JP2018146856A - Lithographic apparatus and article manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lithographic apparatus which is advantageous for keeping deviation in the rotating direction of an array of shot regions on a substrate within an allowable range.SOLUTION: Provided is a lithographic apparatus for forming a pattern on a substrate, which includes: a pre-alignment stage; a substrate stage; a measurement part which measures an array of shot regions on the substrate while the substrate is being held on the substrate stage; and a control part which determines on which stage out of the pre-alignment stage and the substrate stage processing is to be executed for rotating the substrate to keep deviation in the rotating direction of the array while the substrate is being held on the substrate stage based on the measurement result acquired by the measurement part. The substrate stage performs rotating actions within a rotational stroke at least twice for rotating the substrate with a rotation amount exceeding the rotational stroke.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a lithographic apparatus and a method for manufacturing an article.

  In a semiconductor manufacturing process, a lithography process for forming a pattern on a substrate using a lithography apparatus such as an exposure apparatus is performed. Lithography processing is required to improve accuracy and reduce processing time, and the time required for alignment measurement and correction is being reduced.

  In recent years, as semiconductor chips become more complex and multifunctional, there are an increasing number of substrates in which the die (Die) arrangement on the substrate is greatly deviated from the ideal state. For example, a semiconductor device may be manufactured by rearranging individually cut chips on a substrate and performing a lithography process. Such a substrate is called a reconstructed substrate. The reconfigurable substrate is configured by rearranging a chip obtained by cutting a die on the substrate with a scribe line to another substrate using a bonding machine. A resin material is used for fixing (fixing) the chips, and the resin material also fills the gaps between the chips. Therefore, in the reconfigured substrate, the variation in chip arrangement increases due to the effect of chip rearrangement and the expansion and contraction of the resin material, so that the die arrangement on the board tends to be greatly deviated from the external reference such as a notch.

  A technique related to substrate alignment (positioning in the rotation (θ) direction of the substrate) has been proposed (see Patent Document 1). In the alignment of the substrate, first, in the pre-alignment stage, the substrate position is adjusted by rotating the substrate based on the substrate outer shape reference. Next, on the substrate stage, the die arrangement is measured, and the substrate is rotated based on the measurement result to adjust the position of the substrate more precisely. After that, fine alignment such as global alignment is performed.

  In such substrate alignment, after adjusting the position of the substrate on the pre-alignment stage, the amount of substrate rotation required for adjustment on the substrate stage exceeds the rotation stroke of one rotation operation of the substrate stage. There is. In such a case, the substrate stage requires an operation of delivering the substrate between a holding pin that holds the substrate and a chuck that sucks the substrate. During this operation, the substrate stage is returned to the vicinity of the origin of the rotation stroke, and then the substrate is rotated again on the substrate stage to adjust the position of the substrate. Such an operation is repeated until the deviation in the rotational direction of the die arrangement in a state where the substrate is held on the substrate stage falls within an allowable range.

JP 2006-73916 A

  In general, the substrate stage does not have a large rotation stroke due to positioning accuracy and the like. In consideration of the manufacturing cost, the rotation stroke of the substrate stage may be about 1/10 of the variation in the deviation of the die arrangement for each substrate with respect to the substrate external reference. In recent years, the number of substrates with large deviations in die arrangement, represented by reconstructed substrates, has increased, and the variation in deviation in die arrangement for each substrate can be about ± 10000 ppm. For this reason, the time required for the alignment of the substrate becomes long, resulting in a decrease in productivity.

  An object of the present invention is to provide a lithographic apparatus which is made in view of such a problem of the prior art and is advantageous for keeping the deviation in the rotation direction of the arrangement of shot regions on a substrate within an allowable range.

  In order to achieve the above object, a lithographic apparatus according to one aspect of the present invention is a lithographic apparatus that forms a pattern on a substrate, wherein the first stage holding the substrate rotatably and the first stage adjust the lithographic apparatus. A second stage for rotatably holding the substrate transported from the first stage in a state where the position of the substrate is maintained, and a shot on the substrate in a state where the substrate is held on the second stage Based on the measurement result of the array of regions and the measurement result of the measurement unit, the substrate is placed in an allowable range in order to keep the shift in the rotation direction of the array in a state where the substrate is held on the second stage. A control unit that determines which of the first stage and the second stage performs the rotation process, and the second stage includes: As serial processing, and performs the rotation operation of the rotation in a stroke at least twice to rotate the substrate at a rotational amount exceeding the rotation stroke of the second stage.

