JP2018068667A - Medical flow measuring device and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a versatile medical flow measuring device that has high production yield and can measure a speed of fluid.SOLUTION: A carrier resin film 44 with a pair of sensor circuit patterns 47a, 47b formed in an inner circumferential surface is wound up on an outer circumferential surface of a cylindrical supporting tube 42 locally formed of a through hole 42a penetrating in a radial direction so that micro-heating elements 40a, 40b of the pair of sensor circuit patterns 47a, 47b may be positioned in a through hole 42a, and thereby an air flow sensor 22 is constituted. Accordingly, the air flow sensor 22 can be designed and produced independently from the basket forceps, and therefore the flexibility of design and production can be obtained and the production yield becomes high. Also, it can be implemented in a medical tool according to the intended use, and thereby the versatility during use can be increased.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a medical flow measurement device and a method for manufacturing the same.

  It is desirable to measure fluid velocities, such as the flow rate of exhaled air and inhaled air in a human peripheral airway. On the other hand, a basket forceps type anemometer in which an airflow sensor is mounted on the basket forceps has been proposed. That is described in Patent Document 1. Since the tip of the forceps is expanded or contracted in the radial direction, the basket forceps-type anemometer can position and fix the airflow sensor attached to the surface together with the basket forceps according to the inner diameter of the bronchus.

International Publication No. 2016/125842

  By the way, the airflow sensor is composed of a sensor circuit that is formed with a minute thickness and a minute thickness by applying MEMS (Micro Electro Mechanical System) to the heater part of the circuit of the hot wire anemometer. It is mounted near the basket forceps. For this reason, there was a problem that the yield in manufacturing the airflow sensor was low. In addition, since it is integrally attached to the basket forceps, it is impossible to measure a peripheral airway or the like in which the basket forceps cannot be inserted, and there is a problem that the range of use is limited and versatility is poor.

  The present invention has been made in the background of the above circumstances, and its object is to provide a versatile medical flow measuring device that has a high production yield and can measure fluid velocity. is there.

  While the inventors have made various studies against the background described above, a thin carrier is provided on the surface of a flat plate while providing a through hole or a recess penetrating in a radial direction in a part of a comparatively small diameter support tube. The sensor circuit is sequentially formed on the sheet and the carrier sheet, and the support tube is rolled on a flat plate so that the heater of the sensor circuit is positioned in the through hole or the recess. Wrapping the carrier sheet on the outer periphery of the support tube, it can be designed and manufactured independently from the basket forceps, so that the design and manufacturing freedom is obtained and the manufacturing yield is increased. I found. In addition, it was found that it can be mounted on medical tools according to the purpose of use, so that versatility during use is enhanced. The present invention has been made based on such knowledge.

  That is, the gist of the first invention is (a) a medical flow measuring device for measuring a fluid velocity, and (b) a through hole penetrating in the radial direction or a concave hole recessed in the radial direction is locally present. (C) a carrier resin film wound around the outer peripheral surface of the support, and (d) a microheater element, and the microheater element passes through the through hole. And a sensor circuit pattern formed on the inner peripheral surface of the carrier resin film so as to be located in the hole or the recessed hole.

  The gist of the second invention is that, in the first invention, the sensor circuit pattern formed on the inner peripheral surface of the carrier resin film includes a sensor terminal pad, and the sensor terminal of the outer peripheral surface of the support body. A support film for supporting the conductor circuit pattern on the outer peripheral surface is fixed to a position corresponding to the pad, and the conductor circuit pattern is opposed to the sensor terminal pad and contacted with the conductor terminal pad and the lead wire connecting end. It is in having.

  The gist of the third invention is that, in the second invention, the lead wire connecting end portion of the conductor circuit pattern is connected to a lead wire through an anisotropic conductive film.

  A gist of a fourth invention is that, in the first invention, the sensor circuit pattern formed on the inner peripheral surface of the carrier resin film includes a lead wire connection pad, and the lead wire connection pad of the sensor circuit pattern. Is connected to the lead wire through the conductive paste.

  The gist of the fifth invention is that, in any one of the first to fourth inventions, the carrier resin film is composed of a paraxylene-based polymer having a thickness of submicron to micron order, and the carrier. The micro heater element which is a part of the sensor circuit pattern formed on the inner peripheral surface of the resin film is located in the through hole or the concave hole locally formed on the cylindrical or columnar support. It is to have been made.

  The gist of the sixth invention is (a) a method for manufacturing a medical flow measuring device for measuring a fluid velocity, and (b) depositing a carrier resin film having a predetermined thickness on one surface of a flat jig. A carrier resin film forming step; (c) a sensor circuit pattern forming step of forming a sensor circuit pattern having a microheater element and a sensor terminal pad on the carrier resin film by photolithography; and (d) penetrating in the radial direction. A cylindrical or columnar support having locally formed through holes or radially recessed holes is rolled on a carrier resin film on which the sensor circuit pattern is formed on one surface of the jig. By moving the carrier resin film on which the sensor circuit pattern is formed so that the micro heater element is positioned in the through hole or the concave hole, And a step wearing sensor circuit pattern winding wound around the circumferential surface is to include.

  The gist of the seventh invention is that, in the sixth invention, (e) a conductor circuit pattern forming step of forming a conductor circuit pattern having a conductor terminal pad and a lead wire connecting end on a support film by photolithography. (F) A holding film for holding the end of the lead wire through an anisotropic conductive film is heated and pressed to the lead wire connection end of the conductor circuit pattern, and the lead wire connection end of the conductor circuit pattern is A lead wire connecting step of connecting ends of the lead wires; and (g) prior to the sensor circuit pattern winding step, the support is rolled on the support film on which the conductor circuit pattern is formed. The conductor circuit pattern is formed such that the conductor terminal pad of the conductor circuit pattern overlaps the sensor terminal pad of the sensor circuit pattern. And a step wearing the conductor circuit pattern winding wound around the outer peripheral surface of the support film the support is to further comprise.

The gist of the eighth invention is that, in the sixth invention, the sensor circuit pattern formed on the carrier resin film comprises a lead wire connection pad,
A lead wire connecting step of connecting the lead wire connecting pad of the sensor circuit pattern to the lead wire through a conductive paste is further included.

  The gist of the ninth invention is that, in the invention according to any one of the sixth to eighth inventions, the carrier resin film forming step is performed by depositing a paraxylene-based polymer on one surface of the jig. A carrier resin film composed of a paraxylene polymer having a thickness of micron to micron order is formed on one surface of the jig.

  The medical flow measurement device according to the first aspect of the present invention has a sensor circuit pattern on the outer peripheral surface of a cylindrical or columnar support in which a through hole penetrating in the radial direction or a concave hole recessed in the radial direction is locally formed. A carrier resin film formed on the peripheral surface is formed by being wound so that the micro heater element of the sensor circuit pattern is positioned in the through hole or the recessed hole. Therefore, according to the medical flow measuring device of the first invention, it can be designed and manufactured independently of the basket forceps, so that the degree of freedom in design and manufacturing is obtained and the manufacturing yield is increased. Since it can be mounted on a medical tool according to the purpose of use, versatility during use can be enhanced.

