JP2018058140A - Flat surface grinding abrasive wheel - Google Patents
Flat surface grinding abrasive wheel Download PDFInfo
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- JP2018058140A JP2018058140A JP2016196286A JP2016196286A JP2018058140A JP 2018058140 A JP2018058140 A JP 2018058140A JP 2016196286 A JP2016196286 A JP 2016196286A JP 2016196286 A JP2016196286 A JP 2016196286A JP 2018058140 A JP2018058140 A JP 2018058140A
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- outer peripheral
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- 230000002093 peripheral effect Effects 0.000 claims abstract description 21
- 239000006061 abrasive grain Substances 0.000 claims abstract description 20
- 238000007747 plating Methods 0.000 claims description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 12
- 239000002245 particle Substances 0.000 abstract description 7
- 239000011248 coating agent Substances 0.000 abstract 1
- 238000000576 coating method Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 7
- 239000002699 waste material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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- Polishing Bodies And Polishing Tools (AREA)
- Dicing (AREA)
Abstract
Description
本発明は、ウェーハ等の被加工物を研削する際に用いられる平面研削砥石に関する。 The present invention relates to a surface grinding wheel used when grinding a workpiece such as a wafer.
近年、小型軽量なデバイスチップを実現するために、シリコン等の材料でなるウェーハを薄く加工する機会が増えている。ＩＣ等のデバイスが表面側に形成されたウェーハを所望の厚みまで薄くするには、例えば、このウェーハの裏面側を研削すれば良い。研削後のウェーハは、分割予定ラインに沿って各デバイスに対応する複数のデバイスチップへと分割される。 In recent years, in order to realize a small and light device chip, there are increasing opportunities to thinly process a wafer made of a material such as silicon. In order to thin a wafer on which a device such as an IC is formed on the front side to a desired thickness, for example, the back side of the wafer may be ground. The ground wafer is divided into a plurality of device chips corresponding to each device along the division line.
ウェーハのような被加工物を研削する方法の一つに、環状の基台と、基台の外周面を被覆するメッキ層によって砥粒が固定された砥石部と、を備え、ある程度の幅を持つ環状の研削砥石（以下、平面研削砥石）を用いる方法が知られている（例えば、特許文献１及び特許文献２参照）。この方法では、平面研削砥石を被加工物の被研削面に平行な回転軸の周りに回転させて、外周の砥石部を被研削面に接触させる。 One method of grinding a workpiece such as a wafer includes an annular base and a grindstone part in which abrasive grains are fixed by a plating layer covering the outer peripheral surface of the base, and has a certain width. A method using an annular grinding wheel (hereinafter referred to as a “surface grinding wheel”) is known (see, for example, Patent Document 1 and Patent Document 2). In this method, the surface grinding wheel is rotated around a rotation axis parallel to the surface to be ground of the workpiece, and the outer peripheral grinding wheel portion is brought into contact with the surface to be ground.
ところが、上述の方法では、その原理上、研削の際に砥石部に加わる圧力が大きくなり易い。そのため、研削によって発生する研削屑が平面研削砥石の外部に排出されなかったり、十分な量の研削水を砥石部の加工点に供給できなかったりすると、砥粒が目つぶれし易くなり、研削の性能を維持できなかった。 However, in the above-described method, the pressure applied to the grindstone portion during grinding tends to increase due to its principle. Therefore, if the grinding waste generated by grinding is not discharged to the outside of the surface grinding wheel, or if a sufficient amount of grinding water cannot be supplied to the processing point of the grinding wheel, the abrasive grains are easily clogged and grinding The performance could not be maintained.
本発明はかかる問題点に鑑みてなされたものであり、その目的とするところは、研削屑が外部に排出され易く、加工点に十分な量の研削水を供給できる平面研削砥石を提供することである。 The present invention has been made in view of such a problem, and an object of the present invention is to provide a surface grinding wheel capable of supplying a sufficient amount of grinding water to a processing point because grinding scraps are easily discharged to the outside. It is.
