JP2018172758A - Method for manufacturing vapor deposition mask having frame, method for manufacturing organic semiconductor element and method for manufacturing organic el display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a method for manufacturing a vapor deposition mask having a frame, capable of improving the positional accuracy of the vapor deposition mask and forming a high definition vapor deposition pattern; a method for manufacturing an organic semiconductor element; and a method for manufacturing an organic EL display.SOLUTION: A method for manufacturing a vapor deposition mask having a frame and having a vapor deposition mask 100 fixed to the frame 60 includes a vapor deposition mask fixing step of fixing the vapor deposition mask 100 to the frame 60. In the vapor deposition mask fixing step, the vapor deposition mask 100 is temporarily fixed in a more stable state since the vapor deposition mask 100 is supported by not only the frame 60, but also a support member 70 positioned in the frame 60.SELECTED DRAWING: Figure 1

Description

  Embodiments of the present disclosure relate to a method for manufacturing a vapor deposition mask with a frame, a method for manufacturing an organic semiconductor element, and a method for manufacturing an organic EL display.

  Formation of a vapor deposition pattern using a vapor deposition mask is usually performed by bringing a vapor deposition mask provided with an opening corresponding to a pattern to be vapor-deposited and a vapor deposition target into close contact with each other, and allowing the vapor deposition material released from the vapor deposition source to pass through the opening. It is performed by adhering to a vapor deposition object.

  As a vapor deposition mask used for the formation of the vapor deposition pattern, for example, a metal mask having a resin mask opening having a resin mask opening corresponding to the pattern to be vapor deposited and a metal mask opening (sometimes referred to as a slit). A vapor deposition mask (for example, Patent Document 1) formed by laminating and is known. In many cases, these vapor deposition masks are used by being fixed to a frame.

Japanese Patent No. 5288072

  An embodiment of the present disclosure mainly provides a method for manufacturing a vapor deposition mask with a frame capable of forming a high-definition vapor deposition pattern, a method for manufacturing an organic semiconductor element, and a method for manufacturing an organic EL display.

  A method for manufacturing a vapor deposition mask with a frame according to an embodiment of the present disclosure is a method for manufacturing a vapor deposition mask with a frame in which the vapor deposition mask is fixed to the frame, and includes a vapor deposition mask fixing step of fixing the vapor deposition mask to the frame. The vapor deposition mask fixing step is performed in a state where the vapor deposition mask is temporarily supported by a support member located in the frame.

  In the manufacturing method of the vapor deposition mask with a frame, including a support member placing step of placing a support member for temporarily supporting the vapor deposition mask in the frame, the vapor deposition mask fixing step May fix the vapor deposition mask to the frame in a state where the vapor deposition mask is placed on the support member.

  Further, in the above-described method for manufacturing a vapor deposition mask with a frame, the frame includes a frame main body and an auxiliary frame that divides an opening space in the frame main body into a plurality, and in the vapor deposition mask fixing step, The support member may support not only the vapor deposition mask but also the auxiliary frame, and the vapor deposition mask may be fixed to the auxiliary frame on the support member.

  Further, in the above-described method for manufacturing a vapor deposition mask with a frame, the vapor deposition mask includes a resin mask having a plurality of resin mask openings corresponding to a pattern to be vapor deposited, and a metal mask having a metal mask opening. The deposition mask may be formed by laminating the resin mask opening and the metal mask opening so as to overlap each other.

  A manufacturing method of a deposition mask with a frame according to another embodiment of the present disclosure is a manufacturing method of a deposition mask with a frame in which the deposition mask is fixed to the frame, and the deposition mask preparation body is fixed to the frame. Including a preparation body fixing step and a vapor deposition mask forming step for forming a vapor deposition mask by forming an opening in the vapor deposition mask preparation body fixed to the frame, wherein the vapor deposition mask preparation body fixing step is located in the frame This is performed in a state where the deposition mask preparation is temporarily supported by the support member.

  In the above-described method for manufacturing a vapor deposition mask with a frame, the vapor deposition mask preparation includes a support member placement step of placing a support member for temporarily supporting the vapor deposition mask preparation in the frame. In the body fixing step, the vapor deposition mask preparation may be fixed to the frame in a state where the vapor deposition mask preparation is placed on the support member.

  Further, in the above-described method for manufacturing a vapor deposition mask with a frame, the frame includes a frame main body and an auxiliary frame that divides an opening space in the frame main body into a plurality of pieces, and the vapor deposition mask preparation body fixing step The support member may support not only the deposition mask preparation but also the auxiliary frame, and the deposition mask preparation may be fixed to the auxiliary frame on the support member.

