JP2018151243A - Work holding device, inspection device, and work position correction method - Google Patents

Work holding device, inspection device, and work position correction method Download PDF

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JP2018151243A
JP2018151243A JP2017047285A JP2017047285A JP2018151243A JP 2018151243 A JP2018151243 A JP 2018151243A JP 2017047285 A JP2017047285 A JP 2017047285A JP 2017047285 A JP2017047285 A JP 2017047285A JP 2018151243 A JP2018151243 A JP 2018151243A
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workpiece
work
axis
rotation axis
holding device
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JP6671310B2 (en
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友詳 西村
Tomomitsu Nishimura
友詳 西村
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Screen Holdings Co Ltd
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Screen Holdings Co Ltd
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Priority to JP2017047285A priority Critical patent/JP6671310B2/en
Priority to PCT/JP2017/040423 priority patent/WO2018168065A1/en
Priority to US16/475,987 priority patent/US10658219B2/en
Priority to EP17900295.1A priority patent/EP3598109B1/en
Priority to CN201780081005.3A priority patent/CN110114658A/en
Priority to TW106139507A priority patent/TWI663393B/en
Publication of JP2018151243A publication Critical patent/JP2018151243A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/952—Inspecting the exterior surface of cylindrical bodies or wires
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G01M11/0207—Details of measuring devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
    • G01M11/025—Testing optical properties by measuring geometrical properties or aberrations by determining the shape of the object to be tested
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9515—Objects of complex shape, e.g. examined with use of a surface follower device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G01B11/2441—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures using interferometry

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Length Measuring Devices By Optical Means (AREA)

Abstract

PROBLEM TO BE SOLVED: To accurately match the symmetrical axis of a work with the rotation axis of a work holding device which holds and rotates the work.SOLUTION: A work holding device includes: a holding table having a chuck mechanism holding a work, a positioning mechanism for positioning the work by moving the chuck mechanism in a direction orthogonal to a rotation axis while supporting the chuck mechanism, and a rotation mechanism for rotating the work held by the chuck mechanism by rotating the positioning mechanism around the rotation axis; an alignment imaging part for imaging an outer peripheral portion of the work held by the chuck mechanism; a misalignment detection part for detecting a misalignment of the symmetrical axis for the rotation axis based on an image acquired by imaging the work rotated by the rotation mechanism by the alignments imaging part ; and a work position correction part for performing a position correction of the work so that the symmetrical axis matches with the rotation axis by moving the chuck mechanism by the positioning mechanism so as to eliminate the misalignment.SELECTED DRAWING: Figure 5

Description

この発明は、対称軸まわりに回転対称な外周部を有するワークを保持しながら回転軸まわりに回転させるワーク保持装置、当該ワーク保持装置に保持されたワークを検査する検査装置ならびに当該ワーク保持装置におけるワーク位置補正方法に関するものである。   The present invention relates to a workpiece holding device that rotates around a rotation axis while holding a workpiece having a rotationally symmetric outer periphery around a symmetry axis, an inspection device that inspects a workpiece held by the workpiece holding device, and the workpiece holding device. The present invention relates to a work position correction method.

対称軸のまわりに回転対称なワークの外観を検査する装置として、例えば特許文献１に記載されたワーク検査装置が知られている。このワーク検査装置では、モータに連結されたホルダ部によりワークが保持される。そして、上記モータによりワークを回転させながら当該ワークを複数台のカメラで撮像し、それらの撮像画像に基づいてワークの外観を検査する。   As an apparatus for inspecting the appearance of a rotationally symmetric work around a symmetry axis, for example, a work inspection apparatus described in Patent Document 1 is known. In this workpiece inspection apparatus, a workpiece is held by a holder portion connected to a motor. Then, the workpiece is imaged by a plurality of cameras while the workpiece is rotated by the motor, and the appearance of the workpiece is inspected based on the captured images.

特開２０１２−６３２６８号公報JP 2012-63268 A

特許文献１に記載の装置は、歯車をワークとするものであり、歯車に傷や欠陥などが存在していないかを検査する。この装置では、ホルダ部は、ワークを軸方向に貫通する貫通孔に通される軸部と、ワークを軸部と同軸でクランプするクランプ機構とを有している。そして、モータの回転軸が回転することで軸部とワークとが一体に回転する。ここで、ワークの対称軸とモータの回転軸とが一致していない、つまり芯ズレが生じている場合、撮像された画像に基づいて高精度な検査を行うことは困難である。したがって、高精度なワーク検査のために、モータに対するワークの芯ズレを補正してワークの対称軸をモータの回転軸と一致させた、いわゆる芯出し状態でワークを回転させることができる技術が望まれている。   The apparatus described in Patent Document 1 uses a gear as a workpiece, and inspects whether there is a scratch or a defect on the gear. In this apparatus, the holder portion includes a shaft portion that is passed through a through hole that penetrates the workpiece in the axial direction, and a clamp mechanism that clamps the workpiece coaxially with the shaft portion. And a shaft part and a work rotate in one by rotating a rotating shaft of a motor. Here, when the symmetrical axis of the workpiece and the rotational axis of the motor do not coincide with each other, that is, when there is a misalignment, it is difficult to perform a highly accurate inspection based on the captured image. Therefore, for high-accuracy workpiece inspection, a technique that can correct the misalignment of the workpiece relative to the motor and rotate the workpiece in a so-called centering state in which the axis of symmetry of the workpiece coincides with the rotation axis of the motor is desired. It is rare.

この発明は上記課題に鑑みなされたものであり、対称軸まわりに回転対称な外周部を有するワークを保持しながら回転軸まわりに回転させるワーク保持装置において対称軸と回転軸とを高精度に一致させることを目的とする。   The present invention has been made in view of the above problems, and in a work holding device that rotates around a rotation axis while holding a work having a rotationally symmetric outer periphery around the symmetry axis, the symmetry axis coincides with the rotation axis with high accuracy. The purpose is to let you.

この発明の第１の態様は、対称軸まわりに回転対称な外周部を有するワークを保持して回転軸まわりに回転させるワーク保持装置であって、ワークを保持するチャック機構と、チャック機構を支持しながら回転軸と直交する方向にチャック機構を移動させてワークを位置決めする位置決め機構と、位置決め機構を回転軸まわりに回転させることでチャック機構に保持されたワークを回転軸まわりに回転させる回転機構とを有する保持テーブルと、チャック機構に保持されたワークの外周部を撮像するアライメント用撮像部と、回転機構により回転されるワークをアライメント用撮像部で撮像することで取得される画像に基づいて回転軸に対する対称軸の芯ズレを検出する芯ズレ検出部と、芯ズレを解消するように位置決め機構によりチャック機構を移動させて対称軸が回転軸と一致するようにワークの位置補正を行うワーク位置補正部と、を備えることを特徴としている。   A first aspect of the present invention is a workpiece holding device that holds a workpiece having a rotationally symmetric outer peripheral portion around a symmetry axis and rotates the workpiece around the rotation axis, the chuck mechanism holding the workpiece, and the chuck mechanism supported While positioning the workpiece by moving the chuck mechanism in the direction perpendicular to the rotation axis, the rotation mechanism rotates the workpiece held by the chuck mechanism around the rotation axis by rotating the positioning mechanism around the rotation axis. Based on an image acquired by imaging the workpiece rotated by the rotation mechanism with the imaging unit for alignment. A center misalignment detector that detects misalignment of the axis of symmetry with respect to the rotation axis, and a chuck that uses a positioning mechanism to eliminate misalignment It is characterized by structure and by moving the axis of symmetry and a workpiece position correction unit for performing position correction of the workpiece to coincide with the rotation axis.

また、この発明の第２の態様は、対称軸まわりに回転対称な外周部を有するワークを検査する検査装置であって、上記ワーク保持装置と、ワーク保持装置により対称軸を回転軸と一致させた状態で回転軸まわりに回転されるワークを撮像する検査用撮像部と、検査用撮像部により撮像された画像に基づいてワークを検査するワーク検査部と、を備えることを特徴としている。   According to a second aspect of the present invention, there is provided an inspection apparatus for inspecting a workpiece having a rotationally symmetric outer peripheral portion around a symmetry axis, wherein the workpiece holding device and the workpiece holding device make the symmetry axis coincide with the rotation axis. And an inspection imaging unit that images a workpiece rotated about the rotation axis in a state where the workpiece is rotated, and a workpiece inspection unit that inspects the workpiece based on an image captured by the inspection imaging unit.

