lower base material layer 150 may be, for example, 12 GPa or less, preferably 11 GPa or less, and more preferably 10 GPa or less.
In the present embodiment, the elastic modulus of the lower base material layer 150 may be different from the elastic modulus of the upper base material layer 140. In the present embodiment, the elastic modulus is a tensile elastic modulus.

  In the present embodiment, the lower limit values of the film thicknesses of the upper cladding layer 120 and the lower cladding layer 130 may be, for example, 1 μm or more, preferably 3 μm or more, more preferably 5 μm or more. On the other hand, the upper limit values of the film thicknesses of the upper cladding layer 120 and the lower cladding layer 130 may be, for example, 50 μm or less, preferably 30 μm or less, and more preferably 15 μm or less. The film thickness of the upper clad layer 120 may be the film thickness of the upper clad layer 120 on the core portion 112, for example.

  In the present embodiment, the lower limit value of the total film thickness of the optical waveguide sheet 10 may be, for example, 50 μm or more, preferably 60 μm or more, and more preferably 70 μm or more. On the other hand, the upper limit of the total film thickness of the optical waveguide sheet 10 may be, for example, 300 μm or less, preferably 200 μm or less, and more preferably 150 μm or less.

(Cutting process of optical waveguide film 100)
Next, the cutting process of the optical waveguide film 100 is demonstrated using FIG. 5, FIG. In FIG. 5, the cut-out area | region which cuts out the optical waveguide sheet 10 from the optical waveguide film 100 is shown with the dotted line. FIG. 6A to FIG. 6C are process cross-sectional views illustrating a modification of the cutout method in the cutout region shown in FIG.

  As shown in FIG. 6A, the cutting process of the optical waveguide film 100 includes a first cutting process of cutting with a dicing blade at the waveguide end surface 101 and the side surface 103 of the optical waveguide film 100 in the optical connector insertion region 106. Second cutting out by a kind of processing method selected from the group consisting of cutting with a cutting saw, laser, router, ultrasonic cutter or water jet, and punching with a blade die in an area other than the optical connector insertion area 106 And a process.

  In the second cutting process according to the present embodiment, for example, a cutting saw, a laser, a router, an ultrasonic cutter or a water jet, and a blade die are used as the high processing cutting means having a cutting speed superior to the precision processing. A kind of processing method selected from the group consisting of punching can be used, and among these, a cutting saw, a laser and a blade shape are preferable, and a cutting saw and a blade shape are more preferable. These may be used alone or in combination of two or more.

  In this embodiment, the dicing blade is a high precision but is used for linear machining, and the machining means has a relatively slow machining speed compared to a machining method such as cutting with a cutting saw or punching with a blade die. It is. On the other hand, the cutting saw and the blade mold are different from the dicing blade in that they are not rotary blades. In addition, the cutting saw and the blade type have advantages in terms of workability such as a high processing speed and curve processing, although the surface roughness of the cut surface is rough as compared with the dicing blade. As with cutting saws and blades, lasers, routers, ultrasonic cutters, and water jets are excellent in workability such as curve processing.

  In the first cutting process according to the present embodiment, the end face in the short direction of the optical waveguide film 100 (end face functioning as a light incident face) can be cut out from the optical waveguide sheet 10 by a dicing blade.

  In the present embodiment, the processing conditions of the dicing blade are not particularly limited as long as the cut surface can be a mirror surface having a very reduced surface roughness. The cutting direction may be a direction perpendicular to the extending direction (longitudinal direction) of the core portion 112, but may be an inclined direction with respect to the extending direction.

  According to the present embodiment, the waveguide end face 101 is cut out by the precision cutting means using a dicing blade, whereby light attenuation due to light scattering can be suppressed at the waveguide end face 101 of the optical waveguide film 100.

  In addition, since the optical connector insertion region 106 of the optical waveguide film 100 is inserted into the optical connector, high processing accuracy may be required. In response to such a requirement, by using precision cutting means by a dicing blade, the position of the side surface 103 of the optical waveguide film 100 and the position of the internal core portion 112 in the optical connector insertion region 106 are precisely controlled. Thus, the tip portion (optical connector insertion region 106) of the optical waveguide film 100 can be cut out. That is, in the first cutting step, the side surface 103 in the optical connector insertion region 106, that is, the side surface 103 of the optical waveguide film 100 having a predetermined length from one end where the waveguide end surface 101 is formed is applied to the optical waveguide sheet 10 using a dicing blade. Can be cut out from. Accordingly, as shown in FIG. 6A, the side surface 103 is contoured with a dicing blade, whereby excellent positional accuracy can be realized. Therefore, a manufacturing method having excellent manufacturing stability can be obtained.

