JP2018093172A - Sealing structure of Peltier module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To realize a sealing structure of Peltier module having sufficient performance according to use environment.SOLUTION: A sealing frame for sealing a Peltier module between plate-like members, when installing the Peltier module while sandwiching with the plate-like members from above and below includes an enclosure member, i.e., a frame surrounding the Peltier module, an intervening member for sealing a space surrounded by the plate-like members and the enclosure member, by intervening between the plate-like members over the whole circumference of the frame in the enclosure member on the upper and lower surfaces thereof, and a conduction member for conducting the conductor of the Peltier module in the inside and outside direction of the enclosure member, in a partial region of the enclosure member.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a sealing structure for sealing a Peltier module.

  The Peltier module generally has a configuration in which a pair of substrates is sealed with a sealing material such as a resin material so that the Peltier module is sealed in a space between the substrates (see Patent Documents 1 and 2).

JP 2001-185769 A JP 2000-286460 A

  However, in the above-described configuration, for example, when sealing with a silicone-based resin material, water vapor permeation, and when sealing with an epoxy-based resin material, as a sealing structure in terms of heat resistance and flexibility, It cannot be said that a sealing structure having sufficient performance according to the use environment has been realized with only the sealing material, such as difficulty in performance.

  The present invention has been made to solve such problems, and an object of the present invention is to realize a sealing structure having sufficient performance in accordance with the use environment.

  In order to solve the above problems, a first aspect is a sealing frame for sealing the Peltier module between the plate members when the Peltier module is sandwiched and installed between the plate members from above and below, By surrounding the surrounding member which is a frame surrounding the periphery of the Peltier module, and the plate-like member between the upper and lower surfaces of the surrounding member and the plate-like member over the entire circumference of the frame in the surrounding member, A sealing frame comprising: an interposition member that seals a space surrounded by the surrounding member; and a conductive member that conducts the conductive wire of the Peltier module inward and outward of the surrounding member in a partial region of the surrounding member. It is.

  If it is this aspect, it has sufficient performance according to use environment by selectively using the material according to required performance, such as water vapor transmission, heat resistance, and flexibility, as the surrounding member and the interposition member. A sealing structure can be realized.

Further, in this aspect, it is conceivable to perform the following second aspect.
In this aspect, the conductive member is a plate-shaped or bar-shaped conductive member arranged so as to penetrate the surrounding member inward and outward, and the conductive wire is connected to the member by connecting the conductive wire of the Peltier module to the member. Conduction is conducted in the inner and outer directions of the surrounding member.

  In this aspect, the conducting member, which is a rod-like or plate-like conductive member, can conduct the conductive wire of the Peltier module in the inner and outer directions of the surrounding member. In particular, since the conducting member is a rod-like or plate-like member, there is no gap in the member itself that allows liquid or gaseous components such as stranded wires or coated wires to flow inside and outside, thereby providing a sealing structure. High sealing performance can be maintained.

Moreover, in this aspect, you may make it like the 3rd aspect shown below.
In a third aspect, the conductive member is connected to a region located outside the surrounding member in the conductive member, and the external conductive wire is a conductive wire for energizing the Peltier module via the conductive member; And a covering member that covers a region located outside the surrounding member together with a connecting portion with the external conductor and a boundary portion with the surrounding member, and blocks the region from the outside space.

  If it is this situation, since the surrounding member and the covering member can prevent the conducting member from coming into contact with the outer space, the covering member is selectively made of a material having performance according to the use environment. As a result, the sealing performance as the sealing structure can be maintained high even under a more severe use environment.

Moreover, in the said 2nd, 3rd aspect, you may make it like the 4th aspect shown below.
In the fourth aspect, either one of or both of the inner and outer ends of the surrounding member protrudes from the surrounding member and is displaced toward the lower plate-shaped member.

  In this aspect, since the end side of the conducting member protrudes from the surrounding member and is displaced downward, a vertical space can be secured between the upper plate-like member and the end side of the conducting member. The space can be effectively used as a connection space for the conductive wires.

  Moreover, in each aspect mentioned above, in the said plate-shaped member, when the surrounding contact area | region which is an area | region which contacts the said surrounding member, and the module contact area | region which is an area | region which contacts the said Peltier module are the same height It is good to carry out like 5th aspect shown below. On the other hand, in at least one of the plate-like members, the surrounding contact region that is a region that contacts the surrounding member protrudes in the positive direction or the negative direction with respect to the module contact region that is a region that contacts the Peltier module. If so, the sixth aspect shown below may be used.

