JP2018098506A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2018098506A5 JP2018098506A5 JP2017236264A JP2017236264A JP2018098506A5 JP 2018098506 A5 JP2018098506 A5 JP 2018098506A5 JP 2017236264 A JP2017236264 A JP 2017236264A JP 2017236264 A JP2017236264 A JP 2017236264A JP 2018098506 A5 JP2018098506 A5 JP 2018098506A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- fluid discharge
- discharge port
- pass
- moldable material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 47
- 239000012530 fluid Substances 0.000 claims 43
- 239000000463 material Substances 0.000 claims 28
- 238000000034 method Methods 0.000 claims 20
- 230000000875 corresponding Effects 0.000 claims 7
- 238000007599 discharging Methods 0.000 claims 7
- 238000001459 lithography Methods 0.000 claims 3
- 238000000465 moulding Methods 0.000 claims 3
- 230000001143 conditioned Effects 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
Claims (10)
流体吐出ポートを有する流体吐出システムと、
ステージと、
論理素子と、を含み、
前記ステージ、前記流体吐出ポート、または前記ステージと前記流体吐出ポートとの組み合わせは、基板と前記流体吐出ポートとを互いに対して移動させるために適用され、
前記論理素子は、
基板上に成形可能材料を吐出するための液滴パターンを決定する処理と、
インプリント領域についての前記液滴パターンの第１部分を形成するように、第１パス中において前記基板上に前記成形可能材料を吐出するための情報を送信する処理であって、前記基板と前記流体吐出ポートとは並進方向に互いに対して移動する、処理と、
前記並進方向以外の他の方向に前記基板と前記流体吐出ポートとを互いに対してオフセットさせるための情報を送信する処理であって、装置は、前記第１パス中において前記成形可能材料を吐出するための指示が行われた後に前記流体吐出ポートをオフセットさせる、処理と、
前記インプリント領域についての前記液滴パターンの第２部分を形成するように、第２パス中において前記基板上に前記成形可能材料を吐出するための情報を送信する処理であって、装置は、前記基板と前記流体吐出ポートとを互いに対してオフセットさせるための指示が行われた後に前記第２パス中において前記成形可能材料を吐出する、処理と、
を行うことを特徴とする装置。 A device for imprint lithography
A fluid discharge system with a fluid discharge port and
The stage and
Including logic elements
The stage, the fluid discharge port, or a combination of the stage and the fluid discharge port is applied to move the substrate and the fluid discharge port relative to each other.
The logic element is
The process of determining the droplet pattern for ejecting the moldable material onto the substrate, and
A process of transmitting information for ejecting the moldable material onto the substrate during the first pass so as to form the first portion of the droplet pattern for the imprint region, wherein the substrate and the substrate. The fluid discharge port is a process that moves relative to each other in the translational direction.
A process of transmitting information for offsetting the substrate and the fluid discharge port from each other in a direction other than the translational direction, wherein the apparatus discharges the moldable material in the first pass. To offset the fluid discharge port after being instructed to
A process of transmitting information for ejecting the moldable material onto the substrate during the second pass so as to form a second portion of the droplet pattern for the imprint region. A process of discharging the moldable material in the second pass after instructions for offsetting the substrate and the fluid discharge port from each other.
A device characterized by performing.
前記第１パス中、前記第２パス中、または前記第１パス中および前記第２パス中の各々において前記成形可能材料を吐出するための前記情報は、前記並進方向における液滴ピッチが前記事前設定の最小ピッチまたは前記事前設定の最小ピッチの整数倍になるように、前記成形可能材料を吐出するための特定の情報を含み、
前記基板と前記流体吐出ポートとを互いに対してオフセットさせるための前記情報は、前記並進方向において、前記基板と前記流体吐出ポートとの互いに対するオフセットが、前記事前設定の最小ピッチの非整数倍である並進オフセット距離で行われる特定の情報を含む、
ことを特徴とする請求項３に記載の装置。 The fluid discharge system provides droplets separated onto the substrate at a preset minimum pitch when the substrate and the fluid discharge port are moving relative to each other along the translational direction at a preset speed. Further configured to eject droplets of said moldable material at a preset frequency to achieve
The information for discharging the moldable material in each of the first pass, the second pass, the first pass, and the second pass is based on the droplet pitch in the translation direction. Contains specific information for ejecting the moldable material such that it is a preset minimum pitch or an integral multiple of the preset minimum pitch.
