JP2018111213A - Paper set and paper - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a paper set including same-sized multiple sheets of paper and the paper, where with the multiple sheets of paper stacked, information stored in an IC chip of the IC tag provided on each sheet of paper can be efficiently read.SOLUTION: The paper set includes same-sized multiple sheets of paper. The paper has an IC tag between the front and back surface thereof. The first paper of the multiple sheets of paper has an IC tag provided in the first area of the virtual plane including the first direction and the second direction between the front and back surfaces of the paper. The second direction is orthogonal to the first direction. The second paper of the multiple sheets of paper has an IC tag provided in the second area of the virtual plane that is different from the first area.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a sheet set including a plurality of sheets having the same sheet size, and a sheet.

  Techniques relating to paper with an IC tag have been proposed. For example, the patent applicant has proposed a technique relating to Japanese paper in which IC tags are drawn in Patent Documents 1 and 2. That is, Patent Documents 1 and 2 disclose Japanese paper in which an IC tag is made and a manufacturing apparatus for manufacturing this Japanese paper. The aforementioned manufacturing apparatus includes a first cylinder, a second cylinder, a felt, an IC tape unwinding reel, and an IC tag transfer device. The first cylinder is horizontally supported inside the first tank containing the stock. In the first cylinder, the outer periphery is the first mesh. The second cylinder is supported horizontally inside the second tank containing the stock. In the second cylinder, the outer periphery is a second mesh. The felt transports Japanese paper from the first cylinder to the second cylinder. An IC tape having an IC tag is wound around the IC tape reel. The IC tag transfer device is disposed between the first cylinder and the second cylinder in close proximity to the felt. The IC tag transfer device conveys and cuts the IC tape unwound from the IC tape unwinding reel. In the manufacturing apparatus, the first cylinder is rotated. Along with this, a strip-shaped base paper is formed with the stock flowing out from the first mesh in the outer circumferential direction. The base paper adheres to the felt. In the IC tag transfer device, IC tape pieces are transferred at regular intervals in the longitudinal direction and the short direction of the base paper. The second cylinder rotates at the same speed as the first cylinder. Along with this, the cover paper is formed with the paper stock flowing out from the second mesh in the outer circumferential direction. The cover paper is combined with the base paper. The IC tape piece is sandwiched between the base paper and the cover paper. In the manufacturing apparatus, Japanese paper in which the IC tag is made is manufactured in this way. In Patent Documents 1 and 2, the IC tag is referred to as a non-contact IC tag, a non-contact data carrier, a wireless IC tag, a non-contact IC, a non-contact IC label or an RFID tag, and generally refers to a tag including an IC chip and an antenna. It is supposed to be. Patent Documents 1 and 2 exemplify polyethylene and paper as materials for the IC tape. The IC tag transfer device includes a cutting machine. The cutting machine cuts the IC tape into a predetermined length by continuously detecting the positions of the markers provided at equal intervals on the IC tape, and continuously generates IC tape pieces. Washi paper with IC tags is used for files containing confidential information or high-level documents.

  Patent Document 3 discloses IC tag built-in printing paper. The IC tag built-in printing paper is configured such that the IC chip side surface and back surface of the inlet are covered with protective upper paper and lower paper. The inlet has a thickness of about 100 μm. The inlet is based on a paper substrate or a film substrate, and a loop antenna is formed on the surface or front and back of the substrate. An IC chip is connected and fixed to the end of the loop antenna. In particular, the IC tag built-in printing paper has a configuration in which the front and back of the inlet are covered with an upper paper and a lower paper with a thickness of about 100 to 200 μm through an adhesive material such as a heat seal layer. Various types of printing can be performed on the upper paper or lower paper. The loop antenna is provided in a loop shape on the surface of a film substrate or paper substrate having a thickness of about 40 to 60 μm. A wiring pattern having a line width of about 10 μm is drawn in a loop shape a plurality of times. Both ends of the antenna are connected to a connecting island. The IC chip side terminal is connected and fixed to the connection island. Examples of the film substrate include polyethylene terephthalate, polyethylene naphthalate, polystyrene, and polyimide. Examples of the paper substrate include fine paper, art paper, coated paper, matte paper, and synthetic paper. The IC chip is approximately 0.4 to 1.0 mm square. Examples of the communication frequency include 13.56 MHz (HF), 920 MHz, or 2.45 GHz (UHF). The IC tag transmission / reception system includes a reader / writer system and an RFID system on the IC tag side. The reader / writer includes a host computer, a DPU (Digital Processing Unit), a modulation / demodulation circuit, and a loop antenna. The RFID system includes a resonance circuit and an IC chip. The resonant circuit includes a loop antenna and a capacitor. The IC chip includes a rectifier circuit, a modulation circuit, a demodulation circuit, a regulator, a sequencer, a high-pass filter, and a memory. The energy for driving the IC is received from an electromagnetic wave radiated from the reader / writer. The reader / writer is placed close to the IC tag.