  5th aspect WHEREIN: The said interposed member is formed with the member which can be compressed and deformed by interposing between the said surrounding member and the said plate-shaped member, The height of the said surrounding member is at least this surrounding member It is lower than the Peltier module by a height that is the sum of the distances secured by each of the interposition members compressed and deformed with the plate member.

  6th aspect WHEREIN: The height of the said surrounding member is the space | interval ensured by each of the said interposed member compressed and deformed between this surrounding member and the said plate-shaped member, and each in the said plate-shaped member It is lower than the Peltier module by a height that is the sum of the protruding amount of the surrounding contact region with respect to the module contact region.

  If it is these aspects, the space enclosed by the plate-shaped member and the surrounding member can be sealed by the surrounding member and the interposed interposed member, while the plate-shaped member and the Peltier module are sufficiently brought into contact with each other.

  In particular, in the sixth aspect, the space surrounded by the plate-like member and the surrounding member while sufficiently contacting the plate-like member and the Peltier module regardless of the height difference between the surrounding contact surface and the module contact surface. Can be sealed.

Moreover, in each aspect mentioned above, you may make it like the 7th aspect shown below.
In the seventh aspect, in the Peltier module, a conductive wire extends from a plurality of positions spaced at a predetermined interval on any side that is rectangular in a top view, and the surrounding member is connected to the conductive wire of the Peltier module. The conducting member is disposed in each of the corresponding regions, and positioning protrusions for positioning the Peltier module projecting inward from between the regions are formed.

  In this aspect, the Peltier module can be positioned by the positioning protrusion. Moreover, since this positioning protrusion also becomes a mark which aligns the edge | side to which the conducting wire was connected at the time of installation of a Peltier module, the work efficiency at the time of installing a Peltier module can be improved.

The perspective view which shows the component of the sealing structure in 1st Embodiment. The perspective view which shows the sealing frame in 1st Embodiment. The perspective view which shows the sealing frame in 2nd Embodiment. The perspective view which shows the surrounding member of the sealing frame in 2nd Embodiment. Sectional drawing which shows the principal part of the sealing frame in 2nd Embodiment. The top view and front view which show the conduction | electrical_connection member of the sealing frame in 2nd Embodiment The perspective view which shows the interposition member of the sealing frame in 2nd Embodiment. Sectional drawing (1) which shows the positional relationship of each member in another embodiment Sectional drawing (2) which shows the positional relationship of each member in another embodiment

Embodiments of the present invention will be described below with reference to the drawings.
(1) First Embodiment (1-1) Overall Configuration As shown in FIGS. 1 and 2, the Peltier module 1 is sealed in a state of being sandwiched between plate members 2 and 3 from above and below, respectively. In the present embodiment, a heat sink is used as the lower plate-like member 3.

  This sealing structure encloses a resin surrounding member 10 surrounding the Peltier module 1, a conducting member 20 that penetrates the surrounding member 10 in and out to connect to the conductive wire 110 of the Peltier module 1, and the upper and lower surfaces of the surrounding member 10. The interposition member 30 is interposed between the member 10 and the plate-like members 2 and 3 and elastically deforms.

  Among the above, the interposition member 30 is configured by an O-ring, a packing material, or the like, and in this embodiment, a rubber O-ring is employed. Further, the interposition member 30 and the conduction member 20 are configured integrally with the surrounding member 10 by insert molding.

Then, the surrounding member 10 containing the Peltier module 1 is sandwiched between the plate-like members 2 and 3 from above and below, so that the Peltier module 1 is sealed in the space surrounded by the surrounding member 10 and the plate-like members 2 and 3. Is done.
(1-2) Action and effect With this configuration, as the surrounding member 10 and the interposition member 30, by selectively using materials according to required performance such as water vapor transmission, heat resistance and flexibility, A sealing structure having sufficient performance according to the use environment can be realized.
(2) Second Embodiment (2-1) Overall Configuration When the sealing frame 4 is installed with the Peltier module 1 sandwiched by plate members from above and below, the Peltier module 1 is placed between the plate members 2 and 3. As shown in FIG. 3, the surrounding member 10 surrounding the periphery of the Peltier module 1 and the conducting member 20 for conducting the conductive wire 110 of the Peltier module 1 in the inner and outer directions of the surrounding member 10 are sealed. And an interposition member 30 that is interposed between the enclosing member 10 and the plate-like members 2 and 3 and seals the space 100 surrounded by the plate-like members 2 and 3 and the enclosing member 10.