  The medical flow measuring device according to a second aspect of the present invention is the medical flow measurement device according to the first aspect, wherein the sensor circuit pattern formed on the inner peripheral surface of the carrier resin film includes a sensor terminal pad, A support film for supporting the conductor circuit pattern on the outer peripheral surface is fixed to a position corresponding to the terminal pad, and the conductor circuit pattern is opposed to the sensor terminal pad and contacted with the conductor terminal pad and the lead wire connecting end. Department. For this reason, according to the medical flow measurement device of the second invention, the lead wire connected from the micro heater element in the sensor circuit pattern to the lead wire connection end of the conductor circuit pattern via the conductor circuit pattern, It can be easily connected to a measurement circuit provided in a fixed position.

  In the medical flow measurement apparatus according to the third aspect of the invention, the lead wire connection end of the conductor circuit pattern is connected to a lead wire through an anisotropic conductive film. For this reason, the line width and line interval of the lead wire connecting portion of the conductor circuit pattern, and the wire diameter and line interval of the lead wire connected thereto can be greatly reduced.

  A gist of a fourth invention is that, in the first invention, the sensor circuit pattern formed on the inner peripheral surface of the carrier resin film includes a lead wire connection pad, and the lead wire connection pad of the sensor circuit pattern. Is connected to the lead wire via a conductive paste. For this reason, the micro heater element can be connected to a fixed position measuring circuit without providing a conductor circuit pattern.

  In the medical flow measurement device according to the fifth aspect of the present invention, the carrier resin film is made of a paraxylene-based polymer having a thickness on the order of submicron to micron, and the sensor circuit pattern formed on the inner peripheral surface thereof. The microheater element as a part is positioned in the through hole or the concave hole locally formed on the cylindrical or columnar support. For this reason, the microheater element positioned in the through hole or the concave hole formed in the cylindrical support tube is supported by a carrier resin film having a thickness of submicron to micron order, and the heat capacity of the microheater element Is greatly reduced, so that an extremely high responsiveness can be obtained in the flow velocity measurement.

  According to a sixth aspect of the present invention, there is provided a method for manufacturing a medical flow measuring device comprising: a carrier resin film forming step of depositing a carrier resin film having a predetermined thickness on one surface of a flat jig; and a microheater element and a sensor on the carrier resin film. A sensor circuit pattern forming step for forming a sensor circuit pattern having a terminal pad by photolithography, and a cylindrical or columnar support in which a through hole penetrating in the radial direction or a concave hole recessed in the radial direction is locally formed The sensor circuit pattern is arranged so that the micro heater element is positioned in the through hole or the recessed hole by rolling on the carrier resin film on which the sensor circuit pattern is formed on one surface of the jig. A sensor circuit pattern winding step of winding the formed carrier resin film around the outer peripheral surface of the support. For this reason, since it can design and manufacture independently from a basket forceps, the freedom of design and manufacture of a medical flow measuring device can be obtained, and the manufacturing yield can be increased. Moreover, since it can mount in the medical tool according to a use purpose, the versatility at the time of use of a medical flow measuring apparatus can be improved.

  According to a seventh aspect of the present invention, there is provided a method for producing a medical flow measuring device comprising: a conductor circuit pattern forming step of forming a conductor circuit pattern having a conductor terminal pad and a lead wire connecting end portion on a support film by photolithography; Prior to the lead wire connecting step of connecting the enameled thin wire to the lead wire connecting portion of the pattern via the anisotropic conductive film and the sensor circuit pattern winding step, the support circuit is formed with the conductor circuit pattern. The support film on which the conductor circuit pattern is formed so that the conductor terminal pad of the conductor circuit pattern overlaps the sensor terminal pad of the sensor circuit pattern by rolling on the support film is the support. And a conductor circuit pattern winding step of winding around the outer peripheral surface. For this reason, it is easily connected to a measurement circuit provided in a fixed position by a lead wire connected to a lead wire connecting end portion of the conductor circuit pattern from the micro heater element in the sensor circuit pattern via the conductor circuit pattern. be able to.

  In the method for manufacturing a medical flow measuring device according to the eighth invention, the sensor circuit pattern formed on the carrier resin film includes a lead wire connection end pad, and the lead wire connection end pad of the sensor circuit pattern is provided. A lead wire connecting step of connecting to the enamel wire through the conductive paste. For this reason, even if it does not provide a conductor circuit pattern, the medical flow measuring device which can connect the said micro heater element to a position-fixed measuring circuit is obtained.

  In the method for manufacturing a medical flow measuring device according to the ninth aspect of the present invention, the carrier resin film forming step is performed by depositing a paraxylene polymer on one surface of the jig so that the paraxylene system has a thickness of submicron to micron order. A carrier resin film made of a polymer is formed on one surface of the jig. For this reason, the microheater element positioned in the through hole or the concave hole formed in the cylindrical support tube is supported by a carrier resin film having a thickness of submicron to micron order, and the heat capacity of the microheater element Is greatly reduced, and a medical flow measuring device having an extremely high response in flow velocity measurement can be obtained.