  In addition, Patent Document 4 discloses a booklet with an IC tag. Furthermore, Non-Patent Document 1 discloses that with respect to Japanese paper with an IC tag developed by the patent applicant, 47 Japanese papers can be simultaneously identified with a plurality of Japanese papers shifted by 1 mm.

JP 2012-63980 A JP 2012-62599 A JP, 2015-210704, A JP 2012-14611 A

Nihon Keizai Shimbun, “Fukui's Obata Paper Mill, IC-tagged Japanese paper to prevent counterfeiting”, [online], [searched November 1, 2016], Internet <URL: http://www.nikkei.com/ article / DGXNASJB1403K_Y1A110C1LB0000 />

  A plurality of sheets on which various items including confidential items are recorded may be collected and managed. For example, such a plurality of sheets are bound in a predetermined file or holder, or placed in a predetermined box or case for management. In addition, a plurality of sheets on which the above-described various items are recorded may be collected as a booklet. In this case, the plurality of sheets are overlapped. By providing an IC tag including an IC chip and an antenna on a sheet and storing information unique to each sheet in each IC chip, a plurality of sheets to be managed can be managed individually. For example, by reading information stored in each IC chip from the IC chip of the IC tag provided on each overlapped sheet, it is possible to confirm whether there is a lost sheet among a plurality of sheets to be managed. it can. In addition, by reading the information described above, it is possible to confirm whether a part of the plurality of management target sheets has been replaced with other sheets.

  The inventor considered that it would be desirable to be able to efficiently perform such confirmation work. For example, when there are a large number of sheets to be managed, if the sheets are to be read one by one, the confirmation operation takes time. Therefore, the inventor considered that a technique that allows a larger number of sheets to be read together is preferable. In other words, the inventor examined a technique that can smoothly read information stored in each IC chip from an IC chip of an IC tag provided on each paper to be managed. In that case, the inventor examined the technique which can abbreviate | omit the operation | work which shifts each paper like a nonpatent literature 1. FIG. Furthermore, the inventor studied a technique that can efficiently manufacture a sheet having an IC tag.

  The present invention can efficiently read information stored in each IC chip from an IC chip of an IC tag provided on each sheet in a state where a plurality of sheets are stacked. An object is to provide a paper set and paper containing paper.

  One aspect of the present invention is a sheet set including a plurality of sheets having the same sheet size, and the sheet includes an IC tag between a front surface and a back surface of the sheet, and a first of the plurality of sheets. In one sheet, the IC tag is disposed in a first area of a virtual plane including a first direction of the sheet between the front surface and the back surface and a second direction of the sheet orthogonal to the first direction. In the second sheet of the plurality of sheets, the IC tag is a sheet set arranged in a second area of the virtual plane different from the first area. In this case, in the second sheet, the IC tag is arranged in the second area where the range in the first direction is different from the first area and the range in the second direction is different. Also good. In the second sheet, the IC tag may be disposed in the second area where the range in the first direction is different from that in the first area and the range in the second direction is the same. Good.

  According to this paper set, the position of the IC tag can be shifted for each paper. Accordingly, the position of the IC chip can be shifted for each sheet. In a state where a plurality of sheets are stacked, the area where the IC tag is arranged on each sheet can be aligned in the first direction or the second direction.

  A first paper base material that forms either one of the front surface and the back surface, and the first paper base material, and the other surface of the front surface and the back surface is integrated with the first paper base material. A second paper base material to be formed, wherein the IC tag is provided between the first paper base material and the second paper base material, and the IC tag is provided with an IC chip and an antenna. The inlet base material may be provided with a through-hole penetrating the inlet base material in the third direction of the paper perpendicular to the first direction and the second direction. According to this configuration, the first paper base and the second paper base can be connected via the through hole at the portion where the IC tag is provided. It is possible to prevent the first paper base and the second paper base from being peeled off at the portion where the IC tag is provided.

