JP2018081253A - Electrophoresis apparatus, electronic apparatus, and method of manufacturing electrophoresis apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electrophoresis apparatus capable of preventing bonding failure between base plates due to attachment of extra electrophoretic dispersion.SOLUTION: The electrophoresis apparatus includes: electrophoretic dispersion liquid containing charged particles and a dispersion medium; a first base plate and a second base plate which are joined together by a joint to hold the electrophoretic dispersion liquid; and a partition wall that partitions a space between the first base plate and the second base plate into plural cells filled with the electrophoretic dispersion liquid. At least one of the first base plate and the second base plate is formed with a through hole at the outside of a pixel area in which the plural cells an arranged.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a technique for displaying an image using a dispersion liquid (hereinafter referred to as “electrophoretic dispersion liquid”) in which charged particles are dispersed in a dispersion medium.

  For example, Patent Document 1 discloses an electrophoresis apparatus in which an electrophoresis dispersion liquid is held in a gap between an element substrate and a counter substrate that face each other. The element substrate and the counter substrate are bonded to each other by a rectangular frame-shaped seal portion. A liquid reservoir for retaining excess electrophoretic dispersion liquid is formed between the display area where the plurality of pixels are arranged and the seal portion.

Japanese Patent Laying-Open No. 2015-18060

  In the technique of Patent Document 1, the counter substrate is bonded to the element substrate in a state where the electrophoretic dispersion liquid is applied to the surface of the element substrate on which the rectangular frame-shaped seal portion is formed. If excessive electrophoretic dispersion liquid is applied to the surface of the element substrate, excess electrophoretic dispersion liquid that cannot be accommodated in the liquid reservoir in the process of joining the element substrate and the counter substrate is inside the seal section. May overflow. In the above state, excess electrophoretic dispersion liquid adheres to the upper surface of the seal portion, so that there is a possibility that the element substrate and the counter substrate cannot be sufficiently bonded. On the other hand, when the application amount of the electrophoretic dispersion liquid is suppressed so that the electrophoretic dispersion liquid does not overflow from the liquid reservoir, bubbles may remain between the first substrate and the second substrate, causing display defects. In view of the above circumstances, an object of the present invention is to suppress a bonding failure between substrates due to adhesion of an excessive electrophoretic dispersion.

  In order to solve the above problems, an electrophoretic device according to a preferred embodiment of the present invention includes an electrophoretic dispersion liquid including charged particles and a dispersion medium, a first substrate holding the electrophoretic dispersion liquid, and a second substrate. A partition wall section that divides a gap between the substrate and the first substrate and the second substrate into a plurality of cells filled with the electrophoretic dispersion, and includes at least one of the first substrate and the second substrate. On one side, a through hole is formed outside the pixel region where the plurality of cells are provided. In the above configuration, since the through hole is formed in at least one of the first substrate and the second substrate, excess electrophoretic dispersion liquid is discharged from the through hole in the step of bonding the first substrate and the second substrate to each other. leak. Therefore, it is possible to suppress poor bonding (for example, insufficient bonding strength) due to adhesion of excess electrophoretic dispersion.

  The electrophoresis apparatus according to a preferred aspect of the present invention includes a closing portion that closes the through hole. In the above aspect, since the through hole is closed by the closing portion, it is possible to prevent the electrophoretic dispersion from flowing out through the through hole in the state after the closing.

  In a preferred aspect of the present invention, a bonding portion that bonds the first substrate and the second substrate is provided, and the through hole is located in a region surrounded by the bonding portion in plan view. In the above aspect, the through hole is formed in the region surrounded by the joint portion. Therefore, in the step of bonding the first substrate and the second substrate, the electrophoretic dispersion liquid arranged in the pixel region can be allowed to flow out of the through hole before reaching the upper surface of the bonding portion.

  In a preferred aspect of the present invention, the inner diameter of the through hole is larger than the particle diameter of the charged particles. In the above aspect, since the inner diameter of the through hole is larger than the particle diameter of the charged particle, the possibility that the through hole is blocked by the charged particle is reduced. Therefore, the effect of reducing the possibility of extra electrophoresis dispersion liquid adhering to the junction is particularly remarkable.

  In a preferred aspect of the present invention, a plurality of the through holes are formed in different positions in at least one of the first substrate and the second substrate. In the above aspect, since a plurality of through holes are formed at different positions, the above-described effect of reducing the possibility of extra electrophoretic dispersion liquid adhering to the joint is particularly remarkable.