  Further objects and other aspects of the present invention will become apparent from the preferred embodiments described below with reference to the accompanying drawings.

  According to the present invention, for example, it is possible to provide a lithographic apparatus that is advantageous for keeping a deviation in the rotation direction of an array of shot areas on a substrate within an allowable range.

It is the schematic which shows the structure of the exposure apparatus as 1 side surface of this invention. It is the schematic which shows the structure of the exposure apparatus as 1 side surface of this invention. It is a figure for demonstrating correction | amendment of the position shift of the shot area | region on the board | substrate in a substrate stage. It is a flowchart for demonstrating the process which exposes the board | substrate in the exposure apparatus shown in FIG. It is a flowchart for demonstrating the process which exposes the board | substrate in the exposure apparatus shown in FIG. It is a figure which shows the relationship between the external shape reference | standard of a board | substrate, and the arrangement | sequence of a shot area.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached | subjected about the same member and the overlapping description is abbreviate | omitted.

  FIG. 1 is a schematic diagram showing a configuration of an exposure apparatus 100 according to one aspect of the present invention. The exposure apparatus 100 is a lithographic apparatus used for manufacturing semiconductor devices and the like. The exposure apparatus 100 projects a pattern of a mask (original plate) onto a substrate coated with a resist to form a pattern on the substrate.

  The exposure apparatus 100 is connected to a coating and developing apparatus (coater / developer) 1 having a function of coating a resist on a substrate and a function of developing an exposed substrate. The connection between the exposure apparatus 100 and the coating and developing apparatus 1 is usually called inline connection. The coating and developing apparatus 1 includes a first transport mechanism 2 that transports a substrate between the exposure apparatus 100 and the coating and developing apparatus 1. The first transport mechanism 2 includes a hand and a robot that hold a substrate.

  In transporting the substrate from the coating and developing apparatus 1 to the exposure apparatus 100, the substrate is transported to the inside of the exposure apparatus 100, specifically to the temperature adjustment unit 3, via the first transport mechanism 2. The temperature adjustment unit 3 has a function of adjusting the temperature of the substrate, and includes a drive mechanism that drives in the vertical direction while holding the substrate. The temperature adjustment unit 3 lowers the substrate via the drive mechanism and holds the substrate for a certain period of time until the temperature of the substrate is adjusted to a predetermined temperature. When the temperature of the substrate is adjusted to a predetermined temperature, the temperature adjustment unit 3 raises the substrate via the drive mechanism and places the substrate on the supply and recovery position 4.

  The substrate placed at the supply / recovery position 4 is transported to the pre-alignment stage 6 via the second transport mechanism 5. The second transport mechanism 5 includes a hand or a robot that holds the substrate. The pre-alignment stage 6 is a stage that rotatably holds the substrate, and includes a rotation mechanism that rotates the substrate. The pre-alignment stage 6 also includes a detection mechanism that detects an outer shape of the substrate, specifically, an outer shape reference such as a notch or an orientation flat provided on the substrate. In the pre-alignment stage 6, pre-alignment (preparation processing) is performed in which the substrate is rotated to adjust the position of the substrate (alignment in the rotation (θ) direction of the substrate) based on the outer shape reference detected by the detection mechanism. .

  The substrate that has been pre-aligned by the pre-alignment stage 6 is transported to the substrate stage 8 via the third transport mechanism 7. The third transport mechanism 7 includes a hand that holds the substrate, a robot, and the like. The substrate stage 8 is a stage that rotatably holds the substrate transported from the pre-alignment stage 6 while maintaining the position of the substrate adjusted by the pre-alignment stage 6.

  The substrate held on the substrate stage 8 is transported directly below the alignment scope 9. The alignment scope 9 detects an alignment mark provided on a die on the substrate and obtains the position (positional deviation) of the shot region on the substrate. In the present embodiment, the alignment scope 9 functions as a measurement unit that measures the arrangement of shot areas on the substrate while the substrate is held on the substrate stage 8.