  Moreover, in the above-described method for manufacturing a vapor deposition mask with a frame, even if the vapor deposition mask preparation is a vapor deposition mask preparation in which a metal mask having a metal mask opening and a resin layer are laminated. Good.

  Moreover, the manufacturing method of the organic-semiconductor element of other one Embodiment of this indication includes the vapor deposition pattern formation process which forms a vapor deposition pattern in a vapor deposition target object using a vapor deposition mask with a flame | frame, and is used by the said vapor deposition pattern formation process. The framed deposition mask is a framed deposition mask manufactured by the framed deposition mask manufacturing method according to the embodiment of the present disclosure.

  Moreover, the organic-semiconductor element manufactured by the manufacturing method of the organic-semiconductor element concerning embodiment of the said this indication is used for the manufacturing method of the organic electroluminescent display of other one embodiment of this indication.

  According to the method for manufacturing a vapor deposition mask with a frame of the present disclosure, it is possible to manufacture a vapor deposition mask capable of forming a high-definition vapor deposition pattern. Moreover, according to the manufacturing method of the organic semiconductor element of this indication, and the manufacturing method of the organic EL display of this indication, a high-definition organic semiconductor element or a high-definition display can be manufactured.

It is a figure for demonstrating the manufacturing method of the vapor deposition mask with a frame concerning embodiment of this indication. It is a figure for demonstrating the manufacturing method of the vapor deposition mask with a frame concerning embodiment of this indication. Fig.3 (a) is a front view which shows an example when the vapor deposition mask used in the manufacturing method of the vapor deposition mask concerning embodiment of this indication is planarly viewed from the metal mask side, FIG.3 (b) is ( It is sectional drawing in the AA part of a). It is a figure which shows an example of the device which has an organic EL display.

  Embodiments of the present invention will be described below with reference to the drawings. Note that the present invention can be implemented in many different modes, and is not construed as being limited to the description of the embodiments exemplified below. In addition, for the sake of clarity, the drawings may be schematically represented with respect to the width, thickness, shape, etc. of each part as compared to the actual embodiment, but are merely examples, and the interpretation of the present invention is not limited. It is not limited. In addition, in the present specification and each drawing, the same elements as those described above with reference to the previous drawings are denoted by the same reference numerals, and detailed description may be omitted as appropriate. In addition, for convenience of explanation, the description will be made using terms such as “upper” or “lower”, but the vertical direction may be reversed. The same applies to the left-right direction.

<The manufacturing method of the vapor deposition mask with the 1st frame>
A manufacturing method of a deposition mask with a frame according to an embodiment of the present disclosure is a manufacturing method of a deposition mask with a frame in which the deposition mask is fixed to the frame, and includes a deposition mask fixing step of fixing the deposition mask to the frame. The vapor deposition mask fixing step is performed in a state where the vapor deposition mask is temporarily supported by a support member located in the frame. More specifically, in a state in which a support member for temporarily supporting the vapor deposition mask is placed in the frame, a support member placing step, and the vapor deposition mask being placed on the support member And a vapor deposition mask fixing step of fixing the vapor deposition mask to the frame.

  Drawing 1 is a figure for explaining a manufacturing method of a vapor deposition mask with a frame concerning an embodiment of this indication. More specifically, FIG. 1A is a plan view showing a state before the support member mounting step is performed and the vapor deposition mask fixing step is performed, and FIG. 1B is a plan view of FIG. It is AA sectional drawing of).

  As shown in FIGS. 1A and 1B, in the method for manufacturing a vapor deposition mask with a frame according to the embodiment of the present disclosure, a support member 70 for temporarily supporting the vapor deposition mask 100 in the frame 60 is provided. A supporting member mounting step is performed, and then a deposition mask fixing step of fixing the deposition mask 100 to the frame 60 in a state where the deposition mask 100 is mounted on the support member 70. Done. In addition, the code | symbol 80 in FIG. 1 is a stage for manufacturing a vapor deposition mask with a flame | frame, and has played the role as a stand for supporting the flame | frame 60. FIG.

  According to the method for manufacturing a vapor deposition mask with a frame according to the embodiment of the present disclosure, in performing the vapor deposition mask fixing process of fixing the vapor deposition mask 100 to the frame 60, the supporting member placing process is performed in the previous stage. Done. Therefore, since the vapor deposition mask 100 is supported not only by the frame 60 to be fixed but also by the support member 70, the vapor deposition mask 100 can be fixed to the frame 60 in a more stable state. Thereby, the positional accuracy of the vapor deposition mask 100 can be improved, and a highly accurate and high-definition vapor deposition mask can be manufactured.

