JP2018137256A - Light emitting device - Google Patents

Light emitting device Download PDF

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JP2018137256A
JP2018137256A JP2017028596A JP2017028596A JP2018137256A JP 2018137256 A JP2018137256 A JP 2018137256A JP 2017028596 A JP2017028596 A JP 2017028596A JP 2017028596 A JP2017028596 A JP 2017028596A JP 2018137256 A JP2018137256 A JP 2018137256A
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light emitting
emitting element
light
emitting device
recess
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JP6947964B2 (en
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和浩 福元
Kazuhiro Fukumoto
和浩 福元
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Nichia Chemical Industries Ltd
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Nichia Chemical Industries Ltd
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Abstract

PROBLEM TO BE SOLVED: To provide a light emitting device excellent in light extraction efficiency.SOLUTION: A light emitting device includes: a package 10 including a recess having side faces and a bottom face; a light emitting element 40 mounted on a bottom face 12 of the recess; a plurality of bumps 20 which are arranged on the bottom face around the light emitting element 40 so as to be separated from the light emitting element 40, and each of which includes a ball part 21 and an extension part 22 on the ball part 21, and in top view, an upper part 22a of the extension part being located outside a lower part 22b of the extension part; and a light reflecting resin 30 which is arranged between the bumps 20 and the side faces of the recess and which is also arranged such that the bottom face 12 of the recess between the bumps 20 and the light emitting element 40 is exposed.SELECTED DRAWING: Figure 1C

Description

本発明は、発光装置に関する。   The present invention relates to a light emitting device.

パッケージの凹部内部に載置された発光素子の周囲に、光反射樹脂を備えた発光装置が知られている。光反射樹脂は、凹部の底面に形成されたリードフレーム又は樹脂からなる枠体で堰き止められることで、発光素子の側面を被覆しないようにしている。
（例えば、特許文献１）。 2. Description of the Related Art A light emitting device including a light reflecting resin around a light emitting element placed inside a recess of a package is known. The light reflecting resin is blocked by a lead frame formed on the bottom surface of the recess or a frame body made of resin, so that the side surface of the light emitting element is not covered.
(For example, patent document 1).

特開２００５−１３６３７８号公報JP 2005-136378 A

目的や用途に応じて、同じパッケージに載置される発光素子の数が変更されることがある。また、発光素子の数が同じであっても、最適な光反射樹脂が配置される位置や形状が異なる場合がある。そのような場合、先行文献１に開示された構成とすると、樹脂成型用の金型や、リードフレームの形状を変更する必要があり、大幅な手間とコストがかかる。   Depending on the purpose and application, the number of light-emitting elements placed in the same package may be changed. Moreover, even if the number of light emitting elements is the same, the position and shape where the optimal light reflecting resin is disposed may be different. In such a case, if it is set as the structure disclosed by the prior art document 1, it is necessary to change the metal mold | die for resin molding, and the shape of a lead frame, and a big effort and cost start.

本実施形態は、以下の構成を含む。
側面と底面とを有する凹部を備えたパッケージと、凹部の底面に載置される発光素子と、発光素子から離間するように発光素子の周囲の底面上に配置され、ボール部とボール部上の延伸部とを備える複数のバンプであって、上面視において、延伸部の上部が延伸部の下部よりも外側に位置するバンプと、バンプと凹部の側面との間に配置され、かつ、バンプと発光素子との間の凹部の底面が露出するように配置される光反射樹脂と、を備える発光装置。 The present embodiment includes the following configuration.
A package having a recess having a side surface and a bottom surface; a light emitting element mounted on the bottom surface of the recess; and a light emitting element disposed on a bottom surface around the light emitting element so as to be separated from the light emitting element. A plurality of bumps each including an extending portion, wherein the upper portion of the extending portion is positioned outside the lower portion of the extending portion, and the bump is disposed between the bump and the side surface of the recessed portion when viewed from above; And a light reflecting resin disposed so that a bottom surface of the recess between the light emitting element and the light emitting element is exposed.

以上により、光反射樹脂の形成領域を容易に画定することができ、光取り出し効率を向上させる。   As described above, the formation region of the light reflecting resin can be easily defined, and the light extraction efficiency is improved.

