JP2018063984A - Electronic device cooling unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device cooling unit which enables heating components in the unit to be cooled regardless of a drawing state of a drawer in a storage unit which conducts active replacement of hard disc drives.SOLUTION: An electronic device cooling unit 4 includes: a shelf 10 including a heating component 9A to be air-cooled at the back surface side; and a drawer 20 in which multiple hard disc drives (HDDs) 3 are mounted at the front surface side and a heating component 9B to be air-cooled is provided at the back surface side and which is drawn from the shelf 10 during active replacement of the HDDs 3. The shelf 10 is provided with: a first duct 11 which exhausts cooling air toward the heating component 9A through a first exhaust port 11A; and a second duct 22 which exhausts cooling air toward the heating component 9B through a second exhaust port 28. The first exhaust port 11A is disposed at the shaft 10 and the second exhaust port 28 is disposed at the drawer 20 to enable the heating component 9B to be cooled when the drawer 20 is drawn.SELECTED DRAWING: Figure 7

Description

  The present application relates to an electronic device cooling unit.

  In recent years, due to the spread of cloud technology and the miniaturization of electronic devices, mounting components (CPU, DIMM, HDD, SSD, PCI card, etc.) mounted on a server are densely mounted in one unit and only one unit is installed. Therefore, there is a demand for higher functionality such as having a server function. In particular, in a unit having a function of a storage server (hereinafter referred to as a storage unit), the following is required. (1) A large number of HDDs (hard disk drives) can be mounted on a storage unit in order to secure a large-capacity storage area. (2) The ability to add or replace HDDs to the storage unit in units of one while the system is operating (hereinafter referred to as hot replacement).

  From the standpoint of hot replacement, as shown in FIG. 1, there is a structure in which the HDD 3 with the active frame is attached and detached from the front side of the storage unit 2 that is mounted so as to be able to be pulled out to the front of the housing of the server device 1. It is common. However, since the area of the front surface of the storage unit 2 is very small, the number of units that can be mounted on one storage unit 2 is extremely limited.

  Therefore, in recent years, in order to increase the number of HDDs 3 that can be mounted in one storage unit 2, a drawer mechanism type storage unit 4 as shown in FIGS. 2A to 2F has been put into practical use. In the drawer mechanism type storage unit 4, as will be described in detail later, by providing a drawer mechanism in the storage unit 4, the HDD 3 can be mounted in the depth direction of the storage unit 4, and pulled out for active replacement of the HDD 3. .

  2A shows the overall structure of the drawer mechanism type storage unit 4 (hereinafter simply referred to as the storage unit 4) of the comparative technique, and FIG. 2B shows the drawer from the housing 10 of the storage unit 4. The state which pulled out the drawer 20 which is a mechanism is shown. The housing 10 of the storage unit 4 is hereinafter referred to as a shelf 10. In the storage unit 4, the HDDs 3 are accommodated in a plurality of rows and a plurality of stages on both sides in the depth direction of the drawer 20, so that the number of HDDs 3 is large. 2A to 2F, nine HDDs 3 are accommodated in three rows and three stages on one side of the drawer 20, and 18 HDDs 3 are connected to the backplane 8 as a whole. It is housed in the state.

  As shown in FIGS. 2C to 2E, the interior of the drawer 20 is filled with a plurality of HDDs 3 and a backplane 8 for connecting the plurality of HDDs 3. A main board 5 on which electronic components are mounted is provided on the rear side of the shelf 10 that accommodates the drawer 20, and a connector for connecting the storage unit 4 to the server device is provided at the rear end of the main board 5. There are six. Since the drawer 20 is pulled out with respect to the shelf 10 during the active replacement of the HDD 3, the backplane 8 and the main board 5 are connected by a cable 7 having a surplus length. The cable 7 is connected to the main board 5 by a connector 7A, and is connected to the backplane 8 by a connector 7B.

  Cooling air that cools the HDD 3 mounted on the storage unit 4 and the electronic components mounted on the main board 5 is taken from the front surface of the drawer 20 as shown in FIG. Go down to the rear while cooling. For this reason, the electronic components mounted on the main board 5 are cooled by the exhaust heat air warmed by the HDD 3. The exhaust hot air is high temperature, and high heat generation electronic components such as CPU and LSI mounted on the main board 5, capacitors, batteries and other components that are sensitive to temperature are insufficient due to insufficient cooling capacity. Cooling is not possible. Therefore, in the comparative technique, only the low heat-generating component and the low-functional component can be mounted on the rear portion of the storage unit 4, and the high-functionality of the storage unit 4 cannot be realized.