(flame)
The frame 60 used in the present method is not particularly limited, and various conventionally used frames can be appropriately selected and used. Therefore, the frame 60 shown in FIG. 1 has a rectangular shape, but is not limited thereto, and may have any shape. Also, the material of the frame 60 is not particularly limited, and can be appropriately selected from various metals, alloys, glass, ceramics, and the like. Further, the thickness of the frame 60 is not particularly limited and can be appropriately designed, but is preferably in the range of 10 mm to 30 mm from the viewpoint of rigidity and the like. Further, the width of the frame 60 when the frame 60 is viewed from the front is not particularly limited as long as it has a width that can fix the vapor deposition mask 100, and may be, for example, 10 mm or more and 70 mm or less.

  Drawing 2 is a figure for explaining a manufacturing method of a vapor deposition mask with a frame concerning another embodiment of this indication. More specifically, FIG. 2A is a plan view showing a state before the support member placing step is performed and the vapor deposition mask fixing step is performed, and FIG. 2B is a plan view of FIG. It is AA sectional drawing of).

  In the method of manufacturing a vapor deposition mask with a frame according to another embodiment of the present disclosure shown in FIG. 2, the frame 60 used includes a frame main body 61 and a plurality of opening spaces in the frame main body 61 (in FIG. 2). Is composed of an auxiliary frame 62 partitioned into three). In the manufacturing method of the vapor deposition mask with a frame according to the embodiment of the present disclosure, the frame 60 having such an auxiliary frame 62 can also be used.

  In this case, as shown in FIG. 2, in the supporting member placing step, the supporting member 70 is placed so as to support not only the vapor deposition mask 100 but also the auxiliary frame 62, and in the vapor deposition mask fixing step, the supporting member 70 is supported. The vapor deposition mask 100 is fixed to the auxiliary frame 62 on the member 70.

  By using the frame 60 having such an auxiliary frame 62, it becomes possible to fix the vapor deposition mask 100 to the frame 60 with high accuracy.

  Here, the frame main body 61 constituting the frame 60 corresponds to the frame 60 described with reference to FIG. Further, in FIG. 2, the auxiliary frame 62 constituting the frame 60 is provided only in the vertical direction so as to divide the opening space formed by the frame main body 61 into a vertically long strip shape. However, the auxiliary frame 62 is limited to this. For example, it may be formed in a lattice shape vertically and horizontally, or may be provided only in the lateral direction so as to divide the opening space into horizontally long strips.

  Further, the material of the auxiliary frame 62 is not particularly limited, and can be appropriately selected from the same material as the frame main body (frame 60) 61, that is, various metals, alloys, glass, ceramics, and the like. By making the frame main body 61 and the auxiliary frame 62 the same material, as shown in FIG. 2, the frame main body 61 and the auxiliary frame 62 can be integrally formed.

  A method of integrally forming the frame main body 61 and the auxiliary frame 62 is not particularly limited. For example, various metal plates are prepared, and physical processing such as cutting or chemical processing such as etching is performed. A frame 60 having a frame main body 61 and an auxiliary frame 62 may be formed by forming a plurality of opening spaces by processing.

(Support member)
As described above, the support member 70 used in the support member mounting step in the method of manufacturing the vapor deposition mask with frame of the present disclosure is performed when the vapor deposition mask 100 is fixed to the frame 60 (frame body 61) or the auxiliary frame 62. It is a member used for supporting the vapor deposition mask 100, and therefore is not particularly limited as long as it is a member capable of exhibiting this action effect.

  For example, in FIG. 1 and FIG. 2, two vapor deposition masks 100 are supported by using two support members 70 each having a rectangular parallelepiped shape. However, the present invention is not necessarily limited to this mode. One vapor deposition mask may be supported using one support member, and two or more vapor deposition masks may be supported using one support member.

  In FIG. 1 and FIG. 2, the two support members 70 are arranged in parallel so as to divide the opening space in the frame 60 in the lateral direction, but the present invention is not limited to this mode. One support member 70 may be arranged in the entire opening space in the frame 60, and the opening space in the frame 60 may be filled with the supporting member 70, or a plurality of columnar supports may be supported in the opening space in the frame 60. Members may be interspersed.

