JP2018073975A - Manufacturing method of light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming an appropriate amount of uncured resin, on the lateral face of a light-emitting element.SOLUTION: A manufacturing method of light-emitting device includes a step of preparing a light-emitting element, a step of preparing a stamp pin having a recess including an opening wider than the width of the light-emitting element, a bottom face, and a wall at the tip, a step of making translucent resin adhere to the inside surface of the wall, and a step of arranging the opening of the recess of the stamp pin above the upper surface of the light-emitting element, arranging the inside surface of the wall to farther outside than the lateral face of the light-emitting element, and then moving a part of the wall until it is located below the upper surface of the light-emitting element, thus transferring the translucent resin adhering to the inside surface of the wall to the lateral face of the light-emitting element.SELECTED DRAWING: Figure 2B

Description

  The present disclosure relates to a method for manufacturing a light emitting device.

  2. Description of the Related Art A manufacturing method of a light emitting device including a step of supplying uncured resin on an upper surface of a semiconductor light emitting element (hereinafter referred to as a light emitting element) and placing a translucent plate-like member thereon is known (for example, a patent) Reference 1). The uncured resin is formed so as to cover a part of the side surface of the light emitting element by applying the weight or load of the translucent plate-like member.

JP 2013-197450 A

  There is a need for a method of forming an appropriate amount of uncured resin on the side surface of a light emitting element.

The present disclosure includes the following configurations.
A step of preparing a light emitting element, a step of preparing a stamp pin having a concave portion provided with an opening having a width wider than the width of the light emitting element, a bottom surface, and a wall portion at a tip thereof; and an inner surface of the wall portion A step of adhering a translucent resin, an opening of a concave portion of the stamp pin is disposed above the upper surface of the light emitting element, and an inner surface of the wall is disposed outside the side surface of the light emitting element. And a step of transferring a translucent resin adhering to the inner side surface of the wall portion to the side surface of the light emitting element, and a method for manufacturing the light emitting device.

  Thus, an appropriate amount of uncured resin can be formed on the side surface of the light emitting element.

FIG. 1A is a schematic top view showing the light emitting device according to the embodiment. FIG. 1B is a schematic cross-sectional view showing the light emitting device according to the embodiment. FIG. 1C is a schematic diagram illustrating a process of preparing the light emitting device according to the embodiment. FIG. 2A is a schematic side view showing the stamp pin according to the embodiment. FIG. 2B is a schematic perspective view showing a tip portion of the stamp pin shown in FIG. 2A. FIG. 2C is a schematic view of the stamp pin shown in FIG. 2A as viewed from the tip side. 2D is a schematic cross-sectional view taken along line 2D-2D in FIG. 2B. FIG. 3A is a schematic perspective view showing a modification of the stamp pin. FIG. 3B is a schematic perspective view showing a modification of the stamp pin. FIG. 4A is a schematic view illustrating a method for manufacturing the light emitting device according to the embodiment. FIG. 4B is a schematic view illustrating the method for manufacturing the light emitting device according to the embodiment. FIG. 5A is a schematic view illustrating a method for manufacturing the light emitting device according to the embodiment. FIG. 5B is a schematic view illustrating a method for manufacturing the light emitting device according to the embodiment. FIG. 6 is a schematic view illustrating a method for manufacturing the light emitting device according to the embodiment. FIG. 7A is a schematic view illustrating a method for manufacturing the light emitting device according to the embodiment. FIG. 7B is a schematic view illustrating a method for manufacturing the light emitting device according to the embodiment.

  A mode for carrying out the present invention will be described below with reference to the drawings. However, the form shown below illustrates the manufacturing method of the light-emitting device for embodying the technical idea of the present invention, and is not limited to the following. In addition, the dimensions, materials, shapes, relative arrangements, and the like of the component parts described in the embodiments are not intended to limit the scope of the present invention to that unless otherwise specified. It should be noted that the size and positional relationship of the members shown in each drawing may be exaggerated for clarity of explanation. In addition, terms indicating specific directions and positions (for example, “up”, “down”, “right”, “left” and other terms including those terms) are used as necessary. The use of these terms is to facilitate understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. Moreover, the same name is used for the translucent resin both before and after curing.

The manufacturing method of the light-emitting device according to the embodiment includes the following steps.
1) Step of preparing light emitting element 2) Step of preparing stamp pin 3) Step of attaching translucent resin to stamp pin 4) Step of transferring translucent resin from stamp pin to light emitting element Hereinafter, each step Explain in detail. The steps prepared in 1) and 2) are not limited to this order, and the step 1) may be performed after the step 2), or the steps 1) and 2) may be performed in parallel. Good.

