JP2018148132A - Substrate processing apparatus and substrate processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate processing apparatus and a substrate processing method which can protect a lower surface of a substrate successfully.SOLUTION: A substrate processing apparatus comprises: a spin base 21 which is rotatable around a rotation axis A1 in a vertical direction; a plurality of holding pins 20 which are provided on the spin base 21 and arranged at intervals in a rotation direction S of a substrate W to hold a periphery of the substrate W; and a protection disk 10 (opposite member) which faces at least the periphery of the substrate W from below. The protection disk 10 can be lifted between a separated position separated downward from the substrate W and a close position closer to the substrate W than the separated position. The substrate processing apparatus further comprises first entry restriction members 12 for restricting entry of an air current to a space A between a lower surface of the substrate W and the protection disk 10 in a state where the protection disk 10 is located at the close position.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a substrate processing apparatus and a substrate processing method for processing a substrate. Examples of substrates to be processed include semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, and photomasks. Substrates such as substrates for substrates, ceramic substrates, and substrates for solar cells are included.

A single-wafer type substrate processing apparatus that processes substrates one by one includes a spin base that can rotate around a rotation axis along the vertical direction, and a holding pin that is provided on the spin base and holds the substrate. In the substrate processing using such a substrate processing apparatus, the upper surface of the rotating substrate can be processed by the processing liquid discharged from the processing liquid nozzle.
However, during the substrate processing, an air flow is generated around the rotating structure (spin base and holding pin), and the mist (micro droplets) of the processing solution generated during the substrate processing rides on the air flow and moves on the substrate. The processing liquid may wrap around and adhere to the lower surface of the substrate. Therefore, even if it is a case where it adheres to the lower surface of a board | substrate along the upper surface and periphery of a board | substrate, there exists a possibility that a process liquid may adhere to the lower surface of a board | substrate.

  Therefore, in the substrate processing apparatus described in Patent Document 1 below, substrate processing is proposed in which a protective disk is provided between the lower surface of the substrate and the spin base, thereby processing the upper surface of the substrate while protecting the lower surface of the substrate. Yes.

Japanese Patent Laid-Open No. 2015-2328

  In the substrate processing apparatus described in Patent Document 1, the mist of the processing liquid is prevented from entering the space between the protective disk and the lower surface of the substrate by floating the protective disk from the spin base and approaching the lower surface of the substrate. can do. However, even when the protective disk is brought close to the lower surface of the substrate, a gap is provided between the protective disk and the substrate. Therefore, the mist of the processing liquid may adhere to the lower surface of the substrate through the gap.

  Accordingly, one object of the present invention is to provide a substrate processing apparatus and a substrate processing method capable of satisfactorily protecting the lower surface of the substrate.

  The present invention provides a base that rotates about a rotation axis along a vertical direction, and a plurality of bases that are provided in the base and spaced apart from each other in the rotational direction of the base, and that hold the peripheral edge of the substrate above the base. The holding pin is disposed between the base and the substrate and can be moved up and down between a separation position spaced downward from the substrate and a proximity position closer to the substrate than the separation position. A counter member facing from below, and a counter member provided on the counter member, wherein the counter member is positioned in the proximity position to suppress the inflow of airflow into the space between the lower surface of the substrate and the counter member. There is provided a substrate processing apparatus including an ingress suppression member.

  According to this configuration, the base can rotate around the rotation axis in a state where the peripheral edge of the substrate is held by the plurality of holding pins. As described above, an air flow is generated around the rotating structure. For example, an airflow that flows between the lower surface of the substrate and the opposing member tends to be generated from the outside in the rotation radial direction of the substrate. In a state in which the facing member is positioned at the close position, the first intrusion suppressing member suppresses the inflow of airflow into the space between the lower surface of the substrate and the facing member. Therefore, the liquid can also be prevented from entering the space between the lower surface of the substrate and the opposing member by riding on the airflow. Therefore, the lower surface of the substrate can be well protected.

In addition, the rotation diameter direction is a direction orthogonal to the rotation axis. Further, the inner side in the rotational radial direction is a direction toward the rotational axis in the rotational radial direction. Further, the outward direction in the rotational radial direction is a direction toward the side opposite to the rotational axis side in the rotational radial direction.
In one embodiment of the present invention, the first entry suppression member is closer to the lower surface of the substrate as it goes outward in the rotational radial direction of the substrate and the first fixing portion fixed to the opposing member. A first elastic contact portion extending from the first fixed portion and elastically contacting a peripheral portion of the lower surface of the substrate.

  According to this configuration, the first elastic contact portion extends from the first fixing portion so as to approach the lower surface of the substrate as it goes outward from the first fixing portion in the rotation radial direction of the substrate. Therefore, when an air flow directed outward in the rotational radial direction is generated between the lower surface of the substrate and the opposing member, the air flow easily enters between the first elastic contact portion and the lower surface of the substrate. The airflow is first such that a gap having a width necessary to pass between the first elastic contact portion and the lower surface of the substrate is formed between the first elastic contact portion and the lower surface of the substrate. The elastic contact portion is elastically deformed. And this airflow is discharged | emitted outside from the space between the lower surface of a board | substrate and an opposing member through the clearance gap. Therefore, it is possible to prevent an excessive increase in pressure between the lower surface of the substrate and the opposing member, and it is possible to suppress the inflow of airflow into the space between the lower surface of the substrate and the opposing member.

In one Embodiment of this invention, the said 1st approach suppression member is formed with the porous material.
According to this structure, the 1st approach suppression member is formed with the porous material. Therefore, the 1st approach suppression member can let the gas pass by receiving the pressure more than a predetermined value from gas. An air flow directed outward in the radial direction is generated between the lower surface of the substrate and the opposing member. Due to this air flow, the pressure between the lower surface of the substrate and the opposing member around the first entry suppression member is a predetermined value. May be more than the value. In this case, the gas in the space between the lower surface of the substrate and the opposing member passes through the first entry suppressing member and is discharged to the outside. On the other hand, the first entry suppression member can suppress the entry of airflow into the space between the lower surface of the substrate and the opposing member. Therefore, it is possible to prevent an excessive increase in pressure between the lower surface of the substrate and the opposing member, and it is possible to suppress the inflow of airflow into the space between the lower surface of the substrate and the opposing member.

Moreover, since the 1st entrance suppression member is formed with the porous material, it is hard to let a liquid pass. Therefore, it is possible to further suppress the entry of the liquid from the outside into the space between the lower surface of the substrate and the opposing member.
In one embodiment of the present invention, the substrate processing apparatus is provided on the holding pin, and is between the peripheral edge on the lower surface of the substrate and the holding pin and between the peripheral edge on the lower surface of the substrate and the opposing member. It further includes a second entry suppression member that suppresses the entry of the airflow into the space.

According to this configuration, the second entry suppressing member suppresses the inflow of airflow from between the peripheral edge portion of the lower surface of the substrate and the holding pin to the space between the lower surface of the substrate and the opposing member. Therefore, it is possible to suppress the liquid from entering the space between the peripheral portion of the lower surface of the substrate and the holding pin and entering the space between the lower surface of the substrate and the opposing member by riding on the airflow.
In one embodiment of the present invention, the second entry suppressing member is closer to the lower surface of the substrate as it goes outward in the rotational radial direction of the substrate and the second fixing portion fixed to the holding pin. A second elastic contact portion extending from the second fixing portion and elastically contacting a peripheral portion of the lower surface of the substrate.

