JP2018066056A - Molding material discharge head and molding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide highly reliable molding material discharge head having a simple structure and also having a structure, even in a molding material having a high melting point close to 500°C, capable of instantaneously increasing its temperature, and further free from the generation of the peeling or the like of a joint, and a molding method.SOLUTION: Provided is a molding material discharge head comprising: a flow passage structural body where a through hole having a fine hole as a discharge port at the tip parts formed in a metal block or, in a planar body in which a metal block is made wide, a plurality of through holes are formed in a direction vertical to the thickness direction of the planar body, and the through hole(s) is used as the flow passage for a molding material; and a heating plate adhesively provided at least at a part of the outer wall face of the flow passage structural block of the metal block, and each side wall of the flow passage in the flow passage structural body to be provided with the heating plate is formed so as to be thinner than the thickness of the part not provided with the heating plate of the flow passage structural body.SELECTED DRAWING: Figure 1A

Description

  The present invention relates to a modeling material discharge head for discharging a modeling material and a modeling method of a three-dimensional model when a three-dimensional model is manufactured by a three-dimensional printer. More specifically, even a material in which the modeling material melts at a high temperature of about 500 ° C. can be melted in a short time after the switch is turned on, and a desired amount of the modeling material can be discharged, and a highly reliable modeling material discharge head and modeling Regarding the method.

  In recent years, manufacturing a three-dimensional model using a computer with a three-dimensional printer has been actively performed. In addition, various materials such as materials that can withstand high temperatures due to shaped objects, and materials that increase the strength by adding additives to form shaped objects having durability tend to be used. As a result, even when a modeling material is melted to produce a modeled object, it is necessary to increase the temperature while enabling operation immediately after the switch is turned on.

  As an apparatus for discharging such a modeling material, for example, one having a structure as shown in FIG. 9 is known. That is, in FIG. 9, the nozzle 61 is screwed into one end side of the heater block 63, the barrel 62 is screwed into the other end side, and a wire-shaped or rod-shaped modeling material is inserted into the barrel 62. Then, the modeling material is fed at a constant rate by the barrel 62, and the modeling material is heated and melted by the heat of the heater block 63, and the molten modeling material is discharged from the discharge port 61 a at the tip of the nozzle 61 by a certain amount. The A three-dimensional desired shaped article is manufactured by moving the position of the discharge port 61a relative to a shaping table (not shown) that forms the shaped article in the xyz direction. A sheathed heater (not shown) is provided inside the heater block 63, and the temperature of the entire heater block 63 is raised so that the modeling material is melted by the heat. For this reason, it is necessary to raise the temperature of the entire heater block 63, and an extra amount of heat is required, and there is a problem that it takes time to start the operation.

  On the other hand, as an inexpensive discharge head that can be quick-started and melts and discharges a modeling material with a small amount of heat, for example, a through-hole and a discharge port as a flow path are formed in a plate-like body, and the plate-like body is plural It has been proposed to arrange a heating plate on one wall surface of the flow path structure formed by overlapping and fixing so that a heating resistor is formed on a ceramic substrate so that it can be energized (for example, Patent Document 1 and Patent Document 2). By forming the flow path by using such a plate-like body, it is not necessary to assemble the heater block, the nozzle and the barrel, and the flow path structure can be formed very easily. In addition, the use of a heating plate with a heating resistor formed on the ceramic substrate makes it easy to start quickly, and immediately after the switch is turned on, the molding material in the flow path can be melted immediately, and the operation is on demand. Can do.

Japanese Patent No. 5981079 Japanese Patent No. 598732

  As shown in FIG. 9 described above, the structure in which the cylindrical nozzle 61 and the barrel 62 are separately manufactured and fixed to the heater block 63 increases the material cost and manufacturing cost, and penetrates the heater block 63 one by one. As a result, it is necessary to make holes and cut screw holes, and the number of assembling steps increases. As a result, there is a problem that the discharge device as a whole including the heater block is increased in size and cost. Moreover, since the modeling material is heated by the heater from the outside of the heater block 63, it becomes indirect heating and the thermal efficiency is poor.

  Further, since the discharge port 61a is separated from the heater block 63, there is a problem that the modeling material melted at the tip of the nozzle 61 is solidified before the modeling material is discharged to a desired place. Moreover, once solidified, the heater block 63 must be heated to an unnecessarily high temperature in order to increase the temperature of the tip of the nozzle 61. However, if the temperature of the heater block 63 is raised above the melting temperature of the modeling material, the filament, which is a linear or rod-shaped modeling material introduced on the barrel 62 side, melts and can be extruded in a certain amount. There is also a problem of disappearing. Therefore, it is necessary to dissipate heat by providing a heat radiating plate on the barrel 62 side, which is very wasteful. Such a problem is more pronounced as the melting temperature of the modeling material becomes higher, for example, 500 ° C.

  On the other hand, since the flow channel structure is formed of a laminate of plate-like bodies, there is an advantage that mass production is facilitated. However, as described above, when the temperature of the flow path structure is 500 ° C. or higher and it is necessary to withstand a high temperature of at least about 600 ° C. as the modeling material has a high melting point, an adhesive made of an organic material is used. It becomes impossible to bond with. In particular, when a part of the side wall of the flow path is closed with a heating plate, the insulating substrate made of ceramics or the like of the heating plate and the metal plate such as a stainless steel plate of the flow path structure are joined so as not to peel off. It is necessary to

  The present invention has been made in view of such a situation, and has a simple structure and a structure capable of immediately raising the temperature even with a modeling material having a melting point of the modeling material close to 500 ° C. An object of the present invention is to provide a highly reliable modeling material ejection head and modeling method that do not cause separation of the joints.

  Another object of the present invention is to provide a discharge head having a structure that can be applied to a molding material that melts at a high temperature by enabling heating by a heating plate without using a flow path structure by joining plate-like bodies. There is.

  The inventors of the present invention can efficiently heat a heating plate provided with a heating resistor on an insulating substrate even when the melting temperature of the modeling material is increased to about 500 ° C. In order to obtain a head, intensive study was repeated. As a result, when the channel structure is formed by laminating the channel plates, the laminated body is joined with a brazing material made of a high-temperature inorganic material that can withstand temperatures of about 600 ° C. It is highly reliable and the temperature of the modeling material can be immediately raised to about 500 ° C. by closing the exposed portion or joining the heating plate with a similar high-temperature brazing material through a thin metal wall. I found. Even when a metal block made of a thick metal plate having a thickness of about several millimeters (mm) is used as the flow channel structure, a very thin metal wall of about 0.1 to 0.5 mm is interposed on the side wall of the flow channel. It has also been found that the temperature can be raised in a short time by providing the heating plate in close contact with each other, and even with a molding material having a high melting point, a quick start can be performed without the problem of the joining portion.