  In the storage unit 4 having the structure described with reference to FIG. 2, the cooling capacity of the components mounted on the main board 5 depends on how much cool air (fresh air) can be sent to the main board 5. Therefore, it is conceivable to widen the gap between the HDDs 3 mounted on the drawer 20 to increase the effective opening area of the front surface of the storage unit 4 and increase the amount of cooling air that can be taken from the front surface. However, with this measure, the air volume of the cooling air increases, but the cooling air does not change after cooling the HDD 3, and the temperature of the cooling air reaching the main board 5 is only slightly lowered. The effect of 5 is low. In addition, when the HDD 3 is cooled, the wind that runs on the surface of the HDD 3 takes heat from the HDD 3, but when the cooling air escapes through the space where the gaps between the HDDs 3 are widened, the cooling air is applied to the surface of the HDD 3. The supply efficiency is deteriorated, and the cooling efficiency of the HDD 3 is rather deteriorated.

  As a method for sending cool air to the main board 5, as shown in FIG. 3A, a duct 21 independent from the cooling air flow path between the HDDs 3 is provided at the bottom of the drawer 20, and the cooling air is supplied to the main board 5. A direct feed structure is conceivable. In this structure, since the cooling air discharged from the outlet 21A of the duct 21 directly hits the heat generating component 9 on the main substrate 5, a high cooling effect can be expected. Note that a heat sink 9H for heat dissipation is attached to the heat generating component 9.

  However, in the structure provided with the duct 21, as shown in FIG. 3B, when the drawer 20 is pulled out from the shelf 10, a wide space S is created between the outlet 21 </ b> A of the duct 21 and the main board 5. The cooling air that has passed through the duct 21 diffuses into the wide space S. The cooling air diffused into the space S from the outlet 21A is mixed with the exhaust heat air warmed by the HDD 3, and the temperature rises. For this reason, in consideration of the drawer operation of the drawer 20 during active replacement, only low heat-generating components and low-functional components can be mounted on the main board 5.

  Even if a similar independent duct is provided at the bottom of the shelf 10 to send cooling air to the main board 5, a cooling effect can be expected near the duct outlet, but it is mounted on the drawer 20 side (for example, immediately after the HDD 3). Cooled air does not hit the parts that have been removed. For this reason, only low heat-generating parts and low-functional parts can be mounted on the rear side of the HDD 3 on the drawer 20 side.

  In a storage unit having a drawer mechanism, in order to provide more functions and improve performance, there are inevitably more components in the storage unit that are sensitive to temperature, such as highly heat-generating components. Considering that the space in the storage unit is limited, for example, as shown in FIG. 3C, the drawer 20 side also has a high function / high heat generation component 9B, and the shelf 10 has a high function / high performance on the main board 5 side. It is desirable that the heat generating component 9A can be mounted. That is, it is desirable that both the high function / high heat generating component 9B that moves together with the drawer 20 in accordance with the drawer operation and the high function / high heat generating component 9A that is not attached to the drawer 20 and remains on the shelf 10 side can be cooled. This was not possible with the comparative technique.

Japanese Patent Laid-Open No. 11-086523

JP 2004-013192 A

  In one aspect, in a unit having a pull-out mechanism for hot replacement such as a storage unit, the mounting position of a component that is susceptible to temperature is appropriately applied to the cooling air regardless of the shelf side or the drawer side. It is an object of the present invention to provide an electronic device cooling unit that can be used.

  According to one embodiment, a shelf having a first part to be air-cooled on the back side, a plurality of active devices are mounted on the front side, and a second part to be air-cooled is provided on the back side, and during active replacement of the active device A drawer drawn from the shelf, a first duct that is provided on the shelf and discharges air toward the first component through the first exhaust port, and a second duct that discharges air toward the second component through the second exhaust port There is provided an electronic device cooling unit in which a first exhaust port is provided in the shelf and a second exhaust port is provided in the drawer.

