JP2018168378A - Sheet-like encapsulation material, encapsulation sheet, and electronic device - Google Patents

Abstract

To provide a low metal corrosive sheet-like encapsulation material excellent in water blockage property and an electronic device having the same.SOLUTION: There is provided a sheet-like encapsulation material consisting of an encapsulation resin layer and containing a polyolefin-based polymer and a specific thickener as encapsulation resins. The content of the thickener in the encapsulation resin is 0 to 20 pts.mass based on 100 pts.mass of the resin, water vapor permeation rate of the sheet-like encapsulation material at 40°C and relative humidity of 90% is 0.1 g/(mday) to 500 g/(mday), and electric conductivity at 25°C of an encapsulation material component extract liquid obtained by extracting an encapsulation material component by impregnating the encapsulation material of 1 g in water of 20 ml is 2 to 35 μS/cm.SELECTED DRAWING: Figure 1

Description

  The present invention provides a sheet-like sealing material that has excellent moisture barrier properties and is less prone to migration due to dendrite precipitation, a sealing sheet having the sheet-like sealing material and a base sheet, and these sheet-like sealing materials. The present invention relates to an electronic device including a stopper or a sealing sheet.

In recent years, organic EL elements have attracted attention as light-emitting elements that can emit light with high luminance by low-voltage direct current drive.
However, the organic EL element has a problem that light emission characteristics such as light emission luminance, light emission efficiency, and light emission uniformity are likely to deteriorate with time.
As a cause of the problem of the deterioration of the light emission characteristics, it is conceivable that oxygen, moisture or the like enters the inside of the organic EL element and degrades the electrode or the organic layer. As a countermeasure, several methods using a sealing material have been proposed.

As adhesives and pressure-sensitive adhesives that are sealing materials for organic EL elements, acrylic adhesives and pressure-sensitive adhesives (hereinafter referred to as “acrylic adhesives”) are proposed from the viewpoint of optical properties such as transparency. Has been.
For example, Patent Document 1 discloses an acrylic adhesive having an ultraviolet curing function and a room temperature curing function as a sealing material for an organic EL display.
Patent Document 2 discloses acrylic as an adhesive that can form an adhesive layer that can propagate light from an organic EL display element to the display surface with excellent propagation efficiency even after receiving a thermal history. System adhesives are disclosed.

In recent years, a composite electrode including a transparent electrode and an auxiliary electrode has been proposed as a display electrode.
For example, Patent Document 3 describes a composite electrode obtained by forming an auxiliary electrode (metal thin wire) made of a metal thin film having an opening on the surface of a transparent electrode formed on a substrate.
However, when a device or the like is sealed using a conventional sealing material, disconnection due to dissolution (corrosion) of the auxiliary electrode occurs over time when a DC voltage is applied to the device, or dendrite is formed on the surface of the auxiliary electrode. Sometimes deposited, resulting in short circuits (these are sometimes referred to as migration).

JP 2004-87153 A Japanese Patent Laid-Open No. 2004-224991 JP 2013-129987 A

  The present invention has been made in view of the actual situation of the prior art, and has a sheet-shaped sealing material that is excellent in moisture barrier properties and hardly causes migration, and includes the sheet-shaped sealing material and a base sheet. It aims at providing an electronic device provided with a sealing sheet and these sheet-like sealing materials or a sealing sheet.

  As a result of intensive studies to solve the above-mentioned problems, the present inventors have obtained a sheet-like sealing material having a low water vapor permeability and a low electrical conductivity of an extract obtained by extracting a sealing material component. The present inventors have found that the moisture barrier property is excellent and migration is difficult to occur, and the present invention has been completed.

Thus, according to the present invention, the following sheet-shaped sealing materials (1) to (4), the sealing sheets (5) to (6), and the electronic device (7) are provided.
(1) A sheet-like encapsulant comprising one or more encapsulating resin layers, wherein the encapsulating resin layer contains a polyolefin-based polymer as an encapsulating resin, and is aliphatic. A tackifier containing or not containing a tackifier selected from the group consisting of petroleum resins, terpene resins, rosin ester resins, and rosin resins, and the content of the tackifier in the sealing resin layer However, it is 0 to 20 parts by mass with respect to 100 parts by mass of the sealing resin, and the water vapor permeability when converted to a thickness of 50 μm at a temperature of 40 ° C. and a relative humidity of 90% of the sheet-shaped sealing material is 1 g of the sheet-shaped sealing material is 0.1 g / (m ² · day) or more and 500 g / (m ² · day) or less, and is immersed in 20 ml of water having an electric conductivity of 2 μS / cm at 25 ° C. Let the sealant component extract liquid The electrical conductivity at 25 ° C. of the sealing material component extract obtained by extracting the sheet-shaped sealing material component until the electrical conductivity at 25 ° C. is constant is 2 to 35 μS / cm A sheet-like sealing material.
(2) The pH at 25 ° C. of water used for the preparation of the sealing material component extract is 5.1, and the pH of the sealing material component extract is 3.8 to 6.5. The sheet-like sealing material according to (1).
(3) The sheet-shaped sealing according to (1) or (2), wherein the content of the polyolefin-based polymer in the sealing resin layer is 70 to 100% by mass with respect to the entire sealing resin layer. Wood.
(4) The sheet-shaped sealing material in any one of (1)-(3) used for sealing of an electronic device.
(5) A sealing sheet having a sheet-shaped sealing material and a base sheet, wherein the sheet-shaped sealing material is the sheet-shaped sealing material according to any one of (1) to (4). A sealing sheet characterized by that.
(6) The sealing sheet according to (5), which is used for sealing an electronic device.
(7) An electronic device provided with the sheet-like sealing material according to any one of (1) to (4) or the sealing sheet according to (5) or (6).

  According to the present invention, a sheet-shaped encapsulant that has excellent moisture barrier properties and hardly undergoes migration due to the precipitation of dendrites, an encapsulating sheet having the sheet-shaped encapsulant and a base sheet, and these sheets An electronic device provided with a state-like sealing material or a sealing sheet is provided.

It is a schematic diagram of the wiring board used for the electrode corrosion test.

  Hereinafter, the present invention will be described in detail by dividing into 1) a sheet-like encapsulant, 2) an encapsulating sheet, and 3) an electronic device.