  The height of the cross section of the support member 70, that is, the height of the support member 70 shown in FIGS. 1B and 2B is not particularly limited. As shown in FIGS. 1B and 2B, the height of the cross section of the support member 70 is made equal to the height of the cross section of the frame 60 (frame main body 61), so that the frame 60 (frame main body 61) is obtained. ) And the height of the support surface of the vapor deposition mask in the support member 70 may be equalized, while the height of the cross section of the support member is set to the height of the cross section of the frame 60 (frame body 61). It may be higher or lower than the height. By setting the height of the cross section of the support member to be lower than the height of the cross section of the frame 60 (frame body 61), the vapor deposition mask 100 can be fixed to the frame while the vapor deposition mask 100 is intentionally bent. it can.

  Further, the material of the support member 70 is not particularly limited, and various metal materials, alloy materials, resin materials, and the like can be appropriately selected and used. Further, the support member 70 may be configured to transmit light or may be configured not to transmit light. If the support member is configured to transmit light, an alignment mark or the like can be confirmed through the support member, so that the degree of freedom in arranging the support member is increased. On the other hand, when a support member configured not to transmit light is used, an alignment mark or the like for confirming a position where the vapor deposition mask should be fixed may be provided on the support member.

  Further, magnetism may be imparted to at least the surface of the support member 70 that supports the vapor deposition mask 100. By applying magnetism to the surface that supports the vapor deposition mask 100, the vapor deposition mask 100 can be temporarily fixed using magnetic force, and the positional accuracy when the vapor deposition mask 100 is fixed can be improved.

  In order to improve the positional accuracy when fixing the vapor deposition mask 100, a resin having self-adsorption or self-adhesiveness may be provided on at least the surface of the support member that supports the vapor deposition mask 100.

  Here, the self-adsorption property or the self-adhesive property means a property capable of being adsorbed or adhered to the vapor deposition mask 100 by the mechanism of the support member 70 itself. Specifically, the property that the vapor deposition mask 100 can be brought into close contact with the support member 70 between the support member 70 and the vapor deposition mask 100 without using an adhesive or a pressure sensitive adhesive, or without using an external force such as a magnet. Means.

  Examples of such self-adsorbing or self-adhesive resins include acrylic resins, silicone resins, urethane resins, polyester resins, epoxy resins, polyvinyl alcohol resins, cycloolefin resins, and polyethylene resins. Can do. Moreover, it can replace with such resin and can make self-adsorption property or self-adhesiveness express by forming a cell suction cup structure on the surface of the supporting member 70. The cell suction cup structure means a continuous fine concavo-convex structure formed on the surface, and the continuous fine concavo-convex structure acts as a sucker to give the support member 70 self-adsorption or self-adhesiveness. Is done. Examples of such a material include a sheet-like material having a cell suction cup structure described in JP 2008-36895 A.

  In the method for manufacturing the vapor deposition mask with frame according to the present embodiment described above, the support member 70 is placed in advance in the frame 60, and then the vapor deposition mask 100 is placed on the support member 70. However, it is not limited to this mode. That is, the vapor deposition mask 100 may be placed on the frame 60 in advance, and then the movable support member 70 may be moved into the frame 60 to support the vapor deposition mask 100 on the frame 60 (FIG. Not shown). In the case where the movable support member 70 is used, the support member 70 may be moved in the vertical direction or may be moved in the horizontal direction.

<The manufacturing method of the vapor deposition mask with a 2nd frame>
A manufacturing method of a deposition mask with a frame according to a second embodiment of the present disclosure is a manufacturing method of a deposition mask with a frame in which the deposition mask is fixed to the frame, and the deposition mask preparation body is fixed to the frame. Including a preparation body fixing step and a vapor deposition mask forming step for forming a vapor deposition mask by forming an opening in the vapor deposition mask preparation body fixed to the frame, wherein the vapor deposition mask preparation body fixing step is located in the frame This is performed in a state where the deposition mask preparation is temporarily supported by the support member.

  In the first method for manufacturing a vapor deposition mask with a frame, the completed vapor deposition mask 100 was used, and the vapor deposition mask 100 was temporarily supported by using a support member when the vapor deposition mask 100 was fixed to the frame 60. On the other hand, the second method for manufacturing a vapor deposition mask with a frame is a method in which the vapor deposition mask preparation is fixed to the frame, and an opening is formed in the vapor deposition mask preparation in a state of being fixed to the frame. In this method, the deposition mask preparation body is temporarily supported using a support member when the deposition mask preparation body is fixed to the frame.

  Therefore, it can be said that the manufacturing method of the said 2nd frame-equipped vapor deposition mask replaces "the vapor deposition mask 100" in the manufacturing method of the 1st frame-equipped vapor deposition mask demonstrated above with the "vapor deposition mask preparation body." Therefore, description of each step is omitted here.

