JP2018124713A - Winding roll - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a winding roll which prevents generation of a fault due to overcurrent in manufacturing of transparent conductive film for touch panel using a roll-to-roll method.SOLUTION: A cylindrical winding roll 10 includes a support body 14 having a plurality of pattern parts 16 which is wound around a winding core 12. The pattern parts 16 are transparent conductive parts having conductive thin wires and the pattern parts 16 and gap parts 17 are alternately provided in the winding direction Dof the support body. At least one of the gap parts 17 is longer than a pattern length Lp of the pattern part 16 in the winding direction.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a cylindrical winding roll in which a support having a plurality of pattern portions used for a touch sensor, a touch panel and the like is wound around a winding core, and in particular, pattern portions and gap portions are provided alternately, The present invention relates to a winding roll having at least one gap portion longer than the pattern length of the pattern portion in the take-up direction.

Currently, in various electronic devices such as tablet computers and mobile information devices such as smartphones, touch panels that are used in combination with display devices such as liquid crystal display devices and perform input operations to electronic devices by touching the screen There is.
For the touch panel, a transparent conductive film in which a transparent conductive film serving as a detection unit for detecting contact with the transparent substrate is formed is used.
The transparent conductive film has a specific pattern of wiring formed by conductive thin wires. The transparent conductive film is formed of a transparent conductive oxide such as ITO (Indium Tin Oxide) and a metal. Compared to the transparent conductive oxide described above, metal has advantages such as easy patterning, excellent flexibility, and lower resistance. Therefore, metal thin wires such as copper or silver are used as conductive thin wires in touch panels. It is used.

A transparent conductive film for a touch panel is manufactured by a roll-to-roll method in which a plurality of transparent conductive patterns are formed at intervals on a long support serving as a transparent substrate.
For example, in Patent Document 1, a functional pattern made of a first conductive material and including a transparent conductive portion is formed on at least one surface of a transparent support, and on at least one surface of the support. When a region other than the functional pattern formation region where the functional pattern is formed is defined as a functional pattern non-formation region, a thickness adjustment pattern is formed in the functional pattern non-formation region, and the functional pattern non-formation region is formed on the support. Transparent conductive film in which the ratio of the sections that do not include any thickness adjustment pattern is less than 90% of the total number of sections when divided into a plurality of square sections of 1 cm 2 whose one side is parallel to the longitudinal direction of The manufacturing method is described.
Patent Document 1 describes that a support has a long film shape, and a functional pattern and a thickness adjustment pattern are formed on the surface of the support while the support is rolled.

Japanese Patent Laid-Open No. 2006-51194

In the production of a transparent conductive film for a touch panel using a roll-to-roll method, static electricity flows into a part of the wiring of the transparent conductive film, and an overcurrent may occur, resulting in a failure in which the wiring burns out.
In Patent Document 1, the support on which the functional pattern and the thickness adjusting pattern are formed on both surfaces is rolled and conveyed from the mesh forming portion toward the take-up roller by a plurality of pass rollers. At this time, the thickness adjusting pattern is formed of a thin metal wire made of a conductive material, and the support is rolled while the thickness adjusting pattern is in contact with the pass roller. Therefore, the thickness adjusting pattern is formed between the plurality of pass rollers and the thickness adjusting pattern. This prevents static electricity from being generated between the plurality of pass rollers and the functional pattern. Thus, although generation of static electricity can be suppressed in Patent Document 1, it is necessary to form a thickness adjusting pattern in addition to the functional pattern, which increases the manufacturing cost and is not preferable for use as a countermeasure against static electricity.

  An object of the present invention is to provide a take-up roll that solves the above-described problems based on the prior art and suppresses the occurrence of a failure due to an overcurrent.

  In order to achieve the above-described object, the present invention provides a cylindrical winding roll in which a support having a plurality of pattern portions is wound around a core, and the pattern portion includes a transparent conductive portion having a conductive thin wire. The pattern portions and the gap portions are alternately provided in the winding direction of the support, and at least one gap portion longer than the pattern length of the pattern portion in the winding direction is provided among the gap portions. A take-up roll is provided.

It is preferable that all the gaps are longer than the pattern length.
In the inner winding layer and the outer winding layer that overlap in the radial direction of the winding core, the end in the winding direction of the pattern portion of the outer winding layer is the gap of the inner winding layer. It is preferable to arrange at corresponding positions in the radial direction.
In the inner winding layer and the outer winding layer that overlap in the radial direction of the winding core, the gap portion of the outer winding layer and the gap portion of the inner winding layer may overlap at least partially in the winding direction. preferable.
In the inner winding layer and the outer winding layer that overlap in the radial direction of the winding core, the pattern portion is preferably arranged only in a region corresponding to the pattern portion of the inner winding layer in the outer winding layer. .

In the inner winding layer and the outer winding layer that overlap in the radial direction of the core, the pattern portion is preferably arranged only in a region corresponding to the gap portion of the inner winding layer in the outer winding layer. .
In the radial direction of the winding core, it is preferable that a pattern winding layer provided with at least one pattern portion and a gap winding layer provided with only a gap portion are alternately arranged.
The pattern part is preferably provided on both surfaces of the support.

  According to the present invention, the occurrence of a failure can be suppressed.

It is a typical perspective view which shows the 1st example of the winding roll of embodiment of this invention. It is a schematic plan view which shows the transparent conductive film of the 1st example of the winding roll of embodiment of this invention. It is a typical side view showing the 1st example of the winding roll of the embodiment of the present invention. It is a schematic plan view which shows an example of a structure of the pattern part of the 1st example of the winding roll of embodiment of this invention. It is typical sectional drawing which shows an example of the pattern part of the 1st example of the winding roll of embodiment of this invention. It is a schematic diagram which shows an example of the touch sensor using the pattern part of the winding roll of embodiment of this invention. It is a schematic diagram which shows an example of the manufacturing apparatus of the winding roll of embodiment of this invention. It is a typical side view which shows the transparent conductive film of the 2nd example of the winding roll of embodiment of this invention. It is a typical top view which shows the transparent conductive film of the 2nd example of the winding roll of embodiment of this invention. It is a typical side view which shows the 2nd example of the winding roll of embodiment of this invention. It is a schematic diagram which shows the 3rd example of the winding roll of embodiment of this invention. It is a schematic diagram which shows the 4th example of the winding roll of embodiment of this invention. It is a schematic diagram which shows the 5th example of the winding roll of embodiment of this invention. It is a schematic diagram which shows the state before winding of the conventional winding roll. It is a schematic diagram which shows the conventional winding roll. It is a schematic diagram which shows the conventional winding roll. It is a schematic diagram which shows the manufacturing method of the conventional winding roll. It is a schematic diagram which shows the manufacturing method of the conventional winding roll. It is a schematic diagram which shows the manufacturing method of the conventional winding roll. It is a schematic diagram which shows the manufacturing method of the conventional winding roll.

Below, based on the preferred embodiment shown in an accompanying drawing, the winding roll of the present invention is explained in detail.
In the following, “to” indicating a numerical range includes numerical values written on both sides. For example, ε is a numerical value α1 to a numerical value β1, and the range of ε is a range including the numerical value α1 and the numerical value β1, and α1 ≦ ε ≦ β1 in terms of mathematical symbols.
Unless otherwise specified, angles such as “an angle represented by a specific numerical value”, “parallel”, “vertical”, and “orthogonal” include an error range generally allowed in the corresponding technical field.
Transparent means that the light transmittance is at least 60% or more, preferably 75% or more, more preferably 80% or more, and even more preferably 85% in the visible light wavelength range of 400 to 800 nm. That is all. The light transmittance is measured using “Plastic—How to obtain total light transmittance and total light reflectance” defined in JIS K 7375: 2008.