  The modeling material discharge head for three-dimensional modeling of the present invention has a plate-like body in which a through-hole having a thin hole serving as a discharge port is formed in a metal block, or a metal block is widened. A plurality of through-holes formed in a direction perpendicular to the thickness direction of the body, the flow path structure using the through-holes as flow paths for the modeling material, and at least an outer wall surface of the flow path structure of the metal block A heating plate provided in close contact with a part or one surface of the plate-like body, and the side wall of the flow channel structure provided with the heating plate is heated by the flow channel structure. It is formed thinner than the thickness of the part where the plate is not provided.

  Here, “an inorganic bonding material that can withstand a temperature of 500 ° C. or higher” means a material that is made of an inorganic material and can maintain a bonded state at a temperature of 500 ° C. or higher even in a treatment at a temperature of 500 ° C. or lower. Specifically, in addition to brazing materials such as silver and copper, silver and copper and zinc, and nickel, and so-called silver brazing, nano metals, inorganic adhesives, glassy materials (including glazes), and other low-temperature heating Includes inorganic bonding materials that are hardened and heat resistant. For example, nanometals composed of nanoparticles of 100 nm or less such as silver, copper, nickel, for example, organic silver compounds of nanosilver, become 100% silver and become porous when sintered at a low temperature of about 250 ° C. Join (physical interparticle bonding). However, the melting point of silver does not melt to 962 ° C., and the bonding is maintained. Moreover, when it joins to a copper plating film with nano silver, it will sinter-join at 250 degreeC, and joining will be maintained until it becomes eutectic at 780 degreeC after that and melt | dissolves. Ceramics are also metallized with a thick film AgPd (Pt) metal on the surface, so that Ag and nano silver are easily bonded. The inorganic adhesive is, for example, a high heat-resistant material that is hardened at low temperature by a chemical reaction, crystal growth, etc. in a cement form.

  In another form of the modeling material discharge head of the present invention, a plate-like body in which a through-hole having a thin hole serving as a discharge port is formed at a tip portion or a metal block is widened is formed on the metal block. A plurality of through-holes formed in a direction perpendicular to the thickness direction of the body, the flow path structure using the through-holes as flow paths for the modeling material, and at least an outer wall surface of the flow path structure of the metal block A heating plate provided in close contact with one surface of the plate-like body, the heating plate so that a part of a side wall of the flow channel is exposed and an exposed portion of the flow channel is closed. Are joined.

  The modeling method of a three-dimensional modeled object of the present invention is a modeling method of a three-dimensional modeled object, and has a discharge port at one end and a flow channel having a modeling material supply port for supplying a modeling material supply material to the other end. A flow passage structure is formed by forming a through-hole in a metal block or a plate-like body having a wide metal block in a direction perpendicular to the thickness direction of the plate-like body, and the flow path of the flow passage structure is formed. The thickness of one side wall of the path is made thinner than the portion where the heating plate is not provided, the heating plate on which the heating resistor is formed is closely attached to the ceramic substrate, and the modeling material is supplied from the modeling material supply port. However, forming the three-dimensional structure by discharging the modeling material melted in the flow path from the discharge port.

  According to the present invention, the heat generation resistor is formed on the insulating substrate directly or so as to close the side surface of the flow path of the flow path structure formed of the metal plate laminate or the metal block or through the metal wall on the side surface of the flow path. Since the heating plate on which the body is formed is bonded by an inorganic bonding material that can withstand a temperature of 500 ° C. or higher, the bonding between the flow path structure and the heating plate is peeled even if the modeling material is repeatedly melted. There is no. Moreover, the heating plate and the flow path are in direct contact with each other or are joined by a brazing material via a thin (0.5 mm or less) metal wall (a metal plate that closes the partition wall or the flow path). The heat of the heating plate is directly transferred to the molding material inside and is efficiently heated. Even when a thin metal wall (partition wall) is used, the metal wall may be torn and the flow path exposed, so that the metal wall can be made very thin. Since it is joined by the material, the heat of the heating plate can be effectively transmitted to the modeling material in the flow path. As a result, even a modeling material having a high melting point can be reliably melted in a very short time and without the modeling material oozing out. In this case, even when the flow path structure is made of a laminate of metal plates, the metal plates are bonded by an inorganic bonding material that can withstand a temperature of 500 ° C. or higher. It won't interfere.

  Therefore, the bonding of the flow channel structure and the bonding of the flow channel structure and the heating plate are performed by transferring the heat of the heating plate to the modeling material in the flow channel effectively while being bonded very reliably. be able to. As a result, even with a modeling material that melts at about 500 ° C., the modeling material can be melted and discharged on demand by a quick start, and it is not necessary to ignite the heater in advance, which can save a lot of power. . In addition, a rigid three-dimensional model can be efficiently manufactured.

  Even when the flow path structure is made of a metal block and a heating plate is provided via a metal wall around the flow path, the metal plate is made very thin and the heating plate is brought into close contact with the heating plate. Heat can be efficiently transferred to the modeling material in the flow path. With this structure, there is no need to braze the flow path structure itself, and the heating plate only needs to be in close contact, so that it can be assembled without the need for brazing, for example, by tightening with a screw or the like. In this case, the metal wall needs to be thin, but it is necessary that the metal wall is not torn and exposed. When the metal wall is torn, it is preferable to join with an inorganic bonding material that can withstand the temperature of 500 ° C. or higher. Even when this heating plate is not bonded by an inorganic bonding material that can withstand a temperature of 500 ° C. or higher, the metal wall of the flow path structure in the portion where the heating plate is bonded is formed thinner than the portion where the heating plate is not provided. Therefore, if it is in close contact, the heat conduction to the modeling material is excellent. As a result, even in the case of a modeling material that melts at about 500 ° C., the modeling material can be efficiently melted and discharged.

