JP2018069440A - Method of manufacturing hollow structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a hollow structure, which makes an environmental load low and makes steps simple, by an additive process without use of a sacrifice layer.SOLUTION: A hollow structure is manufactured by a step of applying resin-containing ink onto a low surface energy material layer formed on a surface of a base material for transfer, a resin-containing layer formation step of turning the applied ink into a resin-containing layer, and a transfer step of forming the hollow structure, which has a partially-opened space between the resin-containing layer and the base material, by transferring the resin-containing layer to the base material by using an adhesive joint.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a hollow structure used for a MEMS element or the like.

  In recent years, development of MEMS (Micro Electro Mechanical System) in which fine mechanical elements and electronic circuit elements are fused has been advanced. Since the MEMS element generally has a movable structure that moves mechanically (also referred to as a “movable part”), a hollow structure for operating at least the fine movable part is required. For example, as a MEMS element having a hollow structure, there are a pressure sensor, a thermal diaphragm sensor, an acceleration sensor, an acoustic device, and the like (see Patent Documents 1 to 3 and Non-Patent Documents 1 to 4).

  A pressure sensor (also called “diaphragm gauge” or “diaphragm sensor”) detects pressure applied to a diaphragm (diaphragm) as deformation of the membrane. The method of detecting the deformation includes a change in capacitance. Used. For example, in the diaphragm sensor disclosed in Patent Document 1 relating to a pressure sensor, a thermal sensor, and a radiation sensor, there is a thin layer (diaphragm layer) deposited on a substrate such as Si, and a free space that maintains a space under the thin layer. To do. In Patent Document 1, as a manufacturing method for producing a free space under a diaphragm layer, a sacrificial layer is partially formed on the substrate, and the sacrificial layer is removed with a solvent. Due to the hollow chamber formed under this diaphragm layer, the diaphragm layer becomes free and displaceable and is thermally decoupled from the substrate. In addition, an additional absorber layer made up of a conductor path for a heater or a sensor, a black layer for a radiation sensor, or the like is deposited on the diaphragm layer according to the purpose of the sensor.

  It is known that an acceleration sensor measures acceleration by measuring displacement of a beam spring (see Patent Document 2).

  Further, a hollow structure element is known in which a hollow space is formed inside a recess formed in a substrate, and a structure is formed, for example, in a cantilever shape in the hollow space (see Patent Document 3). Patent Document 3 exemplifies an acoustic device called FBAR (Film Bulk Acoustic Resonator), and includes a structure in which a lower electrode, a piezoelectric film, and an upper electrode are stacked as the structure, and a space between the lower electrode and the upper electrode. It is shown that a part of electric energy is converted into a sound wave by the piezoelectric effect of the piezoelectric film by applying an electric field that changes with time. In Patent Document 3, various devices including other hollow structures such as an acceleration sensor and a pressure sensor are also cited as hollow structure elements, not limited to FBAR.

  As a result of a prior literature search, the following patent document 4 was known. Patent Document 4 discloses a thin film forming method for forming a thin film in a state in which a space of a concave portion is maintained on a substrate having a concave portion for sealing. Specifically, a coating liquid containing a thin film raw material to be a thin film material and an organic material composed of an organic compound having a surface energy smaller than that of the thin film raw material is applied to the main surface of the substrate to form a coating film, and then the coating is performed. A method is shown in which a thin film is formed on the main surface of the substrate by bringing the film into contact with the main surface of the substrate, applying load and heating, and then releasing the base material.

Japanese translation of PCT publication No. 2001-510441 JP 2007-229825 A JP 2005-342817 A JP 2008-251816 A

C. Wu, V. Petrini, E. Joseph and F. Amiot, Microelectron. Eng. 119, 1 (2014). A. Johansson, M. Calleja, P.A.Rasmussen and A. Boisen, Sens. Actuators A 123-124, 111 (2005). H. S. Wasisto, S. Merzsch, A. Waag, E. Uhde, T. Salthammer and E. Peiner, Sens. Actuators A 202, 90 (2013). R. Bogue, Sens. Rev. 34, 137 (2014).

  Conventionally, a hollow structure body in a MEMS element or the like has a hollow portion formed by etching and removing the sacrificial layer after proceeding with a sacrificial layer provided in a hollow portion as in Patent Documents 1 to 3. It was manufactured by the method of forming. In the conventional manufacturing method, since a sacrificial layer is used, the process of forming a hollow structure is complicated, and there is a problem that material and energy are wasted. Non-Patent Documents 1 to 3 report that a cantilever structure that is a hollow structure can be used as a main part of various sensors. Further, as described in Non-Patent Document 4, the use of sensor devices is further expanded in the future, and it is predicted that as many as 1 trillion sensors will be manufactured annually in the near future. In such mass production, waste of materials and energy generated by a process using a conventional sacrificial layer is not negligible from the viewpoint of low environmental load and energy saving. Therefore, a simpler manufacturing method is required.

  Conventionally, displacement members such as a pressure sensor, a thermal diaphragm sensor, an acceleration sensor, and an acoustic device having a hollow structure, such as a cantilever beam or a double beam beam, have been metal or Si-based inorganic compound films. It was. The displacement amount of the displacement member is determined by the Young's modulus, and the Young's modulus is determined by the material of the displacement member. If the material of the displacement member is limited to only the inorganic compound film, there is a problem that the range of selectivity of Young's modulus becomes narrow.

  The present invention is intended to solve these problems, and an object thereof is to provide a manufacturing method capable of manufacturing a hollow structure without using a sacrificial layer.

In order to achieve the above object, the present invention has the following features.
(1) A step of applying an ink containing a resin on a low surface energy material layer formed on the surface of a transfer substrate, a resin-containing layer forming step of making the applied ink a resin-containing layer, and the resin A transfer step of forming a hollow structure having a space partially opened between the resin-containing layer and the base material by transferring the content layer to the base material using an adhesive portion. A method for producing a hollow structure, characterized by that.
(2) In the transferring step, the transfer base material on which the resin-containing layer is formed and the base material are bonded so that the resin-containing layer side of the transfer base material faces the base material. The adhesive force formed between the adhesive portion and the base material is greater than the adhesive force formed between the low surface energy material and the resin-containing layer, so that the resin A hollow structure body comprising at least the base material, the adhesive portion, and the resin-containing layer is obtained by peeling a content layer from the transfer base material side. Method.
(3) In the transfer step, the transfer base material on which the resin-containing layer is formed and the base material on which the support layer is provided, and the resin-containing layer side of the transfer base material is the support layer on the base material. A hollow provided with the base material, the strut layer, the adhesive portion, and the resin-containing layer by making contact with the adhesive portion so as to face each other, peeling the resin-containing layer from the transfer base material side A method for producing a hollow structure according to (1), wherein a structure is obtained.
(4) In the transfer step, the adhesive portion is adhered to the resin-containing layer, and the resin-containing layer and the adhesive portion are peeled from the transfer base material, and then the resin-containing layer and the support column of the base material A hollow structure comprising the base material, the support layer, the adhesive portion, and the resin-containing layer is obtained by adhering with the adhesive portion so that the layers face each other. Manufacturing method of structure.
(5) The manufacturing of the hollow structure according to any one of (1) to (4), wherein in the transfer step, the adhesive portion is cured using at least one of heating and ultraviolet irradiation. Method.
(6) A step of applying an ink containing a resin on a low surface energy material layer formed on the surface of the transfer substrate, a transfer substrate having the ink application layer, and a support provided on the substrate In a state where the coating layer is in contact with the coating layer so as to face the support layer, the coating layer is cured to form a resin-containing layer, and then the resin-containing layer is peeled from the transfer substrate side. And a transfer step of forming a hollow structure having a space partially opened between the resin-containing layer and the base material.
(7) The method for producing a hollow structure according to (6), wherein, in the transfer step, the coating layer is cured using at least one of heating and ultraviolet irradiation.
(8) The method for producing a hollow structure according to any one of (1) to (7), wherein the resin-containing layer includes one layer or a plurality of layers.
(9) The method for producing a hollow structure according to any one of (1) to (8), wherein the resin-containing layer has a structure in which a layer not containing a resin is embedded.
(10) The method for producing a hollow structure according to any one of (1) to (9), wherein the resin-containing layer contains functional particles.
(11) The method for producing a hollow structure according to any one of (1) to (10), wherein the resin-containing layer is a displacement member.