  The paper may be a Japanese paper in which the first paper base and the second paper base are combined, and the inlet base may be made of resin. By the way, when the paper is a Japanese paper in which the first paper base and the second paper base are combined, the paper is dehydrated before drying after the first paper base and the second paper base are combined. Is done. For example, the paper is inserted into a predetermined device, and moisture contained in the paper is squeezed out of the paper. According to this configuration, moisture contained in the paper can be squeezed out of the paper through the base material portion connected through the through hole. The paper can be dried in a dehydrated state.

  In another aspect of the present invention, a first paper base, a second paper base integrated with the first paper base, and the first paper base and the second paper base are provided. A through-hole penetrating the inlet base material in a third direction that matches the thickness direction of the inlet base material. Is provided.

  According to this paper, the first paper base and the second paper base can be connected via the through hole at the portion where the IC tag is provided. It is possible to prevent the first paper base and the second paper base from being peeled off at the portion where the IC tag is provided.

  The paper may be a Japanese paper in which the first paper base and the second paper base are combined, and the inlet base may be made of resin. According to this configuration, after the first paper base material and the second paper base material are combined, the water contained in the paper can be squeezed out of the paper through the base material portion connected through the through hole. The paper can be dried in a dehydrated state.

  According to the present invention, information stored in each IC chip can be efficiently read from the IC chip of the IC tag provided on each sheet in a state where a plurality of sheets are stacked, and the sheet size is the same. A paper set including a plurality of sheets and a sheet can be obtained.

It is a perspective view which shows an example of schematic structure of several paper and a paper set. A mode in which the IC tag is shifted by a predetermined amount in the second direction is shown. FIG. 5 is a perspective view illustrating an example of a schematic configuration of one sheet among a plurality of sheets of a sheet set. The upper row shows the first paper base, the IC tag, and the second paper base. The lower row shows the aforementioned paper. FIG. 6 is a perspective view illustrating an example of a schematic configuration of another sheet of a plurality of sheets in a sheet set. The upper row shows the first paper base, the IC tag, and the second paper base. The lower row shows the aforementioned paper. FIG. 10 is a perspective view illustrating an example of a schematic configuration of still another sheet among a plurality of sheets of a sheet set. The upper row shows the first paper base, the IC tag, and the second paper base. The lower row shows the aforementioned paper. It is a perspective view which shows an example of schematic structure of an IC tag. It is a figure which shows an example of arrangement | positioning of the IC tag in the virtual plane in each of several paper. It is a perspective view which shows the other example of schematic structure of several paper and a paper set. An aspect in which the IC tag is shifted by a predetermined amount in the first direction is shown. It is a perspective view which shows the further another example of schematic structure of several paper and a paper set. An aspect in which the IC tag is shifted by a predetermined amount in both the first direction and the second direction is shown.

  Embodiments for carrying out the present invention will be described with reference to the drawings. The present invention is not limited to the configurations described below, and various configurations can be employed in the same technical idea. For example, some of the configurations shown below may be omitted or replaced with other configurations. Other configurations may be included. In each figure of the embodiment, a broken line is a hide line, and a two-dot chain line is an imaginary line.

<Paper set and paper>
The paper set 10 and the plurality of papers 20 will be described with reference to FIGS. The paper set 10 includes a plurality of papers 20. That is, the paper set 10 is a combination of a plurality of papers 20. In the embodiment, three sheets 21, 22, and 23 will be described as an example as the plurality of sheets 20 in one sheet set 10. However, the number of sheets in one sheet set may be two or four or more. When the papers 21, 22, and 23 are not distinguished, or collectively referred to as “paper 20”.

  The paper 20 includes an IC tag 40 between the front surface 24 and the back surface 25 of the paper 20. The IC tag 40 is also referred to as an RF tag or a wireless IC tag, for example. In addition, the IC tag 40 is also referred to as, for example, an inlet, a tag inlet, or an IC tag inlet. In the embodiment, the plurality of sheets 20 in the sheet set 10 are two-layer Japanese paper. In this case, the paper 20 includes a first paper base 30 and a second paper base 32 (see FIGS. 2 to 4). The sheets 21, 22 and 23 have the same structure except for the arrangement of the IC tag 40 on the virtual plane S. The virtual plane S is a virtual plane between the front surface 24 and the back surface 25 of the paper 20. In each figure of the embodiment, the virtual plane S is indicated by a two-dot chain line. The arrangement of the IC tag 40 on the virtual plane S will be described later.

