JP2018147865A - Heater and image formation device - Google Patents

Heater and image formation device Download PDF

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JP2018147865A
JP2018147865A JP2017045046A JP2017045046A JP2018147865A JP 2018147865 A JP2018147865 A JP 2018147865A JP 2017045046 A JP2017045046 A JP 2017045046A JP 2017045046 A JP2017045046 A JP 2017045046A JP 2018147865 A JP2018147865 A JP 2018147865A
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heating element
resistance heating
substrate
resistance
longitudinal direction
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JP6828523B2 (en
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雅彦 玉井
Masahiko Tamai
雅彦 玉井
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Toshiba Lighting and Technology Corp
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Abstract

PROBLEM TO BE SOLVED: To suppress the occurrence of substrate cracks.SOLUTION: A heater comprises: a rectangular substrate; a first resistance heating element which is extended along a longitudinal direction of the substrate, and has an equal resistance value per a unit length in the longitudinal direction; a second resistance heating element which is extended along the longitudinal direction of the substrate, and has the resistance value of both ends smaller than that at the center in the longitudinal direction; and a third resistance heating element which is extended along the longitudinal direction of the substrate, and has the resistance value of both ends larger than that at the center in the longitudinal direction. The first resistance heating element is arranged on one end side in a short direction of the substrate. One resistance heating element from the second resistance heating element and the third resistance heating element, in which the difference of the resistance value of the center and both sides is small is arranged on the other side in the short direction of the substrate. The other resistance heating element in which the difference of the resistance value of the center and both sides is arranged between the first resistance heating element and one resistance heating element.SELECTED DRAWING: Figure 2

Description

本発明の実施形態は、ヒータ及び画像形成装置に関する。   Embodiments described herein relate generally to a heater and an image forming apparatus.

例えば、複写機やファクシミリ等におけるトナー定着、リライタブルカードリーダにおける印字消去等に用いられるヒータが知られている。ヒータは、給電用の電極から供給された電力により、基板上に形成された抵抗発熱体を発熱させる。   For example, a heater used for fixing toner in a copying machine, a facsimile, or the like, and erasing printing in a rewritable card reader is known. The heater generates heat from the resistance heating element formed on the substrate by the electric power supplied from the power supply electrode.

特開2007−240606号公報JP 2007-240606 A

一般に、抵抗発熱体は、長尺状の基板の長手方向に沿って帯状に延ばされている。ヒータは、例えば、抵抗発熱体が加熱する用紙幅(基板の長手方向)の違いに起因して基板の長手方向に温度分布が生じる傾向がある。ヒータでは、基板の長手方向に温度分布が生じることを避け、複数種類の用紙幅に対応するために、基板の短手方向に対する幅が、基板の長手方向に沿って変化する複数の抵抗発熱体が用いられている。このような構成では、基板の長手方向における抵抗発熱体の中央部と両端部との間に生じる温度勾配が大きくなった場合、熱膨張の影響により基板の割れが生じる問題がある。   Generally, the resistance heating element is extended in a strip shape along the longitudinal direction of the long substrate. The heater tends to generate a temperature distribution in the longitudinal direction of the substrate due to, for example, a difference in paper width (longitudinal direction of the substrate) heated by the resistance heating element. In the heater, in order to avoid temperature distribution in the longitudinal direction of the substrate and to cope with a plurality of types of paper widths, a plurality of resistance heating elements whose width in the short direction of the substrate changes along the longitudinal direction of the substrate Is used. In such a configuration, when the temperature gradient generated between the central portion and both ends of the resistance heating element in the longitudinal direction of the substrate becomes large, there is a problem that the substrate is cracked due to the influence of thermal expansion.

そこで、本発明は、基板の割れが生じることを抑えることができるヒータ及び画像形成装置を提供することを目的とする。   SUMMARY An advantage of some aspects of the invention is that it provides a heater and an image forming apparatus that can suppress the occurrence of cracks in a substrate.

実施形態に係るヒータは、矩形状の基板と、前記基板の長手方向に沿って延び、単位長さ当たりの抵抗値が前記長手方向にわたって均等な第1の抵抗発熱体と、前記基板の長手方向に沿って延び、前記長手方向における中央の前記抵抗値が両端の前記抵抗値よりも小さい第2の抵抗発熱体と、前記基板の長手方向に沿って延び、前記長手方向における中央の前記抵抗値が両端の前記抵抗値よりも大きい第3の抵抗発熱体と、を備える。前記第1の抵抗発熱体は、前記基板の短手方向における一端側に配置される。前記第2の抵抗発熱体と前記第3の抵抗発熱体のうち、前記中央と前記両端との前記抵抗値の差が小さい一方の抵抗発熱体が、前記基板の短手方向における他端側に配置され、前記中央と前記両端との前記抵抗値の差が大きい他方の抵抗発熱体が、前記第1の抵抗発熱体と前記一方の抵抗発熱体との間に配置される。   The heater according to the embodiment includes a rectangular substrate, a first resistance heating element extending along the longitudinal direction of the substrate, and having a uniform resistance value per unit length over the longitudinal direction, and the longitudinal direction of the substrate The resistance value at the center in the longitudinal direction is smaller than the resistance values at both ends, and the resistance value at the center in the longitudinal direction is extended along the longitudinal direction of the substrate. And a third resistance heating element having a resistance value larger than the resistance values at both ends. The first resistance heating element is arranged on one end side in the short direction of the substrate. Of the second resistance heating element and the third resistance heating element, one resistance heating element having a small difference in resistance value between the center and the both ends is disposed on the other end side in the short direction of the substrate. The other resistance heating element that is arranged and has a large difference in resistance value between the center and the both ends is arranged between the first resistance heating element and the one resistance heating element.

本発明によれば、基板の割れが生じることを抑えることができる。   According to the present invention, it is possible to prevent the substrate from being cracked.

実施形態に係るヒータを示す平面図である。It is a top view which shows the heater which concerns on embodiment. 実施形態に係るヒータにおける各抵抗発熱体の配置の一例を模式的に示す平面図である。It is a top view which shows typically an example of arrangement | positioning of each resistance heating element in the heater which concerns on embodiment. 実施形態に係るヒータにおける各抵抗発熱体の配置の他の例を模式的に示す平面図である。It is a top view which shows typically the other example of arrangement | positioning of each resistance heating element in the heater which concerns on embodiment. 参考形態に係るヒータを示す平面図である。It is a top view which shows the heater which concerns on a reference form. 参考形態に係るヒータの一例における基板の温度分布を説明するためのグラフである。It is a graph for demonstrating the temperature distribution of the board | substrate in an example of the heater which concerns on a reference form. 参考形態に係るヒータの他の例における基板の温度分布を説明するためのグラフである。It is a graph for demonstrating the temperature distribution of the board | substrate in the other example of the heater which concerns on a reference form. 実施形態に係るヒータにおける基板の温度分布を説明するためのグラフである。It is a graph for demonstrating the temperature distribution of the board | substrate in the heater which concerns on embodiment. 実施形態に係るヒータが用いられた定着装置の一実施形態を示す断面図である。It is sectional drawing which shows one Embodiment of the fixing device using the heater which concerns on embodiment. 実施形態に係るヒータが用いられた画像形成装置の一実施形態を示す断面図である。1 is a cross-sectional view showing an embodiment of an image forming apparatus using a heater according to an embodiment.

以下で説明する実施形態に係るヒータは、矩形状の基板と、第1の抵抗発熱体と、第2の抵抗発熱体と、第3の抵抗発熱体と、を備える。第1の抵抗発熱体は、基板の長手方向に沿って延びている。第1の抵抗発熱体は、単位長さ当たりの抵抗値が基板の長手方向にわたって均等である。第2の抵抗発熱体は、基板の長手方向に沿って延びている。第2の抵抗発熱体は、基板の長手方向における中央の抵抗値が両端の抵抗値よりも小さい。第3の抵抗発熱体は、基板の長手方向に沿って延びている。第3の抵抗発熱体は、基板の長手方向における中央の抵抗値が両端の抵抗値よりも大きい。第1の抵抗発熱体は、基板の短手方向における一端側に配置されている。第2の抵抗発熱体と第3の抵抗発熱体のうち、基板の長手方向における中央と両端との抵抗値の差が小さい一方の抵抗発熱体が、基板の短手方向における他端側に配置されている。第2の抵抗発熱体と第3の抵抗発熱体のうち、基板の長手方向における中央と両端との抵抗値の差が大きい他方の抵抗発熱体が、第1の抵抗発熱体と一方の抵抗発熱体との間に配置される。   A heater according to an embodiment described below includes a rectangular substrate, a first resistance heating element, a second resistance heating element, and a third resistance heating element. The first resistance heating element extends along the longitudinal direction of the substrate. In the first resistance heating element, the resistance value per unit length is uniform over the longitudinal direction of the substrate. The second resistance heating element extends along the longitudinal direction of the substrate. In the second resistance heating element, the resistance value at the center in the longitudinal direction of the substrate is smaller than the resistance values at both ends. The third resistance heating element extends along the longitudinal direction of the substrate. In the third resistance heating element, the resistance value at the center in the longitudinal direction of the substrate is larger than the resistance values at both ends. The first resistance heating element is disposed on one end side in the short direction of the substrate. Of the second resistance heating element and the third resistance heating element, one resistance heating element having a small difference in resistance value between the center and both ends in the longitudinal direction of the substrate is arranged on the other end side in the short direction of the substrate. Has been. Of the second resistance heating element and the third resistance heating element, the other resistance heating element having a large resistance difference between the center and both ends in the longitudinal direction of the substrate is the first resistance heating element and one resistance heating element. Placed between the body.

