JP2018097312A - Electronic device, projection device, and electronic device manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device, projection device including the electronic device and electronic device manufacturing method that reduce adhesion of powder dust to electronic components, and are excellent in maintainability.SOLUTION: An electronic device (a display element device 300) comprises: a heat radiation device 190; a board 320; a pushing plate 330 that is arranged between the heat radiation device 190 and the board 320; an electronic component (a display element 51); and an encapsulation member 370. The encapsulation member 370 has: a cylinder part 371 that is arranged in an outer periphery with a gap with a heat transmission part 192 of the heat radiation device 190 in a first opening part 321 of the board 320 and a second opening part 331 of the pushing plate 330; and an annular flat plate part 372 that is held on one end side of the cylinder part 371 by the board 320 and the pushing plate 330. A heat conductivity member 380 is filled between the heat transmission part 192 and a heat radiation surface, and between the heat transmission part 192 and the cylinder part 371.SELECTED DRAWING: Figure 4

Description

  The present invention relates to an electronic device, a projection device, and an electronic device manufacturing method.

  Examples of the device in which the electronic device is incorporated include a projection device that projects a screen of a personal computer, a video image, an image based on image data stored in a memory card or the like onto a screen.

  The projection apparatus disclosed in Patent Document 1 includes an electronic device such as a red light source device including a red light emitting diode and an excitation light irradiation device including a plurality of blue laser diodes which are also referred to as blue light source devices. Excitation light from the excitation light irradiation device is applied to the fluorescent wheel, and green fluorescent light is emitted from the fluorescent wheel. The red, green, and blue color light source lights are emitted to an electronic device in which a display element is incorporated, and the electronic device emits image light through a projection-side optical system, thereby producing a color image on the screen. Is projected.

  Electronic components such as display elements including red light emitting diodes, blue laser diodes, and DMDs (digital micromirror devices) generate heat when the projection apparatus is driven. Therefore, an electronic device including these electronic components is provided with a heat sink for cooling the respective electronic components.

JP 2013-196946 A

  In general, an electronic component may not be able to exhibit a predetermined performance when dust adheres thereto. For example, if dust adheres to a semiconductor light emitting element such as a red light emitting diode or a blue laser diode in the projection apparatus, the brightness may decrease. In addition, when dust adheres to a display element such as a DMD and an optical component such as a lens, the image quality may be deteriorated due to pixel defects or color unevenness.

  On the other hand, if the members are sealed with an adhesive or putty-like material in order to make the sealing structure strong, it becomes necessary to remove the adhesive or the like during maintenance requiring replacement of the members. Therefore, it is difficult to make the connection surface of the member that supports the electronic component with such heat generation a sealed structure in consideration of maintainability.

  An object of the present invention is to provide an electronic device with good maintainability while reducing the adhesion of dust to electronic components, a projection device including the electronic device, and a method for manufacturing the electronic device.

  An electronic device of the present invention is a plate-like member in which a heat radiating device having a heat transfer portion and a first opening into which the heat radiating device is inserted are formed on one side of the heat radiating device. An electronic component disposed on the other surface side of the substrate such that a heat dissipation surface is located on the first opening side of the substrate, and the heat of the heat dissipation device in the first opening of the substrate A sealing member having a cylindrical portion disposed on the outer periphery with a gap provided between the transmission portion, the heat transfer portion of the heat dissipation device and the heat dissipation surface of the electronic component, and the heat transfer portion of the heat dissipation device And a thermally conductive member filled between the cylindrical portion of the sealing member.

  The projection device of the present invention includes a light source device including the above-described electronic device, a red light source device, a green light source device, and a blue light source device, and a light source that guides light from the light source device to the electronic component that is a display element. A side optical system; a projection side optical system that projects an image emitted from the electronic component; and a control unit that controls the light source device and the electronic component.

  In the method for manufacturing an electronic device according to the present invention, a substrate having a first opening and a heat radiation surface of an electronic component connected via a frame-shaped connecting portion arranged on the substrate are arranged and fixed facing each other. A step of placing a cylindrical sealing member having an annular flat plate portion on one end side on the heat radiating surface; and a holding plate having a second opening, and placing the flat plate portion on the presser foot. A step of sandwiching the plate and the substrate, a step of placing a sheet-like heat conductive member having a predetermined thickness on the heat dissipation surface of the electronic component, and a protrusion-like heat transfer portion of the heat dissipation device Inserting the first opening of the substrate and the second opening of the holding plate to place the sealing member on the outer periphery of the heat transfer unit, and sealing the end of the heat conductive member A step of plastically deforming the thermally conductive member to be positioned between the member and the heat transfer portion , Characterized in that it comprises a.

  According to the present invention, it is possible to provide an electronic device with good maintainability while reducing adhesion of dust to the electronic component, a projection device including the electronic device, and a method for manufacturing the electronic device.

It is an external appearance perspective view which shows the projector which concerns on embodiment of this invention. It is a figure which shows the functional block of the projection apparatus which concerns on embodiment of this invention. It is a plane schematic diagram which shows the internal structure of the projection apparatus which concerns on embodiment of this invention. It is the schematic diagram which represented a part of display device apparatus concerning the embodiment of the present invention by the section. It is the figure which looked at the sealing member concerning the embodiment of the present invention from the upper part. It is VI-VI sectional drawing of FIG. 5 of the sealing member which concerns on embodiment of this invention. FIG. 5 is a VII-VII cross-sectional view of FIG. 4 of a display element device according to an embodiment of the present invention. 1 is a partially exploded view showing a display element device according to an embodiment of the present invention in cross section. It is a figure which shows the modification of the sealing member which concerns on embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of the projection apparatus 10. In the present embodiment, left and right in the projection device 10 indicate the left and right direction with respect to the projection direction, and front and rear indicate the screen side direction of the projection device 10 and the front and rear direction with respect to the traveling direction of the light flux.

  As shown in FIG. 1, the housing of the projection device 10 has a substantially rectangular parallelepiped shape, and includes a side panel including a front panel 12, a back panel 13, a right panel 14, and a left panel 15, an upper panel 11, and a lower panel 16. And is formed by. The projection device 10 has a projection unit on the left side of the front panel 12. Further, the front panel 12 is provided with a plurality of intake / exhaust holes 17. The projection apparatus 10 includes an Ir receiving unit that receives a control signal from a remote controller (not shown).

  The top panel 11 is provided with a key / indicator portion 37. This key / indicator section 37 is notified when a power switch key, a power indicator for notifying power on / off, a projection switch key for switching projection on / off, a light source device, a display element, a control circuit, etc. are overheated. Keys and indicators such as an overheat indicator are arranged.

  Further, the rear panel 13 is provided with an input / output connector section and a power adapter provided with a USB terminal (not shown) and a D-SUB terminal for inputting video signals to which analog RGB video signals are input, an S terminal, an RCA terminal, an audio output terminal, and the like. Various terminals such as plugs are provided. The back panel 13 has a plurality of intake holes.

