JP2018142669A - Coil component and method of manufacturing coil component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a coil component capable of suppressing manufacturing cost low without causing a problem such as contact failure of an electronic component and a method of manufacturing the same.SOLUTION: A coil component includes: an electronic component body 2 having a coil part 21 of a helical structure formed by a raw material having conductivity; a housing case 3 made of a non-conductive raw material, in which the electronic component body 2 is housed; and a pair of electrodes 4, 4 connected to both ends of the electronic component body 2. Each of the electrodes 4, 4 is arranged and installed at both ends of the housing case 3.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a coil component to be assembled to an assembly target such as a substrate and a method for manufacturing the same.

  In recent years, electronic parts used in in-vehicle communication devices and the like have been improved in size and further miniaturized. As a method of manufacturing such an extremely small electronic component, a plurality of ceramic plates (glass layers) formed with a ring-shaped copper wiring pattern are laminated, and external parts formed on both ends of a laminate made of the ceramic plates. A manufacturing method is known in which the conductor portions of each ceramic plate are connected by electrodes (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 2015-23714

  However, in the above-described manufacturing method, it is necessary to position a plurality of ceramic plates with extremely high accuracy, and if this positioning is shifted, it is inevitable that a conduction failure occurs in which each ring-shaped pattern does not conduct. In addition, the chip coil produced by such a manufacturing method needs to be laminated with ceramic plates as many as the number of turns of the coil, and as many connections as the number of through holes and ring patterns are formed. There are disadvantages such as poor contact between the pattern patterns and an increase in manufacturing cost.

  An object of the present invention is to provide a coil component and a method for manufacturing the same that can suppress the occurrence of contact failure in an electronic component and can suppress the manufacturing cost thereof at a low cost.

  The coil component according to the present invention includes an electronic component main body having a spiral coil portion formed of a conductive material, a housing case made of a non-conductive material for housing the electronic component main body, and the electronic component main body. And a pair of electrodes connected to both ends of the housing case, the pair of electrodes being respectively disposed at both ends of the housing case.

  According to this configuration, the electronic component main body having the coil portion of the spiral structure is accommodated in the accommodating case, so that the end portions of the electronic component main body are brought into contact with the electrodes disposed at both ends of the accommodating case. While being able to connect, the electronic component main body can be protected by the housing case. For this reason, even in a very small coil component in which the overall length and diameter of the electronic component main body are set to be extremely small, damage to the electronic component main body can be effectively prevented, and problems such as poor contact can be suppressed while the coil is suppressed. There exists an advantage that the manufacturing cost of components can be held down cheaply.

  Moreover, it is good also as a structure provided with the end plate by which the both ends of the said storage case are each opened, and each said electrode is arrange | positioned so that the opening of the said storage case may be covered.

  According to this configuration, the electronic component main body is accommodated in the housing case, and both the end portions of the electronic component main body are brought into contact with the end plates of the electrodes, respectively, so that the electrical connection can be easily and appropriately performed. .

  Furthermore, it is desirable that the installation interval of the pair of electrodes is set shorter than the entire length of the electronic component main body.

  According to this configuration, only by performing an extremely simple operation of compressing and deforming the electronic component main body and storing it in the storage case, according to the restoring force of the electronic component main body, by pressing the both ends thereof to the electrode, There is an advantage that a stable electrical connection state can be obtained.

  Moreover, it is preferable that each electrode has a through hole for allowing a magnetic flux generated when the electronic component body is energized to pass therethrough.

  According to this configuration, when the electronic component main body is used as an inductance element or the like, it is possible to prevent the magnetic flux generated when the electronic component main body is energized from being obstructed by the electrode. The performance of the main body can be exhibited well.

  The method of manufacturing a coil component according to the present invention includes a molding step of the electronic component body that molds the electronic component body having a spiral coil portion formed of a conductive material, and a non-containment method for housing the electronic component body. A forming step of the receiving case for forming a receiving case made of a conductive material, an electrode disposing step of disposing electrodes at both ends of the electronic component body, and both ends of the electronic component body as the electrodes The electronic component main body and the electrode are connected to each other in contact with each other.

