JP2018055851A - connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a connector which enables size reduction while allowing an electronic component to be mounted thereon.SOLUTION: A connector 100 comprises: a plurality of contacts 1, a housing 2, and an electronic component 3. The housing 2 holds the plurality of contacts 1 in a state aligned in one direction. The electronic component 3 is bonded to two or more of the plurality of contacts 1. The plurality of contacts 1 includes: a first contact 11 to which the electronic component 3 is bonded; and a second contact 12 to which the electronic component 3 is not bonded. The electronic component 3 is bonded to one end (a bonding piece 113), of the first contact 11, which is exposed from the housing 2.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a connector, and more particularly to a connector on which an electronic component is mounted.

  Conventionally, a connector on which an electronic component is mounted is known, and is disclosed in, for example, Patent Document 1. The connector described in Patent Document 1 includes a housing and a contact pin. The contact pins are held by the housing, and both end portions function as connection terminals. The contact pin is provided with a chip component mounting portion. The chip component mounting portion includes a pin side terminal portion connected to the contact pin and a ground side terminal portion connected to the ground, and a chip component (electronic component) as a noise filter is detachably mounted.

Japanese Patent Laid-Open No. 11-86980

  By the way, it is desired to reduce the size of the connector as in the conventional example while mounting an electronic component such as a chip capacitor.

  This invention is made | formed in view of said point, and it aims at providing the connector which can achieve size reduction, mounting an electronic component.

  The connector according to the first aspect of the present invention includes a plurality of contacts, a housing, and an electronic component. The housing is configured to hold the plurality of contacts in a state aligned in one direction. The electronic component is bonded to two or more contacts of the plurality of contacts. The plurality of contacts include a first contact to which the electronic component is bonded and a second contact to which the electronic component is not bonded. The electronic component is joined to one end of the first contact exposed from the housing.

  In the connector according to the second aspect of the present invention, in the first aspect, the housing has a recess in which at least a part of the electronic component is accommodated in a portion where the first contact is held.

  In the connector according to the third aspect of the present invention, in the first or second aspect, the plurality of contacts are respectively pushed into a plurality of storage portions provided in the housing.

  In the connector according to the fourth aspect of the present invention, in the first or second aspect, the housing is insert-molded using the plurality of contacts as inserts.

  In the connector of the 5th form of this invention, in the 4th form, the said electronic component is joined to the said 1st contact with the joining material. The melting point of the bonding material is higher than the maximum temperature at the time of insert molding of the housing.

  In the connector according to the sixth aspect of the present invention, in any one of the first to fifth aspects, the shape of the first contact is different from the shape of the second contact.

  In the connector according to the seventh aspect of the present invention, in any one of the first to fifth aspects, the first contact and the second contact have the same shape.

  The connector of the 8th form of this invention is equipped with multiple said electronic components in any one of the 1st-7th form.

  In the connector according to the ninth aspect of the present invention, in any one of the first to eighth aspects, the plurality of contacts and the housing are configured as male connectors.

  In the connector according to the tenth aspect of the present invention, in any one of the first to eighth aspects, the plurality of contacts and the housing are configured as female connectors.

  In the connector according to an eleventh aspect of the present invention, in any one of the first to tenth aspects, the electronic component is connected to the two or more first contacts located on both sides of the one or more second contacts. Be joined.

  In the connector according to a twelfth aspect of the present invention, in any one of the first to eleventh aspects, the electronic component is joined to three or more first contacts.

  The connector of the 13th form of this invention is comprised so that the said 1st contact may be joined to a board | substrate via the said electronic component in any one of the 1st-12th forms.

  The present invention can be downsized while mounting electronic components.

FIG. 1 is a perspective view of a connector according to an embodiment of the present invention as viewed from the front. FIG. 2 is a perspective view of the same connector as viewed from the rear. FIG. 3 is a cross-sectional view taken along a plane passing through the first contact and the second contact in the above connector. FIG. 4A and FIG. 4B are explanatory diagrams of a process of joining an electronic component to the first frame in which the first contact is formed in the above connectors. 5A and 5B are explanatory diagrams of the process of attaching the second contact to the housing, respectively. 6A and 6B are explanatory views of a process of attaching the first contact to the housing, respectively. FIG. 7 is a perspective view when the connector is the same as the above and includes only one electronic component. FIG. 8 is a perspective view of a connector according to Modification 1 of the embodiment of the present invention. FIG. 9 is a cross-sectional view of the above connector, taken along a plane passing through the first contact and the second contact. FIG. 10 is a front view of a connector according to Modification 2 of the embodiment of the present invention. FIG. 11 is a rear view of the connector according to the third modification of the embodiment of the present invention. FIG. 12 is a perspective view of a connector according to Modification 4 of the embodiment of the present invention. FIG. 13 is a cross-sectional view of the above connector cut along a plane passing through the first contact and the second contact. FIG. 14 is a perspective view of a connector according to Modification 5 of the embodiment of the present invention. FIG. 15 is a cross-sectional view of the above connector, taken along a plane passing through the first contact and the second contact.

(1) Overview Hereinafter, a connector 100 according to an embodiment will be described with reference to FIG. The connector 100 of this embodiment is attached to a board such as a printed wiring board or a flexible printed wiring board. The connector 100 is used for electrically connecting a plurality of boards mounted on a mobile terminal such as a smartphone. Of course, the purpose of the connector 100 is not limited, and the connector 100 may be used for an electronic device other than a mobile terminal such as a camera module. In addition, the connector 100 is not limited to an application for electrically connecting a plurality of substrates, and for example, electrically connects a plurality of components such as between a substrate and a display or between a substrate and a battery. Any use is acceptable.