  The first paper base 30 is a portion of the paper 20 that is on the side of one of the front surface 24 and the back surface 25 of the paper 20. That is, the first paper base 30 forms one of the front surface 24 and the back surface 25 of the paper 20. The second paper base 32 is a portion of the paper 20 that is on the other side of the front surface 24 and the back surface 25 of the paper 20. That is, the second paper base 32 forms one of the front surface 24 and the back surface 25 of the paper 20. In the embodiment, the first paper substrate 30 forms the front surface 24 of the paper 20, and the second paper substrate 32 forms the back surface 25 of the paper 20. In the paper 20, the first paper base material 30 and the second paper base material 32 are combined and integrated. In the first paper base material 30, the surface to be combined with the second paper base material 32 is a surface on the opposite side to the surface to be the surface 24 of the paper 20. In the second paper base material 32, the surface to be combined with the first paper base material 30 is the surface opposite to the surface to be the back surface 25 of the paper 20.

  In the embodiment, the surface of the first paper substrate 30 that becomes the surface 24 of the paper 20 is set to “surface 24” according to the surface 24 of the paper 20, and the first paper substrate to be combined with the second paper substrate 32. The thirty faces are referred to as “first face 31”. The surface of the second paper substrate 32 that becomes the back surface 25 of the paper 20 is set to “back surface 25” according to the back surface 25 of the paper 20, and the surface of the second paper substrate 32 to be combined with the first paper substrate 30 is the surface. , Referred to as “second surface 33”. In the embodiment, for convenience of description, the directions used for specifying the paper 20 are referred to as “first direction”, “second direction”, and “third direction”. For example, when the paper 20 is an A4 size paper, the first direction is a direction along one of 210 mm and 297 mm, and the second direction is the other of 210 mm and 297 mm. It is the direction along the side. The sheet 20 is a rectangular sheet, the first direction is the short direction of the sheet 20, and the second direction is the longitudinal direction of the sheet 20. The third direction is a direction orthogonal to the first direction and the second direction. In other words, the third direction is the thickness direction of the paper 20 perpendicular to the front surface 24 and the back surface 25 of the paper 20. The third direction also coincides with the thickness direction of the inlet base material 43 of the IC tag 40 described later (see FIG. 5).

  In the paper 20 that is a two-layer Japanese paper, the position between the front surface 24 and the back surface 25 of the paper 20 on which the IC tag 40 is provided is between the first paper base 30 and the second paper base 32. . That is, the paper 20 includes an IC tag 40 between the first paper base 30 and the second paper base 32. At this time, the IC tag 40 is sandwiched between the first surface 31 of the first paper substrate 30 and the second surface 33 of the second paper substrate 32. In the embodiment in which the sheet 20 is a two-layer Japanese paper as an example, the above-described virtual plane S is the first surface 31 of the first sheet substrate 30 and the second surface 33 of the second sheet substrate 32. Matches.

  The IC tag 40 includes, for example, an IC chip 41, an antenna 42, and an inlet base material 43 as in the known IC tag (see FIG. 5). The IC chip 41 and the antenna 42 are provided on the inlet base material 43. The IC chip 41 stores the following information. The aforementioned information is information specific to the paper 20 on which the IC tag 40 including the IC chip 41 is provided. The antenna 42 receives electromagnetic waves or radio waves output from the reader / writer 50 (see FIG. 1). The shape of the antenna 42 shown in FIGS. 1 to 5 and FIGS. 6 to 8 described later is an example. The antenna 42 has a predetermined shape in accordance with, for example, electromagnetic waves or radio waves output from the reader / writer 50. The reader / writer 50 is a device similar to a reader / writer based on a known RFID (Radio Frequency Identification). Also in the paper set 10, information stored in the IC chip 41 is read by a method similar to that of a known RFID. For this reason, the explanation about the reader / writer 50 and the above-described reading of information is omitted.

