JP2018094546A - Thin film peeling method and manufacturing method of thin film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of continuously peeling a thin film from a base material easily even when the thin film is not flexible and is easy to be broken.SOLUTION: A support body 3 is overlapped with a thin film 2 so that the thin film 2 is exposed to an outside than a pair of both opposite end parts 7 of the support body 3 in a state that the support body 3 is overlapped with the thin film 2 formed on a surface of a base material 1. An adhesive tape 4 is stuck on both end parts 7 of the support body 3 and the thin film 2 so as to bridge each of the end parts of both end parts 7 of the support body 3 and a part of the thin film 2 exposed to the outside than the end parts. One end part except for both end parts 7 of the support body 3 is pulled up, and the support body 3 is separated from the base material 1 so as to peel from a side of the pulled end part in a state that both end parts 7 of the support body 3 and the thin film 2 are stuck by the adhesive tape 4 to peel the thin film 2 together with the support body 3 from the base material 1.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a method of peeling a thin film coated on a base substrate into a desired shape without defects such as tears, scratches, and wrinkles, and a method of manufacturing a thin film using this thin film peeling method.

In recent years, thin films ranging from micron order to nano order have been used as functional materials in various fields such as electronic discs, batteries, and medical materials. As a means for stably forming a thin film, a means for peeling the thin film coated on the base substrate from the base substrate is common. For example, when a thin film is continuously coated on a smooth base substrate such as a film, productivity and cost reduction can be achieved if the thin film can be continuously peeled from the base substrate by roll-to-roll.
However, if the target film is a nano-thickness ultra-thin film, defects such as tears, scratches, and wrinkles are likely to occur when it is peeled off from the base substrate, and technology to prevent these defects is necessary. It is.

  As a method for preventing the above-mentioned defects, Patent Documents 1 and 2 disclose a method in which a resilient annular frame is attached to a thin film and the thin film is peeled off together with the annular frame. In this method, after bonding the annular frame and the thin film, by grabbing a part of the annular frame and pulling it down from the base substrate, the annular frame is bent in a cantilevered manner, and from the left and right peripheral edges that bond the annular frame. Gradually peel off the thin film from the base substrate.

Japanese Patent Laid-Open No. 2-84626 Japanese Patent Laid-Open No. 7-80865

  However, in the methods of Patent Document 1 and Patent Document 2, a pre-molded annular frame is attached only to a portion where a thin film is applied each time, and the annular frame is peeled off. It is difficult to peel off. In addition, since there is a portion where the thin film is not gripped by the annular frame, if the thin film is not flexible and can be easily torn, it cannot be handled, and the film will flutter, causing the thin film to be broken, causing scratches and wrinkles. .

  The present invention provides a method for continuously and easily peeling a thin film from a base substrate without causing breakage, scratches or wrinkles even if the thin film is flexible and easily broken.

1. A first thin film peeling method of the present invention that solves the above problems is a thin film peeling method for peeling a thin film formed on a surface of a base substrate from the base substrate, and includes the following steps A1, A2, and A3. This is a thin film peeling method performed in this order.
Step A1: A step of stacking the support on the thin film formed on the surface of the base substrate, with the support being stacked on the thin film, the thin film exposed outside a pair of opposite ends of the support The process of superimposing the support on the thin film.
Step A2: Adhesive tape is applied to both ends of the support and the thin film so as to straddle the respective ends of the both ends of the support and the thin film portions exposed to the outside of the ends. Attaching process.
Step A3: Cause one end of the support other than the both ends, and from the side of the raised end while the both ends of the support and the thin film are adhered by the adhesive tape The process of peeling a thin film from a base substrate with a support body by separating a support body from the said base base material like peeling.

  2. In the first thin film peeling method of the present invention, in the step A2, the thin film is exposed outside the adhesive tape in a state where the adhesive tape is attached to the both end portions and the thin film of the support. The adhesive tape is attached to both ends of the support and the thin film, and in step A3, the thin film is cracked along the boundary between the adhesive tape and the thin film portion exposed to the outside of the adhesive tape. Then, it is preferable that the thin film of the other part is peeled off from the base substrate together with the support while the thin film portion exposed to the outside of the adhesive tape is left on the base substrate.

  3. In the first thin film peeling method of the present invention, in the step A3, a rod-like body having a length extending over both ends of the support is placed on the support so as to extend over both ends of the support. It is preferable to peel the thin film from the base substrate together with the support while bending the thin film along the rod-shaped body.