  The control unit 10 includes a CPU, a memory, and the like, and controls the entire exposure apparatus 100 (each unit). For example, the control unit 10 moves the substrate stage 8 through the stage driver 21 based on the positions (X position, Y position, Z position, θ position) obtained by the alignment scope 9 as shown in FIG. To drive. Thereby, the positional deviation of the shot area on the substrate held by the substrate stage 8 is corrected. The substrate whose positional deviation has been corrected in the substrate stage 8 is conveyed by the substrate stage 8 under the projection optical system 22 that projects the mask pattern onto the substrate, and is exposed through the projection optical system 22.

  The exposed substrate is conveyed by the substrate stage 8 from below the projection optical system 22 to the supply / recovery position 4. The substrate transported to the supply and recovery position 4 is transported to the coating and developing apparatus 1 via the first transport mechanism 2 and developed.

  With reference to FIGS. 3A to 3D, correction of positional deviation of the shot area on the substrate in the substrate stage 8 will be described. Here, in particular, a process of rotating the substrate in order to keep the deviation in the rotation direction of the array of shot areas in a state where the substrate is held on the substrate stage 8 within an allowable range will be described.

  The substrate stage 8 holds the substrate via a substrate chuck 31 as shown in FIG. When the substrate is transferred from the third transport mechanism 7 to the substrate stage 8, the substrate chuck 31 is lowered with respect to the stage base 33 and the holding pins 34 are raised from the stage base 33. In this state, the substrate held by the third transport mechanism 7 is placed on the holding pins 34 as shown in FIG. When the third transport mechanism 7 is retracted, the substrate chuck 31 is raised to hold (suck) the substrate placed on the holding pins 34 with the substrate chuck 31, and the holding pins 34 are lowered relative to the stage base 33. Let The substrate chuck 31 has a structure that can be rotated by a rotation mechanism 35 provided on the substrate stage 8 in a state where the substrate is held. Further, as shown in FIG. 3C, the substrate chuck 31 has a structure that can be rotated by the rotation mechanism 35 even when the holding pins 34 hold the substrate. The rotation stroke of the substrate chuck 31 by the rotation mechanism 35 (that is, the rotation stroke of one rotation operation of the substrate stage 8) cannot be increased from the viewpoint of positioning accuracy. Further, it is important that the rotation stroke of the substrate chuck 31 by the rotation mechanism 35 is an appropriate rotation stroke from the viewpoint of manufacturing cost. In general, it is advantageous in terms of manufacturing cost that the rotation stroke is smaller with respect to the variation in deviation of shot arrangement for each substrate.

  In the pre-alignment stage 6, as described above, pre-alignment is performed in which the substrate is rotated with reference to the outer shape to adjust the position of the substrate. However, in recent years, as shown in FIG. 6, there are an increasing number of substrates in which the arrangement of shot regions (die arrangement) is greatly deviated with respect to the outer shape reference such as a reconstructed substrate. In such a substrate, the alignment residual on the pre-alignment stage 6 (that is, the shift in the rotation direction of the array of shot areas on the substrate stage 8) may exceed the rotation stroke of the substrate stage 8. In such a case, the substrate stage 8 requires an operation of delivering the substrate between the holding pins 34 and the substrate chuck 31.

  For example, the amount of rotation of the substrate necessary for keeping the deviation in the rotation direction of the shot region arrangement in the state where the substrate is held on the substrate stage 8 obtained from the measurement result of the alignment scope 9 within the allowable range is the substrate stage 8. Consider the case of exceeding the rotation stroke. In this case, generally, first, the substrate chuck 31 holding the substrate is rotated in the first direction (for example, clockwise) by the rotation mechanism 35 with the maximum rotation amount (that is, the rotation stroke of the substrate stage 8). Let Next, the substrate held by the substrate chuck 31 is transferred to the holding pins 34 so that the substrate chuck 31 does not hold the substrate. In this state, the substrate chuck 31 is rotated by the rotation mechanism 35 in the second direction (counterclockwise) opposite to the first direction with the maximum rotation amount (that is, the substrate chuck 31 is returned to the original position (origin). Back to). Then, the substrate held by the holding pins 34 is transferred to the substrate chuck 31. At this time, the rotation amount of the substrate necessary for keeping the deviation in the rotation direction of the arrangement of the shot areas within an allowable range is reduced by the rotation operation on the substrate stage 8 described above. Further, since the substrate chuck 31 is returned to the origin, it can be rotated with the maximum amount of rotation. Then, the substrate chuck 31 holding the substrate is rotated again in the first direction by the rotation mechanism 35. Such an operation is repeated until the shift in the rotation direction of the arrangement of the shot areas in a state where the substrate is held on the substrate stage 8 falls within an allowable range. As described above, in the process of rotating the substrate in order to keep the deviation in the rotation direction of the array of shot areas on the substrate within an allowable range, an operation of delivering the substrate between the holding pins 34 and the substrate chuck 31 is required. , It takes a long time and productivity is lowered.