  The connector 100 according to the present embodiment includes a plurality of contacts 1, a housing 2, and an electronic component 3. The housing 2 is configured to hold the plurality of contacts 1 in a state aligned in one direction. The electronic component 3 is bonded to two or more contacts 1 among the plurality of contacts 1. The dimension in the thickness direction of the housing 2 is, for example, 1 mm or less. Moreover, the dimension of the longitudinal direction of the housing 2 is ten and several millimeters, for example. Moreover, the dimension of the transversal direction of the housing 2 is several mm, for example. Furthermore, the interval between the plurality of contacts 1, that is, the pitch is, for example, a comma number of mm. In the present embodiment, the plurality of contacts 1 are arranged at an equal pitch, but may be arranged at an irregular pitch.

  The plurality of contacts 1 include a first contact 11 to which the electronic component 3 is bonded and a second contact 12 to which the electronic component 3 is not bonded. The electronic component 3 is joined to one end of the first contact 11 exposed from the housing 2. That is, the connector 100 according to the present embodiment has a structure in which the electronic component 3 is joined to one end of the first contact 11 exposed from the housing 2, so that it is possible to reduce the size while mounting the electronic component 3. .

(2) Configuration Hereinafter, the configuration of the connector 100 of the present embodiment will be described in detail. In the following description, in FIG. 1, the direction in which the first contact 11 and the electronic component 3 are arranged will be referred to as the front-rear direction, and the first contact 11 side as viewed from the electronic component 3 will be referred to as the front. In FIG. 1, the short direction of the housing 2 will be described as the up and down direction, and the long direction of the housing 2 will be described as the left and right direction. Note that FIGS. 1 to 15 show arrows indicating these directions (up, down, left, right, front, back), but these arrows are described only for the purpose of assisting the explanation. It is not too much, and it is not accompanied by an entity. Further, the definition of the above direction is not intended to limit the usage pattern of the connector 100 of the present embodiment.

  The connector 100 of this embodiment is a socket (female connector), and as shown in FIGS. 1 to 3, a plurality (here, 24) of contacts 1, a housing 2, and a plurality (here, 3). ) Electronic component 3 and a pair of holding metal fittings 4. That is, in this embodiment, the plurality of contacts 1 and the housing 2 are configured as female connectors.

  The plurality of contacts 1 are all formed by bending a band-shaped metal plate. Each of the plurality of contacts 1 is plated with gold. In the present embodiment, the plurality of contacts 1 includes three pairs of first contacts 11 and the remaining 18 second contacts 12. The three electronic components 3 are joined to one end of each of the three pairs of first contacts 11.

  As shown in FIG. 3, the first contact 11 includes a spring piece 111, a rising piece 112, and a joining piece 113, and these are integrally formed. The spring piece 111 has a tip that is curved in a horseshoe shape and is configured to bend in the lateral direction (vertical direction) of the housing 2. In addition, when the header (male connector) contact is inserted into the fitting recess 24 (described later), the spring piece 111 is pushed by the header contact, thereby causing an elastic force in the direction toward the header contact (downward). Is configured to generate.

  The rising piece 112 is formed in a long plate shape along the thickness direction (front-rear direction) of the housing 2. The first end (rear end) of the rising piece 112 is formed integrally with one end (lower end) of the spring piece 111. The rising piece 112 is configured to come into contact with the header contact when the header contact is inserted into the fitting recess 24.

  The joining piece 113 is formed in a long plate shape along the short direction (vertical direction) of the housing 2. The first end (upper end) of the joining piece 113 is formed integrally with the second end (front end) of the rising piece 112. Further, the second end (lower end) of the joining piece 113 is exposed from the housing 2 at one end side (front side) in the thickness direction of the housing 2. One surface (rear surface) of the bonding piece 113 is a bonding surface to which a first electrode 31 (described later) of the electronic component 3 is bonded by, for example, soldering or welding. In other words, the electronic component 3 is joined to one end (joining piece 113) of the first contact 11 exposed from the housing 2.

  In the present embodiment, one end of the first contact 11 exposed from the housing 2 is not one end on the spring piece 111 side, but is located outside the spring piece 111 in the short direction (vertical direction) of the housing 2. It is one end of the joining piece 113 side. For this reason, in this embodiment, in the first contact 11, the electronic component 3 can be disposed between the spring piece 111 serving as a contact point with the contact of the header and the joining piece 113 serving as the joining surface with the substrate. Can be made more efficient.

  In the present embodiment, the first contact 11 is configured not to be directly bonded to the substrate but to be bonded to the substrate via the electronic component 3. Specifically, the first electrode 31 of the electronic component 3 is bonded to the first contact 11, and the second electrode 32 (described later) of the electronic component 3 is bonded to a conductor wired on the substrate, whereby the first contact is obtained. 11 is electrically connected to a conductor wired on the substrate via the electronic component 3.

  As shown in FIG. 3, the second contact 12 includes a spring piece 121, a rising piece 122, a falling piece 123, and a terminal piece 124, and these are integrally formed. . The spring piece 121 has a tip that is curved in a horseshoe shape and is configured to bend in the lateral direction (vertical direction) of the housing 2. Further, when the header contact is inserted into the fitting recess 24, the spring piece 121 is configured to generate an elastic force in a direction (upward) toward the header contact by being pushed by the header contact. Yes.

  The rising piece 122 is formed in a long plate shape along the thickness direction (front-rear direction) of the housing 2. The first end (rear end) of the rising piece 122 is formed integrally with one end (upper end) of the spring piece 121. The rising piece 122 is configured to come into contact with the header contact when the header contact is inserted into the fitting recess 24.

  The falling piece 123 is formed in a long plate shape along the thickness direction (front-rear direction) of the housing 2. The first end (front end) of the falling piece 123 is curved in an inverted U shape and is formed integrally with the second end (front end) of the rising piece 122.

  The terminal piece 124 is formed in a long plate shape along the short direction (vertical direction) of the housing 2. The first end (lower end) of the terminal piece 124 is formed integrally with the second end (rear end) of the falling piece 123. Further, the second end (upper end) of the terminal piece 124 is exposed from the housing 2 at one end side (rear side) in the thickness direction of the housing 2.