  FIG. 1 is a schematic perspective view showing a first example of a winding roll according to an embodiment of the present invention, and FIG. 2 is a schematic diagram showing a transparent conductive film of the first example of the winding roll according to the embodiment of the present invention. FIG. 3 is a schematic side view showing a first example of a winding roll according to an embodiment of the present invention.

The winding roll 10 of the first example shown in FIG. 1 is a cylindrical one in which a support body 14 having a plurality of pattern portions 16 is wound around a winding core 12. The core 12 is cylindrical and has a length equal to or greater than the width W of the support 14. The pattern portion 16 is a transparent conductive portion having conductive thin wires, and the pattern portion 16 will be described in detail later.
In the winding roll 10, pattern portions 16 and gap portions 17 are alternately provided on the support 14 in the winding direction D _F of the support 14. Among the gap portions of the pattern portion 16, there is at least one gap portion 17 longer than the pattern length Lp of the pattern portion 16 in the winding direction _DF . The gap portion 17 is a region between the pattern portion 16 and the pattern portion 16 in the winding direction _DF of the support 14 and is the support 14 itself.
A plurality of pattern portions 16 and gap portions 17 are provided on the support body 14 along the winding direction _DF .

Specifically, for example, as shown in FIG. 2, a plurality of pattern portions 16 are provided across the gap portion 17 along the winding direction _DF of the support 14. The plurality of pattern portions 16 are all congruent and are unit patterns. In the winding roll 10, the same pattern portion 16 is repeatedly provided with a gap portion 17.
In FIG. 2, the length L of the gap portion 17 in the winding direction _DF of the support 14 is all longer than the pattern length Lp of the support 14 in the winding direction _DF . That is, Lp <L. Note that the length L of the gap portion 17 in the winding direction _DF of the support 14 is also referred to as a pattern interval L.
The width W of the support 14 is a length in a direction orthogonal to the winding direction _DF . The width W of the support 14 becomes the width of the winding roll 10.
As shown in FIG. 2, the support 14 having the pattern portion 16 and the gap portion 17 before being wound around the core 12 is referred to as a transparent conductive film 18. The transparent conductive film 18 is such that the pattern portion 16 is hardly visible, and is transparent as a whole including the support 14 and the pattern portion 16.

  In the winding roll 10, as described above, by providing at least one gap portion 17 longer than the pattern length Lp of the pattern portion 16, the support 14 is attached to the winding core 12 as shown in FIG. 3. When the winding roll 10 is a cylindrical winding roll 10, the inner winding layer 60 and the outer winding layer 62 that overlap in the radial direction Dr have two pattern portions 16 sandwiching the gap portion 17 on the inner side. The pattern part 16 of the outer winding layer 62 in the direction Dr does not straddle. Moreover, the pattern part 16 of the inner winding layer 60 does not straddle the two pattern parts 16 sandwiching the gap part 17 on the outer side. For this reason, there is no short circuit in the pattern portion 16, no overcurrent is generated in the pattern portion 16 due to static electricity or the like, and it is possible to prevent the occurrence of a failure such as the conductive wire of the pattern portion 16 being burned out. .

The core 12 is cylindrical, and the radial direction Dr is a direction extending radially from the center of the circular cross section of the core 12. In the drawing, although only one direction is shown with respect to the radial direction Dr, it is a direction extending radially from the center of the circular cross section of the core 12 as described above.
The inner side and the outer side are referred to as the inner side when close to the core 12 in the radial direction Dr, and the outer side is closer to the core 12 in the radial direction Dr than the inner side. The winding layer refers to the transparent conductive film 18 wound around the winding core 12 by one turn along the circumferential surface of the winding core 12.
The inner winding layer 60 and the outer winding layer 62 indicate the relative positional relationship of the winding layers in the radial direction Dr. The surface of the winding roll 10 is the outermost layer as the winding layer.

The above-described pattern portion 16 does not straddle that the inner winding layer 60 and the outer winding layer 62 that overlap in the radial direction Dr of the core 12 have a gap 17 between the outer winding layer 62 and the inner winding layer 62. The gap 17 of the winding layer 60 is at least partially overlapped in the winding direction _DF .
In addition, the above-mentioned pattern part 16 does not straddle that in the inner winding layer 60 and the outer winding layer 62 that overlap in the radial direction Dr of the core 12, the pattern part 16 of the outer winding layer 62 It can also be said that the end in the winding direction _DF is arranged at a position corresponding to the gap 17 of the inner winding layer 60 in the radial direction Dr of the core 12.

Next, when a short circuit occurs between the pattern portions 16 during winding of the support 14 for obtaining the winding roll 10, an overcurrent flows through the pattern portions 16, and the conductive thin wires of the pattern portions 16 are burned out due to the overcurrent. The occurrence of a failure will be described with reference to FIGS.
FIG. 14 is a schematic diagram showing a state before winding of a conventional winding roll, FIG. 15 is a schematic diagram showing a conventional winding roll, and FIG. 16 is a schematic diagram showing a conventional winding roll. . 17-20 is a schematic diagram which shows the manufacturing method of the conventional winding roll, and shows that time has passed in order of FIG.17, FIG.18, FIG.19 and FIG.

In order to improve productivity, the pattern portion 16 which is a unit pattern is arranged in the range of the support 14, and the distance between patterns, that is, the gap portion 17, as in the transparent conductive film 18 shown in FIG. Usually, the length L is made as short as possible to increase the production quantity per unit area of the support 14.
As shown in FIG. 15, when the pattern length Lp of the pattern portion 16 provided on the support 14 and the length L of the gap portion 17 are L <Lp, the support 14 is wound around the core 12. time, the gap portion 17 of the pattern portion 16 of the inner winding layer 60 in the radial direction Dr as region R ₁ shown in FIG. 16, the pattern portion 16 of the outer winding layer 62 is wound across. Further, the gap portion 17 of the pattern portion 16 of the inner winding layer 60 in the radial direction Dr as region R ₂ shown in FIG. 16, the pattern portion 16 of the outer winding layer 62 is wound across.
In particular, when the length L of the gap 17, that is, the distance between the unit patterns is shorter than the pattern length Lp of the pattern portion 16, the pattern portion 16 straddles the gap 17 of the support 14 that has already been wound. Thus, the support body 14 to be wound up may overlap.

Here, a case will be described in which overcurrent flows through the conductive thin wire when the inside of the pattern portion 16 of the winding layer 62 straddles the outside of the pattern portion 16 of the winding layer 60 by winding.
FIG. 17 shows a moment when the pattern portion 16 of the winding layer 62 and the pattern portion 16 of the winding layer 60 are not in contact with each other when the winding layer 62 overlaps the winding layer 60. When the pattern portion 16 includes the first conductive layer 20 provided on the front surface 14a of the support 14 and the second conductive layer 22 provided on the back surface 14b of the support 14, the first conductive layer 20 and the first conductive layer 20 The two conductive layers 22 may have different charges. In FIG. 17, the first conductive layer 20 is negatively charged, and the second conductive layer 22 is positively charged. In this moment, the potential S _L of the outer surface of the outer surface of the potential S _R and the left pattern portion 16 of the right pattern portion 16 of the winding layer 60 in FIG. 17 is equipotential.
At this time, as the winding of the support 14 proceeds, the inside of the pattern portion 16 of the winding layer 62 comes into contact with the outside of the pattern portion 16 of the winding layer 62 of the winding layer 60, and the pattern portions having different charges 16, neutralization of charges occurs due to contact between the inside of the pattern portion 16 and the outside of the pattern portion 16, and as shown in FIGS. 18 and 19, the potential of the outer side surface of the right-side pattern portion of the winding layer 60 is changed. potential S _L of the outer surface of the outer surface of the potential S _R and the left pattern portion 16 of the right pattern 16 have different potentials.