  An electronic apparatus according to a preferred aspect of the present invention includes the electrophoresis apparatus according to each aspect described above. For example, watches and electronic paper are good examples of electronic devices, but the scope of application of the present invention is not limited to the above examples.

  According to a preferred aspect of the present invention, there is provided a method for manufacturing an electrophoretic device, an electrophoretic dispersion containing charged particles and a dispersion medium, a first substrate and a second substrate that hold the electrophoretic dispersion, and the first An electrophoretic device manufacturing method comprising: a partition wall partitioning a gap between a substrate and the second substrate into a plurality of cells, wherein the electrophoresis is performed on a surface of the second substrate on which the partition wall is formed. Including a first step of disposing a dispersion and a second step of bonding the first substrate and the second substrate via a bonding portion, and at least one of the first substrate and the second substrate includes: A through hole is formed outside the pixel region where the plurality of cells are provided, and in the second step, the electrophoretic dispersion liquid is caused to flow out of the through hole. In the above aspect, in the second step of joining the first substrate and the second substrate, excess electrophoresis dispersion liquid flows out from the through hole. Therefore, for example, even if an amount of the electrophoretic dispersion liquid sufficient to suppress the remaining of bubbles between the first substrate and the second substrate is disposed on the surface of the second substrate in the first step, the excess electricity The possibility that the electrophoretic dispersion liquid adheres to the junction is reduced. That is, it is possible to suppress bonding failure (for example, insufficient bonding strength) caused by the electrophoresis dispersion liquid adhering to the bonding portion.

  The method for manufacturing an electrophoretic device according to a preferred aspect of the present invention includes a third step of forming a closing portion for closing the through hole after the second step. In the above aspect, since the closed portion for closing the through hole is formed, the outflow of the electrophoretic dispersion liquid through the through hole is prevented.

1 is a plan view of an electrophoresis apparatus according to a first embodiment of the present invention. It is sectional drawing of the II-II line in FIG. It is explanatory drawing of process P1 in the manufacturing method of an electrophoresis apparatus. It is explanatory drawing of process P2 in the manufacturing method of an electrophoresis apparatus. It is explanatory drawing of process P3 in the manufacturing method of an electrophoresis apparatus. It is explanatory drawing of process P4 in the manufacturing method of an electrophoresis apparatus. It is explanatory drawing of process P5 in the manufacturing method of an electrophoresis apparatus. It is explanatory drawing of process P5 in the manufacturing method of an electrophoresis apparatus. It is explanatory drawing of process P5 in the manufacturing method of an electrophoresis apparatus. It is explanatory drawing of process P6 in the manufacturing method of an electrophoresis apparatus. It is sectional drawing of the electrophoresis apparatus in 2nd Embodiment. It is sectional drawing of the electrophoresis apparatus in a modification. It is a top view of the electrophoresis device in a modification. It is a top view of the electrophoresis device in a modification. It is explanatory drawing of process P4 in a modification. It is a front view of the wristwatch which is an example of electronic equipment. It is a perspective view of electronic paper which is an example of electronic equipment.

<First Embodiment>
FIG. 1 is a plan view of an electrophoresis apparatus 100 according to the first embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line II-II in FIG. The electrophoretic device 100 according to the first embodiment is a display device that displays an arbitrary image by using a plurality of pixels arranged in a matrix in the pixel region A across an X direction and a Y direction that intersect each other. . As illustrated in FIGS. 1 and 2, the electrophoresis apparatus 100 includes a first substrate 10 and a second substrate 20 that face each other with a space therebetween. The 1st board | substrate 10 is located in the user side which visually recognizes a display image, and the 2nd board | substrate 20 is located in the opposite side (back side) from a user. Each of the first substrate 10 and the second substrate 20 is a light transmissive plate-like member. However, the light transmittance of the second substrate 20 located on the back side is not essential.

  As illustrated in FIG. 1 and FIG. 2, the first substrate 10 and the second substrate 20 are bonded to each other via the bonding portion 30. The joint portion 30 is formed in an annular shape (specifically, a rectangular frame shape) along the periphery of each of the first substrate 10 and the second substrate 20. Specifically, the joint portion 30 of the first embodiment includes a base portion 32 and a sealing material 34 as illustrated in FIG. The base portion 32 is a rectangular frame-like structure formed of an acrylic or epoxy resin material, and the sealing material 34 is an adhesive layer formed on the upper surface of the base portion 32 with the same resin material. .

