JP7100813B2 - Light source device and projection device - Google Patents

Description

The present invention relates to a light source device and a projection device including the light source device.

Today, data projectors are widely used as image projection devices that project images such as screens and video images of personal computers and images based on image data stored in a memory card or the like onto the screen. Conventionally, such projectors have mainly used a high-brightness discharge lamp as a light source, but in recent years, they are provided with a light source device using a laser diode as a power-saving, long-life, high-brightness semiconductor light emitting element. A projection device has been proposed.

The light source device disclosed in Patent Document 1 has a phosphor layer made of a phosphor ceramic or the like and a transparent layer provided on the emission side of the emitted light in the phosphor layer, and emits the emitted light in the phosphor layer. A heat dissipation substrate is arranged on the opposite side to the side via the joint. The transparent layer is formed of, for example, transparent ceramics or a transparent resin, and is considered to have higher thermal conductivity than air. This transparent layer can effectively dissipate the heat generated in the irradiation spot irradiated with the excitation light from the solid light source in the phosphor layer.

Japanese Unexamined Patent Publication No. 2013-187043

The transparent layer can increase the amount of heat radiation on the emission side of the phosphor layer (fluorescent plate) made of phosphor ceramics or the like. However, even if the amount of heat dissipated on the emission side of the phosphor plate is increased to suppress the thermal stress in the phosphor plate, if the temperature difference between the front and back of the bonding plate to which the phosphor plate is bonded is large, it is bonded by thermal expansion. The board is warped. Then, problems such as cracking and peeling of the phosphor plate may occur.

An object of the present invention is to provide a light source device in which cracking and peeling of a phosphor plate are reduced, and a projection device provided with the light source device.

The light source device according to the present invention is arranged on one side of the heat conductive layer, the heat conductive layer, a phosphor plate indirectly arranged with the heat conductive layer, and the other side of the heat conductive layer. The heat conductive layer is provided with a heat radiating portion, and the heat conductivity of the first region corresponding to the phosphor plate in the heat conductive layer does not correspond to the phosphor plate in the heat conductive layer. It is characterized by being lower than the thermal conductivity in the region of.

The projection device according to the present invention includes the above-mentioned light source device, a display element that is irradiated with light source light from the light source device to form an image light, and a projection that projects the image light emitted from the display element onto a screen. It is characterized by having a side optical system, the display element, and a projection device control unit that controls the light source device.

According to the present invention, it is possible to provide a light source device in which cracking and peeling of a phosphor plate are reduced, and a projection device including the light source device.

It is a figure which shows the functional block of the projection apparatus which concerns on embodiment of this invention. It is a plane schematic diagram which shows the internal structure of the projection apparatus which concerns on embodiment of this invention. It is a figure which shows the fluorescent substance plate part which concerns on embodiment of this invention, (a) is the front view seen from the emission side of the fluorescent substance plate part, (b) shows the cross section of IIIb-IIIb of (a). It is a sectional view. It is a figure which compares the thermal gradient of the joint plate which concerns on embodiment of this invention, and the thermal gradient of the junction plate in the conventional fluorescent plate apparatus, (a) shows the thermal gradient of the junction plate which concerns on embodiment of this invention, (b) is The thermal gradient of the conventional joint plate is shown. It is sectional drawing corresponding to FIG. 3 (b) which shows the fluorescent substance plate part which concerns on the modification of embodiment of this invention, (a) shows modification 1 and (b) shows modification 2.

Hereinafter, embodiments according to the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a functional circuit block of the projection device control unit of the projection device 10. The projection device control unit is composed of a control unit 38, an input / output interface 22, an image conversion unit 23, a display encoder 24, a display drive unit 26, and the like.

The control unit 38 controls the operation of each circuit in the projection device 10, and is composed of a ROM that fixedly stores operation programs such as a CPU and various settings, a RAM that is used as a work memory, and the like. ing.

Then, by this control means, the image signals of various standards input from the input / output connector unit 21 are images of a predetermined format suitable for display by the image conversion unit 23 via the input / output interface 22 and the system bus (SB). After being converted into a signal, it is output to the display encoder 24.