また、以下で説明する実施形態に係るヒータにおいて、基板の短手方向における第1の抵抗発熱体の幅は、長手方向にわたって均等である。第2の抵抗発熱体は、基板の長手方向における中央の幅が両端の幅よりも大きい。第3の抵抗発熱体は、基板の長手方向における中央の幅が両端の幅よりも小さい。   In the heater according to the embodiment described below, the width of the first resistance heating element in the short direction of the substrate is uniform in the longitudinal direction. In the second resistance heating element, the center width in the longitudinal direction of the substrate is larger than the widths at both ends. The third resistance heating element has a width at the center in the longitudinal direction of the substrate that is smaller than the width at both ends.

また、以下で説明する実施形態に係るヒータにおいて、第2の抵抗発熱体は、基板の長手方向における中央の抵抗値に対する両端の抵抗値が180[%]以下である。第3の抵抗発熱体は、基板の長手方向における中央の抵抗値に対する両端の抵抗値が20[%]以上である。   In the heater according to the embodiment described below, the resistance value of both ends of the second resistance heating element with respect to the central resistance value in the longitudinal direction of the substrate is 180% or less. In the third resistance heating element, the resistance values at both ends with respect to the central resistance value in the longitudinal direction of the substrate are 20% or more.

また、以下で説明する実施形態に係るヒータは、導体を更に備える。導体は、第1の抵抗発熱体、第2の抵抗発熱体及び第3の抵抗発熱体に電力を供給する。導体は、第1の電極部、第2の電極部及び第3の電極部と、導通部と、を有する。第1の電極部、第2の電極部及び第3の電極部は、基板の長手方向における一端側にそれぞれ配置されている。第1の電極部は、第1の抵抗発熱体に接続される。第2の電極部は、第2の抵抗発熱体に接続される。第3の電極部は、第3の抵抗発熱体に接続される。導通部は、基板の長手方向における他端側に配置されている。導通部は、第1の抵抗発熱体、第2の抵抗発熱体及び第3の抵抗発熱体に跨って導通されている。   The heater according to the embodiment described below further includes a conductor. The conductor supplies power to the first resistance heating element, the second resistance heating element, and the third resistance heating element. The conductor has a first electrode part, a second electrode part, a third electrode part, and a conduction part. The first electrode portion, the second electrode portion, and the third electrode portion are respectively disposed on one end side in the longitudinal direction of the substrate. The first electrode portion is connected to the first resistance heating element. The second electrode portion is connected to the second resistance heating element. The third electrode portion is connected to the third resistance heating element. The conducting portion is disposed on the other end side in the longitudinal direction of the substrate. The conducting portion is conducted across the first resistance heating element, the second resistance heating element, and the third resistance heating element.

また、以下で説明する実施形態に係る画像形成装置は、ヒータと、加圧ローラと、を備える。ヒータは、媒体を加熱する。加圧ローラは、ヒータによって加熱される媒体を加圧する。画像形成装置は、ヒータ及び加圧ローラによって、媒体に付着させたトナーを定着させる。   In addition, an image forming apparatus according to an embodiment described below includes a heater and a pressure roller. The heater heats the medium. The pressure roller presses the medium heated by the heater. The image forming apparatus fixes the toner attached to the medium by a heater and a pressure roller.

(実施形態)
以下、実施形態に係るヒータについて、図面を参照して説明する。図1は、実施形態に係るヒータを示す平面図である。図2は、実施形態に係るヒータにおける各抵抗発熱体の配置の一例を模式的に示す平面図である。図3は、実施形態に係るヒータにおける各抵抗発熱体の配置の他の例を模式的に示す平面図である。
(Embodiment)
Hereinafter, a heater according to an embodiment will be described with reference to the drawings. FIG. 1 is a plan view showing a heater according to the embodiment. Drawing 2 is a top view showing typically an example of arrangement of each resistance heating element in a heater concerning an embodiment. FIG. 3 is a plan view schematically showing another example of the arrangement of the resistance heating elements in the heater according to the embodiment.

(ヒータの構成)
図1に示すように、本実施形態に係るヒータ1は、画像形成装置等の電子機器に搭載され、例えば、ヒータ1を通過する紙等を加熱するために用いられる。ヒータ1は、矩形状である長尺状の基板5と、基板5上に設けられた帯状の第1の抵抗発熱体6、第2の抵抗発熱体7及び第3の抵抗発熱体8と、を有する。また、ヒータ1は、第1の抵抗発熱体6、第2の抵抗発熱体7及び第3の抵抗発熱体8へ電力をそれぞれ供給するための導体10と、第1の抵抗発熱体6、第2の抵抗発熱体7及び第3の抵抗発熱体8、導体10をそれぞれ被覆する保護膜(オーバーコート層)11と、を備える。
(Heater configuration)
As shown in FIG. 1, the heater 1 according to the present embodiment is mounted on an electronic apparatus such as an image forming apparatus, and is used to heat, for example, paper passing through the heater 1. The heater 1 includes an elongated substrate 5 having a rectangular shape, a strip-shaped first resistance heating element 6, a second resistance heating element 7, and a third resistance heating element 8 provided on the substrate 5, Have The heater 1 includes a conductor 10 for supplying electric power to the first resistance heating element 6, the second resistance heating element 7, and the third resistance heating element 8, respectively, the first resistance heating element 6, 2 resistance heating elements 7, third resistance heating elements 8, and protective films (overcoat layers) 11 covering the conductors 10, respectively.

基板5は、例えば、アルミナ等のセラミック、ガラスセラミック、耐熱複合材料等によって形成されており、耐熱性及び絶縁性を有する。基板5の厚みは、例えば、0.5[mm]程度〜1.0[mm]程度に形成されている。   The substrate 5 is made of, for example, ceramic such as alumina, glass ceramic, heat resistant composite material, or the like, and has heat resistance and insulation. The thickness of the substrate 5 is, for example, about 0.5 [mm] to about 1.0 [mm].

図1及び図2に示すように、第1の抵抗発熱体6、第2の抵抗発熱体7及び第3の抵抗発熱体8は、基板5の長手方向(X方向)に沿って延びる帯状に形成されており、基板5の短手方向(Y方向)に間隔をあけて配置されている。第1の抵抗発熱体6、第2の抵抗発熱体7及び第3の抵抗発熱体8は、電流を流すことで発熱するものであり、例えば、酸化ルテニウム(RuO)、銀・パラジウム(Ag−Pd)合金を含む材料等によって形成されている。第1の抵抗発熱体6、第2の抵抗発熱体7及び第3の抵抗発熱体8は、抵抗発熱体ペーストを基板5上に塗布して硬化させることで形成されている。 As shown in FIGS. 1 and 2, the first resistance heating element 6, the second resistance heating element 7, and the third resistance heating element 8 are formed in a strip shape extending along the longitudinal direction (X direction) of the substrate 5. It is formed, and is arranged at intervals in the short side direction (Y direction) of the substrate 5. The first resistance heating element 6, the second resistance heating element 7, and the third resistance heating element 8 generate heat when an electric current flows. For example, ruthenium oxide (RuO 2 ), silver / palladium (Ag) -Pd) It is made of a material containing an alloy or the like. The first resistance heating element 6, the second resistance heating element 7, and the third resistance heating element 8 are formed by applying a resistance heating element paste on the substrate 5 and curing it.

図2に示すように、第1の抵抗発熱体6は、単位長さ当たりの電気抵抗値が、基板5の長手方向全体にわたって均等に形成されている。例えば、基板5の短手方向に対する第1の抵抗発熱体6の幅W1は、基板5の長手方向全体にわたって均等なストレート状に形成されている。また、第1の抵抗発熱体6は、図1に示すように、基板5の短手方向における一端側に配置されている。   As shown in FIG. 2, the first resistance heating element 6 has an electrical resistance value per unit length that is evenly formed over the entire length of the substrate 5. For example, the width W1 of the first resistance heating element 6 with respect to the short direction of the substrate 5 is formed in a uniform straight shape over the entire length direction of the substrate 5. Further, the first resistance heating element 6 is arranged on one end side in the short direction of the substrate 5 as shown in FIG.