(Deposition mask)
The vapor deposition mask 100 used in the method of manufacturing the frame-equipped vapor deposition mask according to the first embodiment of the present disclosure is not particularly limited, and conventionally used metal vapor deposition masks and resin vapor deposition masks are used. It is possible to appropriately select from various deposition masks.

  FIG. 3A is a front view showing an example when the vapor deposition mask used in the vapor deposition mask manufacturing method according to the first embodiment of the present disclosure is viewed in plan from the metal mask side, and FIG. These are sectional drawings in the AA part of (a). Note that a portion near the center of the vapor deposition mask in FIG. 3B is omitted.

  The vapor deposition mask 100 shown in FIG. 3 includes a metal mask 10 having a metal mask opening 15 and a resin mask 20 having a plurality of resin mask openings 25 corresponding to a pattern to be vapor-deposited. The resin mask openings 25 are stacked so as to overlap. The vapor deposition mask 100 formed by laminating the metal mask 10 and the resin mask 20 is attracting attention as a high-definition and high-accuracy vapor deposition mask, and can be suitably used in the method of manufacturing a frame-equipped vapor deposition mask of the present disclosure.

  Below, the vapor deposition mask 100 shown in FIG. 3 is demonstrated.

(Metal mask)
The metal mask 10 is made of metal, and has a metal mask opening 15 extending in the vertical direction or the horizontal direction. The arrangement example of the metal mask openings is not particularly limited, and the metal mask openings extending in the vertical direction and the horizontal direction may be arranged in a plurality of rows in the vertical direction and the horizontal direction, and the metal mask openings extending in the vertical direction. The portions may be arranged in a plurality of rows in the horizontal direction, and the metal mask openings extending in the horizontal direction may be arranged in a plurality of rows in the vertical direction. Further, only one row may be arranged in the vertical direction or the horizontal direction. In the present specification, “vertical direction” and “lateral direction” mean the vertical and horizontal directions of the drawing, and may be either the longitudinal direction or the width direction of the vapor deposition mask. For example, the longitudinal direction of the vapor deposition mask may be “vertical direction”, and the width direction may be “vertical direction”. In addition, in the present specification, the case where the shape of the vapor deposition mask when viewed in plan is a rectangular shape is described as an example, but other shapes, for example, a circular shape, a polygonal shape such as a rhombus shape, etc. It is good. In this case, the longitudinal direction, the radial direction, or an arbitrary direction of the diagonal line is defined as a “longitudinal direction”, and a direction orthogonal to the “longitudinal direction” is referred to as a “width direction (sometimes referred to as a short direction)”. do it.

  The material of the metal mask 10 is not particularly limited, and any conventionally known material can be appropriately selected and used in the field of the evaporation mask, and examples thereof include metal materials such as stainless steel, iron-nickel alloy, and aluminum alloy. . Among them, an invar material that is an iron-nickel alloy can be suitably used because it is less deformed by heat.

  Although the thickness of the metal mask 10 is not particularly limited, it is preferably 100 μm or less, more preferably 50 μm or less, and more preferably 35 μm or less in order to more effectively prevent the occurrence of shadows. Particularly preferred. When the thickness is less than 5 μm, the risk of breakage and deformation increases and handling tends to be difficult.

  In the form shown in FIG. 3A, the opening shape when the metal mask opening 15 is viewed in plan is a rectangular shape, but the opening shape is not particularly limited, and the opening of the metal mask opening 15 is not limited. The shape may be any shape such as a trapezoidal shape or a circular shape.

  The cross-sectional shape of the metal mask opening 15 formed in the metal mask 10 is not particularly limited, but may be a shape that expands toward the evaporation source as shown in FIG. preferable. More specifically, the angle formed by the straight line connecting the lower bottom tip of the metal mask opening and the upper bottom tip of the metal mask opening 15 and the bottom surface of the metal mask 10, in other words, the metal mask opening. In the thickness direction cross section of the inner wall surface constituting the portion 15, the angle formed between the inner wall surface of the metal mask opening 15 and the surface of the metal mask 10 on the side in contact with the resin mask 20 (in the illustrated embodiment, the lower surface of the metal mask) is It is preferably within the range of 5 ° to 85 °, more preferably within the range of 15 ° to 80 °, and even more preferably within the range of 25 ° to 65 °. In particular, within this range, an angle smaller than the vapor deposition angle of the vapor deposition machine to be used is preferable.