  Next, the projector control unit of the projector 10 will be described with reference to the functional block diagram of FIG. The projection device control unit includes a control unit 38, an input / output interface 22, an image conversion unit 23, a display encoder 24, a display drive unit 26, and the like.

  The control unit 38 controls the operation of each circuit in the projection apparatus 10, and includes a CPU, a ROM that stores operation programs such as various settings fixedly, and a RAM that is used as a work memory. ing.

  The image signal of various standards input from the input / output connector unit 21 by the projection device control unit is in a predetermined format suitable for display by the image conversion unit 23 via the input / output interface 22 and the system bus (SB). Are converted into a uniform image signal and then output to the display encoder 24.

  The display encoder 24 develops and stores the input image signal in the video RAM 25, generates a video signal from the stored contents of the video RAM 25, and outputs the video signal to the display driving unit 26.

  The display driving unit 26 functions as a display element control unit, and drives the display element 51 which is a spatial light modulation element (SOM) at an appropriate frame rate corresponding to the image signal output from the display encoder 24. To do. The projection device 10 irradiates the light beam emitted from the light source device 60 to the display element 51 through the light source side optical system, thereby forming an optical image (image light) with the reflected light of the display element 51 and projecting it. An image is projected and displayed on a screen (not shown) through the side optical system. The movable lens group 235 of the projection side optical system is driven by the lens motor 45 for zoom adjustment and focus adjustment.

  The image compression / decompression unit 31 performs a recording process in which a luminance signal and a color difference signal of an image signal are data-compressed by a process such as ADCT and Huffman coding, and are sequentially written in a memory card 32 which is a detachable recording medium.

  Further, the image compression / decompression unit 31 reads the image data recorded on the memory card 32 in the reproduction mode, decompresses each image data constituting a series of moving images in units of one frame, and converts the image data into image conversion. Based on the image data that is output to the display encoder 24 via the unit 23 and stored in the memory card 32, a process for enabling display of a moving image or the like is performed.

  An operation signal of a key / indicator unit 37 composed of a main key and an indicator provided on the top panel 11 of the housing is directly sent to the control unit 38, and a key operation signal from the remote controller is sent to the Ir receiving unit 35. And the code signal demodulated by the Ir processing unit 36 is output to the control unit 38.

  Note that an audio processing unit 47 is connected to the control unit 38 via a system bus (SB). The sound processing unit 47 includes a sound source circuit such as a PCM sound source, converts the sound data into analog in the projection mode and the playback mode, and drives the speaker 48 to emit loud sounds.

  Further, the control unit 38 controls a light source control circuit 41 as a light source control unit, and the light source control circuit 41 is configured so that light of a predetermined wavelength band required at the time of image generation is emitted from the light source device 60. Individual control for emitting light in the red, green, and blue wavelength bands of the light source device 60 is performed.

  The control unit 38 causes the cooling fan drive control circuit 43 to perform temperature detection using a plurality of temperature sensors provided in the light source device 60 and the like, and controls the rotation speed of the cooling fan based on the temperature detection result. Further, the control unit 38 causes the cooling fan drive control circuit 43 to continue the rotation of the cooling fan even after the projection apparatus main body is turned off by a timer or the like, or depending on the result of temperature detection by the temperature sensor, the power supply of the projection apparatus 10 main body Control such as turning off is also performed.

  Next, the internal structure of the projection apparatus 10 will be described with reference to FIG. FIG. 3 is a schematic plan view showing the internal structure of the projection apparatus 10. The projection apparatus 10 includes a control circuit board 241 in the vicinity of the left panel 15. The control circuit board 241 includes a power circuit block, a light source control block, and the like. On the right panel 14 side of the control circuit board 241, a display element device 300, which is an electronic device including the display element 51 and a heat sink 190 serving as a heat dissipation device for cooling the display element 51, is disposed. In the present embodiment, DMD is used as the display element 51. Further, the projection device 10 includes a light source device 60 on the front right side of the housing of the projection device 10. Further, a light source side optical system 170 is disposed between the light source device 60 and the back panel 13. A projection-side optical system 220 is disposed on the left panel 15 side of the projection apparatus 10.

  The light source device 60 includes an excitation light irradiation device 70, a red light source device 120, and a green light source device 80. The excitation light irradiation device 70 is a light source for blue wavelength band light (blue light source device) and an excitation light source. The red light source device 120 is a light source of red wavelength band light. The green light source device 80 is a light source of green wavelength band light, and includes an excitation light irradiation device 70 and a fluorescent plate device 100.

  The light source device 60 is provided with a light guide optical system 140. The light guide optical system 140 guides light in the wavelength bands of blue, red, and green emitted from the excitation light irradiation device 70, the red light source device 120, and the green light source device 80, and emits the light to the light source side optical system 170. To do.

  The excitation light irradiation device 70 is disposed in the vicinity of the front panel 12 at a substantially central portion on the front side in the housing of the projection device 10. The excitation light irradiation device 70 is provided with a blue laser diode 71 that is a plurality of semiconductor light emitting elements arranged so that the optical axis is parallel to the right panel 14 and the left panel 15. A heat sink 81 is provided on the front panel 12 side of the blue laser diode 71. Further, on the optical axis of each blue laser diode 71, a plurality of collimator lenses 73 that convert the emitted light from each blue laser diode 71 into parallel light so as to enhance directivity are arranged. In the present embodiment, the excitation light irradiation device 70 includes a total of eight blue laser diodes 71 and collimator lenses 73 arranged in two rows and four columns.

  The red light source device 120 is juxtaposed on the right side of the excitation light irradiation device 70 and includes a red light source 121 and a condenser lens group 125. The red light source 121 is disposed so that the light emitted from the blue laser diode 71 and the optical axis are parallel to each other. The red light source 121 is a red light emitting diode that is a semiconductor light emitting element that emits light in the red wavelength band. The condenser lens group 125 condenses the red wavelength band light emitted from the red light source 121. The optical axis of the red wavelength band light emitted from the red light source device 120 intersects the optical axis of the blue wavelength band light emitted from the excitation light irradiation device 70 and then reflected by the first reflecting mirror 141.

  The red light source device 120 includes a heat sink 130 on the front panel 12 side of the red light source 121. On the other hand, a cooling fan 261 is disposed on the left side of the excitation light irradiation device 70. The cooling air from the cooling fan 261 is sent to the heat sink 81 of the excitation light irradiation device 70 and the heat sink 130 of the red light source device 120. Therefore, the blue laser diode 71 and the red light source 121 are cooled by the heat sinks 81 and 130, respectively.

  The fluorescent screen device 100 constituting the green light source device 80 is disposed in the vicinity of the right panel 14. The fluorescent plate device 100 is arranged on the optical path of the excitation light that is emitted from the excitation light irradiation device 70 and then reflected by the first reflection mirror 141.

  Here, the fluorescent plate device 100 includes a fluorescent plate 101, a motor 110, a condenser lens group 111, and a condenser lens 115. The fluorescent plate 101 is a fluorescent wheel and is arranged to be parallel to the right panel 14, that is, to be parallel to the optical axis of the emitted light of the excitation light irradiation device 70.

