JP2018147953A - Heat radiation unit and electric/electronic device including the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heat radiation unit which can attain desired cooling effect without increasing the size of a heat sink.SOLUTION: A heat radiation unit 40 used in a power supply device 10 serving as an electric/electronic device includes: a heat sink 41; and a heat radiation assisting plate 42 in which a base end part is fixed to the heat sink 41 by fixing screws 43. The heat radiation assisting plate 42 is configured so that a tip part deforms in a direction away from the heat sink 41 when a temperature of the heat radiation assisting plate 42 becomes a predetermined deformation temperature or higher.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a heat radiating unit used in electric / electronic devices such as a power supply circuit and a power conditioner, and an electric / electronic device including the heat radiating unit.

  Conventionally, in electrical and electronic equipment (hereinafter also referred to simply as equipment), excessive heat generation of parts that require heat dissipation (hereinafter referred to as heat dissipation target parts), such as parts that generate a large amount of heat or parts that are susceptible to heat generation, and surrounding parts A technique for preventing the heat generation of the is known.

  For example, a heat sink is arranged around the heat radiation target component, or the heat radiation target component itself is attached to the heat sink. Further, for example, an air cooling technique using a cooling fan as disclosed in Patent Documents 1 and 2 is known. In Patent Document 1, the rotation speed of the cooling fan is continuously changed based on the temperature detected from the power transformer of the power amplifier. Moreover, in patent document 2, the rotational speed of a fan motor is controlled according to the electric current amount which flows into the power supply circuit of a mechanical apparatus. In general, a cooling effect is enhanced by combining a heat sink and a cooling fan.

Japanese Patent Laid-Open No. 5-190329 JP-A-5-201102

  Here, in the prior arts such as Patent Documents 1 and 2, the rotation speed of the cooling fan is increased as the heat generation amount of the heat radiation target component increases, but the cooling capacity is limited. Therefore, generally, the cooling effect is sufficiently ensured by determining the size of the heat sink based on the maximum heat generation amount. However, if the size of the heat sink is increased, there is a problem that the size of the device increases accordingly.

  For example, when the heat generation amount during normal operation of the device is lower than the maximum heat generation amount, if the heat sink size design based on the maximum heat generation amount is performed, the size of the heat sink may be larger than necessary.

  In view of the above problems, an object of the present invention is to solve the above-described problems and provide a heat dissipation unit that can obtain a desired cooling effect without increasing the size of a heat sink.

  A heat dissipation unit for an electric / electronic device according to the first aspect of the present invention includes a heat sink, a fixed portion that extends along the heat sink, is fixed to the heat sink, and a deformed end provided at a position different from the fixed portion. The heat dissipation auxiliary plate has a deformation end portion that is deformed in a direction away from the heat sink when the heat dissipation auxiliary plate reaches a predetermined deformation temperature or higher.

  In the heat radiating unit according to this aspect, when the temperature becomes equal to or higher than a predetermined deformation temperature, the heat radiating auxiliary plate is deformed in a direction away from the heat sink, so that the area in contact with the air around it can be increased. That is, when the temperature of the heat dissipation auxiliary plate rises, the cooling effect can be enhanced according to the temperature. Thereby, the size of the heat sink can be optimized (miniaturized).

  The heat sink includes a base plate and a plurality of fins erected on the base plate at a predetermined pitch, and the fixed portion and the deformed end portion of the heat radiation auxiliary plate are arranged in a ventilation direction connecting between both side ends of the fin. It may be lined up along.

  According to this aspect, the heat dissipation auxiliary plate is deformed so that the wind passing in the ventilation direction is received by the wide surface. Therefore, the cooling effect of the heat radiating unit can be enhanced.

  An electric / electronic device according to a second aspect of the present invention has a housing in which the heat dissipation unit described in the first aspect is accommodated, and the housing has at least two vent holes for communicating the inside and outside of the housing. Is formed. The heat radiating unit is on a ventilation path formed between the vents, the fixing portion of the heat radiation auxiliary plate is on the downstream side of the ventilation direction along the ventilation path, and the deformation end is in the ventilation direction. It is arrange | positioned so that it may come to the upstream of.

