JP2018104781A - Substrate holder, plating apparatus, and plating method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress an influence of plating solution pressure in a substrate holder.SOLUTION: A substrate holder including first and second holding members to hold a substrate comprises: an arm unit for installing the substrate holder in a plating tank, having one or a plurality of external junctions; a holding unit which holds the substrate with the first and second holding members; a plurality of contacts provided on the holding unit, for feeding electricity to the substrate; a plurality of wirings connecting the external junctions to the plurality of contacts; and a wiring accommodation unit arranged between the arm unit and the holding unit, having a housing space to accommodate different length wirings that occur due to the route difference between the external junctions and each contact.SELECTED DRAWING: Figure 23

Description

  The present invention relates to a substrate holder, a plating apparatus, and a plating method.

  Conventionally, wiring, bumps (projection electrodes), and the like are formed on the surface of a substrate such as a semiconductor wafer or a printed circuit board. An electroplating method is known as a method for forming the wirings, bumps, and the like.

  In a plating apparatus used for electrolytic plating, a substrate holder that seals an end surface of a circular or polygonal substrate and exposes and holds the surface (surface to be plated) may be used. When performing the plating process on the substrate surface in such a plating apparatus, the substrate holder holding the substrate is immersed in the plating solution.

Patent Document 1 describes a substrate holder 8 for holding a disk-shaped wafer W and performing a plating process. The substrate holder 8 includes a first holding member 22 and a second holding member 24 for sandwiching the wafer W, and a pair of holder hangers 34 are provided at the end of the first holding member 22. One of the holder hangers 34 is provided with a plurality of external connection contacts 42, and these external connection contacts 42 are arranged around the wafer W via a plurality of wirings 55 disposed inside the substrate holder 8. Are connected to a plurality of conductive members 41 (internal contacts) (FIG. 3).
Patent Document 2 describes a configuration in which when the substrate holder 8 is disposed in the plating tank 24, the entire substrate holder 8 is positioned below the surface of the plating solution.

JP, 2006-003376, A JP2015-137374A

In electroplating, the plating process is performed while a current is passed through the substrate through a plurality of contacts provided on the peripheral edge of the substrate. The length of the wiring from the external connection contact provided on the arm (handle) of the substrate holder to each contact Are preferably of equal length. This is because it is preferable for plating quality that the resistance of each wiring is made equal to make the current flowing through each contact uniform. However, the length of the path from each external connection contact to each contact may vary depending on the position of the contact. For this reason, in the substrate holder, it is necessary to absorb the length of the wiring corresponding to the difference in the path length to the contact.
In the substrate holder of Patent Document 1, each wiring 55 is not the same length based on the description of FIG. In the substrate holder described in Patent Document 1, it is assumed that the current flowing through each wiring 55 is relatively small, and the wiring diameter is relatively thin and the wiring 55 itself is likely to be bent. Further, in the configuration of the substrate holder described in Patent Document 1, it is considered that the first holding member 22 has a shape that can secure a space in the portion that is the back side of the wafer, and the wiring 55 is bent in the space. Can be accommodated.
However, the plating tank is provided with a paddle, an anode mask, a regulation plate, etc. for stirring the plating solution, and it is required to perform the plating process by arranging a substrate holder in a limited space in the plating tank. ing. In particular, dimensional constraints in the thickness direction of the substrate are becoming strict. For this reason, securing a space on the back side of the wafer as in the substrate holder of Patent Document 1 is not preferable because the thickness of the substrate holder increases.
In recent years, depending on the plating process, it is required to perform the plating process with a large current. Further, depending on the shape of the substrate, it is required to perform the plating process with a large current, and it is required to increase the diameter of the wiring. A large-diameter wiring is difficult to bend compared to a small-diameter wiring, and it is difficult to accommodate the wiring in a narrow space. Therefore, it is desired that the substrate holder can absorb the wiring length corresponding to the path difference to the contact even when the wiring diameter is large. It is also desirable to suppress or prevent an increase in the thickness of the substrate holder.
In the configuration described in Patent Document 2, since the entire substrate holder is immersed in the plating solution, the plating material contacts the entire substrate holder. For this reason, the whole substrate holder deteriorates with age almost in the same manner according to the period of use and the number of uses, and it is necessary to replace the whole substrate holder.
An object of the present invention is to solve at least a part of the problems described above.

  [1] According to the first aspect, a substrate holder including first and second holding members that sandwich the substrate is provided, and the substrate holder is an arm portion for installing the substrate holder in the plating tank. Or an arm portion having a plurality of external connection contacts, a clamping portion for clamping the substrate in the first and second holding members, and one or a plurality of contacts provided in the clamping portion for supplying power to the substrate A plurality of wirings connecting the one or more external connection contacts and the one or more contacts; and between the arm portion and the clamping portion, and the one or more external connection contacts and the 1 Or a wiring housing portion having a housing space for housing the one or more wires of an extra length relative to the path length between the plurality of contacts.

According to the first aspect, the wiring accommodating portion disposed between the arm portion and the sandwiching portion of the substrate holder accommodates an extra length of wiring with respect to the path length between the external connection contact and the contact, The arrangement of the wiring can be adjusted. In this configuration, since the wiring accommodating portion is provided between the arm portion and the clamping portion of the substrate holder, it is possible to suppress or prevent an increase in the thickness of the substrate holder. That is, in the substrate holder, the wiring accommodating portion is arranged side by side with the arm portion and the sandwiching portion, so that the thickness of the arm portion for supporting the substrate holder and the sandwiching portion for holding the substrate is increased. It can be suppressed or prevented.
Moreover, since it does not overlap with the clamping portion that holds the substrate, the thickness of the wiring housing portion can be secured while suppressing the thickness of the entire substrate holder. Therefore, it is easy to secure a space for bending and arranging a wiring having a large diameter. A substrate holder that holds a large rectangular substrate is particularly advantageous.
In addition, since the wiring housing portion does not overlap with the clamping portion that holds the substrate, the wiring housing portion can be configured to be accessible even after the substrate is held on the substrate holder.

[2] According to the second aspect, in the substrate holder according to the first aspect, the wiring housing portion includes the housing main body having a first recess that houses a part of the length of the one or the plurality of wirings. A lid member that is detachably attached to the housing main body and closes the first recess.
According to the second aspect, the wiring in the wiring housing portion can be protected from the processing solution such as the plating solution by the lid member, and the wiring in the wiring housing portion can be accessed by opening the lid member. Therefore, maintenance in the wiring housing portion is facilitated.

[3] According to Aspect 3, in the substrate holder according to Aspect 2, the lid member has a second recess at a position facing the first recess of the housing main body.
According to the third aspect, a space obtained by combining the housing portion main body and the concave portion of the lid member can be used as a wiring housing space (a space for housing the wiring). It is easy to increase the thickness direction of the wiring housing space while suppressing the thickness of the housing body. When the material of the housing part main body is more expensive than the material of the lid member, an increase in cost can be suppressed by reducing the volume of the housing part main body.

  [4] According to Aspect 4, in the substrate holder according to Aspect 2 or 3, the wiring accommodation part further includes a seal member disposed between the accommodation part main body and the lid member. As the seal member, an O-ring, packing, or the like can be used. According to the form 4, it is possible to seal the space in the wiring housing portion more airtightly by the seal member.

[5] According to the fifth aspect, in the substrate holder of any one of the first to fourth aspects, the wiring housing space of the wiring housing portion has a high plating solution level when the substrate holder is placed in the plating tank. It is arranged at a position corresponding to a height higher than that.
According to the form 5, it is possible to prevent the wiring housing space from being almost immersed in the plating solution. In the plating solution, the thickness direction of the substrate holder is limited by the configuration of the plating tank such as the paddle, anode mask, and regulation plate. However, the restriction in the thickness direction is moderate above the plating solution surface, so wiring is accommodated. It is possible to sufficiently ensure the thickness direction of the portion, particularly the dimension of the wiring housing space. Further, since the wiring housing space is hardly immersed in the plating solution, the leakage of the plating solution into the wiring housing space can be more reliably suppressed.

[6] According to Aspect 6, in any one of the substrate holders of Aspects 1 to 5, the wiring housing portion is separate from the arm portion and the clamping portion.
According to the form 6, it becomes possible to replace | exchange an arm part, a clamping part, and a wiring accommodating part separately. In particular, when the wiring container is placed in the plating tank so that it is higher than the plating liquid level, it is possible to replace the clamping part, which has a relatively fast aging deterioration with the plating liquid, separately from the wiring container. It is.

[7] According to Aspect 7, in any of the substrate holders of Aspects 1 to 6, a plurality of external connection contacts and a plurality of contacts are connected by a plurality of wirings, and the plurality of contacts are located at different positions on the substrate holder. The plurality of wirings have the same length.
By making the lengths of the plurality of wirings between the contact and the external connection contact the same, the current flowing through each contact can be made uniform, and the plating quality can be improved. Further, the extra length of one or a plurality of wirings resulting from the path difference between each contact and the external connection contact can be accommodated in the wiring accommodating portion.

[8] According to Aspect 8, in any of the substrate holders according to Aspects 2 to 4, the housing main body is made of titanium, and the lid member is made of polyvinyl chloride.
According to the eighth aspect, the housing portion main body is made of titanium having high rigidity, and the lid member is made of inexpensive polyvinyl chloride, so that the rigidity necessary for the wiring housing portion can be secured while suppressing the cost. .