図１Ａは、実施形態に係る発光装置の概略上面図である。FIG. 1A is a schematic top view of the light emitting device according to the embodiment. 図１Ｂは、図１Ａの１Ｂ−１Ｂ線における概略断面図である。1B is a schematic cross-sectional view taken along line 1B-1B in FIG. 1A. 図１Ｃは、図１Ｂの１Ｃ部分の拡大図である。FIG. 1C is an enlarged view of a portion 1C of FIG. 1B.

本発明を実施するための形態を、以下に図面を参照しながら説明する。ただし、以下に示す形態は、本発明の技術思想を具体化するための発光装置を例示するものであって、本発明は、発光装置を以下に限定するものではない。   A mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below illustrates the light-emitting device for embodying the technical idea of the present invention, and the present invention does not limit the light-emitting device to the following.

また、本明細書は、特許請求の範囲に示される部材を、実施の形態の部材に特定するものでは決してない。特に、実施の形態に記載されている構成部品の寸法、材質、形状、その相対的配置等は、特定的な記載がない限りは、本発明を実施形態にのみ限定する趣旨ではない。尚、各図面が示す部材の大きさや位置関係等は、説明を明確にするため誇張していることがある。さらに以下の説明において、同一の名称、符号については同一もしくは同質の部材を示しており、詳細説明を適宜省略する。   Further, the present specification by no means specifies the member shown in the claims as the member of the embodiment. In particular, the dimensions, materials, shapes, relative arrangements, and the like of the components described in the embodiments are not intended to limit the present invention only to the embodiments unless specifically described. It should be noted that the size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation. Furthermore, in the following description, the same name and symbol indicate the same or the same members, and detailed description thereof will be omitted as appropriate.

図１Ａ〜図１Ｃは、実施形態に係る発光装置１００を示す。発光装置１００は、主な構成部材として、パッケージ１０と、発光素子４０と、バンプ２０と、光反射樹脂３０と、を備える。以下、各構成について詳説する。   1A to 1C show a light emitting device 100 according to an embodiment. The light emitting device 100 includes a package 10, a light emitting element 40, a bump 20, and a light reflecting resin 30 as main components. Hereinafter, each configuration will be described in detail.

（パッケージ）
パッケージ１０は、例えば、図１Ａに示すような、上面視形状が四角形のパッケージ１０とすることができる。パッケージ１０の形状、大きさ、厚み等は、特に限定されず、公知のパッケージを用いることができる。パッケージ１０は、側面１１と底面１２とを備えた凹部１３を備える。例えば、図１Ａに示すような、開口部が四角形の凹部１３を備えることができる。凹部１３の形状も、特に限定されるものではない。凹部１３の底面１２には、発光素子４０に通電するための導電部材（不図示）を備えている。 (package)
For example, the package 10 may be a package 10 having a quadrangular shape when viewed from above as shown in FIG. 1A. The shape, size, thickness and the like of the package 10 are not particularly limited, and a known package can be used. The package 10 includes a recess 13 having a side surface 11 and a bottom surface 12. For example, as shown in FIG. 1A, the opening can include a concave portion 13 having a square shape. The shape of the recess 13 is not particularly limited. A conductive member (not shown) for energizing the light emitting element 40 is provided on the bottom surface 12 of the recess 13.

このようなパッケージ１０としては、例えば、成形樹脂で金属部材を一体的に保持した樹脂パッケージを用いることができる。あるいは、セラミックと配線とを備えたセラミックパッケージや、ガラスエポキシ樹脂と配線とを備えたガラエポパッケージなど公知のパッケージを用いることができる。   As such a package 10, for example, a resin package in which a metal member is integrally held with a molding resin can be used. Alternatively, a known package such as a ceramic package including a ceramic and a wiring, or a glass epoxy package including a glass epoxy resin and a wiring can be used.

