JP2018129323A - Three-dimensional circuit component and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a three-dimensional circuit component in which a circuit pattern is formed in a fine recessed portion with high accuracy, a large area, and low price while maintaining print position accuracy of a circuit pattern.SOLUTION: In a three-dimensional circuit component 200 having a circuit pattern composed of a conductive ink 106 formed in a fine recessed portion 116 provided in a film-like or sheet-like thermosetting resin, the thickness of the thermosetting resin is 1 μm or more and 400 μm or less and at least a part of the circuit pattern made of the conductive ink is buried in the recessed portion.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a three-dimensional circuit component having a circuit pattern in a minute recess and a method for manufacturing the same.

  In recent years, micro devices having a micro three-dimensional structure such as an acceleration sensor, a crystal resonator, a mirror array device, and a micro flow channel device have been widely used and devices having various micro three-dimensional structures have been commercialized.

  These devices are collectively referred to as MEMS (Micro Electro Mechanical Systems) devices, and include minute uneven shapes, circuit patterns, integrated circuits, and the like on a silicon wafer or a glass substrate.

  As a manufacturing method of these MEMS devices, a semiconductor fine processing technique is mainly used, and each process such as a resist coating process, an exposure process, a wet etching process, or a dry etching process is used.

  In a MEMS device that employs the above manufacturing method, when trying to form a device structure (three-dimensional circuit component) having a circuit pattern in a minute recess, etc., in a resist coating process and an exposure process in the minute recess Since the suitability for patterning tends to deteriorate compared to a flat surface, special processes and apparatuses are used.

  For example, in Patent Document 1, resist coating by spray coating that can prevent resist pinholes from being generated on a substrate having a micro uneven structure and can be applied with a substantially uniform film thickness even if the work has unevenness. It is carried out.

  Further, in Patent Document 2, as a method of forming a circuit pattern in a recess, a circuit pattern is previously formed on a transfer film by printing, the printed transfer film is set in a mold, and a molten resin is injected. A manufacturing method is disclosed in which a wiring pattern can be formed inside a recess.

  However, in the method of Patent Document 1, since the size of the workpiece is at the silicon wafer level, it is difficult to increase the area. In addition, a plurality of processes and apparatuses such as a resist coating process, an exposure process, a developing process, a dry etching process, a wet etching process, and the like are required, and there is a problem that a manufacturing cost increases.

  Further, in the method of Patent Document 2, there is a step of setting the transfer film on the mold during the setting process, and therefore there is a problem that alignment deviation occurs with respect to the mold during film setting and injection molding. Furthermore, it is limited to the thickness of the transfer film on which the circuit pattern is printed in advance, and the shape of the concave portion needs to be increased.

JP 2006-55756 A JP 2011-42106 A

  The present invention has been made in view of the above circumstances, and provides a three-dimensional circuit component in which a circuit pattern is formed in a minute concave portion with high accuracy, a large area, and low cost while maintaining the printing position accuracy of the circuit pattern. Is an issue.

As a means for solving the above problems, the invention according to claim 1 of the present invention is a three-dimensional circuit component comprising a circuit pattern made of conductive ink in a recess formed in a film-like or sheet-like thermosetting resin. Because
The thickness of the thermosetting resin is 1 μm or more and 400 μm or less,
A three-dimensional circuit component characterized in that at least a part of a circuit pattern made of conductive ink is embedded in a recess.

  The invention according to claim 2 of the present invention is characterized in that the circuit pattern is composed of a conductive ink composed of one or more layers, and the thickness of the circuit pattern is 10 μm or less. It is a circuit component.

  The invention according to claim 3 of the present invention is the three-dimensional circuit component according to claim 1, wherein the maximum depth in the recess is 0.1 μm or more and 200.0 μm or less.