また、この発明の第３の態様は、対称軸まわりに回転対称な外周部を有するワークを保持して回転軸まわりに回転させるワーク保持装置におけるワーク位置補正方法であって、ワーク保持装置のチャック機構によりワークを保持する第１工程と、ワークを保持したチャック機構を回転軸まわりに回転させながらワークの外周部を撮像して得られる画像に基づいて回転軸に対する対称軸の芯ズレを検出する第２工程と、芯ズレを解消するようにチャック機構を回転軸に対して直交する方向に移動させて対称軸を回転軸に一致させる第３工程とを備えることを特徴としている。   According to a third aspect of the present invention, there is provided a workpiece position correcting method in a workpiece holding device for holding a workpiece having a rotationally symmetric outer peripheral portion around a symmetry axis and rotating the workpiece around the rotation axis. The first step of holding the workpiece by the mechanism and the misalignment of the axis of symmetry with respect to the rotation axis are detected based on the image obtained by imaging the outer periphery of the workpiece while rotating the chuck mechanism holding the workpiece around the rotation axis. It is characterized by comprising a second step and a third step in which the chuck mechanism is moved in a direction orthogonal to the rotation axis so as to eliminate the misalignment so that the symmetry axis coincides with the rotation axis.

このように構成された発明では、対称軸まわりに回転対称な外周部を有するワークがチャック機構に保持されて回転軸まわりに回転される。そして、その回転中に撮像されたワークに基づいて回転軸に対する対称軸の芯ズレが検出され、当該芯ズレを解消するようにチャック機構が回転軸に対して直交する方向に移動されて対称軸が回転軸に一致する。   In the invention configured as described above, a workpiece having a rotationally symmetric outer peripheral portion around the symmetry axis is held by the chuck mechanism and rotated around the rotation axis. Then, based on the workpiece imaged during the rotation, the misalignment of the symmetry axis with respect to the rotation axis is detected, and the chuck mechanism is moved in the direction orthogonal to the rotation axis so as to eliminate the misalignment, and the symmetry axis Matches the axis of rotation.

上記のように、本発明によれば、回転軸に対する対称軸の芯ズレを解消するようにチャック機構を回転軸に対して直交する方向に移動させてワーク位置補正を行っているため、対称軸と回転軸とを高精度に一致させることができる。   As described above, according to the present invention, the workpiece position is corrected by moving the chuck mechanism in a direction orthogonal to the rotation axis so as to eliminate the misalignment of the symmetry axis with respect to the rotation axis. And the rotation axis can be matched with high accuracy.

本発明に係るワーク保持装置の一実施形態を装備する検査装置の全体構成を示す図である。It is a figure which shows the whole structure of the test | inspection apparatus equipped with one Embodiment of the workpiece holding apparatus which concerns on this invention. 図１に示す検査装置の電気的構成を示すブロック図である。It is a block diagram which shows the electrical structure of the test | inspection apparatus shown in FIG. 本発明に係るワーク保持装置の一実施形態であるワーク保持ユニットの構成を示す斜視図である。It is a perspective view which shows the structure of the workpiece holding unit which is one Embodiment of the workpiece holding apparatus which concerns on this invention. 図１に示す検査装置によるワークの検査動作を示すフローチャートである。It is a flowchart which shows the workpiece | work test | inspection operation | movement by the test | inspection apparatus shown in FIG. 検査動作を模式的に示す図である。It is a figure which shows test | inspection operation | movement typically.

図１は、本発明に係る検査装置の一実施形態の全体構成を示す図である。また、図２は、図１に示す検査装置の電気的構成を示すブロック図である。この検査装置１００は、歯車や羽根車などのように対称軸まわりに回転対称な形状で凸部と凹部とが周期的に繰り返して設けられた外周部を有するワークＷの外観を検査する装置であり、ローディングユニット１、ワーク保持ユニット２、撮像ユニット３、アンローディングユニット４および制御ユニット５を有している。なお、ここでは、ワークＷは図１に示すように軸部Ｗａの上部に歯車Ｗｂを設けた機械部品であり、例えば鍛造や鋳造処理によって形成される。そして、部品製造後に当該ワークＷは外部搬送ロボットあるいはオペレータによってローディングユニット１に搬送される。   FIG. 1 is a diagram showing an overall configuration of an embodiment of an inspection apparatus according to the present invention. FIG. 2 is a block diagram showing an electrical configuration of the inspection apparatus shown in FIG. This inspection apparatus 100 is an apparatus for inspecting the appearance of a workpiece W having an outer peripheral portion in which a convex portion and a concave portion are periodically and repeatedly provided in a rotationally symmetric shape around a symmetry axis such as a gear or an impeller. There are a loading unit 1, a work holding unit 2, an imaging unit 3, an unloading unit 4, and a control unit 5. Here, as shown in FIG. 1, the workpiece W is a mechanical part in which a gear Wb is provided above the shaft portion Wa, and is formed by forging or casting, for example. After the parts are manufactured, the workpiece W is transferred to the loading unit 1 by an external transfer robot or an operator.

ローディングユニット１には、テーブルやストッカーなどのワーク収容部（図示省略）が設けられている。そして、外部搬送ロボットなどによりワークＷがワーク収容部に一時的に収容されると、ワーク収容部に設けられたワーク検出センサ１１（図２）がワークＷを検出し、その旨の信号を装置全体を制御する制御ユニット５に送信する。また、ローディングユニット１には、ローダ１２（図２）が設けられており、制御ユニット５からの動作指令に応じてワーク収容部に収容されている未検査のワークＷを受け取り、ワーク保持ユニット２に搬送する。   The loading unit 1 is provided with a work accommodating portion (not shown) such as a table or a stocker. Then, when the workpiece W is temporarily accommodated in the workpiece accommodating portion by an external transfer robot or the like, the workpiece detection sensor 11 (FIG. 2) provided in the workpiece accommodating portion detects the workpiece W, and a signal to that effect is sent to the device. It transmits to the control unit 5 which controls the whole. Further, the loading unit 1 is provided with a loader 12 (FIG. 2), which receives an uninspected workpiece W accommodated in the workpiece accommodating portion in response to an operation command from the control unit 5, and receives the workpiece holding unit 2 Transport to.

図３はワーク保持ユニットの構成を示す斜視図である。ワーク保持ユニット２は、ローダ１２により搬送されてきたワークＷを保持する保持テーブル２１Ａ、２１Ｂを装備している。これらの保持テーブル２１Ａ、２１Ｂはともに同一構成を有し、歯車Ｗｂが水平状態となる姿勢でワークＷの軸部Ｗａの一部を把持して保持可能となっている。以下、図３を参照しつつ保持テーブル２１Ａの構成について説明する一方、保持テーブル２１Ｂは保持テーブル２１Ａと同一構成であるため、保持テーブル２１Ｂについては同一符号を付して説明を省略する。   FIG. 3 is a perspective view showing the configuration of the work holding unit. The work holding unit 2 is equipped with holding tables 21 </ b> A and 21 </ b> B that hold the work W conveyed by the loader 12. Both the holding tables 21A and 21B have the same configuration, and can hold and hold a part of the shaft portion Wa of the workpiece W in a posture in which the gear Wb is in a horizontal state. Hereinafter, the configuration of the holding table 21A will be described with reference to FIG. 3, while the holding table 21B has the same configuration as the holding table 21A. Therefore, the holding table 21B is assigned the same reference numeral and description thereof is omitted.

保持テーブル２１Ａでは、図３に示すように、チャック機構２２、水平位置決め機構２３、回転機構２４および鉛直位置決め機構２５が鉛直方向に積層配置されている。チャック機構２２は、側面視で略Ｌ字状の可動部材２２１〜２２３と、制御ユニット５からの移動指令に応じて可動部材２２１〜２２３を放射状に連動して移動させる移動部２２４とを有している。各可動部材２２１〜２２３の上端面には突起部材２２５が突設されており、上端面と突起部材２２５とで軸部Ｗａの段差部位と係合可能となっている。このため、制御ユニット５からの把持指令に応じて移動部２２４が可動部材２２１〜２２３を互いに近接移動させることでチャック機構２２の中心軸（図５中の符号ＡＸ２）と軸部Ｗａの軸芯とを一致させながらワークＷを保持することができる。一方、制御ユニット５からの解放指令に応じて移動部２２４が可動部材２２１〜２２３を互いに離間移動させることで、ローディングユニット１による未検査ワークＷのローディングやアンローディングユニット４による検査済ワークＷのアンローディングを行うことが可能となる。   In the holding table 21A, as shown in FIG. 3, a chuck mechanism 22, a horizontal positioning mechanism 23, a rotating mechanism 24, and a vertical positioning mechanism 25 are stacked in a vertical direction. The chuck mechanism 22 includes substantially L-shaped movable members 221 to 223 in a side view, and a moving unit 224 that moves the movable members 221 to 223 in a radial manner in response to a movement command from the control unit 5. ing. A projecting member 225 projects from the upper end surface of each of the movable members 221 to 223, and the upper end surface and the projecting member 225 can engage with a stepped portion of the shaft portion Wa. For this reason, the moving unit 224 moves the movable members 221 to 223 close to each other in response to a gripping command from the control unit 5, whereby the central axis (reference numeral AX <b> 2 in FIG. 5) of the chuck mechanism 22 and the axis of the shaft part Wa. It is possible to hold the workpiece W while making them coincide with each other. On the other hand, the moving unit 224 moves the movable members 221 to 223 away from each other in response to a release command from the control unit 5, thereby loading the uninspected workpiece W by the loading unit 1 and the inspected workpiece W by the unloading unit 4. Unloading can be performed.