（発光素子）
発光素子４０は、パッケージ１０の凹部１３の底面１２上に載置される。詳細には、発光素子４０は、凹部１３の底面１２上に、接合部材５０を介して載置される。発光素子４０は、半導体層を含む積層構造体と、ｐ電極及びｎ電極と、を備えており、公知の半導体発光素子を用いることができる。例えば、ＩｎＮ、ＡｌＮ、ＧａＮ、ＩｎＧａＮ、ＡｌＧａＮ、ＩｎＧａＡｌＮ等の窒化物半導体を含むＩＩＩ−Ｖ族化合物半導体、あるいはＩＩ−ＶＩ族化合物半導体などが挙げられる。これらの積層構造体は、発光層を含んでいる。また、積層構造体は、透光性基板を備えていてもよい。透光性の基板としては、サファイアが挙げられる。積層構造体は、上面視が三角形、四角形、五角形、六角形等の多角形、もしくは、これらの一部が欠けた形状等とすることができる。発光素子４０は、ｐ電極及びｎ電極を、パッケージ１０の導電部材とワイヤ等によって電気的に接続される。 (Light emitting element)
The light emitting element 40 is placed on the bottom surface 12 of the recess 13 of the package 10. Specifically, the light emitting element 40 is placed on the bottom surface 12 of the recess 13 via the bonding member 50. The light emitting element 40 includes a stacked structure including a semiconductor layer, a p-electrode, and an n-electrode, and a known semiconductor light-emitting element can be used. For example, a group III-V compound semiconductor including a nitride semiconductor such as InN, AlN, GaN, InGaN, AlGaN, InGaAlN, or a group II-VI compound semiconductor can be given. These laminated structures include a light emitting layer. Moreover, the laminated structure may include a light-transmitting substrate. A sapphire is mentioned as a translucent board | substrate. The laminated structure may have a polygonal shape such as a triangle, a quadrangle, a pentagon, and a hexagon in a top view, or a shape in which some of these are missing. In the light emitting element 40, the p electrode and the n electrode are electrically connected to the conductive member of the package 10 by a wire or the like.

（バンプ）
バンプ２０は、発光素子４０から離間するように、発光素子４０の周囲の底面１２上に配置される。バンプ２０光反射樹脂３０を堰き止める部材として用いられる。バンプ２０は、パッケージ１０の凹部１３の底面１２上に配置される。バンプ２０は複数であり、発光素子４０から離間するように発光素子４０の周囲の底面１２上に配置される。各バンプ２０は、ボール部２１とボール部２１上の延伸部２２とを備える。 (bump)
The bump 20 is disposed on the bottom surface 12 around the light emitting element 40 so as to be separated from the light emitting element 40. The bump 20 is used as a member for blocking the light reflecting resin 30. The bump 20 is disposed on the bottom surface 12 of the recess 13 of the package 10. A plurality of the bumps 20 are disposed on the bottom surface 12 around the light emitting element 40 so as to be separated from the light emitting element 40. Each bump 20 includes a ball portion 21 and an extending portion 22 on the ball portion 21.

バンプ２０は、以下のようにして形成される。まず、キャピラリに挿通され、ワイヤクランプで挟持されたワイヤの先端を電気放電等によって溶融させることでイニシャルボールを形成する。電気放電等の条件は、ワイヤの組成、径、目的とするイニシャルボールの大きさ等に応じて適宜選択することができる。このイニシャルボールを、パッケージ１０の凹部１３の底面１２上に当接し、熱及び超音波を印加して圧着接続させる。これにより、イニシャルボールがボール部２１となる。図１Ａでは、超音波の振動の方向を一方向（図１Ａでは左右方向）とすることで、上面視形状が左右方向に長軸を有する楕円形状であるバンプ２０を例示している。尚、バンプ２０の上面視形状は、円形とすることもできる。   The bump 20 is formed as follows. First, an initial ball is formed by melting the tip of a wire inserted through a capillary and held by a wire clamp by electric discharge or the like. Conditions such as electric discharge can be appropriately selected according to the wire composition, diameter, target initial ball size, and the like. The initial ball is brought into contact with the bottom surface 12 of the recess 13 of the package 10 and is subjected to pressure connection by applying heat and ultrasonic waves. As a result, the initial ball becomes the ball portion 21. FIG. 1A illustrates the bump 20 whose top view shape is an elliptical shape having a major axis in the left-right direction by setting the direction of ultrasonic vibration to one direction (left-right direction in FIG. 1A). Note that the top view shape of the bump 20 may be circular.

