JP2018051759A - 終始一貫したパッド表面の微小テクスチャを有するケミカルメカニカル研磨パッド - Google Patents

終始一貫したパッド表面の微小テクスチャを有するケミカルメカニカル研磨パッド Download PDF

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Publication number
JP2018051759A
JP2018051759A JP2017184625A JP2017184625A JP2018051759A JP 2018051759 A JP2018051759 A JP 2018051759A JP 2017184625 A JP2017184625 A JP 2017184625A JP 2017184625 A JP2017184625 A JP 2017184625A JP 2018051759 A JP2018051759 A JP 2018051759A
Authority
JP
Japan
Prior art keywords
cmp
pad
polishing layer
polishing
chemical mechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2017184625A
Other languages
English (en)
Japanese (ja)
Inventor
ジェフリー・ジェームズ・ヘンドロン
James Hendron Jeffrey
ジェフリー・ロバート・スタック
Robert Stack Jeffrey
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm and Haas Electronic Materials CMP Holdings Inc
Original Assignee
Rohm and Haas Electronic Materials CMP Holdings Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm and Haas Electronic Materials CMP Holdings Inc filed Critical Rohm and Haas Electronic Materials CMP Holdings Inc
Publication of JP2018051759A publication Critical patent/JP2018051759A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/205—Lapping pads for working plane surfaces provided with a window for inspecting the surface of the work being lapped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B24B37/245—Pads with fixed abrasives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2017184625A 2016-09-29 2017-09-26 終始一貫したパッド表面の微小テクスチャを有するケミカルメカニカル研磨パッド Pending JP2018051759A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/279,689 2016-09-29
US15/279,689 US20180085888A1 (en) 2016-09-29 2016-09-29 Chemical mechanical polishing pads having a consistent pad surface microtexture

Publications (1)

Publication Number Publication Date
JP2018051759A true JP2018051759A (ja) 2018-04-05

Family

ID=61563983

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017184625A Pending JP2018051759A (ja) 2016-09-29 2017-09-26 終始一貫したパッド表面の微小テクスチャを有するケミカルメカニカル研磨パッド

Country Status (7)

Country Link
US (1) US20180085888A1 (de)
JP (1) JP2018051759A (de)
KR (1) KR20180035698A (de)
CN (1) CN107877360A (de)
DE (1) DE102017008998A1 (de)
FR (1) FR3056430A1 (de)
TW (1) TW201829125A (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11078380B2 (en) 2017-07-10 2021-08-03 Entegris, Inc. Hard abrasive particle-free polishing of hard materials
US11389928B2 (en) * 2017-11-30 2022-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method for conditioning polishing pad
CN108994723A (zh) * 2018-08-03 2018-12-14 成都时代立夫科技有限公司 一种cmp复合沟槽抛光垫
CN114762955A (zh) * 2022-03-14 2022-07-19 宁波赢伟泰科新材料有限公司 一种间断性圆弧沟槽抛光垫

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6641471B1 (en) * 2000-09-19 2003-11-04 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
WO2003082524A1 (en) 2002-03-25 2003-10-09 Thomas West, Inc Smooth pads for cmp and polishing substrates
US7985122B2 (en) * 2006-06-13 2011-07-26 Freescale Semiconductor, Inc Method of polishing a layer using a polishing pad
US9415479B2 (en) * 2013-02-08 2016-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Conductive chemical mechanical planarization polishing pad
US9238296B2 (en) * 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
CN104149023A (zh) * 2014-07-17 2014-11-19 湖北鼎龙化学股份有限公司 化学机械抛光垫

Also Published As

Publication number Publication date
TW201829125A (zh) 2018-08-16
DE102017008998A1 (de) 2018-03-29
US20180085888A1 (en) 2018-03-29
KR20180035698A (ko) 2018-04-06
FR3056430A1 (fr) 2018-03-30
CN107877360A (zh) 2018-04-06

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