  According to the electronic device cooling unit having a drawer mechanism for active exchange as disclosed, cooling air can be appropriately applied to a unit such as a storage unit regardless of the mounting position. As a result, it is possible to cool highly heat-generating electronic components mounted on both the shelf side and the drawer side and components that are susceptible to temperature. Accordingly, there is an effect that it is possible to mount a highly heat-generating electronic component or a component that is easily affected by temperature regardless of the drawer side or the shelf side.

It is a figure which shows the general mounting method to the server of the storage unit which mounts HDD in a comparison technique. FIG. 7 shows a comparison technique when the storage unit on which the HDD is mounted is a drawer mechanism type storage unit, (a) is a perspective view showing the entire storage unit, and (b) is a drawer from the storage unit shown in (a). FIG. 4C is a perspective view of the storage unit shown in FIG. 4A viewed from above, and FIG. 4D is a transparent front view of the storage unit shown in FIG. (E) is a perspective side view of the storage unit shown in (c) as seen from the right side, and (f) is shown in (e). (A) is a side view showing the structure of the storage unit of the comparative technique in which an independent cooling duct is provided at the bottom of the drawer, (b) is a side view explaining the problem of the storage unit shown in (a), (c) FIG. 4 is a side view showing an example of arrangement of high heat generating components in the storage unit. (A) is a perspective view showing the structure of the disclosed storage unit, and (b) is a perspective view showing a state in which a drawer is pulled out from the storage unit shown in (a). (A) is a perspective view which shows the shelf of the state which removed the drawer from the disclosed storage unit, (b) is sectional drawing in the AA surface of (a). (A) is the perspective view which shows the state by which HDD was mounted in the one side of the drawer of an indication, (b) is the perspective view which looked at the drawer shown to (a) from the lower side. (A) is a side view showing cooling of a drawer side high heat generating component in the disclosed storage unit, (b) is a side view showing cooling of a shelf side high heat generating component by pulling out the drawer from the storage unit shown in (a). FIG. 4C is a cross-sectional view taken along line BB in FIG. (A) is a top view of the state which pulled out the drawer from the disclosed storage unit, (b) is a side view which shows cooling of the high heat-emitting components by the side of the drawer in the state of (a). (A) is a schematic plan view showing an embodiment in which an outlet for cooling air on the shelf side and an outlet for cooling air on the drawer side are provided at the same position, and (b) is an outlet for cooling air on the shelf side. It is a schematic plan view which shows the Example by which the exhaust port of the cooling air by the side of a drawer is provided in the back | inner side of the shelf. (A) is a schematic plan view showing an embodiment in which the positions of the exhaust pipe for the cooling air on the shelf side and the exhaust pipe for the cooling air on the drawer side are reversed from the embodiment shown in FIG. FIG. 9B is a schematic plan view showing an embodiment in which the positions of the exhaust side of the cooling air on the shelf side and the exhaust side of the cooling air on the drawer side are opposite to those of the embodiment shown in FIG. is there. (A) is a side view showing an example of the structure of a server device in which a plurality of storage units having a structure not having a cooling fan is installed in the shelf, and (b) is a structure in which a cooling fan is built in the shelf of one storage unit. It is a side view which shows the storage unit.

  Hereinafter, embodiments of the present application will be described in detail based on specific examples with reference to the accompanying drawings. In the following embodiments, elements that are the same as or similar to those in the comparison technique are denoted by common reference numerals, and the scale of the drawings is appropriately changed for easy understanding.

  FIG. 4A is a perspective view showing the structure of an embodiment of the disclosed storage unit 40. The storage unit 40 is roughly divided into a drawer 20 on which parts that require hot replacement such as the HDD 3 are mounted, and a shelf 10 that houses the entire drawer 20, and the drawer 20 can move back and forth with respect to the shelf 10. 4A shows a state where the drawer 20 is stored in the shelf 10, and FIG. 4B shows a state where the drawer 20 is pulled out from the shelf 10 of the storage unit 40 shown in FIG. 4A. Show. The shelf 10 includes side plates 10 </ b> S on both sides as viewed from the front side, but the right side plate of the shelf 10 is not shown to show the internal structure of the shelf 10.