本発明の一態様によれば、スピンドルに装着される環状の基台と、該基台の外周面を被覆するメッキ層によって砥粒が固定された砥石部と、を備え、該砥石部の外周面には、該基台の周方向に沿って連続する螺旋状の溝が設けられている平面研削砥石が提供される。 According to one aspect of the present invention, an annular base mounted on a spindle, and a grindstone portion in which abrasive grains are fixed by a plating layer covering the outer peripheral surface of the base, the outer periphery of the grindstone portion is provided. The surface is provided with a surface grinding wheel provided with a spiral groove continuous along the circumferential direction of the base.
本発明の一態様において、前記溝は、砥粒の粒径の１．５倍〜３倍の幅及び深さを有することが好ましい。 1 aspect of this invention WHEREIN: It is preferable that the said groove | channel has a width | variety and depth 1.5 times-3 times the particle size of an abrasive grain.
本発明の一態様に係る平面研削砥石では、基台の周方向に沿って連続する螺旋状の溝が砥石部の外周面に設けられているので、被加工物の研削によって発生した研削屑は、平面研削砥石の回転と共に螺旋状の溝に沿って外部に排出される。また、平面研削砥石の回転と共に螺旋状の溝に沿って研削水が流れるので、十分な量の研削水を加工点に供給できる。 In the surface grinding grindstone according to one aspect of the present invention, since the spiral groove continuous along the circumferential direction of the base is provided on the outer circumferential surface of the grindstone portion, the grinding waste generated by grinding the workpiece is Then, along with the rotation of the surface grinding wheel, it is discharged to the outside along the spiral groove. Further, since the grinding water flows along the spiral groove along with the rotation of the surface grinding wheel, a sufficient amount of grinding water can be supplied to the processing point.
添付図面を参照して、本発明の一態様に係る実施形態について説明する。図１は、本実施形態の平面研削砥石が装着される研削ユニットの構成例を模式的に示す斜視図である。図１に示すように、研削ユニット２は、移動機構（不図示）によって支持される筒状のスピンドルハウジング４を備えている。 Embodiments according to one aspect of the present invention will be described with reference to the accompanying drawings. FIG. 1 is a perspective view schematically showing a configuration example of a grinding unit to which the surface grinding wheel of this embodiment is mounted. As shown in FIG. 1, the grinding unit 2 includes a cylindrical spindle housing 4 supported by a moving mechanism (not shown).
スピンドルハウジング４の内部には、前後方向（Ｙ軸方向）に対して平行な回転軸となるスピンドル６が収容されている。スピンドル６の一端側（先端側）は、スピンドルハウジング４の前方で露出している。一方、露出していないスピンドル６の他端側（基端側）には、モータ等の回転駆動源（不図示）が連結されている。 A spindle 6 serving as a rotation axis parallel to the front-rear direction (Y-axis direction) is accommodated in the spindle housing 4. One end side (front end side) of the spindle 6 is exposed in front of the spindle housing 4. On the other hand, a rotational drive source (not shown) such as a motor is connected to the other end side (base end side) of the spindle 6 that is not exposed.
スピンドル６の一端部には、マウントフランジ８が固定されている。マウントフランジ８は、径方向で外向きに延出するフランジ部１０と、フランジ部１０の中央領域から前方に突出するボス部１２とを有している。このマウントフランジ８には、本実施形態に係る平面研削砥石１４が装着される。 A mount flange 8 is fixed to one end of the spindle 6. The mount flange 8 has a flange portion 10 that extends outward in the radial direction, and a boss portion 12 that protrudes forward from the central region of the flange portion 10. A surface grinding wheel 14 according to this embodiment is attached to the mount flange 8.