1) Step of Preparing Light-Emitting Element An example of the light-emitting element 10 is shown in FIGS. 1A and 1B. As the light-emitting element, for example, a semiconductor light-emitting element such as a light-emitting diode can be used, and a light-emitting element capable of emitting visible light such as blue, green, and red and ultraviolet light can be used. The light emitting element 10 is a square having the same width Wc and length Lc. The light emitting element 10 is not limited to a square but may be a rectangle. In the case of a rectangle, either the long side or the short side is defined as the width Wc or the length Lc. The light emitting element 10 may be a polygon such as a hexagon or a triangle. The width and length in the case of a hexagon can be the distance between two opposing sides. As for the width and length in the case of a triangle, any one side can be defined as a width, and a distance to a vertex facing the one side can be defined as a length.

  The light emitting element 10 includes a laminated structure 11 including a light emitting layer and an electrode 12. The laminated structure 11 includes a lower surface (electrode forming surface) 10d on which the electrode 12 is formed, an upper surface (light extraction surface) 10a opposite to the lower surface (electrode extraction surface) 10a, and a side surface 10b between the upper surface 10a and the lower surface 10d. . The upper surface 10 a of the laminated structure 11 is also the upper surface of the light emitting element 10. The side surface 10 b of the laminated structure 11 is also the side surface of the light emitting element 10. The lower surface of the electrode 12 is the lower surface 10 c of the light emitting element 10. The height Hc of the light emitting element 10 is the total height of the stacked structure 11 and the electrode 12.

The stacked structure includes a semiconductor layer including a light emitting layer. Furthermore, you may provide the translucent board | substrates, such as sapphire. As an example of the semiconductor stacked body, a semiconductor layer of a first conductivity type semiconductor layer (for example, an n-type semiconductor layer), a light emitting layer (active layer), and a second conductivity type semiconductor layer (for example, a p-type semiconductor layer) can be included. . The semiconductor layer capable of emitting visible light from ultraviolet light or blue light to green light can be formed from a semiconductor material such as a III-V group compound semiconductor, for example. _{Specifically,} it is possible to use _{In X Al Y Ga 1-X} -Y N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) nitride-based semiconductor material or the like. As the semiconductor stack capable of emitting red light, GaAs, GaAlAs, GaP, InGaAs, InGaAsP, or the like can be used.

  The light emitting element includes a pair of electrodes, and is disposed on the same surface side (electrode formation surface) as the lower surface of the multilayer structure. The pair of electrodes may have a single-layer structure or a stacked structure as long as they are ohmic-connected to the stacked structure so that the current-voltage characteristics are linear or substantially linear. Such an electrode can be formed with an arbitrary thickness using materials and configurations known in the art. For example, the thickness of the electrode is preferably a few tens of μm to 300 μm. Moreover, a good electrical conductor can be used as an electrode, for example, metals, such as Cu, are suitable. Various electrode shapes can be selected depending on the purpose and application. The pair of electrodes of the light emitting element may have the same shape or different shapes.

  The step of preparing the light emitting element can be prepared by purchasing the light emitting element as described above, or by forming a part or all of the constituent members, processing, dividing, and the like.

  Moreover, it is preferable to place the prepared light emitting element on the sheet | seat S1 provided with adhesiveness, for example, as shown to FIG. 1C. At that time, the electrode 12 of the light emitting element 10 is preferably placed so as to be in contact with the upper surface of the sheet S1. A plurality of light emitting elements 10 can be arranged on one sheet S1. Such a sheet S1 may be a member used only in the manufacturing process of the light emitting device. That is, it can be used as a member that is not a constituent member of the finally obtained light-emitting device. Further, the sheet S1 may be a member that is a constituent member of the finally obtained light emitting device. For example, a flexible substrate provided with wiring on a resin sheet such as polyimide may be used. Alternatively, a rigid substrate such as a ceramic substrate or a glass epoxy substrate may be used. In the case where such a substrate that is a constituent member of the finally obtained light emitting device is used, it is preferable that the substrate and the electrode of the light emitting element are connected to each other by a conductive bonding member such as solder.

2) Step of Preparing Stamp Pin An example of the stamp pin 20 is shown in FIGS. 2A to 2D. The stamp pin 20 is a component used in a die bonder (die bonding apparatus), and is used by being attached to an arm movable in the vertical direction, the horizontal direction, the front-rear direction, and the like. The stamp pin 20 is a member having an appearance as shown in FIG. 2A, and is a long member having a main body portion 21 and a distal end portion 22 provided on the distal end side thereof and having a tapered outer diameter. .

