JP2018127684A - Electroforming filter and production method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electroforming filter and a production method of the electroforming filter that can easily identify whether a surface is to be placed on the upstream side or the downstream side of a fluid flow path.SOLUTION: An electroforming filter, which is arranged in a fluid flow path, comprises a filter base material including an A-surface and a B-surface opposing to the A-surface. The filter base material forms a plurality of through-holes penetrated in the thickness direction of the filter base material. The A surface and the B surface have their own surface asperities so that the A-surface can be distinguished from the B-surface.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an electroformed filter and a method for producing an electroformed filter.

  In an ink jet recording apparatus, ink that has been made into fine droplets by a pressure on-demand method or a charge control method is ejected from a nozzle toward a recording medium such as paper or cloth according to image information and the like. Adhere to. Thereby, an image or the like is recorded on the recording medium. In such an ink jet recording apparatus, it is necessary to further reduce the size of ink droplets in order to realize further high-definition images, and in order to eject micro droplets of about several pL per droplet, It is necessary to further refine the holes themselves.

  In order to stably eject ink from fine nozzle holes, there is no foreign matter in the ink that stagnates the ink flow in the ink jet head, or it adheres to the vicinity of the nozzle holes and deteriorates ejection accuracy. It is important that there is no foreign matter or the like that makes ejection impossible. From this point of view, conventionally, a metal filter for the purpose of removing foreign matters has been provided in the ink flow path of the inkjet head (see Patent Document 1).

  Blood contains many blood cell components such as red blood cells, white blood cells, and platelets. On the other hand, there are only a very small number of circulating cancer cells in the blood, which are tumor cells infiltrated into blood vessels from primary tumors or metastatic tumors. Circulating cancer cells in the blood circulate in the peripheral bloodstream of humans. Therefore, if circulating cancer cells in the blood can be captured in the same state as in the bloodstream, early detection of cancer and early detection of effective drugs are possible. Development is possible. Therefore, conventionally, a metal filter has been used for the purpose of efficiently capturing predetermined cells from blood cell components (see Patent Document 2).

JP 2007-38658 A International Publication No. 2013/054786

  As a metal filter as described above, a predetermined resist pattern is formed on a conductive support such as a copper substrate, and an electroformed layer such as nickel is formed using the conductive support on which the resist pattern is formed as a matrix. Then, an electroformed filter manufactured by removing the resist pattern and the conductive support is exemplified. A large number of holes are formed in the electroformed filter by the resist pattern on the conductive support. By forming the resist pattern on the conductive support in a tapered shape, the hole can be formed in a tapered shape as in the electroformed filter disclosed in Patent Document 1.

  An electroformed filter having a hole formed in a taper shape has one surface (for example, one having a relatively small hole diameter) on the upstream side of the fluid flow path and the other surface (for example, one having a relatively large hole diameter). It is installed in the fluid channel so as to be positioned downstream of the fluid channel. If an electroformed filter is installed with the surface to be positioned upstream of the fluid flow path and the surface to be positioned downstream, the function required for the electroformed filter is effectively expressed. There is a risk that it cannot be done. For example, the surface roughness of the surface to be positioned on the upstream side of the fluid flow path is different from the surface roughness to be positioned on the downstream side, thereby making the wettability with respect to the fluid different, and thereby the fluid passes through the electroformed filter. Occasionally a function to suppress foaming is developed. Therefore, in the electroformed filter, it is required that the surface to be positioned on the upstream side of the fluid flow path and the surface to be positioned on the downstream side can be easily identified.

  In view of the above problems, the present invention provides an electroformed filter capable of easily identifying a surface to be positioned on the upstream side and a surface to be positioned on the downstream side of the fluid flow path, and a method for manufacturing the electroformed filter. The purpose is to provide.

  In order to solve the above-mentioned problems, the present invention is an electroformed filter disposed in a fluid flow path, comprising a filter base material having an A surface and a B surface facing the A surface, and the filter In the base material, a plurality of through holes penetrating in the thickness direction of the filter base material are formed, and the A surface and the B surface are separated to the extent that the A surface and the B surface can be distinguished. Provided are electroformed filters having different surface roughnesses (Invention 1).

  According to the above invention (Invention 1), since the surface roughness of the A surface of the electroformed filter and the surface roughness of the B surface are different from each other, the A surface and the B surface of the electroformed filter, that is, upstream of the fluid flow path. The surface to be positioned on the side and the surface to be positioned on the downstream side can be easily identified.

  In the above invention (Invention 1), the difference between the arithmetic average height Sa of the A surface and the arithmetic average height Sa of the B surface may be 0.01 μm or more (Invention 2). The average height Sa may be 0.005 μm to 0.1 μm, and the arithmetic average height Sa of the B surface may be 0.02 μm to 0.05 μm (Invention 3). The hole diameter of the through hole on the A surface side can be different from the hole diameter of the through hole on the B surface side (Invention 4), and the hole diameter of the through hole on the A surface side and the B surface side can be different. Of the diameters of the through holes, the larger one can be set to 1 μm to 20 μm (Invention 5). The filter substrate only needs to contain at least one metal selected from Au, Pd, Pt, Ag, Ni, Co, Fe, Sn, In, Cr, W, Ta, and Ir (invention 6). The electroformed filter can be used as a filter for an inkjet head (Invention 7).