  According to this configuration, after the electrodes are attached to both ends of the housing case in the electrode arranging step, the electronic component main body is housed in the housing case in the connecting step, so that both ends of the electronic component body are There is an advantage that a coil component in which the electronic component main body is protected by the housing case can be manufactured easily and appropriately while being pressed and electrically connected to the electrodes. be able to.

  Further, in the molding process of the electronic component main body, the slit extending spirally from one end portion to the other end portion of the cylindrical body is formed along the peripheral surface of the cylindrical body made of a conductive material. Thus, it is desirable to form a coil portion of the electronic component body.

  According to this configuration, the coil portion can be easily and appropriately formed on an extremely small electronic component main body by an etching method or a modeling method using a laser processing machine, so that mass production thereof is achieved. Can do.

  Further, in the housing case forming step, after disposing the electronic component main body between the electrodes in a state where a pair of electrodes are opposed to each other, the outer peripheral portion of the electronic component main body is filled with a non-conductive material. You may make it form the storage case which surrounds the said electronic component main body by filling with an agent and making it harden | cure.

  According to this configuration, the electronic component main body can be held in a state where the electronic component main body is integrally held when the filler is cured, so that the electronic component main body can be stably held in the housing case. Can do.

  Moreover, it is preferable that the said nonelectroconductive raw material is a hardening expansible material.

  According to this configuration, when the filler is cured, the electronic component main body expands in a state of integrally holding the electronic component main body. There is an advantage that the state can be obtained.

  Further, in the step of connecting the electronic component main body and the electrode, a welding current is passed through the electronic component main body from between the electrodes so that both ends of the electronic component main body are welded to the electrode, respectively. Good.

  According to this configuration, both ends of the electronic component main body can be connected to the electrodes by simply passing a welding current through the electronic component main body and the electrodes disposed at both ends thereof, and the welding is performed. By measuring the current value for use, there is an advantage that it can be easily inspected whether or not the welding between the electrode and the electronic component main body is properly performed.

  According to the coil component having such a configuration and the manufacturing method thereof, it is possible to suppress the occurrence of contact failure in the electronic component, and it is possible to reduce the manufacturing cost.

1 is a perspective view schematically showing a configuration of a coil component according to the present invention. It is a top view which shows the decomposition | disassembly state of the said coil components. It is a plane sectional view showing the concrete structure of the coil component. It is the IV-IV sectional view taken on the line of FIG. 1 which shows the specific structure of the said coil components. It is front sectional drawing which shows the state which mounted the said coil components on the board | substrate. It is an enlarged view which shows the modification of the electronic component main body which comprises a coil component. It is a top sectional view showing the state of magnetic flux generated at the time of energization of coil parts. It is front sectional drawing which shows another embodiment of the coil components which concern on this invention. It is process drawing which shows the formation process of the storage case which concerns on the said embodiment. It is explanatory drawing which shows the modification of the connection process of an electronic component main body and an electrode.

  Hereinafter, embodiments of a coil component 1 according to the present invention will be described with reference to the drawings. In addition, the structure which attached | subjected the same code | symbol in each figure shows that it is the same structure, The description is abbreviate | omitted.

  FIG. 1 is a perspective view schematically showing a configuration of a coil component 1 according to the present invention. FIG. 2 is a plan view showing a state in which the coil component 1 is disassembled into components, FIG. 3 is a plan sectional view showing a specific structure of the coil component 1, and FIG. 4 shows a specific structure of the coil component 1. 1 is a cross-sectional view taken along line IV-IV in FIG. 1, FIG. 5 is a front cross-sectional view showing a state where the coil component 1 is mounted on the assembly target 5, and FIG. 6 is a modified example of the electronic component main body 2 constituting the coil component 1. FIG. 7 is a plan sectional view showing a state of the magnetic flux J generated when the coil component 1 is energized.

  The coil component 1 includes an electronic component body 2 made of a nickel or nickel alloy conductive material, a housing case 3 made of a non-conductive material for housing the electronic component body 2, and both ends of the electronic component body 2. It has a pair of electrodes 4 and 4 to be connected. The coil component 1 is a chip-type electronic component having a so-called chip component shape.

