JP2018058265A - Letterpress reversing offset printing machine and manufacturing method of printed matter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a letterpress reversing offset printing member in which adhesion of a foreign matter due to release electrification of an ink film formation base material during printing is prevented from occurring, a manufacturing method thereof, and a manufacturing method of a printed matter which suppresses high definition pattern defects derived from the foreign matter by a letterpress reversing offset printing machine using the member.SOLUTION: In a letterpress reversing offset printing machine including: means for forming an ink film 43 on an ink film formation base material 42 wound to a plate cylinder 47; removal means for removing an unnecessary portion of the ink film from the ink film formation base material; and transfer means which transfers a necessary portion of the ink film left on the ink film formation base material to a printing object substrate 45, a conductive cushion layer 40 is interposed between the plate cylinder and the ink film formation base material.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a reversal offset printing method, and more particularly to a relief reversal offset printing machine, and further to a method for producing a printed matter using the same.

  In recent years, in order to cope with cost reduction and miniaturization of electronic components, it has been attempted to form a pattern such as a wiring or an insulating layer included in the electronic component by a printing method.

  Among the printing methods, the reverse offset printing method can be cited as a candidate capable of forming a fine pattern (see, for example, Patent Document 1).

  FIG. 4 shows a schematic diagram of the main part of the apparatus used in the reverse offset printing method. The white arrow in FIG. 4 indicates the direction of movement or rotation. 4 shows a cylindrical ink film forming substrate 42, an ink supply means 41 (see FIG. 4A) for supplying ink to the ink film forming substrate 42 to form an ink film 43, and an ink film forming substrate. The removal plate 44 (see FIG. 4B) for removing the unnecessary portion 43b from the ink film 43 formed on the material 42 and the main portion 43a remaining on the ink film forming substrate are transferred to form a printed matter. The printing substrate 45, the removal plate 44, and the surface plate 46 which conveys the printing substrate 45 to the position suitable for printing are shown (refer FIG.4 (c)). The ink film forming substrate 42 is usually treated so that the ink film is easily peeled off, and, for example, silicone rubber is used. The removal plate 44 uses a plate-shaped glass plate and is placed on the surface plate 46 by suction (see FIG. 4B).

The printing process will be described step by step with reference to FIG.
First, ink is applied from the ink supply means 41 onto the ink film forming substrate 42 to form the ink film 43 (FIG. 4A). At this time, the ink is placed in a pre-dried state on the ink film-forming substrate and loses some solvent to form an ink film. A cushion layer 40 is provided below the ink film forming substrate 42.
Next, the removal plate 44 having a predetermined shape is brought into contact with the ink film 43, and the unnecessary portion 43b of the ink film 43 is transferred to the removal plate 44 to be removed from the ink film forming substrate 42 (FIG. 4B). )). Here, as the removal plate 44, a relief plate is used in which a portion corresponding to the main portion 43a transferred as an ink pattern to the substrate to be printed is a concave portion and a portion corresponding to the unnecessary portion 43b not transferred is a convex portion.
Next, the principal part 43a of the ink film 43 remaining on the ink film forming substrate 42 can be transferred to the substrate 45 to be printed to obtain a printed material (FIG. 4C).

  As an example of forming a pattern by such a relief reversal offset printing method, it has been proposed to produce an electromagnetic wave shield by printing using conductive ink on a substrate (see, for example, Patent Document 2). In addition to this, the production of printed matter on which various patterns are printed has been studied. In particular, it is required to form a pattern in which a capacitor electrode, which is a solid pattern with a large area, and a thin wiring pattern with a narrow interval are mixed on one printed surface.

When such a pattern is formed using a conventional relief printing offset printing press, it is difficult to avoid the occurrence of pattern defects due to foreign matters.
It has been clarified that the problem that such a pattern defect caused by a foreign substance occurs is caused by the adhesion of the foreign substance due to peeling charging of the ink film forming substrate during printing. Therefore, a letterpress reversal offset printing machine that solves this problem has been awaited.

Japanese Patent Publication No. 60-29358 JP 2005-175061 A

  In view of the above circumstances, the present invention is a relief printing offset printing machine in which foreign matter does not adhere due to peeling charging of an ink film-forming substrate during printing, and production of printed matter in which foreign-derived pattern defects are suppressed using the same. It is an object to provide a method.

