JP2018157320A - Head mounted display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a head mounted display in which heat generated from a circuit board and a battery in a drive unit is effectively dissipated, and in particular, temperature rise of the battery is suppressed to be the heatproof temperature or below of the battery.SOLUTION: A drive unit 103 can be separated into a first casing 201 that stores a circuit board 203 and a second casing 202 that stores a battery 204, and a heat shielding material 205 is disposed between the first casing 201 and the second casing 202. A first heat conducting material 206 is disposed between the circuit board and the first casing and a second heat conducting material 207 is disposed between the battery and the second casing. A volume V1 of the first casing 201 is made larger than a volume V2 of the second casing 202 and the thickness t1 of the first heat conducting material 206 is made larger than the thickness t2 of the second heat conducting material 207 when the heat generation amount of the circuit board is larger than the heat generation amount of the battery and the heatproof temperature of the circuit board is higher than the heatproof temperature of the battery.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a head-mounted display that displays an image in a user's field of view.

  In recent years, a head-mounted display that can be easily carried and displays an image in front of a user's eyes has been developed. The head-mounted display is configured to be mounted on the head, and since the user can see the image while moving his / her hand, the head-mounted display is suitable for an operator such as a construction site. In order to improve the performance of the head mounted display, a configuration in which a display unit that displays an image and a drive unit that drives the display unit are separated has been proposed. A circuit board and a battery are accommodated in this driving unit, but since it generates heat during use, it is necessary to take measures against it.

  For example, Patent Document 1 describes a heat insulating structure in a portable electronic device including a secondary battery, and “a battery housing portion is a molded body having a battery fitting portion for fitting the secondary battery, “A heat insulating layer having a thickness of 500 to 3000 μm and a thermal conductivity of 0.2 W / m · K or less is provided on the surface of the battery fitting portion”, “the heat insulating layer absorbs heat at a temperature of 80 ° C. or higher. “It is a layer containing 30 to 95% by mass of endothermic inorganic compound particles having a peak and 5 to 70% by mass of a binder”.

International Publication No. 2010/032484

  When the amount of information processed by the drive unit increases in order to realize a high-performance head-mounted display, the heat generation amount of the circuit board and the heat generation amount of the battery increase. If the circuit board and the battery are arranged in a closed common housing, the circuit board and the battery themselves are heated due to the heat generated by both, and this causes the performance of the head mounted display to deteriorate. In particular, the heat resistance temperature of a circuit board including a general semiconductor element is about 100 ° C., whereas the heat resistance temperature of a general battery is as low as about 60 ° C. Is likely to increase, resulting in a decrease in battery voltage and a decrease in battery life.

  In the technique described in Patent Document 1, a heat insulating layer is provided between the battery and the electronic device main body, and the surface of the electronic device main body is prevented from being locally heated due to heat generation of the battery. However, no particular consideration is given to the temperature rise of the battery itself, and it is rather conceivable to increase the temperature rise by providing a heat insulating layer.

  Accordingly, an object of the present invention is to provide a head mounted display that effectively dissipates heat generated from a circuit board and a battery in a driving unit, and in particular, suppresses a temperature rise of the battery to a heat resistant temperature or less.

  The head-mounted display according to the present invention has a configuration in which a display unit that generates an image and displays the image in a user's visual field direction and a drive unit that drives the display unit are separated, and the drive unit includes the display unit A circuit board for driving the battery and a battery are housed in a housing, and the housing is separable into a first housing for housing the circuit board and a second housing for housing the battery, A heat shield is disposed between the first housing and the second housing, and a first heat is provided between the first housing and the surface of the circuit board that is far from the heat shield. A conductive member is disposed, and a second heat conductive member is disposed between a surface of the battery that is far from the heat shield and the second housing. When the heat generation amount of the circuit board is larger than the heat generation amount of the battery and the heat resistance temperature of the circuit board is higher than the heat resistance temperature of the battery, the volume V1 of the first housing is set to be equal to that of the second housing. The thickness t1 of the first heat conducting member is made larger than the thickness t2 of the second heat conducting member in a direction perpendicular to the substrate surface of the circuit board.