  The inlet base material 43 is formed of a resin-made sheet material having flexibility. For example, the inlet base material 43 is a predetermined film material. A through hole 44 is provided in the inlet base material 43. The through hole 44 penetrates the inlet base material 43 in the third direction. In the IC tag 40, a plurality of through holes 44 are provided. The number, shape, and arrangement of the through holes 44 provided in the inlet base material 43 with one IC tag 40 are appropriately set in consideration of various conditions. When the paper 20 is manufactured, after the first paper base 30 and the second paper base 32 are combined, the paper 20 is dehydrated before drying. The dehydration is performed, for example, by pressing the paper 20 that has been put together from the third direction. The number, shape, and arrangement of the through holes 44 are appropriately set in consideration of this dewatering state. In the IC tag 40, a marker 45 is further provided on the inlet base material 43. The IC tag 40 is formed by cutting an IC tag tape, for example. The IC tag tape is cut while detecting the marker 45. However, when the IC tag 40 is formed by another method, the marker 45 may be omitted.

<Placement of IC tags>
The arrangement of the IC tag 40 on the virtual plane S will be described with reference to FIG. In this description, of the four corners of the virtual plane S, the corner with a black circle is the origin O (0, 0) of the two-dimensional coordinates. In the paper set 10, the area of the virtual plane S where the IC tag 40 is arranged is differently arranged for the papers 21, 22, and 23. That is, on the paper 21, the IC tag 40 is on the virtual plane S, the first corner P1 of the IC tag 40 is arranged at the two-dimensional coordinates (X1, Y1), and the second corner P2 of the IC tag 40 is two-dimensional. Arranged at coordinates (X2, Y2). In other words, on the paper 21, the IC tag 40 is arranged in a quadrangular area specified by the two-dimensional coordinates (X1, Y1) and (X2, Y2) in the virtual plane S. In the embodiment, the above-described area in the virtual plane S where the IC tag 40 is arranged on the paper 21 is referred to as “area A”. A hatched area shown in the IC tag 40 in “paper 21” in FIG. 6 corresponds to the area A.

  On the paper 22, the IC tag 40 is on a virtual plane S, the first corner P1 of the IC tag 40 is arranged at two-dimensional coordinates (X1, Y3), and the second corner P2 of the IC tag 40 is two-dimensional coordinates ( X2, Y4). In other words, on the paper 22, the IC tag 40 is arranged in a quadrangular area specified by the two-dimensional coordinates (X1, Y3) and (X2, Y4) in the virtual plane S. In the embodiment, the above-described area in the virtual plane S on which the IC tag 40 is arranged on the paper 22 is referred to as “area B”. The hatched area shown in the IC tag 40 in “paper 22” in FIG. 6 corresponds to the area B. In the paper 23, the IC tag 40 is on the virtual plane S, the first corner portion P1 of the IC tag 40 is arranged at two-dimensional coordinates (X1, Y5), and the second corner portion P2 of the IC tag 40 is two-dimensional coordinates ( X2, Y6). In other words, on the paper 22, the IC tag 40 is arranged in a quadrangular area specified by the two-dimensional coordinates (X1, Y5) and (X2, Y6) in the virtual plane S. In the embodiment, the above-described area in the virtual plane S where the IC tag 40 is arranged on the paper 23 is referred to as “area C”. The hatched area shown in the IC tag 40 on “paper 23” in FIG.

  In the paper set 10, the regions A, B, and C are the outer edge portions on one side of both outer edge portions along the second direction of the paper 20 facing in the first direction. In the sheets 21, 22, and 23 of the sheet set 10, the areas A, B, and C are areas that have the same range in the first direction and different ranges in the second direction. Therefore, in the paper set 10, when the papers 20 are stacked with the first direction and the second direction of the papers 21, 22, and 23 aligned, the positions of the three IC tags 40 in the first direction match. And are respectively arranged at positions shifted by a predetermined amount in the second direction (see the lower part of FIG. 1). In other words, in the state described above, the three IC tags 40 are arranged in a row in the second direction.

<Effect of embodiment>
According to the embodiment, the following effects can be obtained.

  (1) In the paper set 10, the plurality of papers 20 include IC tags 40 (see FIG. 1). In the paper 20, the IC tag 40 is provided between the first paper base 30 and the second paper base 32 between the front surface 24 and the back surface 25 of the paper 20 (see FIGS. 2 to 4). Further, in the paper 21 of the plurality of papers 20, the IC tag 40 is disposed in the area A of the virtual plane S (see “paper 21” in FIG. 6). In the paper 22 of the plurality of papers 20, the IC tag 40 is arranged in a region B on the virtual plane S different from the region A (see “paper 22” in FIG. 6). In the paper 23 of the plurality of papers 20, the IC tag 40 is arranged in a region C on the virtual plane S different from the regions A and B (see “paper 23” in FIG. 6). Therefore, the position of the IC tag 40 can be shifted on each sheet 20. Accordingly, the position of the IC chip 41 can be shifted on each sheet 20.

