JP2018040777A - Sensor structure patterning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sensor structure patterning method capable of recognizing physical and chemical changes in environment around a member, such as deformation, distortion, a temperature condition, minute cracks, rust and corrosion at low cost.SOLUTION: The patterning method includes a step of forming masking layers for high-resistance part and low-resistance part continuity blocks, which cover peripheries of areas where formation of the high-resistance part and low-resistance part continuity blocks is planned, a step of forming conductive layers for the high-resistance part and low-resistance part continuity blocks in ranges including the areas where formation of the high-resistance part and low-resistance part continuity blocks is planned, and a step of removing the masking layers for the high-resistance part and low-resistance part continuity blocks.SELECTED DRAWING: Figure 30

Description

  The present invention relates to a building such as a residential house, an apartment house, a building, a bridge, a steel tower, a railway, a pipeline, a plant, a power plant, a wind power generator, a solar power generator, etc. Buildings are simply referred to as buildings.) And various materials such as building materials and structural materials used in them, industrial machines such as construction machines and machine tools, and other mechanical devices, and fastening members and blades constituting them, Consumables such as holding members, element parts such as springs, bearings, linear guides, etc., various moving means such as rockets, aircraft, submarines, ships, trains and buses, trucks, passenger cars, motorcycles, bicycles, elevators, etc. The present invention relates to members used in various scenes such as office and household equipment, daily necessities, and the like, and a method of forming a current path patterned on these members.

  Currently, buildings, houses, apartment buildings, buildings that form spaces such as buildings, bridges, dams, caissons, wave-dissipating blocks, water gates, etc. (hereinafter referred to as buildings), automobiles, bicycles, railways Various kinds of members are used in various scenes such as various moving means including vehicles such as vehicles, mechanical equipment, electrical equipment, power generation equipment, and chemical plants. In addition, various materials such as iron, resin, rubber, stone, concrete, asphalt, wood, paper, ceramic, and glass are used as the material.

  For example, there are various things related to social infrastructure such as houses, apartment houses, school buildings, station buildings, airport terminals, hospitals, municipal offices, bridges and tunnels. The shape of a building is maintained by various structural materials such as columns, beams, floors, ceilings, bolts, nuts, reinforced concrete, and the like. Moreover, not only a structural material but various members and facilities, such as a window glass and a door, are used, and it is comprised by various materials and various shapes and structures.

  It is assumed that the structural material is used for a long period of time. However, since the structural material is exposed to external forces such as thermal expansion and contraction due to cold and warm, aging deterioration, earthquakes and other vibrations and impacts, aging is inevitable. If aging is neglected, there is a risk of human-induced disasters.

  In addition, typhoons, tornadoes, earthquake disasters, and the like, which are expected to become larger in the future, may give excessive stress and load even to the window glass, resulting in cracks or partial cuts. If these are left unattended, the window glass will break and there is a risk of injury.

  Therefore, in the future, various members such as building materials will be able to be monitored quantitatively and extensively to prevent accidents and disasters and to realize disaster mitigation and disaster prevention (National Resilience). )is important.

  However, at present, there are a huge number of buildings, for example. Prioritize the building materials that should be maintained, and focus on any structural material within a building. In reality, it is impossible to judge whether or not.

  By the way, for example, a bridge management chart is created to maintain and manage a bridge, and a person in charge in a prefecture / city / town / village regularly checks the bridge. However, since the inspection mainly focuses on visual appearance inspection by humans, individual differences are likely to occur and lack of objectivity, and real-time inspection cannot be performed. there were.

  It is common for various members other than structural materials to be repaired or replaced after a failure or damage has occurred, and there is a problem that it is difficult to prevent accidents and economic losses caused by this. there were.

  On the other hand, conventionally, there is a strain sensor element called a strain gauge, and the strain or stress generated in the object to be measured is indirectly measured by attaching it to an object to be measured using an adhesive. However, in this method, it is necessary to perform difficult attachment work with the adhesive to the object to be measured, and it is impossible to determine whether the adhesive is stretched or the object to be measured is stretched. Subject to be measured over a long period of time due to problems such as deterioration due to thermal effects, differences in thermal expansion, fatigue strength due to repeated expansion and contraction, weather resistance and durability. There is a problem that it is essentially impossible to obtain an accurate measurement result of the distortion occurring in the case.

  In addition, since the conventional strain gauge has a limit in detection sensitivity, for example, it is very difficult to detect locally extremely small deformations, vibrations, oscillations, etc., which occur over the entire huge building. Met.

  More specifically, a conventional strain gauge has a structure in which a resistance wiring that reciprocates in a bellows shape is formed with high accuracy in a small detection region, and this strain gauge is attached to a measurement object and deformed. Detect level. As a result, the detection area by one strain gauge is extremely small. Therefore, for example, when trying to detect a deformation that cannot be determined in advance in a large structure with a strain gauge, it is necessary to attach a huge number of strain gauges to the structure. From the viewpoint of the above, there was a problem that it was not realistic.

  The present invention has been made by the inventor's earnest research in view of the above-mentioned problems, and by making it possible to objectively measure the status of various members, maintenance management of the entire building, maintenance time Judgment and / or clarification of preferential repair structures and parts, connection to better design, or factory buildings as well as in-plant facilities, especially production facilities, industrial machines, equipment, or consumables used for them Real-time measurement and state grasping by this, or state grasping of various vehicles or moving bodies including airplanes, ships, railways, railway vehicles, automobiles, etc., and prevention of accidents due to this.

  The present invention that achieves the above-described object provides a sensor structure having a plurality of high-resistance partial energization zones that are spaced apart from each other and a plurality of low-resistance partial energization zones that are arranged so as to connect the high-resistance partial energization zones. Is formed on the surface of an object to be measured, and the object to be measured is combined into a sensor by combining the object to be measured and the sensor structure, and includes at least a plurality of high-resistance partial energizations. More than the masking layer forming step for the high resistance partial energization zone and the masking layer forming step for the high resistance partial energization zone forming the masking layer for the high resistance partial energization zone covering the periphery so that the zone formation planned area is exposed. A high-resistance portion that is executed in a later process and forms a conductive layer for a high-resistance partial current-carrying region using a conductive material for a high-resistance partial current-carrying region with respect to a range including a plurality of high-resistance partial current-carrying region formation planned areas A conductive layer forming step for the electric domain and a masking layer for the low-resistance partial energized area covering the periphery of the plurality of low-resistance partial energized areas to be formed are formed to expose the plurality of low-resistance partial energized areas to be formed. The low resistance partial energization zone masking layer formation step and the low resistance partial energization zone masking layer formation step are executed in a later process, and the range including a plurality of low resistance partial energization zone formation planned areas is low. Conductive layer forming step for low-resistance partial energization zone using conductive material for resistance partial energization zone and forming a conductive layer for low-resistance partial energization zone, and after the conductive layer forming step for high-resistance partial energization zone A masking layer for high-resistance partial current-carrying regions that is formed and forms a plurality of the high-resistance partial current-carrying regions by the conductive layer for high-resistance partial current-carrying regions by removing the masking layer for high-resistance partial current-carrying regions It is executed in a later process than the leaving step and the conductive layer forming step for the low-resistance partial energization zone, and the masking layer for the low-resistance partial energization zone is removed, so that a plurality of the conductive layers for the low-resistance partial energization zone are used. And a masking layer removing step for the low resistance partial energization zone for forming the low resistance partial energization zone.

  In relation to the patterning method, at least a part of the high-resistance partial energization region and the low-resistance partial energization region are formed to overlap each other.

  The present invention that achieves the above object includes forming a sensor structure having a base path and a plurality of low-resistance partial energization zones in contact with the base path on the surface of the object to be measured. A patterning method for converting the object to be measured itself into a sensor by combining the object and the sensor structure, wherein the base path is formed on the surface of the object to be measured by using a base path conductive material. A base path forming step to be formed and a plurality of low resistance partial energization zones to be formed for the base path having a plurality of low resistance partial energization zone formation scheduled areas, which are executed later than the base path forming step. Forming a masking layer for a low-resistance partial energization zone that covers the periphery of the region, and exposing a plurality of low-resistance partial energization zone forming areas, and the low-resistance portion It is executed in a later process than the masking layer forming step for the electric domain, and the base path in a range including a plurality of regions where the low-resistance partial energized areas are to be formed is reduced using the conductive material for the low-resistance partial energized areas. Conductive layer forming step for low-resistance partial energization zone for forming the conductive layer for resistance partial energization zone, and masking layer for the low-resistance partial energization zone executed after the conductive layer formation step for low-resistance partial energization zone A patterning method for a sensor structure, comprising: removing a masking layer for a low-resistance partial current-carrying region by forming a plurality of low-resistance partial current-carrying regions by removing the conductive layer for the low-resistance partial current-carrying region It is.

  The present invention that achieves the above object includes forming a sensor structure having a base path and a plurality of low-resistance partial energization zones in contact with the base path on the surface of the object to be measured. A patterning method for converting the object to be measured itself into a sensor by combining the object and the sensor structure, and forming the base path on the surface of the object to be measured having a base path forming area A base road masking layer that covers the periphery of the region, and the base road masking layer forming step that exposes the base road formation planned area, and is executed in a later process than the base road masking layer forming step, A base path conductive layer forming step of forming a base path conductive layer using a base path conductive material on the surface of the object to be measured in a range including a base path formation scheduled area; The base path conductive layer forming step is performed in a later process than the base path conductive layer forming step, and the base path conductive layer having a plurality of low-resistance partial energization zone forming areas within the range of the base path forming planned area Low resistance partial energization zone masking layer forming step of forming a low resistance partial energization zone masking layer covering the low resistance partial energization zone formation planned area and exposing a plurality of the low resistance partial energization zone formation areas And a low-resistance partial energization for the base path conductive layer in a range including a plurality of low-resistance partial energization zone formation regions that are executed after the low-resistance partial energization zone masking layer forming step. Conductive layer forming step for low-resistance partial energized section using conductive material for section and forming a conductive layer for low-resistance partial energized section, and is executed in a process after the base-layer conductive layer forming step. By removing the base path masking layer, the base path masking layer removing step for forming the base path with the base path conductive layer and the low resistance partial conducting area conductive layer forming step are executed later. Removing the masking layer for the low-resistance partial current-carrying region to form a plurality of the low-resistance partial current-carrying regions by the conductive layer for the low-resistance partial current-carrying region, It is a patterning method of the sensor structure characterized by having.

  In relation to the patterning method, the method includes an insulating layer forming step that is performed prior to the base path conductive layer forming step and that forms an insulating layer in the base path forming scheduled region with respect to the surface of the object to be measured. It is characterized by that.

  The present invention that achieves the above object includes forming a sensor structure having a base path and a plurality of low-resistance partial energization zones in contact with the base path on the surface of the object to be measured. A patterning method for converting the object to be measured itself into a sensor by combining the object and the sensor structure, wherein a plurality of low resistance partial current-carrying regions are formed on the surface of the object to be measured. Forming a masking layer for a low resistance partial energization zone that covers the periphery of the region where the low resistance partial energization zone is to be formed, and exposing a plurality of the low resistance partial energization zone formation areas Step, and the surface of the surface of the object to be measured in a range including a plurality of low-resistance partial energization zone formation planned areas, which is executed in a later process than the masking layer forming step for the low-resistance partial energization zone, Conductive layer forming step for low-resistance partial energization zone using the conductive material for resistance partial energization zone and forming a conductive layer for low-resistance partial energization zone, and after the conductive layer forming step for low-resistance partial energization zone A low-resistance partial current-carrying masking layer removing step that is performed to form a plurality of low-resistance partial current-carrying regions by a low-resistance partial current-carrying conductive layer by removing the low-resistance partial current-carrying masking layer; For the surface of the object to be measured having a base path formation scheduled area that is executed in a later process than the masking layer removal step for the low resistance partial conduction area and overlaps with the plurality of low resistance partial conduction area formation planned areas, A base road masking layer forming step for forming a base road masking layer covering the base road formation planned area and exposing the base road formation planned area; and The base path conductive layer is formed using the base path conductive material on the surface of the object to be measured in a range including the base path formation planned area, which is executed in a process subsequent to the masking layer forming step for the base. The base path conductive layer forming step and the base path conductive layer forming step are performed after the base path conductive layer forming step, and the base path masking layer is removed to form the base path with the base path conductive layer. And a masking layer removal step for the road.

  In relation to the patterning method, an insulating layer is formed in a region where the base path is to be formed with respect to the surface of the object to be measured. It has a step.

  The present invention that achieves the above object includes forming a sensor structure having a base path and a plurality of low-resistance partial energization zones in contact with the base path on the surface of the object to be measured. A patterning method for converting the object to be measured itself into a sensor by combining the object and the sensor structure, wherein a plurality of the low-resistance partial energization zones are formed on the surface of the object to be measured that also serves as the base path A masking layer forming step for forming a low-resistance partial energization zone that exposes a plurality of the low-resistance partial energization zone forming areas by forming a masking layer for the low-resistance partial energization zone that covers the periphery of the formation planned region, and the low-resistance portion Conductive material for low-resistance partial current-carrying area on the surface of the object to be measured in a range including a plurality of low-resistance partial current-carrying region formation regions, which is executed after the current-carrying zone masking layer forming step. The low-resistance partial current-carrying conductive layer forming step is used to form a low-resistance partial current-carrying conductive layer forming step, and the low-resistance partial current-carrying conductive layer forming step is performed in a later process. And a masking layer removing step for low-resistance partial energization zones in which a plurality of low-resistance partial energization zones are formed by the conductive layer for low-resistance partial energization zones by removing the masking layer for the sensor. Patterning method.