  In addition, the present invention provides a process for preparing an electroformed layer forming support having a first surface and a second surface facing the first surface; and on the first surface of the electroformed layer forming support. A step of forming a concavo-convex structure including a plurality of convex portions, a step of forming an electroformed layer on the first surface of the electroformed layer forming support on which the concavo-convex structure is formed, and the electric Peeling the cast layer from the electroformed layer forming support, and the surface roughness of the first surface of the electroformed layer forming support is the surface of the electrodeposited growth surface of the electroformed layer Provided is a method for producing an electroformed filter having a different roughness (Invention 8).

  In the above invention (invention 8), the electroformed layer forming support is so arranged that the surface roughness of the first surface of the electroformed layer forming support is different from the surface roughness of the electrodeposited growth surface of the electroformed layer. Preferably, the method further includes a step of performing a surface treatment on the first surface of the body (invention 9), and the size of the bottom of the convex portion and the size of the top of the convex portion may be different from each other (invention). 10). The difference between the arithmetic average height Sa of the first surface of the electroformed layer forming support and the arithmetic average height Sa of the electrodeposited growth surface of the electroformed layer can be 0.01 μm or more (invention). 11). The arithmetic average height Sa of the first surface of the electroformed layer forming support is 0.02 μm to 0.05 μm, and the arithmetic average height Sa of the electrodeposited growth surface of the electroformed layer is 0.005 μm to 0. 1 μm (Invention 12), the arithmetic average height Sa of the first surface of the electroformed layer forming support may be 0.005 μm to 0.1 μm, and the electrodeposited growth surface of the electroformed layer The arithmetic average height Sa may be set to 0.02 μm to 0.05 μm (Invention 13). The electroformed layer may contain at least one metal selected from Au, Pd, Pt, Ag, Ni, Co, Fe, Sn, In, Cr, W, Ta, and Ir (Invention 14).

  Furthermore, the present invention provides a process for preparing an electroformed layer forming support body having a first surface and a second surface facing the first surface, and on the first surface of the electroformed layer forming support body. A step of forming a concavo-convex structure including a plurality of convex portions, a step of forming an electroformed layer on the first surface of the substrate on which the concavo-convex structure is formed, and the electroformed layer as the electroformed layer. A step of peeling from the casting layer forming support, so that the surface roughness of the electrodeposited growth surface of the electroformed layer is different from the surface roughness of the release surface facing the electrodeposition growing surface, Provided is a method for producing an electroformed filter for forming the electroformed layer (Invention 15).

  ADVANTAGE OF THE INVENTION According to this invention, the electrocast filter which can identify easily the surface which should be located in the upstream of a fluid flow path, and the surface which should be located in a downstream, and the manufacturing method of the said electrocast filter are provided. it can.

FIG. 1 is a partially enlarged perspective view showing a schematic configuration of an electroformed filter according to an embodiment of the present invention. FIG. 2 is a cross-sectional end view taken along the line II in FIG. 1, showing a schematic configuration of the electroformed filter according to one embodiment of the present invention. FIG. 3 is a partially enlarged cut end view showing a schematic configuration of an electroformed filter according to an embodiment of the present invention. FIG. 4 is a partially enlarged cross-sectional view for explaining a state where a through hole is blocked by a foreign substance when an electroformed filter according to an embodiment of the present invention is installed in a fluid flow path in the reverse direction. FIG. 5 is a partially enlarged cross-sectional view for explaining a state in which a foreign matter blocking a through hole is removed when an electroformed filter according to an embodiment of the present invention is installed in a fluid flow path in a forward direction. FIG. 6 is a process flow diagram showing each step of the method for manufacturing an electroformed filter according to an embodiment of the present invention at a cut end face. FIG. 7 is a partial cross-sectional view showing a schematic configuration of an ink jet head using an electroformed filter according to an embodiment of the present invention.

  Embodiments of the present invention will be described with reference to the drawings. In the drawings attached to this specification, in order to facilitate understanding, the shape, scale, vertical / horizontal dimensional ratio, etc. of each part may be changed from the actual one or may be exaggerated. In the present specification and the like, a numerical range expressed using “to” means a range including each of the numerical values described before and after “to” as a lower limit value and an upper limit value. In this specification and the like, terms such as “film”, “sheet”, and “plate” are not distinguished from each other on the basis of the difference in names. For example, the “plate” is a concept including members that can be generally called “sheet” and “film”.

  FIG. 1 is a partially enlarged perspective view showing a schematic configuration of an electroformed filter according to this embodiment, and FIG. 2 shows a schematic configuration of the electroformed filter according to this embodiment. FIG. 3 is a partially cut end view showing a schematic configuration of the electroformed filter according to the present embodiment.