It is a figure explaining the structure of the gas flow velocity measuring apparatus in an airway containing the Example of this invention, and the principal part of the control function of the electronic controller contained in it. It is the schematic explaining the airway in a biological body. It is the schematic which shows the catheter protruded from the front-end | tip of the bronchoscope inserted into the airway of FIG. 2, or the front-end | tip of the bronchoscope, and the airflow sensor provided in the front-end | tip part of the catheter. It is a perspective view explaining the other application example of the airflow sensor used for FIG. FIG. 4 is a schematic diagram illustrating the configuration of the airflow sensor of FIG. 3 in a perspective view. 6 is a schematic diagram illustrating the configuration of the airflow sensor of FIG. 5 in a cross-sectional view. It is process drawing explaining the manufacturing process of the airflow sensor of FIG. 5 and FIG. FIG. 8 is a schematic diagram illustrating a state in which four enamel wires are fixed on a holding film placed on one surface of a flat jig plate in the lead wire connecting step of FIG. 7. FIG. 8 is a schematic diagram illustrating a state where four enamel wires are fixed on a holding film placed on one surface of a flat jig plate in the lead wire connecting step of FIG. FIG. 8 is a schematic diagram illustrating a perspective view of a state where an anisotropic conductive film is placed on an enameled thin wire in the lead wire connecting step of FIG. 7. FIG. 8 is a schematic view illustrating a state where an anisotropic conductive film is placed on an enameled thin wire in a cross-sectional view in the lead wire connecting step of FIG. 7. In the lead wire connecting step of FIG. 7, the lead wire connecting end of the conductor circuit pattern formed on the support film is positioned on the anisotropic conductive film, and heated and pressed from above the support film. FIG. 6 is a schematic diagram illustrating a state in which a lead wire connecting end and four enameled thin wires are electrically connected with each other in a perspective view. In the lead wire connecting step of FIG. 7, the lead wire connecting end of the conductor circuit pattern formed on the support film is positioned on the anisotropic conductive film, and heated and pressed from above the support film. FIG. 2 is a schematic diagram illustrating a state in which a lead wire connecting end and four enamel wires are electrically connected with cross-sectional views. FIG. 8 is a schematic diagram for explaining a lead wire connecting end using a cross-sectional view in the conductor circuit pattern winding step of FIG. 7. FIG. 8 is a schematic diagram illustrating a cylindrical support tube after the conductor circuit pattern forming step, the lead wire connecting step, and the conductor circuit pattern winding step in FIG. 7 in a perspective view. FIG. 8 is a schematic diagram illustrating a cylindrical support tube after the conductor circuit pattern forming step, the lead wire connecting step, and the conductor circuit pattern winding step in FIG. FIG. 8 is a schematic diagram illustrating a winding start state in the sensor circuit winding step of FIG. 7 in a perspective view. FIG. 8 is a schematic diagram illustrating a winding start state in the sensor circuit winding step of FIG. 7 with a cross-sectional view. It is the schematic explaining the state of the winding end in the sensor circuit winding process of FIG. 7 with a perspective view. FIG. 8 is a schematic diagram illustrating a state of winding end in the sensor circuit winding step of FIG. It is a circuit diagram explaining in detail the specific example of the gas flow velocity measuring circuit of FIG. It is a figure which shows the example of the calibration curve calculated | required previously used in order to calculate a gas flow velocity using the airflow sensor of FIG. 5, and the gas flow velocity measurement circuit of FIG. It is a figure which shows the time change of the output voltage of the airflow sensor of FIG. 5 in a response evaluation test. It is the schematic explaining the structure of the airflow sensor in the other Example of this invention with a perspective view. It is the schematic explaining the structure of the airflow sensor of FIG. 24 with sectional drawing. It is process drawing explaining the manufacturing process of the airflow sensor shown to FIG. 24 and FIG. It is a perspective view explaining the carrier resin film formation process of FIG. FIG. 28 is a schematic diagram for explaining the application state of the conductive paste in the lead wire connecting step of FIG. 26 using a cross-sectional view, and is a cross-sectional view taken along the line XXVIII-XXVIII of FIG. 27. FIG. 27 is a schematic diagram for explaining adhesion of lead wires in the lead wire connecting step of FIG. 26 using a perspective view. FIG. 27 is a schematic diagram illustrating bonding of lead wires in the lead wire connecting step of FIG. 26 using a cross-sectional view. It is the schematic explaining the state of the winding start of the sensor circuit pattern winding process of FIG. 26 with a perspective view. It is the schematic explaining the state of the winding start in the sensor circuit pattern winding process of FIG. 26 with sectional drawing. It is the schematic explaining the state of the end of winding in the sensor circuit pattern winding process of FIG. 26 with a perspective view. FIG. 27 is a schematic diagram illustrating a winding end state in the sensor circuit pattern winding step of FIG. 26 in a cross-sectional view. It is a figure which shows the example of the calibration curve calculated | required previously used in order to calculate a gas flow velocity using the airflow sensor of FIG. 24, and the gas flow velocity measurement circuit of FIG. It is a figure which shows the time change of the output voltage of the airflow sensor of FIG. 24 in a response evaluation test. It is a figure which shows the time change of the output voltage of the airflow sensor of FIG. 24 in a response evaluation test.

  Hereinafter, an in-airway gas flow velocity measuring device according to an embodiment of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows an airway gas flow velocity measuring device 10 corresponding to the medical flow measuring device of the present invention and a bronchoscope 12 provided with the device. As shown in FIGS. 2 and 3, the bronchoscope 12 has a flexible sheath 18 portion that is inserted into the airway 16 of the living body 14, and passes through the flexible sheath 18 from the tip thereof for various diagnostic tests. For example, an optical fiber or OCT (Optical Coherence Tomography) probe 20 can be ejected. An airflow sensor 22 that functions as a flow sensor is detachably provided at the tip of the optical fiber or the OCT probe 20. The hole diameter of the airflow sensor 22 is set to match the outer diameter of the optical fiber or the OCT probe 20. For example, as shown in FIG. 4, the airflow sensor 22 may be provided so as to protrude from the distal end of the flexible sheath 18 and be detachably provided on a catheter 26 protruding from the basket 24. Note that the arrows in FIGS. 3 and 4 indicate the direction of airflow that changes periodically.

  The airflow velocity measuring device 10 in the airway corresponds to the medical flow measuring device of the present invention. The gas flow velocity measuring device 10 in the airway includes an air flow sensor 22, a gas flow velocity measuring circuit 30 that measures a gas flow velocity based on a signal from the air flow sensor 22, and a gas based on an output signal from the gas flow velocity measuring circuit 30. An electronic control unit 34 having a gas flow rate calculation control unit 32 for calculating a flow rate and a display output unit 36 for displaying an output from the electronic control unit 34 are provided. The electronic control unit 34 causes the display output unit 36 to display the gas flow rate calculated by the gas flow rate calculation control unit 32. The optical fiber or OCT probe 20 is connected to an image processing circuit 38 incorporating an imaging device such as a CCD camera. The electronic control device 34 generates an image in the airway 16 based on the output signal of the image processing circuit 38 and causes the display output device 36 to display the image.

  FIG. 5 is a perspective view showing the airflow sensor 22, and FIG. 6 is a cross-sectional view of the airflow sensor 22. The airflow sensor 22 is a two-heater element type including two micro-heater elements 40a and 40b in this embodiment, but is a one-heater element type, a type in which temperature sensor elements are arranged on both sides of the one-heater element type, and the like. Also good. In FIG. 5, the sensor circuit pattern and 47a and 47b are formed inside the carrier resin film 44, but are indicated by solid lines.

  5 and 6, the airflow sensor 22 functions as a support body thereof, and a cylindrical support tube 42 having an outer diameter of about several millimeters in which a through hole 42a penetrating in the radial direction is locally formed; Wrapped around the outer peripheral surface of the support tube 42, for example, 0.6 μm to 3.0 μm, preferably 0.8 μm to 1.5 μm, and more preferably about 1 μm, having a very thin submicron to micron order thickness. A thin film carrier resin film 44 made of paraxylylene resin, micro heater elements 40a and 40b, a pair of sensor terminal pads 46a and 46a, and a pair of sensor terminal pads 46b and 46b, and two micro heater elements 40a and The carrier resin film 4 is positioned such that 40b is located at a predetermined interval in the direction of the central axis of the support tube 42 in the through hole 42a. 4 is provided with a pair of sensor circuit patterns and 47a and 47b formed on the inner peripheral surface. The cylindrical support tube 42 is made of an electrically insulating material such as ceramic or plastic. Even if it is a metal tube, if the surface is coat | covered with the electrically insulating material, it does not interfere.