  One surface (rear surface) of the terminal piece 124 becomes a bonding surface bonded to the substrate by soldering, for example. In the present embodiment, the bonding surface of the terminal piece 124 is flush with the second electrode 32 (described later) of the electronic component 3 bonded to the first contact 11. Therefore, the connector 100 can be directly joined to the substrate without using other components such as spacers.

  Here, the spring piece 111 and the rising piece 112 of the first contact 11 and the spring piece 121 and the rising piece 122 of the second contact 12 have the same shape. On the other hand, the joining piece 113 of the first contact 11 and the falling piece 123 and the terminal piece 124 of the second contact 12 have different shapes. That is, in the present embodiment, the shape of the first contact 11 is different from the shape of the second contact 12.

  As shown in FIGS. 1 and 2, the housing 2 is formed in a flat rectangular parallelepiped shape that is long in the left-right direction by an insulating resin material. The housing 2 has a bottom wall 21, a peripheral wall 22, and a base part 23. The bottom wall 21 has a plate shape that is long in the left-right direction, and constitutes the bottom of the housing 2. The peripheral wall 22 protrudes forward from the periphery of the bottom wall 21 and is formed in a rectangular frame shape in plan view. The base part 23 has a rectangular parallelepiped shape that is long in the left-right direction, and protrudes forward from the center of the bottom wall 21. A portion surrounded by the bottom wall 21, the peripheral wall 22, and the base portion 23 constitutes a fitting recess 24 into which the header is fitted.

  The housing 2 is formed with a plurality (24 in this case) of storage portions 25 corresponding to the plurality of contacts 1 on a one-to-one basis. The plurality of storage portions 25 are formed so as to penetrate the bottom wall 21 in the thickness direction (front-rear direction), respectively. Each of the plurality of contacts 1 is housed in the housing portion 25 by being pushed into the housing portion 25 from behind.

  The plurality of storage portions 25 are provided separately on both upper and lower sides with the base portion 23 interposed therebetween. The plurality of storage portions 25 on both the upper and lower sides of the base portion 23 are all provided at equal intervals along the longitudinal direction (left-right direction) of the housing 2. In other words, the housing 2 holds the plurality of contacts 1 in a state of being aligned in one direction (left-right direction).

  Each of the plurality of contacts 1 is exposed in the fitting recess 24 in a state of being stored in the storage portion 25. Specifically, a part of the spring piece 111 of the first contact 11 is exposed to the fitting recess 24 from the inside of the base portion 23, and a part of the rising piece 112 is exposed to the fitting recess 24 from the inside of the peripheral wall 22. ing. Further, a part of the spring piece 121 of the second contact 12 is exposed to the fitting recess 24 from the inside of the base portion 23, and a part of the rising piece 122 is exposed to the fitting recess 24 from the inside of the peripheral wall 22.

  Therefore, when the header is fitted to the connector 100, the portions exposed to the fitting recesses 24 of the first contact 11 and the second contact 12 are in contact with the header contacts. Thereby, the plurality of contacts 1 of the connector 100 are electrically connected to the contacts of the header.

  The housing 2 has a plurality of (here, three) recesses 26. The recess 26 is provided at a location corresponding to the first contact 11 in the peripheral wall 22. In the present embodiment, two recesses 26 are provided in the lower peripheral wall 22 of the peripheral walls 22, and one recess 26 is provided in the upper peripheral wall 22. The recess 26 is recessed in the direction toward the base 23 in the short direction (vertical direction) of the housing 2. That is, the recess 26 in the lower peripheral wall 22 of the peripheral walls 22 is recessed upward. Moreover, the recess 26 in the upper peripheral wall 22 of the peripheral walls 22 is recessed downward.

  Each of the plurality of recesses 26 stores a part of the electronic component 3 bonded to the pair of first contacts 11. In other words, the housing 2 has a recess 26 in which at least a part of the electronic component 3 is accommodated in a portion where the first contact 11 is held.

  The electronic component 3 is a filter for reducing noise, for example. In addition, the electronic component 3 is not limited to a filter such as a common mode noise filter or a chip capacitor, and may be a component for other purposes. For example, the electronic component 3 may be a chip resistor or a chip inductor.

  In the present embodiment, the electronic component 3 is a common mode noise filter having a common mode choke coil, and has a total of four electrodes, a pair of first electrodes 31 and a pair of second electrodes 32. The pair of first electrodes 31 are exposed from both left and right ends of the front surface of the housing 33 of the electronic component 3. The pair of second electrodes 32 are exposed from both left and right ends of the rear surface of the housing 33 of the electronic component 3. The pair of first electrodes 31 is used to join the joining pieces 113 of the pair of first contacts 11. The pair of second electrodes 32 is used for bonding to conductors wired on the substrate.

  Each of the pair of holding metal fittings 4 is formed by bending a plate-shaped metal plate made of, for example, a copper alloy. Each of the pair of holding metal fittings 4 is plated with nickel. The pair of holding metal fittings 4 are provided at both ends (left and right ends) of the housing 2 in the longitudinal direction. In the present embodiment, the pair of holding metal fittings 4 are provided integrally with the housing 2 by insert molding.

  The holding metal fitting 4 is composed of a pair of holding pieces 41 and a connecting piece 42 that connects the pair of holding pieces 41. Each of the pair of holding pieces 41 can be used as a power supply terminal for electrical connection to a power supply via a power supply line. One surface (rear surface) of each of the pair of holding pieces 41 is a bonding surface bonded to the substrate by soldering, for example. One of the pair of holding pieces 41 is held by the housing 2 so as to be aligned with the plurality of contacts 1 on the lower side of the base portion 23 in one direction (left-right direction). The other of the pair of holding pieces 41 is held by the housing 2 so as to be aligned in one direction (left-right direction) with the plurality of contacts 1 on the upper side of the base portion 23. The holding metal fitting 4 has a function of increasing the strength of the housing 2 by being integrally provided at one end in the longitudinal direction of the housing 2.