1) Sheet-like encapsulant The sheet-like encapsulant of the present invention is a sheet-like encapsulant comprising one or more encapsulating resin layers, and the temperature of the sheet-like encapsulant is 40 ° C., relative The water vapor transmission rate when converted to a thickness of 50 μm at a humidity of 90% is 500 g / (m ² · day) or less, and 1 g of the sheet-like sealing material has an electric conductivity of 2 μS / cm at 25 ° C. Of the sealing material component extract obtained by immersing in 20 ml of water and extracting the sheet-like sealing material component until the electrical conductivity of the sealing material component extract at 25 ° C. is constant. The conductivity is 2 to 35 μS / cm.

The water vapor permeability of the sheet-shaped encapsulant of the present invention when converted to a thickness of 50 μm at a temperature of 40 ° C. and a relative humidity of 90% is 500 g / (m ² · day) or less, preferably 50 g / (m ² · day) or less, and more preferably 20 g / (m ² · day) or less. Lower limit no particular, is preferably as small, usually is 0.1g ^/ (m 2 · day) or more.
The sheet-like sealing material having a water vapor transmission rate in the above range can sufficiently suppress the intrusion of moisture. Therefore, such a sheet-like sealing material is suitably used as a sealing material for electronic devices.

The value of the water vapor transmission rate of the sheet-like sealing material depends on the thickness of the sheet-like sealing material. Therefore, when the thickness of the sheet-like sealing material is not 50 μm, the water vapor transmission rate at a thickness of 50 μm can be obtained by converting from the thickness. For example, in the case of a sheet-like sealing material having a thickness of A μm and a water vapor transmission rate of B {g / (m ² · day)}, the water vapor transmission rate when the thickness is 50 μm is expressed by the formula A × B / 50. It can be calculated by fitting.

In this invention, the sheet-like sealing material which has the target water-vapor-permeation rate can be obtained by selecting suitably sealing resin to be used. For example, as will be described later, a sheet-shaped sealing material having a low water vapor transmission rate can be obtained by containing a large amount of a rubber-based polymer in the sealing resin layer.
The water vapor transmission rate can be measured by the method described in the examples.

1 g of the sheet-like sealing material is immersed in 20 ml of water having an electric conductivity of 2 μS / cm at 25 ° C., and the sheet-like sealing material component is kept until the electric conductivity at 25 ° C. of the sealing material component extract is constant. The electrical conductivity at 25 ° C. of the sealing material component extract obtained by extracting the slag is 2 to 35 μS / cm, preferably 2 to 30 μS / cm, more preferably 2 to 25 μS / cm. is there.
A sheet-like encapsulant having an electric conductivity of the encapsulant component extract of 35 μS / cm or less is less prone to migration due to dendrite precipitation. Therefore, such a sheet-like sealing material is suitably used as a sealing material for electronic devices.

Water (deionized water, ultrapure water) having an electrical conductivity of 2 μS / cm at 25 ° C. used for the preparation of the sealing material component extract can be obtained, for example, by performing a purification process such as a deionization process. .
The method for preparing the sealing material component extract is not particularly limited. For example, the sheet-like encapsulant is immersed in water having an electric conductivity of 2 μS / cm at 25 ° C. and extraction is started, and the electric conductivity is measured while measuring the electric conductivity of the encapsulant component extract every predetermined time. By continuing soaking until the degree becomes constant, a sealing material component extract can be obtained. At this time, the extraction operation may be performed while stirring the solution. Moreover, you may perform extraction operation on pressurization conditions.
Although extraction conditions depend on the type and shape of the sheet-shaped sealing material, for example, a sealing material component extract can be obtained by performing an extraction process under conditions of 2 atm and 121 ° C. for 24 hours.
The electrical conductivity can be measured by the method described in the examples.

When the pH at 25 ° C. of the water used for the preparation of the sealing material component extract is 5.1, the pH of the sealing material component extract is preferably 3.8 to 6.5, more preferably 4. 0-6.0.
A sheet-like encapsulant having a pH of the encapsulant component extract in the above range is preferably used as an encapsulant for electronic devices because migration due to precipitation of dendrites is unlikely to occur.

Although the thickness of the sheet-like sealing material of this invention is not specifically limited, Preferably, it is 0.1-100 micrometers, More preferably, it is 5-90 micrometers, More preferably, it is 10-80 micrometers.
A sheet-like sealing material having a thickness within the above range is more excellent in moisture barrier properties.

That the sheet-like sealing material of the present invention is less likely to cause migration is shown by performing an electrode corrosion test (a test in which a DC voltage is continuously applied between insulated electrodes to corrode the electrodes). .
For example, a measurement sample obtained by bonding a wiring substrate on which a comb-shaped electrode is formed and a sheet-like sealing material is allowed to stand under conditions of 130 ° C., 85% relative humidity, and 1.3 atmospheres. When a voltage of 5 V is applied between the electrodes for 168 hours, when the sheet-like sealing material of the present invention is used, the electrode does not corrode and become thin, and dendrite does not occur. It is shown that the sheet-like sealing material is less likely to cause migration.

FIG. 1 shows a schematic diagram of a wiring board on which comb-shaped electrodes are formed, used for an electrode corrosion test.
Fig.1 (a) is a top view which represents typically a wiring board (10), FIG.1 (b) is the cross section along the XY line of the wiring board (10) of Fig.1 (a). FIG.
The wiring substrate (10) is provided with a comb-shaped anode (2) and a comb-shaped cathode (3) on the substrate (1). The line width / space width of these electrodes is, for example, 50 μm / 50 μm.
The wiring board (10) can be obtained, for example, by performing an etching process on the copper foil of the copper clad laminate.

  When the corrosion test is performed while measuring the current, the measurement sample using the sheet-like sealing material of the present invention is not short-circuited. This also indicates that the sheet-like sealing material of the present invention is less prone to migration.

The sheet-like sealing material of the present invention is preferably excellent in adhesiveness. The adhesiveness of the sheet-like sealing material can be evaluated by performing a 180 ° peel test. Specifically, when a peel test is performed using a tensile tester under conditions of a peel rate of 300 mm / min and a peel angle of 180 °, the adhesive strength is preferably 3 N / 25 mm or more.
Such a sheet-like sealing material can sufficiently prevent moisture and the like from entering from the interface with the object to be sealed when sealed.

The sealing resin layer which comprises the sheet-like sealing material of this invention is a layer containing sealing resin.
The sealing resin is not particularly limited as long as the effects of the present invention can be obtained.
Examples of the sealing resin include rubber polymers, (meth) acrylic polymers, polyolefin polymers, polyester polymers, styrene thermoplastic elastomers, silicone polymers, and the like.