  In the present embodiment, the Peltier module 1 has a rectangular shape (in the present embodiment, a quadrangle) when viewed from above as shown in FIGS. The conducting wire 110 extends from a plurality of locations (two locations in the present embodiment).

  As shown in FIG. 4, the surrounding member 10 is a frame that surrounds the periphery of the Peltier module 1, and screw grooves for fixing the surrounding member 10 to the plate-like members 2 and 3 on opposite sides of the frame. 11 is formed. In the present embodiment, screw grooves 11 are formed in each of two opposing sides in the quadrangular frame, that is, in four places.

  In addition, the enclosing member 10 is formed with an accommodation groove 13 for accommodating the interposition member 30 on its entire upper surface and lower surface along the frame. The housing groove 13 is formed inside the screw groove 11, that is, at a position near the space 100.

In addition, the enclosing member 10 is provided with conductive regions 15 in regions corresponding to the conductive wires 110 of the Peltier module 1 (specifically, regions where the conductive wires 110 of the Peltier module 1 reach), and between the conductive regions 15, A positioning projection 17 is formed to project toward the space 100 side. The positioning protrusion 17 is a protrusion for positioning the Peltier module 1 inside the surrounding member 10.
In the present embodiment, the surrounding member 10 has two conductive regions 15 corresponding to the positive electrode and the negative electrode of the Peltier module 1, and the positioning protrusions from the region sandwiched between the conductive regions 15 toward the inside. 17 protrudes.

  Here, in the surrounding member 10, the screw groove 11 on the side where the positioning protrusion 17 is formed is disposed inside the other screw groove 11 and is formed as a hole penetrating in the vertical direction. The accommodation groove 13 on the same side is convex inward along the shape of the positioning protrusion 17 and passes through a route that avoids the screw groove 11.

  The conducting member 20 conducts the conducting wire 110 in the inside and outside directions of the surrounding member 10 in the conducting region 15 corresponding to the conducting wire 110 of the Peltier module 1 in the surrounding member 10. In this embodiment, as shown in FIG. 5, the conducting member 20 is a plate-like conductive member housed in a through hole 19 that penetrates the conducting region 15 of the surrounding member 10 inward and outward. By connecting the conductive wire 110, the conductive wire 110 is made conductive.

  In addition, an external conductor 120, which is a conductor for energizing the Peltier module 1 through the conducting member 20, is connected to a region of the conducting member 20 that is located outside the surrounding member 10. And in the area | region located in the outer side of the surrounding member 10 in the conduction member 20, the covering member 40 which coat | covers this area | region with the connection part with the external conducting wire 120 and the boundary part with the surrounding member 10, and interrupts | blocks from outside space. Is provided.

  In addition, as shown in FIGS. 5 and 6, the conducting member 20 has one or both of the inner and outer ends of the surrounding member 10 (both end sides in the present embodiment) protruding from the surrounding member 10. At the same time, it is displaced toward the lower plate-like member 3, and thus a vertical space is secured between the upper plate-like member 2 and the end side of the conducting member 20. The conducting member 20 is formed with a hole 21 penetrating in the vertical direction in a part of a region not displaced downward.

  The interposition member 30 is disposed in the accommodation groove 13 on each of the upper and lower surfaces of the surrounding member 10, and is interposed between each surface and the plate-like members 2 and 3 to seal the space 100. In this embodiment, the interposition member 30 is formed of an elastically deformable resin material, and has a cross-sectional shape that is convex toward the direction away from the receiving groove 13 (upward or downward) as shown in FIG. Yes. The interposition member 30 compresses and deforms between the surrounding member 10 and the plate-like members 2 and 3, thereby closing the gap between the two members and sealing the space 100.