  In the outer shape processing of the optical waveguide film 100 of the present embodiment, the dicing blade can cut out the side surface 103 of the optical connector insertion region 106 together with the waveguide end surface 101 of the optical waveguide film 100. At this time, the waveguide end face 101 and the side face 103 of the optical waveguide film 100 cut out by the dicing blade shown in FIG. Thereby, the one end (optical connector insertion area | region 106) of the optical waveguide film 100 can improve the ease of insertion to an optical connector insertion port, and insertion position accuracy. Moreover, the optical characteristic of the waveguide end surface 101 of the optical waveguide film 100 can be improved in the state inserted in the optical connector. Moreover, since the width in the optical connector insertion region 106 of the optical waveguide film 100 can be maintained, the variation in the optical characteristics of the optical waveguide located outside the optical waveguide film 100 can be reduced.

  In the present embodiment, the cutting with the dicing blade is preferably performed by cutting the whole in one film thickness direction of the optical waveguide sheet 10. Further, the dicing blade used for cutting the waveguide end face 101 may be the same as or different from that used for cutting the side face 103. Further, the rotational speed and moving speed of the dicing blade can be appropriately selected according to the surface smoothness of the cut surface.

  On the other hand, in the second cutting step according to the present embodiment, the second region other than the first region cut out by the dicing blade in the first cutting step is cut out by a high machining cutting means having excellent workability. Can do. The second region that can be cut out by the high processing cutting means may be a region other than the waveguide end surface 101 of the optical waveguide film 100, for example, other than the optical connector insertion region 106 (the waveguide end surface 101 and the side surface 103). Specifically, the side surface 104 of the connection path region 108, the outer peripheral surface of the light conversion region 107, and the like can be given. Thus, in the second region where high precision processing is not required, the productivity in the manufacturing process of the optical waveguide film 100 is improved by cutting using the high processing cut having excellent processability as described above. Can be made.

  The high machining cutting means is not particularly limited as long as it is a machining means excellent in workability such as machining speed and curve machining. For example, cutting with a cutting saw or punching with a blade die is excellent in that the processing speed is improved and the curve processing is facilitated. Moreover, the punching using a blade mold can improve productivity when mass-producing the same shape.

  According to the present embodiment, it is possible to quickly perform the outer shape processing of a region (for example, the connection path region 108, the light conversion region 107, etc.) of the optical waveguide film 100 that does not require a relatively mirror surface structure. The manufacturing efficiency of the waveguide film 100 can be increased.

Here, in the cutting process of the optical waveguide film so far, the same processing means has been used without changing the processing means from the viewpoint of reducing the number of manufacturing steps. That is, the outer region of the conventional optical waveguide film has been cut out by the same processing means.
On the other hand, in the cutting process of the optical waveguide film 100 of the present application, by using both the precision cutting means and the high processing cutting means as described above, the balance between optical characteristics and workability is excellent. can do.

  As described above, the optical waveguide film 100 is obtained from the optical waveguide sheet 10.

Hereinafter, the modification of the manufacturing process of the optical waveguide film 100 of this embodiment is demonstrated.
As shown in FIG. 6A, as a modification, a step portion 105 may be formed between the side surface 103 and the side surface 104 of the optical waveguide film 100. The step portion 105 is a structure that is generated when the side surface 103 and the side surface 104 are formed by cutting means that are different from each other, and corresponds to the intersection of the side surface 103 and the side surface 104. For example, it corresponds to a crossing portion of a cut surface (side surface 103) by a dicing blade and a cut surface (side surface 104) by a cutting saw or a blade mold. The step portion 105 serves as a mark indicating the position of the optical connector insertion region 106. If the optical connector insertion region 106 is touched when the optical waveguide film 100 is inserted, foreign matter or the like adheres to cause a reduction in the insertion yield of the optical connector. Therefore, it is preferable not to touch the optical connector insertion region 106. Since the mark by the step portion 105 makes it easy to visually recognize the optical connector insertion region 106, it is possible to avoid touching the optical connector insertion region 106. Thereby, the structure of the optical waveguide film 100 excellent in manufacturing stability can be realized.