The information for offsetting the substrate and the fluid discharge port with respect to each other is such that the offset between the substrate and the fluid discharge port with respect to each other in the translational direction is a non-integer multiple of the preset minimum pitch. Contains specific information made at translational offset distances,
The device according to claim 3, wherein the device is characterized by the above.
前記基板と前記流体吐出ポートとを前記他の方向に互いに対してオフセットさせるための前記情報は、前記対応ピッチの非整数倍であるオフセット距離で行われる、
ことを特徴とする請求項１乃至４のいずれか１項に記載の装置。 The fluid discharge port is configured to discharge droplets at a corresponding pitch along a line that is substantially perpendicular to the translational direction.
The information for offsetting the substrate and the fluid discharge port with respect to each other in the other direction is performed at an offset distance that is a non-integer multiple of the corresponding pitch.
The apparatus according to any one of claims 1 to 4, wherein the apparatus is characterized by the above.
前記第２パス中において前記基板上に前記成形可能材料を吐出するための前記情報は、前記液滴エッジ除去のＹ２ラインに沿って前記成形可能材料の液滴を吐出するための情報を含む、
ことを特徴とする請求項１乃至４のいずれか１項に記載の装置。 The information for ejecting the moldable material onto the substrate in the first pass includes information for ejecting droplets of the moldable material along the Y1 line of droplet edge removal.
The information for ejecting the moldable material onto the substrate in the second pass includes information for ejecting droplets of the moldable material along the Y2 line of the droplet edge removal.
The apparatus according to any one of claims 1 to 4, wherein the apparatus is characterized by the above.
流体吐出ポートを有する流体吐出システムを提供する工程と、
基板上に成形可能材料を吐出するための仮想液滴パターンを決定する工程と、
第１パス中において、インプリント領域についての前記基板液滴パターンの第１部分を形成するように前記基板上に前記成形可能材料を吐出する工程であって、前記基板液滴パターンは前記仮想液滴パターンに対応し、前記基板と前記流体吐出ポートとは並進方向に互いに対して移動する、工程と、
前記並進方向以外の他の方向に前記基板と前記流体吐出ポートとを互いに対してオフセットさせる工程であって、前記基板と前記流体吐出ポートとの互いに対するオフセットは、前記第１パス中において前記成形可能材料を吐出した後に行われる、工程と、
第２パス中において、前記インプリント領域についての前記基板液滴パターンの第２部分を形成するように前記基板上に前記成形可能材料を吐出する工程であって、前記第２パス中における前記成形可能材料の吐出は、前記基板と前記流体吐出ポートとを互いに対してオフセットさせた後に行われる、工程と、
を含むことを特徴とする方法。 A method of generating substrate droplet patterns for the imprint lithography process.
A process of providing a fluid discharge system with a fluid discharge port and
The process of determining the virtual droplet pattern for ejecting the moldable material onto the substrate, and
In the first pass, a step of ejecting the moldable material onto the substrate so as to form the first portion of the substrate droplet pattern for the imprint region, wherein the substrate droplet pattern is the virtual fluid. A process in which the substrate and the fluid discharge port move relative to each other in the translational direction corresponding to the drop pattern.
A step of offsetting the substrate and the fluid discharge port with respect to each other in a direction other than the translational direction, wherein the offset of the substrate and the fluid discharge port with respect to each other is the molding in the first pass. The process and the process performed after discharging the possible materials
A step of ejecting the moldable material onto the substrate so as to form a second portion of the substrate droplet pattern for the imprint region in the second pass, wherein the molding in the second pass. Discharge of possible materials is performed after the substrate and the fluid discharge port are offset from each other.
A method characterized by including.
前記基板と前記流体吐出ポートとを互いに対してオフセットさせる工程は、前記対応ピッチの非整数倍であるオフセット距離で、前記他の方向に前記基板と前記流体吐出ポートとを互いに対してオフセットさせることを含む、
ことを特徴とする請求項７に記載の方法。 The fluid discharge port is configured to discharge droplets at a corresponding pitch along a line that is substantially perpendicular to the translational direction.
The step of offsetting the substrate and the fluid discharge port with respect to each other is to offset the substrate and the fluid discharge port with respect to each other in the other direction at an offset distance that is a non-integer multiple of the corresponding pitch. including,
The method according to claim 7, wherein the method is characterized by the above.