  As shown in FIGS. 1 to 3, the electroformed filter 10 according to this embodiment includes a filter base 11 having an A surface 11 </ b> A and a B surface 11 </ b> B facing the A surface 11 </ b> A. A plurality of through holes 12 penetrating in the thickness direction of the filter base 11 are formed. The electroformed filter 10 according to the present embodiment is disposed in a fluid flow path in order to capture foreign matter or the like in the fluid. For example, the ink flow path 60 in the inkjet head 50 (see FIG. 7). ), Disposed in a blood flow path in a blood cell component separation system for capturing blood cell components, a dust filtration device in the air, and the like.

  In the present embodiment, the hole diameter of the through hole 12 on the A surface 11A side of the filter base 11 is configured to be smaller than the hole diameter of the through hole 12 on the B surface 11B side. That is, the through hole 12 is formed in a tapered shape in which the hole diameter gradually increases from the A surface 11A side toward the B surface 11B side. When the electroformed filter 10 according to the present embodiment is disposed in the ink flow path 60 of the inkjet head 50 as described later (see FIG. 7), the hole diameter of the through hole 12 on the A surface 11A side is It is preferably smaller than the hole diameter of the nozzle hole 541. Since the hole diameter of the through hole 12 is smaller than the hole diameter of the nozzle hole 541, foreign matters that can be clogged or adhered to the nozzle hole 541 can be reliably captured by the electroformed filter 10.

  In addition, it is not limited to the said aspect, The hole diameter of the through-hole 12 in the A surface 11A side is larger than the hole diameter of the through-hole 12 in the B surface 11B side, and goes to the B surface 11B side from the A surface 11A side. You may form in the reverse taper shape from which a hole diameter reduces gradually.

  The hole diameter of the through hole 12 on the A surface 11A side of the filter base 11 (the larger of the hole diameter of the through hole 12 on the A surface 11A side and the hole diameter of the through hole 12 on the B surface 11B side) is: It can be set as appropriate according to the application of the electroformed filter 10 according to the present embodiment. For example, when the electroformed filter 10 is disposed in the ink flow path 60 in the inkjet head 50, the hole diameter can be set to about 1 μm to 20 μm. The pitch of the through holes 12 (the length between the centers of the adjacent through holes 12) is not particularly limited, and can be set to, for example, about 1 μm to 20 μm.

  The material constituting the filter base material 11 is not particularly limited. For example, metals such as Au, Pd, Pt, Ag, Ni, Co, Fe, Sn, In, Cr, W, Ta, Ir, It is sufficient that it is made of an alloy containing at least one of these metals, but it is preferably made of a metal having excellent chemical resistance such as Au, Pd—Ni alloy, Pd—Co alloy. . When the material which comprises the filter base material 11 is a palladium (Pd) -nickel (Ni) alloy, the Pd content rate in the said filter base material 11 can be set to about 50 wt%-80 wt%. When the electroformed filter 10 according to the present embodiment is disposed in the ink flow path 60 in the inkjet head 50 and the ink is an ink for printing on a cloth, the ink includes acid and Since a relatively large amount of solvent is contained, the filter base material 11 is made of a metal having excellent chemical resistance, thereby suppressing the filter base material 11 from being corroded by an acid or a solvent contained in the ink. can do.

  The surface roughness of the A surface 11A of the filter substrate 11 and the surface roughness of the B surface 11B are different from each other to the extent that the A surface 11A and the B surface 11B can be distinguished. The ability to distinguish between the A surface 11A and the B surface 11B means that the A surface 11A and the B surface 11B can be identified by optical means, and for example, both can be identified using an optical microscope. However, it is preferable that both can be identified by the naked eye.

  For example, the arithmetic average height Sa of the A surface 11A is preferably 0.005 μm to 0.1 μm, and the arithmetic average height Sa of the B surface 11B is preferably 0.02 μm to 0.05 μm. The difference between the arithmetic average height Sa of the A surface 11A and the arithmetic average height Sa of the B surface 11B is preferably 0.01 μm or more, and more preferably 0.02 μm to 0.1 μm. Since the arithmetic average height Sa of the A surface 11A and the arithmetic average height Sa of the B surface 11B and the difference between them are within the above range, the A surface 11A and the B surface 11B can be easily identified by the naked eye. it can.

  In addition, it is not limited to the said aspect, The arithmetic mean height Sa of A surface 11A is 0.02 micrometer-0.05 micrometer, Comprising: The arithmetic mean height Sa of B surface 11B is 0.005 micrometer-0.1 micrometer. It may be.

  The development area ratio Sdr between the A surface 11A and the B surface 11B of the filter base 11 is preferably 0.01 to 0.02. Since both of the A surface 11A and the B surface 11B have a predetermined surface roughness (for example, arithmetic average height Sa), the development area ratio Sdr thereof can be set within the above range, whereby the present embodiment For example, the electroformed filter 10 according to the above can be firmly incorporated into the ink flow path 60 of the inkjet head 50 via an adhesive or the like.