It is a front view explaining the modeling material discharge head of one embodiment of the present invention. It is a side view of the discharge head of FIG. 1A. It is the bottom view seen from the discharge outlet side of the discharge head of Drawing 1A. It is the top view seen from the supply port side of the modeling material of the discharge head of FIG. 1A. It is a front view explaining the state which removed the modeling material discharge head heating plate of other embodiments of the present invention. It is a side view of the discharge head of FIG. 2A. It is the top view seen from the discharge outlet side of the discharge head of FIG. 2A. FIG. 2B is a side view of a state in which the side wall for joining the heating plates of the ejection head of FIG. 2A is not removed. It is a front view explaining the modeling material discharge head of further another embodiment of the present invention. FIG. 3B is a plan view of an example of a flow path plate for the flow path structure of the ejection head of FIG. 3A. It is a plane explanatory view in the state where the cover member of the heating plate of Drawing 1A was removed. It is a side view of the state where the cover member was attached to Drawing 4A. It is a bottom view which shows the back surface of the heating plate of FIG. 4A. It is a figure explaining the other example of the attachment structure while changing the structure of a heating plate by the flow-path structure shown by FIG. 3A. It is explanatory drawing of the side surface of the discharge head manufactured by the structure of FIG. 5A. It is explanatory drawing of the front seen from the heating-plate side of the discharge head of FIG. 5B. It is explanatory drawing of the side surface which attached the heating plate similar to FIG. 5A by the flow-path structure shown by FIG. 2A. It is an example of the top view which looked at the structure of FIG. 5D from the modeling material supply part side. FIG. 5D is a side view of the ejection head of FIG. FIG. 6B is a view of the exterior case seen through from the discharge port side in the state of FIG. 6A, in which the exterior case is simplified and shown by lines. It is the figure seen from the modeling material supply part side with the discharge head shown by FIG. 6A, and while changing a part of structure of an attaching part, it is the figure which simplified and showed the exterior case with the line. FIG. 5B is a plan view in which the mounting portion is removed in a state where the outer case is put on FIG. 5B, and the outer case is simplified and shown by lines. It is a side view which shows an example of the exterior case shown by FIG. 6B. It is the top view seen from the discharge outlet side of the exterior case shown by FIG. 7A. It is a side view which shows another example of an exterior case. It is the top view seen from the discharge outlet side of FIG. 7C. For example, FIG. 3B is a diagram illustrating a channel structure when a plurality of channels are arranged in parallel with the channel plate shown in FIG. 3B to form a line head. It is sectional explanatory drawing which shows an example of the nozzle for discharge of the conventional modeling material.

  Next, the modeling material discharge head and the modeling method of the present invention will be described with reference to the drawings. 1A to 1D, a front view of a modeling material discharge head according to an embodiment of the present invention viewed from the heating plate 2 side, a side view thereof, a plan view (bottom view) viewed from the discharge port side, and a modeling material supply unit side The top view seen from each is shown. In this example, the modeling material discharge head of the present embodiment has a discharge port 12 at one end and a supply port 13 for modeling material at the other end in the metal block 10 as shown in a side view in FIG. 1B. The flow channel structure 1 in which the flow channel 11 of the modeling material is formed, and the metal that blocks the side surface of the flow channel 11 directly or so as to block the exposed portion of the side surface of the flow channel 11 of the flow channel structure 1 A modeling that is connected via a wall (not shown) and connected to the heating plate 2 having the heating resistor 22 on the insulating substrate 21 and the modeling material supply port 13 of the channel 11 of the channel structure 1 And a material supply unit (a barrel and a fluororesin-based cylindrical ring) 6. And the joining of the metal plate and the joining of the flow path structure 1 and the heating plate 2 that form a laminate when the flow path structure 1 is made of a laminate (not shown) can withstand temperatures of 500 ° C. or higher. Bonded by the obtained inorganic bonding material.

  In this example, as shown in FIG. 1B, the heating plate 2 is formed on both opposing surfaces of the flow path structure 1, but only one of them may be used. In that case, the opposing surface can leave the flow channel 11 unexposed (leave the side wall), or a second nozzle that controls the discharge of each flow channel 11 described later by using a multi-nozzle such as a line head. The heating plate may be provided via a thin metal plate (metal wall). By the heating by the heating plate 2, the modeling material 92 melted in the flow path 11 is pushed out from the discharge port 12 by a certain amount by pressing the modeling material 91 made of filaments at a constant pitch on the modeling material supply unit 6 side. . In addition, even if the modeling material 91 is not a filament shape but is granular or powdery, a certain amount of the modeling material 92 that is melted is extruded from the discharge port. Further, as the modeling material 91, a tablet (a solid or powder temporary molded product), a softened mucus, or the like may be used. In particular, in the case of a modeling material having a high melting point, the number of powders increases. As a result, the modeling material 92 melted at a predetermined location is discharged by relative movement between the discharge head and the modeling table, whereby a modeled object is formed.

  The discharge head of the present embodiment is characterized in that it corresponds to a high melting point modeling material. That is, in the conventional three-dimensional structure, a resin is laminated to produce a three-dimensional structure, and a liquid resin is cured using an ultraviolet curable resin, or a resin mainly composed of ABS or the like is melted. The molded object was manufactured by hardening by cooling after discharging. Therefore, even when the resin is melted, it is sufficient to raise the temperature to about 200 to 300 ° C., and there is almost no problem of heat resistance.

  However, in recent years, in order to form leads and the like, it has been required to discharge and form an alloy material as a conductive material, or in response to a demand for a molded article with high strength, a molding material made of resin or the like is made of metal powder or metal. A modeling material in which a filler having a high melting point such as an oxide is mixed is required, or various sensor functional materials are required. As a result, in order to melt the modeling material, a material that melts at a high temperature of about 500 ° C. is required. However, there is no discharge head for discharging such a high melting point molding material while melting it. In order to improve the durability of the ejection head, the present inventors can raise the temperature immediately after the switch is turned on and melt it immediately after the switch is turned on to enable quick start as described above. As a result of intensive studies, a flow path was formed in the laminate or metal block of metal plates by through holes, and a heating resistor was formed in the ceramic substrate directly or via a thin metal wall. By bonding the ceramic substrate of the heating plate 2 with an inorganic bonding material that can withstand a temperature of 500 ° C. or higher, such as a high-temperature brazing material, the modeling material in the flow path 11 can be heated almost directly, and the temperature is effectively increased. It has been found that the durability of the heating head can be obtained while the temperature can be raised to about 500 ° C. easily in a short time.

  That is, by directly bringing the heating plate 2 into contact with the modeling material 91 in the flow path 1, the heat of the heating plate 2 can be immediately transferred to the modeling material 91 in the flow path 11. In addition, the heating plate 2 and the flow path structure 1 are reliably connected by bonding the heating plate 2 with an inorganic bonding material that can withstand a temperature of 500 ° C. or higher, such as a brazing material (high temperature brazing material) made of an inorganic material. The resin of the modeling material 91 does not soak into the joint surface and the heat conduction does not deteriorate. Furthermore, even if a thin metal wall (a metal plate having a thickness of about 0.5 mm or less) is interposed, the heating plate 2 and the flow path structure 1 are completely made of an inorganic bonding material that can withstand a temperature of 500 ° C. or higher, such as silver solder. Is excellent in heat conduction, and the modeling material 91 in the flow path 11 can be similarly heated. And the inorganic joining material which can endure the temperature of 500 degreeC or more when joining the laminated body of this metal plate 10a (refer FIG. 3B) or the metal block 10 and the heating plate 2, or manufacturing the laminated body of the metal plate 10a. Thus, the present inventors have found that the heat resistance during heating and the durability against heat cycle can be maintained by joining together. Of course, a material having a thermal expansion coefficient close to that of the ceramic to be bonded to the metal (insulating substrate of the heating plate 2) is selected.