仮想液滴パターンを決定する工程は、
前記成形可能材料を前記基板上に吐出するために事前に画定された液滴パターンを決定する工程であって、前記事前に画定された液滴パターンは、インプリントリソグラフィテンプレートのパターンに部分的に基づいており、前記事前に画定された液滴パターンは、前記並進方向に沿って前記基板と前記流体吐出ポートとが前記事前設定の速度で互いに対して移動しているときに、前記事前設定の最小ピッチまたはその整数倍で前記基板上に離間した液滴を表す、工程と、
前記事前に画定された液滴パターンに基づいて、調整液滴パターンを決定する工程であって、調整液滴パターンは、前記事前設定の最小ピッチの非整数倍で離間した液滴を表し、前記調整液滴パターンは前記仮想液滴パターンである、工程と、を含み、
前記方法は、第１および第２パス中において形成される前記基板液滴パターンを生成するように、前記基板と前記流体吐出ポートとの互いに対する調整速度を決定する工程であって、前記調整速度は、前記第１パス中、前記第２パス中、または前記第１パス中および前記第２パス中の各々における前記事前設定の速度と異なる、工程と、
前記第１パス中、前記第２パス中、または前記第１パス中および前記第２パス中の各々において、前記並進方向に前記調整速度で前記基板と前記流体吐出ポートとを互いに対して移動させ、前記事前設定の周波数で前記流体吐出ポートを介して前記成形可能材料を吐出する工程と、を更に含む、
ことを特徴とする請求項７に記載の方法。 The step of providing the fluid discharge system is the fluid discharge system having the fluid discharge port configured to discharge droplets at a corresponding pitch along a line substantially perpendicular to the translational direction. , When the substrate and the fluid discharge port are moving relative to each other at a preset speed along the translational direction that is substantially perpendicular to the line, they are separated onto the substrate at a preset minimum pitch. Further comprising providing the fluid ejection system further configured to eject droplets of the moldable material at a preset frequency to achieve the droplets.
The process of determining the virtual droplet pattern is
A step of determining a pre-defined droplet pattern for ejecting the moldable material onto the substrate, wherein the pre-defined droplet pattern is partially in the pattern of an imprint lithography template. Based on, the pre-defined droplet pattern is forward when the substrate and the fluid discharge port are moving relative to each other at the preset rate along the translational direction. Article The process of representing droplets separated on the substrate at the minimum pitch set before the article or an integral multiple thereof,
A step of determining a conditioned droplet pattern based on the pre-defined droplet pattern, the conditioned droplet pattern represents droplets separated by non-integer multiples of the preset minimum pitch. The adjusted droplet pattern comprises the step, which is the virtual droplet pattern.
The method is a step of determining the adjustment speed of the substrate and the fluid discharge port with respect to each other so as to generate the substrate droplet pattern formed in the first and second passes, and the adjustment speed. Is different from the preset speed in each of the first pass, the second pass, or the first pass and the second pass.
In each of the first pass, the second pass, the first pass, and the second pass, the substrate and the fluid discharge port are moved relative to each other in the translational direction at the adjustment speed. Further comprises the step of discharging the moldable material through the fluid discharge port at the preset frequency.
The method according to claim 7, wherein the method is characterized by the above.
流体吐出ポートを有する流体吐出システムを提供する工程と、
基板上に成形可能材料を吐出するための液滴パターンを決定する工程と、
第１パス中において、インプリント領域についての前記液滴パターンの第１部分を形成するように前記基板上に前記成形可能材料を吐出する工程であって、前記基板と前記流体吐出ポートとは並進方向に互いに対して移動する、工程と、
前記並進方向以外の他の方向に前記基板と前記流体吐出ポートとを互いに対してオフセットさせる工程であって、前記基板と前記流体吐出ポートとの互いに対するオフセットは、前記第１パス中において前記成形可能材料を吐出した後に行われる、工程と、
第２パス中において、前記インプリント領域についての前記液滴パターンの第２部分を形成するように前記基板上に前記成形可能材料を吐出する工程であって、前記第２パス中における前記成形可能材料の吐出は、前記基板と前記流体吐出ポートとを互いに対してオフセットさせた後に行われる、工程と、
表面を有するテンプレートに前記成形可能材料を接触させる工程と、
前記テンプレートの前記表面に対応する層を形成するように前記成形可能材料を硬化する工程と、
を含むことを特徴とする物品の製造方法。 It is a manufacturing method of goods
A process of providing a fluid discharge system with a fluid discharge port and
The process of determining the droplet pattern for ejecting the moldable material onto the substrate, and
In the first pass, a step of discharging the moldable material onto the substrate so as to form the first portion of the droplet pattern for the imprint region, wherein the substrate and the fluid discharge port are translated. The process of moving relative to each other in the direction,
A step of offsetting the substrate and the fluid discharge port with respect to each other in a direction other than the translational direction, wherein the offset of the substrate and the fluid discharge port with respect to each other is the molding in the first pass. The process and the process performed after discharging the possible materials
A step of ejecting the moldable material onto the substrate so as to form a second portion of the droplet pattern for the imprint region in the second pass, wherein the moldable material is formed in the second pass. The process of discharging the material is performed after the substrate and the fluid discharge port are offset from each other.