As means for solving the above-mentioned problems, the invention according to claim 1 of the present invention comprises means for forming an ink film on an ink film forming substrate wound around a plate cylinder,
Removing means for removing unnecessary portions of the ink film from the ink film forming substrate;
In a letterpress reversal offset printing machine comprising a transfer means for transferring the main part of the ink film remaining on the ink film forming substrate to the substrate to be printed,
A letterpress reversal offset printing machine characterized in that a conductive cushion layer is interposed between the plate cylinder and the ink film forming substrate.

  The invention according to claim 2 is characterized in that the conductive material A is coated on the back and side surfaces of the ink film-forming substrate and the outer periphery of the printing region. This is a reverse offset printing machine.

  The invention according to claim 3 is the letterpress reverse offset printing machine according to claim 1 or 2, wherein the conductive cushion layer is coated with a conductive material B.

  According to a fourth aspect of the present invention, the conductive material A is a composite of metal or ITO (indium tin composite oxide), IZO (indium zinc composite oxide), tin oxide, zinc oxide, indium oxide, and aluminum oxide. The letterpress reverse offset printing press according to claim 2, which is an inorganic oxide material or an organic material obtained by combining any one of oxides or two or more oxides.

  The conductive material B is a metal, or ITO (indium tin composite oxide), IZO (indium zinc composite oxide), tin oxide, zinc oxide, indium oxide, and aluminum oxide. 4. The relief printing press according to claim 3, which is an inorganic oxide material or an organic material obtained by combining any one or two or more of complex oxides. 5.

  The invention described in claim 6 is a method for producing a printed matter, characterized in that the relief printing press according to any one of claims 1 to 5 is used.

  According to the relief reversing offset printing machine according to claims 1 to 5, it is possible to suppress the peeling charging of the ink film forming substrate during printing, and therefore it is possible to reduce the adhesion of foreign matter.

According to the method for producing a printed matter according to claim 6, by using the relief reversal offset printing machine of the present invention, it is possible to suppress the peeling charge of the ink film forming substrate during printing, and to reduce the adhesion of foreign matter. Therefore, a printed matter with few defects can be manufactured.

It is sectional drawing which shows an example of the relief printing for relief printing reverse offset printing of this invention. (A) is a top view which shows the other example of the relief printing for letterpress reverse offset printing of this invention, (b) is sectional drawing in the AB line of the figure shown by (a). It is a schematic diagram which shows an example of the manufacturing process of the relief printing plate of this invention. It is a schematic diagram of the process explaining the reverse offset printing method.

<Typographic reversal offset printer>
The letterpress reverse offset printing machine of the present invention will be described.
The relief reversal offset printing machine of the present invention is a means for forming an ink film on an ink film forming substrate wound around a plate cylinder, and a removing means for removing unnecessary portions of the ink film from the ink film forming substrate. A letterpress reversal offset printing machine comprising transfer means for transferring a main part of an ink film remaining on an ink film forming substrate to a substrate to be printed.

  It is characterized in that a conductive cushion layer is interposed between the plate cylinder and the ink film forming substrate. With such a configuration, in the step of removing unnecessary portions of the ink film on the ink film forming substrate, peeling charging occurs, and the ink film forming substrate is charged. Further, in the step of transferring the main part of the ink film remaining on the ink film forming substrate to the substrate to be printed, peeling electrification occurs and the ink film forming substrate is charged.

  However, in the relief reversal offset printing machine of the present invention, when an ink film forming base material is wound around a metal plate cylinder and installed, a conductive cushion layer is interposed between them, so that peeling charging Thus, static electricity generated on the ink film forming substrate can escape to the metal plate cylinder through the conductive cushion layer.

  For this reason, the ink film forming substrate is not charged, and dust and foreign matter existing in the surrounding environment are suppressed from adhering to the ink film forming substrate due to electrical electrostatic attraction.

<Letterpress>
The relief printing for letterpress reverse offset printing of the present invention will be described with reference to FIG.
The material of the relief plate 10 is preferably glass because it is robust and easy to process.