(Resin mask)
The main material of the resin mask 20 constituting the vapor deposition mask 100 shown in FIG. 3 is not limited, and a high-definition resin mask opening 25 can be formed by laser processing or the like, and the dimensional change rate or moisture absorption over time, heat, or the like. It is preferable to use a light material with a low rate. Examples of such materials include polyimide resin, polyamide resin, polyamideimide resin, polyester resin, polyethylene resin, polyvinyl alcohol resin, polypropylene resin, polycarbonate resin, polystyrene resin, polyacrylonitrile resin, ethylene vinyl acetate copolymer resin, ethylene- Examples thereof include vinyl alcohol copolymer resin, ethylene-methacrylic acid copolymer resin, polyvinyl chloride resin, polyvinylidene chloride resin, cellophane, and ionomer resin. Among the materials exemplified above, a resin material having a thermal expansion coefficient of 16 ppm / ° C. or less is preferable, a resin material having a moisture absorption rate of 1.0% or less is preferable, and a resin material having both conditions is particularly preferable. By using this resin material as a resin mask, the dimensional accuracy of the resin mask opening 25 can be improved, and the dimensional change rate and moisture absorption rate with heat and time can be reduced.

  The thickness of the resin mask 20 is not particularly limited, but in the case of further improving the effect of suppressing the generation of shadows, the thickness of the resin mask 20 is preferably 25 μm or less, and more preferably less than 10 μm. Although there is no particular limitation on the preferable range of the lower limit value, when the thickness of the resin mask 20 is less than 3 μm, defects such as pinholes are likely to occur, and the risk of deformation and the like increases. In particular, by setting the thickness of the resin mask 20 to 3 μm or more and less than 10 μm, more preferably 4 μm or more and 8 μm or less, it is possible to more effectively prevent the influence of shadows when forming a high-definition pattern exceeding 400 ppi. . In addition, the resin mask 20 and the metal mask 10 may be directly bonded or may be bonded via an adhesive layer, but the resin mask 20 and the metal mask 10 may be bonded via an adhesive layer. When is bonded, it is preferable that the total thickness of the resin mask 20 and the pressure-sensitive adhesive layer is within the preferable thickness range. In addition, the shadow means that a part of the vapor deposition material discharged from the vapor deposition source collides with the inner wall surface of the opening part of the metal mask or the resin mask and does not reach the vapor deposition target, thereby achieving the target vapor deposition. This refers to a phenomenon in which an undeposited portion having a film thickness thinner than the film thickness occurs.

  The cross-sectional shape of the resin mask opening 25 is not particularly limited, and the end faces of the resin mask that form the resin mask opening 25 may be substantially parallel to each other. However, as shown in FIG. It is preferable that the cross-sectional shape of the mask opening 25 is a shape that expands toward the vapor deposition source. In other words, it is preferable to have a tapered surface that expands toward the metal mask 10 side. The taper angle can be set as appropriate in consideration of the thickness of the resin mask 20 and the like. However, the lower bottom tip of the resin mask opening, the straight line connecting the upper base tips of the resin mask opening, and the resin mask The angle formed with the bottom surface, in other words, the cross-section in the thickness direction of the inner wall surface constituting the resin mask opening 25, the surface on the side that does not contact the inner mask of the resin mask opening 25 and the metal mask 10 of the resin mask 20 (illustrated) In this embodiment, the angle formed with the lower surface of the resin mask is preferably in the range of 5 ° to 85 °, more preferably in the range of 15 ° to 75 °, and more preferably 25 ° to 65 °. More preferably, it is within the range of 0 ° or less. In particular, within this range, an angle smaller than the vapor deposition angle of the vapor deposition machine to be used is preferable. In the illustrated embodiment, the end face forming the resin mask opening 25 has a linear shape, but is not limited to this, and has an outwardly convex curved shape, that is, the resin mask opening. The entire shape of 25 may be a bowl shape. Further, it may be the opposite, that is, it may have a convex curved shape.

(Deposition mask preparation)
The vapor deposition mask preparation used in the method of manufacturing a frame-equipped vapor deposition mask according to the second embodiment of the present disclosure is a state in which an opening corresponding to a pattern to be vapor deposited is not formed before the vapor deposition mask is formed. There is no particular limitation on the configuration and the like.

  For example, as the vapor deposition mask preparation in the vapor deposition mask 100 in which the resin mask 20 and the metal mask 10 described above are laminated, it corresponds to the metal mask 10 and the pattern before forming the resin mask, that is, the pattern to be vapor deposited. A resin layer in a state in which no resin mask opening is formed, a metal layer before being formed into a metal mask, that is, a state in which the metal mask opening is not opened, and the resin layer Can be mentioned.

(Method for manufacturing vapor deposition mask)
Hereinafter, an example is given and demonstrated about the manufacturing method of a vapor deposition mask.

