JP2018114635A - Method for molding repair patch, repair patch, method for repairing part to be repaired, and repair part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for molding a repair patch capable of suppressing deterioration of adhesive strength.SOLUTION: There is provided a method for molding a repair patch 10 used for a part to be repaired in a member, the repair patch 10 being prepared by laminating a plurality of repair patch strips 11, 12 formed from a composite material that is cured in advance. The method comprises: a first repair patch strip arranging step S1 of arranging the first repair patch strip 11 as being before curing, on a molding tool 21; a releasing material arranging step S2 of arranging a releasing material on the first repair patch strip 11; a second repair patch strip arranging step S3 of arranging the second repair patch strip 12 as being before curing, on the releasing material; and a molding step S4 of curing the first repair patch strip 11 and the second repair patch strip 12 in a state where the releasing material is sandwiched between the first repair patch strip 11 and the second repair patch strip 12.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method for forming a repair patch used for repairing a repaired portion of a member, a repair patch, a repair method for a repaired portion, and a repair portion.

  Conventionally, a repair method for a repaired part is known in which a repaired part formed on a repair target is covered with a repair patch and the repair patch is bonded to the repair target (see, for example, Patent Document 1). In this repair method, a repair patch is formed by laminating a plurality of pre-cured repair plates via an adhesive.

JP 2014-188995 A

  However, in the repair method of the repaired part of Patent Document 1, a plurality of repair plates that have been hardened in advance are stacked with an adhesive to form a repair patch. There is sex. If the distance between the repair plates becomes uneven, the adhesive becomes rich in the part where the distance is wide, and in the rich part, voids are likely to occur or the adhesive strength may be reduced. is there.

  Then, this invention makes it a subject to provide the shaping | molding method of the repair patch which can suppress the fall of adhesive strength, a repair patch, the repair method of a to-be-repaired part, and a repair part.

  The method for forming a repair patch according to the present invention is a method for forming a repair patch used for a repaired part to be repaired. The repair patch includes a repair patch piece formed of a composite material that has been cured in advance. A first repair patch piece arranging step of arranging a plurality of the first repair patch pieces before being cured on a forming tool, and a first repair patch piece so as to cover the first repair patch pieces. A mold release material arranging step of arranging a mold release material on the repair patch piece, and before the curing on the mold release material so as to cover the first repair patch piece with the mold release material interposed therebetween. A second repair patch piece placement step of placing the second repair patch piece, and a first sandwiching material between the first repair patch piece and the second repair patch piece. And curing the second repair patch piece and the second repair patch piece. Characterized in that it comprises a step.

  According to this configuration, when the first repair patch piece and the second repair patch piece are cured, the release material can be sandwiched and cured. For this reason, the space | interval between a 1st repair patch piece and a 2nd repair patch piece can be uniformly maintained with a mold release material so that it may become uniform thickness in forming an adhesive bond layer. For this reason, the adhesive layer formed between the first repair patch piece and the second repair patch piece becomes uniform, and a repair patch that can suppress a decrease in adhesive strength can be formed.

  Further, during repair, an adhesive layer is formed between the first repair patch piece and the second repair patch piece, and the release material is provided on the first repair patch piece. A first release film, a second release film provided on the second repair patch piece, and provided between the first release film and the second release film, simulating the adhesive layer And in the release material arranging step, the first release film is arranged on the first repair patch piece, and the spacer is arranged on the first release film. And it is preferable to arrange | position the said 2nd release film on the said spacer.

  According to this configuration, the distance between the first repair patch piece and the second repair patch piece can be accurately and uniformly formed using the spacer having a layer thickness simulating the adhesive layer. Further, the first repair patch piece and the second repair patch piece can be suitably separated by the first release film and the second release film. The spacer is not particularly limited as long as it can form the interval between the first repair patch piece and the second repair patch piece, and any spacer may be used.

  Moreover, it is preferable that the said spacer is an adhesive sheet for forming the said adhesive bond layer.

  According to this configuration, the flow of the adhesive sheet melted by heating can be reproduced, and the interval between the first repair patch piece and the second repair patch piece can be formed by simulating repair time. .

  Further, at the time of repair, an adhesive layer is formed between the first repair patch piece and the second repair patch piece, and the release material has a layer thickness simulating the adhesive layer. It is preferable that

  According to this structure, the space | interval of a 1st repair patch piece and a 2nd repair patch piece can be shape | molded accurately and uniformly only by a mold release material.

  Further, at the time of repair, an adhesive layer is formed between the first repair patch piece and the second repair patch piece, and the release material has a layer thickness simulating the adhesive layer. It is preferable to consist of a plurality of release films laminated in such a manner.

  According to this structure, the space | interval of a 1st repair patch piece and a 2nd repair patch piece can be shape | molded accurately and uniformly with the some release film laminated | stacked.

  Moreover, it is preferable that the said repair patch piece is shape | molded so that thickness may become thin toward an outer edge part in the surface orthogonal to the lamination direction of the said repair patch piece.

  According to this configuration, since the stress applied to the end portion of the repair patch piece can be dispersed, the stress concentration on the end portion of the repair patch can be reduced.

  Further, the method further includes a peel material arrangement step in which at least one surface in the laminating direction of the repair patch piece is an adhesive surface, and a peel material to be peeled off to activate the adhesive surface is provided on the adhesive surface. Is preferred.