このように構成されたチャック機構２２は水平位置決め機構２３に支持されている。水平位置決め機構２３は水平方向において互いに直交する方向に移動させる、いわゆるＸＹテーブルを有している。このため、制御ユニット５からの移動指令に応じてＸＹテーブルが駆動されてチャック機構２２を水平面で高精度に位置決めすることが可能となっている。なお、ＸＹテーブルとしては、モータとボールネジ機構とを組み合わせたものや、水平方向において互いに直交する２つのリニアモータを組み合わせたものなどを用いることができる。   The chuck mechanism 22 configured as described above is supported by the horizontal positioning mechanism 23. The horizontal positioning mechanism 23 has a so-called XY table that moves in a direction orthogonal to each other in the horizontal direction. For this reason, the XY table is driven in accordance with a movement command from the control unit 5, and the chuck mechanism 22 can be positioned with high accuracy on a horizontal plane. As the XY table, a combination of a motor and a ball screw mechanism or a combination of two linear motors orthogonal to each other in the horizontal direction can be used.

回転機構２４はモータ２４１を有している。モータ２４１の回転シャフト（図５中の符号２４２）が鉛直上方に延設されており、その上端部に水平位置決め機構２３が連結されている。このため、制御ユニット５から回転指令が与えられると、モータ２４１が作動してモータ２４１の回転軸（図５中の符号ＡＸ３）まわりに水平位置決め機構２３、チャック機構２２、ならびにチャック機構２２により把持されたワークＷを一体的に回転させる。   The rotation mechanism 24 has a motor 241. A rotating shaft (reference numeral 242 in FIG. 5) of the motor 241 extends vertically upward, and a horizontal positioning mechanism 23 is connected to an upper end portion thereof. Therefore, when a rotation command is given from the control unit 5, the motor 241 operates and is gripped by the horizontal positioning mechanism 23, the chuck mechanism 22, and the chuck mechanism 22 around the rotation axis (reference numeral AX <b> 3 in FIG. 5) of the motor 241. The formed workpiece W is rotated integrally.

ここで、本実施形態では、チャック機構２２と回転機構２４との間に水平位置決め機構２３を設けているが、その技術的意義はチャック機構２２の中心軸、チャック機構２２に把持されたワークＷの歯車Ｗｂの対称軸（図５中の符号ＡＸ４）およびモータ２４１の回転軸の相対的な位置関係を水平位置決め機構２３によって調整可能とする点にある。すなわち、チャック機構２２の中心軸とモータ２４１の回転軸とを一致させておくことで、チャック機構２２で把持したワークＷを軸部Ｗａまわりに回転させることができる。しかしながら、歯車Ｗｂの対称軸が軸部Ｗａから外れている場合には、モータ２４１に対して芯ズレが発生しており、歯車Ｗｂは偏心して回転してしまう。そこで、水平位置決め機構２３を設け、ズレ量とズレ方向を補正するように駆動させることで歯車Ｗｂの対称軸とモータ２４１の回転軸とを一致させることが可能となる。これによって、撮像ユニット３による歯車Ｗｂの画像を高精度に撮像することが可能となり、ワークＷの検査精度を向上させることができる。   Here, in the present embodiment, the horizontal positioning mechanism 23 is provided between the chuck mechanism 22 and the rotation mechanism 24, but the technical significance thereof is the center axis of the chuck mechanism 22 and the workpiece W gripped by the chuck mechanism 22. The horizontal positioning mechanism 23 can adjust the relative positional relationship between the axis of symmetry of the gear Wb (reference numeral AX4 in FIG. 5) and the rotation axis of the motor 241. That is, by making the central axis of the chuck mechanism 22 coincide with the rotation axis of the motor 241, the workpiece W gripped by the chuck mechanism 22 can be rotated around the shaft portion Wa. However, when the axis of symmetry of the gear Wb deviates from the shaft portion Wa, a misalignment occurs with respect to the motor 241 and the gear Wb rotates eccentrically. Therefore, the horizontal positioning mechanism 23 is provided and driven so as to correct the shift amount and the shift direction, whereby the axis of symmetry of the gear Wb and the rotation axis of the motor 241 can be matched. As a result, it is possible to capture the image of the gear Wb by the imaging unit 3 with high accuracy, and the inspection accuracy of the workpiece W can be improved.

鉛直位置決め機構２５は、モータ２４１を保持する保持プレート２５１と、モータ２４１の下方位置に配置されたベースプレート２５２と、保持プレート２５１およびベースプレート２５２を連結する４本の連結ピン２５３と、ベースプレート２５２を鉛直方向に昇降させる昇降部２５４とを有している。昇降部２５４は制御ユニット５からの昇降指令に応じてベースプレート２５２を昇降させることで鉛直方向において回転機構２４、水平位置決め機構２３およびチャック機構２２を一体的に移動させ、次に説明するプリアライメント位置ＰＡおよび検査位置ＰＩにおいてワークＷの高さ位置を適正化することができる。   The vertical positioning mechanism 25 vertically connects the holding plate 251 that holds the motor 241, the base plate 252 disposed below the motor 241, four connecting pins 253 that connect the holding plate 251 and the base plate 252, and the base plate 252. And an elevating part 254 for elevating in the direction. The elevating unit 254 moves the rotating mechanism 24, the horizontal positioning mechanism 23, and the chuck mechanism 22 in the vertical direction by moving the base plate 252 up and down in accordance with an elevating command from the control unit 5, and a pre-alignment position described next. The height position of the workpiece W can be optimized at the PA and the inspection position PI.

このように構成された保持テーブル２１Ａ、２１Ｂは、図３に示すように、支持プレート２６１上に一定距離だけ離間して固定されている。また、保持テーブル２１Ａ、２１Ｂの中間位置で支持プレート２６１が旋回駆動部２６２に支持されている。この旋回駆動部２６２は制御ユニット５からの旋回指令に応じて鉛直方向に延びる旋回軸ＡＸ１まわりに支持プレート２６１を１８０゜旋回可能となっており、図３に示すように保持テーブル２１Ａ、２１Ｂがそれぞれプリアライメント位置ＰＡおよび検査位置ＰＩに位置する第１ポジションと、保持テーブル２１Ａ、２１Ｂがそれぞれ検査位置ＰＩおよびプリアライメント位置ＰＡに位置する第２ポジションとの間で切替可能となっている。例えばプリアライメント位置ＰＡに位置する保持テーブル２１Ａに保持されたワークＷに対してプリアライメント処理を施すのと並行して、旋回駆動部２６２によって第１ポジションから第２ポジションに切り替えることで保持テーブル２１Ａがプリアライメント位置ＰＡから検査位置ＰＩにシフトし、プリアライメント処理済のワークＷを検査位置ＰＩに位置決めすることができる。また、当該ワークＷの検査を終了した後、逆方向に旋回することで保持テーブル２１Ａが検査位置ＰＩからプリアライメント位置ＰＡにシフトし、検査処理済のワークＷをプリアライメント位置ＰＡに位置決めすることができる。このように本実施形態では、支持プレート２６１および旋回駆動部２６２によりワークＷの位置を切り替えるポジション切替機構２６が構成されている。   As shown in FIG. 3, the holding tables 21 </ b> A and 21 </ b> B configured as described above are fixed on the support plate 261 at a predetermined distance apart. The support plate 261 is supported by the turning drive unit 262 at an intermediate position between the holding tables 21A and 21B. The turning drive unit 262 can turn the support plate 261 about the turning axis AX1 extending in the vertical direction in response to a turning command from the control unit 5, and the holding tables 21A and 21B can be turned as shown in FIG. The first position positioned at the pre-alignment position PA and the inspection position PI can be switched to the second position where the holding tables 21A and 21B are positioned at the inspection position PI and the pre-alignment position PA, respectively. For example, in parallel with performing the pre-alignment process on the workpiece W held on the holding table 21A located at the pre-alignment position PA, the holding table 21A is switched from the first position to the second position by the turning drive unit 262. Shifts from the pre-alignment position PA to the inspection position PI, and the pre-aligned workpiece W can be positioned at the inspection position PI. Further, after the inspection of the workpiece W is finished, the holding table 21A is shifted from the inspection position PI to the pre-alignment position PA by turning in the reverse direction, and the inspection-processed workpiece W is positioned at the pre-alignment position PA. Can do. Thus, in the present embodiment, the position switching mechanism 26 that switches the position of the workpiece W is configured by the support plate 261 and the turning drive unit 262.