  The present invention that achieves the above object includes forming a sensor structure having a base path and a plurality of low-resistance partial energization zones in contact with the base path on the surface of the object to be measured. A patterning method for combining the object and the sensor structure to form a sensor for the object to be measured, and for conducting the base path with respect to the surface of the object to be measured in a range including the base path formation planned region A base road conductive layer forming step for forming a base road conductive layer using a conductive material, and a base road masking layer that covers the base path formation planned region for the base road conductive layer, A base path masking layer forming step that exposes an area other than the base path formation scheduled area, and removing the area other than the base path formation planned area in the base path conductive layer; And a range including a plurality of low-resistance partial energization zone formation regions that are executed in a later process than the base path conductive material removal step and overlap with the base path. In contrast, a low-resistance partial current-carrying conductive layer forming step of forming a low-resistance partial current-carrying conductive layer using a low-resistance partial current-carrying conductive material, and the low-resistance partial current-carrying conductive layer And forming a masking layer for the low-resistance partial energization zone that covers the plurality of low-resistance partial energization zone formation planned areas to expose regions other than the plurality of low-resistance partial energization zone formation zones. Low resistance for forming a plurality of low-resistance partial energization zones by removing a region other than the low-resistance partial energization zone formation scheduled area in the low-resistance partial energization zone conductive layer A minute current ku conductive material removal step, a patterning method of a sensor structure, characterized in that it comprises a.

  The present invention that achieves the above object includes forming a sensor structure having a base path and a plurality of low-resistance partial energization zones in contact with the base path on the surface of the object to be measured. A patterning method for combining an object and the sensor structure to form a sensor for the object to be measured itself, the patterning method being low with respect to the surface of the object to be measured in a range including a region where a low-resistance partial energization zone is to be formed A conductive layer forming step for forming a low-resistance partial current-carrying region using a conductive material for a resistance partial current-carrying region, and a plurality of the conductive layers for the low-resistance partial current-carrying region Low resistance partial energization zone masking layer forming step of forming a low resistance partial energization zone masking layer covering the low resistance partial energization zone formation area and exposing a plurality of regions other than the low resistance partial energization zone formation area And the low By removing regions other than the low-resistance partial energization zone formation planned region in the conductive layer for the anti-partial energization zone, a conductive material removing step for low-resistance partial energization zones that forms a plurality of the low-resistance partial energization zones, The base path conductive material is used for a range including a base path formation scheduled region that is executed in a later process than the low resistance partial current-carrying conductive material removing step and overlaps with the plurality of low-resistance partial current-carrying areas. Forming a base path conductive layer, and forming a base path masking layer for covering the base path formation planned area with respect to the base path conductive layer. The base path masking layer forming step for exposing the area other than the planned area, and removing the area other than the base path forming planned area in the base path conductive layer, A patterning method of a sensor structure, characterized in that it comprises a conductive material removal step for the base path to form a.

  The present invention that achieves the above object includes forming a sensor structure having a base path and a plurality of low-resistance partial energization zones in contact with the base path on the surface of the object to be measured. A patterning method for converting the object to be measured itself into a sensor by combining the object and the sensor structure, and forming a low-resistance partial energization zone on the surface of the object to be measured that also serves as the base path A conductive layer for forming a low-resistance partial current-carrying region using a conductive material for low-resistance partial current-carrying region so as to include a conductive layer for forming a low-resistance partial current-carrying region; And forming a masking layer for the low-resistance partial energization zone that covers the plurality of low-resistance partial energization zone formation planned areas to expose regions other than the plurality of low-resistance partial energization zone formation zones. Masking layer formation Step and conductivity for the low-resistance partial current-carrying region that forms a plurality of the low-resistance partial current-carrying regions by removing the regions other than the regions where the low-resistance partial current-carrying regions are to be formed in the conductive layer for the low-resistance partial current-carrying regions And a material removal step. A patterning method for a sensor structure.

  According to the present invention, deformation or distortion generated in the member, temperature state, physical state such as microcracks and / or change in chemical state such as surface state of the substance such as rust and corrosion, physical surrounding the member, Objectively grasping chemical environmental changes can be realized at a very low cost, and mass production is possible, so that a wide range of objects can be objectively and remotely monitored. In addition, the present invention has an effect that application to a wide variety of members and a large number of members can be realized at an extremely low cost.

It is a figure which shows the whole structure of the measurement system of the structure using the member with a sensor structure which concerns on embodiment of this invention. (A) which shows the sensor structure which concerns on embodiment of this invention is a top view, (B) is a BB arrow sectional drawing of a top view, (C) is sectional drawing explaining an internal structure, (D) and ( E) is a sectional view showing a state at the time of deformation. It is a top view at the time of applying the sensor structure which concerns on embodiment of this invention to a base material. It is a top view at the time of applying the sensor structure which concerns on embodiment of this invention to a base material. (A) which shows the other example of the sensor structure which concerns on embodiment of this invention is a top view, (B) is BB arrow sectional drawing of a top view. It is sectional drawing which shows the other example of the sensor structure which concerns on embodiment of this invention. It is sectional drawing which shows the other example of the sensor structure which concerns on embodiment of this invention. It is a perspective view at the time of applying the sensor structure concerning the embodiment of the present invention to a rod-shaped base material. It is a top view which shows the other example of the sensor structure which concerns on embodiment of this invention. It is a perspective view which expands and shows the building to which the member with a sensor structure is applied. (A) is a top view, (B) is a front view, (C) is a rear view, and (D) is a D- in (B) showing an external thread body as an example of a sensor structure member used in the measurement system. It is D arrow sectional drawing. It is a perspective view which expands and shows a part of member with the sensor structure. It is a front view which expands and shows a part of member with the same sensor structure, (B) And (C) is BB arrow sectional drawing of (A). It is the expanded view which shows (A) front view, (B) sectional drawing, and (C) sensor structure only which show the modification of the member with the same sensor structure. It is (A) top view, (B) front view, and (C) bottom view which show the modification of the same male screw body. (A) The perspective view which expands and shows a part of the same external thread body, (B) Partial sectional view, (C) thru | or (I) are partial sectional views which show a lamination process. It is the (A) front view and (B) front sectional view which show the modification of the same male screw body. (A) Front view which shows the modification of the same male screw body, (B) is BB arrow sectional drawing of (A). (A) Front view which shows the modification of the same male screw body, (B) is BB arrow sectional drawing of (A). It is a block diagram which shows the structure of the board | substrate incorporated in the same male screw body. (A) thru | or (D) It is a circuit diagram which shows the structure of the bridge circuit applied to the energization path to the same male screw body. (A) And (B) It is a circuit diagram which shows the structure of the bridge circuit applied to the energization path to the same male screw body. (A) is a block diagram showing a hardware configuration of an information collection device of the measurement system, and (B) is a block diagram showing a functional configuration of the information collection device. It is a front view which shows the loosening prevention structure of the thread part used as the modification of the same male screw body. It is the (A) front view, (B) bottom view, and (C) side view which expand and show the screw part. (A) thru | or (C) is a front view which shows the state which forms an electricity path in the screw part. It is a front view which shows the example of the loosening prevention structure of the thread part of the same male screw body. It is a front view which shows the example of the loosening prevention structure of the thread part of the same male screw body. (A) thru | or (C) is a front view which shows the modification of the member with the same sensor structure. It is a perspective view which expands and shows the building where the member with the same sensor structure is applied. It is a figure which shows the modification of the member with the same sensor structure. It is a figure which shows the modification of the member with the same sensor structure. It is a figure which shows the modification of the member with the same sensor structure. It is a figure which shows the modification of the member with the same sensor structure. It is a figure which shows the modification of the member with the same sensor structure. (A) is a figure which shows the modification of the electricity supply path of the member with the same sensor structure, (B) is BB arrow sectional drawing of (A). It is a figure which shows the modification of the member with the same sensor structure. It is a figure which shows the modification of the member with the same sensor structure. It is a figure which shows the modification of the member with the same sensor structure. It is a figure which shows the electricity supply path of a multilayer structure in the member with the same sensor structure. It is a figure which shows the example of arrangement | positioning of the electric power supply wiring in the member with the same sensor structure. It is a figure which shows the example of arrangement | positioning of the electric power supply wiring in the member with the same sensor structure. It is a figure which shows the modification of the member with the same sensor structure. (A) is a figure which shows the modification of the electricity supply path of the member with the same sensor structure, (B) and (C) are BB arrow sectional drawing of (A). (A) And (B) is a figure which shows the modification of the electricity supply path of the member with the same sensor structure. It is a figure which shows the modification of the electricity supply path of the member with the same sensor structure. (A) And (b) is explanatory drawing which shows the electricity supply circuit which consists of a several electricity supply path. (A) And (b) is explanatory drawing which shows the electricity supply circuit of a two-dimensional matrix form. (A) thru | or (i) are explanatory drawings which show the pattern information for forming the electricity supply circuit. These are explanatory drawings which show the energization circuit pattern which combined the pattern information. (A) is a perspective view which shows the modification of the member with the same sensor structure, (b) It is a fragmentary sectional view of the energization circuit of the member with the same sensor structure. (A) And (b) is a perspective view which shows the usage type of a strip | belt-shaped member with a sensor structure, (b) is a conceptual diagram which shows the detection aspect of the member with a sensor structure. It is a perspective view which shows the case where the base material itself of a member with a sensor structure is used as a base path. It is a top view which shows the process example of the patterning method of the sensor structure which concerns on embodiment of this invention. It is a top view which shows the other process example of the patterning method. It is a top view which shows the other process example of the patterning method. It is a top view which shows the other process example of the patterning method. It is a top view which shows the other process example of the patterning method. It is a top view which shows the other process example of the patterning method. It is a top view which shows the other process example of the patterning method. It is a top view which shows the other process example of the patterning method. It is a top view which shows the other process example of the patterning method.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, the sensor structure formed by the patterning method of the sensor structure of the present embodiment and the member with the sensor structure having the sensor structure will be described, and finally, the patterning method of the sensor structure will be described.

  FIG. 1A shows a building measurement system 1 in which a member with a sensor structure according to an embodiment of the present invention is used. The measurement system 1 includes a plurality of structures 10 such as buildings, bridges, railroad rails, roads, and elevated roads, and a sensor-structured member (for example, a member that defines a structure at the time of construction in the structure 10 (for example, H-shaped steel, C-shaped steel, T-shaped steel, I-shaped steel, structural materials such as round and square tubular steel, screw fastening members, joining members such as rivets, wall materials, concrete materials, etc.) 30 and this sensor The information collecting device 100 is connected to the structural member 30 by wire or wireless.

  FIG. 1B (A) shows a sensor structure 500 applied to the base material 32 of the member 30 with sensor structure. The sensor structure 500 is configured by arranging a plurality of low-resistance partial energization sections (conductive pieces) 95Q on the surface of a strip-shaped base path 95P made of a conductive material. In the present embodiment, a plurality of squares (of course, not necessarily squares are provided on one surface of the base path 95P, but may be provided intermittently as relatively good conductive parts. .)) Are arranged at intervals so as to spread in the longitudinal direction of the band. The base path 95P is made of a conductive material having a relatively high resistance value (high resistivity). On the other hand, the low-resistance partial energization section 95Q is a conductor (good conductor) having a low resistance value (low resistivity) compared to the material of the base path 95P. Although not particularly shown, an insulating layer is formed below the base path 95P. Here, the layer thickness of the base path 95P is not particularly limited, but by setting it thick, it is possible to increase the deformation amount of the base path 95P with respect to the distortion of the base material 32, and the detection sensitivity. Can be improved. However, if the layer pressure of the base path 95P is too thick, the influence of thermal expansion and contraction tends to increase. Therefore, it is preferable that the setting is not too thick, for example, compared to the thickness of the low-resistance partial energization section 95Q. It is preferable to set the thickness to be thicker. In addition, it is preferable to set the layer thickness of the low-resistance partial energization section 95Q to 1 mm or less, considering the followability to deformation of the base material 32, thermal expansion, thermal contraction, material usage, manufacturability, and the like. , Several hundred μm or less, preferably about 0.1 μm to several tens of μm. Of course, if it is too thin, it is preferable to set the setting in consideration of the fact that the base path 95P itself is torn or the resistance value is increased.

  When a voltage is applied to both ends of the base path 95P, it is presumed that electrons flow while selecting a place having a low resistance as much as possible, as indicated by arrows in FIG. 1B (B). Specifically, charges (electrons or the like) move inside the base path 95P in a place where the low-resistance partial energization section 95Q does not exist (that is, an area having the interval d0 of the low-resistance partial energization section 95Q). In addition, electrons move in the low resistance partial energization section 95Q or in the vicinity of the boundary between the base path 95P and the low resistance partial energization section 95Q where the low resistance partial energization section 95Q exists.

  Explaining this sensor structure 500 from another point of view, as shown in FIG. 1B (C), a plurality of high resistance partial energization sections 95T made of a conductive material having a high resistivity are formed in the base path 95P. They are arranged with a distance d1 between them. This interval d1 corresponds to a range where the low-resistance partial energization section 95Q exists. Further, the low resistance partial energization section 95Q made of a conductive material having a low resistivity is disposed so as to connect the adjacent high resistance partial energization section 95T as a pair. At the same time, the plurality of low-resistance partial energization sections 95Q are arranged on the high-resistance partial energization section 95T with an interval d0 therebetween. This interval d0 corresponds to a range where the high-resistance partial energization section 95T exists. If comprised in this way, it will result in the high resistance partial electricity supply area 95T and the low resistance partial electricity supply area 95Q continuing alternately, and when a voltage is applied to both ends, an electron will be in high resistance partial electricity supply area 95T and low resistance partial electricity supply area 95Q. I guess that it flows while selecting alternately.