  4). In the first thin film peeling method of the present invention, before the step A1, the outer side of the other end from the position that is the outer side of one end of the pair of opposing ends of the support in the step A1. A straight cut reaching the base substrate from the surface of the thin film is made over the position where the thin film is peeled from the base substrate together with the support in the step A3. It is preferable to set the position to start.

  5. In the first thin film peeling method of the present invention, in the step A1, the first thin film peeling method may further include an outer side of one end of the other pair of opposite ends of the support. The support is overlaid on the thin film so that the thin film is exposed. Between the step A1 and the step A2, along the one end of the other pair of ends of the support, the support is more than the support. Outside, a straight cut reaching the base substrate from the surface of the thin film is made, and in the step A3, the end portion of the support along which the straight cut is formed, It is preferable to do.

  6). In the first thin film peeling method of the present invention, in the step A3 in the preferred embodiment of the above 4 or 5, a rod-shaped material having a length extending over the both end portions of the support is formed in the vicinity of the linear cut. It is preferable that the thin film is peeled from the base substrate together with the support while being placed on the support so as to extend over both ends of the support and bending the support and the thin film along the rod-shaped material.

  7). In the first thin film peeling method of the present invention, it is preferable that the both ends of the support are parallel.

8). The second thin film peeling method of the present invention that solves the above problems is a thin film peeling method for peeling a thin film formed on the surface of a base substrate from the base substrate, and includes the following steps B1, B2, and B3. This is a thin film peeling method performed in this order.
Step B1: A step of stacking the support on the thin film formed on the surface of the base substrate, and supporting the thin film so that the thin film is exposed outside the periphery of the support in a state where the support is stacked on the thin film. The process of layering the body on a thin film.
Step B2: A step of attaching an adhesive tape to the periphery of the support and the thin film so as to straddle the periphery of the support and the portion of the thin film exposed from the periphery.
Step B3: A part of the peripheral edge of the support is raised, and the base is removed from the raised part while the peripheral edge of the support and the thin film are adhered by the adhesive tape. The process of peeling the thin film from the base substrate together with the support by separating from the material.

  9. In the second thin film peeling method of the present invention, in step B2, the adhesive tape is attached to the peripheral edge of the support and the thin film so that the thin film is exposed outside the adhesive tape. Adhering the adhesive tape to the periphery of the support and the thin film, and in the step B3, causing the thin film to crack along the boundary between the adhesive tape and the thin film portion exposed to the outside of the adhesive tape. It is preferable to peel the thin film of the other part together with the support from the base substrate while leaving the thin film portion exposed outside the adhesive tape on the base substrate.

  10. In the second thin film peeling method of the present invention, in step B3, a rod-shaped body is placed on the support, and the support and the thin film are bent along the rod-shaped body, and the thin film is formed on the base substrate together with the support. It is preferable to peel from. At this time, it is preferable that the rod-shaped body has a length that allows the entire support body to be aligned without protruding from the support body.

  11. In the method for producing a thin film of the present invention, a coating liquid is applied on one surface of a base substrate, and the coating liquid is dried to produce a base substrate on which a thin film is formed. A thin film manufacturing method for obtaining the thin film by peeling the thin film from the base substrate by a thin film peeling method or a second thin film peeling method.

  According to the first thin film peeling method of the present invention, the thin film is peeled from the base substrate together with the support while the both ends of the support and the thin film are adhered, and the thin film is supported by the entire support. Therefore, even a thin film that is not flexible and easily breaks can be peeled without causing tearing, scratching, or wrinkling.

  Moreover, according to the preferable first thin film peeling method of the present invention, the adhesive tape is exposed so that the thin film is exposed to the outside of the adhesive tape in a state where the adhesive tape is attached to both ends and the thin film of the support. Is affixed to both ends of the support and the thin film to intentionally generate a crack that is the starting point of peeling along the boundary with the thin film part exposed outside the adhesive tape. The thin film can be peeled from the base substrate stably and continuously.

  According to the second thin film peeling method of the present invention, the support is overlaid on the thin film so that the thin film is exposed outside the periphery of the support, and the periphery of the support and the thin film exposed from the periphery. The adhesive tape is applied to the periphery and thin film of the support so that it extends over the part of the substrate, and a part of the periphery of the support is peeled off to form a circle, ellipse, square, polygon, etc. Even a thin film having a deformed shape can be peeled off without wrinkling or tearing.