  The motor 110 rotationally drives the fluorescent screen 101. The condensing lens group 111 condenses the light beam of the excitation light emitted from the excitation light irradiation device 70 and reflected by the first reflection mirror 141 onto the fluorescent plate 101 and is emitted from the fluorescent plate 101 toward the left panel 15. Concentrate the light bundle. The condensing lens 115 condenses the light beam transmitted or diffused and transmitted by the fluorescent plate 101. A cooling fan 262 is disposed on the right panel 14 side of the motor 110, and the fluorescent plate device 100 and the like are cooled by the cooling fan 262.

  The fluorescent plate 101 is provided with a fluorescent emission region and a transmission region continuously in the circumferential direction. The fluorescent light emitting region receives the light emitted from the excitation light irradiation device 70 via the condenser lens group 111 as excitation light, and emits fluorescent light in the green wavelength band. The transmission region transmits or diffuses the excitation light emitted from the excitation light irradiation device 70.

  As the base material of the fluorescent plate 101, a metal base material made of copper, aluminum, or the like can be used. An annular groove is formed on the surface of the substrate on the excitation light irradiation device 70 side. The bottom of the groove is mirrored by silver vapor deposition or the like, and a green phosphor layer is laid on the bottom. Further, a transparent base material having translucency is inserted into the cut-out light transmitting portion of the base material in the transmission region. In addition, when a region that diffuses and transmits excitation light is disposed as a transmission region, a transparent base material having a surface with fine irregularities formed by sandblasting or the like is inserted.

  When the green phosphor layer of the phosphor plate 101 is irradiated with the blue wavelength band light emitted from the excitation light irradiation device 70, the green phosphor is excited and emits the green wavelength band light in all directions. The fluorescently emitted green wavelength band light is emitted toward the left panel 15 and enters the condenser lens group 111. On the other hand, the blue wavelength band light emitted from the excitation light irradiation device 70 incident on the transmission region is transmitted or diffusely transmitted through the fluorescent plate 101 and disposed on the back side of the fluorescent plate 101 (in other words, on the right panel 14 side). The light enters the condenser lens 115.

  The light guide optical system 140 is a condensing lens that condenses the light bundles in the blue wavelength band, the red wavelength band, and the green wavelength band, and converts the optical axes of the light bundles in the respective color wavelength bands and guides them to the same optical axis. Equipped with a reflective mirror and dichroic mirror. Specifically, the light guide optical system 140 includes a first reflecting mirror 141, a condensing lens 151, a diffuser plate 152, a first dichroic mirror 142, a second reflecting mirror 143, a condensing lens 146, a third reflecting mirror 149, a collecting mirror. It comprises an optical lens 147, a condenser lens 145, and a second dichroic mirror 148.

  The first reflection mirror 141 is disposed on the back panel 13 side of the excitation light irradiation device 70. The first reflecting mirror 141 converts the optical axis of the blue wavelength band light emitted from the excitation light irradiation device 70 by 90 degrees toward the right panel 14.

  The condenser lens 151 is disposed on the right panel 14 side of the first reflecting mirror 141. The diffusion plate 152 is disposed on the right panel 14 side of the condenser lens 151. The excitation light reflected by the first reflecting mirror 141 is condensed by the condenser lens 151 and diffused by the diffusion plate 152.

  The first dichroic mirror 142 is located at a position where the blue wavelength band light diffused and transmitted through the diffusion plate 152, the green wavelength band light emitted from the fluorescent plate 101, and the red wavelength band light emitted from the red light source device 120 intersect. Has been placed. The first dichroic mirror 142 transmits blue wavelength band light and red wavelength band light and reflects green wavelength band light. The optical axis of the green wavelength band light is converted 90 degrees toward the rear panel 13.

  The second reflection mirror 143 is disposed between the condensing lens 115 and the right panel 14. The second reflecting mirror 143 reflects the blue wavelength band light and converts the optical axis of the blue wavelength band light by 90 degrees in the direction of the back panel 13. A condensing lens 146 is disposed on the rear panel 13 side of the second reflecting mirror 143. Further, a third reflecting mirror 149 is disposed on the rear panel 13 side of the condenser lens 146. The third reflection mirror 149 converts the optical axis of the blue wavelength band light reflected by the second reflection mirror 143 and incident through the condenser lens 146 to the left panel 15 side by 90 degrees. A condenser lens 147 is disposed on the left panel 15 side of the third reflecting mirror 149.

  On the other hand, a condensing lens 145 is disposed on the back panel 13 side of the first dichroic mirror 142. The red wavelength band light transmitted through the first dichroic mirror 142 and the green wavelength band light reflected by the first dichroic mirror 142 so as to coincide with the optical axis of the red wavelength band light enter the condenser lens 145.

  A second dichroic mirror 148 is disposed on the rear panel 13 side of the condenser lens 145 and on the left panel 15 side of the condenser lens 147. The second dichroic mirror 148 reflects red wavelength band light and green wavelength band light and transmits blue wavelength band light. The red wavelength band light and green wavelength band light transmitted through the condenser lens 145 are reflected by the second dichroic mirror 148 and enter the condenser lens 173 of the light source side optical system 170.

  On the other hand, the blue wavelength band light transmitted through the condenser lens 147 passes through the second dichroic mirror 148 and enters the condenser lens 173. Therefore, the optical axes of the blue wavelength band light, the red wavelength band light, and the green wavelength band light coincide with each other by being transmitted or reflected by the second dichroic mirror 148.

  The light source side optical system 170 includes a condenser lens 173, a light tunnel 175, a condenser lens 178, a condenser lens 179, an irradiation mirror 185, and a condenser lens 195. The condenser lens 195 emits the image light emitted from the display element 51 disposed on the back panel 13 side of the condenser lens 195 toward the fixed lens group 225 and the movable lens group 235, so that the projection side optical system 220 is used. It is also part of.

  The condenser lens 173 is disposed between the light tunnel 175 and the second dichroic mirror 148. The condenser lens 173 collects the light source light at the entrance of the light tunnel 175. Blue wavelength band light, red wavelength band light, and green wavelength band light collected by the condenser lens 173 enter the light tunnel 175. The light beam incident on the light tunnel 175 has a uniform intensity distribution by the light tunnel 175.

  The condenser lenses 178 and 179 are disposed on the optical axis of the light tunnel 175 on the left panel 15 side. The light beam emitted from the light tunnel 175 is irradiated to the irradiation mirror 185 via the condenser lenses 178 and 179 and reflected to the condenser lens 195 by the irradiation mirror 185. The light beam reflected by the irradiation mirror 185 is irradiated to the display element 51 through the condenser lens 195 at a predetermined angle. The display element 51 is cooled by a heat sink 190 provided on the back panel 13 side. In the display element device 300, optical components such as the display element 51, the heat sink 190, the condenser lens 195, the condenser lens 179, the irradiation mirror 185, and the projection side optical system 220 are held by a holding member 310.