  According to the present invention, since the temperature rise of the battery can be suppressed to the heat resistant temperature or lower, the battery is consumed and the head mounted display can be used for a long time.

1 is an overall configuration diagram showing an embodiment of a head mounted display 100 according to the present invention. It is a figure which shows the state in which the user is using the head mounted display. FIG. 3 is an exploded perspective view illustrating a configuration of a drive unit 103 according to the first embodiment. It is AA sectional drawing which shows the structure of the drive part 103 shown in FIG. FIG. 6 is a cross-sectional view illustrating a configuration of a drive unit 103 according to a second embodiment. FIG. 6 is a cross-sectional view illustrating a configuration of a driving unit 103 according to a third embodiment. FIG. 10 is a cross-sectional view illustrating a configuration of a driving unit 103 according to a fourth embodiment. FIG. 10 is an exploded perspective view illustrating a configuration of a driving unit 103 according to a fifth embodiment. It is AA sectional drawing which shows the structure of the drive part 103 shown in FIG. It is a figure which shows the temperature rise of each part in the drive part.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, since the structure which attached | subjected the same code | symbol has the same function, unless it mentions especially, those description is abbreviate | omitted when already demonstrated. Further, in the necessary drawings, orthogonal coordinate axes including an x axis, a y axis, and a z axis are described in order to clarify the description of the position of each part.

  FIG. 1 is an overall configuration diagram showing an embodiment of a head mounted display 100 according to the present invention. A head-mounted display (hereinafter abbreviated as HMD) 100 includes a display unit 101 that includes a light source and generates an image, a screen 102 that displays an image in a user's field of view, a drive unit 103 that drives the display unit 101, and a display unit 101. And a wiring 104 that connects the driving unit 103 to the driving unit 103. The drive unit 103 stores a circuit board and a battery as will be described later. The display unit 101 and the drive unit 103 are separated, and the position of the drive unit 103 can be freely arranged by connecting via the wiring 104 as shown in the figure. Further, by separating the display unit 101 and the drive unit 103, it is possible to increase the size of the circuit board stored in the drive unit 103 and increase the capacity of the battery. As a result, the amount of information handled by the HMD 100 can be increased, and high performance such as enhancement of three-dimensional display and communication functions can be achieved. In this example, a one-eye type in which the display unit 102 is arranged at a position corresponding to the right eye is shown, but a binocular type in which two display units 102 are arranged at a position corresponding to both eyes has the same configuration. .

FIG. 2 is a diagram illustrating a state in which the user is using the head mounted display. A user (for example, a worker) 301 is in a state of wearing the display unit 101 of the HMD 100 on the head and performing work while viewing the screen 102 with the right eye. The driving unit 103 of the HMD 100 is stored in the pocket 302 of the worker 301. The display unit 101 and the drive unit 103 are connected by a wiring 104. Here, the drive unit 103 is housed in the chest pocket, but it may be attached to the pocket or helmet of the pants via an adapter. Thus, since the drive part 103 is mounted | worn with or close to an operator's body, it is necessary to suppress a temperature rise.
Hereinafter, the configuration of the drive unit 103 of the HMD 100 will be described in some embodiments.

  FIG. 3 is an exploded perspective view illustrating the configuration of the drive unit 103 according to the first embodiment. The driving unit 103 stores the circuit board 203 and the battery 204 and supplies a driving signal and power to the display unit 101. The housing of the driving unit 103 can be separated into a first housing 201 and a second housing 202. The first housing 201 has a circuit board 203, and the second housing 202 has a battery 204. Store. The circuit board 203 has a planar shape, and the direction of the board surface is used as a reference in the following description. The battery 204 has a rectangular parallelepiped shape, and its upper surface is planar. However, the battery 204 may be uneven.

  The first casing 201 and the second casing 202 are coupled to each other in a state where they face each other in a direction perpendicular to the substrate surface of the circuit board 203 (z direction in the drawing). In the driving unit 103, electronic components such as a semiconductor element 208 are mounted on the circuit board 203 and serve as a heat source together with the battery 204. In order to efficiently dissipate these heat generations, the following configuration is characteristic.