  In the stamp pin 20, the main body portion 21 has a columnar shape, and the tip portion 22 includes a truncated cone portion and a quadrangular columnar portion. The main body 21 may be a prism, and the tip 22 may be a truncated pyramid and a quadrangular prism. Note that the tip portion does not have to have a frustum portion.

  The front end portion 22 of the stamp pin 20 has a recess 23 composed of an opening 233 that opens to the end surface that is the most distal end, a bottom surface 231, and a wall portion 232. The bottom surface 231 of the recess 23 is square, and the wall portion 232 is formed in a frame shape along the four sides so as to surround the bottom surface 231. The opening 233 of the recess is also square. The wall portion 232 has an inner side surface 232a constituting the inner side surface of the recess 23 and an outer side surface 232c opposite to the inner side surface 232a. Furthermore, the lower surface 232b between the inner surface 232a and the outer surface 232c is provided. Moreover, as shown to FIG. 3A, it is good also as the front-end | tip part 22A provided with one wall part in two opposing sides, respectively. Or as shown to FIG. 3B, it is good also as the front-end | tip part 22B provided with four wall parts spaced apart in four sides, respectively.

  The height Hr of the wall portion 232 of the stamp pin 20 is equal to or less than that of the laminated structure 11. The inner side surface 232a of the wall portion 232 can be a surface substantially parallel to the side surface 10b of the light emitting element 10 or a surface inclined with respect to the side surface 10b of the light emitting element. The outer surface 232c of the wall 232 can be a surface parallel to the inner surface 232a or a surface inclined with respect to the inner surface 232a. The width of the lower surface 232b of the wall 232 (the shortest distance between the lower end of the inner surface and the lower end of the outer surface) can be, for example, about 10% to 50% of the width or length of the light emitting element. Further, the inner surface 232a and the outer surface 232c may contact each other at the lower end. That is, it is not necessary to have a lower surface between the inner surface 232a and the outer surface 232c.

The width Wr of the recess opening 233 is wider than the width Wc of the light emitting element. For example, the width Wr of the opening 233 can be set to be about 60 to 120 μm larger than the width Wc of the light emitting element. For example, when the width Wc of the light emitting element is about 200 μm, the width Wr of the opening 233 of the recess can be about 300 μm. The length Lr of the opening 233 is longer than the length Lc of the light emitting element. For example, the length Lr of the opening 233 can be a width that is about 60 to 120 μm larger than the length Lc of the light emitting element. For example, when the length Lc of the light emitting element is about 1100 μm, the opening 233 length Lr can be about 1200 μm.
When the inner surface 232a of the recess is inclined so as to become wider toward the opening, the width of the opening only needs to be wider than the width Wc of the light emitting element.

  When the light-emitting element is a polygon other than a quadrangle, the shape of the opening of the recess is preferably a shape corresponding to the number of sides of the light-emitting element. For example, in the case of a hexagonal light emitting element, the shape of the opening of the recess is preferably a hexagon. When the opening of the recess is a polygon other than a rectangle, the width or length of the recess can be defined as the width or length of one side of the opening of the recess.

  The stamp pin 20 is made of a hard material. For example, ceramics, cemented carbide, hard resin and the like can be mentioned. The size of the stamp pin can be changed as appropriate according to the size of the light emitting element.

3) Step of attaching translucent resin to stamp pin Next, as shown in FIG. 4A, translucent resin is attached to the stamp pin 20. The resin dish 200 provided in the die bonder holds a fluid uncured translucent resin 40a. The stamp pin 20 is placed on the resin dish 200 and lowered. A part of the tip portion 22 of the stamp pin 20 is lowered to a position where the stamp pin 20 is immersed in the translucent resin 40a. Specifically, the tip 22 is lowered to a position where the bottom surface 231 of the recess 23 is immersed. Alternatively, the translucent resin 40 a may be thick enough to immerse the bottom surface 231, and the stamp pin may be lowered until it contacts the resin dish 200.

  Next, the stamp pin 20 is raised. As shown in FIG. 4B, a part of the translucent resin 40 a in the resin dish 200 is attached to the tip portion 22 of the stamp pin 20. Specifically, the translucent resin 40 a is attached to the inner surface 232 a of the wall portion 232 of the recess 23. The translucent resin 40 a adheres to the lower surface 232 b and the outer surface 232 c of the wall portion 232, and further adheres to the bottom surface 231 of the recess 23.

