JP2018125092A - Forming method of functional layer and substrate for forming the functional layer - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method of a functional layer of an organic light emitting element, capable of more precisely measuring landing displacement of an ink droplet with a simple method, while suppressing deterioration of a manufacturing method.SOLUTION: The present invention provides a method for manufacturing a functional layer formation substrate 10 by discharging an ink droplet 222 containing a functional material from a nozzle 125 to a coating planned region 15a between a plurality of separation walls 15 arranged in parallel with each other with an interval therebetween in a row direction in a display panel planned part 211 of a coated substrate 200. The coated substrate 200 includes an inspection part 212 including an entirely flat upper surface 15bs on which a contact angle of the ink is smaller than that at a surface 15s of the separation walls 15, in addition to a display panel planned part 211. At a step of discharging the ink droplet 222, displacement of a target landing position 221 and a landing position 0 is measured by discharging the ink droplet 222 to the inspection part 212. If the displacement exceeds a predetermined threshold value, the occurrence of the displacement is resolved, and the ink droplet 222 is discharged to the display panel planned part 211 of the same or another coated substrate 200.SELECTED DRAWING: Figure 11

Description

  The present disclosure relates to a method for forming a functional layer and a functional layer forming substrate, and more particularly to a functional layer by a manufacturing method using an inkjet method.

In an organic EL display panel in which organic EL (Electroluminescence) elements are arranged in a matrix on a substrate, an image is displayed by using light emission of each organic EL element as a pixel.
The organic EL element has a structure in which a functional layer containing a functional material, for example, an organic light emitting layer containing an organic light emitting material is sandwiched between a pair of electrodes. In addition to the organic light emitting layer, the functional layer includes a hole / electron injection layer, a hole / electron transport layer, a hole / electron blocking layer, a buffer layer, and the like. The function is determined by.

  The method for forming these functional layers is roughly classified into a dry process such as a vacuum deposition method and a wet process such as an ink jet method. The wet process is a method using ink in which a functional material is included in an organic solvent, and is regarded as a technique suitable for increasing the resolution and size of an organic EL display panel from the viewpoint of formation accuracy and cost of the functional layer. Yes. In particular, in a wet process, an ink jet method that discharges ink to a region to be coated on which a functional layer is to be formed while relatively scanning a nozzle capable of discharging ink as fine droplets along the upper surface of the substrate. Development is progressing.

  In the inkjet method, a plurality of nozzles arranged in a line are used from the viewpoint of manufacturing efficiency, but the number of nozzles used in accordance with the increase in resolution and size of the display panel is in the tens of thousands. From these many nozzles, the ink landing position deviated significantly from the design value (target position) due to factors such as the viscosity increase of the ink in the device over time, bubbles in the nozzle, adhesion of dry ink and foreign matter, etc. A defective nozzle may occur. The ink droplet landing deviation (deviation of the landing position from the target position) causes non-uniform film thickness and color mixing, and causes deterioration in the quality of the organic EL display panel. Therefore, Patent Document 1 discloses a method for inspecting landing position deviation using an inspection substrate.

  Further, Patent Document 2 discloses a method for inspecting landing deviation by ejecting ink droplets on a bank (partition wall) between pixel regions outside or between adjacent pixel regions.

JP 2011-65856 A JP2012-15098A

However, in the method disclosed in the cited document 1, it is necessary to stop the production line once, install the inspection substrate in the ink jet apparatus, and perform the inspection.
When the functional layer is formed by the ink jet method, usually, the liquid repellency with respect to the ink on the bank surface is increased, that is, the contact angle of the ink (hereinafter simply referred to as “contact angle”) is increased to achieve the target. Even when the ink droplet lands at a position slightly deviated from the position, the ink droplet easily flows into the pixel region. When ink droplets are ejected onto a bank between adjacent pixel regions as in the method disclosed in the cited document 2, there is a possibility that the ink droplets unintentionally flow into the pixel regions. Even when ink droplets are applied on the bank outside the pixel area, the contact angle on the bank surface is high (high liquid repellency), so the ink looks like water droplets falling on a lotus leaf. There is a problem that liquid droplets are easily moved from the landing position and it is difficult to accurately measure the deviation of the landing position.

However, if the ink application area for inspection is formed of a material with a small contact angle (low liquid repellency) for the inspection of ink droplet landing deviation, the number of processes and the types of materials increase, and the production efficiency decreases. To do.
Therefore, an object of the present disclosure is to provide a method for forming a functional layer that can more accurately measure landing deviation of ink droplets by a simple method while suppressing a decrease in manufacturing efficiency.

  The functional layer forming method according to one embodiment of the present disclosure includes an ink in which a functional material is dissolved in a solvent with respect to a predetermined coating region between a plurality of partition walls arranged in parallel in the row direction on a coating substrate. Are discharged from a plurality of nozzles to form a functional layer having a plurality of light emitting regions, and the coated substrate has a functional layer formation scheduled portion where the functional layer is to be formed, In the process of ejecting ink droplets, the ink contact angle is smaller than the partition wall surface and has a flat surface on the entire surface. The ink droplets are ejected, and the deviation between the target landing position and the actual landing position of the ink droplet is measured. , Functional layer formation planned part of the same coated substrate or another coated base Characterized by ejecting droplets of ink onto the functional layer forming scheduled portion.

  In the method for forming a functional layer according to the above aspect, the functional layer forming substrate is provided with an inspection portion having a smaller ink contact angle on the upper surface than the partition wall surface of the functional layer formation scheduled portion, thereby applying the ink on the actual product substrate. In this step, landing deviation can be accurately measured. Thereby, in the mass production process, the defective nozzle can be accurately determined without adding a separate inspection process using the inspection substrate.

1 is a block diagram illustrating an overall configuration of an organic EL display device 1. FIG. 3 is a schematic plan view in which a part of the image display surface of the organic EL display panel 10 is enlarged. FIG. (A) is a schematic cross-sectional view along the XX line of FIG. 2, (b) is a schematic cross-sectional view along the YY line of FIG. It is a schematic cross section which shows the manufacture process of the organic electroluminescent display panel 10, Comprising: (a) is a figure which shows a 1st electrode and a positive hole injection layer formation process, (b) is a figure which shows a pixel control layer formation process. (C) is a figure which shows a partition formation process. It is a schematic cross section which shows the manufacture process of the organic electroluminescence display panel 10, Comprising: (a) is a figure which shows the ink application process in hole transport layer formation, (b) is the ink drying process in hole transport layer formation. (C) is a figure which shows an organic light emitting layer formation process. It is a schematic cross section which shows the manufacture process of the organic electroluminescent display panel 10, Comprising: (a) is a figure which shows an electron carrying layer formation process, (b) is a figure which shows a 2nd electrode formation process, (c). These are figures which show a thin film sealing layer formation process. 1 is a schematic perspective view showing an inkjet device 100. FIG. 2 is a functional block diagram of the inkjet device 100. FIG. 3 is a schematic cross-sectional view of a nozzle head 122. FIG. It is a schematic plan view of the coating substrate 200 which concerns on embodiment. FIG. 4A is a schematic cross-sectional view of a display panel scheduled portion 211 in the coated substrate 200. FIG. FIG. 4B is a schematic cross-sectional view of the inspection unit 212 in the coated substrate 200. It is a flowchart which shows the content of the ink application | coating process in embodiment. 4 is a schematic plan view showing a state where ink droplets are being ejected to an inspection unit 212. FIG. It is a graph which shows the difference in the dispersion | variation in the landing position of an ink droplet by the difference in the contact angle with respect to ink. 10 is a schematic plan view of a coated substrate 300 according to Modification 1. FIG. 10 is a flowchart showing the contents of an ink application process in Modification 2. 10 is a flowchart showing the contents of an ink application process in Modification 3.

<Overview of One Aspect of the Present Disclosure>
In the method for forming and manufacturing a functional layer according to one embodiment of the present disclosure, a functional material is dissolved in a solvent in a region to be coated between a plurality of partition walls that are arranged in parallel in the row direction on the coated substrate. A method of manufacturing an organic EL display panel having a plurality of light emitting regions by ejecting ink droplets from a plurality of nozzles, wherein the coated substrate has a display panel planned portion on which a functional layer is to be formed. In addition, the ink contact angle is smaller than the surface of the partition wall and has an inspection part having a flat surface on the entire surface. In the process of discharging ink droplets, the inspection is performed prior to the functional layer formation scheduled part. The ink droplet is ejected to the part, and the deviation between the target landing position of the ink droplet and the actual landing position is measured. If the deviation is equal to or greater than a predetermined threshold, the occurrence of the deviation is eliminated. In this state, display panel preparation on the same coated substrate Characterized by ejecting droplets of ink onto the display panel portion to be parts or another coating substrate.

  According to the method for forming a functional layer according to one aspect of the present disclosure, an actual product is provided on the functional film forming substrate by providing an inspection unit having a smaller ink contact angle on the upper surface than the partition wall surface of the functional film formation scheduled portion. In the step of applying ink to the substrate, landing deviation can be accurately measured. Thereby, in the mass production process, the defective nozzle can be accurately determined without adding a separate inspection process using the inspection substrate. Since the defective nozzle can be accurately determined, it is possible to suppress the generation of a defective panel due to the defective nozzle being used as it is in the ink application process of the next substrate.

In a specific aspect of the method for forming a functional layer according to an aspect of the present disclosure, in addition to measuring the deviation, the area of the ink droplet in the inspection unit is measured, and the ink droplet whose area is not within the predetermined range The nozzle that ejects the nozzle may be specified, and the specified nozzle may be set to be non-use.
In the above aspect, when the volume of the ink droplet is large, the area of the ink droplet that has landed and spread out also increases. Therefore, an ink droplet whose volume is not within the desired range can be determined for an ink droplet whose area is not within the predetermined range by substituting the volume of the ink droplet with the area, and an ink droplet whose volume is not within the desired range. By setting the nozzle for discharging the ink to be unused, the ink application amount can be more accurately controlled when ink droplets are discharged to the display panel scheduled portion.
In a specific aspect of forming the functional layer according to an aspect of the present disclosure, the inspection unit and the partition may be formed of the same material, and the upper surface of the inspection unit may be subjected to UV irradiation for a longer time than the surface of the partition. .