  For example, in the state shown in the lower part of FIG. 1, information stored in the IC chip 41 of the IC tag 40 provided on the sheets 21, 22, and 23 can be read at once by the reader / writer 50. Although the description is omitted above, the paper set 10 may be a set of three sheets 21, 22, 23, and a plurality of sets may be used together. For example, a total of 30 pages of material can be obtained by collecting 10 sets of paper sets 10 of papers 21, 22, and 23. In this case, the plurality of sheets 20 are bound in a state where two identical sheets 20 among the sheets 21, 22 and 23 are not continuous. For example, 30 pages of paper 20 are repeatedly bound in the order of papers 21, 22, 23, 21, 22, 23,. Accordingly, the position of the IC tag 40 does not match between two continuous sheets of paper 20, and the IC chips 41 are arranged in the stacking direction of the plurality of sheets 20 on the same sheet 20 of the sheets 21, 22, and 23. Can be separated. By reading the information stored in the IC chip 41 of the IC tag 40 provided on the paper 20 for 30 pages by the reader / writer 50 at a time, for example, a predetermined number of materials from a plurality of pages on a plurality of papers 20 including confidential matters are determined. It is possible to efficiently check whether the sheet 20 is lost or replaced with another sheet. The plurality of sheets 20 are bound at, for example, the outer edge of the outer edge of the sheet 20 along the second direction opposite to the outer edge along the second direction where the IC tag 40 is provided. It is done.

  (2) In the IC tag 40, the through hole 44 is provided in the inlet base material 43 (see FIG. 5). Therefore, the first paper base 30 and the second paper base 32 can be connected via the through hole 44 at the portion where the IC tag 40 is provided. It is possible to prevent the first paper base material 30 and the second paper base material 32 from being peeled off at the portion where the IC tag 40 is provided (see “regions A, B, and C” above). When manufacturing the paper 20, the moisture contained in the paper 20 can be squeezed out of the paper 20 through the base material portion connected through the through hole 44. The paper 20 can be dried in a dehydrated state.

<Modification>
The embodiment can also be performed as follows. Some configurations of the modifications shown below can be appropriately combined and employed. Hereinafter, points different from the above will be described, and description of similar points will be omitted as appropriate.

  (1) Patent Documents 1 and 2 by the patent applicant describe a method for manufacturing Japanese paper in which an IC tag is incorporated as described above. Although not described above, the paper 20 can also be manufactured by a manufacturing method similar to this manufacturing method. In that case, the manufacturing apparatus similar to the manufacturing apparatus of patent documents 1 and 2 is used. When the paper 20 is manufactured by a manufacturing method similar to the manufacturing method of Patent Documents 1 and 2, the IC tag 40 is arranged differently for the papers 21, 22 and 23 as described above. A long Japanese paper manufactured by a manufacturing method similar to the manufacturing method of Patent Documents 1 and 2 is cut into a paper 20 having a predetermined paper size, with one IC tag 40 included. In the configuration exemplified in Patent Documents 1 and 2, three IC tags are arranged at a predetermined interval in the short direction of the long Japanese paper to be manufactured. In the manufacturing method similar to the manufacturing method of Patent Documents 1 and 2, the supply positions of the three IC tags 40 are shifted in the longitudinal direction of the long Japanese paper. Accordingly, three types of papers 21, 22, and 23 in which the IC tags 40 are arranged differently in the direction corresponding to the longitudinal direction described above can be obtained.