  The electronic component body 2 is formed of a cylindrical body having a diameter of about 50 μm to 500 μm. A coil portion 21 having a spiral structure is formed in the central portion of the electronic component main body 2 over a length of, for example, about 0.5 to 1.0 mm, and cylindrical electric connection portions 22 are formed at both ends thereof. Is provided. Note that a structure in which a plating layer such as gold plating is provided on the inner peripheral surface of the electronic component main body 2 and an insulating coating layer is provided on the outer peripheral portion of the electronic component main body 2 may be employed.

  In the molding process of the electronic component main body 2, for example, after forming a cylindrical body made of a conductive material, the slit 23 extending spirally from one end to the other end is formed on the peripheral surface of the cylindrical body. Is formed along the slit 23, and a method of forming a predetermined region of the electronic component body 2 with the coil portion 21 having a spiral structure partitioned through the slit 23 is employed.

  Moreover, if the etching method or the shaping | molding processing method using a laser processing machine etc. are employ | adopted as a formation method of the slit 23, the said coil part 21 can be shape | molded to the very small electronic component main body 2 easily and appropriately. Therefore, mass production can be achieved. Instead of the embodiment in which the slit 23 is formed after forming the cylindrical body, the coil portion 21 and the slit 23 are simultaneously formed by an electroforming method or a forming method using a three-dimensional metal printer. You may make it shape | mold. Moreover, the cross-sectional shape of the electronic component main body 2 is not limited to a circle, and may be various shapes such as a square or a hexagon.

  In the forming process of the housing case 3, a non-conductive material such as a ceramic material or a plastic material has a U-shaped cross section having a bottom wall portion 31 and a pair of left and right side wall portions 32, 32. An open storage case 3 is formed. The total length L3 of the housing case 3 is formed to be shorter than the total length L2 of the electronic component body 2. Further, the installation interval W3 between the side wall portions 32, 32 is set to a value larger than the diameter D2 of the electronic component main body 2 so that the electronic component main body 2 can be accommodated in the accommodating case 3 ( (See FIG. 2).

  The electrode 4 includes an end plate 41 that covers an opening formed on the end surface of the housing case 3, and a peripheral wall 42 that is externally fitted to the end portion of the housing case 3. The electrode 4 is formed with a through-hole 43 made of a round hole or the like for allowing a magnetic flux J (see FIG. 7) generated when the electronic component body 2 is energized to pass through substantially the center of the end plate 41. Further, the installation interval between the electrodes 4, 4, specifically the installation interval between the inner wall surfaces of the end plate 41, is set equal to the total length L 3 of the housing case 3, so that it is larger than the total length L 2 of the electronic component body 2. It is set to a short value.

  In the forming process of the electrode 4, the electrode 4 including the end plate 41 and the peripheral wall 42 is formed by, for example, bending a plate material made of a conductive material such as copper, nickel, or silver. Then, in the step of arranging the electrode 4, the end wall of the housing case 3 is covered with the end plate 41 of the electrode 4 by fitting the peripheral wall 42 of the electrode 4 to the end of the housing case 3.

  It is possible to form the electrode 4 by applying a conductive paste obtained by adding glass frit to metal powder to the end of the housing case 3 and then heating and baking it to a predetermined temperature. According to this method, the shaping | molding of the electrode 4 and arrangement | positioning of the electrode 4 can be performed simultaneously.

  Thus, after arrange | positioning the electrode 4 to the both ends of the storage case 3, respectively, the electronic component main body 2 in the storage case 3 from the upper opening part of the storage case 3 in the connection process of the electronic component main body 2 and the electrode 4 is carried out. By inserting the, the end surfaces of the electrical connection portions 22 provided at both ends of the electronic component main body 2 can be brought into pressure contact with the end plates 41 of the electrodes 4, respectively, and these can be electrically connected.

  That is, in the embodiment, the installation interval (L3) between the electrodes 4 and 4 is set to be shorter than the total length L2 of the electronic component body 2. For this reason, if the electronic component main body 2 is accommodated in the accommodating case 3 in a compressed and deformed state, the electrical connection portion 22 is connected to the electrode 4 according to the restoring force of the electronic component main body 2 as shown in FIG. The two end portions of the electronic component body 2 are electrically connected to both electrodes 4 by being pressed against the end plate 41.