第2の抵抗発熱体7は、基板5の長手方向における中央の抵抗値が、両端の抵抗値よりも小さい。例えば、基板5の長手方向において、第2の抵抗発熱体7の中央の幅W2aは、両端の幅W2bよりも大きい。第2の抵抗発熱体7は、基板5の長手方向における中央から両端に向かって幅W2aが幅W2bまで小さくなるテーパ状に形成されている。   In the second resistance heating element 7, the central resistance value in the longitudinal direction of the substrate 5 is smaller than the resistance values at both ends. For example, in the longitudinal direction of the substrate 5, the center width W2a of the second resistance heating element 7 is larger than the width W2b at both ends. The second resistance heating element 7 is formed in a tapered shape in which the width W2a decreases from the center in the longitudinal direction of the substrate 5 to both ends toward the width W2b.

第3の抵抗発熱体8は、基板5の長手方向における中央の抵抗値が、両端の抵抗値よりも大きい。基板5の長手方向において、第3の抵抗発熱体8の中央の幅W3aが、両端の幅W3bよりも小さい。第3の抵抗発熱体8は、基板5の長手方向における中央から両端に向かって幅W3aが幅W3bまで大きくなるテーパ状に形成されている。   In the third resistance heating element 8, the central resistance value in the longitudinal direction of the substrate 5 is larger than the resistance values at both ends. In the longitudinal direction of the substrate 5, the width W3a at the center of the third resistance heating element 8 is smaller than the width W3b at both ends. The third resistance heating element 8 is formed in a taper shape in which the width W3a increases from the center in the longitudinal direction of the substrate 5 toward both ends to the width W3b.

そして、第2の抵抗発熱体7と第3の抵抗発熱体8のうち、基板5の長手方向における中央と両端との抵抗値の差(抵抗値の勾配)が小さい一方の抵抗発熱体が、基板5の短手方向における他端側に配置されている。また、第2の抵抗発熱体7と第3の抵抗発熱体8のうち、基板5の長手方向における中央と両端との抵抗値の差が大きい他方の抵抗発熱体が、第1の抵抗発熱体6と一方の抵抗発熱体との間に配置される。以下、抵抗発熱体について、基板5の長手方向における抵抗値の差を、単に「抵抗値の勾配」と称する。また、温度勾配は、基板5の長手方向に生じるものを指す。   Of the second resistance heating element 7 and the third resistance heating element 8, one resistance heating element having a small difference in resistance value (resistance value gradient) between the center and both ends in the longitudinal direction of the substrate 5 is: It is arranged on the other end side in the short direction of the substrate 5. Of the second resistance heating element 7 and the third resistance heating element 8, the other resistance heating element having a large difference in resistance value between the center and both ends in the longitudinal direction of the substrate 5 is the first resistance heating element. 6 and one resistance heating element. Hereinafter, regarding the resistance heating element, the difference in resistance value in the longitudinal direction of the substrate 5 is simply referred to as “resistance value gradient”. Further, the temperature gradient refers to what occurs in the longitudinal direction of the substrate 5.

言い換えると、第2の抵抗発熱体7と第3の抵抗発熱体8のうち、基板5の長手方向において加熱に伴う温度勾配が相対的に生じ難い抵抗発熱体が、基板5の短手方向に対して、第1の抵抗発熱体6が配置された一端側とは反対側の他端側に配置されている。また、基板5の長手方向において温度勾配が相対的に生じ易い抵抗発熱体が、基板5の短手方向に対して、基板5の長手方向において温度勾配が相対的に生じない第1の抵抗発熱体6に隣接して配置されている。   In other words, of the second resistance heating element 7 and the third resistance heating element 8, the resistance heating element that hardly causes a temperature gradient due to heating in the longitudinal direction of the substrate 5 is formed in the short direction of the substrate 5. On the other hand, it arrange | positions at the other end side on the opposite side to the one end side in which the 1st resistance heating element 6 is arrange | positioned. In addition, the resistance heating element in which the temperature gradient is relatively likely to occur in the longitudinal direction of the substrate 5 is the first resistance heating in which the temperature gradient is not relatively caused in the longitudinal direction of the substrate 5 with respect to the short direction of the substrate 5. Arranged adjacent to the body 6.

例えば、第2の抵抗発熱体7の抵抗値の勾配が、第3の抵抗発熱体8の抵抗値の勾配よりも大きい場合には、図2に示すように、第2の抵抗発熱体7が第1の抵抗発熱体6に隣接して配置され、第3の抵抗発熱体8が基板5の短手方向における他端側に配置されている。すなわち、基板5の短手方向において、第2の抵抗発熱体7は、第1の抵抗発熱体6と第3の抵抗発熱体8との間に配置されている。   For example, when the gradient of the resistance value of the second resistance heating element 7 is larger than the gradient of the resistance value of the third resistance heating element 8, as shown in FIG. The third resistance heating element 8 is arranged adjacent to the first resistance heating element 6, and is arranged on the other end side in the short direction of the substrate 5. That is, in the short direction of the substrate 5, the second resistance heating element 7 is disposed between the first resistance heating element 6 and the third resistance heating element 8.

このようにヒータ1が構成された場合、温度勾配が相対的に生じ易い第2の抵抗発熱体7によって生じる温度分布が、温度勾配が生じない第1の抵抗発熱体6の発熱によって弱められると共に、温度勾配が相対的に生じ難い第3の抵抗発熱体8が基板5の他端側に配置されることで、基板5の他端側に生じる温度分布が抑えられる。   When the heater 1 is configured as described above, the temperature distribution generated by the second resistance heating element 7 in which the temperature gradient is relatively likely to occur is weakened by the heat generation of the first resistance heating element 6 in which the temperature gradient does not occur. The temperature distribution generated on the other end side of the substrate 5 can be suppressed by disposing the third resistance heating element 8 on the other end side of the substrate 5 where the temperature gradient is relatively difficult to occur.

一方、第3の抵抗発熱体8の抵抗値の勾配が、第2の抵抗発熱体7の抵抗値の勾配よりも大きい場合には、図3に示すように、第3の抵抗発熱体8が第1の抵抗発熱体6に隣接して配置され、第2の抵抗発熱体7が基板5の短手方向における他端側に配置されている。すなわち、基板5の短手方向において、第3の抵抗発熱体8は、第1の抵抗発熱体6と第2の抵抗発熱体7との間に配置されている。   On the other hand, when the gradient of the resistance value of the third resistance heating element 8 is larger than the gradient of the resistance value of the second resistance heating element 7, as shown in FIG. The second resistance heating element 7 is arranged adjacent to the first resistance heating element 6, and the second resistance heating element 7 is arranged on the other end side in the short direction of the substrate 5. That is, in the short direction of the substrate 5, the third resistance heating element 8 is disposed between the first resistance heating element 6 and the second resistance heating element 7.

このようにヒータ1が構成された場合、温度勾配が相対的に生じ易い第3の抵抗発熱体8によって生じる温度分布が、温度勾配が生じない第1の抵抗発熱体6の発熱によって弱められると共に、温度勾配が相対的に生じ難い第2の抵抗発熱体7が基板5の他端側に配置されることで、基板5の他端側に生じる温度分布が抑えられる。   When the heater 1 is configured as described above, the temperature distribution generated by the third resistance heating element 8 in which the temperature gradient is relatively likely to occur is weakened by the heat generation of the first resistance heating element 6 in which the temperature gradient does not occur. The temperature distribution generated on the other end side of the substrate 5 can be suppressed by arranging the second resistance heating element 7 on which the temperature gradient is relatively unlikely to be generated on the other end side of the substrate 5.

また、図2及び図3にそれぞれ示す各構成において、基板5の長手方向に対する第2の抵抗発熱体7の中央の抵抗値を100[%]としたとき、第2の抵抗発熱体7の中央の抵抗値に対する両端の抵抗値が180[%]以下である。また、基板5の長手方向に対する第3の抵抗発熱体8の中央の抵抗値を100[%]としたとき、第3の抵抗発熱体8の中央の抵抗値に対する両端の抵抗値が20[%]以上である。基板5の長手方向に対する第2の抵抗発熱体7及び第3の抵抗発熱体8の抵抗値は、基板5の短手方向に生じる温度分布を抑える上で、上述の範囲内に抵抗値が設定されることが好ましい。   2 and 3, when the resistance value at the center of the second resistance heating element 7 with respect to the longitudinal direction of the substrate 5 is 100 [%], the center of the second resistance heating element 7 is used. The resistance value at both ends with respect to the resistance value is 180 [%] or less. When the resistance value at the center of the third resistance heating element 8 with respect to the longitudinal direction of the substrate 5 is 100 [%], the resistance value at both ends with respect to the resistance value at the center of the third resistance heating element 8 is 20 [%]. That's it. The resistance values of the second resistance heating element 7 and the third resistance heating element 8 with respect to the longitudinal direction of the substrate 5 are set within the above range in order to suppress the temperature distribution occurring in the short direction of the substrate 5. It is preferred that

なお、本実施形態における第1の抵抗発熱体6、第2の抵抗発熱体7及び第3の抵抗発熱体8は、基板5の長手方向に対して幅を変化させることで抵抗値が長手方向に対して変化するように形成されたが、この構成に限定されるものではない。抵抗発熱体としては、例えば、形成材料の組成の分布によって抵抗値に勾配が生じるものであってもよく、長手方向に対して抵抗値の勾配を有する傾斜材料が用いられてもよい。   Note that the first resistance heating element 6, the second resistance heating element 7, and the third resistance heating element 8 in this embodiment have a resistance value in the longitudinal direction by changing the width with respect to the longitudinal direction of the substrate 5. However, the present invention is not limited to this configuration. As the resistance heating element, for example, a resistance value may be gradient depending on the composition distribution of the forming material, or a gradient material having a resistance value gradient with respect to the longitudinal direction may be used.