  According to this configuration, the second elastic contact portion extends from the second fixing portion so as to approach the lower surface of the substrate as it goes outward from the second fixing portion in the rotation radial direction of the substrate. Therefore, when an air flow directed outward in the rotational radial direction is generated between the lower surface of the substrate and the opposing member, the air flow easily enters between the second elastic contact portion and the lower surface of the substrate. The airflow is secondly formed such that a gap having a width necessary to pass between the second elastic contact portion and the lower surface of the substrate is formed between the second elastic contact portion and the lower surface of the substrate. The elastic contact portion is elastically deformed. And this airflow is discharged | emitted outside from the space between the lower surface of a board | substrate and an opposing member through the clearance gap. Therefore, the pressure between the lower surface of the substrate and the opposing member can be prevented from becoming excessively large, and the space between the peripheral portion of the lower surface of the substrate and the holding pin and the space between the lower surface of the substrate and the opposing member can be prevented. It is possible to suppress the entry of the airflow into the.

In one Embodiment of this invention, the said 2nd approach suppression member is formed with the porous material.
According to this structure, the 2nd approach suppression member is formed with the porous material. Therefore, the 2nd approach suppression member can let the gas pass by receiving the pressure more than a predetermined value from gas. An airflow directed outward in the radial direction is generated between the lower surface of the substrate and the opposing member, and due to this airflow, the pressure between the lower surface of the substrate and the opposing member around the second entry suppression member is predetermined. May be more than the value. In this case, the gas in the space between the lower surface of the substrate and the counter member is discharged outside from the space between the lower surface of the substrate and the counter member. On the other hand, it is possible to suppress the airflow from entering the space between the lower surface of the substrate and the facing member. Therefore, the pressure between the lower surface of the substrate and the opposing member can be prevented from becoming excessively large, and the space between the peripheral portion of the lower surface of the substrate and the holding pin and the space between the lower surface of the substrate and the opposing member can be prevented. It is possible to suppress the entry of the airflow into the.

Moreover, since the 2nd approach suppression member is formed with the porous material, it is hard to let a liquid pass. Therefore, it is possible to further suppress the entry of the liquid from the outside into the space between the lower surface of the substrate and the opposing member.
In one embodiment of the present invention, the first entry suppression member prevents an air flow from entering a space between the lower surface of the substrate and the opposing member in a region between the holding pins adjacent in the rotation direction. Suppress. And the said 2nd approach suppression member suppresses the approach of the airflow to the space between the lower surface of the said board | substrate and the said opposing member in the circumference | surroundings of each said holding pin.

  According to this configuration, the first entry suppressing member suppresses the entry of the airflow into the space between the lower surface of the substrate and the opposing member in the region between the holding pins adjacent in the rotation direction. And a 2nd approach suppression member suppresses approach of the air current to the space between the lower surface of a board | substrate and an opposing member in the circumference | surroundings of a holding pin. Therefore, in the relatively wide range (substantially the entire circumference) in the rotation direction, it is possible to suppress the inflow of airflow into the space between the lower surface of the substrate and the opposing member.

In one embodiment of the present invention, the substrate processing apparatus further includes a gas supply unit that supplies a gas between the counter member and the substrate.
According to this configuration, the gas is supplied between the facing member and the substrate by the gas supply unit. By supplying the gas between the facing member and the substrate, an air flow from the space between the lower surface of the substrate and the facing member toward the outside of the space can be generated. Therefore, it is possible to suppress the inflow of airflow into the space between the lower surface of the substrate and the opposing member.

  A substrate holding step of holding a peripheral portion of the substrate above the base by a plurality of holding pins provided on the base spaced apart from each other in the rotation direction around the rotation axis along the vertical direction; A proximity step in which the opposing member is brought close to the substrate so that an elastic member fixed to the opposing opposing member contacts the lower surface of the substrate; and the plurality of holding pins hold the peripheral edge of the substrate; and A substrate rotating step of rotating the substrate by rotating the base while the elastic member is in contact with the lower surface of the substrate, and a processing liquid supplying step of supplying a processing liquid for processing the substrate to the upper surface of the rotating substrate A substrate processing method is provided.

  According to this method, the substrate is rotated while the elastic member is in contact with the lower surface of the substrate. As described above, an air flow is generated around the rotating structure. For example, an airflow that flows between the lower surface of the substrate and the opposing member tends to be generated from the outside in the rotation radial direction of the substrate. By bringing the elastic member into contact with the lower surface of the substrate, the space between the elastic member and the substrate is closed, so that the space between the lower surface of the substrate and the opposing member is closed. Therefore, it is possible to suppress the inflow of airflow into the space between the lower surface of the substrate and the opposing member. Therefore, even when the rotating substrate is processed with the processing liquid, it is possible to prevent the mist of the processing liquid from entering the space between the lower surface of the substrate and the opposing member by riding on the airflow. Therefore, the lower surface of the substrate can be well protected.

FIG. 1 is a schematic plan view for explaining the internal layout of the substrate processing apparatus according to the first embodiment of the present invention. FIG. 2 is a schematic diagram for explaining a configuration example of a processing unit provided in the substrate processing apparatus. FIG. 3 is a schematic plan view of a spin base provided in the substrate processing apparatus. 4A is a schematic diagram of a cross section taken along the line IVA-IVA of FIG. FIG. 4B is an enlarged view of the periphery of the first fixing portion of FIG. 4A. FIG. 5 is a schematic diagram of a cross section taken along line VV in FIG. FIG. 6 is a block diagram for explaining an electrical configuration of a main part of the substrate processing apparatus. FIG. 7 is a flowchart for explaining an example of substrate processing by the substrate processing apparatus. FIG. 8 is a schematic diagram of the periphery of the first entry suppressing member according to the first modification of the present embodiment. FIG. 9 is a schematic diagram of the periphery of the second entry suppressing member according to the second modification of the present embodiment. FIG. 10 is a schematic view of the periphery of the second entry suppressing member according to the third modification of the present embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 is an illustrative plan view for explaining an internal layout of a substrate processing apparatus 1 according to an embodiment of the present invention.
The substrate processing apparatus 1 is a single wafer processing apparatus that processes substrates W such as silicon wafers one by one. In this embodiment, the substrate W is a disk-shaped substrate. The substrate processing apparatus 1 has a load on which a plurality of processing units 2 for processing a substrate W with a processing solution such as a chemical solution or a rinsing solution, and a carrier C for storing a plurality of substrates W processed by the processing unit 2 are placed. It includes a port LP, transfer robots IR and CR that transfer the substrate W between the load port LP and the processing unit 2, and a control unit 3 that controls the substrate processing apparatus 1. The transfer robot IR transfers the substrate W between the carrier C and the transfer robot CR. The transfer robot CR transfers the substrate W between the transfer robot IR and the processing unit 2. The plurality of processing units 2 have the same configuration, for example.

