CN220711724U

CN220711724U - Chip electronic device

Info

Publication number: CN220711724U
Application number: CN202321825998.XU
Authority: CN
Inventors: 唐建平; 李圣佳; 吕提; 刘胜军
Original assignee: Shenzhen Shinning Electronic Co ltd
Current assignee: Shenzhen Shinning Electronic Co ltd
Priority date: 2023-07-12
Filing date: 2023-07-12
Publication date: 2024-04-02
Anticipated expiration: 2033-07-12

Abstract

The utility model discloses a chip electronic device, which comprises a pair of conducting mechanisms fixedly connected with each other, wherein each conducting mechanism comprises a chip assembly and a connecting assembly, each chip assembly comprises a circuit board and a chip group fixedly connected with the circuit board, the connecting assembly is connected with the chip group in a mode of welding before glue filling, and the chip electronic device realizes the transmission of current and signals between the two chip assemblies through the connecting assembly. The chip electronic device has no worry of colloid retention and false pulling, can meet various height requirements, comprises the total height between two chip sets and the height of the components, wherein a single chip set comprises the components, and can protect the precise components on the chip from being affected by falling foreign objects and natural corrosion in an integral glue filling mode, so that the stability and the service life of the whole device are ensured.

Description

Chip electronic device

Technical Field

The present disclosure relates to electronic devices, and particularly to a chip electronic device.

Background

At present, the server chip set has the use scene that two PCBs are placed in parallel, the middle of the server chip set needs to be kept as a connector with a fixed height distance, the chips on the boards are opposite, larger current and signals need to be transmitted between the opposite chips on the two PCBs, and no good solution exists at present.

The existing products have the following limitations in practicality: the conventional male and female connector holders, such as conventional pin header and round pin round hole type connector, all comprise a plastic body which is about 2.00mm high in the connector industry, and the main colloid cannot be removed and damaged later. Therefore, the height combination value between two subsequent PCBs is limited, the height of a single PCB is more than or equal to 2mm, and the total height of the connector is more than or equal to 4mm. And after the male and female seats of the existing connector are welded on the board at high temperature, the retention force between the terminals and the colloid is reduced. The gel risks disengaging from the terminals, thereby losing the insulating and supporting effect of the gel. Secondly, the server chip set does not need to have a circuit breaking function, and the male and female seats of the existing connector can be plugged in and pulled out, and correspond to a passage and an open circuit, and the risk of carelessly breaking the circuit by manual operation is caused.

Disclosure of Invention

The utility model aims to provide a chip electronic device.

The technical scheme adopted for solving the technical problems is as follows: a chip electronic device is constructed, which comprises a pair of conducting mechanisms fixedly connected with each other, wherein each conducting mechanism comprises a chip component and a connecting component;

each chip assembly comprises a circuit board and a chip set fixedly connected with the circuit board, the connection assemblies are connected with the chip set in a mode of welding and then glue filling, and one connection assembly is connected with the other connection assembly through welding;

the chip electronic device realizes the transmission of current and signals between the two chip components through the connecting component.

In some embodiments, the connection components are distributed in a cross shape on the chipset or the connection components are distributed in a zig-zag shape on the chipset.

In some embodiments, the connection assembly includes at least one signal transmission connector and a plurality of current transmission connectors, each signal transmission connector including a mounting base and a plurality of signal transmission terminals provided on the mounting base, each signal transmission terminal being electrically connected to the chipset;

in some embodiments, the signal transmission terminal has a diameter of 0.5mm and is made of pure copper material.

In some embodiments, each of the current transfer connectors includes a current transfer member having an inverted U-shaped structure in an initial state, the current transfer member having a thickness of 3.5mm, and the current transfer member being made of a pure copper material.

In some embodiments, the connection assembly includes a plurality of conductive connectors, each of the conductive connectors including a mounting body and a plurality of conductive terminals disposed on the mounting body, each of the conductive terminals electrically connected to the chipset;

a part of the plurality of conductive terminals is used for transmitting signals, and the other part is used for transmitting current.

In some embodiments, the conductive terminal is 0.5mm in diameter and is made of pure copper material.