  A region where the high resistance partial energization section 95T does not exist in the base path 95P is defined as an auxiliary energization section 95U. The auxiliary energizing section 95U is provided together with the low resistance partial energizing section 95Q and has a higher resistivity than the conductive material of the low resistance partial energizing section 95Q (here, the same as the low resistance partial energizing section 95Q). (Conducting material). The auxiliary energizing section 95U is virtually paired and electrically connected to the adjacent high resistance partial energizing section 95T. However, since the low resistance partial energizing section 95Q is in parallel, the electrons are in the low resistance section. It will move on the energizing section 95Q side. That is, it is presumed that the auxiliary energization section 95U functions as a wiring that does not provide dominant conduction, although some current may flow.

  As a result, a region corresponding to the interval d0 between the plurality of low resistance partial energization sections 95Q in the base path 95P becomes a high resistance partial energization section 95T, and an area in contact with the low resistance partial energization section 95Q in the base path 95P. At least a part of the auxiliary energizing section 95U.

  When the sensor structure 500 configured as described above is curved in one direction so that the base path 95P extends in the longitudinal direction due to the convex surface of the base material 32 as shown in FIG. 1B (D). The distance between adjacent low-resistance partial energization sections 95Q increases from d0 to d +. As a result of verification by the present inventors, when the base path 95P extends, the resistance value between both ends thereof increases, and the convex curve state of the base material 32 can be detected.

  Further, as shown in FIG. 1B (E), when the base path 95P is curved in the other direction so that the surface of the base material 32 becomes concave, the distance between the adjacent low-resistance partial energization sections 95Q. Shrinks from d0 to d-. As a result of verification by the present inventors, in this case, the resistance value between both ends of the base path 95P decreases, and the concave curved state of the base material 32 can be detected. That is, according to the sensor structure 500 of this structure, a physical phenomenon such as expansion and contraction in the longitudinal direction and bending can be detected with good sensitivity by a change in resistance value. At this time, the thickness of the base path 95P having a high resistance value is set to be thicker than that of the low resistance partial energization section 95Q, and the deformation of the base path 95P with respect to the distortion of the base material 32 sets the thickness to be thin. It is also preferable to configure so as to increase more than the case.

  Since the sensor structure 500 can be formed relatively easily, the sensor structure 500 can be formed over a wide range with respect to various base materials 32 to detect a physical phenomenon of the base material 32. For example, as shown in FIG. 1C (A), in the case of a base material 32 having a wide range of planes such as walls, floors, ceilings, pillars, etc., in one direction X on the plane, over the entire area from the vicinity of one end to the vicinity of the other end. The sensor structure 500 which becomes a single circuit is formed so as to extend. In this example, in the other direction Y, which is perpendicular to the specific direction X, the single circuit reciprocates a plurality of times and spreads in a bellows shape over the entire region from the vicinity to the vicinity of the other end. That is, a single circuit is arranged in the whole area from the vicinity of one end to the vicinity of the other end in both directions in the X direction and the Y direction. As shown in FIG. 1C (B), a plurality of sensor structures 500 extending from the vicinity of one end to the vicinity of the other end in one direction X are arranged in the Y direction, so that the physical phenomenon of the entire plane can be observed. You may make it detect.

  Also, for example, as shown in FIG. 1D (A), in the case of a base material 32 having a strip-like surface that is long in one direction, such as a frame such as a beam, a railroad rail, etc. The sensor structure 500 that is a single circuit is formed so as to extend over the entire area in the vicinity of the end. Incidentally, in this example, a single circuit is reciprocated once in the longitudinal direction Z. Further, as shown in FIG. 1D (B), the sensor structure 500 that extends from the vicinity of one end to the vicinity of the other end in one direction X meanders in the Y direction to detect a physical phenomenon in the entire plane. Anyway.

  Next, another configuration example of the sensor structure will be described. In the sensor structure 500 shown in FIGS. 1E and 1B, the low-resistance partial energization section 95Q is on the lower layer side (base material 32 side), and the base path 95P can be the upper layer. That is, the low resistance partial energization section 95Q is formed on the surface on the back side of the base path 95P. Even in this case, substantially the same output as that of the sensor structure 500 of FIG. 1A can be obtained. In the case of this structure, the base path 95P can be formed by previously forming the low-resistance partial energization section 95Q and covering the whole. As a result, since the conductive material of the base path 95P is filled in the space of the interval d0 between the plurality of low resistance partial energization sections 95Q, the space itself becomes the high resistance partial energization section 95T.

  A sensor structure 500 shown in FIG. 1F (A) has a structure in which a low-resistance partial energization section 95Q is embedded in the base path 95P (in the present embodiment, in the thickness direction). In the case of this structure, a portion corresponding to the interval d0 between the plurality of low-resistance partial energization sections 95Q is the high-resistance partial energization section 95T.

  Further, the sensor structure 500 shown in FIG. 1F (B) does not have a series of base paths 95P, and is formed such that the high-resistance partial energization section 95T and the low-resistance partial energization section 95Q are alternately connected. In this case, the edges of the high-resistance partial energization section 95T and the low-resistance partial energization section 95Q are electrically connected, and electrons flow alternately in the high-resistance partial energization section 95T and the low-resistance partial energization section 95Q. Will go. As an application of this, as shown in FIG. 1F (C), the high-resistance partial energization region 95T and the low-resistance partial energization region 95Q are planar, and the high-resistance partial energization region 95T and the low-resistance partial energization region 95Q are By overlapping, the planes (not the ends) may be in surface contact with each other. Here, the layer thickness of the high-resistance partial energization section 95T is not particularly limited, but by setting the layer thickness to be thick, the deformation amount of the high-resistance partial energization section 95T with respect to the distortion of the base material 32 can be increased. This is possible, and the detection sensitivity can be improved. However, if the layer thickness of the high-resistance partial energization section 95T is too thick, the influence of thermal expansion and shrinkage tends to increase. Therefore, it is preferable that the setting is not too thick, for example, compared with the thickness of the low-resistance partial energization section 95Q. Thus, it is preferable to set the thickness to be thicker. In addition, it is preferable to set the layer thickness of the low-resistance partial energization section 95Q to 1 mm or less, considering the followability to deformation of the base material 32, thermal expansion, thermal contraction, material usage, manufacturability, and the like. , Several hundred μm or less, preferably about 0.1 μm to several tens of μm. Of course, if it is too thin, it is preferable to set the setting in consideration of the fact that the base path 95P itself is torn or the resistance value is increased.

  As shown in FIGS. 1G (A) to (C), the sensor structure 500 can be multi-layered. Specifically, in the base path 95P, a plurality of high-resistance partial energization sections 95T made of a conductive material having a high resistivity are arranged at intervals. The paired high resistance partial energization section 95T is electrically connected by the low resistance partial energization section 95Q laminated on the surface of the base path 95P. In the base path 95P, a region where the high resistance partial energization section 95T does not exist is an auxiliary energization section 95U. A second low-resistance partial energization section 95H is further formed as a part of the surface of the low-resistance partial energization section 95Q. The second low-resistance partial energization section 95H is made of a conductive material that has a lower resistivity than the low-resistance partial energization section 95Q. Accordingly, as shown in FIG. 1G (C), electrons moving in the low resistance partial energization section 95Q further move on the second low resistance partial energization section 95H side and return to the low resistance partial energization section 95Q. .

  That is, when attention is paid only to the low-resistance partial energization section 95Q and the second low-resistance partial energization section 95H, the low-resistance partial energization section 95Q serves as a so-called base path, and at least a pair of high-resistance partial energization sections 95T ′ and And an auxiliary energizing section 95U ′ interposed therebetween. The second low resistance partial energization section 95H is provided so as to electrically connect the paired high resistance partial energization sections 95T ′. As a result, in the sensor structure 500 of the present example, the high resistance partial energization zone having a relatively high resistance and the low resistance partial energization zone having a relatively low resistance are formed in a multi-layered state, thereby further increasing sensitivity. I think it will be possible.

  Of course, in the sensor structure 500, if the low-resistance partial energization section 95Q and the second low-resistance partial energization section 95H are integrally formed and these are defined as the low-resistance partial energization section as a whole, the sensor structure 500 of FIG. And can be equated.

  In addition, as shown in FIG. 1H (A), when the base material 32 is a rod-shaped member (the cross-sectional shape is not limited to a circle but may be a prism or the like), an annular high-resistance partial energization section 95T extending in the circumferential direction The annular low resistance partial energization zones Q extending in the circumferential direction may be alternately arranged in the axial direction. If a voltage is applied to both ends in the axial direction, it is possible to detect with high accuracy behaviors such as bending, twisting, and pulling of the base material that becomes the rod-shaped member. Further, as shown in FIG. 1H (B), a plurality of high-resistance partial energization sections 95T may be arranged at a constant interval in the circumferential direction.

  Further, as shown in FIG. 1I (A), in the base material 32 having a surface (a flat surface or a curved surface), a planar base path 95P extending over the entire surface is formed, and a plurality of low-profile base paths 95C are formed on the surface of the base path 95C. The resistance partial energization section 95Q can also be arranged. In this example, a low-resistance partial energizing section 95Q of a plurality of squares (not necessarily required to be rectangular but need only be provided with a conductive area having a relatively good resistance value intermittently) in the plane direction. They are arranged so as to spread (for example, in a matrix shape, a honeycomb shape, or a random shape) with a space therebetween. In this sensor structure 500, if a voltage is applied from two distant locations, it is possible to detect deformation of the base material 32 and the like. When a planar wiring is constructed, there is no need to worry about disconnection and the like, and long-term stable sensing is realized. Further, the low-resistance partial energization section 95Q is not limited to being arranged in a matrix, and as shown in FIG. 1I (B), a plurality of the low-resistance partial energization sections 95Q are provided while being spaced apart in the band width direction. By arranging, sensing of the entire surface may be realized.

  Next, a case where the sensor structure 500 is applied to the screw body will be described.

  Here, the sensor structure-equipped member 30 is a male screw body or a female screw body, and is preferably used as a basic structural material of the building 10.

  Specifically, as shown in FIG. 2, a joining portion for connecting a column 12 made of a rectangular cylindrical steel material extending in the vertical direction of the building 10, an H-shaped steel material extending in a horizontal direction from the column 12, so-called H A member 30 with a sensor structure, which is a screw fastening member, is fastened using a connection plate 17 at a plurality of joint portions where the steel beam 14 is coupled. The sensor structure-attached member 30 serves as a part where the structural material (framework material) of the building 10 is joined. Thus, the sensor structure-equipped member 30 can indirectly receive internal stress generated in the structural material by being involved in the joining of the structural materials. Of course, the column 12, the beam 14, and the connection plate 17 themselves are also structural materials.

  As shown in FIG. 2, it is preferable to select a location where the axial directions (fastening directions) are different from each other in the plurality of members 30 with sensor structure. By doing in this way, it becomes possible to measure the state of stress acting on the structural material of the building 10 from the front and rear, from the left and right, and from the top and bottom in three dimensions and to grasp the state.

  3 and 4A show a basic structure in the case where the male screw body 40 is employed as the sensor structure-equipped member 30. FIG. The male screw body 40 is a so-called bolt and has a head portion 42 and a shaft portion 44. The shaft portion 44 is formed with a cylindrical portion 44a and a screw portion 44b. Of course, the cylindrical portion 44a is not essential.

  A head housing space 48 is formed in the head 42, and a shaft housing space 46 extending in the axial direction is formed in the shaft 44. The head housing space 48 and the shaft housing space 46 are in communication with each other, and the head housing space 48 is expanded in the radial direction relative to the shaft housing space 46. Here, the head housing space 48 and the shaft housing space 46 are collectively referred to as an internal space 49.

  The cylindrical portion 44 a has a concave portion 90 formed on the outer peripheral surface, and a current path 92 for strain measurement is formed on the cylindrical bottom surface of the concave portion 90. The energization path 92 is made of a metal material, and itself is deformed as the sensor structure-attached member 30 is deformed. As a result, electrical characteristics such as a resistance value are changed. Output the resulting distortion state. An electrical insulating layer 91 is directly formed on the bottom surface of the recess 90, and a current path 92 is directly formed on the electrical insulating layer 91.

  For the electrical insulating layer 91, for example, laminated printing, pad printing, painting, plating, ink jet printing, or the like can be employed. In addition, for example, in a state where a predetermined mask is disposed, an insulating material is formed by sputtering, a silica material is applied and heat-treated, or an organic insulating material such as polyimide, epoxy, urethane, or silicone is used. Various methods such as coating can be employed. In addition, when the base material itself that forms the current path 92 has electrical conductivity, the base material surface is oxidized to form an oxide film, thereby forming the electrical insulating layer 91, or when the base material is aluminum-based. It is also effective to provide the electrical insulating layer 91 by anodizing. Of course, the electrical insulating layer 91 is not limited to these.

  The energizing path 92 includes a first energizing path 93 and a second energizing path 94 that are provided independently of each other. The 1st electricity supply path 93 is extended so that it may reciprocate along the axial direction J used as a 1st direction, and the state which the surface of the member 30 with a sensor structure deform | transforms along a 1st direction is detected. The second energization path 94 extends so as to reciprocate along the circumferential direction S, which is a second direction perpendicular to the first direction, and the surface of the sensor-structured member 30 is deformed along the second direction. Detect the state to be. In addition, although the case where only one first energization path 93 is disposed is illustrated here, it is also preferable to dispose a plurality of them in a place having a certain phase difference (for example, 90 °, 180 °) in the circumferential direction. A plurality may be arranged at intervals. The same applies to the second energization path 94. The current path 92 is directly formed in the concave portion 90 or the electrical insulating layer 91 by layer printing, pad printing, painting, plating, ink jet printing, sputtering, or the like using a conductive paste. The shape of the wiring may be set by performing masking and etching according to the shape of the current path 92. By forming the energization path 92 directly in this way, the energization path 92 is prevented from peeling off over a long period of time. By the way, when a so-called conventional strain gauge is installed on a measurement object by means of an adhesive layer composed of an adhesive, an error equivalent to the thickness of the adhesive appears, or the error is large depending on the installation direction and the installation angle with respect to the measurement object. In addition, it is unreasonable because it causes sag, and accurate measurement of strain cannot be performed due to deterioration of the adhesive over time. Therefore, direct formation as in this embodiment is preferable. On the other hand, when the sensor structure is made detachable (transferable) depending on the seal type, it is preferable to provide adhesive on the lower layer side and provide a release sheet layer on the surface thereof.