  In addition, the translucent resin 40a should just adhere to the inner surface of the wall part at least. Therefore, for example, as shown in FIG. 7A, the stamp pin may be lowered so that the bottom surface of the concave portion of the distal end portion 22c does not contact the translucent resin 40a. In such a case, as shown in FIG. 7B, the amount of translucent resin 40a adhering to the tip portion 22c of the stamp pin can be reduced.

4) Step of transferring translucent resin from stamp pin to light emitting element The stamp pin 20 to which the translucent resin 40 a is attached is disposed above the upper surface of the light emitting element 10. Specifically, the stamp pin 20 is arranged so that the center of the recess 23 and the center of the light emitting element 10 substantially coincide. Furthermore, it arrange | positions so that the wall part 232 may be located in the outer side of the side surface 10b of the light emitting element 10. FIG. Then, as shown in FIG. 5A, the stamp pin 20 is moved until a part of the wall portion 232 is positioned below the upper surface 10 a of the light emitting element 10. Thereafter, by raising the stamp pin 20, the translucent resin 40a attached to the inner surface 232a of the wall 232 can be transferred to the side surface 10b of the light emitting element 10 as shown in FIG. 5B. Further, the translucent resin 40 a is also transferred to the upper surface of the light emitting element 10. As shown in FIG. 7B, when the translucent resin 40a is not attached to the bottom surface of the recess of the stamp pin, the translucent resin 40a is transferred only to the side surface of the light emitting element 10.

  As described above, after forming the translucent resin 40 on the upper surface and side surfaces of the light emitting element, the light emitting device 100 can be obtained through the following steps. FIG. 6 shows an example of a process for obtaining a light emitting device.

  FIG. 6A is a diagram illustrating a state in which the light emitting element 10 having the translucent resin 40 formed on the upper surface and the side surface is disposed on the sheet S1. Here, a state in which two light emitting elements 10 are arranged side by side is shown. Three or more light emitting elements 10 can be arranged. The light emitting elements 10 are preferably arranged at equal intervals.

  FIG. 6B is a diagram illustrating a state where the translucent plate-like member 50 is placed on the translucent resin 40. The translucent plate member 50 is a member placed on the upper surface 10a of the light emitting element 10, and light from the light emitting element 10 is transmitted through the translucent plate member and emitted to the outside. The translucent resin 40 can function as an adhesive between the light emitting element 10 and the translucent plate member. By forming the translucent resin on the upper surface of the light emitting element, the adhesive strength between the translucent plate-like member and the light emitting element can be improved.

  As shown in FIG. 7B, when the translucent resin is not attached to the bottom surface of the concave portion at the tip of the stamp pin, the translucent resin is not transferred to the upper surface of the light emitting element. Therefore, the translucent plate-like member is disposed on the upper surface of the light emitting element without interposing a translucent resin. The amount of the translucent resin can be appropriately selected according to the purpose and application.

  In addition, although the translucent plate-shaped member 50 is made into "plate shape" for convenience, it refers to the member containing various shapes, such as a sheet form, a film form, a block form, and uses translucent resin as an adhesive agent. A member attached to the top surface of the light emitting element. In other words, the translucent plate-like member 50 is a member molded in a state that can be transported as an individual.

  The translucent resin 40 is uncured before the translucent plate-like member 50 is placed. Therefore, the translucent resin 40 can be pressed and deformed when the translucent plate-like member 50 is placed. Thereby, as shown in FIG.6 (b), the outer surface of the translucent resin 40 turns into the inclined surface.

  As the translucent plate-shaped member, translucent resin, glass, or the like can be used. In particular, a translucent resin is preferable, and a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin, or a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a methylpentene resin, or a polynorbornene resin is used. it can. In particular, a silicone resin excellent in light resistance and heat resistance is suitable.

The translucent plate-shaped member may include a phosphor as a wavelength conversion member in addition to the above translucent material. A phosphor that can be excited by light emitted from the light emitting element is used. For example, phosphors that can be excited by blue light-emitting elements or ultraviolet light-emitting elements include yttrium-aluminum-garnet phosphors (YAG: Ce) activated by cerium; lutetium-aluminum-garnet-based phosphors activated by cerium (LAG: Ce); Nitrogen-containing calcium aluminosilicate phosphor activated with europium and / or chromium (CaO—Al ₂ O ₃ —SiO ₂ ); Silicate phosphor activated with europium ((Sr, Ba)) ₂ SiO ₄ ); nitride phosphor such as β sialon phosphor, CASN phosphor, SCASN phosphor; KSF phosphor (K ₂ SiF ₆ : Mn); sulfide phosphor, quantum dot phosphor Etc. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, light emitting devices of various colors (for example, white light emitting devices) can be manufactured.
Moreover, you may make a translucent plate-shaped member contain various fillers etc. for the purpose of adjusting a viscosity.