Further, the display encoder 24 expands and stores the input image signal in the video RAM 25, generates a video signal from the stored contents of the video RAM 25, and outputs the video signal to the display drive unit 26.

The display drive unit 26 functions as a display element control means, and drives the display element 51, which is a spatial light modulation element (SOM), at an appropriate frame rate in response to the image signal output from the display encoder 24. It is a thing.

Then, in this projection device 10, by irradiating the display element 51 with the light bundle emitted from the light source device 60 via the optical system, an optical image is formed by the reflected light of the display element 51, and the projection side optical system is formed. The image is projected and displayed on a screen (not shown). The movable lens group 235 of the projection side optical system is driven by the lens motor 45 for zoom adjustment and focus adjustment.

Further, the image compression / decompression unit 31 performs recording processing in which the luminance signal and the color difference signal of the image signal are data-compressed by processing such as ADCT and Huffman coding and sequentially written to the memory card 32 which is a detachable recording medium. ..

Further, the image compression / decompression unit 31 reads out the image data recorded in the memory card 32 in the reproduction mode, decompresses the individual image data constituting the series of moving images in units of one frame, and converts the image data into an image. It outputs to the display encoder 24 via the unit 23, and performs a process that enables display of a moving image or the like based on the image data stored in the memory card 32.

Then, the operation signal of the key / indicator unit 37 composed of the main key and the indicator provided in the housing of the projection device 10 is directly sent to the control unit 38, and the key operation signal from the remote controller is received by Ir. The code signal received by the unit 35 and demodulated by the Ir processing unit 36 is output to the control unit 38.

A voice processing unit 47 is connected to the control unit 38 via a system bus (SB). The voice processing unit 47 includes a sound source circuit such as a PCM sound source, converts voice data into analog in the projection mode and the reproduction mode, and drives the speaker 48 to emit loud sound.

Further, the control unit 38 controls a light source control circuit 41 as a light source control means, and the light source control circuit 41 so that light in a predetermined wavelength band required at the time of image generation is emitted from the light source device 60. , The light emission of the red light source device, the green light source device, and the blue light source device of the light source device 60 is individually controlled.

Further, the control unit 38 causes the cooling fan drive control circuit 43 to detect the temperature by a plurality of temperature sensors provided in the light source device 60 and the like, and controls the rotation speed of the cooling fan from the result of the temperature detection. Further, the control unit 38 keeps the cooling fan rotating even after the power of the projection device 10 is turned off by a timer or the like in the cooling fan drive control circuit 43, or depending on the result of temperature detection by the temperature sensor, the projection device 10 main body. It also controls such as turning off the power.

Next, the internal structure of the projection device 10 will be described. FIG. 2 is a schematic plan view showing the internal structure of the projection device 10. Here, the housing of the projection device 10 is formed in a substantially box shape, and includes upper and lower surface panels, a front panel 12, a back panel 13, a right panel 14, and a left panel 15. In the following description, the left and right in the projection device 10 indicate the left-right direction with respect to the projection direction, and the front-back means the front-back direction with respect to the screen side direction of the projection device 10 and the traveling direction of the light flux. ..

The projection device 10 includes a light source device 60 in the central portion, and a lens barrel 225 of the projection side optical system 220 on the left side of the light source device 60. Further, the projection device 10 includes a display element 51 such as a DMD between the lens barrel 225 and the rear panel 13. The projection device 10 includes a heat sink 191 for cooling the display element 51 between the display element 51 and the back panel 13. Further, the projection device 10 includes a main control circuit board (not shown) below the light source device 60.

The light source device 60 includes a green light source device 80 that emits green wavelength band light, a red light source device 120 that emits red wavelength band light, a blue light source device 300 that emits blue wavelength band light, and a light guide optical system 140. , Formed by. Further, the green light source device 80 is formed by the excitation light irradiation device 70 and the fluorescent plate device 100.