It is sectional drawing which shows typically embodiment of the 1st thin film peeling method of this invention. It is a schematic diagram which shows the top view of embodiment of FIG. It is a schematic diagram which shows the peeling process in embodiment of FIG. It is a schematic diagram which shows the method of peeling continuously by roll to roll using the 1st thin film peeling method of this invention. It is sectional drawing which shows typically embodiment of the 2nd thin film peeling method of this invention. It is a schematic diagram which shows the upper side figure of embodiment of FIG. It is a schematic diagram which shows the peeling process in embodiment of FIG. It is the schematic diagram which provided the notch which determines the peeling start position in embodiment of FIG. It is a schematic diagram which shows the peeling process in embodiment of FIG. It is the schematic diagram which provided the notch which determines a peeling start position by the method different from FIG. It is a schematic diagram which shows the peeling process in embodiment of FIG. It is a schematic diagram which shows the method of peeling continuously by roll to roll in embodiment of FIG. It is a schematic diagram which shows the method of making a notch | incision when peeling continuously by roll to roll in embodiment of FIG. It is a schematic diagram which shows the method of peeling continuously by the roll toe roll in embodiment of FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. However, the present invention is not limited to these.

[Embodiment of First Thin Film Stripping Method]
First, an example of an embodiment of the first thin film peeling method of the present invention will be described with reference to FIG. FIG. 1 is a cross-sectional view schematically showing the configuration of the first thin film peeling method of the present invention.

  Please refer to FIG. In the peeling method of the present invention, the thin film 2 applied to the base substrate 1 is peeled from the base substrate 1 using the support 3, the adhesive tape 4, and the rod-like body 5. Hereinafter, each component will be described in detail.

  The base substrate 1 is a base material for applying the thin film 2, and it is preferable to use a substrate having a surface roughness that does not penetrate the thin film so that the thin film 2 can be applied uniformly. The base substrate 1 may be a glass substrate or a silicon wafer, but is preferably a flexible material such as a film that can be continuously applied and conveyed by roll-to-roll.

  When the thin film 2 is thick to some extent, the thin film can be peeled from the base substrate 1 without using the thin film peeling method of the present invention. Therefore, the thickness of the thin film 2 is preferably such that the effect of the thin film peeling method of the present invention is manifested, specifically 0.01 μm to 200 μm. The thin film 2 is formed by continuously transporting a flexible base substrate 1 such as a film by roll-to-roll and continuously coating the coating liquid uniformly with a die or a gravure coater. Is preferred.

  The support 3 transfers the peeled thin film 2 so that the peeled thin film 2 is not torn and scratches, wrinkles, etc. are generated, and at the same time, the support 3 is smooth and flexible to follow the thin film in order to improve handling properties after peeling. Any material can be used. As such a material, a PET film having a thickness of 50 to 100 μm is preferable.

  The pressure-sensitive adhesive tape 4 is preferably a pressure-sensitive adhesive tape having a pressure-sensitive adhesive surface for bonding the thin film 2 coated on the base substrate 1 and the support 3 only on one side. The thickness of the pressure-sensitive adhesive tape is preferably 0.07 mm or less in order to contact the support 3 and the rod-shaped body 5 without forming a gap when bent along the rod-shaped body 5. The material of the base material of the adhesive tape 4 and the adhesive are not particularly defined, but preferably have an adhesive strength of 1.0 N / 10 mm or more.

  The material of the rod-shaped body 5 is not particularly defined, but the thin film 2 is peeled from the base substrate 1 together with the support 3 while bending the thin film 2 and the support 3 along the rod-shaped body. A substantially straight roll having a diameter of 10 to 150 mm that does not bend so that it can move with peeling while applying a uniform tension is preferable.

  Next, the first thin film peeling method of the present invention will be described with reference to FIGS. FIG. 2 is a top view of FIG. 1, and FIG. 3 is a schematic view showing a peeling process.

  The support 3 is overlaid on the surface of the base substrate 1 on which the thin film 2 has been applied in advance (step A1). In step A1, the thin film 2 is overlaid so as to be exposed outside the pair of opposite end portions 7 of the support 3. That is, the width W2 of the support 3 is narrower than the width W1 of the thin film 2.

  Next, the adhesive tape 4 is affixed so that it may straddle each edge part of a pair of both ends 7 which the support body 3 opposes, and the thin film 2 exposed outside the edge part (process A2).

  Further, one end portion of the support body 3 to which the adhesive tape 4 is attached is peeled off while bending along the rod-shaped body 5 except for the opposite end portions, and the pair of opposite end portions 7 of the support body 3 and the thin film. As shown in FIG. 3, the thin film 2 is peeled from the base substrate 1 with the 2 attached (step A <b> 3).