  The rubber-based polymer has rubber elasticity such as natural rubber or synthetic rubber. For example, natural rubber (NR), butadiene homopolymer (butadiene rubber, BR), chloroprene homopolymer (chloroprene rubber, CR), isoprene homopolymer, acrylonitrile-butadiene copolymer (nitrile rubber), Examples thereof include an ethylene-propylene-nonconjugated diene terpolymer, an isobutylene polymer, or a modification thereof. Of the rubber polymers, isobutylene polymers are more preferable.

The isobutylene polymer refers to a polymer having repeating units derived from isobutylene in the main chain and / or side chain. The amount of the repeating unit derived from isobutylene is preferably 50% by mass or more, more preferably 60% by mass or more, and further preferably 70 to 99% by mass.
Examples of the isobutylene polymer include isobutylene homopolymer (polyisobutylene), isobutylene-isoprene copolymer (butyl rubber), isobutylene-n-butene copolymer, isobutylene-butadiene copolymer, and these polymers. And an isobutylene polymer such as a halogenated polymer obtained by brominating or chlorinating a benzene. Among these, a copolymer of isobutylene and isoprene (butyl rubber) is preferable.

The number average molecular weight (Mn) of the rubber polymer is preferably from 100,000 to 2,000,000, more preferably from 100,000 to 1,500,000, and further preferably from 100,000 to 1,000,000.
When the number average molecular weight (Mn) of the rubber-based polymer is within the above range, a sheet-like sealing material having a low water vapor transmission rate is easily obtained.
The number average molecular weight (Mn) of the rubber-based polymer can be obtained as a standard polystyrene equivalent value by performing gel permeation chromatography using tetrahydrofuran as a solvent.

The (meth) acrylic polymer is a polymer having a repeating unit derived from a (meth) acrylic monomer in the main chain and / or side chain. For example, homopolymers or copolymers of (meth) acrylic monomers, or modified ones thereof may be mentioned. Here, “(meth) acryl” means acryl or methacryl (the same applies hereinafter).
The amount of the repeating unit derived from the (meth) acrylic monomer in the (meth) acrylic polymer is preferably 50% by mass or more, more preferably 60% by mass or more, and further preferably 70 to 99% by mass.
Examples of (meth) acrylic monomers include alkyl groups such as methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate. Examples thereof include (meth) acrylic acid esters having 1 to 20 carbon atoms; (meth) acrylic monomers having reactive functional groups such as (meth) acrylic acid and hydroxymethyl (meth) acrylate.

The polyolefin-based polymer is a polymer having a repeating unit derived from an olefin-based monomer in the main chain and / or side chain. For example, homopolymers or copolymers of olefinic monomers, or modified ones thereof may be mentioned.
Examples of olefin monomers include ethylene; α-olefins having 3 to 20 carbon atoms such as propylene, 1-butene, 4-methyl-1-pentene, 3-methyl-1-butene, 1-hexene, 1-octene; cyclobutene , Tetracyclododecene, norbornene and other cyclic olefins having 4 to 20 carbon atoms; or modified ones thereof.

The polyester polymer is a polymer obtained by polycondensation of a polyvalent carboxylic acid and a polyol, or a modification thereof.
Examples of the polyvalent carboxylic acid include terephthalic acid, isophthalic acid, orthophthalic acid, succinic acid, adipic acid, sebacic acid, cyclohexanedicarboxylic acid, trimellitic acid and the like. Examples of the polyol include aliphatic alcohols such as ethylene glycol and propylene glycol, and polyether polyols such as polyethylene glycol and polypropylene glycol.

  The styrenic thermoplastic elastomer is a polymer having a repeating unit derived from styrene or a modified one thereof. For example, styrene-butadiene-styrene block copolymer (SBS), styrene-ethylene-butene-styrene block copolymer (SEBS) which is a hydrogenated product of SBS, styrene-isoprene-styrene block copolymer (SIS), SIS-hydrogenated styrene-ethylene-propylene-styrene block copolymer (SEPS), styrene-butadiene copolymer (styrene-butadiene rubber, SBR), styrene-isoprene copolymer, styrene-isobutylene diblock Examples thereof include a copolymer (SIB) and a styrene-isobutylene-styrene triblock copolymer (SIBS).

The silicone-based polymer is a polymer having a (poly) siloxane structure in the main chain and / or side chain, or a modification thereof.
Examples of the silicone polymer include dimethylpolysiloxane, methylphenylpolysiloxane, methylhydrogenpolysiloxane, and the like.

These sealing resins can be used alone or in combination of two or more.
Among these, a rubber-based polymer or a polyolefin-based polymer is preferable as the sealing resin because a sheet-shaped sealing material having a low water vapor transmission rate is easily obtained.

The sealing resin layer may be formed with a crosslinked structure. By forming the crosslinked structure, the sealing resin layer has a sufficient cohesive force, is superior in adhesiveness, and has a lower water vapor transmission rate.
When a crosslinked structure is formed in the sealing resin layer, a known crosslinked structure forming method using an adhesive or the like can be used.

  For example, when a sealing resin having a hydroxyl group or a carboxyl group is used, a crosslinked structure is formed by using a crosslinking agent such as an isocyanate crosslinking agent, an epoxy crosslinking agent, an aziridine crosslinking agent, or a metal chelate crosslinking agent. Can do.

The isocyanate-based crosslinking agent is a compound having an isocyanate group as a crosslinkable group.
Isocyanate-based crosslinking agents include trimethylolpropane-modified tolylene diisocyanate, tolylene diisocyanate, diphenylmethane diisocyanate, xylylene diisocyanate, etc .; aliphatic polyisocyanates such as hexamethylene diisocyanate; isophorone diisocyanate, hydrogenated diphenylmethane diisocyanate, etc. Alicyclic polyisocyanates of these compounds; biurets, isocyanurates of these compounds, and also reactants with low molecular active hydrogen-containing compounds such as ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane, castor oil Adduct body; and the like.

The epoxy-based crosslinking agent is a compound having an epoxy group as a crosslinkable group.
Examples of the epoxy crosslinking agent include 1,3-bis (N, N′-diglycidylaminomethyl) cyclohexane, N, N, N ′, N′-tetraglycidyl-m-xylylenediamine, ethylene glycol diglycidyl ether, Examples include 1,6-hexanediol diglycidyl ether, trimethylolpropane diglycidyl ether, diglycidyl aniline, diglycidyl amine and the like.