The excitation light irradiation device 70 is arranged in the vicinity of the back panel 13 at substantially the center in the left-right direction of the projection device 10. The excitation light irradiation device 70 is composed of two semiconductor light emitting elements, a blue laser diode 71. The two blue laser diodes 71 are arranged side by side so that the optical axis is perpendicular to the back panel 13. A heat sink 81 is arranged between the blue laser diode 71 and the back panel 13. On the optical axis of each blue laser diode 71, a collimator lens 73 that converts light into parallel light is arranged so as to enhance the directivity of the light emitted from each blue laser diode 71. Further, a cooling fan 261 is arranged between the heat sink 81 and the back panel 13. The blue laser diode 71 is cooled by the cooling fan 261 and the heat sink 81.

The fluorescent plate device 100 emits fluorescent light in the green wavelength band by being irradiated with the excitation light from the excitation light irradiation device 70. The fluorescent plate device 100 is arranged on the optical path of the excitation light emitted from the excitation light irradiation device 70 and in the vicinity of the front panel 12. The phosphor plate device 100 includes a phosphor plate unit 110 having a phosphor plate 101 arranged so as to be parallel to the front panel 12, that is, perpendicular to the optical axis of the emitted light from the excitation light irradiation device 70. The light bundle of the excitation light emitted from the excitation light irradiation device 70 is focused on the phosphor plate 101, and the light bundle of the fluorescent light in the green wavelength band emitted from the phosphor plate portion 110 toward the back panel 13 is focused. The condenser lens group 111 and the light condensing lens group 111 are provided. The details of the phosphor plate portion 110 of the fluorescent plate apparatus 100 will be described later. A cooling fan 261 is arranged between the phosphor plate portion 110 and the front panel 12, and the fluorescent plate device 100 and the like are cooled by the cooling fan 261.

The red light source device 120 includes a red light source 121 and a condenser lens group 125 that collects the light emitted from the red light source 121. The red light source 121 is a red light emitting diode which is a semiconductor light emitting device that emits light in a red wavelength band. Then, in the red light source device 120, the optical axis of the red wavelength band light emitted from the red light source 121 of the red light source device 120 is from the optical axis of the blue wavelength band light emitted from the blue light source device 300 and the phosphor plate 101. It is arranged so as to intersect the optical axis of the green wavelength band light that is emitted and reflected by the first dichroic mirror 141 described later. Further, the red light source device 120 includes a heat sink 130 arranged on the back panel 13 side of the red light source 121. A cooling fan 261 is arranged between the heat sink 130 and the front panel 12, and the red light source 121 is cooled by the cooling fan 261 and the heat sink 130.

The blue light source device 300 is arranged at a substantially central position in the front-rear direction of the projection device 10 in the vicinity of the right panel 14. The blue light source device 300 is arranged with a blue laser diode 301, which is a semiconductor light emitting element, and a collimator lens 320, which converts light emitted from the blue laser diode 301 into parallel light so as to enhance the directivity of the light emitted from the blue laser diode 301. The optical axis of the emitted light from the blue laser diode 301 emitted through the collimator lens 320 is emitted toward the left panel 15 side so as to be parallel to the front panel 12. Therefore, the emitted light from the blue light source device 300 is orthogonal to the emitted light from the excitation light irradiation device 70, the emitted light from the fluorescent plate device 100, and the emitted light from the red light source device 120. A heat sink 190 is arranged on the right side panel 14 side of the blue light source device 300.

Between the cooling fan 261 on the front panel 12 side of the fluorescent plate apparatus 100 and the front panel 12, the cooling fan 261 extends from the position on the front panel 12 side to the front panel 12 side of the heat sink 190 in the vicinity of the right panel 14. A heat sink 135 is placed. A cooling fan 261 is arranged between the heat sink 135 and the front panel 12 in the vicinity of the right panel 14. The cooling fans 261 cool the heat sinks 135 and 190.

The light guide optical system 140 includes a condenser lens that condenses light bundles in the red, green, and blue wavelength bands, and a reflection mirror that converts the optical axis of the light bundle in each color wavelength band into the same optical axis. It consists of a dichroic mirror and the like. Specifically, the optical axis of the blue wavelength band light emitted from the blue light source device 300, the optical axis of the blue wavelength band light emitted from the excitation light irradiation device 70, and the optical axis of the green wavelength band light emitted from the fluorescent plate device 100. A first dichroic mirror 141 that transmits blue wavelength band light, reflects green wavelength band light, and converts the optical axis of this green light by 90 degrees in the left panel 15 direction is placed at the position where Has been done. By the first dichroic mirror 141, the optical axis of the blue wavelength band light emitted from the blue light source device 300 and the optical axis of the green wavelength band light emitted from the phosphor screen device 100 are set to be the same optical axis.