[9] According to the ninth aspect, there is provided a plating apparatus having a plating tank for installing any one of the substrate holders of the first to eighth aspects.
According to the ninth aspect, it is possible to provide a plating apparatus that exhibits the effects described in the first to eighth aspects. In particular, since a large-diameter wiring can be arranged in the wiring housing space while suppressing or preventing an increase in the thickness of the substrate holder, a more uniform and large current can be passed through the substrate. Thereby, a plating process with good quality can be performed on a larger substrate. Moreover, since the increase in the thickness of the substrate holder can be suppressed or prevented, an increase in the size of the plating tank can be suppressed or prevented.

[10] According to the tenth aspect, there is provided a plating method for plating a substrate in a state where the substrate is held by the substrate holder. In the plating method, one or more external connection contacts of the substrate holder are provided in the plating tank. The substrate is plated in a state in which a wiring accommodating portion that accommodates one or more extra wiring lengths relative to the path length between the first and the plurality of contacts is higher than the plating solution surface. I do.
According to the tenth aspect, it is possible to prevent the wiring housing space from being substantially immersed in the plating solution. In the plating solution, the dimension of the thickness direction of the substrate holder is limited by the configuration of the plating tank such as a paddle, an anode mask, and a regulation plate, but the dimension constraint in the thickness direction is moderate above the plating solution surface. For this reason, it can suppress thru | or prevent that a wiring accommodating part and the structure of a plating tank interfere. Further, since the wiring housing space is hardly immersed in the plating solution, the leakage of the plating solution into the wiring housing space can be more reliably suppressed.

1 is an overall layout view of a plating apparatus in which a substrate holder according to an embodiment of the present invention is used. It is a schematic front view of the substrate holder which concerns on one Embodiment. It is a schematic side view of a substrate holder. It is a schematic rear view of a substrate holder. It is a front perspective view of a substrate holder. It is a back perspective view of a substrate holder. It is a front view of a substrate holder. It is a rear view of a substrate holder. It is a front view of a back plate. It is a rear view of a back plate. It is a partial enlarged rear view of the substrate holder showing the attachment state of the back plate. It is a partial expansion perspective view of a substrate holder which shows the attachment state of a backplate. It is a perspective view which shows the relationship between a clamp and a connection member. It is a perspective view of the clamp of a clamp state. It is a side view of the clamp of a clamp state. It is a cross-sectional perspective view of the clamp in a clamped state. It is sectional drawing of the clamp of a clamp state. It is a perspective view which shows the structure of the clamp of an unclamp state. It is a side view of the clamp of an unclamp state. It is a cross-sectional perspective view of the clamp in an unclamped state. It is sectional drawing which shows the structure of the clamp of an unclamp state. It is a partially notched side view which shows the clip of a backplate. It is a partially expanded perspective view which shows the clip of a backplate. It is a partially notched perspective view which shows the state of the clip at the time of closure. It is a partially notched sectional view which shows the state of the clip at the time of closing. It is a partially notched perspective view which shows the state of the clip at the time of open | release. It is a partially cutaway sectional view showing the state of the clip at the time of opening. It is sectional drawing which shows the inner seal part of a front plate. It is sectional drawing which shows the inner seal part and outer seal part of a front plate. It is a rear view of a front plate body. FIG. 6 is a partially enlarged plan view of a region including a front plate connector. It is a cross-sectional perspective view of a front panel. It is sectional drawing of a front panel. It is a partial enlarged perspective view of a front panel showing the arrangement of cables. FIG. 10 is a perspective view of the vicinity of the cable introduction position of the face portion when illustration of the wiring buffer portion is omitted. FIG. 6 is a top view showing the vicinity of a cable introduction position of a face portion when illustration of a wiring buffer portion is omitted. It is an enlarged top view showing the vicinity of the cable introduction position of the face portion when the illustration of the wiring buffer portion is omitted. It is a rear view in the corner vicinity of the face part near the connector. It is the rear view which expanded further the corner part vicinity of the face part near the connector. It is sectional drawing in the CC line of FIG. 21A. It is a perspective view of the part which removed the coating | cover of the cable. It is explanatory drawing explaining the connection relation of a cable and an external connection contact. It is a perspective view of the front plate in the vicinity of the wiring buffer part. It is an expansion perspective view of a wiring buffer part. It is a rear view of the cover member of a wiring buffer part. It is a side view of the cover member of a wiring buffer part. It is a rear view of the front plate in the vicinity of the wiring buffer unit. It is a rear view of the front plate in the vicinity of the wiring buffer part with the cover member removed. It is a perspective view of the front plate in the vicinity of the wiring buffer part with the cover member removed. It is explanatory drawing explaining the difference in the length of the wiring resulting from the path | route difference between each contact and an external connection contact. It is an enlarged perspective view of the face side of the wiring buffer unit. It is the perspective view which looked at the attachment part side of the wiring buffer part from the attachment part side. It is the perspective view which looked at the attaching part side of the wiring buffer from the wiring buffer part side. It is a perspective view which shows the wiring buffer part of the state which removed the cover member. It is a perspective view which shows the wiring buffer part of the state which attached the cover member. It is a perspective view of the wiring buffer part of the state which removed the cover member which concerns on other embodiment. It is a perspective view of the wiring buffer part in the state where the cover member concerning other embodiments was attached. It is a rear view of the cover member of the wiring buffer part which concerns on other embodiment.

  Embodiments of the present invention will be described below with reference to the drawings. In the following embodiments, the same or corresponding members are denoted by the same reference numerals, and redundant description is omitted. In this specification, expressions such as “front”, “back”, “front”, “back”, “up”, “down”, “left”, “right”, etc. are used. The above shows the position and direction on the paper surface of the example drawing, and may differ in actual arrangement when the apparatus is used. Further, in this specification, the “arm portion” or “handle” is used synonymously with “engagement portion” of a portion where the substrate holder is gripped or engaged by the transfer device when the substrate holder is transferred.

  FIG. 1 is an overall layout diagram of a plating apparatus in which a substrate holder according to an embodiment of the present invention is used. As shown in FIG. 1, this plating apparatus 100 loads a substrate (corresponding to an example of an object to be processed) on the substrate holder 1 or unloads the substrate from the substrate holder 1, It is roughly divided into a processing unit 120 for processing a substrate and a cleaning unit 50a. The processing unit 120 further includes a pre-processing / post-processing unit 120A that performs pre-processing and post-processing of the substrate, and a plating processing unit 120B that performs plating processing on the substrate. In addition, the board | substrate processed with this plating apparatus 100 contains a square substrate and a circular substrate. The rectangular substrate includes a polygonal glass substrate such as a rectangle, a liquid crystal substrate, a printed circuit board, and other polygonal plating objects. The circular substrate includes a semiconductor wafer, a glass substrate, and other circular plating objects.

The load / unload unit 110 includes two cassette tables 25 and a substrate detachment mechanism 29. The cassette table 25 is mounted with a cassette 25a that stores substrates such as semiconductor wafers, glass substrates, liquid crystal substrates, and printed circuit boards. The substrate removal mechanism 29 is configured to attach and detach the substrate to and from the substrate holder 1 (described later in FIG. 2A). In addition, a stocker 30 for accommodating the substrate holder 1 is provided in the vicinity (for example, below) of the substrate removal mechanism 29. In the center of these units 25, 29, and 30, a substrate transfer device 27 including a transfer robot that transfers a substrate between these units is disposed. The substrate transfer device 27 is configured to be able to travel by the travel mechanism 28.

  The cleaning unit 50a includes a cleaning device 50 that cleans and dries the substrate after the plating process. The substrate transport device 27 is configured to transport the plated substrate to the cleaning device 50 and take out the cleaned substrate from the cleaning device 50.

  The pre-processing / post-processing unit 120A includes a pre-wet tank 32, a pre-soak tank 33, a pre-rinse tank 34, a blow tank 35, and a rinse tank 36. In the pre-wet tank 32, the substrate is immersed in pure water. In the pre-soak tank 33, the oxide film on the surface of the conductive layer such as the seed layer formed on the surface of the substrate is removed by etching. In the pre-rinse tank 34, the substrate after the pre-soak is cleaned with a cleaning liquid (pure water or the like) together with the substrate holder. In the blow tank 35, the substrate is drained after cleaning. In the rinsing tank 36, the substrate after plating is cleaned with a cleaning liquid together with the substrate holder. The pre-wet tank 32, the pre-soak tank 33, the pre-rinse tank 34, the blow tank 35, and the rinse tank 36 are arranged in this order. The configuration of the pretreatment / post-processing unit 120A of the plating apparatus 100 is an example, and the configuration of the pre-processing / post-processing unit 120A of the plating apparatus 100 is not limited, and other configurations can be adopted. .

  The plating processing unit 120 </ b> B has a plurality of plating tanks 39 provided with an overflow tank 38. Each plating tank 39 accommodates one substrate therein and immerses the substrate in a plating solution held therein to perform plating such as copper plating on the substrate surface. Here, the type of the plating solution is not particularly limited, and various plating solutions are used depending on the application.

  The plating apparatus 100 includes a substrate holder transfer device 37 that employs, for example, a linear motor system, which is located on the side of each of these devices and transfers the substrate holder together with the substrates between these devices. The substrate holder transport device 37 is configured to transport the substrate holder between the substrate desorption mechanism 29, the pre-wet tank 32, the pre-soak tank 33, the pre-rinse tank 34, the blow tank 35, the rinse tank 36, and the plating tank 39. Is done.