  The connector 100 configured as described above is bonded to a board (hereinafter referred to as “first board”) built in an electronic device such as a smartphone. Further, the header corresponding to the connector 100 is joined to another board (hereinafter referred to as “second board”) that is also built in the electronic device. When the connector 100 is connected to the header, the first conductor wired on the first substrate and the second conductor wired on the second substrate are electrically connected. At this time, the electronic component 3 included in the connector 100 is also electrically connected to a circuit including the first conductor and the second conductor.

(3) Manufacturing Method Hereinafter, the manufacturing method of the connector 100 of this embodiment is demonstrated using FIG. 4A-FIG. 6B. The manufacturing method of the connector 100 broadly includes a first step, a second step, a third step, and a fourth step. The first step is a process for forming the housing 2. The second step is a process of joining the electronic component 3 to the first contact 11. The third step is a step of attaching the second contact 12 to the housing 2. The fourth step is a step of attaching the first contact 11 to the housing 2.

  Below, it demonstrates in order of a 1st step, a 2nd step, a 3rd step, and a 4th step, but these steps are random. These steps may be in any order as long as the conditions that the third step and the fourth step are not executed before the first step are satisfied.

  First, the first step will be described. The first step is a process of forming the housing 2 having the plurality of storage portions 25 by insert molding, for example. In other words, the first step is a step of forming a housing 2 having a plurality of storage portions 25 in which a plurality of contacts 1 are respectively stored, and the plurality of storage portions 25 are arranged in one direction (left-right direction). By the first step, the housing 2 is integrally formed as a resin molded product having a bottom wall 21, a peripheral wall 22, a base portion 23, and a plurality of storage portions 25. In the present embodiment, in the first step, the housing 2 having one or more recesses 26 is formed at a position corresponding to the place where the first contact 11 is disposed.

  Next, the second step will be described with reference to FIGS. 4A and 4B. The second step is a process of joining one or more (here, four) electronic components 3 to the first frame 51 by, for example, soldering or welding. In other words, the second step is a process of joining the electronic component 3 to two or more first contacts 11 of the plurality of contacts 1.

  Here, the first frame 51 is a frame in which a plurality of pairs (here, four pairs) of first contacts 11 are integrally formed on one end edge (here, upper end edge) of a metal plate made of, for example, a copper alloy. is there. The first frame 51 is formed by press molding, for example. The plurality of first contacts 11 are preliminarily plated with gold. As shown in FIGS. 4A and 4B, in the second step, the electronic component 3 is joined to the joining piece 113 in each of the multiple pairs of first contacts 11.

  Next, the third step will be described with reference to FIGS. 5A and 5B. The third step press-fits one or more second contacts 12 into one or more storage portions 25 of the housing 2 with one or more second contacts 12 connected to the second frame 52. It is a process. In other words, in the third step, one or more second contacts 12 to which one or more second contacts 12 to which the electronic component 3 of the plurality of contacts 1 is not bonded are pushed into one or more storage portions 25, respectively. It is a process of attaching to the housing 2.

  Here, in the second frame 52, for example, a plurality of (here, twelve) second contacts 12 are integrally formed on one end edge (here, upper end edge or lower end edge) of a metal plate made of a copper alloy. It is a frame. The second frame 52 is formed by press molding, for example. The plurality of second contacts 12 are preliminarily plated with gold.

  In the example shown in FIG. 5A, in each of the two second frames 52, the second contacts 12 corresponding to the storage portions 25 in which the first contacts 11 are stored are thinned out. Specifically, in the lower second frame 52, the two pairs of second contacts 12 are thinned out by cutting unnecessary root portions of the two pairs of second contacts 12. Similarly, in the upper second frame 52, the pair of second contacts 12 is thinned by cutting unnecessary root portions of the pair of second contacts 12.

  As shown in FIGS. 5A and 5B, in the third step, the one or more second contacts 12 are pushed into the one or more storage portions 25 of the housing 2 from the rear, whereby the one or more second contacts 12 are moved to the housing. 2 is attached. After the one or more second contacts 12 are attached to the housing 2, the remaining portions of the two second frames 52 are removed by cutting the base portions of the one or more second contacts 12.

  Here, in the third step, the unnecessary second contacts 12 are thinned out from the second frame 52 after gold plating is applied to the plurality of second contacts 12, but the reverse may be possible. That is, in the third step, one or more second contacts 12 may be plated with gold after the unnecessary second contacts 12 are thinned out from the second frame 52.

  Finally, the fourth step will be described. The fourth step is a step of press-fitting the two or more first contacts 11 into the one or more storage portions 25 of the housing 2 in a state where the two or more first contacts 11 are connected to the first frame 51. In other words, in the fourth step, two or more first contacts 11 are pushed into two or more storage portions 25 with one end where the electronic component 3 is joined exposed from the housing 2. This is a step of attaching one contact 11 to the housing 2.

  Here, unnecessary portions of the first frame 51 are cut according to the number of required pairs of first contacts 11. In the example illustrated in FIG. 6A, unnecessary portions are cut off in the lower first frame 51, leaving two pairs of first contacts 11. In the upper first frame 51, unnecessary portions are cut off with the pair of first contacts 11 being left.

  As shown in FIG. 6A and FIG. 6B, in the fourth step, the two or more first contacts 11 are pushed into the two or more storage portions 25 of the housing 2 from the rear, respectively. 2 is attached. At this time, one or more electronic components 3 are pushed into one or more recesses 26 of the housing 2. After attaching the two or more first contacts 11 to the housing 2, the remaining portions of the two first frames 51 are removed by cutting the base portions of the two or more first contacts 11.