  According to the present invention, it is possible to realize a method of forming an additional film on a necessary portion instead of removing an unnecessary portion after forming a sacrificial layer as in the prior art. Therefore, according to the present invention, the hollow structure can be manufactured with a low environmental load and can be formed in a reduced process.

  In this invention, since the member which comprises a hollow structure can be formed with a resin content layer, desired Young's modulus etc. can be designed according to the elements, such as target MEMS. In addition, according to the present invention, functional particles such as conductive particles, luminescent particles, piezoelectric particles, and semiconductive particles can be mixed in the resin-containing layer. It can be applied to members, semiconductor members, displacement members of sensors, and the like.

It is a figure explaining the manufacturing method of the hollow structure of the 1st Embodiment of this invention. It is a figure explaining the manufacturing method of the hollow structure of the 2nd Embodiment of this invention. It is a figure explaining the manufacturing method of the hollow structure of the 3rd Embodiment of this invention. It is a figure explaining the manufacturing method of the hollow structure of the 4th Embodiment of this invention. It is a figure explaining the manufacturing method of the hollow structure of the 5th Embodiment of this invention. It is a figure explaining the manufacturing method of the hollow structure of the 6th Embodiment of this invention. It is a figure explaining the manufacturing method of the hollow structure of the 7th Embodiment of this invention. It is a perspective view of the hollow structure of the 7th Embodiment of this invention. It is a figure which shows the change of the load, the displacement amount of a cantilever, and an electrostatic capacitance in the load sensor of the 8th Embodiment of this invention. It is a figure explaining the manufacturing method of the hollow structure of the 9th Embodiment of this invention. It is a figure explaining the manufacturing method of the hollow structure of the 10th Embodiment of this invention.

  Embodiments of the present invention will be described below.

  The present inventor has paid attention to the following points in manufacturing a cantilever-like or doubly-supported displacement member that can be used for a load sensor or the like in a research process for advancing the technical development of a hollow structure. First, the range of selection of the material for the displacement member is not limited to the conventional inorganic compounds, but a new option is realized, and second, the addition without using a sacrificial layer in the manufacturing method of the hollow structure It is to realize an additive method. Therefore, in the present embodiment, a method for manufacturing the hollow structure is realized by transferring the main layer of the hollow structure that maintains the space by applying an ink layer containing a resin and then transferring the layer.

The main manufacturing process in the embodiment of the present invention is the following process.
(A) The process of apply | coating the ink containing resin on the low surface energy material layer formed in the surface of the base material for transcription | transfer.
(B) A resin-containing layer forming step in which the applied ink is used as a resin-containing layer.
(C) By transferring the resin-containing layer to a base material using an adhesive portion, a hollow structure having a space partially opened between the resin-containing layer and the base material is formed. Transfer process.

  The substrate for transfer is not particularly limited as long as the low surface energy material can be uniformly laminated on the surface. Specific examples include metal plates and metal foils made of glass, aluminum, stainless steel, etc., plate-like plastics, thin-film plastic films, paper, and the like.

  The low surface energy material that covers the transfer substrate is preferably a material that easily peels off the ink of the upper layer of the transfer substrate in a later step. Specifically, polydimethylsiloxane and its derivatives and copolymers, resin materials whose terminal groups are fluorine-substituted, such as polytetrafluoroethylene, and surface treatments whose terminal groups are fluorine-substituted, such as fluorinated organopolysiloxanes And surface modifiers such as fluorinated organosilanes and fluorinated alkanethiols.

  The reason for using the ink containing the resin is to have a high cohesive force, and when contacting through the adhesive portion described later, the entire layer including the non-contact portion is transferred regardless of the partial contact. This is to make it possible. When a layer that does not contain a resin is used, only the contact portion with the adhesive portion is transferred, making it impossible to form a hollow structure. Here, the resin is not particularly limited as long as it becomes a film when dried or cured. Examples include polyethylene, polypropylene, polyvinyl alcohol, polystyrene, polyvinyl pyrrolidone, polyvinyl phenol, polyimide, polyamide, polyphthalamide, polyvinyl fluoride, polymethyl methacrylate, polyvinyl chloride, polytetrafluoroethylene, and polyvinylidene fluoride. Epoxy resin, acrylic resin, urethane resin, silicone resin, butyl rubber, isoprene rubber, butadiene rubber, styrene butadiene rubber, natural rubber, and the like. These listed resins are all insulating (dielectric) materials, but may be conductive or semiconductive resins. Examples of the conductive material include PEDOT and PEDOT / PSS, and examples of the semiconductor material include polythiophene and derivatives thereof. These resin materials may be used alone or a plurality of types may be mixed.

  The solvent used for converting the resin into an ink is not particularly limited as long as it dissolves the target resin. For example, methanol, ethanol, isopropanol, 1-butanol, tertiary butanol, isobutanol, diacetone alcohol, acetone, propylene glycol 1-monomethyl ether 2-acetate, methyl ethyl ketone, diethyl ketone, methyl isobutyl ketone, cyclohexanone, ethyl acetate, Methyl acetate, butyl acetate, methoxybutyl acetate, cellosolve acetate, amyl acetate, normal propyl acetate, isopropyl acetate, methyl lactate, ethyl lactate, butyl lactate, dibutyl ether, tetrahydrofuran, dioxane, ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, diethylene glycol mono Examples include ethyl ether, diethylene glycol diethyl ether, butyl cellosolve, and water. .

Functional particles may be mixed in the ink for the purpose of imparting a function to the hollow structure. For example, gold, silver, copper, aluminum, nickel, silicon (silicon), silicon carbide, carbon nanotube, graphene, ITO, IZO and the like can be used for the expression of conductivity. Examples of semiconducting properties include organic semiconductors such as carbon nanotubes, fullerenes, rubrenes, and low molecular thiophene derivatives, ZnO, ZnS, TiO ₂ , IGZO, and the like.

