JP2018051668A - Polishing pad, method for manufacturing the same, and method for manufacturing polished object - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a polishing pad that is excellent in polishing rate and excellent in surface quality of an object to be polished and acquired, and to provide a method for manufacturing the same and a method for manufacturing a polished object using a polishing pad.SOLUTION: A polishing pad includes: a knitted fabric 1 knitted with a warp and a weft; and a resin impregnated to the knitted fabric. The knitted fabric contains parallel arrangement knitting yarn constituted by parallelly arranging two or more sorts of fibers having different melting points.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a polishing pad, a method for manufacturing the same, and a method for manufacturing a polished article.

In recent years, materials such as silicon carbide (SiC), gallium nitride (GaN), diamond, sapphire (Al ₂ O ₃ ), and aluminum nitride (AlN), which are wide band gap semiconductors, have attracted attention as next-generation power semiconductor device materials. Yes. For example, silicon carbide (SiC) has excellent physical properties such as three times the band gap and about seven times the dielectric breakdown electric field strength compared to Si semiconductors, and operates at higher temperatures than current silicon semiconductors. It is excellent in that it is excellent in performance, small size, and high energy saving effect. For sapphire wafers, electronic devices with optical elements, such as high-performance overhead projectors, due to their chemical stability, optical properties (transparency), mechanical strength, thermal properties (thermal conductivity), etc. The importance as an industrial part is increasing. For the full-scale spread of these next-generation power devices, the substrate diameter and mass production have been promoted, and the importance of substrate processing technology has increased accordingly.

  In the processing process, similarly to Si, a cylindrical single crystal (ingot) used for a wafer is sliced and cut into a disk shape. Next, the surface of the sliced disk-shaped single crystal is flattened. First, in order to roughly remove the roughness of the surface, primary lapping polishing (rough lapping), secondary lapping polishing ( Finish lapping). Thereafter, primary polishing (rough polishing) and secondary polishing (finish polishing) are performed to further improve the flatness of the surface of the sliced disk-shaped single crystal and to remove the fine scratches on the surface to make a mirror surface. Do.

  Conventionally, in a lapping process for a general Si semiconductor wafer or the like, a semiconductor wafer polishing cloth in which a felt-like fibrous sheet is impregnated with a thermoplastic polyurethane resin, a foamed polyurethane polishing pad, or the like is used (for example, Patent Document 1). In particular, as a lapping process for high-hardness materials such as SiC, which is much harder than Si, a metal surface plate such as copper and tin is used, and the surface plate and diamond abrasive grains are combined. Lapping (hereinafter also referred to as “diamond wrapping”) is known (for example, see Patent Document 2).

  Further, as a specific polishing method for primary polishing (rough polishing) and secondary polishing (finish polishing), chemical mechanical polishing (CMP) is generally employed. As a polishing pad used for CMP, for example, one end of a plurality of fiber members fixed with a resin-impregnated nonwoven fabric or polyurethane foam (for example, see Patent Document 3) or resin is exposed on a polishing surface for polishing a workpiece. A polishing pad formed in (1) is known.

Japanese Patent Laid-Open No. 5-8178 JP 2007-61961 A Japanese Patent Laid-Open No. 2001-205555 JP 2015-212462 A

  However, since the metal surface plate is heavy, it is difficult to handle, and there are problems that it requires labor for maintenance after use, such as maintenance of the surface of the surface plate where diamond abrasive grains are embedded. Further, when a general polishing cloth used for Si polishing is employed for processing SiC or the like, there is a problem that the lapping rate is low and it is not practical. Further, in addition to SiC, sapphire also has a modified Mohs hardness next to diamond and SiC, has high resistance to chemicals, and is extremely difficult to process. For this reason, in addition to general Si semiconductor wafers and the like, materials that are expected as next-generation power semiconductor element materials, especially wrapping materials that are excellent in handling and lapping rate in wrapping of difficult-to-process materials with high hardness Is desired.

  In addition, the resin-impregnated nonwoven fabric and foamed polyurethane disclosed in Patent Document 3 have a problem that the polishing rate is low in polishing processing of materials expected as next-generation power semiconductor element materials, particularly difficult processing materials with high hardness. is there. Furthermore, the resin-impregnated non-woven fabric is a non-woven fabric composed of short fibers, so that there is little entanglement between the fibers, and the fibers detached during polishing cause scratches on the workpiece (object to be polished), so that the surface quality is inferior. There are also drawbacks.

  And, in the polishing pad as disclosed in Patent Document 4, since the fiber does not have a structure such as a knitted fabric structure, the fiber is more easily detached than the nonwoven fabric, and the work is scratched, resulting in poor surface quality. There is a problem.

  The present invention has been made in view of the above circumstances, and has a polishing pad excellent in polishing rate and excellent in surface quality of an object to be obtained, a manufacturing method thereof, and a manufacturing method of a polishing object using the polishing pad The purpose is to provide. The polishing pad of the present invention includes primary lapping polishing (rough lapping), secondary lapping polishing (finish lapping), primary polishing (rough polishing), secondary polishing (finish polishing), and a plurality of these polishings (hereinafter referred to as “polishing lapping”). , Collectively referred to simply as “polishing”). In addition, when “polishing rate” is described without particularly limiting the distinction between primary lapping polishing, secondary lapping polishing, primary polishing, and secondary polishing, “polishing rate” includes “lapping rate”. Shall be.

  The present inventors diligently studied to solve the above problems. As a result, the above problem is solved if the polishing pad is provided with a knitted fabric having an aligned knitting yarn composed of two or more types of fibers having different melting points and a resin impregnated in the knitted fabric. The present invention was completed by finding out what can be done.

That is, the present invention is as follows.
[1]
A knitted fabric knitted by warp knitting or weft knitting, and a resin impregnated in the knitted fabric,
The knitted fabric includes an aligned knitting yarn configured by aligning two or more kinds of fibers having different melting points;
Polishing pad.
[2]
The knitting yarn constituting the front and back surfaces of the knitted fabric includes the aligned knitting yarn,
The polishing pad according to [1].
[3]
Among the two or more types of fibers having different melting points, the melting point of the fiber having the lowest melting point is 50 to 180 ° C.
The polishing pad according to [1] or [2].
[4]
Among the two or more types of fibers having different melting points, the melting point of the fiber having the highest melting point is 200 to 400 ° C.
The polishing pad according to any one of [1] to [3].
[5]
At least a part of the fibers constituting the knitted fabric is false twisted yarn,
The polishing pad according to any one of [1] to [4].
[6]
Having a cross-section cut in the surface direction of the knitted fabric as a polishing surface,
The polishing pad according to any one of [1] to [5].
[7]
The resin includes a first resin and a second resin different from the first resin;
The second resin is a reaction product of a urethane prepolymer having an NCO equivalent of 400 or less and a curing agent.
The polishing pad [8] according to any one of [1] to [6]
The resin includes a first resin and a second resin different from the first resin;
The content of the knitted fabric is 30 to 60% by mass with respect to the total amount of the knitted fabric, the first resin, and the second resin.
The polishing pad according to any one of [1] to [7].
[9]
The number average diameter of the single yarn constituting the knitted fabric is 3 to 30 μm.
The polishing pad according to any one of [1] to [8].
[10]
The surface roughness Ra of the polished surface is 25 to 80 μm.
The polishing pad according to any one of [1] to [9].
[11]
The compression rate is 0.5 to 20%.
The polishing pad according to any one of [1] to [10].
[12]
The compression modulus is 50 to 98%,
The polishing pad according to any one of [1] to [11].
[13]
A hardness is 50-98 degrees,
The polishing pad according to any one of [1] to [12].
[14]
The thickness is 1.0 to 5.0 mm.
The polishing pad according to any one of [1] to [13].
[15]
A knitted fabric knitted by warp knitting or weft knitting, including an aligned knitting yarn composed of two or more types of fibers having different melting points, has a melting point of two or more types of fibers having different melting points. A heat setting step of heating at a temperature not lower than the melting point of the lowest fiber and lower than the melting point;
A primary impregnation step of impregnating the knitted fabric with a resin solution containing a first resin and performing wet coagulation to obtain a resin-impregnated knitted fabric;
An immersion step of immersing the resin-impregnated knitted fabric in an immersion liquid containing a solvent in which the first resin is soluble;
A secondary impregnation step of impregnating the resin-impregnated knitted fabric after the immersion step with a solution containing a urethane prepolymer having an NCO equivalent of 400 or less and a curing agent,
Manufacturing method of polishing pad.
[16]
A cutting step of cutting the resin-impregnated knitted fabric after the dipping step in the surface direction of the knitted fabric,
[15] The method for producing a polishing pad according to [15].
[17]
The first resin is soluble in one or more selected from the group consisting of N, N-dimethylformaldehyde, dimethylacetamide, methyl ethyl ketone and dimethyl sulfoxide;
[15] The method for producing a polishing pad according to [16].
[18]
The solvent includes one or more solvents selected from the group consisting of N, N-dimethylformaldehyde, dimethylacetamide, methyl ethyl ketone, and dimethyl sulfoxide.
[15] The method for producing a polishing pad according to any one of [17].
[19]
Using the polishing pad according to any one of [1] to [14], the method includes a polishing step of polishing an object to be polished.
A method for producing an abrasive.

  INDUSTRIAL APPLICABILITY According to the present invention, it is possible to provide a polishing pad that is excellent in polishing rate and excellent in surface quality of an object to be obtained, a manufacturing method thereof, and a manufacturing method of a polishing object using the polishing pad.

It is a conceptual diagram which shows the cutting process in the manufacturing method of the polishing pad of this embodiment.

  Hereinafter, a form for carrying out the present invention (hereinafter simply referred to as “the present embodiment”) will be described in detail with reference to the drawings as necessary. Further, the positional relationship such as up, down, left and right is based on the positional relationship shown in the drawings unless otherwise specified. Further, the dimensional ratios in the drawings are not limited to the illustrated ratios. In the present embodiment, “fiber” refers to a filament (multifilament) in which a plurality of single yarns (monofilaments) are assembled. The “knitting yarn” refers to a fiber supplied to a yarn feeder when a knitted fabric is manufactured, and an aligned knitting yarn constituted by two or more fibers having different melting points being aligned, and 1 Examples thereof include knitting yarns other than the aligned knitting yarns made of seed fibers.