Then, the optical axis of the blue wavelength band light emitted from the blue light source device 300 transmitted through the first dichroic mirror 141 and the optical axis of the green wavelength band light emitted from the fluorescent plate device 100 reflected by the first dichroic mirror 141. At a position where the optical axis of the red wavelength band light emitted from the red light source device 120 intersects at right angles, the blue wavelength band light and the green wavelength band light are transmitted, and the red wavelength band light is reflected to this red color. A second dichroic mirror 142 that converts the optical axis of light by 90 degrees in the direction of the left panel 15 is arranged. The optical axis of the blue wavelength band light emitted from the blue light source device 300, the optical axis of the green wavelength band light emitted from the fluorescent plate device 100, and the red wavelength emitted from the red light source device 120 by the second dichroic mirror 142. The optical axis of the band light is the same as the optical axis.

A diffuser plate 144 is arranged on the left side panel 15 side of the second dichroic mirror 142. The diffuser plate 144 diffuses the light of each color wavelength band. A microlens array 145 is arranged on the left side panel 15 side of the diffuser plate 144. The microlens array 145 further diffuses each color wavelength band light and superimposes the light transmitted through each microlens array 145 to make the intensity distribution in each wavelength band light uniform.

The microlens in the present embodiment is a lens in which biconvex lenses having a horizontally long rectangular shape in a plan view are arranged in a grid pattern. A condenser lens 147 is arranged on the left panel 15 side of the microlens array 145. The condenser lens 147 concentrates the diffuse uniform light transmitted through the microlens array 145 to the effective size of the display element 51. In this way, the light guide optical system 140 is formed by the first dichroic mirror 141, the second dichroic mirror 142, the diffuser plate 144, the microlens array 145, and the condenser lens 147.

The light source side optical system 170 arranged on the back panel 13 side in the vicinity of the left panel 15 is provided with an optical axis conversion mirror 173 and a condenser lens 174. Since the condenser lens 174 collects the light emitted from the display element 51 and causes it to enter the lens barrel 225, it is also regarded as one of the components of the projection side optical system 220.

The light emitted from the light source device 60 is emitted to the optical axis conversion mirror 173 arranged in the vicinity of the left panel 15. On the other hand, a condenser lens 174 is provided in front of the display element 51. Therefore, the light source light reflected by the optical axis conversion mirror 173 is effectively applied to the display element 51 by the condenser lens 174.

The on-light reflected by the display element 51 is emitted to the screen by the projection side optical system 220 as projected light. The lens barrel 225 of the projection side optical system 220 is a varifocal lens having a fixed lens group and a movable lens group 235 built in the lens barrel 225 and having a zoom function. The movable lens group 235 is capable of zoom adjustment and focus adjustment using a lens motor as a drive source.

By configuring the projection device 10 in this way, when light is emitted from the excitation light irradiation device 70, the red light source device 120, and the blue light source device 300 that irradiate the phosphor plate 101 of the fluorescent plate device 100 at different timings, red light is emitted. Since the green and blue wavelength band light is incident on the display element 51 via the light guide optical system 140 and the light source side optical system 170, the DMD, which is the display element 51 of the projection device 10, is the light of each color according to the data. By displaying the light in a time-divided manner, a color image can be projected on the screen.

Next, the phosphor plate portion 110 of the fluorescent plate apparatus 100 will be described with reference to FIGS. 3 (a) and 3 (b). 3A is a view seen from the emission side of the phosphor plate portion 110, FIG. 3B is a cross-sectional view taken along the line IIIb-IIIb of FIG. 3A, and is viewed from the same direction as the plan view of FIG. It is a figure. The phosphor plate portion 110 includes a phosphor plate 101, a joining plate 102, and a heat sink 103 which is a heat radiating portion.