  The relief plate 10 shown in FIG. 1 is formed such that a portion corresponding to the unnecessary portion becomes a convex portion (relief pattern) in order to remove the unnecessary portion from the ink film on the ink film forming substrate and leave the essential portion. ing. Referring to FIG. 1, in the present invention, the highest part of the surface of the relief plate 10 is the convex top 14 and the lowest part is the concave bottom 16, and the side of the convex or the side of the concave is the convex. Let it be side surface 15. The difference between the convex top 14 and the concave bottom 16 is the plate depth d, and the allowable range is selected depending on the printed matter to be manufactured. A space surrounded by the convex side surface 15 and the concave bottom surface 16 is a concave portion 17.

<Method for producing letterpress>
An example of the manufacturing process of the relief plate used as the removal plate will be described with reference to FIG.
First, the mask 32 which consists of a desired pattern is formed in the position corresponding to the convex part top part 14 (refer FIG. 1) on the surface of the relief base 31 (FIG. 3 (a)). The mask 32 has a role of protecting the surface of the base material in the subsequent relief forming process, and as the material, for example, a metal thin film can be used. In the case of a metal thin film, a mask 32 having a desired pattern can be formed by forming a resist pattern so as to cover a necessary portion after vapor deposition and performing etching under conditions that remove only the metal thin film.

  By removing the region of the relief-printed base material 33 thus masked, which is not covered with the mask 32, the concave portion 18 is formed, and a relief 34 is formed (FIG. 3B). The formation method of the relief 34 can be suitably selected according to the relief base material 31 to be used. Examples thereof include blasting methods such as sand blasting and wet blasting, FIB (focused ion beam) processing, nanoimprinting method, dry etching method, wet etching method, and the like.

  Next, in some cases, with respect to the convex side surface 15 and the concave bottom surface 16 (see FIG. 1) newly formed by removing the area not covered with the mask 32 of the masked relief base material 33, An ink repellent treatment 35 may be performed (FIG. 3C). An ink repellent surface 36 is formed in the concave portion 18 of the relief printing plate. The ink repellent surface 36 can be implemented, for example, by forming a silane coupling agent monomolecular film.

  Further, although the surface treatment agent selected for the ink repellent treatment 35 varies depending on the ink used, it is preferable to use a silane coupling agent containing a fluorine element or a siloxane group having high water repellency and oil repellency. Examples of compounds that can be preferably used include long-chain fluoroalkylsilanes, hydrolyzable group-containing siloxanes, fluoroether group-containing polymers, and fluoroalkyl group-containing oligomers.

  Examples of the method of performing the ink repellency treatment on the convex portion side surface 15 and the concave portion bottom surface 16 include a method of chemically bonding and fixing the above-described silane coupling agent to the surface of the relief plate. For example, a known glass surface treatment method using a silane coupling agent can be used. That is, a silane coupling agent is dissolved in water, acetic acid water, a water-alcohol mixed solution, or alcohol to prepare a coupling agent solution. Next, the silane coupling agent solution is applied to the glass surface using a known coating method such as spin coating, roll coating, and applicator. Finally, the silane coupling agent can be fixed to a relief surface such as glass by drying by heating and removing the solvent. At this time, by heat drying, the silane coupling agent and the glass surface are strongly bonded by oligomerization, so that the surface treatment is extremely resistant.

  After the ink-repellent treatment, the unreacted silane coupling agent adhering to the mask 32 is washed and removed, and finally the metal thin film on the top 14 of the convex portion is removed by etching to correspond to the main part (pattern formation position). The concave plate 18 (the side surface of the convex portion and the bottom surface of the concave portion) is subjected to the ink repellent treatment 35 to obtain the relief plate 30 having the ink repellent treated surface 36 formed (FIG. 3D).

<Method for producing printed matter>
A method for producing a printed matter using a relief reversal offset printing machine using the relief plate thus obtained will be described with reference to FIG. Note that description of what has already been described is omitted. The relief plate is used as a removal plate 44 (see FIG. 4B) of the relief reverse printing method.

