JP2018117040A - Manufacturing method of wiring board and wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve surface smoothness of a conductive part of a substrate surface.SOLUTION: A manufacturing method of a wiring board, includes: a step of forming a conductive part by a conductive material to a first insulation layer, and forming an inner conductive layer onto the conductive part of the first insulation layer; and a step of forming a second insulation layer so as to cover the first insulation layer and the inner conductive layer, forming a penetration hole in which an inner surface between an end part of one side and the end part of the other side is not continuous to the second insulation layer on the inner conductive layer over a whole periphery when viewing from a predetermined direction, forming a first power supply film on the inner conductive layer in the penetration hole and a second power supply film on the second insulation layer separated from the first power supply film by forming a film from the predetermined direction by using a film forming method having anisotropy, supplying a power for the first power supply film through the conductive part, forming a via conductor into the penetration hole by an electric plating, supplying the power to the via conductor and the second power supply film through the conductive part after the formation of the via conductor, and forming a front surface conductive layer by the electric plating.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a wiring board and a wiring board.

  2. Description of the Related Art Conventionally, it is known that wiring boards used in various electronic devices and the like form via conductors for electrically connecting conductors formed between different layers by plating. For example, Patent Document 1 discloses that a via conductor is formed by forming a power supply film and supplying power to the power supply film.

JP 2003-110211 A

  However, when the via conductor and the conductor layer on the substrate surface continuous from the via conductor are formed by plating using the power supply film, there is room for improvement in the flatness of the substrate surface after plating.

  The present invention has been made in view of the above, and an object of the present invention is to provide a method of manufacturing a wiring board and a wiring board in which the flatness of a conductor portion on the surface of the board is improved.

  In order to achieve the above object, a method of manufacturing a wiring board according to an aspect of the present invention includes a step of forming a current-carrying portion with a conductive material with respect to a first insulating layer, and a step on the current-carrying portion of the first insulating layer A step of forming an inner conductor layer; a step of forming a second insulating layer so as to cover the first insulating layer and the inner conductor layer; and a second direction on the inner conductor layer from a predetermined direction. When viewed, the step of forming a through hole in which the inner surface between the end on one side and the end on the other side is not continuous over the entire circumference, and using the film forming method having anisotropy, By performing film formation from a predetermined direction, a first power supply film on the inner conductor layer in the through hole, a second power supply film on the second insulating layer separated from the first power supply film, And supplying power to the first power supply film through the energization unit, Forming via conductors in the through-holes by plating, supplying power to the via conductors and the second power supply film through the energizing portion after forming the via conductors, and forming a surface conductor layer by electroplating Forming.

  The wiring board according to an aspect of the present invention includes a first insulating layer having a current-carrying portion made of a conductive material, an internal conductor layer laminated on the current-carrying portion of the first insulating layer, and the first insulating layer. And a second insulating layer laminated so as to cover the inner conductor layer, a surface conductor layer laminated on the second insulating layer, and the second insulating layer on the inner conductor layer from a predetermined direction. When viewed, the inner conductor layer and the surface conductor layer are filled with a conductor material inside the through hole where the inner surface between the end portion on one side and the end portion on the other side is not continuous over the entire circumference. Via conductors for electrically connecting the two.

  According to the above wiring board manufacturing method and wiring board, when viewed from a predetermined direction, the inner surface between the end on one side and the end on the other side is not continuous over the entire circumference. After the film is formed, the power supply film is not formed on a part of the inner surface of the through hole in the second insulating layer, but is formed on the second insulating layer. The second power feeding film is formed in a state of being separated from the first power feeding film provided in the through hole. Then, by supplying power from the first insulating layer side via the inner conductor layer and the current-carrying portion, power is initially supplied only to the first power supply film, and after the via conductor is formed first, Is also supplied with power, and a surface conductor layer is formed. Therefore, since the formation of the surface conductor layer on the substrate surface is performed after the formation of the via conductor, it is possible to prevent a step or the like from being generated between the via conductor and the second power feeding film, and the surface flatness can be reduced. Can be improved.

