JP2018146865A - Display device and mother substrate thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To at least easily manufacture two types of display devices each including an upper frame area, a left frame area and a right frame area which are different in width.SOLUTION: A display device comprises a first substrate and a second substrate. The first substrate includes: a first frame area (FLA1) and a second frame area FLA2 adjacent to a display area DPA and extending in an X-direction; a third frame area FLA3 and a fourth frame area (FLA4) intersecting the first frame area and the second frame area FLA2 and extending in a Y-direction; a first seal ADH formed on the first to fourth frame areas; and a third seal ADH formed adjacent to a side of the third frame area FLA3 not in contact with a display area of the first seal ADH. The second substrate includes a first spacer SP21 extending in the Y-direction formed on the third frame area FLA3, and the first spacer SP21 is formed across a formation area of the first seal ADH and the third seal ADH.SELECTED DRAWING: Figure 7

Description

  The present invention relates to a display device and a mother substrate thereof, and relates to a technique effective when applied to, for example, a display device having a frame region provided outside a display region.

  For example, a display device such as a liquid crystal display device has a display area and a frame area outside the display area. In addition, such a display device includes an array substrate and a counter substrate disposed to face the array substrate. In the display region, a plurality of pixels are provided on the array substrate. The plurality of pixels are arranged in a matrix, for example. In the frame region, a seal is provided between the array substrate and the counter substrate. The seal bonds the array substrate and the counter substrate. In addition, a spacer is provided on the array substrate or the counter substrate. The spacer maintains a distance between the array substrate and the counter substrate.

  For example, in Japanese Patent Application Laid-Open No. 2014-52546 (Patent Document 1), a display panel is opposed to an array substrate, a counter substrate disposed opposite to the array substrate with a gap therebetween, and a frame region surrounding the display region. And a sealing material that joins the array substrate and the counter substrate.

JP 2014-52546 A

  In such a display device, a semiconductor chip is provided in the frame region. The frame area in which the semiconductor chip is arranged is called a lower frame area, and the frame area arranged on the opposite side of the lower frame area across the display area is called an upper frame area. At this time, the frame areas arranged on both sides in the direction intersecting the direction in which the lower frame area is arranged with respect to the display area are referred to as a left frame area and a right frame area, respectively. In such a configuration, even if the size of the display area is the same, there are some having different external dimensions as a display panel. In such a case, the size is adjusted by the width of the frame area outside the display area, and in the case of a rectangular display device, the terminal portion of the upper frame area, the left frame area, the right frame area, and the lower frame area is The widths of the upper frame region, the left frame region, and the right frame region other than the lower frame region to be formed are designed to be different depending on the display panel.

  In general, a display device is formed by forming a plurality of display devices on a single mother substrate made of glass or the like, and is individually cut after the formation. For example, when manufacturing two types of display devices having different widths of the upper frame region and the left and right frame regions, if only display devices of the same size are formed on the mother substrate, the manufacturing process of each display device It is necessary to separately prepare a set of a plurality of photomasks used for photolithography. Therefore, the cost required for manufacturing the display device may increase, or the period required for manufacturing the display device may be increased, and two types of display devices having different widths of the upper frame region, the left frame region, and the right frame region Cannot be easily manufactured.

  For this reason, if a pattern of a display device that can be cut out in either size can be formed on the same mother substrate, it is very efficient in manufacturing.

  The present invention has been made to solve the above-described problems of the prior art, and at least two types of display devices having different widths of the upper frame region, the left frame region, and the right frame region are easily manufactured. It is an object of the present invention to provide a display device that can be used.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  A display device as one embodiment of the present invention includes a first substrate, a second substrate disposed opposite to the first substrate, a display region having a substantially rectangular shape in plan view, and the first substrate and the second substrate. A seal provided between the first substrate and the second substrate. When the direction in which one side of the display area extends is the X direction, and the direction in which one side of the display area intersects the extending direction is the Y direction, the first substrate is adjacent to the plurality of signal lines and the display area. A first frame region extending in the X direction, a second frame region extending in the X direction facing the first frame region through the display region, and intersecting the first frame region and the second frame region And a third frame region and a fourth frame region that are opposed to each other through the display region and extend in the Y direction, and a plurality of terminal portions that are formed at the end of the signal line and formed in the first frame region. And the first seal formed in the first to fourth frame regions on the outer periphery of the display region, and adjacent to the side of the third frame region that does not face the display region of the first seal And a third seal formed. In the second substrate, a first spacer extending in the Y direction is formed in the third frame region, and the first spacer is formed across the formation region of the first seal and the third seal. .

  In addition, a mother substrate as one embodiment of the present invention includes a first substrate on which display regions corresponding to a plurality of display devices are formed, a second substrate opposed to the first substrate, a first substrate, and a second substrate. A liquid crystal layer sandwiched between the substrate and the substrate. A plurality of rectangular first seal portions surrounding each display area on the mother substrate, and a second rectangular shape formed between the first seal portions and arranged in contact with the first seal portion. The first spacer is formed at a position overlapping both the first seal portion and the second seal portion of the second substrate.

It is a top view which shows an example of the display apparatus of embodiment. It is sectional drawing which shows an example of the display apparatus of embodiment. It is sectional drawing which shows an example of the display apparatus of embodiment. It is a figure which shows the equivalent circuit of the display apparatus of embodiment. It is a top view of the display apparatus of embodiment. It is a top view of the frame area | region of the display apparatus of embodiment. It is a top view of the frame area | region of the display apparatus of embodiment. It is sectional drawing of the frame area | region of the display apparatus of embodiment. It is sectional drawing of the frame area | region of the display apparatus of embodiment. It is a top view of the frame area | region of the display apparatus of embodiment. It is a top view of the frame area | region of the display apparatus of embodiment. It is a top view in the manufacturing process of the display apparatus of embodiment. It is a top view in the manufacturing process of the display apparatus of embodiment. It is a top view in the manufacturing process of the display apparatus of embodiment. It is sectional drawing in the manufacturing process of the display apparatus of embodiment. It is sectional drawing in the manufacturing process of the display apparatus of embodiment. It is a top view in the manufacturing process of the display apparatus of embodiment. It is a top view in the manufacturing process of the display apparatus of embodiment. It is a top view in the manufacturing process of the display apparatus of Embodiment and the modification of Embodiment.

  Embodiments of the present invention will be described below with reference to the drawings.

  It should be noted that the disclosure is merely an example, and those skilled in the art can easily conceive of appropriate modifications while maintaining the gist of the invention are naturally included in the scope of the present invention. In addition, the drawings may be schematically represented with respect to the width, thickness, shape, and the like of each part as compared with the embodiments for the sake of clarity of explanation, but are merely examples, and the interpretation of the present invention is not limited thereto. It is not limited.

  In addition, in the present specification and each drawing, elements similar to those described above with reference to the previous drawings are denoted by the same reference numerals, and detailed description may be omitted as appropriate.

  Further, in the drawings used in the embodiments, hatching may be omitted even in a cross-sectional view for easy viewing of the drawings. Further, even a plan view may be hatched to make the drawing easy to see.

  The technology described in the following embodiments is widely applicable to display devices including a mechanism for supplying signals from the periphery of the display area to a plurality of elements provided in the display area provided with the display function layer. Examples of the display device as described above include various display devices such as a liquid crystal display device or an organic EL (Electro-Luminescence) display device. In the following embodiments, a liquid crystal display device will be described as a representative example of a display device.

  In the embodiment described below, a horizontal electric field mode display device will be described as an example, but the present invention is not limited thereto.

(Embodiment)
<Configuration of display device>
First, the configuration of the display device will be described with reference to FIGS. FIG. 1 is a plan view illustrating an example of the display device according to the embodiment. 2 and 3 are cross-sectional views illustrating an example of the display device according to the embodiment. FIG. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is an enlarged sectional view of a portion B in FIG.

  For the sake of clarity in FIG. 1, in the display area DPA, scanning lines (scanning signal lines) GL (see FIG. 4 described later) and signal lines (video signal lines) SL (see FIG. 4 described later) are shown. Omitted. Moreover, although FIG. 2 is a cross section, hatching is omitted for ease of viewing.

  As shown in FIG. 1, the display device LCD1 of the present embodiment has a display unit DP for displaying an image. The display device LCD1 includes a substrate BS (first substrate) also referred to as an array substrate and a substrate FS (second substrate) also referred to as a counter substrate. For example, the display unit DP is included in the substrate BS. The provided area is the display area DPA. Further, the display device LCD1 has a frame portion (peripheral portion) FL that is a portion around the display portion DP and does not display an image in plan view. A region where the frame portion FL is provided is a frame region FLA. That is, the frame area FLA is an area (peripheral area) outside the display area DPA.

  In the specification of the present application, in the plan view, as shown in FIG. 1, it means that the substrate BS is viewed from a direction perpendicular to the surface BSf (see FIG. 2) facing the substrate FS that is the main surface of the substrate BS. To do. Further, two directions intersecting, preferably orthogonal to each other, in the main surface BSf of the substrate BS are defined as an X-axis direction and a Y-axis direction, and a direction perpendicular to the main surface BSf of the substrate BS is defined as a Z-axis direction (FIG. 2). Reference).

  The display device LCD1 has a structure in which a liquid crystal layer, which is a display function layer, is formed between a pair of substrates disposed to face each other. That is, as shown in FIG. 2, the display device LCD1 includes a display surface side substrate (counter substrate) FS, a substrate (array substrate) BS located on the opposite side of the substrate FS, and a space between the substrate FS and the substrate BS. A liquid crystal layer LCL (see FIG. 3).

  Further, the substrate BS shown in FIG. 1 crosses the side BSs1 extending along the X-axis direction, the side BSs2 extending along the X-axis direction parallel to the side BSs1, and the X-axis direction in a plan view. Has a side BSs3 extending along the orthogonal Y-axis direction, and a side BSs4 extending along the Y-axis direction parallel to the side BSs3. The distances from the side BSs2, the side BSs3, and the side BSs4 of the substrate BS illustrated in FIG. 1 to the display unit DP are approximately the same, and are shorter than the distance from the side BSs1 to the display unit DP.

  Hereinafter, when it is described as the peripheral portion of the substrate BS in the present specification, it means one of the side BSs1, the side BSs2, the side BSs3, and the side BSs4 that constitute the outer edge of the substrate BS. In addition, when simply referred to as the peripheral portion, it means the peripheral portion of the substrate BS.

  The display unit DP includes a pixel Pix (see FIG. 4 described later) as a plurality of display elements. That is, the plurality of pixels Pix are provided on the display area DPA of the substrate BS. The plurality of pixels Pix are arranged in a matrix in the X-axis direction and the Y-axis direction. In the present embodiment, each of the plurality of pixels Pix includes a thin-film transistor (TFT) formed in the display area DPA on the main surface BSf side of the substrate BS.