  First, a metal plate with a resin layer in which a resin layer (or resin film) is formed on one surface of the metal plate is prepared, and a metal mask opening 15 is formed in the metal plate with a resin layer, whereby a vapor deposition mask. A preparation is produced.

  Next, the deposition mask preparation is irradiated with laser through the metal mask opening 15 from the metal mask 10 side to form the resin mask opening 25 corresponding to the pattern to be deposited on the resin layer, thereby forming the resin mask 20. Is formed, and the vapor deposition mask 100 is manufactured.

  More specifically, for example, as a method of manufacturing a metal plate with a resin layer, a resin layer that finally becomes a resin mask can be formed on the metal plate by a conventionally known coating method or the like.

  Moreover, as a manufacturing method of a vapor deposition mask preparation body, a masking member, for example, a resist material is applied to the surface of the metal plate with a resin layer which is not in contact with the resin layer, and a predetermined portion is exposed and developed. Finally, a resist pattern is formed leaving the position where the metal mask opening 15 is to be formed. As the resist material used as the masking member, those having good processability and desired resolution are preferable. Next, etching is performed from the side of the metal plate with a resin layer that does not contact the resin layer by an etching method using the resist pattern as an etching resistant mask. After the etching is completed, the resist pattern is removed by washing. Thereby, the vapor deposition mask preparation body by which the resin layer was laminated | stacked on one surface of the metal mask 10 in which the metal mask opening part 15 was provided can be manufactured. In addition, when the resin layer has etching resistance to the etching material of the metal plate, it is not necessary to mask the surface of the resin layer, but when the resin layer does not have resistance to the etching material of the metal plate. Needs to be coated with a masking member on the surface of the resin layer. In the above description, the resist material is mainly described as the masking member. However, instead of coating the resist material, a dry film resist may be laminated and the same patterning may be performed.

  As a method of forming the resin mask opening 25, the vapor deposition mask prepared body prepared above is penetrated through the resin layer using a laser processing method, precision press processing, photolithographic processing, and the like, and vapor deposition is created on the resin layer. By forming the resin mask opening 25 corresponding to the pattern, the metal mask opening 15 is provided on one surface of the resin mask 20 provided with the resin mask opening 25 corresponding to the pattern to be deposited. The vapor deposition mask 100 on which the metal mask 10 is laminated is obtained. In addition, it is preferable to use the laser processing method for formation of the resin mask opening part 25 from the point which can form the high-definition resin mask opening part 25 easily.

<Method for manufacturing organic semiconductor element>
Next, a method for manufacturing an organic semiconductor element according to an embodiment of the present disclosure (hereinafter referred to as an organic semiconductor element manufacturing method of the present disclosure) will be described. The method for producing an organic semiconductor element of the present disclosure includes a step of forming a vapor deposition pattern on a vapor deposition object using a vapor deposition mask with a frame, and in the step of forming the vapor deposition pattern, the vapor deposition mask with a frame of the present disclosure described above. A vapor deposition mask with a frame manufactured by the manufacturing method is used.

  There is no particular limitation on the process of forming a vapor deposition pattern by a vapor deposition method using a vapor deposition mask with a frame, and an electrode forming process for forming an electrode on a substrate, an organic layer forming process, a counter electrode forming process, a sealing layer forming process, etc. In each optional step, a vapor deposition pattern is formed using the frame-equipped vapor deposition mask manufactured by the above-described method for manufacturing a frame-equipped vapor deposition mask described above. For example, the frame-equipped vapor deposition mask manufactured by the method of manufacturing the frame-equipped vapor deposition mask of the present disclosure described above in the R (red), G (green), and B (blue) light emitting layer forming steps of the organic EL device When each is applied, a vapor deposition pattern of each color light emitting layer is formed on the substrate. In addition, the manufacturing method of the organic-semiconductor element of this indication is not limited to these processes, It is applicable to the arbitrary processes in manufacture of a conventionally well-known organic-semiconductor element.

  According to the method for manufacturing an organic semiconductor element of the present disclosure described above, vapor deposition for forming the organic semiconductor element can be performed in a state in which the deposition mask with the frame and the deposition target are closely adhered to each other without gaps, and high-definition is achieved. An organic semiconductor element can be manufactured. As an organic semiconductor element manufactured with the manufacturing method of the organic semiconductor element of this indication, the organic layer, light emitting layer, cathode electrode, etc. of an organic EL element can be mentioned, for example. In particular, the method for manufacturing an organic semiconductor element of the present disclosure is preferably used for manufacturing R (red), G (green), and B (blue) light emitting layers of organic EL elements that require high-definition pattern accuracy. it can.