FIG. 2 is a schematic diagram for explaining a configuration example of the processing unit 2.
The processing unit 2 includes a spin chuck 5 that rotates the substrate W around a vertical rotation axis A1 that passes through the central portion of the substrate W while holding a single substrate W in a horizontal posture, and deionized water on the upper surface of the substrate W. A treatment liquid supply unit 8 for supplying a treatment liquid such as (Deionized Water: DIW), a cleaning unit 9 for cleaning the upper surface of the substrate W by rubbing the brush 31 on the upper surface of the substrate W, and facing the substrate W from below, It further includes a protection disk 10 that protects the lower surface of the substrate W from a mist of processing liquid generated during the substrate processing. The protective disk 10 is an example of a facing member that faces at least the peripheral edge of the substrate W from below. The processing unit 2 further includes a gas supply unit 11 that supplies a gas such as nitrogen (N ₂ ) gas to the space A between the lower surface of the substrate W and the protective disk 10.

The processing unit 2 further includes a chamber 16 (see FIG. 1) that houses the spin chuck 5. In the chamber 16, an entrance (not shown) for carrying the substrate W into the chamber 16 and carrying the substrate W out of the chamber 16 is formed. The chamber 16 is provided with a shutter unit (not shown) that opens and closes the entrance.
The spin chuck 5 is coupled to a spin base 21 (base) that can rotate around the rotation axis A <b> 1, a plurality of holding pins 20 that hold the periphery of the substrate W above the spin base 21, and the center of the spin base 21. And the electric motor 23 that applies a rotational force to the rotary shaft 22. The rotation shaft 22 extends in the vertical direction along the rotation axis A1. The rotation shaft 22 passes through the spin base 21 and has an upper end above the spin base 21. The spin base 21 has a disk shape along the horizontal direction. The plurality of holding pins 20 are provided on the peripheral edge of the upper surface of the spin base 21 with an interval in the rotation direction S (see also FIG. 3 described later).

In order to open and close the plurality of holding pins 20, an opening / closing unit 25 is provided. The plurality of holding pins 20 hold (clamp) the substrate W by being closed by the opening / closing unit 25. The plurality of holding pins 20 release the holding of the substrate W by being opened by the opening / closing unit 25.
The opening / closing unit 25 includes, for example, a link mechanism (not shown) and a drive source (not shown). The driving source includes, for example, a ball screw mechanism and an electric motor that gives a driving force thereto. The opening / closing unit 25 may be configured to open and close the plurality of holding pins 20 by magnetic force. In this case, the opening / closing unit 25 includes, for example, a first magnet (not shown) attached to the holding pin 20 and a second magnet that applies a repulsive force or an attractive force to the first magnet by approaching the first magnet. (Not shown). The opening and closing of the holding pin 20 is switched by the repulsive force or attractive force that the second magnet applies to the first magnet.

When the rotary shaft 22 is rotated by the electric motor 23, the spin base 21 is rotated. Thus, the substrate W is rotated in the rotation direction S around the rotation axis A1. The spin chuck 5 is included in a substrate holding and rotating unit that holds the substrate W and rotates the substrate W about the rotation axis A1 along the vertical direction.
The processing liquid supply unit 8 is interposed in the processing liquid nozzle 40 for supplying a processing liquid such as DIW to the upper surface of the substrate W, a processing liquid supply pipe 41 coupled to the processing liquid nozzle 40, and the processing liquid supply pipe 41. Treatment liquid valve 42. A processing liquid is supplied to the processing liquid supply pipe 41 from a processing liquid supply source.

The treatment liquid nozzle 40 is a fixed nozzle. Unlike the present embodiment, the treatment liquid nozzle 40 may be a moving nozzle that is movable in the horizontal direction and the vertical direction.
The treatment liquid supplied from the treatment liquid nozzle 40 is not limited to DIW, and is carbonated water, electrolytic ion water, ozone water, hydrochloric acid water having a diluted concentration (for example, about 10 ppm to 100 ppm), and reduced water (hydrogen water). Also good.

The cleaning unit 9 drives the brush 31 for cleaning the upper surface of the substrate W, the brush arm 35 that supports the brush 31, the rotation shaft 36 that rotates the brush arm 35, and the rotation shaft 36. And an arm moving mechanism 37 for moving the brush arm 35 in the horizontal direction and the vertical direction.
The brush 31 is held by a brush holder 32 disposed above the brush 31. The brush holder 32 protrudes downward from the brush arm 35.

The brush 31 is an elastically deformable sponge brush made of a synthetic resin such as PVA (polyvinyl alcohol). The brush 31 protrudes downward from the brush holder 32. The brush 31 is not limited to a sponge brush, and may be a brush including a hair bundle formed by a plurality of resin fibers.
The arm movement mechanism 37 moves the brush arm 35 horizontally by rotating the rotation shaft 36 around the rotation axis A2, and moves the rotation shaft 36 vertically. And a brush vertical drive mechanism (not shown) for moving the brush arm 35 vertically. The brush horizontal drive mechanism includes, for example, an electric motor that rotates the rotation shaft 36. The brush vertical drive mechanism includes, for example, a ball screw mechanism and an electric motor that drives the ball screw mechanism.

The gas supply unit 11 includes a gas nozzle 50 that supplies a gas such as nitrogen gas to a space A between the lower surface of the substrate W and the protective disk 10, a gas supply pipe 51 that is coupled to the gas nozzle 50, and a gas supply pipe 51, and a gas valve 52 that opens and closes a gas flow path. A gas such as nitrogen gas is supplied to the gas supply pipe 51 from a gas supply source.
The gas supplied from the gas supply source to the gas supply pipe 51 is preferably an inert gas such as nitrogen gas. The inert gas is not limited to nitrogen gas but is a gas inert to the lower surface of the substrate W and the devices formed on the lower surface. Examples of the inert gas include, in addition to nitrogen gas, rare gases such as helium and argon, and homing gas (a mixed gas of nitrogen gas and hydrogen gas). Moreover, it is also possible to use air as the gas supplied from the gas supply source to the gas supply pipe 51.

The gas nozzle 50 is inserted through the rotary shaft 22. The upper end of the gas nozzle 50 is exposed from the upper end of the rotating shaft 22. A rectifying member 54 that rectifies the gas discharged from the gas nozzle 50 may be provided above the upper end of the gas nozzle 50.
The protection disk 10 has a substantially annular shape. A rotating shaft 22 is inserted through the protective disk 10. The protective disk 10 is disposed between the substrate W held by the holding pins 20 and the spin base 21. The protective disk 10 can move up and down.

  A protective disk lifting / lowering unit 60 is coupled to the protective disk 10. The protection disk 10 is moved up and down by the protection disk lifting / lowering unit 60, so that the protection disk 10 can be moved between a separation position spaced downward from the substrate W and a proximity position near the lower surface of the substrate W above the separation position. It is. The protection disk lifting / lowering unit 60 is an example of a facing member lifting / lowering unit that lifts and lowers the facing member.