  The display device LCD1 includes a plurality of scanning lines GL and a plurality of signal lines SL, as will be described later with reference to FIG. As described later with reference to FIG. 4, each of the plurality of scanning lines GL is electrically connected to a plurality of pixels Pix arranged in the X-axis direction, and each of the plurality of signal lines SL is connected to the Y-axis. It is electrically connected to a plurality of pixels Pix arranged in the direction.

  Further, the display device LCD1 includes a drive circuit CC. The drive circuit CC includes a scanning line drive circuit CG and a video line drive circuit CS. As described later with reference to FIG. 4, the scanning line driving circuit CG is electrically connected to the plurality of pixels Pix via the plurality of scanning lines GL, and the video line driving circuit CS includes a plurality of signal lines. It is electrically connected to a plurality of pixels Pix via SL.

  In the example shown in FIG. 1, the frame area FLA includes a frame area FLA1 (first frame area), a frame area FLA2 (second frame area), a frame area FLA3 (third frame area), and a frame area FLA4 ( 4th frame area). The frame area FLA1 is an area arranged on one side (lower side in FIG. 1) in the Y-axis direction with respect to the display area DPA in plan view, and is an area where the semiconductor chip CHP is arranged. The frame area FLA2 is an area arranged on the side opposite to the frame area FLA1 (upper side in FIG. 1) across the display area DPA. The frame area FLA3 is an area arranged on one side (left side in FIG. 1) in the X-axis direction with respect to the display area DPA in plan view, and the frame area FLA4 is a frame area across the display area DPA. This is a region arranged on the opposite side to FLA3.

  In the example shown in FIG. 1, a semiconductor chip CHP is provided on the substrate BS. The semiconductor chip CHP is disposed in the frame area FLA1 in plan view. A video line driving circuit CS is provided in the semiconductor chip CHP. Therefore, the video line driving circuit CS is provided in the frame area FLA1 which is an area on the main surface BSf side of the substrate BS and is located on one side with respect to the display area DPA in the Y-axis direction. Yes.

  The frame area FLA1 in which the semiconductor chip CHP is disposed may be referred to as a lower frame area, and the frame area FLA2 disposed on the opposite side of the frame area FLA1 across the display area DPA may be referred to as an upper frame area. At this time, the frame areas FLA3 and FLA4 arranged on both sides in the direction (X-axis direction) intersecting the direction (Y-axis direction) in which the frame area FLA1 is arranged with respect to the display area DPA, respectively, Sometimes referred to as a frame region.

  Further, the semiconductor chip CHP may be provided in the frame area FLA1 using a so-called COG (Chip On Glass) technique, or provided outside the substrate BS and connected to the substrate BS via an FPC (Flexible Printed Circuits). It may be connected. The frame area FLA1 is provided with a plurality of terminal portions for connecting the semiconductor chips CHP and FPC.

  Note that, as will be described later with reference to FIGS. 5 to 11, the display device LCD <b> 1 has a seal ADH disposed in the frame area FLA in plan view. The seal ADH is formed so as to continuously surround the periphery of the display unit DP, and the substrate FS and the substrate BS shown in FIG. 2 are bonded and fixed by a seal material provided on the seal ADH. Thus, by providing the seal ADH around the display portion DP, the liquid crystal layer LCL (see FIG. 3) which is a display function layer can be sealed.

  Further, as shown in FIG. 2, on the back surface BSb side of the substrate BS of the display device LCD1, a backlight LS composed of optical elements such as a light source and a diffusion plate, and a polarizing plate PL2 that polarizes light generated from the backlight LS. Is provided. The polarizing plate PL2 is fixed to the substrate BS. On the other hand, a polarizing plate PL1 is provided on the back surface FSf side of the substrate FS. The polarizing plate PL1 is fixed to the substrate FS.

  In addition, in FIG. 2, the basic components of the display device are shown as examples, but as a modification, other components such as a touch panel and a protective layer are added in addition to the components shown in FIG. Can do.

  As shown in FIG. 3, the display device LCD1 includes a plurality of pixel electrodes PE and a common electrode CE arranged between the substrate FS and the substrate BS. Since the display device LCD1 of the present embodiment is a display device in a horizontal electric field mode as described above, the plurality of pixel electrodes PE and the common electrode CE are respectively formed on the substrate BS.

  The substrate BS is made of a glass substrate or the like, and is mainly formed with an image display circuit. The substrate BS has a main surface BSf (see FIG. 2) facing the substrate FS side and a back surface BSb (see FIG. 2) located on the opposite side. On the main surface BSf side of the substrate BS, driving elements such as TFTs and a plurality of pixel electrodes PE are formed in a matrix. The substrate BS includes a display area DPA and a frame area FLA provided outside the display area DPA. The substrate BS may be formed of a resin such as polyimide other than the glass substrate.

  Since the example shown in FIG. 3 shows the display device LCD1 in the horizontal electric field mode (specifically, FFS mode), the common electrode CE is formed on the main surface BSf (see FIG. 2) side of the substrate BS, and the insulating layer OC2 Covered with. Further, the plurality of pixel electrodes PE are formed on the substrate FS side of the insulating layer OC2 so as to face the common electrode CE through the insulating layer OC2.

  A substrate FS shown in FIG. 3 is made of a glass substrate or the like, and is provided with a color filter CF that forms an image for color display. The substrate FS has a back surface FSf (see FIG. 2) which is the display surface side, and a main surface FSb (see FIG. 2) located on the opposite side of the back surface FSf. The substrate FS is disposed to face the substrate BS with the main surface BSf of the substrate BS and the main surface FSb of the substrate FS facing each other. The substrate (array substrate) BS can also be called a TFT substrate, and the substrate (counter substrate) FS on which the color filter CF is formed can also be called a color filter substrate. Further, as a modification to FIG. 3, a configuration in which the color filter CF is provided on a substrate BS as a TFT substrate may be employed.

  Although not shown, a plurality of scanning lines, signal lines, thin film transistors, and a plurality of insulating layers, which will be described later, are formed between the common electrode CE and the substrate BS.

  The color filter CF of the substrate FS as the counter substrate is one in which three color filter pixels CFr, CFg, and CFb of R (red), G (green), and B (blue) are periodically arranged.

  Further, a light shielding film BM is formed at each boundary between the color filter pixels CFr, CFg, and CFb of each color. The light shielding film BM is called a black matrix, and is made of a film having a light shielding property such as a black resin or a low reflective metal. The light shielding film BM is formed in a lattice shape in plan view.

  The light shielding film BM is formed in both the display area DPA and the frame area FLA. Generally, among the openings formed in the light shielding film BM and embedded with the color filter CF, the end of the opening formed on the peripheral side is defined as the boundary between the display area DPA and the frame area FLA. . A dummy color filter may be provided on the peripheral edge side of the display area DPA. The light shielding film formed in the frame area FLA is provided from the display area DPA to the end of the substrate FS.

  The substrate FS has a resin layer OC1 that covers the color filter CF. Since the light shielding film BM is formed at the boundary between the color filter pixels CFr, CFg, and CFb for each color, the liquid crystal layer side of the color filter CF is an uneven surface. The resin layer OC1 functions as a flattening film that flattens unevenness on the liquid crystal layer side of the color filter CF. Alternatively, the resin layer OC1 functions as a protective film that prevents impurities from diffusing from the color filter CF to the liquid crystal layer. The resin layer OC1 can harden the resin material by containing a component that is cured by applying energy, such as a thermosetting resin or a photocurable resin. The resin layer OC1 is also provided in the frame area FLA.

  A liquid crystal layer LCL driven by an electric field formed by the pixel electrode PE and the common electrode CE is provided between the substrate FS and the substrate BS.

  The substrate FS has an alignment film AF1 that covers the resin layer OC1 on the main surface FSb that is an interface in contact with the liquid crystal layer LCL. The substrate BS has an alignment film AF2 that covers the insulating layer OC2 and the plurality of pixel electrodes PE on the main surface BSf that is an interface in contact with the liquid crystal layer LCL. The alignment films AF1 and AF2 are resin films formed to align the initial alignment of the liquid crystal contained in the liquid crystal layer LCL, and are made of, for example, a polyimide resin. The alignment films AF1 and AF2 are also provided in the frame area FLA, and may be provided up to the end of the substrate FS.

  In the display device LCD1 shown in FIG. 3, light emitted from the backlight LS (see FIG. 2) is filtered by the polarizing plate PL2 (see FIG. 2) and enters the liquid crystal layer LCL. The light incident on the liquid crystal layer LCL is emitted from the substrate FS with the polarization state changed by the liquid crystal.

  At this time, the orientation of the liquid crystal is controlled by an electric field formed by applying a voltage to the pixel electrode PE and the common electrode CE, and the liquid crystal layer LCL functions as an optical shutter.

  Note that the thickness of the liquid crystal layer LCL is extremely thin compared to the thickness of the substrate FS or the substrate BS. In the example shown in FIG. 3, the thickness of the liquid crystal layer LCL is, for example, about 3 to 4 μm.

<Equivalent circuit of display device>
Next, an equivalent circuit of the display device will be described with reference to FIG. FIG. 4 is a diagram illustrating an equivalent circuit of the display device according to the embodiment.

  As shown in FIG. 4, the display unit DP of the display device LCD1 has a plurality of pixels Pix. The plurality of pixels Pix are provided on the substrate BS in the display area DPA in a plan view, and are arranged in a matrix in the X-axis direction and the Y-axis direction.

  Further, the display device LCD1 includes a plurality of scanning lines GL and a plurality of signal lines SL. The plurality of scanning lines GL are provided on the substrate BS (for example, see FIG. 2) in the display area DPA, extend in the X-axis direction, and are arranged in the Y-axis direction. The plurality of signal lines SL are provided on the substrate BS in the display area DPA, extend in the Y-axis direction, and are arranged in the X-axis direction. The plurality of signal lines SL and the plurality of scanning lines GL intersect each other.

  Each of the plurality of pixels Pix includes subpixels SPix that display colors of R (red), G (green), and B (blue). Each of the sub-pixels SPix is provided in a region surrounded by two adjacent scanning lines GL and two adjacent signal lines SL, but may have another configuration.