By the said aspect, since an inspection part and a partition can be formed with the same material, manufacture is easy. In addition, the ink contact angle can be easily adjusted by changing the UV irradiation time.
In a specific aspect of the method for forming a functional layer according to one embodiment of the present disclosure, the inspection unit and the partition may be formed of the same material, and the upper surface of the inspection unit may be subjected to UV irradiation stronger than the surface of the partition. . By the said aspect, since an inspection part and a partition can be formed with the same material, manufacture is easy. In addition, the ink contact angle can be easily adjusted by changing the UV irradiation intensity.

In a specific aspect of the method for forming a functional layer according to an aspect of the present disclosure, the inspection unit and the partition may be formed of the same material, and the inspection unit may be subjected to heat treatment at a temperature lower than that of the partition.
By the said aspect, since an inspection part and a partition can be formed with the same material, manufacture is easy. Further, the ink contact angle can be easily adjusted by changing the heating temperature.

In a specific aspect of the method for forming a functional layer according to one embodiment of the present disclosure, the inspection portion and the partition are formed of the same material and are subjected to heat treatment, and the thickness of the inspection portion is larger than the thickness of the partition. It may be thin.
By the said aspect, since an inspection part and a partition can be formed with the same material, manufacture is easy. Further, the ink contact angle can be easily adjusted by changing the film thickness.

In a specific aspect of the method for forming a functional layer according to an aspect of the present disclosure, the contact angle of the ink on the upper surface of the inspection unit may be 30 ° or more.
According to the above aspect, since the landed ink droplets do not spread too much, the landing position can be measured using the imaging device.
In a specific aspect of the method for manufacturing an organic EL display panel according to an aspect of the present disclosure, the contact angle of the ink on the upper surface of the inspection unit may be 55 ° or less.
According to the above aspect, the movement of the landed ink droplet can be suppressed, and the landing position can be measured more accurately.

In a specific aspect of the method for forming a functional layer according to an aspect of the present disclosure, the corresponding process includes a process of setting the specified nozzle to stop discharging, a process of correcting the ink discharge timing of the specified nozzle, and the specification At least one of the cleaning processes around the ink discharge ports of the nozzles may be included.
By the said aspect, it can be made the state without the nozzle from which the shift | offset | difference of the landing position became more than a predetermined threshold value.

  In the functional layer forming substrate according to another aspect of the present disclosure, an ink in which a functional material is dissolved in a solvent is applied to a region to be coated between a plurality of partition walls arranged in parallel in the row direction. A functional layer formation scheduled portion where a functional layer having a plurality of light emitting regions is formed by discharging droplets from a plurality of nozzles, and an inspection portion having an entirely flat upper surface, and an inspection portion Is characterized in that the contact angle of the ink in which the organic light emitting material or the functional material is dissolved in the solvent is smaller than the surface of the plurality of partition walls.

According to the functional layer forming substrate according to another aspect of the present disclosure, the ink contact angle on the upper surface of the inspection unit is smaller than the partition wall surface of the planned display panel, so that the ink droplets move when landing. It is difficult to measure landing deviation more accurately. Thereby, the discharge timing correction of the nozzle can be performed with higher accuracy.
In a specific aspect of the functional layer forming substrate according to another aspect of the present disclosure, the partition wall and the inspection unit may be made of the same material.

By the said aspect, since an inspection part and a partition can be formed with the same material, manufacture is easy.
In a specific aspect of the functional layer forming substrate according to another aspect of the present disclosure, the inspection unit may be thinner than the partition wall.
By the said aspect, since an inspection part and a partition can be formed with the same material, manufacture is easy. Further, the ink contact angle can be easily adjusted by changing the film thickness.

In a specific aspect of the functional layer forming substrate according to another aspect of the present disclosure, the contact angle of the ink on the upper surface of the inspection unit may be 30 ° or more.
According to the above aspect, since the landed ink droplets do not spread too much, the landing position can be measured using the imaging device.
In a specific aspect of the functional layer forming substrate according to another aspect of the present disclosure, the contact angle of the ink on the upper surface of the inspection unit may be 55 ° or less.

According to the above aspect, the movement of the landed ink droplet can be suppressed, and the landing position can be measured more accurately.
In the present application, “upper” does not indicate the upward direction (vertically upward) in absolute space recognition, but is defined by the relative positional relationship based on the stacking order in the layered structure of functional layers. It is. Specifically, in the functional layer forming substrate, the direction perpendicular to the main surface of the substrate and from the substrate toward the laminate is defined as the upward direction.

Further, for example, the expression “on the substrate” does not indicate only the upper region in direct contact with the substrate, but also includes the upper region of the substrate through the stack.
<Embodiment>
Below, the formation method of the functional layer which concerns on 1 aspect of this indication is demonstrated, referring drawings for the organic light emitting layer containing the organic light emitting material of an organic EL (Electroluminescence) element. The drawings include schematic ones, and there are cases where the scale of each member, the aspect ratio, and the like are different from actual ones. Further, in the present application, a plan view and a plan photograph are a view and a photograph viewed from a direction substantially perpendicular to the main surface of the object. In an organic EL display panel, the panel is viewed from a direction substantially perpendicular to the upper surface of the substrate. It is the figure and the photograph which saw. Further, the planar shape refers to a shape appearing in a plan view and a plan photograph.
1. Overall Configuration of Organic EL Display Device 1 FIG. 1 is a block diagram showing the overall configuration of the organic EL display device 1. The organic EL display device 1 is a display device used for, for example, a television, a personal computer, a portable terminal, a business display (electronic signboard, large screen for commercial facilities), and the like. The organic EL display device 1 includes an organic EL display panel 10 (hereinafter referred to as “panel 10”) and a drive control unit 20 electrically connected thereto.

  The panel 10 is, for example, a top emission type display panel whose upper surface is a rectangular image display surface. As shown in FIG. 1, for the sake of explanation, the direction along the long side of the upper surface of the panel 10 is referred to as the X direction, and the direction along the short side of the upper surface of the panel 10 is referred to as the Y direction. In the panel 10, a plurality of organic EL elements (not shown) are arranged along the image display surface, and an image is displayed by combining the light emission of each organic EL element. Note that the panel 10 employs an active matrix system as an example.

  The drive control unit 20 includes a drive circuit 21 connected to the panel 10 and a control circuit 22 connected to an external device such as a computer or a receiving device such as an antenna. The drive circuit 21 is a power supply circuit that supplies power to each organic EL element, a signal circuit that applies a voltage signal that controls the power supplied to each organic EL element, and a scan that switches between locations where the voltage signal is applied at regular intervals. Circuit and the like. The control circuit 22 controls the operation of the drive circuit 21 according to data including image information input from an external device or a receiving device.

In FIG. 1, four drive circuits 21 are arranged around the panel 10 as an example, but the configuration of the drive control unit 20 is not limited to this, and the number and positions of the drive circuits 21 are as follows. It can be changed as appropriate.
2. Configuration of Panel 10 (1) Plane Configuration FIG. 2 is a schematic plan view in which a part of the image display surface of panel 10 is enlarged. In the panel 10, as an example, sub-pixels (sub-pixels) SPR, SPG, and SPB that emit light in red, green, and blue are arranged in a matrix. The subpixels SPR, SPG, and SPB are alternately arranged in the X direction along the long side of the panel 10, and the set of subpixels SPR, SPG, and SPB constitute one pixel (pixel) P. In the pixel P, it is possible to express full color by combining the light emission luminances of the sub-pixels SPR, SPG, and SPB whose gradation is controlled.

  Further, in the Y direction along the short side of the panel 10, only one of the sub-pixel SPR, sub-pixel SPG, and sub-pixel SPB is arranged so that the sub-pixel column LR, the sub-pixel column LG, and the sub-pixel column LB are respectively arranged. It is configured. Thereby, the pixels P as a whole panel 10 are arranged in a matrix along the X direction and the Y direction, and an image is displayed on the image display surface by combining the colors of the pixels P arranged in this matrix.

  The sub-pixels SPR, SPG, and SPB are formed with organic EL elements that emit red, green, and blue, respectively. By extracting light emitted from the organic EL elements from the image display surface side, the sub-pixels SPR, SPG, and SPB are Emits light. The emission colors of the sub-pixels SPR, SPG, and SPB may be the emission colors of the organic EL elements themselves, or may be those obtained by correcting the emission colors of the organic EL elements with a color filter.

  The panel 10 employs a line bank method as an example. That is, by forming a plurality of partition walls 15 that divide the sub-pixel rows LR, LG, and LB for each column, a plurality of planned application regions 15 a arranged in the X direction are formed as regions between adjacent partition walls 15. Yes. Each application planned region 15a is a region where ink is to be applied when a functional layer is formed by an inkjet method described later. In the line bank method, the application region 15a is continuous over the sub-pixel rows LR, LG, and LB, so that the applied ink can flow along the Y direction, and the film thickness unevenness of the functional layer is reduced. Can do.

In the panel 10, a pixel regulation layer 14 that insulates each of the sub-pixels SPR, SPG, and SPB is formed in each application planned region 15a, and each of the sub-pixels SPR, SPG, and SPB emits light independently. Is possible. In FIG. 2, the pixel restriction layer 14 is represented by a dotted line, but this represents that the pixel restriction layer 14 is covered with the functional layer and cannot be directly seen in the plan view.
(2) Cross-sectional configuration FIG. 3A is a schematic cross-sectional view along the line XX in FIG. 2, and FIG. 3B is a schematic cross-sectional view along the line YY in FIG. . 3A mainly shows the cross-sectional configuration of the sub-pixel SPG, and FIG. 3B only shows the cross-sectional configuration of the sub-pixel column LG. However, the sub-pixels SPR and SPB and the sub-pixel column are illustrated. LR and LB have the same configuration as that shown in FIGS. 3 (a) and 3 (b). In FIG. 3, the upward direction on the paper is the Z direction.