  Moreover, in this embodiment, said cutting process can be implemented in the state which affixed the optical waveguide sheet 10 on the support base material through the dicing tape not shown. Such a support substrate may be half-cut.

  In the processing step of the present embodiment, either the first cutting step or the second cutting step may be performed first. In other words, the second cutting process may be performed after the first cutting process, or the first cutting process may be performed after the second cutting process.

  In the present embodiment, when the width in the end face direction of the optical waveguide film 100 is W1 in the connection path region 108 and W2 is the width in the optical connector insertion region 106, W2 and W1 may be the same, but W2 May be cut out to be thicker than W1. Thereby, since the visibility of the optical connector insertion region 106 of the optical waveguide film 100 is improved, it is possible to suppress touching the optical connector insertion region 106 and to realize a structure excellent in insertion yield.

  Moreover, when the both ends of the optical waveguide film 100 are the optical connector insertion area | region 106 and the waveguide end surface 101 is one end and the other end, each end surface can be cut out with a dicing blade.

  Moreover, as shown in FIG. 6B, as a modification, the first cutting step cuts only the waveguide end face 101 in the short direction of the optical waveguide film 100 with a dicing blade (precision cutting means), In the second cutting step, a region other than the optical connector insertion region 106, that is, the side surface 103 of the optical connector insertion region 106, the side surface 104 of the connection path region 108, and the outer peripheral surface of the light conversion region 107 are cut using a cutting saw. Or you may cut out by high processing cut means, such as punching using a blade type.

  The cutting process as shown in FIG. 6B is a cutting region using a high-cutting means such as cutting using a cutting saw or punching using a blade die, compared to the cutting process shown in FIG. Therefore, productivity can be increased.

  Further, as shown in FIG. 6C, it is possible to cut out a plurality of optical waveguide films 100 from the optical waveguide sheet 10.

  As shown in FIG. 6C, the position of the waveguide end face 101 of the optical waveguide film 100 is preferably aligned in the short direction. As a result, a plurality of waveguide end faces 101 can be cut out with a single dicing blade, so that productivity can be improved.

  Moreover, a predetermined spacing portion may be formed between the optical waveguide films 100 in the longitudinal direction. Thereby, in cut | disconnecting the side surface 103 of the optical waveguide film 100, since a cut auxiliary | assistant part can be ensured, manufacturing stability can be improved.

  It is also possible to simultaneously cut out a plurality of optical waveguide films 100 using a plurality of cutting means (dicing blade, cutting saw, blade type or the like).

  Further, after the groove 109 is formed, a step of cutting the optical waveguide film 100 may be performed. For example, a dicing blade may be used to form the groove 109.

  The outer shape of the optical waveguide film 100 is not limited to the above example, and may be, for example, a bifurcated shape or a tridental shape.

  The core layer 110 of the optical waveguide film 100 may be a single layer, but a plurality of core layers may be formed with a cladding layer interposed therebetween.

  The method for manufacturing an optical component according to the present embodiment can include a step of inserting one end (optical connector insertion region 106) of the optical waveguide film 100 obtained by the method for manufacturing the optical waveguide film 100 into the optical connector. Thereby, an optical component is obtained. An optical connector may be formed on at least one end (optical connector insertion region 106) of the optical waveguide film 100, but an optical connector may be formed on each of both ends of the optical waveguide film 100.

  In the present embodiment, the optical connector is not particularly limited. For example, an MT connector, an MPO connector, an MPX connector, a PMT connector, a PT connector, or the like can be used.

  As mentioned above, although embodiment of this invention was described with reference to drawings, these are the illustrations of this invention, Various structures other than the above are also employable.

  EXAMPLES Hereinafter, although this invention is demonstrated in detail with reference to an Example, this invention is not limited to description of these Examples at all.

Example 1
1. 6. Production of Optical Waveguide Sheet (1) Synthesis of polyolefin-based resin having a leaving group Both hexyl norbornene (HxNB) in a glove box whose moisture and oxygen concentrations are controlled to 1 ppm or less and filled with dry nitrogen. 2 g (40.1 mmol) and 12.9 g (40.1 mmol) of diphenylmethylnorbornenemethoxysilane were weighed into a 500 mL vial, 60 g of dehydrated toluene and 11 g of ethyl acetate were added, and the top was sealed with a silicon sealer.