Further, as the winding of the support 14 proceeds, as shown in FIG. 20, the inner side of the pattern portion 16 of the winding layer 62 straddles the right and left sides of the outer side of the pattern portion 16 of the winding layer 60, 16 is electrically short-circuited, and a current corresponding to the potential difference flows through the first conductive layer 20 of the pattern portion 16 of the inner winding layer 60 and the second conductive layer 22 of the winding layer 62. At this time, when a current flows through the conductive thin wire constituting the first conductive layer 20 or the second conductive layer 22 of the pattern portion 16, if the flowing current becomes an overcurrent for the conductive thin wire, the conductive thin wire becomes an overcurrent. It may burn out without being able to tolerate.
Thus, when there is the pattern portion 16 straddling the gap portion 17 of the pattern portion 16, a short circuit may occur as described above, and a failure such as burnout of the conductive thin wire of the pattern portion 16 may occur.

  As described above, an electrical short circuit of the pattern portion 16 due to the overlap of the support 14 due to winding can be avoided by making the length L of the gap portion 17 larger than the pattern length Lp of the pattern portion 16. As shown in FIG. 2, when the length L of the gap portion 17 is larger than the pattern length Lp, the gap portion 17 is not straddled by the pattern portion 16 regardless of how the support 14 is wound up. Since no short circuit occurs, no overcurrent flows through the pattern portion 16. As a result, it is possible to prevent the occurrence of a failure such as the conductive thin wire of the pattern portion 16 being burned out. In the take-up roll 10, failure of the pattern portion 16 can be avoided by intentionally adjusting the length L of the gap portion 17 as described above.

Next, the pattern unit 16 will be described.
FIG. 4 is a schematic plan view showing an example of the configuration of the pattern portion of the first example of the winding roll according to the embodiment of the present invention, and FIG. 5 shows the first of the winding roll according to the embodiment of the present invention. It is typical sectional drawing which shows an example of the example pattern part. FIG. 6 is a schematic diagram illustrating an example of a touch sensor using the pattern portion of the winding roll according to the embodiment of the present invention.
As shown in FIG. 4, the first conductive layer 20 and the second conductive layer 22 of the pattern portion 16 are both formed by a mesh pattern composed of fine metal wires 24. The metal thin wire 24 is a conductive thin wire. The mesh pattern will be described in detail later.

For example, as shown in FIG. 5, the pattern unit 16 includes a first conductive layer 20 formed on the front surface 14 a of the support 14, and a second conductive layer 22 formed on the back surface 14 b of the support 14.
The first conductive layer 20 and the second conductive layer 22 are composed of fine metal wires 24. By forming the first conductive layer 20 on the front surface 14a of one support 14 and forming the second conductive layer 22 on the back surface 14b, the first conductive layer 20 and the first conductive layer 20 are formed even when the support 14 contracts. The positional deviation with respect to the two conductive layers 22 can be reduced.
Note that the configuration of the pattern portion 16 is not limited to the configuration shown in FIG. 4, and a configuration in which one conductive portion is provided on one support and two supports are stacked via an adhesive layer may be employed. In this case, an optically transparent resin (OCR, Optical Clear Resin) such as an optically transparent pressure-sensitive adhesive (OCA, Optical Clear Adhesive) and UV (Ultra Violet) curable resin is used for the adhesive layer.

For example, the touch sensor 30 shown in FIG. 6 can be formed using the pattern unit 16. The touch sensor 30 is a capacitive touch sensor.
As shown in FIG. 6, the touch sensor 30 includes a substrate 31, detection electrodes formed on both surfaces of the substrate 31, peripheral wirings formed around the detection electrodes and electrically connected to the detection electrodes, Have A plurality of first detectors 32 extending in the first direction Y and arranged in parallel in the second direction X orthogonal to the first direction Y are formed on the surface of the substrate 31, respectively. A plurality of first peripheral wirings 33 electrically connected to one detection unit 32 are arranged close to each other. Similarly, on the back surface of the substrate 31, a plurality of second detection units 34 extending in the second direction X and arranged in parallel in the first direction Y are formed, and a plurality of second detection units 34 are formed. A plurality of second peripheral wirings 35 electrically connected to the detection unit 34 are arranged close to each other. The first detection unit 32 and the plurality of second detection units 34 are detection electrodes.

In the touch sensor 30, in the substrate 31, a region where the plurality of first detection units 32 and the plurality of second detection units 34 are overlapped in a plan view is a sensor region 37. The sensor area 37 is an area where a touch can be detected.
The substrate 31 of the touch sensor 30 is configured by the support 14. The surface of the substrate 31 corresponds to the surface 14 a of the support 14, and the back surface of the substrate 31 corresponds to the back surface 14 b of the support 14.
The first detection unit 32 is configured by the first conductive layer 20 of the pattern unit 16 described above, and is formed by a mesh pattern composed of the fine metal wires 24 as in the first conductive layer 20. The second detection unit 34 is configured by the second conductive layer 22 of the pattern unit 16 described above, and is formed by a mesh pattern made of the fine metal wires 24 as in the second conductive layer 22.
The first peripheral wiring 33 and the second peripheral wiring 35 are composed of, for example, metal thin wires 24. In this case, the first peripheral wiring 33 and the second peripheral wiring 35 can be formed by processing the pattern portion 16.

The first peripheral wiring 33 and the second peripheral wiring 35 are not particularly limited to being configured by the metal thin wires 24, and are configured by conductive wirings having line widths, thicknesses, and the like different from those of the metal thin wires 24. May be. The first peripheral wiring 33 and the second peripheral wiring 35 can be formed of, for example, a strip-shaped conductor. In this case, the first detection unit 32 and the plurality of second detection units 34 are configured by the pattern unit 16, and the first peripheral wiring 33 and the second peripheral wiring 35 are configured by other things.
The touch sensor formed using the pattern unit 16 is not limited to the capacitive touch sensor, but may be a resistive film touch sensor.
Each component of the touch sensor 30 will be described in detail later.

Next, the manufacturing method of the winding roll 10 is demonstrated.
In the winding roll 10, after the pattern portion 16 is formed on the support 14, the support 14 is wound around the winding core 12 to obtain the cylindrical winding roll 10.
The formation method of the pattern part 16 is not specifically limited, For example, a plating method, a silver salt method, a vapor deposition method, a printing method, etc. can be utilized suitably. In addition, the first conductive layer 20 and the second conductive layer 22 of the pattern unit 16 may be formed on the support 14 at the same time, and either the first conductive layer 20 or the second conductive layer 22 is formed. You may form the remainder after forming previously.

FIG. 7 is a schematic diagram illustrating an example of a winding roll manufacturing apparatus according to an embodiment of the present invention.
A manufacturing apparatus 40 shown in FIG. 7 is a roll-to-roll manufacturing apparatus. The manufacturing apparatus 40 has a rotating shaft 42 on which a support roll 15 described later is loaded. The first pass roller 43a and the first pass roller 43a are arranged in order from the upstream side of the winding direction _DF of the support 14 with respect to the rotating shaft 42. A two-pass roller 43b and a third pass roller 43c are provided.
The feed roller 44 and the nip roller 45 constitute a roller pair, and the feed roller 44 and the nip roller 45 are provided on the downstream side of the third pass roller 43c. A fourth pass roller 43d is provided on the downstream side of the roller pair constituted by the feed roller 44 and the nip roller 45. The core 12 is provided on the downstream side of the fourth pass roller 43d. A forming portion 48 is provided in the conveyance path of the support 14 between the feed roller 44 and the nip roller 45 and the fourth pass roller 43d.