The panel 10 includes a substrate 11, a first electrode 12, a hole injection layer 13, a pixel regulating layer 14, a partition wall 15, a hole transport layer 16A, an organic light emitting layer 16B, an electron transport layer 17, a second electrode 18, and a thin film encapsulation. Layer 19 is provided. Among these, the hole transport layer 16A and the organic light emitting layer 16B are formed by an ink jet method which will be described later. Note that this stacked configuration is merely an example, and in addition to this, an electron injection layer, a blocking layer, a buffer layer, and the like may be stacked, or a part of each of the above layers may be omitted. Further, like an electron injecting and transporting layer, one physical layer may have a plurality of functions.
a. Substrate 11
The substrate 11 is a support member for the panel 10. Although illustration is omitted, in the substrate 11, a TFT (Thin Film Transistor) layer is formed on a rectangular plate-like substrate body.

  The substrate body is made of a metal material such as aluminum or stainless steel coated with a material having electrical insulation or a material having electrical insulation. Examples of the material having electrical insulation include glass materials such as alkali-free glass, soda glass, non-fluorescent glass, phosphate glass, borate glass, and quartz glass. The material may be a resin material such as an acrylic resin, a styrene resin, a polycarbonate resin, an epoxy resin, a polyethylene resin, a polyester resin, a polyimide resin, or a silicone resin. The material may be a metal oxide material such as aluminum oxide, for example.

  Since the organic EL element may be deteriorated by reacting with moisture or oxygen, the substrate body is made of a material having a low moisture permeability, such as glass or metal, so that the moisture or oxygen can penetrate from the lower part of the organic EL element. Is preferably suppressed. In the case where a resin material is used for the substrate body, it is preferable to coat a thin film with low moisture permeability such as silicon nitride, silicon oxynitride, and aluminum oxide on the upper surface of the resin material.

  The TFT layer is a layer of an electronic circuit formed on the substrate body, and a power supply circuit for the organic EL element, a control circuit for supply power, and the like are arranged. Specifically, the TFT layer is a laminate composed of a semiconductor layer, a conductor layer, and an electrical insulator layer disposed on the substrate body, and this laminate structure allows the TFT element, capacitor element, wiring, A circuit element is configured. An interlayer insulating layer (not shown) is formed on the uppermost portion of the TFT layer, and the upper surface of the substrate 11 is flattened.

  The semiconductor layer is, for example, a general semiconductor material such as silicon, an oxide semiconductor material such as indium-zinc-gallium oxide, or an organic semiconductor having a π-electron conjugated system spread in a planar direction such as a polycyclic aromatic compound. It is made of materials. Examples of the conductive layer include metal materials such as aluminum (Al), copper (Cu), and gold (Au), carbon materials such as graphite and carbon nanotubes, indium tin oxide (ITO), and indium zinc oxide (IZO). The conductive oxide material is used. The electrical insulator layer is formed of, for example, an inorganic material such as silicon nitride, silicon oxide, silicon oxynitride, or aluminum oxide, or an organic material such as an acrylic resin, a polyimide resin, a silicone resin, or a phenol resin. . The interlayer insulating layer is formed of an electrically insulating patternable material, for example, an organic material such as an acrylic resin, a polyimide resin, a silicone resin, or a phenol resin.

In the TFT layer, a layer made of silicon nitride, aluminum oxide, or the like covering the entire electronic circuit element of the TFT layer may be formed as a passivation layer separately from the interlayer insulating layer.
b. First electrode 12
The first electrode 12 is a plurality of electrodes formed on the substrate 11 in a matrix shape in which the row direction is defined in the X direction and the column direction is defined in the Y direction, and supplies holes to the organic light emitting layer 16B. It has a role as an anode. Each of the first electrodes 12 defines the position of each organic EL element and is formed to correspond to the formation position of each subpixel SPR, SPG, SPB.

  The first electrode 12 is formed of a metal material such as Al, silver (Ag), molybdenum (Mo), tungsten (W), titanium (Ti), chromium (Cr), nickel (Ni), or zinc (Zn). Is done. Further, it may be formed of an alloy material combining these metal materials, or a multilayer structure in which metal materials / alloy materials are laminated. Further, for the purpose of improving the bonding property between the first electrode 12 and the hole injection layer 13 and preventing the oxidation of the first electrode 12, a layer made of a transparent conductive oxide material such as ITO or IZO is formed on the above layer. You may form with the laminated multilayer structure. Furthermore, a barrier metal layer made of a metal oxide material such as tungsten oxide may be formed on the lowermost layer of the first electrode 12 for the purpose of suppressing erosion due to wet etching or diffusion of hydrogen to the lower layer. .

From the viewpoint of supplying holes, it is preferable to use a material having a high work function for the first electrode 12. Further, in the panel 10 of the top emission type, it is preferable to impart light reflectivity to the first electrode 12.
c. Hole injection layer 13
The hole injection layer 13 is a kind of functional layer, and is a layer formed on the first electrode 12, and energy in supplying holes (hole injection) from the first electrode 12 to the organic light emitting layer 16 </ b> B. It serves to lower the barrier and facilitate hole injection. In the panel 10, the hole injection layer 13 is formed independently for each first electrode 12 and arranged in a matrix on the substrate 11. The hole injection layer 13 is formed using a material having an appropriate ionization energy as a functional material. Examples of such materials include metal oxide materials such as Ag, Mo, Cr, W, Ni, vanadium (V), and iridium (Ir), and PEDOT (a mixture of polythiophene and polystyrene sulfonic acid). ) Etc.
d. Pixel restriction layer 14
As shown in FIG. 3B, the pixel regulation layer 14 is an electrically insulating layer formed so as to cover the end portions of the first electrode 12 and the hole injection layer 13. The height (height along the Z direction) is lower than the partition wall 15. The pixel regulating layer 14 has a role of improving electrical insulation between the adjacent subpixels SPR, SPG, and SPB (first electrode 12) in each application planned region 15a. In addition, the pixel regulation layer 14 covers the end of the first electrode 12, thereby suppressing a short circuit due to contact between the first electrode 12 and the second electrode 18.

  In addition, in the panel 10, as shown in FIG. 2, the planar shape which covers the edge part of the 1st electrode 12 and the positive hole injection layer 13 of the pixel control layer 14 is formed so that it may become curvilinear. By forming the pixel regulation layer 14 in this manner, when the hole transport layer 16A is formed, the ink easily spreads to the end of the region surrounded by the hole injection layer 13, the pixel regulation layer 14, and the partition wall 15. , Wetting defects can be suppressed.

The material of the pixel regulation layer 14 is formed of, for example, an inorganic material such as silicon nitride, silicon oxide, silicon oxynitride, or aluminum oxide, or an organic material such as acrylic resin, polyimide resin, or novolac phenol resin. Further, when forming the hole transport layer 16A, the surface of the pixel regulation layer 14 is preferably lyophilic with respect to the ink so that the ink containing the functional material is easily spread in the coating application region 15a.
e. Partition 15
The partition walls 15 divide the columns of the first electrode 12 and the hole injection layer 13 aligned along the Y direction into columns, thereby providing a plurality of application planned regions aligned along the direction X as regions between the adjacent partition walls 15. 15a is formed. At this time, as shown in FIG. 2, the partition wall 15 has a linear shape extending in the Y direction, a so-called line bank.

Specifically, the partition wall 15 prevents the ink containing the functional material from flowing out of the respective application planned regions 15a when forming the hole transport layer 16A and the organic light emitting layer 16B. Further, the partition wall 15 has a role of partitioning and electrically insulating the hole transport layer 16A and the organic light emitting layer 16B after formation.
The partition wall 15 is made of, for example, a photosensitive resist material that has electrical insulation and can be patterned by a photolithography method. Examples of the photosensitive resist material include acrylic resin, polyimide resin, and novolac type phenol resin. In addition, the partition 15 may contain materials other than the photosensitive resist material. Further, the photosensitive resist material may have either a negative type in which the solubility in a developer is lowered by light exposure or a positive type in which the solubility in a developer is increased by light exposure. Is preferred. In general, the photosensitive region of the photosensitive resist material when exposed from above tends to have a reverse taper shape having a wide upper portion and a narrow lower portion. Therefore, in the negative type in which the photosensitive region remains, the photosensitive resist material after the development processing has a shape close to a reverse taper, and it is possible to prevent the ink from flowing out beyond the formed partition wall 15.

  In addition, it is preferable that the partition 15 has the tolerance with respect to an organic solvent or a heat | fever from the manufacturing method of the panel 10 mentioned later. Further, in order to suppress the outflow of ink, the surface of the partition wall 15 preferably has liquid repellency. For example, a material containing a liquid repellent component is used for the partition wall 15 or the partition wall 15 is provided with liquid repellency. It is preferable to perform a surface treatment. Examples of the liquid repellent component include a fluorine compound and a siloxane compound. The liquid repellent component may be mixed in the photosensitive resist material as an independent material, for example, or may be contained in a copolymer of the photosensitive resist material, for example. As the surface treatment for imparting liquid repellency, for example, plasma treatment in a fluorine gas atmosphere can be used.

“Liquid repellency” is used herein as a term that means low affinity for ink containing a functional material.
f. Hole transport layer 16A
The hole transport layer 16A is a kind of functional layer, and is a layer formed by drying ink applied to each application planned region 15a by an ink jet method described later, and is supplied from the first electrode 12. It has the role of improving the transportability of holes to the organic light emitting layer 16B. In the panel 10 adopting the line bank method, the hole transport layer 16A has a shape extending in the Y direction along each application planned region 15a, and all the first electrodes 12 in each application planned region 15a, The shape is continuous so as to cover the hole injection layer 13 and the pixel regulation layer 14. That is, in each subpixel row LR, LG, LB, each subpixel SPR, SPG, SPB shares the hole transport layer 16A.

The hole transport layer 16A is formed using an organic material having a relatively high hole mobility as a functional material. Examples of such materials include triazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives, pyrazolone derivatives, phenylenediamine derivatives, arylamine derivatives, amino-substituted chalcone derivatives, oxazole derivatives, styrylanthracene derivatives. Fluorenone derivatives, hydrazone derivatives, stilbene derivatives, porphyrin compounds, aromatic tertiary amine compounds, styrylamine compounds, butadiene compounds, polystyrene derivatives, triphenylmethane derivatives, tetraphenylbenzine derivatives (all disclosed in JP-A-5-163488) And the like.
g. Organic light emitting layer 16B
The organic light emitting layer 16B is a kind of functional layer, and is a layer formed by drying ink applied to each application planned region 15a by an inkjet method described later, like the hole transport layer 16A. In the organic light emitting layer 16 </ b> B, light emission (electroluminescence phenomenon) is performed by recombination of holes and electrons supplied from the first electrode 12 and the second electrode 18.
In the panel 10 that employs the line bank method, the organic light emitting layer 16B has a shape extending in the Y direction along the respective application planned regions 15a in the same manner as the hole transport layer 16A, and the hole in each application planned region 15a. It has a continuous shape so as to cover the entire surface of the transport layer 16A. That is, in each subpixel row LR, LG, LB, each subpixel SPR, SPG, SPB shares the organic light emitting layer 16B. However, the organic light emitting layer 16B emits light only at a portion above the first electrode 12, and emits light independently for each of the subpixels SPR, SPG, and SPB.