  When the electroformed filter 10 according to the present embodiment is disposed in the ink flow path 60 in the inkjet head 50, A is a surface having a relatively small hole diameter of the through hole 12 in the filter base 11. The electroformed filter so that the surface 11A is located on the upstream side of the ink flow path 60 and the B surface 11B, which is the surface with the larger diameter of the through hole 12, is located on the downstream side of the ink flow path 60. 10 is disposed in the ink flow path 60. By arranging in this way, it is possible to prevent the foreign matter 80 captured by the electroformed filter 10 from clogging the through hole 12. When the B surface 11B of the filter base 11 is located on the upstream side, as shown in FIG. 4, the foreign matter 80 may be fitted into the forward tapered through-hole 12 from upstream to downstream, causing clogging. If the foreign material 80 is soft, there is a possibility that it cannot be captured. On the other hand, when the A surface 11A of the filter base material 11 is positioned on the upstream side, the through hole 12 on the A surface 11A side of the filter base material 11 is blocked as shown in FIGS. 5 (A) and (B). However, since the foreign matter 80 can be easily moved by the flow of ink near the boundary between the outer edge of the through-hole 12 and the foreign matter 80 (arrows shown in FIGS. 5A and 5B), the through-hole 12 is clogged. Can be prevented. 4, 5 </ b> A, and 5 </ b> B, the upper side in the figure is the upstream side of the fluid flow path, and the lower side is the downstream side of the fluid flow path.

  The thickness of the filter base material 11 is not specifically limited, For example, it may be set to about 1 micrometer-10 micrometers. The shape and size of the filter base 11 can be appropriately set according to the application of the electroformed filter 10 according to the present embodiment.

  In addition, A surface 11A of the filter base material 11 in the electroformed filter 10 according to the present embodiment corresponds to an electrodeposition growth surface in the manufacturing process of the electroformed filter 10 (see FIG. 6). In this case, the A surface 11A is slightly convexly curved between adjacent through holes 12, and the outer edge of the through hole 12 is configured to be rounded (see FIG. 3). When the B surface 11B of the filter substrate 11 corresponds to the electrodeposition growth surface, naturally, the B surface 11B is slightly convexly curved between the adjacent through holes 12, and the outer edge of the through hole 12 is Configured to be rounded.

  According to the electroformed filter 10 according to the present embodiment having the above-described configuration, the surface roughness (for example, arithmetic average height Sa) of the A surface 11A of the filter base 11 and the surface roughness (for example, arithmetic) of the B surface 11B. Since the average height Sa) is different from each other to such an extent that they can be identified, the A surface 11A and the B surface 11B can be easily identified. Therefore, when the electroformed filter 10 is disposed, for example, in the ink flow path 60 of the inkjet head 50, the A surface 11A to be positioned on the upstream side of the ink flow path 60 and the B surface 11B to be positioned on the downstream side. The electroformed filter 10 can be reliably incorporated into the ink flow path 60 without misunderstanding.

  The electroformed filter 10 according to this embodiment can be manufactured as described below. FIG. 6 is a process flow diagram showing each process of the method for manufacturing the electroformed filter 10 according to the present embodiment at a cut end face.

  First, an electroformed layer forming support 20 having a first surface 201 on which the electroformed layer 10 ′ is formed and a second surface 202 facing the first surface 201 is prepared (see FIG. 6A). As the electroformed layer forming support 20, a support having at least the first surface 20A having conductivity can be used. For example, a conductive metal substrate such as a copper substrate, a stainless steel substrate, an aluminum substrate, or an iron substrate. A semiconductor substrate such as a silicon wafer or a silicon carbide wafer, or a conductive layer provided on the first surface 201 of the semiconductor substrate; a conductive layer provided on the first surface 201 of an insulating substrate such as glass or ceramics; And the like.

  The surface roughness of the first surface 201 is obtained by subjecting at least the first surface 201 of the electroformed layer forming support body 20 (or the conductive layer in the case where a conductive layer is provided on the first surface 201) to surface treatment. Is adjusted to a predetermined range. Examples of the surface treatment applied to the first surface 201 include immersion of the electroformed layer forming support 20 in a chemical polishing solution, and application of the chemical polishing solution to the first surface 201 of the electroformed layer forming substrate 20. Examples include chemical polishing treatment by spraying. The chemical polishing liquid is not particularly limited as long as the surface roughness (for example, the arithmetic average height Sa) of the first surface 201 of the electroformed layer forming support 20 can be adjusted to a predetermined range. For example, formic acid A system chemical polishing liquid, a perhydrosulfuric acid type chemical polishing liquid, or the like can be used. In this way, by performing a surface treatment on at least the first surface 201 of the electroformed layer forming support 20, the arithmetic average height Sa of the first surface 201 is adjusted to about 0.02 μm to 0.05 μm. Can do. The arithmetic average height Sa of the first surface 201 of the electroformed layer forming base material 20 is the base material contact surface of the electroformed layer 10 ′ formed in a subsequent process, that is, the filter base material 11 of the electroformed filter 10. Is transferred to the B side. Prior to the surface treatment on the first surface 201 of the electroformed layer forming support 20, an alkaline degreasing treatment or the like may be performed.