  The outer surfaces of the first energization path 93 and the second energization path 94 are set so as not to protrude from the recess 90. That is, the depth of the recess 90 is set to be equal to or greater than the thickness of the wiring of the first energizing path 93 and the second energizing path 94. By doing in this way, you may comprise so that the 1st electricity supply path 93 and the 2nd electricity supply path 94 may avoid contacting and damaging another member. In addition, it is also preferable to form a cover layer on the outer surface of the first energizing path 93 and the second energizing path 94 for protection. An insulating material is also used for the cover layer. Of course, a barrier layer having high oil resistance, water resistance, heat resistance, steam resistance, weather resistance and the like may be provided.

  A recess 96 is also formed in the seating surface 42 </ b> A and the peripheral surface 42 </ b> B of the head 42. A wiring 97 for supplying electricity from a battery 52 (described later) to the energizing path 92 is formed in the recess 46. Therefore, even if the connection plate 17 is fastened by the seating surface 42 </ b> A, the wiring 97 can be prevented from contacting the connection plate 17. Further, even when the head 42 is rotated with a tool such as a spanner, it is possible to avoid contact between the tool and the wiring 97.

  In the internal space 49, a board 54 to which wiring 97 is connected and a battery 52 for supplying power to the board 54 are housed. However, in the case of a short-range wireless communication tag, a battery or a capacitor is not necessarily required. Not a reason. In this embodiment, the case where the battery 52 is built in is exemplified, but a battery box is arranged outside, and power is supplied from the battery box to the sensor structure member 30 by wire and / or wireless. Also good. Moreover, although this embodiment shows the case where the male screw body 40 is operated using the battery 52, for example, when power is supplied from the outside by wired power wiring, this battery can be omitted. . Furthermore, the battery 52 can also be omitted in the case of a passive structure such as an RFID that receives radio waves from an external reader or the like as energy and operates using this energy as a power source.

  Further, in order to prevent foreign matter and moisture from entering the internal space 49, a cap 50 is installed at the opening of the internal space 49. If the cap 50 on the head accommodating space 48 side is removed, the battery 52 can be replaced and the substrate 54 and the like can be maintained without removing the male screw body 40 from the building 10. Of course, instead of closing with the cap 50, it may be embedded with resin, rubber, putty or the like.

  FIG. 4B (A) shows an enlarged detailed structure of the energization path 92 (the first energization path 93 and the second energization path 94). A sensor structure 500 is formed in the energization path 92. The sensor structure 500 is configured by arranging a plurality of low-resistance partial energization sections (conductive pieces) 95Q on the surface of a strip-shaped base path 95P made of a conductive material. In the present embodiment, a plurality of squares (of course, not necessarily squares are provided on one surface of the base path 95P, but may be provided intermittently as relatively good conductive parts. .)) Are arranged at intervals so as to spread in the longitudinal direction of the band. Further, the base path 95P becomes a conductor of a relatively high resistance value material, and the low resistance partial energization section 95Q becomes a conductor of a relatively low resistance value (good conductor). Although not particularly shown, an insulating layer is formed below the base path 95P.

  When a voltage is applied to both ends of this base path 95P, as shown by the arrow in FIG. 4B (B), one of the base paths 95P between the inside of the base path 95P and the low-resistance partial energization section 95Q adjacent at a distance d0. Electrons move through the surface layer and current flows. Therefore, the current can be supplied only to one surface layer side of the base path 95P.

  Therefore, as shown in FIG. 4B (C), when the energization path 92 is curved in one direction so that one surface of the base path 95P extends, the distance between the adjacent low-resistance partial energization sections 95Q increases from d0 to d. As a result of verification by the present inventors, the resistance value between both ends of the base path 95P increases, and the curved state can be detected. That is, according to the current-carrying path 92 of this structure, it is possible to increase the sensitivity of resistance value changes due to longitudinal expansion / contraction (particularly expansion) and bending. In particular, when the surface of the base path 95P on the low resistance partial energization section 95Q side (that is, the upper side surface in the figure) is curved so as to be convex, the low resistance partial energization section 95Q side extends in the longitudinal direction. The resistance value between them tends to increase.

  4B illustrates the case where the first energizing path 93 is formed so as to extend in a partial range in the circumferential direction S while extending and reciprocating in the axial direction J as the first direction. Is not limited to this. For example, as illustrated in FIG. 4C, the energization path 92 (first energization path 93) may be formed over substantially the entire circumference in the circumferential direction S while extending and reciprocating in the axial direction J that is the first direction. . In this way, even when the sensor-structured member 30 bends in various directions or vibrates (shifts in axis), the behavior can be detected by the single energization path 93.

  FIG. 5A shows another configuration example of the male screw body 40. A concave portion (plane) 60 having a non-circular cross section is formed on the outer peripheral surface of the shaft portion 44 of the male screw body 40 made of an electrically insulating material. The recess (plane) 60 extends in the axial direction, and a current path 92 is directly formed there. However, when the outer surface of the material of the male screw body 40 has conductivity, it can be interposed through an electrical insulating layer. The recesses 60 are disposed on both sides in the diameter direction with the central axis as a boundary. In this case, for example, when a bending moment is applied to the shaft portion 44 of the male screw body 40, one axial conduction path 92 exerts a compressive force, and the other conduction path 92 exerts an extension force. Can occur. By this difference, a change in bending moment acting on the male screw body 40 can be detected. Here, the case where the flat surface 60 is formed in the entire axial direction of the shaft portion 44 is illustrated, but it is also preferable to form the concave portion (plane) 60 only in the region of the cylindrical portion 44a.

  FIG. 5B shows another configuration example of the male screw body 40. A groove (recessed portion) 90A that defines a current path 92 is formed on the outer peripheral surface of the shaft portion 44 of the male screw body 40. As shown in FIG. An electrical insulating layer 91 is formed, and a current path 92 is formed directly on the electrical insulating layer 91. As a result, the energization path 92 does not need to contact the external member, so that disconnection or peeling of the energization path 92 can be suppressed, and the deformation of the male screw body 40 as the target member can be directly measured.

  As a specific procedure for forming the current path 92, first, as shown in FIG. 5B (C), an electrical insulating layer 91 is formed on the entire outer peripheral surface of the shaft portion 44, and as shown in FIG. 5B (D), After removing the electrically insulating layer 91 protruding from the groove 90A, a high resistance conductive material used for the base path 95P is formed on the entire outer peripheral surface of the shaft portion 44 as shown in FIG. 5B (E). I can do it. After that, as shown in FIG. 5B (F), the base path 95P protruding from the groove 90A is removed, and further, as shown in FIG. 5B (G), the inside of the base path 95P is etched. Thus, the fine recesses 90X are continuously formed at intervals in the longitudinal direction. Next, as shown in FIG. 5B (H), a low-resistance conductive material used for the low-resistance partial energization region 95Q is formed so as to include the inside of the fine recess 90X. After that, as shown in FIG. 5B (I), the low-resistance conductive material 95Q is formed in the fine recess 90X by removing the low-resistance conductive material protruding from the fine recess 90X. As a result, the electrical insulating layer 91 and the current path 92 can be formed in the groove 90A.

  FIG. 5C shows another configuration example of the male screw body 40. In the male screw body 40, a current path 92 is formed in the screw portion 44 b in the shaft portion 44. Specifically, as shown in the partial enlarged view of FIG. 5C (A), the electrical insulating layer 91 and the current path 92 are spirally formed along the bottom (valley bottom) 211u of the thread groove between the adjacent strips 211. Form. Since the bottom portion 211u has a gap between the thread of the female screw body 70 to be screwed together, if the electric insulation layer 91 and the current path 92 are formed by effectively using the gap, the bottom portion 211u interferes with the female screw body 70. There is nothing. The energizing path 92 is configured by arranging a plurality of low resistance partial energizing sections (conductive pieces) 95Q on the surface of the base path 95P. Of course, in order to form the energization path 92, it is also preferable to set the bottom part 211u of the thread groove deeper. Of course, the energization path 92 may be formed on the flank surface, and in particular, if the energization path 92 is formed in a recess recessed from the surface of the flank surface, the energization path 92 is long without being disconnected due to repeated attachment / detachment or friction. It can be measured stably over a period, which is preferable. Further, if a top coat having high wear resistance is applied to the surface of the current path 92, the wear resistance can be improved.

  By forming a current path spirally along the thread groove, one end 92 a of the current path 92 is positioned on the head 42 side and the other end 92 b is positioned on the tip side of the shaft portion 44. Accordingly, as shown in FIG. 5C (B), one end 92 a of the energizing path 92 is extended to the internal space 49 via the through hole 49 a formed in the head portion 42 or the shaft portion 44. The other end 92 b extends to the internal space 49 via the shaft housing space 46.

  FIG. 5D shows another configuration example of the male screw body 40. In the male screw body 40, a pair of energization paths 92 are formed in the screw portion 44 b in the shaft portion 44. Specifically, as shown in the partially enlarged view of FIG. 5D (A), along the bottom part (valley bottom) 211u of the thread groove between the adjacent strips 211, the electrical insulating layer 91 and the pair of energization paths 93a, 93b Is formed in a spiral shape. The pair of energization paths 93a and 93b are separated from each other with the electrical insulating layer 91 interposed therebetween.

  As shown to FIG. 5D (B), the axial front-end | tip side in a pair of electricity supply path 93a, 93b is electrically connected. Accordingly, the pair of energization paths 93a and 93b constitute one energization path 92 that reciprocates in a spiral. Accordingly, the one end 92a and the other end 92b of the energization path 92 can be concentrated on the head 42 side. As a result, these both ends 92 a and 92 b can be extended to the internal space 49 via the through holes 49 a formed in the head portion 42 or the shaft portion 44. Of course, both ends 92 a and 92 b may be integrated on the tip side of the shaft portion 44. Each of the pair of energization paths 93a and 93b is configured by arranging a plurality of low resistance partial energization sections (conductive pieces) 95Q on the surface of the base path 95P.

  FIG. 5E (A) shows another configuration example of the male screw body 40. In the male screw body 40, an energization path 92 is formed along the longitudinal direction in the screw portion 44 b in the shaft portion 44. Specifically, as shown in the enlarged cross-sectional view of FIG. 5E (B), a groove (concave portion) 90A extending in the longitudinal direction is formed in the threaded portion 44b. An energization path 92 is formed directly on the electrical insulating layer serving as the formation. Accordingly, the energizing path 92 extends so as to get over the thread of the threaded portion 44b, but since it is formed in the groove (recessed portion) 90A, it is possible to avoid interference even if screwed with the female screw.

<Presentation of methods for forming electrical insulation layers and current paths>
There are various methods for forming the electrical insulating layer 91 and the current path 92. However, the method is largely a film formation method (of course, a conductive layer is formed after masking and coating other than the current path, and the masking is removed. It is also possible to form a current path, or conversely, to form an insulating layer on the current path to form an electrical insulating layer on the current path is called pattern formation.) is there. Typical examples of the film forming method include a vapor phase film forming method and a liquid phase film forming method. Typical pattern forming methods include printing methods (for example, screen printing, transfer, ink spraying), writing with a pen or the like, and foil stamping.

  Vapor deposition methods include vacuum deposition (for example, resistance heating type vacuum deposition, electron beam deposition / cluster beam deposition, flash deposition), ion plating (for example, high frequency excitation ion plating, activation reactive deposition), sputtering ( For example, direct current (DC) sputtering, radio frequency (RF) sputtering, flat plate magnetron sputtering, dual ion beam sputtering), molecular beam epitaxy (MBE), pulsed laser deposition and other PVD methods (physical vapor deposition), thermal CVD, plasma CVD There are CVD methods (chemical vapor deposition) such as (PECVD), metal organic chemical vapor deposition (MOCVD), chloride CVD, photo (chemical reaction) CVD, laser CVD, atomic layer deposition (ALE).

  Liquid phase film forming methods include plating, coating, sol-gel method, spin coating method and the like.

  In addition, since these film-forming methods may not be able to form a pattern, it is also possible to pattern with a resist, for example. For example, if patterning is performed using a photoresist (photolithography), screen printing, or the like, a high-precision and high-density pattern can be formed. The resist may be appropriately selected depending on the type of film forming method, and examples thereof include an etching resist, a solder resist, and a plating resist. When removing the resist, for example, an electrolysis method or the like is used.

  Although not particularly shown here, the outer surface of the energization path 92 can be further covered with a cover layer. This cover layer may be formed by the same method as the electrical insulating layer.

  FIG. 6A shows the configuration of the substrate 54. The substrate 54 is a so-called RFID, and is composed of an analog circuit and / or an IC chip, etc., and a high-speed memory RAM for reading and writing temporary data, and a CPU serving as a central processing unit for controlling all processes A read-only memory ROM used for storing programs, a writable memory EPROM for storing data, an interface for controlling communication between the board and the outside, wireless communication with the outside, and external radio waves The antenna can be configured to have a resistance value detection unit and an antenna that supplies electric power by using the antenna. In the present embodiment, the substrate 54 is also provided with an acceleration sensor.

  The resistance value detection unit is connected to the wiring 97 and detects the resistance value of the energization path 92 by measuring the voltage value and / or the current value. At the same time, the resistance value detection unit may be digital information (of course, analog signal processing). .) To provide to the CPU. As a result, the resistance value data is stored in the EPROM.