The organic light emitting layer 16B is formed using an organic light emitting material that emits light by an electroluminescence phenomenon as a functional material. Examples of organic light-emitting materials include oxinoid compounds, perylene compounds, coumarin compounds, azacoumarin compounds, oxazole compounds, oxadiazole compounds, perinone compounds, pyrrolopyrrole compounds, naphthalene compounds, anthracene compounds, fluorene compounds, fluoranthene compounds, tetracene compounds, Pyrene compounds, coronene compounds, quinolone compounds, azaquinolone compounds, pyrazoline derivatives, pyrazolone derivatives, rhodamine compounds, chrysene compounds, phenanthrene compounds, cyclopentadiene compounds, stilbene compounds, diphenylquinone compounds, styryl compounds, butadiene compounds, dicyanomethylenepyran compounds, dicyano Methylenethiopyran compound, fluorescein compound, pyrylium compound, thiapyrylium compound, Lenapyrylium compound, telluropyrylium compound, aromatic aldadiene compound, oligophenylene compound, thioxanthene compound, cyanine compound, acridine compound, metal complex of 8-hydroxyquinoline compound, metal complex of 2-bipyridine compound, Schiff salt and group III metal Known fluorescent materials and phosphorescent materials such as fluorescent materials such as complexes, oxine metal complexes, and rare earth complexes (all described in JP-A-5-163488). Further, for example, a mixed layer of an organic compound using the above-described fluorescent substance or phosphorescent substance as a dopant may be used. Note that the panel 10 adopts a three-color coating method in which an organic light emitting layer 16B including an organic light emitting material that emits red, green, and blue light is applied to the sub-pixel rows LR, LG, and LB, respectively, and is compatible with full color. .
h. Electron transport layer 17
The electron transport layer 17 is a kind of functional layer, and is a layer formed so as to cover the entire substrate 11 on which the partition wall 15 and the organic light emitting layer 16B are formed, and is an organic material for electrons supplied from the second electrode 18. It has a role of improving transportability to the light emitting layer 16B.

The electron transport layer 17 is formed using an organic material having a relatively high electron mobility as a functional material. Examples of such materials include nitro-substituted fluorenone derivatives, thiopyrandioxide derivatives, diphequinone derivatives, perylene tetracarboxyl derivatives, anthraquinodimethane derivatives, fluorenylidenemethane derivatives, anthrone derivatives, oxadiazole derivatives, perinone derivatives. Quinoline complex derivatives (all described in JP-A-5-163488), phosphorus oxide derivatives, triazole derivatives, todiazine derivatives, silole derivatives, dimesityl boron derivatives, triarylboron derivatives, and the like.
i. Second electrode 18
The second electrode 18 is an electrode that covers the functional layer. In the panel 10, the second electrode 18 is formed over the entire substrate 11 so as to cover the electron transport layer 17. The second electrode 18 serves as a cathode that supplies electrons to the organic light emitting layer 16B.

The second electrode 18 is formed of, for example, a transparent conductive oxide material such as ITO or IZO, or a layer made of a transparent conductive oxide material, Ag, Au, Ni, Cu, Al, platinum (Pt), palladium (Pd). ) Or a layer of these alloy materials.
From the viewpoint of supplying electrons, it is preferable to use a material having a low work function for the second electrode 18. In the top emission type panel 10, it is preferable to use a material having a high light transmittance such as a light transmittance of 80% or more for the second electrode 18.
j. Thin film sealing layer 19
The thin film sealing layer 19 is a layer formed so as to cover the entire substrate 11 on which the respective members from the first electrode 12 to the second electrode 18 are formed, and each member is exposed to moisture, oxygen, and the like. It has a role to suppress. The thin film sealing layer 19 is formed of a material having a low moisture permeability, for example, an inorganic material such as silicon nitride, silicon oxynitride, carbon oxide, carbon nitride, or aluminum oxide. In the top emission type panel 10, it is preferable to use a material having a high light transmittance and a small refractive index difference from the second electrode 18 for the thin film sealing layer 19.
k. Others In the panel 10, a sealing plate formed of a material having low moisture permeability such as a glass material may be disposed on the substrate 11 on which the above members are formed. At this time, the substrate 11 and the sealing plate are bonded by, for example, an adhesive layer made of a curable resin material. Thereby, the penetration | invasion of the water | moisture content, oxygen, etc. with respect to each organic EL element on the board | substrate 11 can further be suppressed.

  Further, a color filter may be arranged at a position corresponding to the sub-pixels SPR, SPG, SPB of the sealing plate. As a result, the emission colors of the subpixels SPR, SPG, and SPB can be corrected. Further, a black matrix may be arranged at a position corresponding to the sub-pixels SPR, SPG, SPB of the sealing plate and a peripheral region of the sealing plate. Thereby, reflection of external light on the image display surface of the panel 10 can be suppressed, and the contrast between the pixel P and other portions on the image display surface can be improved.

The above cross-sectional configuration is merely an example. For example, in FIG. 3A, the electron transport layer 17 and the second electrode 18 are formed over a plurality of planned application regions 15a. Or a part may be formed for every application | coating plan area | region 15a or every subpixel SPR, SPG, SPB. Further, for example, in FIGS. 3A and 3B, the hole injection layer 13 is formed for each of the sub-pixels SPR, SPG, and SPB. However, the hole injection layer 13 extends over each of the planned application regions 15a or a plurality of planned application regions 15a. It may be formed.
3. Manufacturing Method of Panel 10 (1) Overall Process First, the overall process of the manufacturing method of the panel 10 that is one aspect of the present disclosure is described. 4, 5, and 6 are schematic cross-sectional views illustrating the manufacturing process of the panel 10. Note that the cross sections shown in FIGS. 4, 5, and 6 correspond to the cross section of the sub-pixel SPG in FIG. Further, the pixel regulation layer 14 without hatching shown in FIGS. 4B and 4C does not exist in the cross section but represents the surface of the pixel regulation layer 14 existing on the back side of the cross section of the paper surface. doing.
a. Substrate preparation First, the substrate 11 is prepared. Specifically, a substrate body in which an electrically insulating material is formed into a flat plate shape is prepared, and a TFT layer is formed on the substrate body. For example, the TFT layer can be formed as follows.

  First, a layer of a semiconductor material, a layer of a conductor material, or a layer of an electrical insulator material patterned in a predetermined shape is formed on a substrate body, and this is repeated to form a predetermined electronic circuit. For forming each layer, depending on the material of each layer, for example, a dry process such as a vacuum deposition method, an electron beam deposition method, an ion plating method, a gas layer growth method, a printing method, a spin coating method, an inkjet method, a dispensing method, etc. A wet process such as a method or a die coating method can be used. For patterning each layer, for example, a photolithography method, a shadow mask method, a metal mask method, or the like may be used, or the layers may be directly formed into a predetermined shape by a wet process. Moreover, you may perform processes, such as plasma implantation, ion implantation, and baking, to each layer formed as needed.

Next, a passivation layer and an interlayer insulating layer are sequentially formed so as to cover the electronic circuit. For the formation of the passivation layer and the interlayer insulating layer, the above dry process and wet process can be used depending on the material of each layer. Note that openings (contact holes) are formed at predetermined positions in the passivation layer and the interlayer insulating layer so that the TFT element in the electronic circuit and the first electrode 12 can be electrically connected. The patterning method described above can be used to form the contact hole.
b. Formation of first electrode and hole injection layer Next, a plurality of first electrodes 12 and a plurality of hole injection layers 13 are formed on the substrate 11 in a matrix in which the row direction and the column direction are determined in the X direction and the Y direction. Form. For example, a metal thin film is first formed on the substrate 11 by sputtering, and then a metal oxide thin film is formed on the metal thin film by reactive sputtering. Next, after applying a photoresist material on the metal oxide thin film, the photoresist material is patterned by a photolithography method, and formation regions of subpixels SPR, SPG, and SPB arranged in a matrix composed of the X direction and the Y direction are formed. Only leave the photoresist material. Next, a dry etching method and a wet etching method are successively used in this order, and the metal oxide thin film and the metal thin film are etched at a place where the photoresist material is not disposed. Finally, the photoresist material and residues on the metal oxide thin film are removed. Thus, the first electrode 12 made of a metal thin film arranged in a matrix along the X direction and the Y direction and the hole injection layer 13 made of a metal oxide thin film stacked on the metal thin film can be formed (FIG. 4). (A)). Thus, the manufacturing process can be made more efficient by simultaneously etching the first electrode 12 and the hole injection layer 13. Further, by patterning with the same photoresist, the alignment accuracy between the first electrode 12 and the hole injection layer 13 is improved.