  According to this aspect, similarly to the first aspect, the heat dissipation auxiliary plate of the heat dissipation unit can increase the area in contact with the air around it. That is, when the temperature of the heat dissipation auxiliary plate rises, the cooling effect of the heat dissipation unit can be enhanced according to the temperature. Thereby, the size of the heat radiating unit (heat sink) can be optimized (miniaturized), and as a result, the size and cost of the electric / electronic device on which the heat radiating unit is mounted can be reduced.

  In the electrical / electronic device according to the second aspect, an electronic component may be attached so as to be in contact with the heat sink at a position upstream of the deformed end portion of the heat dissipation auxiliary plate in the ventilation direction.

  According to this aspect, since the electronic component is attached at a position upstream of the deformation end portion in the ventilation direction, the wind passing through the ventilation path is directed to the fixed portion from the deformation end portion after deformation, that is, the heat dissipation target. Since it flows toward the component, the cooling effect of the component to be radiated can be enhanced.

  In the electrical / electronic device according to the second aspect, in the housing, a plurality of the heat radiating units are arranged side by side along the ventilation direction, and the heat radiating auxiliary plate constituting each of the plurality of heat radiating units. The deformation temperatures may be different from each other.

  According to this aspect, since the deformation temperatures of the heat radiation auxiliary plates arranged side by side along the ventilation direction are different from each other, the timing at which the heat radiation auxiliary plates rise can be shifted. Thereby, each thermal radiation unit can be cooled effectively. Therefore, it is possible to reduce the size of the heat radiating unit, the chassis (base) for assembling the heat radiating unit, and the housing or case for housing them.

  In the electrical / electronic device according to the second aspect, the plurality of heat radiating units are different from each other in the direction orthogonal to the ventilation perpendicular to the direction of ventilation. It may be arranged.

  According to this aspect, even when the heat radiation auxiliary plate stands up at the same time, cooling can be performed simultaneously.

  According to the present invention, it is possible to increase the area where the heat radiation auxiliary plate (heat radiation unit) comes into contact with air when the heat radiation unit reaches a predetermined temperature or more, so that the cooling effect of the heat radiation unit can be increased without increasing the size of the heat sink. Can be increased.

It is a permeation | transmission perspective view which shows schematic structure of the apparatus (power supply device) provided with the thermal radiation unit. It is a schematic sectional drawing in the XX line of FIG. It is a schematic block diagram which shows the other example of a thermal radiation unit. It is a permeation | transmission perspective view which shows the other example of the apparatus provided with the thermal radiation unit.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The following description of the preferred embodiments is merely exemplary in nature and is in no way intended to limit the invention, its application, or its application.

<Configuration of power supply device (equipment) and heat dissipation unit>
FIG. 1 is a transparent perspective view showing a schematic configuration of a power supply device as an electric / electronic device including a heat dissipation unit according to the present embodiment. In the following description, it is assumed that the front side of FIG. 1 is a front surface, and that the upper, lower, left and right directions are the same as those in the drawing. The same applies to other drawings.

  As shown in FIG. 1, the power supply device 10 includes a rectangular casing 20 and a circuit board 30 accommodated in the casing 20. Vents 21 that allow the inside and outside of the housing 20 to communicate with each other are formed through the left and right side walls of the housing 20. A fan 22 for introducing outside air into the housing 20 is attached to the vent 21 on the left side wall of the housing 20. The ventilation hole 21 on the right side wall of the housing 20 is an exhaust port for discharging air introduced into the housing 20 by the fan 22. Thus, a ventilation path WL extending from the left side wall (fan 22) of the housing 20 toward the right side wall (ventilation port (exhaust port) 21) is formed. Note that air cooling by natural convection between the vent holes 21 provided on both side walls may be performed without providing the fan 22. In this case, the height positions of the vent holes 21 provided on both side walls of the housing 20 may be made different from each other so that airflow is easily generated.

  The circuit board 30 extends along the ventilation direction WD (left-right direction in FIG. 1) along the ventilation path WL, and is fixed to the base 23 erected on the bottom plate of the housing 20 by screwing (not shown) or the like. Has been. Various electronic components 31 are mounted on the circuit board 30. In addition, a heat dissipation target component 31 a (a component that requires heat dissipation), which is a part of the electronic component 31, is mounted in a state of being closely fixed to the heat dissipation unit 40. FIG. 1 shows an example in which three heat radiating units 40 having the same shape are arranged on the circuit board 30 so as to form a line along the ventilation direction WD. In addition, the number of the heat radiating units 40 to be attached is not particularly limited, and may be less than 3 or may be 4 or more.