  Next, 1.56 g (3.2 mmol) of Ni catalyst and 10 mL of dehydrated toluene were weighed in a 100 mL vial, and a stirrer chip was placed and sealed, and the catalyst was thoroughly stirred to dissolve completely. When 1 mL of this Ni catalyst solution was accurately weighed with a syringe, and quantitatively injected into the vial bottle in which the two kinds of norbornene were dissolved and stirred for 1 hour at room temperature, a marked increase in viscosity was confirmed. At this point, the stopper was removed, 60 g of tetrahydrofuran (THF) was added, and the mixture was stirred to obtain a reaction solution.

  In a 100 mL beaker, 9.5 g of acetic anhydride, 18 g of hydrogen peroxide (concentration 30%) and 30 g of ion-exchanged water were added and stirred to prepare an aqueous solution of peracetic acid on the spot. Next, the total amount of the aqueous solution was added to the reaction solution, and the mixture was stirred for 12 hours to reduce Ni.

  Next, the treated reaction solution was transferred to a separatory funnel, the lower aqueous layer was removed, and then 100 mL of a 30% aqueous solution of isopropyl alcohol was added and vigorously stirred. The aqueous layer was removed after standing and completely separating the two layers. After repeating this water washing process three times in total, the oil layer was dropped into a large excess of acetone to reprecipitate the polymer produced, separated from the filtrate by filtration, and then in a vacuum dryer set at 60 ° C. Polymer # 1 was obtained by heating and drying for 12 hours.

  The molecular weight distribution of polymer # 1 was Mw = 100,000 and Mn = 40,000 as a result of GPC measurement. The molar ratio of each structural unit in polymer # 1 was 50 mol% for the hexylnorbornene structural unit and 50 mol% for the diphenylmethylnorbornenemethoxysilane structural unit as a result of identification by NMR measurement.

(2) Production of composition for forming core layer 10 g of the purified polymer # 1 was weighed into a 100 mL glass container, and 40 g of mesitylene, 0.01 g of an antioxidant Irganox 1076 (manufactured by BASF), cyclohexyloxetane monomer ( CHOX manufactured by Toagosei Co., CAS # 48333-3-25-9, molecular weight 186, boiling point 125 ° C./1.33 kPa) 2 g, polymerization initiator (photoacid generator) “Rhodorsil Photoinitiator 2074” (manufactured by Rhodia, CAS # 178233-72- 2) (0.0125 g, in 0.1 mL of ethyl acetate) was added and dissolved uniformly, and then filtered through a 0.2 μm PTFE filter to obtain a clean core layer forming composition.

(3) Production of cladding layer Norbornene-based resin composition containing a cyclic olefin-based resin (20 wt% 2-heptanone solution, 10 g of Avatrel 2590 manufactured by Promelas), 2-undecylmethylimidazole (manufactured by Shikoku Kasei Kogyo Co., Ltd., Part No. C11Z) (0.06 g) was added and mixed to obtain a coating solution for forming a cladding layer. The clad layer forming coating solution was uniformly applied onto two polyimide films with a doctor blade, and then dried for 15 minutes in a dryer at 45 ° C. After completely removing the solvent, the coating film was cured by heating at 160 ° C. for 2 hours in a dryer to form two optical waveguide forming films (cladding layer and base material layer).

(4) Preparation of core layer The composition for core layer formation was uniformly apply | coated with the doctor blade on the mold release process PET film, Then, it injected | threw-in to the dryer of 40 degreeC for 5 minutes. After completely removing the solvent to form a film, a photomask having a linear pattern of lines and spaces drawn on the entire surface was pressure-bonded onto the obtained film. Then, ultraviolet rays were irradiated from above the photomask with a parallel exposure machine. The integrated light quantity of ultraviolet rays was 1300 mJ / cm ² .

  Next, the photomask was removed and placed in an oven at 150 ° C. for 30 minutes. When taken out from the oven, it was confirmed that a clear waveguide pattern (a plurality of core portions) having a rectangular cross section appeared on the coating. The thickness of the obtained core layer was 40 μm.

(5) Production of optical waveguide sheet On a stainless steel plate, a base material layer, a clad layer, a core layer, a clad layer, and a base material layer were laminated in this order by a laminator to obtain a laminate. The obtained laminate was heat-treated at 160 ° C. for 2 hours to obtain an optical waveguide sheet. The thickness of the obtained laminate was 100 μm.