  According to this configuration, since the repair patch piece provided with the peel material can be formed, the adhesive surface of the repair patch piece is activated by peeling off the peel material at the time of repair using the repair patch piece. be able to.

  Moreover, it is preferable that the said shaping | molding tool has a tool surface in which the said repair patch piece before hardening is arrange | positioned, and the said tool surface is a flat surface.

  According to this configuration, the repair patch can be formed by laminating the repair patch pieces before curing on the flat tool surface of the forming tool. Moreover, since the tool surface of the forming tool is flat, the forming tool can be simplified.

  Moreover, it is preferable that the said shaping | molding tool has a tool surface where the said repair patch piece before hardening is arrange | positioned, and the said tool surface is a surface which simulated the said to-be-repaired part.

  According to this configuration, since the repair patch piece can be formed in accordance with the shape of the repaired part, the repair patch piece can be arranged in the repaired part without deforming the repair patch piece at the time of repair. it can. For this reason, the residual stress which generate | occur | produces in the repair patch piece after repair can be reduced.

  The method further includes a deaeration circuit forming member step of installing a deaeration circuit forming member for forming a deaeration circuit between the first repair patch piece and the second repair patch piece. ,preferable.

  According to this configuration, since a deaeration circuit can be formed between the first repair patch piece and the second repair patch piece, the first repair patch piece and the second repair patch can be used during repair. The space between the pieces can be properly deaerated. For this reason, generation | occurrence | production of the void formed in the adhesive bond layer between a 1st repair patch piece and a 2nd repair patch piece can be suppressed.

  The repair patch of the present invention is a repair patch used for a repaired part to be repaired of a member, and includes a first repair patch piece formed of a composite material cured in advance, and the first repair patch piece. A second repair patch piece disposed on the first repair patch piece and formed from a pre-cured composite so as to cover the first repair patch piece and the second repair patch piece The gap formed between the repair patch pieces has a uniform thickness.

  According to this configuration, since the adhesive layer formed between the first repair patch piece and the second repair patch piece can be made to have a uniform thickness, the formation of the portion where the adhesive is rich is formed. It can suppress and the fall of adhesive strength can be controlled.

  Moreover, it is preferable to further provide an adhesive sheet provided between the first repair patch piece and the second repair patch piece.

  According to this structure, these can be handled in the state which pinched | interposed the adhesive sheet between the 1st repair patch piece and the 2nd repair patch piece.

  In addition, the first repair patch piece has a non-circular shape when viewed from the direction facing the second repair patch piece, and the second repair patch piece includes the first repair patch piece. It is preferable that the non-circular shape is similar to the first repair patch piece, which is larger than the patch piece.

  According to this configuration, the non-circular first repair patch piece and the non-circular second repair patch piece that is similar to each other are formed on the basis of the shape of each repair patch piece. It can arrange | position so that a center may overlap. Therefore, the positioning of the second repair patch piece with respect to the first repair patch piece is accurately performed so that the gap formed between the first repair patch piece and the second repair patch piece has a uniform thickness. Can be done well. The non-circular shape is not particularly limited as long as the shape is, for example, an elliptical shape or a rectangular shape, and the shape allows positioning of the first repair patch piece and the second repair patch piece.

  A repair method for a repaired part according to the present invention is a repair method for a repaired part that repairs a repaired part that is a repair target of a member using the repair patch described above. A first adhesive sheet placing step, and the first repair patch piece is placed on the first adhesive sheet so as to cover the portion to be repaired with the first adhesive sheet interposed therebetween. A first repair patch piece stacking step to be disposed; a second adhesive sheet in which a second adhesive sheet is disposed on the first repair patch piece; and the first repair patch piece sandwiching the second adhesive sheet. A second repair patch piece laminating step of placing the second repair patch piece on the second adhesive sheet so as to cover the first adhesive sheet, and melting the first adhesive sheet and the second adhesive sheet. And a molding step for curing.

  According to this configuration, the adhesive layer (adhesive sheet cured by melting) formed between the first repair patch piece and the second repair patch piece can have a uniform thickness. The formation of the portion where the agent becomes rich can be suppressed, and the decrease in the adhesive strength can be suppressed.

  In addition, it is preferable to further include a lightning protection member arranging step of arranging a lightning protection member so as to cover the first repair patch piece and the second repair patch piece before the forming step.

  According to this configuration, since the lightning protection member can be installed together with the repair of the repaired portion, the work efficiency can be improved.

  In addition, a deaeration circuit member arranging step of arranging a deaeration circuit member serving as a deaeration circuit together with the second adhesive sheet between the first repair patch piece and the second repair patch piece, It is preferable to provide further.

  According to this configuration, since the deaeration circuit can be formed between the first repair patch piece and the second repair patch piece by the deaeration circuit member, the first repair patch piece and the second repair patch are formed. The space between the patch pieces can be properly deaerated. For this reason, generation | occurrence | production of the void formed in the adhesive bond layer between a 1st repair patch piece and a 2nd repair patch piece can be suppressed.

