JP2018162638A - Cure laying body and floor curing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cure laying body and a floor curing method which can be easily applied and dust is hard to fall on a floor.SOLUTION: An underlaying material 10 having a slightly adhesive surface 10b and a non-adhesive surface 10a on the opposite side thereof is prepared and laid on a floor surface 1a with the non-adhesive surface 10a facing downward. Preferably, a plurality of underlaying materials 10 are laid on the floor surface 1a and the edges of the two adjacent underlying materials 10 are overlapped. After that, a curing member 20 that can be peeled off the slightly adhesive surface 10b is laid on the underlaying material 10.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a curing laying body laid on a floor material and a floor curing method.

  For example, in a construction site, after a flooring such as flooring is constructed, various necessary operations may be further performed. In this case, necessary work is performed after laying a curing material on the floor to protect the flooring. Usually, the curing material is in the form of a board (including cardboard) or a sheet. Spread multiple curing materials on the floor. Adhesive tape (curing tape) is affixed to the joint between the curing materials and the edge of the outermost curing material to prevent the curing material from shifting or turning. When the required work is completed, the adhesive tape is peeled off and the curing material is removed.

  According to patent document 1, the adhesive is provided in the lower surface of the curing material. The curing material is previously attached to the upper surface of the flooring. After the floor is constructed, the curing material is peeled off and removed.

Japanese Patent Laid-Open No. 10-088812

The process of applying adhesive tape to each joint of the curing material is cumbersome and time consuming. On the other hand, if it is not firmly pasted, the curing material will shift or turn over during the subsequent required work. In addition, a gap may be formed at the joint between the curing materials, and dust may fall on the floor surface from there. When removing the curing material after the required work is completed, it is necessary to peel off the adhesive tape for each joint, which is troublesome and troublesome. Moreover, when removing the adhesive tape at the seam or removing the curing material, dust on the curing material tends to fall on the floor surface.
According to Patent Document 1, when the curing material with adhesive is peeled from the flooring, the adhesive may be transferred to the floor surface.
In view of such circumstances, an object of the present invention is to provide a curing laying body and a floor curing method that can be easily constructed and that dust does not easily fall on the floor.

In order to solve the above problems, the present invention is a curing laying body laid on the floor surface,
An underlaying material having a non-adhesive surface to be in contact with the floor surface and a slightly adhesive surface on the opposite side;
Curing material detachably laid on the underlaying material,
It is provided with.

  According to the curing laying body, first, an underlay material is laid on the floor surface. Since the lower surface of the underlaying material is non-adhesive, the position of the underlaying material can be easily adjusted on the floor surface. Subsequently, a curing material is laid on the underlaying material. Then, the curing material adheres to the underlay material due to the slight adhesiveness of the upper surface of the underlay material. Thereby, it can prevent that a curing material slip | deviates with respect to an underlay material, or turns. Therefore, it is not necessary to stop the joint between the curing materials and the peripheral portion of the curing material with an adhesive tape. Thereby, a curing laying body can be easily constructed. At the time of removal, since the upper surface of the underlay material is slightly sticky, the curing material can be easily peeled off from the underlay material. Further, it is possible to prevent dust from falling on the floor surface.

It is preferable that a plurality of the underlay materials are spread on the floor surface, and the edges of two adjacent underlay materials are overlapped.
Of the two adjacent underlaying materials, the upper underlaying material can be attached by the slight adhesiveness of the upper surface of the lower underlaying material. Therefore, it is not necessary to stop the joint between the underlaying materials with the adhesive tape. For example, only the outermost edges of the plurality of underlaying materials spread on the floor may be attached to the flooring with an adhesive tape. Thereby, construction of a curing laying body can be further facilitated.

In the floor curing method according to the present invention, an underlaying material having a non-adhesive surface and a slightly adhesive surface on the opposite side thereof is laid on the floor surface with the non-adhesive surface facing down,
Thereafter, a curing material that can be peeled off from the slightly adhesive surface is laid on the underlaying material.

  According to the present invention, a curing laying body can be easily constructed on a floor surface. Moreover, dust can be prevented from falling on the floor.

FIG. 1 is a plan view showing a curing laying body according to an embodiment of the present invention in a state where it is laid on a flooring material. 2 is a cross-sectional view taken along line II-II in FIG. FIG. 3 is an exploded perspective view of the curing laying body. FIG. 4A is an exploded enlarged cross-sectional view of a part of the curing laying body. FIG. 4B is an enlarged cross-sectional view of the circle IVb in FIG. FIG. 5 is an enlarged cross-sectional view of the circle V in FIG. FIG. 6A is an enlarged cross-sectional view of the circle VIa in FIG. FIG.6 (b) is an expanded sectional view when the clearance gap is made in the joint of the curing material in the figure (a).