[Polishing pad]
The polishing pad of this embodiment has a knitted fabric composed of warp knitting or weft knitting, and a resin impregnated in the knitted fabric, and the knitted fabric has two or more kinds of fibers having different melting points. Includes an aligned knitting yarn (hereinafter also simply referred to as “aligned knitting yarn”).

  A knitted fabric generally has a characteristic that it is easy to stretch and deform when a tension in the surface direction is applied. Therefore, a polishing pad using a knitted fabric has a problem that it is likely to be deformed due to a tension that can be applied in the manufacturing process or the like, or contraction / expansion when the impregnated resin is cured. Such deformation lowers the uniformity of the internal structure of the resulting polishing pad and the regularity of the uneven pattern on the polishing surface, and as a result, can affect the polishing rate and the surface quality of the object to be polished. On the other hand, in the polishing pad of this embodiment, the fibers having a low melting point are heat set (heat-fixed) by including an aligned knitting yarn configured by aligning two or more kinds of fibers having different melting points. It becomes possible to introduce a large number of fusion points in which the intersections of fibers having a low melting point are fused in the knitted fabric. By introducing such a fusion point, deformation of the knitted fabric can be suppressed, and as a result, it is possible to further improve the polishing rate and the surface quality of the workpiece to be obtained.

  Moreover, since the polishing pad of this embodiment has a knitted fabric and a resin, it is lighter than a metal surface plate and is excellent in handling and maintenance. Moreover, by using a knitted fabric composed of warp knitting or weft knitting, the polishing rate is superior to a polishing pad in which a nonwoven fabric is impregnated with a resin. By using a knitted fabric composed of warp knitting or weft knitting with a regular knitting structure, the internal structure of the polishing pad becomes more uniform, and the surface (polishing surface) of the polishing pad is regular. Although it is thought that it originates in having an uneven pattern, a reason is not limited to this.

  The polishing pad of this embodiment may have a cross section cut in the surface direction of the knitted fabric as a polishing surface. By providing a knitted fabric composed of warp knitting or weft knitting in a state of being cut in the surface direction, fiber end faces are uniformly distributed on the polished surface, and fiber detachment is suppressed. Therefore, the polishing rate is further improved, and the quality of the polished surface can be ensured. The cross-section in the surface direction of the knitted fabric may be a polished surface that is entirely covered with resin, or at least part of which is covered with resin, and the cross-section and cross-section that are not covered with resin. It may be a polished surface composed of a coated resin surface, or may be a polished surface that is not entirely coated with resin.

  Although not particularly limited, the polishing pad having the surface of the knitted fabric of the polishing pad as the polishing surface is particularly suitable for primary lapping polishing (rough lapping) and secondary lapping polishing (finish lapping), and the surface direction of the knitted fabric A polishing pad having a cross-section cut as a polishing surface is particularly suitable for chemical mechanical polishing (CMP) such as primary polishing (rough polishing) and secondary polishing (finish polishing).

  The surface roughness Ra of the polishing surface of the polishing pad is preferably 25 to 80 μm, more preferably 30 to 75 μm, and still more preferably 35 to 70 μm. When the surface roughness Ra is 25 μm or more, the polishing rate tends to be further improved. Further, when the surface roughness Ra is 80 μm or less, the surface quality of the object to be polished tends to be further improved. The surface roughness Ra can be measured by the method described in the examples. Further, the surface roughness Ra can be adjusted by selecting, for example, the knitting method of the knitted fabric, the type of fiber constituting the knitted fabric, the twisting method of the fiber, the number average diameter of the single yarn, and the like. .

  The compressibility of the polishing pad is preferably 0.5 to 20%, more preferably 1 to 10%, and further preferably 1 to 5%. When the compression ratio is 0.5% or more, the surface quality of the object to be polished is further improved, and the adhesion between the polishing pad and the object to be polished tends to be further improved. Further, when the compression rate is 20% or less, the polishing rate is further improved, and the deformation of the polishing pad tends to be further suppressed. In addition, a compression rate can be measured by the method as described in an Example. Further, the compression rate tends to increase by adjusting the density of the resulting polishing pad to be low, for example, in a preferable manufacturing method described later.

  The compression elastic modulus of the polishing pad is preferably 50 to 98%, more preferably 70 to 95%, and further preferably 80 to 90%. When the compression elastic modulus is 50% or more, the polishing rate is further improved and deformation of the polishing pad tends to be further suppressed. Moreover, it exists in the tendency for adhesiveness with to-be-polished material to improve more because a compression elastic modulus is 98% or less. The compression modulus can be measured by the method described in the examples. Further, for example, in a preferable manufacturing method described later, the compression elastic modulus tends to be increased by increasing the content of the second resin.

  The A hardness of the polishing pad is preferably 50 to 98 °, more preferably 60 to 95 °, and still more preferably 70 to 95 °. When the A hardness is 50 ° or more, the deformation of the polishing pad tends to be further suppressed. Moreover, when A hardness is 98 degrees or less, it exists in the tendency which adhesiveness with to-be-polished material improves more. In addition, A hardness can be measured by the method as described in an Example. Further, the A hardness tends to be increased by increasing the content of the second resin, for example, in a preferable manufacturing method described later.

  The density of the polishing pad is preferably 0.35 to 0.70, more preferably 0.35 to 0.60, and still more preferably 0.40 to 0.60. When the density is 0.35 or more, the permanent deformation of the polishing pad and the pressure drop at the action point due to the increase in the contact area with the object to be polished tend to be further suppressed. Further, when the density is 0.70 or less, the slurry retention tends to be further improved. In addition, a density can be measured by the method as described in an Example. Further, for example, the density tends to be increased by increasing the contents of the first resin and the second resin with respect to the knitted fabric in a preferable manufacturing method described later.

  The thickness of the polishing pad is preferably 1.0 to 5.0 mm, more preferably 1.5 to 3.5 mm, and still more preferably 2.0 to 3.0 mm. When the thickness is 1.0 mm or more, the followability to the object to be polished tends to be further improved. Moreover, when the thickness is 5.0 mm or less, the deformation (swell and surface shape) of the object to be polished tends to be more stable and improved. In addition, thickness can be measured by the method as described in an Example. The thickness can be adjusted, for example, by selecting a knitting method of the knitted fabric.

[Knitted fabric]
The knitted fabric is constituted by warp knitting or weft knitting, and includes an aligned knitting yarn formed by aligning two or more kinds of fibers having different melting points. Among the fibers contained in the drawn knitting yarn, the fiber having the lowest melting point (hereinafter also referred to as “low melting point fiber”) is easily affected by external factors such as heat. It can be softened and fused together. On the other hand, the fiber having the highest melting point (hereinafter, also referred to as “high melting point fiber”) is hardly affected by external factors such as heat, and can improve the hardness of the polishing pad. As a result, it becomes possible to suppress deformation of the knitted fabric by heat-fixing fibers having a low melting point, and it is possible to solve the problem of the knitted fabric that it is easy to stretch and deform when applied in the surface direction. It becomes. When the aligned knitting yarn includes three or more kinds of fibers having different melting points, the one having the lowest melting point is defined as a low melting point fiber, and the one having the highest melting point is defined as a high melting point fiber.

  As the knitting yarn constituting the knitted fabric, even when only the aligned knitting yarn is used, the aligned knitting yarn and the knitting yarn other than the aligned knitting yarn (hereinafter also referred to as “non-aligned knitting yarn”) are used. You may use together.

  Further, the fibers constituting the knitting yarn are not particularly limited. For example, polyesters such as polyethylene terephthalate (melting point 255 to 260 ° C.), polybutylene terephthalate (melting point 232 to 267 ° C.), polylactic acid (melting point 170 ° C.), etc. Fiber: Low melting point nylon (melting point 110-120 ° C), nylon 6 (melting point 225 ° C), nylon 66 (melting point 265 ° C), nylon 11 (melting point 187 ° C), nylon 12 (melting point 176 ° C), nylon 610 (melting point 225) ), Nylon 612 (melting point: 220 ° C.), etc .; low density polyethylene (melting point: 95-130 ° C.), high density polyethylene (melting point: 120-140 ° C.), ethylene-vinyl acetate copolymer (melting point: 65-90) ° C) Polyolefin fibers such as polypropylene (melting point 165 ° C); acrylic fibers (melt 317 ° C.) and the like. The melting point in the parentheses is a reference value, and the melting point of the resin constituting each fiber is not limited to the above, and commercially available products can be used as appropriate.

  Of the two or more types of fibers having different melting points constituting the aligned knitting yarn, the melting point of the low melting point fiber is preferably 50 to 180 ° C, more preferably 75 to 170 ° C, further preferably 100 to 100 ° C. 150 ° C. When the melting point of the low-melting fiber is 180 ° C. or lower, deformation of the knitted fabric can be suppressed, and as a result, the polishing rate and the surface quality of the object to be polished tend to be further improved. Moreover, when the melting point of the low-melting fiber is 50 ° C. or higher, physical properties such as hardness of the polishing pad tend to be further improved. Examples of such fibers include, but are not limited to, polylactic acid (melting point 170 ° C.), low melting point polyethylene terephthalate (melting point 130 to 180 ° C.), low melting point nylon (melting point 100 to 130 ° C.), nylon 12 (melting point 176). ° C), low density polyethylene (melting point 95-130 ° C), high density polyethylene (melting point 120-140 ° C), ethylene-vinyl acetate copolymer (melting point 65-90 ° C), polypropylene (melting point 165 ° C), and the like. .