  Each sub-pixel SPix includes a transistor Trd formed of a thin film transistor connected to the signal line SL by a source electrode, a pixel electrode PE connected to the drain electrode of the transistor Trd, and a common electrode facing the pixel electrode PE across the liquid crystal layer. CE. In FIG. 4, a liquid crystal capacitor equivalent to the liquid crystal layer and a storage capacitor formed between the common electrode CE and the pixel electrode PE are shown as a capacitor Clc. Note that the drain electrode and the source electrode of the thin film transistor are switched as appropriate depending on the polarity of the potential.

  The driving circuit CC (see FIG. 1) of the display device LCD1 includes a video line driving circuit CS, a scanning line driving circuit CG, a control circuit CTL, and a common electrode driving circuit CM.

  Each source electrode of the transistors Trd of the plurality of subpixels SPix arranged in the Y-axis direction is connected to the signal line SL. Each of the plurality of signal lines SL is connected to the video line driving circuit CS.

  The gate electrodes of the transistors Trd of the plurality of subpixels SPix arranged in the X-axis direction are connected to the scanning line GL. Each scanning line GL is connected to a scanning line driving circuit CG.

  The control circuit CTL controls the video line driving circuit CS, the scanning line driving circuit CG, and the common electrode driving circuit CM based on display control signals such as display data, a clock signal, and a display timing signal transmitted from the outside of the display device. ,Control.

  The control circuit CTL displays display data and display control signals supplied from the outside depending on the arrangement of subpixels of the display device, the display method, the presence or absence of an RGB switch (not shown), the presence or absence of a touch panel (not shown), and the like. Are appropriately converted and output to the video line driving circuit CS, the scanning line driving circuit CG, and the common electrode driving circuit CM.

<Problems when changing the width of the frame area>
In the display device, there are various external dimensions as a panel even if the size of the display area is the same. This is because there are various requests from users of display devices. Therefore, among the frame area (upper frame area) FLA2, the frame area (left frame area) FLA3, the frame area (right frame area) FLA4, and the frame area (lower frame area) FLA1, for example, the frame areas FLA2, FLA3, and FLA4 The display device may be designed by changing the width of each of the display devices.

  Conventionally, in order to manufacture each of two types of display devices having different widths of the frame regions FLA2, FLA3, and FLA4, a set of a plurality of photomasks that are respectively used for photolithography in the manufacturing process of each display device, It was common to prepare separately and manufacture with different mother substrates. Therefore, the cost required for manufacturing the display device is increased, and the period required for manufacturing the display device is long.

  Therefore, in the present embodiment, two types of display devices that solve the conventional problems and have at least the widths of the frame areas FLA2, FLA3, and FLA4, preferably the widths of the frame areas FLA2, FLA3, FLA4, and FLA1 are different. It can be easily manufactured on the same mother board.

<Configuration of mother board>
First, the configuration of the substrate assembly (mother substrate) SG will be described with reference to FIG. A portion indicated by a rectangular thick line frame corresponds to one display device. As shown in FIG. 12, a plurality of display devices are impositioned on the mother substrate SG.

  Corresponding to each display device, a plurality of shapes of sealing materials are formed on the mother substrate SG. The sealing material S1 (first sealing portion) is formed in a rectangular shape around the display area. The liquid crystal layer is filled in a region surrounded by the sealing material S1. Other areas are not filled. The sealing material S1 is arranged at intervals in a matrix in the X direction (X axis direction) and the Y direction (Y axis direction). In the X direction, a seal material S2 (second seal portion) is formed in a rectangular shape between the seal materials S1. The sealing material S2 is formed so as to be in contact with the sealing material S1 on the side extending in the Y direction. Thereby, the width | variety of the X direction of sealing material S1 can be expanded by sealing material S2.

  On the sides extending in the X direction of the sealing material S1 and the sealing material S2, the sealing material S3 (third sealing portion) and the sealing material S4 (fourth sealing portion) are formed linearly. The sealing material S3 and the sealing material S4 are formed so as to be in contact with the sides extending in the X direction of the sealing material S1 and the sealing material S2. Thereby, the width | variety of the Y direction of the sealing material S1 and the sealing material S2 can be expanded by the sealing material S3 and the sealing material S4.

  A plurality of terminal portions for connecting the semiconductor chip CHP and the flexible circuit board are provided on the side of the sealing material S4 opposite to the side in contact with the sealing material S1. A seal material S5 is formed extending in the X direction adjacent to the terminal region.

<Configuration of frame area of display device>
Next, with reference to FIGS. 5 to 11, the configuration of the frame region of each display device after being separated from the mother substrate SG will be described. In the present invention, a structure in which each frame area can be separated with a plurality of dimensions is shown. In the following, the frame area (upper frame area) FLA2, the frame area (left frame area) FLA3, and the frame area (right frame) Region) A display device when the width of FLA4 is large will be described.

  FIG. 5 is a plan view of the display device according to the embodiment. 6 and 7 are plan views of a frame region of the display device according to the embodiment. 6 and 7 show an enlarged region RG1 in the display device shown in FIG. 6 shows alignment marks AM11 and AM21 formed on the main surface BSf of the substrate BS, and FIG. 7 shows alignment marks AM12 and AM22 formed on the main surface FSb of the substrate FS.

  8 and 9 are cross-sectional views of a frame region of the display device according to the embodiment. 8 is a cross-sectional view taken along the line CC in FIGS. 6 and 7, and FIG. 9 is a cross-sectional view taken along the line DD in FIGS. 6 and 7. In FIGS. 6 and 7, for the sake of easy understanding, illustration of parts other than those necessary for the description among the parts shown in FIGS. 8 and 9 is omitted. 8 and 9, the liquid crystal layer LCL (see FIG. 3) is not shown.

  In the display device shown in FIG. 5, the plan view showing the region RG2 in an enlarged manner is the same as FIG. 6 and FIG. 7 except that FIG. 6 and FIG. Is omitted. Further, the sectional view of the omitted plan view is the same as that in FIGS.

  As described with reference to FIG. 1 described above, and as shown in FIG. 5, the substrate BS has a side BSs1, a side BSs2, a side BSs3, and a side BSs4. Further, the four side surfaces of the substrate BS respectively corresponding to the side BSs1, the side BSs2, the side BSs3, and the side BSs4 are referred to as a side surface SSB1, a side surface SSB2, a side surface SSB3, and a side surface SSB4, respectively. Further, the side surfaces of the substrate FS respectively corresponding to the side BSs2, the side BSs3, and the side BSs4 are referred to as a side surface SSF2, a side surface SSF3, and a side surface SSF4, respectively. Note that the side surface of the substrate FS on the side BSs1 side with respect to the display area PDA is referred to as a side surface SSF1.

  The frame area FLA2 has frame areas FLA21 and FLA22. The frame area FLA21 is a part located on the display area DPA side in the frame area FLA2, and the frame area FLA22 is a part located on the opposite side to the display area DPA side in the frame area FLA2.

  The frame area FLA3 has frame areas FLA31 and FLA32. The frame area FLA31 is a part located on the display area DPA side in the frame area FLA3, and the frame area FLA32 is a part located on the opposite side to the display area DPA side in the frame area FLA3.

  The frame area FLA4 has frame areas FLA41 and FLA42. The frame area FLA41 is a part located on the display area DPA side in the frame area FLA4, and the frame area FLA42 is a part located on the opposite side to the display area DPA side in the frame area FLA4.

  The frame area FLA1 has frame areas FLA11 and FLA12. The frame area FLA11 is a part located on the display area DPA side in the frame area FLA1, and the frame area FLA12 is a part located on the opposite side to the display area DPA side in the frame area FLA1.

  As shown in FIGS. 6 to 9, in the frame regions FLA2 and FLA3 (the same applies to the frame region FLA4), the main surface BSf of the substrate BS has a wiring WG, an insulating film IF1, a wiring WS, and an interlayer resin film. IL1 and an alignment film AF2 are provided. As shown in FIG. 6, alignment marks AM11 and AM21 are formed on the main surface BSf of the substrate BS.

  In the frame regions FLA2 and FLA3 (FLA4), the wiring WG is formed on the main surface BSf of the substrate BS. The wiring WG is formed in the same layer as the scanning line GL, for example, and is made of a metal such as chromium (Cr) or molybdenum (Mo) or an alloy thereof. That is, preferably, the wiring WG is made of a conductive film having a light shielding property such as a metal film or an alloy film.

  In the frame regions FLA2 and FLA3 (FLA4), an insulating film IF1 is provided on the main surface BSf of the substrate BS so as to cover the wiring WG. The insulating film IF1 is a transparent insulating film made of, for example, silicon nitride or silicon oxide.

  Note that the insulating film IF0 may be formed between the main surface BSf of the substrate BS and the wiring WG and the insulating film IF1.

  In the frame regions FLA2 and FLA3 (FLA4), the wiring WS is formed on the insulating film IF1. The wiring WS is formed, for example, in the same layer as the signal line SL, and is made of, for example, a metal film having a multilayer structure in which aluminum (Al) is sandwiched between molybdenum (Mo) or the like. That is, the wiring WS is preferably made of a conductive film having a light shielding property such as a metal film.

  In the frame regions FLA2 and FLA3 (FLA4), an interlayer resin film IL1 as a protective film or a planarizing film is formed on the insulating film IF1 so as to cover the wiring WS. The interlayer resin film IL1 is made of, for example, an acrylic photosensitive resin.

  In the frame regions FLA2 and FLA3 (FLA4), the interlayer resin film IL1 is formed with an opening OP1 that penetrates the interlayer resin film IL1 and reaches the insulating film IF1. An insulating film IF2 is provided on the bottom of the opening OP1, the inner wall of the opening OP1, and the interlayer resin film IL1. The insulating film IF2 is a transparent insulating film made of, for example, silicon nitride or silicon oxide.

  A portion of the insulating film IF2 formed at the bottom of the opening OP1 has an opening OP2 that reaches the insulating film IF1 through the insulating film IF2. An alignment film AF2 is formed on the bottom of the opening OP2, the portion of the insulating film IF2 formed on the inner wall of the opening OP1, and the portion of the insulating film IF2 formed on the interlayer resin film IL1. . As described above, the alignment film AF2 is made of, for example, a polyimide resin.

  Note that the shield electrode SHE is formed on the bottom of a part of the opening OP2, on the part of the insulating film IF2 formed on the inner wall of the opening OP1, and on the part of the insulating film IF2 formed on the interlayer resin film IL1. May be formed. The shield electrode SHE is made of a transparent conductive material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide). In such a case, the alignment film AF2 is formed on the bottom of the opening OP2, the portion of the insulating film IF2 formed on the inner wall of the opening OP1, and the portion of the insulating film IF2 formed on the interlayer resin film IL1. Then, it is formed so as to cover the shield electrode SHE.