A step of bringing the moldable material into contact with a template having a surface,
A step of curing the moldable material so as to form a layer corresponding to the surface of the template.
A method of manufacturing an article, which comprises.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/375,912 | 2016-12-12 | ||
| US15/375,966 US10634993B2 (en) | 2016-12-12 | 2016-12-12 | Fluid droplet methodology and apparatus for imprint lithography |
| US15/375,912 US10481491B2 (en) | 2016-12-12 | 2016-12-12 | Fluid droplet methodology and apparatus for imprint lithography |
| US15/375,966 | 2016-12-12 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2018098506A JP2018098506A (en) | 2018-06-21 |
| JP2018098506A5 true JP2018098506A5 (en) | 2021-01-21 |
| JP7079085B2 JP7079085B2 (en) | 2022-06-01 |
Family
ID=62634796
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2017236264A Active JP7079085B2 (en) | 2016-12-12 | 2017-12-08 | Sessile drop technique and equipment for imprint lithography |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7079085B2 (en) |
| KR (1) | KR102205141B1 (en) |
| CN (1) | CN108227373B (en) |
| SG (1) | SG10201709153VA (en) |
| TW (1) | TWI715815B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10468247B2 (en) * | 2016-12-12 | 2019-11-05 | Canon Kabushiki Kaisha | Fluid droplet methodology and apparatus for imprint lithography |
| US11209730B2 (en) * | 2019-03-14 | 2021-12-28 | Canon Kabushiki Kaisha | Methods of generating drop patterns, systems for shaping films with the drop pattern, and methods of manufacturing an article with the drop pattern |
| US11762295B2 (en) | 2020-10-28 | 2023-09-19 | Canon Kabushiki Kaisha | Fluid droplet methodology and apparatus for imprint lithography |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE69221410T2 (en) * | 1991-09-19 | 1997-12-11 | Canon Kk | Serial recording process with the possibility to change the resolution |
| US6536883B2 (en) | 2001-02-16 | 2003-03-25 | Eastman Kodak Company | Continuous ink-jet printer having two dimensional nozzle array and method of increasing ink drop density |
| JP3922177B2 (en) * | 2002-02-12 | 2007-05-30 | セイコーエプソン株式会社 | Film forming method, film forming apparatus, droplet discharge apparatus, color filter manufacturing method, display apparatus manufacturing method |
| US7559619B2 (en) * | 2002-08-20 | 2009-07-14 | Palo Alto Research Center Incorporated | Digital lithography using real time quality control |
| JP4168788B2 (en) | 2003-03-06 | 2008-10-22 | セイコーエプソン株式会社 | Film forming method, color filter substrate manufacturing method, electroluminescent device substrate manufacturing method, display device manufacturing method |
| JP4337586B2 (en) * | 2004-03-10 | 2009-09-30 | セイコーエプソン株式会社 | Method of forming optical coating and optical article manufactured by the method |
| US8001924B2 (en) | 2006-03-31 | 2011-08-23 | Asml Netherlands B.V. | Imprint lithography |
| US8707890B2 (en) * | 2006-07-18 | 2014-04-29 | Asml Netherlands B.V. | Imprint lithography |
| JP4908369B2 (en) | 2007-10-02 | 2012-04-04 | 株式会社東芝 | Imprint method and imprint system |
| US8187515B2 (en) * | 2008-04-01 | 2012-05-29 | Molecular Imprints, Inc. | Large area roll-to-roll imprint lithography |
| US8586126B2 (en) * | 2008-10-21 | 2013-11-19 | Molecular Imprints, Inc. | Robust optimization to generate drop patterns in imprint lithography which are tolerant of variations in drop volume and drop placement |
| NL2003875A (en) * | 2009-02-04 | 2010-08-05 | Asml Netherlands Bv | Imprint lithography method and apparatus. |
| JP5495767B2 (en) * | 2009-12-21 | 2014-05-21 | キヤノン株式会社 | Imprint apparatus and method, and article manufacturing method |