The first pass roller 43 a to the fourth pass roller 43 d are rotating rollers that guide the support 14. The first pass roller 43a, the third pass roller 43c, and the fourth pass roller 43d are wound around the back surface 14b of the support 14, and the second pass roller 43b is wound around the front surface 14a of the support 14. The first pass roller 43 a is wound around the back surface 14 b of the support 14, the second pass roller 43 b is wound around the front surface 14 a of the support 14, and the third pass roller 43 c is wound around the back surface 14 b of the support 14.
A feed roller 44 is disposed in contact with the surface 14 a of the support 14. The nip roller 45 is in contact with the back surface 14 b of the support 14 and presses the support 14 against the feed roller 44, and the support 14 is sandwiched between the feed roller 44 and the nip roller 45. In this state, the support 14 is conveyed by the feed roller 44 in the winding direction _DF . The feed roller 44 may be configured to rotate by a motor, or may be a rotating roller without a motor.

Although not shown, the manufacturing apparatus 40 includes a motor that rotates the core 12 in the direction r, and a control unit that controls the forming unit 48, the motor, and the like. The direction r coincides with the winding direction _DF .
In addition to the members shown in the drawings, the manufacturing apparatus 40 includes a variety of sensors, a pair of transport rollers, and a guide member that regulates the position of the support 14 in the width direction. The structure which has various members, such as various members, may be sufficient.

The manufacturing apparatus 40 forms the first conductive layer 20 on the front surface 14a of the support 14 and the second conductive layer 22 on the back surface 14b by the forming unit 48 while transporting the support 14 in the winding direction _DF. Then, a plurality of pattern portions 16 and a plurality of gap portions 17 are formed. In this manufacturing apparatus, a cylindrical winding roll 10 is obtained by winding a support 14 on which a pattern portion 16 and a gap portion 17 are formed around a winding core 12.

In the manufacturing apparatus 40, the support roll 15 in which the support 14 is wound in a roll shape is loaded on the rotary shaft 42. When the support roll 15 is loaded on the rotary shaft 42, the support 14 is pulled out from this, and is wound around the first pass roller 43a, the second pass roller 43b, and the third pass roller 43c in this order from the downstream side to feed the feed roller. Guided between 44 and the nip roller 45. The support 14 is further passed through a predetermined conveyance path through the feed roller 44 and the nip roller 45, and is wound around the core 12 through the forming portion 48 and the fourth pass roller 43d.
When preparation for formation of the pattern part 16 by the formation part 48 is completed, the conveyance of the support body 14 is started. The feed of the support 14 from the support roll 15 and the winding of the support 14 on the winding core 12 are performed in synchronization to convey the support 14 in the winding direction _DF while patterning the support 14. The part 16 is formed, and the support 14 is wound around the winding core 12 to obtain the winding roll 10.

For example, the forming unit 48 forms a silver salt emulsion layer on the support 14 and exposes and develops the silver salt emulsion layer to obtain a metal thin wire 24 made of metallic silver to obtain the first conductive layer 20 and the second conductive layer 20. The conductive layer 22 is formed.
Specifically, the forming portion 48 applies a silver salt emulsion layer containing a photosensitive silver halide salt on the front surface 14a and the back surface 14b of the support 14 to form the first conductive layer 20 of the pattern portion 16 and The silver salt emulsion layer coated on the support 14 is exposed through an exposure mask for forming the second conductive layer 22.

In the exposure, for example, a region (not shown) to be the pattern portion 16 shown in FIG. In this case, the length L of the gap portion 17 is longer than the pattern length Lp of the pattern portion 16 in all the gap portions 17, that is, the relationship of Lp <L is satisfied.
The pattern part 16 can be formed using a method disclosed in JP 2011-129501 A, JP 2013-149236 A, JP 2014-112512 A, or the like, in addition to the above-described method. .

A method for forming the fine metal wires 24 of the first conductive layer 20 and the second conductive layer 22 in the pattern portion 16 other than the silver salt method described above will be described.
First, a method for forming the fine metal wires 24 of the first conductive layer 20 and the second conductive layer 22 by plating will be described. For example, the fine metal wire 24 can be formed of a metal plating film formed on the underlayer by electroless plating on the electroless plating underlayer. In this case, the catalyst ink containing at least metal fine particles is formed in a pattern on the substrate, and then the substrate is immersed in an electroless plating bath to form a metal plating film. More specifically, the method for producing a metal film substrate described in JP 2014-159620 A can be used. In addition, after forming a resin composition having a functional group capable of interacting with at least a metal catalyst precursor in a pattern on a substrate, a catalyst or a catalyst precursor is applied, and the substrate is immersed in an electroless plating bath. It is formed by forming a metal plating film. More specifically, the method for producing a metal film substrate described in JP 2012-144661 A can be applied.

A method for forming the fine metal wires 24 of the first conductive layer 20 and the second conductive layer 22 by vapor deposition will be described. First, a thin metal wire 24 can be formed by forming a copper foil layer by vapor deposition and forming a copper wiring from the copper foil layer by a photolithography method. As the copper foil layer, an electrolytic copper foil can be used in addition to the deposited copper foil. More specifically, a step of forming a copper wiring described in JP 2014-29614 A can be used.
A method of forming the fine metal wires 24 of the first conductive layer 20 and the second conductive layer 22 by a printing method will be described. First, the thin metal wire 24 can be formed by applying a conductive paste containing a conductive powder to the substrate in the same pattern as the fine metal wire 24 and then performing a heat treatment. The pattern formation using the conductive paste is performed by, for example, an ink jet method or a screen printing method. More specifically, as the conductive paste, a conductive paste described in JP 2011-28985 A can be used.

Hereinafter, the fine metal wires 24 of the first conductive layer 20 and the second conductive layer 22 will be described. Note that the fine metal wires 24 of the first conductive layer 20 and the second conductive layer 22 are the first detection unit 32 and the second detection unit 34 when the pattern unit 16 is applied to the touch sensor 30 shown in FIG. Configure.
The line width w of the thin metal wire 24 is not particularly limited. However, if the thin wire 24 has a line width w of 0.5 μm or more and 5 μm or less, the first conductive layer 20 and the second conductive layer having a low resistance are used. Layer 22 can be formed relatively easily.
In the first detection unit 32 and the second detection unit 34 of the touch sensor 30 illustrated in FIG. 6, the line width w of the thin metal wire 24 is preferably 0.5 μm or more and 5 μm or less from the viewpoint of the low resistance described above. .
In the touch sensor 30 shown in FIG. 6, when the thin metal wire 24 is applied as a peripheral wiring (lead wiring), the line width w of the fine metal wire 24 is preferably 500 μm or less, more preferably 50 μm or less, and particularly preferably 30 μm or less. preferable. If the line width w is in the above range, a low resistance peripheral wiring can be formed relatively easily.

  When the metal thin wire 24 is applied as a peripheral wiring, it can be a mesh pattern as in the case of the first conductive layer 20 and the second conductive layer 22. In that case, the line width w is not particularly limited. 30 μm or less, preferably 15 μm or less, more preferably 10 μm or less, particularly preferably 9 μm or less, most preferably 7 μm or less, preferably 0.5 μm or more, and more preferably 1.0 μm or more. If the line width w is in the above range, a low resistance peripheral wiring can be formed relatively easily.

The thickness t of the fine metal wire 24 is not particularly limited, but is preferably 1 to 200 μm, more preferably 30 μm or less, further preferably 20 μm or less, and 0.01 to 9 μm. Particularly preferred is 0.05 to 5 μm. When the thickness t is in the above range, a detection electrode having low resistance and excellent durability can be formed relatively easily.
The width w of the thin metal wire 24 and the thickness t of the thin metal wire 24 are obtained by obtaining a cross-sectional image of the take-up roll 10 including the thin metal wire 24, taking the cross-sectional image on a personal computer, and displaying it on the monitor. A horizontal line is drawn at two locations that define the line width w of the thin metal wire 24 to obtain the length between the horizontal lines. Thereby, the line width w of the thin metal wire 24 can be obtained. Further, horizontal lines are drawn at two locations that define the thickness t of the fine metal wires 24, and the length between the horizontal lines is obtained. Thereby, the thickness t of the thin metal wire 24 can be obtained.