プリアライメント位置ＰＡは上記したようにプリアライメント処理を行う位置であり、プリアライメント位置ＰＡに位置決めされた保持テーブル２１Ａ（または２１Ｂ）の上方にアライメントカメラ２７が配置されている。このアライメントカメラ２７は図３に示すようにワークＷに対してモータ２４１の反対側、つまりワークＷの上方側に配置されており、ワークＷの対称軸ＡＸ４に対して径方向外側に延設されたラインセンサ２７１を有している。このため、ワークＷを回転させながら当該ラインセンサ２７１によりワークＷの上面を撮像可能となっており、ワークＷを少なくとも１周回転させることで歯車Ｗｂの外周部に形成される凸部（歯末）および凹部（歯元）の全てを含む画像が得られる。   The pre-alignment position PA is a position where the pre-alignment process is performed as described above, and the alignment camera 27 is disposed above the holding table 21A (or 21B) positioned at the pre-alignment position PA. As shown in FIG. 3, the alignment camera 27 is disposed on the opposite side of the motor 241 with respect to the workpiece W, that is, on the upper side of the workpiece W, and extends radially outward with respect to the symmetry axis AX4 of the workpiece W. The line sensor 271 is provided. Therefore, the upper surface of the workpiece W can be imaged by the line sensor 271 while the workpiece W is rotated, and a convex portion (tooth end) formed on the outer peripheral portion of the gear Wb by rotating the workpiece W at least once. And an image including all of the recesses (tooth bases).

また、図３への図示を省略しているが、当該保持テーブル２１Ａ（または２１Ｂ）に保持されたワークＷを照明してアライメント処理を良好に行うためのアライメント照明部２８（図２）が設けられている。このため、回転機構２４によりワークＷを回転させるとともに、アライメント照明部２８によりワークＷを照明しながらアライメントカメラ２７によりワークＷを撮像することができる。そして、ワークＷの画像データが制御ユニット５に送られ、芯ズレを補正して歯車Ｗｂの対称軸とモータ２４１の回転軸とを一致させる、つまりプリアライメント処理が実行される。   Although not shown in FIG. 3, an alignment illumination unit 28 (FIG. 2) is provided for illuminating the workpiece W held on the holding table 21 </ b> A (or 21 </ b> B) and performing the alignment process satisfactorily. It has been. For this reason, while rotating the workpiece | work W with the rotation mechanism 24, the workpiece | work W can be imaged with the alignment camera 27, illuminating the workpiece | work W with the alignment illumination part 28. FIG. Then, the image data of the workpiece W is sent to the control unit 5 to correct the misalignment so that the symmetry axis of the gear Wb and the rotation axis of the motor 241 coincide with each other, that is, pre-alignment processing is executed.

一方、検査位置ＰＩは検査処理を行う位置であり、検査位置ＰＩに位置決めされた保持テーブル２１Ａ（または２１Ｂ）の上方に撮像ユニット３が配置されている。この検査位置ＰＩでは、歯車Ｗｂの対称軸とモータ２４１の回転軸とが一致した状態でワークＷを回転させながらワークＷを撮像ユニット３によって撮像することができる。そして、ワークＷの画像データが制御ユニット５に送られ、歯車Ｗｂにおける傷や欠陥などの有無を検査する検査処理が実行される。   On the other hand, the inspection position PI is a position where inspection processing is performed, and the imaging unit 3 is arranged above the holding table 21A (or 21B) positioned at the inspection position PI. At the inspection position PI, the workpiece W can be imaged by the imaging unit 3 while rotating the workpiece W in a state where the axis of symmetry of the gear Wb and the rotation axis of the motor 241 coincide. Then, the image data of the workpiece W is sent to the control unit 5, and an inspection process for inspecting the gear Wb for the presence or absence of scratches or defects is executed.

この撮像ユニット３は、図２に示すように、複数の検査カメラ３１と複数の検査照明部３２とを有している。この撮像ユニット３では、検査位置ＰＩに位置決めされた保持テーブル２１Ａ（または２１Ｂ）に保持されるワークＷを種々の方向から照明するように複数の検査照明部３２が配置されている。そして、回転機構２４によりワークＷを回転させるとともに、検査照明部３２によりワークＷを照明しながら複数の検査カメラ３１によりワークＷを種々の方向から撮像することが可能となっている。これら複数の画像データが制御ユニット５に送られ、制御ユニット５によりワークＷの検査が実行される。   As illustrated in FIG. 2, the imaging unit 3 includes a plurality of inspection cameras 31 and a plurality of inspection illumination units 32. In the imaging unit 3, a plurality of inspection illumination units 32 are arranged so as to illuminate the workpiece W held on the holding table 21A (or 21B) positioned at the inspection position PI from various directions. And while rotating the workpiece | work W by the rotation mechanism 24, it is possible to image the workpiece | work W from various directions with the some inspection camera 31, illuminating the workpiece | work W by the test | inspection illumination part 32. FIG. The plurality of image data is sent to the control unit 5, and the work unit W is inspected by the control unit 5.

こうして検査されたワークＷを保持する保持テーブル２１Ａ（または２１Ｂ）は上記したようにポジション切替機構２６により検査位置ＰＩからプリアライメント位置ＰＡにシフトされる。そして、アンローディングユニット４により保持テーブル２１Ａ（または２１Ｂ）から検査済のワークＷが搬出される。なお、アンローディングユニット４は基本的にローディングユニット１と同一である。つまり、アンローディングユニット４は、検査済のワークＷを一時的に収容するワーク収容部（図示省略）、ワーク検出センサ４１（図２）およびアンローダ４２（図２）を有しており、制御ユニット５からの動作指令に応じて検査済のワークＷを保持テーブル２１Ａ（または２１Ｂ）からワーク収容部に搬送する。   The holding table 21A (or 21B) holding the workpiece W thus inspected is shifted from the inspection position PI to the pre-alignment position PA by the position switching mechanism 26 as described above. Then, the unloaded unit 4 carries out the inspected workpiece W from the holding table 21A (or 21B). The unloading unit 4 is basically the same as the loading unit 1. In other words, the unloading unit 4 includes a work storage unit (not shown) that temporarily stores the inspected work W, a work detection sensor 41 (FIG. 2), and an unloader 42 (FIG. 2). In response to the operation command from 5, the inspected work W is transported from the holding table 21A (or 21B) to the work accommodating unit.

制御ユニット５は、図２に示すように、論理演算を実行する周知のＣＰＵ（Central Processing Unit）、初期設定等を記憶しているＲＯＭ（Read Only Memory）、装置動作中の様々なデータを一時的に記憶するＲＡＭ（Random Access Memory）等から構成されている。制御ユニット５は、機能的には、演算処理部５１、メモリ５２、駆動制御部５３、外部入出力部５４、画像処理部５５および照明制御部５６を備えている。   As shown in FIG. 2, the control unit 5 is a well-known CPU (Central Processing Unit) that executes logical operations, a ROM (Read Only Memory) that stores initial settings, and various data during operation of the apparatus. RAM (Random Access Memory) etc. which memorize | store memorize | stored. Functionally, the control unit 5 includes an arithmetic processing unit 51, a memory 52, a drive control unit 53, an external input / output unit 54, an image processing unit 55, and an illumination control unit 56.

上記駆動制御部５３は、装置各部に設けられた駆動機構、例えばローダ１２、チャック機構２２などの駆動を制御する。外部入出力部５４は、装置各部に装備されている各種センサ類からの信号を入力する一方、装置各部に装備されている各種アクチュエータ等に対して信号を出力する。画像処理部５５は、アライメントカメラ２７および検査カメラ３１から画像データを取り込み、２値化等の画像処理を行う。照明制御部５６はアライメント照明部２８および検査照明部３２の点灯および消灯等を制御する。   The drive control unit 53 controls driving of drive mechanisms provided in each part of the apparatus, such as the loader 12 and the chuck mechanism 22. The external input / output unit 54 inputs signals from various sensors provided in each part of the apparatus, and outputs signals to various actuators provided in each part of the apparatus. The image processing unit 55 takes in image data from the alignment camera 27 and the inspection camera 31 and performs image processing such as binarization. The illumination control unit 56 controls turning on and off of the alignment illumination unit 28 and the inspection illumination unit 32.