The implementation of the utility model has the following beneficial effects: this chip electron device passes through the fixed connection of coupling assembling and chipset and the fixed connection between two coupling assembling, can make chip electron device have the worry of colloid holding power, and the worry of no malocclusion can satisfy various high demands, including total height between two chipsets and the height that single chipset contained above components and parts, adopts the mode of whole encapsulating to protect the accurate components and parts on the chip to avoid the invasion and the natural erosion of dropping the foreign object, guarantees the stability and the life of whole device.

Drawings

In order to more clearly illustrate the technical solution of the present utility model, the following description will be given with reference to the accompanying drawings and examples, it being understood that the following drawings only illustrate some examples of the present utility model and should not be construed as limiting the scope, and that other related drawings can be obtained from these drawings by those skilled in the art without the inventive effort. In the accompanying drawings:

FIG. 1 is a diagram illustrating an assembly process of a chip electronic device according to some embodiments of the present utility model when a connection assembly is in a first configuration;

FIG. 2 is an exploded view of a connection assembly of a chip electronic device according to some embodiments of the utility model in a first configuration;

FIG. 3 is a block diagram of a cross-shaped arrangement on a chip assembly when the connection assembly is in a first configuration in some embodiments of the utility model;

FIG. 4 is a block diagram of a first configuration of a connection assembly in accordance with some embodiments of the present utility model in a zig-zag arrangement on a chip assembly;

FIG. 5 is a perspective view of a completed assembly of a chip electronic device in accordance with some embodiments of the utility model;

FIG. 6 is a front view block diagram of a chip electronic device after assembly in accordance with some embodiments of the utility model;

FIG. 7 is a diagram illustrating an assembly process of a chip electronic device according to some embodiments of the present utility model when the connection assembly is in a second configuration;

FIG. 8 is a block diagram of a connection assembly of a chip electronic device according to some embodiments of the utility model in a second configuration;

fig. 9 is a block diagram of a second configuration of a connection assembly according to some embodiments of the present utility model in a zig-zag arrangement on a chip assembly.

Detailed Description

For a clearer understanding of technical features, objects and effects of the present utility model, a detailed description of embodiments of the present utility model will be made with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "rear", "upper", "lower", "left", "right", "longitudinal", "transverse", "vertical", "horizontal", "top", "bottom", "inner", "outer", "head", "tail", etc. are configured and operated in specific directions based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model, and do not indicate that the apparatus or element to be referred to must have specific directions, and thus should not be construed as limiting the present utility model.

It should also be noted that unless explicitly stated or limited otherwise, terms such as "mounted," "connected," "secured," "disposed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or one or more intervening elements may also be present. The terms "first," "second," "third," and the like are used merely for convenience in describing the present utility model and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby features defining "first," "second," "third," etc. may explicitly or implicitly include one or more such features. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

Referring to fig. 1 to 9, a chip electronic device according to some embodiments of the present utility model is mainly used for current and signal transmission in the field of server chips, and includes a pair of conducting mechanisms 1 fixedly connected to each other, each conducting mechanism 1 includes a chip assembly 11 and a connection assembly 12 connected to the chip assembly 11, and the chip electronic device is configured to implement current and signal transmission between the two chip assemblies 11 through the connection assembly 12.

Each chip assembly 11 comprises a circuit board 111 and a chip set 112 fixedly connected with the circuit board 111, the circuit board 111 and the chip set 112 can be fixedly connected in a welding mode or an injection molding mode to form an independent assembly, and the assembly among the assemblies can be sequentially assembled in an automatic mode, so that the production efficiency is improved.