  As described above, the molding process of the electronic component body 2 for molding the electronic component body 2 having the helically structured coil portion 21 formed of the conductive material, and a non-conductive material for housing the electronic component body 2 The housing case 3 forming step for forming the housing case 3, the electrode 4 disposing step for disposing the electrodes 4 at both ends of the electronic component body 2, and the both ends of the electronic component body 2 against the electrodes 4, respectively. According to the manufacturing method of the coil component 1 of the present invention comprising the step of connecting the electronic component main body 2 and the electrode 4 to be connected in contact with each other, the electrode 4 is accommodated in the housing case in the step of arranging the electrode 4. 3 are attached to both ends of the electronic component main body 2 and then inserted into the electronic component main body 2 from the upper opening of the housing case 3 in the connecting step. End plate 4 of electrode 4 Respectively brought into pressure contact to thereby electrically connected.

  Then, as shown in FIG. 5, the electrodes 4 and 4 disposed at both ends of the housing case 3 are printed circuit boards, flexible boards, ceramic multilayer wiring boards, electrode plates for liquid crystal displays and plasma displays, semiconductor substrates. Is mounted on the assembly target 5 and the like, and a pair of electrode pads 51, 51 provided on the assembly target 5 and the bottom surfaces of the electrodes 4, 4 are connected by solder 52, etc. The coil component 1 having the electronic component main body 2 in which the coil portion 21 having the structure is formed can be used as an inductance element, a T-type filter, an oscillation circuit, or the like.

  As described above, in the coil component 1 according to the present invention, the electronic component main body 2 having the spiral coil portion 21 formed of a conductive material and the housing made of the non-conductive material for housing the electronic component main body 2 are accommodated. Since the case 3 and the pair of electrodes 4 and 4 connected to both ends of the electronic component main body 2 are provided and the electrodes 4 are disposed at both ends of the housing case 3, the coil component 1 is formed extremely small. Even if it does, there exists an advantage that the manufacturing cost can be held down cheaply, suppressing that the contact failure generate | occur | produces in the coil component 1. FIG.

  That is, by accommodating the electronic component body 2 in the housing case 3 made of a non-conductive material, the cylindrical electrical connection portions 22 provided at both ends thereof are disposed at both ends of the housing case 3. Since the electrodes 4 are brought into contact with each other and connected, a plurality of thin ceramic plates each having a circular conductor portion are laminated as in the prior art disclosed in Patent Document 1, and the ceramic plates are laminated. There is no risk of frequent contact failure between the conductor portions, as in the case where the conductor portions of the ceramic plates are connected to each other by the external electrodes formed at both ends of the chip coil body made of a body, and extremely The coil component 1 can be easily formed.

  Moreover, since the electronic component main body 2 can be accommodated in the housing case 3 and protected, the electronic component main body 2 can be prevented from being damaged even in the extremely small coil component 1 in which the overall length and diameter are set to be extremely small. However, the coil component 1 can be easily and properly mounted on the assembly target 5 made of a substrate or the like.

  Moreover, in the said embodiment, after forming the cylindrical body which consists of a raw material which has electroconductivity in the shaping | molding process of the electronic component main body 2, the slit 23 extended helically toward the other end part from the one end part of a cylindrical body Since the coil part 21 having a spiral structure is formed in the electronic component main body 2 by forming along the peripheral surface of the cylindrical body, by an etching method or a modeling method using a laser processing machine, etc. The following extremely small electronic component main body 2 can be easily and appropriately molded and mass-produced.

  For example, the total length of the coil portion 21 provided in the electronic component body 2 is 0.5 mm to 1.0 mm, the diameter D2 of the coil portion 21 is 50 μm to 500 μm, and the number of turns of the coil portion 21 is appropriately selected, so An inductance element having an inductance of about 100 pH can be easily and appropriately formed.

  Further, according to the structure in which both end portions of the housing case 3 are opened as described above and the electrode 4 is disposed so as to cover the opening of the housing case 3, the electronic component body 2 is placed in the housing case. These electrical connections can be made easily and appropriately by accommodating both ends of the electronic component body 2 in contact with the electrodes 4.