  The light beam that is the light source light irradiated to the image forming surface of the display element 51 by the light source side optical system 170 is reflected by the image forming surface of the display element 51 and projected onto the screen through the projection side optical system 220 as projection light. Is done.

  Here, the projection side optical system 220 includes a condenser lens 195, a movable lens group 235, a fixed lens group 225, and the like. The movable lens group 235 is formed to be movable by a lens motor. The movable lens group 235 and the fixed lens group 225 are built in the fixed lens barrel. Therefore, the projection-side optical system 220 is configured as a variable focus lens capable of zoom adjustment and focus adjustment.

  By configuring the projection device 10 in this manner, when the fluorescent plate 101 is rotated and light is emitted from the excitation light irradiation device 70 and the red light source device 120 at different timings, the blue, red, and green wavelength band lights are guided. The light enters the condenser lens 173 and the light tunnel 175 of the light source side optical system 170 sequentially via the optical optical system 140 and further enters the display element 51. Therefore, a color image can be projected onto the screen by performing time-division display of light of each color according to data displayed by the DMD that is the display element 51 of the projection device 10.

  Next, the display element device 300 which is an electronic device will be described. As shown in FIG. 4, the display element device 300 includes a display element 51 as an electronic component and a heat sink 190 as a heat dissipation device, a condenser lens 195, a condenser lens 179, an irradiation mirror 185, and a projection side optical system 220. Are integrally held by the holding member 310. In FIG. 4, only a portion where the holding member 310 holds the display element 51 and the heat sink 190 is shown in a sectional view.

  An optical path space 312 is formed at the center of the holding member 310. A condenser lens 195 is held in the optical path space 312. On the other hand, a substrate 320 is provided on the rear end surface of the holding member 310. A long rectangular first opening 321 that is long in the left-right direction is formed in the center of the substrate 320 (see also FIG. 7). A heat sink 190 is disposed on the rear panel 13 side (that is, the rear side) in FIG. 3 which is one side of the substrate 320. The display element 51 is disposed on the front panel 12 side (that is, the front side) in FIG. 3, which is the other surface side of the first opening 321 of the substrate 320. A micromirror is disposed on the front surface of the display element 51, and a heat radiation surface is provided on the back surface.

  The display element 51 is supported on the front surface by the contact surface of the edge portion on the front side of the display element 51 coming into contact with a step portion 314 having a frame shape in front view formed in the optical path space 312 on the back side of the condenser lens 195. . The display element 51 is connected to the socket 52 for the display element 51 formed in a front-view frame shape at the edge on the back side. The socket 52 has an opening 521 at the center, and is disposed on the front edge of the first opening 321 of the substrate 320. A connection terminal 52 a protrudes from the back surface of the socket 52. The connection terminal 52a is electrically connected to the substrate 320. Therefore, the back surface of the socket 52 is separated from the front surface of the substrate 320 by a predetermined gap according to the length of the connection terminal 52a. In this way, the socket 52 functions as a connection part for an electronic component for electrically connecting the display element 51 to the substrate 320.

  A frame-shaped cushion 53 is provided on the outer periphery of the display element 51 and the socket 52 between the step portion 314 and the substrate 320. The cushion 53 can be made of an elastic material such as resin, rubber, or non-woven fabric. The cushion 53 is disposed from the front side of the substrate 320 to the back side of the stepped portion 314.

  On the back side of the substrate 320, a pressing plate 330 formed of a metal such as aluminum or a resin is provided. A sheet metal member 340 is provided on the back side of the presser plate 330. Bolts 350 are inserted into the hole portions for the respective bolts in the sheet metal member 340, the holding plate 330 and the substrate 320. Then, the two bolts 350 are screwed into two female screw portions 316 formed on the left and right sides of the holding member 310. Therefore, the sheet metal member 340, the pressing plate 330 and the substrate 320 are fixed to the holding member 310. In addition, a second opening 331 and an opening 341 that are narrower than the first opening 321 of the substrate 320 are formed at the center of the presser plate 330 and the sheet metal member 340, respectively. Note that the second opening 331 and the opening 341 of the holding plate 330 and the sheet metal member 340 may have the same shape as the first opening 321 of the substrate 320.

  A spacer 390 is provided between the sheet metal member 340 and the heat sink 190. An opening 391 having the same shape as the second opening 331 and the opening 341 of the substrate 320, the pressing plate 330, and the sheet metal member 340 is formed at the center of the spacer 390.

  The heat sink 190 which is a heat radiating device has a plurality of heat radiating fins 191 on the back surface as heat radiating portions. In FIG. 4, a plurality of heat dissipating fins 191 are arranged in a direction from the near side toward the far side. Therefore, the plurality of radiating fins 191 are formed with the left-right direction in FIG. 4 as the longitudinal direction. Further, the plurality of grooves formed between the radiation fins 191 are formed in the left-right direction in FIG.

  A protruding heat transfer portion 192 is formed on the front side of the heat sink 190. As shown in FIG. 7, the cross section of the heat transfer unit 192 in the front view is a long rectangular shape. As shown in FIG. 4, the heat transfer portion 192 is formed in a size that can be inserted into the first opening 321, the second opening 331, the opening 341, and the opening 391. The heat sink 190 can be formed by extrusion molding. Note that protrusions may be formed on the four side surfaces of the heat sink 190 excluding the outer corners of the heat transfer portion 192. In this case, the protrusion is formed so as to be inclined from the radiating fin 191 side to the display element 51 side. The height of the protrusion is such that the height on the side of the heat dissipating fin 191 is high, and the height gradually decreases toward the display element 51 side.

  A plate spring part 342 is formed on each of the left and right sides of the sheet metal member 340. Each leaf spring portion 342 is formed with a female screw portion 343. Bolts 360 are respectively inserted into the bolt holes 193 at the left and right positions of the heat sink 190. The bolt 360 is also inserted into the bolt hole 392 of the spacer 390 and is screwed into the female screw portion 343 of the leaf spring portion 342. Accordingly, the spacer 390 and the heat sink 190 are fixed to the sheet metal member 340 and are urged toward the display element 51 on the front side by the urging force of the plate spring portion 342 functioning as urging means.

  The tip of the bolt 360 is positioned in the hole 332 of the presser plate 330. Thereby, interference between the tip of the bolt 360 and the back surface of the substrate 320 is prevented.

  Next, the sealing member 370 will be described with reference to FIGS. 5 and 6. 5 is a view of the sealing member 370 as viewed from above in FIG. 4, and FIG. 6 is a cross-sectional view of the sealing member 370 taken along line VI-VI in FIG. Hereinafter, in the description of the sealing member 370, the front side of FIG. 5 on which the heat sink 190 is disposed is the back surface, and the opposite side is the front surface.