The phosphor plate 101 is formed in the shape of a substantially square rectangular plate in the front view of FIG. 3A. The phosphor plate 101 can be formed on a green phosphor using a translucent ceramic binder. In addition, the phosphor plate 101 can also be formed by using an inorganic material such as glass, a transparent resin binder, or the like.

The joining plate 102 is formed in the shape of a substantially square rectangular plate in the front view of FIG. 3A. The phosphor plate 101 is fixed to a substantially central position on one surface of the joining plate 102 by brazing or the like. The joint plate 102 is made of a metal base material made of copper, aluminum, or the like, and one surface on which the phosphor plate 101 is provided is mirror-processed by silver vapor deposition or the like. Therefore, when the phosphor plate 101 is irradiated with the excitation light from the excitation light irradiation device 70, which is the blue wavelength band light, the green phosphor in the phosphor plate 101 is excited, and the green wavelength band is omnidirectional from the green phosphor. Light is emitted. At this time, the fluorescent light emitted in the emission direction, which is the direction in which the excitation light irradiation device 70 is arranged, is emitted as the emission light as it is, and the fluorescent light emitted in the direction opposite to the emission direction is mirrored. It is reflected by the surface of the joint plate 102 and emitted in the emission direction.

The surface of the heat sink 103 on one side, which is the emission direction side of the phosphor plate portion 110, is a rectangular flat surface. In the front view of FIG. 3A, one surface of the heat sink 103 and one surface and the other surface of the joining plate 102 have the same shape. A plurality of fins (not shown) are formed on the other side of the heat sink 103. In addition to the heat sink 103, the heat radiating unit may be another device (heat pipe or the like) having a heat radiating function.

A heat conduction region 105 is formed between the other surface of the joint plate 102 and one surface of the heat sink 103. The heat generated from the phosphor plate 101 when irradiated with the excitation light is conducted from the bonding plate 102 to the heat sink 103 via the heat conduction region 105. Specifically, the heat conduction region 105 is defined by the sides h1 and h2 in the joint plate 102 and the gap t1 between the other surface of the joint plate 102 and one surface of the heat sink 103. Then, in the present embodiment, the heat conductive layer 106 is arranged in the heat conductive region 105. The heat conductive layer 106 thermally connects the joining plate 102 and the heat sink 103. The heat conductive layer 106 is formed in the form of a thin sheet and is arranged in close contact with the other surface of the joining plate 102 and one surface of the heat sink 103.

In the heat conductive layer 106, the region corresponding to the phosphor plate 101 in the heat conductive region 105 is formed of the carbon sheet 106a, and the periphery of the region corresponding to the phosphor plate 101 in the heat conductive region 105 is formed of the thermal sheet 106b. To. In the present embodiment, the carbon sheet 106a in the region corresponding to the phosphor plate 101 in the heat conductive region 105 is formed to be larger than the phosphor plate 101 to some extent. Here, the carbon sheet 106a has lower thermal conductivity in the direction from the joint plate 102 to the heat sink 103 than the thermal sheet 106b. In this way, the heat conductive layer 106 is formed by combining materials having different heat conductivity. Therefore, the thermal conductivity of the region corresponding to the phosphor plate 101 in the heat conductive region 105 is formed lower than the thermal conductivity around the region corresponding to the phosphor plate 101 in the heat conductive region 105.

Here, in the carbon sheet 106a, the thermal conductivity in the horizontal direction (direction orthogonal to the exit direction, that is, the in-layer direction parallel to one surface or the other surface of the joint plate 102) is in the vertical direction (emission direction, that is, the joint plate). It has a property higher than the thermal conductivity of one side or the normal direction of the other side of 102. On the other hand, the thermal sheet 106b has uniform thermal conductivity in both the horizontal direction and the vertical direction.