  (Configuration 1) A heat shield 205 is inserted between the first casing 201 and the second casing 202 to suppress heat radiation between the circuit board 203 and the battery 204. The heat shielding material 205 is a heat insulating material such as a resin having a heat insulating effect for blocking heat conduction from the circuit board 203 and the battery 204, and may have a function of blocking heat radiation (emissivity 0.2). Less than). For example, a material obtained by coating a resin with aluminum can be used.

  (Configuration 2) The volume V1 of the first casing 201 that stores the circuit board 203 is made larger than the volume V2 of the second casing 202 that stores the battery 204 (V1> V2).

  (Configuration 3) A first heat conducting member 206 is disposed between the surface of the circuit board 203 on the side farther from the heat shield 205 (in this figure, the semiconductor element 208) and the first housing 201, and the circuit board 203 The heat is conducted to the first housing 201 and is radiated from the surface of the first housing 201.

  (Configuration 4) A second heat conducting member 207 is disposed between a surface of the battery 204 far from the heat shield 205 and the second casing 202, and heat from the battery 204 is transferred to the second casing 202. It conducts heat and dissipates heat from the surface of the second housing 202. The first and second heat conductive members 206 and 207 are formed between the circuit board 203 and the first housing 201 and between the battery 204 and the second housing 202 using a heat conductive sheet or heat conductive grease. The thermal conductivity of can be improved.

  (Configuration 5) In the direction (z direction) perpendicular to the substrate surface of the circuit board 203, the thickness t1 of the first heat conducting member 206 is made larger than the thickness t2 of the second heat conducting member 207 (t1> t2). ).

  4 is a cross-sectional view taken along line AA showing the configuration of the drive unit 103 shown in FIG. In this state, the first casing 201 that stores the circuit board 203 and the second casing 202 that stores the battery 204 are coupled in a direction (z direction) perpendicular to the board surface of the circuit board 203. The configuration satisfies the above-described conditions (Configuration 1) to (Configuration 5). Note that another semiconductor element 209 is mounted on the surface of the circuit board 203 close to the heat shield 205.

Here, the heat radiation operation in the drive unit 103 of the present embodiment will be described.
The drive unit 103 has two heat sources (the circuit board 203 and the battery 204), and it is necessary to suppress the temperature rise of each heat source. The heat resistance temperature of the circuit board 203 including a general semiconductor element is about 100 ° C., whereas the heat resistance temperature of the general battery 204 is as low as about 60 ° C. Therefore, it is necessary to generate a temperature difference between the temperature Tp of the circuit board 203 and the temperature Tb of the battery 204 (Tp> Tb), and to keep the temperature Tb of the battery 204 at or below the heat resistant temperature (request 1).

  Considering that the driving unit 103 touches the human body of the worker 301, it is necessary to keep the surface temperature of the driving unit 103 within a safe range so as not to affect the human body. Generally, the heat generation amount Q1 of the circuit board 203 is larger than the heat generation amount Q2 of the battery 204, and if the heat dissipation performance for both is equal, the case surface temperature T1 of the first case 201 is equal to that of the second case 202. It tends to be higher than the housing surface temperature T2. Therefore, the housing surface temperatures T1 and T2 of the first casing 201 and the second housing 202 are made uniform, and the heat dissipation performance is improved so that the surface temperature of the housing is in a temperature range in consideration of safety. Needed (Request 2).

The operation of the above (Configuration 1) to (Configuration 5) will be described.
By providing the heat shielding material 205 between the first casing 201 and the second casing 202 as in (Configuration 1), heat radiation and heat conduction from the circuit board 203 to the battery 204 are prevented, and the battery temperature Tb can be kept lower than the circuit board temperature Tp.

  Further, as in (Configuration 2), the volume V1 of the first casing 201 is larger than the volume V2 of the second casing 202, in other words, the height h1 of the first casing 201 is set to the second casing. By making it larger than the height h2 of 202, it is possible to make a difference in the thermal resistance of the space in the housing, and to keep the battery temperature Tb lower than the circuit board temperature Tp.