Invention of Claim 4 of this invention is a manufacturing method of the three-dimensional circuit component provided with the circuit pattern which consists of conductive ink formed in the recessed part with which the film-form or sheet-like thermosetting resin was equipped, ,
A printing step of printing a circuit pattern made of conductive ink on the convex portion of the mold having the convex portion;
An application step of applying a thermosetting resin before curing onto a mold on which conductive ink is printed;
A curing step of curing the thermosetting resin applied on the mold,
And a peeling step for peeling the cured thermosetting resin from the mold.

  According to a fifth aspect of the present invention, in the method for producing a three-dimensional circuit component according to the fourth aspect, the printing step performs alignment using an alignment mark provided in the mold. It is.

  The invention according to claim 6 of the present invention is the three-dimensional circuit component according to claim 4 or 5, wherein the maximum height of the convex portion of the mold is 0.1 or more and 200.0 μm or less. It is a manufacturing method.

  As described above, according to the present invention, it is possible to provide a three-dimensional circuit component in which a circuit pattern made of conductive ink is formed on a minute recess without using a lithography process with many steps. Become.

  In addition, since the existing printing technique and molding technique can be used, it is easy to increase the area. Furthermore, since the circuit pattern is formed by conducting the alignment directly with the molding die and using the conductive ink, it is possible to provide a three-dimensional circuit component in which the circuit pattern is formed with high precision in a minute recess at a large area and at a low cost.

1 is a side view illustrating a mechanical configuration of a printing apparatus according to an embodiment of the invention. It is a side view which shows an example of the shaping | molding die concerning embodiment of this invention. It is a side view which illustrates arrangement | positioning of the shaping | molding die at the time of shaping | molding which concerns on embodiment of this invention, and a thermosetting resin. It is a side view which illustrates the state where the circuit pattern by the fine recessed part and conductive ink was formed on the surface of the thermosetting resin which concerns on embodiment of this invention. It is a three-dimensional view illustrating a state in which a fine recess and a circuit pattern with conductive ink are formed on the surface of the thermosetting resin according to the embodiment of the present invention. It is a side view which shows an example of the shaping | molding die by the thermosetting resin in the Example of this invention. It is a side view which illustrates arrangement | positioning of the shaping | molding die and thermosetting resin in the Example of this invention. It is sectional drawing which illustrates the state by which the fine line | wire pattern by the fine recessed part and conductive ink was formed on the surface of the silicon resin in the Example of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

(Printing device schematic configuration)
As the printing apparatus according to the embodiment of the present invention, an intaglio offset printing apparatus can be suitably used. In the following, the embodiment of the present invention will be described by taking the case of using an intaglio offset printing apparatus as an example, but it is not meant to be limited to this printing method.

  In FIG. 1, the printing apparatus 100 includes a blanket 105 and a printing plate 102. The blanket 105 is fixed to the surface of a rotatable blanket cylinder 104 and is disposed so that the conductive ink 106 can be transferred to a molding die 108 that is a printing medium.

  The printing plate 102 is fixed to the upper surface of the printing plate fixing surface plate 101, and is disposed at a position where the conductive ink 106 can be transferred to the printing surface of the blanket 105.

  The blanket cylinder 104 is supported by a cart (not shown) so as to be able to rotate and move up and down, and an alignment camera 109 for performing printing positioning is installed on the cart.

  The carriage is supported so as to be movable with respect to the printing plate fixing surface plate 101 and the printing material fixing surface plate 107. A molding die 108 that is a printing medium is fixed to the upper surface of a printing plate fixing surface plate 107.

  The surface of the blanket 105, that is, the printing surface is made of a rubber layer. As the rubber material used for the rubber layer, various materials known as blankets can be used. These rubber materials are selected according to the type of the core material. Silicon rubber having a low surface energy is suitable.

  The rubber layer alone can be used as the blanket 105, but the rubber layer may be provided on the base substrate.

  Note that the rubber layer made of a rubber material can be cured on the base substrate, or the rubber material on the film can be bonded to the base substrate.