  Each heat radiating unit 40 includes a heat sink 41 and a heat radiating auxiliary plate 42 fixed to the heat sink 41. The heat sink 41 includes a flat base plate 41a and a plurality of fins 41b erected on the base plate 41a at a predetermined pitch. Both outer end fins 41b (outer end fins 41b) rise from both ends of the base plate 41a. Each heat radiating unit 40 is fixed by screwing (not shown) or the like with the outer wall surface of one outer end fin 41b (hereinafter referred to as the lower end fin 41c) in contact with the surface of the circuit board 30. . A heat radiation auxiliary plate 42 is attached and fixed to the upper surface (outer wall surface) of the other outer end fin 41b (hereinafter referred to as the upper end fin 41d) by screwing or the like.

  The heat radiation auxiliary plate 42 is a rectangular plate that extends along the upper surface of the upper end fin 41d, and is arranged such that the lower surface thereof is in contact with the upper surface of the upper end fin 41d at room temperature. In this state, a base end portion 42a (end portion on the downstream side in the ventilation direction) as a fixing portion of the heat radiation auxiliary plate 42 is fixed to the upper end fin 41d by screwing or the like. In the following description, the state at normal temperature as described above is referred to as a steady state. Reference numeral 43 denotes a fixing screw.

  When the auxiliary heat dissipation plate 42 is at or above a preset deformation temperature, the tip end portion 42b (upstream end portion in the ventilation direction WD) as a deformation end portion is deformed in a direction away from the upper surface of the upper end fin 41d, and the upper end fin 41d It is configured to stand up from. In the following description, the state in which the heat radiation auxiliary plate 42 rises from the upper fin is referred to as the heat radiation unit 40 in the cooling acceleration state or simply the cooling acceleration state.

  The rising amount of the heat radiation auxiliary plate 42 in this cooling acceleration state increases in accordance with the temperature transmitted to the heat radiation auxiliary plate 42. Further, after the cooling acceleration state is reached, when the temperature of the heat radiation auxiliary plate 42 falls below the deformation temperature, for example, when the temperature of the heat sink 41 decreases, the heat radiation auxiliary plate 42 is configured to return to the original steady state. ing.

  Here, the deformation temperature of the heat radiation auxiliary plate 42 can be arbitrarily set, and is not particularly limited. For example, the deformation temperature may be obtained by subtracting a predetermined margin temperature from the heat-resistant temperature of the heat radiation target component 31a. Such a deformation temperature can be set by, for example, forming the heat radiation auxiliary plate 42 with a bimetal and changing a combination of materials used for the bimetal, plate thickness, and the like.

  The strength of the heat radiation auxiliary plate 42 is preferably set so as to be able to maintain the standing state against the wind sent from the fan 22.

<Operation of power supply>
Hereinafter, the operation of the power supply device 10 will be described. First, the operation of the single heat radiating unit 40 will be mainly described. The state immediately before the power supply device 10 is turned on will be described as being in a steady state (normal temperature).

  When the power supply 10 is turned on, the fan 22 rotates and power is supplied to the circuit board 30, so that various electronic components 31 (including the heat dissipation target component 31 a), circuit patterns (not shown), etc. Flows.

  In this state, the cooling of the heat radiating unit 40 is realized mainly by the air introduced into the housing 20 from the fan 22 and passing between the fins 41 b of the heat sink 41. When a sufficient cooling effect is obtained by the air passing between the fins 41b, that is, when the temperature of the heat radiation auxiliary plate 42 is lower than the deformation temperature, the heat radiation unit 40 is maintained in a steady state.