図２（Ａ）は、平面研削砥石１４の構成例を模式的に示す断面図であり、図２（Ｂ）は、図２（Ａ）の一部を拡大した断面図である。図１、図２（Ａ）、及び図２（Ｂ）に示すように、平面研削砥石１４は、ステンレスやアルミニウム等の金属材料で円盤状（円環状、円柱状、円筒状）に形成された基台１６を備えている。この基台１６は、前後方向において所定の幅（厚み）を有している。 FIG. 2A is a cross-sectional view schematically showing a configuration example of the surface grinding wheel 14, and FIG. 2B is an enlarged cross-sectional view of a part of FIG. As shown in FIG. 1, FIG. 2 (A), and FIG. 2 (B), the surface grinding grindstone 14 is formed in a disc shape (annular, cylindrical, cylindrical) with a metal material such as stainless steel or aluminum. A base 16 is provided. The base 16 has a predetermined width (thickness) in the front-rear direction.
基台１６の中央部には、マウントフランジ８のボス部１２を挿入する装着穴１６ａが設けられている。マウントフランジ８のボス部１２を基台１６の装着穴１６ａに挿入した状態で、ボス部１２の前端側から固定具２０を締め込めば、平面研削砥石１４をマウントフランジ８に固定できる。つまり、マウントフランジ８を介して平面研削砥石１４をスピンドル６に装着できる。 A mounting hole 16 a for inserting the boss portion 12 of the mount flange 8 is provided in the center portion of the base 16. If the fixing tool 20 is tightened from the front end side of the boss portion 12 in a state where the boss portion 12 of the mount flange 8 is inserted into the mounting hole 16 a of the base 16, the surface grinding wheel 14 can be fixed to the mount flange 8. That is, the surface grinding wheel 14 can be attached to the spindle 6 via the mount flange 8.
円筒の側面に相当する基台１６の外周面１６ｂには、基台１６の周方向に沿って連続する螺旋状の細い溝１６ｃが形成されている。この溝１６ｃは、例えば、基台１６となる部材の外周面をＮＣ旋盤等で加工することにより形成できる。溝１６ｃの幅、深さ、間隔（ピッチ）等の条件は後述する。また、この基台１６の外周面１６ｂには、研削の際に被加工物（不図示）と接触する砥石部１８が設けられている。 On the outer peripheral surface 16b of the base 16 corresponding to the side surface of the cylinder, a spiral thin groove 16c continuous along the circumferential direction of the base 16 is formed. The groove 16c can be formed, for example, by machining the outer peripheral surface of a member that becomes the base 16 with an NC lathe or the like. Conditions such as the width, depth, and interval (pitch) of the groove 16c will be described later. In addition, the outer peripheral surface 16b of the base 16 is provided with a grindstone portion 18 that comes into contact with a workpiece (not shown) during grinding.
砥石部１８は、例えば、基台１６の外周面１６ｂを被覆するニッケル等のメッキ層（金属層）２２でダイヤモンド等の砥粒２４を固定することによって形成される。この砥石部１８の外周部分で露出する表面（外周面）１８ａが、被加工物の被研削面と接触する研削面となる。なお、メッキ層２２や砥粒２４の種類（材質）に特段の制限はない。 The grindstone 18 is formed, for example, by fixing abrasive grains 24 such as diamond with a plating layer (metal layer) 22 such as nickel that covers the outer peripheral surface 16 b of the base 16. The surface (outer peripheral surface) 18a exposed at the outer peripheral portion of the grindstone 18 becomes a grinding surface that comes into contact with the ground surface of the workpiece. In addition, there is no special restriction | limiting in the kind (material) of the plating layer 22 or the abrasive grain 24. FIG.
砥粒２４の粒径（例えば、最大粒径、又は平均粒径）にも制限はないが、例えば、粒径が１０μｍ〜３０μｍ程度の砥粒２４を用いると良い。一方で、メッキ層２２の厚みは、例えば、砥粒２４の粒径の０．５倍〜３倍程度、好ましくは、１倍〜１．５程度とする。これにより、砥粒２４をメッキ層２２から適切に表出させることができる。 Although there is no restriction | limiting also in the particle size (for example, maximum particle size or average particle size) of the abrasive grain 24, For example, it is good to use the abrasive grain 24 with a particle size of about 10 micrometers-30 micrometers. On the other hand, the thickness of the plating layer 22 is, for example, about 0.5 to 3 times, preferably about 1 to 1.5 times the particle size of the abrasive grains 24. Thereby, the abrasive grains 24 can be appropriately exposed from the plating layer 22.