  The example shown in FIGS. 1A to 1D is an example in which the discharge port 12 is a single-type discharge head, and the flow path structure 1 has a rectangular outer shape. However, as will be described later, the outer shape may not be a quadrangle but may be a circle, and not a single structure, but a number such that the width of the flow channel structure 1 is formed by extending in the lateral direction. A multi-nozzle type discharge head such as a line head can also be formed of a metal plate having a thickness of millimeter (mm) (thickness capable of forming a flow path in a direction perpendicular to the plate thickness direction).

  The flow path structure 1 shown in FIGS. 1A to 1D has a through hole having a diameter of about 2 mm constituting the flow path 11 at the center of a quadrangular prism type metal block 10 having an outer shape of 4 mm square or a position eccentric from the center. It is formed, and its tip is thinned to form a discharge port 12 having a diameter of about 0.5 mm, for example. The shape of the discharge port 12 is not limited to a circle, and may be a rectangle or a sheet. As shown in FIG. 1B, when the heating plates 2 are provided on both surfaces of the flow channel 11 of the flow channel structure 1, the flow channel 11 is formed at the center of the square metal block, and then faces each other. The two metal blocks are cut so that the inside of the through-hole that is the flow path 11 is exposed. The thickness F (see FIG. 1B) of the metal block 10 after being shaved is, for example, about 1.7 to 2.3 mm in the case of a filament. Then, the heated plate 2 is applied to the exposed side surface of the flow path 11 and brazed or the like, whereby the opened portion of the flow path 11 is closed by the heat plate 2. In other words, a part of the side surface of the flow path 11 is covered with the insulating substrate 21 of the heating plate 2. As a result, the modeling material flowing in the flow path 11 is directly heated by the heating plate 2. Therefore, even a modeling material having a melting point of about 500 ° C. can be easily melted in a short time.

  However, even if the side wall of the metal block 10 is not shaved until the flow path 11 is completely exposed, a part of the side wall is exposed or the whole side wall is very thin (for example, about 0.1 to 0.5 mm). Even if the metal wall and the heating plate 2 are brazed, the heat of the heating plate 1 can be easily transferred to the modeling material in the flow path. In addition, the metal wall does not need to leave the side wall of the metal block 10 as it is, the flow path 11 may be completely exposed, and a metal plate as thin as the metal wall may be attached. This is easier to achieve a uniform thickness. In this case, the same joining material as the joining of the flow path structure 1 and the heating plate 2 is used as the joining material of the metal plate.

  On the other hand, the flow path structure 1 and the heating plate 2 require an adhesive force that can withstand a high temperature of about 500 ° C. or higher in order to melt the modeling material at about 500 ° C. Therefore, in the present embodiment, the flow path structure 1 and the heating plate 2 are joined using, for example, silver brazing mainly composed of silver and copper, copper brazing, aluminum brazing, or the like, that is, brazing material made of an inorganic material, or nano metal. It is joined by the joining material used. For example, bonding is performed using a JIS standard BAg-7 (Ag 56%, Cu 22%, Zn 17%, Sn 5%: brazing temperature of about 650 to 760 ° C.). As a result, for example, the metal block 10 made of stainless steel and the insulating substrate 21 of the heating plate 2 made of ceramics can be firmly joined, and the molten modeling material does not ooze out from the joint. As a result, a highly reliable ejection head can be obtained. The brazing material is not limited to this example. For example, JIS standard BAg-8 (Ag 72%, Cu 28%: brazing temperature 780 to 900 ° C.), BAg-7, BAg-8 and other materials are further added with additives. And what mixed inorganic materials, such as what changed brazing temperature, can be used.

  By applying a nano metal, for example, an organic silver compound, which is an organic compound of nano silver, in a paste or ink form and sintering at about 250 ° C., it becomes 100% silver and can be bonded by interparticle bonding. it can. In this case, the bonding force is slightly inferior, but the bonding can be maintained as long as the peeling force does not work. If necessary, it can be completely joined by raising the temperature to the melting temperature. By adhering Cu or the like that easily forms an alloy with Ag, the melting temperature can be lowered. The silver thus bonded does not melt unless the melting point is 962 ° C., and the temperature can be lowered to about 780 ° C. in the case of Ag—Cu eutectic. However, if there is no peeling force, it can endure such a very high temperature. That is, it is durable to high temperatures while being sintered and cured at low temperatures.

  In the example shown in FIGS. 1A to 1D, the flow path structure 1 has a length A of about 10 to 25 mm, and widths B1 and B2 of about 8 to 15 mm. A flow path forming portion is formed, and is formed of a metal block 10 in which a through hole is formed in the center of the flow path 11 having a diameter G of about φ1 to 3.5 mm. The length C of the flow path forming portion of the metal block 10 is 5 to 15 mm, and one end thereof is tapered to a length D of about 1 to 3 mm, and the flow path 11 is also narrow at the center. Thus, a discharge port 12 of about 0.2 to 1 mm is formed. The discharge port 12 is preferably formed after the heating plate 2 is joined. This is because the brazing material when brazing the heating plate 2 can be prevented from flowing into the discharge port 12 and being blocked. Moreover, the rectangular attachment part 15 whose one side B larger than the formation part of the flow path 11 is about 12 mm is formed in the other end part side. The outer shape of the attachment portion 15 may be a circle of about φ9 to 15 mm.

  The material of the metal block 10 preferably has a thermal expansion coefficient close to that of the insulating substrate (ceramics) of the heating plate 2. From this point, iron, iron alloy, stainless steel (SUS), Fe—Ni, Fe—Ni—Co (Kovar) : Registered trademark). Moreover, it is preferable that thermal conductivity is good, and from that viewpoint, copper alloys, aluminum alloys, those subjected to surface treatment such as plating, alumite, and the like are preferable. In addition, it is preferable to perform an adherend treatment and a surface hardening treatment.

  The modeling material supply member 6 (the barrel 61 and the fluororesin tube 62 (see FIG. 1D)) is fitted into the mounting portion 15 on the other end side (the side opposite to the discharge port 12) of the flow channel structure 1. It is. As an example, the barrel 61 has a length of about 25 to 35 mm and is fitted into the mounting portion 15 with a screw having a diameter of φ6 mm, and a through hole having an inner diameter of φ3.2 mm is formed at the center. A cylindrical ring-shaped tube 62 having an inner diameter of 2 mm is inserted into the through hole. This tube 62 is provided so that the modeling material 91 called a wire-like filament can be smoothly fed without adhering. Recently, instead of filaments, resins and various filler mixtures are used in powder form. This is from the viewpoint of automatic supply and downsizing of the apparatus.