  The acceleration sensor detects vibration, displacement, and / or deformation of the substrate 54 and calculates displacement amount data of the male screw body 40. Thereby, the movement which the structure of the building 10 bends, shakes, or deform | transforms can be grasped | ascertained. The displacement amount data is stored in the EPROM. Of course, when the energization path is used as a strain gauge, it is also possible to generate acceleration and velocity data by associating information obtained from the energization path as the strain gauge with time information or the like. As the acceleration sensor, various methods such as a semiconductor method such as a capacitance type, a piezoresistive type, and a gas temperature distribution type can be adopted in addition to the generally known vibration method and optical method.

  The resistance value data and the displacement data stored in the EPROM are transmitted to the outside (the information collecting apparatus 100) via the antenna at any time when the administrator collects information, at regular timing, or at irregular timing. . Of course, transmission of various types of acquired data is not limited to a wired method or a wireless method, and may be an analog signal method or a digital signal method.

  Information (individual identification information) for identifying the individual male screw body 40 is stored in the ROM or EPROM, and the location of the building 10 is associated with the individual identification information on the information collecting apparatus 100 side. Register (address), name, installation location on the structure, etc. Thereby, each male screw body 40 can be managed individually. In the present embodiment, a part of the substrate 54 employs a so-called RFID technology using an IC chip, but the present invention is not limited to this, and other technologies may be used.

  <Bridge circuit configuration>

  Connection of the current path 92 is not essential, but a bridge circuit can be used as shown in FIGS. 6B and 6C. The wiring or resistance R of this bridge circuit may be configured in the middle of the wiring 97 and / or in the substrate 54, and the amount of distortion is calculated from the amount of change in the output voltage, where E is the input voltage and e is the output voltage. Can do. Of course, the bridge circuit itself may be directly patterned (patterned) on the member with sensor structure to be measured.

  FIG. 6B (A) is a one-gauge bridge circuit in the case of using one energization path 92. FIG. 6B (B) is a bridge circuit of a two-line one-gauge method in the case where two current paths 92 are arranged in series and used as one gauge. These two energization paths 92 are disposed in the same direction on the front and back of the member, for example, and are used when measuring the tensile / compressed component while removing the bending component. FIG. 6B (C) is a four-gauge bridge circuit in which two current paths 92 arranged in series are set and two sets are arranged in parallel. For example, the four energization paths 92 can be used in the case of detecting tensile / compressed components by arranging them along the axial direction at four locations that are equally spaced in the circumferential direction of the columnar members. FIG. 6B (D) is a two-gauge bridge circuit in the case of using two energization paths 92. In the two-gauge method, the measurement directions (stretching directions) of the two current paths 92 are made different, and the two-gauge two-active method for measuring each stress and the measurement directions (stretching directions) of the two current paths 92 are combined. The two-gauge, one-active-one-dummy method using one as a dummy can be used.

  FIG. 6C (A) shows a two-sided two-gauge bridge circuit in which two energization paths 92 are connected to the opposite sides of the bridge. For example, by arranging the two energization paths 92 on the front and back of the member in the same direction, it can be used when measuring the tensile / compressed component while removing the bending component. FIG. 6C (B) is a four-gauge bridge circuit in which four current paths 92 are connected to each side of the bridge. Two of the four current paths 92 are arranged along the circumferential direction of the cylindrical member, and the other two are arranged in the axial direction, so that it can be used for measuring an axial force. This four-gauge method can also be used when measuring torque or bending.

  In addition, although the Wheatstone bridge circuit was illustrated here, as other bridge circuits, a Wien bridge oscillation circuit, a Maxwell bridge AC circuit, a snake side bridge AC circuit, a Sobel network bridge high frequency circuit, a Schering bridge circuit, a Carrefosta bridge AC circuit, An Anderson bridge circuit or the like may be used, but a Wheatstone bridge circuit may be selected for use as a direct current.

  FIG. 7A shows a hardware configuration of the information collection device 100. This information collection device 100 is a so-called server, a CPU that serves as a central processing unit, a high-speed memory RAM for reading and writing temporary data, a read-only memory ROM used for storing a motherboard program, data A hard disk HDD writable to store the data, an interface for performing external communication control, and an antenna for wireless communication with the male screw body 40. Note that this antenna is not limited to the case where the antenna is arranged in the server constituting the hardware of the information collecting apparatus 100, and may be an antenna or a relay antenna arranged in the vicinity of the male screw body 40 of each building 10. good.

  FIG. 7B shows a program configuration of the information collecting apparatus 100. The information collecting apparatus 100 includes an information organizing unit, an information analyzing unit, an alarm display unit, and a maintenance history holding unit. The information organizing unit is associated with the individual identification information of the male screw body 40 described above, the name of the building 10, the location (address), the installation location of the structure, the installation direction, the size of the sensor-structured member 30, the manager In addition to (contact address), etc., resistance value data and displacement amount data collected from each male screw body 40 are accumulated in time series.

  The information analysis unit analyzes the collected resistance value data and displacement amount data, and performs abnormality determination. For example, whether or not an abnormal numerical value appears with the passage of time, or whether the overall mechanical balance of the building 10 is lost based on data collected from the plurality of members 30 with sensor structure, etc. Can be analyzed and determined. The alarm display unit performs a process of outputting a maintenance alarm and an alert to the operator (notifying by screen, characters, light emission, sound, etc.) when the information analysis unit determines that the analysis result includes abnormal data. You may comprise. The maintenance history holding unit may store the maintenance history of the building 10.

  In particular, the information analysis unit of the present embodiment can grasp the failure of some of the current paths 92 by, for example, periodically measuring the output values of the plurality of current paths 92 included in the single male screw body 40.

  According to the above, distortion and / or displacement (various information and data that can be converted from strain information) generated in the sensor structure-provided member 30 by disposing a plurality of sensor structure-provided members 30 in the structure of the building 10. ) Can be detected. The detection result is collected by being connected by wire and / or wireless by the information collecting apparatus 100, and can be used as objective data. In addition, for example, data recovery can be automated, and at the same time, observation and collection can be performed substantially in real time, so that the deformation amount and strain of the building 10 and changes in internal stress when an earthquake or the like occurs can be grasped. Based on this situation, it becomes possible to determine the priority of maintenance and important points. Unlike the information acquired from various sensors such as acceleration sensors and vibrometers, the strain data and stress data associated with the electrical resistance value of the current path contain the acceleration displacement and vibration of the measurement object. Even in a still state after the measurement, it is possible to more accurately grasp the current state of the measurement object from the current strain value information (including residual strain) and strain history information.

  In particular, in the member 30 with a sensor structure of the present embodiment, the energization path 92 is directly formed by printing or the like, so that peeling or the like hardly occurs and the internal stress can be grasped stably over a long period (for example, several decades). . Furthermore, since a plurality of energization paths 92 are formed for one sensor structure member 30, for example, the output of a plurality of energization paths 92 (details will be described later) arranged in the same direction cannot be obtained. In this case, it can be determined that a failure has occurred due to damage or breakage of the corresponding portion of the member 30 with sensor structure, disconnection of one energization path 92, or partial damage. As a result, it is easy to identify the location to be confirmed, and further clarification of items to be confirmed and examination of advance measures can be performed, so that quick maintenance can be performed. In addition, since distortion can be detected using the other energizing path 92 even while one energizing path 92 is in failure, measurement can be stably continued over a long period of time by this multiplexed structure.

  Further, since the electrical insulating layer 91 is also directly formed on the surface of the member by printing, sputtering, or the like, it is difficult for peeling or dropping to occur over a long period (for example, several decades). As a result, the internal stress can be stably grasped by the energization path 92 formed directly on the outer surface of the electrical insulating layer 91.

  Furthermore, since the member 30 with a sensor structure of the present embodiment has the first energization path 93 and the second energization path 94, it is possible to simultaneously measure multi-directional strain or stress. Therefore, it becomes possible to grasp in detail the external force, stress, stress distribution and the like acting on the structure 10 and to analyze it.

  In the present embodiment, the male screw body 40 is employed as the sensor structure-providing member 30, but there are various fastening methods. For the purpose of the measurement system 1, it is preferable that the male screw body 40 has a structure that does not loosen.

  To illustrate this structure, for example, in FIG. 8A, by forming two types of male screw spiral grooves in the screw portion 40b of the male screw body 40, the first female screw body 70A screwed into one spiral groove, and the other By incorporating the mechanism for preventing the relative rotation of the second female screw body 70B that is screwed into the spiral groove and at the same time, the sensor-structured member 30 that does not loosen completely can be constructed. The energization path 92 may be formed in the cylindrical portion 44a of the male screw body 40.

  As shown in FIG. 8B (A) or FIG. 8B (C), the threaded portion 40b of the male threaded body 40 has a strip 211 having a substantially rhombus-shaped outer shape in a state of being developed on a plane with a phase difference equivalent to 180 °. They are formed alternately in the axial direction. Moreover, you may laminate | stack the electrical conduction path from which directions differ through an insulating layer.

  As shown in FIG. 8B (B), the strip 211 forming a substantially rhombic strip alternates between the strip 211a forming one axial row and the other strip 211b forming an axial row with a phase difference equivalent to 180 °. Prepare for. As shown in FIG. 8B (B), the strip 211 is formed by forming a ridge portion so that the center is the highest along the circumferential direction and both ends in the circumferential direction are lowered. Accordingly, the strip 211 of the threaded portion 40b is a substantially crescent-shaped thread and / or valley extending in the circumferential direction in the surface direction perpendicular to the axis (screw shaft), and is on one side (left side in the figure) and the other side. (Alternatively on the right side of the figure). This circumferential structure has a structure in which a first spiral groove indicated by an arrow A and a second spiral groove indicated by an arrow B whose lead direction is opposite to the first spiral groove are overlapped. As a result, the screw portion 40b can be screwed to both the first female screw body 70A serving as a right-hand thread and the second female screw body 70B serving as a left-hand thread.

  Thus, when the structure of the threaded portion 40b of the male threaded body 40 shown in FIG. 8B is adopted, as shown in FIG. 8C (A), a current path 92 is formed in the groove of one spiral groove and the other spiral groove. You may do it. If it does in this way, along one spiral groove, energization way 92 will advance to one side of an axial direction (refer arrow A), and energization way 92 will advance to the other of the direction of an axis along the other spiral groove (refer to arrow B). Therefore, it is possible to reciprocate in the axial direction by one continuous energization path 92. As a result, both ends of the energization path 92 can be concentrated on the head side or the shaft end side.

  Furthermore, as shown in FIG. 8C (B), the energization path 92 can be formed in a zigzag shape at the boundary between the one strip 211a and the other strip 211b. In this case, the zigzag-shaped energization path A located at the front boundary in FIG. 8C (B) and the zigzag energization path B located at the back-side boundary in FIG. May be.

  Furthermore, as shown in FIG. 8C (C), it is also possible to form an energization path 92 that progresses in a zigzag manner around the approximately rhombus shape of one strip 211a arranged in the axial direction. In this way, one zigzag energization path 92 can advance one in the axial direction (see arrow A), and the other zigzag energization path 92 can proceed to the other in the axial direction (see arrow B). It is possible to reciprocate in the axial direction by one continuous energization path 92. The energizing path 92 has a structure in which an 8-shaped energizing path 92 is continuous in the axial direction.

  Further, for example, as shown in FIG. 9, a method of preventing loosening using a washer 150 can be employed. For example, the screw body side seat portion 122 is formed in a portion corresponding to the lower part or root of the head portion 42 of the male screw body 40, and the first receiving portion 160 is formed on one side (the upper surface side in FIG. 9) of the washer 150. 1st engagement mechanism A is comprised between these. The first engagement mechanism A is a ratchet mechanism or the like, and engages with each other when the male screw body 40 is rotated in the loosening direction, and the first receiving portion 160 and the screw body side seat portion 122 with respect to the rotation direction Prevent relative rotation of the.

  Further, a second receiving portion 170 is formed on the other side (the lower surface side in FIG. 9) of the washer 150. The second receiving portion 170 faces the structures (posts or beams) 12 and 14 of the building 10. A member-side seat portion 182 that faces the second receiving portion 170 of the washer 150 is formed as a hole in the structures 12 and 14. A second engagement mechanism B is configured between the member side seat portion 182 and the second receiving portion 170 of the washer 150. Specifically, the outer shapes of the member side seat portion 182 and the second receiving portion 17 are non-circular with respect to the axis, and the second engagement mechanism B is at least in a direction in which the washer 150 is loosened. When the rotation is attempted, the second receiving portion 170 and the member side seat portion 182 are engaged with each other to prevent relative rotation between the second receiving portion 170 and the member side seat portion 182 with respect to the rotation direction. When the male screw body 40 tries to rotate in the loosening direction by the action of the first engagement mechanism A and the second engagement mechanism B, the relative rotation between the male screw body 40 and the structures 12 and 14 is restricted by the interposition of the washer 150. Is done.

  At this time, the energization path 92 may be formed in the cylindrical portion of the male screw body 40, the energization path 92 may be formed in the second receiving portion 170 of the washer 150, and the energization path 92 is formed on the outer peripheral surface of the washer 150. May be formed.

  Further, as shown in FIG. 10, it is possible to prevent loosening by using the female screw body 70 and the washer 50. A male screw side cooperation region 80 having a non-circular cross section when viewed from the axial direction is formed in the shaft portion 44 of the male screw body 40. The male screw side cooperation region 80 can also serve as the plane 60 already described.

  The first engagement mechanism A is configured on the surface where the washer 50 and the female screw body 70 face each other. The first engagement mechanism A is, for example, a ratchet mechanism. When at least the female screw body 70 tries to rotate in a loosening direction with respect to the male screw body 40 to be screwed, the first engagement mechanism A is engaged with each other, and the rotation direction The relative rotation of the male screw body 40 and the washer 50 is prevented. The other side of the washer 50 faces the members with sensor structure 12 and 14.