The phosphor plate portion 110 formed in this way generates heat when the irradiation spot S irradiated with the excitation light in the phosphor plate 101 is irradiated with the excitation light. The heat generated from the phosphor plate 101 is transferred to the carbon sheet 106a of the heat conductive layer 106 via the joining plate 102. Since the carbon sheet 106a has the above-mentioned properties, a part of the heat conducted to the carbon sheet 106a via the joint plate 102 is conducted in the vertical direction and conducted to the heat sink 103 as shown by the arrow d1. However, most of the heat is conducted horizontally as shown by arrows d2 and d3. The heat spread in the horizontal direction from the carbon sheet 106a is conducted to the thermal sheet 106b, and as shown by arrows d4 and d5, is conducted to the heat sink 103 via the thermal sheet 106b and dissipated.

FIG. 4 shows a schematic diagram of the heat gradient (isothermal line) in the joining plate 102.
When the heat generated from the phosphor plate 101 is dissipated in this way, heat is conducted in the horizontal direction from the phosphor plate 101, which is a heat generating source, as shown in FIG. 4 (a). The temperature of the other surface of the joint plate 102 becomes close to that of one surface of the joint plate 102, and the heat gradient becomes gentle on the front and back surfaces of the joint plate 102. Therefore, the difference in elongation due to the horizontal thermal expansion between the one-sided side and the other-sided side of the joining plate 102 due to the heat generated by the phosphor plate 101 becomes small, and thus the occurrence of warpage of the joining plate 102 is suppressed.

If the heat conductive layer 106 of the phosphor plate portion 110 is entirely formed of the thermal sheet 106b as conventionally used, the bonding plate 102 has the phosphor plate 101 as shown in FIG. 4 (b). A thermal gradient is generated in a concentric circle in the horizontal direction and a layer in the vertical direction. Then, a difference in elongation occurs between the front and back surfaces of the joint plate 102 due to thermal expansion, warpage of the joint plate 102 occurs, and cracking or peeling of the phosphor plate 101 occurs.

(Modification 1)
Next, a modified example of the embodiment of the present invention will be described. FIG. 5A shows a heat sink 103 in which a rectangular recess 103a is formed on one surface of the heat sink 103 in the region corresponding to the phosphor plate 101 in the heat conduction region 105, and the other surface of the joining plate 102 and the recess 103a are included. The heat conductive layer 106 is provided so as to be in close contact with one surface. At this time, the heat conductive layer 106 can be formed only by the thermal sheet 106b. Since the thermal sheet 106b in the region corresponding to the phosphor plate 101 in the heat conductive region 105 is formed thicker than the periphery of the region corresponding to the phosphor plate 101 in the heat conductive region 105, the phosphor plate in the heat conductive region 105 is formed. The thermal conductivity of the region corresponding to 101 is formed lower than the thermal conductivity around the region corresponding to the phosphor plate 101 in the thermal conductive region 105.

(Modification 2)
In FIG. 5B, a continuous uneven shape 103b having a wavy cross section is formed on one surface of the heat sink 103 in the region corresponding to the phosphor plate 101 in the heat conduction region 105. Then, the heat conductive layer 106 uniformly formed by the thermal sheet 106b is in close contact with the other surface of the joint plate 102 and is in point contact with the uneven shape 103b on one surface of the heat sink 103 to be a flat surface. The periphery of the shape 103b (the periphery of the region corresponding to the phosphor plate 101 in the heat conduction region 105) is in close contact with the surface. Also in this modification, the heat conductivity of the region corresponding to the phosphor plate 101 in the heat conduction region 105 is formed lower than the heat conductivity around the region corresponding to the phosphor plate 101 in the heat conduction region 105.

Contrary to the example of FIG. 5B, one surface of the heat sink 103 around the region corresponding to the phosphor plate 101 in the heat conductive region 105 is formed into an uneven shape, and corresponds to the phosphor plate 101 in the heat conductive region 105. If the region is a flat surface and the heat conductive layer 106 is in close contact with each other on both the uneven shape and the flat surface, the area where the thermal sheet 106b, which is the heat conductive layer 106, comes into contact with one surface of the heat sink 103 is increased in the uneven shape. In this case as well, the heat conductivity of the region corresponding to the phosphor plate 101 in the heat conduction region 105 is formed lower than the heat conductivity around the region corresponding to the phosphor plate 101 in the heat conduction region 105. ..