上記演算処理部５１は、演算機能を有するものであり、上記メモリ５２に記憶されているプログラムに従って駆動制御部５３、画像処理部５５、照明制御部５６などを制御することで次に説明する一連の処理を実行する。   The arithmetic processing unit 51 has an arithmetic function, and controls a drive control unit 53, an image processing unit 55, an illumination control unit 56, and the like according to a program stored in the memory 52, and will be described next. Execute the process.

なお、図２中の符号６はオペレータとのインターフェースとして機能する表示ユニットであり、制御ユニット５と接続され、検査装置１００の動作状態を表示する機能のほか、タッチパネルで構成されてオペレータからの入力を受け付ける入力端末としての機能も有する。また、この構成に限定されるものではなく、動作状態を表示するための表示装置と、キーボードやマウス等の入力端末を採用しても良い。   Reference numeral 6 in FIG. 2 denotes a display unit that functions as an interface with the operator. The display unit is connected to the control unit 5 and is configured with a touch panel in addition to the function of displaying the operation state of the inspection apparatus 100. It also has a function as an input terminal that accepts. Further, the present invention is not limited to this configuration, and a display device for displaying an operation state and an input terminal such as a keyboard and a mouse may be adopted.

図４は図１に示す検査装置によるワークの検査動作を示すフローチャートである。また、図５は検査動作を模式的に示す図である。なお、図５においては、保持テーブル２１Ａ、２１Ｂの動作を明確に区別するために、保持テーブル２１Ｂおよび当該保持テーブル２１Ｂにより保持されるワークＷに対してドットを付している。   FIG. 4 is a flowchart showing a workpiece inspection operation by the inspection apparatus shown in FIG. FIG. 5 is a diagram schematically showing the inspection operation. In FIG. 5, in order to clearly distinguish the operations of the holding tables 21A and 21B, dots are given to the holding table 21B and the work W held by the holding table 21B.

この検査装置１００では、制御ユニット５のメモリ５２に予め記憶された検査プログラムにしたがって演算処理部５１が装置各部を制御して以下の動作を実行する。ここでは、１つのワークＷに着目して当該ワークＷに対して実行される各種動作について図４および図５を参照しつつ説明する。制御ユニット５は、図５の（ａ）欄に示すようにプリアライメント位置ＰＡに位置している保持テーブル２１ＡにワークＷが存在せず、しかもワーク検出センサ１１により未検査のワークＷがローディングユニット１のワーク収容部に収容されていることを確認すると、保持テーブル２１ＡへのワークＷのローディングを開始する（ステップＳ１）。このローディング工程では、ローダ１２がワーク収容部の未検査ワークＷを把持し、ローディングユニット１から保持テーブル２１Ａに搬送する。なお、本実施形態では、ローディング工程および後の芯ズレの検出工程を円滑に行うために、保持テーブル２１ＡへのワークＷの搬送前に、図５の（ａ）欄に示すように水平位置決め機構２３によりチャック機構２２の中心軸ＡＸ２とモータ２４１の回転軸ＡＸ３とを一致させるとともに、３本の可動部材２２１〜２２３を互いに離間させてワークＷの受け入れ準備を行っている。   In this inspection apparatus 100, the arithmetic processing unit 51 controls each part of the apparatus according to an inspection program stored in advance in the memory 52 of the control unit 5, and executes the following operations. Here, with reference to one workpiece W, various operations performed on the workpiece W will be described with reference to FIGS. 4 and 5. As shown in the column (a) of FIG. 5, the control unit 5 has no workpiece W on the holding table 21A positioned at the pre-alignment position PA, and the workpiece detection sensor 11 causes the workpiece W to be uninspected. When it is confirmed that the workpiece W is accommodated in one workpiece accommodating portion, loading of the workpiece W onto the holding table 21A is started (step S1). In this loading step, the loader 12 grips the uninspected workpiece W in the workpiece container and transports it from the loading unit 1 to the holding table 21A. In the present embodiment, in order to smoothly perform the loading step and the subsequent misalignment detection step, the horizontal positioning mechanism as shown in the column (a) of FIG. 5 before the work W is transferred to the holding table 21A. 23, the central axis AX2 of the chuck mechanism 22 and the rotation axis AX3 of the motor 241 are made to coincide with each other, and the three movable members 221 to 223 are separated from each other to prepare for receiving the workpiece W.

ローダ１２によりワークＷが保持テーブル２１Ａに搬送されてくると、チャック機構２２が上記したように３本の可動部材２２１〜２２３を互いに近接移動させてワークＷの軸部Ｗａの一部を挟み込んでワークＷを把持する。より詳しくは、ローディング動作中に、可動部材２２１〜２２３は互いに近接移動し、可動部材２２１〜２２３の各上端面と突起部材２２５とが軸部Ｗａの段差部位に係合してチャック機構２２の中心軸ＡＸ２と軸部Ｗａの軸芯とを一致させながらワークＷを保持する（図５の（ｂ）欄参照）。こうして、ローディング工程が完了し、この完了時点では、モータ２４１の回転軸ＡＸ３、チャック機構２２の中心軸ＡＸ２および軸部Ｗａの軸芯は一致している。しかしながら、鍛造や鋳造処理によって製造されたワークＷでは、例えば図５の（ｂ）欄に示すように歯車Ｗｂの対称軸ＡＸ４が軸部Ｗａの軸芯から外れ、モータ２４１に対するワークＷの芯ズレが発生していることがある。   When the workpiece W is conveyed to the holding table 21A by the loader 12, the chuck mechanism 22 moves the three movable members 221 to 223 close to each other as described above to sandwich a part of the shaft portion Wa of the workpiece W. Hold the workpiece W. More specifically, during the loading operation, the movable members 221 to 223 move close to each other, and the upper end surfaces of the movable members 221 to 223 and the protruding member 225 engage with the stepped portion of the shaft portion Wa, so that the chuck mechanism 22 The workpiece W is held while the center axis AX2 and the axis of the shaft portion Wa coincide with each other (see the column (b) in FIG. 5). Thus, the loading process is completed, and at the time of completion, the rotational axis AX3 of the motor 241, the central axis AX2 of the chuck mechanism 22, and the axis of the shaft portion Wa are aligned. However, in the workpiece W manufactured by forging or casting processing, for example, as shown in the column (b) of FIG. 5, the axis of symmetry AX4 of the gear Wb deviates from the axis of the shaft portion Wa, and the misalignment of the workpiece W with respect to the motor 241 occurs. May occur.

そこで、本実施形態では、アライメント照明部２８（図２）により未検査ワークＷを照明するとともに、保持テーブル２１Ａのモータ２４１により未検査ワークＷを回転させながらアライメントカメラ２７により歯車Ｗｂを撮像し、その画像データをメモリ５２に記憶する（ステップＳ２）。   Therefore, in the present embodiment, the alignment illumination unit 28 (FIG. 2) illuminates the uninspected work W, and the alignment camera 27 images the gear Wb while rotating the uninspected work W by the motor 241 of the holding table 21A. The image data is stored in the memory 52 (step S2).

この撮像完了後に、旋回駆動部２６２により第１ポジションから第２ポジションへの切替を行う。すなわち、旋回駆動部２６２が支持プレート２６１を旋回軸ＡＸ１まわりに１８０゜旋回させ、これによって図５の（ｃ）欄に示すように未検査のワークＷを保持する保持テーブル２１Ａがプリアライメント位置ＰＡから検査位置ＰＩに移動するとともに昇降部２５４によってワークＷを撮像ユニット３により撮像可能な高さ位置に移動させる（ステップＳ３）。   After this imaging is completed, the turning drive unit 262 switches from the first position to the second position. That is, the turning drive unit 262 turns the support plate 261 about the turning axis AX1 by 180 °, whereby the holding table 21A holding the uninspected work W is moved to the pre-alignment position PA as shown in the column (c) of FIG. Then, the workpiece W is moved to a height position where it can be imaged by the imaging unit 3 by the elevating unit 254 (step S3).

また、本実施形態では、上記移動と並行して、メモリ５２からワークＷの画像データを読み出し、回転機構２４（モータ２４１）に対するワークＷの芯ズレ（本実施形態では、ズレ量Δとズレ方向とを含む情報に相当）を検出し（ステップＳ４）、それに続いて保持テーブル２１Ａにおける芯ズレ補正を行う（ステップＳ５）。この芯ズレ補正は上記ステップＳ４で検出された芯ズレを解消するように水平位置決め機構２３によりチャック機構２２を移動させる。これによって、図５の（ｃ）欄に示すように、保持テーブル２１Ａが検査位置ＰＩに到達した時点あるいは到達前後で歯車Ｗｂの対称軸とモータ２４１の回転軸とが一致し、直ちにワーク撮像工程（ステップＳ６）を開始することができる。   In this embodiment, in parallel with the above movement, the image data of the workpiece W is read from the memory 52, and the center displacement of the workpiece W with respect to the rotation mechanism 24 (motor 241) (in this embodiment, the displacement amount Δ and the displacement direction). Is detected (step S4), and subsequently, misalignment correction is performed on the holding table 21A (step S5). In this misalignment correction, the horizontal positioning mechanism 23 moves the chuck mechanism 22 so as to eliminate the misalignment detected in step S4. As a result, as shown in the column (c) of FIG. 5, the symmetrical axis of the gear Wb coincides with the rotational axis of the motor 241 when the holding table 21A reaches the inspection position PI or before and after reaching the inspection position PI. (Step S6) can be started.