砥石部１８の表面１８ａには、基台１６の外周面１６ｂの形状が反映されている。すなわち、砥石部１８の表面１８ａ側には、基台１６の外周面１６ｂの溝１６ｃに対応し、基台１６の周方向に沿って連続する螺旋状の細い溝１８ｂが形成されている。この溝１８ｂの幅は、例えば、砥粒の粒径の１．５倍〜３倍程度とすることが好ましい。つまり、砥粒２４の粒径が１０μｍ〜３０μｍ程度の場合には、溝１８ｂの幅を１５μｍ〜９０μｍ程度にすると良い。 The shape of the outer peripheral surface 16 b of the base 16 is reflected on the surface 18 a of the grindstone 18. That is, on the surface 18 a side of the grindstone portion 18, a spiral thin groove 18 b that corresponds to the groove 16 c of the outer peripheral surface 16 b of the base 16 and is continuous along the circumferential direction of the base 16 is formed. The width of the groove 18b is preferably about 1.5 to 3 times the grain size of the abrasive grains, for example. That is, when the grain size of the abrasive grains 24 is about 10 μm to 30 μm, the width of the groove 18 b is preferably about 15 μm to 90 μm.
また、溝１８ｂの深さは、例えば、砥粒の粒径の１．５倍〜３倍程度とすることが好ましい。つまり、砥粒２４の粒径が１０μｍ〜３０μｍ程度の場合には、溝１８ｂの深さを１５μｍ〜９０μｍ程度にすると良い。同様に、溝１８ｂの間隔（ピッチ）は、砥粒の粒径の１．５倍〜３倍程度とすることが好ましい。つまり、砥粒２４の粒径が１０μｍ〜３０μｍ程度の場合には、溝１８ｂの間隔を１５μｍ〜９０μｍ程度にすると良い。 The depth of the groove 18b is preferably about 1.5 to 3 times the grain size of the abrasive grains, for example. That is, when the grain size of the abrasive grains 24 is about 10 μm to 30 μm, the depth of the groove 18 b is preferably about 15 μm to 90 μm. Similarly, the interval (pitch) between the grooves 18b is preferably about 1.5 to 3 times the grain size of the abrasive grains. That is, when the grain size of the abrasive grains 24 is about 10 μm to 30 μm, the interval between the grooves 18 b is preferably about 15 μm to 90 μm.
上述のように、砥石部１８の表面１８ａの形状は、基台１６の外周面１６ｂの形状によって決まる。よって、このような幅、深さ、間隔の溝１８ｂを形成するためには、基台１６の外周面１６ｂに設ける溝１６ｃの幅、深さ、間隔を、希望する溝１８ｂの幅、深さ、間隔に合わせれば良い。 As described above, the shape of the surface 18 a of the grindstone 18 is determined by the shape of the outer peripheral surface 16 b of the base 16. Therefore, in order to form the groove 18b having such width, depth, and interval, the width, depth, and interval of the groove 16c provided on the outer peripheral surface 16b of the base 16 are set to the desired width and depth of the groove 18b. , It can be adjusted to the interval.
溝１８ｂは、基台１６の周方向に沿って連続する螺旋状に形成されているので、被加工物の研削によって発生する研削屑は、平面研削砥石１４の回転と共に溝１８ｂに沿って外部へと排出され、砥石部１８の表面１８ａ等に残留してしまうことがない。更に、平面研削砥石１４の回転と共に溝１８ｂに沿って研削水が流れるので、十分な量の研削水を加工点に供給できる。 Since the groove 18b is formed in a continuous spiral shape along the circumferential direction of the base 16, grinding scraps generated by grinding the workpiece are moved outward along the groove 18b along with the rotation of the surface grinding wheel 14. And is not left on the surface 18a of the grindstone 18 or the like. Furthermore, since the grinding water flows along the groove 18b as the surface grinding wheel 14 rotates, a sufficient amount of grinding water can be supplied to the processing point.