Further, the heat conductive layer 106 in the heat conductive region 105 does not have to be in close contact with the other surface of the joint plate 102 or the entire surface of one surface of the heat sink 103, and a space is formed in a part of the heat conductive region 105. Is also good.

As described above, according to the embodiment of the present invention, the light source device 60 includes a phosphor plate 101, a bonding plate 102 in which a phosphor plate is arranged on one surface, and a heat conductive region having a heat conductive layer 106. The heat conductivity of the region corresponding to the phosphor plate 101 in the heat conduction region 105 is lower than the heat conductivity around the region corresponding to the phosphor plate 101 in the heat conduction region 105.

As a result, in the region corresponding to the phosphor plate 101 in the heat conduction region 105, the conduction of heat in the vertical direction among the heat generated from the phosphor plate 101 is hindered, so that the heat gradient is gentle on the front and back of the joint plate 102. Therefore, the difference in elongation due to thermal expansion between the front and back surfaces of the joint plate 102 is suppressed, and the warp of the joint plate 102 is reduced. Therefore, cracking and peeling of the phosphor plate 101 due to irradiation with the excitation light are reduced.

Further, the horizontal thermal conductivity of the region corresponding to the phosphor plate 101 in the thermal conductive region 105 can be made higher than the vertical thermal conductivity. As a result, it is possible to suppress the difference in elongation due to thermal expansion between the front and back surfaces of the joint plate 102.

Further, the heat conductive layer 106 can be formed by combining materials having different heat conductivity. As a result, the other surface of the joining plate 102 and one surface of the heat sink 103 can be formed flat, so that the manufacturing of the joining plate 102 and the heat sink 103 can be facilitated.

Further, in the heat conductive layer 106, the region corresponding to the phosphor plate 101 in the heat conductive region 105 is formed by the carbon sheet 106a, and the periphery of the region corresponding to the fluorescent plate 101 in the heat conductive region 105 is formed by the thermal sheet 106b. do. As a result, the heat conductive layer 106 can be formed into a single sheet, so that the assemblability of the phosphor plate portion 110 can be improved.

Further, in the heat conductive layer 106, the thickness of the region corresponding to the phosphor plate 101 in the heat conductive region 105 is thicker than the thickness of the periphery of the region corresponding to the phosphor plate 101 in the heat conductive region 105. Alternatively, the heat sink 103 is formed with a continuous uneven shape 103b on one surface, which is a portion corresponding to the region corresponding to the phosphor plate 101 in the heat conduction region 105. As a result, the heat conductive layer 106 can be formed of a single material, such as by forming the heat conductive layer 106 only with the thermal sheet 106b, so that the heat conductive layer 106 can be easily manufactured.

Further, the heat sink 103 can be used as the heat radiating unit. As a result, the heat sink 103 having a plurality of fins that can be extruded can be formed, so that the heat sink 103 can be easily manufactured.

Further, the projection device 10 includes a light source device 60, a display element 51, a projection side optical system 220, and a projection control unit. Thereby, it is possible to provide the projection device 10 provided with the light source device 60 which reduces the generation of thermal stress due to the irradiation of the excitation light and reduces the cracking and peeling of the phosphor plate 101.

The embodiments described above are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other embodiments, and various omissions, replacements, and changes can be made without departing from the spirit of the invention. These embodiments and variations thereof are included in the scope and gist of the invention, and are also included in the scope of the invention described in the claims and the equivalent scope thereof.