  Further, the support tube 42 of the airflow sensor 22 includes conductor terminal pads 48a and 48a, conductor terminal pads 48b and 48b, and a pair of lead wire connection ends 50a, 50a and 50b and 50b (see FIGS. 13 and 14). A support film 54 that supports a pair of conductor circuit patterns 52a and 52b provided respectively on the outer peripheral surface is fixed. The support film 54 is made of a flexible resin such as a polyimide resin. The outer periphery of the support film 54 is opposed to the pair of sensor terminal pads 46a and 46a and the pair of sensor terminal pads 46b and 46b of the pair of sensor circuit patterns 47a and 47b formed on the inner peripheral surface of the carrier resin film 44. The pair of conductor terminal pads 48a and 48a, the pair of conductor terminal pads 48b and 48b, and the lead wire connection ends 50a and 50b of the conductor circuit patterns 52a and 52b formed on the surface are positioned to face each other. It has been. Accordingly, the pair of sensor terminal pads 46a and 46a and the pair of sensor terminal pads 46b and 46b of the pair of sensor circuit patterns 47a and 47b, the pair of conductor terminal pads 48a and 48a and the pair of conductors of the conductor circuit patterns 52a and 52b. The terminal pads 48b and 48b are in electrical contact with each other.

  Four enameled thin wires 56 functioning as lead wires are connected to the pair of lead wire connecting ends 50a, 50a and 50b, 50b of the pair of conductor circuit patterns 52a and 52b, respectively. An anisotropic conductive film (ACF) 58 (See FIGS. 13 and 14). The anisotropic conductive film 58 is formed by, for example, forming a film obtained by mixing fine metal particles in which an insulating layer is coated on nickel particles plated with gold with a thermosetting resin, and applying pressure. The selected portion becomes selectively conductive. The lead wire connecting ends 50a, 50a and 50b, 50b protrude from the support film 54 by the thickness, and the four enameled thin wires 56 also protrude from the holding film 62 by the wire diameter. The portion sandwiched between both of the anisotropic conductive films 58 is changed into a conductive region, and the lead wire connecting ends 50a, 50a and 50b, 50b and the four enameled thin wires 56 are electrically connected to each other. Connected to.

  FIG. 7 shows a manufacturing process of the airflow sensor 22 configured as described above. In the conductor circuit pattern forming step P1, the lead wire connecting step P2, and the conductor circuit pattern winding step P3 in FIG. 7, the conductor circuit patterns 52a and 52b formed on the support film 54 shown in FIGS. 15 and 16 are wound. This is a process of manufacturing the attached cylindrical support tube 42. The carrier resin film forming step P4, the sensor circuit pattern forming step P5, and the sensor circuit pattern winding step P6 in FIG. 7 are shown in FIGS. 5 and 6 using the cylindrical support tube 42 shown in FIGS. This is a process for manufacturing the airflow sensor 22.

  In the conductor circuit pattern forming step P1 of FIG. 7, a pair of conductor terminal pads 48a and 48a, a pair of conductor terminal pads 48b and 48b, and lead wire connecting ends 50a and 50b are formed on a support film 54 made of polyimide resin. A pair of conductor circuit patterns 52a and 52b provided respectively form a photolithography technique including processes such as resist coating, exposure, and etching on a support film 54 and a metal film such as copper, aluminum, gold, and chromium. And thin film technology.

  Next, in the lead wire connecting step P2, the holding film 62 for holding the end portions of the four enameled thin wires 56 through the anisotropic conductive film 58 on the lead wire connecting end portions 50a and 50b of the conductor circuit patterns 52a and 52b. By pressing while heating, the lead wire connecting ends 50a and 50b and the enameled thin wire 56 are electrically connected. FIGS. 8 and 9 show a state where four enamel wires 56 are fixed on a holding film 62 placed on one surface of a flat jig plate 60, and FIGS. 10 and 11 show the enamel wires 56. FIG. 12 and FIG. 13 show a state in which the lead wire connection ends 50a and 50b of the conductor circuit patterns 52a and 52b formed on the support film 54 are different from each other. The lead wire connecting ends 50a and 50b and the four enameled thin wires 56 are respectively placed on the isotropic conductive film 58 and heated from above the support film 54 and pressed in the direction of the arrow in FIG. A state of electrical connection is shown.

  Next, in the conductor circuit pattern winding step P3, prior to the sensor circuit pattern winding step P6 described later, the cylindrical support tube 42 is formed with the conductor circuit patterns 52a and 52b on one surface of the flat jig plate 60. By rolling on the support film 54, the support film 54 is wound around the outer peripheral surface of the cylindrical support tube 42 with the surface on which the pair of conductor circuit patterns 52a and 52b are formed as the outside. The support film 54 is wound around a cylindrical shape so that a carrier resin film 44 on which sensor circuit patterns 47a and 47b, which will be described later, are formed, is located in the through holes 42a, and the microheater elements 40a and 40b of the sensor circuit patterns 47a and 47b. When wound around the outer peripheral surface of the cylindrical support tube 42, the conductor terminal pads 48a, 48a and 48b, 48b of the pair of conductor circuit patterns 52a, 52b become the sensor terminal pads 46a, 46a of the sensor circuit patterns 47a, 47b and It is determined to overlap with 46b and 46b. 14 is a cross-sectional view showing the lead wire connecting ends 50a and 50b after the conductor circuit pattern winding step P3, and FIGS. 15 and 16 are perspective views showing the cylindrical support tube 42 after the conductor circuit pattern winding step P3. And FIG.

  In the carrier resin film forming step P4, the paraxylene-based polymer is deposited on one surface of a flat film forming jig 64 such as a glass plate in a vacuum champ, thereby obtaining a thickness of submicron to micron order, for example, 0.6 μm to 3 μm. A thin carrier resin film 44 having a thickness of about 0.0 μm, preferably 0.8 μm to 1.5 μm, and more preferably about 1 μm is formed on one surface of the film forming jig 64. The upper limit value of the thickness of the carrier resin film 44 is set to obtain the required responsiveness, and the lower limit value is set to obtain rigidity for supporting the microheater elements 40a and 40b. Since the shape of the carrier resin film 44 covering the through hole 42a of the support tube 42 is a partially cylindrical curved surface, the smaller the outer diameter of the support tube 42, the higher the rigidity.

  In the sensor circuit pattern forming step P5, a pair of sensor circuit patterns 47a having micro heater elements 40a and 40b and sensor terminal pads 46a, 46a and 46b and 46b on the carrier resin film 44 on the film forming jig 64, respectively. 47b is formed on the carrier resin film 44 by using a photolithography technique including processes such as resist coating, exposure, and etching, and a thin film technique for forming a metal film such as platinum, gold, and chromium.