  The heating plate 2 (first heating plate 2) includes, for example, a plan view in which the cover member 26 (see FIG. 4B) is removed from FIGS. 4A to 4C, a side view in which the cover member 26 is provided, and a bottom view ( The back surface is formed as shown. For example, as shown in FIGS. 4A to 4C, the heating plate 2 has a heating resistor 22 that heats the insulating substrate 21 on one surface of the insulating substrate 21. The heating resistor 22 is formed with electrodes 23 for flowing a current in the longitudinal direction connected to both ends of the heating resistor 22, and the end thereof is formed at the end of the insulating substrate 21. The electrode terminal 23a extends to the back surface of the insulating substrate 21 through the hole. Leading out to the back surface of the insulating substrate 21 facilitates connection of the leads 27, but it is not always necessary to do so. In the example shown in FIG. 4A, the second heating resistor 22a is further formed to have a length that is about half of the direction of the discharge port 12 side. This is because the temperature on the discharge port 12 side is increased to facilitate discharge, and the temperature on the supply port 13 side of the modeling material 91 is not increased so much. However, the arrangement and shape of the heating resistor 22 are not limited to this example, and can be formed in various shapes as described in, for example, Patent Document 1 or 2 described above. In short, it is preferable that the temperature on the discharge port 12 side is higher than that on the modeling material supply port 13 side. Further, a temperature measuring resistor 24 is formed in the vicinity of the heating resistor 22.

  A temperature measuring terminal 25a is formed in the temperature measuring resistor 24 via a measuring wire 25 for measuring the electrical resistance at a predetermined location, for example, at both end portions and an intermediate portion thereof. The temperature measuring terminal 25a is also led out to the back surface of the insulating substrate 21 through the through hole of the insulating substrate 21, like the electrode terminal 23a. Materials such as the heating resistor 22 and the temperature measuring resistor 24, a forming method, and the like are the same as those described in Patent Document 1 or 2, and are formed by the same method. A cover member 26 (see FIG. 4B) is formed on these by a glass material or a ceramic substrate, and the surface of the heating resistor 22 and the like is protected. Further, as shown in FIG. 4C, the electrode terminal 23a of the heating resistor 22 and the temperature measuring terminal 25a of the temperature measuring resistor 24 are connected to lead on the back side of the ceramic substrate 21 via the wirings 23b and 25b. 27 (see also FIG. 1A) is derived. The wires 23b and 25b are not provided, and the lead 27 may be directly connected to the electrode terminal 23a or the temperature measuring terminal 25a.

  The lead 27 is connected to the wirings 23b and 25b and the terminals 23a and 25a by an inorganic conductive adhesive having heat resistance with respect to a temperature of 500 ° C. or higher. For use as a modeling material discharge head, a control means including a drive circuit for the heating resistor 22 and a measurement circuit for measuring the temperature of the insulating substrate 21 is provided. The control unit controls the drive circuit by controlling the current of the heating resistor 22 so that the temperature of the insulating substrate 21 becomes a predetermined temperature. This control is also performed by the method described in Patent Document 1 or 2 described above. Can be done. Although not shown, the connecting portion between the lead 27 and the electrode terminal 23a or the temperature measuring terminal 25a is protected by a protective member so that the lead 27 does not break at the connecting portion. In FIG. 4A, the lead 27 is omitted because the connecting portion is on the back side of the insulating substrate 21.

  In the present embodiment, as shown in FIG. 4C, a metallized 21 a is formed on the back surface of the insulating substrate 21 of the heating plate 2. The metallized 21 a is formed in a joining region for joining with the flow path structure 1. That is, the side wall of the metal block 10 of the flow channel structure 1 is formed around the flow channel 11 exposed by cutting, and is not formed in the exposed portion of the flow channel 11. Even if metallization is formed in this portion, there is no problem, but the material is wasted. Since the discharge port 12 is thinner than the flow channel 11 at the end on the discharge port 12 side, even if the side surface of the metal block 10 is scraped and the flow channel 11 is exposed, the vicinity of the discharge port 12 is not exposed, The metal block 10 remains. Therefore, the metallized 21a is formed on the insulating substrate 21 so that the part can be brazed, and the part of the metallized 21a is U-shaped. In addition, since the heating plate 2 is provided on the opposite side to the discharge port 12 side by being attached to the mounting portion 15, a sealing material made of an inorganic adhesive such as ceramic, glass or metal is applied and solidified. By doing so, the attachment part 15 and the heating plate 2 are joined so that the modeling material does not flow out.

  This metallized 21a is formed by applying a material mainly composed of Ag, Pd, Pt or the like to a metallized formation place on the back surface of the insulating substrate 21 and baking it at about 600 to 800 ° C., for example. . Similarly, the heating resistor 21, the temperature measuring resistor 24, the electrode 23, and the like are formed by applying and baking a paste in which Ag, Pd, or the like is mixed. Can be formed. Forming the metallized first is preferable from the viewpoint of baking at a sufficiently high temperature and preventing the resistance value of the heating resistor 22 from fluctuating.

  Silver solder (for example, the above-mentioned JIS standard BAg described above) that is formed into a sheet shape or a wire shape between the heating plate 2 having the metallized insulating substrate 21 and the flow path structure 1 or that can be applied. Brazing is performed by heating the surface to about 700 [deg.] C. by laying on and sandwiching a silver braze containing -7 as a main component and activating the surface with a flux. Even if such a brazing material is not used, the temperature of the brazing material rises by applying silver plating and copper plating to the brazed portion of the flow path structure 1 or the metallized portion of the insulating substrate 21. It is possible to braze by melting both at about 700 ° C. by alloying both metals.

  As described above, the heating plate 2 has the heating resistor 12 and the like formed on one surface of the insulating substrate 21 and the cover member 26 formed on the surface thereof. The exposed surface of the heating plate 2 is the other surface (back surface). ) Is flatter, and the insulating substrate 21 is thicker, so that the temperature is likely to be uniform (the temperature of the heating resistor 22 is the highest, but is not easily affected). In view of this, it is preferable that the other surface side of the insulating substrate 21 be the flow channel structure 1 side. With this structure, the metallization 21 a can be formed in advance on the other surface side of the insulating substrate 21 as described above.

  1C is a plan view (bottom view) of FIG. 1A viewed from the discharge port 12 side, and FIG. 1D is a plan view (top view) of FIG. 1A viewed from the material supply unit 6 side. The same parts as those in FIG. 1A are denoted by the same reference numerals, and the description thereof is omitted.

  In the example shown in FIGS. 1A to 1D, the outer shape of the metal block 10 is a quadrangle, but the outer shape may be circular. If it is circular, an automatic lathe can form the outer shape and the through-hole as the flow path 11 at the same time. An example is shown in FIGS.