  Here, the predetermined direction is a stacking direction of the first insulating layer, the inner conductor layer, and the second insulating layer, and a side on which the second insulating layer is stacked. Can do.

  The through-holes of the second insulating layer are not continuous when viewed from the side in which the second insulating layers are stacked in the stacking direction of each layer. When it is set as the structure which forms 2 electric power feeding films | membranes, the through-hole of the state in which the through-hole of a 2nd insulating layer is not continuous can be formed comparatively easily. Therefore, a wiring board having a flat conductor on the surface can be manufactured by a simpler method. Note that “the state in which the through holes of the second insulating layer are not continuous” refers to the stacking direction of the respective layers, and when the through hole is viewed from the side on which the second insulating layer is stacked, A state in which the inner surface of the through hole cannot be observed as a continuous surface.

  ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method and wiring board of a wiring board with which the flatness of the conductor part of a board | substrate surface was improved are provided.

It is sectional drawing of the wiring board which concerns on one Embodiment of this invention. It is a figure explaining the manufacturing method of a wiring board. It is a figure explaining the manufacturing method of a wiring board. It is a figure explaining the modification of a wiring board.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 1 is a cross-sectional view of a wiring board according to an embodiment of the present invention, showing a laminated structure of each layer. A wiring board 1 shown in FIG. 1 is used as a part constituting a multilayer wiring board. When the wiring board 1 is used as a part of the multilayer wiring board, the wiring board 1 and another board are stacked in the thickness direction. In FIG. 1, a partial cross section of the wiring board 1 is schematically shown.

  The wiring substrate 1 includes a first insulating layer 11, an internal conductor layer 12 stacked on the first insulating layer 11, a second insulating layer 13 stacked on the first insulating layer 11 and the internal conductor layer 12, A surface conductor layer 15 electrically connected to the inner conductor layer 12 via the via conductor 14 on the second insulating layer 13. In the present embodiment, the direction in which the first insulating layer, the inner conductor layer 12 and the second insulating layer 13 are stacked (vertical direction in FIG. 1) is referred to as a stacking direction. In FIG. 1, the first power supply film 16 formed on the bottom surface of the via conductor 14 on the surface of the inner conductor layer 12 and the first power supply film 16 formed on the bottom surface of the surface conductor layer 15 on the second insulating layer 13. The two power feeding films 17 are individually illustrated. When the first power supply film 16, the second power supply film 17, the via conductor 14, and the surface conductor layer 15 are made of the same material (for example, all copper), they are integrated. Moreover, when these materials are not the same material, it will be in the state which is not integrated as shown in FIG.

  The 1st insulating layer 11 and the 2nd insulating layer 13 are comprised from the material which has electrical insulation. In the present embodiment, as the first insulating layer 11 and the second insulating layer 13, for example, an insulating resin such as an epoxy resin, a polyamideimide resin, a polyamide resin, a polyimide resin, or an acrylic resin can be used. The first insulating layer 11 and the second insulating layer 13 may be made of different materials. Moreover, the thickness of the 1st insulating layer 11 is although it does not specifically limit, For example, it can be set as about 1 micrometer-500 micrometers.

  Although the 1st insulating layer 11 is exhibiting flat form, the opening 18 is provided in the position used as the bottom face of the internal conductor layer 12, and the electricity supply part 19 with which the conductor material was filled inside is formed. The energization portion 19 is provided to supply power to the first power supply film 16 and the second power supply film 17 when the via conductor 14 and the surface conductor layer 15 are formed by plating. The energizing section 19 may function as a via conductor for electrically connecting the internal conductor layer 12 and another conductor when assembling a multilayer laminated board from the wiring board 1 or the like. Further, instead of providing the opening 18 in the first insulating layer 11 as in the energizing part 19A of FIG. 1, the energizing part may be provided in layers on the surface of the first insulating layer 11 (the inner conductor layer 12 side). Good. The height (thickness) of the energizing portion 19 </ b> A is not particularly limited, and may have the same thickness as the internal conductor layer 12 or may have a thickness different from that of the internal conductor layer 12.

