JP2018060363A - Processing device - Google Patents

Processing device Download PDF

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JP2018060363A
JP2018060363A JP2016197291A JP2016197291A JP2018060363A JP 2018060363 A JP2018060363 A JP 2018060363A JP 2016197291 A JP2016197291 A JP 2016197291A JP 2016197291 A JP2016197291 A JP 2016197291A JP 2018060363 A JP2018060363 A JP 2018060363A
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processing
visible light
processing apparatus
information
apparatuses
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JP6856345B2 (en
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悟志 佐脇
Satoshi Sawaki
悟志 佐脇
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Disco Corp
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Disco Abrasive Systems Ltd
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Priority to JP2016197291A priority Critical patent/JP6856345B2/en
Priority to TW106130445A priority patent/TWI727090B/en
Priority to CN201710859238.3A priority patent/CN107919300B/en
Priority to KR1020170125371A priority patent/KR102272970B1/en
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    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM]
    • G05B19/4185Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS], computer integrated manufacturing [CIM] characterised by the network communication
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67092Apparatus for mechanical treatment
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/11Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
    • H04B10/114Indoor or close-range type systems
    • H04B10/116Visible light communication
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

PROBLEM TO BE SOLVED: To send and receive device information among a plurality of devices without causing information leakage.SOLUTION: A processing device (10) for processing a workpiece (W) comprises: a chuck table (12) holding the workpiece; processing means processing the workpiece held on the chuck table; control means (15) controlling the chuck table and the processing means; input means (14) inputting a processing condition to the processing means; a storage part (16) storing the processing condition input to the input means; and an LED display lamp (19) emitting visible light to inform an operating status. The processing device is configured to send and receive device information with other processing devices by the visible light.SELECTED DRAWING: Figure 4

Description

本発明は、被加工物を加工する加工装置に関する。   The present invention relates to a processing apparatus for processing a workpiece.

半導体デバイスや電子部品の製造工程では、半導体ウエーハやセラミックス基板等の板状の被加工物を、研削装置によって所定厚みまで薄化した後、切削装置やレーザー加工装置等で個々のデバイスチップに分割している。これらの加工装置は工場等に設置されるが、工場内の同一フロアに複数の加工装置が並べられている場合が多く、各加工装置がオペレータに入力された加工条件で稼働している。加工装置の台数が多くなればオペレータの入力負担が増えるため、複数の加工装置間で加工条件を送受信させることで、装置間で同じ加工条件を同期させる加工装置が提案されている(例えば、特許文献1参照)。   In the manufacturing process of semiconductor devices and electronic components, a plate-like workpiece such as a semiconductor wafer or ceramic substrate is thinned to a predetermined thickness with a grinding machine, and then divided into individual device chips with a cutting machine or laser processing machine. doing. These processing apparatuses are installed in a factory or the like, but a plurality of processing apparatuses are often arranged on the same floor in the factory, and each processing apparatus is operating under the processing conditions input by the operator. Since the input burden on the operator increases as the number of processing devices increases, a processing device that synchronizes the same processing conditions between devices by transmitting and receiving processing conditions between a plurality of processing devices has been proposed (for example, patents) Reference 1).

特開2014−235443号公報JP 2014-235443 A

しかしながら、Wi−Fi(Wireless Fidelity)やBluetooth(登録商標)等の無線通信で複数の加工装置を通信させる場合には、加工条件等の装置情報が屋外に漏洩してしまう恐れがあった。一方で、ケーブル等を用いた有線通信で複数の加工装置間を接続するのは、加工装置の増設やレイアウト変更が困難になると共にケーブルによって美観を損なうという問題があった。   However, when a plurality of processing apparatuses communicate with each other by wireless communication such as Wi-Fi (Wireless Fidelity) or Bluetooth (registered trademark), apparatus information such as processing conditions may be leaked outdoors. On the other hand, connecting a plurality of processing devices by wired communication using a cable or the like has a problem in that it is difficult to increase the number of processing devices or to change the layout and to impair the beauty of the cable.

本発明はかかる点に鑑みてなされたものであり、情報漏洩を起こすことなく複数の装置間で装置情報を送受信させることができる加工装置を提供することを目的の1つとする。   The present invention has been made in view of this point, and an object of the present invention is to provide a processing apparatus capable of transmitting and receiving apparatus information between a plurality of apparatuses without causing information leakage.

本発明の一態様の加工装置は、被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を加工する加工手段と、少なくとも該チャックテーブル及び該加工手段を制御する制御手段と、該制御手段に対し加工条件を入力設定する入力手段と、該加工条件を含む装置情報を記憶する記憶部と、可視光を発して可動状況を報知するLED表示灯と、を備える加工装置であって、該制御手段は、該装置情報に対応して該LED表示灯を点滅させて可視光送信を行い、他の加工装置の該LED表示灯の可視光が到達する位置に配設され、可視光送信で送信された該装置情報を受信する受信部を備え、該装置情報を可視光通信により加工装置間で送受信することを特徴とする。   A processing apparatus according to an aspect of the present invention includes a chuck table that holds a workpiece, a processing unit that processes the workpiece held on the chuck table, and a control unit that controls at least the chuck table and the processing unit. A processing device comprising: an input unit that inputs and sets processing conditions to the control unit; a storage unit that stores device information including the processing conditions; and an LED indicator that emits visible light to notify the movable state. The control means blinks the LED indicator light corresponding to the device information and transmits visible light, and is disposed at a position where the visible light of the LED indicator light of another processing device reaches. A receiving unit that receives the device information transmitted by visible light transmission, and transmits and receives the device information between processing devices by visible light communication.