  The protective disk lifting / lowering unit 60 includes, for example, a ball screw mechanism (not shown) and an electric motor (not shown) that applies a driving force to the ball screw mechanism. Further, the protective disk lifting / lowering unit 60 may be configured to lift and lower the protective disk 10 by magnetic force. In this case, the protection disk lifting / lowering unit 60 raises the protection disk 10 together with the first magnet by applying a repulsive force to the first magnet (not shown) attached to the protection disk 10 and the first magnet, for example. And a second magnet (not shown).

  A guide shaft 61 extending in the vertical direction in parallel with the rotation axis A1 is coupled to the lower surface of the protective disk 10. The guide shafts 61 are arranged at a plurality of positions at equal intervals in the rotation direction S of the substrate W. The guide shaft 61 is coupled to a linear bearing 62 provided at a corresponding portion of the spin base 21. The guide shaft 61 is movable in the vertical direction, that is, in a direction parallel to the rotation axis A <b> 1 while being guided by the linear bearing 62. Further, since the guide shaft 61 coupled to the lower surface of the protective disk 10 is coupled to the linear bearing 62, the protective disk 10 rotates integrally with the spin base 21 around the rotation axis A1.

  The guide shaft 61 passes through the linear bearing 62. The guide shaft 61 includes a flange 63 protruding outward at the lower end thereof. When the flange 63 contacts the lower end of the linear bearing 62, the upward movement of the guide shaft 61, that is, the upward movement of the protective disk 10 is restricted. That is, the flange 63 is a restricting member that restricts the upward movement of the protective disk 10.

FIG. 3 is a schematic plan view of the spin base 21. In FIG. 3, for convenience of explanation, the substrate W is indicated by a two-dot chain line.
Referring to FIG. 3, the protective disk 10 has a circular shape that is substantially the same size as the substrate W in plan view, and faces the periphery of the substrate W. A cutout 10 a in which at least a part of the holding pin 20 is accommodated is provided at a portion corresponding to the holding pin 20 in the peripheral portion of the protective disk 10.

The processing unit 2 includes a first intrusion suppressing member 12 and a first intrusion suppressing member 12 that suppress (restrict) air current from entering the space A between the lower surface of the substrate W and the protection disk 10 from the outside in the rotation radial direction of the substrate W. 2 further includes an entry suppression member 13.
Note that the rotational diameter direction of the substrate W is a direction orthogonal to the rotational axis A1. The inward direction of the substrate W in the radial direction is the direction toward the rotation axis A1 in the radial direction of the substrate W. Hereinafter, the inner side in the rotational radial direction of the substrate W is simply referred to as the radial inner side. Further, the outward direction of the substrate W in the radial direction is a direction toward the opposite side of the rotational axis A1 side in the radial direction of the substrate W. Hereinafter, the outer side in the rotational radial direction of the substrate W is simply referred to as a radially outer side.

The first intrusion suppressing member 12 suppresses the inflow of airflow from the space between the peripheral portion of the lower surface of the substrate W and the peripheral portion of the protective disk 10 into the space A between the lower surface of the substrate W and the protective disk 10. The second entry suppression member 13 suppresses the inflow of airflow from between the peripheral edge of the lower surface of the substrate W and the holding pin 20 into the space A between the lower surface of the substrate W and the protective disk 10.
A plurality of first entry suppression members 12 and second entry suppression members 13 are provided. Specifically, the first entry suppressing member 12 is provided one by one in a portion between the holding pins 20 adjacent in the rotation direction S in the protective disk 10. Each first entry suppression member 12 suppresses the entry of airflow into the space A between the lower surface of the substrate W and the protective disk 10 in the region between the holding pins 20 adjacent in the rotation direction S. One second entry suppression member 13 is provided for each holding pin 20. Each second entry suppression member 13 suppresses the entry of airflow into the space A between the lower surface of the substrate W and the protection disk 10 around the corresponding holding pin 20.

4A is a schematic diagram of a cross section taken along the line IVA-IVA of FIG. In FIG. 4A, the protection disk 10 located at the close position is indicated by a solid line. In FIG. 4A, the protection disk 10 positioned at the separated position is indicated by a two-dot chain line.
The first entry suppression member 12 is a curved resin sheet in plan view (see FIG. 3). The resin constituting the first entry suppressing member 12 is, for example, a synthetic resin. Examples of the synthetic resin include PTFE (polytetrafluoroethylene), PFA (tetrafluoroethylene / perfluoroalkyl vinyl ether copolymer), PP (polypropylene), PE (polyethylene), and the like. The first entry suppression member 12 is an elastic member. The first entry suppressing member 12 may be an elastic body such as synthetic rubber.

  The first entry suppressing member 12 integrally includes a first fixing portion 80 fixed to the protection disk 10 and a first elastic contact portion 81 that elastically contacts the peripheral edge portion of the lower surface of the substrate W. The first elastic contact portion 81 is in contact with the outer side in the radial direction from the portion where the device is formed on the lower surface of the substrate W. Specifically, the first elastic contact portion 81 contacts a portion between the radially outer end and a slightly inner side (inward of about 2 mm) from the radially outer end at the peripheral edge of the lower surface of the substrate W. doing.

  The first elastic contact portion 81 extends from the first fixing portion 80 so as to approach the lower surface of the substrate W as it goes outward in the radial direction. The distance between the first elastic contact portion 81 and the substrate W in the vertical direction becomes smaller toward the outside in the rotational radial direction. Support protrusions 82 that support the first elastic contact portions 81 from below are formed in the region between the holding pins 20 adjacent to each other in the rotation direction S at the peripheral edge of the upper surface of the protective disk 10.

  The first fixing portion 80 is fixed to the protective disk 10 by, for example, a resin screw 83. FIG. 4B is an enlarged view of the periphery of the first fixing unit 80 in FIG. 4A. Referring to FIG. 4B, screw 83 includes a screw shaft 83a in which a male screw portion is formed, and a head portion 83b protruding from one end in the axial direction of screw shaft 83a in a direction orthogonal to the axial direction. . The screw shaft 83 a is inserted (screwed) into a screw hole 84 formed in the protective disk 10. The male screw portion formed on the screw shaft 83 a is screwed with the female screw portion formed on the inner peripheral surface of the screw hole 84. The first fixing portion 80 is formed with an insertion hole 85 through which the screw shaft 83a is inserted, and an accommodation hole 86 that communicates with the insertion hole 85 and accommodates the head portion 83b. The first fixing portion 80 is fixed to the protective disk 10 by sandwiching the bottom of the accommodation hole 86 between the head 83 b and the protective disk 10.

The first fixing portion 80 is in close contact with the protective disk 10 while being fixed to the protective disk 10 with screws 83. Therefore, regardless of the position of the protection disk 10, the entry of the airflow F from the space between the first entry suppression member 12 and the protection disk 10 into the space A between the lower surface of the substrate W and the protection disk 10 is suppressed. .
The first elastic contact portion 81 is separated from the lower surface of the substrate W when the protective disk 10 is in the separated position (see the two-dot chain line in FIG. 4A). The first elastic contact portion 81 is in close contact with the lower surface of the substrate W in a state where the protective disk 10 is located at the close position (see a solid line in FIG. 4A). Therefore, in the state where the protective disk 10 is located at the close position, the air flow F enters the space A between the lower surface of the substrate W and the protective disk 10 from between the first entry suppression member 12 and the lower surface of the substrate W. It is suppressed.