  The through-hole 82 of the male screw body in the washer 50 has a non-circular shape when viewed from the axial direction. Accordingly, the through hole 82 engages with the male screw side cooperation region 80 of the male screw body 40 in the circumferential direction (this is defined as the auxiliary engagement mechanism B).

  As described above, the first engagement mechanism A and the auxiliary engagement mechanism B can provide a structure in which the female screw body 70 cannot be loosened.

  At this time, the energization path 92 may be formed in the shaft portion 44 of the male screw body 40, the energization path 92 may be formed in the outer peripheral surface of the female screw body 70, or in the groove of the female screw portion, and on the seat surface of the washer 150. An energization path 92 may be formed.

  Moreover, in the said embodiment, although the case where the electricity path 92 was formed in the external thread body 40 used as a member was illustrated, this invention is not limited to this. For example, the energization path 92 can be formed in the plate material 300 such as metal or reinforced resin shown in FIG. The plate member 300 is formed with engagement portions 302 for joining to the mating member by bolts, rivets, welding, or the like at least at two places. Accordingly, the plate member 300 is stretched, contracted, twisted, etc. in conjunction with the deformation of the mating member. In this plate material 300, a plurality (four in this case) of first energization paths 93 reciprocating in the first direction X are arranged in a matrix. Specifically, they are arranged in a lattice shape composed of a plurality separated in the first direction X and a plurality of places separated in the second direction Y perpendicular to the first direction X. As described above, when the first current paths 93 are arranged in a matrix, a twist (see arrow P) about the first direction X of the plate material 300 is also detected from the difference between the outputs of the first current paths 93. It becomes possible. Further, regarding the stress in the first direction X, even if a part of the first energization path 93 fails, it can be detected by another first energization path 93.

  For example, like the plate material 300 shown in FIG. 11B, a plurality of (here, two) first current paths 93 that reciprocate in the first direction X and second current paths 94 that reciprocate in the second direction Y. A plurality (two in this case) may be arranged in a matrix. A pair of first energization paths 93 are arranged at locations separated in the second direction Y. A pair of the second energization paths 94 is disposed at a location away from the first energization path 93 in the first direction X and at locations away from each other in the second direction Y. In the plate material 300, a pair of engagement holes 302 are formed at locations separated in the second direction Y in the vicinity of both ends. In this way, in addition to expansion / contraction in the first direction X, expansion / contraction in the second direction Y can be detected. Note that a bending moment around the third direction Z (see arrow Q) that is perpendicular to both the first direction X and the second direction Y can also be detected.

  Further, for example, like the plate member 300 shown in FIG. 11C, a plurality of (here, two) first energization paths 93 reciprocating in the first direction X and a second energization path 94 reciprocating in the second direction Y. A plurality (two in this case) may be arranged in a matrix in a staggered manner. Specifically, a pair of first energization paths 93 are arranged at locations separated in the first direction X and the second direction Y. A pair of second energization paths 94 are also arranged at locations separated in the first direction X and the second direction Y. If it does in this way, expansion and contraction in the first direction X, expansion and contraction in the second direction Y, twist about the first direction X (see arrow P), twist about the second direction Y (not shown), first Various stresses can be detected, such as a bending moment around the third direction Z (see arrow Q) perpendicular to both the direction X and the second direction Y.

  These members with sensor structure (plate material 300) can be used as a connection plate when fastened to a steel material or the like with a bolt as shown in FIG. 12, for example. Therefore, by arranging the plurality of plate members 300 along various directions, it is possible to realize more various stress measurements.

  In addition, the member with a sensor structure of the present invention is not limited to the member shown in the above embodiment. Hereinafter, members to which the present invention can be applied will be presented from various viewpoints. Needless to say, the present invention is not limited to the members presented here but can be applied to other members.

<Member presentation from the viewpoint of materials>
The material of the member includes metal and nonmetal. Metals include pure substances such as aluminum, copper, silver, gold, iron, nickel, tungsten, titanium, zinc, and mixtures and compounds containing such components, such as alloys such as brass, stainless steel, and magnesium alloys including. Non-metal includes non-metals such as wood, plastic, paper, flame-treated wood, plywood, glass, ceramic, ceramics, porcelain, rubber, natural resin, synthetic resin, concrete, asphalt, etc. Includes composite materials.

  Iron-based metals include steel (carbon content <0.02%), cast iron (carbon content> 2.14%), and the like. Steel includes ordinary steel such as general structural rolled steel (SS), welded structural rolled steel (SM), cold rolled steel (SPCC), special steel such as machine structural alloy steel, tool steel, and special purpose steel. Including steel. Alloy steel for machine structure carbon steel includes alloy steel such as chromium steel (SCr), nickel chromium steel (SNC), etc. Tool steel is carbon tool steel (SK), alloy tool steel (SKD), high speed tool steel ( Special purpose steels include low alloy spring steel (SUP), bearing steel (SUJ), free cutting steel (SUM), high alloy stainless steel (SUS), heat resistant steel (SUH), and high manganese. Including steel. Cast iron includes gray cast iron (FC) and spheroidal graphite cast iron (FCD).

  Non-ferrous metals include light metals such as aluminum, magnesium, sodium, potassium, calcium and lithium titanium, base metals such as copper, tin, zinc and lead, nickel, chromium, manganese, molybdenum, tungsten, bismuth, cadmium and cobalt Rare metals such as cerium, neodymium, and praseodymium, precious metals such as gold, silver, and platinum, and radioactive metals such as uranium and plutonium, and alloys containing them.

  Trees include camellia, tablin, camphor, fir, spruce and other evergreen trees, maple, cherry, larch, beech, mizunara and other deciduous trees, as well as plywood, laminated wood, resin composites, resin reinforcement and difficulties This includes specially-designed wood that has been treated with fire.

  Plastics (synthetic resins) include phenolic resin (PF), epoxy resin (EP), melamine resin (MF), urea resin (urea resin, UF), unsaturated polyester resin (UP), alkyd resin, polyurethane (PUR) , Thermosetting resins such as thermosetting polyimide (PI), polyethylene (PE), high density polyethylene (HDPE), medium density polyethylene (MDPE), low density polyethylene (LDPE), polypropylene (PP), polyvinyl chloride ( PVC), polyvinylidene chloride, polystyrene (PS), polyvinyl acetate (PVAc), polyurethane (PUR), Teflon (registered trademark) (polytetrafluoroethylene, PTFE), ABS resin (acrylonitrile butadiene styrene resin), AS resin, Thermoplastic resins such as acrylic resin (PMMA) (general-purpose plastic), various nylons such as polyamide (PA), polyacetal (POM), polycarbonate (PC), modified polyphe Thermoplastic resins such as lenether (m-PPE, modified PPE, PPO), polyethylene terephthalate (PET), glass fiber reinforced polyethylene terephthalate (GF-PET), polybutylene terephthalate (PBT) -containing polyester, cyclic polyolefin (COP) (Engineering plastics), Polyphenylene sulfide (PPS), Polysulfone (PSF), Polyethersulfone (PES) (Polyethersulfone), Amorphous polyarylate (PAR), Liquid crystal polymer (LCP), Polyetheretherketone (PEEK) Including thermoplastic polyimide (PI), polyamide imide (PAI) (Polyamide-imide) and other thermoplastic resins (super engineering plastics), and polymer alloys that are a mixture of these, glass fiber, carbon fiber , Reinforcing materials such as silicon fiber, aramid fiber and metal fiber Comprising comprising a so-called FRP and various reinforcing materials.

  Paper includes Asa, Casinoki, Ganpi, Kozo, Mayumi, Mitsumata, bamboo, straw (rice straw, straw), flax, cotton, sugarcane, Manila asa, kenaf, banana, oil palm, and other non-wood plant paper materials And those made of hardwood, softwood, wood chips, waste paper, recycled paper, and other wood paper materials, including special papers that have been reinforced with resin and flame retardant.

  Flame retardant materials include flame retardant treated wood, flame retardant plywood, flame retardant fiber boards, and flame retardant plastic boards. Plywood includes structural plywood, concrete formwork plywood (companies), ordinary plywood, flame retardant plywood, decorative plywood, and curved plywood.

  Glass is soda-lime glass, potash glass, crystal glass, quartz glass, polarizing glass, multilayer glass (eco glass), tempered glass, laminated glass, heat-resistant glass / borosilicate glass, bulletproof glass, glass fiber, titanium oxide layer on the surface So-called photocatalyst cleaning glass, water glass, uranium glass, acrylic glass, dichroic, goldstone, tea metal stone, sand gold stone, purple gold stone, glass ceramics , Low melting glass, metallic glass, saphiret, phase separation glass, porous glass, liquid glass or liquid glass, hybrid glass, organic glass, lead glass.

  Ceramics include oxide-based, hydroxide-based, carbide-based, carbonate-based, nitride-based, halide-based and phosphate-based elemental ceramics, barium titanate, high-temperature superconducting ceramics, boron nitride, ferrite Fine ceramics such as lead zirconate titanate, aluminum oxide, silicon carbide, silicon nitride, steatite, zinc oxide and zirconia.

  Ceramics include earthenware, earthenware (for example, half porcelain, baking), ceramics, and porcelain.

  Synthetic rubbers include butadiene rubber (BR), styrene-butadiene rubber (SBR), chloroprene rubber (CR), nitrile rubber (NBR), polyisobutylene (butyl rubber IIR) and other R groups (excluding natural rubber), ethylene propylene rubber (EPM, EPDM), chlorosulfonated polyethylene (CSM), acrylic rubber (ACM), M group such as fluoro rubber (FKM), O group such as epichlorohydrin rubber (CO, ECO), U such as urethane rubber (U) Including group, Q group such as silicone rubber (Q).

  Concrete includes ordinary concrete, high-strength concrete, early-strength concrete, shielding concrete, lightweight concrete, greening concrete, watertight concrete, reinforced concrete, and the like. Reinforced concrete is represented by reinforced concrete, bamboo reinforced concrete, concrete filled steel pipe structure (CFT), steel fiber reinforced concrete (SFRC), glass fiber reinforced concrete (GFRC, GRC), carbon fiber reinforced concrete (CFRC), and roman concrete. Including so-called ancient concrete.

  Asphalt includes straight asphalt, blown asphalt, waterproof construction asphalt, paving modified asphalt, and the like.

<Member presentation from the viewpoint of use>
Applications of the members include vehicles such as vehicles (moving means), buildings (buildings), home appliances, agricultural machines, construction machines (including general construction machines and special construction machines), and machine tools.

  Vehicles or moving bodies include multi-wheel vehicles and unwheeled vehicles for land use, including manned movements or unmanned movements. Trucks, buses, fire trucks, ladder trucks, pump trucks, trailers, tank trucks, mixer trucks, crane trucks, road sweepers, vacuum cars, tow trucks, snow plows, trains, monorails, bullet trains , Including trams, locomotives, cable cars, armored vehicles, tanks, etc., four-wheel vehicles include automobiles, police cars, ambulances, campers, etc., three-wheel vehicles include tricycles, automatic tricycles, two-wheel vehicles, Motorcycles, scooters, bicycles, electrically assisted bicycles, wheelchairs, strollers, rickshaws, etc. are included, and unicycles include unicycles. Non-wheeled vehicles include linear motor cars, hovercraft, elevators, escalators, lifts, gondola, ropeways, ferris wheels, merry-go-rounds, swings, seesaws and the like. Other wheeled vehicles include wheel loaders, tire rollers, road rollers, graders, asphalt finishers, motor sweepers, dump trucks, wheel cranes, forklifts, straddle carriers, turret type on-site vehicles, agricultural tractors , Agricultural chemical spreader, mowing threshing vehicle, rice transplanter, combine, excavator, backhoe, loading excavator, snowmobile, roller skates, roller shoes, skateboard, kickboard, ski, snowboard, skate shoes, etc. The air vehicle or the moving body includes a light aircraft such as a balloon and an airship, regardless of manned flight or unmanned flight, and a heavy aircraft such as an airplane, a rotary wing airplane, a glider, a helicopter, a drone, a rocket, and a vertical take-off and landing aircraft. Marine vehicles include ship boats, yachts, ship passenger ships, passenger ships, cargo passenger ships, cargo ships, tankers, fishing boats, warships, submarines and the like. The parts used in the vehicle include monocoque, body shell, bonnet, door, tailgate, front fender, radiator grill, bumper, meter, heater, windshield glass, door windglass, engine, radiator, muffler, and brake pedal. Accelerator pedal, clutch pedal, seat, exhaust pipe, tail lamp, head lamp, wheel, tire, track, propeller, tank, cylinder, piston, actuator, damper, linear guide, bearing, chassis, shaft, etc.

  Buildings include buildings and civil engineering structures (workpieces). Buildings include residential, commercial, public, cultural, educational, medical, entertainment, transportation, industrial, religious, military, and plant facilities. Buildings are also detached houses, multi-storey houses (terrace houses), apartment houses, apartment houses, share houses, office buildings, churches, monasteries, temples, shrines, castles, palaces, palaces, gardens, parks, hospitals, clinics , Station, station building, airport, government office housing, government office building, police station, fire department, police box, stadium, stadium, playground, pool, school, gymnasium, theater, movie theater, theater, theater, viewing hall, public hall, gathering Venue, hotel, inn, factory, warehouse, logistics warehouse, logistics center, boarding house, dormitory, child welfare facility, midwifery, rehabilitation facility for the physically handicapped, rehabilitation facility for the mentally disabled, protection facility, women's protection facility, intellectual Support facilities for the disabled, welfare facilities for the elderly, nursing homes for the elderly, nursing homes for the elderly, day service centers, maternal and child health facilities, cinemas, museums, museums, libraries, public toilets, sports practice areas, bowling alleys Ski resort, department store, supermarket, general store, exhibition hall, cabaret, cafe, night club, bar, dance hall, playground, public bath, waiting room, restaurant, restaurant, store, car garage, auto repair factory, movie studio Including TV studios.