  As described above, the method for manufacturing the connector 100 of this embodiment includes the first step, the second step, the third step, and the fourth step. The first step is a step of forming a housing 2 having a plurality of storage portions 25 in which a plurality of contacts 1 are respectively stored, and the plurality of storage portions 25 are arranged in one direction. The second step is a step of joining the electronic component 3 to two or more first contacts 11 of the plurality of contacts 1. The third step is to push the one or more second contacts 12 into the housing 2 by pushing the one or more second contacts 12 to which the electronic component 3 of the plurality of contacts 1 is not bonded into the one or more storage portions 25, respectively. It is a process of attaching. In the fourth step, the two or more first contacts 11 are pushed into the two or more storage portions 25 by pushing the two or more first contacts 11 into the two or more storage portions 25 in a state where one end where the electronic component 3 is bonded is exposed from the housing 2. Is a step of attaching to the housing 2.

  According to this manufacturing method, it is easy to manufacture a small connector 100 in which the interval between the plurality of contacts 1 is relatively narrow and the housing 2 is relatively small while the electronic component 3 is mounted.

  In addition, the second step and the fourth step are preferably executed using the first frame 51. That is, in the second step and the fourth step, it is preferable that two or more first contacts 11 are integrally formed on a single metal plate. The third step is preferably performed using the second frame 52. That is, in the third step, it is preferable that the one or more second contacts 12 are integrally formed on a single metal plate.

(4) Effect As described above, the connector 100 according to the present embodiment has a structure in which the electronic component 3 is joined to one end (joint piece 113) of the first contact 11 exposed from the housing 2. For this reason, in the connector 100 of this embodiment, since it is not necessary to provide the housing 2 with the space for mounting the electronic component 3, the housing 2 can be designed comparatively freely. Therefore, when manufacturing the connector 100 of this embodiment, it is easy to concentrate on downsizing the housing 2 to which the plurality of contacts 1 are attached. That is, the connector 100 of the present embodiment can be downsized while mounting the electronic component 3.

  In the connector 100 of this embodiment, the electronic component 3 is joined to the first contact 11. For this reason, in the connector 100 of this embodiment, the reliability of the electrical connection of the electronic component 3 to the first contact 11 is improved as compared with the configuration in which the electronic component 3 is merely in contact with the first contact 11. be able to.

  Moreover, in the connector 100 of this embodiment, since the electronic component 3 can be mounted only in a required portion of the plurality of contacts 1, if necessary (for example, according to the specifications of the electronic device), Functions can be added freely.

  Moreover, in the connector 100 of this embodiment, since the electronic component 3 is exposed to the outside of the housing 2, there is an effect that the heat dissipation of the electronic component 3 can be improved.

  Here, the connector 100 according to the present embodiment is used in an electronic device such as a smartphone as described above. However, in such an electronic device, with the recent increase in signal transmission speed, the reduction of high-frequency noise is reduced. It is desired. Therefore, if the connector 100 of this embodiment in which a filter is mounted as the electronic component 3 is used in such an electronic device, it is not necessary to provide a space for mounting the filter in the electronic device. That is, the connector 100 of the present embodiment also has an effect that it can contribute to downsizing of the electronic device while reducing noise in the electronic device.

  By the way, although the connector 100 of this embodiment is provided with the plurality of electronic components 3 (here, three), for example, as shown in FIG. 7, only one electronic component 3 may be provided. In the example shown in FIG. 7, the pair of contacts 1 to which the electronic components 3 of the plurality of contacts 1 are bonded are the first contacts 11, and the other contacts 1 are all the second contacts 12. In the example shown in FIG. 7, the housing 2 has only one recess 26.

<Modification 1>
Hereinafter, the connector 101 according to the first modification of the embodiment will be described with reference to FIGS. 8 and 9. However, the basic configuration of the connector 101 according to the present modification is common to the connector 100 according to the embodiment, and thus description of common points is omitted.

  The connector 101 of this modification includes one electronic component 3 as shown in FIG. In the connector 101 of this modification, as shown in FIG. 9, the first contact 11 is similar to the second contact 12, the spring piece 121, the rising piece 122, the falling piece 123, and the terminal piece 124. It consists of and. That is, in this modification, the first contact 11 and the second contact 12 have the same shape.

  In this modification, the electronic component 3 is, for example, a chip capacitor. The electronic component 3 includes a pair of electrodes 34 instead of including a pair of first electrodes 31 and a pair of second electrodes 32. The pair of electrodes 34 are exposed from both left and right ends of the housing 33 of the electronic component 3. The pair of electrodes 34 are joined to the front surfaces of the terminal pieces 124 of the pair of first contacts 11, respectively.

  Moreover, in this modification, the height dimension (front-rear direction dimension) of the electronic component 3 is smaller than the height dimension of the electronic component 3 in the embodiment. For this reason, in this modification, unlike the embodiment, the recess 26 does not penetrate in the thickness direction (front-rear direction) of the housing 2. Note that the electronic component 3 can be bonded to the front surface of the terminal piece 124 without providing the recess 26 depending on the size of the electronic component 3 (here, the vertical dimension). In this case, the recess 26 is unnecessary.

  The connector 101 of this modification can be manufactured by the manufacturing method of the connector 100 of the embodiment. That is, the connector 101 of this modification can be manufactured by a manufacturing method including the first step, the second step, the third step, and the fourth step. When manufacturing the connector 101 of this modification, the first frame 51 may be used in place of the second frame 52 in the second step.

<Modification 2>
Hereinafter, the connector 102 according to the second modification of the embodiment will be described with reference to FIG. However, the basic configuration of the connector 102 according to the present modification is common to the connector 100 according to the embodiment, and thus description of common points is omitted.

  The connector 102 of this modification includes two electronic components 3 as shown in FIG. In the connector 102 of this modification, the electronic component 3 includes three first electrodes 31 and three second electrodes 32 instead of the pair of first electrodes 31 and the pair of second electrodes 32. Yes. Since FIG. 10 is a plan view of the connector 102 as viewed from the front, the three second electrodes 32 are not shown.