An aziridine-based crosslinking agent is a compound having an aziridine group as a crosslinkable group.
Examples of the aziridine-based crosslinking agent include diphenylmethane-4,4′-bis (1-aziridinecarboxamide), trimethylolpropane tri-β-aziridinylpropionate, tetramethylolmethanetri-β-aziridinylpro Pionate, toluene-2,4-bis (1-aziridinecarboxamide), triethylenemelamine, bisisophthaloyl-1- (2-methylaziridine), tris-1- (2-methylaziridine) phosphine, tri And methylolpropane tri-β- (2-methylaziridine) propionate.

Examples of the metal chelate-based crosslinking agent include chelate compounds in which the metal atom is aluminum, zirconium, titanium, zinc, iron, tin, etc. Among them, aluminum chelate compounds are preferable.
Aluminum chelate compounds include diisopropoxy aluminum monooleyl acetoacetate, monoisopropoxy aluminum bis oleyl acetoacetate, monoisopropoxy aluminum monooleate monoethyl acetoacetate, diisopropoxy aluminum monolauryl acetoacetate, diisopropoxy aluminum mono Examples include stearyl acetoacetate and diisopropoxyaluminum monoisostearyl acetoacetate.
These crosslinking agents can be used alone or in combination of two or more.

  When a crosslinked structure is formed using these crosslinking agents, the amount used is that the crosslinking group of the crosslinking agent (in the case of a metal chelate crosslinking agent, the metal chelate crosslinking agent) is the hydroxyl group and carboxyl of the sealing resin. The amount of 0.1 to 5 equivalents relative to the group is preferred, and the amount of 0.2 to 3 equivalents is more preferred.

  Moreover, when using sealing resin which has polymerizable functional groups, such as a (meth) acryloyl group, a crosslinked structure can be formed by using a photoinitiator, a thermal polymerization initiator, etc.

  Examples of the photopolymerization initiator include benzophenone, acetophenone, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin benzoic acid methyl, benzoin dimethyl ketal, 2,4-diethylthioxanthone, 1 -Hydroxycyclohexyl phenyl ketone, benzyldiphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, 2-chloroanthraquinone, diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, bis (2,4,6 -Trimethylbenzoyl) -phenyl-phosphine oxide.

  Examples of the thermal polymerization initiator include hydrogen peroxide; peroxodisulfates such as ammonium peroxodisulfate, sodium peroxodisulfate, and potassium peroxodisulfate; 2,2′-azobis (2-amidinopropane) dihydrochloride, 4,4 Azo compounds such as' -azobis (4-cyanovaleric acid), 2,2'-azobisisobutyronitrile, 2,2'-azobis (4-methoxy-2,4-dimethylvaleronitrile); benzoyl peroxide , Organic peroxides such as lauroyl peroxide, peracetic acid, persuccinic acid, di-t-butyl peroxide, t-butyl hydroperoxide, cumene hydroperoxide, and the like.

These polymerization initiators can be used singly or in combination of two or more.
When using these polymerization initiators to form a crosslinked structure, the amount used is preferably from 0.1 to 100 parts by weight, more preferably from 1 to 100 parts by weight, based on 100 parts by weight of the sealing resin.

  The content of the sealing resin in the sealing resin layer (including a crosslinked structure when a crosslinked structure is formed) is preferably 70 to 99.99 mass% with respect to the entire sealing resin layer, 90 to 99.95% by mass is more preferable, and 95 to 99.9% by mass is more preferable.

The sealing resin layer may further contain a tackifier.
By including a tackifier in the sealing resin layer, it becomes easy to obtain a sheet-like sealing material that is excellent in moisture barrier properties and excellent in adhesive strength.

A tackifier will not be specifically limited if it improves the adhesiveness of a sheet-like sealing material, A well-known thing can be used. For example, alicyclic petroleum resin, aliphatic petroleum resin, terpene resin, ester resin, coumarone-indene resin, rosin resin, epoxy resin, phenol resin, acrylic resin, butyral resin, olefin resin, chlorinated olefin resin , Vinyl acetate resins, and these modified resins or hydrogenated resins. Among these, aliphatic petroleum resins, terpene resins, rosin ester resins, rosin resins and the like are preferable.
A tackifier can be used individually by 1 type or in combination of 2 or more types.

The weight average molecular weight of the tackifier is preferably 100 to 10,000, more preferably 500 to 5,000.
The softening point of the tackifier is preferably 50 to 160 ° C, more preferably 60 to 140 ° C, and still more preferably 70 to 130 ° C.

  Moreover, a commercial item can also be used as it is as a tackifier. For example, commercially available products include aliphatic petroleum resins such as Escolets 1000 Series (Exxon Chemical Co., Ltd.), Quinton A, B, R, CX Series (Zeon Japan Co., Ltd.); Alcon P, M Series (Arakawa Chemical Co., Ltd.) ), ESCOREZ series (manufactured by Exxon Chemical), EASTOTAC series (manufactured by Eastman Chemical), ILARV series (manufactured by Idemitsu Kosan Co., Ltd.); ), Clearon P series (manufactured by Yashara Chemical), picolite A, C series (manufactured by Hercules), etc .; Foal series (manufactured by Hercules), Pencel A series, ester gum, super ester, pine crystal Ester resins such as Arakawa Chemical Industries, etc .;

  When a sealing resin layer contains a tackifier, 0.1-40 mass% is preferable with respect to the whole sealing resin layer, and, as for content of the tackifier in a sealing resin layer, 1-30 mass % Is more preferable.

The sealing resin layer may contain other components as long as the effects of the present invention are not hindered.
Examples of other components include additives such as ultraviolet absorbers, silane coupling agents, antistatic agents, light stabilizers, antioxidants, resin stabilizers, fillers, pigments, extenders, and softeners.
These can be used singly or in combination of two or more.
When a sealing resin layer contains another component, 0.01-5 mass% is preferable with respect to the whole sealing resin layer, respectively, and 0.01-2 mass% is more preferable.

  The thickness of the sealing resin layer is not particularly limited, and can be appropriately determined according to the thickness of the target sheet-like sealing material. The thickness of the sealing resin layer is usually 0.1 to 100 μm, preferably 1.0 to 80 μm, and more preferably 5.0 to 50 μm.

The sheet-like sealing material of the present invention comprises one or two or more sealing resin layers. The upper limit of the number of sealing resin layers is not particularly limited, but is usually 10 layers or less.
When the sheet-like sealing material of the present invention is composed of two or more sealing resin layers, such a sheet-like sealing material is a laminate of two or more of the same sealing resin layers. Alternatively, two or more different sealing resin layers may be laminated.
Examples of the different sealing resin layers include layers having different sealing resins, components other than the sealing resin, layers having different contents, and the like.