  FIG. 2A shows a state in which a part of the side wall of the metal block 10 whose outer shape is cylindrical is cut away and the flow path 11 is exposed. In FIG. 2A, the heating plate 2 is not shown, and the wall surface of the metal block 10 that has been shaved and exposed is indicated by hatching. That is, the heating plate 2 (not shown) is joined by brazing or the like at the hatched portion. The discharge port 12, the modeling material supply port 13, and the attachment part 15 are the same as the above-mentioned example. FIG. 2B is a side view of FIG. 2A, and the flow path 11 is exposed on both the left and right sides of FIG. 2B, and at least one is blocked by a heating plate 2 (not shown) and the heating plate 2 is not provided on the other. The second heating plate may be closed, or a thin metal wall may be left. FIG. 2C is a plan view (bottom view of the state where the heating plate 2 is provided on both sides of FIG. 2A) when the heating plate 2 is provided on both sides of the exposed channel 11 and viewed from the discharge port 12 side. Show. FIG. 2D is a side view of the flow channel structure 1 in a state where the side walls for exposing the flow channel 11 are not removed. The heating plate 2 is also the same as the example shown in FIG. 1B, and the same parts are denoted by the same reference numerals and the description thereof is omitted.

  In each of the above examples, the flow channel structure 1 is formed of the metal block 10 made of a prism or a cylinder. In such a flow path structure made of the metal block 10, there is no bonding of the flow path structure 1 itself, so only the junction between the flow path structure 1 and the heating plate 2 is used. It is easy to get resistance. However, if bonded by an inorganic bonding material that can withstand a temperature of 500 ° C. or higher, such as the brazing material described above, a flow path structure including a stacked body in which a plurality of plate-like bodies 10a (see FIG. 3B) are bonded together. 1, the heating plate 2 is provided so as to close the exposed portion of the flow path 11, so that the laminated body itself and the flow path structure 1 made of the laminated body and the heating plate 2 can be bonded with high reliability. Moreover, it can be applied to a modeling material having a melting point of about 500 ° C. by direct heating.

  An example is shown in FIGS. That is, a flow path plate 10a as shown in FIG. 3B is used. The flow path plate 10a is formed with a through hole serving as a flow path 11 having a width L of about 2 mm in a plate-like body having a thickness of about 1 mm, a width W of about 4 mm, and a length H of about 20 mm, for example. The front end portion is formed with a groove as a discharge port 12 having a width M of about 0.3 mm and a depth of about 0.15 mm so as to communicate with the flow path 11. The flow path plate 10a is bent at a position P where the length J from the front end of the discharge port 12 is about 13 mm, and the end opposite to the flow path 11 is a mounting portion 15a. A hole 16 for attachment is formed in the attachment portion 15a with a size of about φ2.2 mm, and is attached to the attachment plate 5 shown in FIG. 3A. In the example shown in FIG. 3A, the heat insulating spacer 8 is inserted between the mounting portion 15 a and the mounting plate 5. The mounting portion 15a has a length K of about 6.8 mm, of which about 1.8 mm is spent on the bent portion. Therefore, although not shown, a groove having a width of about 1.8 mm and a depth of about 0.6 mm is formed so as to be easily bent. These holes and grooves are formed by etching, but may be formed simultaneously with the formation of the outer shape by a punching die. In this case, the through hole may be formed by a mold, and the groove may be formed by etching.

  For example, after the two attachment portions 15 are bent in opposite directions, such a flow path plate 10a is overlapped and joined so that the flow paths 11 and the like coincide with each other, whereby the flow path structure 1 is formed. ing. The pasting of the flow path plate 10a is joined by brazing or the like with a high-temperature silver brazing as in the pasting of the flow path structure 1 and the heating plate 2. In this case, since metal plates made of, for example, stainless steel are joined together, there is no need for metallization, and a sheet-like brazing material or a ribbon-like brazing material is directly scattered and applied with a flux and stacked. It can be brazed by melting in a heating furnace. Note that brazing can be performed without flux by brazing in a vacuum furnace or a reducing atmosphere furnace. In the flow channel structure 1 formed in this way, since the vertically long through holes formed in the flow channel plate 10a become the flow channels 11, even if the two flow channel plates 10a are joined, Since both ends are open, two opposing side surfaces of the flow path 11 are open. As in the example shown in FIG. 1A and the like, the heating plate 2 is attached to both surfaces, thereby forming the ejection head shown in FIG. 3A.

  In FIG. 3A, the structure of the heating plate 2 is the same as the example shown in FIG. 1A and is the structure shown in FIGS. 4A to 4C. The heating plate 2 may be joined after the flow channel structure 1 is formed, but the flow channel structure 1 and the heating plate 2 may be joined. May be. In the example shown in FIG. 3A, a heat insulating spacer 8 is interposed between the flow path structure 1 and the mounting plate 5. The heat insulating spacer 8 prevents heat from the flow path structure 1 from being transmitted to the mounting plate 5 as much as possible. This is because if the heat is conducted toward the mounting plate 5, the modeling material 91 is melted on the modeling material supply unit 6 side, and the feeding becomes difficult. As the heat insulating spacer 8, for example, a plate material made of porous glass, porous ceramics, etc. and having a thickness of about 1 to 2 mm can be used.

  In each of the above examples, the heating plate 2 has a structure as shown in FIGS. 4A to 4C. However, as described above, the shape of the heating resistor 12 and the structure for taking out the lead 27 are changed to various structures. Can be done. Examples of such changes are shown in FIGS. That is, in the example shown in FIG. 5A, two heating plates 2 are arranged in the same direction with an interval corresponding to the thickness of the flow path structure 1, and in that state, the two heating plates 2 share a common terminal. The two electrode terminals 23c and the temperature measuring terminals 25c that can be connected to each other are connected by leads 27c and 27d, respectively. In this state, the two heating plates 2 are bent so as to sandwich the flow path structure 1, and the flow path structure 1 and the two heating plates 2 are simultaneously joined by brazing or the like.

  The heating plate 2 has the same structure in which the heating resistor 22, the temperature measuring resistor 24, the electrode terminal 23, the temperature measuring terminal 25, and the like are formed on the insulating substrate 21, and the description thereof is omitted. The In this example, the heating resistor 22 is formed in a U shape so that the temperature on the discharge port side can be increased, and the temperature measuring resistor 24 is formed in an L shape. In FIG. 5A, the cover member 26 is omitted. Further, the formation and location of the metallization on the back surface of the insulating substrate 21 are the same as the example shown in FIG. 4C described above, and the terminal wiring is formed in the same manner, but the positions of the wirings 23b and 25b and the through holes are Is different. Parts having the same function are denoted by the same reference numerals, and detailed description thereof is omitted. In FIG. 5A, the range L indicates the width of the flow path 11 (see FIG. 3B), and the range W indicates the width of the flow path plate 10a (see FIG. 3B). In this example, the position of the U-shaped center line of the heating resistor 22 is not symmetric with respect to the position of the flow path 11, but the left and right of the heating plate 2 provided on both surfaces of the flow path structure 1 are Therefore, the heating by 2 on both heating plates is symmetric with respect to the flow path 11. The metallization formed on the back surface of the heating plate 2 may be subjected to silver plating and copper plating as a brazing material as necessary.