  As illustrated in FIG. 2, the electrophoretic dispersion liquid 40 is held in the gap between the first substrate 10 and the second substrate 20. The electrophoretic dispersion liquid 40 is sealed in the space surrounded by the joint 30 in the gap between the first substrate 10 and the second substrate 20. The electrophoretic dispersion liquid 40 is a display medium that displays gradation using electrophoresis of a plurality of charged particles 42 (42B, 42W). Specifically, the electrophoretic dispersion liquid 40 is a dispersion in which white charged particles 42W and black charged particles 42B charged in opposite polarities and a plurality of charged particles 42 (42W, 42B) are dispersed so as to be able to migrate. Medium 44.

  As illustrated in FIG. 2, the common electrode 12 and the insulating layer 14 are formed on the surface of the first substrate 10 facing the second substrate 20. The common electrode 12 is an electrode continuous over a plurality of pixels in the pixel region A, and is formed of a light-transmitting conductive material such as ITO (Indium Tin Oxide) or IZO (Indium Zinc Oxide). The insulating layer 14 is a light-transmitting film that is formed of an insulating material and covers the common electrode 12. Although the material of the insulating layer 14 is arbitrary, for example, inorganic materials such as silicon oxide or silicon nitride and various resin materials are suitable.

  As illustrated in FIG. 2, a circuit layer 22 is formed on the surface of the second substrate 20 facing the first substrate 10. The circuit layer 22 is formed of a stack of a plurality of layers (not shown) including a conductive layer and an insulating layer, and includes a transistor and a wiring for driving each of the plurality of pixels. A plurality of pixel electrodes 24 are formed on the surface of the circuit layer 22. The plurality of pixel electrodes 24 are formed of a light transmissive conductive material such as ITO or IZO, for example. Each pixel electrode 24 is a substantially rectangular electrode formed individually for each pixel. As illustrated in FIG. 1, a plurality of pixel electrodes 24 are arranged in a matrix in the X direction and the Y direction at intervals inside the pixel region A.

  A plurality of charged particles 42 migrate according to the voltage between the pixel electrode 24 and the common electrode 12, so that the gradation (white / black) is controlled for each pixel electrode 24. For example, white is displayed when the white charged particles 42 </ b> W approach the common electrode 12, and black is displayed when the black charged particles 42 </ b> B approach the common electrode 12. As understood from the above description, a portion where the pixel electrode 24 and the common electrode 12 face each other with the electrophoretic dispersion liquid 40 therebetween functions as a pixel.

  As illustrated in FIGS. 1 and 2, a partition wall portion 26 is formed between the first substrate 10 and the second substrate 20. The partition wall portion 26 is formed on the surface of the second substrate 20. Specifically, the partition wall portion 26 is a structure that is positioned inside the pixel region A and divides the gap between the first substrate 10 and the second substrate 20 into a plurality of spaces (hereinafter referred to as “cells”) C. . The upper surface of the partition wall portion 26 is in contact with the surface of the insulating layer 14 formed on the surface of the first substrate 10. In the first embodiment, as illustrated in FIG. 1 and FIG. 2, the gap between the first substrate 10 and the second substrate 20 is partitioned for each pixel by the partition wall 26, and a plurality of cells extends in the X direction and the Y direction. C is arranged in a matrix. That is, the planar shape of the partition wall portion 26 is such that a linear portion extending in the X direction within a region between the pixel electrodes 24 adjacent in the Y direction and a region between the pixel electrodes 24 adjacent in the X direction. It is the lattice shape which combined the linear part extended in a Y direction inside. The pixel area A can also be referred to as an area surrounded by the outer peripheral edge of the partition wall portion 26. Although the material of the partition wall portion 26 is arbitrary, for example, an acrylic or epoxy resin material is suitable. If the partition wall portion 26 is formed of a light shielding material, the partition wall portion 26 can be used as a light shielding layer that shields the gap between pixels.