  The translucent plate-like member can have a thickness of 50 μm to 500 μm, for example. In addition, the size in a top view can be a size that is approximately equal to the area of the top surface of the light emitting element or a size that approximates the size.

  Next, the light shielding member 60 is formed. FIG. 6C is a diagram illustrating a state in which the light shielding member 60 is formed around the light emitting element. The light shielding member 60 is formed so as to fill a space between adjacent light emitting elements. It is preferable to form the light shielding member 60 also under the light emitting element. Moreover, it is preferable to form the light-shielding member 60 so as not to cover the upper surface of the translucent plate-like member 50. Further, the light shielding member 60 is preferably formed so as to cover all of the translucent resin 40 formed on the side surface of the light emitting element.

  The light shielding member 60 is preferably a light reflective resin member. The light reflectivity means that the reflectance with respect to light from the light emitting element is 70% or more. For example, the light shielding member 60 is preferably a white resin. The light reaching the light shielding member is reflected and travels toward the light emitting surface of the light emitting device, whereby the light extraction efficiency of the light emitting device can be increased.

  The light shielding member 60 is preferably a resin member mainly composed of a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin. And what made the light-reflective substance disperse | distribute to these translucent resins can be used. As the light reflective substance, for example, titanium oxide, silicon oxide, zirconium oxide, potassium titanate, aluminum oxide, aluminum nitride, boron nitride, mullite and the like are suitable. The light-reflective material may be in the form of particles, fibers, thin plate pieces, etc., but the fiber-like material is particularly preferable because it can be expected to reduce the thermal expansion coefficient of the light-shielding member.

  After curing the light-shielding member 60, the light-shielding member 60 between the light-emitting elements is cut to obtain the singulated light-emitting device 100 as shown in FIG. Note that part or all of the sheet S1 may be cut when cutting.

  The light emitting device manufacturing method according to the present invention can be applied to a light emitting device manufacturing method including a step of forming an uncured resin on a light emitting element.

DESCRIPTION OF SYMBOLS 10 ... Light emitting element 11 ... Laminated structure 12 ... Electrode 10a ... Upper surface (light extraction surface) of a light emitting element
10b: side surface of light emitting element 10c: lower surface of light emitting element (lower surface of electrode)
10d: Lower surface of laminated structure (electrode formation surface)
Wc: Width of the light emitting element Lc: Length of the light emitting element Hc: Height of the light emitting element 20 ... Stamp pin 21 ... Main body part 22, 22A, 22B, 22C ... Tip part 23 ... Concave part 231 ... Concave surface 232 ... Concave part Wall portion 233 ... Opening portion of recess 232a ... Inner side surface of wall portion 232b ... Lower surface of wall portion 232c ... Outer surface of wall portion Wp ... End face width Lp ... End face length Wr ... Depression opening width Lr ... Recess portion Length of opening Hr: Height of wall portion of recess 100: Light emitting device 40, 40a ... Translucent resin 50 ... Translucent plate member 60 ... Light shielding member 200 ... Resin plate S1 ... Sheet

Claims (3)

Preparing a light emitting element;
A step of preparing a stamp pin having a concave portion provided with an opening having a width wider than the width of the light emitting element, a bottom surface, and a wall portion at a tip;
Attaching a translucent resin to the inner surface of the wall;
The opening of the concave portion of the stamp pin is disposed above the upper surface of the light emitting element, and the inner side surface of the wall portion is disposed outside the side surface of the light emitting element, and a part of the wall portion is Moving the light-transmitting resin attached to the inner side surface of the wall part to the side surface of the light-emitting element by moving the light-emitting element until it is located below the upper surface of the light-emitting element;
A method for manufacturing a light emitting device.   The method of manufacturing a light emitting device according to claim 1, wherein the translucent resin is attached to the bottom surface of the recess.   The light-emitting device according to claim 1, further comprising a step of forming a light-blocking member that covers the light-transmitting resin after the light-transmitting plate-shaped member is disposed on the upper surface of the light-emitting element. Production method.

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