  As a base material, since it is attached to the blanket cylinder 104 at the time of printing, there is no limitation on the type as long as it is a flexible film or a thin metal plate, but polyester such as polyethylene terephthalate (PET) due to cost and dimensional stability. A film or a polyimide film is preferred.

  Moreover, a primer layer and an adhesive layer are provided between the base substrate and the silicon rubber layer as necessary. Further, a cushion layer is provided under the base substrate as necessary. A sponge-like material can be used for the cushion layer. The blanket 105 is fixed to the substantially cylindrical blanket cylinder 104 by winding both ends in the width direction with a mounting tool (not shown).

  In the printing plate 102, grooves corresponding to the wiring are formed in a metal plate such as a copper plate or a nickel plate, or a glass plate, and a rubbing resistant film is formed on the surface thereof by chromium plating or carbon plating. The concave portion of the printing plate 102 is filled with the conductive ink 109 at a constant speed by the doctor blade 103.

  In addition, the printing apparatus 100 includes a control unit (not shown) in order to control each unit of the printing apparatus 100. A feed mechanism (not shown) for the blanket cylinder 104, a carriage (not shown) on which the blanket cylinder is supported, a printing plate fixing surface plate 101, and a printing object fixing surface plate 107 are electrically connected to the control unit. Has been.

  The control unit is a well-known computer and includes a CPU, ROM, RAM, input / output port, storage device, display device, input / output device and the like interconnected by a data bus.

  The control unit fills the printing plate 102 with the conductive ink 106 using the doctor blade 103, feeds and rotates the blanket cylinder 104 according to the operation input of the operator, the input from various sensors, and the control program stored in the ROM. The movement, the movement of the carriage on which the blanket cylinder 104 is supported, the operation of the feed plate fixing surface plate 101, the feeding mechanism (not shown) for the printing material fixing surface plate 107, and the drying operation for the blanket 105 are linked. And can be controlled.

(Forming mold)
In FIG. 2, the outer shape of the molding die 108 in this embodiment is a flat plate, and an alignment mark is formed on the molding surface of the molding die 108 for positioning the circuit pattern.
The material of the mold 108 can be appropriately selected from metal, glass, carbon, resin, and composites thereof.

  The uneven structure of the molding material of the molding die 108 and the method of forming the alignment mark are not particularly limited, but differ depending on the molding material. For metal materials, cutting, wet etching, and dry etching are preferred. For glass materials, wet etching and dry etching are preferred. In the resin material, a pressing method or a casting method, an injection molding method, or a UV molding method is also preferable.

  In the mold convex part 110 formed by the method for forming the mold 108, the maximum height of the convex part is preferably in the range of 0.1 to 200.0 μm.

(Printing method on mold)
Next, a printing method that is a first step of patterning conductive ink on a mold using the printing apparatus 100 configured as described above will be described.

  As shown in FIG. 1, the blanket cylinder 104 rolls while rotating in the direction of the arrow (A) in the drawing, and continuously contacts the conductive ink 106 filled in the printing plate 102, whereby the printing surface of the blanket 105. In this case, the conductive ink 106 is transferred. The transfer speed to the blanket 105 can be performed at, for example, 50 mm / s.

  After transferring the conductive ink 106 onto the blanket 105, the mold 108 is fixed to the platen fixing platen 107, and the platen fixing platen 107 is fixed based on the alignment marks formed on the mold 108. Is moved to position the print on the mold 108.

  Thereafter, as shown in FIG. 1, the blanket 105 to which the circuit pattern by the conductive ink 106 has been transferred is pressed against the mold 108 while rotating in the direction of the arrow A in the figure, so that the circuit pattern is formed on the mold protrusion 110 (FIG. 1, FIG. 2). The transfer speed to the mold 108 can be performed at 200 mm / s, for example.

  At this time, the transfer of the circuit pattern to the mold convex part 110 is not necessarily limited to the zenith part of the mold convex part 110, and can be transferred to an arbitrary position such as a tapered portion of the mold convex part 110. .