  It is not limited to the said aspect, surface treatment is performed to at least the 1st surface 201 of the support body 20 for electroformed layer formation, and arithmetic mean height Sa of the 1st surface 201 is adjusted to about 0.005-0.1 micrometer. Also good.

  Next, a resist layer 30 is formed on the first surface 201 of the electroformed layer forming support 20 (see FIG. 6B). The method of forming the resist layer 30 may be a method of laminating a dry film resist on the first surface 201, or a method of applying a liquid resist to the first surface 201. As the resist material constituting the resist layer 30, a known active energy ray (ultraviolet ray, electron beam, etc.) sensitive resist material or the like can be used.

  Then, the resist layer 30 is exposed and developed to form a resist pattern 31 including a plurality of convex portions (see FIG. 6C). The electroformed layer forming support 20 having the resist pattern 31 serves as an electroformed mother mold for forming the through holes 12 of the electroformed filter 10. Therefore, the dimension, height, and the like of the convex portion of the resist pattern 31 are appropriately set according to the thickness of the electroformed filter 10, the hole diameter, the pitch, and the like of the through holes 12. In addition, the dimension of a convex part shall mean a diameter, if the shape of a convex part is planar view substantially circular shape, for example, and if it is planar view substantially rectangular shape, it shall mean the length of a diagonal line. Further, by appropriately adjusting the exposure conditions, the resist pattern 31 is formed into a forward tapered shape in which the size of the bottom of the convex portion is larger than the size of the top portion or a reverse tapered shape in which the size of the bottom portion of the convex portion is smaller than the size of the top portion. Can be formed.

  Subsequently, the electroformed layer forming support 20 is immersed in the electroforming liquid in the electroforming tank, and the electroformed layer 10 ′ is formed on the first surface 201 of the electroformed layer forming support 20 (FIG. 6). (See (D)). Examples of the metal material contained in the electroforming liquid include metals such as Au, Pd, Pt, Ag, Ni, Co, Fe, Sn, In, Cr, W, Ta, and Ir, and at least one of them. And a metal material excellent in chemical resistance such as Au, Pd—Ni alloy, Pd—Co alloy and the like. When the metal material contained in the electroforming liquid is a Pd—Ni alloy, the Pd content ratio in the alloy can be set to about 50 wt% to 80 wt%. Electroforming conditions (for example, current density, pH and temperature of electroforming liquid) when forming the electroformed layer 10 ′ are not particularly limited, but the electroforming conditions (for example, current density) are appropriately set. By adjusting, the surface roughness (for example, the arithmetic average height Sa) of the electrodeposited growth surface of the electroformed layer 10 ′ formed on the first surface 201 of the electroformed layer forming support 20 is set within a predetermined range ( 0.005 μm to 0.1 μm).

  In addition, it is not limited to the said aspect, Surface roughness of the electrodeposition growth surface of the electroformed layer 10 'formed on the 1st surface 201 of the electrocast layer forming support body 20 by adjustment of electroforming conditions The height (for example, the arithmetic average height Sa) may be set within a predetermined range (0.02 μm to 0.05 μm).

  The resist pattern 31 is removed from the electroformed layer forming support 20 on which the electroformed layer 10 ′ is formed (see FIG. 6E), and the electroformed layer forming support 20 is removed from the electroformed layer 10 ′. (See FIG. 6F). Thereby, the electroformed filter 10 according to the present embodiment is manufactured.

  In the method for producing an electroformed filter in the present embodiment, the surface roughness (for example, arithmetic average height Sa) of the first surface 201 is obtained by subjecting the first surface 201 of the electroformed layer forming support 20 to surface treatment. ) Is adjusted to a predetermined range. By forming the electroformed layer 10 ′ on the first surface 201, the surface roughness of the first surface 201 is transferred to the base material contact surface of the electroformed layer 10 ′, and the filter base material of the electroformed filter 10. The surface roughness (for example, arithmetic average height Sa) of the 11 B surfaces 11B can be set within a predetermined range. On the other hand, the surface roughness (for example, the arithmetic average height Sa) of the electrodeposited growth surface of the electroformed layer 10 ′, that is, the A surface 11A of the filter base 11 of the electroformed filter 10, is determined by the electroformed layer forming condition (for example, It can be set within a predetermined range by adjusting (current density). Therefore, according to the method for producing an electroformed filter in the present embodiment, the surface roughnesses of the A surface 11A and the B surface 11B of the filter base 11 are different from each other to such an extent that they can be identified. The filter 10 can be easily manufactured.