導体10は、電力を供給する端子部(図示せず)とそれぞれ接続される第1の電極部10a、第2の電極部10b及び第3の電極部10cと、第1の電極部10aと第1の抵抗発熱体6とを接続する第1の接続部10dと、第2の電極部10bと第2の抵抗発熱体7とを接続する第2の接続部10eと、第3の電極部10cと第3の抵抗発熱体8とを接続する第3の接続部10fと、第1の抵抗発熱体6、第2の抵抗発熱体7及び第3の抵抗発熱体8に跨って導通された導通部10gと、を有する。導体10は、例えば、銀(Ag)系の材料等によって形成されており、低抵抗導体ペーストを基板5上に塗布して硬化させることで形成されている。   The conductor 10 includes a first electrode portion 10a, a second electrode portion 10b, a third electrode portion 10c, and a first electrode portion 10a and a first electrode portion, which are respectively connected to a terminal portion (not shown) for supplying power. A first connecting part 10d for connecting the first resistance heating element 6, a second connecting part 10e for connecting the second electrode part 10b and the second resistance heating element 7, and a third electrode part 10c. And the third resistance heating element 8 and the third resistance heating element 8, the second resistance heating element 7, the second resistance heating element 7, and the third resistance heating element 8. Part 10g. The conductor 10 is formed of, for example, a silver (Ag) -based material or the like, and is formed by applying and curing a low resistance conductor paste on the substrate 5.

第1の電極部10a、第2の電極部10b及び第3の電極部10cは、基板5の長手方向(X方向)における一端側に、互いに間隔をあけて配置されている。第1の接続部10d、第2の接続部10e及び第3の接続部10fは、基板5の長手方向に沿って延びて設けられている。導通部10gは、基板5の長手方向における他端側に、第1の抵抗発熱体6、第2の抵抗発熱体7及び第3の抵抗発熱体8の各端部に跨って配置されている。このようにヒータ1は、基板5の長手方向における一端側に第1の電極部10a、第2の電極部10b及び第3の電極部10cが集約された、いわゆる片側給電構造であり、電極部の個数を減らして基板5が小型化されている。   The first electrode portion 10a, the second electrode portion 10b, and the third electrode portion 10c are disposed at one end side in the longitudinal direction (X direction) of the substrate 5 with a space therebetween. The first connection portion 10 d, the second connection portion 10 e, and the third connection portion 10 f are provided so as to extend along the longitudinal direction of the substrate 5. The conducting portion 10g is disposed on the other end side in the longitudinal direction of the substrate 5 across the end portions of the first resistance heating element 6, the second resistance heating element 7, and the third resistance heating element 8. . Thus, the heater 1 has a so-called one-side power feeding structure in which the first electrode portion 10a, the second electrode portion 10b, and the third electrode portion 10c are integrated on one end side in the longitudinal direction of the substrate 5, and the electrode portion The substrate 5 is reduced in size by reducing the number of.

保護膜11は、導体10の第1の電極部10a、第2の電極部10b及び第3の電極部10cを露出させて基板5上に形成されている。保護膜11は、第1の抵抗発熱体6、第2の抵抗発熱体7及び第3の抵抗発熱体8、導体10の第1の接続部10d、第2の接続部10e及び第3の接続部10f、導通部10gが外部へ直接露出することを防ぎ、外部からの干渉(例えば、機械的、化学的、電気的な干渉)によって損傷することを抑える。保護膜11としては、例えば、熱伝導性が優れるアルミナ等の無機酸化物フィラーが添加されることにより熱伝導率が2[W/(m・K)]程度以上であるガラス層が用いられている。   The protective film 11 is formed on the substrate 5 by exposing the first electrode portion 10a, the second electrode portion 10b, and the third electrode portion 10c of the conductor 10. The protective film 11 includes the first resistance heating element 6, the second resistance heating element 7, the third resistance heating element 8, the first connection part 10d of the conductor 10, the second connection part 10e, and the third connection. The portion 10f and the conductive portion 10g are prevented from being directly exposed to the outside, and are prevented from being damaged by external interference (for example, mechanical, chemical, or electrical interference). As the protective film 11, for example, a glass layer having a thermal conductivity of about 2 [W / (m · K)] or more by adding an inorganic oxide filler such as alumina having excellent thermal conductivity is used. Yes.

(参考形態)
図4は、参考形態に係るヒータを示す平面図である。ここで、本実施形態のヒータ1と比較するための参考形態のヒータについて説明する。図4に示すように、参考形態のヒータ2は、実施形態における第1の抵抗発熱体6の代わりに、導体の第1の接続部が基板5の長手方向に沿って延ばされている点が実施形態と異なる。参考形態において、実施形態と同一の構成部材には、実施形態と同一符号を付して説明を省略する。
(Reference form)
FIG. 4 is a plan view showing a heater according to a reference embodiment. Here, the heater of the reference form for comparing with the heater 1 of this embodiment is demonstrated. As shown in FIG. 4, the heater 2 of the reference form is such that the first connecting portion of the conductor extends along the longitudinal direction of the substrate 5 instead of the first resistance heating element 6 in the embodiment. Is different from the embodiment. In the reference embodiment, the same components as those of the embodiment are denoted by the same reference numerals as those of the embodiment and description thereof is omitted.

参考形態のヒータ2は、基板5の長手方向に沿って延びる第1の抵抗発熱体27及び第2の抵抗発熱体28と、第1の抵抗発熱体27及び第2の抵抗発熱体28に電力を供給する導体20と、を有する。参考形態における第1の抵抗発熱体27及び第2の抵抗発熱体28は、実施形態における第2の抵抗発熱体7及び第3の抵抗発熱体8と同様であるので説明を省略する。   The heater 2 according to the reference mode supplies power to the first resistance heating element 27 and the second resistance heating element 28 extending along the longitudinal direction of the substrate 5, and to the first resistance heating element 27 and the second resistance heating element 28. And a conductor 20 for supplying. Since the first resistance heating element 27 and the second resistance heating element 28 in the reference form are the same as the second resistance heating element 7 and the third resistance heating element 8 in the embodiment, the description thereof is omitted.

参考形態における導体20は、第1の電極部20a、第2の電極部20b及び第3の電極部20cと、第1の抵抗発熱体27及び第2の抵抗発熱体28と第1の電極部20aとを接続する第1の接続部20dと、第2の電極部20bと第1の抵抗発熱体27とを接続する第2の接続部20eと、第3の電極部20cと第2の抵抗発熱体28とを接続する第3の接続部20fと、第1の抵抗発熱体27と第2の抵抗発熱体28とに跨って導通された導通部20gと、を有する。第1の接続部20dは、導通部20gを介して、第1の抵抗発熱体27及び第2の抵抗発熱体28と接続されている。導体20は、第1の接続部20dが、基板5の長手方向に沿って延ばされており、基板5の短手方向における一端側に配置されている点が、実施形態における導体10と異なる。   The conductor 20 in the reference form includes the first electrode portion 20a, the second electrode portion 20b, the third electrode portion 20c, the first resistance heating element 27, the second resistance heating element 28, and the first electrode portion. A first connecting portion 20d that connects 20a, a second connecting portion 20e that connects the second electrode portion 20b and the first resistance heating element 27, a third electrode portion 20c and a second resistor. A third connecting portion 20f for connecting the heat generating body 28 and a conducting portion 20g conducted across the first resistance heating body 27 and the second resistance heating body 28 are provided. The first connecting portion 20d is connected to the first resistance heating element 27 and the second resistance heating element 28 via the conduction portion 20g. The conductor 20 is different from the conductor 10 in the embodiment in that the first connecting portion 20d extends along the longitudinal direction of the substrate 5 and is disposed on one end side in the short direction of the substrate 5. .