  The entire sealing member 370 is formed in a substantially cylindrical shape. The sealing member 370 is made of a material having electrical insulation and heat resistance. For example, a flexible material such as a metal subjected to insulation treatment, resin, or rubber can be used. For the sealing member 370, a thermally conductive material can be used. The sealing member 370 has a cylindrical portion 371 that is formed in a rectangular shape that is substantially rectangular in plan view (see FIG. 5). An annular flat plate portion 372 standing outward is formed on the outer periphery of one end side of the cylindrical portion 371 on the heat sink 190 side. The outer shape of the flat plate portion 372 is formed in a substantially rectangular shape in plan view. A rectangular opening 373 is formed at the center of the cylindrical portion 371.

  In addition, a buffer member 374 is provided on the outer peripheral side surface of the cylindrical portion 371 continuously in an annular shape. The buffer member 374 may be an elastic member such as rubber, and may be provided by winding an annular member such as an O-ring around the outer periphery of the cylindrical portion 371 or by attaching an elastic member. Also good.

  As shown in FIG. 4, the cylindrical portion 371 of the sealing member 370 is disposed between the outer periphery of the heat transfer portion 192 and the inner periphery of the first opening portion 321 and the opening portion 521 of the socket 52. At this time, a gap is formed between the cylindrical portion 371 and the heat transfer portion 192. Further, the buffer member 374 provided on the outer periphery of the cylindrical portion 371 shown in FIGS. 5 and 6 is disposed between the outer periphery of the cylindrical portion 371 and the inner periphery of the first opening 321 and the opening 521. The flat plate portion 372 is sandwiched between the substrate 320 and the pressing plate 330. The lower end 371 a of the cylindrical portion 371 is formed up to the heat dissipation surface of the display element 51. The lower end 371a may be formed so as to contact the display element 51.

  The cylindrical portion 371 of the sealing member 370 that is formed in a rectangular tube shape is formed of a deformable material. Accordingly, when the heat transfer portion 192 of the heat sink 190 is pressed, the sealing member 370 is pressed outward by the protrusions formed on the heat transfer portion 192 of the heat sink 190, so that the buffer member 374 is connected to the outer substrate 320. It will come into contact with certainty. Also. When the heat transfer portion 192 of the heat sink 190 is inserted into the cylindrical portion 371 of the sealing member 370 and pressed, the protrusion formed on the heat transfer portion 192 of the heat sink 190 is formed to be inclined, so that the heat sink 190 is smooth Can be inserted into.

  A heat conductive member 380 such as a heat conductive putty is provided between the front end surface of the heat transfer unit 192 and the back surface of the display element 51. In addition, the end 381 of the heat conductive member 380 is positioned closer to the heat dissipating fins 191 of the heat sink 190 than the front end surface of the heat transfer unit 192 so as to be positioned between the inner surface of the cylindrical part 371 and the heat transfer unit 192. ing.

  The thermal conductive member 380 is a clay-like material having a low hardness, mainly made of silicon, having thermal conductivity, flame retardancy, electrical insulation, and the like. Therefore, the heat conductive member 380 can be easily plastically deformed with a low load and has high adhesion. The front end surface of the heat transfer unit 192 and the back surface of the display element 51 are in close contact with each other through a heat conductive member 380.

  The display element 51 of the display element device 300 generates heat when the projection device 10 is driven. Then, the heat generated by the display element 51 is transmitted from the heat radiation surface on the back surface side of the display element 51 to the heat transfer unit 192 via the heat conductive member 380. Then, the heat transmitted to the heat transfer unit 192 is radiated by the plurality of radiating fins 191 of the heat sink 190.

  Next, the dustproof function of the display element device 300 of this embodiment will be described. When the projection device 10 is activated, the external air taken in by the cooling fans 261 and 262 (see FIG. 3) flows through the inside of the projection device 10 and is exhausted. At this time, even in a normal use environment, dust is mixed in the external air taken into the projection apparatus 10.

  Normally, the optical path space 312 is shielded from the space on the heat radiation fin 191 side of the heat sink 190, and it is desirable that the external space does not enter, but even if the members such as the substrate 320 and the holding plate 330 are closely connected, the boundary An inflow of air occurs due to a slight gap in the surface. In the present embodiment, by providing the sealing member 370, the degree of shielding between the optical path space 312 and the space on the radiating fin 191 side can be improved.

  As specifically shown in FIG. 4, it is assumed that the external air enters from the boundary “a” between the heat sink 190 and the spacer 390 and the gap “b” between the spacer 390 and the sheet metal member 340. The external air that has entered from the boundary a passes through the gap between the opening 391 and the heat transfer unit 192, and the gap between the opening 341 and the heat transfer unit 192, and the gap between the second opening 331 and the heat transfer unit 192. To reach. The external air that has entered through the gap b reaches the gap between the opening 341 and the heat transfer unit 192 and the gap between the second opening 331 and the heat transfer unit 192. Further, the inner periphery of the substrate 320 is covered with the cylindrical portion 371, and the external air that has entered from the boundary a and the gap b reaches the gap between the cylindrical portion 371 and the heat transfer portion 192. However, the gap between the inner periphery of the cylindrical portion 371 and the outer periphery of the heat transfer portion 192 is sealed by the heat conductive member 380 from the middle. Therefore, the outside air is prevented from entering thereafter.

  Further, it is assumed that the external air enters from the boundary c between the substrate 320 and the presser plate 330. External air that has entered from the boundary c moves along the surface direction of the substrate 320 and the pressing plate 330 and reaches the first opening 321 side of the substrate 320, but is sealed by the flat plate portion 372 of the sealing member 370 on the way. Therefore, subsequent intrusion is prevented.

  Furthermore, it is assumed that the external air enters from the boundary d between the holding member 310 and the substrate 320. The external air that has entered from the boundary d moves along the surface direction of the holding member 310 and the substrate 320 and reaches the socket 52 side. However, since it is sealed by the cushion 53 on the way, the subsequent entry is prevented. The Therefore, even if external air enters due to the gap b and the boundaries a, c, d formed between the heat sink 190, the spacer 390, the pressing plate 330, the substrate 320, and the holding member 310, the sealing member 370, the heat The conductive member 380 or the cushion 53 can effectively prevent the dust contained in the external space from entering the optical path space 312.

  The contact portion where the contact surface of the front edge of the display element 51 contacts the back surface of the stepped portion 314 is not sealed. However, the cushion 53 causes external air dust to adhere to the plurality of micromirrors on the front side of the display element 51 from the outer periphery of the display element 51 through the contact portion where the display element 51 and the step portion 314 are in contact. There is no end to it.

  Since the holding member 310 is sufficiently larger than the display element 51, the holding member 310 is hardly deformed by heat generation of the display element 51. Accordingly, the cushion 53, the holding member 310, and the substrate 320 are brought into close contact with each other, so that intrusion of dust from the outside of the cushion 53 is prevented.