  The sheet-like sealing material of the present invention comprises one or two or more sealing resin layers, and this represents a state functioning as a sealing material. That is, the sheet-like sealing material of the present invention may have a layer that is peeled off before use, such as a peeling sheet. When the sheet-like sealing material of the present invention has a release sheet, the water vapor transmission rate and the thickness of the sheet-like sealing material described below are the values excluding the release sheet (sealing resin layer).

A conventionally well-known thing can be utilized as a peeling sheet. For example, what has the peeling layer by which peeling processing was carried out with the release agent on the base material for peeling sheets is mentioned.
As the base material for the release sheet, paper base materials such as glassine paper, coated paper, high-quality paper; laminated paper obtained by laminating a thermoplastic resin such as polyethylene on these paper base materials; polyethylene terephthalate resin, polybutylene terephthalate resin, Examples thereof include plastic films such as polyethylene naphthalate resin, polypropylene resin, and polyethylene resin.
Examples of the release agent include rubber elastomers such as silicone resins, olefin resins, isoprene resins, and butadiene resins, long chain alkyl resins, alkyd resins, and fluorine resins.

The manufacturing method of the sheet-like sealing material of the present invention is not particularly limited. For example, the sheet-like sealing material of the present invention can be produced using a casting method or an extrusion method.
When the sheet-like sealing material of the present invention is produced by a casting method, for example, a resin composition containing a predetermined component such as a sealing resin is prepared, and this resin composition is prepared by a known method using a release sheet. It is possible to form a sealing resin layer with a release sheet (the sheet-like sealing material of the present invention with a release sheet) by applying to the release-treated surface and drying the obtained coating film.

The resin composition can be prepared by appropriately mixing and stirring predetermined components, a solvent and the like according to a conventional method.
Solvents include aromatic hydrocarbon solvents such as benzene and toluene; ester solvents such as ethyl acetate and butyl acetate; ketone solvents such as acetone, methyl ethyl ketone, and methyl isobutyl ketone; n-pentane, n-hexane, and n- And aliphatic hydrocarbon solvents such as heptane; alicyclic hydrocarbon solvents such as cyclopentane and cyclohexane; and the like.
These solvents can be used alone or in combination of two or more.

Examples of the method for applying the resin composition include spin coating, spray coating, bar coating, knife coating, roll coating, blade coating, die coating, and gravure coating.
As drying conditions when drying a coating film, 30 seconds-5 minutes are mentioned at 80-150 degreeC, for example.
After performing the drying treatment, the sealing resin layer may be cured by leaving it still for about one week. By curing the sealing resin layer, a crosslinked structure can be sufficiently formed.

After the sealing resin layer is formed, another sheet of release sheet is laminated on the sealing resin layer, whereby a sheet-like sealing material having release sheets as both outermost layers can be obtained.
Moreover, the sheet-like sealing material consisting of two or more sealing resin layers can be obtained by forming a plurality of sealing resin layers and laminating them so that the sealing resin layers face each other. it can.
Also, after forming the sealing resin layer, a sheet-like sealing composed of two or more sealing resin layers can be obtained by applying a resin composition on the sealing resin layer and drying the obtained coating film. A material can be obtained.

When producing the sheet-like sealing material of the present invention by an extrusion molding method, for example, by dry blending a sealing resin and other components, and using this as a raw material, a film is formed by an extrusion film forming method. A sheet-like sealing material can be obtained.
At this time, a sheet-like sealing material made of two or more sealing resin layers can be obtained by forming a film by a multilayer extrusion film forming method.
When manufacturing the sheet-like sealing material of this invention by a multilayer extrusion film forming method, the well-known method used when manufacturing a co-extrusion multilayer film can be utilized.

  The sheet-like sealing material of the present invention is excellent in moisture barrier properties, and migration due to precipitation of dendrite hardly occurs. Therefore, as will be described later, the sheet-like sealing material of the present invention is suitably used when sealing an electronic device.

2) Sealing sheet The sealing sheet of this invention is a sealing sheet which has a sheet-like sealing material and a base material sheet, Comprising: The said sheet-like sealing material is a sheet-like sealing material of this invention. It is characterized by that.

As the base sheet to be used, polyimide, polyamide, polyamideimide, polyphenylene ether, polyether ketone, polyether ether ketone, polyolefin, polyester, polycarbonate, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, acrylic resin, cyclohexane Resin films and sheets such as olefin polymers, aromatic polymers, and polyurethane polymers, metal foils such as aluminum, and laminates thereof can be used.
Although there is no restriction | limiting in particular in the thickness of a base material sheet, From a viewpoint of the ease of handling, Preferably it is 0.5-500 micrometers, More preferably, it is 1-200 micrometers, More preferably, it is 5-100 micrometers.

  The base sheet may contain an ultraviolet absorber, a light stabilizer, an antioxidant, an antistatic agent, a slip agent, an antiblocking agent, a colorant and the like. Moreover, you may surface-treat with respect to the base material sheet surface as needed from a viewpoint of improving the adhesiveness of a base material sheet and a sheet-like sealing material.

A gas barrier layer may be formed on the base sheet directly or via other layers. The “gas barrier layer” is a layer having a property that it is difficult for gas such as air, oxygen, and water vapor to pass therethrough.
The thickness of the gas barrier layer is not particularly limited, but is usually in the range of 10 to 2000 nm, preferably 20 to 1000 nm, more preferably 30 to 500 nm, and still more preferably 40 to 200 nm from the viewpoints of gas barrier properties and handleability.

  The gas barrier layer may be a single layer or a plurality of layers, but is preferably a plurality of layers from the viewpoint of obtaining higher gas barrier properties.

The gas barrier layer preferably has a water vapor transmission rate of 0.1 g / m ² / day or less in an environment of a temperature of 40 ° C. and a relative humidity of 90% (hereinafter abbreviated as “90% RH”). It is more preferable that it is 0.05 g / m ² / day or less, and it is more preferable that it is 0.005 g / m ² / day or less.
When the water vapor transmission rate in the environment of the gas barrier layer at 40 ° C. and 90% RH is 0.1 g / m ² / day or less, oxygen or moisture is contained inside the element such as an organic EL element formed on the transparent substrate. Etc. can effectively prevent the electrode and the organic layer from deteriorating.
The permeability of water vapor or the like of the gas barrier layer can be measured using a known gas permeability measuring device.