In the present embodiment, the interposition member 30 and the covering member 40 are formed of the same material so as to be an integral member.
In the present embodiment, each set of interposition members 30 is partially connected. The connecting portions 31 of the interposition members 30 connect the interposition members 30 in a state where the main body portions of the interposition members 30 extend to positions where they do not overlap in the vertical direction. The housing groove 13 of the surrounding member 10 is configured as a groove having a shape capable of housing the interposition member 30 together with the connecting portion 31.
Further, in the present embodiment, in the plate-like members 2 and 3, the surrounding contact region 210 that is the contact region of the surrounding member 10 and the module contact region 220 that is the contact region of the Peltier module 1 are the same height. Yes. The height (H) of the surrounding member 10 is the total value of the distance (d) secured between the members by at least the interposition member 30 compressed and deformed between the surrounding member 10 and the plate-like members 2 and 3. The height of (2d) is lower than the height (Hp) of the Peltier module 1. That is, the surrounding member 10 has a height (H) that is the same as the height (Hp) of the Peltier module 1 as an upper limit, and is a total value (2d) or less than the total value of the intervals of the interposition members 30. The height (H ≧ Hp−2d) adjusted to be lower than the height (Hp) of the Peltier module 1 by a predetermined value.
Here, in the surrounding member 10, the “predetermined value that is less than the total value of the intervals of the interposed members 30” as a value that is lower than the height (Hp) of the Peltier module 1 is a state in which the interposed member 30 is compressed and deformed. Thus, the plate-like members 2 and 3 and the Peltier module 1 are selected within a range where they can sufficiently contact each other.
(2-2) Action and Effect With the above-described configuration, the surrounding member 10 and the interposition member 30 can be selectively used with materials according to required performance such as water vapor transmission, heat resistance and flexibility. A sealing structure having sufficient performance according to the use environment can be realized.

  In the above configuration, the conducting wire 20 of the Peltier module 1 can be conducted in the inner and outer directions of the surrounding member 10 by the conducting member 20 that is a plate-like conductive member. In particular, since the conducting member 20 is a plate-like member, there is no gap in the member itself that allows liquid and gas components such as stranded wires and coated wires to flow inside and outside, thereby sealing as a sealing structure. The stopping performance can be maintained high.

  In the above configuration, since the surrounding member 10 and the covering member 40 can prevent the conducting member 20 from coming into contact with the outer space, the covering member 40 is selected from a material having performance according to the use environment. By using it steadily, the sealing performance as the sealing structure can be kept high even under a more severe usage environment.

  Further, in the above configuration, since the end side of the conducting member 20 protrudes from the surrounding member 10 and is displaced downward, the vertical direction between the upper plate-like member 2 and the end side of the conducting member 20 is increased. A space can be secured, and this space can be effectively used as a connection space for conducting wires.

  Moreover, if it is the said structure, according to the relationship of the height in each member (H> = Hp-2d), the surrounding member 10 and the plate-shaped member 2 will fully contact the plate-shaped members 2 and 3 and the Peltier module 1. , 3, the space 100 can be sealed by the interposition member 30 compressed and deformed.

In the above configuration, the Peltier module 1 can be positioned by the positioning protrusion 17. Further, since the positioning protrusion 17 also serves as a mark for aligning the side to which the conducting wire 110 is connected when the Peltier module 1 is installed, work efficiency when installing the Peltier module 1 can be improved.
(3) Modifications Embodiments of the present invention have been described above, but the present invention is not limited to the above-described embodiments, and can take various forms as long as they belong to the technical scope of the present invention. Needless to say.

  For example, in the said embodiment, the case where the conduction member 20 was comprised with the electroconductive plate-shaped member was illustrated. However, this conducting member 20 is not limited to a plate-like member as long as it can suppress the flow of liquid or gaseous components in and out as a member. For example, it may be configured by a rod-like member or a member not covered with a single core as a shape other than the plate shape.

  The conducting member 20 is configured to have a rectangular cross-sectional shape, and is configured to have a cross-sectional shape with curved corners, or the cross-sectional shape is elliptical or circular. You may comprise as follows. As described above, when the cross-sectional shape has no corners, the through-hole 19 of the surrounding member 10 is also a non-cornered hole, which is simply compared with a rectangular cross-sectional shape having corners. In addition, since the through hole 19 and the outer peripheral surface of the conductive member 20 are easily brought into close contact with each other in a curved shape, the sealing performance as a sealing structure can be maintained higher.