このステップＳ６では、検査位置ＰＩに位置決めされた保持テーブル２１Ａの回転機構２４が作動し、ワーク回転を開始する。このとき、保持テーブル２１Ａに保持されたワークＷは上記芯ズレ補正を受けた、いわゆる芯出し状態であり、対称軸ＡＸ４まわりに回転する。また、その回転に対応して複数の検査照明部３２が点灯して回転中のワークＷを複数の方向から照明する。なお、ここではワーク回転後に検査照明部３２を点灯させているが、点灯タイミングはこれに限定されるものではなく、回転開始と同時、あるいは回転開始前に検査照明部３２の点灯を開始してもよい。   In this step S6, the rotation mechanism 24 of the holding table 21A positioned at the inspection position PI is actuated to start the work rotation. At this time, the workpiece W held on the holding table 21A is in a so-called centering state that has undergone the above-described centering correction, and rotates around the symmetry axis AX4. In response to the rotation, the plurality of inspection illumination units 32 are lit to illuminate the rotating workpiece W from a plurality of directions. Here, the inspection illumination unit 32 is turned on after the workpiece is rotated. However, the lighting timing is not limited to this, and lighting of the inspection illumination unit 32 is started simultaneously with the start of rotation or before the start of rotation. Also good.

こうしてワークＷの回転と照明とを行っている間に、複数の検査カメラ３１がワークＷを種々の方向から撮像し、複数方向からのワークＷの画像（以下「ワーク画像」という）の画像データを制御ユニット５に送信する。一方、制御ユニット５では上記画像データをメモリ５２に記憶し、以下のタイミングで当該画像データに基づいてワークＷの検査を行う。   While the workpiece W is rotated and illuminated in this way, the plurality of inspection cameras 31 capture the workpiece W from various directions, and image data of the workpiece W image (hereinafter referred to as “work image”) from a plurality of directions. Is transmitted to the control unit 5. On the other hand, the control unit 5 stores the image data in the memory 52 and inspects the workpiece W based on the image data at the following timing.

こうした画像取得後、保持テーブル２１Ａではワーク回転が停止され、撮像ユニット３では検査照明部３２が消灯される。また、旋回駆動部２６２が支持プレート２６１を旋回軸ＡＸ１まわりに１８０゜反転旋回させ、これによって保持テーブル２１Ａが検査済のワークＷを保持したまま検査位置ＰＩからプリアライメント位置ＰＡに移動するとともに昇降部２５４によってワークＷが元の高さ位置に移動する（ステップＳ７）。このワークＷの移動と並行して、制御ユニット５はメモリ５２から画像データを読み出し、ワーク画像に基づいて歯車Ｗｂに傷や欠陥などが存在しているか否かを判定して保持テーブル２１Ａに保持されたワークＷについてワーク検査を行う（ステップＳ８）。   After such an image acquisition, the work rotation is stopped on the holding table 21A, and the inspection illumination unit 32 is turned off in the imaging unit 3. In addition, the turning drive unit 262 turns the support plate 261 180 ° around the turning axis AX1, thereby moving the holding table 21A from the inspection position PI to the pre-alignment position PA while holding the inspected workpiece W and moving up and down. The workpiece W is moved to the original height position by the portion 254 (step S7). In parallel with the movement of the workpiece W, the control unit 5 reads out the image data from the memory 52, determines whether there is a scratch or a defect on the gear Wb based on the workpiece image, and holds it in the holding table 21A. The workpiece inspection is performed on the workpiece W (step S8).

プリアライメント位置ＰＡに戻ってきたワークＷはアンローダ４２によって把持された後、可動部材２２１〜２２３による把持の解除により保持テーブル２１Ａからアンローダ４２に受け渡される。それに続いて、アンローダ４２がワークＷをアンローディングユニット４に搬送し、ワーク収容部（図示省略）に搬送する（ステップＳ９）。上記した一連の工程（ステップＳ１〜Ｓ９）が保持テーブル２１Ａ、２１Ｂにより交互に繰り返される。   The workpiece W that has returned to the pre-alignment position PA is gripped by the unloader 42, and then transferred from the holding table 21A to the unloader 42 by releasing the gripping by the movable members 221 to 223. Subsequently, the unloader 42 conveys the workpiece W to the unloading unit 4 and conveys it to the workpiece accommodating portion (not shown) (step S9). The series of steps described above (steps S1 to S9) are alternately repeated by the holding tables 21A and 21B.

以上のように、本実施形態では、保持テーブル２１Ａ、２１ＢによりワークＷを回転軸ＡＸ３まわりに回転させながら撮像して得られたワークＷの画像に基づいて回転軸ＡＸ３に対する対称軸ＡＸ４のズレ、つまり芯ズレを検出している。また、保持テーブル２１Ａ、２１Ｂでは、水平位置決め機構２３が設けられ、上記芯ズレを解消するようにチャック機構２２を回転軸ＡＸ３に対して直交する方向（本実施形態では、水平方向）に移動させてワーク位置補正を行っている。その結果、ワークＷの対称軸ＡＸ４とモータ２４１の回転軸ＡＸ３とを高精度に一致させることができる。   As described above, in the present embodiment, the shift of the symmetry axis AX4 with respect to the rotation axis AX3 based on the image of the work W obtained by imaging while rotating the workpiece W around the rotation axis AX3 by the holding tables 21A and 21B, That is, the misalignment is detected. Further, the holding tables 21A and 21B are provided with a horizontal positioning mechanism 23, and the chuck mechanism 22 is moved in a direction orthogonal to the rotation axis AX3 (in this embodiment, in the horizontal direction) so as to eliminate the misalignment. To correct the workpiece position. As a result, the symmetry axis AX4 of the workpiece W and the rotation axis AX3 of the motor 241 can be matched with high accuracy.

また、本実施形態では、３本の可動部材２２１〜２２３を同時に中心軸ＡＸ２に向けて移動させることでワークＷを保持しており、ワークＷの対称軸ＡＸ４を中心軸ＡＸ２に接近させることができる。しかも、回転軸ＡＸ３に対して中心軸ＡＸ２を一致させた状態で可動部材２２１〜２２３により保持されたワークＷを回転させながら撮像している。これらの構成を有することで、アライメントカメラ２７によりワークＷを確実に撮像することができ、上記芯ズレの検出を良好に行うことができる。   In the present embodiment, the workpiece W is held by simultaneously moving the three movable members 221 to 223 toward the central axis AX2, and the symmetry axis AX4 of the workpiece W can be moved closer to the central axis AX2. it can. In addition, imaging is performed while rotating the workpiece W held by the movable members 221 to 223 in a state where the central axis AX2 coincides with the rotation axis AX3. By having these configurations, the workpiece W can be reliably imaged by the alignment camera 27, and the above-described misalignment can be detected satisfactorily.

また、本実施形態では、保持テーブル２１Ａ、２１Ｂをプリアライメント位置ＰＡから検査位置ＰＩに移動している間に、芯ズレの検出および補正によるワークＷの位置補正を並行して行っている。このため、タクトタイムを短縮することができる。なお、アライメントカメラ２７により撮像されたワークＷの画像に基づき芯ズレを検出した後に、保持テーブル２１Ａ、２１Ｂの検査位置ＰＩへの移動を開始し、その移動中に芯ズレの補正を行ってもよく、同様の作用効果が得られる。つまり、保持テーブル２１Ａ、２１Ｂのプリアライメント位置ＰＡから検査位置ＰＩへの移動と並行して、芯ズレの検出および芯ズレの補正（ワークＷの位置補正）の少なくとも一部を実行することでタクトタイムの短縮を図ることができる。   In the present embodiment, while the holding tables 21A and 21B are moved from the pre-alignment position PA to the inspection position PI, the position correction of the workpiece W by detecting and correcting the misalignment is performed in parallel. For this reason, tact time can be shortened. In addition, after detecting the misalignment based on the image of the workpiece W imaged by the alignment camera 27, the movement of the holding tables 21A and 21B to the inspection position PI is started, and the misalignment is corrected during the movement. Well, the same effect can be obtained. In other words, in parallel with the movement of the holding tables 21A and 21B from the pre-alignment position PA to the inspection position PI, tact is detected by executing at least a part of detection of misalignment and correction of misalignment (position correction of the workpiece W). Time can be shortened.