  In step A2, the reason for applying the adhesive tape 4 so as to straddle the respective ends of the pair of opposite end portions 7 of the support 3 and the thin film 2 exposed outside the ends is as follows. It is as follows. In the bonding portion 17 between the thin film 2 and the adhesive tape 4, a shearing force is generated in the bonding portion 17 between the force for peeling the thin film 2 from the base substrate 1 and the bonding force between the base substrate 1 and the thin film 2. A crack can be intentionally generated. More preferably, the adhesive tape 4 is attached to both ends of the support 3 so that the thin film 2 is exposed to the outside of the adhesive tape 4 in a state where the adhesive tape 4 is attached to both ends 7 of the support 3 and the thin film 2. 7 and the thin film 2. This starts from the bonding boundary 6 between the thin film 2 and the adhesive tape 4, and the shearing force between the force for peeling the thin film 2 from the base substrate 1 and the force for bonding the base substrate 1 and the thin film 2 is more locally concentrated. By doing so, a crack is intentionally generated at the bonding boundary 6. As a result, the thin film 2 in other portions is peeled off while leaving a part of the thin film 2 exposed outside the adhesive tape 4 on the base substrate 1. That is, since the adhesion boundary 6 becomes a starting point of peeling, a crack can be stably formed along the adhesion boundary 6, and it is possible to prevent a break due to a crack other than the adhesion boundary 6. This is an effective method for continuously peeling 2.

  In step A3, the peeling tension at which the thin film 2 is peeled off from the base substrate 1 can be made uniform at the peeling point 8 in the width direction of the thin film 2 by peeling it so as to be bent along the rod-like body 5. If the difference in the peel tension in the width direction is not uniform, the small part will be delayed and peeled in comparison with the part where the peel tension is large, and a shear force will act between the part where the peel tension is large and the small part. , Random tearing of the thin film 2 may occur. By using the rod-shaped body 5, such a phenomenon can be eliminated. Although the rod-like body 5 depends on the width of the base substrate 1, it is preferable to use a roll that does not bend. Further, the smaller the rod-like body 5 is, the smaller the contact area with the support 3 is, and it is possible to uniformly apply a peeling tension in the width direction. On the other hand, when the rod-shaped body 5 is too small in diameter, there is a concern that the rod-shaped body 5 cannot be uniformly contacted in the width direction due to the bending of the rod-shaped body 5 itself, and uniform peeling tension cannot be applied. Therefore, it is preferable to select a diameter at which the rod-shaped body 5 does not bend according to the length of the rod-shaped body 5. Moreover, since the peeled thin film 2 is supported by the support body 3, the handling property can be improved and the peeled thin film 2 can be prevented from being broken. As described above, the thin film 2 can be uniformly peeled from the base substrate 1 without the thin film 2 being broken except at the bonding boundary 6.

[Thin film peeling method by roll-to-roll]
Next, one method for continuously peeling by roll-to-roll using the first thin film peeling method of the present invention will be described with reference to FIG. FIG. 4 is a schematic diagram in the case of continuous peeling with a roll-to-roll using the first thin film peeling method of the present invention.

  The apparatus configuration shown in FIG. 4 includes unwinding A9, unwinding B10, winding A11, winding B12, backup roll 13, nip roll A14, nip roll B15, and rod-shaped body 5. Although not shown, unwinding A9, unwinding B10, winding A11, winding B12, and backup roll 13 are driven by, for example, a servo motor to control the conveyance speed and tension.

  A roll-shaped support 3 is set for unwinding A9, and a roll-shaped base substrate 1 on which a thin film 2 has been applied in advance is set for unwinding B10. The set base material 1 and the support 3 are unwound, and the support 3 is superposed on the thin film 2 on the base material 1 on the backup roll 13. In order to prevent displacement of the support 3 and air from entering between the thin film 2 and the support 3, nip is performed by the nip roll A <b> 14. If air enters between the thin film 2 and the support 3, the balance of the peeling tension is broken in the width direction at the time of peeling, and the thin film 2 is broken.

  And each edge part of a pair of opposing both ends 7 of the support body 3 piled up on the surface by which the thin film 2 on the base substrate 1 was coated, and the thin film 2 exposed outside the edge parts. The adhesive tape 4 fed out from the two-strand adhesive tape core 16 is attached and niped by the nip roll B15. By using the support body 3 whose both end portions 7 are parallel, the adhesive tape 4 can be continuously attached. Then, the support 3 is peeled off together with the thin film 2 so as to be bent along the rod-shaped body 5, and the support 3 is wound together with the thin film 2 by winding A11, and the base substrate 1 is wound by winding B12. At this time, peeling tension can be kept constant in the width direction by applying tension by winding A11 and winding B12.