この構成によれば、複数の加工装置間で自動的に装置情報が送受信されるため、オペレータによる装置情報の入力負担を軽減することができる。このとき、複数の加工装置間で可視光通信されているため、通信時に加工装置の装置情報が屋外に漏洩することがない。また、複数の加工装置間に配線が不要になることで、加工装置の増設やレイアウト変更が容易になると共に、ケーブルによって美観を損なうことがない。このように、情報漏洩を起こすことなく、複数の加工装置間で装置情報を同期させることができる。   According to this configuration, since apparatus information is automatically transmitted and received between a plurality of processing apparatuses, it is possible to reduce the burden of input of apparatus information by an operator. At this time, since visible light communication is performed between a plurality of processing apparatuses, apparatus information of the processing apparatus does not leak to the outdoors during communication. Further, since no wiring is required between the plurality of processing devices, it is easy to add processing devices and change the layout, and the cable does not impair the aesthetic appearance. Thus, apparatus information can be synchronized among a plurality of processing apparatuses without causing information leakage.

また、本発明の一態様の加工装置において、隣接する加工装置間をリレーして複数の該加工装置間で該装置情報を送受信することを特徴とする。   In the processing apparatus of one embodiment of the present invention, the apparatus information is transmitted and received between a plurality of processing apparatuses by relaying between adjacent processing apparatuses.

本発明によれば、複数の加工装置間で可視光通信によって装置情報を送受信することで、情報漏洩を起こすことなく複数の装置間で装置情報を送受信させることができる。   ADVANTAGE OF THE INVENTION According to this invention, apparatus information can be transmitted / received between several apparatuses, without causing information leakage by transmitting / receiving apparatus information by visible light communication between several processing apparatuses.

本実施の形態の加工装置の斜視図である。It is a perspective view of the processing apparatus of this Embodiment. 比較例の加工装置の配置例を示す上面模式図である。It is an upper surface schematic diagram which shows the example of arrangement | positioning of the processing apparatus of a comparative example. 本実施の形態のLED表示灯の一例を示す図である。It is a figure which shows an example of the LED indicator lamp of this Embodiment. 本実施の形態の可視光通信の一例を示す図である。It is a figure which shows an example of the visible light communication of this Embodiment. 本実施の形態の可視光信号のデータ構造の一例を示す図である。It is a figure which shows an example of the data structure of the visible light signal of this Embodiment. 本実施の形態の通信手順のシーケンス図の一例を示す図である。It is a figure which shows an example of the sequence diagram of the communication procedure of this Embodiment. 本実施の形態の通信中の可視光信号の一例を示す図である。It is a figure which shows an example of the visible light signal in communication of this Embodiment.

以下、添付図面を参照して、本実施の形態の加工装置について説明する。図1は、本実施の形態の加工装置の斜視図である。図2は、比較例の加工装置の配置例を示す上面模式図である。なお、本実施の形態では加工装置として切削装置を例示して説明するが、加工装置は被加工物を加工するものであればよく、例えば、研削装置、研磨装置、レーザー加工装置、エッチング装置等でもよい。   Hereinafter, the processing apparatus of the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of a processing apparatus according to the present embodiment. FIG. 2 is a schematic top view illustrating an arrangement example of the processing apparatus of the comparative example. In the present embodiment, a cutting device will be described as an example of the processing device. However, the processing device only needs to process a workpiece, for example, a grinding device, a polishing device, a laser processing device, an etching device, or the like. But you can.

図1に示すように、加工装置10は、タッチパネル(入力手段)14から入力された加工条件に応じて、チャックテーブル12に保持された被加工物Wを加工手段13で加工するように構成されている。タッチパネル14は筐体11の外面に設けられており、タッチパネル14から制御手段15に対して加工条件等が設定入力されることで、制御手段15にチャックテーブル12及び加工手段13が制御されている。また、タッチパネル14から入力された加工条件を含む装置情報は記憶部16に記憶され、制御手段15は記憶部16から各種の装置情報を読み出すことで加工装置10が統括的に制御される。   As shown in FIG. 1, the processing apparatus 10 is configured to process the workpiece W held on the chuck table 12 by the processing means 13 in accordance with the processing conditions input from the touch panel (input means) 14. ing. The touch panel 14 is provided on the outer surface of the housing 11, and the chuck table 12 and the processing unit 13 are controlled by the control unit 15 when a processing condition or the like is set and input from the touch panel 14 to the control unit 15. . In addition, device information including processing conditions input from the touch panel 14 is stored in the storage unit 16, and the control unit 15 reads various device information from the storage unit 16 to control the processing device 10 in an integrated manner.

制御手段15及び記憶部16は、各種処理を実行するプロセッサやメモリ等によって構成されている。メモリは、用途に応じてROM(Read Only Memory)、RAM(Random Access Memory)等の一つ又は複数の記憶媒体で構成されている。また、チャックテーブル12は、ポーラスセラミック材によって保持面が形成されており、この保持面に生じる負圧によって被加工物Wが吸引保持される。加工手段13は、筐体11内でスピンドル17の先端の切削ブレード18を高速回転させ、切削ブレード18に対するチャックテーブル12の相対移動によって被加工物Wが切削加工される。   The control means 15 and the memory | storage part 16 are comprised by the processor, memory, etc. which perform various processes. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory) and a RAM (Random Access Memory) depending on the application. The chuck table 12 has a holding surface made of a porous ceramic material, and the workpiece W is sucked and held by the negative pressure generated on the holding surface. The processing means 13 rotates the cutting blade 18 at the tip of the spindle 17 in the housing 11 at a high speed, and the workpiece W is cut by relative movement of the chuck table 12 with respect to the cutting blade 18.

被加工物Wの裏面にはダイシングテープTが貼着されており、ダイシングテープTの外周にはリングフレームFが貼着されている。すなわち、被加工物Wは、ダイシングテープTを介してリングフレームFに支持された状態で加工装置10に搬入される。被加工物Wは、半導体基板上に半導体デバイスが形成された半導体ウエーハでもよいし、無機材料基板上に光デバイスが形成された光デバイスウエーハでもよい。なお、ここでは被加工物Wとして切削装置の加工対象を例示しているが、切削装置以外の加工装置では、各加工装置で加工対象になるものであればよい。   A dicing tape T is attached to the back surface of the workpiece W, and a ring frame F is attached to the outer periphery of the dicing tape T. That is, the workpiece W is carried into the processing apparatus 10 while being supported by the ring frame F via the dicing tape T. The workpiece W may be a semiconductor wafer in which a semiconductor device is formed on a semiconductor substrate, or an optical device wafer in which an optical device is formed on an inorganic material substrate. In addition, although the processing target of the cutting device is illustrated here as the workpiece W, any processing device other than the cutting device may be used as long as it is a processing target in each processing device.