  The plating processing system including the plating apparatus 100 configured as described above includes a controller 175 configured to control each unit described above. The controller 175 includes a memory 175B that stores a predetermined program, a CPU (Central Processing Unit) 175A that executes the program in the memory 175B, and a control unit 175C that is realized by the CPU 175A executing the program. The control unit 175C, for example, controls the transport of the substrate transport device 27, controls the attachment / detachment of the substrate to / from the substrate holder in the substrate detachment mechanism 29, controls the transport of the substrate holder transport device 37, and controls the plating current and plating time in each plating tank 39. In addition, the opening diameter of an anode mask (not shown) and the opening diameter of a regulation plate (not shown) disposed in each plating tank 39 can be controlled. The controller 175 is configured to be communicable with a host controller (not shown) that performs overall control of the plating apparatus 100 and other related apparatuses, and can exchange data with a database included in the host controller. Here, the storage medium constituting the memory 175B stores various programs such as various setting data and a plating processing program described later. As the storage medium, known media such as a computer-readable memory such as ROM and RAM, and a disk-shaped storage medium such as a hard disk, CD-ROM, DVD-ROM, and flexible disk can be used.

[Substrate holder]
FIG. 2A is a schematic front view of a substrate holder according to an embodiment. FIG. 2B is a schematic side view of the substrate holder. FIG. 2C is a schematic rear view of the substrate holder. FIG. 3A is a front perspective view of the substrate holder. FIG. 3B is a rear perspective view of the substrate holder. FIG. 4A is a front view of the substrate holder. FIG. 4B is a rear view of the substrate holder.

  The substrate holder 1 includes a front plate 300 and a back plate 400. The substrate S is held between the front plate 300 and the back plate 400. In this embodiment, the substrate holder 1 holds the substrate S with one side of the substrate S exposed. The substrate S can be a semiconductor wafer, a glass substrate, a liquid crystal substrate, a printed board, or other objects to be plated. The substrate S has any shape such as a circle and a square. In the following description, a rectangular substrate will be described as an example. However, if the shape of the opening of the substrate holder 1 is changed, it is possible to hold a circular or other shape substrate.

  The front plate 300 includes a front plate main body 310 and an arm portion 330. The arm portion 330 is a grip portion that is gripped by the substrate holder transport device 37 and is a portion that is supported when the arm portion 330 is disposed in the plating tank 39. The substrate holder 1 is transported by the substrate holder transport device 37 in a state where the substrate holder 1 stands vertically with respect to the installation surface of the plating apparatus 100, and is disposed in the plating tank 39 while standing vertically.

  The front plate main body 310 is substantially rectangular, has a wiring buffer portion 311 and a face portion 312, and has a front surface 301 and a back surface 302. The front plate body 310 is attached to the arm portion 330 at two locations by the attachment portion 320. The front plate main body 310 is provided with an opening 303, and the surface to be plated of the substrate S is exposed from the opening 303. In the present embodiment, the opening 303 is formed in a rectangular shape corresponding to the rectangular substrate S. When the substrate S is a circular semiconductor wafer or the like, the shape of the opening 303 is also circular.

  A wiring buffer portion 311 is provided on the side of the front plate body 310 close to the arm portion 330. The wiring buffer unit 311 is a region for distributing cables that reach the front plate main body 310 via the arm unit 330, and is a region that accommodates a cable having a spare length. The wiring buffer portion 311 is formed to have a thickness slightly larger than the other portion (face portion 312) of the front plate body 310 (see FIG. 2B). In the present embodiment, the wiring buffer part 311 is formed separately from the other part (face part 312) of the front plate body 310 and is attached to the face part 312. A connector 331 for electrically connecting to an external wiring is provided on one end side of the arm portion 330 (see FIG. 3A and the like). The back plate 400 is fixed to the back surface 302 of the front plate main body 310 (more specifically, the face portion 312) by a clamp 340 (FIGS. 2C, 3B, and 4B).

(Mounting structure of back plate to front plate)
FIG. 5A is a front view of the back plate. FIG. 5B is a rear view of the back plate. FIG. 6A is a partially enlarged rear view of the substrate holder showing the attachment state of the back plate. FIG. 6B is a partially enlarged perspective view of the substrate holder showing a state where the back plate is attached. FIG. 7 is a perspective view showing the relationship between the clamp and the connecting member.

The back plate 400 includes a back plate body 410. The back plate body 410 has a generally rectangular shape, but has a smaller size than the front plate body 310 of the front plate 300 (FIGS. 3B and 4B). The back plate body 410 has a front surface 401 (
5A) and a back surface 402 (FIG. 5B).

  A front surface 401 of the back plate body 410 is a mounting surface of the substrate S, and is attached to the back surface 302 of the front plate body 310. A total of eight clip portions 420 for holding (fixing) the substrate S are provided on the front surface 401 of the back plate body 410 corresponding to each side of the substrate S. In this example, one clip portion 420 is disposed on each of the upper and lower sides of the substrate S, and three clip portions 420 are disposed on the left and right sides. Note that the number and arrangement of the clip portions 420 are appropriately selected according to the size and shape of the substrate S, and are not limited to the number and arrangement shown.

  Positioning pieces 490 are provided at three of the four corners of the back plate body 410. A through hole 490 a is formed in the positioning piece 490. The positioning piece 490 may be formed integrally with the back plate body 410, or may be formed separately from the back plate body 410 and attached to the back plate body 410. On the back surface 302 of the front plate main body 310, positioning pins 390 are provided at positions corresponding to the positioning pieces 490 (FIGS. 6A and 6B). The positioning pins 390 may be formed integrally with the front plate body 310, or may be formed separately from the front plate body 310 and attached to the front plate body 310. When the back plate 400 is attached to the front plate 300, the positioning pins 390 are inserted through the through holes 490a of the positioning pieces 490 of the back plate 400, and the both are aligned.

  As shown in FIG. 4B, fixing members 350 are disposed on the back surface 302 of the front plate 300 corresponding to the four sides of the back plate 400. Two fixing members 350 are provided for one side of the back plate 400, and are arranged side by side along one side of the back plate 400. As shown in FIGS. 6A, 6B, and 7, two clamps 340 are attached to each fixing member 350. Therefore, four clamps 340 are provided per side. Further, a lever 342 for operating the four clamps 340 at the same time is attached between the two fixing members 350 on each side. The number of clamps per side is not limited to four, and may be three or less or five or more.

  A rotating shaft 341 is attached across the two fixing members 350 on each side. The rotating shaft 341 is rotatably attached to the fixed member 350 (FIG. 7). Each clamp 340 and lever 342 are non-rotatably attached to the rotation shaft 341 by key coupling (key and key groove) (FIGS. 8A, B, and 9A, B). The four clamps 340 are attached to the rotation shaft 341 with the same phase, but the lever 342 is attached to the rotation shaft 341 with a phase different from that of the four clamps 340. With this configuration, when the lever 342 rotates, the four clamps 340 rotate in synchronization therewith. Here, the clamp 340 is configured to rotate around a rotation axis 341 parallel to the surfaces 301 and 302 of the front plate body 310, but reciprocating in a direction perpendicular to the surfaces 301 and 302 of the front plate body 310. Then, the clamp 340 may be configured to clamp the back plate 400.

The clamp 340 has an engaging portion 340a that is curved like a bowl at the tip. The clamp 340 has a through hole on the base end side, and a rotation shaft 341 is inserted through the through hole and fixed to be non-rotatable by a key and a key groove (see FIG. 9A). When not receiving external force, the lever 342 is urged to rise from the back surface 302 of the front plate 300 by a compression spring 343 as shown in FIG. 7, and each clamp 340 is closed accordingly. Is biased in the direction. In other words, the clamp 340 is configured as a normally closed type. The lever 342 is configured as a force receiving portion that can receive a pressing force from the outside. The lever 342 can receive a pressing force from an actuator provided in the board attaching / detaching mechanism 29, for example. In FIG. 10B, the actuator AR1 is schematically shown. Actuator AR1 is provided with drive parts DRV, such as an air cylinder and a motor, and rod-shaped member RD driven by drive part DRV, for example. When the lever 342 receives a pressing force from the actuator AR1, the lever 342 rotates in a direction to tilt toward the back surface 302 of the front plate 300, and accordingly, the clamp 340 rotates in the opening direction. In this example, four actuators AR1 are provided corresponding to the levers 342 on each side. Preferably, the four actuators AR1 are simultaneously driven to push the lever 342. However, the four actuators AR1 may be driven separately and are not limited to being driven simultaneously.

  An engagement receiving portion 430 is provided on the back surface 402 of the back plate 400 at a position corresponding to the clamp 340. As shown in this embodiment, the engagement receiving portion 430 is formed as a separate member from the back plate body 410 of the back plate 400 and may be attached to the back plate body 410 or formed integrally with the back plate body 410. It may be what you did. The engagement receiving portion 430 is formed with a protruding portion 430a having a shape capable of being hooked and engaged with the hook-like engagement portion 340a of the clamp 340. The protrusion 430a has a longer dimension than the engagement portion 340a in order to reliably receive the engagement of the engagement portion 340a of the clamp 340.

Hereinafter, a structure for attaching the back plate 400 to the front plate 300 will be described with reference to the drawings.
FIG. 8A is a perspective view of the clamp in a clamped state. FIG. 8B is a side view of the clamp in a clamped state. FIG. 9A is a cross-sectional perspective view of the clamp in a clamped state. FIG. 9B is a cross-sectional view of the clamp in a clamped state. FIG. 10A is a perspective view showing a configuration of a clamp in an unclamped state. FIG. 10B is a side view of the clamp in an unclamped state. FIG. 11A is a cross-sectional perspective view of the clamp in an unclamped state. FIG. 11B is a cross-sectional view showing the configuration of the clamp in an unclamped state.