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 shows a flooring 1 such as flooring of a building in the middle of construction. As shown in FIG. 2, a curing laying body 3 is laid on the floor surface 1 a of the flooring 1. As shown in FIG. 3, the curing laying body 3 includes an underlay layer 3a and a curing material layer 3b. The underlay layer 3a is composed of a plurality of underlay materials 10, 10,. A curing material layer 3b is laminated on the upper side of the underlay layer 3a. The curing material layer 3b is composed of a plurality of curing materials 20, 20.

  As shown in FIG. 4A, one side (the lower surface in the figure) of the underlaying material 10 is a non-adhesive surface 10a, and the opposite surface (the upper surface in the figure) is a slightly adhesive surface 10b. . Specifically, the underlay material 10 includes an underlay main body 11 and a slight adhesive 12. The underlay main body 11 may be a paper material, a non-woven fabric, or a resin sheet. One surface (the lower surface in the figure) of the underlay main body 11 constitutes the non-adhesive surface 10a. The non-adhesive surface 10a is not coated with the fine adhesive 12, and the underlying body 11 is exposed. A slight adhesive 12 is applied to the opposite surface (upper surface in the figure) of the underlay body 11. Preferably, the slightly adhesive 12 is applied to the entire area of the opposite side surface (upper surface) of the underlay main body 11. The surface of the slightly adhesive 12 constitutes the slightly adhesive surface 10b.

  The slight pressure-sensitive adhesive 12 has weak adhesiveness to paper, resin, etc., and can adhere the curing material 20 in a peelable manner. Examples of the fine adhesive 12 include acrylic adhesives, silicon adhesives, urethane adhesives, rubber adhesives, and the like. The slightly adhesive 12 may be a porous adhesive such as acrylic foam.

The thickness of the underlay material 10 is not particularly limited and is, for example, 1 mm or less.
The original shape of the underlay material 10 before use is preferably a long shape having a certain width and is wound in a roll shape. The underlay material 10 is cut out from the roll for each desired length and used.
Note that the original shape of the underlay material 10 is not limited to a roll shape, and may be a square or the like having an appropriate length and width.

The curing material 20 has a board shape or a sheet shape. The material of the curing material 20 may be made of paper or resin. A composite material of a plurality of materials may be used. It may have a cardboard structure.
The thickness of the curing material 20 is not particularly limited, and is about several mm, for example. Preferably, the curing material 20 is thicker than the underlay material 10. By making the curing material 20 thick, the flooring 1 can be reliably protected against impact loads and the like.
Note that the size of the curing material 20 need not match the size of the underlay material 10. In FIG. 1, the width of the curing material 20 is smaller than the width of the underlay material 10, but the width of the curing material 20 may be larger than the width of the underlay material 10 or may be the same width as each other.

  As shown in FIGS. 1 and 2, a plurality of underlay materials 10 are spread on the floor surface 1a. As shown in FIG. 4B, the non-adhesive surface 10 a is directed downward to constitute the lower surface of the underlay material 10. The non-adhesive surface 10a is in contact with the floor surface 1a. The slightly adhesive surface 10 b is directed upward to constitute the upper surface of the underlay material 10.

  As shown in FIG. 5, the edges of two adjacent underlay materials 10, 10 are overlapped. Of these two underlaying materials 10 and 10, the slightly adhesive surface 10 b of the lower underlaying material 10 is detachably attached to the non-adhesive surface 10 a of the upper underlaying material 10 due to its slight adhesiveness.

  As shown in FIG. 3, the adhesive tape 4 is provided along the peripheral part of the whole underlay layer 3a. As shown in FIG. 2, the peripheral portion of the underlay layer 3 a is attached to the flooring 1 by the adhesive tape 4. In other words, as shown in FIG. 1, the adhesive tape 4 is provided only on the outer edge of the outermost underlay material 10. Adhesive tape is not provided at the joint between the underlay materials 10.

As shown in FIG. 2, a curing material layer 3 b composed of a plurality of curing materials 20 is laid on an underlying layer 3 a composed of a plurality of underlying materials 10. Each curing material 20 is detachably bonded to the slightly adhesive surface 10b.
As shown to Fig.6 (a), Preferably, the end surfaces of two adjacent curing materials 20 and 20 are faced | matched mutually.
In addition, as shown in FIG.6 (b), the clearance gap 25 of some (for example, about 1 mm-several mm) may exist between the end surfaces of these two curing materials 20,20. Moreover, although illustration is abbreviate | omitted, when the curing material 20 is thin wall etc., the edge of two adjacent curing materials 20, 20 may be piled up.
As shown in FIG. 1, the adhesive tape is not provided at the joint between the curing materials 20. No adhesive tape is provided on the outer edge of the outermost curing material 20.