  Civil engineering structures (structures) include bridges, metal structures, railways, roads, ports, coasts, rivers, power generation facilities and power generation facilities, dams, tunnels, land improvement structures, disaster prevention structures, and agricultural civil engineering structures. Bridges include girder bridges, cable-stayed bridges, truss bridges, arch bridges, ramen bridges, suspension bridges, and metal structures are tower-like structures, storage structures, sluice / Xiamen, hydraulic iron pipes, composite structures, waterworks , Including various types of pipelines, including those for delivery such as sewerage, gas and oil, and railways are tracks, track structures, roadbeds, railway stops, signal / security / communication equipment, high-speed railways, special railways, cableways, cities Including railways, roads include roadbeds / basements, pavements, asphalt pavements, concrete pavements, gravel roads, dustproof roads, etc., and ports are anchorage, breakwater, revetment, jetty, wharf, wharf, pier, upper Including coastal buildings, coastal structures, rivers including levee / revetment, sabo, river structures, canals, power generation facilities and equipment Equipment, reservoir, regulating pond, nuclear power plant, thermal power plant Hydropower plants, tidal power generation, geothermal power generation, wave power generation, wind power generation, dams include gravity dams, fill type dams, arch dams, tunnels include tunnel structures, land improvement structures include land creation, Includes reclamation, dredging, irrigation, drainage, reclamation, and land.

  In addition, the materials used in the building are natural stone, artificial stone, stones including crushed stone, wood, precut material, solid wood, mechanical grade lumber, visual grade lumber, gradeless lumber, class A structural material, class B structural material, Glulam, engineering wood, structural glulam, plywood, wood products, resin products, metal products, steel materials, steel plates, steel frames, organic materials, paint materials, waterproof materials, cement paste, sludge, mortar, concrete, tiles, Porcelain tiles, stoneware tiles, earthenware tiles, tatami mats, lightweight cellular concrete, panel, water resistant plywood, gypsum board, fireproof board, calcium silicate board, insulation, glass wool, rock wool, rigid urethane foam, styrofoam, phenol foam, Polystyrene foam, cellulose fiber, prestressed concrete, precast concrete , Including underwater concrete, polymer concrete, resin concrete, mass concrete, expanded concrete, low shrinkage concrete, the non-shrinkage concrete.

  The parts of the building are structural materials, fastening members, finishing materials, base materials, interior materials, exterior materials, face materials, heat insulating materials, foundations, foundations, walls, pillars (through pillars, pipe pillars, corner pillars, side pillars, Large black pillars), beams (shed beams, fire beams, log beams, climbing beams), roofs, ceilings, floors, stairs, bundles, shed bundles, windows, window glass, window frames, doors, door frames, doors, shelves, baseboards , Wall (uphill), decorative pillars, between floors, floor tiles, floorboards, floor pillars, bamma, duck, attached duck, torso, fire beam, bracing, through, studs, bundles, eaves, eaves ceiling, field edge, eaves , Flooring, carpet, cushion floor, cloth, wallpaper, shoji, shoji paper, siding, expansion joint, tile, cement tile, slate tile, colonial, corrugated sheet steel, handrail.

  The structure realized by each member of the building is masonry, brick, wooden, woody, earthen, steel (S), light steel (LGS), heavy steel, unreinforced concrete, reinforced concrete ( RC structure), steel reinforced concrete structure (SRC structure), concrete-filled steel pipe structure, concrete block structure (CB structure), reinforced concrete block structure, steel / concrete composite structure, prestressed concrete structure (PC), membrane structure, wall structure, frame Structure, masonry structure, air film structure (single film), air film structure (double film), air film structure (air beam), pure ramen structure, walled ramen, braided ramen, brace structure, core structure, Tube structure, truss structure, vault structure, shell structure, cable (hanging) structure, pin structure, space frame, arch, dome shell, earthquake resistant structure, seismic isolation structure Including damping structures, rigid structures, flexible structures, and seismic structures.

  Construction methods include a masonry type, a shaft type, a panel type, a wooden panel construction method, a suspension type, a frame construction method, a log construction method, a heavy steel structure, a lightweight steel structure, a plane truss, and a three-dimensional truss.

  Building types include one-story, low-rise, middle-rise, high-rise, super-high rise, towers, and the like.

  Home appliances include video equipment (display devices) such as TVs and projectors, video tape recorders, DVD recorders, Blue-ray Disc recorders, HDD recorders, DVD players, Blue-ray Disc players and other video equipment (recording and playback devices), video Audio equipment such as cameras, digital cameras, etc. (wireless recorders, tape recorders, mini-disc recorders, radio cassette recorders, IC recorders, etc.), analog players, CD players, amplifiers, radios, etc. Includes equipment (playback devices), audio equipment (reproduction devices) such as speakers and headphones, white goods, information appliances, and the like.

  Electric appliances including so-called white goods are washing machines, vacuum cleaners, irons, sewing machines, futon dryers, hair dryers, clothes dryers, hanger steamers, trouser presses, shoe dryers, towel heaters, sewing irons, Microwave oven, microwave oven, rice cooker, mixer / food processor, gas table, stove, toaster, IH cooker, hot plate / grill pan, home bakery / baking utensil, tabletop cooker, kettle, fried food, electric pressure cooker / electric Stewed pan, fish roaster, steam cooker, soup maker / soy milk maker, mochi mochi machine, dry food maker, refrigerator / freezer, kettle / pot, coffee maker, water purifier, dishwasher, dish dryer, carbonated water maker, water conditioner , Tea maker, garbage processing machine, capsule tea machine , Towel steamer / heater, heating appliance, air purifier, air conditioner, humidifier, dehumidifier, fan, ion generator, circulator, bathroom dryer, cool air fan, dryer, hair iron, electric hair clipper, electric shaver, Hot curlers, facial instruments, microscopes, electric toothbrushes, oral cleaners, stain cleaners, alcohol checkers, breath checkers, epilators, optical epilators, laser epilators, high frequency epilators, electric keratin removers, desk stands, entrance lighting , Ceiling lighting, interior stand, spotlight, slide lighting, ceiling fan, chandelier, facility / outdoor lighting, bathroom lighting, downlight, black light, bracket light, footlight, garden light, guide light, massage equipment, health Care / measurement, hot water cleaning stool Seat, electric / low frequency treatment device, hearing aid, electronic cigarette, inhaler, nasal irrigator, oxygen air charger, household UV treatment device, thermal treatment device, bulb / fluorescent light, LED bulb, straight tube fluorescent light, bulb shape Fluorescent lamp, incandescent lamp, round fluorescent lamp (FCL), LED fluorescent lamp, round slim fluorescent lamp (FHC), compact fluorescent lamp, halogen bulb, lighting tube (glow bulb), double ring fluorescent lamp (FHD) ), Miniature bulb, electronic lighting tube, HID lamp, light bulb cap-shaped slim fluorescent lamp (EFC), square slim fluorescent lamp (FHG), insulated bulb, telephone / fax, telephone, fax, composite fax, extension cordless handset, Includes LED bulbs with motion sensors and general bulb types (LED bulbs).

  Information home appliances include personal computers, displays, keyboards, mice, printers, 3D printers, tablets, USB memories, external HDDs, card readers, facsimiles, mobile phones, smartphones, mobile games, home game machines, educational toys.

  Agricultural machinery can be used for general purpose agricultural machinery such as tractors, plows, halos, rollers, rotary tillers, shaving machines, pressure reducers, leveling machines, ridgers, groovers, etc. Agricultural machinery to be used, rooting machine, subsoil crusher, groove digger, mold liner (dark pit drilling machine), drilling machine, agricultural machinery used for cultivating, creating and improving backhoes, manuscript spreader (compost spreader), slurry Agricultural machinery used for sowing and transplanting, such as spreaders, lime sowers (lime spreaders), planters (spotting machines), fertilizer and sowing machines, rice transplanters, vegetable transplanters, transplanters (transplanters), and sowing machines Sprayer, power sprayer, mist machine, duster, power duster, duster, power duster, smoke sprayer, air sprayer / helicopter (air control), soil disinfector, brush cutter, control machine, Agricultural machinery, binders, combines, vegetable harvesters, mowers, hay balers, etc. used for pest sprayers, freeze / frost damage control machines, plowing and weeding machines, thinners (thinning machines), power pumps, sprinklers (irrigation devices), etc. Roll baler, windrower, threshing machine, bean cutter (bean harvesting machine), corn harvesting machine, corn sheller, potato harvesting machine, beet harvesting machine, sweet potato mower, sugarcane vine harvesting machine, sugarcane harvesting machine, raccoon harvesting machine , Flax harvesting machine, onion digging machine, chestnut threshing machine, lazy threshing machine, plucking machine, strip mulberry harvesting machine, special crop digging machine, vibration harvesting machine, hop flowering machine, etc. Dryers, rice grinders, sorters, rice mills, pasture dryers, chicken manure dryers, special crop dryers, millers, disc mowers, mower conditioners Tedder, Rake, Forage Harvester, Hebera, Hepress, Road Wagon, Heeler, Bale Loader, Forage Cutter, Forage Blower, Silage Unloader, Forage Crusher, Feed Chopper, Root Cutter, Forage Blender, Forage Molding Agricultural machinery, automatic feeders, milking machines, milk coolers, water feeders, water heaters, urine spreaders, barn cleaners, solid-liquid separators, manure processing equipment, heat insulators, etc. Farm machinery used for the management of livestock such as egglifter, egg washing sorter, barn disinfection machine, juvenile joint rearing temperature control device, power mulberry machine, automatic rearing device for young children, automatic rearing device for souvenirs, Agricultural machinery used for growing, such as stripping machines, astringent machines, eyebrows, feather removal machines, etc., malcha, tillage cultivation equipment, house heating machine, sugar beet washing machine, deep fertilizer, power pruning machine, Agricultural machinery, steaming machine, roughing machine, ten-yen machine, medium-yielding machine for sugar beet fruit gardening (field cropping) such as tree tower, orchard rotary cutter, fruit selection machine, orchard transportation machine, management machine, Agricultural machinery, pruning machines, ramie skinning machines, weed sorting machines, tulip sorting machines, raccoon moulting machines, etc. Agricultural machinery used for forestry, etc., trailer, grain conveyor, front loader, etc.

  General construction machinery includes bulldozers, ripper dozers (bulldozers with ripper), scrape dozers, towed scrapers, bulldozer scrapers such as motor scrapers, hydraulic excavators (yumbo, backhoe, power shovel), drag lines, clam shells, mud drilling Excavators and loaders such as tractors, tractor excavators, wheel loaders, trenchers, bucket wheel excavators, trucks, dump trucks, trucks with crane equipment, trailers, locomotives, scrap steel cars, shuttle cars, rough terrain vehicles ( Specially equipped transport vehicles), excavator loaders, fork loaders, all-wheel drive vehicles, belt conveyors, bucket wheel excavators, etc., crawler cranes, truck cranes, wheel cranes (all terrain cranes, roughs) Lane crane), tower crane, jib crane, railway crane, floating crane, pipe layer, construction lift, elevator, portal crane, forklift, straddle carrier, container carrier, top lifter, clamp lift, aerial work vehicle (lift vehicle) , Concrete floor finishing robot, slinging robot, crane / loading machine such as unloader, pile driver, diesel hammer, hydraulic hammer, vibratory hammer, water jet (water jet cutter), earth auger, earth auger digger, monken, Hydraulic steel pipe press-fitting and drawing machine, sandpile punching machine, powder injection stirrer, all-casing excavator, drilling shaft, earth drill, reverse circulation drill, underground continuous wall construction machine, mud drainage treatment equipment (alkaline water) Japanese equipment, including sludge suction and discharge vehicle (vacuum car), grout pump, grout mixer (including mortar plant), pneumatic caisson construction equipment, deep-mixing processing machine, ground improvement machine for high-pressure jet stirring, chemical injection equipment, deep foundation Industrial machinery (rotary spraying machine, underwater cutting machine, etc.), foundation machine such as pile cutter, boring machine, down-the-hole hammer, drill rocker (hand hammer, leg hammer, drifter, pick hammer, baby hammer, riveting hammer, chipping) Hammer, caulking hammer, scaling hammer, sand hammer, concrete breaker, large breaker, etc.), drill jumbo, crawler drill, tunnel drilling machine / cutting machine, grab hopper, grablifter, tunnel construction equipment, shield construction equipment, etc. Machinery, motor graders, stabilizers, mixing plants, motor graders and roadbed machines such as ultra-soft ground mixers, road rollers (Macadam rollers, tandem rollers), tire rollers, tamping rollers, vibration rollers, tampers, rampers, Compaction machines such as vibration compactors, concrete plants, concrete mixers (agitator trucks), concrete pump cars, concrete pumps, concrete placers, screw cleats, agitator cars, concrete crushers and other concrete machines, asphalt plants, recycling plants, asphalt Finisher, asphalt kettle, distributor, chip spreader, asphalt cooker, concrete spreader, concrete finisher, concrete leveler Concrete vertical finishing machine), simple concrete finishing machine, concrete horizontal finishing machine, vibration joint cutting machine, concrete cutter, inner vibrator, asphalt engine sprayer, asphalt carver, joint sealer, placer sprayer, slip foam vapor, curing machine, etc. Machines, road heaters, joint cleaners, road cleaners, line markers, dissolution tanks, lane marking erasers, road surface cutters, road surface layer regenerators, guardrail cleaners, road surface safety groove cutters (grooving machines), water trucks, guardrails Road driving machines, lane marking construction machines, floor slab thickening machines, microsurface machines, drainage pavement function recovery machines and other road maintenance machines, air compressors (compressors), blowers (fans) and other air compressors・ Blower, small spiral pump, Type multi-stage centrifugal pump (turbine pump), submersible motor pump for deep well, vacuum pump, submersible motor pump for construction (submersible pump), submersible sand pump (submersible pump for construction with stirrer), pump for slurry pump, transformer (Transformer), high-pressure air switch, cubicle-type high-voltage power receiving / transforming equipment, electric generators such as generators, winches such as winches, hoists, chain blocks, truck scales, measuring instruments, core collectors (core boring machines), Testing CBR tester, flat plate loading tester, grout flow / pressure measuring device, gas detector, sound level meter, vibration measuring device, settlement / tilt measuring device, dust meter, turbidimeter, automatic surveying device, light wave measuring device, etc. Measuring equipment, erection girder, vent, portal crane, hoist, chain block, geared trolley, winch, jack, hydraulic pump, heavy Weighing trolley, delivery device, steel tower, carrier, saddle, backstay adjustment device, cable fixing device, turn buckle, rope hanger, unreeler, delivery device, horizontal capture device, descent device, traveler crane, girder suspension device, girder suspension gate moving device, Steel bridges and PC bridges such as turntables, mobile supports, terrain work vehicles, temporary equipment for construction, concrete mixers, aggregate measurers, concrete buckets, concrete vibrators, concrete crushers, jaw crushers, impact crushers, welding machines , Welding rod dryer, hydraulic jack, monken, rail, turntable, mortar concrete sprayer, concrete sprayer, quick setting agent supply device, seed sprayer, bentonite mixer, water tank, brush cutter, lawn mower, chainsaw, float, Construction signal, construction high pressure washing Aircraft, including chemical spraying machine, grass-collecting machine, jet heater, packer vehicles, self-propelled crushing machine, self-propelled soil improvement machine, and other land for general construction machine such as a self-propelled wood crusher.