Examples of the material of the ink film forming substrate 42 used in the letterpress reverse offset printing machine include the formation of an ink film, the removal of the ink pattern of the non-pattern part (unnecessary part 43b) by the letterpress, and the pattern part (main part) on the substrate 45 to be printed. 43a) A material capable of transferring an ink film is used. As the material of the ink film forming substrate 42, a material with little deformation is preferable, but a certain degree of flexibility is required. As such a material, silicone elastomer, butyl rubber, ethylene propylene rubber and the like can be used. Further, in order to adjust the wettability of the surface of the ink film forming substrate 42, the surface of the ink film forming substrate 42 may be subjected to a surface treatment such as application of a fluororesin and silicone, plasma treatment, or UV ozone cleaning treatment. Since such an ink film forming member 42 is usually supplied as a flexible plate, it is used by being wound around a cylindrical plate cylinder 47 (see FIG. 4) or by being fixed to a strong flat plate. Can be.

  Separation of the ink film forming substrate 42 during printing is performed by coating the back and side surfaces of the ink film forming substrate 42 used in the relief printing press of the present invention and the outer periphery of the printing region with a conductive material. Charge can be suppressed. The outer peripheral portion of the printing area refers to an outer area of the ink film coating area on the surface of the ink film forming substrate 42.

  In the ink film forming base material 42 used in the relief reversal offset printing machine of the present invention, the cushion layer 40 for installing the ink film forming base material 42 on the plate cylinder 47 and the plate cylinder 47 are electrically connected by a conductive material. Thus, since static electricity generated during printing can be released from the ink film forming base material 42 to the plate cylinder 47 through the cushion layer, charging of the ink film forming base material 42 can be suppressed.

  Examples of the conductive material that conducts the ink film-forming base material 42, the cushion layer 40 on which the ink film-forming base material 42 is installed on the plate cylinder, and the plate cylinder 47 include metals and conductive inorganic oxide materials, Organic materials etc. are mentioned. Examples of the metal include copper, titanium, aluminum, gold, platinum, chromium, and nickel. Examples of the inorganic oxide material include ITO (indium tin composite oxide) and IZO (indium zinc composite oxide). , Tin oxide, zinc oxide, indium oxide, aluminum oxide composite oxide, etc., and the conductive organic material is classified into, for example, a conductive polymer such as a charge transfer complex, a conductive organic low-molecular compound, and polythiophene. . In addition, as a coating method for the conductive material, a dry film forming method such as a vacuum deposition method, a sputtering method, or an ion plating method, or a coating method such as a spin coater, a bar coater, a roll coater, a die coater, or a gravure coater is used. .

  The ink used in the letterpress reversal offset printing machine can be adjusted according to the type of printed matter to be produced, and various additions to the fine metal particle dispersions such as gold, silver, copper, nickel, platinum, palladium, and rhodium as required Examples include, but are not limited to, conductive ink with an additive, ink in which an organic electroluminescence (EL) material is dissolved or dispersed in an organic solvent, and a pigment dispersion for a color filter. In consideration of swelling of the ink film-forming base material, it is preferable to adjust using water or an alcohol solvent.

  As the ink supply means 41 on the ink film forming substrate 42, a uniform ink film may be formed, and bar coating, die coating, cap coating, spin coating, slit coating, and the like can be used. It is not limited.

  The substrate to be printed 45 on which the pattern is formed by transferring the ink film can be appropriately selected according to the target printed matter. In the case of manufacturing electronic components, usually, polyethylene terephthalate (PET), polyimide, polyethersulfone (PES), polyethylene naphthalate (PEN), flexible plastic materials such as polycarbonate, glass substrates such as quartz, and silicon wafers are listed. be able to. It is also possible to select a flexible base material such as a film according to the environment in which the printed material is used. In this case, continuous printing is performed using a long base material to improve production efficiency. Is preferred.

  After the unnecessary ink film is removed from the ink film forming substrate 42, the ink film held by the convex portion top portion 14 (see FIG. 1) of the relief plate 10 as a removal plate is washed by a washing step. Examples of the method for cleaning the relief plate 10 include a method of cleaning with a chemical solution or an organic solvent, and a method of removing the ink film by pressing it against the adhesive film carrying the adhesive.

  Examples of chemicals that can be used for washing include sulfuric acid and hydrochloric acid. Examples of the organic solvent include toluene. What is necessary is just to select suitably by the composition of an ink film, and should just select the chemical | medical solution which can melt | dissolve or remove an ink film easily and does not corrode the material which comprises the relief plate 10. FIG. Vibration can also be applied by ultrasonic waves during cleaning.