<Conductor wire>
The thin conductive wire constitutes the first conductive layer 20 and the second conductive layer 22 and has electrical conductivity, and is composed of, for example, a thin metal wire 24. The thin metal wire 24 is made of, for example, a metal or an alloy, and can be made of a copper wire or a silver wire. The metal thin wire 24 preferably contains metallic silver, but may contain a metal other than metallic silver, such as gold or copper. The fine metal wires 24 preferably contain a polymer binder such as metal silver and gelatin, which is suitable for forming a mesh pattern.

  The thin metal wires 24 are not limited to those composed of the above-described metals or alloys. For example, metal oxide particles, silver pastes and metal pastes such as copper pastes, silver nanowires and copper nanowires, etc. It may contain metal nanowire particles.

In the first conductive layer 20 and the second conductive layer 22, the mesh pattern constituted by the fine metal wires 24 is not particularly limited, but is a triangle such as an equilateral triangle, an isosceles triangle, a right triangle, a square, It is preferably a rectangle, rhombus, parallelogram, trapezoidal quadrangle, hexagon, octagonal polygon, circle, ellipse, star, etc., or a geometric figure combining these. The mesh pattern is a combination of a large number of cells configured in a lattice shape with fine metal wires. Specifically, as shown in FIG. 4, a pattern in which a plurality of square lattices formed by intersecting metal thin wires 24 formed on the same surface of a transparent substrate are combined is intended. The mesh pattern may be a combination of similar and congruent grids, or may be a combination of differently shaped grids. The length of one side of the lattice is not particularly limited, but is preferably 50 to 500 μm because it is difficult to be visually recognized, and more preferably 150 to 300 μm. When the length of the side of the unit cell is in the above-mentioned range, it is possible to keep the transparency even better, and when it is attached to the front surface of the display device, it is possible to visually recognize the display.
In addition, the mesh pattern of the first conductive layer 20 and the second conductive layer 22 may be configured by combining curves. For example, a circular or elliptical lattice cell may be formed by combining arcs. . As the arc, for example, a 90 ° arc or a 180 ° arc can be used.

The mesh pattern of the first conductive layer 20 and the second conductive layer 22 may be a random pattern. The random pattern is, for example, a pattern in which polygons of different types and sizes are randomly combined. In addition to this, a random pattern is a pattern in which at least one of the arrangement pitch, the angle, the length, and the shape is not constant with respect to a polygon that forms the pattern. Here, the polygon may be substantially a polygon, and part or all of the sides may form a curve.
In this case, for example, the random pattern is a pattern in which the opening is a parallelogram in which the angle is preserved and the irregularity is given to the pitch with respect to the regular rhombus shape. Further, the random pattern may be a pattern in which the opening has a rhombus, and the rhombus-shaped angle is given irregularity with respect to the angle. The irregularity distribution may be a normal distribution or a uniform distribution.

<Support>
The support 14 is provided with the pattern portion 16 and the gap portion 17 described above.
The type of the support 14 is not particularly limited as long as the pattern part 16 described above, that is, the first conductive layer 20 and the second conductive layer 22 can be provided. Since the support 14 is wound, it is preferable that the support 14 has flexibility as a general property, and since it is required to be transparent for use in a touch panel, the support 14 is used. Is preferably a plastic film.
Further, the support 14 corresponds to the substrate 31 of the touch sensor 30 shown in FIG. 6 as described above. In this case, the support 14 is preferably transparent.
The support 14 may support the first conductive layer 20, the first peripheral wiring 33, the second conductive layer 22, and the second peripheral wiring 35 of the touch sensor 30 illustrated in FIG. 6. Good.

  Specific examples of the material constituting the support 14 include PET (polyethylene terephthalate) (258 ° C.), polycycloolefin (134 ° C.), polycarbonate (250 ° C.), acrylic resin (128 ° C.), PEN (polyethylene naphthalate). (269 ° C), PE (polyethylene) (135 ° C), PP (polypropylene) (163 ° C), polystyrene (230 ° C), polyvinyl chloride (180 ° C), polyvinylidene chloride (212 ° C) and TAC (triacetyl cellulose) ) (290 ° C.) or the like, and a plastic film having a melting point of about 290 ° C. or less is preferable, and PET, polycycloolefin, and polycarbonate are particularly preferable. Figures in parentheses are melting points.

  One preferred embodiment of the support 14 includes a treated substrate that has been subjected to at least one treatment selected from the group consisting of atmospheric pressure plasma treatment, corona discharge treatment, and ultraviolet irradiation treatment. By performing the above-described treatment, a hydrophilic group such as an OH group is introduced into the surface of the treated support 14, and the first conductive layer 20, the second conductive layer 22, and the support 14. Adhesion is further improved. Among the above-described treatments, atmospheric pressure plasma treatment is preferable in that the adhesion between the first conductive layer 20 and the second conductive layer 22 and the support 14 is further improved.

As another preferred embodiment of the support 14, it is preferable to have an undercoat layer containing a polymer on the surface on which the first conductive layer 20 and the second conductive layer 22 are provided. A photosensitive layer for forming the first conductive layer 20 and the second conductive layer 22 is formed on the undercoat layer, so that the first conductive layer 20, the second conductive layer 22 and the support are formed. Adhesion with 14 is further improved.
A method for forming the undercoat layer is not particularly limited, and examples thereof include a method in which a composition for forming an undercoat layer containing a polymer is applied on a substrate and heat-treated as necessary. The undercoat layer forming composition may contain a solvent, if necessary. Although the kind of solvent is not specifically limited, The solvent used with the composition for photosensitive layer formation mentioned later is illustrated. Moreover, latex containing polymer fine particles may be used as the composition for forming an undercoat layer containing polymer.
The thickness of the undercoat layer is not particularly limited, but is preferably 0.02 to 0.3 μm in that the adhesion between the first conductive layer 20 and the second conductive layer 22 and the support 14 is more excellent. 0.03-0.2 μm is more preferable.
Note that, if necessary, the take-up roll 10 may include, for example, antihalation other than the above-described undercoat layer as another layer between the support 14, the first conductive layer 20, and the second conductive layer 22. A layer may be provided.

It is not limited to the structure of the winding roll 10 shown in the above-mentioned FIGS. 1-3, Hereinafter, the other structure of a winding roll is demonstrated.
FIG. 8 is a schematic side view showing a transparent conductive film of the second example of the winding roll of the embodiment of the present invention, and FIG. 9 is a transparent conductive film of the second example of the winding roll of the embodiment of the present invention. FIG. 10 is a schematic plan view showing a film, and FIG. 10 is a schematic side view showing a second example of a winding roll according to an embodiment of the present invention.
8-10, the same code | symbol is attached | subjected to the same structure as the winding roll 10 shown in FIGS. 1-3, and the detailed description is abbreviate | omitted.
8 and 9 show a state before being wound around the core 12 and a state of the transparent conductive film 18.

The winding roll 11 shown in FIGS. 8 to 10 is different from the winding roll 10 shown in FIGS. 1 to 3 in that the length L of the gap 17 does not satisfy Lp <L. The other configuration is the same as that of the winding roll 10 described above.
As shown in FIGS. 8 and 9, the gap portions 17 of the pattern portion 16 are not all the same in length, and there are some that are longer than the pattern length Lp and shorter than the pattern length Lp. The length L of the gap portion 17 is satisfy Lp <L, as described above, the length _{L 1} of the gap 17 is _L 1 <Lp, the length _{L 2} of the gap 17 is _L 2 <Lp The length L ₃ of the gap 17 is L ₃ <Lp. The length L ₁ of the gap portion 17, the length L ₂ of the gap portion 17, and the length L ₃ of the gap portion 17 are in a relationship of L ₃ <L ₂ <L ₁ .
8 and pattern section 16 as shown in FIG. 9 is provided with a length L ₃ of the support 14 of the core 12 side from the gap portion 17, provided four pattern portion 16 along the winding direction D _F After being formed, the gap 17 has a length L. Two pattern portions 16 are provided with a length L ₃ of the gap portion 17. Next, the pattern portion 16 is provided with the length L ₁ of the gap portion 17.