また、筐体11の上面には、可視光を発して装置の稼働状況を報知するLED表示灯19が突設されている。LED表示灯19は、例えば、加工装置10が正常に稼働している状態では緑色で点灯し、加工装置10に何らかの不具合が生じた場合に赤色で点滅する。筐体11の上面にはLED表示灯19以外の障害物が存在しないため、遠くからオペレータが視認することが可能になっている。このように構成された加工装置10は、オペレータによってタッチパネル14から加工条件が手動で設定入力されて、加工条件に基づいてチャックテーブル12及び加工手段13の動作が制御される。   In addition, an LED indicator lamp 19 is provided on the upper surface of the housing 11 to emit visible light and notify the operating status of the apparatus. For example, the LED indicator lamp 19 is lit in green when the processing apparatus 10 is operating normally, and flashes in red when some malfunction occurs in the processing apparatus 10. Since there is no obstacle other than the LED indicator light 19 on the upper surface of the casing 11, the operator can visually recognize from a distance. In the machining apparatus 10 configured as described above, machining conditions are manually set and input from the touch panel 14 by an operator, and operations of the chuck table 12 and the machining means 13 are controlled based on the machining conditions.

ところで、図2A及び図2Bの比較例に示すように、一般的に工場等では複数の加工装置30が並んで設置されており、個々の加工装置30をオペレータが手動で装置情報を設定すると負荷が大きい。このため、ホストコンピュータ31から複数の加工装置30に対して有線通信又は無線通信によって遠隔で装置情報を設定する方法が検討されている。しかしながら、有線通信では加工装置30をケーブルで接続する必要があるため、加工装置30の増設やレイアウト変更が困難になる(図2A参照)。一方で、無線通信では指向性の低い電波が広がりながら屋外まで伝播するため、加工装置30の装置情報が外部に漏洩してしまう(図2B参照)。   By the way, as shown in the comparative example of FIG. 2A and FIG. 2B, in general, a plurality of processing devices 30 are installed side by side in a factory or the like, and load is set when device information is manually set for each processing device 30 by an operator. Is big. For this reason, a method of remotely setting device information from a host computer 31 to a plurality of processing devices 30 by wired communication or wireless communication has been studied. However, since it is necessary to connect the processing device 30 with a cable in wired communication, it is difficult to add the processing device 30 or change the layout (see FIG. 2A). On the other hand, in radio communication, radio waves with low directivity propagate to the outside while spreading, so that the device information of the processing device 30 leaks to the outside (see FIG. 2B).

図1に戻り、工場等では同一フロア内に多数の加工装置10が近接して設置されており、通常は隣り合う加工装置10の間に通信を遮るような障害物が設置されることはない。このため、加工装置10同士で通信させれば、通信距離が長く指向性の低い電波で無線通信する必要はない。そこで、本実施の形態では、工場等の屋内に複数の加工装置10が近接して設置される点に着目して、通信距離が短く指向性が高い可視光を用いて加工装置10同士で無線通信させている。指向性の高い可視光が屋外まで伝搬し難くなり、情報漏洩を起こすことなく複数の加工装置10間で装置情報を送受信させることが可能である。   Returning to FIG. 1, in a factory or the like, a large number of processing devices 10 are installed close to each other on the same floor, and normally there are no obstacles that block communication between adjacent processing devices 10. . For this reason, if the processing apparatuses 10 communicate with each other, it is not necessary to perform wireless communication with radio waves having a long communication distance and low directivity. Therefore, in the present embodiment, paying attention to the fact that a plurality of processing devices 10 are installed close to each other in a factory or the like, wirelessly between the processing devices 10 using visible light having a short communication distance and high directivity. Communicate. Visible light with high directivity becomes difficult to propagate outdoors, and device information can be transmitted and received between the plurality of processing devices 10 without causing information leakage.

また、上記したように可視光通信は通信距離が短いため、距離が離れた加工装置10に直に可視光通信させることができない。そこで、本実施の形態では、隣り合う加工装置10で装置情報をリレーさせることで、複数の加工装置10を介して距離が離れた加工装置10間で装置情報を送受信させるようにしている。これにより、1台の加工装置10に装置情報を設定するだけで、隣り合う加工装置10間の可視光通信によって装置情報がリレーされて、工場等の同一フロアに設置された全ての加工装置10に同一の装置情報を同期させることが可能になっている。   Further, as described above, since the visible light communication has a short communication distance, it is not possible to directly make visible light communication to the processing apparatus 10 with a long distance. Therefore, in the present embodiment, device information is relayed between adjacent processing devices 10 so that the device information is transmitted and received between the processing devices 10 that are separated from each other via a plurality of processing devices 10. Thereby, only by setting apparatus information to one processing apparatus 10, apparatus information is relayed by visible light communication between adjacent processing apparatuses 10, and all the processing apparatuses 10 installed on the same floor of a factory or the like. It is possible to synchronize the same device information.

なお、装置情報は、加工装置10に含まれる情報であれば特に限定されず、デバイスデータ等の加工条件だけでなく、切削ブレード18(図1参照)の消耗量等のブレード関連情報が含まれてもよい。ブレード関連情報を複数の加工装置10で記憶させておくことで、切削ブレード18を別の加工装置10に着け替えた時に、切削ブレード18の消耗量を反映して別の加工装置10で切削加工することができる。   The apparatus information is not particularly limited as long as it is information included in the processing apparatus 10, and includes not only processing conditions such as device data but also blade related information such as the amount of wear of the cutting blade 18 (see FIG. 1). May be. By storing blade-related information in a plurality of processing devices 10, when the cutting blade 18 is changed to another processing device 10, the amount of wear of the cutting blade 18 is reflected and cutting is performed in another processing device 10. can do.