(6) Preparation of optical waveguide test piece An optical waveguide sheet was attached to dicing tape UHP-110AT (manufactured by Denka), and the optical waveguide sheet was cut using a dicer. Then, in order to peel off the optical waveguide film from the dicing tape, UV irradiation with an integrated light amount of 500 mJ / cm ² was performed, the optical waveguide film was peeled off from the dicing tape, and a 3 mm × 30 mm optical waveguide test piece (optical waveguide film) was obtained. Obtained.

(Example 2)
When producing the optical waveguide sheet, the same procedure as in Example 1 was performed except that the obtained laminate was heat-treated at 170 ° C. for 2 hours.

(Example 3)
When producing the optical waveguide sheet, the same procedure as in Example 1 was performed except that the obtained laminate was heat-treated at 180 ° C. for 2 hours.

(Comparative Example 1)
When producing the optical waveguide sheet, the same procedure as in Example 1 was performed, except that the both ends of the clad layer in the short direction of the optical waveguide were laminated with a laminator while being fixed with a tape.

(Comparative Example 2)
When producing the optical waveguide sheet, the same procedure as in Example 1 was performed, except that the both ends of the cladding layer in the longitudinal direction of the optical waveguide were laminated using a laminator in a state of being fixed with a tape.

2. Evaluation of Optical Waveguide Film The optical waveguide test pieces obtained in Examples and Comparative Examples were evaluated as follows. The evaluation results are shown in Table 1.

(Degree of freedom X in the longitudinal direction)
As shown in FIG. 2B, a support base 200 having a mounting surface 210 that is horizontal to the ground is prepared, and the support base 200 is such that one end of the optical waveguide film 100 that is an optical waveguide test piece is a free end 220. The optical waveguide film 100 was installed on the mounting surface 210 of 200, and a position 25 mm from one end (free end 220) was fixed. With the fixed position as a reference, the amount of displacement in the direction perpendicular to the mounting surface 210 at one end (free end 220) was defined as the degree of freedom X. The measurement was performed at room temperature of 25 ° C. 50 samples of the above optical waveguide test pieces were prepared, and the average values of the measured values are shown in the table.

(Degree of freedom Y in the short direction)
As shown in FIG. 3B, a support base 200 having a mounting surface 210 that is horizontal to the ground is prepared, and the support base is set so that one end of the optical waveguide film 100 that is an optical waveguide test piece is a free end 220. The optical waveguide film 100 was installed on the mounting surface 210 of 200, and was left in a state where it was not fixed by applying a load at a position 7 mm from one end (free end 220). At this time, the back surface of the optical waveguide film 100 (the surface opposite to the surface 102 having the groove portion 109 through which light can be input and output) was opposed to the mounting surface 210 of the support base 200.
Light was incident on the core portion 112 from the other end opposite to the one end (free end 220), and position information of the core portion 112 at the free end 220 was obtained. Subsequently, as shown in FIG. 3A, the position information of the core portion 112 was acquired from the light irradiation position on the waveguide end face 101. The position information of the core part 112 was measured with a camera. The position information of the core part 112 obtained in this way was plotted on the plane coordinates composed of the X axis and the Y axis. Then, on a plane coordinate, a straight line L connecting two points of the core part 112 (second core part 250) located on the outermost side is drawn, and the core part 112 (first core part) closest to the center is drawn from the straight line L. 240), the distance D of the coordinates indicating (240, when the core portion 112 has a symmetric structure, the larger one of the distances D when the two first core portions 240 are present) is defined as the degree of freedom Y. The measurement was performed at room temperature of 25 ° C. 50 samples of the above optical waveguide test pieces were prepared, and the average values of the measured values are shown in the table.

(Evaluation 1: Workability of insertion into optical connector)
Inserting the optical waveguide test piece in the examples and comparative examples into a jig having an opening of 110 μm × 3.2 mm, and observing the end of the optical waveguide test piece with an optical microscope before and after the insertion, thereby increasing the number of scratches due to the insertion. investigated. As a result, at the level of Comparative Example 1, scratches were confirmed at the ends of the optical waveguide test piece inserted in the 20% test piece. No scratches were observed at other levels.

(Evaluation 2: Yield)
The ratio of the number of non-defective products to the number of manufactured optical waveguide test pieces in Examples and Comparative Examples was evaluated. As a result, at the level of Comparative Example 2, when the optical waveguide sheet attached to the dicing tape was cut with a dicer in the production of the optical waveguide test piece, 10% of the optical waveguide test piece was dropped from the dicing tape. Because it was lost, the percentage of non-defective products was 90%. At other levels, the percentage of good products was 100%.