本実施形態に係る平面研削砥石１４を用いる被加工物の加工方法について簡単に説明する。まず、ウェーハ等の被加工物を、研削ユニット２の下方に位置する支持テーブル（不図示）に固定する。ここでは、被研削面が上方に露出するように、被加工物を支持テーブルに固定する。なお、ウェーハ以外の基板等を被加工物としても良い。 A method for processing a workpiece using the surface grinding wheel 14 according to the present embodiment will be briefly described. First, a workpiece such as a wafer is fixed to a support table (not shown) located below the grinding unit 2. Here, the workpiece is fixed to the support table so that the surface to be ground is exposed upward. A substrate other than the wafer may be used as a workpiece.
次に、スピンドル６（平面研削砥石１４）を回転させる。また、平面研削砥石１４の下端が被加工物の被研削面より低くなるように、研削ユニット２を下降させる。研削ユニット２の下降量は、被加工物の研削量（研削後の被加工物の厚み）等に合わせて調整される。 Next, the spindle 6 (surface grinding wheel 14) is rotated. Further, the grinding unit 2 is lowered so that the lower end of the surface grinding wheel 14 is lower than the surface to be ground of the workpiece. The descending amount of the grinding unit 2 is adjusted in accordance with the grinding amount of the workpiece (the thickness of the workpiece after grinding) or the like.
この状態で、研削ユニット２と支持テーブルとを左右方向（Ｘ軸方向）に沿って相対的に移動させることで、被加工物の被研削面を平面研削砥石１４で直線的に研削できる。なお、平面研削砥石１４の加工点には、研削水供給ノズル（不図示）から純水等の研削水を供給する。上述の動作は、被研削面の全体が研削されるまで、研削ユニット２と支持テーブルとの位置関係を変更しながら繰り返される。 In this state, the grinding surface of the workpiece can be linearly ground with the surface grinding wheel 14 by relatively moving the grinding unit 2 and the support table along the left-right direction (X-axis direction). A grinding water such as pure water is supplied to a processing point of the surface grinding wheel 14 from a grinding water supply nozzle (not shown). The above operation is repeated while changing the positional relationship between the grinding unit 2 and the support table until the entire surface to be ground is ground.
以上のように、本実施形態に係る平面研削砥石１４では、基台１６の周方向に沿って連続する螺旋状の溝１８ｂが砥石部１８の表面（外周面）１８ａに設けられているので、被加工物の研削によって発生した研削屑は、平面研削砥石１４の回転と共に螺旋状の溝１８ｂに沿って外部に排出される。また、平面研削砥石１４の回転と共に螺旋状の溝１８ｂに沿って研削水が流れるので、十分な量の研削水を加工点に供給できる。 As described above, in the surface grinding wheel 14 according to the present embodiment, the spiral groove 18b continuous along the circumferential direction of the base 16 is provided on the surface (outer peripheral surface) 18a of the grinding wheel portion 18, Grinding waste generated by grinding the workpiece is discharged to the outside along the spiral groove 18b as the surface grinding wheel 14 rotates. Further, since the grinding water flows along the spiral groove 18b with the rotation of the surface grinding wheel 14, a sufficient amount of grinding water can be supplied to the processing point.
なお、本発明は、上記実施形態の記載に制限されず種々変更して実施可能である。例えば、上記実施形態では、平面研削砥石１４に１本の連続する螺旋状の溝１８ｂを形成しているが、本発明は必ずしもこの態様に限定されない。例えば、複数本の連続する螺旋状の溝を形成しても良い。 In addition, this invention is not restrict | limited to description of the said embodiment, A various change can be implemented. For example, in the above-described embodiment, one continuous spiral groove 18b is formed in the surface grinding wheel 14, but the present invention is not necessarily limited to this aspect. For example, a plurality of continuous spiral grooves may be formed.