In addition, the formation method of the 1st electrode 12 and the hole injection layer 13 is not restricted to the combination of said sputtering method, reactive sputtering method, and the photolithography method, According to material, the dry process illustrated above, the wet process A patterning method can be used. When a barrier metal layer is disposed in the lowermost layer of the first electrode 12, a metal oxide thin film is formed before the metal thin film is formed, and after the metal thin film is wet etched, the metal oxide thin film is further formed. May be dry-etched. Note that the method for manufacturing the panel 10 is not limited to the method in which the first electrode 12 and the hole injection layer 13 are continuously etched as described above, and the metal oxide thin film is formed after the first electrode 12 is formed. The hole injection layer 13 may be formed by forming and patterning.
c. Formation of Pixel Restriction Layer Next, the pixel restriction layer 14 is formed on the substrate 11 on which the first electrode 12 and the hole injection layer 13 are formed. Specifically, for example, a thin film of an inorganic material that covers the entire surface of the substrate 11 is formed using a vacuum evaporation method, and the first electrode 12 and the hole injection layer 13 are formed using the thin film using a photolithography method. It is formed in a shape that extends in the X direction so as to cover the end of each. Thereby, the pixel regulation layer 14 is formed (FIG. 4B). The pixel regulating layer 14 may be formed using an organic material, and may be formed using another dry process, wet process, or patterning method exemplified above.
d. Formation of Partition Walls Next, a plurality of partition walls 15 are formed on the substrate 11 to partition the columns of the first electrode 12 and the hole injection layer 13 arranged in the Y direction. As a result, a plurality of application scheduled regions 15 a arranged in the X direction are formed as regions between adjacent partition walls 15. Specifically, for example, a photosensitive resist material is applied over the entire surface of the substrate 11 by a die coating method so that the film thickness is larger than that of the pixel regulating layer 14 to form a slow-acting resist material layer. Then, a plurality of partition walls 15 are formed by patterning the photosensitive resist material layer into a shape extending in the Y direction by photolithography, and dividing the columns of the first electrode 12 and the hole injection layer 13 aligned in the Y direction. It forms (FIG.4 (c)).

The partition wall 15 may be formed using other dry processes, wet processes, and patterning methods.
In the present embodiment, the X direction corresponds to the row direction, and the Y direction corresponds to the column direction.
e. Ink Application Next, the ink 16a containing a functional material (here, the material of the hole transport layer 16A) is ejected by an ink jet method to be described later to apply the ink 16a to the intended application region 15a (FIG. 5A )). The ink 16a is ejected so as to continue beyond the pixel restricting layer 14 in the planned application region 15a. As a result, the ink 16a can flow in the Y direction in the planned application region 15a, and uneven application of the ink 16a in the planned application region 15a is reduced. As a result, in the subsequent drying, the occurrence of non-uniform film thickness and poor formation of the hole transport layer 16A in the application planned region 15a is reduced.
f. Drying Subsequently, the applied ink 16a is dried to form the hole transport layer 16A, which is a functional layer containing a functional material, in the intended application region 15a. Specifically, for example, the substrate 11 after application of the ink 16a is placed in a vacuum environment such as a vacuum chamber to evaporate the solvent of the ink 16a. Thereby, the hole transport layer 16A is formed in each application planned region 15a (FIG. 5B).
g. Next, in the same manner as the formation method of the hole transport layer 16A, the functional material (ink containing the organic light emitting material in this case) is ejected by an ink jet method to be described later. Apply. Then, by drying the applied ink, a functional layer containing an organic light emitting material, that is, an organic light emitting layer 16B is formed in the planned application region 15a (FIG. 5C). In addition, in the ink application including the material of the organic light emitting layer 16B, the ink can flow in the Y-axis direction of FIG. 2 in the planned application region 15a as in the case of the ink application including the material of the hole transport layer 16A. Thus, the ink is applied to the entire surface of the hole transport layer 16A in the planned application region 15a. As a result, uneven application of ink in the planned application region 15a is reduced, and the occurrence of nonuniform film thickness and poor formation of the organic light emitting layer 16B in the planned application region 15a after drying is reduced.
h. Formation of Electron Transport Layer Subsequently, the electron transport layer 17 is formed so as to cover all the partition walls 15 and the organic light emitting layer 16B on the substrate 11 (FIG. 6A). For the formation of the electron transport layer 17, for example, the dry process or the wet process exemplified above can be used according to the material of the electron transport layer 17.
i. Second Electrode Formation Next, a second electrode 18 is formed to cover the functional layer, here, the electron transport layer 17 (FIG. 6B). For example, the second electrode 18 is formed by forming a thin film of a transparent conductive oxide material on the electron transport layer 17 by the dry process exemplified above.
j. Sealing Then, the substrate 11 on which the first electrode 12 to the second electrode 18 are formed is sealed. Specifically, for example, by the dry process exemplified above, a thin film of an inorganic material is formed so as to cover the upper surface of the substrate 11 on which the second electrodes 18 are formed, thereby forming the thin film sealing layer 19 (FIG. 6 (c)).

With the above method, the panel 10 having the cross-sectional structure shown in FIG. 3 is completed.
(2) Ink Application by Inkjet Method Next, ink application by the inkjet method in forming the hole transport layer 16A and the organic light emitting layer 16B will be described.
a. Configuration of Inkjet Device 100 First, the configuration of the inkjet device 100 used for ink application by the inkjet method will be described. FIG. 7 is a schematic perspective view showing the ink jet apparatus 100. FIG. 8 is a functional block diagram of the inkjet apparatus 100.

As shown in FIGS. 7 and 8, the inkjet device 100 includes a work table 110, a head unit 120, and a control device 130 as main components.
(A) Work table 110
The work table 110 is a so-called gantry-type work table, and includes a base 111 on which a coating substrate 200 that is an object of ink application is placed, and a long movable base placed above the base 111. 112. The coated substrate 200 is a substrate for manufacturing an organic EL display panel, and is, for example, a substrate in the middle of manufacturing the panel 10 (before ink application). As shown in FIG. 10, the coated substrate 200 includes a display panel planned portion 211 that becomes the panel 10 and an inspection portion 212 that is used for nozzle inspection described later. Further, for example, a plurality of panels 10 may be divided and manufactured from a single coated substrate 200. In this case, each application | coating scheduled area | region 15a formed in the upper surface 210 of the application | coating board | substrate 200 becomes a long shape along the Y direction which is a short side direction of the upper surface 210. FIG.

The base 111 is plate-shaped, and the upper surface on which the coating substrate 200 is placed is rectangular. Here, the direction along the long side of the upper surface of the base 111 is defined as the longitudinal direction of the base 111, and the direction along the short side of the upper surface of the base 111 is defined as the short direction of the base 111.
The moving gantry 112 is bridged between a pair of guide shafts 113a and 113b arranged in parallel along the longitudinal direction of the base 111 so that the longitudinal direction of the moving gantry 112 is along the short direction of the base 111. Has been placed. The pair of guide shafts 113a and 113b is supported by columnar stands 114a, 114b, 114c, and 114d disposed at the four corners of the upper surface of the base 111.

The movable gantry 112 is attached to the guide shafts 113a and 113b via linear motor portions 115a and 115b fixed to the longitudinal ends of the movable gantry 112, respectively. Therefore, the movable base 112 can be moved along the longitudinal direction of the base 111 by driving the linear motor portions 115a and 115b.
An L-shaped pedestal 116 is attached to a guide groove 118 formed on the surface of the movable frame 112 and extending in the longitudinal direction via a servo motor 117. Therefore, the pedestal 116 can move along the short direction of the base 111 by driving the servo motor unit 117.

The linear motor units 115a and 115b and the servo motor unit 117 are driven by the control device 130 connected via the communication cables 101 and 102, respectively.
(B) Head portion 120
The head unit 120 includes a main body unit 121, a nozzle head 122, and an imaging device 123. The main body 121 is fixed to the pedestal 116 of the work table 110, and the nozzle head 122 and the imaging device 123 are attached to the main body 121. Therefore, the head unit 120 is movable in the longitudinal direction and the short direction of the base 111 in conjunction with the movement of the movable frame 112 and the pedestal 116. The main body 121 includes a drive circuit that controls the operation of the nozzle head 122, and the drive device is connected to the control device 130 via the communication cable 103.

The nozzle head 122 is a long member that extends in the short direction of the base 111. On the lower surface side of the nozzle head 122, long sub-heads 124 are arranged in the longitudinal direction of the nozzle head 122 (that is, the short direction of the base 111).
FIG. 9 is a schematic cross-sectional view of the sub head 124. In the sub head 124, a plurality of nozzles 125 for discharging ink from the opening on the lower surface side are arranged side by side. In addition, on the upper surface side of the sub head 124, piezoelectric elements 124a are disposed at positions corresponding to the respective nozzles 125, and liquid chambers 124c are disposed below the piezoelectric elements 124a via vibration plates 124b.
Each piezoelectric element 124 a is connected to the control device 130 via a drive circuit of the main body 121, and deforms the diaphragm 124 b in accordance with a signal from the control device 130. The diaphragm 124b is a plate-like member common to the nozzles, is deformed by the piezoelectric element 124a, and applies pressure to the liquid chamber 124c below the piezoelectric element 124a. The liquid chamber 124c is filled with ink supplied from an ink tank (not shown) via the infusion tube 104 shown in FIG. 7, and when pressure is applied by the diaphragm 124b, ink is supplied from the opening of the nozzle 125. Discharged. That is, in the ink jet apparatus 100, the control device 130 can independently control the ink discharge amount and the discharge timing of each nozzle 125.

  The imaging device 123 is a CCD camera, for example, and is connected to the control device 130 via the communication cable 105. The imaging device 123 images the upper surface 210 and transmits the imaging data to the control device 130. The CPU 131 stores the imaging data in the storage unit 132 and processes it based on the control program. Thus, the control device 130 can detect the position of the head unit 120 (each nozzle 125) with respect to the upper surface 210, and can accurately apply ink from each nozzle 125 to a predetermined position on the upper surface 210. Further, the control device 130 can inspect the application position and the application amount of the ink ejected from each nozzle 125 on the application substrate 200 based on the imaging data.

The control device 130 includes a CPU 131, a storage unit (including mass storage means such as an HDD) 132, a display unit (display) 133, and an input unit 134. Specifically, the control device 130 is a personal computer (PC).
The storage unit 132 stores a work table 110 connected to the control device 130, a control program for driving the head unit 120, and the like.

When driving the inkjet apparatus 100, the CPU 131 performs control based on an instruction input by an operator through the input unit 134 and each control program stored in the storage unit 132.
Further, the control device 130 can individually set use (discharge) / non-use (discharge stop) of the plurality of nozzles 125 provided in the nozzle head 122, and the nozzle head 122 is set to use. Ink can be discharged only from the nozzle 125.
b. Display panel scheduled portion 211 and inspection portion 212
As illustrated in FIG. 10, the coated substrate 200 includes a display panel planned portion 211 and an inspection unit 212. The display panel planned part 211 and the inspection part 212 are arranged side by side in the X-axis direction (row direction). The nozzle head 122 ejects ink droplets while moving on the coating substrate 200 in the X-axis direction (see FIG. 7). In other words, the scanning direction of the nozzle head 122 is the X-axis direction.