  By disposing the first heat conductive member 206 and the second heat conductive member 207 as in (Configuration 3) and (Configuration 4), the heat of the circuit board 203 is transferred to the first casing 201 and to the battery. The heat of 204 can be efficiently conducted to the second housing 202, and the heat can be radiated from the surfaces of the first housing 201 and the second housing 202 to the outside air.

  At that time, as in (Configuration 5), since the thickness t1 of the first heat conducting member 206 is larger than the thickness t2 of the second heat conducting member 207, there is a difference in the thermal resistance of each heat conducting member. The temperature difference (Tp−T1) between the circuit board 203 and the first housing 201 is larger than the temperature difference (Tb−T2) between the battery 204 and the second housing 202. As a result, an increase in the temperature T1 of the first casing 201 is suppressed, and the temperature T1 of the first casing 201 and the temperature T2 of the second casing 202 can be made equal.

  As described above, (Request 1) and (Request 2) related to heat radiation can be satisfied, and the following effects can be obtained.

  (Request 1): Since the temperature rise of the battery 204 can be efficiently suppressed, the consumption of the battery is suppressed and the HMD 100 can be used for a long time. Moreover, since the temperature rise of the circuit board 203 can be reduced, an image with a large amount of information can be displayed by the HMD 100.

  (Request 2): The surface temperature of the drive unit 103 is efficiently reduced by making the case surface temperatures of the first case 201 and the second case 202 uniform. Will improve. Further, since the housing surface temperatures of the first housing 201 and the second housing 202 can be made uniform, the operator 301 does not need to worry about the direction when the driving unit 103 is mounted, and the workability is improved. improves.

  According to the configuration of the first embodiment, it is not necessary to attach a special cooling device to the driving unit 103, and an HMD that displays a high-quality image with a safe and simple configuration can be provided. Further, since the casing can be separated into the first casing 201 and the second casing 202, it is easy to replace the second casing 202 that stores the battery 204 in accordance with the usage state of the HMD. For example, when the HMD is used outdoors for a long time, it may be replaced with the second housing 202 storing a large-capacity battery.

The configuration of the first embodiment can be modified as follows.
The first heat conducting member 206 is not only disposed between the semiconductor element 208 mounted on the circuit board 203 and the first casing 201, but also between the surface of the circuit board 203 and the first casing 201. May also be arranged. In particular, when the semiconductor element 209 is mounted on the heat shielding material 205 side of the circuit board 203, the first heat conducting member 206 is disposed at a position opposite to the circuit board 203 on which the semiconductor element 209 is mounted. Thus, heat from the semiconductor element 209 can be released to the first housing 201.

  The thickness t1 of the first heat conducting member 206 is larger than the thickness t2 of the second heat conducting member 207. This is because the thermal resistance R1 from the circuit board 203 to the first housing 201 is changed to the battery 204. This is because the thermal resistance R2 from the first casing 202 to the second casing 202 is made larger (R1> R2). Therefore, this relationship can also be obtained by setting the thicknesses t1 and t2 to be equal and making the thermal conductivity of the first thermal conductive member 206 smaller than the thermal conductivity of the second thermal conductive member 207.

  In addition, when the thicknesses t1 and t2 of the first heat conducting member 206 and the second heat conducting member 207 are equal and their materials (thermal conductivity) are the same, the first heat conducting member 206 The above relationship (R1> R2) can also be obtained by making the cross-sectional area (cross-sectional area with the normal direction to the substrate surface normal) smaller than the cross-sectional area of the second heat conducting member 207.

FIG. 5 is a cross-sectional view illustrating the configuration of the drive unit 103 according to the second embodiment. In the second embodiment, the configuration of the first embodiment is basically used. However, a distance d1 is set between the surface of the circuit board 203 on the side close to the heat shield 205 (in this figure, the semiconductor element 209) and the heat shield 205, and the battery 204. By providing the distance d2 between the surface near the heat shield material 205 and the heat shield material 205, the heat shield effect of the heat shield material 205 is enhanced. At that time, the distance d1 on the side of the circuit board 203 having a high temperature is made larger than the distance d2 on the side of the battery 204 (d1> d2), thereby preventing heat radiation and heat conduction from the circuit board 203 to the battery 204, thereby reducing the battery temperature Tb. Can be kept lower than the circuit board temperature Tp.
Also in the second embodiment, the effect on (request 1) (request 2) can be obtained as in the first embodiment.