  Next, an ink jet head using the electroformed filter 10 according to this embodiment will be described. FIG. 7 is a cross-sectional view showing a schematic configuration of the ink jet head in the present embodiment.

  The inkjet head 50 includes a cavity plate 51, a base plate 52, a manifold plate 53, and a nozzle plate 54, and these plates 51 to 54 are laminated and joined.

  The cavity plate 51 is formed with a pressure chamber 63 having a substantially oval shape in plan view. The base plate 52 is formed with a first communication hole 62 and a second communication hole 64 located at both ends in the longitudinal direction of the pressure chamber 63. A manifold channel 61 is formed in the manifold plate 53. The manifold channel 61 communicates with the ink tank, and ink is supplied from the ink tank to the manifold channel 61. A third communication hole 65 is formed at the opposite end of the manifold channel 61 in the longitudinal direction of the manifold plate 53.

  In the nozzle plate 54, nozzles 542 having nozzle holes 541 having a diameter of about 5 μm to 50 μm are formed. The manifold channel 61 communicates with the pressure chamber 63 via the first communication hole 62, and the pressure chamber 63 communicates with the nozzle 542 via the second communication hole 64 and the third communication hole 65. The ink flow path 60 is formed by the manifold flow path 61, the first communication hole 62, the pressure chamber 63, the second communication hole 64, the third communication hole 65, and the nozzle 542. The electroformed filter 10 according to this embodiment is installed in the first communication hole 62 of the ink flow path 60. The electroformed filter 10 only needs to be installed in at least one of the ink flow paths 60, may be installed in the second communication hole 64, or is installed in the third communication hole 65. May be.

  On the upper surface of the cavity plate 51, a vibration plate 71, a piezoelectric layer 72, and an electrode 73 are laminated in this order. When a drive pulse as a drive signal is applied to the electrode 73, the piezoelectric layer 72 is vibrated and deformed, and the deformation is transmitted to the vibration plate 71. The pressure chamber 63 is compressed by the deformation of the vibration plate 71. As a result, pressure is applied to the ink in the pressure chamber 63, and the ink is ejected as droplets from the nozzle hole 541 of the nozzle 542.

  In the ink jet head 50, the electroformed filter 10 according to the present embodiment is disposed in the first communication hole 62, so that the ink in the manifold channel 61 includes foreign matter or the like. Since it is captured by the filter 10 made from production, the nozzle hole 541 can be prevented from being clogged. And since the electrocast filter 10 which concerns on this embodiment has the surface roughness of A surface 11A and B surface 11B mutually different to such an extent that the A surface 11A and B surface 11B of the filter base material 11 are distinguishable. When the electroformed filter 10 is incorporated into the inkjet head 50, the surface to be positioned on the upstream side (manifold channel 61 side) and the surface to be positioned on the downstream side (pressure chamber 63 side) are mistakenly recognized. Can be prevented.

  Further, when the surface roughness of the A surface 11A of the electroformed filter 10 according to this embodiment is larger than the surface roughness of the B surface 11B, the wettability of the A surface 11A with respect to the ink is wet with respect to the ink of the B surface 11B. Lower than sex. In such an aspect, in the inkjet head 50 according to the present embodiment, even if bubbles are mixed during ink filling or the like, it is easy to transmit the bubbles toward the nozzle hole 541. An effect that bubbles mixed in ink can be removed can also be achieved.

  The embodiment described above is described for facilitating understanding of the present invention, and is not described for limiting the present invention. Therefore, each element disclosed in the above embodiment is intended to include all design changes and equivalents belonging to the technical scope of the present invention.

  In the said embodiment, although the surface roughness of the said 1st surface 201 is prepared by performing the chemical polishing process to the 1st surface 201 of the support body 20 for electroformed layer formation, it is limited to this aspect is not. For example, the electroformed layer 10 ′ is formed using the electroformed layer forming support 20 that is not subjected to the surface treatment on the first surface 201, and the substrate contact surface in the obtained electroformed layer 10 ′ is formed. By performing the surface treatment, the surface roughness (for example, the arithmetic average height Sa) of the base material contact surface and the electrodeposition growth surface of the electroformed layer 10 ′ may be made different from each other so that they can be identified. Good. Moreover, the surface roughness (for example, arithmetic average height Sa) of the electrodeposition growth surface of electroformed layer 10 'is controlled by controlling the electroforming conditions (for example, current density etc.) at the time of forming electroformed layer 10'. The surface roughness of each of the A surface 11A and the B surface 11B of the filter base 11 may be controlled so that they can be identified.

  EXAMPLES Hereinafter, although an Example etc. are given and this invention is demonstrated further in detail, this invention is not limited to the following Example etc. at all.