以下、図3及び図4を参照して、加工装置に設けられた可視光通信の通信手段について説明する。図3は、本実施の形態のLED表示灯の一例を示す図である。図4は、本実施の形態の可視光通信の一例を示す図である。   Hereinafter, the communication means of visible light communication provided in the processing apparatus will be described with reference to FIGS. 3 and 4. FIG. 3 is a diagram illustrating an example of the LED indicator lamp according to the present embodiment. FIG. 4 is a diagram illustrating an example of visible light communication according to the present embodiment.

図3に示すように、加工装置10(図1参照)のLED表示灯19は制御手段15に接続されており、制御手段15の制御によってLED表示灯19が点滅されることで可視光通信が行われる。LED表示灯19では、制御手段15の制御によって装置情報に対応してオンオフされ、光の明暗情報によって可視光が変調されることで装置情報が可視光信号に変換されて送信される。なお、変調方式としては、通信していないときと人間が目視したときの明るさが同等になるような変調方式が選択される。また、LEDの点灯間隔は、人が知覚できない領域で行われ、例えば、通信をしていない時は100Hz−120Hzで点滅し、通信をしている時は3kHz−3MHzで点滅する。また、LED表示灯19の外周面には、他の加工装置10のLED表示灯19の可視光が到達する位置で、可視光通信で送信された装置情報を受信する受信部24が設けられている。受信部24は、照度センサやイメージセンサ等で構成され、可視光信号を電気信号に変換し、復調処理を施して装置情報を受信する。   As shown in FIG. 3, the LED indicator light 19 of the processing apparatus 10 (see FIG. 1) is connected to the control means 15, and the visible light communication is performed by the LED indicator light 19 blinking under the control of the control means 15. Done. The LED indicator 19 is turned on / off in response to the device information under the control of the control means 15, and the device information is converted into a visible light signal and transmitted by modulating the visible light with the light brightness information. As the modulation method, a modulation method is selected such that the brightness when not communicating is the same as when viewed by a human. Further, the lighting interval of the LED is performed in a region that cannot be perceived by a person, for example, blinking at 100 Hz-120 Hz when not communicating, and blinking at 3 kHz-3 MHz when communicating. In addition, the outer peripheral surface of the LED indicator lamp 19 is provided with a receiving unit 24 that receives device information transmitted by visible light communication at a position where the visible light of the LED indicator lamp 19 of another processing apparatus 10 reaches. Yes. The receiving unit 24 includes an illuminance sensor, an image sensor, and the like, converts a visible light signal into an electric signal, performs demodulation processing, and receives device information.

また、LED表示灯19は、可視光を加工装置10の周囲に向けて発光するように、複数のLED発光素子23が周方向に等間隔に配設されている。各LED発光素子23の発光範囲(有効角度)が部分的に重なっており、LED表示灯19の周辺に360度方向で可視光が発光される。受信部24は、加工装置10の周囲から可視光を受光するように、LED表示灯19の外周面に複数のLED受光素子25が等間隔に配設されている。各LED受光素子25の受光範囲(有効角度)も部分的に重なっており、LED表示灯19の周辺からの可視光が360度方向で受光される。   The LED indicator 19 has a plurality of LED light emitting elements 23 arranged at equal intervals in the circumferential direction so that visible light is emitted toward the periphery of the processing apparatus 10. The light emission ranges (effective angles) of the LED light emitting elements 23 partially overlap, and visible light is emitted around the LED indicator lamp 19 in a 360 degree direction. In the receiving unit 24, a plurality of LED light receiving elements 25 are arranged at equal intervals on the outer peripheral surface of the LED indicator lamp 19 so as to receive visible light from the periphery of the processing apparatus 10. The light receiving ranges (effective angles) of the LED light receiving elements 25 also partially overlap, and visible light from the periphery of the LED indicator lamp 19 is received in a 360 degree direction.

図4に示すように、工場等の屋内には複数の加工装置10が並んでおり、隣り合う加工装置10の間隔L1、すなわちLED表示灯19の間隔L1が可視光の到達距離L2よりも狭く設定されている。この場合、隣り合う加工装置10間でしか可視光が届かないため、各加工装置10では装置情報をそれぞれ隣の加工装置10にリレーするような通信手順で通信される。複数の加工装置10で装置情報が順番に伝達されるため、1台の加工装置10に装置情報を設定するだけで全ての加工装置10で装置情報を同期させることが可能になっている。なお、加工装置10による通信手順の詳細については後述する。   As shown in FIG. 4, a plurality of processing apparatuses 10 are lined up indoors in a factory or the like, and an interval L1 between adjacent processing apparatuses 10, that is, an interval L1 between LED indicator lights 19 is narrower than a visible light reach distance L2. Is set. In this case, since visible light reaches only between the adjacent processing apparatuses 10, each processing apparatus 10 is communicated by a communication procedure in which apparatus information is relayed to the adjacent processing apparatus 10. Since the apparatus information is transmitted in order by the plurality of processing apparatuses 10, it is possible to synchronize the apparatus information in all the processing apparatuses 10 simply by setting the apparatus information in one processing apparatus 10. Details of the communication procedure by the processing apparatus 10 will be described later.