  On the other hand, when the temperature of the heat sink 41 rises due to heat generation of the heat radiation target component 31a and the heat is transmitted and the temperature of the heat radiation auxiliary plate 42 becomes equal to or higher than the deformation temperature, the heat radiation auxiliary plate 42 is deformed to rise. Then, the heat radiating unit 40 is in a cooling acceleration state (see FIG. 2). Then, in addition to the cooling by the air passing between the fins 41b, the heat radiation auxiliary plate 42 that has received the air passing directly above the upper end fin 41d is cooled, and the cooling heat is transmitted through the screwed portion, so that the heat sink 41 To be cooled. Further, since the air hitting the heat radiation auxiliary plate 42 flows through the inclined surface 42c from the tip end portion 42b to the base end portion 42a, an air flow in the direction toward the upper end fin 41d is generated, and cooling of the heat sink 41 is accelerated. .

  When the heat dissipation unit 40 is sufficiently cooled after the heat dissipation unit 40 is in the cooling acceleration state, the temperature of the heat dissipation auxiliary plate 42 decreases to below the deformation temperature, and the heat dissipation auxiliary plate 42 returns to the original steady state. When the temperature of the heat sink 41 (heat radiation auxiliary plate 42) rises again to the deformation temperature, the heat radiation unit 40 is again in the cooling acceleration state. While the power supply device 10 is powered on, the above operation is automatically and repeatedly executed.

  As described above, the heat radiating unit 40 according to this aspect is configured so that the heat radiating auxiliary plate 42 is deformed so as to rise in response to a temperature rise, so that the cooling effect can be enhanced. Can be optimized (miniaturized). Specifically, in the prior art, it is necessary to design the size of the heat sink 41 according to the maximum heat generation amount of the heat radiation target component 31a and the like, but in this aspect, the heat radiation unit is based on the cooling ability including the heat radiation auxiliary plate 42. The size of 40 (heat sink 41) can be set.

  Furthermore, in the prior art, even when the temperature of the heat dissipation target component 31a and the like rises only for a specific time (local) during the operation period, the heat dissipation target component is used regardless of whether the state is limited to the specific time. It was necessary to design the size of the heat sink 41 in accordance with the maximum heat generation amount such as 31a. On the other hand, in the technique of this aspect, for example, the size of the heat sink is set based on the heat generation amount (necessary cooling amount) of the heat radiation target component 31a in a steady state, and the temperature rises locally during the operation period. Can be properly used to cope with the heat radiation unit 40 in the cooling acceleration state.

  Next, the operation of a plurality (three in FIGS. 1 and 2) of the heat radiation units 40 will be specifically described. In the following description, the heat radiating unit 40 will be referred to as a front unit 40a, a middle unit 40b, and a rear unit 40c in order from the upstream side to the downstream side in the airflow direction WD when separately described. .

  FIG. 2A shows a state in which the front unit 40a is in a cooling acceleration state. Similarly, in FIG. 2B, the middle unit 40b is in the cooling acceleration state, and in FIG. 2C, the rear unit 40c is in the cooling acceleration state. Thus, by attaching the plurality of heat radiation units 40 having the same shape so as to form a line along the ventilation direction WD, the airflow used in the cooling acceleration state can be shared. Specifically, as shown in FIG. 2, the wind (airflow) passing directly above the heat radiating unit 40 can be shared, and the volume of the power supply device 10 can be prevented from increasing.

  Such a configuration is particularly useful when, for example, the timing of entering the cooling acceleration state is different between the front stage unit 40a, the middle stage unit 40b, and the rear stage unit 40c during the operation period. That is, for example, first, the front unit 40a is in the cooling acceleration state (see FIG. 2A), and after the front unit 40a returns to the steady state, the middle unit 40b is in the cooling acceleration state (see FIG. 2B). ), After the middle stage unit 40b returns to the steady state, the rear stage unit 40c may be configured to be in the cooling acceleration state. Thereby, efficient cooling is realizable. If it does so, the chassis (illustration omitted) for assembling the thermal radiation unit 40 and the thermal radiation unit 40 can be made small, and the circuit board 30 and the housing | casing 20 can be reduced in size.

  For example, when the temperature rise characteristics and the temperature rise timing of the heat dissipating target component 31a are different, the components may be arranged in order from the fastest temperature rise from the upstream side to the downstream side in the ventilation direction WD. Further, for example, when using the heat radiation target component 31a having the same heat generation characteristics, the heat sink 41 constituting each heat radiation unit 40 may have different sizes, and the temperature rise timing may be shifted.