次に、ワイヤクランプを開いた状態でキャピラリを上昇させて、その上昇させた位置でワイヤクランプを閉じてワイヤを挟持する。そして、ワイヤクランプでワイヤを挟持した状態でキャピラリを上昇させることで、ワイヤが切断される。詳細には、キャピラリをボール部の直上に移動させた後、発光素子と反対側の方向の横方向に移動させ、その位置から直上に移動させる。これにより、ボール部２１から斜め方向に延伸する延伸部２２が形成される。つまり、延伸部２２の上部２２ａが、延伸部２２の下部２２ｂの直上ではなく、延伸部２２の下部２２ｂよりも外側に位置する。このように延伸部２２を外側に傾斜させることで、後述の光反射樹脂３０の広がりを、効率よく抑制することができる。   Next, the capillary is raised with the wire clamp open, and the wire clamp is closed and the wire is clamped at the raised position. And a wire is cut | disconnected by raising a capillary in the state which clamped the wire with the wire clamp. Specifically, after moving the capillary directly above the ball portion, the capillary is moved in the lateral direction opposite to the light emitting element, and is moved immediately above that position. Thereby, the extending part 22 extending in an oblique direction from the ball part 21 is formed. That is, the upper part 22 a of the extending part 22 is not located immediately above the lower part 22 b of the extending part 22 but is located outside the lower part 22 b of the extending part 22. Thus, by extending the extending portion 22 outward, the spread of the light reflecting resin 30 described later can be efficiently suppressed.

バンプ２０の中心と発光素子４０（発光素子４０の側面）の距離は、例えば、８０μｍ〜５００μｍ程度とすることができる。図１Ａでは、上面視形状が正方形の発光素子４０の周囲に、長方形状に配置されたバンプ２０を例示している。バンプ２０は、発光素子４０に沿うように配置することが好ましい。例えば、上面視形状が正方形の発光素子４０の周囲に、バンプ２０を正方形状に配置してもよい。   The distance between the center of the bump 20 and the light emitting element 40 (side surface of the light emitting element 40) can be, for example, about 80 μm to 500 μm. FIG. 1A illustrates bumps 20 arranged in a rectangular shape around a light emitting element 40 having a square shape when viewed from above. The bumps 20 are preferably arranged along the light emitting element 40. For example, the bumps 20 may be arranged in a square shape around the light emitting element 40 whose top view shape is square.

ボール部２１の厚みは、例えば、最も厚い部分の厚みを１μｍ〜１５μｍ程度とすることができる。また、図１Ａに示すように、発光素子４０に近い側（内側）のボール部２１を、発光素子４０から離れた側（外側）のボール部２１よりも薄くすることができる。これにより、発光素子４０からの光を上方に反射し易くすることができる。このような形状のボール部２１は、発光素子４０に近い側のボール部２１をキャピラリで押圧することで変形させて形成することができる。このような変形は、各バンプ２０毎に行ってもよく、あるいは、複数のバンプ２０をまとめて変形させてもよい。ボール部２１の径は、例えば、３０μｍ〜１５０μｍ程度とすることができる。ボール部を楕円形状とする場合は、例えば、長径を３０μｍ〜１５０μｍ程度、短径を２０μｍ〜１４０μｍ程度とすることができる。   As for the thickness of the ball portion 21, for example, the thickness of the thickest portion can be set to about 1 μm to 15 μm. Further, as shown in FIG. 1A, the ball portion 21 on the side (inner side) close to the light emitting element 40 can be made thinner than the ball portion 21 on the side away from the light emitting element 40 (outer side). Thereby, the light from the light emitting element 40 can be easily reflected upward. The ball portion 21 having such a shape can be formed by deforming the ball portion 21 closer to the light emitting element 40 by pressing it with a capillary. Such deformation may be performed for each bump 20 or a plurality of bumps 20 may be deformed collectively. The diameter of the ball | bowl part 21 can be about 30 micrometers-150 micrometers, for example. When the ball portion has an elliptical shape, for example, the major axis can be about 30 μm to 150 μm and the minor axis can be about 20 μm to 140 μm.

延伸部２２は、上部２２ａの高さが、例えば、パッケージ１０の底面１２から１５μｍ〜５０μｍ程度とすることができる。また、延伸部２２の上部２２ａの高さを、発光素子４０をパッケージ１０に固定させるための接合部材５０の厚みよりも小さくすることが好ましい。これにより、発光素子４０からの光を光反射樹脂３０で反射し易くすることができる。尚、接合部材５０は、発光素子４０の側面に這い上がっている場合があり、その場合は、発光素子４０の直下の接合部材５０の厚みよりも、低い位置に延伸部２２の上部２２ａが位置するようにすることが好ましい。   The extending portion 22 can have a height of the upper portion 22 a of, for example, about 15 μm to 50 μm from the bottom surface 12 of the package 10. In addition, the height of the upper portion 22 a of the extending portion 22 is preferably made smaller than the thickness of the bonding member 50 for fixing the light emitting element 40 to the package 10. Thereby, the light from the light emitting element 40 can be easily reflected by the light reflecting resin 30. In addition, the joining member 50 may crawl up to the side surface of the light emitting element 40. In this case, the upper portion 22a of the extending portion 22 is located at a position lower than the thickness of the joining member 50 directly below the light emitting element 40. It is preferable to do so.