  Next, a manufacturing method of the display element device 300 will be described with reference to FIGS. This manufacturing method includes a substrate 320 having a first opening 321 and a heat dissipation surface of a display element 51 that is an electronic component connected via a socket 52 that is a frame-shaped connection portion disposed on the substrate 320. A step of placing and fixing the plates facing each other, a step of placing a cylindrical sealing member 370 having an annular flat plate portion 372 on one end side, and a holding plate 330 having a second opening 331 are mounted on the heat radiation surface. Placing the flat plate portion 372 between the pressing plate 330 and the substrate 320, placing the sheet-like heat conductive member 380 having a predetermined thickness on the heat radiation surface of the electronic component, and a heat dissipation device The projecting heat transfer portion 192 of the (heat sink 190) is inserted into the first opening 321 and the second opening 331, and the sealing member 370 is disposed on the outer periphery of the heat transfer portion 192, and the heat conductive member 380 is disposed. The end 381 of And a step of plastically deforming the heat conductive member 380 to be positioned between the stop member 370 and the heat transfer portion 192.

  Specifically, it is as follows. First, in FIG. 8, the display element 51 is placed on the step portion 314 of the holding member 310. At this time, the display element 51 is placed on the step 314 so that the heat radiating surface on the back side is on the heat sink 190 side. Next, the board | substrate 320 by which the socket 52 is connected to the edge part of the front side of the 1st opening part 321 of the board | substrate 320, and the cushion 53 is arrange | positioned on the outer periphery of the socket 52 is arrange | positioned in the rear end of the holding member 310. Thereafter, the sealing member 370 is placed from the back side of the substrate 320. The presser plate 330 is disposed on the back side of the substrate 320, and the sheet metal member 340 is disposed on the back side of the presser plate 330. Then, the bolt 350 is screwed into the female thread portion 316 of the holding member 310, and the sheet metal member 340, the holding plate 330 and the substrate 320 are fixed to the holding member 310.

  Next, the heat conductive member 380 formed in a sheet shape is placed on the heat dissipation surface of the display element 51. After that, the heat transfer portion 192 of the heat sink 190 is inserted into the first opening 321, the second opening 331, the opening 341, and the opening 391 of the substrate 320, the holding plate 330, the sheet metal member 340, and the spacer 390 to transfer heat. The tip surface of the part 192 is brought into contact with the heat conductive member 380. Then, the bolt 360 is inserted into the bolt holes 193 and 392 of the heat sink 190 and the spacer 390, and the bolt 360 and the female screw portion 343 of the plate spring portion 342 of the sheet metal member 340 are screwed together.

  When the bolt 360 is tightened, the heat sink 190 moves to the front side while being urged toward the front side by the leaf spring portion 342. Then, a load is applied to the heat conductive member 380 by the heat transfer part 192, and the heat conductive member 380 is plastically deformed. Due to the plastic deformation of the heat conductive member 380, the heat conductive member 380 between the front end surface of the heat transfer portion 192 and the heat radiating surface of the display element 51 is crushed and thinned, as shown in FIG. The heat conductive member 380 begins to fill the gap between the heat radiation surface of the display element 51 and the heat transfer unit 192. Further, by further tightening the bolt 360, the heat conductive member 380 is filled between the outer periphery of the heat transfer portion 192 and the inner periphery of the cylindrical portion 371. The space between the substrate 320 and the pressing plate 330 is sealed by the flat plate portion 372 of the sealing member 370.

  In the above manufacturing method, the display element 51 is placed on the holding member 310, the substrate 320 and the like are placed on the holding member 310 and fixed, and then the heat conductive member 380 is placed on the heat dissipation surface of the display element 51. However, if the display element 51 is connected to the socket 52 before the substrate 320 is placed on the holding member 310, the heat conductive member 380 is placed on the heat dissipation surface of the display element 51, and then the substrate 320 or the like is mounted. It may be arranged and fixed on the holding member 310.

  Next, a modified example of the sealing member 370 will be described. FIG. 9 is a view showing a sealing member 370 </ b> A which is a modification of the sealing member 370. This figure is a cross-sectional view at a position corresponding to the VI-VI cross section of FIG. In the following description, the same components as those of the sealing member 370 are denoted by the same reference numerals, and the description thereof is omitted or simplified.

  The sealing member 370 is formed so that the thickness of the lower end 371a of the cylindrical portion 371 gradually becomes thinner. Specifically, the cylindrical portion 371 formed in a rectangular tube shape has a parallel inner peripheral surface 371b substantially parallel to the outer peripheral surface on the back side, and the distance from the outer peripheral surface gradually increases toward the lower end 371a on the front side. And an inclined inner peripheral surface 371c inclined in a convex curve shape toward the inside.

  Such a sealing member 370 </ b> A is arranged so as to be positioned on the outer periphery of the heat transfer part 192 as shown in FIG. 4, and the heat transfer part 192 is biased toward the display element 51 on which the heat conductive member 380 is arranged. Then, the contact area between the heat conductive member 380 and the heat radiation surface of the display element 51 can be further increased. Therefore, it is possible to prevent the heat conductive member 380 from flowing out to the socket 52, the substrate 320, and the holding plate 330, and to enhance the heat dissipation effect and dustproof effect of the heat generated in the display element 51. The inclined inner peripheral surface 371c may be a flat inclined surface.

  As described above, according to the present embodiment, since the heat conductive member 380 does not enter the gap between the substrate 320 and the socket 52, when performing maintenance such as removing the heat sink 190 or the like for parts replacement, etc. The cleaning work of the heat conductive member 380 can be omitted. In addition, it is possible to eliminate the concern that moisture or the like of the display element 51 enters the gap between the components and deteriorates the metal portion. Therefore, the display element device 300 can improve dust resistance and maintainability while having heat dissipation.

  Further, by using a thermally conductive resin or an insulation-treated member as the material of the sealing member 370, the heat of the display element 51 can be efficiently transferred to the holding plate 330 side that is a metal part. Therefore, since the heat generated from the display element 51 can be distributed and sent to a plurality of locations, the cooling of the display element 51 can be advantageously promoted.

  The electronic device according to the present embodiment has been described above, but the contact surface of the heat transfer unit 192 of the heat sink 190 with the heat conductive member 380 may have another configuration. For example, the heat transfer unit 192 may be provided with a groove on the contact surface with the heat conductive member 380. A plurality of groove portions may be provided linearly or in a plurality of directions. Further, the groove portion may be formed in a circular shape or a quadrangular annular shape. Furthermore, the cross-sectional shape of the groove may be a concave curve or a concave rectangle. The shape and depth of such a groove portion may be changed depending on the position of the heat transfer portion 192 on the contact surface with the heat conductive member 380.

  Thus, although the display element apparatus 300 which is an electronic device was comprised, this invention can also be set as the other electronic device provided with another electronic component. For example, an electronic device including a semiconductor light emitting element such as a light emitting diode or a laser diode may be used. In this case, according to the shape of the heat radiating surface of the electronic component, the heat transfer portion can be formed in another shape such as a cylindrical shape.

  Further, in the present embodiment, the plate spring portion 342 is formed on the sheet metal member 340 as an urging means for urging the heat sink 190 to the front side. However, the present invention is not limited to this, and a coil spring wound around the bolt 360 is used. You can also.