  Among the two or more types of fibers having different melting points constituting the aligned knitting yarn, the melting point of the high melting point fiber is preferably 200 to 400 ° C, more preferably 210 to 380 ° C, and still more preferably 220 to 360 ° C. When the melting point of the high melting point fiber is within the above range, physical properties such as hardness of the polishing pad tend to be further improved. Examples of such fibers include, but are not limited to, polyethylene terephthalate (melting point 255 to 260 ° C.), polybutylene terephthalate (melting point 232 to 267 ° C.), nylon 610 (melting point 225 ° C.), nylon 612 (melting point 220 ° C.). An acrylic fiber (melting point 317 ° C.) and the like can be mentioned.

  The number average diameter of the single yarn constituting the knitted fabric is preferably 3 to 30 μm, more preferably 5 to 25 μm, and still more preferably 10 to 20 μm. When the number average diameter of the single yarn constituting the knitted fabric is within the above range, the production of the yarn or the knitted fabric tends to be easier.

  The single yarn fineness constituting the knitted fabric is preferably 0.1 to 10 dtex, more preferably 0.3 to 6 dtex, and still more preferably 0.9 to 4 dtex. When the single yarn fineness constituting the knitted fabric is within the above range, the production of the yarn or the knitted fabric tends to be easier.

  The fiber fineness of the high melting point fibers constituting the draw-knitting yarn is preferably 30 to 300 dtex, more preferably 40 to 250 dtex, and still more preferably 50 to 200 dtex. When the fiber fineness of the high-melting-point fibers constituting the aligned knitting yarn is within the above range, the production of yarns and knitted fabrics tends to be easier.

  The fiber fineness of the low-melting-point fibers constituting the draw knitting yarn is preferably 3 to 30 dtex, more preferably 4 to 25 dtex, and still more preferably 5 to 20 dtex. When the fiber fineness of the low melting point fibers constituting the aligned knitting yarn is within the above range, it tends to be easier to produce yarn and knitted fabric.

  In the aligned knitting yarn, the fiber fineness of the low-melting fiber is preferably 5 to 20%, more preferably 5 to 17.5%, and still more preferably 7 to the fiber fineness of the high-melting fiber. 5-15%. When the fiber fineness of the low-melting fibers is 5% or more with respect to the fiber fineness of the high-melting fibers, the fusion of the low-melting fibers becomes stronger and the deformation of the knitted fabric tends to be further suppressed. Further, since the fiber fineness of the low melting point fiber is 20% or less with respect to the fiber fineness of the high melting point fiber, the balance of the physical properties of the polishing pad, the amount of the resin impregnated, the porosity, etc. is improved, and the polishing rate is increased. It tends to improve.

  The fiber fineness of the fibers constituting the non-aligned knitting yarn is preferably 30 to 300 dtex, more preferably 40 to 250 dtex, and still more preferably 50 to 200 dtex. When the fiber fineness of the fibers constituting the non-aligned knitting yarn is within the above range, the production of the yarn or the knitted fabric tends to be easier.

  The number of filaments per fiber of the high melting point fibers constituting the draw-knitting yarn is preferably 10 to 100, preferably 15 to 75, and preferably 20 to 50. When the number of filaments per one fiber of the high melting point fibers constituting the aligned knitting yarn is within the above range, the production of the yarn or the knitted fabric tends to be easier.

  The number of filaments per one fiber of the low melting point fibers constituting the aligned knitting yarn is preferably 1 to 10, preferably 2 to 7, and preferably 2 to 5. When the number of filaments per one fiber of the low melting point fibers constituting the aligned knitting yarn is within the above range, the production of the yarn or the knitted fabric tends to be easier.

  The number of filaments per fiber of the fibers constituting the non-aligned knitting yarn is preferably 10 to 100, preferably 15 to 75, and preferably 20 to 50. When the number of filaments per one fiber constituting the non-aligned knitting yarn is within the above range, the production of the yarn or the knitted fabric tends to be easier.

(Mode in which the surface of the knitted fabric is used as the polishing surface)
Since the knitted fabric constituted by warp knitting or weft knitting has a regular knitting structure as compared with the nonwoven fabric, the internal structure of the polishing pad becomes more uniform. Therefore, the distribution state of the impregnated resin is easily uniformed, and an improvement in the polishing rate can be achieved. In addition, the surface of the knitted fabric has regular irregularities (nodes) compared to the surface of the nonwoven fabric. The regular concave and convex recesses act as an abrasive grain holding part in polishing using, for example, abrasive grains. Therefore, it becomes possible to hold | maintain an abrasive grain more efficiently and a polishing rate can be improved. Moreover, the regular uneven | corrugated convex part can work an abrasive grain effectively, and can contribute to the improvement of a polishing rate. Furthermore, the regular distribution of irregularities enables more uniform polishing and can contribute to achieving polishing with excellent surface quality.

  In comparison with a metal surface plate produced by forming an abrasive grain holding part, the knitted fabric does not need to go through a manufacturing process to form the abrasive grain holding part. By adjusting the kind of knitting method and the thickness of the fiber, it is advantageous in that the abrasive grain holding part can be easily formed with an arbitrary size and distribution. In addition, since the knitted fabric is lighter than a metal surface plate, it is advantageous from the viewpoint of handleability, and also advantageous from the viewpoint of manufacturing cost and its maintenance cost.

  By the way, in the conventional lapping polishing, from the viewpoint of emphasizing the lapping speed, mechanical polishing using a metal surface plate such as copper, tin, cast iron and free diamond abrasive grains is performed, and in the secondary lapping polishing, From the viewpoint of emphasizing accuracy such as quality, mechanical polishing using a resin-impregnated non-woven pad or foamed urethane resin pad and diamond loose abrasive grains used in so-called CMP polishing is performed.

  The polishing pad having the surface of the knitted fabric as the polishing surface can be used for both polishing and lapping, but is preferably used for both such primary lapping and secondary lapping. In particular, by changing the knitting method of the knitted fabric, it becomes possible to easily configure a wrapping material according to the required wrapping rate and surface quality. For example, a relatively deep concave portion tends to be formed on the surface of a knitted fabric constituted by warp knitting, which is suitable for primary wrapping requiring a higher wrapping rate. In addition, since the surface of the knitted fabric composed of weft knitting tends to form a relatively shallow recess, and more uniform polishing pressure can be applied to the polishing surface of the object to be polished. It is suitable for secondary lapping that requires high polishing accuracy such as high surface quality.

  That is, the polishing pad of this embodiment is advantageous from the viewpoint of handling and the like while achieving a lapping rate and surface quality close to those of a conventional metal surface plate, so that the metal-based surface plate is used for conventional primary lapping. It can be used as a substitute for a board, and is advantageous in that it can achieve a higher lapping rate and surface quality than conventional resin-impregnated nonwoven fabric pads, etc., so resin-impregnated nonwoven fabric pads for conventional secondary wrapping, etc. Can be used as an alternative.

(Aspect in which a cross section cut in the surface direction of the knitted fabric is used as a polishing surface)
Also, in place of having the surface of the knitted fabric as the polishing surface, the polishing pad is composed of warp knitting or weft knitting as compared with the nonwoven fabric when the polishing pad has a cross section cut in the surface direction of the knitted fabric as the polishing surface When the knitted fabric is used, the distribution of fiber end faces on the polishing surface and the internal structure of the polishing pad become more uniform. Therefore, the distribution state of the impregnated resin is easily uniformed, and an improvement in the polishing rate can be achieved. Further, the regular distribution of the fiber end faces can effectively cause the abrasive grains to act, and can contribute to the improvement of the polishing rate. Furthermore, the regular distribution of the fiber end faces enables more uniform polishing and can contribute to achieving polishing with excellent surface quality.

  A polishing pad having a cross-section cut in the surface direction of the knitted fabric as a polishing surface can be used for both polishing and lapping, but is preferably used for primary polishing and / or secondary polishing. . In particular, by changing the knitting method of the knitted fabric, it is possible to easily configure a polishing pad according to the required polishing rate and surface quality.

(Composition of knitted fabric)
The warp knitting is not particularly limited, and examples thereof include tricots such as single tricot and double tricot; raschels such as single raschel and double raschel; and Miranese. Among the warp knitting, Russell is preferable from the viewpoint of more effectively exerting the effects of the present invention.

  The weft knitting is not particularly limited, and examples thereof include round knitting such as single knitting and double knitting; and flat knitting such as rib knitting, double-side knitting and double-head knitting. Further, the single knitting is not particularly limited, and examples thereof include a sinker table round knitting, a hanging knitting, and a tompkin knitting. The double knitting is not particularly limited, and examples thereof include a milling knitting, a smooth knitting, and a cardboard knitting. Among the weft knitting, the circular knitting is preferable from the viewpoint of more effectively exerting the effects of the present invention.

  The types of the knitting yarn mainly constituting the knitted fabric front and back and the knitting yarn mainly constituting the inner structure of the knitted fabric (structure between the front and back surfaces) may be the same or different. For example, the knitting yarn mainly constituting the knitted fabric front and back surfaces is an aligned knitting yarn, and the knitting yarn mainly constituting the middle structure of the knitted fabric (structure between the front and back surfaces) is a non-aligned knitting yarn. Knitted fabric; knitted fabric in which the knitting yarn mainly constituting the knitted fabric front and back surfaces and the knitting yarn mainly constituting the middle structure of the knitted fabric (structure between the front and back surfaces) are both aligned knitted yarns; A knitted fabric in which the knitting yarn mainly constituting is a non-aligned knitting yarn and the knitting yarn mainly constituting the middle structure of the knitted fabric (the structure between the front and back surfaces) is an aligned knitting yarn. Among these, the knitted fabric that mainly includes the knitted yarn that mainly includes the knitted fabric front and back surfaces is preferable, and the knitted yarn that mainly configures the knitted fabric front and back surfaces is the aligned knitted yarn, and the inner structure of the knitted fabric. A knitted fabric in which the knitting yarn mainly constituting the (structure between the front and back surfaces) is a non-aligned knitting yarn is more preferable. By using such a knitted fabric, the deformation is suppressed and the uniformity of the knitted fabric structure tends to be further improved without impairing the characteristics of the knitted fabric.