  Moreover, as an adhesive film which can be used for washing, a commercially available adhesive film can be used. For example, an ethylene vinyl acetate copolymer is used as a base film, and an adhesive is applied by applying an acrylic adhesive. The applied adhesive film can be used. It is only necessary that the adhesive does not transfer to the relief 10 side during cleaning. Washing with an adhesive film can be used for immediate printing after washing, and is particularly suitable for printing continuously using the same letterpress. Therefore, the adhesive film is also supplied in a roll form, and a necessary portion may be pressed against the relief plate 10 according to use, and the used film may be wound up.

  As a pattern to be printed, for example, an electrode provided in a thin film transistor substrate, a capacitor electrode, wiring, etc., a colored layer provided in a color filter, an electrode provided in an organic electroluminescence element, an organic electroluminescence layer, and a wiring provided in a printed wiring board In the case of an element-embedded printed wiring board, passive elements / active elements such as capacitor electrodes, dielectric layers, resistance element electrodes, resistors, inductors, and transistor components can be used.

  Next, the Example about manufacture of the printed matter using the letterpress reverse offset printing machine of this invention is described.

<Example 1>
As a material for the relief printing plate, a glass plate having a size of 100 mm × 100 mm and a thickness of 0.7 mm was used. A chromium thin film was deposited on the front and back surfaces of this glass plate to a thickness of 50 nm by vapor deposition. A resist pattern was formed on the chromium thin film by a photolithography method using a positive resist, and the exposed chromium thin film was etched. Thereafter, the resist was peeled off to obtain a glass plate on which a chromium pattern was formed.

  The pattern formed here is 10 units × 10 units in a 100 mm square region at the center of the glass plate, with the pattern sparse portion 21 and the pattern dense portion 22 schematically shown in FIG. 100 units are arranged. The pattern corresponding to the pattern sparse portion 21 is a square of 250 μm × 250 μm, and the pattern corresponding to the pattern dense portion 22 is a rectangle of 140 μm × 250 μm. The line / space width of the pattern dense portion 22 is 5 μm / 5 μm.

  Using this chrome thin film as a mask, concavo-convex portions were formed by glass etching using hydrofluoric acid so that the depth of the concave portions became 5 μm, and finally, the chrome thin film was removed by etching to produce a relief plate for letterpress reverse offset printing.

(ink)
As an ink, polyethylene oxide (average molecular weight 10,000, manufactured by Aldrich) is added to an aqueous silver particle dispersion (average particle size 20 nm, manufactured by Sumitomo Electric), and (polyethylene oxide / silver particles / water) = (1/8/31). A conductive ink was prepared by dissolving so as to have a weight ratio.

(Method for producing printed matter)
The printed material according to this example was manufactured as follows.
First, a two-component silicone rubber manufactured by Toshiba GE (manufactured by GE Toshiba Silicone Co., Ltd .: trade name TSE3455T) was molded to a thickness of 2 mm and a size of 150 mm × 120 mm, and then the back surface, side surface, and printing of the ink film forming substrate. An ITO film was formed on the outer periphery of the region by sputtering.

  Similarly, this ink film forming substrate was wound around a plate cylinder to form a cylindrical shape by using a cushion material in which ITO was formed by sputtering. On the other hand, after applying the conductive ink on the ink film-forming substrate with a bar coater, it was dried at room temperature for 3 minutes to form a film of conductive ink on the ink film-forming substrate.

  Next, the letterpress was brought into close contact with the ink film on the ink film-forming substrate and then peeled to remove the non-patterned ink film. Next, the ink film-forming substrate on which the ink film of the pattern portion is left and the soda-lime glass substrate (printed substrate) having a thickness of 0.7 mm and a size of 100 mm × 100 mm are adhered and then peeled off. The ink film on the ink film forming substrate was transferred to the substrate to be printed. Similarly, after continuous printing of 5 sheets with the same letterpress, the substrates to be printed were heat-treated at 200 ° C. for 30 minutes to form printed matter having a conductive pattern. When the obtained electroconductive pattern was observed with the optical microscope, the pattern defect derived from the foreign material was not seen.