  In addition, the first repair patch piece has a non-circular shape when viewed from the direction facing the second repair patch piece, and the second repair patch piece includes the first repair patch piece. A non-circular shape that is similar to the first repair patch piece that is larger than the patch piece, and in the second repair patch piece stacking step, It is preferable that the second repair patch piece is disposed so that the repair patch piece is accommodated and the center of the first repair patch piece and the center of the second repair patch piece overlap each other.

  According to this configuration, the second repair patch piece with respect to the first repair patch piece has a uniform thickness so that the gap formed between the first repair patch piece and the second repair patch piece has a uniform thickness. Positioning can be performed with high accuracy.

  The repaired part of the present invention is a repaired part formed by repairing a repaired part to be repaired with a repair patch, and the repaired part is provided with a first adhesive layer interposed therebetween. A first repair patch piece to be adhered to the first repair patch piece, and a second repair patch piece to be adhered via a second adhesive layer so as to cover the first repair patch piece, The adhesive layer has a uniform thickness.

  According to this configuration, since the adhesive layer formed between the first repair patch piece and the second repair patch piece can form a repair portion having a uniform thickness, the adhesive is rich. Formation of the part which becomes can be suppressed, and the fall of the adhesive strength in a repair part can be suppressed.

FIG. 1 is a cross-sectional view schematically illustrating an example of a repair patch according to the first embodiment. FIG. 2 is a cross-sectional view schematically illustrating another example of the repair patch according to the first embodiment. FIG. 3 is an explanatory diagram of an example relating to a repair patch forming method according to the first embodiment. FIG. 4 is an explanatory diagram of another example relating to the repair patch forming method according to the first embodiment. FIG. 5 is an explanatory diagram of another example related to the repair patch forming method according to the first embodiment. FIG. 6 is an explanatory diagram of an example of a repair method for a repaired part using the repair patch according to the first embodiment. FIG. 7 is an explanatory diagram of an example of a repair method for a repaired part using the repair patch according to the second embodiment. FIG. 8 is a cross-sectional view of an example schematically illustrating a method for forming a repair patch according to the third embodiment. FIG. 9 is a cross-sectional view of an example schematically illustrating a repair patch forming method according to the fourth embodiment. FIG. 10 is an explanatory diagram of another example related to the repair patch forming method according to the fifth embodiment. FIG. 11 is an explanatory diagram of an example of a repair method for a repaired part using the repair patch according to the sixth embodiment. FIG. 12 is an explanatory diagram of another example related to the method for forming a repair patch according to the seventh embodiment.

  Embodiments according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. In addition, constituent elements in the following embodiments include those that can be easily replaced by those skilled in the art or those that are substantially the same. Furthermore, the constituent elements described below can be appropriately combined, and when there are a plurality of embodiments, the embodiments can be combined.

[Embodiment 1]
The repair patch 10 according to the first embodiment has a defective portion formed on the member 1 due to damage or the like as a repair target, and is used when repairing the repaired portion 5 to be repaired.

  1 and 2 are cross-sectional views schematically showing an example of a repair patch according to the first embodiment. 3 to 5 are explanatory diagrams of an example relating to the repair patch forming method according to the first embodiment. FIG. 6 is an explanatory diagram of an example of a repair method for a repaired part using the repair patch according to the first embodiment. First, the repair patch 10 will be described prior to the method of forming the repair patch 10.

  As shown in FIG. 1, the repair patch 10 is a laminate of a plurality of repair patch pieces 11 and 12. In the first embodiment, the description is applied to the repair patch 10 in which the two repair patch pieces 11 and 12 are stacked. However, the number of stacks is not particularly limited, and may be three or more.

  The repair patch 10 includes a first repair patch piece 11 and a second repair patch piece 12. These repair patch pieces 11 and 12 are formed using a composite material in which reinforcing fibers and a resin are integrally formed. These repair patch pieces 11 and 12 are composite materials cured in advance. The composite material is, for example, carbon fiber reinforced plastic (CFRP) in which carbon fibers are used as reinforcing fibers. The reinforcing fiber is not limited to carbon fiber, and may be other plastic fiber, glass fiber, or metal fiber. The resin is, for example, a thermosetting resin or a thermoplastic resin. An example of the thermosetting resin is an epoxy resin. Examples of the thermoplastic resin include polyether ether ketone (PEEK), polyether ketone ketone (PEKK), and polyphenylene sulfide (PPS). In addition, resin is not limited to these, You may use other resin.

  The first repair patch piece 11 is formed in a disk shape, for example, and is bonded to the repaired part 5. The peripheral edge portion of the first repair patch piece 11 decreases in thickness from the center portion toward the outer end portion in a plane orthogonal to the stacking direction in which the first repair patch pieces 11 are laminated. It is molded into. For this reason, the first repair patch piece 11 has a large area on one side (upper surface in FIG. 1) bonded to the repaired part 5 and an area on the other side (lower surface in FIG. 1) on one side. It is narrow compared to the area.

  The second repair patch piece 12 is provided to face the first repair patch piece 11 so as to cover the first repair patch piece 11. The second repair patch piece 12 is formed, for example, in a disk shape having a larger diameter than the first repair patch piece 11, and is bonded to the first repair patch piece 11 and the portion to be repaired 5. Similar to the first repair patch piece 11, the peripheral edge of the second repair patch piece 12 is located on the outer side from the center in a plane perpendicular to the stacking direction in which the second repair patch pieces 12 are laminated. It is molded so that the thickness decreases toward the end.