  As illustrated in FIG. 2, the electrophoretic dispersion liquid 40 is filled in each of the plurality of cells C partitioned by the partition walls 26. In the first embodiment, the electrophoretic dispersion liquid 40 is also filled in a space R (hereinafter referred to as “reserving space”) R between the outer peripheral edge (outermost periphery) of the partition wall 26 and the inner peripheral edge of the joint 30. As illustrated in FIG. 1, the storage space R is a rectangular frame-like space that surrounds the pixel region A in a plan view (that is, when viewed from a direction perpendicular to the surface of the first substrate 10 or the second substrate 20).

  As illustrated in FIGS. 1 and 2, a through hole 16 is formed in the first substrate 10. In the first substrate 10 of the first embodiment, a plurality of through holes 16 are formed at different positions in plan view. Each of the plurality of through holes 16 causes the excess electrophoretic dispersion 40 to flow out to the outside in the step of bonding the first substrate 10 and the second substrate 20 to each other via the bonding portion 30 (step P5 described later). It is a space for. As illustrated in FIG. 1, in the first embodiment, a plurality of through holes 16 are formed outside the pixel region A. Specifically, each through hole 16 is located between the outer peripheral edge of the pixel region A and the inner peripheral edge of the joint portion 30. That is, each through hole 16 communicates with the storage space R. As described above, since the through hole 16 is formed outside the pixel region A in the first embodiment, the through hole 16 does not affect the image display in the pixel region A. In addition, a well-known processing technique can be arbitrarily employ | adopted for formation of the through-hole 16. FIG. For example, the through holes 16 can be formed in the first substrate 10 by mechanical processing such as cutting or chemical processing such as etching.

  As illustrated in FIG. 1, the cross-sectional shape of the through hole 16 in the first embodiment is circular. The inner diameter of each through hole 16 is larger than the particle size (for example, average diameter) of the charged particles 42. Accordingly, the charged particles 42 of the electrophoretic dispersion liquid 40 can flow through the through holes 16 together with the dispersion medium 44. A typical example of the cross-sectional shape of the through-hole 16 is a circular shape, but it is also possible to form the through-hole 16 having a cross-sectional shape (for example, a polygonal shape) other than the circular shape.

  As illustrated in FIGS. 1 and 2, each of the plurality of through holes 16 of the first substrate 10 is closed by a closing portion 18. The blocking portion 18 is formed on the surface of the first substrate 10 opposite to the second substrate 20 and closes the through hole 16. Although the material of the blocking part 18 is arbitrary, for example, an acrylic or epoxy resin material is suitable. As illustrated above, in a state where the through hole 16 communicating with the storage space R is closed by the closing portion 18, the electrophoresis dispersion liquid 40 in the storage space R does not flow out to the external space through the through hole 16. Absent.

<Method for Manufacturing Electrophoresis Device 100>
A method for manufacturing the electrophoresis apparatus 100 exemplified above will be described. 3 to 9 are process diagrams of the method for manufacturing the electrophoresis apparatus 100. FIG. In the process P1, as illustrated in FIG. 3, a plurality of through holes 16 are formed at different positions outside the pixel region A in the first substrate 10 on which the common electrode 12 and the insulating layer 14 are formed. In addition, the order of the formation of the through hole 16 and the formation of the common electrode 12 and the insulating layer 14 is arbitrary. For example, the common electrode 12 and the insulating layer 14 can be formed on the surface of the first substrate 10 in which the plurality of through holes 16 are formed.

  In the process P2, as illustrated in FIG. 4, the circuit layer 22, the plurality of pixel electrodes 24, and the partition walls 26 are sequentially formed on the surface of the second substrate 20. A known film forming technique and processing technique can be arbitrarily employed for forming each layer in the process P2. Note that the process P1 and the process P2 are optional.

  In the process P3 after the process P2, as illustrated in FIG. 5, the bonding portion 30 is formed on the surface of the second substrate 20. Specifically, a rectangular frame-shaped base portion 32 surrounding the pixel region A is formed by a known manufacturing technique, and a sealing material 34 (that is, the first substrate 10 and the second substrate) is formed on the surface of the base portion 32. 20) is applied.