  FIG. 6 is a cross-sectional view illustrating the configuration of the drive unit 103 according to the third embodiment. In the third embodiment, as in the second embodiment, a distance d1 from the circuit board 203 (semiconductor element 209) to the heat shield material 205 and a distance d2 from the battery 204 to the heat shield material 205 are provided. At this time, in order to facilitate the attachment of the heat shield 205, a rib 210 is provided inside the second casing 202 to surround a part around the battery 203 so as to support the heat shield 205. . The height (z direction) of the rib 210 is such that the height h3 from the outer bottom surface of the second housing 202 to the heat shield 205 is the height h4 from the outer bottom surface of the second housing 202 to the surface of the battery 204. It is determined to be larger and the difference is equal to the distance d2 (h3−h4 = d2).

According to the third embodiment, the heat shielding material 205 only needs to be attached to the rib 210, and the positioning accuracy is improved and a stable heat shielding effect can be secured. At that time, a groove for attaching the heat insulating material 205 may be provided in the second housing 202.
Also in the third embodiment, the effect on (Request 1) (Request 2) can be obtained as in the first embodiment.

  FIG. 7 is a cross-sectional view illustrating the configuration of the drive unit 103 according to the fourth embodiment. The fourth embodiment is based on the configuration of the first embodiment, and a thin plate heat conducting member 211 that is in contact with the second heat conducting member 207 is disposed on the inner surface of the second housing 202. Since the surface of the second housing 202 touches the worker 301, a heat insulating material such as resin is desirable. In that case, the heat from the battery 204 is not easily diffused throughout the second casing 202 by the second heat conducting member 207 alone, so that the heat dissipation performance is lowered. Therefore, a thin plate heat conductive member 211 that is in contact with the second heat conductive member 207 is disposed on the inner surface of the second housing 202 to diffuse the heat from the battery 204 throughout the second housing 202. Thereby, the surface temperature of the 2nd housing | casing 202 becomes uniform, and a thermal radiation performance improves. Here, the thin plate heat conducting member 211 is preferably a metal thin plate such as aluminum or copper, or a carbon fiber such as a graphite sheet.

  Further, in order to effectively use the entire surface of the second housing 202, the thin plate heat conducting member 211 is provided by extending to the area where the second heat conducting member 207 is not disposed on the inner surface of the second housing 202. . Specifically, the thin plate heat conducting member 211 is arranged to extend from the inner bottom surface of the second housing 202 to the inner side surface, and from the outer bottom surface of the second housing 202 to the tip of the thin plate heat conducting member 211. The height h5 is larger than the height h4 from the outer bottom surface of the second housing 202 to the surface of the battery 204 (h5> h4).

  According to the fourth embodiment, even if a heat insulating material is used as the second housing 202, the entire surface including the side surface becomes a heat radiating surface, and the heat radiating performance is improved. Moreover, the effect with respect to (request 1) (request 2) is acquired similarly to Example 1. FIG.

  In FIG. 7, the thin plate heat conducting member 211 is disposed so as to be in contact with the second heat conducting member 207 of the second housing 202, but similarly, the first housing 201 (on the circuit board 203 side). ), A thin plate heat conductive member may be disposed so as to be in contact with the first heat conductive member 206. Moreover, you may arrange | position a thin-plate heat conductive member with respect to the structure of Example 2 (FIG. 5) or Example 3 (FIG. 6).

  FIG. 8 is an exploded perspective view illustrating the configuration of the drive unit 103 according to the fifth embodiment. The fifth embodiment is based on the configuration of the first embodiment, and the upper surface of the first housing 201 ′ that stores the circuit board 203 has a convex shape in a direction perpendicular to the board surface of the circuit board 203 (z direction in the figure) ( Kamaboko shape). Accordingly, the first heat conducting member 206 ′ in contact with the first housing 201 ′ is also convex, and its thickness (maximum value) is represented by t 1 ′. On the other hand, the bottom surface of the second housing 202 that stores the battery 204 has a planar shape parallel to the substrate surface of the substrate 203.