  And this repair patch 10 is shape | molded by the shaping | molding method mentioned later so that the clearance gap formed between the 1st repair patch piece 11 and the 2nd repair patch piece 12 may become uniform thickness.

  The repair patch 10 may be handled so as to be stored and managed in a state where the first repair patch piece 11 and the second repair patch piece 12 are overlapped as shown in FIG. . Further, as shown in FIG. 2, the repair patch 10 has an adhesive sheet 13 (second adhesive sheet 42 described later) sandwiched between the first repair patch piece 11 and the second repair patch piece 12. It may be handled in such a way that it is stored and managed.

  Next, a method for forming the repair patch 10 will be described with reference to FIG. In this molding method, a molding tool 21 whose upper surface is a tool surface 25 is used. The tool surface 25 is a horizontal flat surface, and the first repair patch piece 11 and the second repair patch piece 12 before curing are disposed on the tool surface 25.

  In the method of forming the repair patch 10, first, the first repair patch piece 11 before being cured is placed on the tool surface 25 of the forming tool 21 (step S1: first repair patch piece arranging step). The tool surface 25 of the forming tool 21 is a release surface, and the first repair patch piece 11 after being cured is appropriately released from the forming tool 21. In addition, you may provide a release film between the shaping | molding tool 21 and the 1st repair patch piece 11 before hardening. In the first repair patch piece arrangement step S1, for example, a plurality of fiber sheets impregnated with a resin such as a prepreg are stacked to form the first repair patch piece 11. At this time, the first repair patch piece 11 is laminated with a plurality of fiber sheets so that the thickness decreases from the center toward the outer end.

  After the first repair patch piece placement step S1, a release material is placed on the first repair patch piece 11 so as to cover the first repair patch piece 11 (step S2: release material placement step). . Here, the release material used in the release material arrangement step S2 of the first embodiment is configured to include a first release film 31, a second release film 32, and an adhesive sheet 33 as a spacer. Yes. The first release film 31 is a circular film that is slightly larger than the first repair patch piece 11, and is provided on the first repair patch piece 11. The second release film 32 is a circular film having substantially the same size as the first release film 31, is provided on the second repair patch piece 12 side, and faces the first release film 31. Provided. The adhesive sheet 33 is the same as the adhesive sheet used when repairing the repaired part 5, and is provided between the first release film 31 and the second release film 32. As the adhesive sheet 33, for example, the same resin as that contained in the repair patch 10 is used. Therefore, the gap between the first repair patch piece 11 and the second repair patch piece 12 is uniformly spaced by the release material composed of the first release film 31, the second release film 32 and the adhesive sheet 33. Is maintained.

  In the release material arranging step S2, the first release film 31 is arranged on the first repair patch piece 11 (step S2a). Subsequently, in the release material arranging step S2, the adhesive sheet 33 is arranged on the first release film (step S2b). Thereafter, in the release material arranging step S2, the second release film 32 is arranged on the adhesive sheet 33 (step S2c).

  After the release material placement step S2, the second repair patch piece before curing is placed on the second release film 32 so as to cover the first repair patch piece 11 with the release material interposed therebetween. (Step S3: Second repair patch piece arranging step). Also in the second repair patch piece arranging step S3, as in the first repair patch piece arranging step S1, for example, a plurality of fiber sheets impregnated with a resin such as a prepreg are stacked to form the second repair patch piece 12. . At this time, similarly to the first repair patch piece 11, the second repair patch piece 12 is also laminated with a plurality of fiber sheets so that the thickness decreases from the center toward the outer end.

  After the second repair patch piece placement step S3, the first repair patch piece 11 and the second repair patch piece 11 and the second repair patch piece 11 are sandwiched between the first repair patch piece 11 and the second repair patch piece 12. The repair patch piece 12 is cured (step S4: molding process). Specifically, in the molding step S4, the bag film 35 is disposed via a sealing material (not shown) so as to cover the first repair patch piece 11 and the second repair patch piece 12 before curing. In the molding step S4, the inside of the bag film 35 is vacuum-sucked from a vacuum port arranged in communication with the inside of the bag film 35, and the resin is heat-cured by heating in this state. The patch piece 11 and the second repair patch piece 12 are formed. Then, the second repair patch piece 12 after molding (after curing) is separated from the second release film 32, and the adhesive sheet 33 after curing is separated from the first release film 31 and after molding (curing). The later first repair patch piece 11 is separated from the forming tool 21. In addition, since the adhesive sheet 33 after hardening becomes unnecessary, it is removed.

  In Embodiment 1, the release material includes the first release film 31, the second release film 32, and the adhesive sheet 33, but the configuration shown in FIG. 4 may be used. That is, the release material 37 is a single material having a layer thickness simulating the adhesive layer formed between the first repair patch piece 11 and the second repair patch piece 12 at the time of repair. May be. Moreover, as shown in FIG. 5, the release material 38 may be comprised by the some release film laminated | stacked so that it might become the layer thickness which simulated the adhesive bond layer.