このように、本実施の形態の加工装置10では、可視光の発光範囲の狭さを複数のLED発光素子23(図3参照)及びLED受光素子25(図3参照)によってカバーすると共に、可視光の通信距離の短さを複数の加工装置10によるリレー伝送でカバーしている。また、各加工装置10の上面にはLED表示灯19だけが突設されており、可視光通信の障害になるような物体が存在していない。よって、各LED表示灯19の外面のLED発光素子23から発光された可視光が遮られることがなくLED受光素子25で受光されて、隣り合う加工装置10間で良好に装置情報を送受信させることができる。   Thus, in the processing apparatus 10 of the present embodiment, the narrow range of visible light emission is covered by the plurality of LED light emitting elements 23 (see FIG. 3) and the LED light receiving elements 25 (see FIG. 3), and visible. The short communication distance of light is covered by relay transmission by a plurality of processing devices 10. Moreover, only the LED indicator lamp 19 protrudes from the upper surface of each processing apparatus 10, and there is no object which becomes an obstacle of visible light communication. Therefore, visible light emitted from the LED light emitting element 23 on the outer surface of each LED indicator lamp 19 is received by the LED light receiving element 25 without being blocked, and device information can be transmitted and received between the adjacent processing devices 10 satisfactorily. Can do.

続いて、図5から図7を参照して、可視光信号のデータ構造及び加工装置による通信手順について説明する。図5は、本実施の形態の可視光信号のデータ構造の一例を示す図である。図6は、本実施の形態の通信手順のシーケンス図の一例を示す図である。図7は、本実施の形態の通信中の可視光信号の一例を示す図である。なお、図6にはシーケンス図の隣に加工装置の配置構成の一例が記載されている。加工装置の配置構成では、直線で接続された加工装置同士が可視光通信可能なことを示している。また、下記の通信手順及びデータ構造はあくまでも一例を示すものであり、可視光通信で装置情報を送受信可能であれば他の通信手順及びデータ構造で実施されてもよい。   Next, the data structure of the visible light signal and the communication procedure by the processing device will be described with reference to FIGS. FIG. 5 is a diagram illustrating an example of a data structure of a visible light signal according to the present embodiment. FIG. 6 is a diagram illustrating an example of a sequence diagram of a communication procedure according to the present embodiment. FIG. 7 is a diagram illustrating an example of a visible light signal during communication according to the present embodiment. In FIG. 6, an example of the arrangement configuration of the processing apparatus is described next to the sequence diagram. The arrangement configuration of the processing devices indicates that the processing devices connected in a straight line can communicate with each other with visible light. Further, the following communication procedure and data structure are merely examples, and other communication procedures and data structures may be implemented as long as device information can be transmitted and received by visible light communication.

図5に示すように、装置情報は64〜1024バイト程度のデータパケットに分割して伝送される。各データパケットには複数のフィールドが設けられており、各フィールドには装置情報のデータの他に、パケット識別子、発信元ID、宛先ID、元装置ID、データID、パケットID、誤り訂正符号が設定されている。パケット識別子はパケットであることを示している。発信元IDは発信装置のIDを示し、宛先IDは宛先装置のIDを示している。元装置IDは、複数の装置のうち装置情報の最初の発信源となる装置のIDを示している。   As shown in FIG. 5, the device information is divided into data packets of about 64 to 1024 bytes and transmitted. Each data packet is provided with a plurality of fields. In addition to device information data, each field includes a packet identifier, a source ID, a destination ID, a source device ID, a data ID, a packet ID, and an error correction code. Is set. The packet identifier indicates a packet. The transmission source ID indicates the ID of the transmission device, and the destination ID indicates the ID of the destination device. The original device ID indicates the ID of a device that is the first transmission source of device information among a plurality of devices.

データIDは、データの識別情報を示しており、宛先装置に既に装置情報のデータが記憶されているか否かの確認に使用される。例えば、発信元装置から宛先装置に加工条件が送信される場合には、宛先装置ではデータIDから発信元装置と同じ加工条件が設定されているか否かが判断される。したがって、発信元装置から宛先装置に同じ加工条件が繰返し送信されることがない。なお、ホストコンピュータによる中央管理ではなく、装置毎にデータIDを管理しているため、元装置IDによってデータIDに一意性を確保している。誤り訂正符号は、データにエラーが生じた場合の訂正に使用される。   The data ID indicates data identification information, and is used for confirming whether or not device information data is already stored in the destination device. For example, when the processing condition is transmitted from the transmission source device to the destination device, it is determined whether or not the same processing condition as that of the transmission source device is set from the data ID in the destination device. Therefore, the same processing condition is not repeatedly transmitted from the transmission source device to the destination device. Since the data ID is managed for each device, not the central management by the host computer, the original device ID ensures the uniqueness of the data ID. The error correction code is used for correction when an error occurs in the data.

図6に示すように、加工装置10Aに加工条件が設定されると、加工装置10Aから周辺の加工装置10に向けて加工条件を含む送信パケットが同報送信される(ステップS01)。送信パケットには、加工条件のデータIDとして「001」、元装置IDとして加工装置10Aの装置ID「A」、宛先IDとして同報送信用の「共通ID」が設定されている(図7A参照)。以下では、元装置である加工装置10AのデータIDを「A001」として説明する。加工装置10Aからの可視光の到達距離内の加工装置10B、10CではデータID「A001」が受信されるが、可視光の到達距離外の加工装置10D、10EではデータID[A001]が受信されない。   As shown in FIG. 6, when the processing conditions are set in the processing apparatus 10A, a transmission packet including the processing conditions is broadcast from the processing apparatus 10A to the peripheral processing apparatus 10 (step S01). In the transmission packet, “001” is set as the data ID of the processing condition, the device ID “A” of the processing device 10A is set as the original device ID, and the “common ID” for broadcast transmission is set as the destination ID (see FIG. 7A). ). In the following description, it is assumed that the data ID of the processing apparatus 10A that is the original apparatus is “A001”. Data ID “A001” is received by processing devices 10B and 10C within the reachable range of visible light from processing device 10A, but data ID [A001] is not received by processing devices 10D and 10E outside the reachable range of visible light. .