As described above, the first entry suppression member 12 suppresses the entry of the airflow F into the space A between the lower surface of the substrate W and the protection disk 10 in a state where the protection disk 10 is positioned in the proximity position.
FIG. 5 is a schematic diagram of a cross section taken along line VV in FIG.
The second entry suppressing member 13 is a resin sheet. The resin constituting the second entry suppressing member 13 is, for example, a synthetic resin. Examples of the synthetic resin include PTFE, PFA, PP, PE, and the like. The second entry suppression member 13 is an elastic member. The second entry suppressing member 13 may be an elastic body such as rubber.

The holding pin 20 includes a sandwiching portion 20a that sandwiches the substrate W from the horizontal direction, and a facing portion 20b that extends substantially in the horizontal direction and faces the lower surface of the substrate W with a space therebetween.
The second entry suppressing member 13 includes a second fixing portion 90 fixed to the facing portion 20 b of the holding pin 20, a second elastic contact portion 91 that elastically contacts the peripheral portion of the lower surface of the substrate W, and the protective disk 10. , And a protection disk contact portion 92 that comes into contact with the peripheral edge of the protection disk 10 from above. The second elastic contact portion 91 extends from the second fixing portion 90 so as to approach the lower surface of the substrate W as it goes outward in the radial direction. The distance between the second elastic contact portion 91 and the substrate W in the vertical direction becomes smaller toward the outer side in the radial direction. The second fixing portion 90 is fixed to the holding pin 20 by being fixed to the facing portion 20b of the holding pin 20 with a resin screw 93, for example. The facing portion 20 b of the holding pin 20 supports the substrate W from below via the second entry suppressing member 13.

The second fixing portion 90 is in close contact with the holding pin 20 in a state of being fixed to the corresponding holding pin 20 with a screw 93. The entry of the airflow F from the space between the second entry suppressing member 13 and the holding pin 20 into the space A between the lower surface of the substrate W and the protective disk 10 is suppressed.
The second elastic contact portion 91 is in close contact with the lower surface of the substrate W in a state where the substrate W is held by the plurality of holding pins 20. The entry of the airflow F from the space between the second entry suppressing member 13 and the lower surface of the substrate W to the space A between the lower surface of the substrate W and the protective disk 10 is suppressed.

  The protective disk contact portion 92 extends from the second fixing portion 90 on the side opposite to the second elastic contact portion 91 (inward in the radial direction). The protection disk contact portion 92 may be elastically deformed by being pushed up by the protection disk 10 so that the tip (radially inner end) moves upward in a state where the protection disk 10 is in the proximity position. The protection disk contact portion 92 overlaps the portion 10b around the notch 10a on the upper surface of the protection disk 10 in plan view.

  FIG. 6 is a block diagram for explaining the electrical configuration of the main part of the substrate processing apparatus 1. The control unit 3 includes a microcomputer and controls a control target provided in the substrate processing apparatus 1 according to a predetermined program. More specifically, the control unit 3 includes a processor (CPU) 3A and a memory 3B in which a program is stored, and the processor 3A executes various programs to execute various controls for substrate processing. It is configured as follows. In particular, the control unit 3 controls operations of the transfer robots IR and CR, the arm moving mechanism 37, the electric motor 23, the protective disk lifting / lowering unit 60, the opening / closing unit 25, the valves 42 and 52, and the like.

FIG. 7 is a flowchart for explaining an example of substrate processing by the substrate processing apparatus 1, and mainly shows processing realized by the control unit 3 executing a program.
In the substrate processing, first, an unprocessed substrate W is carried into the processing unit 2 from the carrier C by the transfer robots IR and CR, and is transferred to the spin chuck 5 (step S1). Thereafter, the substrate W is held horizontally with an interval upward from the upper surface of the spin base 21 until it is unloaded by the transfer robot CR. The opening / closing unit 25 holds the periphery of the substrate W on the plurality of holding pins 20 (substrate holding step, step S2). At this time, the substrate W is held by the plurality of holding pins 20 with the device surface on which the device is formed facing downward.

  Next, the protection disk lifting / lowering unit 60 raises the protection disk 10 to the proximity position (proximity step, step S3). Thereby, the first elastic contact portion 81 of the first entry suppressing member 12 contacts the lower surface of the substrate W. Next, the gas valve 52 is opened. Thereby, supply of gas, such as nitrogen gas, to the space A between the upper surface of the protective disk 10 and the lower surface of the substrate W is started (step S4). The gas supply flow rate at this time is, for example, 100 L / min to 200 L / min. The electric motor 23 rotates the spin base 21 in a state where the plurality of holding pins 20 hold the peripheral edge of the substrate W and the first entry suppressing member 12 is in contact with the lower surface of the substrate. As a result, the substrate W held horizontally by the holding pins 20 rotates (substrate rotation step, step S5). The rotation speed of the substrate W at this time is, for example, 500 rpm. The rotation speed of the substrate W is not limited to 500 rpm, and may be any rotation speed from 100 rpm to 1000 rpm. It is. Then, the processing liquid valve 42 is opened while the supply of gas to the space A between the upper surface of the protective disk 10 and the lower surface of the substrate W is continued. Thereby, the supply of the processing liquid such as DIW to the upper surface of the rotating substrate W is started (processing liquid supply step, step S6).

Then, scrub cleaning is performed (step S7). Specifically, the arm moving mechanism 37 moves the brush arm 35 and presses the brush 31 against the upper surface of the substrate W. Since the substrate W is rotated, the brush 31 is rubbed against the upper surface of the substrate W.
The arm moving mechanism 37 retracts the brush 31 from the upper side of the spin chuck 5 to the side thereof. Then, the processing liquid valve 42 is closed, and the supply of the processing liquid from the processing liquid nozzle 40 is stopped (step S8). Furthermore, the electric motor 23 accelerates the rotation of the spin base 21 (step S9). Thereby, a spin dry process for drying the substrate W is performed by shaking off the droplets on the upper surface and the peripheral end surface of the substrate W by centrifugal force. The rotation speed of the substrate W during this spin dry process is, for example, 1500 rpm to 3000 rpm. In this way, the processing liquid is removed from the substrate W, and the substrate W is dried. When a predetermined time elapses after the high-speed rotation of the substrate W is started, the electric motor 23 stops the rotation of the substrate W by the spin base 21 (step S10).

  Then, the gas valve 52 is closed, and the supply of the inert gas to the space A between the lower surface of the substrate W and the upper surface of the protective disk 10 is stopped (step S11). Then, the protection disk lifting / lowering unit 60 lowers the protection disk 10 to the separation position (step S12). Then, when the opening / closing unit 25 opens the plurality of holding pins 20, the substrate W is released from the holding by the plurality of holding pins 20 (step S13).