  A side view of the ejection head formed in this way is shown in FIG. 5B. FIG. 5B mainly schematically shows the connection structure of the lead 27. That is, in this example, as shown in FIG. 6B described later, the lead 27 is a side surface of the flow path structure 1 where the heating plate 2 is not provided, and the lead space 28 sandwiched between the two heating plates 2. The lead 27 extends and is led out to extend toward the modeling material supply unit 6 side. A side view perpendicular to FIG. 5B is shown in FIG. 5C. As shown in FIG. 4C, the heating plate 2 and the lead 27 may be connected via the wiring 27b on the insulating substrate 21, or directly connected to the lead 27 by the terminals 23a and 25a. The lead 27 may be led to the modeling material supply unit 6 side.

  FIG. 5D is a side view similar to FIG. 5B in which the heating plate 2 shown in FIG. 5A is bonded to both surfaces of the flow channel structure 1 shown in FIG. 2A. In this structure, the lead 27 is taken out in the same manner as the example shown in FIG. 5B described above, but is formed on the side surface of the mounting portion 15 as shown in FIG. 5E from the top view seen from the modeling material supply portion 6 side. Since the lead 27 can be embedded in the groove 15b, the structure is very simple. The lead 27 may not be embedded in the groove 15b but may pass through the through hole 15c formed in the attachment portion 15 as shown in FIG. 6C described later.

  Since these modeling material discharge heads are dangerous at high temperatures if the heating plate 2 and the wiring of the leads 27 are exposed, they are preferably covered with the outer case 7. An example is shown in FIG. 6A. That is, the example shown in FIG. 6A has a structure in which the exterior case 7 is covered with the ejection head shown in FIG. 5D. A plan view of the ejection head in this state seen through the exterior case 7 from the ejection port side is shown in FIG. 6B, and a plan view seen from the modeling material supply unit 6 side is shown in FIG. 6C. In these drawings, for simplicity, the outer case 7 does not represent the thickness and is shown only by lines. The outer case 7 is made of aluminum, and the outer surface is black anodized to perform insulation, prevent corrosion, and improve the appearance. The inner surface may also be subjected to an insulation treatment, or may be further filled with glass fiber, an inorganic insulating hardener, or the like for electrical insulation.

  In FIG. 6B, reference numeral 28 denotes a space through which the lead 27 passes as described above. Further, in FIG. 6C, 15c is a hole through which the lead 27 passes as described above, but may be a groove 15b as shown in FIG. 5E. Further, the heating plate 2 is drawn so that the cover member 26 is smaller than the layer such as the heating resistor 22, but may be the same size as the insulating substrate 21 as in the above-described example. For example, in FIG. 6B, the length (width) R of the insulating substrate 21 is about 7.8 mm, the distance S between both outer surfaces of the cover members 26 of the two heating plates 2 is about 7 mm, and the inner diameter of the outer case 7 is The outer case 7 having an inner diameter of 10 mm has a sufficient margin. Further, as will be described later, the shape of the outer case 7 may be a quadrangle. In these drawings, the same parts as those in the above-described example are denoted by the same reference numerals, and the description thereof is omitted.

  6D shows the modeling material supply port 13 side in a state in which the mounting plate 5 and the modeling material supply unit 6 of the ejection head (the ejection head in which the flow channel structure 1 is formed by the plate-like body 10a) shown in FIG. 5B are removed. The top view seen from is shown. Also in this example, the structure of the heating plate 2 and the outer case 7 are the same as the example shown in FIG. 6B, and the plan view with the modeling material supply unit 6 attached is the same as the structure shown in FIG. 6C. It is omitted.

  FIG. 7A is a side view showing an example of the case 7 having such a cylindrical shape, and FIG. 7B is a plan view seen from the discharge port side. As described above, the exterior case 7 is formed of an aluminum-based material (for example, Al—Mg-based A5052) having a plate thickness of about 1.5 mm, and the outer surface is black anodized. In this example, the outer diameter of the root portion 71 that covers the attachment portion 15 (see FIG. 2A) of the flow channel structure 1 is about φ12 mm, and the height is about 7.5 mm. The outer diameter of the cylindrical portion 72 covering the portion 2 is, for example, about φ10 to 12 mm, and the length is about 12.5 mm. In order to discharge the melted modeling material, a rectangular opening 73 of 2.2 mm × 4.2 mm is formed in a portion corresponding to the discharge port 12.

  FIG. 7C shows an example in which the outer case 7 is a rectangular tube. The outer shape of the flow channel structure 1 as shown in FIG. 1A is suitable for a rectangular shape, but a circular flow channel structure as shown in FIG. 2A is used. It can also be applied to the body 1. In this example, the length of one side of the root portion 74 is about 12 mm, and the height is about 5 mm. Moreover, one side of the rectangular tube part 75 which covers the part of the heating plate 2 is about 10 mm, and the length is about 12.5 mm. The opening 73 is the same as the above example. The surface treatment and the like are the same as in the above example.

  In the above description, the single-head type has only one flow path 11, but the discharge head corresponding to the molding material that melts at 500 ° C. or higher similarly in the multi-head type in which a plurality of flow paths are arranged. Can be obtained. For example, a flow path plate 10b as shown in FIG. 8 can be formed by integrating the flow path plates 10a as shown in FIG. The example shown in FIG. 8 shows an example in which the modeling material supply port is common to the plurality of flow paths 11 and only the flow paths 11 are separated into a large number. Therefore, in order to supply the modeling material from the modeling material supply port 13 to each flow path 11, a common flow path 11 a common to the whole is formed, and the modeling material melted in the common flow path 11 a is supplied to each flow path 11. It has come to be.

  In this case, since the modeling material cannot be pushed from the modeling material supply port 13 side and discharged from the specific discharge port, a driving mechanism that drives the molten modeling material to be discharged to each flow path 11 is necessary. Such a drive mechanism can be controlled by using the second heating plate 3 such as the bimetal method described in Patent Document 1 or 2 described above. Although the details are omitted, one of the two heating plates 2 shown in FIG. 3A is changed to the second heating plate 3 so that the heating resistor 32 of the second heating plate 3 is indicated by an imaginary line. The heat generating resistor 32 is formed so as to be able to extrude the melted modeling material 92 in the flow path 11 by thermal expansion.

  In the example shown in FIG. 8, the modeling material obtained by melting the same modeling material from the specific discharge ports 12 of the plurality of discharge ports 12 can be discharged. However, for example, the structure in which the ejection heads shown in FIG. 3A are arranged may be formed integrally, the modeling material supply port 13 may be formed separately, and a structure in which separate supply materials 91 are supplied may be used.