次に、同報送信に対する応答として、加工装置10B、10Cから加工装置10Aに加工条件が受信済みか否かを示す応答パケットが返信される(ステップS02)。応答パケットには、加工条件が受信済みか否かをY/Nで示すフラグが追加されている。加工装置10B、10CのいずれにもデータID「A001」で示すデータが受信されていないため、加工装置10Aの加工条件が未設定であるとして、応答パケットには宛先IDとして加工装置Aの装置ID、フラグとして「N」が設定されている(図7B参照)。そして、加工装置10B、10Cから加工装置10Aに送受信済みではないことを示す応答パケットが送信される。   Next, as a response to the broadcast transmission, a response packet indicating whether or not the processing conditions have been received is returned from the processing devices 10B and 10C to the processing device 10A (step S02). In the response packet, a flag indicating whether or not the processing condition has been received is added by Y / N. Since none of the processing apparatuses 10B and 10C has received the data indicated by the data ID “A001”, it is assumed that the processing conditions of the processing apparatus 10A are not set, and the apparatus ID of the processing apparatus A is set as the destination ID in the response packet. “N” is set as the flag (see FIG. 7B). Then, a response packet indicating that transmission / reception has not been completed is transmitted from the processing apparatuses 10B and 10C to the processing apparatus 10A.

次に、加工装置10Aでは、同報送信に対する応答パケットを待って、加工装置10B、10Cから送受信済みでは無いという応答があれば、加工装置10Aから加工装置10B、10Cに加工条件のデータパケットが送信される(ステップS03)。データパケットには、宛先IDとして加工装置10B、10Cの装置ID「B」又は「C」、データとして「データA−n」が設定されている(図7C参照)。これにより、加工装置10Aから加工装置10B、10Cに向けて、「データA−01」から順番にデータが送信される。なお、加工装置10Aでは、周辺の加工装置10から送受信済みの応答があれば応答元にデータが送信されない。   Next, the processing apparatus 10A waits for a response packet for the broadcast transmission, and if there is a response indicating that transmission / reception has not been completed from the processing apparatuses 10B and 10C, the processing apparatus 10A sends a processing condition data packet to the processing apparatuses 10B and 10C. It is transmitted (step S03). In the data packet, the device ID “B” or “C” of the processing devices 10B and 10C is set as the destination ID, and “data An” is set as the data (see FIG. 7C). Thereby, data is transmitted in order from “data A-01” from the processing apparatus 10A to the processing apparatuses 10B and 10C. In the processing apparatus 10A, if there is a response transmitted / received from the peripheral processing apparatus 10, data is not transmitted to the response source.

次に、データ送信に対する応答として、加工装置10B、10Cから加工装置10Aにデータが受信済みか否かを示す応答パケットが返信される(ステップS04)。応答パケットには、データが受信済みか否かをOK/NGで示すフラグが追加されている。加工装置10B、10CにデータA−01が適切に受信されているため、データA−01が受信済みであるとして、応答パケットには宛先IDとして加工装置Aの装置ID、フラグとして「OK」が設定されている(図7D参照)。そして、加工装置10B、10Cから加工装置10Aに肯定応答を示す応答パケットが送信される。   Next, as a response to the data transmission, a response packet indicating whether or not data has been received is returned from the processing apparatuses 10B and 10C to the processing apparatus 10A (step S04). In the response packet, a flag indicating whether data has been received is indicated by OK / NG. Since the data A-01 is properly received by the processing apparatuses 10B and 10C, the data A-01 has been received, and the response packet includes the apparatus ID of the processing apparatus A as the destination ID and “OK” as the flag. Has been set (see FIG. 7D). Then, a response packet indicating an affirmative response is transmitted from the processing apparatuses 10B and 10C to the processing apparatus 10A.

次に、加工装置10Aでは、データ送信に対する応答パケットを待って、加工装置10B、10Cから受信済みであるという応答があれば、加工装置10Aから加工装置10B、10Cに次のデータパケットが送信される(ステップS05)。なお、加工装置10B、10Cから受信済みでは無いという応答があった場合、又は加工装置10B、10Cから応答パケットが無い場合には、加工装置10Aから加工装置10B、10Cにデータパケットが再送される。このデータの送受信処理が繰り返されることで、加工装置10B、10Cに加工装置10Aの加工条件が設定される。   Next, the processing apparatus 10A waits for a response packet for data transmission, and if there is a response indicating that it has been received from the processing apparatuses 10B and 10C, the next data packet is transmitted from the processing apparatus 10A to the processing apparatuses 10B and 10C. (Step S05). When there is a response that the processing apparatuses 10B and 10C have not received the response, or when there is no response packet from the processing apparatuses 10B and 10C, the data packet is retransmitted from the processing apparatus 10A to the processing apparatuses 10B and 10C. . By repeating this data transmission / reception process, the processing conditions of the processing apparatus 10A are set in the processing apparatuses 10B and 10C.

加工装置10B、10Cに加工装置10Aの加工条件が設定されると、再び加工装置10Aから周辺の加工装置10に向けて加工条件を含む送信パケットが同報送信される(ステップS06)。加工装置10B、10Cからのみパケット受信済みの応答パケットが返信されるため、加工装置10Aの加工条件のデータの送受信処理は開始されない。また、加工装置10Bにおいても、周辺の加工装置に向けて加工装置10Aの加工条件を含む送信パケットが同報送信される(ステップS07、図7E参照)。加工装置10Bでは、加工装置10A、10Cからのみパケット受信済みの応答パケットが返信され、加工装置10Dからはパケット受信済みでは無い応答パケットが返信される。   When the processing conditions of the processing apparatus 10A are set in the processing apparatuses 10B and 10C, a transmission packet including the processing conditions is again broadcast from the processing apparatus 10A to the peripheral processing apparatus 10 (step S06). Since a response packet that has been received is returned only from the processing apparatuses 10B and 10C, the transmission / reception process of the processing condition data of the processing apparatus 10A is not started. Also in the processing apparatus 10B, a transmission packet including the processing conditions of the processing apparatus 10A is broadcast to the peripheral processing apparatuses (see step S07, FIG. 7E). In the processing apparatus 10B, a response packet that has been received by the packet is returned only from the processing apparatuses 10A and 10C, and a response packet that has not been received by the processing apparatus 10D is returned.