  Therefore, in the present embodiment, the process of rotating the substrate in order to keep the deviation in the rotation direction of the shot region arrangement in a state where the substrate is held on the substrate stage 8 within an allowable range is performed by the pre-alignment stage 6 and the substrate stage 8. Decide which stage to use. In addition, the substrate stage 8 performs the rotation operation within the rotation stroke at least twice in order to rotate the substrate by the rotation amount exceeding the rotation stroke of the substrate stage 8 as the processing described above.

  Specifically, from the measurement result of the alignment scope 9, the rotation amount of the substrate necessary for the process of rotating the substrate in order to keep the deviation in the rotation direction of the array of shot areas within an allowable range is obtained, and this process is performed on the substrate stage. 8 is calculated. In addition, a time B required when the pre-alignment stage 6 performs the process of rotating the substrate in order to keep the deviation in the rotation direction of the shot area arrangement within an allowable range is calculated. Here, the time B is the sum of the substrate transport time by the third transport mechanism 7 and the time required to rotate the pre-alignment stage 6. The substrate transport time by the third transport mechanism 7 is the time required to transport the substrate from the substrate stage 8 to the pre-alignment stage 6 and the substrate rotated by the pre-alignment stage 6 from the pre-alignment stage 6 to the substrate stage 8. Time required for transport.

  Next, time A and time B are compared. When the time B is shorter than the time A, the substrate is transferred from the substrate stage 8 to the pre-alignment stage 6, rotated by the pre-alignment stage 6, and then transferred again from the pre-alignment stage 6 to the substrate stage 8. To do. The pre-alignment stage 6 has a rotation stroke larger than the rotation stroke of the substrate stage 8. In the present embodiment, since the pre-alignment stage 6 has a rotation stroke of 360 degrees, a deviation in the rotation direction of the array of shot areas in a state where the substrate is held on the substrate stage 8 by one rotation operation. Can be within an allowable range. On the other hand, when the time B is longer than the time A, the substrate is rotated on the substrate stage 8 until the deviation in the rotation direction of the shot region arrangement falls within an allowable range.

  Thus, in the present embodiment, the time required for such processing of the pre-alignment stage 6 and the substrate stage 8 is short in the processing of rotating the substrate in order to keep the shift in the rotation direction of the shot region arrangement within an allowable range. On stage. Thereby, it is possible to minimize the time required for the process of rotating the substrate in order to keep the deviation in the rotation direction of the shot area arrangement within an allowable range, and it is possible to prevent the productivity from being lowered.

  With reference to FIG. 4, the process which exposes the board | substrate in the exposure apparatus 100 is demonstrated. Such processing is performed by the control unit 10 controlling the respective units of the exposure apparatus 100 in an integrated manner.

  In S41, the substrate is loaded. Specifically, the substrate is transferred from the coating and developing apparatus 1 to the exposure apparatus 100. The substrate transported to the exposure apparatus 100 is transported from the supply / recovery position 4 to the pre-alignment stage 6 via the temperature adjustment unit 3.

  In S42, pre-alignment is performed in the pre-alignment stage 6. In the pre-alignment, as described above, the outline reference of the substrate is detected, and the position of the substrate is adjusted by rotating the substrate based on the outline reference.

  In S43, the third transport mechanism 7 transports the substrate from the pre-alignment stage 6 to the substrate stage 8. At this time, the time when the substrate is transferred from the pre-alignment stage 6 is stored as the transfer start time P1. The substrate transported to the substrate stage 8 is attracted to the substrate chuck 31. The time when the substrate chuck 31 sucks the substrate is stored as the transfer end time P2. The difference between the transfer end time P2 and the transfer start time P1 is a time required to transfer the substrate from the pre-alignment stage 6 to the substrate stage 8.