  It is preferable that at least a part of the fibers constituting the knitted fabric is false twisted yarn. By using the false twisted yarn, the inner structure of the knitted fabric has a regular knitted structure, and the gap between the fibers is filled with twisted fibers as compared with the case where no false twisted yarn is used. It will have a structure. Thereby, the space | gap between fibers decreases and it becomes easy to impregnate in the fiber by which resin was twisted.

  Therefore, in the case of using the surface of the knitted fabric as the polishing surface, the fibers and the resin constituting the knitted fabric are more uniformly distributed in the internal structure of the polishing pad. As a result, the internal structure of the polishing pad is made more uniform, and the polishing rate tends to be improved.

  Moreover, in the case of using the cross section cut in the surface direction of the knitted fabric as the polishing surface, in the distribution of the fiber end surface of the cross section obtained by cutting (slicing) the knitted fabric in the surface direction and the internal structure of the polishing pad The fibers and the resin constituting the knitted fabric are more uniformly distributed. As a result, the unevenness distribution of the polishing surface and the internal structure of the polishing pad, which directly or indirectly reflect the distribution of the fiber end faces of the cross section, are more uniform, and the polishing rate tends to be further improved.

  Further, the types of fibers mainly constituting the knitted fabric front and back surfaces and the fibers mainly constituting the inner structure of the knitted fabric (structure between the front and back surfaces) may be different from each other. The type of fiber that mainly constitutes the knitted fabric front and back and the type of fiber that mainly constitutes the inner structure of the knitted fabric can be appropriately adjusted by selecting the knitting method and the fiber.

  For example, in the case of using the surface of the knitted fabric as the polishing surface, the polishing rate is further improved by using raw yarn as the fiber mainly constituting the knitted fabric front and back surfaces, and the surface quality is further improved by using false twisted yarn. It tends to improve. On the other hand, by using false twisted yarn as the fiber mainly constituting the inner structure of the knitted fabric, the internal structure of the polishing pad is made more uniform as described above, and the polishing rate tends to be further improved. A preferable combination from the viewpoint of improving the polishing rate such as primary lapping is a combination in which fibers mainly constituting the knitted fabric front and back surfaces are raw yarns, and fibers mainly constituting the inner structure of the knitted fabric are false twisted yarns. . Further, as a preferable combination from the viewpoint of achieving both surface quality such as secondary lapping and polishing rate, the fibers mainly constituting the knitted fabric front and back are raw yarns, and the fibers mainly constituting the inner structure of the knitted fabric are raw yarns. One combination is a combination in which fibers mainly constituting the knitted fabric front and back surfaces are false twisted yarns, and a fiber mainly constituting the inner structure of the knitted fabric is false twisted yarns.

  Moreover, in the case of using the cross-section cut in the surface direction of the knitted fabric as a polishing surface, the fiber end surface of the polishing surface as described above by using false twisted yarn as the fiber mainly constituting the inner structure of the knitted fabric And the internal structure of the polishing pad are made more uniform, and the polishing rate tends to be improved.

〔resin〕
The resin impregnated in the knitted fabric is not particularly limited. For example, polyurethane resins such as polyurethane and polyurethane polyurea; acrylic resins such as polyacrylate and polyacrylonitrile; polyvinyl chloride, polyvinyl acetate, and polyvinylidene fluoride Vinyl sulfone resins; polysulfone resins such as polysulfone and polyethersulfone; acylated cellulose resins such as acetylated cellulose and butyryl cellulose; polyamide resins; and polystyrene resins.

  Among these, it is preferable that a polyurethane resin is included as the resin impregnated in the knitted fabric. Examples of polyurethane resins include, but are not limited to, polyester polyurethane resins, polyether polyurethane resins, and polycarbonate polyurethane resins. By using such a resin, the polishing rate tends to be further improved.

  The resin impregnated in the knitted fabric may be used alone or in combination of two or more. Among these, as a preferable aspect of the present embodiment, it is preferable that the resin includes a first resin and a second resin different from the first resin.

  The first resin is not particularly limited as long as it can impregnate the knitted fabric with a so-called wet coagulable resin, and various known resins can be applied. Examples of such resins include, but are not limited to, polyurethane resins, acrylic resins, vinyl resins, polysulfone resins, acylated cellulose resins, polyamide resins, and polystyrene resins. Examples of polyurethane resins include, but are not limited to, polyester polyurethane resins, polyether polyurethane resins, and polycarbonate polyurethane resins. “Wet coagulation” means impregnating a resin solution impregnated by impregnating a knitted fabric with a resin solution in which the resin is dissolved and immersing it in a bath of a coagulation liquid (which is a poor solvent for the resin). The resin inside is solidified and regenerated. By replacing the solvent and the coagulation liquid in the resin solution, the resin in the resin solution is aggregated and coagulated. From the viewpoint of use in wet coagulation, the first resin is preferably soluble in one or more selected from the group consisting of N, N-dimethylformaldehyde, dimethylacetamide, methyl ethyl ketone, and dimethyl sulfoxide.

  The 100% modulus of the first resin at 23 ± 2 ° C. is preferably 5 MPa to 30 MPa, more preferably 10 MPa to 20 MPa. The 100% modulus is a value obtained by dividing the load applied by the unit area when the resin sheet is stretched 100%, that is, when the sheet is stretched twice the original length.

  The second resin can be impregnated into the knitted fabric with a so-called dry-coagulable resin, and is not particularly limited as long as it is a reaction product of a urethane prepolymer having an NCO equivalent of 400 or less and a curing agent. Can be applied. The “dry coagulation” is to impregnate a knitted fabric with a liquid containing a prepolymer and a curing agent and react the prepolymer and the curing agent to form a resin. At this time, the liquid may contain a solvent.

  Here, the urethane prepolymer is not particularly limited. For example, an adduct of hexamethylene diisocyanate and hexanetriol; an adduct of 2,4-tolylene diisocyanate and prenzcatechol; tolylene diisocyanate and hexanetriol Adduct of tolylene diisocyanate and trimethylolpropane; adduct of xylylene diisocyanate and trimethylolpropane; adduct of hexamethylene diisocyanate and trimethylolpropane; and addition of isocyanuric acid and hexamethylene diisocyanate Things. A urethane prepolymer may be used individually by 1 type, or may use 2 or more types together.

  The NCO equivalent of the urethane prepolymer is preferably 400 or less, more preferably 220 to 400, and further preferably 230 to 300. When the NCO equivalent of the urethane prepolymer is within the above range, the polishing rate tends to be further improved. In the present specification, “NCO equivalent” means the average NCO equivalent of the urethane prepolymer in the resin solution. Moreover, NCO equivalent can be measured by a well-known method, for example, can be measured based on JISK7301 (1995).

  Further, the curing agent is not particularly limited, and examples thereof include 3,3′-dichloro-4,4′-diaminodiphenylmethane, 4-methyl-2,6-bis (methylthio) -1,3-benzenediamine, 2 -Methyl-4,6-bis (methylthio) -1,3-benzenediamine, 2,2-bis (3-amino-4-hydroxyphenyl) propane, 2,2-bis [3- (isopropylamino) -4 -Hydroxyphenyl] propane, 2,2-bis [3- (1-methylpropylamino) -4-hydroxyphenyl] propane, 2,2-bis [3- (1-methylpentylamino) -4-hydroxyphenyl] Propane, 2,2-bis (3,5-diamino-4-hydroxyphenyl) propane, 2,6-diamino-4-methylphenol, trimethylethylenebis Amine compounds such as 4-aminobenzoate and polytetramethylene oxide-di-p-aminobenzoate; ethylene glycol, propylene glycol, diethylene glycol, trimethylene glycol, tetraethylene glycol, triethylene glycol, dipropylene glycol, 1, 4-butanediol, 1,3-butanediol, 2,3-butanediol, 1,2-butanediol, 3-methyl-1,2-butanediol, 1,2-pentanediol, 1,4-pentanediol 2,4-pentanediol, 2,3-dimethyltrimethylene glycol, tetramethylene glycol, 3-methyl-4,3-pentanediol, 3-methyl-4,5-pentanediol, 2,2,4-trimethyl -1,3-pentanedio 1,6-hexanediol, 1,5-hexanediol, 1,4-hexanediol, 2,5-hexanediol, 1,4-cyclohexanedimethanol, neopentyl glycol, glycerin, trimethylolpropane, trimethylolethane And polyhydric alcohol compounds such as trimethylolmethane. A hardening | curing agent may be used individually by 1 type, or may use 2 or more types together.

  Although it does not specifically limit as a solvent, For example, N, N-dimethylformamide, N, N-dimethylacetamide, methyl ethyl ketone, etc. are mentioned.

  When the resin includes the first resin and a second resin different from the first resin, the content of the knitted fabric is based on the total amount of the knitted fabric, the first resin, and the second resin. , Preferably, it is 30-60 mass%, More preferably, it is 35-55 mass%. When the content of the knitted fabric is within the above range, the polishing rate tends to be further improved.

  In addition, each content of knitted fabric, 1st resin, and 2nd resin is the mass of the component to elute, using the difference in the solubility (polarity) to a polar solvent, or a difference in amine decomposability, or It can be determined from the mass of the residue. Further, the density of the polishing pad after the primary impregnation step described later, the density of the polishing pad after the immersion step described later, and the density of the polishing pad after the secondary impregnation step described later are measured, respectively, from the difference in density. It can also be calculated. The density can be measured in the same manner as described above.

[Other ingredients]
In addition to the knitted fabric and resin described above, the polishing pad may contain various additives that can be included in a normal polishing pad depending on the purpose. Such additives include, but are not limited to, pigments or fillers such as carbon black, hydrophilic additives, and hydrophobic additives.

  The hydrophilic additive is not particularly limited. For example, anionic surfactants such as sodium lauryl sulfate, carboxylate, sulfonate, sulfate ester salt, phosphate ester salt; hydrophilic ester compound, ether type Nonionic surfactants such as compounds, ester / ether compounds, and amide compounds are exemplified.