  In step P4 (exemplification of the first step) after step P3, the electrophoretic dispersion liquid 40 is disposed on the surface of the second substrate 20 as illustrated in FIG. Specifically, the electrophoresis dispersion liquid 40 is filled in each cell C (that is, in the pixel region A) partitioned by the partition wall 26. In step P4, a sufficient amount of the electrophoretic dispersion 40 is applied onto the surface of the second substrate 20 so that no bubbles remain in the gap between the first substrate 10 and the second substrate 20 after bonding. Specifically, an amount of electrophoretic dispersion 40 that exceeds the volume assumed in the gap between the first substrate 10 and the second substrate 20 after bonding is applied onto the surface of the second substrate 20 in step P4. . Therefore, the electrophoretic dispersion liquid 40 disposed in the pixel region A in the process P4 can flow from the inside to the outside of the pixel region A and reach the storage space R. However, the amount of the electrophoretic dispersion 40 disposed on the surface of the second substrate 20 in the process P4 is limited to such an extent that it does not overflow from the storage space R. Therefore, even when the electrophoresis dispersion liquid 40 flows into the storage space R at the stage of the process P 4, the electrophoresis dispersion liquid 40 does not reach the upper surface of the joint portion 30.

  In the process P5 (exemplification of the second process) after the process P4, as illustrated in FIGS. 7 to 10, the first substrate 10 after the execution of the process P1 and the second substrate 20 after the execution of the process P4 are performed. Are joined to each other through the joint 30 formed in the process P3. In the process of bringing the first substrate 10 closer to the second substrate 20 in the process P5, first, as illustrated in FIG. 7, the surface of the first substrate 10 facing the second substrate 20 is first sealed with the joint 30. Contact material 34. That is, the space between the first substrate 10 and the second substrate 20 is sealed by the joint portion 30 in a state where it communicates with the external space through the plurality of through holes 16.

  When the first substrate 10 and the second substrate 20 further approach each other, the surface of the insulating layer 14 formed on the surface of the first substrate 10 comes into contact with the electrophoretic dispersion 40 as illustrated in FIG. The electrophoresis dispersion liquid 40 flows from the inside of the pixel region A to the storage space R by being pressed by the contact of the first substrate 10. When the first substrate 10 and the second substrate 20 further approach each other, the electrophoretic dispersion liquid 40 is filled in the storage space R, and as shown by the dashed arrows in FIG. The liquid 40 flows out from the through holes 16 of the first substrate 10 to the external space by capillary force. As described above, since the inner diameter of the through hole 16 is larger than the particle diameter of the charged particle 42, the charged particle 42 also flows out of the through hole 16 together with the dispersion medium 44. As illustrated in FIG. 9, the first substrate 10 and the second substrate 20 are held in a state where the upper surface of the partition wall portion 26 is in contact with the insulating layer 14 on the surface of the first substrate 10. As illustrated above, in the process P5, the excess electrophoretic dispersion 40 flows out through the through-holes 16, so that an excessive increase in the pressure in the space between the first substrate 10 and the second substrate 20 is suppressed. Is done.

  In the process P6 (exemplification of the third process) after the process P5, as illustrated in FIG. 10, a blocking portion 18 that closes each of the plurality of through holes 16 is formed. Specifically, for example, a resin material is applied so as to close each through-hole 16 after the electrophoretic dispersion liquid 40 that has reached the surface of the first substrate 10 opposite to the second substrate 20 is wiped off. And the obstruction | occlusion part 18 is formed by hardening. Due to the formation of the blocking portion 18 in the process P6, the outflow of the electrophoretic dispersion liquid 40 through the through hole 16 is stopped. That is, the electrophoretic dispersion liquid 40 does not flow out of the through hole 16 after the electrophoretic device 100 is manufactured (for example, at a stage where it is used).

  As described above, in the first embodiment, in the process P5 for joining the first substrate 10 and the second substrate 20, excess electrophoresis dispersion liquid 40 flows out through the through holes 16. Accordingly, even when an amount of the electrophoresis dispersion liquid 40 sufficient to suppress the bubbles remaining between the first substrate 10 and the second substrate 20 is disposed on the second substrate 20 in the process P4, the electrophoresis dispersion liquid. The possibility of 40 reaching the upper surface of the joint 30 is reduced. That is, it is possible to suppress a bonding failure (for example, insufficient bonding strength) between the first substrate 10 and the second substrate 20 due to the extra electrophoresis dispersion liquid 40 adhering to the upper surface of the bonding portion 30. . Particularly in the first embodiment, since the plurality of through holes 16 are formed in the first substrate 10, it is possible to reduce the possibility that the electrophoretic dispersion liquid 40 reaches the upper surface of the bonding portion 30 (as a result, poor bonding between the substrates). The effect that it can be suppressed) is particularly remarkable.