  A polymerization initiator may be added to the ink for the purpose of promoting or controlling the curing of the film. Examples of the polymerization initiator by light include acetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 4-isopropyl-2-hydroxy-2-methylpropiophenone, 2-hydroxy- 2-methylpropiophenone, 4,4′-bis (diethylamino) benzophenone, benzophenone, methyl (o-benzoyl) benzoate, 1-phenyl-1,2-propanedione-2- (o-ethoxycarbonyl) oxime, 1 -Phenyl-1,2-propanedione-2- (o-benzoyl) oxime, benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin octyl ether, benzyl, benzyldimethylketer , Benzyl diethyl ketal, carbonyl compounds diacetyl such as methyl anthraquinone, chloroanthraquinone, chlorothioxanthone, 2-methyl thioxanthone, anthraquinone or thioxanthone derivatives such as 2-isopropylthioxanthone, diphenyl disulfide, sulfur compounds such as dithiocarbamate. As the polymerization initiator by heat, 2,2′-azobisisobutyronitrile, 2,2′-azobisisovaleronitrile, 2,2′-azobis (2,4-dimethylvaleronitrile), 4, 4'-azobis (4-cyanovaleric acid), 1,1'-azobis (cyclohexanecarbonitrile), 2,2'-azobis (2-methylpropane), 2,2'-azobis (2-methylpropionamidine) ) Azo compounds such as dihydrochloride, ketone peroxides such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, acetylacetone peroxide, isobutyl peroxide, benzoyl peroxide, 2,4-dichlorobenzoyl peroxide , O-methylbenzoyl peroxide, lauroyl peroxide Diacyl peroxides such as p-chlorobenzoyl peroxide, hydroperoxides such as 2,4,4-trimethylpentyl-2-hydroperoxide, diisopropylbenzene peroxide, cumene hydroperoxide, tert-butyl peroxide Dialkyl peroxides such as dicumyl peroxide, tert-butyl cumyl peroxide, di-tert-butyl peroxide, tris (tert-butylperoxy) triazine, 1,1-di-tert-butylperoxycyclohexane, Peroxyketals such as 2,2-di (tert-butylperoxy) butane, tert-butylperoxypivalate, tert-butylperoxy-2-ethylhexanoate, tert-butylperoxyisobutyrate, Z-ter t-butylperoxyhexahydroterephthalate, di-tert-butylperoxyazelate, tert-butylperoxy-3,5,5-trimethylhexanoate, tert-butylperoxyacetate, tert-butylperoxybenzoate, Examples include alkyl peresters such as di-tert-butylperoxytrimethyladipate, and percarbonates such as diisopropylperoxydicarbonate, di-sec-butylperoxydicarbonate, and tert-butylperoxyisopropylcarbonate.

  Other materials may be added to the ink for the purpose of adjusting wettability to a low surface energy material. For example, a fluorine-based surfactant or a silicone-based surfactant can be used.

  As a method for forming ink on the surface of a low surface energy material, general coating and printing methods are widely used. Specifically, inkjet method, screen printing method, spin coating method, bar coating method, slit coating method, dip coating method, spray coating method, gravure printing method, flexographic printing method, gravure offset method, letterpress offset method, microcontact A printing method, a letterpress reverse printing method, or the like can be used.

  The resin-containing layer forming step is a step of forming a resin-containing layer by drying or curing the coating layer of the ink containing the resin. The resin-containing layer can also be referred to as, for example, a resin film, and is a state in which the ink that has become liquid by dissolving or dispersing the resin material in a solvent becomes a solid by solvent removal by drying. Sure. At this time, the resin polymerization reaction or condensation reaction may not be completely completed. This includes cases where polymerization or condensation treatment (exposure, etc.) is performed later.

  The step of curing or drying the ink is not particularly limited as long as it is a method for changing the ink into a film, but heat treatment using an oven or a hot plate, light irradiation including ultraviolet light or a high-power flash lamp is specifically performed. Take as an example. By this step, the cohesive force of the film is increased, and the entire layer including the non-contact portion can be transferred by the contact through the adhesive portion described later, despite the partial contact.

  As the adhesive portion, a wide range of commonly used adhesive materials can be used, as long as the cured or dried ink of this embodiment and the element substrate can be appropriately joined together, There is no particular limitation. Specific examples include water-soluble adhesives such as vinyl acetate emulsion, rubber adhesives such as nitrile rubber, epoxy adhesives, acrylic adhesives, vinyl adhesives, silicone rubber adhesives, ABS resins, and polycarbonates. Resin adhesives such as polyamide and acrylic. In addition, a conductive adhesive (eg, Fujikura Kasei Co., Ltd. Dotite FA-705BN) can also be used.

  The area where the adhesive portion and the resin-containing layer are in contact is related to the possibility of transfer in a later step, and is preferably at least 1/10 of the area where the resin-containing layer is in contact with the low surface energy material. It is more preferable that

  As a method for forming the adhesive portion, general coating and printing methods are widely used. Specifically, inkjet method, screen printing method, spin coating method, bar coating method, slit coating method, dip coating method, spray coating method, gravure printing method, flexographic printing method, gravure offset method, letterpress offset method, micro contact printing And letterpress reverse printing can be used.

  The element base material is not particularly limited as long as the adhesiveness of the bonding portion can function. Specific examples include metal plates and metal foils made of glass, aluminum, stainless steel, etc., plate-like plastics, thin-film plastic films, paper, and the like. In addition, one or more other layers may be laminated on the surface of these base materials, and the surface may not be flat, for example, the surface may include an uneven structure.

  The method for bringing the element base material into contact with the transfer base material on which ink or the like is formed is not particularly limited as long as the bonding portion and a part of the base material are in physical contact with each other. The two substrates may be fixed to each other in a flat shape, or may be fixed to each other in a roll shape, or one may be fixed in a flat shape and the other may be fixed in a roll shape.

  The hollow structure of the present embodiment has a structure in which a partly open space is provided between the resin-containing layer and the base material. The hollow structure includes a hollow portion and peripheral members that maintain the hollow portion. For example, the peripheral member fixes the element substrate on the first surface, the resin-containing layer on the second surface facing the element substrate, the first surface and the second surface, and And at least a member constituting the third surface having a function of adjusting the interval. For example, if the hollow space is a substantially rectangular parallelepiped, the remaining fourth surface, fifth surface, and sixth surface may be open spaces where no peripheral members are present. Further, the cantilever shape described later is an example of a space in which three side surfaces are open, and the double-sided beam shape is an example of a space in which both side surfaces are open. The resin-containing layer in the form of a cantilever or cantilever forms a hollow structure in which the resin-containing layer is partially suspended from the base material. Examples of the member constituting the third surface include a combined use of an adhesive portion and a support layer, or an adhesive portion.

  The transfer process will be specifically described in each embodiment described later.

The modification of the main manufacturing steps (a), (b) and (c) in the embodiment of the present invention is a step including the following steps (d) and (e). In this method, instead of connecting by a connecting portion, the ink coating layer itself is transferred to the substrate side by the adhesiveness. That is, the applied ink is brought into contact with the substrate side in an uncured state, and the ink coating layer is cured during the transfer process.
(D) The process of apply | coating the ink containing resin on the low surface energy material layer formed in the surface of the base material for transcription | transfer.
(E) The ink coating layer is cured in a state where the transfer base material having the ink coating layer and the support layer provided on the base material are in contact with each other so that the ink coating layer faces the support layer. After the resin-containing layer is formed, a hollow structure having a space in which a part of the resin-containing layer and the base material are opened by peeling the resin-containing layer from the transfer base material side. Transfer process to be formed.