  In addition, the hydrophobic additive is not particularly limited. For example, polyoxyethylene alkyl ether, polyoxypropylene alkyl ether, polyoxyethylene polyoxypropylene alkyl ether, perfluoroalkylethylene oxide adduct, glycerin fatty acid ester, propylene Nonionic surfactants to which an alkyl chain having 3 or more carbon atoms, such as glycol fatty acid ester, is added.

  Furthermore, various materials such as a solvent used in the manufacturing process may remain on the polishing pad.

[Production method of polishing pad]
The manufacturing method of the polishing pad of this embodiment will not be specifically limited if it is a method which has the process of impregnating resin to a knitted fabric and solidifying. For example, when a plurality of types of resins are used, a plurality of resins may be mixed and impregnated into the knitted fabric at once, or a part of the resin may be impregnated into the knitted fabric and solidified, and then the remaining The resin may be impregnated into a knitted fabric and solidified by a multi-stage impregnation step.

  The method for performing the multi-stage impregnation step using the first resin and the second resin is not particularly limited. For example, the pulling method includes two or more fibers having different melting points. A heat setting step of heating a knitted fabric knitted by warp knitting or weft knitting including aligned knitting yarn at a temperature not lower than the softening point of the fiber having the lowest melting point and lower than the melting point; A primary impregnation step of obtaining a resin-impregnated knitted fabric by impregnating the resin solution and performing wet coagulation, and an immersion in which the resin-impregnated knitted fabric is immersed in an immersion liquid containing a solvent in which the first resin is soluble And a secondary impregnation step of impregnating the resin-impregnated knitted fabric after the immersion step with a solution containing a urethane prepolymer having an NCO equivalent of 400 or less and a curing agent.

[Heat setting process]
Heat a knitted fabric knitted by warp knitting or weft knitting, including an aligned knitting yarn composed of two or more fibers having different melting points, at a temperature not lower than the softening point of the low melting point fiber and lower than the melting point. By doing so, there is a fusion point where the softened low melting point fibers are fused at the intersection. Thereby, it can suppress that a knitted fabric extends or deform | transforms in a surface direction.

[Primary impregnation step]
This is a step of obtaining a resin-impregnated knitted fabric by impregnating a knitted fabric with a resin solution containing a first resin and performing wet coagulation. When the wet coagulation method is used after impregnating the knitted fabric with the resin solution, in the coagulating liquid, the substitution of the resin solution solvent and the coagulating liquid on the surface of the resin solution adhering to the knitted fabric fibers proceeds. The resin is coagulated and regenerated on the fiber surface.

  Specific examples of the primary impregnation step are as follows. First, the first resin as described above, a solvent capable of dissolving the first resin and mixed in the coagulation liquid described later, and other additives as necessary are mixed, and further required. Accordingly, defoaming is performed under reduced pressure to prepare a resin solution. The solvent is not particularly limited, and examples thereof include N, N-dimethylformamide (DMF), N, N-dimethylacetamide (DMAC), methyl ethyl ketone (MEK), and dimethyl sulfoxide. From the viewpoint of selecting a good solvent for the resin, and from the viewpoint of facilitating wet coagulation by uniformly mixing with the coagulation bath, the first resin is composed of N, N-dimethylformaldehyde, dimethylacetamide, methyl ethyl ketone and dimethyl sulfoxide. It is preferably soluble in one or more solvents selected from the group consisting of Similarly, the solvent preferably contains one or more solvents selected from the group consisting of N, N-dimethylformaldehyde, dimethylacetamide, methyl ethyl ketone and dimethyl sulfoxide.

  From the viewpoint of impregnating the resin over the entire knitted fabric, and from the viewpoint of sufficiently ensuring the impregnation amount of the resin, the viscosity measured at 20 ° C. using a B-type rotational viscometer for the resin solution is preferably It is 8000 cp or less, More preferably, it is 100 cp-5000 cp, More preferably, it is 400 cp-3000 cp. From the viewpoint of obtaining a resin solution having such a numerical range of viscosity, for example, the polyurethane resin is a solvent in a range of 5 to 25% by mass, more preferably in a range of 8 to 20% by mass with respect to the total amount of the resin solution. It may be dissolved in Since the viscosity of the resin solution also depends on the type and molecular weight of the resin to be used, it is preferable to select the resin, set the concentration, etc. in consideration of these comprehensively.

  Next, after sufficiently immersing the knitted fabric in the resin solution, the resin solution is squeezed out from the knitted fabric to which the resin solution has adhered using a mangle roller that can be pressurized between a pair of rollers. The amount of adhesion to the knitted fabric is adjusted to a desired amount and the knitted fabric is impregnated with the resin solution uniformly or substantially uniformly. Next, the knitted fabric impregnated with the resin solution is immersed in a coagulant containing a poor solvent for the resin, for example, water as a main component, so that the resin (hereinafter, the resin that is wet coagulated is referred to as “wet resin”). Coagulate and regenerate. In order to adjust the regeneration speed of the resin, an organic solvent such as a polar solvent other than the solvent in the resin solution may be added to the coagulation liquid. The temperature of the coagulation liquid is not particularly limited as long as the resin can be coagulated, and may be, for example, 15 to 60 ° C.

  In this embodiment, after performing the above-mentioned wet coagulation, it is preferable to use the following washing / drying steps. First, the knitted fabric obtained by coagulating and regenerating the wet resin is washed in a cleaning solution such as water, and the solvent such as DMF remaining in the knitted fabric is removed. After washing, the knitted fabric is pulled up from the washing liquid, and excess washing liquid is squeezed out using a mangle roller or the like. Thereafter, the knitted fabric may be dried in a dryer at 100 ° C to 150 ° C. In addition, after the above drying, the obtained resin-impregnated knitted fabric is further subjected to processing by slicing, buffing, etc., and the skin layer of the surface layer is removed to a predetermined thickness, so that the uniformity of the dipping step in the next step is improved. It is preferable from the viewpoint of enhancing.

[Immersion process]
The dipping process is a process in which the wet resin is partially re-dissolved in the solvent by dipping the resin-impregnated knitted fabric in an immersion liquid containing a solvent in which the first resin is soluble. It is considered that air bubbles (for example, closed pores and open pores having small openings) inside the resin-impregnated knitted fabric are reduced by the dipping process, and adhesion between the knitted fabric and the wet resin is improved. Although it does not specifically limit as a solvent used for an immersion process, For example, N, N- dimethylformamide (DMF), N, N- dimethylacetamide (DMAC), methyl ethyl ketone (MEK), and dimethyl sulfoxide are mentioned. Moreover, as temperature conditions at the time of immersion, it is preferable that it is 15.0-25.0 degreeC from a viewpoint of reducing the bubble of 1st resin and preventing the elution of the resin to a solvent, The time is preferably 5 to 30 seconds from the same viewpoint. In addition, it is preferable to provide a drying process after the above-mentioned immersion process.

[Cutting process]
The manufacturing method of the polishing pad of this embodiment may further include a cutting step of cutting the resin-impregnated knitted fabric after the dipping step in the surface direction of the knitted fabric. By the cutting step, a cross section cut in the surface direction of the knitted fabric can be formed as the polishing surface. In FIG. 1, the conceptual diagram of a cutting process is shown. FIG. 1 is a cross-sectional view when the resin-impregnated knitted fabric 1 after the dipping process is cut in the surface direction of the knitted fabric. As shown in FIG. 1, in this embodiment, the knitted fabric is cut in the surface direction to create a polished surface 2 (before secondary impregnation). On the polishing surface 2, the end surfaces of the fibers are uniformly distributed in the surface direction. Further, the fiber end face 2 ′ need not be exposed on the polishing surface 2, and the polishing surface may be covered with a resin by a subsequent secondary impregnation step or the like.

  The cutting method is not particularly limited, and cutting can be performed using a band knife or the like.

[Secondary impregnation step]
The secondary impregnation step is a step of impregnating the resin-impregnated knitted fabric after the immersion step with a solution containing a urethane prepolymer having an NCO equivalent of 400 or less and a curing agent. It is presumed that a resin (hereinafter, this resin is also referred to as “dry resin”) is formed on the surface of the wet resin described above by the secondary impregnation step.

  As a specific example of the secondary impregnation step, first, a solution containing a urethane prepolymer having an isocyanate group at a terminal, a curing agent, and a solvent capable of dissolving them is prepared. Here, the urethane prepolymer, the curing agent, and the solvent can be the same as those exemplified above.

  Next, after immersing the resin-impregnated knitted fabric after the dipping step in the above solution, the solution is squeezed out from the resin-impregnated knitted fabric to which the solution has adhered using a mangle roller that can be pressurized between a pair of rollers. Then, the adhesion amount of the solution to the resin-impregnated knitted fabric is adjusted to a desired amount, and the resin-impregnated knitted fabric is impregnated with the solution uniformly or substantially uniformly. Next, the resin-impregnated knitted fabric impregnated with the solution is dried in a dryer. As a result, the polishing pad of this embodiment obtained by polymerizing with the urethane prepolymer and the curing agent and impregnating the resin-impregnated knitted fabric with the dry resin is obtained. As a drying temperature, 100 to 140 degreeC may be sufficient, for example. Note that the polishing surface of the polishing pad obtained by the secondary impregnation step may be further treated with a buff or the like.