延伸部２２の長さ（上部２２ａから下部２２ｂの距離）は、例えば、１０μｍ〜５０μｍ程度とすることができる。また、延伸部２２の上部２２ａは、ボール部２１の外周よりも内側に位置することが好ましい。延伸部２２の傾斜角度は、底面１２に対して３０度〜９０度とすることができる。また、延伸部２２が傾斜する方向は、上面視において発光素子４０の中心と各バンプ２０の中心とを結んだ直線上であって、発光素子４０から離れる方向に傾斜させることが好ましい。   The length of the extending portion 22 (distance from the upper portion 22a to the lower portion 22b) can be set to about 10 μm to 50 μm, for example. Further, the upper portion 22 a of the extending portion 22 is preferably located inside the outer periphery of the ball portion 21. The extending portion 22 can be inclined at an angle of 30 to 90 degrees with respect to the bottom surface 12. In addition, the direction in which the extending portion 22 is inclined is preferably on a straight line connecting the center of the light emitting element 40 and the center of each bump 20 in a top view, and is inclined in a direction away from the light emitting element 40.

また、各バンプ２０は、図１Ａに示すように、隣接するバンプ２０と、それぞれ接していることが好ましい。   Each bump 20 is preferably in contact with the adjacent bump 20 as shown in FIG. 1A.

バンプ２０の材料としては、Ａｕ、Ａｌ、Ａｇ等を挙げることができる。   Examples of the material of the bump 20 include Au, Al, and Ag.

（光反射樹脂）
光反射樹脂３０は、パッケージ１０の凹部１３の側面１１とバンプ２０の間の底面１２に配置される。光反射樹脂３０は、液状の光反射樹脂３０を、ディスペンスノズル等を用いて供給し、硬化させることで形成することができる。液状の光反射樹脂３０は、バンプ２０によって堰き止められるため、発光素子４０に接しないように形成される。換言すると、バンプ２０と発光素子４０との間の凹部１３の底面１２が露出するように、光反射樹脂３０が配置される。これにより、発光素子４０からの光を効率よく反射させることができる。 (Light reflecting resin)
The light reflecting resin 30 is disposed on the bottom surface 12 between the side surface 11 of the recess 13 of the package 10 and the bump 20. The light reflecting resin 30 can be formed by supplying and curing the liquid light reflecting resin 30 using a dispense nozzle or the like. Since the liquid light reflecting resin 30 is blocked by the bumps 20, it is formed so as not to contact the light emitting element 40. In other words, the light reflecting resin 30 is disposed so that the bottom surface 12 of the recess 13 between the bump 20 and the light emitting element 40 is exposed. Thereby, the light from the light emitting element 40 can be reflected efficiently.

光反射樹脂３０を構成する材料としては、発光素子からの光を吸収しにくく、且つ、効率よく反射する部材が好ましい。具体的な反射率としては、少なくとも５０％以上とすることが好ましく、より好ましくは７０％以上である。また、絶縁性部材が好ましく、発光素子からの光や、外光によって劣化しにくい部材が好ましい。また、ある程度の強度を有するもので、熱硬化性樹脂、熱可塑性樹脂などを用いることができ、より具体的には、フェノール樹脂、ガラスエポキシ樹脂、ＢＴレジン、ＰＰＡやシリコーン樹脂などが挙げられる。これら母体となる樹脂に、発光素子からの光を反射する反射部材（例えばＴｉＯ２、Ａｌ２Ｏ３、ＺｒＯ２，ＭｇＯ、ＺｎＯ）などを添加することで、効率よく光を反射させることができる。 As a material constituting the light reflecting resin 30, a member that hardly absorbs light from the light emitting element and efficiently reflects is preferable. The specific reflectance is preferably at least 50% or more, more preferably 70% or more. Further, an insulating member is preferable, and a member that is not easily deteriorated by light from the light emitting element or external light is preferable. Moreover, it has a certain amount of strength, and a thermosetting resin, a thermoplastic resin, or the like can be used, and more specifically, a phenol resin, a glass epoxy resin, a BT resin, a PPA, a silicone resin, or the like can be given. By adding a reflective member (for example, TiO 2 , Al 2 O 3 , ZrO 2 , MgO, ZnO) or the like that reflects light from the light-emitting element to the base resin, light can be efficiently reflected. .