  It turned out that the optical waveguide film of Examples 1-3 is excellent in the manufacture stability and yield of an optical connector.

DESCRIPTION OF SYMBOLS 10 Optical waveguide sheet 100 Optical waveguide film 101 Waveguide end surface 102 Surface 103 Side surface 104 Side surface 105 Step part 106 Optical connector insertion area 107 Optical conversion area 108 Connection path area 109 Groove part 110 Core layer 112 Core part 114 Clad part 120 Upper clad layer 130 Lower clad layer 140 Upper base material layer 150 Lower base material layer 200 Support base 210 Mounting surface
220 Free end 240 First core portion 250 Second core portion

Claims (11)

A long optical waveguide film comprising a lower clad layer, a plurality of patterned core portions provided on the lower clad layer, and an upper clad layer provided on the core portion,
It is used for forming an optical component in which at least one end of the optical waveguide film is inserted into an optical connector,
When the degree of freedom in the longitudinal direction of the core part measured under the following conditions is X, and the degree of freedom in the short direction in which the core parts are adjacent to each other in a direction perpendicular to the longitudinal direction is Y,
X / Y (provided that, X> 0, and, Y> 0) is state, and are 120 to 1200 or less,
An optical waveguide film in which 0.86 mm ≦ X ≦ 3.1 mm and 2.6 μm ≦ Y ≦ 7.2 μm .
(Measurement condition)
・ Temperature: Room temperature 25 ℃
-Degree of freedom X in the longitudinal direction:
A support base having a mounting surface horizontal to the ground is prepared, and the optical waveguide film is installed on the mounting surface of the support base so that the one end of the optical waveguide film is a free end. On the other hand, a position of 25 mm from the one end is fixed so that the optical waveguide film is bent on the lower surface side in the vertical direction . With the fixed position as a reference, the amount of displacement of the one end in the direction perpendicular to the mounting surface is defined as the degree of freedom X.
・ Degree of freedom Y in the short direction:
Prepared with a support base having a mounting surface horizontal to the ground, and installed the optical waveguide film on the mounting surface of the support base so that the one end of the optical waveguide film is a free end, 7 mm from the one end The position of is fixed. Light is incident on the core portion from the other end opposite to the one end, and position information of the core portion at the one end is acquired. From the position information of the core part, the first core part located on the outermost side in the short side direction and the second core part nearest to the center in the short side direction in the direction perpendicular to the short side direction and the long side direction. The amount of positional deviation is calculated, and the degree of freedom is Y. The optical waveguide film according to claim 1,
In the short direction, it has a convex shape toward the upper surface side,
An optical waveguide film having a convex shape toward a lower surface side opposite to the upper surface side in the longitudinal direction. The optical waveguide film according to claim 1 or 2,
A lower base material layer provided on the lower surface side of the lower clad layer;
An upper base material layer provided on the upper surface side of the upper clad layer, and
The said lower base material layer and the said upper base material layer are optical waveguide films comprised by the polyimide layer. The optical waveguide film according to claim 3,
The film thickness of the said lower base material layer is the same as the film thickness of the said upper base material layer, The optical waveguide film. The optical waveguide film according to claim 3 or 4,
The optical waveguide film, wherein the elastic modulus of the lower base material layer is different from the elastic modulus of the upper base material layer. The optical waveguide film according to any one of claims 1 to 5,
The optical waveguide film has a thickness of 50 μm or more and 300 μm or less. The optical waveguide film according to any one of claims 1 to 6,
The optical waveguide film, wherein the upper cladding layer and / or the lower cladding layer has a thickness of 1 μm or more and 50 μm or less.   The optical waveguide film according to any one of claims 1 to 7,
  The side surface in an optical connector insertion area | region is an optical waveguide film which has predetermined length from the end of the said optical waveguide film in which the waveguide end surface was formed.   The optical waveguide film according to claim 8, wherein
  An optical waveguide film in which a step is formed between a side surface of the optical connector insertion region and a side surface of a region other than the optical connector insertion region.   The optical waveguide film according to any one of claims 1 to 9,
  An optical waveguide film in which a groove for performing optical path conversion of an optical signal passing through a core is formed on the surface of the optical waveguide film. Comprising an optical connector, and a optical waveguide film according to any one of claims 1 to 10, one end of which is inserted into the optical connector, the optical component.

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