  In addition, the timing which will be in a cooling acceleration state may be simultaneous between the thermal radiation units 40 arrange | positioned side by side. For example, the case where the front stage unit 40a and the middle stage unit 40b are simultaneously in the cooling acceleration state will be described.

  In this case, first, the heat radiation auxiliary plate 42 rises in both the heat radiation units 40 (40a, 40b). Thereafter, first, the wind strikes the heat radiation auxiliary plate 42 of the front unit 40a. When the front stage unit 40a is sufficiently cooled, the front stage unit 40a returns to the steady state. Next, when wind hits the heat radiation auxiliary plate 42 of the middle unit 40b and the middle unit 40b is sufficiently cooled, the middle unit 40b returns to the steady state. At this time, for example, when the auxiliary heat radiation plate 42 rises simultaneously in the front stage unit 40a and the middle stage unit 40b, the state is monitored, and the heat radiation attached to the rear side heat radiation unit 40 (here, the middle stage unit 40b). The supply current of the target component 31a may be reduced.

  The preferred embodiments of the present invention and the modifications thereof have been described above, but the technology according to the present disclosure is not limited thereto, and can be applied to embodiments that have been appropriately changed, replaced, and the like. Moreover, it is also possible to combine each component demonstrated by the said embodiment into a new embodiment.

-Other embodiments-
In the heat radiating unit 40 shown in FIG. 1, the example in which the heat radiating target component 31a is attached to the base plate 41a and the heat radiating auxiliary plate 42 is attached to the upper end fin 41d is shown, but the present invention is not limited thereto. For example, the heat radiation target component 31a and the heat radiation auxiliary plate 42 may be attached to the same surface of the base plate 41a or the fin 41b. FIG. 3 shows an example in which the heat dissipation target component 31a and the heat dissipation auxiliary plate 42 are attached and fixed to the outer surface of the outer end fin 41b (the side surface of the heat dissipation unit 40).

  Specifically, in the heat radiating unit 40 shown in FIG. 3, a base plate 41a is fixed on the circuit board 30, and a plurality of fins 41b are erected integrally at a predetermined pitch from the upper surface of the base plate 41a. . The heat radiation target component 31a and the heat radiation auxiliary plate 42 are attached to the outer surface (the front side surface in FIG. 3) of the outer end fin 41b.

  The heat radiation auxiliary plate 42 is configured such that a base end portion 42a disposed on the downstream side in the ventilation direction is screwed and fixed to the heat sink, and the tip end portion 42b is deformed in a direction away from the heat sink 41 when a predetermined deformation temperature is reached. Yes. FIG. 3 shows a state after the deformation. In addition, a heat radiation target component 31a is fixed to the upstream side of the heat radiation auxiliary plate 42 in the ventilation direction WD by screwing or the like.

  As a result, the wind hitting the heat radiation auxiliary plate 42 flows toward the heat radiation target component 31a via the inclined surface 42c from the front end portion 42b toward the base end portion 42a, so that the cooling effect can be further enhanced.

  FIG. 4 shows an example in which the positions of the vent 21 and the fan 22 are different from those in FIG. Specifically, as shown in FIG. 4, a fan 22 is provided on the right front side of the housing 20 in the drawing, and a vent hole 21 (exhaust port) is formed through the left rear side of the drawing. That is, in FIG. 4, a ventilation path WL is formed from the right front side of the drawing toward the back left side of the drawing.

  Also, the difference from FIG. 1 is that the direction of the heat sink 41 is rotated 90 degrees along the horizontal direction. That is, the heat sink 41 is arranged so that the air introduced into the housing 20 from the fan 22 passes between the fins 41 b of the heat sink 41 with the straight line connecting the both ends thereof and the ventilation direction aligned. A heat radiation auxiliary plate 42 is attached and fixed to the upper surface of the upper end fin 41d. The heat radiation auxiliary plate 42 is disposed such that the base end portion 42a is on the downstream side in the ventilation direction and the tip end portion 42b is on the upstream side in the ventilation direction. Yes.

  As in the above-described embodiment, when the heat sink 41 is heated and the heat dissipation auxiliary plate 42 reaches a predetermined deformation temperature or higher, the tip end portion 42b rises in a direction away from the heat sink 41. Thereafter, when the temperature of the heat radiation auxiliary plate 42 (heat sink 41) returns to below the deformation temperature, the heat radiation auxiliary plate 42 returns to the original state (steady state).