  As described above, the clamp 340 is a normally closed type, and is in a closed state as shown in FIGS. 8A and 8B and FIGS. 9A and 9B when the lever 342 is not subjected to a pressing force. When the back plate 400 is attached to the front plate 300, first, a pressing force is applied to the lever 342 of the front plate 300 by the actuator AR1 (FIG. 10B), and as shown in FIGS. 10A and 10B and FIGS. The clamp 340 is rotated in the opening direction against the urging force of 343. With the clamp 340 opened, the back plate 400 is disposed at a predetermined position on the back surface 302 of the front plate 300 (face portion 312). At this time, the alignment pin 390 of the front plate 300 engages with the through hole 490a of the alignment piece 490 of the back plate 400, and the back plate 400 is aligned with a predetermined position of the front plate 300.

  Next, the pressing force of the actuator AR1 is removed from the lever 342 of the front plate 300. Accordingly, the lever 342 is rotated toward the original position by the urging force of the compression spring 343, and the clamps 340 are rotated in the closing direction. As a result, the engaging portion 340a of the clamp 340 engages with the engaging receiving portion 430 of the back plate 400, and the back plate 400 is fixed to the front plate 300 (FIGS. 8A and B and FIGS. 9A and 9B).

  When the back plate 400 is removed, as described above, a pressing force is applied to the lever 342 of the front plate 300 by an actuator (not shown), and the clamp 340 is rotated in a direction to open against the urging force of the compression spring 343. (FIGS. 10A and B and FIGS. 11A and B). As a result, the clamp 340 is released from the engagement receiving portion 430, and the back plate 400 can be detached from the front plate 300.

(Mounting structure of the board to the back plate)
FIG. 12A is a partially cutaway side view showing a clip of the back plate. FIG. 12B is a partially enlarged perspective view showing a clip of the back plate. FIG. 13A is a partially cutaway perspective view showing a state of a clip at the time of closing. FIG. 13B is a partially cutaway cross-sectional view showing the state of the clip when closed. FIG. 14A is a partially cutaway perspective view showing a state of a clip when opened. FIG. 14B is a partially cutaway cross-sectional view showing the state of the clip when opened.

  A total of eight clip portions 420 corresponding to each side of the substrate S are provided on the front surface 401 of the back plate 400 (see FIG. 5A). In addition, buttons 470 are provided on the back surface 402 of the back plate 400 at positions corresponding to the clip portions 420 (see FIG. 5B). When no force is applied to the button 470, the surface on the front surface 401 side of the button 470 is disposed with a predetermined distance from the base ends of the two clips 421 (FIG. 13B). The button 470 includes a force receiving portion 471, an elastic portion 472 that supports the force receiving portion 471 so as to be displaceable with respect to the back plate main body 410, and a mounting portion 473 on the outer periphery of the elastic portion 472. The button 470 is fixed at the attachment portion 473 by a pressing member 474 and a fastening member 475. The fastening member 475 is, for example, a stud, a bolt, or the like.

  As shown in FIGS. 12A and 12B, each clip portion 420 includes a fixed portion 423 fixed to the front surface 401 of the back plate body 410, a fixed shaft 424 fixed to the fixed portion 423 so as not to rotate, and a fixed shaft 424. Two clips 421 that are rotatably supported while being translated, and a winding spring 422 that is provided on each of the clips 421 and biases the clip 421 in the closing direction.

  The clip 421 has a claw portion 421a at its distal end, and a long hole 421b and two round holes 421c are formed on its proximal end side. The clip 421 is attached by inserting the fixed shaft 424 through the elongated hole 421b. As illustrated in FIG. 13B, the winding spring 422 includes a winding portion 422c and legs 422a and 422b extending from the winding portion 422c. The winding spring 422 is formed by winding a wire or the like a plurality of times in a circular shape to provide a winding portion 422c, leaving leg portions 422a and 422b having a predetermined length. The leg portion 422a has a bent portion that bends at a substantially right angle at the tip, and this bent portion is inserted and fitted into a round hole 421c on the proximal end side of the two round holes 421c of the clip 421. The other leg portion 422b is not attached to the clip 421, and has a bent portion that bends at a substantially right angle at the tip, and this bent portion abuts on a regulating surface 423a provided on the fixing portion 423. Supported by the state. Moreover, the leg part 422a is guided by the guide surface 423b provided in the fixing | fixed part 423 (FIG. 13B, FIG. 14B).

  With this configuration, the clip 421 can rotate toward the outside of the back plate body 410 while moving away from the back plate body 410 (FIGS. 13B to 14B). As a result, the clip 421 is opened (FIGS. 14A and 14B). Conversely, the clip 421 can rotate toward the inside of the back plate body 410 while moving in a direction approaching the back plate body 410 (FIGS. 14B to 13B). As a result, the clip 421 is closed (FIGS. 13A and 13B). In this embodiment, the clip 421 is biased in the closing direction by the winding spring 422 in a state in which no force is applied from the outside, and is normally closed (FIGS. 13A and 13B). 14B shows a state where the force receiving portion 471 of the button 470 is not displaced in order to avoid complication of the drawing, but in reality, the force receiving portion 471 is displaced toward the clip 421. The clip 421 is pressed, and the clip 421 is in an open state by this pressing.

When the substrate S is placed on the back plate 400, a pressing force is applied to the eight buttons 470 (force receiving portion 471) of the back plate 400 from the outside by the actuator AR2 (FIG. 14B). As a result, as shown in FIGS. 14A and 14B, the force receiving portion 471 is displaced toward the front surface 401 and comes into contact with the proximal end portions of the two clips 421. As shown in FIG. 14B, the clip 421 rotates in the direction away from the back plate body 410 by the force received from the force receiving portion 471, and rotates to the outside of the back plate body 410 to be in an open state (FIG. 14B). . As schematically shown in FIG. 14B, the actuator AR2 includes, for example, a drive unit DRV such as an air cylinder or a motor, and a rod-shaped member RD driven by the drive unit DRV. Eight actuators AR2 are provided corresponding to the eight buttons 470. Preferably, the eight actuators AR2 are simultaneously driven to press the button 470. However, the eight actuators AR2 may be driven separately and are not limited to being driven simultaneously.

  In a state where the clip 421 is opened, the substrate S is placed at a predetermined position on the front surface 401 of the back plate 400, and then the pressing force by the actuator AR2 is released from the button 470. As a result, the clip 421 rotates inward of the back plate main body 410 while moving in a direction approaching the back plate main body 410 by the urging force of the winding spring 422, and enters a closed state (FIGS. 14B to 13B). At this time, the claw portion 421 a at the tip of the clip 421 engages with the peripheral edge portion of the substrate S, and the substrate S can be fixed to the front surface 401 of the back plate 400.

  If the back plate 400 to which the substrate S is thus attached is attached to the front plate 300 (face portion 312) as described with reference to FIGS. 5 to 13, the attachment of the substrate S to the substrate holder 1 is completed. When removing the substrate S from the back plate 400, as described above, the pressing force is applied to the eight buttons 470 (force receiving portion 471) of the back plate 400 from the outside by the actuator AR2 (FIGS. 14A and 14B).

  Here, the clip 421 is configured to rotate around the fixed shaft 424 parallel to the surfaces 401 and 402 of the back plate body 410, but reciprocating in a direction perpendicular to the surfaces 401 and 402 of the back plate body 410. Then, the clip 421 may be configured to clamp the substrate S.

(Configuration of seal part)
FIG. 15 is a cross-sectional view showing the inner seal portion of the front plate. FIG. 16 is a cross-sectional view showing the inner seal portion and the outer seal portion of the front plate.

  An inner seal 361 is provided on the back surface 302 of the front plate 300 adjacent to the opening 303. The inner seal 361 is attached to the back surface 302 of the front plate 300 by a seal holder 363. The inner seal 361 seals between the substrate S and the front plate 300 and prevents the plating solution from entering the end of the substrate S. A contact 370 for supplying a potential to the substrate S is also attached to the seal holder 363.

  Further, as shown in FIG. 16, an outer seal 362 is attached to the back surface 302 of the front plate 300 by a seal holder 364 outside the inner seal 361. The outer seal 362 contacts the back plate 400 and seals between the front plate 300 and the back plate 400.

  In the present embodiment, since the seal holders 363 and 364 to which the inner seal 361 and the outer seal 362 are attached are configured as separate members, the inner seal 361 and the outer seal 362 can be replaced separately.

FIG. 17 is a rear view of the front plate body. FIG. 18 is a partially enlarged plan view of a region including the front plate connector. FIG. 19A is a cross-sectional perspective view of the front panel. FIG. 19B is a cross-sectional view of the front panel. FIG. 19C is a partially enlarged perspective view of the front panel showing the arrangement of the cables. FIG. 20A is a perspective view of the vicinity of the cable introduction position of the face portion when illustration of the wiring buffer portion is omitted. FIG. 20B is a top view showing the vicinity of the cable introduction position of the face portion when the illustration of the wiring buffer portion is omitted. FIG. 20C is an enlarged top view showing the vicinity of the cable introduction position of the face portion when the illustration of the wiring buffer portion is omitted.

  The back surface 302 of the front plate body 310 has 18 contact regions C1-C18. The contact areas C1-C7, C17, C18 are arranged in a half area (first area, right half area in FIG. 17) of the face portion 312 on the connector 331 side. The portion 312 is arranged in a half area far from the connector 331 (second area, left half area in FIG. 17). In the following description, for the sake of convenience, a cable arranged in the first region may be referred to as a first group of cables, and a cable arranged in the second region may be referred to as a second group of cables.

  Each contact region C1-C18 includes a contact (contact member) 370 for supplying power to the substrate S shown in FIGS. The contacts 370 in the contact regions C1 to C18 are supplied with power from the outside via the cables L1 to L18, respectively. In the following description, when it is not necessary to distinguish between the cables, the cables L1 to L18 may be collectively referred to as a cable L in some cases. An arbitrary cable may be referred to as the cable L.