  In this modification, the electronic component 3 is joined to the three first contacts 11. Specifically, the three first electrodes 31 of the electronic component 3 are respectively joined to the joining pieces 113 of the three first contacts 11. That is, in this modification, the electronic component 3 is bonded to three or more first contacts 11.

  In the present modification, the first contact 11 and the second contact 12 have different shapes, but may have the same shape as the connector 101 of the first modification.

  The connector 102 of this modification can be manufactured by the manufacturing method of the connector 100 of the embodiment. That is, the connector 102 of this modification can be manufactured by a manufacturing method including the first step, the second step, the third step, and the fourth step. When manufacturing the connector 102 of this modification, the electronic component 3 may be joined to three or more first contacts 11 in the second step.

<Modification 3>
Hereinafter, the connector 103 according to the third modification of the embodiment will be described with reference to FIG. However, the basic configuration of the connector 103 of the present modification is common to that of the connector 101 of the first modification, and thus description of common points is omitted.

  In the connector 103 of this modification, as shown in FIG. 11, the electronic component 3 is joined to a pair of first contacts 11 sandwiching one second contact 12 in the left-right direction. In other words, the electronic component 3 is joined to the two or more first contacts 11 located on both sides of the one or more second contacts 12. That is, the electronic component 3 may be bonded to two or more first contacts 11 with two or more second contacts 12 sandwiched in the left-right direction.

  In the present modification, the pair of electrodes 34 of the electronic component 3 are joined to the front surfaces of the terminal pieces 124 of the pair of first contacts 11, respectively. On the other hand, the second contact 12 sandwiched between the pair of first contacts 11 joined to the electronic component 3 is not joined to the electronic component 3. That is, the terminal piece 124 of the second contact 12 is in contact with the housing 33 of the electronic component 3, but is not joined to any of the pair of electrodes 34 of the electronic component 3.

  In the present modification, the first contact 11 and the second contact 12 have the same shape, but may have different shapes as in the connector 100 of the embodiment.

  The connector 103 of this modification can be manufactured by the manufacturing method of the connector 100 of the embodiment. That is, the connector 103 of this modification can be manufactured by a manufacturing method including the first step, the second step, the third step, and the fourth step. When manufacturing the connector 103 of this modification, the steps may be performed in the order of the fourth step and the third step so that the second contact 12 does not get in the way in the fourth step.

<Modification 4>
Hereinafter, a connector 104 according to Modification 4 of the embodiment will be described with reference to FIGS. 12 and 13. However, the basic configuration of the connector 104 according to the present modification is common to the connector 100 according to the embodiment, and thus description of common points is omitted.

  The connector 104 of this modification is a header (male connector) and includes one electronic component 3 as shown in FIG. That is, in this modification, the plurality of contacts 1 and the housing 2 are configured as male connectors. Therefore, in this modification, the shapes of the first contact 11, the second contact 12, and the housing 2 are different from those of the embodiment.

  The housing 2 is formed in a flat rectangular parallelepiped shape that is long in the left-right direction by an insulating resin material. The housing 2 has a bottom wall 27 and a peripheral wall 28. The bottom wall 27 has a plate shape that is long in the left-right direction, and constitutes the bottom of the housing 2. The peripheral wall 28 protrudes forward from the peripheral edge of the bottom wall 27 and is formed in a rectangular frame shape in plan view. A portion surrounded by the bottom wall 27 and the peripheral wall 28 constitutes a fitting recess 29 into which a part of the socket (female connector) is fitted. For example, if the socket is the connector 100 of the embodiment, the base portion 23 of the connector 100 is fitted into the fitting recess 29.

  The housing 2 is formed by insert molding using a plurality of contacts 1 and a pair of holding metal fittings 4 as inserts. Half of the plurality of (here, 24) contacts 1 are integrally provided on the upper peripheral wall 28. The remaining half of the plurality of contacts 1 is integrally provided on the lower peripheral wall 28. That is, the housing 2 holds the plurality of contacts 1 in a state of being aligned in one direction (left-right direction). In this modification, a pair of holding pieces 41 of each of the pair of holding fittings 4 are exposed from the housing 2. Each connection piece 42 of the pair of holding metal fittings 4 is embedded in the peripheral wall 28.

  As shown in FIG. 13, the first contact 11 has a contact piece 131 and a joining piece 132, and these are integrally formed. The contact piece 131 is formed in a long plate shape along the thickness direction (front-rear direction) of the housing 2. The contact piece 131 is disposed on the surface of the peripheral wall 28 facing the fitting recess 29. The contact piece 131 is configured to contact the socket contact when the socket contact is inserted into the fitting recess 29.

  The contact piece 131 is provided with a recess 133 that is recessed in a direction away from the fitting recess 29 (downward). The recess 133 is configured such that a part of the socket contact is caught when the socket contact is inserted into the fitting recess 29. Therefore, the depression 133 functions as a socket retaining. For example, if the socket is the connector 100 of the embodiment, a part of the spring piece 111 (or the spring piece 121) is caught in the depression 133.

  The joining piece 132 is formed in a long plate shape along the thickness direction (front-rear direction) of the housing 2. The joining piece 132 is disposed along the outer surface (upper surface or lower surface) of the peripheral wall 28. That is, the joining piece 132 is exposed from the housing 2. One end (front end) of the joining piece 132 is curved in an inverted U shape, and is formed integrally with one end (front end) of the contact piece 131. One surface (lower surface) of the bonding piece 113 is a bonding surface to which the first electrode 31 of the electronic component 3 is bonded by, for example, soldering or welding. In other words, the electronic component 3 is joined to one end (joint piece 132) of the first contact 11 exposed from the housing 2.