When the transparent conductive film 18 provided with the pattern portion 16 in the arrangement shown in FIGS. 8 and 9 is wound around the core 12 to form the take-up roll 11 as shown in FIG. Neither the pattern portion 16 of the inner winding layer 60 nor the pattern portion 16 of the outer winding layer 62 in FIG. For this reason, like the winding roll 10, a short circuit does not occur in the pattern portion 16, and the occurrence of a failure such as the conductive thin wire of the pattern portion 16, that is, the metal thin wire 24 being burned out, can be prevented.
Further, in the winding roll 11, by providing the gap portion 17 shorter than the pattern length Lp, the number of pattern portions 16 per winding roll is increased as compared with the winding roll 10 described above. Can do. The arrangement density of the pattern portions 16 can be increased, and the productivity of the pattern portions 16 can be increased.

FIG. 11 is a schematic view showing a third example of the winding roll according to the embodiment of the present invention.
In the winding roll 11a shown in FIG. 11, the same components as those of the winding roll 10 shown in FIGS.
The winding roll 11a shown in FIG. 11 includes a pattern of the inner winding layer 60 in the outer winding layer 62 in the inner winding layer 60 and the outer winding layer 62 that overlap in the radial direction Dr of the winding core 12. The pattern portion 16 is disposed only in the region 19 corresponding to the portion 16.
In the radial direction Dr of the core 12, the pattern portion 16 is disposed only outside the inner pattern portion 16. In FIG. 11, four pattern portions 16 are arranged on the circumferential surface of the winding core 12 at equal intervals in the winding direction _DF . In addition, in the outer winding layer 62, if the pattern portion 16 is arranged only in the region 19 corresponding to the pattern portion 16 of the inner winding layer 60, the number of arrangement of the pattern portion 16 in the circumferential direction of the core 12; And the arrangement interval of the pattern part 16 is not limited to an equal interval. The circumferential direction of the winding core 12 and the winding direction _DF are the same direction.
Also in the winding roll 11a, as in the winding roll 10 described above, the pattern portion 16 is suppressed from straddling the gap portion 17 of the pattern portion 16, a short circuit does not occur in the pattern portion 16, and the conductive wire of the pattern portion 16 That is, it is possible to prevent the occurrence of a failure such as the metal thin wire 24 being burned out.

FIG. 12 is a schematic view showing a fourth example of the winding roll according to the embodiment of the present invention.
In the winding roll shown in FIG. 12, the same components as those of the winding roll 10 shown in FIGS.
The winding roll 11b shown in FIG. 12 includes a pattern of the inner winding layer 60 in the outer winding layer 62 in the inner winding layer 60 and the outer winding layer 62 overlapping in the radial direction Dr of the winding core 12. The pattern portion 16 is arranged in a region 19 corresponding to the portion 16. In addition, the pattern portion 16 is also arranged in a region 19 a where the pattern portion 16 is long because the gap portion 17 of the pattern portion 16 is long.
In FIG. 12, four pattern portions 16 are arranged on the circumferential surface of the winding core 12 at equal intervals in the winding direction _DF . Further, four pattern portions 16 are arranged on the circumferential surface of the core 12 at four positions with equal intervals in the winding direction _DF .

In the outer winding layer 62, the pattern portion 16 is disposed only in the region 19 corresponding to the pattern portion 16 of the inner winding layer 60. The arrangement of the pattern portion 16 in the circumferential direction of the core 12 is as follows. The number and the arrangement interval of the pattern portions 16 are not limited to equal intervals.
Also, with respect to the pattern portions 16 arranged with different phases, if the pattern portions 16 can be arranged, the number of arrangement of the pattern portions 16 in the circumferential direction of the core 12 and the arrangement interval of the pattern portions 16 are equal. It is not limited.
Also in the winding roll 11b, as in the winding roll 10 described above, the pattern portion 16 is suppressed from straddling the gap portion 17 of the pattern portion 16, a short circuit does not occur in the pattern portion 16, and the conductive wire of the pattern portion 16 That is, it is possible to prevent the occurrence of a failure such as the metal thin wire 24 being burned out. Moreover, the winding roll 11b can increase the number of the pattern parts 16 per one winding roll compared with the above-mentioned winding roll 11a. The arrangement density of the pattern portions 16 can be increased, and the productivity of the pattern portions 16 can be increased.

FIG. 13 is a schematic view showing a fifth example of the winding roll according to the embodiment of the present invention.
In the winding roll shown in FIG. 13, the same components as those of the winding roll 10 shown in FIGS.
The winding roll 11c shown in FIG. 13 includes a pattern winding layer 50 provided with at least one pattern portion 16 and a gap winding layer 52 provided only with the gap portion 17 in the radial direction Dr of the winding core 12. Alternatingly arranged. The outermost layer of the winding roll 11 c is a gap winding layer 52.

  In the pattern winding layer 50 provided with the pattern portion 16, the pattern portion 16 is provided with a gap portion 17 therebetween. The gap portion 17 of the pattern winding layer 50 may be shorter than the pattern length Lp of the pattern portion 16. Note that the length of the pattern winding layer 50 changes when the position in the radial direction Dr with respect to the core 12 changes. For this reason, the number of the pattern portions 16 arranged in the pattern winding layer 50 increases as the pattern winding layer 50 is farther in the radial direction Dr from the winding core 12.

The pattern winding layer 50 and the gap winding layer 52 are in a relationship between the inside and the outside of the winding layer, or in a relationship between the outside and the inside of the winding layer. For this reason, the pattern portion 16 of the outer winding layer 62 does not straddle the gap portion 17 of the pattern portion 16 of the inner winding layer 60, and the interval between the pattern portions 16 of the outer winding layer 62 is set to the inner winding. The pattern part 16 of the layer 60 does not straddle.
In the winding roll 11c, similarly to the winding roll 10 described above, the pattern portion 16 is suppressed from straddling the gap portion 17 of the pattern portion 16, a short circuit does not occur in the pattern portion 16, and the conductive wire of the pattern portion 16 That is, it is possible to prevent the occurrence of a failure such as the metal thin wire 24 being burned out.
The outermost layer of the winding roll 11c is not limited to the gap winding layer 52, and may be the pattern winding layer 50.

  The present invention is basically configured as described above. As mentioned above, although the winding roll of this invention was demonstrated in detail, this invention is not limited to the above-mentioned embodiment, Of course, in the range which does not deviate from the main point of this invention, a various improvement or change may be made. It is.

  The features of the present invention will be described more specifically with reference to the following examples. The materials, reagents, used amounts, substance amounts, ratios, processing details, processing procedures, and the like shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Accordingly, the scope of the present invention should not be construed as being limited by the specific examples shown below.

  In the present example, winding rolls of Examples 1 to 6 and Comparative Examples 1 to 12 in which the pattern interval of the pattern part and the thickness of the support were changed were produced, and the yield rate of the pattern part was determined. The pattern interval is the length of the gap portion 17.

<Good product yield>
Conduction inspection and surface inspection for each pattern part of the completed winding roll, the presence or absence of a location where an electrical continuity failure has occurred, and the overcurrent locally flowing in the pattern part. The presence or absence of breakage of the conductive thin wire such as the thin wire loss and discoloration of the conductive thin wire was confirmed. The pattern portion where the electrical continuity failure occurred and the pattern portion where the conductive thin wire was damaged were regarded as defective products. A pattern portion where there was no portion where an electrical continuity failure occurred and the above-described conductive thin wire was not damaged was determined as a good product.
For the continuity test, the continuity of the pattern portion was confirmed using a tester. For the surface inspection, an image of the pattern portion was obtained, and the defect of the conductive fine wire and the discoloration of the conductive fine wire were examined.
The good product yield (%) was obtained from the number of good products and the number of defective products in the pattern portion of the winding roll. If the yield rate is 100%, there is no defective product.