Then, the transfer robot CR enters the processing unit 2, scoops the processed substrate W from the spin chuck 5, and carries it out of the processing unit 2 (step S14). The substrate W is transferred from the transfer robot CR to the transfer robot IR, and is stored in the carrier C by the transfer robot IR.
According to the present embodiment, the spin base 21 can rotate around the rotation axis A <b> 1 in a state where the peripheral portions of the substrate W are held by the plurality of holding pins 20. Here, an air flow is generated around the rotating structure. For example, an airflow F that flows between the lower surface of the substrate W and the protective disk 10 from the outside in the radial direction of the substrate W is likely to be generated (see FIG. 4A). In a state in which the protective disk 10 is positioned at the close position, the first intrusion suppressing member 12 suppresses the entry of the airflow F into the space A between the peripheral edge of the lower surface of the substrate W and the protective disk 10. Specifically, the first entry suppression member 12 and the lower surface of the substrate W are brought into close contact with each other by bringing the first entry suppression member 12 into elastic contact with the lower surface of the substrate W. On the other hand, the first entry suppressing member 12 and the protective disk 10 are in close contact with each other. Therefore, the space between the lower surface of the substrate W and the protective disk 10 is closed. Therefore, even when the rotated substrate W is processed with the processing liquid, the liquid (such as a mist of the processing liquid generated by the substrate processing) rides on the air flow F and is between the lower surface of the substrate W and the protective disk 10. The entry into the space A can also be suppressed. Therefore, the lower surface of the substrate W can be well protected.

  Further, according to the present embodiment, the gas is supplied to the space A between the protection disk 10 and the substrate W by the gas supply unit 11. By supplying the gas to the space A between the protective disk 10 and the substrate W, an air flow (see FIG. 4A) from the space A between the substrate W and the protective disk 10 toward the outside of the space A is generated. be able to. Therefore, the entry of the airflow F into the space A between the lower surface of the substrate W and the protective disk 10 can be suppressed.

Note that the radially outward airflow (see FIG. 4A) generated between the lower surface of the substrate W and the protective disk 10 is not only the pushing force by the gas supply by the gas supply unit 11 but also the rotation of the substrate W. Also due to centrifugal force.
In addition, according to the present embodiment, the first elastic contact portion 81 extends from the first fixing portion 80 so as to approach the lower surface of the substrate W as it goes radially outward from the first fixing portion 80. Therefore, the radially outward airflow generated between the lower surface of the substrate W and the protective disk 10 tends to enter between the first elastic contact portion 81 and the lower surface of the substrate W. Then, a gap having a width necessary for the air flow to pass between the first elastic contact portion 81 and the lower surface of the substrate W is formed between the first elastic contact portion 81 and the lower surface of the substrate W. Thus, the first elastic contact portion 81 is elastically deformed. Then, the airflow is discharged outside from the space A between the lower surface of the substrate W and the protection disk 10 through the gap. Therefore, it is possible to prevent the pressure between the lower surface of the substrate W and the protective disk 10 from becoming excessively large, and to prevent the air flow F from entering the space A between the lower surface of the substrate W and the protective disk 10. Can be suppressed.

In addition, since the air flow directed outward in the radial direction passes between the first elastic contact portion 81 and the lower surface of the substrate W, the space A between the lower surface of the substrate W and the protective disk 10 travels along the lower surface of the substrate W. It is possible to suppress the liquid from entering.
In addition, according to the present embodiment, the second entry suppression member 13 extends from the space between the peripheral edge of the lower surface of the substrate W and the holding pin 20 to the space A between the peripheral edge of the lower surface of the substrate W and the protective disk 10. The entry of the airflow F is suppressed. Specifically, the second entry suppression member 13 and the lower surface of the substrate W are brought into close contact with each other by bringing the second entry suppression member 13 into elastic contact with the lower surface of the substrate W. On the other hand, the second entry suppressing member 13 and the holding pin 20 are in close contact. Therefore, the space between the lower surface of the substrate W and the protective disk 10 is closed. Therefore, a liquid (such as a mist of the processing liquid generated by the substrate processing) rides on the airflow F, and the space A between the lower surface of the substrate W and the holding pin 20 to the lower surface of the substrate W and the protective disk 10. Can be prevented from entering

  Further, according to the present embodiment, the second elastic contact portion 91 extends from the second fixing portion 90 so as to approach the lower surface of the substrate W as it goes radially outward from the second fixing portion 90. Therefore, the airflow directed radially outward between the lower surface of the substrate W and the protective disk 10 tends to enter between the second elastic contact portion 91 and the lower surface of the substrate W. Then, a gap having a width necessary for the air flow to pass between the second elastic contact portion 91 and the lower surface of the substrate W is formed between the second elastic contact portion 91 and the lower surface of the substrate W. Thus, the second elastic contact portion 91 is elastically deformed. Then, the airflow is discharged outside from the space A between the lower surface of the substrate W and the protection disk 10 through the gap. Therefore, it is possible to prevent the pressure between the lower surface of the substrate W and the protective disk 10 from being excessively increased, and to protect the lower surface of the substrate W from between the peripheral portion of the lower surface of the substrate W and the holding pins 20. The entry of the airflow F into the space A with the disk 10 can be suppressed.

In addition, since the air flow toward the outside in the radial direction passes between the second elastic contact portion 91 and the lower surface of the substrate W, the lower surface of the substrate W and the protective disk are transmitted around the holding pin 20 along the lower surface of the substrate W. The liquid can be prevented from entering the space A between the two.
In addition, according to the present embodiment, the first entry suppressing member 12 has an air flow F to the space A between the lower surface of the substrate W and the protective disk 10 in the region between the holding pins 20 adjacent in the rotation direction S. Suppresses the entry. The second entry suppressing member 13 suppresses the entry of the airflow F into the space A between the lower surface of the substrate W and the protective disk 10 around the holding pin 20. Therefore, in the relatively wide range (substantially the entire circumference) of the rotation direction S, it is possible to suppress the inflow of airflow into the space A between the lower surface of the substrate W and the protective disk 10.

Further, according to the present embodiment, the head 83 b of the screw 83 is accommodated in the accommodation hole 86. Therefore, the first entry suppressing member 12 can be fixed to the protective disk 10 by the screw 83 without hindering the airflow directed radially outward between the lower surface of the substrate W and the protective disk 10.
In addition, unlike the above-described embodiment, there is a case where no gas is supplied from the gas supply unit 11. Further, unlike the above-described embodiment, there may be a case where the gas supply unit 11 is not provided in the processing unit 2. In these cases, gas supply (step S3) and gas supply stop (step S10) are not performed in the substrate processing. Even in these cases, the gas between the lower surface of the substrate W and the protective disk 10 moves radially outward due to the centrifugal force when the substrate W rotates. Therefore, the first elastic contact portion 81 is elastically deformed and discharged from the space A between the lower surface of the substrate W and the protection disk 10 to the outside. As a result, the pressure between the lower surface of the substrate W and the protective disk 10 becomes lower than the external pressure, resulting in a negative pressure state. Therefore, the first elastic contact portion 81 is further adhered to the lower surface of the substrate. Accordingly, it is possible to further suppress the entry of the airflow F into the space A between the lower surface of the substrate W and the protective disk 10.