  By passing through the heat setting process, the primary impregnation process, the dipping process, and the secondary impregnation process described above, a polishing pad having the desired configuration of the present embodiment can be obtained. This polishing pad is not intended to be limited to the contents described below, but is presumed to have the following configuration. That is, through the heat setting step, the knitted fabric has a fusion point where softened low melting point fibers are fused at the intersection. Next, a wet resin is formed on the surface of the knitted fabric through the primary impregnation step. In particular, in the primary impregnation step, wet resin is uniformly deposited in the knitted fabric by employing wet coagulation. However, at this stage, there are many fine bubbles derived from the wet coagulation method inside the resin of the resulting resin-impregnated knitted fabric, and the adhesion and strength between the knitted fabric and the wet resin are not sufficient. Next, the immersion solution is filled in the fine bubbles of the wet resin by passing through the dipping step, and the wet resin is re-dissolved by heating by drying, so that fine bubbles (for example, closed pores and openings) inside the resin-impregnated knitted fabric are obtained. Small pores) and the resin impregnated in the knitted fabric (wet resin) increases in density around the fiber, improving the adhesion between the knitted fabric fiber and the wet resin and improving the strength. To do. Further, the reduction of fine bubbles leads to uniform impregnation of dry resin and improvement of strength in the secondary impregnation step. Furthermore, a dry resin layer is further formed on the surface of the wet resin layer on the knitted fabric fiber through the secondary impregnation step.

  According to the present embodiment, since bubbles are reduced in the dipping process, voids that can be impregnated in the secondary impregnation process are secured and air permeability is improved, and the number of places where the dry resin is difficult to enter decreases. The existing area increases. Therefore, the dry resin can be uniformly impregnated. Further, since the wet resin in the portion not directly attached to the knitted fabric is reduced, peeling of the resin in the polishing pad is suppressed during polishing, and the life can be extended. Thus, in the polishing pad of this embodiment, it is inferred that a knitted fabric is used as a base material, a wet resin layer is formed on the knitted fabric, and a dry resin layer is formed on the wet resin layer. Is done. In addition, as a whole of the polishing pad, it is presumed that the adhesion between the knitted fabric and the wet resin layer and the adhesion between the wet resin layer and the dry resin layer are all good. From the above viewpoint, it is considered that the polishing pad of this embodiment can ensure sufficient strength.

  The polishing pad obtained as described above may then be cut into a desired shape and size such as a circle as necessary, and inspection such as confirming that there is no dirt or foreign matter attached. May be applied.

  Further, when the cutting process is performed, in the obtained polishing pad, at least a part of the cross section in the surface direction of the knitted fabric is covered with resin (dry resin), and the cross section not covered with the resin and the cross section are covered. The surface of the finished resin becomes the polished surface. In such a polishing pad, the fiber end surface is uniformly distributed in the cross section obtained by cutting the knitted fabric composed of warp knitting or weft knitting in the surface direction. The distribution of the fiber end face is directly reflected, and the distribution of the fiber end face is indirectly reflected in the portion where the cross section is coated with the resin. As a result, in addition to the homogenization of the internal structure of the polishing pad as described above, the unevenness distribution of the polishing surface is also made more uniform, so that the polishing rate tends to be further improved. In addition, fiber detachment is suppressed at the portion where the cross section is coated with resin. As a result, the polishing pad of the present embodiment has a higher polishing rate and can ensure the quality of the polished surface.

  Further, the surface of the obtained polishing pad is a polishing surface. When an object to be polished (hereinafter, also referred to as “workpiece”) is polished using the polishing pad, the polishing pad has a polishing surface in advance. A double-sided tape (having an adhesive layer and release paper) for adhering a polishing pad to a polishing surface plate of a polishing machine may be bonded to the opposite surface.

  In consideration of the supply of slurry during polishing and the discharge of polishing debris, the polishing surface of the polishing pad may be grooved or embossed. Examples of the planar shape (pattern) on the polished surface of the groove include a radial shape, a lattice shape, and a spiral shape. Examples of the cross-sectional shape of the groove include a rectangular shape, a U shape, a V shape, and a semicircular shape. Furthermore, the pitch, width, and depth of the grooves are not particularly limited as long as the polishing waste can be discharged and the slurry can be moved.

[Production Method of Polished Product]
The manufacturing method of the polishing object of this embodiment will not be specifically limited if it is a method which has the grinding | polishing process of lapping a to-be-polished object using the said polishing pad. The polishing step includes primary lapping polishing (rough lapping), secondary lapping polishing (finish lapping), primary polishing (rough polishing), secondary polishing (finish polishing), and those that also serve as a plurality of these polishings. .

  The object to be polished is not particularly limited. For example, materials such as semiconductor devices and electronic components, in particular, Si substrates (silicon wafers), SiC (silicon carbide) substrates, GaAs (gallium arsenide) substrates, glass, hard disks and LCDs. A thin substrate (object to be polished) such as a substrate for (liquid crystal display) can be mentioned. Among these, the manufacturing method of the polished article of the present embodiment is a method for manufacturing difficult-to-process materials that are difficult to polish, such as materials that can be applied to power devices, LEDs, and the like, for example, sapphire, SiC, GaN, and diamond. It can be used suitably.

  Hereinafter, examples of aspects in primary lapping polishing (rough lapping) and secondary lapping polishing (finish lapping) and aspects in primary polishing (rough polishing) and secondary polishing (finish polishing) will be described. The method for producing the polished product is not limited to the following.

(Primary lapping polishing and secondary lapping polishing)
As the wrapping method, a conventionally known method can be used and is not particularly limited. Hereinafter, a method for lapping a workpiece with a polishing pad in the presence of abrasive grains will be described as an example.

  The lapping method preferably includes an abrasive grain embedding step of embedding abrasive grains in the polishing pad before the lapping process. In the abrasive grain embedding step, the abrasive grains are embedded in the polishing pad from the surface side that becomes the polishing surface of the polishing pad. As a method of embedding, for example, after a desired amount of abrasive particles are dispersed on the surface of the polishing pad, the abrasive particles placed on the surface of the polishing pad are directed toward the polishing pad to a predetermined amount. There is a method of embedding (charging) abrasive grains by pressing with pressure. Examples of the means used for pressing include a retainer ring. The abrasive grains may be dispersed by themselves, but from the viewpoint of preventing agglomeration of a plurality of abrasive grains, the abrasive grains are dispersed by being applied in a dispersed state. Is preferred. The dispersant may be any liquid that is used in a normal diamond abrasive dispersion or a polishing slurry containing diamond abrasive, and includes, for example, a mixed liquid of glycerin and water.

  The abrasive grain embedding step may be provided before lapping the object to be polished using the polishing pad, or may be provided during the lapping step. When embedding the abrasive grains together with the lapping process, the abrasive grains on the polishing pad can be embedded by pressing the abrasive grains on the polishing pad toward the polishing pad while supplying a polishing slurry containing the abrasive grains onto the polishing pad. .

  Abrasive grains are embedded in the polishing surface of the polishing pad in advance. In addition, the abrasive grains may be newly supplied during lapping and embedded in the polishing surface of the polishing pad. It is also possible to be free (without being embedded in the polishing surface of the polishing pad and / or free once embedded in the polishing surface). As a result, the diamond abrasive grains can be densely fixed only on the polished surface with a high grinding force, and the surface quality of the object to be polished can be improved while increasing the lapping rate.

  In the lapping method, first, a polishing pad is mounted at a predetermined position of the lapping apparatus. At the time of mounting, the polishing pad is mounted so as to be fixed to the wrapping device via the above-mentioned adhesive layer. Then, the object to be polished, which is held on the holding surface plate disposed so as to face the polishing pad as the lapping surface plate, is pressed against the polishing surface side, and polishing is performed while supplying a polishing slurry containing diamond abrasive grains from the outside. Rotate the pad and / or holding platen. Thus, lapping is performed on the processing surface (surface to be polished) of the object to be polished by the action of the abrasive grains supplied between the polishing pad and the object to be polished and embedded in the polishing pad.

  The polishing slurry preferably includes diamond abrasive grains and a dispersant that disperses them. The content ratio of the diamond abrasive grains in the polishing slurry is not particularly limited, but it is 0 with respect to the total amount of the polishing slurry from the viewpoint of performing the lapping process more effectively and suppressing the thickness of the work-affected layer in the object to be polished. It is preferable that it is 0.01-1.0 mass%. Moreover, the average particle diameter of diamond abrasive grains is preferably 0.5 to 20 μm, more preferably 1 to 18 μm, further preferably 2 to 15 μm, and particularly preferably 3 to 10 μm. When the average particle diameter of the diamond abrasive grains is within the above range, the lapping rate can be further improved and the occurrence of scratches on the workpiece surface can be further suppressed.

  Examples of the dispersant include water and an organic solvent, and an organic solvent is preferable from the viewpoint of further suppressing deterioration of the object to be polished. As the organic solvent, a hydrocarbon is preferable, and a hydrocarbon having a high boiling point is more preferable. The hydrocarbon is not particularly limited, and examples thereof include paraffinic hydrocarbons, olefinic hydrocarbons, aromatic hydrocarbons, and alicyclic hydrocarbons. Examples of the hydrocarbon having a high boiling point include petroleum hydrocarbons having an initial boiling point of 220 ° C. or higher. A solvent is used individually by 1 type or in combination of 2 or more types. Further, the solvent may contain other additives as necessary. Examples of such additives include nonionic surfactants, anionic surfactants, carboxylic acid esters, carboxylic acid amides, and carboxylic acids.

  In addition, from the viewpoint of suppressing a temperature rise due to friction between the polishing pad and the object to be polished during lapping, a solvent that does not contain abrasive grains and may contain additives is appropriately supplied to the polishing surface of the polishing pad. Also good. Examples of the solvent and additives include those described above.

(Primary polishing and secondary polishing)
As a polishing method, a conventionally known method can be used and is not particularly limited. Hereinafter, a method for polishing an object to be polished with a polishing pad in the presence of abrasive grains will be described as an example.

  First, a polishing pad is mounted and fixed on a polishing surface plate of a polishing machine. Then, the polishing surface plate is pressed while the object to be polished held on the holding surface plate disposed so as to face the polishing surface plate is pressed to the polishing surface side of the polishing pad, and slurry is supplied between the workpiece and the polishing pad. In addition, the processing surface of the workpiece is polished by relatively rotating the holding surface plate.