  The main components of the energization portion 19, the inner conductor layer 12 on the first insulating layer 11, a via conductor 14 and a surface conductor layer 15 described later are tantalum (Ta), nickel (Ni), copper (Cu), tungsten (W ), Platinum (Pt), palladium (Pd), iridium (Ir), ruthenium (Ru), rhodium (Rh), alloys containing these metals, or materials that are intermetallic compounds are preferably used. It is not limited to. In addition to the main component material, a trace amount of impurities may be included. The term “main component” means that the proportion of the component is 50% by mass or more. In the present embodiment, the case where the main component of the energizing portion 19, the internal conductor layer 12, the via conductor 14, and the surface conductor layer 15 is Cu will be described.

  The internal conductor layer 12 is a layer that forms wiring in the wiring board 1. Therefore, the shape of the inner conductor layer 12 is designed so that the wiring board 1 can perform a desired function. Moreover, although the thickness of the internal conductor layer 12 is not specifically limited, For example, it can be set as about 1 micrometer-500 micrometers, for example.

  The second insulating layer 13 is provided so as to cover the first insulating layer 11 and the inner conductor layer 12. The thickness of the second insulating layer 13 (thickness in the stacking direction from the interface with the first insulating layer 11) is not particularly limited, but is formed on the first insulating layer 11 and covers the inner conductor layer 12. For example, the thickness is set to be thicker than the inner conductor layer 12, and may be, for example, about 1 μm to 500 μm.

  The second insulating layer 13 on the inner conductor layer 12 is formed with a through hole 21 penetrating the second insulating layer 13, and the via conductor 14 is formed by filling the inside with a conductor material. As shown in FIG. 1, the shape of the through hole 21 (and the via conductor 14 formed therein) has a cross-sectional area as it goes from the end on the surface conductor layer 15 side toward the end on the inner conductor layer 12 side. The cross-sectional shape gradually increases so that becomes larger, and the cross-section becomes trapezoidal. In this shape, the via conductor 14 has a cross-sectional area larger than the cross-sectional area (area in a plane perpendicular to the stacking direction) of the end portion of the via conductor 14 on the surface conductor layer 15 side, and in plan view ( When the wiring board 1 is viewed from the upper surface), the via conductor 14 overlaps the cross section of the end portion on the surface conductor layer 15 side and forms an outer shape larger than that. In the example shown in FIG. 1, the cross-sectional area of the via conductor 14 other than the end portion on the surface conductor layer 15 side is larger than the cross-sectional area of the end portion on the surface conductor layer 15 side of the via conductor 14 in plan view, and A larger cross section than the end portion of the via conductor 14 on the surface conductor layer 15 side in plan view is formed.

  In other words, the shape of the through-hole 21 is the penetration on the surface conductor layer 15 side when viewed along the stacking direction from above (surface conductor layer 15 side), which is a predetermined direction, over the entire circumference of the through-hole 21. The inner surface between the end portion of the hole 21 and the end portion of the through hole 21 on the inner conductor layer 12 side which is the bottom surface is not continuous. “The inner surface is not continuous” means a state in which a part of the inner surface from one end portion of the through hole 21 to the other end portion appears to be broken when viewed from a predetermined direction. When the inner surface is flat, the state where the inner surface is interrupted cannot be confirmed when viewed along the direction in which the inner surface extends. On the other hand, even if the inner surface is flat, when viewed from a direction different from the extending direction, a portion between one end portion and the other end portion may not be visible. Such a state is called “the inner surface is not continuous”.

  Since the through hole 21 and the via conductor 14 of the second insulating layer 13 have the shape as described above, the surface conductor layer 15 can be formed flat.

  The surface conductor layer 15 is formed on the second insulating layer 13 so as to be electrically connected to the via conductor 14. Although the thickness of the surface conductor layer 15 is not specifically limited, For example, it can be set as about 1 micrometer-500 micrometers, for example.