The curing laying body 3 is laid and constructed as follows.
First, the underlay material 10 is laid on the floor surface 1a. At this time, the non-adhesive surface 10a is directed downward and the slightly adhesive surface 10b is directed upward. Since the non-adhesive surface 10a is not bonded to the floor surface 1a, the position of the underlay material 10 can be easily adjusted on the floor surface 1a.
At the joint between the adjacent underlay materials 10 and 10, the edges of the underlay materials 10 and 10 are stacked one above the other. Then, the upper underlay material 10 is attached to the slightly adhesive surface 10b of the lower underlay material 10 (FIG. 5).
It is not necessary to stop with adhesive tape for each joint between the underlaying materials 10 and 10.
Only the periphery of the entire underlay layer 3a may be attached to the flooring 1 with the adhesive tape 4 (FIG. 2). Thereby, the underlay layer 3a can be easily laid and constructed.

Next, the curing material layer 3b is laid on the underlying layer 3a.
That is, the curing material 20 is placed on the underlying layer 3a while positioning the curing material 20 one by one above the underlying layer 3a. Then, the curing material 20 adheres to the underlay material 10 due to the slight adhesiveness of the upper surface of the underlay material 10. Even if it is slightly adhesive, it can sufficiently prevent the curing material 20 from moving in order to develop a strong bonding force (friction resistance) in the in-plane direction of the underlay material 10. Therefore, it is not necessary to stop the joint between the curing materials 20 and 20 and the peripheral portion of the curing material layer 3b (the outer edge of the outermost curing material 20) with an adhesive tape.
Further, even after the curing material 20 is once placed on the underlay material 10, it is possible to peel off the underlay material 10 and change the arrangement position.
Thereby, the curing material layer 3b can be easily laid and constructed.
As a result, the curing laying body 3 can be easily laid on the floor material 1 in a short time.

After laying the curing laying body 3, various required operations are performed on the floor surface 1a.
Since the curing material 20 is adhered to the underlay material 10, it can be prevented from being turned over during the required work. In addition, as shown in FIG. 6B, even if there is a gap 25 at the joint between the curing materials 20 and dust 5 (including dust) enters there, the dust 5 is slightly adhered to the underlay material 10. Stick to face 10b and stay there. It does not reach the floor 1a.

When the required work is finished, the curing laying body 3 is removed.
As a removal procedure, the curing material 20 is first peeled off from the underlay material 10. Since the upper surface of the underlay material 10 is slightly adhesive, the curing material 20 can be easily peeled off. A portion of the curing material 20 sticks to the underlaying material 10 and does not remain or break, and can be peeled off cleanly.
Moreover, since the curing material 20 is not stopped by the adhesive tape, it is not necessary to remove the adhesive tape, and the curing material 20 can be easily removed.
When the curing material 20 is peeled off and removed, dust (including dust) on the top surface of the curing material 20 may fall. As in the case of the required work, these dusts stick to the slightly adhesive surface 10b of the underlaying material 10, stay there, and do not reach the floor surface 1a.

Next, the adhesive tape 4 at the periphery of the underlay layer 3a is peeled off, and the underlayer 3a is removed. The underlay layer 3 a may be removed by being rounded or folded, or may be removed after being separated for each underlay material 10, or may be removed by rounding or folding each underlay material 10. At this time, even if there is dust on the underlaying material 10, since the dust adheres to the fine adhesive 12, it can be prevented from falling on the floor surface 1a. By rolling or folding the underlay material 10 so that the slightly adhesive surface 10b does not face downward, even if the adhesion between the dust and the slightly adhesive 12 is weak, it is ensured that the dust will fall on the floor surface 1a. Can be prevented.
Further, since the non-adhesive surface 10a is in contact with the floor surface 1a, the fine adhesive 12 is not transferred to the floor surface 1a when the curing laying body 3 is removed.
In this way, the curing laying body 3 can be easily removed.
Since the removed curing material 20 is in a clean state as described above, it can be used again. That is, the curing material 20 can be reused a plurality of times, and the material cost can be reduced.

The present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, the curing laying body 3 and the floor curing method of the present invention are not limited to the curing of the flooring 1 in the middle of construction, but can also be applied to the curing of the flooring 1 when performing a moving operation.

  The present invention can be applied, for example, as a curing means for flooring such as flooring in a construction site.

DESCRIPTION OF SYMBOLS 1 Floor material 1a Floor surface 3 Curing laying body 3a Underlay layer 3b Curing material layer 4 Adhesive tape 10 Underlay material 10a Non-adhesive surface (lower surface)
10b Slightly adhesive surface (upper surface)
11 Underlay body 12 Slight adhesive 20 Curing material 25 Crevice

Claims (3)

A curing laying body laid on the floor surface,
An underlaying material having a non-adhesive surface to be in contact with the floor surface and a slightly adhesive surface on the opposite side;
Curing material detachably laid on the underlaying material,
Curing laying body characterized by comprising.   The curing laying body according to claim 1, wherein a plurality of the underlay materials are spread on a floor surface, and edges of two adjacent underlay materials are overlapped with each other. Laying an underlaying material having a non-adhesive surface and a slightly adhesive surface on the opposite side thereof on the floor surface with the non-adhesive surface facing down,
Then, the curing method which can peel with respect to the said slightly adhesive surface is laid on the said underlay material, The floor curing method characterized by the above-mentioned.

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