  In the sensor circuit pattern winding step P6, the sensor circuit patterns 47a and 47b on one surface of the film forming jig 64 are formed on the cylindrical support tube 42 in which the through holes 42a penetrating in the radial direction are locally formed. By rolling on the carrier resin film 44, the carrier resin film 44 is wound around the outer peripheral surface of the cylindrical support tube 42 so that the pair of microheater elements 40a and 40b are positioned in the through hole 42a. It is done. 17 and 18 are a perspective view and a cross-sectional view showing a state at the start of winding, and FIGS. 19 and 20 are a perspective view and a cross-sectional view showing a state at the end of winding. In FIG. 19, the sensor circuit patterns 47a and 47b are formed on the inner peripheral surface of the carrier resin film 44, but are indicated by solid lines.

  FIG. 21 is a configuration example of the gas flow velocity measurement circuit 30 and shows a constant temperature type measurement circuit. In FIG. 21, the gas flow rate measuring circuit 30 includes four resistors R1, R2, R3 and a micro heater element 40a (resistance value Rhd), and a first bridge circuit 66a to which a first bridge power supply voltage Vs1 is applied. And a first measurement circuit 72a that amplifies the output voltage Vout1 of the first bridge circuit 66a by the first feedback amplifier 68a and causes a current corresponding to the signal to flow to the first bridge circuit 66a through the first transistor 70a. Yes. The gas flow velocity measuring circuit 30 includes four resistors R5, R6, R7, and a micro heater element 40b (resistance value Rhu), and a second bridge circuit 66b to which a second bridge power supply voltage Vs2 is applied; A second measurement circuit 72b is provided which amplifies the output voltage Vout2 of the second bridge circuit 66b by the second feedback amplifier 68b and causes a current corresponding to the signal to flow to the second bridge circuit 66b through the second transistor 70b. The output voltage Vout1 and the output voltage Vout2 represent the air velocity. The gas flow velocity measurement circuit 30 further includes a differential amplifier 74 that amplifies the difference voltage between the output voltage Vout1 of the first bridge circuit 66a and the output voltage Vout2 of the second bridge circuit 66b and outputs the output voltage Vout. Yes. The resistor R3 is a variable resistor that adjusts the balanced state of the first bridge circuit 66a, and the resistor R7 is a variable resistor that adjusts the balanced state of the second bridge circuit 56b.

  In the gas flow rate measurement circuit 30 configured as described above, when the gas flow rate suddenly increases from the equilibrium state of the first bridge circuit 66a, the temperature of the microheater element 40a decreases and its resistance value Rhd decreases. The first bridge power supply voltage Vs1 is increased by the first feedback amplifier 68a so as to return the first bridge circuit 66a to the original equilibrium state, the temperature of the microheater element 40a is increased, and the temperature of the microheater element 40a is fixed. Maintained at temperature. Similarly, if the gas flow rate suddenly increases from the equilibrium state of the second bridge circuit 66b, the temperature of the microheater element 40b decreases and its resistance value Rhu decreases, so that the second bridge circuit 66b is brought to the original equilibrium state. The second bridge power supply voltage Vs2 is increased by the feedback amplifier 68b so as to return, the temperature of the microheater element 40b is raised, and the temperature of the microheater element 40b is maintained at a constant temperature. The output voltage Vout, which is output from the differential amplifier 74 and represents the difference voltage between the output voltage Vout1 of the first bridge circuit 66a and the output voltage Vout2 of the second bridge circuit 66b, is a pair of micro heater elements in the gas flow velocity measurement circuit 30. The signal reflects the difference in resistance change between 40a and 40b, that is, a waveform representing the forward and backward gas flow directions in the airway 16. That is, the signal represents the direction of gas flow expressed as a waveform composed of one peak and valley in one respiratory cycle.

  In the gas flow rate calculation control unit 32, the gas flow rate FR (cc / min) is determined from the relationship between the calibration curve obtained in advance shown in FIG. 22, for example, the gas flow rate FS (cm / sec) and the square value of the output voltage. Of the output voltage Vout1 and the output voltage Vout2 from the first bridge circuits 72a and 72b including the heater elements 40a and 40b, the output is output from the bridge circuit including the microheater element located on the upstream side of the microheater elements 40a and 40b. It is calculated based on the output voltage. One of the output voltage Vout1 and the output voltage Vout2 is selected based on whether the output voltage Vout of the gas flow velocity measurement circuit 30 is positive or negative. The flow cross-sectional area C (constant) in the airway 16 calculated from the image obtained in advance through the optical fiber 20 to the output voltage Vout1 and the output voltage Vout2 representing the gas flow velocity FS (cm / sec) output from the gas flow velocity measurement circuit 30. ) To obtain the gas flow rate FR (cc / min) flowing through the airway 16 where the airflow sensor 22 is located. In this case, a gas flow rate FS (cm / sec) is used instead of the gas flow rate which is the horizontal axis of the relationship shown in FIG.

  FIG. 23 shows temporal changes in the output voltage Vout1 and the output voltage Vout2 of the airflow sensor 22 in the response evaluation test. Since the output voltage Vout1 and the output voltage Vout2 show similar changes, they are shown in one figure. As is clear from FIG. 23, high responsiveness of about 17 ms is shown. It is presumed that the microheater elements 40a and 40b are supported by the carrier resin film 44 having a thickness of about 1 μm to reduce the heat capacity.

  As described above, in the airflow sensor 22 of the in-airway gas flow velocity measuring device 10 according to the present embodiment, a pair of radially extending through holes 42a are locally formed on the outer peripheral surface of the cylindrical support tube 42. The carrier resin film 44 having the sensor circuit patterns 47a and 47b formed on the inner peripheral surface is wound so that the micro heater elements 40a and 40b of the pair of sensor circuit patterns 47a and 47b are located in the through holes 42a. It consists of For this reason, since the airflow sensor 22 can be designed and manufactured independently of the basket forceps, the degree of freedom in design and manufacturing can be obtained, the manufacturing yield can be increased, and the medical use according to the purpose of use can be achieved. Since it can be mounted on a tool, versatility during use can be improved.

  Further, in the airflow sensor 22 of the airway gas flow velocity measuring device 10 of the present embodiment, the pair of sensor circuit patterns 47a and 47b formed on the inner peripheral surface of the carrier resin film 44 are sensor terminal pads 46a, 46a and 46b, 46b. And a support film 54 for supporting the pair of conductor circuit patterns 52a and 52b on the outer peripheral surface at positions corresponding to the two pairs of sensor terminal pads 46a, 46a and 46b and 46b on the outer peripheral surface of the support tube 42. The pair of conductor circuit patterns 52a and 52b are fixed to the conductor terminal pads 48a, 48a and 48b and 48b which are opposed to and contacted with the sensor terminal pads 46a, 46a and 46b and 46b, and lead wire connection ends 50a and 50b. And. For this reason, the position is fixed by the enamel wire (lead wire) 56 connected from the micro heater elements 40a and 40b to the lead wire connection ends 50a and 50b of the conductor circuit patterns 52a and 52b through the sensor circuit patterns 47a and 47b. Can be easily connected to the gas flow rate measuring circuit 30 provided in the circuit.