[Second thin film peeling method]
Next, an example of an embodiment of the second thin film peeling method of the present invention will be described with reference to FIGS. FIG. 5 is a sectional view schematically showing the second thin film peeling method. FIG. 6 is a schematic view of the upper surface of FIG.

  Please refer to FIG. 5 and FIG. The second embodiment is the first embodiment except that the circular thin film 102 is formed on the base substrate 101 and the adhesive tape 104 is attached to the entire periphery of the circular support 103. FIG. It is the same composition as.

  The thin film 102 is circularly coated on the base substrate 101, but there is no limitation on the shape such as an ellipse or an irregular shape.

  Next, a method of peeling the thin film 102 without tearing and wrinkling by the second thin film peeling method will be described with reference to FIGS. FIG. 7 is a schematic view showing a peeling process in the second thin film peeling method of the present invention.

  Please refer to FIG. 6 and FIG. First, the support body 103 is overlaid on the surface on which the thin film 102 is coated on the base substrate 101 (step B1).

  Next, the adhesive tape 104 is attached to the peripheral portion 107 of the support 103 and the thin film 102 so as to straddle the portion of the thin film 102 exposed from the peripheral portion 107 of the support 103 (step B2).

  Further, a part of the peripheral portion 107 of the support body 103 is peeled off, and the support body is bent while being bent along the rod-like body 105 while the peripheral edge portion 107 of the support body 103 and the thin film 102 are adhered by the adhesive tape 104. By peeling off 103 from the base substrate 101, the thin film 102 is peeled from the base substrate 101 together with the support 103 (step B3).

  By attaching the adhesive tape 104 to the peripheral portion 107 and the thin film 102 of the support 103 so as to straddle the exposed portion of the thin film 102 rather than the peripheral portion 107 of the support 103 in step B2, the thin film has a circular or irregular shape. Even in the case of the thin film, a shearing force between the force for peeling the thin film 102 from the base substrate 101 and the force for bonding the base substrate 101 and the thin film 102 at the bonding portion 109 between the thin film 102 and the adhesive tape 104 is the bonding portion 109. It is possible to intentionally generate a crack. More preferably, the adhesive tape 104 is attached to the periphery of the support 103 such that the thin film 102 is exposed to the outside of the adhesive tape 104 in a state where the adhesive tape 104 is attached to the periphery 107 of the support 103 and the thin film 102. 107 and the thin film 102. As a result, the adhesive boundary 106 between the adhesive tape 104 and the thin film 102 is a starting point, and the shearing force of the force that peels the thin film 102 from the base substrate 101 and the force that bonds the base substrate 101 and the thin film 102 is more locally concentrated. As a result, a crack is intentionally generated along the bonding boundary 106. In other words, the generation of cracks other than the adhesive boundary 106 can be prevented by peeling the thin film 102 in other portions while leaving the portion of the thin film 102 exposed outside the adhesive tape 104 on the base substrate 101. Can do.

  In the process B3, by causing it to bend along the rod-shaped body 105, the thin film 102 is formed into the base substrate 101 for the same reason as in the case of peeling using the rod-shaped body 5 in the process A3 of the first thin film peeling method. It is possible to make the peeling point 108 that peels from the substrate uniform in the width direction of the thin film 102. Further, since the peeled thin film 102 is supported by the support 103, the handling property can be improved and the peeled thin film 102 can be prevented from being broken. As described above, even if the thin film has a non-rectangular shape such as a circular shape or an irregular shape, the thin film 102 can be uniformly peeled from the base substrate 101 without being broken except at the bonding boundary 106.

[Thin film manufacturing method]
If the first thin film peeling method and the second thin film peeling method described so far are used, a thin film can be easily formed. Specifically, a coating liquid was applied to one surface of the base substrate 1 (101), and the coating liquid was dried to produce a base substrate 1 (101) on which a thin film 2 (102) was formed. Then, the thin film 2 (102) free from breakage, scratches and wrinkles is obtained by peeling the thin film 2 (102) from the base substrate 1 (101) by the first thin film peeling method or the second thin film peeling method. Can do.