  In particular, when the installation interval (L3) of the electrodes 4 and 4 disposed at both ends of the housing case 3 is set shorter than the total length L2 of the electronic component body 2 as in the coil component 1 according to the embodiment. For this purpose, the electronic component main body 2 is compressed and deformed and accommodated in the accommodating case 3, and both ends of the electronic component main body 2 are connected to the end plate 41 of the electrode 4 according to the restoring force of the electronic component main body 2. There is an advantage in that a stable electrical connection state can be obtained by press-contacting to.

  It should be noted that, in place of the above-described configuration in which both ends thereof are pressed against the end plate 41 of the electrode 4 according to the restoring force of the electronic component main body 2, or together with this configuration, The both ends of the electronic component main body 2 are attached to the electrodes 4 and 4 by soldering the end of the electronic component main body 2 accommodated in the accommodating case 3 to the electrode 4 or by adhering it with a conductive adhesive. You may comprise so that it may each connect.

  Alternatively, the cylindrical electrical connection portions 22 provided at both ends of the electronic component main body 2 may be omitted, and the spiral coil portion 21 may be formed over the entire length of the electronic component main body 2. In this case, depending on the restoring force of the electronic component body 2, the end of the coil part 21 is pressed against the end plate 41 of the electrode 4, or the end of the coil part 21 and the electrode 4 are soldered, etc. The end of the electronic component body 2 can be electrically connected to the electrode 4.

  Moreover, in the said embodiment, the one slit 23 extended spirally toward the other end part from the one end part of the cylindrical body which consists of a raw material which has electroconductivity is formed along the surrounding surface of the said cylindrical body. The example in which the coil portion 21 of the electronic component main body 2 is formed has been described. However, as shown in FIG. 6, a spiral is formed from the electrical connection portion 22 provided on one end portion side of the electronic component main body 2 toward the other end portion side. It is good also as a structure which provided the pair of coil parts 21a and 21b extended in parallel with a fixed space | interval in the electronic component main body 2 by forming a pair of slit 23a, 23b extended in a shape along the surrounding surface of a cylindrical body.

  Furthermore, in the said embodiment, since it was set as the structure which provided the through-hole 43 for allowing the magnetic flux which generate | occur | produces at the time of electricity supply with respect to an electronic component main body to be provided in the end plate 41 of the electrode 4, when using the electronic component main body 2 as an inductance element etc. In addition, as shown in FIG. 7, the flow of magnetic flux J generated when the electronic component body 2 is energized can be prevented from being obstructed by the electrode 4, and the performance of the electronic component body 2 can be exhibited well. Can do.

  In the above-described embodiment, the example in which the through-hole 43 made of a round hole or the like is formed in the central portion of the end plate 41 of the electrode 4 has been described. However, both end portions of the electronic component body 2 can be brought into contact with the electrode 4. As long as the shape and position allow the magnetic flux J to pass through, it is possible to form various shapes of through-holes such as square holes at arbitrary positions on the electrode 4.

  The housing case 3 is not limited to a U-shaped cross section having a bottom wall portion 31 and a pair of left and right side wall portions 32, 32, but has a circular cross section made of a nonconductive material such as a ceramic material or a plastic material, Alternatively, the storage case may be formed by a square cylinder having a square cross section, and the electronic component main body 2 may be inserted from one end thereof, and then the electrodes 4 may be disposed at both ends of the storage case.

  FIG. 8 is a cross-sectional view showing another embodiment of the coil component 1 according to the present invention, and FIG. 9 is a process diagram showing a forming process of the housing case 34 according to this another embodiment.

  In order to mold the housing case, first, as shown in FIG. 9A, a pair of electrodes 4 and 4 are set on the jig 6 at intervals corresponding to the entire length of the electronic component main body 2, and then FIG. The electronic component body 2 is disposed between the electrodes 4 and 4 as shown in FIG. Next, a filler made of a nonconductive material such as a silicon resin material is filled between the electrodes 4 and 4 so as to surround the outer peripheral portion of the electronic component main body 2 and cured. As a result, as shown in FIG. 8, the housing case 34 made of a covering layer surrounding the electronic component body 2 is formed, and the electrodes 4 and 4 are disposed so as to cover both ends thereof. 2 and the electrodes 4 and 4 are joined.