  The via conductor 14 and the surface conductor layer 15 are formed by plating using a power supply film. The first power supply film 16 used for forming the via conductor 14 and the second power supply film 17 used for forming the surface conductor layer 15 are not particularly limited as long as they can supply power. For example, chromium (Cr ), Nickel (Ni), copper (Cu), and the like, alloys containing these metals, and the like can be used. Although the 1st electric power feeding film 16 and the 2nd electric power feeding film | membrane 17 can be suitably set in the range which can perform the electric power feeding concerning plating appropriately, For example, it can be set as about 100 nm-several dozen micrometer. The first power supply film 16 and the second power supply film 17 are physically separated (not continuous). As a result, the surface of the surface conductor layer 15 formed by plating, in particular, the surface conductor layer 15 above the via conductor 14 can be formed flat.

  The manufacturing method of said wiring board 1 is demonstrated referring FIG.2 and FIG.3. First, as shown in FIG. 2A, a first insulating layer 11 is prepared. And after providing the opening 18 with a laser etc., the inside is filled with a conductor material and the electricity supply part 19 is formed (step which forms an electricity supply part). In the case where the current-carrying portion 19A is provided in the form of a layer on the surface of the first insulating layer 11 (on the inner conductor layer 12 side) (see FIG. 1), the opening 18 is not formed and the next inner conductor layer 12 is formed. An energizing portion 19A is formed.

  Next, as shown in FIG. 2B, the inner conductor layer 12 and the second insulating layer 13 are formed on the first insulating layer 11, and the through hole 21 is formed in the second insulating layer 13. First, the inner conductor layer 12 is formed so as to be electrically connected to the energization portion 19 of the first insulating layer 11 (step of forming the inner conductor layer). The method for forming the inner conductor layer 12 is not particularly limited. For example, after a metal film to be the inner conductor layer is formed on the first insulating layer 11, a desired wiring shape is formed by pattern etching using a resist or the like. The method can be used. After forming the inner conductor layer 12, the second insulating layer 13 is formed so as to cover the surfaces of the first insulating layer 11 and the inner conductor layer 12 (step of forming a second insulating layer). Thereafter, a through hole 21 is formed in the second insulating layer 13 on the internal conductor layer 12 (step of forming a through hole). As a method of forming the through hole 21, for example, laser irradiation or photolithography can be used.

  As described above, the through hole 21 has a small cross section at the end on the upper surface side of the second insulating layer 13 (that is, the side on which the surface conductor layer 15 is formed), and the cross sectional area increases toward the inner conductor layer 12 side. Become. At this time, the through hole 21 is formed so that the inner surface of the through hole 21 is inclined with respect to the stacking direction (vertical direction) of each layer and the inner surface is not visible from the upper surface side. As a method of forming such a through-hole 21, for example, a method of adjusting the intensity of laser light irradiated to the second insulating layer 13 can be mentioned. Moreover, the method of enlarging the through-hole 21 by the side of the internal conductor layer 12 using the heat radiation at the time of irradiating the laser beam to the surface of the internal conductor layer 12 is also mentioned. Although the formation method of the through-hole 21 is not limited, by using the method as described above, an opening having a large cross-sectional area can be formed on the inner conductor layer 12 side. 2B, the second insulating layer 13 is divided into two upper and lower layers (layer 13A and layer 13B), and a sheet (an upper layer of the second insulating layer) in which an opening is already formed. 13B) may be attached to the surface composed of the inner conductor layer 12 and the lower layer of the second insulating layer 13 (layer 13A).

  Next, as shown in FIG. 2C, the first power supply film 16 is formed on the inner conductor layer 12 and the second power supply film 17 is formed on the second insulating layer 13 (first Step of forming a power feeding film and a second power feeding film). The film formation method of the first power supply film 16 and the second power supply film 17 is not particularly limited, but a film formation method having anisotropy is used. The film forming method having anisotropy is a method having anisotropy in the direction in which the film is formed (the direction in which the film grows and becomes thicker). As such a film formation method, typically, sputtering, vapor deposition, or the like can be used. Among these, since the sputtering method has high anisotropy, it is suitably used in the method for manufacturing the wiring board 1 according to the present embodiment.