  The first end portions of the cables L1 to L18 are connected to a connector 331 provided at one end of the arm portion 330. More specifically, in the connector 331, individual contacts or a plurality of common contacts (not shown) are connected. Electrically connected. Cables L1-L18 can be electrically connected to an external power supply (power supply circuit, power supply device, etc.) via each contact of connector 331.

FIG. 22 is an explanatory diagram illustrating a connection relationship between the cable and the external connection contact.
In the connector 331, the cables L1-L18 are connected to the external connection contacts 331a1, 331a2 (FIG. 22). The external connection contacts 331a1, 331a2 are connected to a power supply terminal from an external power source. For example, three cables of the first group (L1-L7, L17, L18) are connected to the common first-side external connection contact 331a1, and three cables of the second group of cables (L8-L16) are connected. The first external connection contact 331a1 and the second external connection contact 331a2 are connected to the common second external connection contact 331a2, and the pair of external connection contacts 331a. Here, the first side and the second side correspond to the respective sides when the contacts are arranged in two rows in the connector 331. For example, in FIG. 17, when the connector 331 of the substrate holder 1 is viewed from the right side, the right side is the first side and the left side is the second side. Specifically, the external connection contact is configured as follows.

  Cables L17, L18, and L1 are connected to a common first-side external connection contact 331a1, and cables L8, L9, and L10 are connected to a common second-side external connection contact 331a2, and these first-side external connections The contact 331a1 and the second-side external connection contact 331a2 are paired (referred to as a first pair or a first external connection contact pair 331a).

  The cables L2, L3, and L4 are connected to another external connection contact 331a1 on the first side, and the cables L11, L12, and L13 are connected to another external connection contact 331a2 on the second side, and these external connections on the first side The contact 331a1 and the second-side external connection contact 331a2 are paired (referred to as a second pair or a second external connection contact pair 331a).

  The cables L5, L6, and L7 are connected to another external connection contact 331a1 on the first side, and the cables L14, L15, and L16 are connected to another external connection contact 331a2 on the second side, and these external connections on the first side The contact 331a1 and the second-side external connection contact 331a2 are paired (referred to as a third pair or a third external connection contact pair 331a).

  In the connector 331, the external connection contact 331a1 on the first side and the external connection contact 331a2 on the second side of each external connection contact pair 331a are arranged to face each other. The first-side external connection contact 331a1 and the second-side external connection contact 331a2 of the first external connection contact pair 331a are arranged to face each other, and the first-side external connection of the second external connection contact pair 331a. The contact 331a1 and the second-side external connection contact 331a2 are arranged to face each other, and the first-side external connection contact 331a1 and the second-side external connection contact 331a2 of the third external connection contact pair 331a face each other. Arranged.

  In the substrate attaching / detaching mechanism 29, an energization confirmation process is executed. Specifically, after the substrate S is held on the substrate holder 1 (after the back plate 400 is fixed by the clamp 340 of the front plate 300), a resistance measuring device (not shown) is connected to the first to third pairs of the connector 331. And a predetermined inspection voltage is applied between the first external connection contact and the second external connection contact in each pair. Thereby, the electrical resistance between the first external connection contact and the second external connection contact in each pair is measured. If the electrical resistance of each pair is equal to or less than a predetermined value and within a predetermined range (the electrical resistance of each pair is not varied and there is no abnormality such as disconnection), it is determined that the substrate holder 1 is energized well. (Energization confirmation process). This energization confirmation process is executed by the controller 175C of the controller 175, and can be included in the above-described “control of attaching / detaching the substrate to / from the substrate holder by the substrate attaching / detaching mechanism 29”.

  The second ends, which are the other ends of the cables L1-L18, are electrically connected to the contacts 370 in the contact regions C1-C18, respectively, as will be described later. Each cable L1-L18 passes from the connector 331, through the arm portion 330, through one attachment portion 320, and enters the wiring buffer portion 311 (FIG. 18). In the wiring buffer unit 311, among the cables L1-L18, the cables L17, L18, L1-L7 are directed to the first area (connector side area), and the cables L8-L16 are the second area (area far from the connector). ) FIG. 18 mainly shows the first group of cables L17, L18, and L1-L7 arranged in the first region. As shown in FIG. 18, the first group of cables L <b> 17, L <b> 18, L <b> 1-L <b> 7 passes through the wiring buffer unit 311 and is guided to the cable passage 365 between the seal holders 363 and 364 in the face unit 312. Although not shown, the second group of cables L8-16 also pass through the second region (region far from the connector) of the wiring buffer unit 311 and are guided to the cable path 365 in the second region of the face unit 312. . In FIG. 18, in order to avoid complication of the drawing, a part of the cable length is omitted. Further, the arrangement of the cables L1-L18 in the wiring buffer unit 311 can be arbitrarily arranged so as to buffer a part of the length of the cables L1-L18.

  A thick portion 3113 is provided on the face portion 312 side of the wiring buffer portion 311 (FIGS. 19A and 19B). Wiring holes 311a corresponding to the respective cables L1-L18 are provided in the thick portion 3113 and the face portion 312 of the wiring buffer portion 311 up to the cable passage 365 between the seal holders 363 and 364 (FIGS. 19A and 19B). ). Here, the wiring hole 311a is a conical hole having a diameter through which the cable can pass. Although only one wiring hole 311a is shown in FIG. 19A, actually, a plurality of wiring holes 311a are provided corresponding to each cable as shown in FIG. 19C. Wiring holes 311a corresponding to at least the number of cables are provided.

  In this embodiment, as shown in FIGS. 19A and 19B, the wiring buffer unit 311 is provided separately from the face unit 312 of the front panel main body 310 and is attached to the face unit 312. An O-ring 501 for sealing the wiring hole 311 a and the cable L is disposed around the cable at the boundary between the wiring buffer unit 311 and the face unit 312. Thereby, the wiring hole 311a and the cable L are protected from the plating solution and foreign matter from the outside.

  FIG. 21A is a rear view in the vicinity of the corner portion of the face portion on the side close to the connector. FIG. 21B is a rear view further enlarging the vicinity of the corner of the face near the connector. FIG. 21C is a cross-sectional view taken along the line CC of FIG. 21A. FIG. 21D is a perspective view of a portion where the cable covering is removed.

  As shown in FIGS. 21A and 21B, the cables L1-L7 are introduced into the cable passage 365 side by side in the same plane, and are arranged along the side of the opening 303 on the connector 331 side. The cables do not overlap in the thickness direction of the face portion 312. Therefore, the thickness of the face portion 312 and the front panel 300 can be suppressed.

  As shown in FIGS. 21A and 21B, a contact 370 made of a conductor is arranged for each contact region C1-C18 along each side of the opening 303. The contact 370 does not contact the inner seal 361 but is disposed adjacent to it. The contact 370 is disposed on the seal holder 363 and is fixed to the seal holder with a plurality of screws 511. The seal holder 363 is provided with a wiring groove 363a for drawing the cable from the cable passage 365 to the connection position (position of the screw 511) in each contact region. As shown in FIG. 21D, the cable L includes a core wire or a conductive wire 601 made of an electrical conductor, and a coating 602 for insulating the conductive wire 601. In the cable L, the sheath 602 is removed at the distal end (second end), and the core wire or the conductive wire 601 is exposed. Then, the core wire 601 of the cable L is drawn into the wiring groove 363a. Note that the cable L drawn in the assigned contact region terminates in the contact region.

  For example, in the contact region C1, a wiring groove 363a (FIG. 21C) that opens toward the cable passage 365 near the contact region C1 is formed in the seal holder 363, and the wiring groove 363a is provided in the contact region C1. It extends so as to pass under the four screws (fastening members) 511 and terminates (FIG. 21A). Similarly, in the contact region C2, a wiring groove 363a that opens toward the cable passage 365 near the contact region C2 is formed in the seal holder 363, and the wiring groove 363a includes four screws provided in the contact region C2. Extends and terminates to pass below 511. The positional relationship between the screw 511 and the wiring groove 363a is shown in FIG. 21C. When the cable L (L1 in FIG. 21C) is disposed in the wiring groove 363a, the contact 370 and the cable (core wire) are pressed by the flange portion 511a of the screw 511.

The electrical connection between the cable L and the contact 370 in each contact region is performed as follows. Taking the cable L1 as an example, the sheath (602) is removed from the tip (second end) of the cable L1, and the core wire (conductive wire) 601 is exposed (FIGS. 21A to 21D). The distal end of the cable L1 is introduced into the wiring groove 363a of the seal holder 363 in the vicinity of the contact C1, and is pressed together with the contact 370 by four screws (fastening members) 511 in the contact region C1. That is, the screw (fastening member) 511 and the seal holder 363 sandwich the core wire 601 of the cable L1 together with the contact 370. As a result, as shown in FIG. 21C, the cable L1 is electrically connected to the contact 370. When the substrate holder 1 holds the substrate S, the contact 370 comes into contact with the substrate S, and power is supplied to the substrate S from the external power source via the cable L1 and the contact 370. The other contact regions C2-C18 are similarly configured, and power is supplied to the substrate S from 18 contacts 370.

  Since the cable L2-L7 is not drawn into the contact region C1, the cables L2-L7 are arranged side by side between the contact region C1 and the contact region C2. In the contact region C2, as in the contact region C1, the cable L2 is drawn into the wiring groove 363a of the seal holder 363, and is pressed together with the contact 370 by the four screws 511 to be electrically connected to the contact 370. As a result, the cables L3 to L7 are arranged side by side between the contact region C2 and the contact region C3. Similarly, cables L3-L7 are electrically connected to contacts 370 in contact regions C3-C7, respectively. As a result, the cables L4-L7 are arranged side by side between the contact regions C3 and C4, the cables L5-L7 are arranged side by side between the contact regions C4 and C5, and between the contact regions C5 and C6. Cables L6-L7 are arranged side by side, and cable L7 is arranged side by side between contact regions C6 and C7.