[Another embodiment of first thin film peeling method]
Next, a method for setting the peeling start position for peeling the thin film 2 from the base substrate 1 to a specific position will be described with reference to FIGS. FIG. 8 is a schematic view in which a cut for defining a peeling start position is provided in the embodiment of FIG. FIG. 10 is a schematic view in which a cut is given by a method different from that in FIG. FIG. 9 is a schematic diagram showing a peeling process in the embodiment of FIG. 8, and FIG. 11 is a schematic diagram showing a peeling process in the embodiment of FIG.

  Please refer to FIG. The embodiment of FIG. 8 is the same as the embodiment of FIG. Hereinafter, the method for determining the peeling start position will be described in detail.

  Before the step A1 of superimposing the support 3 on the surface of the base substrate 1 coated with the thin film 2, a straight cut 18 reaching the base substrate 1 from the surface of the thin film 2 is made. The length of the notch 18 is such that the both ends of the notch 18 are outside the respective positions where the both ends 7 of the support come when the support 3 is overlapped. More preferably, the cut 18 reaches the outside of the adhesive boundary 6 between the adhesive tape 4 and the thin film 2. The method of making the cut 18 is not particularly limited as long as it is a method that breaks through the thin film 2 and does not break through the base substrate 1. Can be provided.

  Next, as in the embodiment of the first thin film peeling method of FIG. 2, one end portion other than both end portions to which the adhesive tape 4 of the support 3 is attached is caused. Here, a crack is intentionally generated at the bonding boundary 6 to start peeling of the thin film 2 from the base substrate 1. And when the raise of the support body 3 reaches the notch 18, the crack by the adhesion boundary 6 and the crack by the notch 18 are connected, and the thin film 2 peels from the base substrate 1 with the full width of the support body 3 starting from the notch 18. The peeling start position can be determined.

  Further, when placing the rod-shaped body 5 in the step A3, by placing the rod-shaped body 5 in the vicinity of the cut 13, it is possible to apply a straight and uniform peeling tension to both ends of the support 3 to which the adhesive tape 4 is attached. Therefore, it is preferable.

  Reference is now made to FIG. In the embodiment of FIG. 10, the support 3 is overlaid on the thin film 2 such that the exfoliated film 2 is exposed outside one end other than the both ends 7 to which the adhesive tape 4 is attached. In addition, a cut 18 is provided along the one end portion. The rest is the same as the embodiment of FIG.

  Details of the embodiment of FIG. 10 will be described. In step A1, the thin film 2 is exposed to the outside of one end of the other pair of both ends different from the pair of opposite ends 7 to which the adhesive tape 4 of the support 3 is attached. The support 3 is overlaid on the thin film 2. And between the process A1 and the process A2, along the edge part which exposed the said thin film 2 of the support body 3, the linear notch 18 which reaches the base base material 1 from the surface of the thin film 2 is made. The length of the cut 18 is such that both ends of the cut 18 are outside the both end portions 7 of the support 3. The end of the support 3 serves as a guide when the cut 13 is provided, and it is easy to make a straight cut. Subsequent steps are the same as those in the first embodiment. However, since the end portion that causes the support 3 and the cut 18 are in the same position, the peeling start position can be accurately determined.

  Further, when placing the rod-shaped body 5 in the step A3, by placing the rod-shaped body 5 in the vicinity of the cut 13, it is possible to apply a straight and uniform peeling tension to both ends of the support 3 to which the adhesive tape 4 is attached. Therefore, it is preferable.

  Next, one method of continuously peeling roll-to-roll using the thin film peeling method in the embodiment of FIG. 8 will be described with reference to FIG. FIG. 12 is a schematic view showing a method of continuously peeling by roll-to-roll in the embodiment of FIG. A roll toe is used by using the first thin film peeling method of the present invention except that a cut 18 is given to the thin film 2 coated on the base substrate 1 between the unwinding B10 and the nip roll A14. -It is the same as FIG. 4 which is a schematic diagram in the case of peeling continuously with a roll.

  First, the support 3 unwound from the unwinding A9 and the base substrate 1 unwound from the unwinding B10 are passed through the nip roll A14, and the conveyance of the base substrate 1 and the support 3 is once stopped. Then, the position where the base substrate 1 and the support 3 are overlapped by the nip roll A14 is confirmed, and the front end of the notch 18 is sharper than the support 3 before the nip roll A14 so that the start end and the end are outside. Scratch at once with a needle, drill or flathead screwdriver. Further, if the cut 18 is made in the entire width of the thin film 2, the start end and the end of the cut 18 can be surely placed outside the support 3. The subsequent steps are the same as those in FIG. When the position where the cut 18 is made passes through the rod-shaped body 5, the cut 18 and a crack generated at the boundary between the adhesive tape 4 and the thin film 2 are connected, and the thin film 2 can be reliably peeled off from the cut 18.