  A material etc. will not be specifically limited if a gas barrier layer can provide desired gas barrier property. Examples thereof include an inorganic film and a gas barrier layer obtained by modifying a layer containing a polymer compound. Among these, the gas barrier layer is preferably a gas barrier layer made of an inorganic film and a gas barrier layer obtained by implanting ions into a layer containing a polymer compound because a layer having a small thickness and excellent gas barrier properties can be efficiently formed. .

The inorganic film is not particularly limited, and examples thereof include an inorganic vapor deposition film.
Examples of the inorganic vapor deposition film include vapor deposition films of inorganic compounds and metals.
As the raw material for the vapor-deposited film of the inorganic compound, inorganic oxides such as silicon oxide, aluminum oxide, magnesium oxide, zinc oxide, indium oxide and tin oxide; inorganic nitrides such as silicon nitride, aluminum nitride and titanium nitride; inorganic carbides; Inorganic sulfides; inorganic oxynitrides such as silicon oxynitride; inorganic oxide carbides; inorganic nitride carbides; inorganic oxynitride carbides and the like.
Examples of the raw material for the metal vapor deposition film include aluminum, magnesium, zinc, and tin.

In a gas barrier layer obtained by ion implantation into a layer containing a polymer compound (hereinafter sometimes referred to as “polymer layer”), the polymer compound used is a silicon-containing polymer such as polyorganosiloxane or polysilazane compound. Compound, polyimide, polyamide, polyamideimide, polyphenylene ether, polyether ketone, polyether ether ketone, polyolefin, polyester, polycarbonate, polysulfone, polyethersulfone, polyphenylene sulfide, polyarylate, acrylic resin, cycloolefin polymer, aromatic System polymers and the like. These polymer compounds can be used alone or in combination of two or more.
Among these, from the viewpoint of forming a gas barrier layer having excellent gas barrier properties, silicon-containing polymer compounds are preferable, and polysilazane compounds are more preferable.

  A polysilazane compound is a polymer compound having a repeating unit containing a —Si—N— bond (silazane bond) in the molecule. Specifically, the formula (1)

The compound which has a repeating unit represented by these is preferable. The number average molecular weight of the polysilazane compound to be used is not particularly limited, but is preferably 100 to 50,000.

In said formula (1), n represents arbitrary natural numbers.
Rx, Ry, and Rz each independently represent a hydrogen atom, an unsubstituted or substituted alkyl group, an unsubstituted or substituted cycloalkyl group, an unsubstituted or substituted alkenyl group, unsubstituted or substituted Represents a non-hydrolyzable group such as an aryl group having a group or an alkylsilyl group; Among these, as Rx, Ry, and Rz, a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, or a phenyl group is preferable, and a hydrogen atom is particularly preferable. Examples of the polysilazane compound having a repeating unit represented by the formula (1) include inorganic polysilazanes in which Rx, Ry, and Rz are all hydrogen atoms, and organic polysilazanes in which at least one of Rx, Ry, and Rz is not a hydrogen atom. It may be.
The polysilazane compounds can be used alone or in combination of two or more. In the present invention, a modified polysilazane compound can also be used as the polysilazane compound. In the present invention, as the polysilazane compound, a commercially available product as a glass coating material or the like can be used as it is.

The polymer layer may contain other components in addition to the above-described polymer compound as long as the object of the present invention is not impaired. Examples of other components include curing agents, other polymers, anti-aging agents, light stabilizers, and flame retardants.
The content of the polymer compound in the polymer layer is preferably 50% by mass or more and more preferably 70% by mass or more because a gas barrier layer having better gas barrier properties can be obtained.

The thickness of the polymer layer is not particularly limited, but is preferably in the range of 50 to 300 nm, more preferably 50 to 200 nm.
In the present invention, even if the thickness of the polymer layer is nano-order, a gas barrier laminate having a sufficient gas barrier property can be obtained.

  As a method for forming a polymer layer, for example, a known device such as a spin coater, a knife coater, a gravure coater, or the like is used to form a layer forming solution containing at least one kind of a polymer compound, and optionally other components and a solvent. The method of using and apply | coating and forming the coating film obtained by drying moderately is mentioned.

Examples of the polymer layer modification treatment include ion implantation treatment, plasma treatment, ultraviolet irradiation treatment, and heat treatment.
The ion implantation process is a method of modifying the polymer layer by implanting ions into the polymer layer, as will be described later.
The plasma treatment is a method for modifying the polymer layer by exposing the polymer layer to plasma. For example, plasma treatment can be performed according to a method described in Japanese Patent Application Laid-Open No. 2012-106421.
The ultraviolet irradiation treatment is a method for modifying the polymer layer by irradiating the polymer layer with ultraviolet rays. For example, the ultraviolet modification treatment can be performed according to the method described in JP2013-226757A.
Among these, the ion implantation treatment is preferable because the gas barrier layer can be efficiently modified to the inside without roughening the surface of the polymer layer and more excellent in gas barrier properties.

As ions implanted into the polymer layer, ions of rare gases such as argon, helium, neon, krypton, and xenon; ions such as fluorocarbon, hydrogen, nitrogen, oxygen, carbon dioxide, chlorine, fluorine, and sulfur;
Ions of alkane gases such as methane and ethane; Ions of alkene gases such as ethylene and propylene; Ions of alkadiene gases such as pentadiene and butadiene; Ions of alkyne gases such as acetylene; Benzene, toluene, etc. Ions of aromatic hydrocarbon gases such as: ions of cycloalkane gases such as cyclopropane; ions of cycloalkene gases such as cyclopentene; ions of metals; ions of organosilicon compounds;
These ions can be used alone or in combination of two or more.
Among these, ions of rare gases such as argon, helium, neon, krypton, and xenon are preferable because ions can be more easily implanted and a gas barrier layer having particularly excellent gas barrier properties can be obtained.

  The method for implanting ions is not particularly limited. For example, a method of irradiating ions accelerated by an electric field (ion beam), a method of injecting ions in plasma, and the like can be mentioned. A gas barrier layer can be easily obtained, and the latter method of injecting plasma ions is preferable. .

  The substrate sheet to be used is preferably transparent. The total light transmittance of the base sheet is preferably 80% or more, and more preferably 85% or more.

  The sealing sheet of this invention may further have other layers, such as a protective layer, a conductor layer, and a primer layer, in addition to the base material sheet. The position where these layers are laminated is not particularly limited.