(First embodiment)
This embodiment will be described below with reference to FIG. FIG. 1 is a diagram schematically showing a method for manufacturing a hollow structure in the present embodiment. The hollow structure of the present embodiment includes a base material 5 (also referred to as “element base material”), an adhesive portion 4, and a resin-containing layer 3 (see FIG. 1D).

The manufacturing method of the hollow structure of this embodiment includes the following steps.
(1) A step of applying an ink layer 3 containing at least a resin (indicated by the same symbol as the resin-containing layer 3 for convenience) to the surface of the low surface energy material 2 laminated on the transfer substrate 1. In addition, the base material for transfer refers to a base material that is peeled off by a transfer process described later and does not constitute a hollow structure.
(2) A resin-containing layer forming step in which the ink layer 3 is cured or dried to form a resin-containing layer (see FIG. 1A).
(3) The process of providing the adhesion part 4 to the said resin content layer 3 (refer FIG.1 (b)). The area of the bonding portion 4 is smaller than the area of the ink layer 3.
(4) A step in which the resin-containing layer 3 on the transfer substrate 1 and the substrate 5 are opposed to each other, and the adhesive portion 4 on the ink layer is brought into contact with the substrate 5 (see FIG. 1C). In this step, a pressure necessary to transfer the resin-containing layer 3 to the substrate 5 is applied when contacting.
(5) A step of forming a hollow structure in which the resin-containing layer 3 is partially suspended from the base material 5 via the adhesive portion 4 by transfer after the contact in the step (4) (FIG. 1D). reference). In this step, the resin-containing layer 3 is transferred together with the adhesive portion 4 to the base material 5 side. At the time of transfer, the resin layer-containing 3 peels not only the region adhered to the adhesive portion but also the region not adhered to the adhesive portion from the surface of the low surface energy material 2 on the surface of the transfer substrate 1. At the time of peeling, the resin-containing layer itself is not cut or cracked.

  In the transfer step, the entire resin-containing layer 3 is peeled off from the surface of the low surface energy material 2 on the surface of the transfer substrate 1 because the adhesive force formed between the adhesive portion and the substrate is low surface energy. This is because it is larger than the adhesive force formed between the material and the resin-containing layer.

(Second Embodiment)
This embodiment will be described below with reference to FIG. FIG. 2 is a diagram schematically showing a method for manufacturing the hollow structure in the present embodiment. The hollow structure of this embodiment includes a base material 5, an adhesive portion 4, and a resin-containing layer 3 (see FIG. 2D), and has the same structure as that of the first embodiment.

  In the first embodiment, the adhesive portion 4 is formed on the resin-containing layer 3 on the transfer substrate 1. However, the present embodiment is different in that it is formed on the substrate side of the hollow structure. Also in the hollow structure of the present embodiment, the same effect as that of the first embodiment can be obtained.

The manufacturing method of the hollow structure of this embodiment mainly includes the following steps. Steps (2-1) and (2-2) are the same as steps (1) and (2) in the first embodiment.
(2-3) The process of forming the adhesion part 4 in the base material 5 (refer FIG.2 (b)). The area of the bonding portion 4 is smaller than the area of the ink layer 3.
(2-4) A step in which the resin-containing layer 3 and the substrate 5 on the transfer substrate 1 are opposed to each other, and the resin-containing layer 3 is brought into contact with the adhesive portion 4 on the substrate 5 (see FIG. 2C). ). In this step, the resin-containing layer 3 on the surface of the low surface energy material 2 layered on the surface of the transfer substrate is brought into contact with the adhesive portion 4, and the resin-containing layer 3 is then used as the substrate. Apply the pressure required to transfer to 5.
(2-5) After the contact in the step (2-4), a step of forming a hollow structure body in which the resin-containing layer 3 is partially suspended from the base material 5 via the bonding portion 4 by transfer (FIG. 2 (d)). In this step, the resin-containing layer 3 is transferred to the bonding portion side. At the time of transfer, the resin-containing layer 3 peels not only the region adhered to the adhesive portion but also the region not adhered to the adhesive portion from the surface of the low surface energy material 2 on the surface of the transfer substrate 1. At the time of peeling, the resin-containing layer 3 itself is not cut or cracked.

(Third embodiment)
This embodiment will be described below with reference to FIG. FIG. 3 is a diagram schematically showing a method for manufacturing the hollow structure in the present embodiment. The hollow structure of the present embodiment has a structure including a base material 5, a support layer 6, an adhesive portion 4, and a resin-containing layer 3 supported by the support layer 6 and the adhesive portion 4 (FIG. 3 ( d)).

  In 1st Embodiment, although the thickness of the layer of the hollow space formed between the base material which comprises a hollow structure, and the resin content layer 3 was determined by the thickness of the adhesion part, this embodiment is In order to adjust the thickness of the layer of the hollow space, it differs from the first embodiment in that a support layer 6 is provided in addition to the bonding portion 4.

The manufacturing method of the hollow structure of this embodiment mainly includes the following steps. Steps (3-1), (3-2), and (3-3) are the same as steps (1), (2), and (3) of the first embodiment.
(3-4) The process of providing the support | pillar layer 6 in the base material 5. FIG.
(3-5) The resin-containing layer 3 on the transfer substrate 1 and the support layer 6 on the substrate 5 are made to face each other, and the adhesive portion 4 on the resin-containing layer is attached to the support layer 6 on the substrate 5. A step of contacting (see FIG. 3C). In this step, a pressure necessary for transferring the resin-containing layer 3 to the substrate 5 is applied when contacting.
(3-6) After the contact in the step (3-5), a hollow structure body in which the resin-containing layer 3 is partially suspended from the base material 5 via the adhesive portion 4 and the support layer 6 is formed by transfer. Process (refer FIG.3 (d)). In this step, the resin-containing layer 3 is transferred together with the bonding portion 4 to the support layer 6 on the base material 5 side. During transfer, the resin-containing layer 3 peels not only the region bonded to the bonding portion 4 but also the region not bonded to the bonding portion 4 from the surface of the low surface energy material 2 on the surface of the transfer substrate 1. To do. During peeling, the ink layer itself is not cut or cracked.

  As in this embodiment, a support layer is provided on the element base material, and the surface of the support layer is contacted with the adhesive portion to transfer the air, so that the air formed between the hollow structure and the base material is transferred. There exists an effect which can adjust the thickness of a layer.

  In FIG. 3, the adhesive portion 4 is formed on the resin-containing layer 3. Instead, the adhesive portion 4 is first formed on the support layer 6, and then the resin-containing layer 3 is formed on the support-side support layer. A similar hollow structure can be obtained by transferring to the upper adhesive portion 4.