  On the other hand, as shown in FIGS. 6 to 9, in the frame regions FLA2 and FLA3 (the same applies to the frame region FLA4), the light shielding film BM, the color filter CF, and the resin layer OC1 are formed on the main surface FSb of the substrate FS. , Spacers SP1 and SP2 and an alignment film AF1 are provided. As shown in FIG. 7, alignment marks AM12 and AM22 are formed on the main surface FSb of the substrate FS.

  In the frame regions FLA2 and FLA3 (FLA4), a light shielding film BM is formed on the main surface FSb of the substrate FS. As described above, the light shielding film BM is made of, for example, a black resin or a low reflective metal.

  In the frame regions FLA2 and FLA3 (FLA4), a color filter CF is formed between the light shielding film BM and the substrate BS. As the color filter CF, for example, a B (blue) color filter pixel CFb is formed.

  In the frame regions FLA2 and FLA3 (FLA4), a resin layer OC1 is formed so as to cover the light shielding film BM and the color filter CF. As described above, the resin layer OC1 contains a thermosetting resin or a photocurable resin. The color filter CF may be provided between the light shielding film and the substrate FS.

  In the frame regions FLA2 and FLA3 (FLA4), spacers SP1 and SP2 are formed between the resin layer OC1 and the substrate BS. The spacers SP1 and SP2 protrude from the main surface FSb of the substrate FS to the substrate BS side. The spacers SP1 and SP2 maintain a distance between the substrate BS and the substrate FS. The spacers SP1 and SP2 are made of, for example, an acrylic photosensitive resin. A color filter pixel CFb is provided between the spacers SP1 and SP2 and the substrate FS to control the height of the spacers SP1 and SP2. In addition, the spacer SP1 may be dotted with conical spacers. Alternatively, the spacer SP2 may be a plurality of island-shaped spacers scattered in the X-axis direction and the Y-axis direction.

  The height of the spacer SP1 from the substrate FS is higher than the height of the spacer SP2 from the substrate FS.

  The spacers SP1 and SP2 may be provided on the main surface BSf of the substrate BS. At this time, the spacers SP1 and SP2 protrude from the main surface BSf of the substrate BS to the substrate FS side.

  In the frame regions FLA2 and FLA3 (FLA4), an alignment film AF1 is formed between the resin layer OC1 and the substrate BS. As described above, the alignment film AF1 is made of, for example, a polyimide resin. Although not shown in FIG. 8, the alignment film AF1 may be formed on the side surfaces and the upper surface of the spacers SP1 and SP2.

  10 and 11 are plan views of a frame region of the display device according to the embodiment. 10 and 11 show the region RG3 in an enlarged manner in the display device shown in FIG. FIG. 10 shows alignment marks AM11 and AM21 formed on the main surface BSf of the substrate BS, and FIG. 11 shows alignment marks AM12 and AM22 formed on the main surface FSb of the substrate FS.

  In the display device shown in FIG. 5, the plan view showing the region RG4 in an enlarged manner is the same as FIG. 10 and FIG. 11 except that FIG. 10 and FIG. Is omitted.

  As shown in FIG. 10 and FIG. 11, the detailed description is also omitted in the frame area FLA1, but, like the frame areas FLA2 and FLA3 (FLA4), the main surface (BSf) of the substrate BS has wiring (WG). ), An insulating film (IF1), a wiring (WS), an interlayer resin film IL1, and an alignment film (AF2), and alignment marks AM11 and AM21 are formed. The main surface (FSb) of the substrate FS is provided with a light shielding film BM, a color filter (CF), a resin layer (OC1), spacers (SP1) and SP2, and an alignment film (AF1). Furthermore, alignment marks AM12 and AM22 are formed.

  In the frame area FLA1, in addition to the alignment marks AM11, AM21, AM12 and AM22, alignment marks AM21a and AM22a having the same shape as the alignment marks AM21 and AM22 are also provided in order to scribe the substrate FS.

  In the display device of the present embodiment, as shown in FIGS. 8 and 9, a seal ADH is provided between the alignment film AF1 and the alignment film AF2. That is, the seal ADH is an adhesive portion that is provided between the substrate BS and the substrate FS and bonds the substrate BS and the substrate FS. Further, as shown in FIG. 5, the seal ADH has a portion PT1 provided in the frame region FLA1, a portion PT2 provided in the frame region FLA2, and a portion provided in the frame region FLA3 in plan view. PT3 and a portion PT4 provided in the frame area FLA4 are included.

<Arrangement of seals and spacers in the frame area>
In the display device of the present embodiment, the spacer SP21 (spacer SP2) is disposed in the frame areas FLA2, FLA3, FLA4, and FLA1. The spacer SP21 is a spacer SP21 (first spacer) disposed in the frame area FLA3, a spacer SP21 (second spacer) disposed in the frame area FLA4, and a spacer disposed in the frame area FLA2. SP21 (third spacer) and a spacer SP21 (fourth spacer) disposed in the frame area FLA1 are included.

  In the display device according to the present embodiment, the seal ADH (first to fourth seals) is arranged in the frame areas FLA2, FLA3, FLA4, and FLA1. The seal ADH includes a seal ADH (first and third seals) disposed in the frame region FLA3, a seal ADH (first and fourth seals) disposed in the frame region FLA4, and a frame region FLA2. A seal ADH (first and second seals) disposed therein.

  The part PT2 of the seal ADH includes a part PT21 and a part PT22. The portion PT21 of the seal ADH is disposed on the display area DPA side in the Y-axis direction with respect to the spacer SP21, and the portion PT22 of the seal ADH is disposed on the opposite side of the portion PT21 across the spacer SP21. That is, in the second frame region FLA2, the third spacer SP21 extending in the X-axis direction is formed across the formation region of the first seal ADH and the second seal ADH (FIGS. 8 and 8). 15).

  The part PT3 of the seal ADH includes a part PT31 and a part PT32. The portion PT31 of the seal ADH is disposed on the display area DPA side in the X-axis direction with respect to the spacer SP21, and the portion PT32 of the seal ADH is disposed on the opposite side of the portion PT31 with the spacer SP21 interposed therebetween. That is, in the third frame region FLA3, the first spacer SP21 extending in the Y-axis direction is formed across the formation region of the first seal ADH and the third seal ADH (FIGS. 9 and 9). 16). The width of the first spacer SP21 is larger than the width of the third spacer SP21 (see FIGS. 13, 14, 17, and 18).

  Although not shown, the portion PT4 of the seal ADH is similar to the portion PT3 of the seal ADH, and includes a portion (PT41) corresponding to the portion PT31 and a portion (PT42) corresponding to the portion PT32. For the sake of explanation, they are referred to as a part (PT41) and a part (PT42). That is, in the fourth frame region FLA4, the second spacer SP21 extending in the Y-axis direction is formed across the formation region of the first seal ADH and the fourth seal ADH. The width of the second spacer SP21 is larger than the width of the third spacer SP21.

  The part PT1 of the seal ADH includes a part PT11 and a part PT12. The portion PT11 of the seal ADH is disposed on the display area DPA side in the Y-axis direction with respect to the spacer SP21, and the portion PT12 of the seal ADH is disposed on the opposite side of the portion PT11 with the spacer SP21 interposed therebetween.

  In other words, the frame regions FLA21, FLA31, FLA41 and FLA11 as the first part of the frame regions FLA2, FLA3, FLA4 and FLA1 are arranged on the display region PDA side with respect to the spacer SP21, and the frame regions FLA2, FLA3, FLA4 and The frame regions FLA22, FLA32, FLA42 and FLA12 as the second part of FLA1 are arranged on the opposite side of the frame regions FLA21, FLA31, FLA41 and FLA11 across the spacer SP21. The seal ADH is provided in the frame regions FLA21, FLA31, FLA41 and FLA11, and FLA22, FLA32, FLA42 and FLA12 in plan view. The spacer SP21 is formed around the outer edge of the substrate FS at the boundary between the frame regions FLA21, FLA31, FLA41 and FLA11 and the frame regions FLA22, FLA32, FLA42 and FLA12. The frame regions FLA21, FLA31, FLA41 and FLA11 side of the spacer SP21 are in contact with the portions PT21, PT31, (PT41) and PT11 of the seal ADH, and the frame regions FLA22, FLA32, FLA42 and FLA12 side of the spacer SP21 are sealed ADH. The portions PT22, PT32, (PT42) and PT12 are in contact with each other.

  When manufacturing such a display device, as will be described with reference to FIGS. 12 to 18 described later, when the substrate aggregate (mother substrate) SG is divided, the frame region FLA2 extends in the X-axis direction. As the existing scribe line, one of two types of scribe lines including the scribe line LN11 and the scribe line LN12 can be used. The scribe line LN11 passes through the spacer SP21 in plan view. The scribe line LN12 is provided on the opposite side of the display area DPA across the scribe line LN11, and passes through the area RL1 where the spacer SP21 and the seal ADH are not provided in plan view.

  When the scribe line LN11 is used as the scribe line, as will be described with reference to FIGS. 12 to 18 described later, for example, the force applied to the substrate assembly SG at the time of the scribe process is centered on the scribe line LN11. By being distributed symmetrically, scribing can be easily performed. On the other hand, even when the scribe line LN12 is used as the scribe line, the scribe process can be easily performed as will be described later with reference to FIGS. Therefore, as described later with reference to FIGS. 12 to 18, the width of the frame area FLA <b> 2 in the Y-axis direction can be easily changed between two types of widths.

  On the other hand, as the scribe line LN2 provided in the frame regions FLA3 and FLA4 and extending in the Y-axis direction, either of two types of scribe lines including the scribe line LN21 and the scribe line LN22 can be used. The scribe line LN21 passes through the spacer SP21 in plan view. The scribe line LN22 is provided on the opposite side of the display area DPA across the scribe line LN21, and passes through the spacer SP21 in plan view. Regardless of whether the scribe line LN21 or LN22 is used as the scribe line, the spacer SP21 is cut, so that the force applied to the substrate assembly SG during the scribe process is symmetric about the scribe line LN21 or LN22. By being distributed, scribing can be easily performed.

  Therefore, in the display device of the present embodiment, the width of the frame area FLA2 in the Y-axis direction and the widths of the frame areas FLA3 and FLA4 in the X-axis direction can be easily changed. Such a change in the width of the frame areas FLA2, FLA3, FLA4 is an important configuration from the viewpoint of adjusting the balance between narrowing the frame areas FLA2, FLA3, FLA4 and ensuring the strength of the display device. It has become to.