Meanwhile, the connection assemblies 12 may be connected to the chipset 112 by soldering and then glue filling, and one connection assembly 12 is connected to another connection assembly 12 by soldering. It will be appreciated that the retention between the terminals and the gel is reduced due to the high temperature soldering of the male and female sockets of the prior art connectors to the board. The gel has a risk of being separated from the terminals, so that insulation and supporting effects of the gel are lost, meanwhile, the server chipset 112 does not need to have a circuit breaking function, the existing male and female connector seats can be plugged in and pulled out, corresponding to a passage and an open circuit, and the risk of carelessly breaking the circuit by manual operation is caused. Therefore, in this embodiment, the connection components 12 are connected with the chipset 112 by welding, and the two connection components 12 are also connected together by welding, so that the risk that the connection components 12 fall off on the chipset 112 is avoided, the risk that the circuit is disconnected carelessly by manual operation is avoided, the connection firmness between the connection components 12 is enhanced, and the stability and the safety of the chip electronic device during working are ensured.

In addition, the chip set 112 has a large number of extremely precise electronic components, so as to avoid short circuit and open circuit caused by falling, invasion and natural erosion of foreign objects, for example, the components of the chip electronic device are easy to erode and cause open circuit and short circuit under severe environments such as humidity, dust and the like, so that the whole glue filling treatment is performed between the connecting component 12 and the chip set 11211 in the implementation to protect a large number of extremely precise electronic components of the chip set 112, ensure that the chip electronic device can normally work under the severe environments, and improve the applicability and the safety. The glue filling method can adopt epoxy pouring glue or UV glue pouring glue.

Meanwhile, the prior connector female seat structure can not be filled with glue, a hole of the female seat can be blocked, a male seat terminal can not be inserted into contact with the female seat terminal, and the connection function is lost. In this embodiment, the connection assembly 12 and the chipset 112 are connected by welding and then glue filling, so that the connection assembly 12 and the chipset 112 are electrically welded and connected, and then glue filling is performed integrally, thereby avoiding the risk that the connection part of the connection assembly 12 is blocked after glue filling integrally so as not to be in contact with the chipset 112.

In this embodiment, the structural form of the connection assembly 12 can be divided into two types, and the first structural form of the connection assembly 12 is as follows: the connection assembly 12 includes at least one signal transmission connector 121 and a plurality of current transmission connectors 122, as shown in fig. 2, each signal transmission connector 121 includes a mounting base 1211 and a plurality of signal transmission terminals 1212 disposed on the mounting base 1211, and each signal transmission terminal 1212 is electrically connected to the chipset 112. The signal transmission connector 121 is used for transmitting signals between the two chipsets 112, and the current transmission connector 122 is used for transmitting current between the two chipsets 112.

The mounting base 1211 may be made of a hard insulating material, such as a phenolic plastic, a polyurethane plastic, an epoxy plastic, an unsaturated polyester plastic, a furan plastic, a silicone resin, an acryl resin, and the like, and modified resins thereof.

Preferably, the signal transmission terminal 1212 is made of pure copper material. It can be appreciated that, since the connection mode of the signal transmission terminal 1212 is a welding and fixing connection mode in this embodiment, a brand new terminal structure is used, the space temporary use of the female terminal is reduced without separating the male terminal from the female terminal, and since there is no female terminal, a metal material with relatively poor elasticity but stronger conductivity, such as pure copper, can be used to facilitate power transmission, the transmission terminal can be made of pure copper material, which has excellent conductivity, the conductivity of pure copper is very stable, and even in severe environments such as high temperature, high humidity, etc., the conductivity of pure copper will not change significantly.

The diameter of the signal transmission terminal 1212 is 0.5mm, each transmission terminal can be in a cylindrical shape, and can be processed and finished by a wire drawing die in a mode of wire drawing and cutting, and the diameter of each signal transmission terminal 1212 is 0.5mm, so that the requirement of 4A/PIN transmission signals can be completely met. In other embodiments, in the first configuration of the connection assembly 12, the signal transmission terminal 1212 may be used to transmit current according to actual requirements, and if a larger current is to be transmitted, the cylindrical terminal may be increased in diameter.

Each of the current transmission connectors 122 includes a current transmission member 1221, the current transmission member 1221 has an inverted U-shaped structure in an initial state, the thickness of the current transmission member 1221 is 3.5mm, and the current transmission member 1221 is made of pure copper material.