  (2) In the sheets 21, 22, and 23 of the sheet set 10, the IC tag 40 is disposed at a position shifted by a predetermined amount in the second direction (see FIGS. 1 and 6). That is, the three IC tags 40 are arranged in a line in the second direction in a state where the sheets 21, 22, and 23 are overlapped. On the sheets 21, 22, and 23, the IC tags 40 may be arranged differently. For example, in the sheets 21, 22, and 23, the IC tag 40 may be arranged at a position shifted by a predetermined amount in the first direction as shown in FIG. In the paper set 10 shown in FIG. 7, each region in the virtual plane S where the IC tag 40 is disposed on the papers 21, 22, and 23 is both outer edge portions along the first direction of the paper 20 facing the second direction. It is set as the outer edge part of one side. Each of the aforementioned regions is a region where the range in the first direction is different and the range in the second direction is the same. In addition, in the sheets 21, 22, and 23, the IC tag 40 may be disposed at a position shifted by a predetermined amount in both the first direction and the second direction, as shown in FIG. In the paper set 10 shown in FIG. 8, the areas in the virtual plane S where the IC tags 40 are arranged on the papers 21, 22, and 23 are areas having different ranges in the first direction and different ranges in the second direction. . Each region in the virtual plane S where the IC tag 40 is arranged may be inside the outer edge portion of the virtual plane S. For example, each of the above-described regions may be a central portion in the first direction and / or the second direction in the virtual plane S.

  (3) The inlet base material 43 is made of resin. The inlet base material may be made of paper. In the resin or paper inlet base material, the through hole 44 may be omitted. For example, if the dehydrated paper can be dried in the drying process after dehydration, the through hole 44 may be omitted. In addition, the through-hole 44 may be omitted when either or both of the first direction and the second direction are small in a resin or paper inlet base material. When the inlet base material is small regardless of the material, the amount of water blocked by the inlet base material during dehydration is reduced.

  (4) In the paper 20, the first paper base 30 and the second paper base 32 are combined (see FIGS. 2 to 4). The paper 20 may be paper other than Japanese paper. In this case, the first paper base and the second paper base are integrated by a predetermined method in a state where the IC tag 40 is arranged in the same manner as described above. For example, the first paper base and the second paper base are bonded together with the IC tag 40 sandwiched therebetween.

  (5) On the paper 20, for example, a predetermined pattern may be formed at a predetermined position on the front surface 24 or the back surface 25 by a predetermined method. In this case, for example, information for identifying the sheets 21, 22, and 23 or information indicating a confidential document may be formed as a pattern. An example of the predetermined pattern is a concave pattern formed on the front surface 24 or the back surface 25. When the paper 20 is Japanese paper, the predetermined pattern may be a watermark pattern.

10 paper set, 20, 21, 22, 23 paper, 24 front surface, 25 back surface 30 first paper base material, 31 first surface, 32 second paper base material, 33 second surface 40 IC tag, 41 IC chip, 42 Antenna, 43 Inlet base material 44 Through hole, 45 Marker, 50 Reader / writer, A, B, C region O Origin, P1 first corner, P2 second corner, S Virtual plane

Claims (7)

A paper set containing a plurality of papers having the same paper size,
The paper includes an IC tag between the front surface and the back surface of the paper,
In the first paper of the plurality of papers, the IC tag includes a first direction of the paper between the front surface and the back surface and a second direction of the paper perpendicular to the first direction. Arranged in the first area of the plane,
In the second sheet of the plurality of sheets, the IC tag is disposed in a second area of the virtual plane different from the first area.   The said 2nd paper WHEREIN: The said IC tag is arrange | positioned in said 2nd area | region where the range of said 1st direction corresponds with said 1st area | region, and the range of said 2nd direction differs. Paper set.   The said 2nd paper WHEREIN: The said IC tag is arrange | positioned in said 2nd area | region where the range of said 1st direction differs from said 1st area | region, and the range of said 2nd direction corresponds. Paper set. A first paper base material forming one of the front surface and the back surface;
A second paper base material that is integral with the first paper base material and forms the other surface of the front surface and the back surface;
The IC tag is provided between the first paper base and the second paper base,
The IC tag is provided with a through-hole penetrating the inlet base material in a third direction of the paper perpendicular to the first direction and the second direction in an inlet base material provided with an IC chip and an antenna. The paper set according to any one of claims 1 to 3, wherein the paper set is provided. The paper is a Japanese paper in which the first paper base and the second paper base are combined,
The paper set according to claim 4, wherein the inlet base material is made of resin. A first paper substrate;
A second paper substrate integral with the first paper substrate;
An IC tag provided between the first paper base and the second paper base,
The paper in which the IC tag is provided with a through-hole penetrating the inlet base material in a third direction corresponding to a thickness direction of the inlet base material in an inlet base material on which an IC chip and an antenna are provided. The paper is a Japanese paper in which the first paper base and the second paper base are combined,
The paper according to claim 6, wherein the inlet base is made of resin.

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