Hereinafter, the winding roll will be described.
In this example, a polyethylene terephthalate (PET) film (manufactured by Fuji Film) having a width of 250 mm and a length of 4000 m was used as the support.
The pattern portion 16 having a region of 200 mm in the width direction of the support and 300 mm in the longitudinal direction of the support was used as a unit pattern. An exposure mask for preparing the pattern portion 16 was prepared. In Examples 1-6 and Comparative Examples 1-12, the pattern length of the pattern part 16 was made all the same, and was 300 mm. The longitudinal direction of the support is the same as the winding direction _DF, and the width direction of the support is a direction orthogonal to the longitudinal direction.

  With respect to the above-mentioned film, the exposure mask which forms the pattern part 16 was exposed by the predetermined space | interval, and the pattern part 16 was formed as a unit pattern, and the transparent conductive film was produced. A transparent conductive film was wound around the core to obtain a winding roll. In the process of obtaining the winding roll, all the processes were performed with a roll-to-roll manufacturing apparatus. Hereinafter, a method for producing a transparent conductive film will be described.

<Method for producing transparent conductive film>
(Preparation of silver halide emulsion)
To the following 1 liquid maintained at a temperature of 38 ° C. and a pH of 4.5 (potential of hydrogen) 4.5, an amount corresponding to 90% of each of the following 2 liquid and 3 liquids was simultaneously added over 20 minutes while stirring, and 0.16 μm of Nuclear particles were formed. Subsequently, the following 4 and 5 solutions were added over 8 minutes, and the remaining 10% of the following 2 and 3 solutions were added over 2 minutes to grow to 0.21 μm. Further, 0.15 g of potassium iodide was added and ripened for 5 minutes to complete the grain formation.

1 liquid:
750 ml of water
9g gelatin
Sodium chloride 3g
1,3-Dimethylimidazolidine-2-thione 20mg
Sodium benzenethiosulfonate 10mg
Citric acid 0.7g
Two liquids:
300 ml of water
150 g silver nitrate
3 liquids:
300 ml of water
Sodium chloride 38g
Potassium bromide 32g
Potassium hexachloroiridium (III) (0.005% KCl 20% aqueous solution) 8 ml
Ammonium hexachlororhodate
(0.001% NaCl 20% aqueous solution) 10 ml
4 liquids:
100ml water
Silver nitrate 50g
5 liquids:
100ml water
Sodium chloride 13g
Potassium bromide 11g
Yellow blood salt 5mg

  Then, it washed with water by the flocculation method according to a conventional method. Specifically, the temperature was lowered to 35 ° C., and the pH was lowered using sulfuric acid until the silver halide precipitated (the pH was in the range of 3.6 ± 0.2). Next, about 3 liters of the supernatant was removed (first water washing). Further, 3 liters of distilled water was added, and sulfuric acid was added until the silver halide settled. Again, 3 liters of the supernatant was removed (second water wash). The same operation as the second water washing was further repeated once (third water washing) to complete the water washing / desalting step. The emulsion after washing with water and desalting was adjusted to pH 6.4 and pAg 7.5, and gelatin 3.9 g, sodium benzenethiosulfonate 10 mg, sodium benzenethiosulfinate 3 mg, sodium thiosulfate 15 mg and chloroauric acid 10 mg were added. Chemical sensitization is performed to obtain an optimum sensitivity at 0 ° C., and 100 mg of 1,3,3a, 7-tetraazaindene is added as a stabilizer and 100 mg of proxel (trade name, manufactured by ICI Co., Ltd.) is used as a preservative. It was. The finally obtained emulsion contains 0.08 mol% of silver iodide, and the ratio of silver chlorobromide is 70 mol% of silver chloride and 30 mol% of silver bromide. It was a silver iodochlorobromide cubic grain emulsion having a coefficient of 9%.

(Preparation of photosensitive layer forming composition)
1,3,3a, 7-tetraazaindene 1.2 × 10 ⁻⁴ mol / mol Ag, hydroquinone 1.2 × 10 ⁻² mol / mol Ag, citric acid 3.0 × 10 ⁻⁴ mol / Mol Ag, 2,4-dichloro-6-hydroxy-1,3,5-triazine sodium salt 0.90 g / mol Ag, a trace amount of hardener was added, and the coating solution pH was adjusted to 5. with citric acid. Adjusted to 6.
A polymer latex containing a dispersant composed of a polymer represented by (P-1) and a dialkylphenyl PEO sulfate ester (dispersant / polymer mass ratio is 2.0) with respect to gelatin contained in the coating solution. /100=0.02) and polymer / gelatin (mass ratio) = 0.5 / 1.

Furthermore, EPOXY RESIN DY 022 (trade name: manufactured by Nagase ChemteX Corporation) was added as a crosslinking agent. In addition, the addition amount of the crosslinking agent was adjusted so that the amount of the crosslinking agent in the photosensitive layer described later would be 0.09 g / m ² .
A photosensitive layer forming composition was prepared as described above.
In addition, the polymer represented by the above (P-1) was synthesized with reference to Japanese Patent No. 3305459 and Japanese Patent No. 3754745.

(Photosensitive layer forming step)
The above polymer latex was applied to both sides of the film to provide an undercoat layer having a thickness of 0.05 μm.
Next, an antihalation layer comprising a mixture of the above-described polymer latex and gelatin and a dye having an optical density of about 1.0 and decolorizing with an alkali of a developer was provided on the undercoat layer. The mixing mass ratio of polymer to gelatin (polymer / gelatin) was 2/1, and the polymer content was 0.65 g / m ² .
On the above-mentioned antihalation layer, the above-mentioned composition for forming a photosensitive layer is applied, and the above-mentioned polymer latex, gelatin and Epocross K-2020E (trade name: manufactured by Nippon Shokubai Co., Ltd., oxazoline-based cross-linking reactive polymer latex) (Crosslinkable group: oxazoline group)), Snowtex C (registered trademark, product name: manufactured by Nissan Chemical Industries, colloidal silica) and solid content mass ratio (polymer / gelatin / Epocross K-2020E / Snowtex C ( (Registered Trademark)) The composition mixed at 1/1 / 0.3 / 2 was applied so that the amount of gelatin was 0.08 g / m ² , thereby obtaining a supporting substrate having a photosensitive layer formed on both sides. A supporting substrate having a photosensitive layer formed on both sides is referred to as a film A. The formed photosensitive layer had a silver amount of 6.2 g / m ² and a gelatin amount of 1.0 g / m ² .

(Exposure development process)
As the exposure mask for forming the pattern portion 16, an exposure mask having a mesh pattern as shown in FIG. 4 was prepared. The exposure mask of the mesh pattern was arrange | positioned on both surfaces of the above-mentioned film A, and it exposed repeatedly using the parallel light which used the high pressure mercury lamp as the light source at the predetermined pattern space | interval. As the mesh pattern, one in which the length of one side of the lattice was set to 150 μm and the line width was set to 4 μm was used.
After the exposure, development was performed with the following developer, and further development was performed using a fixing solution (trade name: N3X-R for CN16X, manufactured by Fuji Film Co., Ltd.). Further, the substrate was rinsed with pure water and dried to obtain a support base having a pattern portion made of silver fine wires and a gelatin layer formed on both sides. The gelatin layer was formed between the silver thin wires. The resulting film is referred to as film B.