  Therefore, in the display device of the present embodiment, in order to manufacture each of the two types of display devices having different widths of the frame areas FLA2, FLA3, and FLA4 in the Y-axis direction and the X-axis direction, There is no need to separately prepare a set of a plurality of photomasks used for photolithography. Therefore, it is possible to reduce the cost required for manufacturing two types of display devices having different widths of the frame regions FLA2, FLA3, and FLA4 in the Y-axis direction and the X-axis direction. Alternatively, it is possible to shorten the time required for manufacturing two types of display devices having different widths of the frame regions FLA2, FLA3, and FLA4 in the Y-axis direction and the X-axis direction. Therefore, two types of display devices with different widths of the frame regions FLA2, FLA3, FLA4 in the Y-axis direction and the X-axis direction can be easily manufactured.

  That is, according to the present embodiment, it is possible to select the width of the frame regions FLA2, FLA3, and FLA4 by providing two cutable portions in the frame regions FLA2, FLA3, and FLA4 and changing the cutting position.

  The spacer SP21 extends in the X-axis direction and the Y-axis direction. Thereby, as will be described later with reference to FIGS. 12 to 18, scribing can be performed more easily.

  Ends BF2 and BF1 in the Y-axis direction of main surface BSf of substrate BS and ends FB2 and FB1 in the Y-axis direction of main surface FSb of substrate FS are exposed from seal ADH. In other words, the end portions BF2 and BF1 of the substrate BS and the end portions FB2 and FB1 of the substrate FS in the frame regions FLA22 and FLA12 are exposed from the seal ADH. That is, the seal ADH is separated from the side surfaces SSB2 and SSB1 of the substrate BS in the Y-axis direction and the side surfaces SSF2 and SSF1 of the substrate FS in the Y-axis direction in plan view. In such a case, as will be described with reference to FIGS. 12 to 18 described later, scribing can be easily performed on the scribe line LN12. However, the seal ADH may be provided also in the region RL1 including the scribe line LN12.

  On the other hand, the end portion BF3 and the end portion BF3 of the main surface BSf of the substrate BS in the X-axis direction (the end portion BF4 corresponding to the end portion BF3, not shown), and the end portion of the main surface FSb of the substrate FS in the X-axis direction The part FB3 and the end part FB4 corresponding to the end part FB3 (not shown) are in contact with the spacer SP21 and the seal ADH. In other words, the end portions BF3 and (BF4) of the substrate BS and the end portions FB3 and (FB4) of the substrate FS in the frame regions FLA32 and FLA42 are in contact with the spacer SP21 and the seal ADH. That is, the spacer SP21 and the seal ADH are in contact with the side surfaces SSB3 and SSB4 of the substrate BS in the X-axis direction and the side surfaces SSF3 and SSF4 of the substrate FS in the X-axis direction in plan view. In such a case, as will be described later with reference to FIGS. 12 to 18, scribing can be easily performed on the scribe line LN22.

  Preferably, the display device of the present embodiment has an alignment mark AM1 (first alignment mark) for alignment. The alignment mark AM1 is provided on the substrate BS or the substrate FS, and is arranged at the same position as the spacer SP21 in the Y-axis direction and the X-axis direction. In other words, the alignment mark AM1 overlaps the spacer SP21 in the Y-axis direction and the X-axis direction. The alignment mark AM1 is provided in the frame regions FLA21, FLA31, FLA41, and FLA11 at the boundaries between the frame regions FLA21, FLA31, FLA41, and FLA11 and the frame regions FLA22, FLA32, FLA42, and FLA12. As shown in FIGS. 6, 7, 10 and 11, the alignment mark AM1 formed on the substrate BS is referred to as an alignment mark AM11, and the alignment mark AM1 formed on the substrate FS is referred to as an alignment mark AM12.

  By performing scribing using the scribe lines LN11 and LN21 passing through the alignment marks AM11 and AM12 in a plan view, the position accuracy of the scribing can be improved.

  Preferably, the display device of the present embodiment has an alignment mark AM2 (second alignment mark) for alignment. The alignment mark AM2 is the end portions BF2, BF3, (BF4) and BF1 in the Y-axis direction and the X-axis direction of the main surface BSf of the substrate BS, or the Y-axis direction and the X-axis direction of the main surface FSb of the substrate FS. Are provided at the end portions FB2, FB3, (FB4) and FB1. In other words, the alignment mark AM2 is provided at the end portions BF2, BF3, (BF4) and BF1 or the end portions FB2, FB3, (FB4) and FB1 in the frame regions FLA22, FLA32, FLA42 and FLA12. As shown in FIGS. 6, 7, 10 and 11, the alignment mark AM2 formed on the substrate BS is referred to as an alignment mark AM21, and the alignment mark AM2 formed on the substrate FS is referred to as an alignment mark AM22. The alignment marks AM21 and AM22 have a corresponding relationship with the alignment marks AM11 and AM12, and are arranged at a position farther from the display area DPA than the alignment marks AM11 and AM12, that is, both in the X-axis direction and the Y-axis direction. .

  By performing scribing using the scribe lines LN21 and LN22 that pass through the alignment marks AM21 and AM22 in plan view, the position accuracy of the scribing can be improved.

  The alignment marks AM11 and AM21 are preferably formed in the same layer as the plurality of scanning lines GL or the plurality of signal lines SL. Each of the scanning lines GL and the signal lines SL is made of a conductive film having a light shielding property as described above. Therefore, the alignment marks AM11 and AM21 are formed in the same layer as the plurality of scanning lines GL or the plurality of signal lines SL, so that the visibility of the alignment marks AM11 and AM21 can be improved. The alignment accuracy can be increased.

  The alignment marks AM12 and AM22 are preferably formed in the same layer as the light shielding film BM. As described above, the light shielding film BM is formed of a film having a light shielding property. Therefore, the alignment marks AM12 and AM22 are formed in the same layer as the light shielding film BM, whereby the visibility of the alignment marks AM12 and AM22 can be improved, and the alignment accuracy by the alignment marks AM12 and AM22 can be improved. it can.

  Preferably, alignment mark AM2 has a shape different from the shape of alignment mark AM1. This prevents misidentification of the alignment mark AM1 and the alignment mark AM2, and reliably selects a desired scribe line from among the scribe line LN11 and the scribe line LN12, and among the scribe line LN21 and the scribe line LN22. Scribing can be performed.

  Preferably, for example, circuit wiring such as the wiring WS is arranged in the frame regions FLA21, FLA31, FLA41, and FLA11. As described above, the frame areas FLA21, FLA31, FLA41, and FLA11 are portions located on the display area DPA side of the frame areas FLA2, FLA3, FLA4, and FLA1, and are on the display area DPA side with respect to the center of the spacer SP21. It is a part located in. On the other hand, in the frame areas FLA22, FLA32, FLA42 and FLA12, dummy patterns may be arranged, but no circuit wiring such as wiring WS is arranged. As described above, the frame areas FLA22, FLA32, FLA42, and FLA12 are portions of the frame areas FLA2, FLA3, FLA4, and FLA1 that are located on the opposite side of the display area DPA, and are displayed with respect to the center of the spacer SP21. It is a portion arranged on the side opposite to the area DPA side. Although FIG. 8 shows an example in which the dummy pattern SD is arranged in the frame area FLA22, in this case, since it is for adjusting the area ratio of the pattern, it is in an electrically floating state (floating state). Is preferred.

  According to such an arrangement, even when the width of the frame areas FLA2 and FLA1 in the Y-axis direction and the width of the frame areas FLA3 and FLA4 in the X-axis direction are changed, for example, the arrangement of the circuit wiring such as the wiring WS is changed. Therefore, it is possible to easily design two types of display devices in which the widths of the frame regions FLA2 and FLA1 in the Y-axis direction and the widths of the frame regions FLA3 and FLA4 in the X-axis direction are changed.

  Note that the width WD1 of the frame area FLA2 in the Y-axis direction can be set to, for example, about 1 mm. Furthermore, in the frame area FLA2, the width WD11 in the Y-axis direction of the portion (frame area FLA21) disposed on the display area DPA side with respect to the spacer SP2 (scribe line LN11) may be set to, for example, about 0.5 mm. it can.

  Further, the width WD2 in the X-axis direction of the frame regions FLA3 and FLA4 can be set to about 0.7 mm, for example. Further, of the frame areas FLA3 and FLA4, the width WD21 in the X-axis direction of the portion (frame areas FLA31 and FLA41) arranged on the display area DPA side with respect to the spacer SP2 (scribe line LN21) is, for example, about 0.5 mm. It can be.

  According to the display device having such a dimension, the frame region FLA2 has a width WD1 in the Y-axis direction of about 1 mm, and the frame regions FLA3 and FLA4 have a width WD2 in the X-axis direction of about 0.7 mm. Two types of display devices can be easily manufactured, with the width WD1 of FLA2 in the Y-axis direction being about 0.5 mm and the outer dimensions of the frame regions FLA3 and FLA4 having the width WD2 in the X-axis direction of about 0.5 mm. . In this case, in the two types of display devices, the difference in the width of the frame area FLA1 in the Y-axis direction can be, for example, about 0.45 mm.

<Manufacturing method of display device>
Next, a method for manufacturing a display device will be described with reference to FIGS. 12-14 is a top view in the manufacturing process of the display apparatus of Embodiment. FIGS. 13 and 14 show the region RG11 in an enlarged manner in the substrate assembly SG shown in FIG. FIG. 13 shows the alignment marks AM11 and AM21 formed on the mother substrate BSG and the main surface BSf of the mother substrate BSG, and FIG. 14 shows the alignment formed on the main surface FSb of the mother substrate FSG and the mother substrate FSG. Marks AM12 and AM22 are shown.

  15 and 16 are cross-sectional views during the manufacturing process of the display device of the embodiment. 15 is a cross-sectional view taken along the line CC in FIGS. 13 and 14, and FIG. 16 is a cross-sectional view taken along the line DD in FIGS. 13 and 14. In FIG. 13 and FIG. 14, for the sake of easy understanding, the illustration of parts other than those necessary for the description among the parts shown in FIG. 15 and FIG. 16 is omitted. 15 and 16, the liquid crystal layer LCL (see FIG. 3) is not shown.

  FIGS. 17 and 18 show the region RG13 in an enlarged manner in the substrate assembly SG shown in FIG. 17 shows alignment marks AM11 and AM21 and the like formed on the main surface BSf of the mother substrate BSG, and FIG. 18 shows alignment marks AM12 and AM22 and the like formed on the main surface FSb of the mother substrate FSG.