Moreover, the conducting member 20 is not limited to the configuration in which the member penetrates the inside and outside as long as it can conduct the conducting wire 110 of the Peltier module 1 in the inside and outside directions of the surrounding member 10 in the conducting region 15. For example, in the surrounding member 10, the conductive region 15 itself may be a conductive member, or the conductive region 15 may be mixed with a conductive material. Further, a configuration is adopted in which the conducting member 20 formed in a thin film shape is passed inside and outside along the surface of the conducting region 15 of the surrounding member 10 so that the conducting wire 110 of the Peltier module 1 is conducted in the inside and outside directions of the surrounding member 10. You can also.
Moreover, in the said embodiment, although the conducting wire 110 illustrated the structure which is a member separate from the conduction | electrical_connection member 20, if the thing of a single core is employ | adopted as the conducting wire 110, for example, the edge part side of this conducting wire 110 It is good also as a structure which penetrates to the inner side of the surrounding member 10, and the area | region of the conducting wire 110 which penetrates this surrounding member 10 functions as the conduction | electrical_connection member 20. FIG.

  Moreover, in the said embodiment, the case where the edge part side of the conduction | electrical_connection member 20 was displaced toward the downward direction was illustrated. However, the end side of the conductive member 20 only needs to secure a connection space for the conductive wires 110 and 120, and is not limited to a configuration that is displaced downward. For example, the end side of the conductive member 20 may be displaced upward or sideward. Further, it is possible to adopt a configuration in which the end region of the conductive member 20 has a bifurcated shape and a space sandwiched between the divided portions is secured as a connection space.

  In the present embodiment, the surrounding contact area 210 and the module contact area 220 of the plate-like members 2 and 3 have the same height, and the height (H) of the surrounding member 10 is secured by at least the interposition member 30. A configuration in which the height (Hp) of the Peltier module 1 is lower than the height (Hp) of the Peltier module 1 is exemplified (H ≧ Hp−2d).

  However, in at least one of the plate-like members 2 and 3, when the surrounding contact area 210 projects in the positive direction or the negative direction with respect to the module contact area 220 according to the height of the Peltier module 1, The member 10 may be configured to have a height as shown below.

  Specifically, the height of the surrounding member 10 is at least an interval secured by each of the interposed members 30 compressed and deformed between the surrounding member 10 and the plate-like members 2 and 3, and the plate-like member 2. 3, the total height of the surrounding contact area 210 relative to the module contact area 220 may be lower than the Peltier module 1.

  For example, when the module contact surfaces of both the plate-like members 2 and 3 are protruded toward the space 100 in order to match the Peltier module 1 with a short height, as shown in FIG. The amount of protrusion with respect to the contact region 220 is negative (−ΔHu, −ΔHd). In order to cope with such a protruding amount, the surrounding member 10 needs to be configured to be higher than the Peltier module 1 by the amount of each protruding amount. Therefore, the surrounding member 10 becomes lower than the height (Hp) of the Peltier module 1 by at least the total value (2d) of the interval by the interposition member 30 or a predetermined value that is less than this total value. The height (H ≧ Hp−2d + ΔHu + ΔHd) so that the height (ΔHu, ΔHd) to be added is higher than the height (Hp) of the Peltier module 1 by the amount of protrusion of each of the shaped members 2 and 3. Adjust. Here, the upper limit of the height (H) as the surrounding member 10 is a height obtained by adding the amount of protrusion (ΔHu, ΔHd) to the Peltier module 1 side in the surrounding contact region 210 to the height (Hp) of the Peltier module 1. (Hp + ΔHu + ΔHd).

  On the other hand, when the module contact area 220 of both the plate-like members 2 and 3 is recessed from the surrounding contact area 210 to match the tall Peltier module 1, as shown in FIG. The amount of protrusion with respect to the module contact region 220 is a positive amount of protrusion (+ ΔHu, + ΔHd). In order to cope with such a protruding amount, it is necessary to configure the surrounding member 10 to be lower than the Peltier module 1 by the amount of each protruding amount. Therefore, the surrounding member 10 becomes lower than the height (Hp) of the Peltier module 1 by at least the total value (2d) of the interval by the interposition member 30 or a predetermined value that is less than this total value. The height (H ≧ Hp−) so that the height (−ΔHu, −ΔHd) to be subtracted in accordance with the protruding amount of each of the shaped members 2 and 3 is lower than the height (Hp) of the Peltier module 1. 2d−ΔHu−ΔHd)). Here, the upper limit of the height (H) of the surrounding member 10 is the height obtained by subtracting the amount of protrusion (ΔHu, ΔHd) from the surrounding contact region 210 toward the Peltier module 1 side to the height (Hp) of the Peltier module 1. (Hp−ΔHu−ΔHd).

