JP2018161894A - Structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technology for widening the selection range of a material on a mold side in a room temperature imprint.SOLUTION: A structure comprises a base material 1 and an inorganic film 3b disposed on one side of the base material 1. In the structure, at least one side of the base material 1 is composed of a material having a porous structure.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a structure.

A room temperature nanoimprint lithography technique that is attracting attention as a fine pattern formation technique is disclosed in Patent Document 1. After applying a coating agent containing a material such as SOG (Spin-On-Glass) and a solvent to the substrate surface to form a coating film, the solvent is volatilized and imprinted on the coating film with a mold before curing is completed. Thereafter, a nano-accurate SiO ₂ fine pattern can be formed by separating the mold from the coating film.

  In addition, the SOG material is imprinted using a mold made of polydimethylsiloxane having solvent absorbability (hereinafter referred to as “PDMS”), and the solvent contained in the coating film is absorbed on the mold side to form a pattern. The forming technique is also disclosed in Non-Patent Document 1.

Japanese Patent Laid-Open No. 2003-100609

“Room-Temperature Nanoimpringing Using Liquid-Phase Hydrogen Silsesquioxane with Hard Poly (dimethylsiloxane) Mold, Jpn. J. Appl. Phys. 49 (2010) 06GL 13 (5 pages).

  However, in the conventionally proposed technique, when the solvent is absorbed on the mold side, it is necessary to use a solvent-absorbing material on the mold side, and there is a problem that the selection range of the material is narrowed. Further, since the mold can be deteriorated by absorbing the solvent, the mold may be swollen, and therefore, the mold may need to be replaced.

  An object of the present invention is to broaden the range of selection of materials on the mold side in room temperature imprinting.

  In one embodiment of the present invention, a step of forming a coating film by containing an inorganic material and a solvent on a base material, and contacting the coating film with a mold, the shape of the surface of the mold is changed. And transferring to the surface of the coating film, and the base material has a solvent absorbability at least on the side on which the coating film is formed.

  As another aspect of an embodiment of the present invention, the mold may be silicon or quartz glass.

  As another aspect of an embodiment of the present invention, at least the side of the mold that faces the coating film may have solvent absorbability.

  As another aspect of an embodiment of the present invention, the inorganic material may be a siloxane polymer.

  One embodiment of the present invention includes a base material and an inorganic film disposed on one side of the base material, and at least one side of the base material is made of a material having a porous structure. It is a structure characterized by the above.

  As another aspect of one embodiment of the present invention, one side of the substrate is made of a material having a porous structure having a solvent absorbability that absorbs a solvent of a coating agent for forming the inorganic film. It may be.

  According to the present invention, in room temperature imprinting, the range of selection of materials on the mold side can be expanded. In addition, it is possible to extend the service life limit of the mold due to absorption of the solvent.

It is a figure which shows the manufacturing process of the structure by one embodiment of this invention.

  Hereinafter, a structure manufacturing method according to an embodiment of the present invention will be described in detail with reference to the drawings. Below, the coating agent containing an inorganic material and a solvent is apply | coated to a solvent absorptive board | substrate, a coating film is formed, and it demonstrates as an example the process of shape | molding a coating film using a mold.

  FIG. 1 is a process diagram showing a main process of the structure manufacturing method according to the present embodiment. As shown to Fig.1 (a), the coating film 3 is formed by apply | coating the coating agent containing an inorganic material and a solvent on the base material 1 with a solvent absorptivity (coating film formation process).

  The coating film 3 can be formed by a known coating method, and typically a spin coating method can be used. When the coating film 3 is formed by spin coating, a uniform thin film can be formed by increasing the solvent amount of the coating agent and decreasing the viscosity of the coating agent. Although there is no restriction | limiting in particular in the thickness of the coating film 3, For example, it can form in 0.01 micrometer-0.5 micrometer.

  The substrate 1 has solvent absorbability at least on the side on which the coating film 3 is formed. The substrate 1 having solvent absorbability has, for example, a porous porous material such as porous silicon, porous silica, ceramics, and PDMS, and a three-dimensional network structure that can be impregnated with a solvent such as paper or fiber. A material etc. can be used. In addition, the whole base material 1 may have solvent absorptivity. Although there is no restriction | limiting in particular in the thickness of the base material 1, When it is necessary to bend the base material 1 in the case of peeling mentioned later, it can set suitably in the range of 100 micrometers-3 mm. The substrate 1 may be a multilayer structure, for example, as long as the layer having solvent absorbability is at least on the surface in contact with the coating film 3. When the base material 1 has solvent absorbability, it is possible to prevent the mold from being swollen due to the absorption of the solvent, and thus to extend the useful life of the mold.

  The inorganic material contained in the coating agent may be any material that can provide a hard inorganic film when the coexisting solvent decreases. For example, semiconductors such as silicon, titanium, nickel, cobalt, gold, silver, copper, palladium Materials such as platinum, tin, rhodium, indium, ruthenium, zinc, aluminum, molybdenum, chromium, etc., as well as inorganic colloids and polymers containing these oxides and nitrides, or colloids of these. Can be mentioned.