The manufacturing method of the sealing sheet of this invention is not specifically limited. For example, the sealing sheet of this invention can be obtained by using a base material sheet instead of the peeling sheet of the sheet-like sealing material with a peeling sheet.
Moreover, by laminating the sheet-like sealing material of the sheet-like sealing material with the release sheet and the base material sheet so as to face each other, the layer configuration of the base material sheet / sheet-like sealing material / release sheet is obtained. The sealing sheet of the present invention can be obtained.

  The encapsulating sheet of the present invention is excellent in moisture barrier properties and hardly causes migration due to precipitation of dendrites. Therefore, as will be described later, the sheet-like sealing material of the present invention is suitably used when sealing an electronic device.

3) Electronic device The electronic device of this invention is equipped with the sheet-like sealing material of this invention, or the sealing sheet of this invention.

As an electronic device of the present invention, for example, an electronic device comprising a substrate, an element formed on the substrate, and a sealing material for sealing the element, the sealing material is What is the sheet-like sealing material of the invention, or an electronic device comprising a substrate, an element formed on the substrate, and a sealing sheet for sealing the element, the sealing sheet However, what is the sealing sheet of this invention is mentioned.
Since the electronic device of the present invention includes the sealing material of the present invention, even if the sealing material is in contact with a conductive member such as an electrode or wiring of the electronic device, the conductive member Since dendrite does not easily precipitate, migration is unlikely to occur.

The substrate is not particularly limited, and various substrate materials can be used. In particular, when the electronic device is a bottom emission type organic EL element, it is preferable to use a substrate material having a high visible light transmittance. In addition, a material having a high blocking performance for blocking moisture and gas to enter from the outside of the element and having excellent solvent resistance and weather resistance is preferable. Specifically, transparent inorganic materials such as quartz and glass; polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polystyrene, polyethylene, polypropylene, polyphenylene sulfide, polyvinylidene fluoride, acetyl cellulose, brominated phenoxy, aramids, polyimides, And transparent plastics such as polystyrenes, polyarylates, polysulfones, and polyolefins.
The thickness of the substrate is not particularly limited, and can be selected as appropriate in consideration of light transmittance and performance for blocking the inside and outside of the element.

Further, a conductive layer may be provided over the substrate. The sheet resistance of the conductive layer is preferably 500Ω / □ or less, and more preferably 100Ω / □ or less.
As a material for forming the conductive layer, known materials can be used. Specifically, indium-tin composite oxide (ITO), fluorine-doped tin oxide (IV) SnO ₂ (FTO), oxidation tin (IV) SnO _2, zinc oxide (II) ZnO, indium - zinc oxide (IZO) and the like.
These materials can be used alone or in combination of two or more.

An auxiliary electrode may be provided over the conductive layer. The auxiliary electrode is made of a metal thin film having an opening and improves the conductivity of the conductive layer.
When a conventional sheet-like sealing material is brought into contact with a metal member such as an auxiliary electrode, dendrites may be deposited on the metal member.
However, when the sheet-like sealing material of the present invention is brought into contact with a metal member such as an auxiliary electrode, dendrites are difficult to deposit on the metal member, and therefore the electronic device of the present invention can be driven stably over a long period of time. It is.

As an element, an element that converts electric energy into light (light emitting diode, semiconductor laser, etc.), or a photoelectric conversion element that is an element that converts light into electric energy (photodiode, solar cell, etc.); organic EL layer, etc. And the like.
There are no particular restrictions on the type, size, shape, number, etc. of the elements formed on the substrate.

  Electronic devices include organic devices such as organic transistors, organic memories, and organic EL devices; liquid crystal displays; electronic paper; thin film transistors; electrochromic devices; electrochemiluminescence devices; touch panels; solar cells; Device; and the like.

  Specific examples of the electronic device include an organic EL element. For example, a bottom emission type organic EL element having a transparent conductive layer, an auxiliary electrode, an organic EL layer, an electrode, and a sealing resin layer in this order on a transparent substrate, a substrate, an electrode layer, an organic EL layer, a transparent electrode, a seal The top emission type organic EL element which has a stop resin layer in this order is mentioned.

Hereinafter, the present invention will be described in more detail with reference to examples. However, the present invention is not limited to the following examples.
Unless otherwise indicated, the part and% in each example are based on mass.

(Compounds and materials)
The compounds and materials used in each example are shown below.
Sealing resin (1): copolymer of isobutylene and isoprene (manufactured by Nippon Butyl Co., Exxon Butyl 268, number average molecular weight 260,000, isoprene content 1.7 mol%)
Tackifier (1): (Nippon Zeon, Quinton A100)

In addition, the number average molecular weight of sealing resin (1) performed the gel permeation chromatography on the following conditions, and calculated | required it as a standard polystyrene conversion value.
Apparatus: HLC-8020 manufactured by Tosoh Corporation
Column: manufactured by Tosoh Corporation, TSK guard column HXL-H, TSK gel GMHXL (× 2), TSK gel G2000HXL
Column temperature: 40 ° C
Developing solvent: Tetrahydrofuran Flow rate: 1.0 mL / min

Release sheet (1): Polyethylene terephthalate film subjected to silicone release treatment (manufactured by Lintec Corporation, SP-PET381130, thickness: 38 μm)
Release sheet (2): Silicone release treated polyethylene terephthalate film (Lintec Corporation, SP-PET38T103-1, thickness 38 μm)

[Production Example 1]
In a reaction vessel equipped with a stirrer, thermometer, reflux condenser, dropping device and nitrogen introduction tube, 85 parts of methyl acrylate, 15 parts of 2-hydroxyethyl acrylate, 200 parts of ethyl acetate, 2,2′-azobisiso 0.16 parts of butyronitrile was charged, and a copolymerization reaction was performed at 70 ° C. in a nitrogen gas atmosphere. An acrylic copolymer having a weight average molecular weight (Mw) of 370,000 and a molecular weight distribution (Mw / Mn) of 4.2 ( A solution containing 1) was obtained.

  Weight average molecular weight (Mw) of 700,000, molecular weight distribution (Molecular weight distribution (Mw)) in the same manner as in Production Example 1, except that 95 parts of methyl acrylate was charged and 95 parts of 2-hydroxyethyl acrylate was replaced. A solution containing an acrylic copolymer (Mw / Mn) 2.6 was obtained.

[Reference Example 1]
The sealing resin (1) was dissolved in toluene to obtain a coating solution having a solid content concentration of 20%.
The obtained coating liquid was applied onto the release-treated surface of the release sheet (1) so that the thickness after drying was 20 μm, and the obtained coating film was dried at 120 ° C. for 2 minutes to be sealed. A resin layer was formed. Next, the release sheet (2) was bonded to the release-treated surface to obtain a sheet-like sealing material (1) with a release sheet.