  In S44, the rotation amount of the substrate necessary for the processing of rotating the substrate in order to keep the deviation in the rotation direction of the shot area arrangement in the state where the substrate is held on the substrate stage 8 within an allowable range is obtained. Specifically, the alignment of the shot areas is measured by the alignment scope 9, and the rotation amount of the substrate is calculated based on the measurement result.

  In S45, it is determined whether or not the rotation amount of the substrate obtained in S44 exceeds the rotation stroke of the substrate stage 8 (the rotation stroke of the substrate stage 8> the rotation amount of the substrate). If the rotation amount of the substrate obtained in S44 does not exceed the rotation stroke of the substrate stage 8, the process proceeds to S46. On the other hand, if the rotation amount of the substrate obtained in S44 exceeds the rotation stroke of the substrate stage 8, the process proceeds to S50.

  In S46, the substrate is rotated at the substrate stage 8 by the rotation amount obtained in S44. Since the process of rotating the substrate by the substrate stage 8 is as described above, a detailed description thereof is omitted here. In S47, fine alignment is performed. Fine alignment is the final alignment of the substrate before exposure. In S48, the substrate is exposed. In S49, the substrate is unloaded. Specifically, the exposed substrate is transported from the substrate stage 8 to the coating and developing apparatus 1 via the supply / recovery position 4.

  In S50, the time A required for performing the processing for rotating the substrate by the rotation amount obtained in S44 on the substrate stage 8 is the time required for performing the processing for rotating the substrate by the rotation amount obtained in S44 on the pre-alignment stage 6. It is determined whether it is longer than B (time A> time B). When the time A is not longer than the time B, the process proceeds to S51. On the other hand, when the time A is longer than the time B, the process proceeds to S52.

  In S51, the substrate is rotated in the substrate stage 8 until the rotation amount obtained in S44 is reached. During this time, in the substrate stage 8, the operation of rotating the substrate and the operation of delivering the substrate between the holding pins 34 and the substrate chuck 31 are repeated.

  In S <b> 52, the substrate is transferred from the substrate stage 8 to the pre-alignment stage 6 by the third transfer mechanism 7. In other words, the substrate transported from the prealignment stage 6 to the substrate stage 8 is returned to the prealignment stage 6 in order to rotate the substrate in the prealignment stage 6.

  In S53, in the pre-alignment stage 6, the substrate stage 8 rotates the substrate by the rotation amount obtained in S44. As described above, in this embodiment, since the pre-alignment stage 6 has a rotation stroke of 360 degrees, the substrate can be rotated by the rotation amount obtained in S44 by one rotation operation.

  Here, when the time required for performing the process of rotating the substrate on the substrate stage 8 is longer than the time required for performing the process of rotating the substrate on the pre-alignment stage 6, the process is performed on the pre-alignment stage 6. It has been decided. However, which stage of the pre-alignment stage 6 and the substrate stage 8 is used to perform this processing based on the number of rotations required for the substrate stage 8 to rotate the substrate by the rotation amount obtained in S44. You may decide. In this case, if the number of rotation operations required in the substrate stage 8 is equal to or less than a predetermined number of times, it is determined that the process of rotating the substrate is performed in the substrate stage 8, and if the number of rotation operations is larger than the predetermined number, It is determined that the process of rotating the substrate is performed by the pre-alignment stage 6. Further, based on the rotation amount obtained in S <b> 44, it may be determined which of the pre-alignment stage 6 and the substrate stage 8 performs the process of rotating the substrate. In this case, if the rotation amount obtained in S44 is less than or equal to a predetermined rotation amount, it is determined that the process of rotating the substrate is performed on the substrate stage 8. If the rotation amount is larger than the predetermined rotation amount, the substrate is rotated. It is determined that the process to be performed is performed in the pre-alignment stage 6. As shown in FIG. 2, the threshold number of times and the rotation amount may be set via an input unit 23 including a keyboard and a mouse, or may be taken in from an external device such as a host computer.