  As described above, in the configuration of FIG. 4, the plurality of heat radiating units 40 are arranged side by side in a direction orthogonal to the ventilation direction WD along the ventilation path WL (hereinafter referred to as the ventilation orthogonal direction). Thereby, even when the heat radiation auxiliary plate 42 of the heat radiation units 40 arranged side by side rises at the same time, there is an advantage that cooling can be performed simultaneously. If the positions of the heat radiation auxiliary plates 42 constituting each of the plurality of heat radiation units 40 are different from each other in the direction perpendicular to the ventilation, the same effect as in FIG. 4 can be obtained. That is, as viewed from the ventilation direction WD, part or all of the position of the heat dissipation unit 40 may overlap. Furthermore, as a configuration in which the configuration in FIG. 1 and the configuration in FIG. 4 are combined, for example, a plurality of rows of heat radiation units 40 may be arranged side by side along the ventilation direction WD.

  In FIG. 2, the heat sinks 41 of the plurality of heat radiating units 40 are described as having the same height, but the heights may be different from each other. Although specific illustration is omitted, for example, in FIG. 2, the number of fins 41 b is reduced by two from the upper end of the heat sink 41 of the front stage unit 40 a without changing the interval between the fins 41 b. Similarly, the number of fins 41b of the middle unit 40b is reduced by one from the upper end. If it does so, the several thermal radiation unit 40 will become step shape which becomes high toward the back from the near along the ventilation path WL. Then, the heat radiation auxiliary plate 42 is attached to the upper end fin 41 d of each heat radiation unit 40. Thereby, since the vertical position of the heat radiation auxiliary plate 42 is different between the heat radiation units 40 (40a, 40b, 40c), the heat radiation auxiliary plates 42 provided in all the heat radiation units 40 (40a, 40b, 40c) are provided. Even in the case of standing up at the same time, cooling can be performed simultaneously.

  In addition, regarding the shape of the heat dissipation auxiliary plate 42, in the above-described embodiment, the length of the ventilation direction WD is a rectangular plate that is longer than the direction orthogonal to the ventilation, but the heat dissipation auxiliary plate 42 is arranged in the direction orthogonal to the ventilation. Longer plates can be used. Even in this case, it is preferable to fix the downstream side (base end portion 42a) of the heat radiation auxiliary plate 42 in the ventilation direction WD by screwing or the like. Thereby, when the heat dissipation auxiliary plate 42 becomes equal to or higher than the deformation temperature, wind can be received by the wide surface (the inclined surface 42c), and the cooling effect can be enhanced as in the embodiment.

  Also, the number of auxiliary heat radiation plates 42 attached to each heat sink 41 may be plural. In this case, the arrangement of the heat radiation auxiliary plate 42 may be arbitrarily set according to the shape of the heat sink 41. For example, the plurality of heat radiation auxiliary plates 42 may be arranged in the ventilation direction WD, or may be arranged in the ventilation orthogonal direction.

  Further, although the heat radiation auxiliary plate 42 is disposed such that the base end portion 42a is on the downstream side in the ventilation direction and the tip end portion 42b is on the upstream side in the ventilation direction, the present invention is not limited to this. Specifically, other arrangements may be used as long as the area of touching the wind passing through the ventilation path WL increases due to the deformation of the heat radiation auxiliary plate 42. For example, the heat radiation auxiliary plate 42 may be arranged such that the base end portion 42a is on the upstream side in the ventilation direction WD and the tip end portion 42b is on the downstream side in the ventilation direction WD. You may arrange | position so that the part 42a and the front-end | tip part 42b may be located in a line. However, by disposing the base end portion 42a of the heat radiation auxiliary plate 42 on the downstream side in the airflow direction, an air flow toward the heat sink 41 can be created by the inclined surface 42c of the heat radiation auxiliary plate 42, and a higher cooling effect can be obtained. Can do.

  Further, the heat sink 41 has the fins 41b, but may be a plate-like heat sink 41 without the fins 41b. Even in this case, the same effect can be obtained by fixing the heat radiation auxiliary plate 42 to the heat sink 41 as in the above embodiment.