  Further, in the airflow sensor 22 of the gas flow velocity measuring device 10 in the airway of the present embodiment, the lead wire connection ends 50a and 50b of the conductor circuit patterns 52a and 52b are connected to the enameled thin wire 56 through the anisotropic conductive film 58. Has been. For this reason, the line width and line spacing of the lead wire connecting ends 50a and 50b of the conductor circuit patterns 52a and 52b, and the wire diameter and line spacing of the enameled thin wires 56 connected thereto can be greatly reduced.

  Further, in the airflow sensor 22 of the airway gas flow velocity measuring device 10 of this embodiment, the carrier resin film 44 supporting the microheater elements 40a and 40b has a thickness of submicron to micron order, preferably about 1 μm. The microheater elements 40a and 40b, which are part of the sensor circuit pattern 47a and 47b formed on the inner peripheral surface of the paraxylene polymer, are locally formed on the cylindrical support tube 42. Since the heat capacity of the microheater elements 40a and 40b is significantly reduced because of being positioned in the through hole 42a, an extremely high responsiveness can be obtained in the flow velocity measurement.

  In addition, according to the method for manufacturing the airflow sensor 22 of the gas flow velocity measuring device 10 in the airway of the present embodiment, the carrier resin film forming step P4 for depositing the carrier resin film 44 having a predetermined thickness on one surface of the film forming jig 64, A sensor circuit pattern forming step P5 for forming a pair of sensor circuit patterns 47a and 47b having micro heater elements 40a and 40b and sensor terminal pads 46a, 46a and 46b and 46b on the carrier resin film 44 by photolithography, The cylindrical support tube 42 in which the through holes 42a penetrating in the radial direction are locally formed is placed on the carrier resin film 44 on which the sensor circuit pattern patterns 47a and 47b on one surface of the film forming jig 64 are formed. So that the micro heater elements 40a and 40b are positioned in the through hole 42a. Sensor circuit patterns 47a, and a sensor circuit pattern winding process P6 to wear around the outer peripheral surface of the support tube 42 to a carrier resin film 44 cylindrical which 47b is formed, including. The air flow sensor 22 configured by such a process can be designed and manufactured independently from the basket forceps, so that the degree of freedom in designing and manufacturing the medical flow measuring device is obtained and the manufacturing yield is high. Become. Moreover, since it can mount in the medical tool according to a use purpose, the versatility at the time of use of the airflow sensor 22 can be improved.

  Moreover, according to the manufacturing method of the airflow sensor 22 of the airflow velocity measuring apparatus 10 of the present embodiment, the conductor terminal pads 48a and 48b and the lead wire connection ends 50a and 50b are formed on the support film 54 made of polyimide resin. Conductor circuit pattern forming step P1 for forming conductor circuit patterns 52a and 52b having photolithography, and lead wire connection ends 50a and 50b of the conductor circuit patterns 52a and 52b through an anisotropic conductive film 58 and enameled thin wires 56 Prior to the lead wire connecting step P2 for connecting the sensor circuit pattern and the sensor circuit pattern winding step P6, the cylindrical support tube 42 is supported by the conductor circuit patterns 52a and 52b formed on one surface of the flat jig plate 60. By rolling on the film 54, the conductor terminal pads 48a and 48a of the conductor circuit patterns 52a and 52b and The support film 54 on which the conductor circuit patterns 52a and 52b are formed is attached to the outer peripheral surface of the cylindrical support tube 42 so that 48b and 48b overlap the sensor terminal pads 46a and 46a and 46b and 46b of the sensor circuit patterns 47a and 47b. And a conductor circuit pattern winding step P3 to be wound around. As a result, the enameled thin wires connected from the micro heater elements 40a, 40b in the sensor circuit patterns 47a, 47b to the lead wire connection ends 50a, 50b of the conductor circuit patterns 52a, 52b via the conductor circuit patterns 52a, 52b ( The lead wire 56 can be easily connected to the gas flow velocity measuring circuit 30 provided at a fixed position.

  Further, according to the manufacturing method of the air flow rate measuring apparatus 10 in the airway of the present embodiment, the carrier resin film forming step P4 is performed by depositing paraxylene-based polymer on one surface of the film forming jig 64, thereby submicron to micron. A carrier resin film 44 made of para-xylene polymer having an order thickness of, for example, about 1 μm is formed on one surface of the film forming jig 64. For this reason, the microheater elements 40a and 40b positioned in the through holes 42a formed in the cylindrical support tube 42 are supported by the carrier resin film 44 having a thickness on the order of submicron to micron. Since the heat capacities of the heater elements 40a and 40b are significantly reduced, a medical flow measuring device with extremely high responsiveness can be obtained in the flow velocity measurement.

  In the following, another embodiment of the present invention will be described. In the following description, parts common to those in the above-described embodiment are denoted by the same reference numerals and description thereof is omitted.

  24 and 25 are schematic perspective views and cross-sectional views illustrating an airflow sensor 80 functioning as a flow sensor in another embodiment of the present invention. The airflow sensor 80 of the present embodiment does not use the holding film 62 on which the conductor circuit patterns 52a and 52b are formed, and a pair of sensor circuit patterns 84a formed on the carrier resin film 82 similar to the carrier resin film 44. And 84b are different in that the enameled thin wires 56 are directly connected to each other. In FIG. 24, the sensor circuit patterns 84a and 84b are formed on the inner peripheral surface of the carrier resin film 82, but are indicated by solid lines.

  The pair of sensor circuit patterns 84a and 84b formed on the carrier resin film 82 wound around the outer peripheral surface of the cylindrical support tube 42 includes L-shaped conductor portions 86a and 86b, and an L-shaped conductor portion 86a. And 86b are respectively protruded from the end of the circumferentially extending portion and are located in the through hole 42a, and the center of the support tube 42 of the L-shaped conductor portions 86a and 86b. A pair of lead wire connection pads 90a, 90a and 90b, 90b formed at the ends of the portions extending in the axial direction are provided. The lead wire connection pads 90a, 90a and 90b, 90b are connected to the enamel thin wire 56 through the conductive paste 92. The conductive paste 92 is a highly viscous fluid in which, for example, metal particles such as silver and a resin adhesive are mixed. The conductive paste 92 functions as an adhesive and functions as a conductor in a cured state.