  In the present modification, the first contact 11 is configured not to be directly bonded to the substrate but to be bonded to the substrate via the electronic component 3. Specifically, the first electrode 11 of the electronic component 3 is bonded to the first contact 11, and the second electrode 32 of the electronic component 3 is bonded, so that the first contact 11 is attached to the substrate via the electronic component 3. It is electrically connected to the wired conductor.

  As shown in FIG. 13, the second contact 12 includes a contact piece 141, a hanging piece 142, and a terminal piece 143, and these are integrally formed. The contact piece 141 has the same shape as the contact piece 131 of the first contact 11 and has a function equivalent to that of the contact piece 131. The contact piece 141 is provided with a recess 144 that is recessed in a direction away from the fitting recess 29 (upward). The depression 144 has a function equivalent to that of the depression 133 of the first contact 11.

  The hanging piece 142 is formed in a long plate shape along the thickness direction (front-rear direction) of the housing 2. The dimension in the longitudinal direction (front-rear direction) of the hanging piece 142 is shorter than the dimension in the longitudinal direction of the joining piece 132 of the first contact 11. The drooping piece 142 is disposed along the outer surface (upper surface or lower surface) of the peripheral wall 28. One end (front end) of the hanging piece 142 is curved in an inverted U shape and is formed integrally with the first end (front end) of the contact piece 141.

  The terminal piece 143 is formed in a long plate shape along the short direction (vertical direction) of the housing 2. The first end (lower end) of the terminal piece 143 is formed integrally with the second end (rear end) of the contact piece 141. The second end (upper end) of the terminal piece 143 is exposed from the housing 2 at one end side (rear side) in the thickness direction of the housing 2.

  One surface (rear surface) of the terminal piece 143 becomes a bonding surface bonded to the substrate by soldering, for example. In the present modification, the pair of second electrodes 32 of the electronic component 3 are flush with the joint surface of the terminal piece 143 of the second contact 12. Therefore, the connector 104 can be directly bonded to the substrate without using other components such as a spacer.

  The connector 104 of this modification can be manufactured by the manufacturing method of the connector 100 of the embodiment. That is, the connector 104 of this modification can be manufactured by a manufacturing method including the first step, the second step, the third step, and the fourth step. When manufacturing the connector 104 of this modification, the first step, the third step, and the fourth step are one process, the first contact 11 and the second contact 12 are used as inserts, and the housing 2 is insert-molded. That's fine.

<Modification 5>
Hereinafter, the connector 105 according to the fifth modification of the embodiment will be described with reference to FIGS. 14 and 15. However, the basic configuration of the connector 105 according to the present modification is common to the connector 100 according to the fourth modification, and thus description of common points is omitted.

  The connector 105 of this modification includes one electronic component 3 as shown in FIG. And in the connector 105 of this modification, as shown in FIG. 15, the 1st contact 11 is comprised with the contact piece 141, the drooping piece 142, and the terminal piece 143 similarly to the 2nd contact 12. As shown in FIG. . That is, in this modification, the first contact 11 and the second contact 12 have the same shape.

  In this modification, the electronic component 3 is the same as the electronic component 3 of the modification 1, and includes a pair of electrodes 34. The pair of electrodes 34 are joined to the front surfaces of the terminal pieces 143 of the pair of first contacts 11, respectively.

  The connector 105 of this modification can be manufactured by the manufacturing method of the connector 100 of the embodiment. That is, the connector 105 of this modification can be manufactured by a manufacturing method including the first step, the second step, the third step, and the fourth step. When manufacturing the connector 105 of this modification, the first step, the third step, and the fourth step are one process, the first contact 11 and the second contact 12 are used as inserts, and the housing 2 is insert-molded. That's fine.

  As described above, the connectors 100 to 105 according to the first aspect include the plurality of contacts 1, the housing 2, and the electronic component 3. The housing 2 is configured to hold the plurality of contacts 1 in a state of being aligned in one direction (left-right direction). The electronic component 3 is bonded to two or more contacts 1 among the plurality of contacts 1. The plurality of contacts 1 include a first contact 11 to which the electronic component 3 is bonded and a second contact 12 to which the electronic component 3 is not bonded. The electronic component 3 is joined to one end (joining piece 113) of the first contact 11 exposed from the housing 2.

  According to this configuration, it is possible to reduce the size while mounting the electronic component 3.

  Further, in the connectors 100 to 103 according to the second aspect, in the first aspect, the housing 2 has a recess 26 in which at least a part of the electronic component 3 is accommodated in a portion where the first contact 11 is held.

  According to this configuration, when at least a part of the electronic component 3 is received in the recess 26, a portion where the electronic component 3 is exposed from the housing 2 is reduced, and the connectors 100 to 103 can be downsized. For example, in the connector 100 of the embodiment, the dimension in the short side direction (vertical direction) of the housing 2 is smaller than that in the case where the housing 2 does not have the recess 26. Of course, it is not essential that the housing 2 has the recess 26, and whether or not the housing 2 has the recess 26 is arbitrary.

  In the connectors 100 to 105 according to the third aspect, in the first or second aspect, the plurality of contacts 1 are pushed into the plurality of storage portions 25 provided in the housing 2, respectively.

  According to this configuration, when the connectors 100 to 105 are manufactured, the plurality of contacts 1 can be easily attached to the housing 2 by taking a step of pushing the plurality of contacts 1 into the plurality of storage portions 25 respectively. Of course, it is not essential that the plurality of contacts 1 are pushed into the plurality of storage portions 25 of the housing 2. That is, the plurality of contacts 1 may be attached to the housing 2 by other processes.

  In the connectors 100 to 105 according to the fourth aspect, in the first or second aspect, the housing 2 may be insert-molded with the plurality of contacts 1 as inserts.