It can be appreciated that the current transmission member 1221 is an integral inverted U-shaped terminal in the initial state, and is also made of pure copper material, and can be manufactured by stamping process, and the current transmission member 1221 is equivalent to a combination of a plurality of signal transmission terminals 1212, and the gaps between the terminals are filled, thereby maximally utilizing the space. If the thickness of the current transmission member 1221 is equal to the total thickness of 7 signal transmission terminals 1212, the maximum current that can be transmitted can be doubled, which is: 4×7×2=56a, the ability to transmit current is further greatly enhanced.

In addition, when the chip electronic device is used, the arrangement and the number of the corresponding connector assemblies can be selected according to the arrangement n×m of the chip sets 112, and in this embodiment, the arrangement of the chip sets 112 is 2×2, as shown in fig. 3 and fig. 4, the arrangement of the connector assemblies 12 on the respective chip sets 112 may be cross-shaped or in a field shape. More specifically, in the first structural form of the connection member 12, the connection member 12 is arranged in a cross-like form, the number of the signal transmission connectors 121 is one, which is located in the middle, and the current transmission connector 122 is circumferentially enclosed around the signal transmission connector 121, forming a cross as a whole. When the connection assemblies 12 are arranged in a delta-shaped form, the signal transmission connectors 121 and the current transmission connectors 122 can be fully distributed with the contacts on each chipset 112, and the signal transmission connectors 121 and the current transmission connectors 122 are staggered to form a delta-shaped form as a whole, so that any one of the contacts on the chip can not be wasted. In other embodiments, the arrangement of the connection assemblies 12 may be appropriately adjusted according to the arrangement of the chipset 112, which is not particularly limited herein.

As shown in fig. 8, the second structural form of the connecting assembly 12 is: the connection assembly 12 includes a plurality of conductive connectors 123, each conductive connector 123 including a mounting body 1231 and a plurality of conductive terminals 1232 disposed on the mounting body 1231, each conductive terminal 1232 being electrically connected to the chipset 112, a portion of the plurality of conductive terminals 1232 being configured to transmit signals and another portion being configured to transmit electrical current. The customer can flexibly select the function of the conductive terminal 1232 according to the actual demand.

The diameter of the conductive terminal 1232 is preferably 0.5mm, and is also made of pure copper material, and likewise, the requirement of 4A/PIN signal transmission can be completely met by adopting a 0.5mm diameter design, and if larger current is required to be transmitted, the diameter of the cylindrical terminal can be increased to meet the requirement.

As shown in fig. 7 and 9, the second configuration of the connector assembly 12 is arranged in a manner consistent with the first configuration thereof and will not be described in detail herein.

In this embodiment, the chip electronic device may be assembled according to the following steps, as shown in fig. 1 and fig. 7, which are as follows:

step S10: completing the pre-installation of the chip assembly 11 and the connection assembly 12;

step S20: after the connecting component 12 and the chip component 11 are welded and fixed, glue filling is carried out, and then grinding is carried out;

step S30: one of the conducting mechanisms 1 is connected with the other conducting mechanism 1 through welding to form a final chip electronic device, and the whole structure of the chip electronic device after completion is shown in fig. 5 and 6.

It will be appreciated that in the present embodiment, the structural form of the connection assembly 12 is divided into two, so that in step S20, the division of the execution steps is performed according to two different structural forms thereof.

Specifically, referring to fig. 1, in step S20, if the connection assembly 12 includes at least one signal transmission connector 121 and a plurality of current transmission connectors 122, during the polishing process, a polishing machine is used to polish all the signal transmission connectors 121 and the current transmission connectors 122 respectively until the current transmission connectors 122 are polished into two parts, and the polished surfaces of the signal transmission connectors 121 and the current transmission connectors 122 are on the same plane after being polished. Wherein, during the glue filling process, glue material is used to fill the glue to be flush with or slightly lower than the upper surface of the mounting block 1211. The mounting base 1211 may be completely ground off during grinding, and flatness is ensured, and finally one of the connection assemblies 12 is reversely soldered in step S30, so as to form an integral chip electronic device.