  Next, a repair method for repairing the repaired portion 5 of the member 1 using the repair patch 10 will be described with reference to FIG. Here, the member 1 is configured by using a composite material, for example, similarly to the repair patch 10. In the repair method for the repaired part 5, first, the first adhesive sheet 41 is placed on the repaired part 5 of the member 1 (step S11: first adhesive sheet placement step). The first adhesive sheet 41 has substantially the same size as the surface on one side of the first repair patch piece 11 (the lower surface in FIG. 6).

  Subsequently, the first repair patch piece 11 is arranged on the first adhesive sheet 41 so as to cover the portion to be repaired 5 with the first adhesive sheet 41 interposed therebetween (step S12: first repair patch piece). Lamination process). In the first repair patch piece stacking step S <b> 12, the one surface having a large area of the first repair patch piece 11 is disposed in contact with the first adhesive sheet 41.

  Next, the 2nd adhesive sheet 42 is arrange | positioned on the 1st repair patch piece 11 (step S13: 2nd adhesive sheet arrangement | positioning process). The second adhesive sheet 42 is larger than the other surface (the upper surface in FIG. 6) of the first repair patch piece 11, and the one surface (the lower surface in FIG. 6) of the second repair patch piece 12. Are almost the same size.

  Then, the second repair patch piece 12 is arranged on the second adhesive sheet 42 so as to cover the first repair patch piece 11 with the second adhesive sheet 42 interposed therebetween (step S14: second repair). Patch piece lamination process). In the second repair patch piece stacking step S <b> 14, one surface of the second repair patch piece 12 is disposed in contact with the second adhesive sheet 42. As a result, the second adhesive sheet 42 is sandwiched between the first repair patch piece 11 and the second repair patch piece 12.

  Then, the 1st adhesive sheet 41 and the 2nd adhesive sheet 42 are heated, each adhesive sheet 41 and 42 is fuse | melted and thermosetting, and the repair part 8 is shape | molded (step S14: shaping | molding process). The repaired part 8 formed in this way is attached to the repaired part 5 via the first adhesive layer formed by the first repair patch piece 11 being thermally cured by the first adhesive sheet 41. Glued. In addition, the repair unit 8 includes the second repair patch piece 12 and the first repaired part 5 and the first repair through the second adhesive layer formed by thermally curing the second adhesive sheet 42. The patch piece 11 is adhered. And the repair part 8 is formed so that the 2nd adhesive bond layer formed between the 1st repair patch piece 11 and the 2nd repair patch piece 12 may become uniform thickness.

  Note that a third adhesive sheet may be disposed on the second repair patch piece 12 after the second repair patch piece stacking step S14.

  As described above, according to the first embodiment, when the first repair patch piece 11 and the second repair patch piece 12 are molded and cured, the release material can be sandwiched and cured. For this reason, the space | interval between the 1st repair patch piece 11 and the 2nd repair patch piece 11 can be uniformly maintained with a mold release material so that it may become uniform thickness in forming an adhesive bond layer. . For this reason, the adhesive layer formed between the 1st repair patch piece 11 and the 2nd repair patch piece 12 becomes uniform, and the repair patch 10 which can suppress the fall of adhesive strength can be shape | molded.

  In addition, according to the first embodiment, the distance between the first repair patch piece 11 and the second repair patch piece 12 using the adhesive sheet 33 as a spacer having a layer thickness simulating the second adhesive layer. Can be accurately and uniformly formed. Moreover, the first repair patch piece 11 and the second repair patch piece 12 can be suitably separated by the first release film 31 and the second release film 32.

  In addition, according to the first embodiment, since the adhesive sheet 33 is used as the spacer, the flow of the second adhesive sheet 42 that is melted by heating at the time of repair can be reproduced. An interval between the repair patch piece 11 and the second repair patch piece 12 can be formed.

  Further, according to the first embodiment, by using the release material 37 having a layer thickness simulating the adhesive layer, the interval between the first repair patch piece 11 and the second repair patch piece 12 can be accurately set. Uniform molding is possible.

  In addition, according to the first embodiment, by using a plurality of laminated release films as the release material 38, the distance between the first repair patch piece 11 and the second repair patch piece 12 is uniform with high accuracy. Can be molded.

  Further, according to the first embodiment, the repair patch pieces 11 and 12 are reduced in thickness from the central portion toward the outer end portion in a plane orthogonal to the stacking direction of the repair patch pieces 11 and 12. Thus, the stress applied to the end portions of the repair patch pieces 11 and 12 can be dispersed, and the stress concentration on the end portions of the repair patch 10 can be reduced.

  In addition, according to the first embodiment, the repair patch 10 can be molded by laminating the repair patch pieces 11 and 12 before curing on the flat tool surface 25 of the molding tool 21. In this case, since the tool surface 25 of the molding tool 21 is flat, the molding tool 21 can be simplified.

  In addition, according to the first embodiment, the adhesive layer formed between the first repair patch piece and the second repair patch piece by using the repair patch pieces 11 and 12 formed as described above. Since the thickness can be made uniform, formation of a portion where the adhesive is rich can be suppressed, and a decrease in adhesive strength can be suppressed.

  Further, according to the first embodiment, when the adhesive sheet 13 is provided between the first repair patch piece 11 and the second repair patch piece 12, it is possible to handle them integrally. Note that the adhesive sheet 13 may be omitted, and the first repair patch piece 11 and the second repair patch piece 12 may be handled as the repair patch 10.