さらに、加工装置10Cにおいても、周辺の加工装置に向けて加工装置10Aの加工条件を含む送信パケットが同報送信される(ステップS08)。加工装置10Cでは、加工装置10A、10Bからのみパケット受信済みの応答パケットが返信され、加工装置10Eからはパケット受信済みでは無い応答パケットが返信される。このため、加工装置10B、10D間で加工装置10Aの加工条件のデータの送受信処理が開始されると共に、加工装置10C、10E間で加工装置10Aの加工条件のデータの送受信処理が開始される(ステップS09)。この動作が繰り返されることで、全ての加工装置10A−10Eに同一の加工条件が設定される。   Further, also in the processing apparatus 10C, a transmission packet including the processing conditions of the processing apparatus 10A is broadcast to the peripheral processing apparatuses (step S08). In the processing apparatus 10C, a response packet that has been received by the packet is returned only from the processing apparatuses 10A and 10B, and a response packet that has not been received by the processing apparatus 10E is returned. Therefore, the processing condition data transmission / reception process of the processing apparatus 10A is started between the processing apparatuses 10B and 10D, and the processing condition data transmission / reception process of the processing apparatus 10A is started between the processing apparatuses 10C and 10E. Step S09). By repeating this operation, the same processing conditions are set in all the processing apparatuses 10A-10E.

以上のように、本実施の形態の加工装置10によれば、複数の加工装置10間で自動的に装置情報が送受信されるため、オペレータによる装置情報の入力負担を軽減することができる。このとき、複数の加工装置10間で可視光通信されているため、通信時に加工装置10の装置情報が屋外に漏洩することがない。また、複数の加工装置10間に配線が不要になることで、加工装置10の増設やレイアウト変更が容易になると共に、ケーブルによって美観を損なうことがない。このように、情報漏洩を起こすことなく、複数の加工装置10間で装置情報を同期させることができる。   As described above, according to the processing apparatus 10 of the present embodiment, the apparatus information is automatically transmitted and received between the plurality of processing apparatuses 10, so that the burden of input of the apparatus information by the operator can be reduced. At this time, since visible light communication is performed between the plurality of processing devices 10, the device information of the processing device 10 does not leak to the outdoors during communication. Further, since no wiring is required between the plurality of processing apparatuses 10, it is easy to increase the number of processing apparatuses 10 and change the layout, and the cable does not impair the aesthetic appearance. Thus, apparatus information can be synchronized among the plurality of processing apparatuses 10 without causing information leakage.

なお、本実施の形態では、加工装置10として切削装置を例示して説明したが、この構成に限定されない。加工装置は、被加工物を加工するものであればよく、例えば、研削装置、研磨装置、レーザー加工装置、エッチング装置でもよい。したがって、加工手段は、切削手段に限らず、研削手段、研磨手段、レーザー加工手段、エッチング加工手段のいずれでもよいし、チャックテーブルは、吸引チャック式のテーブルに限定されず、静電チャック式のテーブルでもよい。   In the present embodiment, the cutting apparatus is exemplified as the processing apparatus 10, but the present invention is not limited to this configuration. The processing apparatus may be any apparatus that processes a workpiece, and may be, for example, a grinding apparatus, a polishing apparatus, a laser processing apparatus, or an etching apparatus. Therefore, the processing means is not limited to the cutting means, and may be any of a grinding means, a polishing means, a laser processing means, and an etching processing means, and the chuck table is not limited to a suction chuck type table, but an electrostatic chuck type table. It can be a table.

また、本実施の形態では、入力手段としてタッチパネル14を例示して説明したが、この構成に限定されない。入力手段は、加工装置の制御手段に対して加工条件を入力設定可能であればよく、例えば、マウス、トラックボール等のポインティングデバイスでもよいし、キーボード等の文字入力デバイスでもよい。   In the present embodiment, the touch panel 14 has been described as an example of the input unit. However, the present invention is not limited to this configuration. The input unit only needs to be able to input and set processing conditions to the control unit of the processing apparatus. For example, the input unit may be a pointing device such as a mouse or a trackball, or may be a character input device such as a keyboard.

また、本実施の形態では、送信部22が複数のLED発光素子23を有する構成にしたが、この構成に限定されない。送信部は、装置情報を可視光で送信する構成であればよく、単一のLED発光素子を有していてもよい。   Moreover, in this Embodiment, although the transmission part 22 was set as the structure which has several LED light emitting element 23, it is not limited to this structure. The transmission part should just be the structure which transmits apparatus information by visible light, and may have a single LED light emitting element.

また、本実施の形態では、受信部24が複数のLED受光素子25を有する構成にしたが、この構成に限定されない。受信部は、送信部から可視光で送信された装置情報を受信する構成であればよく、単一のLED受光素子を有していてもよい。   Moreover, in this Embodiment, although the receiving part 24 was set as the structure which has several LED light receiving element 25, it is not limited to this structure. The reception unit may be configured to receive device information transmitted from the transmission unit with visible light, and may include a single LED light receiving element.

また、本実施の形態では、複数の加工装置10が装置情報をリレーする構成にしたが、この構成に限定されない。加工装置の台数が少ない場合には、隣り合う加工装置10間でのみ装置情報が送受信されてもよい。   Moreover, in this Embodiment, although the some processing apparatus 10 was set as the structure which relays apparatus information, it is not limited to this structure. When the number of processing devices is small, device information may be transmitted / received only between adjacent processing devices 10.

また、本実施の形態及び変形例を説明したが、本発明の他の実施の形態として、上記実施の形態及び変形例を全体的又は部分的に組み合わせたものでもよい。   Moreover, although this Embodiment and the modified example were demonstrated, what combined the said embodiment and modified example entirely or partially as another embodiment of this invention may be sufficient.