  In addition, according to the present embodiment, the second entry suppressing member 13 includes the protective disk contact portion 92 that comes into contact with the peripheral edge portion of the protective disk 10 from above in a state where the protective disk 10 is in the proximity position. Therefore, the airflow that enters the space A between the lower surface of the substrate W and the protective disk 10 from between the protective disk 10 and each holding pin 20 until it flows between the lower surface of the substrate W and the protective disk 10. Can block the way. Therefore, it is possible to suppress the generation of airflow that flows into the space A between the lower surface of the substrate W and the protective disk 10 from between the protective disk 10 and the holding pin 20. In other words, the entry of the airflow into the space A can be suppressed.

If the protective disk contact portion 92 is elastically deformed so that the tip (radially inner end) moves upward in a state where the protective disk 10 is in the proximity position, the gap between the protective disk 10 and the holding pin 20 is sufficient. Generation of airflow flowing into the space A between the lower surface of the substrate W and the protective disk 10 can be further suppressed.
FIG. 8 is a schematic diagram of the periphery of the first entry suppression member 12P according to the first modification of the present embodiment. In FIG. 8, the same members as those described so far are denoted by the same reference numerals, and the description thereof is omitted.

  Referring to FIG. 8, unlike the present embodiment, the first entry suppression member 12P according to the first modification is formed of a sponge-like porous material. Examples of the porous material include fluororesin, PVA, PP, and PE. The first entry suppressing member 12P is provided on the first fixing portion 87 fixed to the protective disk 10 and the peripheral edge portion of the lower surface of the substrate W and the peripheral edge portion of the upper surface of the protective disk 10 in a state where the protective disk 10 is positioned in the proximity position. The first contact portion 88 that comes into contact with the first fixing portion 87 and the first connection portion 89 that connects the first contact portion 88 are integrally included. The 1st fixing | fixed part 87 is being fixed to the protection disk 10 with the screw | thread 83 similarly to the 1st fixing | fixed part 80 (refer FIG. 4A) of the 1st approach suppression member 12 of this embodiment.

  According to the first modification, the first entry suppression member 12P is formed of a porous material. Therefore, the first entry suppressing member 12P can pass the gas by receiving a pressure of a predetermined value or more from the gas. A radially outward airflow is generated in the space A between the lower surface of the substrate W and the protective disk 10, and due to this airflow, the lower surface of the substrate W and the protective disk 10 are surrounded around the first entry suppressing member 12 </ b> P. The pressure in the space A may become a predetermined value or more. In this case, the gas in the space A between the lower surface of the substrate W and the protective disk 10 passes through the first entry suppressing member 12P and is discharged to the outside. On the other hand, unlike the space A, the gas is not actively supplied to the space radially outward from the first entry suppressing member 12P by the gas supply unit 11 or centrifugal force. Therefore, in the space radially outward from the first entry suppression member 12P, the pressure is less likely to increase compared to the portion around the first entry suppression member 12P in the space A. Therefore, the first entry suppressing member 12P can suppress the entry of the airflow F into the space A between the lower surface of the substrate W and the protective disk 10 from the radially outer side. Therefore, it is possible to prevent the pressure between the lower surface of the substrate W and the protective disk 10 from becoming excessively large, and to prevent the air flow F from entering the space A between the lower surface of the substrate W and the protective disk 10. Can be suppressed.

Moreover, since the 1st approach suppression member 12P is formed with the porous material, it is hard to let the mist of a process liquid pass. Therefore, it is possible to further suppress the liquid from entering the space A between the lower surface of the substrate W and the protective disk 10 from the outside.
FIG. 9 is a schematic view of the periphery of the holding pin 20 according to the second modification of the present embodiment. In FIG. 9, the same members as those described so far are denoted by the same reference numerals, and the description thereof is omitted.

Referring to FIG. 9, unlike the present embodiment, the second entry suppressing member 13P according to the second modification is formed of a sponge-like porous material. Examples of the porous material include fluororesin, PVA, PP, and PE.
The second entry suppressing member 13P includes a second fixing portion 97 fixed to the facing portion 20b of the holding pin 20, a second contact portion 98 that contacts the peripheral portion of the lower surface of the substrate W and the facing portion 20b, and a second fixing. The second connecting part 99 that connects the part 97 and the second contact part 98 and the protective disk contact part 96 that contacts the peripheral edge of the protective disk 10 from above in the state where the protective disk 10 is in the close position are integrally included. . The 2nd fixing | fixed part 97 is being fixed to the opposing part 20b with the screw 93 similarly to the 2nd fixing | fixed part 90 (refer FIG. 5) of the 2nd approach suppression member 13P of this embodiment.

The protective disk contact part 96 extends from the second fixing part 97 on the side opposite to the second connecting part 99. The protective disk contact portion 96 overlaps the portion 10b around the notch 10a on the upper surface of the protective disk 10 in plan view.
According to the 2nd modification, since the 2nd approach suppression member 13P is formed with the porous material, it can let gas pass. Therefore, the second entry suppressing member 13P can pass the gas by receiving a predetermined pressure from the gas. A radially outward airflow is generated between the lower surface of the substrate W and the protective disk 10, and due to this airflow, between the lower surface of the substrate W and the protective disk 10 around the second entry suppressing member 13P. The pressure may exceed a predetermined value. In this case, the gas in the space A between the lower surface of the substrate W and the protective disk 10 is discharged to the outside from the space A between the lower surface of the substrate W and the protective disk 10. On the other hand, unlike the space A, the gas is not positively supplied by the gas supply unit 11 or the centrifugal force in the space radially outward from the second entry suppressing member 13P. Therefore, in the space radially outward from the second entry suppression member 13P, the pressure is less likely to increase as compared to the portion around the second entry suppression member 13P in the space A. Therefore, it is possible to prevent the airflow F from entering the space A between the lower surface of the substrate W and the protective disk 10 from the outside. Therefore, it is possible to prevent the pressure between the lower surface of the substrate W and the protective disk 10 from becoming excessively large, and to protect the lower surface of the substrate W from between the peripheral edge portion of the lower surface of the substrate W and the holding pins 20. The entry of the airflow F into the space A with the disk 10 can be suppressed.

Moreover, since the 2nd approach suppression member 13P is formed with the porous material, it is hard to let the mist of a process liquid pass. Therefore, it is possible to further suppress the liquid from entering the space A between the lower surface of the substrate W and the protective disk 10 from the outside.
The second entry suppressing member 13P includes a protective disk contact portion 92 that comes into contact with the peripheral edge portion of the protective disk 10 from above in a state where the protective disk 10 is in the proximity position. Therefore, the airflow that enters the space A between the lower surface of the substrate W and the protective disk 10 from between the protective disk 10 and each holding pin 20 until it flows between the lower surface of the substrate W and the protective disk 10. Can block the way. Therefore, it is possible to suppress the generation of airflow that flows into the space A between the lower surface of the substrate W and the protective disk 10 from between the protective disk 10 and the holding pin 20. In other words, the entry of the airflow into the space A can be suppressed.

FIG. 10 is a schematic diagram of the periphery of the holding pin 20 according to a third modification of the present embodiment. In FIG. 10, the same members as those described so far are denoted by the same reference numerals, and the description thereof is omitted.
Referring to FIG. 10, unlike the present embodiment, the second fixing portion 90 of the second entry restraining member 13Q according to the third modification extends substantially horizontally between the substrate W and the protective disk 10. It is fixed to the member 15. The extending member 15 faces the protective disk 10 from above.