  Similarly, the cables L17 and L18 are electrically connected to the contacts 370 in the contact regions C17 and C18, respectively. Also, in the region far from the connector (second region), the cables L8 to L16 are electrically connected to the contacts 370 in the contact regions C8 to C16, respectively, similarly to the cables in the first region.

  In the present embodiment, the case where the cable L is sandwiched together with the contact 370 and the cable L and the contact 370 are directly electrically connected has been described. 2 conductive members) may be interposed.

(Wiring buffer)
FIG. 23 is a perspective view of the front plate in the vicinity of the wiring buffer unit. FIG. 24 is an enlarged perspective view of the wiring buffer unit. FIG. 25 is a rear view of the lid member of the wiring buffer unit. FIG. 26 is a side view of the lid member of the wiring buffer unit.

  The wiring buffer unit 311 includes a housing main body 3111 and a lid member 3120. The container main body 311 is made of titanium, for example. The lid member 3120 is made of, for example, polyvinyl chloride (PVC). Note that the face portion 312 and the arm portion 330 can also be formed of titanium. Further, the back plate 400 can be formed entirely of titanium. In the present embodiment, the lid member 3120 is a dedicated lid for the wiring buffer unit 311, and is not shared with a member that covers other parts such as the face unit 312.

  The housing main body 311 has a generally rectangular shape and has a recess 3112 formed on the back surface thereof. The recess 3112 is a substantially cubic space and forms a wiring accommodation space 3140. The concave portion 3112 is formed over substantially the entire width direction of the face portion 312, and has a width slightly shorter than the width of the face portion 312. The accommodating portion main body 311 has a thick portion 3113 on the face portion 312 side. A stepped portion 3113 a that engages with the face portion 312 is formed on the front surface of the thick portion 3113. The accommodating portion main body 311 has a thick portion 3114 on the attachment portion 320 side. The thick portion 3114 has two projecting portions 3114 a projecting corresponding to the mounting portions 320. A stepped portion 3114b that engages with the mounting portion 320 is formed on the back surface of each protruding portion 3114a. The concave portion 3112 forms a rectangular space surrounded by the thick portion 3113 on the face portion 312 side, the thick portion 3114 on the attachment portion 320 side, and the thick portions on both sides in the width direction.

The lid member 3120 has a substantially rectangular shape, and has a recess 3121 on the front surface side (side attached to the housing portion main body 3111). The concave portion 3120 has a shape that substantially matches the concave portion 3112 of the housing portion main body 3111 in plan view, and forms the wiring housing space 3140 together with the concave portion 3112 when the lid member 3120 is attached to the housing portion main body 3111. A seal groove 3122 is provided in a thick portion around the recess 3121 of the lid member 3120 so as to surround the recess 3121 (FIG. 25). A seal member 3130 is attached to the seal groove 3122 (FIG. 23). The seal member 3130 is, for example, an O-ring or packing. When the lid member 3120 is attached to the housing portion main body 311, the seal member 3130 seals between the lid member 3120 and the housing portion main body 311 and hermetically seals the wiring housing space 3140 (FIG. 24). A fixing hole 3131a through which a fastening member 3131 such as a bolt or a stud is passed is provided in the peripheral portion of the lid member 3120, and a hole corresponding to the hole 3131a is provided in the housing portion main body 3111. The lid member 3120 is fixed to the housing main body 3111 by the fastening member 3131 at the position of the hole 3131a (FIG. 24).

  FIG. 27 is a rear view of the front plate in the vicinity of the wiring buffer unit. FIG. 28 is a rear view of the front plate in the vicinity of the wiring buffer portion with the lid member removed. FIG. 29 is a perspective view of the front plate in the vicinity of the wiring buffer portion with the lid member removed.

  In the front plate 300, the wiring buffer unit 311 is disposed between the face unit 312 and the arm unit 330. Here, the substrate holder 1 is suspended by the arm portion 330 in the plating tank 39 (FIG. 1), and is disposed so as to be immersed in the plating solution in a substantially vertical posture. The wiring housing space 3140 (concave portion 3112) of the wiring housing portion 311 has a position (for example, higher than the height of the plating solution WL (FIGS. 27 and 28) when the substrate holder 1 is placed in the plating tank 39 (for example, (Position at a predetermined distance higher than the plating solution surface WL). For example, the wiring housing portion 311 may be disposed in the substrate holder 1 at a position where the lower end of the seal member 3130 is equal to or higher than the height of the plating solution surface WL.

  As described above, the face portion 312 holds the substrate S together with the back plate 400. The face portion 312 and the back plate 400 constitute a sandwiching portion that sandwiches the substrate S. The housing part main body 3111 of the wiring buffer part 311 is fixed to the face part 312 by fastening members 3116 such as bolts and studs. In addition, the housing part main body 3111 of the wiring buffer part 3111 is fixed to the arm part 330 by two attachment parts 320. The accommodating portion main body 3111 is fixed to the two attachment portions 320 by fastening members 320a such as bolts and studs. The attachment portion 320 is fixed to the arm portion 330 by a fastening member 330a such as a bolt or a stud. A connector 331 is provided on one end side of the arm portion 330. The connector 331 is provided with a plurality of external connection contacts 331a (331a1, 331a2) (FIG. 22), and cables L1 to L18 are connected to the external connection contacts 331a (331a1, 331a2). The cables L <b> 1 to L <b> 18 pass through one end side of the arm portion 330 from the external connection contact 331 a, pass through one attachment portion 320, and are introduced into the wiring accommodating space 3140 (concave portion 3112) of the wiring buffer portion 311. A cover 331b that covers the connector 331 and the cables L1 to L18 connected to the connector 331 is attached to the arm portion 330 (FIG. 27). A cover 321 that covers the cable L is attached to the attachment portion 320 and the arm portion 330. FIG. 28 illustrates a configuration in the vicinity of the wiring buffer 311 with the cover member 3120, the cover 321, and the cover 331b removed.

In the present embodiment, the lengths of the cables L1 to L18 are the same, and the length of the extra cable due to the difference in the path length of each path from the external connection contacts 331a1 and 331a2 to the contact areas C1 to C18 (FIG. 17). The length is stored in the wiring buffer unit 311, and the arrangement of the extra cable length is adjusted in the wiring buffer unit 311. The same lengths of the cables L1 to L18 are selected so as to match the longest path length among the path lengths from the external connection contacts 331a1 and 331a2 to the contact regions C1 to C18. The cable L having an extra length will have an extra length. The extra length of the cable L is adjusted by the wiring buffer unit 311.

  FIG. 30 is an explanatory diagram for explaining the difference in the length of the wiring due to the path difference between each contact and the external connection contact. For example, as shown in FIG. 30, if the path lengths from the external connection contact external connection contact 331a to the contact regions C8 and C1 (contact 370) are x8 and x1 (x8> x1), respectively, the difference in path length is Δx = X8-x1. As shown in FIG. 17, the path length x8 to the contact region C8 is the maximum path length, and the lengths of the cables L1 to L18 are matched to the maximum path length x8 (substantially the same length). Selected. In this case, the lengths of the cables L8 and L1 are both set to y8 corresponding to the maximum path length x8. On the other hand, since the path length x1 to the contact region C1 is shorter than the maximum path length x8, as shown in FIG. 30, the cable L1 has an extra length by Δx. The extra length Δx is accommodated in the wiring buffer unit 311 and the cable length (the length of the cable L1) is adjusted. The same applies to the contact regions C1 to C7 and C9 to C18 having a path length shorter than the maximum path length x8. FIGS. 28 and 29 show an example of the arrangement of the cables L1 to L18 in the recess 3112 (wiring accommodating space 3140) of the wiring buffer 311. However, the arrangement of the cables L1 to L18 is not limited to this, and the extra cable length Arbitrary arrangements can be made to accommodate.

  The advantage that the lengths of the cables L1 to L18 are the same is that the difference in resistance value due to the difference in cable length is removed, and a uniform current can be supplied from the contact 370 connected to each cable to the substrate S. It can be improved.

  Even if the lengths of the cables L1 to L18 are not the same, if one or more cables have an extra length with respect to the path length from the external connection contact to the contact, the wiring buffer unit 311 can accommodate the extra length and adjust the cable length.

  FIG. 31 is an enlarged perspective view of the face side of the wiring buffer unit. FIG. 32 is a perspective view of the attachment portion side of the wiring buffer portion as seen from the attachment portion side. FIG. 33 is a perspective view of the attachment portion side of the wiring buffer as seen from the wiring buffer portion side. FIG. 34 is a perspective view showing the wiring buffer section with the lid member removed. FIG. 35 is a perspective view showing the wiring buffer portion with the lid member attached.

  As shown in FIG. 34 and FIG. 35, the cable L is introduced from the attachment portion 320 on the connector 331 side into the wiring accommodation space 3140 (recesses 3112 and 3121) of the wiring buffer portion 311. After the length is adjusted, it is guided to the face portion 312.

  The arrangement of the cable L at the boundary between the wiring buffer unit 311 and the face unit 312 is shown in FIG. Referring to the figure, the thick part 3113 of the wiring buffer part 311 is provided with a plurality of wiring holes 311a made of conical holes as described in FIGS. 19A to 19C. Each cable L is guided from the recess 3112 of the wiring buffer 311 through the wiring hole 311a to the face 312 (cable path 365 in FIG. 21A).