  Further, the rotation amount obtained in S44 may be stored in the storage unit 24. As described above, pre-alignment is performed on the pre-alignment stage 6 before the substrate held on the pre-alignment stage 6 is transferred to the substrate stage 8. Therefore, when it is determined that the process of rotating the substrate by the rotation amount obtained in S44 is performed on the substrate stage 8, the rotation amount stored in the storage unit 24 in addition to the pre-alignment for the subsequent substrate. The pre-alignment stage 6 performs the process of rotating at. The subsequent substrate is a substrate on which a pattern is formed following the substrate on which the process of rotating the substrate by the rotation amount obtained in S44 is performed on the substrate stage 8. As a result, for the subsequent substrate, the amount of rotation required for the substrate stage 8 is reduced, which contributes to an improvement in productivity. The storage unit 24 may store the rotation amount for the same lot processed in the past, and the average value may be used as the rotation amount to be rotated by the pre-alignment stage 6. Alternatively, the tendency of the rotation amount in the lot stored in the storage unit 24 may be learned, and the value may be used as the rotation amount rotated by the pre-alignment stage 6.

  In the processing shown in FIG. 4, the case where the substrate can be returned from the substrate stage 8 to the pre-alignment stage 6 without considering the throughput, that is, the case where the subsequent substrate is made to stand by has been described as an example. However, in actuality, when the throughput is taken into consideration, there are cases where the substrate cannot be returned from the substrate stage 8 to the pre-alignment stage 6 because the subsequent substrate is held on the pre-alignment stage 6. In such a case, the process shown in FIG. 5 may be performed.

  Since each of S501 to S511 shown in FIG. 5 is the same process as S41 to S51 shown in FIG. 4, detailed description thereof is omitted here. When the time A is longer than the time B (Yes in S510), the substrate is returned from the substrate stage 8 to the pre-alignment stage 6 as described above. However, if the subsequent substrate is held on the pre-alignment stage 6, the substrate cannot be returned from the substrate stage 8 to the pre-alignment stage 6. In such a case, it is possible to retract all subsequent substrates, but the productivity is significantly reduced. Therefore, in this embodiment, the subsequent substrate is made to stand by at the temperature adjustment unit 3 so that the substrate is not held on the pre-alignment stage 6 and the substrate can be returned from the substrate stage 8 to the pre-alignment stage 6. To do.

  In S512, the conveyance of the subsequent substrate is stopped. Specifically, the temperature adjusting unit 3 waits for the subsequent substrate transported to the exposure apparatus 100.

  In S513, it is determined whether the subsequent substrate is waiting in the exposure apparatus. If the subsequent substrate is not waiting in the exposure apparatus, the process proceeds to S514. On the other hand, when the subsequent substrate is waiting in the exposure apparatus, the process proceeds to S516.

  In S514, similarly to S52, the third transport mechanism 7 transports the substrate from the substrate stage 8 to the pre-alignment stage 6. In S515, similarly to S53, in the pre-alignment stage 6, the substrate stage 8 rotates the substrate by the rotation amount obtained in S504.

  In S516, the substrate held on the substrate stage 8 is held by the second transport mechanism 5.

  In S517, it is determined whether or not the third transport mechanism 7 holds the substrate. When the third transport mechanism 7 holds the substrate, the process proceeds to S518. On the other hand, if the third transport mechanism 7 does not hold the substrate, the process proceeds to S519.

  In S518, the substrate held by the third transport mechanism 7 is transported to the substrate stage 8. The substrate stage 8 holds the substrate transported by the third transport mechanism 7.

  In S519, it is determined whether or not the pre-alignment stage 6 holds the substrate. When the pre-alignment stage 6 holds the substrate, the process proceeds to S520. On the other hand, when the pre-alignment stage 6 does not hold the substrate, the process proceeds to S521.

  In S520, the substrate held on the pre-alignment stage 6 is held by the third transport mechanism 7.

  In step S <b> 521, the substrate held by the second transport mechanism 5 is transported to the pre-alignment stage 6. As a result, the substrate held on the substrate stage 8 is transferred from the substrate stage 8 to the pre-alignment stage 6.

  In S522, the substrate is rotated by the rotation amount obtained in S504 in the substrate stage 8 in the pre-alignment stage 6 as in S53.