  As shown in FIG. 4A, the shelf 10 includes a bottom plate 10B and a side plate 10S extending upward from both sides of the bottom plate 10B (the side plate on the right side as viewed from the front is not shown). Further, at the upper end portion of the side plate 10 </ b> S, there is a hook 10 </ b> E that prevents the drawer 20 moving inside the shelf 10 from being removed from the shelf 10. A connector 6 connected to the connector of the server device is provided at the rear end of the bottom plate 10B. A main board 5 connected to the backplane 8 of the drawer 20 is provided in front of the connector 6, and the shelf side is provided on the main board 5. There is a small board 10P on which high heat-generating components are mounted. The drawer 20 is equipped with a plurality of HDDs 3 as active devices.

  As shown in FIG. 4B, the drawer 20 that can be pulled out from the shelf 10 includes a front plate 20A and a bottom plate 20B. A backplane 8 extending from the front side of the drawer 20 to the rear side is provided at the center of the bottom plate 20B. Nine HDDs 3 are attached to both sides of the backplane 8 in a replaceable manner. A chimney-shaped exhaust cylinder 28 is provided on the rear end side of the bottom plate 20B. Above the exhaust cylinder 28 is a small board 20P on which high heat-generating components are mounted. Further, as can be seen from FIG. 4 (b) showing a state in which the drawer 20 is pulled out from the shelf 10, a chimney-shaped exhaust cylinder 18 is provided on the bottom plate 10B of the shelf 10 so that the drawer 20 moves. An opening 10A is provided in the bottom plate 10B. The backplane 8 and the main board 5 are connected by a cable having a surplus length as in the comparative technique, but the illustration of the cable is omitted.

  FIG. 5A is a perspective view showing the shelf 10 with the drawer removed from the disclosed storage unit, and FIG. 5B is a cross-sectional view taken along the AA plane of FIG. As described above, the shelf 10 includes the bottom plate 10B, the side plate 10S that extends upward from both sides of the bottom plate 10B and includes the flange 10E at the upper end, the main board 5, the connector 6, and the small board on which the shelf-side high heat generating components are mounted. 10P is provided. On the other hand, the bottom plate 10B includes a rear low floor portion 10B1 to which the main board 5 is attached, and a high floor portion 10B2 that is positioned in front of the lower floor portion 10B1 and is higher than the low floor portion 10B1.

  The raised floor portion 10B2 is provided with a duct 11 and a duct 12 each having an intake port on the front surface of the shelf 10, and the cross-sectional shapes of the duct 11 and the duct 12 are shown in FIG. The duct 11 is a cooling duct for components mounted on the shelf 10 side, and the duct 12 is a cooling duct for components mounted on the drawer 20 side. By providing a cooling duct 11 for components mounted on the shelf 10 side and a cooling duct 12 for components mounted on the drawer 20 side, highly heat-generating electronic components and components that are easily affected by temperature are on the shelf 10 side. It can be mounted regardless of the drawer 20 side.

  The duct 11 has the bottom surface, both side surfaces, the ceiling surface, and the rear end surface covered with the constituent members of the shelf 10. On the other hand, the duct 12 has a bottom surface and both side surfaces covered with the constituent members of the shelf 10, and the ceiling surface is opened to form an opening 10A. The rear end surface of the duct 12 may be closed by a constituent member of the shelf 10 or may be opened. On the upper surface of the raised floor portion 10B2 in the vicinity of the rear end surface of the duct 11, there is an opening communicating with the duct 11, and a chimney-shaped exhaust pipe 18 is provided around the opening. The cooling air sucked from the front intake port is discharged from the chimney-shaped exhaust cylinder 18 without leaking. In this embodiment, a duct 11 for cooling the parts on the shelf 10 side as viewed from the front of the storage unit 40 and a duct 12 for cooling the parts on the side of the drawer 20 are disposed at the bottom on the right side. However, this arrangement is not limited. Further, the part of the storage unit 40 in which the ducts 11 and 12 are provided may not be the bottom part, and may be installed on the side of the storage unit 40 or on the ceiling part.