  In FIG. 2C, the first power supply film 16 and the second power supply film are formed so that the films grow (thickness increases) in the stacking direction of each layer (vertical direction: the direction of arrow A in FIG. 2C). 17 is formed simultaneously. The inner surface of the through hole 21 is inclined so that the cross-sectional area on the inner conductor layer 12 side is increased. As a result, no power supply film is formed on the inner surface of the through hole 21, and the first power supply film 16 and the second power supply film 17 are formed in a separated state.

  Next, as shown in FIG. 3A, a resist 23 for specifying the shape of the surface conductor layer is formed. At this time, the second power feeding film 17 below the resist 23 may be removed or may remain.

  Thereafter, the via conductor 14 and the surface conductor layer 15 are formed by electroplating using the first feeding film 16 and the second feeding film 17. At this time, electroplating is performed by supplying power from the lower side (first insulating layer 11 side) using the energizing portion 19 filled in the opening 18 of the first insulating layer 11. .

  When power is supplied from the first insulating layer 11 side through the energizing portion 19, first, as shown in FIG. 3B, two locations of the inner conductor layer 12 and the first power supply film 16 formed thereon are provided. Only the power is supplied. Therefore, the metal 14 </ b> A that becomes the via conductor 14 is deposited only by plating on the first power supply film 16 side, and the metal 14 </ b> A in the through hole 21 of the second insulating layer 13 grows in the arrow B direction. A via conductor 14 is formed in (step of forming a via conductor).

  When the metal 14 </ b> A fills the through hole 21 of the second insulating layer 13, the metal 14 </ b> A and the second power supply film 17 are electrically connected to each other. Power is supplied via 19. As a result, the metal is deposited on both the metal 14 </ b> A that becomes the via conductor 14 and the second power supply film 17, and the metal that becomes the surface conductor layer 15 grows in the direction of arrow C indicated by the broken line. As a result, the surface conductor layer 15 having a flat surface is formed as shown in FIG. 1 (step of forming the surface conductor layer). Thereafter, when the resist 23 is removed, the wiring substrate 1 of FIG. 1 is obtained.

  As described above, according to the wiring substrate 1 and the manufacturing method thereof according to the present embodiment, the power supply film is not formed on a part of the inner surface of the through hole 21 in the second insulating layer 13, and the second insulating layer 13 is not formed. The second power supply film 17 for the surface conductor layer 15 formed thereon is formed in a state of being separated from the first power supply film 16 provided in the through hole 21 for the via conductor 14. Then, by feeding power from the first insulating layer 11 side through the inner conductor layer 12 and the current-carrying portion 19, at first, the inner conductor layer 12 and the first feeding film 16 formed thereon are only at two places. Power is supplied and the via conductor 14 can be formed first. Then, after the via conductor 14 is formed, the second power feeding film 17 is also fed, and the surface conductor layer 15 is formed on the via conductor 14 and the second power feeding film 17. Therefore, it is possible to prevent a step in the surface conductor layer 15 from being generated between the via conductor 14 and the second power feeding film 17, and the surface flatness can be improved.

  In the conventional method of forming a via conductor and a surface conductor layer by general plating, a power supply film is also formed on the inner surface of the through-hole 21, and the first power supply film 16 and the second power supply film 17 are continuous. . Therefore, power is not supplied to only one of them. In general, the metal deposited on the power supply film grows with a substantially uniform thickness on the power supply film. In the through hole 21 of the second insulating layer 13, metal is deposited from the first power supply film 16 formed on the bottom surface, so that both the first power supply film 16 and the second power supply film 17 have the same thickness. Even if the metal grows only, the height position (height position in the stacking direction) of the surface is different, and the metal surface on the first feeding film 16 side is more than the metal surface on the second feeding film 17 side. Lower. In this conventional method, a feeding film is also formed on the inner surface of the through hole 21 of the second insulating layer 13, but the growth direction of the metal is different from the vertical direction (stacking direction). Therefore, in the wiring board, the height of the metal surface formed on the via conductor 14 is higher than the height position of the metal surface formed on the second power supply film 17 (height position in the stacking direction). The position is lowered. Therefore, there is room for improvement in the flatness of the conductor portion on the surface of the substrate.