(ヒータの基板における温度分布)
図5は、参考形態に係るヒータ2の一例における基板5の温度分布を説明するためのグラフである。図6は、参考形態に係るヒータ2の他の例における基板5の温度分布を説明するためのグラフである。図7は、実施形態に係るヒータ1における基板5の温度分布を説明するためのグラフである。
(Temperature distribution on heater substrate)
FIG. 5 is a graph for explaining the temperature distribution of the substrate 5 in an example of the heater 2 according to the reference embodiment. FIG. 6 is a graph for explaining the temperature distribution of the substrate 5 in another example of the heater 2 according to the reference embodiment. FIG. 7 is a graph for explaining the temperature distribution of the substrate 5 in the heater 1 according to the embodiment.

図5〜図7において、縦軸は基板5の短手方向に対する相対温度[%]を示し、横軸は基板5の短手方向に対する相対距離[%]を示す。ここで、相対温度とは、基板5の短手方向における中央の温度を100[%]とし、中央の温度に対する相対的な温度を指す。相対距離とは、基板5の短手方向の一端を0[%]、他端を100[%]とした相対位置を指す。参考形態では、相対距離が「0%」である一端側に沿って導体20の第1の接続部20dが延びている。実施形態では、相対距離が0[%]である一端側に沿って第1の抵抗発熱体6が延びている。   5 to 7, the vertical axis represents the relative temperature [%] with respect to the short direction of the substrate 5, and the horizontal axis represents the relative distance [%] with respect to the short direction of the substrate 5. Here, the relative temperature refers to a temperature relative to the central temperature, where the central temperature in the short direction of the substrate 5 is 100 [%]. The relative distance refers to a relative position where one end of the substrate 5 in the short direction is 0 [%] and the other end is 100 [%]. In the reference mode, the first connecting portion 20d of the conductor 20 extends along one end side having a relative distance of “0%”. In the embodiment, the first resistance heating element 6 extends along one end side having a relative distance of 0 [%].

(参考形態の温度分布)
図5は、図4に示すように、基板5の短手方向において第1の抵抗発熱体27が導体20の第1の接続部20dと第2の抵抗発熱体28との間に配置された参考形態の構成について、基板5の短手方向に生じる温度分布を示している。参考形態において、第1の抵抗発熱体27の抵抗値の勾配が、第2の抵抗発熱体28の抵抗値の勾配よりも大きい場合について、基板5の短手方向に生じる温度分布を図5中の実線L1で示す。また、第1の抵抗発熱体27の抵抗値の勾配が、第2の抵抗発熱体28の抵抗値の勾配よりも小さい場合について、基板5の短手方向に生じる温度分布を図5中の破線L2で示す。
(Temperature distribution of reference form)
In FIG. 5, as shown in FIG. 4, the first resistance heating element 27 is arranged between the first connection portion 20 d of the conductor 20 and the second resistance heating element 28 in the short direction of the substrate 5. The temperature distribution generated in the short direction of the substrate 5 is shown for the configuration of the reference form. In the reference embodiment, the temperature distribution generated in the short direction of the substrate 5 in the case where the gradient of the resistance value of the first resistance heating element 27 is larger than the gradient of the resistance value of the second resistance heating element 28 is shown in FIG. This is indicated by a solid line L1. Further, the temperature distribution generated in the short direction of the substrate 5 when the gradient of the resistance value of the first resistance heating element 27 is smaller than the gradient of the resistance value of the second resistance heating element 28 is shown by a broken line in FIG. This is indicated by L2.

図5に示すように、参考形態では、第2の抵抗発熱体28が配置された基板5の他端側近傍の温度が相対的に高くなる。この参考形態では、基板5の他端側近傍の相対温度が140[%]程度(実線L1)または130[%](破線L2)で最大となり、基板5の一端の相対温度が70[%]程度で最小となる。したがって、この参考形態では、基板5の短手方向に対して、相対温度の差が70[%]程度(実線L1)または60[%]程度(破線L2)生じている。   As shown in FIG. 5, in the reference embodiment, the temperature in the vicinity of the other end side of the substrate 5 on which the second resistance heating element 28 is disposed is relatively high. In this reference embodiment, the relative temperature in the vicinity of the other end of the substrate 5 becomes maximum at about 140 [%] (solid line L1) or 130 [%] (broken line L2), and the relative temperature at one end of the substrate 5 is 70 [%]. Minimal in degree. Therefore, in this reference embodiment, the relative temperature difference is about 70 [%] (solid line L1) or about 60 [%] (broken line L2) with respect to the short direction of the substrate 5.

図6は、図4に示した構成と比べて、第1の抵抗発熱体27と第2の抵抗発熱体28の位置を入れ替えた構成、すなわち、基板5の短手方向において第2の抵抗発熱体28が導体20の第1の接続部20dと第1の抵抗発熱体27との間に配置された参考形態の構成について、基板5の短手方向に生じる温度分布を示している。参考形態において、第2の抵抗発熱体28の抵抗値の勾配が、第1の抵抗発熱体27の抵抗値の勾配よりも大きい場合について、基板5の短手方向に生じる温度分布を図6中の実線L3で示す。また、第2の抵抗発熱体28の抵抗値の勾配が、第1の抵抗発熱体27の抵抗値の勾配よりも小さい場合について、基板5の短手方向に生じる温度分布を図6中の破線L4で示す。   6 shows a configuration in which the positions of the first resistance heating element 27 and the second resistance heating element 28 are exchanged as compared with the configuration shown in FIG. 4, that is, the second resistance heating in the short direction of the substrate 5. The temperature distribution generated in the short direction of the substrate 5 is shown for the configuration of the reference embodiment in which the body 28 is disposed between the first connection portion 20 d of the conductor 20 and the first resistance heating element 27. In the reference embodiment, the temperature distribution generated in the short direction of the substrate 5 in the case where the gradient of the resistance value of the second resistance heating element 28 is larger than the gradient of the resistance value of the first resistance heating element 27 is shown in FIG. This is indicated by a solid line L3. 6 shows the temperature distribution generated in the short direction of the substrate 5 when the gradient of the resistance value of the second resistance heating element 28 is smaller than the gradient of the resistance value of the first resistance heating element 27. This is indicated by L4.

図6に示すように、参考形態では、基板5の短手方向における中央近傍の温度が相対的に高くなる。この参考形態では、基板5の中央近傍の相対温度が110[%]程度で最大となり、第1の抵抗発熱体27が配置された基板5の他端の相対温度が50[%]程度(実線L3)または60[%]程度(破線L4)で最小となる。したがって、この参考形態では、基板5の短手方向に対して、相対温度の差が60[%](実線L3)程度または50[%](破線L4)程度生じている。   As shown in FIG. 6, in the reference embodiment, the temperature in the vicinity of the center of the substrate 5 in the short direction is relatively high. In this reference embodiment, the relative temperature in the vicinity of the center of the substrate 5 becomes maximum at about 110 [%], and the relative temperature at the other end of the substrate 5 on which the first resistance heating element 27 is disposed is about 50 [%] (solid line). L3) or about 60 [%] (dashed line L4). Therefore, in this reference embodiment, the relative temperature difference is about 60 [%] (solid line L3) or about 50 [%] (broken line L4) with respect to the short direction of the substrate 5.

(実施形態の温度分布)
図7は、図2に示すように、基板5の短手方向において第2の抵抗発熱体7が第1の抵抗発熱体6と第3の抵抗発熱体8との間に配置された実施形態の構成について、基板5の短手方向に生じる温度分布を示している。この構成では、第2の抵抗発熱体7の温度勾配が、第3の抵抗発熱体8の温度勾配よりも大きい。実施形態において、第1の抵抗発熱体6と共に第3の抵抗発熱体8を加熱したときに、基板5の短手方向に生じる温度分布を図7中の実線L5で示す。また、第1の抵抗発熱体6と共に第2の抵抗発熱体7を加熱したときに、基板5の短手方向に生じる温度分布を図7中の破線L6で示す。
(Temperature distribution of the embodiment)
FIG. 7 shows an embodiment in which the second resistance heating element 7 is arranged between the first resistance heating element 6 and the third resistance heating element 8 in the short direction of the substrate 5 as shown in FIG. The temperature distribution which arises in the transversal direction of the board | substrate 5 about this structure is shown. In this configuration, the temperature gradient of the second resistance heating element 7 is larger than the temperature gradient of the third resistance heating element 8. In the embodiment, when the third resistance heating element 8 is heated together with the first resistance heating element 6, the temperature distribution generated in the short direction of the substrate 5 is indicated by a solid line L5 in FIG. A temperature distribution generated in the short direction of the substrate 5 when the second resistance heating element 7 is heated together with the first resistance heating element 6 is indicated by a broken line L6 in FIG.