  6A is a perspective view showing a state in which the HDD 3 is mounted on one surface of the disclosed drawer 20, and FIG. 6B is a view of the drawer 20 shown in FIG. 6A viewed from below. It is a perspective view which shows a state. A backplane 8 extending from the front end side to the rear end side of the drawer 20 is provided at the center of the drawer 20, and connectors 13 for connecting the HDD 3 are provided on both sides of the backplane 8. Further, one of the bottom plates 20 </ b> B divided by the back plane 8 of the drawer 20 becomes a ceiling portion of the duct 12 provided in the shelf 10 when the drawer 20 is accommodated in the shelf 10.

  A small board 20P is attached to the rear end portion of the back plane 8 on the duct 12 side, and a high heat generating component 9B is attached to the lower surface of the small board 20P. An opening 20A is provided on the rear end side of the bottom plate 20B located below the small substrate 20P, and a chimney-like exhaust cylinder 28 is provided around the opening 20A. Further, a partition plate 23 to be inserted into the duct 12 protrudes from the lower surface of the bottom plate 20B on the rear end side of the opening 20A. When the drawer 20 is accommodated in the shelf 10, the partition plate 23 enters the duct 12 and the bottom plate 20 </ b> B of the drawer 20 closes the upper surface of the duct 12. The partition plate 23 can slide and move inside the duct 12 when the drawer 20 is pulled out with respect to the shelf 10.

  As described above, the cooling duct 12 for the drawer-side mounted component has a structure in which the position of the chimney-shaped exhaust stack 18 moves in accordance with the storing / drawing operation of the drawer 20 with respect to the shelf 10. With this structure, a constant cooling air is applied to the component mounted on the drawer 20 side regardless of whether the drawer 20 is stored in the drawer 10 or pulled out from the shelf 10. It becomes possible to cool. Therefore, even if the drawer 20 is pulled out of the shelf 10 for active replacement, the cooling capacity of the duct 12 is not reduced.

  FIG. 7A is a side view showing cooling of the high heat-generating component 9 </ b> B on the drawer 20 side in the disclosed storage unit 40, and shows a state where the drawer 20 is housed in the shelf 10. Moreover, FIG.7 (c) has shown the cross section in the BB line of Fig.7 (a). Further, FIGS. 7B, 8 </ b> A, and 8 </ b> B show a state in which the drawer 20 is pulled out from the storage unit 40.

  As can be seen from these drawings, the cooling air entering from the air inlet of the duct 12 hits the partition plate 23 provided on the bottom plate 20B of the drawer 20 through the duct 12, and the chimney type exhaust stack of the drawer 20 without leakage. 28 is exhausted. The partition plate 23 is always directly below the rear end side of the chimney-type exhaust stack 28 of the drawer 20 regardless of the position of the drawer 20 with respect to the shelf 10. Therefore, regardless of whether the drawer 20 is stored or pulled out, the cooling air is always exhausted from the chimney-type exhaust cylinder 28 of the drawer 20, and a constant amount of cooling air can be applied to the high heat generating component 9B on the drawer side.

  On the other hand, in the state where the drawer 20 is accommodated in the storage unit 40, the duct 11 sucks cooling air from the air inlets on the front surface of the shelf 10 and blows out the cooling air from the chimney-type exhaust cylinder 18. Cooling air strikes the high heat generating component 9A mounted on the board. Further, even when the drawer 20 is pulled out from the storage unit 40 shown in FIGS. 7B and 8A, the position of the intake port of the duct 11 on the front surface of the shelf 10 does not change. For this reason, the cooling air drawn from the intake port on the front surface of the shelf 10 flows through the duct 11 and blows out from the chimney-type exhaust cylinder 18, so that the cooling air hits the high heat generating component 9 </ b> A mounted on the small board 10 </ b> P. The small board 10P on which the high heat generating component 9A is mounted is attached to the main board 5 by the connection mediating small board 10.

  In this way, regardless of the drawer 20 pulling-out operation, the high heat generating component 9 </ b> A on the shelf 10 side is cooled by the cooling air exhausted from the chimney-type exhaust stack 18 through the duct 11. In addition, the drawer-side high heat generating component 9B that moves together with the drawer 20 is also cooled by the cooling air exhausted from the chimney-type exhaust cylinder 28 regardless of the drawer 20 drawing operation. Since the storage unit 40 has the above-described cooling structure, the drawer 20 can be pulled out regardless of whether it is the shelf 10 side or the drawer 20 side even if the front part of the storage unit 40 is clogged with components such as the HDD 3. Regardless, the high heat-generating component mounted on the rear portion can be cooled.