<Example 2>
A relief printing for letterpress reversal offset printing was produced in the same manner as in Example 1 except that the color filter color ink adjusted as shown below was used as the ink, and a printed material was produced using this.

<Colored ink>
First, a red pigment dispersion was prepared with the following composition.
[Red pigment dispersion]
-Red pigment C.I. I. Pigment Red 254 (“Ilgar For Red B-CF” manufactured by Ciba Specialty Chemicals) 18 parts by weight C.I. I. Pigment Red 177 ("Chromophthal Red A2B" manufactured by Ciba Specialty Chemicals) ... 2 parts by weight • Acrylic varnish (solid content 20%) ... 108 parts by weight

[Red coloring ink]
A mixture having the following composition was stirred and mixed so as to be uniform, and then filtered through a 5 μm filter to obtain a red colored ink.
Red pigment dispersion: 100 parts by weight Methylated methylol melamine (manufactured by Sanyo Chemical Industries, Ltd .: MW-30) 20 parts by weight Leveling agent (manufactured by Dainippon Ink & Chemicals, Inc .: MegaFuck F-483SF) 1 part by weight, propylene glycol monomethyl ether ... 85 parts by weight, propylene glycol monomethyl ether acetate ... 45 parts by weight

  The red colored ink thus adjusted was applied to the ink film forming substrate in the same manner as in Example 1, and after removing unnecessary portions, the ink pattern was obtained on the glass substrate by transferring to the substrate to be printed. . The printed matter thus obtained did not show pattern defects due to foreign matters.

<Comparative example>
In addition to the ink film forming base material and the cushion layer on which the ink film forming base material is installed on the plate cylinder, except that the ITO film was not formed by the sputtering method, a relief printing plate for letterpress reverse offset printing was produced in the same manner as in Example 1. The production of printed materials was performed. When the conductive pattern of the obtained printed matter was observed with an optical microscope, pattern defects derived from foreign matters were remarkable, and there were printing defects in some places.

The relief reversal offset printing member of the present invention can reduce printing defects due to foreign matter,
Since a fine pattern can be continuously formed by printing, it can be applied when a device such as a thin film transistor, a thin film transistor array, or a color filter is manufactured as a printed matter.

10, 20, 30: Letterpress 11: Ink repellent surface 14: Convex top 15: Convex side 16: Concave bottom 17, 18: Concave 21: Pattern sparse 22: Pattern dense 31: Letter base 32: Mask 33: Masked letterpress base material 34: Relief 35: Ink repellent treatment 36: Ink repellent surface 40: Cushion layer 41: Ink supply means 42: Ink film forming base material 43: Ink film 43a: Essential part 43b of ink film : Unnecessary portion 44 of ink film: Removal plate (letter plate)
45: Printed substrate 46: Surface plate 47: Plate cylinder d: Plate depth

Claims (6)

Means for forming an ink film on the ink film forming substrate wound around the plate cylinder;
Removing means for removing unnecessary portions of the ink film from the ink film forming substrate;
In a letterpress reversal offset printing machine comprising a transfer means for transferring the main part of the ink film remaining on the ink film forming substrate to the substrate to be printed,
A letterpress reverse offset printing machine characterized in that a conductive cushion layer is interposed between a plate cylinder and an ink film forming substrate.   2. The letterpress reverse offset printing press according to claim 1, wherein the conductive material A is coated on the back surface and side surfaces of the ink film forming substrate and the outer periphery of the printing region.   The letterpress reverse offset printing machine according to claim 1 or 2, wherein the conductive cushion layer is coated with a conductive material B.   The conductive material A is a metal, or any one or two of ITO (indium tin composite oxide), IZO (indium zinc composite oxide), tin oxide, zinc oxide, indium oxide, and aluminum oxide composite oxide. The letterpress reversal offset printing machine according to claim 2, which is an inorganic oxide material or an organic material combining the above.   The conductive material B is a metal, or any one of ITO (indium tin composite oxide), IZO (indium zinc composite oxide), tin oxide, zinc oxide, indium oxide, and aluminum oxide composite oxide, or 2 The letterpress reverse offset printing machine according to claim 3, which is an inorganic oxide material or an organic material combining at least seeds.   A method for producing a printed matter, wherein the relief printing press according to any one of claims 1 to 5 is used.