(Fourth embodiment)
In the first to third embodiments, the example in which the ink layer 3 including the resin is one layer has been described. However, in any of the embodiments, a plurality of stacked bodies may be used. The case where it consists of a several laminated body is demonstrated below with reference to FIG. FIG. 4 is a diagram schematically showing a method for manufacturing the hollow structure in the present embodiment. The hollow structure of the present embodiment includes a base material 5, an adhesive portion 4, and a resin-containing layer 3 composed of a plurality of layers (31, 32, 33) supported by the adhesive portion 4 (FIG. 4 (d). )reference).

The manufacturing method of the hollow structure of this embodiment mainly includes the following steps. The method is the same as that of the first embodiment except that there are a plurality of ink layers containing a resin.
(4-1) A step of applying an ink layer 31 containing at least a resin to the surface of the low surface energy material 2 laminated on the transfer substrate 1.
(4-2) A step of curing or drying the ink layer 31.
(4-3) A step of applying an ink layer 32 containing a resin on the ink layer 31.
(4-4) A step of curing or drying the ink layer 32.
(4-5) A step of applying an ink layer 33 containing a resin on the ink layer 32.
(4-6) A step of curing or drying the ink layer 33 (see FIG. 4A).
(4-7) A step of applying the adhesive portion 4 after repeating the formation and curing or drying of the ink containing the resin as many times as necessary (see FIG. 4B).
(4-8) A step of bringing the plurality of cured or dried ink layers on the transfer substrate 1 and the substrate 5 to face each other and bringing the contact portions 4 on the ink layer into contact with the substrate 5 (FIG. 4). (See (c)).
(4-9) After the contact in the step (4-8), the resin-containing layer 3 composed of the ink layers (31, 32, 33) cured or dried by transfer is separated from the base material 5 through the adhesive portion 4. Forming a hollow structure in a state where the portion is suspended (see FIG. 4D).

  In the present embodiment, a plurality of layers can be collectively transferred by bringing a transfer substrate on which a plurality of ink layers are formed into contact with an element substrate through an adhesive portion. As shown in FIG. 4, in the case of a laminate of resin-containing ink, the ink 33 containing resin (after drying or curing) protrudes from the ink 31 containing resin that is formed first (after drying or curing). Even if it is formed, it is possible to transfer all at once.

  For example, if the ink layers (31, 32, 33) containing resin (after drying or curing) are formed of silicone resin, polymethyl methacrylate resin, and silicone resin, respectively, an optical waveguide element can be realized.

  Note that a strut layer is further provided corresponding to the desired size of the hollow space of the hollow structure, and the resin-containing layer 3 composed of a plurality of layers (31, 32, 33) is supported by the adhesive portion 4 and the strut layer. You may do it.

(Fifth embodiment)
In the fourth embodiment, in the hollow structure, the case where the layer including the resin is formed of a laminate and the entire stack is formed of the ink layer including the resin has been described. A case where the laminate is formed of an ink layer containing a resin and a layer not containing a resin will be described.

  FIG. 5 is a diagram schematically showing a method for manufacturing the hollow structure in the present embodiment. The hollow structure of the present embodiment includes a base material 5, an adhesive portion 4, a laminate (resin-containing ink layer (after drying or curing)) 31, 32, 33 supported by the adhesive portion 4, and a resin. (See FIG. 5 (d)).

In the present embodiment, similarly to the fourth embodiment, the laminate can be collectively transferred to the bonding portion of the base material to produce a hollow structure. As a structure of the laminated body, a layer that does not include a resin can be used as long as it is in a size that fits in a plane with an ink layer that includes a resin and is in contact with the ink layer that includes the resin. For example, even if a layer that does not include a resin, such as the layer 71 that does not include a resin, is in direct contact with the low surface energy substrate, batch transfer is possible if the layer is embedded in an ink layer that includes a resin. Layers that do not contain resin include films of inorganic materials such as metals and oxides created by vacuum deposition methods such as vapor deposition and sputtering, organic low molecular films, or nanoparticles (gold, silver, copper, aluminum, nickel, silicon (Silicon), silicon carbide, carbon nanotubes, graphene, ITO, IZO, fullerene, rubrene, organic semiconductors such as low molecular thiophene derivatives, films in which ZnO, ZnS, TiO ₂ , IGZO) are gathered.

The manufacturing method of the hollow structure of this embodiment mainly includes the following steps. The method is the same as that of the first embodiment except that the ink layer containing a resin is a laminate.
(5-1) A step of forming a resin-free layer 71 on the surface of the low surface energy material 2 laminated on the transfer substrate 1.
(5-2) An ink layer 31 containing a resin is applied so as to cover the surface 71 of the low surface energy material 2 laminated on the transfer substrate 1 and cover the layer 71 not containing the resin. Process.
(5-3) A step of curing or drying the ink layer 31.
(5-4) A step of applying a resin-containing ink layer 32 on the ink layer 31 and then curing or drying, and a step of forming a resin-free layer 72.
(5-5) A step of applying an ink layer 33 containing resin on the ink layer 32 and the layer 72 not containing resin.
(5-6) A step of curing or drying the ink layer 33 (see FIG. 5A).
(5-7) A step of applying the adhesive portion 4 after repeating the formation and curing or drying of the ink containing the resin as many times as necessary (see FIG. 4B).
(5-8) A step in which a plurality of cured or dried ink layers on the transfer substrate 1 and the substrate 5 are opposed to each other, and the contact portion 4 on the ink layer is brought into contact with the substrate 5 (FIG. 5). (See (c)).
(5-9) After contact in the step (5-8), the laminated body (31, 32, 33, 71, 72) is hollow in a state where a part thereof is floated from the base material 5 through the bonding portion 4 by transfer. A step of forming a structure (see FIG. 5D).

  For example, the resin-free layers 71 and 72 are formed of a metal thin film such as gold, silver or aluminum, and the resin-containing ink layers (after drying or curing) 31, 32 and 33 are respectively made of polymethyl methacrylate resin and semiconductor. A thin film transistor element can be realized by forming a polymethyl methacrylate resin in which particles are dispersed and polystyrene.

  Note that a strut layer may be further provided corresponding to the desired size of the hollow space of the hollow structure, and the laminate may be supported by the adhesive portion 4 and the strut layer.

(Sixth embodiment)
In the first to fifth embodiments, the adhesive portion is provided on the opposite surface of both the ink layer 3 containing the resin on the transfer substrate and the substrate (element substrate 5) for transfer. However, the position where the adhesive portion is provided is not limited to the facing surface. This embodiment demonstrates the example which provided the adhesion part other than the opposing surface. The position where the adhesive portion is provided may be an arrangement where the ink layer 3 peeled off from the transfer substrate can be adhered to the substrate 5 side by the adhesive portion and a hollow structure can be formed. In order to obtain a hollow structure, it is preferable that the support layer 6 is provided separately or integrally with the base material 5.

  FIG. 6 is a diagram schematically showing a method for manufacturing the hollow structure in the present embodiment. The hollow structure of the present embodiment has a structure composed of a base material 5, a support layer 6, a resin-containing layer 3, and an adhesive base material 8 (see FIG. 6D). In the present embodiment, the pressure-sensitive adhesive base material 8 that is cited as an example of an adhesive portion is a pressure-sensitive adhesive base material that is coated with a sticky material (also referred to as a pressure-sensitive adhesive).