  In this case, as the filler constituting the housing case 34, it is preferable to use a curable expandable material such as a curable expandable resin or gypsum having a property of expanding when cured. When the storage case 34 is formed using a filler made of this curable and expandable material, the electronic component main body 2 is integrally held when the filler is cured. There is an advantage that a stable electrical connection state can be obtained by reliably pressing the both ends of the component body 2 against the electrodes 4 and 4 held by the jig 6 or the like.

  Further, when a heat-resistant material is used as the filler constituting the housing case 34, the electronic component body 2 is heated even if the coil component 1 is used in a high temperature environment of, for example, 200 ° C. or higher. Deterioration can be effectively suppressed by the housing case 34 made of the heat-resistant material.

  FIG. 10 is an explanatory view showing a modified example of the connection process for connecting both end portions of the electronic component main body 2 to the electrode 4. In this connection process, a welding current of about 1 ampere is applied to the electrodes 4, 4 and the electronic component body 2 disposed therebetween from the power supply device 7 having the power source 71, the open / close switch 72 and the ammeter 73. Thus, the joint between the electrodes 4 and 4 and the electronic component main body 2 is heated and welded.

  According to this configuration, the both ends of the electronic component main body 2 are welded to the electrode 4 only by applying a welding current from the power supply device 7 to the electrodes 4 and 4 and the electronic component main body 2 disposed therebetween. In addition to being able to connect, there is an advantage that whether or not the electrodes 4 and 4 and the electronic component main body 2 are properly welded can be inspected simultaneously according to the measured value of the ammeter 73.

  That is, in the case where there is a problem such as interruption of the welding current energized from the energization device 7 due to the presence of foreign matter between the electronic component body 2 and the electrode 4, Since the measured value of the total 73 becomes 0, if the current value is measured by the ammeter 73 as to whether or not the coil component 1 is properly manufactured, whether or not a defective product is manufactured at the time of manufacturing the electronic component body 2. There is an advantage that it can be detected easily and appropriately.

DESCRIPTION OF SYMBOLS 1 Coil component 2 Electronic component main body 3,34 Housing case 4 Electrode 6 Jig 21 Coil part 23, 23a, 23b Slit 41 End plate 43 Through-hole J Magnetic flux

Claims (9)

An electronic component main body having a coil portion of a spiral structure formed of a conductive material;
A housing case made of a non-conductive material for housing the electronic component body;
A pair of electrodes connected to both ends of the electronic component body,
A coil component in which the pair of electrodes are respectively disposed at both ends of the housing case. Both ends of the storage case are opened,
The coil component according to claim 1, further comprising an end plate disposed so that each electrode covers an opening of the housing case.   The coil component according to claim 1 or 2, wherein an installation interval of the pair of electrodes is set to be shorter than a total length of the electronic component main body.   The coil component according to any one of claims 1 to 3, wherein each of the electrodes is formed with a through hole for allowing a magnetic flux generated when the electronic component body is energized to pass therethrough. A molding step of the electronic component body for molding an electronic component body having a coil portion of a helical structure formed of a conductive material;
A molding step of the housing case for molding a housing case made of a non-conductive material that houses the electronic component body; and
An electrode disposing step of disposing electrodes on both ends of the electronic component body;
A method of manufacturing a coil component, comprising: a step of connecting the electronic component main body and the electrode, wherein both ends of the electronic component main body are brought into contact with and connected to the electrodes.   In the molding process of the electronic component main body, the slit extending spirally from one end portion to the other end portion of the cylindrical body is formed along the peripheral surface of the cylindrical body made of a conductive material. The method of manufacturing a coil component according to claim 5, wherein a coil portion of the electronic component body is formed. In the molding process of the housing case, after disposing the electronic component main body between the electrodes in a state where a pair of electrodes are arranged to face each other,
The manufacturing method of the coil components of Claim 5 or 6 which forms the storage case which surrounds the said electronic component main body by filling the outer peripheral part of the said electronic component main body with the filler which consists of nonelectroconductive materials, and making it harden | cure.   The method for manufacturing a coil component according to claim 7, wherein the non-conductive material is a curable and expandable material.   The connection process of the said electronic component main body and the said electrode WHEREIN: The electric current of welding is supplied to the said electronic component main body from between the said electrodes, and the both ends of the said electronic component main body are each welded to the said electrode. The manufacturing method of the coil components of any one of Claims 1.

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