  Next, one method for continuously peeling by roll-to-roll using the thin film peeling method in the embodiment of FIG. 10 will be described with reference to FIGS. The apparatus configuration of FIG. 13 is the same as that of FIG. Before the support 3 unwound from the unwinding A9 passes through the nip roll A14 and reaches the nip roll B15, the conveyance of the base substrate 1 and the support 3 is once stopped. Then, the notch 18 is formed by scratching at once with a sharp needle, a drill or a flat-blade screwdriver along a step formed by overlapping the end portion of the support 3 and the base substrate 1. Thereafter, the lead 19 which is the same member as the support 3 is attached to the end of the support 3 with the lead adhesive tape 20, and the adhesive tape 4 is set in the same manner as in FIG. As shown in FIG. 14, the peeling process after setting is the same as that of the embodiment of FIG.

Example 1
The thin film was peeled in the embodiment of the first thin film peeling method of FIG.
A full-width PET film having a thickness of 100 μm and a width of 400 mm was prepared on the base substrate 1, and polyvinyl alcohol was applied to the base substrate 1 with a film thickness of 10 μm and a width W1 = 350 mm using a die to form a thin film 2.
The thin film 2 was overlaid with a PET film, which is a support 3 having a thickness of 50 μm and a width W2 = 300 mm, so that the thin film 2 was exposed from a pair of opposing ends.

  Further, an adhesive tape 4 having a width of 25 mm was attached so as to straddle the thin film 2 exposed outside the respective end portions of the pair of both end portions 7 of the support 3. At this time, the adhesive tape was affixed so that the thin film 2 might be exposed outside the adhesive tape 4.

  Then, one portion of the end portion of the support 3 that was not attached with the adhesive tape 4 was caused, and the support 3 was peeled off while being bent along the rod-shaped body 5 of a SUS roll having a diameter of 20 mm and a length of 400 mm. However, a crack occurred in the thin film 2 along the adhesive boundary 6 between the adhesive tape 4 and the thin film 2, and the thin film 2 could be peeled stably without being broken in a region in contact with the support 3.

(Example 2)
Using the same member as in Example 1, peeling was performed by the thin film peeling method of the embodiment of FIG.
A straight cut 18 was made using a flat-blade screwdriver over the entire width of the coating width W1 = 350 mm of the thin film 2 coated on the base substrate 1. And it overlap | superposed so that the thin film 2 might be exposed from a pair of both ends which oppose the PET film which is the support body 3, and peeled in the same procedure as Example 1 after that. When the cause of the support 3 reaches the cut 18, a crack caused by the adhesion boundary 6 and a crack caused by the cut 18 are connected, and the thin film 2 can be peeled from the base substrate 1 with the full width of the support 3 starting from the cut 18. .

(Example 3)
Using the same member as in Example 1, thin film peeling of the embodiment of FIG. 10 was performed. The support 3 is thinned so that the thin film 2 is exposed to the outside of one end of the other pair of opposite end portions to which the opposite end portion 7 to which the support 3 and the adhesive tape 4 are attached is attached. 2 overlaid. And the straight notch 18 which reaches the base base material 1 from the surface of the thin film 2 was formed along the edge part of the support body 3 using the minus driver. The length of the notch 18 was set such that the start end and the end were 10 mm outside the both ends 7 of the support 3. And when the support body 3 was caused, the peeling start position could be accurately determined because the end portion causing the support body 3 and the cut 18 were at the same position.

  INDUSTRIAL APPLICATION This invention can be utilized for the process of peeling the thin film coated and formed on the base substrate continuously and stably.

DESCRIPTION OF SYMBOLS 1 Base base material 2 Thin film 3 Support body 4 Adhesive tape 5 Rod-shaped body 6 Bonding boundary 7 Both ends 8 Peeling point 9 Unwinding A
10 Unwind B
11 Winding A
12 Winding B
13 Backup roll 14 Nip roll A
15 Nip roll B
16 Adhesive Tape Core 17 Adhesion 18 Notch 19 Lead 20 Lead Adhesive Tape 101 Base Substrate 102 Thin Film 103 Support 104 Adhesive Tape 105 Bar-Shaped Body 106 Adhesive Boundary 107 Peripheral Edge 108 Peeling Point 109 Adhesive W1 Thin Film 2 Width W2 Support Width of 3

Claims (11)