The display panel scheduled portion 211 is a portion that is separated from the inspection unit 212 and becomes the panel 10 used as a product after each layer is formed. The inspection unit 212 is a part used for nozzle reproducibility inspection, landing deviation inspection, and the like of the nozzle 125 of the inkjet apparatus 100.
FIG. 11A is a schematic cross-sectional view of the display panel planned portion 211. As shown in FIG. 11A, in the display panel planned portion 211, the partition walls 15 that are long in the Y-axis direction (column direction) are arranged at intervals in the X-axis direction (row direction). The area of the adjacent 15 partition walls is a coating application area 15a.

  FIG. 11B is a schematic cross-sectional view of the inspection unit 212. In the inspection unit 212, a landing inspection layer 15 b is formed on the substrate 11 as a so-called solid film whose entire upper surface is flat using the same material as the partition wall 15. Further, the contact angle of the ink applied to the planned application region 15 a of the planned display panel portion 211 of the landing inspection layer 15 b is smaller than the contact angle of the surface of the partition wall 15 in the planned display panel portion 211. Specifically, for example, if the contact angle of the surface 15s of the partition wall 15 is 55 degrees, the contact angle of the upper surface 15bs of the landing inspection layer 15b is less than 55 degrees.

Further, the smaller the contact angle of the upper surface 15bs of the landing inspection layer 15b, the more easily the landed ink gets wet. If the contact angle of the upper surface 15bs is too small, the contrast of the boundary of the ink that has spread out becomes small in the landing deviation inspection by the imaging device 123 described later, so that the landing position of the ink droplet and the area after landing are accurately measured. I can't do that. Therefore, the contact angle of the upper surface 15bs of the landing inspection layer 15b is preferably, for example, 30 degrees or more.
The landing inspection layer 15b is formed by forming a photosensitive resist material on the substrate 11 at the same time when the partition wall 15 is formed after the pixel regulating layer 14 is formed on the display panel planned portion 211 in FIG. Apply and form without patterning.

  After patterning the partition wall 15, the landing inspection layer 15 b is heated at a temperature lower than that of the partition wall 15 in a step of heating to promote hardening of the partition wall 15. Thereby, the landing inspection layer 15b having a smaller contact than the surface 15s of the partition wall 15 is obtained. By heating at a lower temperature, the amount of fluorine groups present inside the landing inspection layer 15 b can be made smaller than the amount of fluorine groups exposed on the surface 15 s of the partition wall 15.

  Further, when performing the step of adjusting the contact angle to a desired size by irradiating the surface 15s of the partition wall 15 with UV light, the upper surface 15bs of the landing inspection layer 15b is irradiated with UV for a longer time than the surface 15s. Accordingly, the contact angle of the upper surface 15bs of the landing inspection layer 15b may be smaller than the contact angle of the surface 15s of the partition wall 15. When UV irradiation is performed for a long time, the fluorine group is cut and the contact angle becomes small.

Furthermore, the contact angle of the upper surface 15bs of the landing inspection layer 15b is set to be in contact with the surface 15s of the partition wall 15 by making the integrated value (intensity × time) of the UV light applied to the upper surface 15bs larger than the surface 15s. It may be smaller than the corner.
The film thickness of the landing inspection layer 15 b may be made thinner than the film thickness of the partition wall 15. In the case of being formed of the same material, the smaller the film thickness, the smaller the amount of fluorine contained therein, so that the amount of fluorine exposed by heating becomes smaller and the contact angle becomes smaller.

  In the nozzle reproducibility inspection, ink droplets are ejected a plurality of times (for example, 10 times) from each of the plurality of nozzles 125, and the ink droplet landing position and ink ejection amount (volume of ink droplets) vary for each nozzle 125. And the nozzle 125 whose variation is greater than or equal to a predetermined threshold value is identified. The identified nozzle 125 is classified as a defective nozzle (in this case, a defective nozzle at the time of manufacture), and is set to not used.

Even if the magnitude of the variation does not reach the predetermined threshold, a nozzle whose landing deviation direction is random cannot be dealt with by the ejection timing correction, and may be set not to be used.
In the landing deviation inspection, ink droplets are ejected using a nozzle that is not classified as a defective nozzle by the nozzle reproducibility inspection, that is, the nozzle 125 that is set to be used as a normal nozzle, and a target landing position (target landing position) ) From the actual ink landing position is identified, and the nozzle 125 whose magnitude is greater than or equal to a predetermined threshold is specified.

The nozzle is identified by, for example, coordinate data of a location on the coated substrate 200 where the ink droplet landing deviation is equal to or greater than a predetermined threshold and a location where the ink discharge amount is equal to or greater than the predetermined threshold. The measurement can be performed by determining the nozzle that has passed through the coordinate position.
When a nozzle 125 whose landing deviation is equal to or greater than a predetermined threshold is identified, a corresponding process is performed on the identified nozzle 125.

  For example, there are the following three processes as the handling process. (1) A process in which the specified nozzle 125 is set to non-use (discharge stop), and ink is applied using a nozzle 125 other than the nozzle 125 at the time of subsequent ink application. (2) A process of correcting the timing of ink droplet ejection for the identified nozzle 125 so as to cancel the deviation of the actual landing position of the ink droplet from the target landing position. (3) The inkjet apparatus is temporarily stopped, and ink or dust adhering to the ejection surface (lower surface) of the nozzle head 122 is wiped off with a sponge or the like to perform cleaning.

  When a nozzle 125 having a landing deviation is identified, the cause of the landing deviation is identified, and a corresponding process is performed according to the identified cause. For example, when the ink or foreign matter (dust) adhered to the periphery of the nozzle 125 on the ejection surface of the nozzle head 122 is the cause, the wiping cleaning (3) is performed. The foreign matter here includes ink that has adhered to the periphery of the discharge port of the nozzle 125 and dried. For example, when the ink viscosity is gradually increased due to the gradual evaporation of the ink solvent, the ink droplet ejection timing correction (2) is performed. If the cause is not one of the above, for example, a bubble present in the nozzle 125, the non-use setting of (1) is performed.

In order to save the time required for specifying the cause of ink mixing, the non-use setting of (1) may be performed uniformly for the specified nozzle 125. For example, whether or not ink or foreign matter is attached to the ejection surface of the nozzle 125 needs to temporarily stop the inkjet apparatus 100 and the operator visually confirms the ejection surface. However, when the non-use setting is uniformly performed, the non-use setting can be automatically and instantaneously performed by the control device 130 (see FIG. 8) without specifying the cause. There is no need to stop, and a reduction in manufacturing efficiency can be suppressed.
c. Ink Application Process FIG. 12 is a flowchart showing a process of applying ink to the application substrate 200 using the inkjet apparatus 100.

  First, a nozzle reproducibility inspection and a landing deviation inspection are performed (step S1). The nozzle reproducibility inspection and the landing deviation inspection are performed as follows. Ink droplets are ejected a plurality of times from all the nozzles 125, and the direction and size of the deviation between the landing position of the ejected ink droplet and the target landing position, and the ejection for each time of each nozzle 125 are discharged. Measure the volume of the ink drop. In the measurement of landing deviation, the substrate after ink application is photographed by the imaging device 123, and in the photographed image, the distance between the center of each ink droplet and the target landing position is calculated, and the direction of deviation To read. The measurement of the ink droplet volume is performed by calculating the wetting and spreading area of each ink droplet in the image captured by the imaging device 123.

Then, the nozzle 125 in which the magnitude of at least one of the ink droplet landing deviation and the volume variation is equal to or larger than a predetermined threshold is classified as a defective nozzle. The defective nozzle is a nozzle 125 having low ink droplet reproducibility, and is a defective product that does not have a stable ink ejection capability.
The nozzle reproducibility inspection and the landing deviation inspection may be performed using the inspection unit 212 of the coated substrate 200, or may be performed separately using a nozzle reproducibility inspection substrate.

  If there is a nozzle 125 classified as a defective nozzle (step S2: YES), the defective nozzle is set not to be used (step S3). By discharging ink only from used nozzles that are not classified as defective nozzles and not discharging ink from defective nozzles, ink application accuracy is improved, short-circuits and leaks due to ink mixing and functional layer formation defects, functional layers It is possible to reduce the occurrence of variations in luminance due to uneven film thickness.

  Subsequently, it is determined whether there is a landing deviation for the nozzles 125 that are not classified as defective nozzles (step S4). In step S4, it is not less than a predetermined threshold (hereinafter referred to as “second landing deviation threshold”) smaller than a threshold (hereinafter referred to as “first landing deviation threshold”) in the defective nozzle determination in step S2. Determine whether. In reality, it is rare that the actual ink droplet landing position completely coincides with the target landing position. Therefore, if the amount of landing deviation is within the allowable range, that is, less than the second landing deviation threshold, it is determined that there is no landing deviation, and if it is equal to or greater than the second landing deviation threshold, it is determined that there is landing deviation.

If there is a nozzle 125 that is determined to have a landing deviation in step S4, the ejection timing correction is set for the nozzle 125 (step S5), and then ink is applied to the inspection unit 212 and the display panel planned unit 211 (step S5). S6).
When it is determined in step S4 that there is no landing deviation nozzle (step S4: NO), the process proceeds to step S6, and ink is applied to the inspection unit 212 and the display panel planned unit 211.
Then, the inspection unit 212 after ink application is photographed by the imaging device 123 (see FIG. 7), and landing deviation is measured (step S7).

If the landing deviation is equal to or greater than a predetermined threshold (for example, the second threshold), it is classified as having a landing deviation, and if it is less than the predetermined threshold, it is classified as having no landing deviation.
When there is no nozzle 125 classified as having landing deviation (step S8: NO), it is determined whether or not ink application has been completed for all the application substrates 200 (step S12). When there is a nozzle 125 classified as having a landing deviation (step S8: YES), the ejection timing correction is set for the corresponding nozzle 125 (step S10), and ink application to all the application substrates 200 is completed. It is determined whether or not (step S12).

If ink application has been completed for all the application substrates 200 (step S12: YES), the ink application process ends.
When ink application has not been completed for all the application substrates 200 (step S12: NO), the process returns to step S6, and ink is applied to the inspection unit 212 and the display panel scheduled portion 211 of the next application substrate 200. Thereafter, step S6 to step S12 are repeated until it is determined in step S12 that ink application has been completed for all the application substrates 200.