  FIG. 9 is a cross-sectional view taken along line AA showing the configuration of the drive unit 103 shown in FIG. The description will focus on differences from the first embodiment (FIG. 4).

  The drive unit 103 can be separated into a first casing 201 ′ and a second casing 202, and the upper surface of the first casing 201 ′ is in a direction perpendicular to the board surface of the circuit board surface 203 (in the drawing). It has a convex shape in the z direction). Therefore, the volume V1 ′ of the first casing 201 ′ is larger than the volume V2 of the second casing 202 (V1 ′> V2), that is, the height h1 ′ of the first casing 201 ′ is the second casing. A structure (h1 ′> h2) larger than the height h2 of the body 202 can be easily realized. Further, by making the first casing 201 'convex, the surface area of the first casing 201' is increased and the heat dissipation performance is improved.

  The shape of the first heat conducting member 206 ′ disposed on the first housing 201 ′ has a convex shape on the upper surface in accordance with the shape of the first housing 201 ′. Therefore, a structure (t1 '> t2) in which the thickness t1' is larger than the thickness t2 of the second heat conducting member 207 on the second housing 202 side can be easily realized.

  As described above, the conditions of (Configuration 1) to (Configuration 5) described in the first embodiment can be easily realized, and as a result, the effect on (Request 1) and (Request 2) can be surely obtained.

  Furthermore, according to the fifth embodiment, workability and safety when the operator wears the drive unit 103 is improved. When the worker 301 wears the drive unit 103 in a pocket or the like, it is more strange to wear the flat second housing 202 side toward the human body than the convex first housing 201 ′ side. Less natural. At that time, since the battery 204 having a low internal temperature is stored in the second housing 202, it is safer even if the driving unit 103 touches the human body. On the other hand, since the first casing 201 ′ faces the outside air side, the heat dissipation characteristics of the drive unit 103 are improved.

  Even if the convex first casing 201 ′ is attached to the human body, the convex shape is formed, so that a gap is generated between the human body of the worker 301 and the first casing 201 ′. The area where the drive unit 103 touches the human body is reduced by this gap, and the heat dissipation performance of the drive unit 103 is improved by the air flow generated in the gap.

Although the embodiments of the present invention have been described with respect to various examples, the heat dissipation effect will be described with reference to the drawings.
FIG. 10 is a diagram showing the temperature rise of each part in the drive unit 103.
(A) is a temperature distribution of a conventional structure for comparison, in which the circuit board 203 and the battery 204 are provided as heat sources, and the heat shield 205 and the heat conducting members 206 and 207 are not provided. It is assumed that the heat generation amount of the circuit board 203 is larger than the heat generation amount of the battery 204. There is a risk that the temperature Tb of the circuit board and the temperature Tb of the battery approach and the battery temperature Tb exceeds the heat resistance temperature. Further, the temperature difference between the temperature T1 of the first casing and the temperature T2 of the second casing becomes large, and the temperature T1 of the first casing becomes high.

  (B) is a temperature distribution of each part in the case of Example 1, and the effect which provided the heat-shielding material 205 and the heat conductive members 206 and 207 appears. The temperature difference between the circuit board temperature Tp and the battery temperature Tb increases, and the battery temperature Tb can be kept below the heat-resistant temperature. Further, the temperature T1 of the first casing and the temperature T2 of the second casing are greatly reduced, and the temperatures of both are equal.

  As described above, according to the embodiment of the present invention, the temperature increase of the battery 204 can be reduced to a heat resistant temperature or lower, so that the battery can be consumed and the head mounted display 100 can be used for a long time and the life can be extended. Further, since the temperature rise of the circuit board 203 can be reduced, an image with a large amount of information can be displayed. Furthermore, by making the housing surface temperature of the drive unit 103 uniform, the heat dissipation performance is improved, the housing surface temperature can be reduced, and the safety to the worker 301 is improved. The worker 301 can handle the driver 103 without worrying about the direction when mounting the drive unit 103, and the work efficiency is improved. It is not necessary to attach a special cooling device to the drive unit 103, and the head mounted display 100 that displays a high-quality image with a safe and simple configuration can be provided.