このように本実施形態における水平位置決め機構２３が本発明の「位置決め機構」の一例に相当している。アライメントカメラ２７および検査カメラ３１がそれぞれ本発明の「アライメント用撮像部」および「検査用撮像部」の一例に相当している。ポジション切替機構２６が本発明の「テーブル移動機構」として機能しており、プリアライメント位置ＰＡと、本発明の「非プリアライメント位置」の一例に相当する検査位置ＰＩとの間で保持テーブル２１Ａ、２１Ｂを移動させる。また、ワーク保持ユニット２と制御ユニット５とにより本発明の「ワーク保持装置」が構成されており、特に制御ユニット５の演算処理部５１が本発明の「芯ズレ検出部」および「ワーク位置補正部」として機能している。さらに、制御ユニット５は本発明の「ワーク検査部」として機能する。   Thus, the horizontal positioning mechanism 23 in the present embodiment corresponds to an example of the “positioning mechanism” of the present invention. The alignment camera 27 and the inspection camera 31 correspond to examples of the “alignment imaging unit” and the “inspection imaging unit” of the present invention, respectively. The position switching mechanism 26 functions as the “table moving mechanism” of the present invention, and the holding table 21A between the pre-alignment position PA and the inspection position PI corresponding to an example of the “non-pre-alignment position” of the present invention, 21B is moved. The workpiece holding unit 2 and the control unit 5 constitute the “work holding device” of the present invention. In particular, the arithmetic processing unit 51 of the control unit 5 includes the “center misalignment detecting unit” and the “work position correction” of the present invention. Part ". Furthermore, the control unit 5 functions as a “work inspection unit” of the present invention.

なお、本発明は上記した実施形態に限定されるものではなく、その趣旨を逸脱しない限りにおいて上述したもの以外に種々の変更を行うことが可能である。例えば上記実施形態では、歯車Ｗｂを有するワークＷを保持するワーク保持装置および当該装置を装備する検査装置に対して本発明を適用しているが、ワークＷの種類はこれに限定されるものではなく、本発明の「ワーク」には、対称軸まわりに回転対称な外周部を有するワーク全般が含まれる。   The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, in the above embodiment, the present invention is applied to the workpiece holding device that holds the workpiece W having the gear Wb and the inspection device equipped with the device, but the type of the workpiece W is not limited to this. Rather, the “workpiece” of the present invention includes all works having an outer peripheral portion that is rotationally symmetric about the symmetry axis.

また、上記実施形態では、３本の可動部材２２１〜２２３によりワークＷを保持するように構成しているが、２本あるいは４本以上の可動部材によりワークＷを保持するように構成してもよい。   Moreover, in the said embodiment, although comprised so that the workpiece | work W may be hold | maintained by the three movable members 221-223, even if comprised so that the workpiece | work W may be hold | maintained by two or four or more movable members. Good.

また、上記実施形態では、２つの保持テーブル２１Ａ、２１Ｂを交互にプリアライメント位置ＰＡに位置させて芯ズレを検出する検査装置１００に本発明に係るワーク保持装置やワーク位置補正方法を適用しているが、単一あるいは３つ以上の保持テーブルを有するワーク保持装置や検査装置に対しても本発明を適用することができる。   In the above embodiment, the workpiece holding device and the workpiece position correcting method according to the present invention are applied to the inspection device 100 that detects the misalignment by alternately positioning the two holding tables 21A and 21B at the pre-alignment position PA. However, the present invention can also be applied to a work holding device or an inspection device having a single or three or more holding tables.

また、上記実施形態では、プリアライメント位置ＰＡを検査位置ＰＩから離間させた検査装置１００に本発明を適用しているが、プリアライメント位置ＰＡを検査位置ＰＩと一致させる、つまり検査位置で芯ズレ検出および芯ズレ補正を行った後で検査処理を行う検査装置にも本発明を適用することができる。また、このように構成された検査装置では、検査カメラ３１の一部をアライメントカメラ２７としても機能させてもよい。   In the above embodiment, the present invention is applied to the inspection apparatus 100 in which the pre-alignment position PA is separated from the inspection position PI. However, the pre-alignment position PA is matched with the inspection position PI, that is, the misalignment at the inspection position is performed. The present invention can also be applied to an inspection apparatus that performs an inspection process after performing detection and misalignment correction. In the inspection apparatus configured as described above, a part of the inspection camera 31 may function as the alignment camera 27.

この発明は、対称軸まわりに回転対称な外周部を有するワークを保持しながら回転軸まわりに回転させるワーク保持装置、当該ワーク保持装置に保持されたワークを検査する検査装置ならびに当該ワーク保持装置におけるワーク位置補正方法全般に適用することができる。   The present invention relates to a workpiece holding device that rotates around a rotation axis while holding a workpiece having a rotationally symmetric outer periphery around a symmetry axis, an inspection device that inspects a workpiece held by the workpiece holding device, and the workpiece holding device. It can be applied to all work position correction methods.

５…制御ユニット（ワーク検査部）
２１Ａ，２１Ｂ…保持テーブル
２２…チャック機構
２３…水平位置決め機構
２４…回転機構
２７…アライメントカメラ（アライメント用撮像部）
３１…検査カメラ（検査用撮像部）
５１…演算処理部（芯ズレ検出部、ワーク位置補正部）
１００…検査装置
２２１〜２２３…可動部材
２７１…ラインセンサ
ＡＸ２…（チャック機構の）中心軸
ＡＸ３…（モータ２４１の）回転軸
ＡＸ４…対称軸
ＰＡ…プリアライメント位置
ＰＩ…検査位置（非プリアライメント位置）
Ｗ…ワーク
Δ…ズレ量 5. Control unit (work inspection part)
21A, 21B ... Holding table 22 ... Chuck mechanism 23 ... Horizontal positioning mechanism 24 ... Rotating mechanism 27 ... Alignment camera (imaging part for alignment)
31 ... Inspection camera (inspection imaging unit)
51. Arithmetic processing unit (core misalignment detection unit, work position correction unit)
DESCRIPTION OF SYMBOLS 100 ... Inspection apparatus 221-223 ... Movable member 271 ... Line sensor AX2 ... Center axis (of chuck mechanism) AX3 ... Rotation axis (of motor 241) AX4 ... Symmetric axis PA ... Pre-alignment position PI ... Inspection position (non-pre-alignment position) )
W ... Work Δ ... Misalignment

Claims (6)