  First, manufacture of the mother substrate BSG will be described. In the mother substrate BSG, a plurality of display panel formation regions AR1 as substrate formation regions are formed in the region of the main surface BSf. As shown in FIG. 12, the plurality of display panel formation areas AR1 are arranged in a matrix, for example, in the X-axis direction and the Y-axis direction. After performing a process for forming a seal ADH, which will be described later, the mother substrate BSG is divided into each of the plurality of display panel formation regions AR1, thereby forming a plurality of substrates BS. In other words, the substrate BS is a substrate obtained by dividing the mother substrate BSG into each of the plurality of display panel formation regions AR1 and dividing it into individual pieces.

  As shown in FIG. 12, the main surface BSf of the display panel formation area AR1 includes a display area DPA and frame areas FLA1, FLA2, FLA3, and FLA4 as the frame area FLA. The frame area FLA1 is arranged on one side in the Y-axis direction with respect to the display area DPA in plan view. The frame area FLA1 of the display panel formation area AR1 is provided with a plurality of terminal portions for connecting the semiconductor chip CHP and the flexible circuit board. The frame area FLA2 is disposed on the opposite side of the frame area FLA1 across the display area DPA. The frame area FLA3 is arranged on one side in the X-axis direction that intersects the Y-axis direction and preferably orthogonal to the display area DPA in plan view. The frame area FLA4 is disposed on the opposite side of the frame area FLA3 with the display area DPA interposed therebetween.

  Next, a plurality of pixels are provided in each of the plurality of display panel formation regions AR1. At this time, in the frame regions FLA2, FLA3, FLA4, and FLA1, as shown in FIGS. 15 and 16, the wiring WG is formed on the main surface BSf of the display panel formation region AR1, and is insulated so as to cover the wiring WG. A film IF1 is formed. Note that the insulating film IF0 may be formed between the main surface BSf of the mother substrate BSG and the wiring WG and the insulating film IF1.

  In the frame regions FLA2, FLA3, FLA4, and FLA1, a wiring WS is formed on the insulating film IF1, and an interlayer resin as a protective film or a planarizing film is formed on the insulating film IF1 so as to cover the wiring WS. A film IL1 is formed. An opening OP1 is formed in the interlayer resin film IL1 so as to penetrate the interlayer resin film IL1 and reach the insulating film IF1. On the bottom of the opening OP1, the inner wall of the opening OP1, and the interlayer resin film IL1, an insulating material is formed. A membrane IF2 is provided. In addition, an opening OP2 that penetrates through the insulating film IF2 and reaches the insulating film IF1 is formed in a portion of the insulating film IF2 formed at the bottom of the opening OP1. An alignment film AF2 is formed on the bottom of the opening OP2, on the insulating film IF2 formed on the inner wall of the opening OP1, and on the insulating film IF2 formed on the interlayer resin film IL1. The groove portions of the alignment film AF2 formed on the bottoms and inner walls of the openings OP1 and OP2 become a plurality of grooves at positions facing the spacer SP21.

  When forming the wiring WG, a plurality of scanning lines GL (see FIG. 4) extending in the X-axis direction and arranged in the Y-axis direction in plan view are displayed in the display panel formation area AR1. Form. Further, when the wiring WS is formed, a plurality of signal lines SL (see FIG. 4) extending in the Y-axis direction and arranged in the X-axis direction in the plan view are displayed in the display panel formation region AR1. Form.

  Next, the manufacture of the mother substrate FSG will be described. The mother substrate FSG has a plurality of display panel formation regions AR2 as substrate formation regions in the region of the main surface FSb. As shown in FIG. 12, the display panel formation area AR2 is arranged in a matrix in, for example, the X-axis direction and the Y-axis direction. After performing a step of forming a seal ADH, which will be described later, the mother substrate FSG is divided into each of the plurality of display panel formation regions AR2, thereby forming a plurality of substrates FS. That is, the substrate obtained by dividing the mother substrate FSG into each of the plurality of display panel formation regions AR2 is a substrate FS.

  Next, spacers SP1 and SP2 protruding from the main surface BSf of the display panel formation region AR1 or protruding from the main surface FSb of the display panel formation region AR2 are provided. The spacers SP1 and SP2 may be formed on any of the mother substrates BSG and FSG. Hereinafter, an example in which the spacers SP1 and SP2 are formed on the mother substrate FSG will be described.

  As shown in FIGS. 15 and 16, in the frame regions FLA2, FLA3, FLA4, and FLA1, a light shielding film BM is formed on the main surface FSb of the display panel formation region AR2, and a color filter CF is formed on the light shielding film BM. For example, a B (blue) color filter pixel CFb is formed, and a resin layer OC1 is formed on the light-shielding film BM on the substrate BS side so as to cover the color filter CF.

  Spacers SP1 and SP2 are formed on the substrate BS side of the resin layer OC1. As described above, the height of the spacer SP1 is higher than the height of the spacer SP2, and the lower surface of the spacer SP1 is in contact with the alignment film AF2, but the lower surface of the spacer SP2 is in contact with the alignment film AF2. do not do. In addition, a spacer SP21 (spacer SP2) is provided. The spacer SP21 is provided so that the spacer SP21 is disposed in the frame area FLA2 in plan view when the mother substrate BSG and the mother substrate FSG are disposed to face each other.

  The spacer SP21 may be provided on the mother substrate BSG. At this time, the spacer SP21 is disposed in the frame area FLA2.

  An alignment film AF1 is formed on the resin layer OC1. As described above, the alignment film AF1 is made of, for example, a polyimide resin.

  Next, the seal material ADH1 is formed on the main surface BSf of the display panel formation region AR1 or the main surface FSb of the display panel formation region AR2. As a material for forming the sealing material ADH1, for example, an ultraviolet curable resin is applied by printing or drawing. The sealing material ADH1 may be formed on any of the mother substrates BSG and FSG. Here, an example in which the sealing material ADH1 is formed on the mother substrate FSG will be described.

  Next, as illustrated in FIGS. 15 and 16, the mother substrate BSG and the mother substrate FSG are disposed to face each other. With the main surface BSf of the mother substrate BSG and the main surface FSb of the mother substrate FSG facing each other, the mother substrate BSG and the mother substrate FSG are disposed to face each other. At this time, the spacer SP1 formed in the display panel formation region AR2 is in contact with the alignment film AF2 formed in the display panel formation region AR1, thereby causing a gap between the display panel formation region AR1 and the display panel formation region AR2. Can be held.

  Next, the seal material ADH1 is cured to form a seal ADH as an adhesion portion made of the cured seal material ADH1, and the mother substrate BSG and the mother substrate FSG are bonded by the seal ADH. For example, the sealing material ADH1 is irradiated with ultraviolet rays to cure the sealing material, and further subjected to a thermosetting treatment to fully cure the sealing material. Thereby, the mother substrate BSG and the mother substrate FSG are bonded (bonded) by the seal ADH, and the substrate (display panel) set including the mother substrate BSG and the mother substrate FSG bonded to the mother substrate BSG by the seal ADH. A body SG is formed. At this time, the liquid crystal may be sealed in each display panel, but the liquid crystal may be injected after this.

  In this step, in a plan view, the portion PT1 provided in the frame region FLA1, the portion PT2 provided in the frame region FLA2, the portion PT3 provided in the frame region FLA3, and the frame region FLA4 are provided. The seal ADH including the portion PT4 formed is formed. The parts PT2, PT3, PT4 and PT1 of the seal ADH include parts PT21, PT31, PT41 and PT11 and parts PT22, PT32, PT42 and PT12. Further, the portions PT21, PT31, PT41, and PT11 are arranged on one side with respect to the spacer SP21, that is, the display area DPA side, and the portions PT22, PT32, PT42, and PT12 are placed on the portions PT21, PT31, PT12 across the spacer SP21. It arrange | positions on the opposite side to PT41 and PT11. Note that a portion of the seal ADH provided outside the display panel formation areas AR1 and AR2 is referred to as a portion PT5. Further, a portion provided between adjacent display panel formation regions AR1 and AR2 in the X-axis direction is referred to as a portion PT6.

  Next, the substrate aggregate SG is divided, and each of the mother substrates BSG and FSG is divided into a substrate BS made up of the display panel formation area AR1 and a display panel formation area AR2, and is bonded to the substrate BS by a seal ADH. Substrate FS is formed.

  When the mother substrates BSG and FSG are divided to form the substrates BS and FS, they are provided on both sides in the Y-axis direction (frame regions FLA2 and FLA1) with respect to the display area DPA and extend in the X-axis direction. As the scribe line, one of two types of scribe lines including the scribe line LN11 and the scribe line LN12 can be used. At this time, the display panel formation area AR1 or AR2 as the substrate formation area is scribed with a first size defined in the X-axis direction and the Y-axis direction, or a second size larger than the first size. Now you decide whether to scribe. The scribe line LN11 passes through the spacer SP21 in plan view. The scribe line LN12 is provided on the opposite side of the display area DPA across the scribe line LN11, and passes through the area RL1 where the seal ADH is not provided in plan view.

  When the scribe line LN11 is used as the scribe line, the spacer SP21 is cut. The spacer SP21 after cutting becomes two spacers SP22 and SP23 arranged on both sides with respect to the scribe line LN11, and is arranged symmetrically around the scribe line LN11. Therefore, for example, the force applied to the mother substrate BSG or the mother substrate FSG at the time of the scribe processing is distributed symmetrically about the scribe line LN11 by the spacer SP21, so that the mother substrate BSG or the mother substrate FSG is broken. The scribing process can be performed safely.

  On the other hand, when the scribe line LN12 is used as the scribe line, the scribe line is divided at a position where the seal ADH is not formed in a plan view. The width of the seal ADH is uniquely determined by the size of the dispenser for drawing the seal material, but when a large frame area is required, the scribe line is set outside the formation of the seal ADH in this way. In this case, as shown in FIG. 15, the scribe lines LN12 are set between the spacers SP23 formed in two rows. For this reason, even when the scribe line LN12 is used, the spacer SP23 serves as a stopper, so that an adverse effect such as breaking of the mother substrate BSG or the mother substrate FSG can be eliminated, and scribe processing can be easily performed.

  That is, even when any of the scribe lines LN11 and LN12 is used as the scribe line LN1, the scribe process can be easily performed. Therefore, the width of the frame region FLA2 in the Y-axis direction of the substrate BS can be easily changed between the two types of widths. Also in the substrate FS, the width of the frame area FLA2 in the Y-axis direction can be easily changed between two types of widths.

  On the other hand, the scribe line LN2 provided on both sides in the X-axis direction (the frame areas FLA3 and FLA4) with respect to the display area DPA and extending in the Y-axis direction is similarly composed of the scribe line LN21 and the scribe line LN22. Any type of scribe line can be used. At this time, the display panel formation area AR1 or AR2 as the substrate formation area is scribed with a first size defined in the X-axis direction and the Y-axis direction, or a second size larger than the first size. Now you decide whether to scribe. The scribe line LN21 passes through the spacer SP21 in plan view. The scribe line LN22 is provided on the opposite side of the display area DPA across the scribe line LN21, and passes through the spacer SP21 in plan view.