  Further, the flat plate portion 372 of the sealing member 370 may be provided with a protruding portion having a convexly curved cross section on the substrate 320 side or the pressing plate 330 side. The protruding portion can be formed in an annular shape along the flat plate portion 372. Thereby, a stronger sealing structure can be formed.

  As described above, according to the embodiment of the present invention, the electronic device (display element device 300) and the projection device 10 including the electronic device include the sealing member 370 and the heat conductive member 380. The sealing member 370 includes a cylindrical portion 371 disposed on the outer periphery of the first opening portion 321 of the substrate 320 and the second opening portion 331 of the holding plate 330 so as to provide a gap with the heat transfer portion 192 of the heat sink 190, and the cylindrical portion. An annular flat plate portion 372 sandwiched between the substrate 320 and the presser plate 330 is provided on one end side of the 371. Further, the heat conductive member 380 is filled between the heat transfer part 192 and the heat radiation surface of the display element 51 and between the heat transfer part 192 and the cylinder part 371. Therefore, the heat conductive member 380 is filled between the inner periphery of the cylinder part 371 and the outer periphery of the heat transfer part 192, and a sealing structure that prevents intrusion of dust can be formed. Therefore, it is possible to configure the electronic device and the projection device 10 with good maintainability while reducing the adhesion of dust to the electronic component.

  In addition, the electronic device in which the cylindrical portion 371 further includes a buffer member 374 formed in an annular shape on the outer peripheral side surface is sealed between the outer periphery of the cylindrical portion 371 and the inner periphery of the first opening 321 and the opening 521. Since the stop structure is formed, the intrusion of external air can be prevented more reliably.

  Further, in the electronic device in which the flat plate portion 372 is formed toward the outside of the first opening 321 of the substrate 320 and the second opening 331 of the holding plate 330, the relative position of the substrate 320 and the holding plate 330 is in the plane direction. Even if they are displaced, since the width of the flat plate portion 372 is wider than the gap between the heat transfer portion 192 and the cylindrical portion 371, the sealing structure and the arrangement relationship of the heat conductive member 380 are not disturbed, and the intrusion of external air Can be surely prevented.

  In addition, the electronic device in which the other end side in the axial direction of the cylindrical portion 371 extends to the heat radiating surface of the display element 51 which is an electronic component is thermally conductive from the heat radiating surface of the display element 51 to the heat transfer portion 192. While filling with the member 380, the heat conductive member 380 can be easily prevented from leaking out to surrounding components such as the socket 52 and the substrate 320. Therefore, it is possible to save the trouble of removing the heat conductive member 380 when replacing the components such as the heat sink 190.

  In addition, the electronic device in which the heat dissipation device is urged toward the electronic component side by the urging unit enhances the adhesion between the display element 51 and the heat transfer unit 192 via the heat conductive member 380 and has a heat conductivity. The end portion 381 of the member 380 can be positioned on the outer peripheral side of the heat transfer portion 192 by plastic deformation. Therefore, it is possible to reduce the thermal resistance from the display element 51 to the heat sink 190 and to form a sealing structure that prevents external air from entering the optical path space 312.

  In addition, the electronic device in which the urging means is a leaf spring part 342 having a female screw part 343 for fixing the heat dissipation device with the bolt 360 can easily constitute the urging means.

  The manufacturing method of the electronic device (display element device 300) of the present embodiment includes a step of arranging and fixing the substrate 320 and the heat radiation surface of the electronic component (display element 51) facing each other, and a ring shape on one end side of the heat radiation surface. A step of placing the cylindrical sealing member 370 having the flat plate portion 372, and a step of placing the presser plate 330 having the second opening 331 and sandwiching the flat plate portion 372 between the presser plate 330 and the substrate 320. And a step of placing the heat conductive member 380 on the heat radiating surface of the electronic component, and the heat transfer portion 192 of the heat radiating device (heat sink 190) is inserted into the first opening portion 321 and the second opening portion 331 and sealed. The member 370 is disposed on the outer periphery of the heat transfer part 192, and the heat conductive member 380 is plastically deformed so that the end 381 of the heat conductive member 380 is positioned between the sealing member 370 and the heat transfer part 192. And a process. Therefore, the heat conductive member 380 is filled between the inner periphery of the cylinder part 371 and the outer periphery of the heat transfer part 192, and a sealing structure that prevents intrusion of dust can be formed. Therefore, it is possible to configure the electronic device and the projection device 10 with good maintainability while reducing the adhesion of dust to the electronic component.

  In addition, although the annular flat plate portion 372 erected outward is formed on the outer periphery of the sealing member 370 on one end side on the heat sink 190 side, the flat plate portion 372 may be omitted.

  Further, the embodiment described above is presented as an example, and is not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the invention described in the claims and the equivalents thereof.

The invention described in the first claim of the present application will be appended below.
[1] A heat dissipation device having a heat transfer unit;
A substrate of a plate-like member on which the heat radiating device is disposed on one side and a first opening into which the heat transfer unit of the heat radiating device is inserted;
An electronic component disposed on the other surface side of the substrate such that a heat dissipation surface is located on the first opening side of the substrate;
A sealing member having a cylindrical portion disposed on the outer periphery with a gap provided between the heat transfer portion of the heat dissipation device in the first opening of the substrate;
A thermally conductive member filled between the heat transfer portion of the heat dissipation device and the heat dissipation surface of the electronic component and between the heat transfer portion of the heat dissipation device and the cylindrical portion of the sealing member; ,
An electronic device comprising:
[2] It further includes a press plate that is disposed between the heat dissipation device and the substrate and has a second opening into which the heat transfer unit is inserted,
The sealing member includes an annular flat plate portion sandwiched between the substrate and the pressing plate on one end side of the cylindrical portion,
The heat transfer part is formed in a protruding shape,
The heat dissipating device is disposed on one side of the substrate,
The electronic component is connected via a frame-shaped connecting portion arranged on the substrate.
The electronic device according to [1] above, wherein
[3] The electronic device according to [1] or [2], wherein the cylindrical portion further includes a buffer member formed in an annular shape on an outer peripheral side surface.
[4] The electronic device according to [2], wherein the flat plate portion is formed toward the outside of the first opening and the second opening.
[5] The electron according to any one of [1] to [4], wherein the other end side in the axial direction of the cylindrical portion extends to the heat radiation surface of the electronic component. apparatus.
[6] The electronic device according to any one of [1] to [5], wherein the heat dissipation device is urged toward the electronic component by an urging unit.
[7]
The electronic device according to the above [6], wherein the urging means is a leaf spring having a female screw portion for fixing the heat dissipation device with a bolt.
[8] A plurality of heat radiation fins provided at positions facing the heat transfer portion of the heat dissipation device,
Projections are formed on a part of each side surface except for the corners on the outer peripheral side surface of the heat transfer unit,
The protrusion is formed to be inclined from the heat dissipating fin side to the electronic component side,
In the above [1] to [7], the protrusion is formed to be inclined so that the height gradually decreases from the heat radiating fin side to the electronic component side. The electronic device described.
[9] The electronic device according to any one of [1] to [8],
A light source device including a red light source device, a green light source device, and a blue light source device;
A light source side optical system for guiding light from the light source device to the electronic component which is a display element;
A projection-side optical system that projects an image emitted from the electronic component;
A control unit for controlling the light source device and the electronic component;
A projection apparatus comprising:
[10] A step of arranging and fixing the substrate having the first opening and the heat radiation surface of the electronic component connected via the frame-shaped connecting portion arranged on the substrate so as to face each other,
A step of placing a cylindrical sealing member having an annular flat plate portion on one end side on the heat radiating surface;
Placing a presser plate having a second opening and sandwiching the flat plate part between the presser plate and the substrate;
Placing a sheet-like thermally conductive member having a predetermined thickness on the heat dissipation surface of the electronic component;
Inserting the protruding heat transfer part of the heat dissipation device into the first opening part of the substrate and the second opening part of the holding plate, and arranging the sealing member on the outer periphery of the heat transfer part, Plastically deforming the thermally conductive member so that an end portion of the thermally conductive member is positioned between the sealing member and the heat transfer portion;
A method for manufacturing an electronic device, comprising:

DESCRIPTION OF SYMBOLS 10 Projector 11 Top panel 12 Front panel 13 Rear panel 14 Right panel 15 Left panel 16 Lower panel 17 Intake / exhaust hole 21 Input / output connector part 22 Input / output interface 23 Image conversion part 24 Display encoder 25 Video RAM 26 Display drive part 31 Image compression / Expansion unit 32 Memory card 35 Ir receiving unit 36 Ir processing unit 37 Key / indicator unit 38 Control unit 41 Light source control circuit 43 Cooling fan drive control circuit 45 Lens motor 47 Audio processing unit 48 Speaker 51 Display element 52 Socket (connection unit) 52a Connection terminal 53 Cushion 60 Light source device 70 Excitation light irradiation device 71 Blue laser diode 73 Collimator lens 80 Green light source device 81 Heat sink 100 Fluorescent plate device 101 Fluorescent plate 110 Motor 111 Condensing lens group 11 5 condenser lens 120 red light source device 121 red light source 125 condenser lens group 130 heat sink 140 light guide optical system 141 first reflective mirror 142 first dichroic mirror 143 second reflective mirror 145 condenser lens 146 condenser lens 147 condenser lens 148 Second dichroic mirror 149 Third reflecting mirror 151 Condensing lens 152 Diffuser plate 170 Light source side optical system 173 Condensing lens 175 Light tunnel 178 Condensing lens 179 Condensing lens 185 Irradiation mirror 190 Heat sink (heat radiation device) 191 Radiation fin ( Heat dissipation part)
192 Heat transfer portion 193 Bolt hole 195 Condenser lens 220 Projection side optical system 225 Fixed lens group 235 Movable lens group 241 Control circuit board 261 Cooling fan 262 Cooling fan 300 Display element device 310 Holding member 312 Optical path space 314 Step portion 316 Female screw portion 320 Substrate 321 First opening portion 330 Presser plate 331 Second opening portion 332 Hole portion 340 Sheet metal member 341 Opening portion 342 Leaf spring portion 343 Female thread portion 350 Bolt 360 Bolt 370 Sealing member 370A Sealing member 371 Tube portion 371a Lower end 371b Parallel inside Peripheral surface 371c Inclined inner peripheral surface 372 Flat plate portion 372a Projection portion 373 Opening portion 374 Buffer member 380 Thermally conductive member 381 End portion 390 Spacer 391 Opening portion 392 Bolt hole 521 Opening portions a, c, d Boundary b Gap

Claims (10)

A heat dissipation device having a heat transfer section;
A substrate of a plate-like member on which the heat radiating device is disposed on one side and a first opening into which the heat transfer unit of the heat radiating device is inserted;
An electronic component disposed on the other surface side of the substrate such that a heat dissipation surface is located on the first opening side of the substrate;
A sealing member having a cylindrical portion disposed on the outer periphery with a gap provided between the heat transfer portion of the heat dissipation device in the first opening of the substrate;
A thermally conductive member filled between the heat transfer portion of the heat dissipation device and the heat dissipation surface of the electronic component and between the heat transfer portion of the heat dissipation device and the cylindrical portion of the sealing member; ,
An electronic device comprising: A press plate that is disposed between the heat dissipation device and the substrate and has a second opening into which the heat transfer unit is inserted;
The sealing member includes an annular flat plate portion sandwiched between the substrate and the pressing plate on one end side of the cylindrical portion,
The heat transfer part is formed in a protruding shape,
The heat dissipating device is disposed on one side of the substrate,
The electronic component is connected via a frame-shaped connecting portion arranged on the substrate.
The electronic device according to claim 1.   The electronic device according to claim 1, wherein the cylindrical portion further includes a buffer member formed in an annular shape on an outer peripheral side surface.   The electronic device according to claim 2, wherein the flat plate portion is formed toward the outside of the first opening and the second opening.   5. The electronic device according to claim 1, wherein the other end side in the axial direction of the cylindrical portion is formed over the heat radiation surface of the electronic component.   6. The electronic device according to claim 1, wherein the heat radiating device is urged toward the electronic component by an urging unit.   The electronic device according to claim 6, wherein the biasing means is a leaf spring having a female screw portion that fixes the heat dissipation device with a bolt. A plurality of heat dissipating fins provided at positions facing the heat transfer portion of the heat dissipating device;
Projections are formed on a part of each side surface except for the corners on the outer peripheral side surface of the heat transfer unit,
The protrusion is formed to be inclined from the heat dissipating fin side to the electronic component side,
The said protrusion is inclined and formed so that height may become low gradually from the said radiation fin side to the said electronic component side, It is characterized by the above-mentioned. Electronic equipment. An electronic device according to any one of claims 1 to 8,
A light source device including a red light source device, a green light source device, and a blue light source device;
A light source side optical system for guiding light from the light source device to the electronic component which is a display element;
A projection-side optical system that projects an image emitted from the electronic component;
A control unit for controlling the light source device and the electronic component;
A projection apparatus comprising: A step of arranging and fixing the substrate having the first opening and the heat radiation surface of the electronic component connected via the frame-shaped connecting portion arranged on the substrate to face each other;
A step of placing a cylindrical sealing member having an annular flat plate portion on one end side on the heat radiating surface;
Placing a presser plate having a second opening and sandwiching the flat plate part between the presser plate and the substrate;
Placing a sheet-like thermally conductive member having a predetermined thickness on the heat dissipation surface of the electronic component;
Inserting the protruding heat transfer part of the heat dissipation device into the first opening part of the substrate and the second opening part of the holding plate, and arranging the sealing member on the outer periphery of the heat transfer part, Plastically deforming the thermally conductive member so that an end portion of the thermally conductive member is positioned between the sealing member and the heat transfer portion;
A method for manufacturing an electronic device, comprising:

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