  On the other hand, in the wiring board 1 and the manufacturing method thereof according to the present embodiment, the first power feeding film 16 for forming the via conductor 14 and the surface conductor layer 15 on the surface of the second insulating layer 13 are formed. The via conductors 14 are formed by feeding power to the first power supply film 16 in advance by feeding power from the first insulating layer 11 side. Thereafter, the surface conductor layer 15 is formed on the via conductor 14 and the second power feeding film 17. Thereby, since the surface of the surface conductor layer 15 can be manufactured with a more uniform height, the wiring board 1 with improved surface flatness can be obtained. And according to said wiring board 1, the flatness of the trunk | drum part of a surface is improved.

  In addition, as described above, in order to form the first power supply film 16 and the second power supply film 17 in a separated state, the shape of the through hole 21 of the second insulating layer 13 is changed, and anisotropy is performed. The power feeding film is provided by a film forming method having Conventionally, the through-hole 21 for forming the via conductor 14 extends in the laminating direction and has a substantially uniform cross-sectional area, or has a large surface (surface conductor layer 15 side) and a cross-sectional area that decreases toward the bottom surface. This was common. In this case, even if film formation is performed along the stacking direction using an anisotropic film formation method, the metal material adheres to at least a part of the inner surface of the through hole 21, and the first power supply film 16 and the second power supply film 16 There is a possibility that the power feeding film 17 continues.

  On the other hand, in the wiring board 1 and the manufacturing method thereof according to the present embodiment, when viewed along the stacking direction from the upper side (surface conductor layer 15 side) that is the predetermined direction over the entire circumference of the through hole 21. The end portion of the through hole 21 on the surface conductor layer 15 side and the end portion of the through hole 21 on the inner conductor layer 12 side which is the bottom surface are not continuous. In the example shown in FIG. 1, the cross-sectional area of the through-hole 21 on the bottom surface side is larger, and the entire inner surface of the through-hole 21 cannot be confirmed when viewed from above in the stacking direction. Therefore, when the film is formed from above in the predetermined direction along the stacking direction, it is possible to prevent the first power supply film 16 and the second power supply film 17 from being continuously formed. Therefore, when power is supplied from the lower side, the via conductor 14 can be manufactured in advance, and the flatness of the surface conductor layer 15 can be improved.

  Further, as in the wiring substrate of the present embodiment, the first through-hole film 21 is not continuous when viewed from above in the stacking direction, and the first power feeding is performed by film formation from above. When the film 16 and the second power feeding film 17 are configured, a through hole in which the through hole 21 of the second insulating layer 13 is not continuous can be formed relatively easily. Therefore, a wiring board having a flat conductor on the surface can be manufactured by a simpler method. The “predetermined direction” that is the direction in which the film is formed is not limited to the “direction along the stacking direction from above” described in the present embodiment. However, since the first feeding film 16 at the bottom of the through hole 21 can be formed in a state where the through hole 21 is formed in the second insulating layer 13, the film forming direction is limited. It is possible.

  The shape of the through hole 21 of the second insulating layer 13 for separating the first power supply film 16 and the second power supply film 17 is downward (in the inner conductor layer 12 side) as shown in FIG. It is not limited to a widened shape. As described above, when viewed from a predetermined direction over the entire circumference of the through hole 21, the end of the through hole 21 on the surface conductor layer 15 side and the end of the through hole 21 on the inner conductor layer 12 side which is the bottom surface If the state where the gaps are not continuous is formed and the power feeding film can be formed from the direction, a configuration in which the first power feeding film 16 and the second power feeding film 17 are not continuous can be obtained. .