It will be appreciated that the signal transmission connector 121 and the current transmission connector 122 may be ground to meet various height requirements for applications, including the total height between the two chip sets 112 and the height of the components included in the single chip set 112, and meanwhile, the chip electronic device may accept a process of filling glue and grinding, so that other electronic components on the chip set 112 may be effectively protected, and conduction may not be affected.

In addition, referring to fig. 7, in step S20, if the connection assembly 12 includes a plurality of conductive connectors 123, during the polishing process, a polishing machine is used to polish all the conductive connectors 123, so that the polished surfaces of the plurality of conductive connectors 123 are on the same plane. The processing manner and principle are basically the same as those of the first structural form described above, and will not be described in detail here.

In summary, the chip electronic device and the assembling method thereof have the following beneficial effects:

1. the chip electronic device can transmit extremely large current in extremely small space through the current transmission piece 1221 with larger thickness, and can flexibly select whether the terminal is used for transmitting signals or not through the arrangement of the conductive terminal 1232;

2. grinding the connection assembly 12 to a suitable height after pre-installation is completed can meet various height requirements, including the overall height between the two chipsets 112 and the height of the individual chipsets 112 containing the components above;

3. the fixed connection of the connecting component 12 and the chip set 112 and the fixed connection between the two connecting components 12 can lead the chip electronic device to have no concern about colloid retention and no concern about false pull;

4. the method of integral glue filling can protect precise components on the chip from being affected by falling foreign objects and natural corrosion, and ensures the stability and the service life of the whole device.

It is to be understood that the above examples only represent preferred embodiments of the present utility model, which are described in more detail and are not to be construed as limiting the scope of the utility model; it should be noted that, for a person skilled in the art, the above technical features can be freely combined, and several variations and modifications can be made without departing from the scope of the utility model; therefore, all changes and modifications that come within the meaning and range of equivalency of the claims are to be embraced within their scope.

Claims

1. A chip electronic device is characterized by comprising a pair of conducting mechanisms (1) fixedly connected with each other, wherein each conducting mechanism (1) comprises a chip assembly (11) and a connecting assembly (12),

each chip assembly (11) comprises a circuit board (111) and a chip set (112) fixedly connected with the circuit board (111), the connection assemblies (12) are connected with the chip set (112) in a mode of welding before glue filling, and one connection assembly (12) is connected with the other connection assembly (12) through welding;

the chip electronic device is connected with the connecting component (12) to realize the transmission of current and signals between the two chip components (11).

2. The chip electronic device according to claim 1, wherein the connection components (12) are distributed in a cross shape on the chip set (112) or the connection components (12) are distributed in a zig-zag shape on the chip set (112).

3. The chip electronic device according to claim 1, wherein the connection assembly (12) comprises at least one signal transmission connector (121) and a plurality of current transmission connectors (122), each signal transmission connector (121) comprising a mounting seat (1211) and a plurality of signal transmission terminals (1212) provided on the mounting seat (1211).

4. A chip electronic device according to claim 3, wherein each of the signal transmission terminals (1212) is electrically connected to the chipset (112).

5. A chip electronic device according to claim 3, characterized in that the diameter of the signal transmission terminal (1212) is 0.5mm and the signal transmission terminal (1212) is made of pure copper material.

6. A chip electronic device according to claim 3, wherein each of the current transfer connectors (122) comprises a current transfer member (1221), the current transfer members (1221) having an inverted U-shaped structure in an initial state.

7. The chip electronic device according to claim 6, wherein the thickness of the current transmission member (1221) is 3.5mm, and the current transmission member (1221) is made of pure copper material.

8. The chip electronic device according to claim 1, wherein the connection assembly (12) comprises a plurality of conductive connectors (123), each conductive connector (123) comprising a mounting body (1231) and a plurality of conductive terminals (1232) provided on the mounting body (1231).

9. The chip electronic device according to claim 8, wherein each of the conductive terminals (1232) is electrically connected to the chipset (112);

a part of the plurality of conductive terminals (1232) is used for transmitting signals, and the other part is used for transmitting current.

10. The chip electronic device according to claim 8, wherein the diameter of the conductive terminal (1232) is 0.5mm, and the conductive terminal (1232) is made of pure copper material.