  FIG. 26 is a process diagram illustrating the manufacturing process of the airflow sensor 80. In FIG. 26, in the carrier resin film forming step P11, as in the above-described carrier resin film forming step P4, paraxylene-based polymer is deposited on one surface of a flat film forming jig 64 such as a glass plate in a vacuum chamber. Thus, a carrier resin film 82 having a thickness of submicron to micron order, for example, about 1 μm is formed on one surface of the film forming jig 64.

  In the sensor circuit pattern forming step P12, as in the sensor circuit pattern forming step P5, the microheater elements 88a and 88b and the lead wire connection pads 90a, 90a and 90b are formed on the carrier resin film 82 on the film forming jig 64. A pair of sensor circuit patterns 84a and 84b each having 90b are formed on a carrier resin film 82 by a photolithography technique including processes such as resist coating, exposure, and etching, and a metal film such as platinum, gold, and chromium. And thin film technology. FIG. 27 shows this state.

  Next, in the lead wire connecting step P13, as shown in FIGS. 27 and 28, the conductive paste 92 is dispensed on the lead wire connecting pads 90a, 90a and 90b, 90b of the pair of sensor circuit patterns 84a and 84b. After being applied by screen printing or the like, the conductive paste 92 is heated and cured while pressing the holding film 62 that holds the ends of the four enameled thin wires 56, whereby the lead wire connection pads 90a, 90a and 90b, 90b And the enameled thin wire 56 are electrically connected. FIG. 29 shows a state in which four enamel thin wires 56 are fixed to the lead wire connection pads 90a, 90a and 90b, 90b on the film forming jig 64, and FIG. 30 is a schematic diagram showing a section thereof. 27 and 28, in the sensor circuit patterns 84a and 84b, between the lead wire connection pads 90a and 90a and the micro heater element 88a and between the lead wire connection pads 90b and 90b and the micro heater element 88b. Are equal in length and equal in wiring resistance.

  In the sensor circuit pattern winding step P14, as in the sensor circuit pattern winding step P6, the cylindrical support tube 42 in which the through holes 42a penetrating in the radial direction are locally formed is used as the film forming jig 64. The carrier resin film 82 is positioned so that the pair of micro heater elements 88a and 88b are positioned in the through hole 42a by rolling on the carrier resin film 82 on which the sensor circuit patterns 84a and 84b on one surface are formed. Is directly wound around the outer peripheral surface of the cylindrical support tube 42. Thereby, the airflow sensor 80 shown in FIG. 24 and FIG. 25 is obtained. FIGS. 31 and 32 are a perspective view and a cross-sectional view showing a winding start state, and FIGS. 33 and 34 are a perspective view and a cross-sectional view showing a winding end state.

  The air flow sensor 80 configured as described above is connected to a gas flow rate measurement circuit similar to the gas flow rate measurement circuit 30 provided at a fixed position shown in FIG. 21, so that the gas flow rate FR (cc / min) is increased. For example, the output from the first bridge circuits 72a and 72b including the micro heater elements 88a and 88b from the relationship between the calibration curve obtained in advance shown in FIG. 35, that is, the gas flow rate FS (cm / sec) and the square value of the output voltage. Of the voltage Vout1 and the output voltage Vout2, it is calculated based on the output voltage output from the bridge circuit including the microheater element located on the upstream side of the microheater elements 88a and 88b. 36 and 37 show temporal changes in the output voltage Vout1 and the output voltage Vout2 of the airflow sensor 80 in the response evaluation test. Since the output voltage Vout1 and the output voltage Vout2 show similar changes, they are shown in one figure. As is clear from FIGS. 36 and 37, high responsiveness of about 18.5 ms is shown. As in the previous embodiment, it is presumed that the microheater elements 88a and 88b are supported by the carrier resin film 82 having a thickness of about 1 μm to reduce the heat capacity.

  As described above, the airflow sensor 80 according to the present embodiment is similar to the airflow sensor 22 described above in that a pair of the airflow sensor 80 is provided on the outer peripheral surface of the cylindrical support tube 42 in which the through holes 42a penetrating in the radial direction are locally formed. The sensor circuit patterns 84a and 84b are wound so that the micro heater elements 88a and 88b are positioned in the through hole 42a. For this reason, since the airflow sensor 80 can be designed and manufactured independently of the basket forceps, the degree of freedom in design and manufacturing can be obtained, the manufacturing yield can be increased, and the medical use according to the purpose of use can be achieved. Since it can be mounted on a tool, versatility during use can be improved.

  Further, in the airflow sensor 80 of the airway gas flow velocity measuring device 10 of the present embodiment, the sensor circuit patterns 84a and 84b and the lead wire connection pads 90a and 90a and 90b and 90b formed on the inner peripheral surface of the carrier resin film 82 are provided. In addition, the lead wire connection pads 90a, 90a and 90b, 90b of the sensor circuit patterns 84a, 84b are connected to the enamel fine wire 56 through the conductive paste 92. Therefore, the microheater element can be connected to a fixed position measuring circuit without providing a conductor circuit pattern, and the structure is simplified.

  Further, in the airflow sensor 80 of the airflow velocity measuring apparatus 10 of the present embodiment, the carrier resin film 82 is made of a paraxylene polymer having a thickness of submicron to micron order and is formed on the inner peripheral surface thereof. The microheater elements 88a and 88b, which are part of the sensor circuit patterns 84a and 84b, are positioned in a through hole 42a locally formed in the cylindrical support tube 42. For this reason, the microheater elements 88a and 88b positioned in the through hole 42a formed in the cylindrical support tube 42 are supported by the carrier resin film 82 having a thickness of submicron to micron order, Since the heat capacities of the micro heater elements 88a and 88b are significantly reduced, an extremely high responsiveness can be obtained in the flow velocity measurement.

  Further, in the method for manufacturing the airflow sensor 80 of the airflow velocity measuring apparatus 10 of the present embodiment, the sensor circuit patterns 84a and 84b include the lead wire connection pads 90a, 90a and 90b, 90b, and the sensor circuit pattern 84a and A lead wire connecting step P13 for connecting the lead wire connecting pads 90a, 90a and 90b, 90b of 84b with the enamel fine wire 56 through the conductive paste 92 is included. Therefore, the microheater elements 88a and 88b can be connected to the gas flow rate measuring circuit 30 with a fixed position without providing the conductor circuit patterns 52a and 52b.

  As mentioned above, although the Example of this invention was described, this invention is applied also in another aspect.

  For example, in the above-described embodiment, the airflow sensors 22 and 80 measure the airflow in the airway 16, but the airflow in the living body 14 at a site different from the airway 16 and an in vitro airflow having a similar mechanism. It is also used to measure the flow velocity of a liquid flow in a living body. For example, it may be attached to a balloon catheter, a swan gantz catheter, an infusion line of a drip device, or the like and used to detect the flow rate in the urinary tract, the flow rate in the blood vessel, or the flow rate of the infusion solution. Airflow sensors 22 and 80 can also be used to measure in vitro airflow or liquid flow, eg, infusion flow rates.