  When the scribe line LN21 is used as the scribe line, two spacers SP24 and SP25 arranged on both sides of the scribe line LN21 among the spacers SP21 are arranged around the scribe line LN21. On the other hand, also when the scribe line LN22 is used, two spacers SP25 and SP26 arranged on both sides of the scribe line LN22 among the spacers SP21 are arranged around the scribe line LN22. Therefore, for example, the force applied to the mother substrate BSG or the mother substrate FSG during the scribe process is distributed symmetrically about the scribe lines LN21 and LN22, so that the scribe process can be easily performed.

  That is, even when any of the scribe lines LN21 and LN22 is used as the scribe line LN2, the scribe process can be easily performed similarly. Therefore, the positions of the side surfaces SSB3 and SSB4 (see FIG. 12) on the frame regions FLA3 and FLA4 side in the X-axis direction of the substrate BS can be easily changed between the two positions. The widths of the regions FLA3 and FLA4 can be easily changed between two types of widths. Further, since the positions of the side surfaces SSF3 and SSF4 (see FIG. 12) on the frame regions FLA3 and FLA4 side in the X-axis direction of the substrate FS can be easily changed between the two positions, the frame in the X-axis direction The widths of the regions FLA3 and FLA4 can be easily changed between two types of widths.

  Therefore, in the present embodiment, the widths of the frame regions FLA2 and FLA1 in the Y-axis direction and the widths of the frame regions FLA3 and FLA4 in the X-axis direction can be changed. In such a case, in order to manufacture each of the two types of display devices in which the widths of the frame regions FLA2 and FLA1 in the Y-axis direction and the widths of the frame regions FLA3 and FLA4 in the X-axis direction are different, There is no need to separately prepare a set of a plurality of photomasks used for photolithography in the process.

  Preferably, the spacer SP21 extends in the X-axis direction. Accordingly, since the scribe line LN11 overlaps the spacer SP21 in a plan view at any position in the X-axis direction, for example, the optimum conditions for scribe processing are the same at any position in the X-axis direction. Further, the spacer SP21 is arranged across both sides of the scribe line LN11, whereby the rigidity or hardness distribution of the substrate assembly SG has symmetry with respect to the scribe line LN11. Therefore, scribing can be performed more easily. As for the spacer SP21 of the scribe line LN11, divided islands may be scattered in the X-axis direction. The spacer SP21 is not in contact with the opposing substrate, but may be in contact. Moreover, the structure which does not provide spacer SP21 itself may be sufficient.

  When scribing is performed using the scribe line LN12, the end portion BF2 of the main surface BSf of the substrate BS and the end portion FB2 of the main surface FSb of the substrate FS are preferably exposed from the seal ADH. The region where the seal ADH is not provided may be easier to scribe than the region where the seal ADH is provided. In such a case, since the end portion BF2 of the main surface BSf of the substrate BS and the end portion FB2 of the main surface FSb of the substrate FS are exposed from the seal ADH, the scribing line LN12 can be easily scribed. can do.

  At this time, more preferably, the substrate assembly SG is provided with two spacers SP23 (spacer SP2) arranged on both sides of the scribe line LN12 in the region RL1 including the scribe line LN12 in plan view. It may be done. By arranging the two spacers SP23 on both sides of the scribe line LN12, the rigidity or hardness distribution of the substrate assembly has symmetry about the scribe line LN12. Therefore, it is possible to scribe more easily using the scribe line LN12.

  However, it is not essential that the seal ADH is not provided in the region RL1 including the scribe line LN12. The seal ADH may also be provided in the region RL1. Therefore, the end portion BF2 of the main surface BSf of the substrate BS and the end portion FB2 of the main surface FSb of the substrate FS may be covered with the seal ADH.

  Preferably, the substrate assembly SG includes spacers SP24, SP25, and SP26 as the spacer SP21. The spacers SP24, SP25 and SP26 extend in the Y-axis direction. At any position in the Y-axis direction, the scribe lines LN21 and LN22 overlap the spacer SP21 in plan view. Thereby, for example, the optimum conditions for scribe processing are the same at any position in the Y-axis direction. In addition, the spacers SP24 and SP25 are disposed across the scribe line LN21, and the spacers SP25 and SP26 are disposed across the scribe line LN22, thereby increasing the rigidity or hardness of the substrate assembly SG. The distribution has symmetry about the scribe lines LN21 and LN22. Therefore, scribing can be performed more easily.

  Preferably, the substrate assembly SG has an alignment mark AM1. The alignment mark AM1 is provided in the display panel formation region AR1 of the mother substrate BSG or the display panel formation region AR2 of the mother substrate FSG. The alignment mark AM1 is provided so that the alignment mark AM1 is disposed at the same position as the spacer SP21 in the Y-axis direction when the mother substrate BSG and the mother substrate FSG are disposed to face each other. That is, the alignment mark AM1 is provided so as to overlap with the spacer SP21 in the Y-axis direction. When the display panel forming area AR1 or AR2 is scribed with the first size described above, the vicinity of the alignment mark AM1 is cut. Further, when the display panel forming area AR1 or AR2 is scribed with the first size described above, the scribe is performed along the spacer SP21. As shown in FIGS. 13, 14, 17, and 18, alignment mark AM <b> 1 formed on substrate BS is referred to as alignment mark AM <b> 11, and alignment mark AM <b> 1 formed on substrate FS is referred to as alignment mark AM <b> 12. Called.

  The scribe line LN11 extending in the X-axis direction passes through the alignment marks AM11 and AM12 in plan view. Thereby, since the scribe process can be performed on the scribe line LN11 using the alignment marks AM11 and AM12, the position accuracy of the scribe process can be improved.

  Preferably, the substrate assembly SG has an alignment mark AM2. The alignment mark AM2 is provided in the display panel formation region AR1 of the mother substrate BSG or the display panel formation region AR2 of the mother substrate FSG. When the display panel formation area AR1 or AR2 is scribed in the second size described above, the vicinity of the alignment mark AM2 that is farther from the plurality of pixels than the alignment mark AM1 is cut. Further, when the mother substrate BSG and the mother substrate FSG are arranged to face each other, the alignment mark AM2 is aligned with the end BF2 of the main surface BSf of the display panel formation region AR1 or the main portion of the display panel formation region AR2. It is provided so as to overlap with the end portion FB2 of the surface FSb. As shown in FIGS. 13, 14, 17, and 18, alignment mark AM <b> 2 formed on substrate BS is referred to as alignment mark AM <b> 21, and alignment mark AM <b> 2 formed on substrate FS is referred to as alignment mark AM <b> 22. Called.

  The scribe line LN12 extending in the X-axis direction passes through the alignment marks AM21 and AM22 in plan view. Thereby, since the scribe process can be performed on the scribe line LN21 using the alignment marks AM21 and AM22, the position accuracy of the scribe process can be improved.

  Preferably, an alignment mark AM2 having a shape different from that of the alignment mark AM1 is provided. Thereby, misidentification of the alignment mark AM1 and the alignment mark AM2 can be prevented, and the scribe process can be performed by surely selecting a desired scribe line from the scribe line LN11 and the scribe line LN12.

  As shown in FIGS. 13 and 17, the alignment mark AM21 is formed with, for example, a groove part TR11 extending in the X-axis direction and a groove part TR21 extending in the Y-axis direction, and the alignment mark AM11 has a groove part. Are formed, but a top portion TP11 projecting in the X-axis direction and a top portion TP21 projecting in the Y-axis direction are formed. Thereby, the shape of alignment mark AM21 can be made different from the shape of alignment mark AM11.

  Further, in plan view, the scribe line LN12 can be disposed so as to pass through the groove portion TR11, and the scribe line LN11 can be disposed so as to pass through the top portion TP11. By forming the trench part TR11, it is possible to easily improve the positional accuracy when the scribe line LN12 is scribed. Further, by forming the top portion TP11, it is possible to easily improve the positional accuracy when the scribe line LN11 is scribed.

  Similarly, the scribe lines LN21 and LN22 extending in the Y-axis direction can be arranged so that the scribe line LN22 passes through the trench part TR21 and the scribe line LN21 passes through the top part TP21. By forming the trench part TR21, it is possible to easily improve the positional accuracy when the scribe line LN22 is scribed. In addition, by forming the top portion TP21, it is possible to easily improve the positional accuracy when scribing with the scribe line LN21.

  As shown in FIGS. 14 and 18, for example, the alignment mark AM22 includes a groove part TR12 extending in the X-axis direction and a groove part TR22 extending in the Y-axis direction. Are formed, but a top portion TP12 projecting in the X-axis direction and a top portion TP22 projecting in the Y-axis direction are formed. Thereby, the shape of alignment mark AM22 can be made different from the shape of alignment mark AM12.

  Further, in plan view, the scribe line LN12 can be disposed so as to pass through the groove portion TR12, and the scribe line LN11 can be disposed so as to pass through the top portion TP12. By forming the trench part TR12, it is possible to easily improve the positional accuracy when the scribe line LN12 is scribed. In addition, by forming the top portion TP12, it is possible to easily improve the positional accuracy when scribing with the scribe line LN11.

  Similarly, the scribe lines LN21 and LN22 extending in the Y-axis direction can be arranged such that the scribe line LN22 passes through the groove part TR22 and the scribe line LN21 passes through the top part TP22. By forming the trench part TR22, it is possible to easily improve the positional accuracy when scribing with the scribe line LN22. In addition, by forming the top portion TP22, it is possible to easily improve the positional accuracy when scribing with the scribe line LN21.

  The alignment marks AM1 and AM2 only need to be aligned with high shape accuracy. As the alignment marks AM1 and AM2, various shapes other than those illustrated in FIGS. 13, 14, 17, and 18 can be used. Can be used.

<Modification of display device>
FIG. 19 is a plan view in the manufacturing process of the display device of the embodiment and the modification of the embodiment. In FIG. 19, (a) shows an embodiment, and (b) shows a modification of the embodiment. FIGS. 19A and 19B show portions of the alignment mark AM22a and the scribe line LN12a of the mother substrate FSG in the substrate assembly SG shown in FIG. FIGS. 19A and 19B show alignment marks AM3 and AM4.

  As shown in FIG. 19A, in the present embodiment, an alignment mark AM3 is formed on the mother substrate FSG. The alignment mark AM3 is arranged at a distance from the alignment mark AM22a. That is, the alignment mark AM3 is disposed at the same position as the alignment mark AM22a in the X-axis direction.