  The extending member 15 has a substantially semicircular arc shape in plan view. The extending member 15 overlaps the portion 10b around the notch 10a on the upper surface of the protective disk 10 in plan view. In the third modified example, the facing portion 20b of the holding pin 20 is inclined with respect to the horizontal direction, and contacts the substrate W from below and supports the substrate W. The extending member 15 is connected to the lower end of the facing portion 20b and includes an inclined portion 15a that is inclined with respect to the horizontal direction at substantially the same angle as the facing portion 20b. The second fixing portion 90 of the third modification is fixed to the inclined portion 15 a of the extending member 15. The second fixing portion 90 of the third modification is fixed to the holding pin 20 via the extending member 15.

The second entry suppression member 13Q according to the third modification is a resin sheet as in the present embodiment. Unlike the third modified example, the second entry suppressing member 13Q may be formed of a sponge-like porous material in the same manner as the second entry suppressing member 13P (see FIG. 9) according to the second modified example.
Further, as shown in FIG. 10, if the lower surface of the extending member 15 is configured to come into contact with the upper surface (peripheral edge portion) of the protective disk 10 in a state where the protective disk 10 is in the proximity position, the protective disk The air current can be prevented from entering the space A between the lower surface of the substrate W and the protective disk 10 from between the holding pins 20 and the holding pins 20.

The present invention is not limited to the embodiments described above, and can be implemented in other forms.
For example, unlike the above-described embodiment, the processing liquid nozzle 40 may be a two-fluid nozzle that ejects droplets of the processing liquid onto the upper surface of the substrate W together with the gas. In this case, a gas supply pipe that supplies a gas such as nitrogen gas to the processing liquid nozzle 40 is connected to the processing liquid nozzle 40, and whether or not gas is supplied to the processing liquid nozzle 40 in the gas supply pipe A gas valve for switching between is installed. And gas is supplied to the process liquid nozzle 40 from a gas supply source via a gas supply pipe.

  Moreover, unlike the above-mentioned embodiment, the washing | cleaning unit 9 is not provided, but the chemical | medical solution supply unit which supplies a chemical | medical solution instead may be provided. The chemical solution supply unit includes a chemical solution supply nozzle that supplies the chemical solution to the upper surface of the substrate W. Examples of the chemical solution supplied from the chemical solution supply nozzle include HF (hydrogen fluoride water), SPM (sulfuric acid hydrogen peroxide solution mixture), SC1 (ammonia hydrogen peroxide solution mixture), and SC2 (hydrochloric acid hydrogen peroxide solution mixture). ) And the like. The chemical solution supply nozzle may be a two-fluid nozzle. In the substrate processing by the substrate processing apparatus having this configuration, after the upper surface of the substrate W is processed by the chemical liquid supplied from the chemical liquid supply unit, the upper surface of the substrate W is rinsed by DIW or the like supplied from the processing liquid supply unit 8. . Then, similarly to the substrate processing in the above-described embodiment, the substrate W is dried by spin drying.

Further, when the lower surface of the substrate W is restricted from entering the airflow over the entire circumference in the rotation direction S by the first entry suppression members 12 and 12P and the second entry suppression members 13, 13P and 13Q, the above-described implementation is performed. Unlike a form, the gas exclusion unit which excludes the gas of the space A between the lower surface of the board | substrate W and the protection disk 10 may be provided.
Further, the protective disk 10 does not necessarily have to face the peripheral edge of the substrate W, and may have a circular shape smaller than the substrate W in plan view. Even in this case, the first elastic contact portion 81 and the second elastic contact portion 91 have a radially outer end at the peripheral edge of the lower surface of the substrate W and slightly inward (2 mm) from the radially outer end. It is preferable that it is in contact with the portion between the inner portion and the inner portion.

  In addition, various changes can be made within the scope described in the claims.

1: Substrate processing apparatus 10: Protection disk (opposing member)
12: 1st approach suppression member (elastic member)
12P: 1st approach suppression member (elastic member)
13: 2nd approach control member 13P: 2nd approach control member 13Q: 2nd approach control member 20: Holding pin 21: Spin base (base)
80: 1st fixed part 81: 1st elastic contact part 90: 2nd fixed part 91: 2nd elastic contact part A: Space A1: Rotation axis F: Airflow S: Rotation direction W: Substrate

Claims (9)

A base that rotates about a rotation axis along the vertical direction;
A plurality of holding pins provided on the base and spaced apart from each other in the rotation direction of the base, and holding a peripheral edge of the substrate above the base;
It is disposed between the base and the substrate, and can be moved up and down between a spaced position spaced downward from the substrate and a close position closer to the substrate than the spaced position, and faces the substrate from below. An opposing member,
A first entry suppression member that is provided in the opposing member and suppresses the ingress of airflow into the space between the lower surface of the substrate and the opposing member in a state where the opposing member is located at the proximity position; Substrate processing equipment.   The first entry suppressing member extends from the first fixing portion so as to approach the lower surface of the substrate as it goes outward in the rotational radial direction of the substrate, and the first fixing portion fixed to the opposing member, The substrate processing apparatus according to claim 1, further comprising a first elastic contact portion that elastically contacts a peripheral portion of the lower surface of the substrate.   The substrate processing apparatus according to claim 1, wherein the first entry suppressing member is made of a porous material.   A second intrusion suppression member that is provided on the holding pin and that suppresses an inflow of air current from between the peripheral edge of the lower surface of the substrate and the holding pin to a space between the lower surface of the substrate and the opposing member; The substrate processing apparatus as described in any one of Claims 1-3.   The second entry suppressing member extends from the second fixing portion so as to approach the lower surface of the substrate as it goes outward in the rotational radial direction of the substrate, and a second fixing portion fixed to the holding pin, The substrate processing apparatus according to claim 4, further comprising a second elastic contact portion that elastically contacts a peripheral portion of the lower surface of the substrate.   The substrate processing apparatus according to claim 4, wherein the second entry suppressing member is made of a porous material. The first entry suppression member suppresses the entry of airflow into the space between the lower surface of the substrate and the opposing member in a region between the holding pins adjacent in the rotation direction,
The said 2nd approach suppression member suppresses the approach of the airflow to the space between the lower surface of the said board | substrate and the said opposing member in the circumference | surroundings of each said holding pin. Substrate processing equipment.   The substrate processing apparatus according to claim 1, further comprising a gas supply unit that supplies a gas between the facing member and the substrate. A substrate holding step of holding a peripheral portion of the substrate above the base on a plurality of holding pins provided on the base at intervals in a rotation direction around a rotation axis along the vertical direction;
A proximity step of bringing the facing member close to the substrate so that an elastic member fixed to the facing member facing the substrate from below is in contact with the lower surface of the substrate;
A substrate rotating step of rotating the substrate by rotating the base in a state where the plurality of holding pins hold the peripheral edge of the substrate and the elastic member is in contact with the lower surface of the substrate;
A substrate processing method comprising: a processing liquid supply step of supplying a processing liquid for processing a substrate on an upper surface of a rotating substrate.

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