  In the above-described embodiment, the pair of sensor terminal pads 46a and 46a and the pair of sensor terminal pads 46b and 46b of the pair of sensor circuit patterns 47a and 47b, and the pair of conductor terminal pads 48a of the conductor circuit patterns 52a and 52b, 48a and the pair of conductor terminal pads 48b and 48b are arranged in opposition to each other so that they are in electrical contact with each other. Electrical connection may be made via the conductive paste 92.

  Further, in the above-described embodiment, in the sensor circuit patterns 47a and 47b formed on one surface of the carrier resin film 44, the portions excluding the microheater elements 40a and 40b and the sensor terminal pads 46a and 46a and 46b and 46b. May be coated with an insulating layer. Similarly, of the conductor circuit patterns 52a and 52b formed on one surface of the support film 54, the partial insulating layers excluding the conductor terminal pads 48a, 48a, 48b and 48b and the lead wire connection ends 50a, 50a and 50b and 50b. May be coated. Further, other types of lead wires other than the enameled thin wires 56 may be used.

  In the above-described embodiment, the micro heater elements 40a and 40b are disposed in the through holes 42a of the cylindrical support tube 42. However, the micro heater elements 40a and 40b are disposed on the outer peripheral surface of the support tube 42 or the cylindrical solid support body. You may arrange | position in the formed concave hole.

  In the airflow sensor 80 of the second embodiment, the lead wire connection pads 90a, 90a and 90b, 90b and the enameled thin wire 56 are connected via the conductive paste 92, but via the anisotropic conductive film 58. It may be connected.

  The above description is merely an example of the present invention, and the present invention can be variously modified without departing from the spirit of the present invention.

10: Gas flow velocity measuring device in the airway (medical flow measuring device)
12: Bronchoscope 14: Living body 16: Airway 18: Flexible sheath 20: Optical fiber 22: Airflow sensor (flow sensor)
24: Basket 26: Catheter 30: Gas flow rate measurement circuit 32: Gas flow rate calculation control unit 34: Electronic control unit 36: Display output unit 38: Image processing circuit 40a, 40b: Micro heater element 42: Cylindrical support tube (support body)
42a: Through hole 44: Carrier resin film 46a, 46b: Sensor terminal pad 47a, 47b: Sensor circuit pattern 48a, 48b: Conductor terminal pad 50a, 50b: Lead wire connection end 52a, 52b: Conductor circuit pattern 54: Support film 56: Enamel wire (lead wire)
58: Anisotropic conductive film 60: Jig plate 62: Holding film 64: Film forming jig (jig)
66a: first bridge circuit 66b: second bridge circuit 68a: first feedback amplifier 68b: second feedback amplifier 70a: first transistor 70b: second transistor 72a: first measurement circuit 72b: second measurement circuit 74: differential Amplifier 80: Airflow sensor (flow sensor)
82: supporting resin films 84a, 84b: sensor circuit patterns 86a, 86b: L-shaped conductor portions 88a, 88b: micro heater elements 90a, 90b: lead wire connection pads 92: conductive paste 94: dispenser

Claims (9)

A medical flow measuring device for measuring the velocity of a fluid,
A cylindrical or columnar support in which a through hole penetrating in the radial direction or a concave hole recessed in the radial direction is locally formed;
A carrier resin film wound around the outer peripheral surface of the support;
A sensor circuit pattern formed on the inner peripheral surface of the carrier resin film so as to have a microheater element, and the microheater element is positioned in the through hole or the recessed hole;
A medical flow measuring device comprising: The sensor circuit pattern formed on the inner peripheral surface of the carrier resin film includes a sensor terminal pad,
A support film for supporting the conductor circuit pattern on the outer peripheral surface is fixed to a position corresponding to the sensor terminal pad in the outer peripheral surface of the support,
The medical flow measurement device according to claim 1, wherein the conductor circuit pattern includes a conductor terminal pad and a lead wire connecting end that are opposed to and contacted with the sensor terminal pad. The medical flow measurement device according to claim 2, wherein the lead wire connection end portion of the conductor circuit pattern is connected to a lead wire via an anisotropic conductive film. The sensor circuit pattern formed on the inner peripheral surface of the carrier resin film includes a lead wire connection pad,
The medical flow measuring device according to claim 1, wherein the lead wire connection pad of the sensor circuit pattern is connected to the lead wire via a conductive paste. The carrier resin film is composed of a paraxylene-based polymer having a thickness of submicron to micron order,
The microheater element, which is a part of the sensor circuit pattern formed on the inner peripheral surface of the carrier resin film, is in the through hole or the concave hole locally formed on the cylindrical or columnar support. The medical flow measuring device according to any one of claims 1 to 4, wherein the medical flow measuring device is positioned at a position. A method for manufacturing a medical flow measuring device for measuring the velocity of a fluid, comprising:
A carrier resin film forming step of depositing a carrier resin film of a predetermined thickness on one surface of a flat jig;
A sensor circuit pattern forming step of forming a sensor circuit pattern having a microheater element and a sensor terminal pad on the carrier resin film by photolithography,
The carrier resin in which the sensor circuit pattern on one surface of the jig is formed by using a cylindrical or columnar support in which a through hole penetrating in the radial direction or a concave hole recessed in the radial direction is locally formed A sensor that rolls on the film to wind the carrier resin film on which the sensor circuit pattern is formed so that the microheater element is positioned in the through hole or the recessed hole around the outer peripheral surface of the support. A method for manufacturing a medical flow measuring device, comprising: a circuit pattern winding step. On the support film, a conductor circuit pattern forming step of forming a conductor circuit pattern having conductor terminal pads and lead wire connecting ends by photolithography,
A holding film for holding the end of the lead wire through an anisotropic conductive film is heated and pressed to the lead wire connecting end of the conductor circuit pattern, and the lead wire is connected to the lead wire connecting end of the conductor circuit pattern. A lead wire connecting step for connecting the end portions;
Prior to the sensor circuit pattern winding step, the conductor terminal pad of the conductor circuit pattern is moved to the sensor circuit by rolling the support on the support film on which the conductor circuit pattern is formed. A conductor circuit pattern winding step of winding the support film on which the conductor circuit pattern is formed so as to overlap the sensor terminal pad of the pattern around the outer peripheral surface of the support. 6. A method of manufacturing a medical flow measuring device according to claim The sensor circuit pattern formed on the carrier resin film includes a lead wire connection pad,
7. The method for manufacturing a medical flow measuring device according to claim 6, further comprising a lead wire connecting step of connecting the lead wire connecting pad of the sensor circuit pattern to a lead wire via a conductive paste. The carrier resin film forming step includes depositing the paraxylene-based polymer on one surface of the jig to remove the carrier resin film composed of the para-xylene-based polymer having a thickness of submicron to micron order on the jig. The method for manufacturing a medical flow measuring device according to any one of claims 6 to 8, wherein the medical flow measuring device is generated on one surface.

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