The manufacturing method of the hollow structure of this embodiment mainly includes the following steps. Steps (6-1) and (6-2) are the same as steps (1) and (2) in the first embodiment.
(6-3) A step of attaching the adhesive base material 8 covered with an adhesive material to the cured or dried ink layer 3 (see FIG. 6B).
(6-4) The process of providing the support | pillar layer 6 in the base material 5. FIG.
(6-5) The adhesive substrate 8 and the cured or dried ink layer 3 are peeled from the layer 2 of the low surface energy material on the transfer substrate 1 (see FIG. 6C), and the adhesive substrate 8 and the ink layer 3 are brought into contact with the support layer 6 on the substrate 5 and bonded (see FIG. 6D). During the peeling, the ink layer itself is not cut or cracked. A hollow structure in which the ink layer 3 is partially suspended from the base material 5 through the support layer 6 is formed.

  In this embodiment, the ink layer (resin layer) can be peeled off from the transfer substrate 1 and transferred to the element substrate 5 with the adhesive on the surface of the adhesive substrate 8. As an adhesive part containing the adhesion base material 8, an adhesive tape is mentioned, for example. The pressure-sensitive adhesive used is not particularly limited as long as it is a material used for a general pressure-sensitive adhesive tape, and an acrylic pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, a urethane pressure-sensitive adhesive, or the like can be used. Moreover, the base material coat | covered with the adhesive can be used suitably if it is a base material with the flexibility which does not fracture to a curvature radius of 25 mm. Specific examples include polyimide films, polyethylene naphthalate films, polyethylene terephthalate films, polycarbonate films, stainless steel and aluminum foil materials, and paper.

(Seventh embodiment)
In the first to sixth embodiments, an example of a cantilever beam in which the resin-containing layer is supported only at one end by the adhesive portion or the strut layer is illustrated. However, the cantilever beam that supports the resin-containing layer at both ends is illustrated. The structure of may be sufficient. In the present embodiment, a structure of a doubly supported beam in which the resin-containing layer is supported by a plurality of adhesive portions and support layers will be described. In the double-supported beam structure, not all the four sides of the hollow part are closed, but both side surfaces of the hollow part are open. That is, the two opposite sides of the peripheral portion of the resin-containing layer are not fixed and are free ends.

  FIG. 7 is a diagram schematically showing a method for manufacturing the hollow structure in the present embodiment. FIG. 7A shows a process in which an ink layer 3 containing at least a resin is applied on the low surface energy material 2 formed on the surface of the transfer substrate 1, and the ink layer 3 is cured or dried. FIG. 7B shows a step of applying a plurality of adhesive portions 4 (two in the figure) to both end portions of the cured or dried ink layer 3. FIG. 7C shows a case where the cured or dried ink layer on the transfer substrate 1 and the substrate 5 are opposed to each other, and a plurality of adhesive portions 4 on the ink layer are disposed at a plurality of locations on the substrate 5. The process of contacting is shown. FIG. 7 (d) shows that after the contact, the ink layer 3 (resin-containing layer 3) is transferred to form a hollow structure partly floating from the base material 5 via the adhesive portions 4 at both ends. The process to perform is shown. FIG. 8 is a perspective view of a hollow structure manufactured by the manufacturing process of FIG. The hollow structure of the present embodiment includes a base material 5, a plurality of adhesive portions 4, and a resin-containing layer 3 (see FIGS. 7D and 8). The manufacturing method of the hollow structure of the present embodiment is the same as the process of the first embodiment, except that the bonding portion 4 is formed at both ends of the ink layer containing resin.

(Eighth embodiment)
In the present embodiment, an embodiment in which a hollow structure is used as a load sensor will be described based on an actually produced example.

[Example 1]
A load sensor was manufactured as follows by the manufacturing method shown in the third embodiment.

  <Preparation of base material> Non-alkali glass (Japanese plate glass OA-10G) having a thickness of 0.7 mm was used as a substrate. The lower electrode was formed by vacuum deposition through a metal mask in the order of lamination of chromium 5 nm and gold 50 nm. The dimensions of the lower electrode were 10 mm in both width and depth. Next, a photosensitive resist (Japanese explosive SU-8 50) is formed into a film at a speed of 1000 rpm with a spin coater, exposed through a photomask, and then developed and baked so that the support portion adjacent to the lower electrode is formed. Formed. The dimensions of the support part were 10 mm width, 20 mm depth, and 100 μm height. The support part corresponds to an example of a support layer.

  <Preparation of Transfer Substrate> Polydimethylsiloxane (Shin-Etsu Silicone KE106), a low surface energy material, was applied to a polyethylene naphthalate film (Teijin Q65HA) with a thickness of 100 μm with a spin coater at a speed of 800 rpm, and 30 minutes in an oven at 160 ° C. Heated for a few minutes and cured to prepare a substrate for transfer.

  <Patterning and firing of hollow structure electrode> Silver particles and binder polymer in a state in which a metal mask having an opening (width 1 mm, depth 5 mm) having the same shape as that of the hollow structure electrode is adhered to the transfer substrate. A silver paste (DIC GOAGT) having the following composition was blade coated. Thereafter, the metal mask was removed from the transfer substrate to obtain a hollow structure electrode pattern on the surface of the transfer substrate. This was baked in an oven at 160 ° C. for 30 minutes to cure the patterned silver paste. The thickness of the silver paste after curing was 10 μm. The cured silver paste that forms the pattern of the hollow structure electrode corresponds to an example of a resin-containing layer.

  <Formation of adhesive part, transfer of electrode for hollow structure> 5 μL of the same silver paste as the hollow electrode was dropped onto the end of the cured silver paste (resin-containing layer) with a micropipette to form an adhesive part of 0.8 mmφ did. After the transfer substrate is left at room temperature for 10 minutes to increase the viscosity of the bonded portion, the substrate and the transfer substrate are brought into contact so that the bonded portion and the support portion are in contact, and the hollow structure electrode is transferred. Transferred from the substrate to the substrate side. Then, it heated for 1 hour in 120 degreeC oven for hardening of an adhesion part.

  <Evaluation as a load sensor> The produced hollow structure was evaluated as a load sensor as follows. A load is applied at a position 1 mm from the tip of the resin-containing layer of the hollow structure, and the capacitance formed between the hollow structure electrode and the lower electrode is equivalent to the resin-containing layer of the hollow structure (corresponding to a cantilever of a load sensor). ) Was measured according to the displacement. The load was applied with a surface step meter (ET4000 manufactured by Kosaka Laboratory), and the capacitance was measured with an LCR meter (Hioki Electric 3532-50).

  FIG. 9 shows the measurement results. The horizontal axis in FIG. 9 is the load (unit μN), and the vertical axis is the displacement Z position of the cantilever of the load sensor, and the right is the change in capacitance. As shown in FIG. 9, the height (Z position) of the electrode for the hollow structure body was displaced by the load, and the capacitance was changed accordingly. From this, it was confirmed that the hollow structure of the present invention operates normally as a load sensor.

[Example 2]
A load sensor was manufactured as follows by the manufacturing method described in the second half of the third embodiment.

  <Preparation of Substrate>, <Preparation of Transfer Substrate>, and <Patterning and Firing of Hollow Structure Electrode> were performed in the same manner as in Example 1.