（封止部材）
封止部材の材料としては、発光素子からの光を透過可能な透光性を有し、且つ、耐光性を有するものが好ましい。具体的な材料としては、シリコーン樹脂組成物、変性シリコーン樹脂組成物、エポキシ樹脂組成物、変性エポキシ樹脂組成物、アクリル樹脂組成物等の、発光素子からの光を透過可能な透光性を有する絶縁樹脂組成物を挙げることができる。また、シリコーン樹脂、エポキシ樹脂、ユリア樹脂、フッ素樹脂及びこれらの樹脂を少なくとも１種以上含むハイブリッド樹脂等も用いることができる。このような材料に加え、所望に応じて着色剤、光拡散剤、光反射材、各種フィラー、波長変換部材（蛍光体）などを含有させることもできる。 (Sealing member)
As a material of the sealing member, a material having translucency capable of transmitting light from the light emitting element and light resistance is preferable. Specific examples of the material include a silicone resin composition, a modified silicone resin composition, an epoxy resin composition, a modified epoxy resin composition, and an acrylic resin composition, which have a light-transmitting property capable of transmitting light from a light-emitting element. An insulating resin composition can be mentioned. In addition, a silicone resin, an epoxy resin, a urea resin, a fluororesin, and a hybrid resin containing at least one of these resins can be used. In addition to such materials, a colorant, a light diffusing agent, a light reflecting material, various fillers, a wavelength conversion member (phosphor), and the like can be included as desired.

蛍光体としては、例えば、酸化物系、硫化物系、窒化物系の蛍光体などが挙げられる。例えば、発光素子として青色発光する窒化ガリウム系発光素子を用いる場合、青色光を吸収して黄色〜緑色系発光するＹＡＧ系、ＬＡＧ系、緑色発光するＳｉＡｌＯＮ系（βサイアロン）、赤色発光するＳＣＡＳＮ、ＣＡＳＮ系、ＫＳＦ系蛍光体（Ｋ２ＳｉＦ６：Ｍｎ）、硫化物系蛍光体、ナノ蛍光体等の少なくとも１種、又は２種以上を用いることができる。 Examples of the phosphor include oxide-based, sulfide-based, and nitride-based phosphors. For example, when a gallium nitride-based light emitting device that emits blue light is used as the light emitting device, a YAG system that absorbs blue light to emit yellow to green light, a LAG system, a SiAlON system that emits green light (β sialon), a SCASN that emits red light, At least one or more of CASN type, KSF type phosphor (K 2 SiF 6 : Mn), sulfide type phosphor, nanophosphor, etc. can be used.

（接合部材）
接合部材５０は、発光素子４０をパッケージ１０に固定させるための部材である。接合部材としては、絶縁性の接合部材、導電性の接合部材のいずれでも用いることができる。絶縁性の接着剤としては、エポキシ樹脂、シリコーン樹脂などが挙げられ、導電性の接着剤としては、銀、金、パラジウムなどの導電性ペーストや、Ａｕ−Ｓｎ共晶Ｓｎ−Ａｇ−Ｃｕなどのはんだ材料、低融点金属等のろう材、Ｃｕ、Ａｇ、Ａｕなどが挙げられる。 (Joining member)
The bonding member 50 is a member for fixing the light emitting element 40 to the package 10. As the bonding member, either an insulating bonding member or a conductive bonding member can be used. Examples of insulating adhesives include epoxy resins and silicone resins. Examples of conductive adhesives include conductive pastes such as silver, gold, and palladium, and Au—Sn eutectic Sn—Ag—Cu. Examples thereof include solder materials, brazing materials such as low melting point metals, Cu, Ag, and Au.