  With such a configuration, the surrounding member 10 allows the plate-like members 2 and 3 and the Peltier module 1 to sufficiently contact each other regardless of the height difference between the surrounding contact surface and the module contact surface. The space 100 surrounded by 2, 3 and the surrounding member 10 can be sealed.

  Moreover, in the said embodiment, the structure which consists of the resin material in which the interposition member 30 can be elastically deformed was illustrated. However, the interposition member 30 may be a member that is interposed between the surrounding member 10 and the plate-like members 2 and 3 and that is compressively deformed. U-shaped) or a gasket may be employed.

  Moreover, in the said embodiment, the structure by which the set of interposed member 30 was each connected was illustrated. However, the set of interposed members 30 may be separated as separate members.

  DESCRIPTION OF SYMBOLS 1 ... Peltier module, 2 ... Plate-shaped member, 3 ... Plate-shaped member, 4 ... Sealing frame, 10 ... Enclosing member, 11 ... Screw groove, 13 ... Housing groove, 15 ... Conduction area | region, 17 ... Positioning protrusion, 19 ... Through hole, 20 ... conducting member, 21 ... hole, 30 ... interposition member, 31 ... connecting portion, 40 ... covering member, 100 ... space, 110 ... conductor, 120 ... external conductor, 210 ... surrounding contact area, 220 ... module contact region.

Claims (7)

In installing the Peltier module sandwiched by plate members from above and below, a sealing frame for sealing the Peltier module between the plate members,
An enclosing member that is a frame surrounding the periphery of the Peltier module;
An interposition member that seals the space surrounded by the plate-like member and the surrounding member by being interposed between the surrounding member and the plate-like member over the entire circumference of the frame body in the surrounding member. When,
In a partial region of the surrounding member, a conducting member that conducts the conducting wire of the Peltier module in the inside and outside directions of the surrounding member;
A sealing frame. The conducting member is a plate-like or bar-like conductive member arranged so as to penetrate the surrounding member inward and outward, and by connecting the conductive wire of the Peltier module to the member, the conductive wire is connected to the inner and outer sides of the surrounding member. Conducting in the direction,
The sealing frame according to claim 1. An external conductor which is connected to a region located outside the surrounding member in the conducting member and is a conducting wire for energizing the Peltier module through the conducting member;
A covering member that covers a region located outside the surrounding member in the conducting member, together with a connecting portion with the external conductor and a boundary portion with the surrounding member, and blocking the region from an outer space;
The sealing frame according to claim 2, comprising: In the conducting member, either the inside or the outside of the surrounding member or both end portions protrude from the surrounding member and are displaced to the lower plate-like member side,
The sealing frame according to claim 2 or claim 3. In the plate-like member, when the surrounding contact region that is a region that contacts the surrounding member and the module contact region that is a region that contacts the Peltier module are at the same height,
The interposition member is formed of a member that can be compressed and deformed by being interposed between the surrounding member and the plate-like member,
The height of the surrounding member is lower than the Peltier module by at least the height that is the sum of the intervals secured by each of the interposed members compressed and deformed between the surrounding member and the plate-like member,
The sealing frame according to claim 1. In at least one of the plate-like members, the surrounding contact region that is a region that contacts the surrounding member protrudes in the positive direction or the negative direction with respect to the module contact region that is a region that contacts the Peltier module In
The interposition member is formed of a member that can be compressed and deformed by being interposed between the surrounding member and the plate-like member,
The height of the surrounding member is at least an interval secured by each of the interposed members compressed and deformed between the surrounding member and the plate-like member, and the surrounding contact region in each of the plate-like members. Lower than the Peltier module by the total height of the protruding amount with respect to the module contact area,
The sealing frame according to claim 1. The Peltier module has a conductive wire extending from a plurality of locations at predetermined intervals on any side that is rectangular in top view,
In the surrounding member, the conductive member is disposed in each of the regions corresponding to the conductors of the Peltier module, and a positioning protrusion for positioning the Peltier module is formed by projecting inward from between the regions.
The sealing frame according to claim 1.