  <Formation of Adhesive Portion, Transfer of Hollow Structure Electrode> 5 μL of the same silver paste as the hollow structure electrode was dropped on the surface of the support portion of the substrate with a micropipettor to form an adhesive portion of 0.8 mmφ. After the element substrate is left at room temperature for 10 minutes to increase the viscosity of the bonded portion, the substrate and the transfer substrate are brought into contact so that the bonded portion and the electrode pattern (resin-containing layer) are in contact with each other. The transfer electrode was transferred from the transfer substrate to the substrate. Then, it heated for 1 hour in 120 degreeC oven for hardening of an adhesion part.

  <Evaluation as a load sensor> The same results as in Example 1 were obtained.

[Example 3]
A load sensor was manufactured by the manufacturing method shown in the sixth embodiment as follows.

  <Preparation of Substrate>, <Preparation of Transfer Substrate>, and <Patterning and Firing of Hollow Structure Electrode> were performed in the same manner as in Example 1.

  <Peeling and Transfer of Hollow Body Electrode by Adhesive Base> An adhesive tape (Kapton Tape (Teraoka Seisakusho, 650S # 12, width 3 mm)) was used as the adhesive base. The pressure-sensitive adhesive surface was pressed against the hollow structure electrode on the transfer substrate, and the resin-containing layer was removed from the transfer substrate to transfer the hollow structure electrode to the pressure-sensitive adhesive substrate. Subsequently, the transfer of the hollow structure electrode to the element substrate side was completed by fixing with the adhesive property of the tape so that the hollow body electrode was fitted to the support portion on the substrate.

  <Evaluation as a load sensor> The same results as in Example 1 were obtained.

[Comparative Example 1]
The hollow structure electrode was formed of vapor-deposited silver and compared with the examples.
<Preparation of base material> and <Preparation of base material for transfer> were carried out in the same manner as in Example 1.
<Patterning and firing of hollow structure electrode> Silver is vacuum-deposited by 10 μm in a state where a metal mask having an opening (width 1 mm, depth 5 mm) having the same shape as that of the hollow structure electrode is adhered to the transfer substrate. did. Then, the pattern of the silver vapor deposition film | membrane of the electrode for hollow structures was obtained on the surface of the base material for transcription | transfer by removing a metal mask from the base material for transcription | transfer.
<Formation of Adhering Portion and Transfer of Hollow Structure Electrode> The same operation as in Example 1 was performed, but only the portion of the hollow structure electrode that was in direct contact with the support portion was transferred to the base material. It was.

[Comparative Example 2]
The hollow structure electrode was formed of silver ink having no binder polymer, and compared with the examples. <Preparation of base material> and <Preparation of base material for transfer> were carried out in the same manner as in Example 1.
<Patterning and firing of hollow structure electrode> A binder polymer is included in the composition in a state in which a metal mask having an opening (width 1 mm, depth 5 mm) having the same shape as that of the hollow structure electrode is adhered to the transfer substrate. Uncoated silver colloidal ink (Sigma-aldrich 796042) was blade coated. Then, the pattern of the electrode for hollow structures was obtained on the surface of the transfer substrate by removing the metal mask from the transfer substrate. This was baked for 30 minutes in an oven at 160 ° C. to cure the patterned silver colloidal ink. The thickness of the silver paste after curing was 0.5 μm.
<Formation of Adhering Portion and Transfer of Hollow Structure Electrode> The same operation as in Example 1 was performed, but only the portion of the hollow structure electrode that was in direct contact with the support portion was transferred to the base material. It was.

(Ninth embodiment)
In the present embodiment, in the transfer step, the resin-containing layer and the base material are cured and transferred in a state of being in contact with each other via the adhesive portion. Also in the hollow structure of the present embodiment, the same effects as those of the first to seventh embodiments can be obtained.

  This embodiment will be described below with reference to FIG. FIG. 10 is a diagram schematically showing a method for manufacturing the hollow structure in the present embodiment. The hollow structure of FIG. 10 includes a base material 5, an adhesive portion 4, and a resin-containing layer 3 (see FIG. 10E), and has the same structure as the first and second embodiments.

The manufacturing method of the hollow structure of this embodiment mainly includes the following steps. Steps (9-1) and (9-2) are the same as steps (1) and (2) in the first embodiment (see FIG. 10A).
(9-3) The process of providing the adhesion part 4 to the said resin content layer 3 (refer FIG.10 (b)). The area of the bonding portion 4 is smaller than the area of the ink layer 3.
(9-4) Step of bringing the resin-containing layer 3 on the transfer substrate 1 and the substrate 5 to face each other and bringing the adhesive portion 4 on the ink layer into contact with the substrate 5 (see FIG. 10C). ). In this step, a pressure necessary to transfer the resin-containing layer 3 to the substrate 5 is applied when contacting.
(9-5) The step of curing the adhesive portion in the state of contact in the step (9-4), that is, the state in which the substrate 5 and the resin-containing layer 3 are in contact with each other through the adhesive portion (FIG. 10D )reference). It is preferable to completely cure by any one or more of heating and ultraviolet irradiation.
(9-6) By separating the transfer substrate from the substrate side and transferring the resin-containing layer to the substrate side, the resin-containing layer 3 is partially suspended from the substrate 5 via the adhesive portion 4. Forming a hollow structure in a state (see FIG. 10E).

[Example 4]
A load sensor was manufactured as follows by the manufacturing method of the present embodiment.

  <Preparation of base material>, <Preparation of base material for transfer>, and <Patterning and firing of electrode for hollow structure> were performed in the same manner as in Example 1 except that no support portion was provided.

  <Formation of adhesive part, transfer of electrode for hollow structure> 5 μL of the same silver paste as the hollow electrode was dropped onto the end of the cured silver paste (resin-containing layer) with a micropipette to form an adhesive part of 0.8 mmφ did. In order to increase the viscosity of the bonded portion, the transfer substrate is allowed to stand at room temperature for 10 minutes, and then the substrate and the transfer substrate are brought into contact with the substrate so that the bonded portion is in contact with the substrate. And heated. Thereafter, the electrode for hollow structure was transferred from the transfer substrate to the substrate side by separating the transfer substrate and the substrate.

  <Evaluation as a load sensor> The same results as in Example 1 were obtained.

(Tenth embodiment)
The present embodiment relates to a manufacturing method by a process including the above (d) and (e). This embodiment will be described below with reference to FIG. FIG. 11 is a diagram schematically showing a method for manufacturing a hollow structure in the present embodiment. The hollow structure of FIG. 11 includes a base material 5, a support layer 6, and a resin-containing layer 3 (see FIG. 11C).