(Developer composition)
The following compounds are contained in 1 liter (L) of the developer.
Hydroquinone 0.037mol / L
N-methylaminophenol 0.016 mol / L
Sodium metaborate 0.140 mol / L
Sodium hydroxide 0.360 mol / L
Sodium bromide 0.031 mol / L
Potassium metabisulfite 0.187 mol / L

(Gelatin decomposition treatment)
The film B was immersed for 120 seconds in an aqueous solution (proteolytic enzyme concentration: 0.5 mass%, liquid temperature: 40 ° C.) of a proteolytic enzyme (Nagase ChemteX Biolase AL-15FG). The film B was taken out from the aqueous solution, immersed in warm water (liquid temperature: 50 ° C.) for 120 seconds, and washed. The film after gelatin degradation is designated as film C.

(Low resistance treatment)
The above-mentioned film C was calendered at a pressure of 30 kN using a calender device composed of a metal roller. At this time, PET having a rough surface shape with a line roughness Ra = 0.2 μm, Sm = 1.9 μm (measured with Keyence Corporation shape analysis laser microscope VK-X110 (JIS-B-0601-1994)) Polyethylene terephthalate) films were conveyed together so that their rough surfaces face the front and back surfaces of the above-mentioned film C, and the rough surface shape was transferred and formed on the front and back surfaces of the above-mentioned film C.
After the above-described calendar treatment, a heat treatment was performed by passing through a superheated steam tank having a temperature of 150 ° C. over 120 seconds. The film after the heat treatment is referred to as film D. This film D is a transparent conductive film and is wound around a winding core to become a winding roll.

Next, Examples 1 to 6 and Comparative Examples 1 to 12 will be described. In Examples 1 to 6 and Comparative Examples 1 to 12, the pattern length was 300 mm.
Example 1
In Example 1, the pattern interval was 301 mm, and the support thickness was 40 μm. Moreover, the core outer diameter of the core was set to 175 mm.
(Example 2)
In Example 2, the pattern interval was 301 mm, and the support thickness was 100 μm. Moreover, the core outer diameter of the core was set to 175 mm.
(Example 3)
In Example 3, the pattern interval was 301 mm, and the support thickness was 25 μm. Moreover, the core outer diameter of the core was set to 175 mm.
Example 4
In Example 4, the pattern interval was 301 mm, and the support thickness was 40 μm. Moreover, the core outer diameter of the core was set to 100 mm.
(Example 5)
In Example 5, the pattern interval was 301 mm, and the support thickness was 100 μm. Moreover, the core outer diameter of the core was set to 100 mm.
(Example 6)
In Example 6, the pattern interval was 301 mm, and the support thickness was 25 μm. Moreover, the core outer diameter of the core was set to 100 mm.

(Comparative Example 1)
In Comparative Example 1, the pattern interval was 75 mm, and the support thickness was 40 μm. Moreover, the core outer diameter of the core was set to 175 mm.
(Comparative Example 2)
In Comparative Example 2, the pattern interval was 75 mm, and the support thickness was 100 μm. Moreover, the core outer diameter of the core was set to 175 mm.
(Comparative Example 3)
In Comparative Example 3, the pattern interval was 75 mm, and the support thickness was 25 μm. Moreover, the core outer diameter of the core was set to 175 mm.
(Comparative Example 4)
In Comparative Example 4, the pattern interval was 75 mm, and the support thickness was 40 μm. Moreover, the core outer diameter of the core was set to 100 mm.
(Comparative Example 5)
In Comparative Example 5, the pattern interval was 75 mm, and the support thickness was 100 μm. Moreover, the core outer diameter of the core was set to 100 mm.
(Comparative Example 6)
In Comparative Example 6, the pattern interval was 75 mm, and the support thickness was 25 μm. Moreover, the core outer diameter of the core was set to 100 mm.

(Comparative Example 7)
In Comparative Example 7, the pattern interval was 298 mm, and the support thickness was 40 μm. Moreover, the core outer diameter of the core was set to 175 mm.
(Comparative Example 8)
In Comparative Example 8, the pattern interval was 298 mm, and the support thickness was 100 μm. Moreover, the core outer diameter of the core was set to 175 mm.
(Comparative Example 9)
In Comparative Example 9, the pattern interval was 298 mm, and the support thickness was 25 μm. Moreover, the core outer diameter of the core was set to 175 mm.
(Comparative Example 10)
In Comparative Example 10, the pattern interval was 298 mm, and the support thickness was 40 μm. Moreover, the core outer diameter of the core was set to 100 mm.
(Comparative Example 11)
In Comparative Example 11, the pattern interval was 298 mm, and the support thickness was 100 μm. Moreover, the core outer diameter of the core was set to 100 mm.
(Comparative Example 12)
In Comparative Example 12, the pattern interval was 298 mm, and the support thickness was 25 μm. Moreover, the core outer diameter of the core was set to 100 mm.

As shown in Table 1, in Examples 1 to 6, in which the pattern interval was longer than the pattern length, the yield rate of non-defective products was 100%. That is, there was no defective product in the pattern portion.
On the other hand, in Comparative Examples 1 to 12, in which the pattern interval was shorter than the pattern length, the yield of non-defective products was not 100%. Compared with Comparative Examples 7-12, the comparative example 1-6 in which the pattern space | interval was short had a bad yield rate.
In Examples 1 to 6, the pattern intervals were all the same, but even when the configuration shown in FIG. 10, the configuration shown in FIG. 11, the configuration shown in FIG. 12, and the configuration shown in FIG. It was confirmed that.

10, 11, 11a, 11b, 11c Winding roll 12 Core 14 Support 14a Surface 14b Back 15 Support roll 16 Pattern part 17 Gap part 19, 19a Region 20 First conductive layer 22 Second conductive layer 24 Metal Fine wire 30 Touch sensor 31 Substrate 32 First detection unit 33 First peripheral wiring 34 Second detection unit 35 Second peripheral wiring 37 Sensor region 40 Manufacturing apparatus 42 Rotating shaft 43a First pass roller 43b Second pass roller 43c Third Pass roller 43d Fourth pass roller 44 Feed roller 45 Nip roller 48 Forming part 50 Pattern winding layer 52 Gap winding layer 60 Inner winding layer 62 Outer winding layer D _F Winding direction Dr Radial direction L, L ₁ , L ₂ L ₃ length Lp pattern length R ₁ region R ₂ areas S _L potential S _R potential X second direction Y 1 of the direction t thickness w line width W width

Claims (8)

A cylindrical winding roll in which a support having a plurality of pattern portions is wound around a winding core,
The pattern portion is a transparent conductive portion having a conductive thin wire,
The pattern portions and the gap portions are alternately provided in the winding direction of the support,
A winding roll having at least one gap portion longer than a pattern length of the pattern portion in the winding direction among the gap portions.   The winding roll according to claim 1, wherein all the gaps are longer than the pattern length. In the inner winding layer and the outer winding layer overlapping in the radial direction of the core,
The end portion in the winding direction of the pattern portion of the outer winding layer is disposed at a position corresponding to the gap portion of the inner winding layer in the radial direction of the core. The winding roll according to 1 or 2. In the inner winding layer and the outer winding layer overlapping in the radial direction of the core,
The winding roll according to claim 1 or 2, wherein at least a part of the gap portion of the outer winding layer and the gap portion of the inner winding layer overlap in the winding direction. In the inner winding layer and the outer winding layer overlapping in the radial direction of the core,
The winding roll according to claim 1 or 2, wherein in the outer winding layer, the pattern portion is disposed only in a region corresponding to the pattern portion of the inner winding layer. In the inner winding layer and the outer winding layer overlapping in the radial direction of the core,
The winding roll according to claim 1 or 2, wherein in the outer winding layer, the pattern portion is disposed only in a region corresponding to the gap portion of the inner winding layer.   The pattern winding layer provided with at least one said pattern part and the gap | interval winding layer provided only with the said gap part are arrange | positioned alternately in the radial direction of the said core. Winding roll.   The said pattern part is a winding roll of any one of Claims 1-7 provided in both surfaces of the said support body.