  The above-described embodiment has been described in detail for easy understanding of the present invention, and is not necessarily limited to the one having all the described configurations. Further, a part of the configuration of an embodiment can be replaced with a part of the configuration of another embodiment, and further, a part or all of the configuration of the other embodiment is added to the configuration of the certain embodiment. Is also possible.

  Moreover, although the above-described embodiment has been described for a head-mounted display, the present invention can be similarly applied to other portable electronic devices including a drive unit including a circuit board and a battery.

100: head mounted display (HMD),
101: display unit,
102: screen,
103: drive unit,
104: Wiring,
201, 201 ′: first housing,
202: second housing,
203: circuit board,
204: Battery
205: heat shield,
206, 206 ′: a first heat conducting member,
207: Second heat conducting member,
208, 209: semiconductor element,
210: Rib,
211: Thin plate heat conduction member,
301: worker,
302: Pocket.

Claims (11)

In a head-mounted display in which a display unit that generates an image and displays it in a user's field of view and a drive unit that drives the display unit are separated,
The drive unit stores a circuit board and a battery for driving the display unit in a housing,
The case is separable into a first case for storing the circuit board and a second case for storing the battery,
While disposing a heat shield between the first housing and the second housing,
A first heat conducting member is disposed between a surface of the circuit board far from the heat shield and the first housing;
A second heat conducting member is disposed between a surface of the battery far from the heat shield and the second housing;
When the heat generation amount of the circuit board is larger than the heat generation amount of the battery, and the heat resistance temperature of the circuit board is higher than the heat resistance temperature of the battery,
The volume V1 of the first housing is made larger than the volume V2 of the second housing, and the thickness t1 of the first heat conducting member is set to the second in the direction perpendicular to the substrate surface of the circuit board. A head-mounted display having a thickness greater than the thickness t2 of the heat conducting member. The head mounted display according to claim 1,
The distance d1 between the surface near the heat shield in the circuit board and the heat shield is made larger than the distance d2 between the surface near the heat shield in the battery and the heat shield. A head-mounted display characterized by that. The head mounted display according to claim 2,
A rib that surrounds a part of the periphery of the battery and supports the heat shield is provided inside the second housing, and the height of the rib is higher than the surface of the battery closer to the heat shield. Further, the head mounted display is characterized in that it is raised by the distance d2. The head mounted display according to claim 2,
A head mounted display, wherein a thin plate heat conductive member in contact with the second heat conductive member is disposed on an inner surface of the second casing. The head mounted display according to claim 3,
A head mounted display, wherein a thin plate heat conductive member in contact with the second heat conductive member is disposed on an inner surface of the second casing. The head mounted display according to claim 4,
The thin plate heat conducting member is arranged to extend to a region where the second heat conducting member is not arranged, and the height of the tip of the thin plate heat conducting member on the inner side surface of the second casing is A head-mounted display characterized in that it is higher than the surface of the battery on the side close to the heat shield. The head mounted display according to claim 5,
The thin plate heat conducting member is arranged to extend to a region where the second heat conducting member is not arranged, and the height of the tip of the thin plate heat conducting member on the inner side surface of the second casing is A head-mounted display characterized in that it is higher than the surface of the battery on the side close to the heat shield. The head mounted display according to claim 1,
The first casing has a convex shape in a direction perpendicular to the substrate surface of the circuit board, and the first heat conducting member in contact with the first casing is also convex.
The head-mounted display, wherein the second casing has a planar shape parallel to the substrate surface of the circuit board. The head mounted display according to claim 8,
A rib that surrounds a part of the periphery of the battery and supports the heat shield is provided inside the second housing, and the height of the rib is higher than the surface of the battery closer to the heat shield. The head-mounted display is characterized by a higher height. The head mounted display according to claim 8,
A head mounted display, wherein a thin plate heat conductive member in contact with the second heat conductive member is disposed on an inner surface of the second casing. The head mounted display according to claim 10,
The thin plate heat conducting member is arranged to extend to a region where the second heat conducting member is not arranged, and the height of the tip of the thin plate heat conducting member on the inner side surface of the second casing is A head-mounted display characterized in that it is higher than the surface of the battery on the side close to the heat shield.

Images