  Although illustration is omitted, when the heat radiation target component 31a is a flat plate, the heat radiation target component 31a may be attached so as to be sandwiched between the lower end fin 41c and the circuit board 30 in FIGS. Absent.

  In the above embodiment, the example in which the heat dissipation target component 31a is directly fixed to the heat sink 41 has been described. However, the present invention is not limited to this. For example, the heat radiation target component 31a may be attached to the circuit board 30 or the housing 20 and arranged so as to be in contact with the heat sink 41 in that state, and the same effect can be obtained.

  Furthermore, although the power supply device 10 has been described as an example of the electric / electronic device provided with the heat dissipation unit 40, the device to be applied is not particularly limited. For example, the technology of the present disclosure can be applied to electric / electronic devices other than the power supply device, and the same effect can be obtained.

  In the above embodiment, the base end portion 42a of the heat radiation auxiliary plate 42 is fixed to the upper end fin 41d, that is, the fixed portion is provided on the base end portion 42a of the heat radiation auxiliary plate 42. It is not limited to. For example, the position where the fixing portion is provided may be an intermediate portion in the longitudinal direction of the heat radiation auxiliary plate 42, or may be both the intermediate portion and the base end portion 42a. Even in such a case, when the auxiliary heat dissipation plate 42 reaches a predetermined deformation temperature or more, the end portion (deformation end portion) at a position different from the fixing position by the fixing portion is deformed in a direction away from the heat sink 41. For example, when a fixing portion is provided in the center of the heat dissipation auxiliary plate 42 in the longitudinal direction and the fixing portion is fixed to the upper end fin 41d with a screw or the like, the heat dissipation auxiliary plate 42 has both ends in the longitudinal direction centered on the fixing portion. The portion (deformed end portion) is deformed in a direction away from the heat sink 41.

  INDUSTRIAL APPLICABILITY The present invention is extremely useful in a device such as a power supply device because the cooling effect can be enhanced without increasing the size of the heat sink and the size of the heat radiating unit can be optimized (miniaturized). .

10 Power supply (electrical / electronic equipment)
20 Housing 21 Ventilation port 31a Heat radiation target component (electronic component)
40 Heat Dissipation Unit 41 Heat Sink 42 Heat Dissipation Auxiliary Plate 42a Base End (Fixed Part)
42b Tip (deformed end)

Claims (6)

A heat dissipation unit for electrical and electronic equipment,
A heat sink,
A heat radiation auxiliary plate that extends along the heat sink and has a fixed portion fixed to the heat sink and a deformed end provided at a position different from the fixed portion;
The heat dissipation unit is characterized in that the deformed end portion is deformed in a direction away from the heat sink when the heat dissipating auxiliary plate reaches a predetermined deformation temperature or higher. The heat dissipating unit according to claim 1,
The heat sink includes a base plate and a plurality of fins standing on the base plate at a predetermined pitch,
The heat radiating unit according to claim 1, wherein the fixed portion and the deformed end portion of the heat radiation auxiliary plate are arranged along a ventilation direction connecting both side ends of the fin. It has a housing in which the heat dissipation unit according to claim 1 is accommodated, and the housing is formed with at least two vent holes for communicating inside and outside the housing,
The heat radiating unit is on a ventilation path formed between the vents, the fixing portion of the heat radiation auxiliary plate is on the downstream side in the ventilation direction along the ventilation path, and the deformed end is upstream in the ventilation direction. An electrical / electronic device characterized by being placed on the side. The electric / electronic device according to claim 3.
An electrical / electronic device, wherein an electronic component is attached in contact with the heat sink at a position upstream of the deformed end portion of the heat dissipation auxiliary plate in the ventilation direction. The electric / electronic device according to claim 3.
Within the housing, a plurality of the heat dissipation units are arranged side by side along the ventilation direction,
In the plurality of heat dissipating units, the deformation temperatures of the heat dissipating auxiliary plates constituting each of the heat dissipating units are different from each other. The electric / electronic device according to claim 3.
A plurality of the heat radiating units are arranged so that positions of the heat radiating auxiliary plates constituting each of the heat radiating units are different from each other in a direction perpendicular to the ventilation direction orthogonal to the ventilation direction. machine.

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