The arrangement of the cable L at the boundary between the wiring buffer portion 311 and the attachment portion 312 is shown in FIGS. As shown in these drawings, the thick portion 3114 of the wiring buffer portion 311 is provided with a plurality of wiring holes 3115. The mounting portion 320 is provided with a recess 322 that exposes the wiring hole 3115. The recess 322 has an opening on the wiring buffer 311 side so as to expose the wiring hole 3115, and an opening on the back side so that a cable passing through the wiring hole 3115 can pass therethrough. On the other hand, the front side of the recess 322 is closed. The cable L enters the concave portion 322 of the attachment portion 320, passes through the wiring hole 3115, for example, three by three (FIG. 32), and is guided to the concave portion 3112 of the wiring buffer portion 311 (FIG. 33).

  FIG. 36 is a perspective view of the wiring buffer unit with the lid member according to another embodiment removed. FIG. 37 is a perspective view of the wiring buffer unit with a lid member according to another embodiment attached. FIG. 38 is a rear view of a lid member of a wiring buffer unit according to another embodiment. Another embodiment is different from the above-described embodiment in that a recess is not provided in the lid member 3120A of the wiring buffer portion 311. Since other configurations are the same as those of the above-described embodiment, description thereof is omitted. When the concave portion is not provided in the lid member 3120A, the configuration of the lid member 3120A is simplified. Further, since the thickness of the lid member 3120A can be made thinner than the case where the concave portion is provided, the thickness of the housing portion main body 3111 can be increased accordingly.

(Effect of embodiment)
According to the substrate holder 1 according to the present embodiment, the substrate is clamped by the clamp 340 that can rotate around an axis parallel to the surface of the front plate body 310 or reciprocate in a direction intersecting the surface of the front plate body 310. Since the front plate 300 and the back plate 400 to be sandwiched are fixed to each other, it is possible to suppress or prevent the force in the rotation direction from being applied to the substrate. If the substrate is large and thin, the substrate may be bent when a rotational force is applied to the substrate. However, the substrate holder 1 suppresses the occurrence of bending even when holding a large and thin substrate. It can be prevented.

  In addition, since the clamp 340 is a normally closed type, if the clamp is opened when the back plate body 410 is brought into contact with the front plate body 310, it is not necessary to apply an external force by an actuator or the like in the clamped state, thereby reducing energy consumption. Can be suppressed.

  In addition, the back plate 400 can be held by the clamps 340 at a plurality of locations, and the operation of each clamp 340 is synchronized by the connecting member (rotating shaft 341), so that the clamping operation can be performed efficiently. it can. In addition, the configuration of the actuator AR1 that applies force from the outside can be simplified. Since the lever 342 receives the force from the external first actuator AR1 and can operate each clamp 340 via the rotary shaft 341, it is easy to automate the fixing by the clamp 340.

  Further, by providing the back plate 400 with the engagement receiving portion 430 having a shape for receiving the engagement portion 340a of the clamp 340, the engagement by the clamp can be improved. By adopting a configuration in which the separate engagement receiving portion 430 is attached to the back plate body 410, it becomes easy to appropriately select the size, shape, number, etc. of the engagement receiving portions 430.

  In addition, the substrate is fixed to the back plate 400 by a clip 421 that can rotate around an axis 424 parallel to the surface of the back plate body 410 or reciprocate in a direction intersecting the surface of the back plate body 410. It is possible to suppress or prevent a force in the rotational direction from being applied to the surface. If the substrate is large and thin, the substrate may bend when a rotational force is applied to the substrate, but this substrate holder suppresses the occurrence of bending even when holding a large and thin substrate. Can be prevented.

  Since the clip 421 is a normally closed type, if the clip 421 is opened when the substrate is brought into contact with the back plate main body 410, it is not necessary to apply an external force by an actuator or the like in the clipped state, and energy consumption can be suppressed.

Since the button 470 that receives force from the surface opposite to the surface that contacts the substrate is provided, the actuator AR2 can be disposed on the side opposite to the substrate contact surface, and the back plate 400 can be moved after the substrate is fixed. It is easy to change the posture.

  Since the button 470 can operate the clip 421 by receiving a force from the external second actuator AR2, it is easy to automate the fixing by the clip 421.

  Since the seal holders 363 and 364 holding the inner seal 361 and the outer seal 362 are separately provided, each seal can be replaced separately.

  In the substrate holder of the present embodiment, the covering 602 is removed at one end of the cable L, and the core wire 601 of the cable L is clamped together with the contact 370, so that the cable L and the contact 370 can be easily configured. An electrical connection can be established. That is, the connection between the cable L and the contact 370 can be performed without providing a connector or the like at the cable end. When power is supplied by bringing the contacts 370 into contact with a plurality of locations on the substrate S, it is necessary to route a plurality of cables L in the substrate holder to perform electrical connection. According to this substrate holder, with a simple configuration, An electrical connection between the cable L and the contact 370 can be established, and an increase in the size of the substrate holder can be suppressed. Further, when power is supplied to a large board or when a current value supplied to the board is large, the number of cables increases and the cable diameter also increases. For example, in such a case, simple cable connection by the substrate holder is effective.

  Moreover, in the board | substrate holder of this embodiment, the electrical connection between the cable L and the contact 370 can be established by simple structure and simple operation | work with the fastening members 511, such as a volt | bolt and a screw | thread.

  In the substrate holder of this embodiment, since the cable L and the contact 370 can be clamped using the seal holder 363, the existing configuration can be used, and the increase in size and cost of the substrate holder can be suppressed. Can do.

  Moreover, in the substrate holder of this embodiment, since the seal holders 363 and 364 of the seals 361 and 362 are separate, it is easy to replace the seals separately. It is also easy to replace the seal holders 363 and 364 separately.

  Moreover, in the board | substrate holder of this embodiment, it is possible to suppress the increase in the thickness of a board | substrate holder by making the cable L not overlap with the thickness direction of a board | substrate holder. In particular, in the case of a large substrate or a large amount of current, the number of cables and the diameter of the cable may increase. According to this configuration, an increase in the thickness direction of the substrate holder can be suppressed. it can.

  Further, in the substrate holder of the present embodiment, each cable L from which the coating 602 at the end is removed is sequentially drawn into the position of each contact 370 and connected, so that insulation between the cables to the connection position is ensured and simplified. With this configuration, the cable can be connected to the conductive member.

  When applying the substrate holder of this embodiment to a plating apparatus, since the enlargement of a substrate holder can be suppressed, the enlargement of a plating apparatus can also be suppressed.

In the manufacturing method of the substrate holder according to the present embodiment, the covering 602 is removed at one end of the cable L, and the core wire 601 of the cable L is clamped together with the contact 370, so that the cable L and the contact 370 can be easily configured. An electrical connection between can be established. That is, the connection between the cable L and the contact 370 can be performed without providing a connector or the like at the cable end. When power is supplied by bringing the contacts 370 into contact with a plurality of locations on the substrate S, it is necessary to route a plurality of cables L in the substrate holder to perform electrical connection. According to this substrate holder, with a simple configuration, An electrical connection between the cable L and the contact 370 can be established, and an increase in the size of the substrate holder can be suppressed. Further, when power is supplied to a large board or when a current value supplied to the board is large, the number of cables increases and the cable diameter also increases. For example, in such a case, simple cable connection by the substrate holder is effective.

  In addition, when plating is performed on the substrate using the substrate holder 1 described above, the cable and the conductive member in the substrate holder can be used even when power is supplied to a large substrate or when the supply current value to the substrate is large. Since the electrical connection between them is a simple configuration, the plating process can be performed using a substrate holder that suppresses or prevents an increase in size.

  Moreover, in the said embodiment, the electrical resistance between the 1st and 2nd side contacts of each external connection contact pair is measured before a plating process, and it is confirmed whether there is no dispersion | variation in the electrical resistance of several external connection contact pairs. Conduct energization confirmation processing. Therefore, it is possible to perform the plating process after confirming in advance whether there is no problem in the uniformity of the plating film thickness due to variations between the electrical resistances of the plurality of external connection contact pairs. As a result, the reliability of the plating process can be improved.

  According to the above embodiment, the wiring accommodating portion 311 disposed between the arm portion 330 and the sandwiching portions 312 and 400 of the substrate holder 1 has an extra path length between the external connection contact 331a and the contact 370. The length of the cable L can be accommodated, and the arrangement of the cable L can be adjusted. In this configuration, since the wiring accommodating portion (wiring buffer portion) 311 is provided between the arm portion 330 and the sandwiching portions 312 and 400 of the substrate holder 1, it is possible to suppress or prevent an increase in the thickness of the substrate holder 1. Is possible. That is, in the substrate holder 1, the wiring accommodating portion 311 is arranged side by side with the arm portion 330 and the sandwiching portions 312 and 400, so the arm portion 330 for supporting the substrate holder 1 and the sandwiching portion that holds the substrate It is possible to suppress or prevent the thickness of the portions 321 and 400 from increasing.

  In addition, with the substrate holder 1 installed in the plating tank 39, a wiring accommodating portion 311 is added in the height direction of the substrate holder 1. Since it does not overlap with the holding portions 312 and 400 that hold the substrate, the thickness of the wiring housing portion 311 can be secured while suppressing the thickness of the entire substrate holder 1. Therefore, it is easy to secure a space for bending and arranging the wiring L having a large diameter. A substrate holder that holds a large rectangular substrate is particularly advantageous.

  Further, since the wiring housing portion 311 does not overlap with the holding portions 312 and 400 that hold the substrate, the wiring housing portion 311 can be accessed even after the substrate is held on the substrate holder 1.