  In the first embodiment, the first repair patch piece 11 and the second repair patch piece 12 are formed in a disc shape, but the shape of each repair patch piece 11 viewed from the stacking direction is non-circular. In addition, the first repair patch piece 11 and the second repair patch piece 12 may be formed. That is, the first repair patch piece 11 is formed in a non-circular shape, and the second repair patch piece 12 is similar to the first repair patch piece 11 that is larger than the first repair patch piece 11. It is formed in a non-circular shape. Specifically, the non-circular shape is, for example, an elliptical shape or a rectangular shape. In this case, in the second repair patch piece stacking step S <b> 14, based on the shape of each repair patch piece 11, 12, the center of each repair patch piece 11, 12 is overlapped, and the second repair patch piece 12 is formed. Inside, the second repair patch piece 12 is arranged so that the first repair patch piece 11 can be accommodated. For example, when the repair patch pieces 11 and 12 are elliptical, in the second repair patch piece stacking step S14, the major axis direction and the minor axis direction of the repair patch pieces 11 and 12 are the same direction. The centers of the repair patch pieces 11 and 12 are overlapped. In this way, in the second repair patch piece stacking step S14, the second repair patch piece 12 can be accurately positioned with respect to the first repair patch piece 11, and therefore the first repair patch piece 11 and the second repair patch piece 11 The gap formed between the repair patch piece 12 and the repair patch piece 12 can have a uniform thickness. In addition, the shape of the 1st repair patch piece 11 and the 2nd repair patch piece 12 will not be specifically limited if it is a shape which can position mutually.

[Embodiment 2]
Next, with reference to FIG. 7, the repair method of the to-be-repaired part 5 which concerns on Embodiment 2 is demonstrated. In the second embodiment, parts that are different from the first embodiment will be described in order to avoid redundant descriptions, and parts that are the same as those in the first embodiment will be described with the same reference numerals. FIG. 7 is an explanatory diagram of an example of a repair method for a repaired part using the repair patch according to the second embodiment.

  In the repair method of the repaired part of the second embodiment, the lightning protection member arrangement in which the lightning protection mesh 51 is arranged together with the third adhesive sheet 43 on the second repair patch piece 12 after the second repair patch piece stacking step S14. Step S31 is performed. In the lightning resistant member arranging step S31, the third adhesive sheet 43 is arranged on the outermost surface of the repair patch 10, and the lightning resistant mesh 51 is arranged between the second repair patch piece 12 and the third adhesive sheet 43. The

  As described above, according to the second embodiment, the lightning resistance mesh 51 can be installed together with the repair of the repaired portion 5, so that the work efficiency can be improved.

  The lightning resistant mesh 51 may be disposed on the outermost surface of the repair patch 10. In this case, the third adhesive sheet 43 is disposed between the second repair patch piece 12 and the lightning resistant mesh 51.

[Embodiment 3]
Next, a method for forming the repair patch 10 according to the third embodiment will be described with reference to FIG. In the third embodiment, parts that are different from the first and second embodiments will be described in order to avoid redundant descriptions, and parts that have the same configurations as those in the first and second embodiments will be described with the same reference numerals. FIG. 8 is a cross-sectional view of an example schematically illustrating a method for forming a repair patch according to the third embodiment.

  In the method of forming the repair patch 10 of the third embodiment, in the first repair patch piece arranging step S1 of the first embodiment, the thickness of the first repair patch piece 11 decreases from the center portion toward the outer end portion. As shown in FIG. 8, a plurality of fiber sheets 53 are laminated. Specifically, in the first repair patch piece arranging step S1, a plurality of fiber sheets 53 are formed such that the fiber sheet 53 on the molding tool 21 side is reduced and the fiber sheet 53 is increased toward the second repair patch piece 12 side. Are stacked. Similarly, also in 2nd repair patch piece arrangement | positioning process S3, the several fiber sheet 53 is laminated | stacked so that the fiber sheet 53 by the side of the forming tool 21 may be small and the fiber sheet 53 may become large toward the outer side.

  As described above, according to the third embodiment, the repair patch pieces 11 and 12 can be suitably formed so that the thickness decreases from the central portion toward the outer end portion.

[Embodiment 4]
Next, a method for forming the repair patch 10 according to the fourth embodiment will be described with reference to FIG. In the fourth embodiment, parts that are different from those in the first to third embodiments will be described in order to avoid duplicate descriptions, and parts that have the same configuration as those in the first to third embodiments will be described with the same reference numerals. FIG. 9 is a cross-sectional view of an example schematically illustrating a repair patch forming method according to the fourth embodiment.

  In the method of forming the repair patch 10 according to the fourth embodiment, the peel material placement step S35 is performed in which the peel ply 54 is placed as a peel material on both the front and back surfaces of the first repair patch piece 11 in the stacking direction. The peel ply 54 is provided in contact with the adhesion surface of each repair patch piece 11, 12, and the adhesion surface of each repair patch piece 11, 12 is activated by peeling off the peel ply 54. The peel material arrangement step S35 is performed before and after the arrangement steps S1 and S3 of the repair patch pieces 11 and 12, so as to activate both the front and back surfaces that are the bonding surfaces of the repair patch pieces 11 and 12.