また、上記実施形態では、基台１６の外周面１６ｂに溝１６ｃを形成することで、砥石部１８の表面１８ａの溝１８ｂを実現しているが、基台１６の外周面１６ｂに溝を形成せず、砥石部１８の表面１８ａに溝１８ｂを直に形成しても良い。 Moreover, in the said embodiment, although the groove | channel 18b is implement | achieved by forming the groove | channel 16c in the outer peripheral surface 16b of the base 16, the groove | channel 18b of the surface 18a of the grindstone part 18 is implement | achieved. Instead, the groove 18b may be formed directly on the surface 18a of the grindstone 18.
その他、上記実施形態に係る構造、方法等は、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施できる。 In addition, the structure, method, and the like according to the above-described embodiment can be appropriately modified and implemented without departing from the scope of the object of the present invention.
２ 研削ユニット
４ スピンドルハウジング
６ スピンドル
８ マウントフランジ
１０ フランジ部
１２ ボス部
１４ 平面研削砥石
１６ 基台
１６ａ 装着穴
１６ｂ 外周面
１６ｃ 溝
１８ 砥石部
１８ａ 表面（外周面）
１８ｂ 溝
２０ 固定具
２２ メッキ層（金属層）
２４ 砥粒
2 grinding unit 4 spindle housing 6 spindle 8 mount flange 10 flange part 12 boss part 14 surface grinding wheel 16 base 16a mounting hole 16b outer peripheral surface 16c groove 18 grindstone part 18a surface (outer peripheral surface)
18b Groove 20 Fixing tool 22 Plating layer (metal layer)
24 abrasive
Claims (2)
該基台の外周面を被覆するメッキ層によって砥粒が固定された砥石部と、を備え、
該砥石部の外周面には、該基台の周方向に沿って連続する螺旋状の溝が設けられていることを特徴とする平面研削砥石。 An annular base mounted on the spindle;
A grindstone part in which abrasive grains are fixed by a plating layer covering the outer peripheral surface of the base, and
A surface grinding wheel characterized in that a spiral groove continuous in the circumferential direction of the base is provided on the outer peripheral surface of the grinding wheel portion.
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| JP2016196286A JP6925699B2 (en) | 2016-10-04 | 2016-10-04 | Surface grinding wheel |
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| JP2016196286A JP6925699B2 (en) | 2016-10-04 | 2016-10-04 | Surface grinding wheel |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10113878A (en) * | 1996-10-09 | 1998-05-06 | Asahi Diamond Ind Co Ltd | Super abrasive grain wheel and its manufacturing method |
| JP2009045723A (en) * | 2007-08-23 | 2009-03-05 | Disco Abrasive Syst Ltd | Formed grindstone tool |
| JP2010115771A (en) * | 2008-10-15 | 2010-05-27 | Allied Material Corp | Superabrasive tool and its manufacturing method |
| WO2015112540A1 (en) * | 2014-01-24 | 2015-07-30 | 3M Innovative Properties Company | Abrasive material having a structured surface |
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2016
- 2016-10-04 JP JP2016196286A patent/JP6925699B2/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10113878A (en) * | 1996-10-09 | 1998-05-06 | Asahi Diamond Ind Co Ltd | Super abrasive grain wheel and its manufacturing method |
| JP2009045723A (en) * | 2007-08-23 | 2009-03-05 | Disco Abrasive Syst Ltd | Formed grindstone tool |
| JP2010115771A (en) * | 2008-10-15 | 2010-05-27 | Allied Material Corp | Superabrasive tool and its manufacturing method |
| WO2015112540A1 (en) * | 2014-01-24 | 2015-07-30 | 3M Innovative Properties Company | Abrasive material having a structured surface |
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