  The article manufacturing method in the embodiment of the present invention is suitable for manufacturing articles such as devices (semiconductor elements, magnetic storage media, liquid crystal display elements, etc.), for example. Such a manufacturing method includes a step of exposing a substrate coated with a photosensitive agent using the exposure apparatus 100 (forming a pattern on the substrate) and a step of developing the exposed substrate (processing the substrate). Such a manufacturing method may include other well-known steps (oxidation, film formation, vapor deposition, doping, planarization, etching, resist stripping, dicing, bonding, packaging, and the like). The method for manufacturing an article in the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

  As mentioned above, although preferable embodiment of this invention was described, it cannot be overemphasized that this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary. For example, the present invention is not limited to an exposure apparatus as a lithography apparatus, but can be applied to a lithography apparatus such as an imprint apparatus or a drawing apparatus. Here, the imprint apparatus forms a cured product pattern in which the pattern of the mold is transferred by bringing the imprint material supplied on the substrate into contact with the mold and applying energy for curing to the imprint material. To do. In addition, the drawing apparatus forms a pattern (latent image pattern) on the substrate by drawing on the substrate with a charged particle beam (electron beam). The above-described method for manufacturing an article may be performed using these lithography apparatuses.

100: Exposure apparatus 6: Pre-alignment stage 7: Third transport mechanism 8: Substrate stage 9: Alignment scope 10: Control unit

Claims (9)

A lithographic apparatus for forming a pattern on a substrate,
A first stage for rotatably holding the substrate;
A second stage for rotatably holding the substrate conveyed from the first stage in a state where the position of the substrate adjusted by the first stage is maintained;
A measurement unit that measures an array of shot areas on the substrate in a state where the substrate is held on the second stage;
Based on the measurement result of the measurement unit, a process of rotating the substrate in order to keep the shift in the rotation direction of the array in an allowable range in a state where the substrate is held on the second stage, the first stage and A control unit for determining which stage of the second stage to perform,
The lithographic apparatus, wherein the second stage performs, as the processing, at least two rotations within the rotation stroke in order to rotate the substrate by a rotation amount exceeding a rotation stroke of the second stage.   The control unit determines whether the process is performed in the first stage or the second stage based on a rotation amount of the substrate required for the process obtained from the measurement result. A lithographic apparatus according to claim 1, wherein:   The control unit determines that the processing is performed in the first stage when the time required for performing the processing in the second stage is longer than the time required for performing the processing in the first stage. The lithographic apparatus according to claim 1, wherein the apparatus is a lithographic apparatus. A transport mechanism for transporting the substrate between the first stage and the second stage;
The controller is configured to cause the transport mechanism to rotate the substrate transported from the second stage by the first stage and a time required for transporting the substrate from the second stage to the first stage. When the processing is performed on the first stage, the sum of the time required and the time required to transport the substrate rotated on the first stage from the first stage to the second stage by the transport mechanism The lithographic apparatus according to claim 3, wherein a time required for the lithographic process is set. The controller is
Obtaining the number of rotation operations required in the second stage to rotate the substrate by the rotation amount of the substrate required in the processing obtained from the measurement result;
If the number of times is less than or equal to a predetermined number of times, it is determined that the processing is performed in the second stage,
3. The lithographic apparatus according to claim 2, wherein when the number of times is larger than the predetermined number of times, the processing is determined to be performed at the first stage. The controller is
When the rotation amount of the substrate required for the processing obtained from the measurement result is equal to or less than a predetermined rotation amount, it is determined that the processing is performed on the second stage,
The lithographic apparatus according to claim 2, wherein when the rotation amount is larger than the predetermined rotation amount, it is determined that the processing is performed in the first stage. A storage unit that stores the amount of rotation of the substrate that is necessary for the processing obtained from the measurement result;
The controller is
Before the substrate held on the first stage is transported to the second stage, a preparation process is performed on the first stage to rotate the substrate based on an external reference provided on the substrate,
When it is determined that the process is performed in the first stage, in addition to the preparation process, a subsequent substrate on which the pattern is formed following the substrate in which the process is performed in the first stage, The lithographic apparatus according to claim 2, wherein a process of rotating the subsequent substrate by a rotation amount stored in the storage unit is performed in the first stage.   The lithographic apparatus according to claim 1, further comprising a projection optical system that projects a mask pattern onto the substrate held by the second stage. Forming a pattern on a substrate using the lithographic apparatus according to claim 1;
Processing the substrate on which the pattern has been formed in the step;
Producing an article from the treated substrate;
A method for producing an article comprising:

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