  In the example shown in FIG. 8, the above-described heating plate (first heating plate) 2 is attached to one surface of the flow path structure 1 so as to close the flow path. On the other surface, a second heating plate 3 for driving each flow path is formed. In FIG. 8, both of these heating plates are shown in an imaginary line. That is, the heating plate 2 does not show individual heating resistors, and the entire positional relationship of the insulating substrate is indicated by a two-dot chain line. Further, only the portion of the heating resistor 32 of the second heating plate 3 is shown in the same manner, but the second heating plate 3 is also formed on the insulating substrate like the first heating plate 2. And its electrodes, temperature measuring resistors, and the like. However, only the specific flow path 11 is heated, and the cover member side is joined to the flow path structure 1 in order to discharge the modeling material in the flow path 11 by instantaneously raising the temperature by short-time heating. . Therefore, when it is difficult to completely block the flow path, the flow path 11 may be closed with a thin metal plate or the like, and the second heating plate 3 may be provided thereon. A plurality of ejection heads shown in FIG. 3A may be arranged to form a multi-head. However, as shown in FIG. 8, each flow path plate is formed with a plurality of flow paths. The interval between the paths can be narrowed, and a more precise discharge head can be obtained. In addition, in the example shown by FIG. 8, the direction of the attachment part of the flow-path board 10b is not illustrated.

  Such a multi-nozzle ejection head is not limited to the case where the flow path plate 10b is used, but may be a multi-nozzle head using a metal block as shown in FIG. 1A. That is, by arranging a plurality of holes for the flow passage 11 in a direction perpendicular to the thickness direction on a metal plate (metal block) having a thickness shown in B2 (substantially the same as B1) in FIG. A flow channel structure 1 can be formed. Also in this case, the heating plate 2 for heating the plurality of flow paths 11 together is disposed, and the second heating plate for driving the flow paths is disposed on the opposite side. In short, when the flow path structure 1 is formed of a laminate of plate-like bodies, a through-hole is formed in the thickness direction of the plate-like body to form a flow path, but in the case of a metal block, A multi-nozzle ejection head using a metal block (thick metal plate) is formed by forming a plurality of holes in the direction perpendicular to the thickness direction of the thick metal plate to form a flow path.

  In each of the above-described examples, the heating plate 2 is joined to the flow channel structure 1 with a brazing material made of an inorganic material so as to close the flow channel 11, or is joined by brazing or the like through a thin metal wall. It was an example. However, as described above, when the flow path structure 1 is formed of the metal block, the flow path structure 1 is formed without being joined. Therefore, it is not necessary to join with a brazing material made of an inorganic material. On the other hand, if the heating plate 2 is in close contact with the flow path structure 1, the heat of the heating plate can be easily transferred to the flow path structure 1. Therefore, for example, if the partition wall (metal plate or metal plate closing the channel 11) with the channel of the channel structure 1 to which the heating plate is in close contact becomes as thin as about 0.1 to 0.5 mm, brazing is performed. Even if the heating plate 2 is not in contact with the partition wall, the heat of the heating plate 2 can be easily transferred to the modeling material in the flow path 11 because the heating plate 2 is in close contact with the partition wall.

  That is, in another form of the discharge head of the present invention, a through-hole having a thin hole serving as a discharge port at the tip is formed in the metal block, or the through-hole is formed into a plate-like body, and the thickness of the plate-like body. A flow path structure formed in a direction perpendicular to the vertical direction and having the through hole as a flow path for the modeling material, and at least a part of the outer wall surface of the flow path structure of the metal block, or one surface of the plate-shaped body described above Even if it has a structure in which a heating plate is provided in close contact with the other end portion of the flow path structure body and the supply portion of the modeling material is formed so as to communicate with the other end portion of the flow path. If the side wall of the flow path structure of the flow path structure on which the plate is provided is formed thinner than the thickness of the portion where the heating plate of the flow path structure is not provided, even a modeling material having a melting point of about 500 ° C. The molding material can be melted and discharged in a short time. In other words, by forming the side wall of the metal block much thinner than the part where the heating plate is not provided (for example, to a thickness of about 0.1 to 0.5 mm), and by closely contacting the heating plate to the metal wall, Even a modeling material having a melting point close to 500 ° C. can be easily melted and discharged. The close contact includes the case where it is tightened with a screw or the like.

1 Channel Structure 2 Heating Plate (First Heating Plate)
DESCRIPTION OF SYMBOLS 3 2nd heating plate 5 Mounting plate 6 Modeling material supply part 8 Heat insulation spacer 10 Metal block 10a Plate-shaped body 10b Plate-shaped body 11 Flow path 12 Discharge port 13 Modeling material supply port 15 Mounting part 16 Mounting hole 21 Insulating substrate 22 Heat resistance Body 22a Second heating resistor 23 Electrode 23a Electrode terminal 24 Temperature measuring resistor 25 Temperature measuring wire 25a Temperature measuring terminal 26 Cover member 27 Lead

Claims (5)

In the metal block, a through-hole having a thin hole serving as a discharge port at the tip portion is formed, or a plate-like body in which the metal block is widened, a plurality of the above-mentioned in the thickness direction of the plate-like body. A flow path structure in which a through hole is formed and the through hole is a flow path of a modeling material;
A heating plate provided in close contact with at least a part of the outer wall surface of the flow channel structure of the metal block, or one surface of the plate-like body;
The side wall of the flow path structure in which the heating plate is provided is formed to be thinner than the thickness of the portion of the flow path structure where the heating plate is not provided. Modeling material discharge head. In the metal block, a through-hole having a thin hole serving as a discharge port at the tip portion is formed, or a plate-like body in which the metal block is widened, a plurality of the above-mentioned in the thickness direction of the plate-like body. A flow path structure in which a through hole is formed and the through hole is a flow path of a modeling material;
A heating plate provided in close contact with at least a part of the outer wall surface of the flow channel structure of the metal block, or one surface of the plate-like body;
A modeling material discharge head for three-dimensional modeling in which a part of the side wall of the flow path is exposed and the heating plate is joined so as to close the exposed portion of the flow path. The modeling material discharge head according to claim 1, wherein a cross-sectional shape of an outer shape of the metal block is a circle or a rectangle. The flow path structure and the heating plate are joined by forming a metallized layer on the back surface of the insulating substrate of the heating plate and melting a metal layer containing silver and copper provided on the metallized layer. The modeling material discharge head of any one of Claims 1-3 joined to the said flow-path structure by the alloy formed. A method for modeling a three-dimensional model, wherein a through-hole having a discharge port at one end and a modeling material supply port for supplying a modeling material supply material at the other end is used as a metal block, or a metal block is wide. The flow path structure is formed on the plate-shaped body formed in the direction perpendicular to the thickness direction of the plate-shaped body,
The thickness of one side wall of the flow channel structure is formed thinner than the portion where the heating plate is not provided, and the heating plate on which the heating resistor is formed is closely attached to the ceramic substrate,
A modeling method for a three-dimensional model including forming a three-dimensional model by discharging a modeling material melted in the flow path from the discharge port while supplying a modeling material from the modeling material supply port.

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