  Further, the conductive ink 106 remaining on the printing surface of the blanket 105 is removed by a cleaning roller (not shown), for example.

(Method for forming minute recesses and circuit patterns)
Subsequently, as a second step, the uncured thermosetting resin 111 is applied to the upper surface of the mold 108 to which the conductive ink 106 has been transferred (see FIG. 3).

  As a coating method, a known method such as spin coating, screen printing, spray coating, gravure printing, or gravure offset printing can be used. Spin coating and screen printing are particularly suitable. Here, as the thermosetting resin material, it is possible to use thermosetting resins such as phenol resin, epoxy resin, silicon resin, urethane resin and the like alone or in combination such as a mixture or a laminate.

  Thereafter, as a third step, the resin is heated and cured. What is necessary is just to set the heating temperature at the time of hardening to the temperature suitable for every thermosetting resin to be used.

The thickness of the thermosetting resin after curing is preferably 1 μm or more and 400 μm or less.
This is because if the thickness is less than 1 μm and is too thin, the thermosetting resin is likely to be distorted when the mold 108 is pressed, and if it exceeds 400 μm and is too thick, it takes a long time to cure and decreases productivity. is there.

  Next, the thermosetting resin 111 is peeled from the mold 108, whereby a minute recess and a circuit pattern made of the conductive ink 106 are transferred and formed on the surface of the thermosetting resin 111 ( (See FIG. 4).

  Here, in order to transfer the conductive ink 106 to the thermosetting resin 111, the surface of the conductive ink 106 is roughened by using plasma or the like as necessary, and an adhesion improving process such as application of a primer layer is performed. May be.

At this time, as can be seen from FIG. 4, at least a part of the conductive ink 106 forming the circuit pattern is embedded in the surface of the thermosetting resin 111 in the minute recess. FIG. 5 shows an example of a three-dimensional view (also referred to as an overhead view) of FIG. 4 viewed from obliquely above.
As described above, a shape obtained by reversing the shape of the mold can be reproduced, and a circuit pattern with good adhesion can be formed.

  FIG. 6 is a side view showing an example of a mold 108 ′ made of a thermosetting resin. This is an example of a mold 108 ′ in which a thermosetting resin 113 is provided on the surface of a PET film 112, which is a thermoplastic resin film, and the thermosetting resin 113 is molded to form a convex portion 114 made of the thermosetting resin. is there.

  FIG. 7 shows that after forming the conductive ink 106 on the convex portion 114 of the mold of the thermosetting resin, forming and solidifying the silicon resin 115 thereon, the PET film 112, the thermosetting resin, and the thermosetting resin are used. The article illustrated in FIG. 8 can be obtained by peeling the mold formed of the convex portions 114 and the silicon resin 115. This article is an article in which a minute recess is formed on the surface of the film-like silicon resin 115 and a thin line pattern is formed by the conductive ink 106 on the bottom of the minute recess.

  The maximum depth of the minute recess is preferably in the range of 0.1 μm to 200.0 μm.

  This is because if the depth of the minute recess is less than 0.1 μm, it is difficult to form, and if it is deeper than 200.0 μm, peeling from the mold is difficult.

  As described above, a circuit made of conductive ink is formed in a minute recess provided in a film-like or sheet-like thermosetting resin (in the above description, silicon resin is used as an example of the thermosetting resin). It is possible to produce a three-dimensional circuit component formed by embedding a pattern.

  In the above embodiment, the conductive ink circuit pattern was formed using an intaglio or gravure offset printing method, but the printing method is not limited, and known printing techniques such as screen printing and offset printing, On-demand printing means such as inkjet can be used.

  Moreover, in the said embodiment, although transfer was performed using the flat plate-shaped printing plate 102 (refer FIG. 1), you may transfer using not only this but a cylindrical printing plate.

  Moreover, in the said embodiment, although the flat plate-shaped shaping | molding die 108 was used, you may use not only this but a roll-shaped shaping die.