また、本発明の実施の形態は上記の実施の形態に限定されるものではなく、本発明の技術的思想の趣旨を逸脱しない範囲において様々に変更、置換、変形されてもよい。さらには、技術の進歩又は派生する別技術によって、本発明の技術的思想を別の仕方で実現することができれば、その方法を用いて実施されてもよい。したがって、特許請求の範囲は、本発明の技術的思想の範囲内に含まれ得る全ての実施形態をカバーしている。   The embodiments of the present invention are not limited to the above-described embodiments, and various changes, substitutions, and modifications may be made without departing from the spirit of the technical idea of the present invention. Furthermore, if the technical idea of the present invention can be realized in another way by technological advancement or another derived technique, the method may be used. Accordingly, the claims cover all embodiments that can be included within the scope of the technical idea of the present invention.

また、本実施の形態では、本発明を加工装置に適用した構成について説明したが、可視光通信によって装置情報を屋外に漏洩させることなく複数の装置間で装置情報を同期させることができる各種装置に適用することも可能である。   Moreover, although this Embodiment demonstrated the structure which applied this invention to the processing apparatus, the various apparatuses which can synchronize apparatus information between several apparatuses, without leaking apparatus information outdoors by visible light communication. It is also possible to apply to.

以上説明したように、本発明は、情報漏洩を起こすことなく複数の装置間で装置情報を送受信させることができるという効果を有し、特に、工場等に並んで設置される加工装置に有用である。   As described above, the present invention has an effect that apparatus information can be transmitted and received between a plurality of apparatuses without causing information leakage, and is particularly useful for a processing apparatus installed side by side in a factory or the like. is there.

10 加工装置
12 チャックテーブル
13 加工手段
14 タッチパネル(入力手段)
15 制御手段
16 記憶部
19 LED表示灯
24 受信部
W 被加工物
DESCRIPTION OF SYMBOLS 10 Processing apparatus 12 Chuck table 13 Processing means 14 Touch panel (input means)
DESCRIPTION OF SYMBOLS 15 Control means 16 Memory | storage part 19 LED indicator lamp 24 Receiving part W Workpiece

Claims (2)

被加工物を保持するチャックテーブルと、該チャックテーブルに保持された被加工物を加工する加工手段と、少なくとも該チャックテーブル及び該加工手段を制御する制御手段と、該制御手段に対し加工条件を入力設定する入力手段と、該加工条件を含む装置情報を記憶する記憶部と、可視光を発して可動状況を報知するLED表示灯と、を備える加工装置であって、
該制御手段は、該装置情報に対応して該LED表示灯を点滅させて可視光送信を行い、
他の加工装置の該LED表示灯の可視光が到達する位置に配設され、可視光送信で送信された該装置情報を受信する受信部を備え、
該装置情報を可視光通信により加工装置間で送受信することを特徴とする加工装置。
A chuck table for holding a workpiece, a processing means for processing the workpiece held on the chuck table, a control means for controlling at least the chuck table and the processing means, and processing conditions for the control means. A processing apparatus comprising: an input means for setting an input; a storage unit that stores apparatus information including the processing conditions; and an LED indicator that emits visible light to notify a movable state,
The control means performs visible light transmission by blinking the LED indicator lamp corresponding to the device information,
The LED indicator lamp of another processing apparatus is disposed at a position where the visible light reaches, and includes a receiving unit that receives the apparatus information transmitted by visible light transmission,
A processing apparatus which transmits and receives the apparatus information between processing apparatuses by visible light communication.
隣接する加工装置間をリレーして複数の該加工装置間で該装置情報を送受信することを特徴とする請求項1記載の加工装置。   The processing apparatus according to claim 1, wherein the processing information is transmitted and received between a plurality of processing apparatuses by relaying between adjacent processing apparatuses.
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Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001022852A (en) * 1999-07-09 2001-01-26 Akita Electronics Co Ltd Facility operation management system
US20020065631A1 (en) * 2000-10-27 2002-05-30 Michael Loechner Field device configured for wireless data communication
JP2011025358A (en) * 2009-07-24 2011-02-10 Olympus Corp Production system
JP2011025359A (en) * 2009-07-24 2011-02-10 Olympus Corp Production system
JP2014116923A (en) * 2012-06-15 2014-06-26 Outstanding Technology:Kk Spatial optical transmission device
JP2014235443A (en) * 2013-05-30 2014-12-15 株式会社ディスコ Processing device
JP2015179339A (en) * 2014-03-18 2015-10-08 株式会社ディスコ Processing device, processing device system, and information collection system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030101575A1 (en) * 2001-12-05 2003-06-05 Green Alan E. Manufacturing system incorporating telemetry and/or remote control
JP3827082B2 (en) * 2002-10-24 2006-09-27 株式会社中川研究所 Broadcast system, light bulb, lighting device
JP2006318166A (en) * 2005-05-12 2006-11-24 Hitachi Communication Technologies Ltd Parts assembly instruction device
JP4900191B2 (en) * 2007-10-22 2012-03-21 パナソニック株式会社 Electronic component mounting system and facility arrangement information generation method
JP5325526B2 (en) * 2008-10-17 2013-10-23 三星電子株式会社 Visible light communication system and visible light communication method
EP2645699B1 (en) * 2010-11-25 2020-08-05 Panasonic Intellectual Property Corporation of America Communication device
KR20120073442A (en) * 2010-12-27 2012-07-05 서울과학기술대학교 산학협력단 The shoulder management system using led communication

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001022852A (en) * 1999-07-09 2001-01-26 Akita Electronics Co Ltd Facility operation management system
US20020065631A1 (en) * 2000-10-27 2002-05-30 Michael Loechner Field device configured for wireless data communication
JP2011025358A (en) * 2009-07-24 2011-02-10 Olympus Corp Production system
JP2011025359A (en) * 2009-07-24 2011-02-10 Olympus Corp Production system
JP2014116923A (en) * 2012-06-15 2014-06-26 Outstanding Technology:Kk Spatial optical transmission device
JP2014235443A (en) * 2013-05-30 2014-12-15 株式会社ディスコ Processing device
JP2015179339A (en) * 2014-03-18 2015-10-08 株式会社ディスコ Processing device, processing device system, and information collection system

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