<Method for manufacturing organic EL display>
Next, a method for manufacturing an organic EL display (organic electroluminescence display) according to an embodiment of the present disclosure (hereinafter referred to as a method for manufacturing an organic EL display of the present disclosure) will be described. The manufacturing method of the organic EL display of the present disclosure uses the organic semiconductor element manufactured by the manufacturing method of the organic semiconductor element of the present disclosure described above in the manufacturing process of the organic EL display.

  Examples of the organic EL display using the organic semiconductor element manufactured by the organic semiconductor element manufacturing method of the present disclosure include a notebook personal computer (see FIG. 4A) and a tablet terminal (see FIG. 4B). Mobile phones (see FIG. 4C), smartphones (see FIG. 4D), video cameras (see FIG. 4E), digital cameras (see FIG. 4F), smart watches (FIG. Examples thereof include organic EL displays used in g).

DESCRIPTION OF SYMBOLS 10 ... Metal mask 15 ... Metal mask opening part 20 ... Resin mask 25 ... Resin mask opening part 60 ... Frame 61 ... Frame main body 62 ... Auxiliary frame 70 ... Support Member 80 ... Stage 100 ... Deposition mask

Claims (10)

A method of manufacturing a vapor deposition mask with a frame in which a vapor deposition mask is fixed to a frame,
Including a deposition mask fixing process for fixing the deposition mask to the frame;
The deposition mask fixing step is performed in a state where the deposition mask is temporarily supported by a support member located in the frame.
A method for manufacturing a vapor deposition mask with a frame. Including a supporting member placing step of placing a supporting member for temporarily supporting the vapor deposition mask in the frame;
In the vapor deposition mask fixing step, the vapor deposition mask is fixed to the frame in a state where the vapor deposition mask is placed on the support member.
The manufacturing method of the vapor deposition mask with a frame of Claim 1. The frame includes a frame body, and an auxiliary frame that divides an opening space in the frame body into a plurality of parts,
In the deposition mask fixing step, the support member supports not only the deposition mask but also the auxiliary frame, and fixes the deposition mask to the auxiliary frame on the support member.
The manufacturing method of the vapor deposition mask with a frame of Claim 1 or 2. The vapor deposition mask is
A resin mask having a plurality of resin mask openings corresponding to a pattern to be deposited and a metal mask having a metal mask opening are stacked so that the resin mask openings and the metal mask openings overlap. Is a vapor deposition mask,
The manufacturing method of the vapor deposition mask with a frame as described in any one of Claims 1-3. A method of manufacturing a vapor deposition mask with a frame in which a vapor deposition mask is fixed to a frame,
A deposition mask preparation body fixing step of fixing the deposition mask preparation body to the frame;
Forming an opening in the vapor deposition mask preparation body fixed to the frame to form a vapor deposition mask, and a vapor deposition mask forming step,
The deposition mask preparation body fixing step is performed in a state where the deposition mask preparation body is temporarily supported by a support member located in the frame.
A method for manufacturing a vapor deposition mask with a frame. Including a support member placing step of placing a support member for temporarily supporting the vapor deposition mask preparation in the frame;
In the deposition mask preparation body fixing step, the deposition mask preparation body is fixed to the frame in a state where the deposition mask preparation body is placed on the support member.
The manufacturing method of the vapor deposition mask with a frame of Claim 5. The frame includes a frame body, and an auxiliary frame that divides an opening space in the frame body into a plurality of parts,
In the deposition mask preparation body fixing step, the support member supports not only the deposition mask preparation body but also the auxiliary frame, and fixes the deposition mask preparation body to the auxiliary frame on the support member.
The manufacturing method of the vapor deposition mask with a frame of Claim 5 or 6. The deposition mask preparation is
A metal mask having a metal mask opening and a vapor deposition mask preparation in which a resin layer is laminated,
The manufacturing method of the vapor deposition mask with a frame as described in any one of Claims 5-7. A method for producing an organic semiconductor element, comprising:
Including a vapor deposition pattern forming step of forming a vapor deposition pattern on a vapor deposition object using a vapor deposition mask with a frame;
The said vapor deposition mask with a frame used in the said vapor deposition pattern formation process is a vapor deposition mask with a flame | frame manufactured by the manufacturing method of the vapor deposition mask with a flame | frame as described in any one of the said Claims 1-8.
A method for producing an organic semiconductor element. An organic EL display manufacturing method comprising:
An organic semiconductor element manufactured by the method for manufacturing an organic semiconductor element according to claim 9 is used.
Manufacturing method of organic EL display.