図7に示すように、実施形態では、図5及び図6に示す参考形態と比べて、基板5の温度分布が緩やかになる。実施形態では、相対温度が110[%]程度(実線L5)または100[%]程度(破線L6)で最大となり、相対温度が90[%]程度(実線L5)または70[%]程度(破線L6)で最小となる。したがって、実施形態では、基板5の短手方向において、相対温度の差が20[%](実線L5)程度または30[%](破線L6)程度生じている。すなわち、実施形態によれば、参考形態に比べて、基板5の短手方向に生じる温度分布を1/2程度に抑えられる。   As shown in FIG. 7, in the embodiment, the temperature distribution of the substrate 5 becomes gentler than in the reference embodiment shown in FIGS. 5 and 6. In the embodiment, the relative temperature becomes maximum at about 110 [%] (solid line L5) or about 100 [%] (broken line L6), and the relative temperature is about 90 [%] (solid line L5) or about 70 [%] (broken line). L6) is the smallest. Therefore, in the embodiment, the relative temperature difference is about 20 [%] (solid line L5) or about 30 [%] (broken line L6) in the short direction of the substrate 5. That is, according to the embodiment, the temperature distribution generated in the short direction of the substrate 5 can be suppressed to about 1/2 compared to the reference embodiment.

このように実施形態では、温度勾配が生じない第1の抵抗発熱体6が、基板5の一端側に配置されることにより、基板5の一端側に温度分布が生じることが抑えられるので、基板5の割れが基板5の一端側に生じることが抑えられる。このため、基板5の短手方向において、温度勾配が生じない第1の抵抗発熱体6が配置された一端側の端面と、第1の抵抗発熱体6との間の距離を小さくすることが可能になり、基板5の短手方向の寸法を小さくし、コンパクトなヒータ1を実現できる。   Thus, in the embodiment, since the first resistance heating element 6 that does not cause a temperature gradient is arranged on one end side of the substrate 5, it is possible to suppress the temperature distribution from occurring on one end side of the substrate 5. 5 is prevented from occurring on one end side of the substrate 5. For this reason, in the short direction of the substrate 5, the distance between the end surface on the one end side where the first resistance heating element 6 where no temperature gradient is generated and the first resistance heating element 6 can be reduced. Thus, the size of the substrate 5 in the short direction can be reduced, and the compact heater 1 can be realized.

また、実施形態では、温度勾配が相対的に大きい第2の抵抗発熱体7が、第1の抵抗発熱体6に隣接して配置されることで、第1の抵抗発熱体6が基板5を加熱する作用により、第2の抵抗発熱体7によって基板5に生じる温度分布が小さく抑えられる。   In the embodiment, the second resistance heating element 7 having a relatively large temperature gradient is disposed adjacent to the first resistance heating element 6, so that the first resistance heating element 6 holds the substrate 5. Due to the heating action, the temperature distribution generated in the substrate 5 by the second resistance heating element 7 can be kept small.

また、実施形態では、温度勾配が相対的に小さい第3の抵抗発熱体8が、基板5の他端側に配置されることにより、基板5の他端側に温度分布が生じることが抑えられるので、基板5の割れが基板5の他端側に生じることが抑えられる。このため、基板5の短手方向において、温度勾配が相対的に小さい第3の抵抗発熱体8が配置された他端側の端面と、第3の抵抗発熱体8との間の距離を小さくすることが可能になり、基板5の短手方向の寸法を小さくし、コンパクトなヒータ1を実現できる。   In the embodiment, the third resistance heating element 8 having a relatively small temperature gradient is disposed on the other end side of the substrate 5, thereby suppressing the temperature distribution on the other end side of the substrate 5. Therefore, it is possible to prevent the substrate 5 from being cracked on the other end side of the substrate 5. Therefore, in the short direction of the substrate 5, the distance between the end surface on the other end side where the third resistance heating element 8 having a relatively small temperature gradient is arranged and the third resistance heating element 8 is reduced. Therefore, the size of the substrate 5 in the short direction can be reduced, and the compact heater 1 can be realized.

以上、図2に示す構成のヒータ1における温度分布について説明したが、図3に示す構成のヒータ1における温度分布についても同様である。   The temperature distribution in the heater 1 configured as shown in FIG. 2 has been described above, but the same applies to the temperature distribution in the heater 1 configured as shown in FIG.

上述したように実施形態のヒータ1は、抵抗値が長手方向全体にわたって均等な第1の抵抗発熱体6が、基板5の短手方向における一端側に配置される。ヒータ1は、長手方向における中央の抵抗値が両端の抵抗値よりも小さい第2の抵抗発熱体7と、中央の抵抗値が両端の抵抗値よりも大きい第3の抵抗発熱体8と、を備え、第2の抵抗発熱体7と第3の抵抗発熱体8のうち、中央と両端との抵抗値の差が小さい一方の抵抗発熱体が、基板5の短手方向における他端側に配置され、中央と両端との抵抗値の差が大きい他方の抵抗発熱体が、第1の抵抗発熱体6と一方の抵抗発熱体との間に配置される。これにより、基板5の短手方向に生じる温度分布が抑えられ、基板5の割れが生じることを抑えることができる。   As described above, in the heater 1 according to the embodiment, the first resistance heating element 6 having a uniform resistance value over the entire length direction is arranged on one end side in the short direction of the substrate 5. The heater 1 includes a second resistance heating element 7 whose central resistance value in the longitudinal direction is smaller than the resistance values at both ends, and a third resistance heating element 8 whose central resistance value is larger than the resistance values at both ends. One of the second resistance heating element 7 and the third resistance heating element 8 having a small difference in resistance value between the center and both ends is disposed on the other end side in the short direction of the substrate 5. The other resistance heating element having a large difference in resistance value between the center and both ends is arranged between the first resistance heating element 6 and one resistance heating element. Thereby, the temperature distribution generated in the short direction of the substrate 5 is suppressed, and the occurrence of cracks in the substrate 5 can be suppressed.

また、実施形態のヒータ1において、基板5の短手方向における第1の抵抗発熱体6の幅W1が、基板5の長手方向にわたって均等であり、第2の抵抗発熱体7の中央の幅W2aが両端の幅W2bよりも大きく、第3の抵抗発熱体8の中央の幅W3aが両端の幅W3bよりも小さい。このように、第2の抵抗発熱体7及び第3の抵抗発熱体8の幅を変えることにより、抵抗値を容易かつ適正に変化させることができる。   In the heater 1 of the embodiment, the width W1 of the first resistance heating element 6 in the short direction of the substrate 5 is uniform over the longitudinal direction of the substrate 5, and the width W2a at the center of the second resistance heating element 7 is set. Is larger than the width W2b at both ends, and the center width W3a of the third resistance heating element 8 is smaller than the width W3b at both ends. Thus, by changing the widths of the second resistance heating element 7 and the third resistance heating element 8, the resistance value can be easily and appropriately changed.

また、実施形態のヒータ1において、第2の抵抗発熱体7の中央の抵抗値に対する両端の抵抗値が180[%]以下であり、第3の抵抗発熱体8の中央の抵抗値に対する両端の抵抗値が20[%]以上である。これにより、基板5の長手方向に温度分布が生じることを更に抑えることができ、基板5の割れが生じることを抑えることができる。   In the heater 1 of the embodiment, the resistance value at both ends with respect to the central resistance value of the second resistance heating element 7 is 180% or less, and the resistance values at both ends with respect to the central resistance value of the third resistance heating element 8 are. The resistance value is 20% or more. Thereby, it can suppress further that temperature distribution arises in the longitudinal direction of the board | substrate 5, and can suppress that the crack of the board | substrate 5 arises.

また、実施形態のヒータ1における導体10は、基板5の長手方向における一端側にそれぞれ配置された第1の電極部10a、第2の電極部10b及び第3の電極部10cと、基板5の長手方向における他端側に配置されて第1の抵抗発熱体6、第2の抵抗発熱体7及び第3の抵抗発熱体8に跨って導通された導通部10gと、を有する。これにより、基板5の長手方向における一端側に第1の電極部10a、第2の電極部10b及び第3の電極部10cが集約されるので、電極部の個数を減らして基板5を小型化することができる。   In addition, the conductor 10 in the heater 1 of the embodiment includes a first electrode portion 10 a, a second electrode portion 10 b, a third electrode portion 10 c, which are disposed on one end side in the longitudinal direction of the substrate 5, and the substrate 5. A conduction portion 10g disposed on the other end side in the longitudinal direction and conducted across the first resistance heating element 6, the second resistance heating element 7 and the third resistance heating element 8; As a result, the first electrode portion 10a, the second electrode portion 10b, and the third electrode portion 10c are gathered on one end side in the longitudinal direction of the substrate 5, thereby reducing the number of electrode portions and reducing the size of the substrate 5. can do.