  In the first embodiment, the through-hole 16 is formed in a region surrounded by the joint portion 30 (inside the inner peripheral edge of the joint portion 30) in plan view. Therefore, in the process P5 for joining the first substrate 10 and the second substrate 20 to each other, the excess electrophoresis dispersion liquid 40 flows out from the through holes 16 before the electrophoresis dispersion liquid 40 reaches the upper surface of the joint portion 30. It is possible to make it.

Second Embodiment
A second embodiment of the present invention will be described. In addition, about the element which an effect | action or function is the same as that of 1st Embodiment in each form illustrated below, the code | symbol used by description of 1st Embodiment is diverted, and each detailed description is abbreviate | omitted suitably.

  FIG. 11 is a cross-sectional view of the electrophoresis apparatus 100 according to the second embodiment. In the first embodiment, the configuration in which the common electrode 12 and the insulating layer 14 are formed inside the pixel region A in the first substrate 10 is illustrated. In the second embodiment, as illustrated in FIG. 11, the common electrode 12 and the insulating layer 14 are formed so as to continue from the inside to the outside of the pixel region A. The joint portion 30 formed on the surface of the second substrate 20 is in contact with the surface of the insulating layer 14 formed on the surface of the first substrate 10. In the second embodiment, as illustrated in FIG. 11, the plurality of through holes 16 are formed so as to penetrate the stack of the first substrate 10, the common electrode 12, and the insulating layer 14. Other configurations and manufacturing methods of the electrophoresis apparatus 100 are the same as those in the first embodiment. Therefore, the same effects as those of the first embodiment are realized in the second embodiment.

<Modification>
Each aspect illustrated above can be variously modified. Specific modifications are exemplified below. The aspects exemplified below can be applied to the above-described embodiments. In addition, two or more aspects arbitrarily selected from the following examples can be appropriately combined as long as they do not contradict each other.

(1) In each of the above-described embodiments, the through hole 16 and the blocking portion 18 are formed in the first substrate 10, but as illustrated in FIG. 12, the through hole 52 and the blocking portion 54 are similarly formed in the second substrate 20. Can be formed. Specifically, a plurality of through holes 52 are formed at different positions outside the pixel region A in the second substrate 20. Each through hole 52 penetrates through the second substrate 20 and the circuit layer 22 and communicates with the storage space R. The inner diameter of each through hole 52 is larger than the particle diameter of the charged particles 42. Therefore, in the process P5 for bonding the first substrate 10 and the second substrate 20 to each other, excess electrophoretic dispersion liquid is passed through each through hole 16 of the first substrate 10 and each through hole 52 of the second substrate 20. 40 flows out to the external space. The closing part 54 is formed in the process P6 after the process P5 and closes each through-hole 52 in the same manner as the closing part 18 described above. In FIG. 12, the through hole 16 of the first substrate 10 and the through hole 52 of the second substrate 20 are illustrated, but the configuration in which the through hole 52 is formed only in the second substrate 20 (the first substrate 10 has a through hole). A configuration in which the hole 16 and the blocking portion 18 are not formed can also be employed. As understood from the above examples, a configuration in which through holes (16, 52) are formed in at least one of the first substrate 10 and the second substrate 20 is preferable.

(2) In the above-described embodiments, as illustrated in FIG. 1, a total of four through holes 16 are formed near the midpoint of each edge of the pixel area A in plan view. Is optional. For example, as illustrated in FIG. 13, it is possible to form a total of four through holes 16 in the vicinity of the four corners of the pixel region A in plan view. Further, a configuration in which one to three through holes 16 are formed at an arbitrary position outside the pixel region A, or five or more through holes along the outer peripheral edge of the pixel region A as illustrated in FIG. A configuration in which 16 is formed may also be employed.

(3) In each of the above-described embodiments, the electrophoretic dispersion liquid 40 is disposed inside the pixel region A in the process P4 illustrated in FIG. 6, but as illustrated in FIG. 15, both inside and outside the pixel region A. It is also possible to dispose the electrophoretic dispersion liquid 40 on the surface. FIG. 15 illustrates a state in which the entire space surrounded by the joint 30 is filled with the electrophoretic dispersion 40 in the process P4. The liquid level of the electrophoretic dispersion liquid 40 is located between the upper surface of the bonding portion 30 (the surface of the sealing material 34) and the upper surface of the partition wall portion 26.