  Thereby, in the cooling structure of the comparative technique, the rear part was cooled with the exhaust heat air after cooling the HDD 3 that is 50 ° C. to 60 ° C. However, according to the disclosed structure, the cooling of 20 ° C. to 30 ° C. It is possible to cool parts that are highly heat-generated and temperature-sensitive by wind.

  FIG. 9A schematically shows an embodiment in which the cooling air exhaust cylinder 18 on the shelf 10 side and the cooling air exhaust cylinder 28 on the drawer 20 side are provided at the same position in the longitudinal direction of the storage unit 40. It is a top view. The illustration of the HDD is omitted. In this embodiment, the cooling air exhaust cylinder 18 on the shelf 10 side is provided on the left side when viewed from the front of the storage unit 40, and the cooling air exhaust cylinder 28 on the drawer 20 side is provided on the right side. However, as shown in FIG. 10 (a), the cooling air exhaust cylinder 18 on the shelf 10 side is provided on the right side when viewed from the front of the storage unit 40, and the cooling air exhaust cylinder 28 on the drawer 20 side is provided on the left side. Also good.

  In FIG. 9B, the cooling air exhaust cylinder 28 on the drawer 20 side is provided on the back side of the chefff 10 with respect to the longitudinal direction of the storage unit 40 rather than the cooling air exhaust cylinder 18 on the shelf 10 side. It is a schematic plan view which shows an Example. The illustration of the HDD is omitted. When the cooling air exhaust tube 28 on the drawer 20 side is provided on the back side of the shelf 10 with respect to the cooling air exhaust tube 18 on the shelf 10 side, the backplane on the front side of the cooling air exhaust tube 28 on the drawer 20 side. 8 has a space 9C. Then, components or a circuit board can be provided using this space 9C. Also in this embodiment, the cooling air exhaust cylinder 18 on the shelf 10 side is provided on the left side when viewed from the front of the storage unit 40, and the cooling air exhaust cylinder 28 on the drawer 20 side is provided on the right side. However, as shown in FIG. 10B, the cooling air exhaust cylinder 18 on the shelf 10 side is provided on the right side when viewed from the front of the storage unit 40, and the cooling air exhaust cylinder 28 on the drawer 20 side is provided on the left side. Also good.

  In the above-described embodiment, the case where a cooling fan or the like is not mounted inside the storage unit has been described. The storage unit 40 having a structure without a built-in cooling fan includes, for example, a large backplane 80 as shown in FIG. 11A, and a large backplane of the server device 1 in which cooling fans 81 are arranged behind the large backplane 80. It is assumed that a plurality of units 80 are connected. Cooling air taken from the front surface of the plurality of storage units 40 passes through the inside of the storage unit 40, passes through the holes formed in the large backplane 80 and the space around the backplane 80, and is sucked into the cooling fan 81. It is. The cooling air discharged from the cooling fan 81 is exhausted from the rear part of the server apparatus 1 as it is, or after cooling another unit at the rear part of the cooling fan 81, it is exhausted from the rear part of the server apparatus 1.

  FIG. 11B is a side view showing the storage unit 40A having a structure in which the cooling fan 41 is built. Thus, even when the cooling fan 41 can be mounted in the storage unit 40A, the cooling structure of the present application can be effectively applied.

  The present application has been described in detail with particular reference to preferred embodiments thereof. For easy understanding of the present application, specific forms of the present application are appended below.