  According to the above embodiment, the lid members 3120 and 3120A can protect the wiring L in the wiring housing portion 311 from a processing solution such as a plating solution, and the wiring members L in the wiring housing portion 311 can be opened by opening the lid members 3120 and 3120A. Can be accessed. Therefore, the maintenance in the wiring accommodating part 311 becomes easy.

  According to the above-described embodiment, a space including the housing portion main body 3111 and the recesses 3112 and 3121 of the lid member 3120 can be used as the wiring housing space 3140 (a space for housing wiring). It becomes easy to increase the thickness direction of the wiring accommodating space 3140 while suppressing the thickness of the accommodating portion main body 3111. When the material of the housing part main body 3111 is more expensive than the material of the lid member 3120, an increase in cost can be suppressed by reducing the volume of the housing part main body 3111.

According to the above embodiment, the seal member 3130 can seal the space in the wiring housing portion 311 in a more airtight manner.

  According to the embodiment, the wiring housing space 3140 of the wiring housing portion 311 is disposed at a position corresponding to a height equal to or higher than the height of the plating solution surface WL when the substrate holder 1 is disposed in the plating tank 39. ing. Thereby, the wiring accommodating space 3140 can be hardly immersed in the plating solution. In the plating solution, the dimension of the thickness direction of the substrate holder 1 is restricted by the configuration of the plating tank 39 such as a paddle, an anode mask, and a regulation plate, but the restriction in the thickness direction is gentle above the plating solution surface WL. The dimension of the wiring housing portion in the thickness direction can be sufficiently secured. Further, since the wiring housing space 3140 is hardly immersed in the plating solution, the leakage of the plating solution into the wiring housing space 3140 can be more reliably suppressed.

  According to the above-described embodiment, the wiring housing portion 311 is a separate body from the arm portion 330 and the sandwiching portions 312 and 400. Therefore, the arm portion 330, the sandwiching portions 312 and 400, and the wiring housing portion 311 are exchanged separately. Is possible. In particular, when the wiring accommodating part 311 is arranged in the plating tank 39 so as to be equal to or higher than the height of the plating solution WL, the pinching parts 312 and 400 that are relatively rapidly deteriorated with time by the plating solution are connected to the wiring accommodating part 311. It can be exchanged separately.

  According to the above embodiment, by making the lengths of the plurality of wirings L between the contact 370 and the external connection contacts 331a1, 331a2 the same, the current flowing through each contact can be made uniform, and the plating quality can be improved. Can be improved. Further, an extra length of one or more cables due to a path difference between each contact 370 and the external connection contacts 331a1 and 331a2 can be accommodated in the wiring accommodating portion 311.

  According to the above-described embodiment, the housing main body 3111 is made of titanium having high rigidity, and the lid member 3120 is made of inexpensive polyvinyl chloride, thereby ensuring the rigidity necessary for the wiring housing portion 311 while suppressing costs. can do.

  According to the said embodiment, the plating apparatus which has the plating tank 39 for installing the said substrate holder 1 is provided. Thereby, the plating apparatus which show | plays the said effect can be provided. In particular, since the wiring L having a large diameter can be arranged in the wiring housing space 3140 while suppressing or preventing an increase in the thickness of the substrate holder 1, a more uniform and large current can be supplied to the substrate. Thereby, a plating process with good quality can be performed on a larger substrate. In addition, since an increase in the thickness of the substrate holder 1 can be suppressed or prevented, an increase in the size of the plating tank 39 can be suppressed or prevented.

  According to the above embodiment, a plating method for plating a substrate while the substrate is held by the substrate holder 1 is provided. In this plating method, a plurality of contacts 370 and 1 of the substrate holder 1 or 1 A plating process is performed on the substrate in a state in which a wiring accommodating portion that accommodates one or more extra cable lengths with respect to the path length between the plurality of external connection contacts 331a is higher than the plating solution surface. I do. Thereby, the wiring accommodating space 3140 can be hardly immersed in the plating solution. In the plating solution, the dimension of the thickness direction of the substrate holder is limited by the configuration of the plating tank such as a paddle, an anode mask, and a regulation plate, but the dimension constraint in the thickness direction is moderate above the plating solution surface. For this reason, it can suppress thru | or prevent that a wiring accommodating part and the structure of a plating tank interfere. Further, since the wiring housing space 3140 is hardly immersed in the plating solution, the leakage of the plating solution into the wiring housing space 3140 can be more reliably suppressed.

The embodiments of the present invention have been described above based on some examples. However, the above-described embodiments of the present invention are for facilitating understanding of the present invention and do not limit the present invention. . The present invention can be changed and improved without departing from the gist thereof, and the present invention naturally includes equivalents thereof. In addition, any combination or omission of each constituent element described in the claims and the specification is possible within a range where at least a part of the above-described problems can be solved or a range where at least a part of the effect is achieved It is.

DESCRIPTION OF SYMBOLS 1 ... Substrate holder 25 ... Cassette table 25a ... Cassette 27 ... Substrate transport device 28 ... Traveling mechanism 29 ... Substrate removal mechanism 30 ... Stocker 32 ... Pre-wet tank 33 ... Pre-soak tank 34 ... Pre-rinse tank 35 ... Blow tank 36 ... Rinse tank 37 ... Substrate holder transfer device 38 ... Overflow tank 39 ... Plating tank 50 ... Cleaning apparatus 50a ... Cleaning section 100 ... Plating apparatus 110 ... Unloading section 120 ... Processing section 120A ... Pre-processing / Post-processing section 120B ... Processing section 175 ... Controller 175A ... CPU
175B ... Memory 175C ... Control unit 300 ... Front plate 301 ... Front surface 302 ... Back surface 303 ... Opening portion 310 ... Front plate body 311 ... Wiring buffer portion 311a ... Wiring hole 312 ... Face portion 320 ... Mounting portion 320a ... Fastening member 321 ... Cover 330 ... Arm part 330a ... Fastening member 331 ... Connector 331a1, 331a2 ... External connection contact 331b ... Cover 340 ... Clamp 340a ... Engagement part 342 ... Lever 350 ... Fixing member 361 ... Inner seal 362 ... Outer seal 363 ... Seal holder 363a ... Wiring groove 364 ... Seal holder 365 ... Cable passage 370 ... Contact 390 ... Positioning pin 400 ... Back plate 401 ... Front surface 402 ... Back surface 410 ... Back plate body 420 ... Clip part 42 ... Clip 421a ... Claw part 421b ... Long hole 421c ... Round hole 422 ... Winding spring 422a ... Leg part 422b ... Leg part 422c ... Winding part 423 ... Fixed part 423b ... Restricting surface 423b ... Guide surface 424 ... Fixed shaft 430 ... Engagement Joint part 430a ... Projection part 470 ... Button 471 ... Force receiving part 472 ... Elastic part 473 ... Mounting part 474 ... Holding member 475 ... Fastening member 490 ... Positioning piece 601 ... Conductive wire 602 ... Cover 3111 ... Housing part main body 3112 ... Recess 3113 ... Thick part 3114 ... Thick part 3114 a ... Projection part 3114 ... Step part 3115 ... Wiring hole 3116 ... Fastening member 3114 ... Thick part 3120 ... Lid member 3121 ... Recess 3122 ... Seal groove 3130 ... Seal member 3131 ... Fastening Member 3131a ... hole

Claims (10)

A substrate holder comprising first and second holding members for sandwiching a substrate,
An arm portion for installing the substrate holder in the plating tank, the arm portion having one or more external connection contacts;
A clamping part for clamping the substrate in the first and second holding members;
One or a plurality of contacts provided in the sandwiching portion for supplying power to the substrate;
One or more wirings for connecting the one or more external connection contacts and the one or more contacts;
The one or more wires disposed between the arm portion and the clamping portion and having an extra length with respect to a path length between the one or more external connection contacts and the one or more contacts. A wiring accommodating portion having an accommodating space for accommodating;
A substrate holder. The substrate holder according to claim 1,
The wiring housing part is
The housing main body having a first recess for housing a part of the length of the one or more wirings;
A lid member that is detachable from the housing main body and closes the first recess;
A substrate holder. The substrate holder according to claim 2,
The said cover member is a substrate holder which has a 2nd recessed part in the position facing the said 1st recessed part of the said accommodating part main body. The substrate holder according to claim 2 or 3,
The said wiring accommodating part is a board | substrate holder further provided with the sealing member arrange | positioned between the said accommodating part main body and the said cover member. The substrate holder according to any one of claims 1 to 4,
The wiring holder space of the wiring holding part is a substrate holder that is arranged at a position corresponding to a height equal to or higher than a plating solution level when the substrate holder is arranged in a plating tank. The substrate holder according to any one of claims 1 to 5,
The wiring holder is a substrate holder that is a separate body from the arm part and the clamping part. The substrate holder according to any one of claims 1 to 6,
A substrate holder, wherein a plurality of external connection contacts and a plurality of contacts are connected by a plurality of wires, the plurality of contacts are arranged at different positions of the substrate holder, and the plurality of wires have the same length. The substrate holder according to any one of claims 2 to 4,
The substrate holder is made of titanium, and the lid member is made of polyvinyl chloride.   The plating apparatus which has a plating tank for installing the substrate holder in any one of Claims 1 thru | or 8. A plating method for plating a substrate with the substrate held by the substrate holder,
In the plating tank, a wiring accommodating portion that accommodates an extra length of the one or more wires with respect to a path length between the one or more external connection contacts of the substrate holder and the one or more contacts. Is a plating method in which plating is performed on the substrate in a state of being higher than the plating solution surface.

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