  When there is a nozzle 125 classified as having a landing deviation (step S8: YES), it may be determined whether the landing deviation can be corrected (step S9). For example, as described later, the landing deviation of 10 times is not random, and the landing deviation can be corrected when the average in the X direction is larger than a predetermined value and the variation is smaller than a predetermined value. Judge. This is because it is considered that ink can be landed in the planned application region 15a by the ejection timing correction. On the other hand, for example, when the landing deviation of 10 times is random and the variation is larger than a predetermined value, it is determined that the landing deviation cannot be corrected, and the corresponding nozzle 125 is set to be unused.

FIG. 13 is a diagram illustrating a method of performing a landing deviation inspection on the upper surface 15bs of the landing inspection layer 15b of the inspection unit 212. As shown in FIG. 13, while moving the nozzle head 122 in the X direction with respect to the coating substrate 200, ink droplets are ejected from each nozzle 125 aiming at each target landing position 221 set in the inspection unit 212. Let
The ink used here is the same as the ink applied to the planned application region 15 a of the display panel planned portion 211.

In the inspection unit 212 of the coating substrate 200 set on the base 111 (see FIG. 7), each target landing position 221 is set on a scanning line (broken line in FIG. 13) in which each nozzle 125 moves in the X direction. The Y direction pitch of the nozzles 125 and the Y direction pitch of the target landing positions 221 are the same.
There are a plurality of target landing positions 221 for each nozzle 125, which are set side by side in the X direction. The number of target landing positions 221 for one nozzle 125 is preferably 5 or more, and is 10 here.

In the example shown in FIG. 13, the adjacent target landing positions 221 are shifted from each other in the X direction. This is to prevent ink droplets ejected from the adjacent nozzles 125 from being mixed.
Then, a fixed amount of ink is sequentially ejected from each nozzle 125 to a plurality of target landing positions 221.

FIG. 13 shows a state in which the first ink droplet ejection from each nozzle 125 is finished, the ink droplet 222 is scattered on the upper surface 15bs, and the second ink droplet ejection is being performed. However, it continues until the 10th time.
When ink ejection from the nozzles 125 is completed ten times, the landing deviation of each ink droplet 222 attached to the upper surface 15bs is measured.

This measurement is performed by using the image pickup device 123 to pick up an image of the upper surface 15bs to which the ink droplets are attached, and the control device 130 takes the image data into the storage unit 132 and uses image recognition technology.
Specifically, in the two-dimensional image of the landed ink droplet 222 as shown in the partial enlarged view surrounded by the broken line in FIG. 13, the plane of each ink droplet 222 is determined from the contrast of the image using image recognition technology. The contour shape in the visual field is specified, and the center position O is obtained. Then, the distance between the obtained center position O and the target landing position 221 is obtained. In the present embodiment, a distance dx in the X direction between the center position O and the target landing position 221 is obtained, and the distance dx in the X direction is defined as a landing deviation. Here, only the X-direction deviation dx is used as the landing deviation, and the Y-direction landing deviation dy is unquestioned because the partition 15 is a line bank, so even if a landing deviation in the Y direction occurs. It is because it does not become.

The landing deviation dx obtained ten times for each nozzle 125 is stored in the storage unit 132 of the control device 130.
FIG. 14 is a graph showing an example of the result of landing deviation inspection on the upper surface 15bs of the landing inspection layer 15b of this embodiment and the result of landing deviation inspection of the comparative example. FIG. 14 is a graph plotting the relative values of the landing deviations when the average value of the landing deviations when the ink droplets are ejected 10 times on the upper surface 15bs is 1. Then, as a comparative example, after a solid film is formed with the same material as the partition wall 15, an ink liquid is similarly formed on the layer subjected to the same processing as the partition wall 15 (the same heating temperature, the same UV irradiation time, and the same UV irradiation intensity). Drops were ejected 10 times, and the landing deviation of each time was measured. In the example shown in FIG. 14, the contact angle of the upper surface 15bs is 50 degrees, and the contact angle of the upper surface of the comparative example is 55 degrees. However, this is an example, and the contact angle of the upper surface 15bs of the present disclosure is not limited to the above value.

In the graph of FIG. 14, the landing deviation of the upper surface 15bs is indicated by a black diamond, and the landing deviation of the comparative example is indicated by a black square. That is, “Low contact angle” is the result of the upper surface 15bs, and “High contact angle” is the result of the comparative example.
The result of the comparative example is also shown as a relative value when the average value of landing deviation of the upper surface 15bs is 1.

As shown in FIG. 14, in the comparative example (high contact angle), the magnitude of the landing deviation and the variation are larger than those of the upper surface 15bs (low contact angle) of this embodiment. This is considered to indicate that the movement of the ink droplet after landing is smaller in the upper surface 15bs of the present embodiment than in the comparative example, whereby the landing deviation can be measured more accurately. .
As described above, according to the ink application step in the method for forming a functional layer in the present embodiment, the contact angle of the ink on the top surface 15bs of the landing inspection layer 15b in the inspection unit 212 is the surface of the partition wall 15 in the display panel planned portion 211. It is smaller than the contact angle of ink at 15 s. Accordingly, ink droplets are ejected onto a part of the partition wall 15 corresponding to the outer frame of the region where the plurality of planned application regions 15a are arranged in the display panel planned portion 211, or onto the partition wall 15 between the adjacent planned application regions 15a. As compared with the case where the landing deviation inspection is performed, the landed ink droplets are less likely to move, and the landing deviation can be measured more accurately. Thereby, in the mass production process, the defective nozzle can be accurately determined without adding a separate inspection process using the inspection substrate.

Further, in the ink application process in the method for manufacturing the organic EL display panel according to the present embodiment, the landing deviation inspection is performed, and when the landing deviation is detected, the nozzle 125 in which the landing deviation has occurred is identified, and the corresponding processing is performed. Do. Thereby, it is possible to prevent the nozzle 125 in which landing deviation has occurred from being used as it is. As a result, quality improvement and yield improvement can be achieved.
<Modification>
As described above, the present disclosure has been described based on the embodiment, but the present disclosure is not limited to the above description except for the essential characteristic components. Hereinafter, as another example of the present disclosure, a modified example of the coated substrate and a modified example of the ink coating process will be described. In the following description, the same components as those described in the description of the embodiment are denoted by the same reference numerals, and the description thereof is simplified or omitted.
(1)
FIG. 15 is a schematic plan view of a coated substrate 300 according to the first modification. The coated substrate 300 includes inspection units 312a and 312b adjacent to both sides in the X-axis direction of the display panel planned portion 211, respectively.
(2)
In the ink application process in the organic EL manufacturing method according to the embodiment shown in the flowchart of FIG. 12, a method of performing an ink mixture inspection on the inspection unit 212 after applying ink to the inspection unit 212 and the display panel planned portion 211 will be described. did. In this case, even if a nozzle having a landing deviation equal to or greater than a threshold value is generated and a corresponding process is performed, it is applied from the next coated substrate. That is, the nozzle before the corresponding process is used for ink application to the display panel scheduled portion 211 of the same coated substrate 200 in which the landing deviation equal to or greater than the threshold is detected in the inspection unit 212.

In the second modification, after ink application is performed only on the inspection unit, ink mixing inspection is performed. When ink mixing occurs, the corresponding process is performed, and then the ink application is performed on the planned display panel portion of the same application substrate. Do.
FIG. 16 is a flowchart illustrating an ink application process in the method of manufacturing an organic EL display panel according to the second modification. Steps having the same contents as those in the flowchart of FIG. Here, a case where the coated substrate 200 according to the embodiment is used will be described as an example.

Steps S1 to S5 are the same as those in the flowchart of FIG. 12, and thus description thereof is omitted here.
After performing the ejection timing correction in step S5, ink is applied to the planned application region 15a of the inspection unit 212 (step S21).
If it is determined in step S4 that there is no landing deviation nozzle (step S4: NO), the process proceeds to step S21, and ink is applied to the application scheduled region 15a of the inspection unit 212.

Steps S7 to S11 are the same as those in the flowchart of FIG. 12, and thus description thereof is omitted here.
If it is determined in step S8 that there is no landing deviation (step S8: NO), the process proceeds to step S22, and ink is applied to the planned application region 15a of the display panel planned portion 211.
In step S10, after correcting the ejection timing, ink is applied to the planned application region 15a of the display panel planned portion 211 (step S22).

In step S11, after the defective nozzle is set to be non-use, ink is applied to the planned application region 15a of the display panel planned portion 211 (step S22).
In step S22, after ink is applied to the planned application area 15a of the display panel planned portion 211, it is determined whether or not ink application has been completed for all the application substrates 200 (step S12).

If ink application has been completed for all the application substrates 200 (step S12: YES), the ink application process ends.
If ink application has not been completed for all the application substrates 200 (step S12: NO), the process returns to step S4, and ink is applied to the inspection unit 212 of the next application substrate 200. Thereafter, step S4 to step S12 are repeated until it is determined in step S12 that the ink application has been completed for all the application substrates 200.

According to the ink application process of this modification, when applying ink to one application substrate 200, first, ink is applied only to the inspection unit 212 to perform landing deviation inspection, and the landing deviation is equal to or greater than the threshold value. If the nozzle is generated, the ink is applied to the display panel scheduled portion 211 of the same coated substrate 200 after performing the corresponding process. Accordingly, a corresponding process is immediately performed for the nozzle 125 (see FIG. 9) that has caused a landing deviation equal to or greater than the threshold, and the corresponding process is performed when ink is applied to the display panel scheduled portion 211 used as a product. The nozzle 125 that is not used is not used. Thereby, quality improvement and a yield improvement can be aimed at.
(3)
In the landing deviation inspection in step S7 in the flowchart of FIG. 12, only the deviation of the landing position of the ink droplet from the target position is measured, but the present invention is not limited to this. For example, in the image analysis of the upper surface 15bs to which the ink droplets are adhered by the imaging device 123 shown in FIG. 13, the area within the outline of each ink droplet 222 is calculated to be the area of the ink droplet, Assuming that the volume and the area are proportional, the ink droplet volume may be used to represent the volume of the ink droplet.