| JP2012015324A (en) * | 2010-06-30 | 2012-01-19 | Fujifilm Corp | Liquid coating apparatus and method and nano in-print system |
| NL2007633A (en) * | 2010-11-22 | 2012-05-23 | Asml Netherlands Bv | A positioning system, a lithographic apparatus and a method for positional control. |
| JP5748291B2 (en) * | 2012-02-29 | 2015-07-15 | 富士フイルム株式会社 | Liquid ejection apparatus, nanoimprint system, and liquid ejection method |
| JP6135119B2 (en) * | 2012-12-19 | 2017-05-31 | 大日本印刷株式会社 | Imprint method, imprint resin dripping position determination method, and imprint apparatus |
| JP6329425B2 (en) * | 2014-05-02 | 2018-05-23 | キヤノン株式会社 | Imprint apparatus, imprint method, and article manufacturing method |
| US10620532B2 (en) * | 2014-11-11 | 2020-04-14 | Canon Kabushiki Kaisha | Imprint method, imprint apparatus, mold, and article manufacturing method |
-
2017
- 2017-11-07 SG SG10201709153VA patent/SG10201709153VA/en unknown
- 2017-11-13 TW TW106139141A patent/TWI715815B/en active
- 2017-12-04 KR KR1020170164864A patent/KR102205141B1/en active IP Right Grant
- 2017-12-07 CN CN201711281189.6A patent/CN108227373B/en active Active
- 2017-12-08 JP JP2017236264A patent/JP7079085B2/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102130284B1 (en) | Techniques for controlling heating for 3D printing | |
| JP2020121571A (en) | Method of fabricating three-dimensional object with removable support structure | |
| JP2015213130A5 (en) | ||
| JP2018098506A5 (en) | ||
| JP6294659B2 (en) | Manufacturing method and control device of shaped object | |
| JP2017056724A (en) | Thermal management methods and apparatus for producing uniform material deposition and curing for high speed three-dimensional object printing | |
| JP6957159B2 (en) | Systems and methods for producing 3D printed matter from different materials with different properties | |
| US20180009157A1 (en) | Generating three-dimensional objects | |
| EP3338250B1 (en) | Information processing device, image forming apparatus, method for manufacturing output object, and computer-readable recording medium | |
| JP6604995B2 (en) | 3D printing apparatus and inkjet coloring method thereof | |
| US10335995B2 (en) | System and method for compensating for dissimilar shrinkage rates in different materials used to form a three-dimensional printed object during additive manufacturing | |
| TWI239896B (en) | Liquid droplet discharging method, and liquid droplet discharging apparatus | |
| WO2017162306A1 (en) | Accuracy improvement and surface finishing using fusing agent and detailing agent | |
| JP2015193184A (en) | Apparatus and method for shaping three-dimensional laminate and three-dimensional laminate shaping program | |
| US20180043676A1 (en) | System and method for protection of printed images formed on surfaces of three-dimensional printed objects | |
| JP2015233101A5 (en) | ||
| JP6688708B2 (en) | 3D object printer | |
| JP2015150840A (en) | Three-dimensional molding apparatus and three-dimensional molding method | |
| JP6701300B2 (en) | Systems and methods for improving throughput of nanoimprint systems | |
| JP7079085B2 (en) | Sessile drop technique and equipment for imprint lithography | |
| JP6579746B2 (en) | Manufacturing method of three-dimensional structure and three-dimensional structure | |
| JP2016076558A5 (en) | ||
| US10000020B2 (en) | Method and device for producing areas in a printed object having different coefficients of friction | |
| JP2016043512A (en) | Method for manufacturing three-dimensional molded article | |
| JP2015202689A (en) | Method and apparatus for production of three-dimensional molded object |