  FIG. 4 shows an example of the wiring board 2 having different opening shapes. In the wiring board 2 shown in FIG. 4, the through hole 25 formed in the second insulating layer 13 has a so-called via barrel shape in which the central portion is larger than the end portion, and is seen along the stacking direction. A region having the largest cross-sectional area is formed in the middle of the time. As a method of forming the through hole 25 having such a shape, for example, adjustment of the intensity of laser light to be irradiated can be cited.

  When the through hole 25 has a shape as shown in FIG. 4, the through hole on the surface conductor layer 15 side when viewed from above (surface conductor layer 15 side) is provided by providing a region having a large cross-sectional area. The 25 end portion and the bottom end portion of the through hole 25 on the inner conductor layer 12 side which is the bottom surface are not continuous. Therefore, when the film is formed from above in the stacking direction, the first power supply film 16 and the second power supply film 17 are prevented from being continuously formed. Therefore, when power is supplied from the lower side, the via conductor 14 can be manufactured in advance, and the flatness of the surface conductor layer 15 can be improved. In addition, the same effect can be acquired also when the through-hole 25 is not a via barrel shape but a so-called bottleneck shape in which the central portion is smaller than the end portion.

  Thus, the shape of the through hole formed in the second insulating layer 13 in order to form the via conductor 14 that connects the internal conductor layer 12 and the surface conductor layer 15 can be appropriately changed.

  As mentioned above, although embodiment of this invention has been described, this invention is not necessarily limited to embodiment mentioned above, A various change is possible in the range which does not deviate from the summary.

  For example, although the case where the first power supply film 16 and the second power supply film 17 are formed simultaneously has been described, the first power supply film 16 and the second power supply film 17 may not be formed simultaneously. When viewed from a predetermined direction over the entire circumference of the through hole 21 (here, when viewed from the surface conductor layer 15 side and along the stacking direction), the end and bottom surface of the through hole 21 on the surface conductor layer 15 side If the gap between the end of the through hole 21 on the inner conductor layer 12 side is not continuous, the first feeding film and the second feeding film are discontinuously formed when the film is formed from that direction. Can be formed.

  DESCRIPTION OF SYMBOLS 1, 2 ... Wiring board, 11 ... 1st insulating layer, 12 ... Internal conductor layer, 13 ... 2nd insulating layer, 14 ... Via conductor, 15 ... Surface conductor layer, 16 ... 1st electric power feeding film, 17 ... 2nd electric power feeding Membrane, 18 ... opening, 19 ... energization part, 21, 25 ... through hole.

Claims (3)

Forming a current-carrying portion with a conductive material for the first insulating layer;
Forming an internal conductor layer on the energization portion of the first insulating layer;
Forming a second insulating layer so as to cover the first insulating layer and the inner conductor layer;
A through-hole in which the inner surface between one end and the other end is not continuous over the entire circumference when viewed from a predetermined direction in the second insulating layer on the inner conductor layer. Forming step;
The first power supply film on the inner conductor layer in the through hole is separated from the first power supply film by performing film formation from the predetermined direction using a film formation method having anisotropy. Forming a second power feeding film on the second insulating layer;
Supplying power to the first power supply film through the current-carrying portion, and forming a via conductor in the through hole by electroplating;
Supplying power to the via conductor and the second power supply film through the energization part after forming the via conductor, and forming a surface conductor layer by electroplating;
A method of manufacturing a wiring board having   2. The wiring according to claim 1, wherein the predetermined direction is a stacking direction of the first insulating layer, the inner conductor layer, and the second insulating layer, and is a side on which the second insulating layer is stacked. A method for manufacturing a substrate. A first insulating layer having a current-carrying portion made of a conductive material;
An inner conductor layer laminated on the energization part of the first insulating layer;
A second insulating layer laminated to cover the first insulating layer and the inner conductor layer;
A surface conductor layer laminated on the second insulating layer;
When the second insulating layer on the inner conductor layer is viewed from a predetermined direction, the inner surface between the end on one side and the end on the other side is not continuous over the entire circumference. A via conductor filled with a conductor material, and electrically connecting the inner conductor layer and the surface conductor layer;
A wiring board having:

Images