  The slurry may contain a strong oxidizing agent, a solvent, and abrasive particles used in chemical mechanical polishing. Although it does not specifically limit as a strong oxidizing agent, For example, potassium permanganate, sodium permanganate, etc. are mentioned. Examples of the solvent include water and organic solvents. As the organic solvent, a hydrocarbon is preferable, and a hydrocarbon having a high boiling point is more preferable. The hydrocarbon is not particularly limited, and examples thereof include paraffinic hydrocarbons, olefinic hydrocarbons, aromatic hydrocarbons, and alicyclic hydrocarbons. Examples of the hydrocarbon having a high boiling point include petroleum hydrocarbons having an initial boiling point of 220 ° C. or higher. A solvent is used individually by 1 type or in combination of 2 or more types.

  The slurry may contain other additives as necessary. Examples of such additives include nonionic surfactants, anionic surfactants, carboxylic acid esters, carboxylic acid amides, and carboxylic acids.

  Hereinafter, the present invention will be described more specifically with reference to Examples and Comparative Examples. The present invention is not limited in any way by the following examples.

[A hardness]
A pressing needle (measurement element) was pressed against the surface of a test piece having a thickness of 4.5 mm or more via a spring, and the hardness A of the polishing pad was measured from the pressing depth of the pressing needle 30 seconds later. A durometer type A was used as a measuring device. This was performed three times to obtain the A hardness from the arithmetic average. Specifically, the polishing pad was cut out to 10 cm × 10 cm, used as a sample piece, and a plurality of sheets were stacked and measured so as to have a thickness of 4.5 mm or more.

[Compression modulus and compression modulus]
Using a shopper type thickness measuring instrument (pressurized surface: circular with a diameter of 1 cm), the compressibility and compressive modulus of the polishing pad were measured in accordance with Japanese Industrial Standard (JIS L 1021). Specifically, the thickness t ₀ after pressing for 30 seconds with an initial load was measured, and then the thickness t ₁ after standing for 5 minutes under the final load was measured. All the loads were removed, and after standing for 1 minute, the thickness t ₀ ′ after pressing for 30 seconds with the initial load again was measured. At this time, the initial load was 100 g / cm ² and the final load was 1120 g / cm ² . The compression rate was calculated by the following formula (1), and the compression modulus was calculated by the following formula (2).
Formula (1): Compression rate (%) = (t ₀ −t ₁ ) / t ₀ × 100
Formula (2): Compression modulus (%) = (t ₀ ′ −t ₁ ) / (t ₀ −t ₁ ) × 100

〔thickness〕
The thickness of the polishing pad was measured in accordance with Japanese Industrial Standard (JIS K 6505) using a shopper type thickness measuring instrument (pressure surface: circular shape with a diameter of 1 cm). Specifically, three sample pieces obtained by cutting a polishing pad into 10 cm × 10 cm were prepared, and each sample piece was set at a predetermined position of a thickness measuring device, and then a pressure surface to which a load of 480 g / cm ² was applied. Was placed on the surface of the sample piece, and the thickness was measured after 5 seconds. For each sample piece, the thickness was measured at five locations to calculate an arithmetic average, and an arithmetic average of three sample pieces was obtained.

〔density〕
The polishing pad was cut into 10 cm × 10 cm, used as a sample piece, its mass was measured, and the density (bulk density) (g / cm ³ ) of the polishing pad was calculated from the volume obtained from the above size and the above mass.

[Surface roughness Ra]
The surface roughness Ra of the polishing surface of the polishing pad was measured using a laser microscope (LASER MICROSCOPE VK-X100 manufactured by Keyence Corporation).

[Lapping test]
A polishing pad is placed at a predetermined position of a double-sided lapping device via a double-sided tape having an acrylic adhesive, and lapping is performed on a 2-inch 6H-SiC n-type wafer as an object to be polished under the following conditions. A lapping test was performed. In the lapping test, first, a dispersion composed of 0.1% by mass of diamond abrasive grains (polycrystal, average particle size: 9 μm) and a mixed liquid (dispersant) of water and glycerin was added to the polishing pad. While dripping onto the surface, pressing with a SUS carrier for a predetermined time to embed diamond abrasive grains in the polishing pad, and then lapping (diamond mechanical polishing) was performed.
(Wrapping conditions)
Surface plate size of wrapping equipment used: Diameter 935mm
Surface plate rotation speed: 10 rpm
Processing pressure: 278 g / cm ²
Lapping time: 1 hour

[Polishing test 1]
The polishing pad was affixed to a surface plate of a polishing machine (manufactured by Speedfam Co., Ltd., 32 inches), and the polishing surface of the polishing pad was dressed while supplying water at 900 mL / min (pressure 1.3 kPa, time: 10 min) . At that time, “Diamond Dresser (# 100)” manufactured by Asahi Diamond Industrial Co., Ltd. was used as the diamond dresser. Next, polishing was performed on the SiC wafer (diameter 3 inches × thickness 420 μm) as an object to be polished using the polishing pad under the following polishing conditions.
(Polishing conditions)
Slurry: manufactured by Sinmat, product name SC1AJ.
Slurry flow rate: 5mL / min
Rotation speed: 35rpm
Polishing time: 120 min / BT
Polishing pressure: 450 gf / cm ²

[Polishing test 2]
The object to be polished was changed to a sapphire wafer (diameter 2 inches × thickness 375 μm), and polishing was performed in the same manner as polishing test 1 except that the polishing conditions shown below were used.
(Polishing conditions)
Slurry: Fujimi Incorporated, product name “Compol 80” and water mixed at a ratio of 2: 1 were used.
Slurry flow rate: 3L / min (circulation)
Rotation speed: 70rpm
Polishing time: 180 min / BT
Polishing pressure: 400 gf / cm ²

(Polishing rate)
The polishing rate (unit: μm / hr) is determined based on the polishing amount obtained from the decrease in the mass of the object before and after processing in the lapping test, polishing test 1 and polishing test 2, the polishing area and the specific gravity of the object to be polished. The thickness removed by was calculated and evaluated as the thickness removed per hour.

(Face quality 1)
About 5 objects to be polished after the lapping test, scratches on the surface to be polished were visually confirmed. The surface quality (scratch) when using a copper surface plate as the polishing pad and 3 μm diamond abrasive as the embedded abrasive is set to “1”, and the surface quality superior to that is set to “0”. Then, a weighted average of evaluations of five objects to be polished was obtained. The surface of the object to be polished after the lapping test has a ground glass shape in which fine scratches are present when enlarged. The above-mentioned excellent surface quality means that there are no more deep or large scratches in particular.

(Face quality 2)
About 5 objects to be polished after the polishing test 1 or 2, scratches on the surface to be polished were visually confirmed. “2” indicates that many defects such as scratches are recognized, “1” indicates that few defects such as scratches are found, and “0” indicates that no defects such as scratches are found. A weighted average of evaluations of five polished articles was obtained. The surface of the object to be polished after the polishing test has a mirror shape. Whether or not defects such as scratches as described above are found is determined based on whether scratches or the like are observed on the surface of the mirror-like object to be polished, both large and small.

[Knitted fabric]
A warp knitted double raschel knitted fabric A1 using a polyethylene terephthalate fiber as a knitting yarn comprising a polyethylene terephthalate fiber as a knitting yarn constituting the front and back surfaces and a polyethylene terephthalate fiber as a knitting yarn constituting a middle structure. A warp knitted double raschel knitted fabric A2 similar to the knitted fabric A1 except that the melting point nylon fibers are not aligned, and a knitted yarn in which low melting point nylon fibers are aligned with polyethylene terephthalate fibers as knitting yarns constituting the front and back surfaces. A circular knitted cardboard knit knitted fabric B1 using polyethylene terephthalate fiber as a knitting yarn constituting the middle structure, and a circular knitted cardboard knit knitted fabric B2 similar to the knitted fabric B1 except that low melting point nylon fibers are not aligned. Prepared. Table 1 below shows the configuration of each knitted fabric. In addition, it describes separately the fiber which comprises the knitted fabric front and back, and the fiber which comprises the middle structure (between the surface and the back surface) of the knitted fabric.

The knitted fabrics A1 and A2 are warp knitted fabrics (double raschel) made of the following knitted fabric structure knitted by a double raschel machine having yarn feeders L1 to L6, and L3 and L4 are false twisted yarns, L1, L2, L5, and L6 are raw silk. In the knitted fabric C, all of L1 to L6 are raw yarns. In addition, the yarn feeder of the low melting point nylon fiber which is the draw yarn in the knitted fabric A1 is as shown in Table 1.
L1: 4-4-4-4 / 0-0-0-0 //
L2: 0-1-1-1 / 1-0-0-0-0 //
L3: 0-1-1-2 / 1-0-2-1 //
L4: 1-2-0-1 / 2-1-1-0 //
L5: 0-0-0-1 / 1-1-1-0 //
L6: 0-0-4-4 / 4-4-0-0 //

The knitted fabrics B1 and B2 are circular knitted fabrics (corrugated cardboard knits) having the following knitted fabric structure knitted by a circular knitting machine having yarn feeders F1 to F6. In addition, the yarn feeder of the low melting point nylon fiber which is the draw yarn in the knitted fabric B1 is as shown in Table 1.
F1: Tack (Tack structure (odd knitting and knitting cover) with odd-numbered cylinder needles and even-numbered dial needles)
F2: Dial half (Cylinder is not knitted, only odd-numbered dial needles are knitted)
F3: Half cylinder (knitting only the even numbered cylinder needle without knitting the dial)
F4: Tack knit (tack structure of even numbered cylinder needles and odd numbered dial needles, opposite to F1)
F5: Dial half (opposite of F2, cylinder is not knitted, only even-numbered dial needles are knitted)
F6: Half cylinder (opposite of F3, dial is not knitted but only even numbered cylinder needle is knitted)

  The knitted fabric A1, knitted fabric A2, knitted fabric B1, and knitted fabric B2 knitted as described above were subjected to a heat setting treatment at 100 ° C. for 10 minutes using a hot air dryer. Thus, the knitted fabric A1 and the knitted fabric B1 having the aligned knitting yarns in which the low melting point nylon fibers are aligned are in a state in which the low melting point nylon fibers are fused at the intersection. Hereinafter, in the examples and comparative examples, each knitted fabric after the heat setting treatment was used.