A thin film peeling method for peeling a thin film formed on a surface of a base substrate from the base substrate, wherein the following steps A1, A2 and A3 are performed in this order.
Step A1: A step of stacking the support on the thin film formed on the surface of the base substrate, with the support being stacked on the thin film, the thin film exposed outside a pair of opposite ends of the support The process of superimposing the support on the thin film.
Step A2: Adhesive tape is applied to both ends of the support and the thin film so as to straddle the respective ends of the both ends of the support and the thin film portions exposed to the outside of the ends. Attaching process.
Step A3: Cause one end of the support other than the both ends, and from the side of the raised end while the both ends of the support and the thin film are adhered by the adhesive tape The process of peeling a thin film from a base substrate with a support body by separating a support body from the said base base material like peeling. In the step A2, the adhesive tape is attached to both ends of the support so that the thin film is exposed outside the adhesive tape in a state where the adhesive tape is attached to the both ends and the thin film of the support. Pasted on a thin film,
In the step A3, the thin film is exposed outside the adhesive tape by causing a crack in the thin film along a boundary between the adhesive tape and the thin film portion exposed outside the adhesive tape. While remaining on the base substrate, the other part of the thin film is peeled from the base substrate together with the support.
The thin film peeling method according to claim 1.   In the step A3, a rod-shaped material having a length extending over both ends of the support is placed on the support so as to extend over both ends of the support, and the support and the thin film are placed along the rod-shaped material. The thin film peeling method according to claim 1, wherein the thin film is peeled from the base substrate together with the support while being bent. Before the step A1, from the surface of the thin film to the position outside the one end of the pair of opposing ends of the support in the step A1 to the outside the other end, the surface of the thin film Make a straight notch that reaches the base substrate,
In the step A3, the position of the straight cut, a position where the thin film starts to release peeling from the base material together with the support,
The thin film peeling method according to claim 1 or 2. In the step A1, the support is formed into a thin film so that the thin film is exposed to the outside of one end of the other pair of opposite ends of the pair of opposite ends of the support. Repeatedly
Between the step A1 and the step A2, along the one end of the other pair of both ends of the support, outside the support and from the surface of the thin film to the base substrate Make a straight cut to reach,
In the step A3, the end portion of the support body along which the linear cut is formed is the end portion that causes the support body,
The thin film peeling method according to claim 1 or 2.   In the step A3, a rod-like body having a length over the both ends of the support is placed on the support in the vicinity of the linear notch so as to cover both ends of the support, and the support and the The thin film peeling method of Claim 4 or 5 which peels a thin film from a base base material with a support body, bending a thin film along a rod-shaped body.   The thin film peeling method according to claim 1, wherein the both ends of the support are parallel. A thin film peeling method for peeling a thin film formed on a surface of a base substrate from the base substrate, wherein the following steps B1, B2 and B3 are performed in this order.
Step B1: A step of stacking the support on the thin film formed on the surface of the base substrate, and supporting the thin film so that the thin film is exposed outside the periphery of the support in a state where the support is stacked on the thin film. The process of layering the body on a thin film.
Step B2: A step of attaching an adhesive tape to the periphery of the support and the thin film so as to straddle the periphery of the support and the portion of the thin film exposed from the periphery.
Step B3: A part of the peripheral edge of the support is raised, and the base is removed from the raised part while the peripheral edge of the support and the thin film are adhered by the adhesive tape. The process of peeling the thin film from the base substrate together with the support by separating from the material. In the step B2, the adhesive tape is attached to the peripheral edge of the support and the thin film so that the thin film is exposed outside the adhesive tape in a state where the adhesive tape is attached to the peripheral edge of the support and the thin film. Pasted on,
In the step B3, the thin film portion is exposed outside the adhesive tape by causing a crack in the thin film along the boundary between the adhesive tape and the thin film portion exposed outside the adhesive tape. The thin film of the other part is peeled off from the base substrate together with the support while leaving the base substrate.
The thin film peeling method according to claim 8. In the step B3, a rod-shaped material is placed on the support, and the support and the thin film are bent along the rod-shaped body, and the thin film is peeled off from the base substrate together with the support.
The thin film peeling method according to claim 8 or 9, wherein the rod-like body has a length that allows the whole support body to run along without the support body protruding.   A base material on which a thin film is formed by applying a coating liquid on one surface of a base substrate and drying the coating liquid, and then producing the base by the thin film peeling method according to claim 1. A method for producing a thin film, wherein the thin film is obtained by peeling the thin film from a substrate.

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