(4) In each of the above-described embodiments, the partition wall portion 26 having a shape that partitions the gap between the first substrate 10 and the second substrate 20 for each pixel is illustrated, but the shape of the partition wall portion 26 is not limited to the above examples. For example, it is also possible to form the partition wall 26 having a shape that partitions the gap between the first substrate 10 and the second substrate 20 into a plurality of spaces in units of a plurality of adjacent pixels. Further, the partition wall portion 26 does not have to be continuous over the entire surface of the second substrate 20, and the partition wall portion 26 can be configured by a plurality of portions spaced from each other.

<Electronic equipment>
The electrophoretic device 100 exemplified above can be used in various electronic devices. Specific modes of electronic devices using the electrophoresis apparatus 100 are exemplified below.

  FIG. 16 is a front view of a wristwatch 92 using the electrophoretic device 100 as a display device. As illustrated in FIG. 16, the wristwatch 92 is a wearable device including a housing 921 that houses the electrophoresis apparatus 100 and a band 922 that is coupled to the housing 921. The user can wear the wristwatch 92 by winding the band 922 around the wrist. The pixel area A of the electrophoretic device 100 is exposed from the opening 923 of the housing 921 and is used for displaying various information such as time. When the operation element 924 installed in the housing 921 is operated, for example, an image displayed in the pixel area A is changed.

  FIG. 17 is a perspective view of an electronic paper 94 using the electrophoresis apparatus 100. As illustrated in FIG. 17, the electronic paper 94 includes an electrophoretic device 100 that uses elastically deformable sheets as the first substrate 10 and the second substrate 20, and displays various images in the pixel region A. To do.

  The electronic device to which the present invention is applied is not limited to the above examples. For example, the electrophoretic device of the present invention can be used in various electronic devices such as an information terminal such as a mobile phone or an electronic book, a portable sound reproducing device, and a touch panel-mounted display device.

DESCRIPTION OF SYMBOLS 100 ... Electrophoresis apparatus, 10 ... 1st board | substrate, 12 ... Common electrode, 14 ... Insulating layer, 16, 52 ... Through-hole, 18, 54 ... Closure part, 20 ... 2nd board | substrate, 22 ... Circuit layer, 24 ... Pixel Electrode 26 ... Partition part 30 ... Joint part 32 ... Base part 34 ... Sealing material 40 ... Electrophoretic dispersion liquid 42 (42B, 42W) ... Charged particle 44 ... Dispersion medium A ... Pixel region C ... cell, R ... storage space.

Claims (8)

An electrophoretic dispersion containing charged particles and a dispersion medium;
A first substrate and a second substrate holding the electrophoretic dispersion;
A partition that partitions a gap between the first substrate and the second substrate into a plurality of cells filled with the electrophoretic dispersion,
An electrophoretic device, wherein at least one of the first substrate and the second substrate has a through hole formed outside a pixel region in which the plurality of cells are provided. The electrophoretic device according to claim 1, further comprising a closing portion that closes the through hole. Comprising a bonding portion for bonding the first substrate and the second substrate;
The electrophoretic device according to any one of claims 1 to 3, wherein the through hole is located in a region surrounded by the joint portion in plan view. The electrophoretic device according to claim 1, wherein an inner diameter of the through hole is larger than a particle size of the charged particles. The electrophoretic device according to claim 1, wherein a plurality of the through holes are formed at different positions in at least one of the first substrate and the second substrate.   An electronic apparatus comprising the electrophoretic device according to claim 1. An electrophoretic dispersion containing charged particles and a dispersion medium;
A first substrate and a second substrate holding the electrophoretic dispersion;
A method of manufacturing an electrophoresis apparatus comprising: a partition wall that partitions a gap between the first substrate and the second substrate into a plurality of cells,
A first step of disposing the electrophoretic dispersion on the surface of the second substrate on which the partition wall is formed;
A second step of bonding the first substrate and the second substrate through a bonding portion,
In at least one of the first substrate and the second substrate, a through hole is formed outside a pixel region where the plurality of cells are provided,
In the second step, the method for manufacturing an electrophoresis apparatus, wherein the electrophoresis dispersion liquid is caused to flow out of the through hole. The method for manufacturing an electrophoretic device according to claim 7, further comprising a third step of forming a closing portion that closes the through hole after the second step.

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