The manufacturing method of the hollow structure of this embodiment mainly includes the following steps.
(10-1) A step of applying an ink layer (an uncured ink layer 7) containing at least a resin to the surface of the low surface energy material 2 laminated on the transfer substrate 1. It is the same as the first embodiment step (1).
(10-2) An ink layer adjusting step for increasing the viscosity of the ink layer 7 as necessary for preparation for transfer.
(10-3) The process of providing the support | pillar layer 6 in the base material 5. FIG.
(10-4) The step of making the ink layer 7 on the transfer substrate 1 and the support layer 6 on the substrate 5 face each other and bringing the ink layer 7 into contact with the support layer 6 (FIG. 11A) reference). In this step, a pressure necessary to transfer the resin-containing layer 3 to the substrate 5 is applied when contacting.
(10-5) Step of curing the ink layer in the state of contact in step (10-5), that is, in the state where the strut layer 6 and the uncured ink layer 7 are in contact (see FIG. 11B) ). It is preferable to completely cure by any one or more of heating and ultraviolet irradiation.
(10-6) The transfer base material 1 is separated from the base material side, and the cured resin-containing layer 3 is transferred to the base material side so that the resin-containing layer 3 is separated from the base material 5 via the support layer 6. Forming a hollow structure in a state where the portion is suspended (see FIG. 11C).

[Example 5]
A load sensor was manufactured as follows by the manufacturing method of the present embodiment. It is an example of hardening by heating.

  <Preparation of base material> and <Preparation of base material for transfer> were carried out in the same manner as in Example 1.

  <Patterning and drying of hollow structure electrode> Silver particles and binder polymer in a state in which a metal mask having an opening (width 1 mm, depth 5 mm) having the same shape as that of the hollow structure electrode is adhered to the transfer substrate. A silver paste (DIC GOAGT) having the following composition was blade coated. Thereafter, the metal mask was removed from the transfer substrate to obtain a hollow structure electrode pattern on the surface of the transfer substrate. This was heated in an oven at 120 ° C. for 10 minutes. This heating was insufficient as a curing condition for the silver paste used, and the ink was thickened by volatilization of the solvent, but the ink was kept in an uncured state.

  <Transfer of the electrode for the hollow structure> The substrate 5 and the transfer were made so that the uncured silver paste (uncured ink layer 7) and the support portion (support layer 6) were in contact without forming an adhesive portion. The base material 1 for contact was made to contact, and it heated in 160 degreeC 1 hour oven in this state. Thereafter, the electrode for hollow structure was transferred from the transfer substrate to the substrate side by separating the transfer substrate and the substrate.

  <Evaluation as a load sensor> The same results as in Example 1 were obtained.

[Example 6]
The present embodiment is an example of curing with ultraviolet rays.

  <Preparation of base material> and <Preparation of base material for transfer> were carried out in the same manner as in Example 1.

  <Patterning and drying of hollow structure electrode> Silver particles and UV-cured in a state in which a metal mask having an opening (width 1 mm, depth 5 mm) having the same shape as that of the hollow structure electrode is adhered to the transfer substrate. A silver paste (Jujo Chemical JELCON RK232) having an adhesive binder polymer composition was blade coated. Thereafter, the metal mask was removed from the transfer substrate to obtain a hollow structure electrode pattern on the surface of the transfer substrate. This was heated in an oven at 100 ° C. for 10 minutes. This heating was insufficient as a curing condition for the silver paste used, and the ink was thickened by volatilization of the solvent, but the ink was kept in an uncured state.

<Transfer of the electrode for the hollow structure> The substrate 5 and the transfer were made so that the uncured silver paste (uncured ink layer 7) and the support portion (support layer 6) were in contact without forming an adhesive portion. The base material 1 was brought into contact, and in this state, the silver paste was cured by exposing the 365 nm to an integrated light quantity of 500 mJ / cm ² using an ultraviolet lamp. Thereafter, the electrode for hollow structure was transferred from the transfer substrate to the substrate side by separating the transfer substrate and the substrate.

  <Evaluation as a load sensor> The same results as in Example 1 were obtained.

  The examples shown in the above-described embodiment and the like are described for easy understanding of the invention, and are not limited to this embodiment.

  The method for producing a hollow structure according to the present invention is industrially useful because it can be produced with a low environmental load and can be formed with a reduced number of processes. In addition, the manufacturing method of the present invention can realize a hollow structure around the movable part and a hollow structure having an elastic displacement member, so that it can be widely applied to micromachine devices and microsensors and is industrially useful.

DESCRIPTION OF SYMBOLS 1 Transfer base material 2 Low surface energy material 3 Resin-containing ink layer, resin-containing layer 4 Adhesion part 5 Base material 6 Prop layer 7 Uncured ink layer 8 Adhesive base material 31, 32, 33 Ink layer containing resin 71, 72, 73 Resin-free layer

Claims (11)

Applying a resin-containing ink on the low surface energy material layer formed on the surface of the transfer substrate;
A resin-containing layer forming step of making the applied ink into a resin-containing layer;
A transfer step of forming a hollow structure having a partially opened space between the resin-containing layer and the substrate by transferring the resin-containing layer to the substrate using an adhesive portion; A method for producing a hollow structure, comprising: The transfer step includes
The substrate for transfer on which the resin-containing layer is formed and the substrate are brought into contact with each other via an adhesive portion so that the resin-containing layer side of the substrate for transfer faces the substrate.
When the adhesive force formed between the adhesive portion and the base material is larger than the adhesive force formed between the low surface energy material and the resin-containing layer, the resin-containing layer is transferred to the substrate. The method for producing a hollow structure according to claim 1, wherein the hollow structure is provided with at least the substrate, the adhesive portion, and the resin-containing layer by peeling from the substrate side. The transfer step includes
The transfer substrate having the resin-containing layer formed thereon and the substrate having the support layer provided thereon are bonded so that the resin-containing layer side of the transfer substrate faces the support layer of the substrate. Contact through the part,
2. The hollow according to claim 1, wherein the resin-containing layer is peeled from the transfer substrate side to obtain a hollow structure including the substrate, the support layer, the adhesive portion, and the resin-containing layer. Manufacturing method of structure. The transfer step includes
After adhering the adhesive part to the resin-containing layer and peeling the resin-containing layer and the adhesive part from the transfer substrate,
A hollow structure including the base material, the strut layer, the adhesive portion, and the resin-containing layer is obtained by adhering with the adhesive portion so that the resin-containing layer and the strut layer of the base material face each other. The method for producing a hollow structure according to claim 3.   The method for producing a hollow structure according to any one of claims 1 to 4, wherein, in the transfer step, the adhesive portion is cured by using at least one of heating and ultraviolet irradiation. Applying a resin-containing ink on the low surface energy material layer formed on the surface of the transfer substrate;
The transfer substrate having the ink application layer and the support layer provided on the substrate are cured so that the application layer is in contact with the support layer so as to face the support layer. After forming the layer, the transfer step of peeling the resin-containing layer from the transfer substrate side to form a hollow structure having a partially opened space between the resin-containing layer and the substrate. A method for producing a hollow structure, comprising:   The method for producing a hollow structure according to claim 6, wherein in the transfer step, the coating layer is cured using at least one of heating and ultraviolet irradiation.   The method for producing a hollow structure according to any one of claims 1 to 7, wherein the resin-containing layer includes one layer or a plurality of layers.   The method for producing a hollow structure according to any one of claims 1 to 8, wherein the resin-containing layer has a structure in which a layer not containing a resin is embedded.   The method for producing a hollow structure according to any one of claims 1 to 9, wherein the resin-containing layer contains functional particles.   The method for producing a hollow structure according to any one of claims 1 to 10, wherein the resin-containing layer is a displacement member.

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