  Hereinafter, the present invention discloses a method of using a siloxane polymer, which is a silicon-containing inorganic polymer, based on the case of using a hydrogenated silsesquioxane polymer (HSQ) among siloxane polymers. .

  The solvent contained in the coating agent can be appropriately selected according to the inorganic material. For example, methanol, ethanol, xylene, toluene, butyl acetate, cyclohexane, ethylbenzene, isopropyl alcohol, 1-propanol, 2-propanol , Methoxypropyl acetate, propylene glycol monoethyl ether acetylate and the like.

  Next, as shown in FIG. 1B, the surface of the mold 5 on which the uneven pattern is formed is brought into contact with the coating film 3a. Thereby, the pattern on the surface side of the substrate 1 of the mold 5 is transferred to the surface of the coating film 3a on the substrate 1 (transfer process). The mold 5 is not particularly limited. For example, glass, such as silicon, metal, quartz glass, soda glass, fluorite, calcium fluoride, magnesium fluoride, acrylic glass, borosilicate glass, polycarbonate, polypropylene, polyethylene, In addition to resin materials such as polyolefins, ceramic materials such as low expansion ceramics can be used. For example, by using silicon or quartz glass that can be processed with high accuracy as the mold 5, it is possible to form a pattern with high accuracy. In addition, as the mold 5, at least the side on which the coating film 3 is formed may have solvent absorbability like PDMS. In this case, since the solvent is absorbed not only from the substrate 1 side but also from the mold 5 side, the reduction rate of the solvent contained in the coating film 3 can be increased. Although there is no restriction | limiting in particular in the thickness of the mold 5, It can set suitably in the range of 100 micrometers-10 mm. When the thickness of the mold is reduced, it becomes easy to bend at the time of peeling, and the stress required for peeling can be reduced. On the other hand, when the thickness is increased, the deflection due to the external force or the own weight is reduced, so that the positional accuracy and dimensional accuracy of the pattern can be improved. Since the mold can be freely selected as described above, it is possible to provide the selectivity of the thickness. Therefore, the mold 5 can be appropriately designed according to the purpose.

  As shown in FIG. 1C, the state in which the coating film 3 is interposed between the mold 5 and the substrate 1 is maintained. Thereby, the solvent contained in the coating film 3 is absorbed by the substrate 1, and the coating film 3 is cured. At this time, if the absorption rate of the solvent of the coating film 3 to the base material 1 becomes faster than that of the mold 5 and the filling property to the concavo-convex pattern formed on the mold 5 is impaired, FIG. Unlike the mode of (c), the mold may be on the lower side. For example, the coating film 3 may be formed on the mold 5 and the substrate 1 may be brought into contact therewith. Alternatively, the coating film 3 may be formed on the base material 1 and the mold 5 may be brought into contact immediately, and then the mold may be on the lower side and the base material 1 may be on the upper side as viewed from the coating film 3. Thereby, since the speed at which the solvent of the coating film 3 is absorbed by the substrate 1 can be reduced due to the action of gravity, it is possible to prevent the pattern transferability due to absorption from being reduced.

  Next, as shown in FIG. 1D, by separating the mold 5 from the cured coating film 3 on the substrate 1, the pattern of the mold 5 is transferred to the coating film 3a side. The formed coating film pattern 3b can be formed. Thus, the substrate 1 and the coating film pattern 3b (inorganic film) arranged on one side of the substrate 1 are provided, and at least one side of the substrate 1 is made of a material having a porous structure. Structure can be formed.

  Usually, since the substrate 1 and the mold 5 are arranged at a predetermined interval during imprinting, a part of the coating film in the opening O1 remains as a remaining film 3b '.

Further, when it is desired to remove the residual film 3b ', as shown in FIG. 1E, etching back is performed by reactive ion etching or the like for removing the residual film to completely remove the residual film. it can. If necessary, as shown in FIG. 1F, for example, a reactive ion etching method using CF ₄ , CHF ₃ or the like, for example, a Si substrate as a base material 1 and a coating film pattern 3b are formed. By processing as a mask, the substrate 1 can be finely processed.

  As described above, according to the present embodiment, it is possible to shorten the time for reducing the solvent contained in the coating film in the room temperature imprint.

  In the above-described embodiment, the configuration and the like illustrated in the accompanying drawings are not limited to these, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

  Each component of the present invention can be arbitrarily selected, and an invention having a selected configuration is also included in the present invention.

DESCRIPTION OF SYMBOLS 1 ... Base material, 3 ... Coating film, 5 ... Mold.

Claims (2)

A substrate;
An inorganic film disposed on one side of the substrate,
A structure characterized in that at least one side of the substrate is made of a material having a porous structure.   3. The structure according to claim 2, wherein one side of the substrate is made of a material having a porous structure having a solvent absorbability for absorbing a solvent of a coating agent for forming the inorganic film. body.

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