[Example 1]
(Primary impregnation step)
56.7 parts by mass of a polycarbonate urethane resin (manufactured by DIC, trade name “Chrisbon S705”) and 43.3 parts by mass of N, N-dimethylformamide were mixed to prepare a resin solution. The knitted fabric A1 was immersed in the obtained resin solution, and the excess resin solution was squeezed out using a mangle roller, whereby the knitted fabric A1 was substantially uniformly impregnated with the resin solution. Subsequently, the primary impregnation resin was solidified and regenerated by immersing the knitted fabric A1 in a coagulation liquid composed of water at 18 ° C. to obtain a resin-impregnated knitted fabric. Thereafter, the resin-impregnated knitted fabric was taken out from the coagulation liquid and dried to obtain a resin-impregnated knitted fabric from which the skin layer on the surface was removed by buffing.

(Immersion process)
Subsequently, the resin-impregnated knitted fabric obtained above was immersed in an immersion solvent in which N, N-dimethylformamide and pure water were mixed in a ratio of 65 to 35. Thereafter, drying was performed to obtain a resin-impregnated knitted fabric after the dipping process.

(Secondary impregnation step)
Furthermore, urethane prepolymer (made by DIC, trade name “Pandex TM363”, NCO equivalent: 286) 24.11 parts by mass and curing agent (made by DIC, trade name “Pandex E”) 10.91 parts by weight And 60.04 parts by mass of N, N-dimethylformamide were mixed to prepare a resin solution. After immersing the resin-impregnated knitted fabric after the dipping step in the obtained resin solution, the nip conditions of the mangle roller were adjusted so that the density of the polishing pad was 0.36 g / cm ^3, and the resin solution was squeezed out. Then, washing | cleaning and drying were performed and the polishing pad of Example 1 was obtained. The resin adhesion amount was 167% by mass with respect to 100% by mass of the knitted fabric. The NCO equivalent was measured according to JIS K 7301 (1995) (the same applies hereinafter).

[Comparative Example 1]
A polishing pad of Comparative Example 1 was obtained in the same manner as in Example 1 except that the knitted fabric A2 was used instead of the knitted fabric A1. The resin adhesion amount was 167% by mass with respect to 100% by mass of the knitted fabric.

[Example 2]
A polishing pad of Example 2 was obtained in the same manner as in Example 1 except that the knitted fabric B1 was used instead of the knitted fabric A1. The adhesion amount of the resin was 90% by mass with respect to 100% by mass of the knitted fabric.

[Comparative Example 2]
A polishing pad of Comparative Example 2 was obtained in the same manner as in Example 2 except that the knitted fabric B2 was used instead of the knitted fabric B1. The adhesion amount of the resin was 90% by mass with respect to 100% by mass of the knitted fabric.

  Table 2 shows the hardness, compression rate, compression modulus, thickness, density, and surface roughness Ra of each polishing pad obtained in Examples 1-2 and Comparative Examples 1-2. Moreover, the evaluation result of the polishing rate and surface quality 1 at the time of performing on the conditions of the said lapping test is shown.

Example 3
(Primary impregnation step)
56.7 parts by mass of a polycarbonate urethane resin (manufactured by DIC, trade name “Chrisbon S705”) and 43.3 parts by mass of N, N-dimethylformamide were mixed to prepare a resin solution. The knitted fabric A1 was immersed in the obtained resin solution, and the excess resin solution was squeezed out using a mangle roller, whereby the knitted fabric A1 was substantially uniformly impregnated with the resin solution. Subsequently, the primary impregnation resin was solidified and regenerated by immersing the knitted fabric A1 in a coagulation liquid composed of water at 18 ° C. to obtain a resin-impregnated knitted fabric. Thereafter, the resin-impregnated knitted fabric was taken out from the coagulation liquid and dried to obtain a resin-impregnated knitted fabric from which the skin layer on the surface was removed by buffing.

(Immersion process)
Subsequently, the resin-impregnated knitted fabric obtained above was immersed in an immersion solvent in which N, N-dimethylformamide and pure water were mixed in a ratio of 65 to 35. Thereafter, drying was performed to obtain a resin-impregnated knitted fabric after the dipping process.

(Cutting process)
Thereafter, the resin-impregnated knitted fabric was dried and sliced in the surface direction using a band knife type slicer so that the upper and lower thicknesses were uniform.

(Secondary impregnation step)
Furthermore, urethane prepolymer (made by DIC, trade name “Pandex TM363”, NCO equivalent: 286) 24.11 parts by mass and curing agent (made by DIC, trade name “Pandex E”) 10.91 parts by weight And 60.04 parts by mass of N, N-dimethylformamide were mixed to prepare a resin solution. After immersing the resin-impregnated knitted fabric after the cutting step in the obtained resin solution, the nip condition of the mangle roller was adjusted so that the density of the polishing pad was 0.36 g / cm ^3, and the resin solution was squeezed out. Then, washing | cleaning and drying were performed and the polishing pad of Example 3 was obtained. The resin adhesion amount was 198% by mass with respect to 100% by mass of the knitted fabric. The NCO equivalent was measured according to JIS K 7301 (1995) (the same applies hereinafter).

[Comparative Example 3]
A polishing pad of Comparative Example 3 was obtained in the same manner as in Example 3 except that the knitted fabric A2 was used instead of the knitted fabric A1. The resin adhesion amount was 198% by mass with respect to 100% by mass of the knitted fabric.

Example 4
A polishing pad of Example 4 was obtained by the same method as Example 3 except that the knitted fabric B1 was used instead of the knitted fabric A1. The adhesion amount of the resin was 89% by mass with respect to 100% by mass of the knitted fabric.

[Comparative Example 4]
A polishing pad of Comparative Example 4 was obtained in the same manner as in Example 4 except that the knitted fabric B2 was used instead of the knitted fabric B1. The adhesion amount of the resin was 89% by mass with respect to 100% by mass of the knitted fabric.

  Table 3 shows the hardness, compression rate, compression elastic modulus, thickness, and density of each polishing pad obtained in Examples 3-4 and Comparative Examples 3-4. Moreover, the evaluation result of the polishing rate and surface quality 2 at the time of performing on the conditions of the said grinding | polishing tests 1-2 is shown.

  The present invention has industrial applicability as a polishing pad, particularly a polishing pad for difficult-to-cut materials.

  DESCRIPTION OF SYMBOLS 1 ... Resin impregnated knitted fabric, 2 ... Polishing surface, 2 '... End surface

Claims (19)

A knitted fabric knitted by warp knitting or weft knitting, and a resin impregnated in the knitted fabric,
The knitted fabric includes an aligned knitting yarn configured by aligning two or more kinds of fibers having different melting points;
Polishing pad. The knitting yarn constituting the front and back surfaces of the knitted fabric includes the aligned knitting yarn,
The polishing pad according to claim 1. Among the two or more types of fibers having different melting points, the melting point of the fiber having the lowest melting point is 50 to 180 ° C.
The polishing pad according to claim 1. Among the two or more types of fibers having different melting points, the melting point of the fiber having the highest melting point is 200 to 400 ° C.
The polishing pad of any one of Claims 1-3. At least a part of the fibers constituting the knitted fabric is false twisted yarn,
The polishing pad of any one of Claims 1-4. Having a cross-section cut in the surface direction of the knitted fabric as a polishing surface,
The polishing pad according to claim 1. The resin includes a first resin and a second resin different from the first resin;
The second resin is a reaction product of a urethane prepolymer having an NCO equivalent of 400 or less and a curing agent.
The polishing pad according to claim 1. The resin includes a first resin and a second resin different from the first resin;
The content of the knitted fabric is 30 to 60% by mass with respect to the total amount of the knitted fabric, the first resin, and the second resin.
The polishing pad according to claim 1. The number average diameter of the single yarn constituting the knitted fabric is 3 to 30 μm.
The polishing pad according to claim 1. The surface roughness Ra of the polished surface is 25 to 80 μm.
The polishing pad of any one of Claims 1-9. The compression rate is 0.5 to 20%.
The polishing pad according to claim 1. The compression modulus is 50 to 98%,
The polishing pad according to claim 1. A hardness is 50-98 degrees,
The polishing pad according to claim 1. The thickness is 1.0 to 5.0 mm.
The polishing pad according to claim 1. A knitted fabric knitted by warp knitting or weft knitting, including an aligned knitting yarn composed of two or more types of fibers having different melting points, has a melting point of two or more types of fibers having different melting points. A heat setting step of heating at a temperature not lower than the melting point of the lowest fiber and lower than the melting point;
A primary impregnation step of impregnating the knitted fabric with a resin solution containing a first resin and performing wet coagulation to obtain a resin-impregnated knitted fabric;
An immersion step of immersing the resin-impregnated knitted fabric in an immersion liquid containing a solvent in which the first resin is soluble;
A secondary impregnation step of impregnating the resin-impregnated knitted fabric after the immersion step with a solution containing a urethane prepolymer having an NCO equivalent of 400 or less and a curing agent,
Manufacturing method of polishing pad. A cutting step of cutting the resin-impregnated knitted fabric after the dipping step in the surface direction of the knitted fabric,
The manufacturing method of the polishing pad of Claim 15. The first resin is soluble in one or more selected from the group consisting of N, N-dimethylformaldehyde, dimethylacetamide, methyl ethyl ketone and dimethyl sulfoxide;
The manufacturing method of the polishing pad of Claim 15 or 16. The solvent includes one or more solvents selected from the group consisting of N, N-dimethylformaldehyde, dimethylacetamide, methyl ethyl ketone, and dimethyl sulfoxide.
The manufacturing method of the polishing pad of any one of Claims 15-17. Using the polishing pad according to any one of claims 1 to 14, a polishing step of polishing an object to be polished.
A method for producing an abrasive.