なお、実施形態のヒータ1は、抵抗値が均等な第1の抵抗発熱体6以外に、2つの第2の抵抗発熱体7及び第3の抵抗発熱体8を有するが、第1の抵抗発熱体6以外の抵抗発熱体の個数を限定するものではない。ヒータ1は、第1の抵抗発熱体6と、長手方向に抵抗分布を有する3つ以上の他の抵抗発熱体を備えてもよい。この構成の場合、基板5の短手方向において、3つ以上の他の抵抗発熱体のうち、長手方向における抵抗値の差が最も大きい抵抗発熱体が第1の抵抗発熱体6に隣接して配置され、長手方向における抵抗値の差が最も小さい抵抗発熱体が、基板5の短手方向において第1の抵抗発熱体6側の一端とは反対側の他端側に配置され、残る他の抵抗発熱体が、抵抗値の差が最も小さい抵抗発熱体と、抵抗値の差が最も大きい抵抗発熱体との間に配置される。また、この構成の場合、例えば、抵抗値の差が最も大きい抵抗発熱体と、抵抗値の差が最も小さい抵抗発熱体以外の残りの他の抵抗発熱体は、基板5の短手方向において、抵抗値の差が最も小さい抵抗発熱体側から、抵抗値の差が小さな順に配置されるのが好ましい。これにより、基板5の短手方向に生じる温度分布を小さくすることができ、基板5の割れの発生を効果的に抑えることができる。   The heater 1 according to the embodiment includes two second resistance heating elements 7 and a third resistance heating element 8 in addition to the first resistance heating element 6 having the same resistance value. The number of resistance heating elements other than the body 6 is not limited. The heater 1 may include a first resistance heating element 6 and three or more other resistance heating elements having a resistance distribution in the longitudinal direction. In the case of this configuration, among the three or more other resistance heating elements, the resistance heating element having the largest resistance value difference in the longitudinal direction is adjacent to the first resistance heating element 6 in the short direction of the substrate 5. The resistance heating element which is arranged and has the smallest difference in resistance value in the longitudinal direction is arranged on the other end side opposite to the one end on the first resistance heating element 6 side in the short direction of the substrate 5 and the other remaining The resistance heating element is disposed between the resistance heating element having the smallest resistance value difference and the resistance heating element having the largest resistance value difference. In the case of this configuration, for example, the resistance heating element having the largest difference in resistance value and the other resistance heating elements other than the resistance heating element having the smallest difference in resistance value are arranged in the short direction of the substrate 5. It is preferable that the resistance heating elements are arranged in ascending order of resistance value from the resistance heating element side having the smallest resistance value difference. Thereby, the temperature distribution generated in the short direction of the substrate 5 can be reduced, and the occurrence of cracks in the substrate 5 can be effectively suppressed.

また、実施形態のヒータ1は、片側給電構造が適用されたが、この構造に限定されるものではなく、基板5の長手方向における両側に電極部がそれぞれ配置された両側給電構造が適用されてもよい。   Further, the heater 1 of the embodiment is applied with a one-sided power feeding structure, but is not limited to this structure, and a two-sided power feeding structure in which electrode portions are respectively arranged on both sides in the longitudinal direction of the substrate 5 is applied. Also good.

つぎに、実施形態のヒータ1を用いた実施形態の定着装置について図面を参照して説明する。図8は、実施形態に係るヒータが用いられた定着装置の一実施形態を示す断面図である。図8に示すように、定着装置200は、支持体202の周りに円筒状に巻き回された定着フィルムベルト201の底部にヒータ1が設けられている。定着フィルムベルト201は、例えばポリイミド等の耐熱性を有する樹脂材料によって形成されている。ヒータ1及び定着フィルムベルト201に対向する位置には、加圧ローラ203が配置されている。加圧ローラ203は、表面に耐熱性の弾性材料、例えばシリコーン樹脂層204を有しており、定着フィルムベルト201を圧接した状態で、回転軸205まわり(図8中のX方向)に回転することができる。   Next, a fixing device according to an embodiment using the heater 1 according to the embodiment will be described with reference to the drawings. FIG. 8 is a cross-sectional view illustrating an embodiment of a fixing device using the heater according to the embodiment. As shown in FIG. 8, the fixing device 200 is provided with a heater 1 at the bottom of a fixing film belt 201 that is wound around a support 202 in a cylindrical shape. The fixing film belt 201 is made of a heat-resistant resin material such as polyimide. A pressure roller 203 is disposed at a position facing the heater 1 and the fixing film belt 201. The pressure roller 203 has a heat-resistant elastic material such as a silicone resin layer 204 on its surface, and rotates around the rotation shaft 205 (X direction in FIG. 8) in a state where the fixing film belt 201 is pressed. be able to.

トナー定着工程では、定着フィルムベルト201とシリコーン樹脂層204との接触面において、媒体である記録用紙(複写用紙)M上に付着したトナー像U1が、定着フィルムベルト201を介してヒータ1により加熱溶融される。その結果、少なくともトナー像U1の表面部分は、融点を超え、軟化して溶融する。その後、加圧ローラ203の用紙排出側において、記録用紙Mは、ヒータ1から離間すると共に、定着フィルムベルト201から離間し、トナー像U2が自然に放熱して再び固化することで、トナー像U2が記録用紙Mに定着する。   In the toner fixing step, the toner image U1 attached on the recording paper (copy paper) M as a medium is heated by the heater 1 via the fixing film belt 201 at the contact surface between the fixing film belt 201 and the silicone resin layer 204. Melted. As a result, at least the surface portion of the toner image U1 exceeds the melting point and softens and melts. Thereafter, on the paper discharge side of the pressure roller 203, the recording paper M is separated from the heater 1 and from the fixing film belt 201, and the toner image U2 naturally dissipates heat and solidifies again, thereby the toner image U2. Is fixed to the recording paper M.

最後に、実施形態のヒータ1を備えた実施形態の画像形成装置について図面を参照して説明する。図9は、実施形態に係るヒータが用いられた画像形成装置の一実施形態を示す断面図である。なお、本実施形態の画像形成装置は、複写機100として構成されている。図9に示すように、複写機100には、上述した定着装置200を含む各構成要素が筐体101内に設けられている。筐体101の上部には、ガラス等の透明材料からなる原稿載置台が取り付けられており、画像情報を読み取る対象となる原稿M1を原稿載置台上で往復動させて(図9に示す矢印Y)スキャンするように構成されている。   Finally, an image forming apparatus according to an embodiment including the heater 1 according to the embodiment will be described with reference to the drawings. FIG. 9 is a cross-sectional view showing an embodiment of an image forming apparatus using the heater according to the embodiment. Note that the image forming apparatus of the present embodiment is configured as a copying machine 100. As shown in FIG. 9, the copying machine 100 includes each component including the fixing device 200 described above in a housing 101. A document placing table made of a transparent material such as glass is attached to the upper portion of the housing 101, and the document M1 to be read from the image information is reciprocated on the document placing table (arrow Y shown in FIG. 9). ) Configured to scan.

筐体101内の上部には、光照射用ランプと反射鏡とを有する照明装置102が設けられている。照明装置102から照射された光は、原稿載置台上の原稿M1の表面で反射し、短焦点小径結像素子アレイ103によって感光ドラム104上にスリット露光される。なお、感光ドラム104は、回転可能(図9中のZ方向)に設けられている。また、筐体101内に配置された感光ドラム104の近傍には、帯電器105が設けられており、感光ドラム104が帯電器105により一様に帯電される。感光ドラム104は、例えば酸化亜鉛感光層または有機半導体感光層で被覆されている。帯電した感光ドラム104には、短焦点小径結像素子アレイ103によって画像露光が行われた静電画像が形成される。この静電画像は、現像器106による加熱で軟化溶融する樹脂等からなるトナーを用いて顕像化され、トナー像となる。   An illuminating device 102 having a light irradiation lamp and a reflecting mirror is provided in the upper part of the housing 101. The light emitted from the illuminating device 102 is reflected by the surface of the document M1 on the document table, and is slit-exposed on the photosensitive drum 104 by the short focus small-diameter imaging element array 103. The photosensitive drum 104 is provided so as to be rotatable (Z direction in FIG. 9). Further, a charger 105 is provided in the vicinity of the photosensitive drum 104 disposed in the housing 101, and the photosensitive drum 104 is uniformly charged by the charger 105. The photosensitive drum 104 is covered with, for example, a zinc oxide photosensitive layer or an organic semiconductor photosensitive layer. On the charged photosensitive drum 104, an electrostatic image subjected to image exposure by the short focus small diameter imaging element array 103 is formed. This electrostatic image is visualized by using toner made of resin or the like that is softened and melted by heating by the developing device 106, and becomes a toner image.