[Example 1]
A copper-nickel-chromium alloy sputter layer as a conductive layer is formed on the first surface of the polyimide resin substrate by a sputtering method, and a copper plating layer is formed on the copper-nickel-chromium alloy sputter layer by an electroplating method. A support for forming an electroformed layer was prepared. The arithmetic average height Sa of the copper plating layer of the electroformed layer forming support was determined to be 0.025 μm using a laser microscope VK-X260 (manufactured by Keyence Corporation).

  A resist pattern (diameter size: 10 μm, height: 10 μm) was formed on the copper plating layer of the electroformed layer forming support. The electroformed layer forming support on which the resist pattern was formed was immersed in a Pd—Ni electroforming solution (Pd content ratio: 60 wt%) to form an electroformed layer on the copper plating layer. The resist pattern was removed from the electroformed layer forming support on which the electroformed layer was formed, and finally the electroformed layer forming support was removed, whereby the electroformed filter 10 was manufactured.

  Arithmetic mean heights of the A surface 11A (electrodeposited growth surface in the electroformed layer) and the B surface 11B (substrate contact surface in the electroformed layer) of the filter base 11 of the electroformed filter 10 thus obtained. Sa was determined using a laser microscope VK-X260 (manufactured by Keyence Corporation).

  The arithmetic average height Sa of the A surface 11A was 0.038 μm, and the arithmetic average height Sa of the B surface 11B was 0.024 μm. When the A surface 11A and the B surface 11B of the electroformed filter 10 were observed with the naked eye, it was confirmed that they could be identified.

[Example 2]
An electroformed filter 10 was produced in the same manner as in Example 1 except that a Pd—Ni electroforming solution containing a brightener (Pd content ratio: 60 at%) was used, and the filter base material of the electroformed filter 10 was used. The arithmetic average height Sa of 11 A surface 11A (electrodeposition growth surface in an electroformed layer) and B surface 11B (base material contact surface in an electroformed layer) was determined.

  The arithmetic average height Sa of the A surface 11A was 0.012 μm, and the arithmetic average height Sa of the B surface 11B was 0.024 μm. When the A surface 11A and the B surface 11B of the electroformed filter 10 were observed with the naked eye, it was confirmed that they could be identified.

Example 3
A copper surface treatment agent (CZ-8100, manufactured by MEC) was sprayed on the copper plating layer of the electroformed layer forming support (spraying time: 20 sec), and the copper plating layer was subjected to a roughening treatment. The arithmetic average height Sa of the copper plating layer after the roughening treatment was determined to be 0.041 μm.

  An electroformed filter 10 was produced in the same manner as in Example 1 except that the electroformed layer forming support after the roughening treatment was used, and the A surface 11A ( The arithmetic average height Sa of the electrodeposition growth surface in the electroformed layer) and the B surface 11B (substrate contact surface in the electroformed layer) was determined.

  The arithmetic average height Sa of the A surface 11A was 0.084 μm, and the arithmetic average height Sa of the B surface 11B was 0.035 μm. When the A surface 11A and the B surface 11B of the electroformed filter 10 were observed with the naked eye, it was confirmed that they could be identified.

Example 4
Except that the spraying time of the copper surface treatment agent was changed to 15 seconds, an electroformed filter 10 was produced using the electroformed layer forming support after the roughening treatment in the same manner as in Example 3, and the electroforming was performed. The arithmetic average height Sa of the A surface 11A (electrodeposition growth surface in the electroformed layer) and the B surface 11B (substrate contact surface in the electroformed layer) of the filter base 11 of the filter 10 was determined.

  The arithmetic average height Sa of the A surface 11A was 0.059 μm, and the arithmetic average height Sa of the B surface 11B was 0.031 μm. When the A surface 11A and the B surface 11B of the electroformed filter 10 were observed with the naked eye, it was confirmed that they could be identified.

[Comparative Example 1]
A support for forming an electroformed layer was prepared by forming a copper sputter layer as a conductive layer on the first surface of the glass substrate by a sputtering method. When the arithmetic average height Sa of the copper sputter layer of the electroformed layer forming support was determined in the same manner as in Example 1, it was 0.004 μm.

  An electroformed filter was produced in the same manner as in Example 1 except that the electroformed layer forming support was used, and the A side (electrodeposited growth surface in the electroformed layer) and B side of the electroformed filter. The arithmetic average height Sa of (the substrate contact surface in the electroformed layer) was determined. The arithmetic average height Sa of the A surface was 0.012 μm, and the arithmetic average height Sa of the B surface was 0.004 μm. When the A and B surfaces of the electroformed filter were observed with the naked eye, they could not be identified.

[Comparative Example 2]
An electroformed layer forming support was prepared by forming a copper sputter layer as a conductive layer on the first surface of a silicon wafer by sputtering. When the arithmetic average height Sa of the copper sputter layer of the electroformed layer forming support was determined in the same manner as in Example 1, it was 0.007 μm.