対称軸まわりに回転対称な外周部を有するワークを保持して回転軸まわりに回転させるワーク保持装置であって、
前記ワークを保持するチャック機構と、前記チャック機構を支持しながら前記回転軸と直交する方向に前記チャック機構を移動させて前記ワークを位置決めする位置決め機構と、前記位置決め機構を前記回転軸まわりに回転させることで前記チャック機構に保持された前記ワークを前記回転軸まわりに回転させる回転機構とを有する保持テーブルと、
前記チャック機構に保持された前記ワークの前記外周部を撮像するアライメント用撮像部と、
前記回転機構により回転される前記ワークを前記アライメント用撮像部で撮像することで取得される画像に基づいて前記回転軸に対する前記対称軸の芯ズレを検出する芯ズレ検出部と、
前記芯ズレを解消するように前記位置決め機構により前記チャック機構を移動させて前記対称軸が前記回転軸と一致するように前記ワークの位置補正を行うワーク位置補正部と、
を備えることを特徴とするワーク保持装置。 A workpiece holding device that holds a workpiece having a rotationally symmetric outer periphery around a symmetry axis and rotates the workpiece around a rotation axis,
A chuck mechanism for holding the workpiece, a positioning mechanism for positioning the workpiece by moving the chuck mechanism in a direction orthogonal to the rotation axis while supporting the chuck mechanism, and rotating the positioning mechanism around the rotation axis A holding table having a rotation mechanism that rotates the workpiece held by the chuck mechanism around the rotation axis,
An imaging unit for alignment that images the outer peripheral portion of the workpiece held by the chuck mechanism;
A misalignment detection unit that detects a misalignment of the symmetry axis with respect to the rotation axis based on an image acquired by imaging the workpiece rotated by the rotation mechanism with the imaging unit for alignment;
A workpiece position correcting unit that corrects the position of the workpiece so that the axis of symmetry coincides with the rotation axis by moving the chuck mechanism by the positioning mechanism so as to eliminate the misalignment;
A workpiece holding device comprising: 請求項１に記載のワーク保持装置であって、
前記チャック機構は、複数の可動部材と、前記複数の可動部材を中心軸に対して近接および離間させる移動部とを有し、前記移動部により前記複数の可動部材を同時にそれぞれ前記中心軸に向かって移動させて前記ワークを保持するワーク保持装置。 The work holding device according to claim 1,
The chuck mechanism includes a plurality of movable members and a moving unit that moves the plurality of movable members toward and away from a central axis, and the movable unit simultaneously moves the plurality of movable members toward the central axis. A workpiece holding device that holds the workpiece by moving the workpiece. 請求項２に記載のワーク保持装置であって、
前記芯ズレ検出部は、前記複数の可動部材により保持された前記ワークを、前記回転軸に対して前記中心軸が一致するように位置決めした状態で前記回転機構により回転させるワーク保持装置。 The work holding device according to claim 2,
The core misalignment detection unit is a work holding device that rotates the work held by the plurality of movable members by the rotation mechanism in a state where the work is positioned so that the central axis coincides with the rotation axis. 請求項１ないし３のいずれか一項に記載のワーク保持装置であって、
前記アライメント用撮像部による前記ワークの撮像を行うプリアライメント位置と、前記プリアライメント位置から離間した非プリアライメント位置との間で、前記保持テーブルを移動させるテーブル移動機構をさらに備え、
前記保持テーブルを前記プリアライメント位置から前記非プリアライメント位置に移動している間に、前記芯ズレの検出および前記ワークの位置補正の少なくとも一部が並行して実行されるワーク保持装置。 The work holding device according to any one of claims 1 to 3,
A table moving mechanism for moving the holding table between a pre-alignment position where the workpiece is imaged by the alignment imaging unit and a non-pre-alignment position separated from the pre-alignment position;
A workpiece holding device in which at least a part of the detection of the misalignment and the correction of the position of the workpiece are executed in parallel while the holding table is moved from the pre-alignment position to the non-pre-alignment position. 対称軸まわりに回転対称な外周部を有するワークを検査する検査装置であって、
請求項１ないし４のいずれか一項に記載されたワーク保持装置と、
前記ワーク保持装置により前記対称軸を前記回転軸と一致させた状態で前記回転軸まわりに回転される前記ワークを撮像する検査用撮像部と、
前記検査用撮像部により撮像された画像に基づいて前記ワークを検査するワーク検査部と、
を備えることを特徴とする検査装置。 An inspection apparatus for inspecting a workpiece having a rotationally symmetric outer periphery around a symmetry axis,
The work holding device according to any one of claims 1 to 4,
An inspection imaging unit that images the workpiece rotated around the rotation axis in a state in which the axis of symmetry coincides with the rotation axis by the workpiece holding device;
A workpiece inspection unit that inspects the workpiece based on an image captured by the inspection imaging unit;
An inspection apparatus comprising: 対称軸まわりに回転対称な外周部を有するワークを保持して回転軸まわりに回転させるワーク保持装置におけるワーク位置補正方法であって、
前記ワーク保持装置のチャック機構により前記ワークを保持する第１工程と、
前記ワークを保持した前記チャック機構を前記回転軸まわりに回転させながら前記ワークの前記外周部を撮像して得られる画像に基づいて前記回転軸に対する前記対称軸の芯ズレを検出する第２工程と、
前記芯ズレを解消するように前記チャック機構を前記回転軸に対して直交する方向に移動させて前記対称軸を前記回転軸に一致させる第３工程と
を備えることを特徴とするワーク位置補正方法。 A workpiece position correction method in a workpiece holding device that holds a workpiece having a rotationally symmetric outer peripheral portion around a symmetry axis and rotates the workpiece around a rotation axis,
A first step of holding the workpiece by a chuck mechanism of the workpiece holding device;
A second step of detecting a misalignment of the symmetric axis with respect to the rotation axis based on an image obtained by imaging the outer peripheral portion of the work while rotating the chuck mechanism holding the workpiece around the rotation axis; ,
And a third step of moving the chuck mechanism in a direction orthogonal to the rotation axis so as to eliminate the misalignment, and aligning the symmetry axis with the rotation axis. .
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022052981A (en) * 2020-09-24 2022-04-05 旭精機工業株式会社 Boring system

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6598898B2 (en) * 2018-02-27 2019-10-30 株式会社Ｓｃｒｅｅｎホールディングス Core misalignment detection apparatus and core misalignment detection method
JP7161956B2 (en) * 2019-02-22 2022-10-27 株式会社Ｓｃｒｅｅｎホールディングス Inspection device and inspection method
CN111928796B (en) * 2020-09-27 2021-01-01 山东海德智汇智能装备有限公司 Part high-precision identification and detection system based on 3D scanning and laser manufacturing

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5452521A (en) * 1994-03-09 1995-09-26 Niewmierzycki; Leszek Workpiece alignment structure and method
JP2002280440A (en) * 2001-03-16 2002-09-27 Matsushita Electric Ind Co Ltd Method for automatically controlling positional correction of rotary stage in inspection instrument
JP2008039447A (en) * 2006-08-02 2008-02-21 Seiko Epson Corp Clamping mechanism and measuring device
JP2008082900A (en) * 2006-09-27 2008-04-10 Sumitomo Electric Ind Ltd Appearance inspecting apparatus
JP2010019559A (en) * 2008-07-08 2010-01-28 J-Net:Kk Measurement device
JP2010223915A (en) * 2009-03-25 2010-10-07 Fujifilm Corp Method and device for measuring positional variation of center line of rotation
US20110304856A1 (en) * 2010-06-14 2011-12-15 Fujifilm Corporation Lightwave interference measurement apparatus
JP2012002548A (en) * 2010-06-14 2012-01-05 Fujifilm Corp Light wave interference measurement device
JP2012187599A (en) * 2011-03-09 2012-10-04 Toshiba Corp Remote laser processing device
JP2014178150A (en) * 2013-03-13 2014-09-25 Aron Denki Co Ltd Cutting tool inspection device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4887904A (en) * 1985-08-23 1989-12-19 Canon Kabushiki Kaisha Device for positioning a semi-conductor wafer
US6357996B2 (en) * 1999-05-14 2002-03-19 Newport Corporation Edge gripping specimen prealigner
DE50113968D1 (en) * 2001-03-05 2008-06-26 Illinois Tool Works chuck
JP2002350110A (en) * 2001-05-28 2002-12-04 Tokyo Seimitsu Co Ltd Method and device for detecting center of work
US7119566B2 (en) * 2002-03-22 2006-10-10 Electro Scientific Industries, Inc. Test probe alignment apparatus
KR20110010749A (en) * 2008-04-30 2011-02-07 가부시키가이샤 니콘 Observation device and observation method
US8723946B2 (en) 2010-09-16 2014-05-13 Honda Motor Co., Ltd. Workpiece inspecting apparatus and workpiece inspecting method
JP5564373B2 (en) 2010-09-16 2014-07-30 本田技研工業株式会社 Work inspection device
JP6358445B2 (en) 2016-12-09 2018-07-18 株式会社三洋物産 Game machine

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5452521A (en) * 1994-03-09 1995-09-26 Niewmierzycki; Leszek Workpiece alignment structure and method
JP2002280440A (en) * 2001-03-16 2002-09-27 Matsushita Electric Ind Co Ltd Method for automatically controlling positional correction of rotary stage in inspection instrument
JP2008039447A (en) * 2006-08-02 2008-02-21 Seiko Epson Corp Clamping mechanism and measuring device
JP2008082900A (en) * 2006-09-27 2008-04-10 Sumitomo Electric Ind Ltd Appearance inspecting apparatus
JP2010019559A (en) * 2008-07-08 2010-01-28 J-Net:Kk Measurement device
JP2010223915A (en) * 2009-03-25 2010-10-07 Fujifilm Corp Method and device for measuring positional variation of center line of rotation
US20110304856A1 (en) * 2010-06-14 2011-12-15 Fujifilm Corporation Lightwave interference measurement apparatus
JP2012002548A (en) * 2010-06-14 2012-01-05 Fujifilm Corp Light wave interference measurement device
JP2012187599A (en) * 2011-03-09 2012-10-04 Toshiba Corp Remote laser processing device
JP2014178150A (en) * 2013-03-13 2014-09-25 Aron Denki Co Ltd Cutting tool inspection device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022052981A (en) * 2020-09-24 2022-04-05 旭精機工業株式会社 Boring system
JP7204309B2 (en) 2020-09-24 2023-01-16 旭精機工業株式会社 Drilling system

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TW201843437A (en) 2018-12-16
TWI663393B (en) 2019-06-21
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US10658219B2 (en) 2020-05-19
EP3598109B1 (en) 2023-10-18

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