(Supplementary Note 1) A shelf including a first part to be air-cooled on the back side;
A plurality of active devices mounted on the front side, a second part to be air-cooled provided on the back side, and a drawer that is pulled out of the shelf during active replacement of the active device;
A first duct that is provided in the shelf and discharges air toward the first part through a first exhaust port; and a second duct that discharges air toward the second part through a second exhaust port. ,
An electronic device cooling unit in which the first exhaust port is provided in the shelf and the second exhaust port is provided in the drawer.
(Additional remark 2) The said 1st duct and the said 2nd duct are provided adjacent to the bottom part of the said shelf, The electronic device cooling unit of Additional remark 1 characterized by the above-mentioned.
(Additional remark 3) As for the said 1st duct, an inlet port opens in the front surface of the said electronic device cooling unit, and a bottom face, both side surfaces, a ceiling surface, and a rear-end surface are all enclosed by the structural member of the said shelf,
The second duct has an air inlet opening at the front surface of the electronic device cooling unit, a bottom surface and both side surfaces surrounded by the constituent members of the shelf, a ceiling surface formed by the bottom surface of the drawer, and a rear end surface of the drawer The electronic device cooling unit according to appendix 2, wherein the electronic device cooling unit is formed by a partition plate that protrudes from the bottom plate and slides in the second duct by the drawer operation of the drawer.
(Additional remark 4) The said 1st exhaust pipe is opened in the ceiling surface of the said 1st duct, It is equipped with the chimney type exhaust pipe which guides air toward the said 1st component,
The electronic device cooling unit according to appendix 3, wherein the second exhaust port is open to a bottom plate of the drawer and includes a chimney-type exhaust pipe that guides air toward the second component.
(Supplementary Note 5) The first component is mounted on a small board attached to a main board installed on the back side of the shelf,
The electronic device cooling according to any one of appendices 1 to 4, wherein the second component is mounted on a small board attached to a backplane to which the plurality of active devices housed in the drawer are connected. unit.

(Supplementary note 6) From Supplementary note 1, wherein the first exhaust port and the second exhaust port are provided at the same position in the longitudinal direction of the shelf in a state where the drawer is accommodated in the shelf. The electronic device cooling unit according to claim 5.
(Additional remark 7) The said 2nd exhaust port is provided in the position far from the front surface of the longitudinal direction of the said shelf with respect to the said 1st exhaust port in the state in which the said drawer was accommodated in the said shelf. The electronic device cooling unit according to any one of supplementary notes 1 to 5.
(Supplementary Note 8) A cooling fan for drawing cooling air into the electronic device cooling unit is provided on the back side of the electronic device cooling unit from the first exhaust port and the second exhaust port. The electronic device cooling unit according to any one of appendices 1 to 7, characterized in that:
(Supplementary note 9) The electronic device cooling unit according to any one of supplementary notes 1 to 7, wherein the active device is a hard disk device.

1 server 3 HDD
4 Storage unit with drawer mechanism (storage unit)
5 Main board 8 Backplane 9, 9A, 9B Heat-generating component 10 Housing (shelf)
11, 12 Duct 20 Drawer 22 Duct

Claims (5)

A shelf provided with a first part to be air-cooled on the back side;
A plurality of active devices mounted on the front side, a second part to be air-cooled provided on the back side, and a drawer that is pulled out of the shelf during active replacement of the active device;
A first duct that is provided in the shelf and discharges air toward the first part through a first exhaust port; and a second duct that discharges air toward the second part through a second exhaust port. ,
An electronic device cooling unit in which the first exhaust port is provided in the shelf and the second exhaust port is provided in the drawer.   The electronic device cooling unit according to claim 1, wherein the first duct and the second duct are provided adjacent to a bottom portion of the shelf. In the first duct, an air inlet is opened at the front surface of the electronic device cooling unit, and a bottom surface, both side surfaces, a ceiling surface, and a rear end surface are all surrounded by the constituent members of the shelf,
The second duct has an air inlet opening at the front surface of the electronic device cooling unit, a bottom surface and both side surfaces surrounded by the constituent members of the shelf, a ceiling surface formed by the bottom surface of the drawer, and a rear end surface of the drawer 3. The electronic device cooling unit according to claim 2, wherein the electronic device cooling unit is formed by a partition plate that protrudes from a bottom surface of the drawer and slides in the second duct by the drawer operation of the drawer. 4. The first exhaust port has an opening in the ceiling surface of the first duct, and includes a chimney-type exhaust pipe that guides air toward the first part,
4. The electronic device cooling unit according to claim 3, wherein the second exhaust port is open to a bottom surface of the drawer and includes a chimney-type exhaust tube that guides air toward the second component. The first component is mounted on a small board attached to a main board installed on the back side of the shelf,
5. The device according to claim 1, wherein the second component is mounted on a small board attached to a backplane to which the plurality of active devices housed in the drawer are connected. 6. Electronic equipment cooling unit.

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