  According to the fourth embodiment, since the repair patch pieces 11 and 12 provided with the peel ply 54 can be formed, the repair patch piece is removed by peeling off the peel ply 54 at the time of repair using the repair patch pieces 11 and 12. The adhesive surfaces 11 and 12 can be activated.

[Embodiment 5]
Next, a method for forming the repair patch 10 according to the fifth embodiment will be described with reference to FIG. In the fifth embodiment, in order to avoid redundant description, portions different from the first to fourth embodiments will be described, and portions having the same configurations as those of the first to fourth embodiments will be described with the same reference numerals. FIG. 10 is an explanatory diagram of another example related to the repair patch forming method according to the fifth embodiment.

  In the method of forming the repair patch 10 of the fifth embodiment, the tool surface 25 of the forming tool 61 is a surface that simulates the repaired part 5. Specifically, when the repaired part 5 is a curved surface, the tool surface 25 of the forming tool 61 is formed as a curved surface following the repaired part 5.

  According to the fifth embodiment, the repair patch pieces 11 and 12 can be formed in accordance with the shape of the repaired portion 5, so that the repair patch pieces 11 and 12 are not deformed at the time of repair. , 12 can be arranged in the repaired part 5. For this reason, the residual stress which generate | occur | produces in the repair patch pieces 11 and 12 after repair can be reduced.

[Embodiment 6]
Next, with reference to FIG. 11, the repair method of the to-be-repaired part 5 which concerns on Embodiment 6 is demonstrated. In the sixth embodiment as well, parts that are different from the first to fifth embodiments will be described in order to avoid duplicate descriptions, and parts that have the same configuration as those of the first to fifth embodiments will be described with the same reference numerals. FIG. 11 is an explanatory diagram of an example of a repair method for a repaired part using the repair patch according to the sixth embodiment.

  In the repair method of the repaired part 5 according to the sixth embodiment, a deaeration circuit member serving as a deaeration circuit together with the second adhesive sheet 42 between the first repair patch piece 11 and the second repair patch piece 12. The deaeration circuit member arrangement | positioning process S37 which arrange | positions 63 is performed. The deaeration circuit member 63 is, for example, a nonwoven fabric. The deaeration circuit member arrangement step S37 is performed before or after the second adhesive sheet arrangement step S13, and is performed between the first repair patch piece 11 and the second adhesive sheet 42 or with the second adhesive sheet 42. A deaeration circuit member 63 is disposed between the second repair patch piece 12.

  According to the sixth embodiment, since the deaeration circuit member 63 can form a deaeration circuit between the first repair patch piece 11 and the second repair patch piece 12, the first repair patch piece 11. And the second repair patch piece 12 can be appropriately deaerated. For this reason, generation | occurrence | production of the void formed in the 2nd adhesive bond layer between the 1st repair patch piece 11 and the 2nd repair patch piece 12 can be suppressed.

[Embodiment 7]
Next, a method for forming the repair patch 10 according to the seventh embodiment will be described with reference to FIG. In the seventh embodiment, parts that are different from those in the first to sixth embodiments will be described in order to avoid redundant descriptions, and parts that have the same configuration as those in the first to sixth embodiments will be described with the same reference numerals. FIG. 12 is an explanatory diagram of another example related to the method for forming a repair patch according to the seventh embodiment.

  In the method of forming the repair patch 10 according to the seventh embodiment, a degassing circuit forming member 65 for forming a degassing circuit is installed between the first repair patch piece 11 and the second repair patch piece 12. The air circuit forming member step S39 is performed. Specifically, in the deaeration circuit forming member step S <b> 39, the deaeration circuit forming member 65 is installed together with the adhesive sheet 33 between the first release film 31 and the second release film 32. The deaeration circuit forming member 65 has substantially the same thickness as the adhesive sheet 33. The deaeration circuit forming member 65 is formed by recessing a part of the deaeration circuit in a concave shape on the surface in contact with the first repair patch piece 11 via the first release film 31. Similarly, the deaeration circuit forming member 65 is formed by denting a part of the deaeration circuit in a surface in contact with the second repair patch piece 12 via the second release film 32. The deaeration circuit forming member 65 is, for example, a metal mesh.

  According to the seventh embodiment, since a deaeration circuit can be formed between the first repair patch piece 11 and the second repair patch piece 12, the first repair patch piece 11 and the first repair patch piece 11 The space between the two repair patch pieces 2 can be appropriately deaerated. For this reason, generation | occurrence | production of the void formed in the adhesive bond layer between the 1st repair patch piece 11 and the 2nd repair patch piece 12 can be suppressed.