本発明の実施形態に係る発光装置は、各種表示装置、照明器具、ディスプレイ、液晶ディスプレイのバックライト光源、さらには、ファクシミリ、コピー機、スキャナ等における画像読取装置、プロジェクタ装置など、広範囲の用途に利用することができる。   The light-emitting device according to the embodiment of the present invention is used in a wide range of applications such as various display devices, lighting fixtures, displays, backlight light sources of liquid crystal displays, and image reading devices and projector devices in facsimiles, copiers, scanners, and the like. Can be used.

１００…発光装置
１０…パッケージ
１１…側面
１２…底面
１３…凹部
２０…バンプ
２１…ボール部
２２…延伸部
２２ａ…延伸部の上部
２２ｂ…延伸部の下部
３０…光反射樹脂
４０…発光素子
５０…接合部材
６０…封止部材 DESCRIPTION OF SYMBOLS 100 ... Light-emitting device 10 ... Package 11 ... Side surface 12 ... Bottom surface 13 ... Concave 20 ... Bump 21 ... Ball part 22 ... Stretching part 22a ... Upper part of extending part 22b ... Lower part of extending part 30 ... Light reflecting resin 40 ... Light emitting element 50 ... Joining member 60 ... sealing member

Claims (6)

側面と底面とを有する凹部を備えたパッケージと、
前記凹部の底面に載置される発光素子と、
前記発光素子から離間するように前記発光素子の周囲の前記底面上に配置され、ボール部と前記ボール部上の延伸部とを備える複数のバンプであって、上面視において、前記延伸部の上部が前記延伸部の下部よりも外側に位置する前記バンプと、
前記バンプと前記凹部の側面との間に配置され、かつ、前記バンプと前記発光素子との間の前記凹部の前記底面が露出するように配置される光反射樹脂と、
を備える発光装置。 A package with a recess having a side and a bottom;
A light emitting device placed on the bottom surface of the recess;
A plurality of bumps disposed on the bottom surface around the light emitting element so as to be separated from the light emitting element, and including a ball portion and an extending portion on the ball portion, and an upper portion of the extending portion in a top view The bumps located outside the lower portion of the extending portion;
A light reflecting resin disposed between the bump and the side surface of the recess, and disposed so that the bottom surface of the recess between the bump and the light emitting element is exposed;
A light emitting device comprising: 前記バンプと、前記発光素子との距離は、８０μｍ〜５００μｍである、請求項１記載の発光装置。   The light emitting device according to claim 1, wherein a distance between the bump and the light emitting element is 80 μm to 500 μm. 前記延伸部の上部の高さは、前記凹部の前記底面から１５μｍ〜５０μｍに位置する、請求項１又は請求項２記載の発光装置。   3. The light emitting device according to claim 1, wherein a height of an upper portion of the extending portion is located from 15 μm to 50 μm from the bottom surface of the concave portion. 前記発光素子は、接合部材を介して前記凹部の前記底面に固定されており、前記延伸部の上部の高さは、前記接合部材の厚みよりも小さい、請求項１〜請求項３のいずれか一項に記載の発光装置。   The said light emitting element is being fixed to the said bottom face of the said recessed part via the joining member, The height of the upper part of the said extending | stretching part is smaller than the thickness of the said joining member. The light emitting device according to one item. 前記延伸部の長さは、１０μｍ〜５０μｍである、請求項１〜請求項４のいずれか一項に記載の発光装置。   The light emitting device according to claim 1, wherein a length of the extending portion is 10 μm to 50 μm. 前記ボール部は、前記発光素子に近い側の前記ボール部の高さが、前記発光素子から離れた側の前記ボール部の高さよりも薄い、請求項１〜請求項５のいずれか一項に記載の発光装置。   6. The ball portion according to claim 1, wherein a height of the ball portion on a side close to the light emitting element is thinner than a height of the ball portion on a side away from the light emitting element. The light-emitting device of description.
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JPH10112471A (en) * 1996-10-07 1998-04-28 Denso Corp Wire bonding method
JP2000101147A (en) * 1998-09-22 2000-04-07 Nichia Chem Ind Ltd Semiconductor device and manufacture thereof
JP2004071983A (en) * 2002-08-08 2004-03-04 Kaijo Corp Method for forming bump and bump
JP2005136378A (en) * 2003-10-08 2005-05-26 Nichia Chem Ind Ltd Package mold and semiconductor device
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