  According to this configuration, when the connectors 100 to 105 are manufactured, the plurality of contacts 1 can be easily attached to the housing 2 by taking the step of insert-molding the housing using the plurality of contacts 1 as inserts. Of course, it is not essential that the housing 2 is insert-molded with the plurality of contacts 1 as inserts. That is, the plurality of contacts 1 may be attached to the housing 2 by other processes.

  In the connectors 100 to 105 according to the fifth aspect, in the fourth aspect, the electronic component 3 may be bonded to the first contact 11 with a bonding material. The melting point of the bonding material is higher than the maximum temperature at the time of insert molding of the housing 2.

  According to this configuration, even when the electronic component 3 is joined to the first contact 11, the housing 2 can be insert-molded using the plurality of contacts 1 as inserts, thereby improving the degree of freedom in the manufacturing process. be able to. Of course, it is not essential that the electronic component 3 is bonded to the first contact 11 by the bonding material. For example, as in the connector 100 of the embodiment, when the housing 2 is not insert-molded using the plurality of contacts 1 as inserts, the electronic component 3 may be joined to the first contact 11 by soldering or welding.

  In the connectors 100 and 102 to 104 according to the sixth aspect, the shape of the first contact 11 is different from the shape of the second contact 12 in any one of the first to fifth aspects.

  According to this configuration, when the connectors 100 and 102 to 104 are manufactured, it is easy to understand which of the plurality of contacts 1 should be joined with the electronic component 3.

  In the connectors 101 and 105 according to the seventh aspect, in any of the first to fifth aspects, the first contact 11 and the second contact 12 have the same shape.

  According to this configuration, since the process for manufacturing the first contact 11 and the process for manufacturing the second contact 12 can be made common, the process for manufacturing the connectors 101 and 105 can be simplified. .

  Moreover, the connectors 100 and 102 of the eighth aspect include a plurality of electronic components 3 in any one of the first to seventh aspects.

  According to this configuration, the connectors 100 and 102 having functions according to the specifications of the electronic device can be realized.

  Moreover, in the connectors 104 and 105 of the ninth aspect, in any one of the first to eighth aspects, the plurality of contacts 1 and the housing 2 are configured as male connectors.

  According to this configuration, the connectors 104 and 105 can be used for connection to a female connector such as a socket, for example.

  Moreover, in the connectors 100 to 103 of the tenth aspect, in any one of the first to eighth aspects, the plurality of contacts 1 and the housing 2 are configured as female connectors.

  According to this configuration, connectors 100 to 103 can be used for connection with a male connector such as a header, for example.

  In the connector 103 according to the eleventh aspect, in any one of the first to tenth aspects, the electronic component 3 is connected to the two or more first contacts 11 located on both sides of the one or more second contacts 12. It is joined.

  According to this configuration, the electronic component 3 can be bonded to the first contact 11 regardless of the size of the electronic component 3 (the dimension in the direction in which the plurality of contacts 1 are arranged). For example, when the electronic component 3 is joined to the pair of first contacts 11, the pair of first contacts 11 may not be adjacent to each other and may be separated from each other according to the dimensions of the electronic component 3.

  In the connector 102 of the twelfth aspect, in any one of the first to eleventh aspects, the electronic component 3 is joined to three or more first contacts 11.

  According to this configuration, the connector 102 on which the electronic component 3 having three or more electrodes is mounted can be realized.

  Moreover, in the connectors 100 and 102 to 104 according to the thirteenth aspect, in any one of the first to twelfth aspects, the first contact 11 is configured to be joined to the substrate via the electronic component 3. .

  According to this configuration, even when the first contact 11 is positioned away from the substrate when the second contact 12 is bonded to the substrate, the first contact 11 can be electrically connected to the substrate. Further, according to this configuration, only the electrode (the first electrode 31 or the second electrode 32) on one side of the electronic component 3 may be joined to the first contact 11. Therefore, in this configuration, since it is not necessary to join the electrodes on both sides of the electronic component 3 to the first contact 11, manufacturing is easy.

  The connector 100 according to the embodiment and the connectors 101 to 105 according to modifications have been described above. However, the embodiment and the modification described above are only one of various embodiments of the present invention. The above-described embodiments and modifications can be variously changed depending on the design or the like as long as the object of the present invention can be achieved.

DESCRIPTION OF SYMBOLS 1 Contact 11 1st contact 12 2nd contact 2 Housing 25 Storage part 26 Recess 3 Electronic component 100,101, ..., 105 Connector

Claims (13)

Multiple contacts,
A housing for holding the plurality of contacts in a state aligned in one direction;
An electronic component joined to two or more contacts of the plurality of contacts,
The plurality of contacts include a first contact to which the electronic component is bonded, and a second contact to which the electronic component is not bonded,
The electronic component is joined to one end of the first contact exposed from the housing.   The connector according to claim 1, wherein the housing has a recess in which at least a part of the electronic component is accommodated in a portion where the first contact is held.   The connector according to claim 1, wherein the plurality of contacts are respectively pushed into a plurality of storage portions provided in the housing.   The connector according to claim 1, wherein the housing is insert-molded with the plurality of contacts as inserts. The electronic component is bonded to the first contact by a bonding material,
The connector according to claim 4, wherein a melting point of the bonding material is higher than a maximum temperature during insert molding of the housing.   The connector according to claim 1, wherein a shape of the first contact is different from a shape of the second contact.   The connector according to claim 1, wherein the first contact and the second contact have the same shape.   The connector according to claim 1, comprising a plurality of the electronic components.   The connector according to claim 1, wherein the plurality of contacts and the housing are configured as male connectors.   The connector according to claim 1, wherein the plurality of contacts and the housing are configured as female connectors.   11. The connector according to claim 1, wherein the electronic component is joined to two or more first contacts located on both sides of the one or more second contacts. 11.   The connector according to claim 1, wherein the electronic component is joined to three or more first contacts.   The connector according to any one of claims 1 to 12, wherein the first contact is configured to be bonded to a substrate via the electronic component.

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