JP2018121674A - 遊技機 - Google Patents

遊技機 Download PDF

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Publication number
JP2018121674A
JP2018121674A JP2017013749A JP2017013749A JP2018121674A JP 2018121674 A JP2018121674 A JP 2018121674A JP 2017013749 A JP2017013749 A JP 2017013749A JP 2017013749 A JP2017013749 A JP 2017013749A JP 2018121674 A JP2018121674 A JP 2018121674A
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JP
Japan
Prior art keywords
information
winning
output
game
management
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017013749A
Other languages
English (en)
Japanese (ja)
Inventor
卓也 菅原
Takuya Sugawara
卓也 菅原
龍一 浅井
Ryuichi Asai
龍一 浅井
勇樹 松井
Yuuki Matsui
勇樹 松井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Bussan Co Ltd
Original Assignee
Sanyo Bussan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Bussan Co Ltd filed Critical Sanyo Bussan Co Ltd
Priority to JP2017013749A priority Critical patent/JP2018121674A/ja
Publication of JP2018121674A publication Critical patent/JP2018121674A/ja
Priority to JP2021099084A priority patent/JP2021126587A/ja
Priority to JP2022209160A priority patent/JP7414119B2/ja
Pending legal-status Critical Current

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Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Landscapes

  • Pinball Game Machines (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2017013749A 2017-01-30 2017-01-30 遊技機 Pending JP2018121674A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2017013749A JP2018121674A (ja) 2017-01-30 2017-01-30 遊技機
JP2021099084A JP2021126587A (ja) 2017-01-30 2021-06-15 遊技機
JP2022209160A JP7414119B2 (ja) 2017-01-30 2022-12-27 遊技機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017013749A JP2018121674A (ja) 2017-01-30 2017-01-30 遊技機

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2021099084A Division JP2021126587A (ja) 2017-01-30 2021-06-15 遊技機

Publications (1)

Publication Number Publication Date
JP2018121674A true JP2018121674A (ja) 2018-08-09

Family

ID=63110280

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2017013749A Pending JP2018121674A (ja) 2017-01-30 2017-01-30 遊技機
JP2021099084A Pending JP2021126587A (ja) 2017-01-30 2021-06-15 遊技機
JP2022209160A Active JP7414119B2 (ja) 2017-01-30 2022-12-27 遊技機

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2021099084A Pending JP2021126587A (ja) 2017-01-30 2021-06-15 遊技機
JP2022209160A Active JP7414119B2 (ja) 2017-01-30 2022-12-27 遊技機

Country Status (1)

Country Link
JP (3) JP2018121674A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220369473A1 (en) * 2021-04-26 2022-11-17 Pac Tech - Packaging Technologies Gmbh Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder into a Through Hole

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018121675A (ja) * 2017-01-30 2018-08-09 株式会社三洋物産 遊技機
JP2020073133A (ja) * 2020-02-12 2020-05-14 株式会社三洋物産 遊技機
JP7167950B2 (ja) * 2020-02-25 2022-11-09 株式会社三洋物産 遊技機

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0173967U (enExample) * 1987-11-04 1989-05-18
JP2014239800A (ja) * 2013-06-12 2014-12-25 株式会社ソフイア 遊技機

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4374423B2 (ja) * 2003-08-21 2009-12-02 株式会社高尾 弾球遊技機
JP5411908B2 (ja) * 2011-10-28 2014-02-12 株式会社三共 遊技用システムおよび遊技用装置
JP6988066B2 (ja) * 2016-02-16 2022-01-05 株式会社三洋物産 遊技機
JP2018121675A (ja) * 2017-01-30 2018-08-09 株式会社三洋物産 遊技機
JP7039837B2 (ja) * 2017-02-03 2022-03-23 株式会社三洋物産 遊技機

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0173967U (enExample) * 1987-11-04 1989-05-18
JP2014239800A (ja) * 2013-06-12 2014-12-25 株式会社ソフイア 遊技機

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220369473A1 (en) * 2021-04-26 2022-11-17 Pac Tech - Packaging Technologies Gmbh Method for Soldering an Electronic Component to a Circuit Board by Jetting Liquefied Solder into a Through Hole
US12028987B2 (en) * 2021-04-26 2024-07-02 PAC Tech—Packaging Technologies GmbH Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole
US12349287B2 (en) 2021-04-26 2025-07-01 PAC Tech—Packaging Technologies GmbH Method for soldering an electronic component to a circuit board by jetting liquefied solder into a through hole

Also Published As

Publication number Publication date
JP2021126587A (ja) 2021-09-02
JP2023029464A (ja) 2023-03-03
JP7414119B2 (ja) 2024-01-16

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