カセット107内に収容されている記録用紙Mは、給送ローラ108と感光ドラム104上のトナー像と同期して上下方向に圧接して回転される一対の搬送ローラ109によって、感光ドラム104上に送り込まれる。そして、転写放電器110によって感光ドラム104上のトナー像が記録用紙M上に転写される。その後、感光ドラム104上から下流側に送られた記録用紙Mは、搬送ガイド111によって定着装置200に導かれて加熱定着処理(上記トナー定着工程)された後、トレイ112に排出される。なお、トナー像が転写された後、感光ドラム104上の残留トナーは、クリーナ113により除去される。   The recording paper M stored in the cassette 107 is placed on the photosensitive drum 104 by a pair of conveying rollers 109 that are rotated in pressure contact with the feeding roller 108 and the toner image on the photosensitive drum 104 in the vertical direction. It is sent. Then, the toner image on the photosensitive drum 104 is transferred onto the recording paper M by the transfer discharger 110. Thereafter, the recording sheet M sent from the photosensitive drum 104 to the downstream side is guided to the fixing device 200 by the conveyance guide 111 and subjected to a heat fixing process (the toner fixing step), and then discharged to the tray 112. After the toner image is transferred, residual toner on the photosensitive drum 104 is removed by the cleaner 113.

定着装置200において、ヒータ1は、加圧ローラ203の外周に取り付けられたシリコーン樹脂層204に加圧された状態で設けられている。ヒータ1は、記録用紙Mの搬送方向と直交する記録用紙Mの幅方向に、複写機100が複写可能な最大判用紙の幅(長さ)に合わせた有効長、すなわち最大判用紙の幅(長さ)よりも大きい第1の抵抗発熱体6、第2の抵抗発熱体7及び第3の抵抗発熱体8を備える。そして、ヒータ1と加圧ローラ203との間を送られる記録用紙M上の未定着トナー像は、第1の抵抗発熱体6、第2の抵抗発熱体7及び第3の抵抗発熱体8の発熱を利用して溶融され、記録用紙M上に文字、記号、画像等の複写像を現出させる。   In the fixing device 200, the heater 1 is provided in a state in which the pressure is applied to the silicone resin layer 204 attached to the outer periphery of the pressure roller 203. The heater 1 has an effective length in accordance with the width (length) of the maximum size paper that can be copied by the copying machine 100 in the width direction of the recording paper M perpendicular to the conveyance direction of the recording paper M, that is, the width of the maximum size paper ( The first resistance heating element 6, the second resistance heating element 7, and the third resistance heating element 8 are provided. The unfixed toner image on the recording paper M sent between the heater 1 and the pressure roller 203 is the first resistance heating element 6, the second resistance heating element 7, and the third resistance heating element 8. It is melted by using heat generation, and a copy image such as a character, a symbol, or an image appears on the recording paper M.

なお、実施形態のヒータ1を複写機100等の画像形成装置の定着ヒータとして適用した一例について説明したが、ヒータ1の用途を限定するものではない。実施形態のヒータ1は、家庭用電気製品、業務用や実験用の精密機械や化学反応用の機器等に装着して加熱や保温の熱源として使用されてもよい。   In addition, although the example which applied the heater 1 of embodiment as a fixing heater of image forming apparatuses, such as the copying machine 100, was demonstrated, the use of the heater 1 is not limited. The heater 1 according to the embodiment may be used as a heat source for heating or heat retention by being mounted on a household electrical appliance, a business or experimental precision machine, a chemical reaction device, or the like.

本発明の実施形態を説明したが、実施形態は、例として提示したものであり、本発明の範囲を限定することを意図していない。実施形態は、その他の様々な形態で実施することが可能であり、発明の要旨を逸脱しない範囲で、種々の省略、置き換え、変更を行うことができる。実施形態やその変形は、本発明の範囲や要旨に含まれると同様に、特許請求の範囲に記載された発明とその均等の範囲に含まれるものである。   Although the embodiments of the present invention have been described, the embodiments are presented as examples and are not intended to limit the scope of the present invention. The embodiment can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. The embodiments and modifications thereof are included in the scope of the present invention and the gist thereof, and are also included in the invention described in the claims and the equivalents thereof.

1 ヒータ
5 基板
6 第1の抵抗発熱体
7 第2の抵抗発熱体
8 第3の抵抗発熱体
10 導体
10a 第1の電極部
10b 第2の電極部
10c 第3の電極部
10g 導通部
100 複写機(画像形成装置)
DESCRIPTION OF SYMBOLS 1 Heater 5 Board | substrate 6 1st resistance heating element 7 2nd resistance heating element 8 3rd resistance heating element 10 Conductor 10a 1st electrode part 10b 2nd electrode part 10c 3rd electrode part 10g Conductive part 100 Copying Machine (image forming device)

Claims (5)

矩形状の基板と;
前記基板の長手方向に沿って延び、単位長さ当たりの抵抗値が前記長手方向にわたって均等な第1の抵抗発熱体と;
前記基板の長手方向に沿って延び、前記長手方向における中央の前記抵抗値が両端の前記抵抗値よりも小さい第2の抵抗発熱体と;
前記基板の長手方向に沿って延び、前記長手方向における中央の前記抵抗値が両端の前記抵抗値よりも大きい第3の抵抗発熱体と;
を具備し、
前記第1の抵抗発熱体は、前記基板の短手方向における一端側に配置され、
前記第2の抵抗発熱体と前記第3の抵抗発熱体のうち、前記中央と前記両端との前記抵抗値の差が小さい一方の抵抗発熱体が、前記基板の短手方向における他端側に配置され、前記中央と前記両端との前記抵抗値の差が大きい他方の抵抗発熱体が、前記第1の抵抗発熱体と前記一方の抵抗発熱体との間に配置される、ヒータ。
A rectangular substrate;
A first resistance heating element extending along the longitudinal direction of the substrate and having a uniform resistance value per unit length over the longitudinal direction;
A second resistance heating element extending along the longitudinal direction of the substrate, the resistance value at the center in the longitudinal direction being smaller than the resistance values at both ends;
A third resistance heating element extending along the longitudinal direction of the substrate, wherein the resistance value at the center in the longitudinal direction is larger than the resistance values at both ends;
Comprising
The first resistance heating element is disposed on one end side in the short direction of the substrate,
Of the second resistance heating element and the third resistance heating element, one resistance heating element having a small difference in resistance value between the center and the both ends is disposed on the other end side in the short direction of the substrate. The heater which is arrange | positioned and the other resistance heating element with the large difference of the said resistance value of the said center and the said both ends is arrange | positioned between the said 1st resistance heating element and said one resistance heating element.
前記短手方向における前記第1の抵抗発熱体の幅は、前記長手方向にわたって均等であり、
前記第2の抵抗発熱体の前記中央の前記幅が前記両端の前記幅よりも大きく、
前記第3の抵抗発熱体の前記中央の前記幅が前記両端の前記幅よりも小さい、
請求項1に記載のヒータ。
The width of the first resistance heating element in the short direction is uniform over the longitudinal direction,
The width of the center of the second resistance heating element is larger than the width of the ends;
The width of the center of the third resistance heating element is smaller than the width of the both ends;
The heater according to claim 1.
前記第2の抵抗発熱体の前記中央の前記抵抗値に対する前記両端の前記抵抗値が180[%]以下であり、
前記第3の抵抗発熱体の前記中央の前記抵抗値に対する前記両端の前記抵抗値が20[%]以上である、
請求項1または2に記載のヒータ。
The resistance value at the both ends with respect to the resistance value at the center of the second resistance heating element is 180% or less;
The resistance value at the both ends with respect to the resistance value at the center of the third resistance heating element is 20% or more;
The heater according to claim 1 or 2.
前記基板の前記長手方向における一端側にそれぞれ配置されて前記第1の抵抗発熱体、前記第2の抵抗発熱体及び前記第3の抵抗発熱体にそれぞれ接続される第1の電極部、第2の電極部及び第3の電極部と、前記基板の前記長手方向における他端側に配置されて前記第1の抵抗発熱体、前記第2の抵抗発熱体及び前記第3の抵抗発熱体に跨って導通された導通部と、を有し、前記第1の抵抗発熱体、前記第2の抵抗発熱体及び前記第3の抵抗発熱体に電力を供給する導体を更に具備する、
請求項1ないし3のいずれか1項に記載のヒータ。
A first electrode portion disposed on one end side in the longitudinal direction of the substrate and connected to the first resistance heating element, the second resistance heating element, and the third resistance heating element; The electrode portion and the third electrode portion are disposed on the other end side in the longitudinal direction of the substrate and straddle the first resistance heating element, the second resistance heating element, and the third resistance heating element. A conductive portion that is electrically connected to the first resistance heating element, the second resistance heating element, and the third resistance heating element.
The heater according to any one of claims 1 to 3.
媒体を加熱する請求項1ないし4のいずれか1項に記載のヒータと;
前記ヒータによって加熱される前記媒体を加圧する加圧ローラと;
を具備し、
前記ヒータ及び前記加圧ローラによって、前記媒体に付着させたトナーを定着させる、画像形成装置。
The heater according to any one of claims 1 to 4, which heats the medium;
A pressure roller for pressing the medium heated by the heater;
Comprising
An image forming apparatus in which toner adhered to the medium is fixed by the heater and the pressure roller.
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