The inventions described in the first claims of the present application are described below.
[1] Fluorescent plate and
A joining plate on which the phosphor plate is arranged on one side,
A heat radiating portion arranged on the other side of the joint plate and
A heat conductive layer that thermally connects the joint plate and the heat radiating portion and is arranged between the joint plate and the heat radiating portion.
Equipped with
A light source device characterized in that the heat conductivity of a region corresponding to the phosphor plate in the heat conductive layer is lower than the heat conductivity around the region corresponding to the phosphor plate in the heat conductive layer.
[2] The light source device according to the above [1], wherein the thermal conductivity is thermal conductivity in the normal direction of the thermal conductive layer.
[3] The heat conductivity in the in-layer direction of the heat conductive layer in the region corresponding to the phosphor plate in the heat conductive layer is higher than the heat conductivity in the normal direction of the heat conductive layer. The light source device according to the above [1] or the above [2].
[4] The light source device according to any one of the above [1] to [3], wherein the heat conductive layer is formed by combining materials having different heat conductivity.
[5] The heat conductive layer is characterized in that the region corresponding to the phosphor plate is formed of a carbon sheet, and the periphery of the region corresponding to the phosphor plate is formed of a thermal sheet [1]. ] To the light source device according to any one of the above [4].
[6] The heat conductive layer is characterized in that the thickness of the region corresponding to the phosphor plate is thicker than the thickness of the periphery of the region corresponding to the phosphor plate. ] The light source device according to any one of.
[7] The light source device according to any one of the above [1] to [6], wherein the heat radiating portion has a concavo-convex shape in which a region corresponding to the phosphor plate and a corresponding portion are continuous. ..
[8] The light source device according to any one of the above [1] to [7], wherein the heat radiating portion is a heat sink.
[9] The light source device according to any one of the above [1] to [8],
A display element that is irradiated with light from the light source from the light source device to form image light, and
A projection side optical system that projects the image light emitted from the display element onto a screen, and
The display element, a projection device control unit that controls the light source device, and
A projection device characterized by having.

10 Projection device 12 Front panel 13 Back panel 14 Right panel 15 Left panel 21 Input / output connector 22 Input / output interface 23 Image converter 24 Display encoder 25 Video RAM
26 Display drive 31 Image compression / decompression 32 Memory card 35 Ir receiver 36 Ir processing 37 Key / indicator 38 Control 41 Light source control circuit 43 Cooling fan drive control circuit 45 Lens motor 47 Voice processing 48 Speaker 51 Display Element 60 Light source device 70 Excitation light irradiation device 71 Blue laser diode 73 Collimeter lens 80 Green light source device 81 Heat shield 100 Fluorescent plate device 101 Fluorescent material plate 102 Bonding plate 103 Heat sink 103a Recess 103b Concavo-convex shape 105 Heat conduction region 106 Heat conduction layer 106a Carbon sheet 106b Thermal sheet 110 Phosphorus plate part 111 Condensing lens group 120 Red light source device 121 Red light source 125 Condensing lens group 130 Heat sink 135 Heat insulation 140 Light guide optical system 141 First dichroic mirror 142 Second dichroic mirror 144 Diffusing plate 145 Micro lens Array 147 Condensing lens 170 Light source side optical system 173 Optical axis conversion mirror 174 Condenser lens 190 Heat shield 191 Heat shield 220 Projection side optical system 225 Lens lens barrel 235 Movable lens group 261 Cooling fan 300 Blue light source device 301 Blue laser diode 320 Collimeter lens

Claims (6)

With a heat conductive layer,
On one side of the heat conductive layer, a phosphor plate indirectly arranged with the heat conductive layer,
A heat radiating portion arranged on the other side of the heat conductive layer,
Equipped with
In the heat conductive layer, the heat conductivity of the first region corresponding to the phosphor plate in the heat conductive layer is higher than the heat conductivity of the second region corresponding to the phosphor plate in the heat conductive layer. A light source device characterized by being low. The heat radiating portion has a recess formed in a region corresponding to the first region of the heat conductive layer on the heat conductive layer side.
The heat conductive layer is arranged so as to be in close contact with the heat radiating portion including the recess, and the thickness of the first region is formed to be thicker than the thickness of the second region. The light source device according to claim 1. The first aspect of the present invention is characterized in that the contact area between the first region of the heat conductive layer and the heat radiating portion is smaller than the contact area between the second region of the heat conductive layer and the heat radiating portion. Light source device. The light source device according to claim 2 or 3 , wherein the heat conductive layer is formed only of a thermal sheet. The light source device according to any one of claims 1 to 4 , wherein the heat radiating unit is a heat sink. The light source device according to any one of claims 1 to 5 .
A display element that is irradiated with light from the light source from the light source device to form image light, and
A projection side optical system that projects the image light emitted from the display element onto a screen, and
The display element, a projection device control unit that controls the light source device, and
A projection device characterized by having.

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