[Reference Example 2]
100 parts of the sealing resin (1) and 20 parts of the tackifier (1) were dissolved in toluene to obtain a coating liquid having a solid content concentration of 20%.
The obtained coating liquid was applied onto the release-treated surface of the release sheet (1) so that the thickness after drying was 20 μm, and the obtained coating film was dried at 120 ° C. for 2 minutes to be sealed. A resin layer was formed. Next, the release sheet (2) was bonded to the release-treated surface to obtain a sheet-shaped sealing material (2) with a release sheet.

[Comparative Example 1]
The concentration of the solution obtained in Production Example 1 was adjusted to obtain a coating solution having a solid concentration of 20%.
A sheet-like sealing material with a release sheet (3) was obtained in the same manner as in Reference Example 1, except that this coating liquid was used instead of the coating liquid containing the sealing resin (1).

[Comparative Example 2]
The concentration of the solution obtained in Production Example 2 was adjusted to obtain a coating solution having a solid concentration of 20%.
A sheet-like sealing material with a release sheet (4) was obtained in the same manner as in Reference Example 1 except that this coating liquid was used instead of the coating liquid containing the sealing resin (1).

The following measurements were performed on the sheet-like sealing materials with release sheets (1) to (4) obtained in Reference Examples 1 and 2 and Comparative Examples 1 and 2.
(Water vapor transmission rate measurement)
By sandwiching the sheet-like sealing material from which the release sheet was peeled off between two polyethylene terephthalate films (Mitsubishi Resin Co., Ltd., thickness: 6 μm), a sample for measuring water vapor transmission rate was obtained. Subsequently, the water vapor transmission rate of the sealing material at a temperature of 40 ° C. and a relative humidity of 90% was measured using a water vapor transmission rate measuring device (manufactured by LYSSY, L80-5000).
The following calculation was performed on the measurement result, and the water vapor transmission rate when the thickness was 50 μm was calculated. The obtained water vapor transmission rate when the thickness is 50 μm is shown in Table 1.

(Electrical conductivity of the sealing material component extract)
1 g of the sheet-like sealing material from which the release sheet has been peeled is immersed in 20 ml of water (electric conductivity: 2 μS / cm, pH: 5.1), and stirred in a sealed container at 121 ° C. for 24 hours under the conditions of 2 atm. Then, the sheet-like sealing material component was extracted. Subsequently, solid content was separated by filtration and the sealing material component extract was obtained.
The electrical conductivity of the sealing material component extract was measured using a conductivity meter (manufactured by Horiba, Ltd., product name: B-173). The measurement results are shown in Table 1.

(PH of sealing material component extract)
The pH of the sealing material component extract obtained by the above method was measured using a pH meter (manufactured by Horiba, Ltd., product name: B-212). The measurement results are shown in Table 1.

(Migration test)
Etching was applied to the copper foil of the copper clad laminate to obtain a wiring board (electrode line width / space width: 50 μm / 50 μm) shown in FIG.
The sheet-shaped sealing material of the sheet-shaped sealing material with a release sheet was stacked and pressure-bonded at 23 ° C. so as to cover the copper wiring of the wiring board.
Subsequently, the release sheet was peeled off to obtain a measurement sample.
This measurement sample was allowed to stand under the conditions of 130 ° C., relative humidity 85% and 1.3 atm, and a voltage of 5 V was applied between the electrodes for 168 hours.
After the migration test, the comb electrode was observed with a microscope, and the presence or absence of migration was evaluated according to the following criteria.
○: Electrode dissolution is not observed.
×: Electrode dissolution or dendrite formation is observed.

Moreover, the resistance value of the electrode after a test was measured and the presence or absence of the short circuit (short) was confirmed. The measurement results are shown in Table 1.
In Table 1, the case where the resistance value after the test did not become 1 MΩ or less was regarded as not short-circuited, and was designated as “A”. A case where the resistance value after the test was 1 MΩ or less was regarded as a short circuit, and was designated as “B”.

The following can be seen from Table 1.
The sheet-like encapsulants of Reference Examples 1 and 2 were excellent in moisture barrier properties, did not dissolve electrodes or precipitate dendrites, and no current short circuit was observed.
On the other hand, in the sheet-like encapsulants of Comparative Examples 1 and 2, electrode dissolution and dendrite formation were observed in the electrode corrosion test, and a short circuit of current was observed.

1: Substrate 2: Anode 3: Cathode 10: Wiring substrate

Claims (7)

A sheet-like sealing material comprising one or more sealing resin layers,
The sealing resin layer contains a polyolefin polymer as a sealing resin, and is tackified selected from the group consisting of aliphatic petroleum resins, terpene resins, rosin ester resins, and rosin resins. Containing or not containing agents,
Content of the said tackifier in the said sealing resin layer is 0-20 mass parts with respect to 100 mass parts of sealing resin,
The sheet-form sealing material has a water vapor transmission rate of 0.1 g / (m ² · day) or more and 500 g / (m ² · day) when converted to a thickness of 50 μm at a temperature of 40 ° C. and a relative humidity of 90%. And
1 g of the sheet-like sealing material is immersed in 20 ml of water having an electric conductivity of 2 μS / cm at 25 ° C., and the sheet-like sealing material component is kept until the electric conductivity at 25 ° C. of the sealing material component extract is constant. The sheet-form sealing material characterized by the electrical conductivity in 25 degreeC of the sealing-material component extract obtained by extracting a 2 being 35-S / cm.   The water used for the preparation of the sealing material component extract has a pH of 5.1 at 25 ° C, and the pH of the sealing material component extract is 3.8 to 6.5. The sheet-like sealing material described in 1.   The sheet-like sealing material according to claim 1 or 2, wherein the content of the polyolefin-based polymer in the sealing resin layer is 70 to 100% by mass with respect to the entire sealing resin layer.   The sheet-shaped sealing material in any one of Claims 1-3 used for sealing of an electronic device. A sealing sheet having a sheet-like sealing material and a base sheet,
The said sheet-like sealing material is the sheet-like sealing material in any one of Claims 1-4, The sealing sheet characterized by the above-mentioned.   The sealing sheet according to claim 5, which is used for sealing an electronic device.   An electronic device provided with the sheet-like sealing material in any one of Claims 1-4, or the sealing sheet of Claim 5 or 6.

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