  FIG. 17 is a flowchart showing an ink application process in the method for manufacturing an organic EL display panel according to Modification 3. The flowchart shown in FIG. 17 is obtained when the configuration of the present modification is applied to the flowchart shown in FIG. Steps having the same contents as those in the flowchart of FIG. 12 are denoted by the same reference numerals and description thereof is omitted. Here, a case where the coated substrate 200 according to the embodiment is used will be described as an example.

Steps S1 to S7 are the same as those in the flowchart of FIG. 12, and thus description thereof is omitted here.
In step S7, landing deviation inspection is performed, and it is determined whether there is a landing area abnormal nozzle (step S31). Here, the landing area abnormal nozzle means the nozzle 125 that ejects ink droplets whose ink droplet area is not within a predetermined numerical range. When the ink droplet is less than the lower limit value or greater than the upper limit value, the nozzle that ejects the ink droplet is determined to be a landing area abnormal nozzle.

If there is a landing area abnormal nozzle (step S31: YES), the process proceeds to step S11, the landing area abnormal nozzle is set as a defective nozzle, and the process proceeds to step S12.
When there is no landing area abnormal nozzle (step S31: NO), the process proceeds to step S8 to determine whether or not there is a landing deviation.

Steps S8 to S12 are the same as those in the flowchart of FIG. 12, and a description thereof will be omitted here.
According to the ink application step in the method of manufacturing the organic EL display panel according to this modification, not only the nozzles whose landing deviation is equal to or greater than the threshold value, but also the landing area of ink droplets (volume of ink droplets) is outside the desired range. Since the nozzles that have become unusable are also set as non-use nozzles, it is possible to prevent non-uniform film thickness due to non-uniform ink droplet volume in addition to non-uniform film thickness due to landing deviation.

Note that the determination of the abnormal landing area nozzle of the present modification may be applied to the ink application process shown in the flowchart of FIG.
(4)
In the above-described embodiment and each modified example, the configuration in which the ink mixture inspection of the coated substrate 200 is performed on a single sheet has been described, but the configuration is not limited thereto. For example, the ink mixing inspection of the coated substrate 200 may be performed every few sheets. Even in this case, the landing deviation inspection is performed more frequently than when the landing deviation inspection is performed during regular maintenance or ink replacement. It can be performed.
(5)
In each of the modifications described in the above embodiments, the case where the coating substrate 200 has a line bank has been described. However, the present invention is not limited thereto, and the functional film forming method and the configuration of the coating substrate according to one embodiment of the present disclosure are not limited to pixel banks. It is also applicable to.
(6)
In the embodiment, in the manufacturing method of the panel 10, the functional layers formed by the ink jet method, that is, the ink application to the application planned region 15a by the plurality of nozzles 125 were the hole transport layer 16A and the organic light emitting layer 16B. The functional layer is not limited to this. In the method for manufacturing the panel 10, at least one functional layer may be formed by an inkjet method, and the functional layer includes an organic light emitting layer, a hole / electron injection layer, a hole / electron transport layer, a hole / electron transport layer, and a hole / electron transport layer. Any of an electron blocking layer and a buffer layer may be used. Further, the functional layer formed by the ink jet method may be one for each of the sub-pixels SPR, SPG, and SPB, or may be three or more. For example, the functional layer may be only one of the hole transport layer and the organic light emitting layer, and the other may be formed using a dry process. At this time, the shape of the functional layer formed by the dry process is arbitrary, and for example, it may be formed independently for each sub-pixel or each application planned area, or in a plurality of sub-pixels or a plurality of application planned areas. It may be formed to be shared. Further, for example, the functional layer may include only the organic light emitting layer 16B and the hole transport layer 16A may not be formed. Further, for example, the hole injection layer 13 and the electron transport layer 17 may be formed in the application planned region 15a using a wet process. Furthermore, the method for forming this functional layer can be applied to any functional layer as long as it is based on an ink jet method. For example, the functional layer is also applied to a quantum dot light emitting diode (QLED). Is possible.
(7)
In the manufacturing method of the panel 10, a three-color coating method is employed in which the organic light emitting layer 16B including the organic light emitting material that emits red, green, and blue light is formed on the subpixel rows LR, LG, and LB, respectively. The handling method is not limited to this. For example, an organic light emitting layer containing an organic light emitting material that emits blue light is formed on the subpixel columns LR, LG, and LB, and a wavelength conversion layer such as a fluorescent layer is disposed above the organic light emitting layer. A wavelength conversion method that converts light emission into red and blue light emission into green in the sub-pixel row LG may be adopted. Further, for example, a color filter layer may be disposed instead of the wavelength conversion layer in the above.
(8)
In each of the above embodiments and modifications, the coated substrate has a rectangular top surface, but is not limited thereto, for example, a polygon such as a triangle, square, or pentagon, a circle, an ellipse, or a combination thereof The shape may be different. The same applies to the shapes of the display panel scheduled portion, the inspection portion, and the inspection portion. Furthermore, the number and arrangement of the display panel scheduled part, the inspection part and the inspection part included in one coated substrate are limited to the numbers and arrangements shown in the above embodiments and modifications. Absent.
(9)
In the panel 10 according to the embodiment, the subpixels SPR, SPG, and SPB that emit red, green, and blue, respectively, are arranged. However, the combination of the subpixels is not limited to this, and for example, one red color, red, green , Four colors of blue and yellow may be used. Further, in one pixel P, the number of subpixels is not limited to one per color, and a plurality of subpixels of each color such as two blue subpixels SPB may be arranged. Further, the arrangement of the sub-pixels in the pixel P is not limited to the order of red, green, and blue, and may be an order in which these are replaced.
(10)
In the panel 10 according to the embodiment, the first electrode 12 is an anode and the second electrode 18 is a cathode. However, the present invention is not limited to this, and may have an inverted structure in which the first electrode is a cathode and the second electrode is an anode. .
(11)
In the panel 10 according to the embodiment, the organic EL element is formed in the coating application region 15a. However, a bus bar (auxiliary electrode) for reducing the influence of the voltage drop due to the resistance component of the second electrode 18 is partially provided. It may be formed.
(12)
The panel 10 according to the embodiment is a top emission type and active matrix type organic EL display panel, but is not limited thereto, and for example, a bottom emission type or a passive matrix type may be adopted.

  The method for forming a functional layer and the substrate for forming a functional film according to the present disclosure can be widely used as a method for manufacturing a display panel used in various electronic devices such as a television, a personal computer, a portable terminal, and a commercial display.

DESCRIPTION OF SYMBOLS 10 Organic EL display panel 11 Board | substrate 15 Partition 15a Application | coating area | region 15b Landing | inspection test | inspection layer 15bs Top surface 15s (partition | inspection test | inspection layer) Surface 125 Nozzle 200, 300 Application | coating board 211 Display panel plan part 212, 312a, 312b Target landing position 222 Ink droplet

Claims (14)

A plurality of nozzles are formed by ejecting droplets of ink in which a functional material is dissolved in a solvent from a plurality of nozzles to a region to be coated between a plurality of partition walls arranged in parallel in the row direction on the coating substrate. A method of forming a functional layer of
In addition to the functional layer planned portion on which the functional layer is to be formed, the coating substrate has an inspection portion having a flat upper surface that has a contact angle of the ink smaller than the surface of the partition wall,
In the step of discharging the ink droplet, prior to the functional layer formation scheduled portion, the ink droplet is discharged to the inspection unit, and the target landing position of the ink droplet and the actual landing position When the deviation from the landing position is measured and the deviation is equal to or greater than a predetermined threshold, the functional layer of the display panel planned part of the same coated substrate or the functional layer of another coated substrate in a state in which the occurrence of the deviation is eliminated A method for forming a functional layer, wherein a droplet of the ink is ejected to a portion to be formed. In addition to measuring the deviation, measure the area of the ink droplet in the inspection unit,
The method for forming a functional layer according to claim 1, wherein the nozzle that ejects the ink droplets whose area is not within a predetermined range is specified, and the specified nozzle is set to be non-use. The method for forming a functional layer according to claim 1, wherein the inspection unit and the partition are made of the same material, and the upper surface of the inspection unit is subjected to UV irradiation for a longer time than the surface of the partition. 4. The functional layer according to claim 1, wherein the inspection unit and the partition are formed of the same material, and an upper surface of the inspection unit is subjected to UV irradiation stronger than a surface of the partition. Method. The method for forming a functional layer according to claim 1, wherein the inspection unit and the partition are made of the same material, and the inspection unit is subjected to a heat treatment at a temperature lower than that of the partition. The inspection part and the partition are formed of the same material and are subjected to heat treatment,
The method for forming a functional layer according to claim 1, wherein a thickness of the inspection portion is thinner than a thickness of the partition wall. The method for forming a functional layer according to claim 1, wherein a contact angle of the ink on an upper surface of the inspection unit is 30 ° or more. The contact angle of the ink on the upper surface of the inspection unit is 55 ° or less.
The method for forming a functional layer according to any one of claims 1 to 7. The corresponding process includes at least one of a process for setting the specified nozzle to stop discharging, a process for correcting the ink discharge timing of the specified nozzle, and a cleaning process around the ink discharge port of the specified nozzle. The method for forming a functional layer according to claim 1, comprising one. A droplet of ink in which a functional material is dissolved in a solvent is ejected from a plurality of nozzles to a region to be coated between a plurality of partition walls that are long in the column direction and arranged in parallel in the row direction. A functional layer formation planned portion where a plurality of functional layers are to be formed, and an inspection portion having an entirely flat upper surface,
The upper surface of the inspection unit is a functional layer forming substrate having a smaller contact angle of ink in which an organic light emitting material or a functional material is dissolved in a solvent than the surfaces of the plurality of partition walls. The functional layer forming substrate according to claim 10, wherein the partition wall and the inspection unit are made of the same material. The functional layer forming substrate according to claim 11, wherein the inspection unit has a film thickness smaller than that of the partition wall. The functional layer forming substrate according to claim 10, wherein a contact angle of the ink on the upper surface of the inspection unit is 30 ° or more. 14. The functional layer forming substrate according to claim 10, wherein a contact angle of the ink on an upper surface of the inspection unit is 55 ° or less.

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