  An electroformed filter was produced in the same manner as in Example 1 except that the electroformed layer forming support was used, and the A side (electrodeposited growth surface in the electroformed layer) and B side of the electroformed filter. The arithmetic average height Sa of (the substrate contact surface in the electroformed layer) was determined. The arithmetic average height Sa of the A surface was 0.012 μm, and the arithmetic average height Sa of the B surface 11B was 0.007 μm. When the A and B surfaces of the electroformed filter were observed with the naked eye, they could not be identified.

  As is clear from the results of Examples 1 to 4 and Comparative Examples 1 and 2, the surface roughnesses of the surface A and the surface B of the filter base of the electroformed filter are mutually reciprocally identifiable. The difference in surface roughness (arithmetic mean roughness Sa) is 0.01 μm or more, the arithmetic mean roughness Sa of the A side is about 0.005 μm to 0.1 μm, and the arithmetic mean roughness of the B side It was confirmed that the surface A and the surface B can be identified with the naked eye by setting the thickness Sa to about 0.02 μm to 0.05 μm.

DESCRIPTION OF SYMBOLS 10 ... Electroformed filter 11 ... Filter base material 11A ... A surface 11B ... B surface 12 ... Through-hole 50 ... Inkjet head

Claims (15)

An electroformed filter disposed in a fluid flow path,
A filter substrate having an A surface and a B surface facing the A surface,
A plurality of through holes penetrating in the thickness direction of the filter base material are formed in the filter base material,
An electroformed filter in which the surface roughnesses of the A surface and the B surface are different from each other to such an extent that the A surface and the B surface can be distinguished.   2. The electroformed filter according to claim 1, wherein a difference between the arithmetic average height Sa of the A surface and the arithmetic average height Sa of the B surface is 0.01 μm or more.   The electroforming according to claim 1 or 2, wherein the arithmetic average height Sa of the A surface is 0.005 µm to 0.1 µm, and the arithmetic average height Sa of the B surface is 0.02 µm to 0.05 µm. Made filter.   The electroformed filter according to any one of claims 1 to 3, wherein a hole diameter of the through hole on the A surface side is different from a hole diameter of the through hole on the B surface side.   5. The electroformed filter according to claim 4, wherein a larger one of a diameter of the through hole on the A surface side and a diameter of the through hole on the B surface side is 1 μm to 20 μm.   The filter base material according to any one of claims 1 to 5, wherein the filter base material includes at least one metal selected from Au, Pd, Pt, Ag, Ni, Co, Fe, Sn, In, Cr, W, Ta, and Ir. The electroformed filter described in 1.   The electroformed filter according to claim 1, wherein the electroformed filter is an inkjet head filter. Preparing an electroformed layer forming support having a first surface and a second surface facing the first surface;
Forming a concavo-convex structure including a plurality of convex portions on the first surface of the electroformed layer forming support;
Forming an electroformed layer on the first surface of the electroformed layer forming support on which the uneven structure is formed;
Separating the electroformed layer from the electroformed layer forming support,
The method for producing an electroformed filter, wherein the surface roughness of the first surface of the electroformed layer forming support is different from the surface roughness of the electrodeposited growth surface of the electroformed layer.   The surface on the first surface of the electroformed layer forming support is such that the surface roughness of the first surface of the electroformed layer forming support is different from the surface roughness of the electrodeposited growth surface of the electroformed layer. The method for producing an electroformed filter according to claim 8, further comprising a step of performing a treatment.   The method for manufacturing an electroformed filter according to claim 8 or 9, wherein a dimension of a bottom part of the convex part and a dimension of a top part of the convex part are different from each other.   The difference between the arithmetic average height Sa of the first surface of the electroformed layer forming support and the arithmetic average height Sa of the electrodeposited growth surface of the electroformed layer is 0.01 µm or more. The manufacturing method of the electroformed filter in any one of -10.   The arithmetic average height Sa of the first surface of the electroformed layer forming support is 0.02 μm to 0.05 μm, and the arithmetic average height Sa of the electrodeposited growth surface of the electroformed layer is 0.005 μm. The method for producing an electroformed filter according to any one of claims 8 to 11, which is?   The arithmetic average height Sa of the first surface of the electroformed layer forming support is 0.005 μm to 0.1 μm, and the arithmetic average height Sa of the electrodeposited growth surface of the electroformed layer is 0.02 μm. The method for producing an electroformed filter according to any one of claims 8 to 11, which is?   The electroformed layer includes at least one metal selected from Au, Pd, Pt, Ag, Ni, Co, Fe, Sn, In, Cr, W, Ta, and Ir. The manufacturing method of the filter made from electroforming as described in 2. Preparing an electroformed layer forming support having a first surface and a second surface facing the first surface;
Forming a concavo-convex structure including a plurality of convex portions on the first surface of the electroformed layer forming support;
Forming an electroformed layer on the first surface of the base material on which the uneven structure is formed;
Separating the electroformed layer from the electroformed layer forming support,
A method for producing an electroformed filter, wherein the electroformed layer is formed such that the surface roughness of the electrodeposited growth surface of the electroformed layer is different from the surface roughness of the release surface facing the electrodeposition grown surface. .

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