  The scribe line LN12a extending in the X-axis direction passes through the alignment mark AM22a and the alignment mark AM3 in plan view. As a result, the scribing process can be performed on the scribe line LN12a using the alignment marks AM22a and AM3 that are spaced apart from each other in the X-axis direction, so that scribing is performed as compared with the case where only the alignment mark AM22a is provided. The processing position accuracy can be further improved.

  Preferably, alignment mark AM3 has a shape different from that of alignment mark AM22a. Thereby, when scribing is performed on the scribe line LN12a, it is possible to prevent or suppress the misalignment of the alignment mark AM3 as the alignment mark AM22a. At this time, it can be prevented or suppressed that the alignment mark AM3 is mistakenly recognized as the alignment marks AM12 and AM22.

  The alignment mark AM3 is used as a mark for visually determining a cutting dimension when the mother substrate FSG is cut by a scribe line LN12a extending in the X-axis direction. That is, when the substrate assembly SG is cut by the scribe line LN21 extending in the Y-axis direction in order to divide the substrate aggregate SG by the first size, the main part of the alignment mark AM22a does not remain, so that the alignment is performed instead. Using the mark AM3, the cutting dimension when the mother substrate FSG is cut by the scribe line LN12a extending in the X-axis direction is visually determined.

  The visual determination of the cutting dimension is also possible in a modified example as shown in FIG. As shown in FIG. 19B, in this modification, the size of the alignment mark AM22a is devised instead of the absence of the alignment mark AM3. For example, the alignment mark AM22a is increased in size to increase the length of the groove TR12 extending in the X-axis direction and the length of the groove TR22 extending in the Y-axis direction. In FIG. 19B, compared with FIG. 19A, the length of the trench part TR12 is increased from LX to LXa, and the length of the trench part TR22 is increased from LY to LYa. Thereby, even when the substrate aggregate SG is cut by the scribe line LN21 extending in the Y-axis direction, the main part of the alignment mark AM22a remains. Therefore, the mother substrate FSG is moved in the X-axis direction using the alignment mark AM22a. It is possible to visually determine the cutting dimension when cutting with the scribe line LN12a extending in the direction.

  In the present embodiment and this modification, the alignment mark AM4 shown in FIGS. 19A and 19B is used when the mother substrate BSG and the mother substrate FSG of the substrate assembly SG are overlaid. This mark is used as a mark for adjusting the positional deviation of the superposition.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  For example, in the above-described embodiment, as a disclosure example, at least two types of display devices having different widths of the upper frame region, the left frame region, and the right frame region can be manufactured using one type of photomask. However, as another application example, it can be applied to a case where at least three types of display devices having different widths of the upper frame region, the left frame region, and the right frame region can be manufactured using one type of photomask. is there. Preferably, when two types of display devices having different widths of the upper frame region, the left frame region, the right frame region, and the lower frame region, and more than three types of display devices can be manufactured using one type of photomask. It is also applicable to.

  Moreover, in the said embodiment, although each board | substrate is a tetragon | quadrangle (rectangle), it may be a polygon, a circle, an ellipse, or a shape in which some sides of the polygon draw an arc. For example, according to the present invention, a circular panel and a panel in which a part of the circle is a straight line can be formed with one type of mask.

  Further, in the above-described embodiment, the case of a liquid crystal display device has been exemplified as a disclosure example. However, as other application examples, an electronic paper having an organic EL display device, another self-luminous display device, an electrophoretic element, or the like. Any flat panel type display device such as a type display device may be used. Needless to say, the present invention can be applied without any particular limitation from small to medium size.

  In the scope of the idea of the present invention, those skilled in the art can conceive various changes and modifications, and it is understood that these changes and modifications also belong to the scope of the present invention.

  For example, those in which the person skilled in the art appropriately added, deleted, or changed the design of the above-described embodiments, or those in which processes have been added, omitted, or changed conditions, As long as the gist is provided, it is included in the scope of the present invention.

ADH Seal ADH1 Seal material AF1, AF2 Alignment film AM1, AM11, AM12, AM2, AM21, AM21a, AM22, AM22a, AM3, AM4 Alignment mark AR1, AR2 Display panel formation region BF1, BF2, BF3 End BM Light shielding film BS, FS substrate BSb, FSf Back surface BSf, FSb Main surface BSG, FSG Mother substrate BSs1 to BSs4 Side CC Drive circuit CE Common electrode CF Color filter CFb, CFg, CFr Color filter pixel CG Scan line drive circuit CHP Semiconductor chip Clc Capacitor CM Common electrode Drive circuit CS Video line drive circuit CTL Control circuit DP Display part DPA Display area FB1, FB2, FB3 End part FL Frame part FLA, FLA1, FLA11, FLA12, FLA2, FLA21, FLA22, FLA3, LA31, FLA32, FLA4, FLA41, FLA42 Frame region GL Scan line IF0, IF1, IF2 Insulating film IL1 Interlayer resin film LCD1 Display device LCL Liquid crystal layer LN1, LN11, LN12, LN12a, LN2, LN21, LN22 Scribe line LS Backlight OC1 Resin layer OC2 Insulating layer OP1, OP2 Opening PDA Display area PE Pixel electrode Pix Pixel PL1, PL2 Polarizers PT1, PT11, PT12, PT2, PT21, PT22, PT3, PT31, PT32, PT4, PT5, PT6 Partial RG1-RG4 , RG11, RG13, RL1 Regions S1 to S5 Seal material SD Dummy pattern SG Substrate aggregate SHE Shield electrode SL Signal lines SP1, SP2, SP21 to SP26 Spacer SPix Subpixels SSB1 to SSB4 , SSF1 to SSF4 Side surface TP11, TP12, TP21, TP22 Top part TR11, TR12, TR21, TR22 Groove part Trd Transistor WD1, WD11, WD2, WD21 Width WG, WS wiring

Claims (15)

A first substrate;
A second substrate disposed opposite to the first substrate;
A display area having a substantially rectangular shape in plan view;
A seal provided between the first substrate and the second substrate, for bonding the first substrate and the second substrate;
A display device comprising:
When the direction in which one side of the display area extends is the X direction, and the direction in which one side of the display area and the extending direction intersect is the Y direction,
The first substrate is
Multiple signal lines,
A first frame region adjacent to the display region and extending in the X direction; a second frame region facing the first frame region through the display region and extending in the X direction; A third frame region and a fourth frame region that intersect the frame region and the second frame region, and face each other through the display region and extend in the Y direction,
A plurality of terminal portions formed at an end portion of the signal line and formed in the first frame region;
A first seal formed on the outer periphery of the display region and in the first to fourth frame regions;
A third seal formed adjacent to a side of the third frame region that does not face the display region of the first seal;
Including
In the second substrate, a first spacer extending in the Y direction is formed in the third frame region, and the first spacer is a region where the first seal and the third seal are formed. A display device formed over the substrate. The display device according to claim 1,
The first substrate has a fourth seal formed adjacent to a side of the fourth frame region that does not face the display region of the first seal;
The second substrate is formed with a second spacer extending in the Y direction in the fourth frame region, and the second spacer is a region where the first seal and the fourth seal are formed. A display device formed over the substrate. The display device according to claim 2,
The first substrate has a second seal formed adjacent to a side of the second frame area that does not face the display area of the first seal;
In the second substrate, a third spacer extending in the X direction is formed in the second frame region, and the third spacer is a region where the first seal and the second seal are formed. A display device formed over the substrate. The display device according to claim 3,
The display device, wherein a width of the first and second spacers is larger than a width of the third spacer. The display device according to claim 3,
A first alignment mark is provided in each of a region where the second frame region and the third frame region intersect, and a region where the second frame region and the fourth frame region intersect,
The first alignment mark has a portion extending in the X direction so as to overlap with the second spacer, and a portion extending in the Y direction so as to overlap with the third spacer or the fourth spacer. Display device. The display device according to claim 5,
A second alignment mark is provided in each of the region where the second frame region and the third frame region intersect, and the region where the second frame region and the fourth frame region intersect,
The second alignment mark is formed at a position overlapping with the third spacer or the fourth spacer, and is displaced from both the X direction and the Y direction with respect to the first alignment mark. Display device. The display device according to claim 3,
A first alignment mark is provided in each of a region where the first frame region and the third frame region intersect, and a region where the first frame region and the fourth frame region intersect,
The first alignment mark has a portion extending in the Y direction so as to overlap the third spacer or the fourth spacer,
The display device, wherein the first alignment mark is formed on the first substrate and at a position where the second substrate does not overlap. The display device according to claim 7,
A second alignment mark is provided in each of the region where the first frame region and the third frame region intersect, and the region where the first frame region and the fourth frame region intersect,
The second alignment mark is formed at a position overlapping the third spacer or the fourth spacer, and is arranged so as to be shifted in both the X direction and the Y direction with respect to the first alignment mark. apparatus. The display device according to claim 6 or 8,
The display device, wherein the second alignment mark has a shape different from the shape of the first alignment mark in plan view. A first substrate on which display areas corresponding to a plurality of display devices are formed;
A second substrate disposed opposite to the first substrate;
A liquid crystal layer sandwiched between the first substrate and the second substrate;
A mother board having
On the mother board,
A plurality of rectangular first seal portions surrounding each of the display areas;
A rectangular second seal portion formed between the first seal portions and disposed so as to be in contact with the first seal portion;
Formed,
A mother substrate in which a first spacer is formed at a position overlapping with both the first seal portion and the second seal portion of the second substrate. The mother board according to claim 10,
The first seal portion and the second seal portion are in contact with each other in the long side direction,
The mother substrate, wherein a width of the second seal portion in a short side direction is narrower than a width of the first seal portion in a short side direction. The mother board according to claim 10,
The first substrate is a mother substrate having a plurality of grooves at positions facing the first spacer. The mother board according to claim 10,
A linear third seal portion is formed so as to contact both the first side in the short side direction of the first seal portion and the first side in the short side direction of the second seal portion,
A linear fourth seal portion is formed so as to contact both the second side in the short side direction of the first seal portion and the second side in the short side direction of the second seal portion;
A terminal portion forming region corresponding to each display region is provided in a region opposite to the side in contact with the first seal portion of the second seal portion,
A mother substrate in which a second spacer is formed at a position overlapping both the first seal portion and the third seal portion. The mother board according to claim 13,
The first substrate is a mother substrate having a plurality of grooves at positions facing the first spacer. The mother board according to claim 10,
A mother substrate in which a region surrounded by the first seal portion is filled with the liquid crystal layer, and a region surrounded by the second seal portion does not exist in the liquid crystal layer.

Images