<Example>
First, a mold 108 ′ having a convex portion 114 made of a thermosetting resin 113 on a PET film 112 having a thickness of 200 μm illustrated in FIG. 6 was prepared. The convex portion 114 made of the thermosetting resin used in this example has an elliptical cross-sectional shape, a height from the bottom surface to the apex of 20 μm, an elliptical distance between the apexes of 50 μm, and an elliptical long axis diameter. Is 30 μm.

  The mold 108 ′ is set on the printing plate fixing surface plate 107 of the gravure offset printing apparatus used as the printing apparatus 100 in FIG. 1, and after performing printing positioning by the alignment operation, the fine line pattern by the conductive ink 106 is used. Was printed on the convex portion 114 made of thermosetting resin.

Next, PDMS (polydimethylsiloxane) -based silicon resin 115 (SILPOT184 manufactured by Toray Dow Corning) was applied onto the mold using a spin coater (see FIG. 7). The silicone resin 115 was applied under conditions such that the thickness after curing was 50 μm, and then cured by heating at 150 ° C. for 8 minutes in an oven. After curing, the silicon resin 115 and the mold 108 ′ were finally peeled off with tweezers, and it was confirmed that the conductive ink 106 was transferred to the silicon resin 115.

  The three-dimensional circuit component 200 (see FIG. 8) obtained in this way has a conductive property with a line width of 20 μm formed in a minute recess 116 formed in a silicon resin 115 and having an elliptical cross section of 30 μm wide and 20 μm deep. It was confirmed that a fine line pattern of the ink 106 was formed.

(Other)
The present invention is not limited to the modes shown in the embodiments, and includes all modifications, applications, and equivalents included in the concept of the present invention defined by the claims. Therefore, the present invention should not be construed as being limited, and can be applied to any other technique belonging to the scope of the idea of the present invention.

DESCRIPTION OF SYMBOLS 100 ... Printing apparatus 101 ... Printing plate fixing surface plate 102 ... Printing plate 103 ... Doctor blade 104 ... Blanket cylinder 105 ... Blanket 106 ... Conductive ink 107 ... Printed substrate fixing surface plate 108, 108 '... Mold 109 ... Alignment camera 110 ... Mold convex part 111 ... Thermosetting resin 112 ... PET film 113 ... Thermosetting resin 114 ... Convex part by thermosetting resin 115 ... Silicon resin 116 ... Small concave part 200 ... Three-dimensional circuit component

Claims (6)

A three-dimensional circuit component comprising a circuit pattern made of conductive ink in a recess formed in a film-like or sheet-like thermosetting resin,
The thickness of the thermosetting resin is 1 μm or more and 400 μm or less,
A three-dimensional circuit component, wherein at least part of a circuit pattern made of conductive ink is embedded in a recess.   2. The three-dimensional circuit component according to claim 1, wherein the circuit pattern is made of a conductive ink composed of one or more layers, and the thickness of the circuit pattern is 10 μm or less.   The three-dimensional circuit component according to claim 1, wherein a maximum depth in the concave portion is 0.1 μm or more and 200.0 μm or less. A method for producing a three-dimensional circuit component comprising a circuit pattern made of conductive ink formed in a recess provided in a film-like or sheet-like thermosetting resin,
A printing step of printing a circuit pattern made of conductive ink on the convex portion of the mold having the convex portion;
An application step of applying a thermosetting resin before curing onto a mold on which conductive ink is printed;
A curing step of curing the thermosetting resin applied on the mold,
And a peeling step of peeling the cured thermosetting resin from the mold.   The method for manufacturing a three-dimensional circuit component according to claim 4, wherein the printing step performs alignment using an alignment mark provided in the mold.   The method for manufacturing a three-dimensional circuit component according to claim 4 or 5, wherein the maximum height of the convex portion of the mold is 0.1 or more and 200.0 µm or less.