DESCRIPTION OF SYMBOLS 1 Member 5 Repair part 8 Repair part 10 Repair patch 11 1st repair patch piece 12 2nd repair patch piece 13 Adhesive sheet 21 Forming tool 25 Tool surface 31 1st release film 32 2nd release film 33 Adhesive sheet 35 Bag Film 37 Release Material 38 Release Material 41 First Adhesive Sheet 42 Second Adhesive Sheet 43 Third Adhesive Sheet 51 Lightning Resistant Mesh 53 Fiber Sheet 54 Peel Ply 63 Deaeration Circuit Member 65 Deaeration Circuit Forming Member

Claims (18)

A method of forming a repair patch used for a repaired part to be repaired of a member,
The repair patch is formed by laminating a plurality of repair patch pieces formed of a pre-cured composite material,
A first repair patch piece placement step of placing the first repair patch piece before curing on a molding tool;
A mold release material arranging step of arranging a mold release material on the first repair patch piece so as to cover the first repair patch piece;
A second repair patch piece placement step of placing the second repair patch piece before curing on the release material so as to cover the first repair patch piece with the release material interposed therebetween;
A molding step of curing the first repair patch piece and the second repair patch piece in a state where the release material is sandwiched between the first repair patch piece and the second repair patch piece; A method for forming a repair patch, comprising: At the time of repair, an adhesive layer is formed between the first repair patch piece and the second repair patch piece,
The release material is
A first release film provided on the first repair patch piece;
A second release film provided on the second repair patch piece;
A spacer provided between the first release film and the second release film and having a layer thickness simulating the adhesive layer;
In the release material arranging step, the first release film is arranged on the first repair patch piece, the spacer is arranged on the first release film, and the second release film is arranged on the spacer. The method for forming a repair patch according to claim 1, wherein:   The method for forming a repair patch according to claim 2, wherein the spacer is an adhesive sheet for forming the adhesive layer. At the time of repair, an adhesive layer is formed between the first repair patch piece and the second repair patch piece,
The method of forming a repair patch according to claim 1, wherein the release material has a layer thickness simulating the adhesive layer. At the time of repair, an adhesive layer is formed between the first repair patch piece and the second repair patch piece,
The method of forming a repair patch according to claim 1, wherein the release material comprises a plurality of release films laminated to have a layer thickness simulating the adhesive layer.   The repair patch piece is formed such that the thickness thereof decreases from a central portion toward an outer end portion in a plane orthogonal to a stacking direction of the repair patch pieces. The method for forming a repair patch according to any one of 1 to 5.   The method further comprises a peel material arrangement step in which at least one surface in the laminating direction of the repair patch piece is an adhesive surface, and a peel material to be peeled off to activate the adhesive surface is provided on the adhesive surface. A method for forming a repair patch according to any one of claims 1 to 6.   The said forming tool has a tool surface in which the said repair patch piece before hardening is arrange | positioned, The said tool surface is a flat surface, The any one of Claim 1 to 7 characterized by the above-mentioned. How to form a repair patch.   The said forming tool has a tool surface where the said repair patch piece before hardening is arrange | positioned, The said tool surface is a surface which simulated the said to-be-repaired part, It is characterized by the above-mentioned. The method for forming a repair patch according to any one of the above items.   A degassing circuit forming member step of installing a degassing circuit forming member for forming a degassing circuit between the first repair patch piece and the second repair patch piece; The method for forming a repair patch according to any one of claims 1 to 9. A repair patch used for a repaired part to be repaired of a member,
A first repair patch piece formed of a pre-cured composite;
A second repair patch piece disposed on the first repair patch piece and formed from a pre-cured composite so as to cover the first repair patch piece;
The repair patch, wherein a gap formed between the first repair patch piece and the second repair patch piece has a uniform thickness.   The repair patch according to claim 11, further comprising an adhesive sheet provided between the first repair patch piece and the second repair patch piece. The first repair patch piece has a non-circular shape when viewed from the direction facing the second repair patch piece,
The second repair patch piece has a non-circular shape that is larger than the first repair patch piece and is similar to the first repair patch piece. The repair patch described. A repair method for a repaired part for repairing a repaired part to be repaired by using the repair patch according to any one of claims 11 to 13,
A first adhesive sheet arranging step of arranging a first adhesive sheet on the repaired portion;
A first repair patch piece laminating step of placing the first repair patch piece on the first adhesive sheet so as to cover the repaired part with the first adhesive sheet interposed therebetween;
A second adhesive sheet arranging step of arranging a second adhesive sheet on the first repair patch piece;
A second repair patch piece laminating step of placing the second repair patch piece on the second adhesive sheet so as to cover the first repair patch piece with the second adhesive sheet interposed therebetween;
And a molding step of melting and curing the first adhesive sheet and the second adhesive sheet.   The method of repairing a repaired part according to claim 14, further comprising a lightning protection member arranging step of arranging a lightning protection member so as to cover the second repair patch piece before the forming step.   A deaeration circuit member disposing step of disposing a deaeration circuit member serving as a deaeration circuit together with the second adhesive sheet between the first repair patch piece and the second repair patch piece; The repair method of the repaired part according to claim 14 or 15, wherein the repaired part is repaired. The first repair patch piece has a non-circular shape when viewed from the direction facing the second repair patch piece,
The second repair patch piece is larger than the first repair patch piece and has a non-circular shape similar to the first repair patch piece,
In the second repair patch piece laminating step, the first repair patch piece is accommodated inside the second repair patch piece, and the center of the first repair patch piece and the center of the second repair patch piece. 17. The method of repairing a repaired part according to claim 14, wherein the second repair patch piece is disposed so as to overlap with each other. A repaired part formed by repairing a repaired part to be repaired with a repair patch,
A first repair patch piece bonded to the portion to be repaired via a first adhesive layer;
A second repair patch piece bonded via a second adhesive layer so as to cover the first repair patch piece,
The repair part, wherein the second adhesive layer has a uniform thickness.

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