  In addition, the present invention can also be applied to special construction machines, such as main work boats, auxiliary work boats, auxiliary equipment for work boats, auxiliary equipment for port construction, etc. Machinery, concrete production equipment, concrete transportation equipment, concrete cooling equipment, aggregate production equipment, cement transportation and storage equipment, water supply equipment, pollution control equipment, other dam construction machines such as dam construction machines, snow vehicles, snow removal equipment, snow removal Attachments, snow removal machines such as scatter trucks, sewerage construction machines such as propulsion construction machines, and landmine removal machines.

  Machine tools include lathes such as general-purpose or NC turret lathes, milling machines using milling cutters, end mills, etc., shaping machines using cutting tools, planing machines using cutting tools, drilling machines, drilling machines using reamers, taps, cutting tools, etc. Teeth such as boring machines using wire, EDM machines such as wire-cut electric discharge machines and sculpture electric discharge machines, broaching machines using broaches, bob machines, gear shapers (rack cutters, pinion cutters), etc. Grinding machines using cutting machines, grinding wheels, contour machines, band saw machines, machining centers, water jet processing machines, laser processing machines, electron beam processing machines, honing processing machines, electrolytic processing machines, deburring and chamfering machines, electrolytic deburring machines, Includes cutting machines, rolling machines, and forming devices such as nut formers and parts formers. Also included are various machining tools such as drills, end mills, tools, chips, taps, saw-tooth tools, dies, dies, and tool holders included in these machine tools.

  In addition, general structural materials include structural members for buildings, structural materials for buildings, exterior materials, interior materials, propellers for wind power generation, solar panels, cylinders, pistons, actuators, dampers, linear guides, bearings, engine blocks. , Chassis, shaft, rod, L-shaped metal fittings, curtains, roll curtains, handrails / lattices / sashes for verandas / balconies / bay windows, handrails for hallways, passages, stairs, bedsides, toilet walls, chairs, desks, bookcases, Includes cupboards, beds, bathtubs, toilet seats and toilet bowls.

  <Member presentation from the viewpoint of shape>

  The shape of the member is various. For example, the shape of the steel is steel plate, octagonal steel, hexagonal steel, flat steel, square steel, round steel, wire rod, unequal angle iron, straight steel sheet pile, U-shaped steel sheet pile, equilateral angle steel, channel steel, I-shape Includes steel, H-shaped steel, rails including rail and curtain rails, steel pipes, etc.

  In addition, as a shape not limited to steel materials, a propeller, a screw, a cross section H shape, an overall shape, a cross sectional shape, an annular shape, an annular shape, a circular tubular shape, a rectangular tubular shape, a spherical shape, a cube shape, a rectangular parallelepiped shape, a plate shape, a sheet shape, a tube, Includes soft tubes, hard tubes, spirals, planar spirals (spiral), solid spirals (coiled), porous, soft porous, hard porous, cones, pyramids, horns, streamlines, hollows, etc.

  <Member presentation from the viewpoint of general-purpose names including manufacturing method and shape>

  For example, general-purpose names of steel materials include steel plates such as thin steel plates (thickness less than 3 mm), thick steel plates (thickness 3 mm or more), ERW steel pipes, forged steel pipes, seamless steel pipes, spiral steel pipes, UOE steel pipes (= large welded steel pipes) ), Steel pipes such as sheet-wound steel pipes, H-shaped steels, angle steels, I-shaped steels, grooved steels, steel sheet piles, rails, lightweight steel shapes, deck plates, lightweight steel sheet piles, round bars, square bars, Hexagonal bar, octagonal bar, flat steel, deformed steel bar, etc., mild steel wire, hard steel wire, piano wire, special wire, etc. It includes a cast-forged steel product such as a forged steel product that is formed by forging a steel ingot or steel piece so as to give a forging ratio and is usually heat-treated to give a predetermined mechanical property.

  In addition, general-purpose names that are not limited to steel materials include tiles, pillars, beams, tiles, window glass, doors, doors, sliding doors, joinery, screws, propellers, impellers, and other feathers, wheels, lean hoses, bonnets, wallpaper, Includes shelves, tables, H steel, chimneys, ladders, etc.

  Next, various details of the current paths formed directly on the above-described members will be described. Note that the present invention is not limited to the contents presented here.

<Location where the current path is formed>
The place where the current path is formed with respect to the member is both the front surface, the back surface, the front and back surfaces, the side surface, and the peripheral surface of the member. In the case of a member having an internal space, it is one or both of an inner peripheral surface or an inner surface and an outer peripheral surface. In addition, when a groove or hole exists in the meat part of the member, it is also possible to form an energization path in the meat part of the member by laminating or filling the groove or hole with an energizing material.

<Layer state of current path>
The layer state of the current path is not limited to a single layer as shown in FIG. 3 or the like and two layers as shown in FIG. 5D, and a multilayer structure of three or more layers can be adopted. When the energization path has a multi-layer structure, an electrically insulating material can be interposed as an intermediate layer. It is preferable to form a protective layer in the outermost current path. The protective layer is a protective layer for protecting the current path from being damaged by external interference with the current path, a weathering layer for preventing deterioration due to ultraviolet rays, etc., gas from air, steam, corrosive gas, etc. It is also preferable to form a single layer or a laminated layer of a gas resistant layer for preventing permeation, oxidation, corrosion, etc., an acidic or basic layer or a chemical resistant layer for preventing influences from solvents, oils, chemicals and the like.

<Shape of current path>
The shape of the current path includes a linear shape such as a straight line or a curve, a planar shape such as a flat surface or a curved surface, a three-dimensional shape combining a plurality of flat surfaces or curved surfaces, and other surfaces (including both hollow and solid). In the case of a planar current path, in addition to the case where the current path itself is configured in a planar shape, linear wiring is spread within a plane / curved area, such as a zigzag shape, matrix shape, lattice shape, and spiral shape. The case where it is substantially planar by arranging or laminating is also included. The planar energization path may be formed into a curved surface shape by a part or all of the surface of a cylinder, a part or whole of a cone, or a part or whole of a sphere. Examples of the outer shape of the planar current path include a ring shape (annular), a cylindrical shape (inner peripheral surface, outer peripheral surface), a quadrangular shape, a polygonal shape, a circular or elliptical shape, a deformed shape, and combinations thereof.

<Number of current paths>
There may be a single or a plurality of energization paths. In addition, when the energization path is planar, as a pattern for arranging a plurality of energization paths, when arranging a plurality of energization paths along a straight line, a plurality of energization paths along a curved line (including a circular shape) When arranging them side by side, when arranging a plurality of current paths along a spiral, when arranging a plurality of current paths in a matrix / lattice form, when arranging a plurality of current paths in multiple layers, a plurality of three-dimensionally There is a case where an energization path is arranged. In addition, when the energization path has a ring shape (annular shape), for example, a plurality of energization paths can be arranged concentrically (such as concentric circles or substantially similar shapes). Of course, it goes without saying that it does not have to be concentric. Similarly, a plurality of energization paths can be arranged adjacent to each other by arranging a plurality of strands in a parallel state or a laminated state.

<Material of current path>
The material of the current path includes a material mainly composed of aluminum, copper, silver, gold, platinum, iron, carbon, and / or a composite material thereof, or a material not based on these materials. In addition, a current path and an insulating layer can be formed by a film forming method such as a PVC method or a CVD method. Examples thereof include an oxide thin film, a fluoride thin film, a nitride film, and a carbonized film. There is. The oxide thin films are Al2O3 (aluminum oxide, alumina), CeO2 (cerium oxide), Cr2O3 (chromium oxide), Ga2O3 (gallium oxide), HfO2 (hafnium oxide, hafnia), NiO (nickel oxide), MgO (magnesium oxide) , Magnesia), ITO (In2O3 + SnO2) indium tin oxide, Nb2O5 (niobium pentoxide), Ta2O5 (tantalum pentoxide), Y2O3 (yttrium oxide, yttria), WO3 (tungsten oxide), TiO (titanium monoxide), Ti3O5 (five) Titanium oxide), TiO2 (titanium dioxide, titania), ZnO (zinc oxide), ZrO2 + TiO2 (composite oxide), ZrO2 (zirconium oxide, zirconia) and the like.

  Fluoride thin films include AlF3 (aluminum fluoride), CaF2 (calcium fluoride), CeF3 (cerium fluoride), LaF3 (lanthanum fluoride), LiF (lithium fluoride), NaF (sodium fluoride), MgF2 ( Magnesium fluoride), NdF3 (neodymium fluoride), SmF3 (samarium fluoride), YbF3 (ytterbium fluoride), YF3 (yttrium fluoride), GdF3 (gadolinium fluoride) and the like.

  The nitride films are TiN (titanium nitride), CrN (chromium nitride), TiCN (titanium carbonitride), TiAlN (titanium nitride aluminum), BN (boron nitride), AlN (aluminum nitride), CN (carbon nitride), BCN ( Boron nitride carbon) and the like.

  The carbide film includes DLC (diamond-like carbon), TiC (titanium carbide), SiC (silicon carbide), BC (boron carbide), WC (tungsten carbide), and the like.

  In addition, there are iZO, graphene, polyacetylene, SnO2 (tin dioxide), etc.

  Various colors such as transparent, opaque, translucent, white, gray, silver, black, red, and brown can be used as the color of the current path. When the member is transparent or translucent, such as glass, the current path is preferably transparent or translucent.

<Function of current path>
Sensing functions realized by the current path include mechanical quantity measurement, heat / temperature measurement, light / radiation measurement, electrical measurement, magnetic measurement, chemical measurement, and the like. The mechanical quantity measurement includes acceleration such as an acceleration sensor, strain gauge (strain gauge), load cell, force such as a semiconductor pressure sensor, vibration such as sound waves (microphones) and ultrasonic waves. Thermal / temperature measurement can be realized by forming contacts at both ends of current conducting paths with different thermistors, resistance thermometers, thermocouples (in this case, hot and cold junctions). )) And non-contact sensing such as radiation thermometers. The light / radiation measurement includes light detection, infrared detection, radiation detection and the like of optical sensors, photoelectric elements, photodiodes, and the like. Electrical measurements include electric field, current, voltage, power, etc. Magnetic measurement includes a magnetic sensor and the like. Chemical measurement includes odor detection, ion concentration detection, gas concentration detection, and the like.

  In addition, sensors realized by a single current path or in cooperation with other circuits and elements include time sensors that measure time, optical position sensors (PSD), position sensors such as limit switches, ultrasonic distance meters, capacitance displacement Rotation angle of meter, optical distance measurement, distance sensor such as electromagnetic distance measurement, displacement sensor such as differential transformer, linear encoder, speed sensor such as laser Doppler vibration speed meter, laser Doppler current meter, potentiometer, rotation angle sensor, etc. Sensors, tachometer generators, rotary encoders and other rotational speed sensors, gyro sensors, one-dimensional images Linear image sensors and other angular velocity sensors, CCD image sensors, CMOS image sensors and other two-dimensional image sensors, stereo image sensors, and leak sensors (leakage) Sensor), liquid sensor such as liquid detection sensor (level sensor), hardness sensor, humidity sensor, The amount sensor, inclination sensor, including seismic sensor.

  Further, the use of the strain sensor realized in the current path includes load measurement (load cell), displacement measurement, vibration measurement, acceleration measurement, torque measurement (transducer), pressure measurement, Coriolis force measurement, and the like. In addition, the environmental temperature may be measured from a change in the electrical resistance value of the current path. In this case, it means that the energization path is used as a so-called resistance thermometer, and it is possible to select a location where the base material, which is the subject of the energization path, is not easily affected by thermal expansion and contraction or deformation. preferable.

  For example, a material whose coefficient of thermal expansion is substantially zero in a finite predetermined temperature range, specifically, a perovskite material, a bismuth / lanthanum / nickel oxide material, or a negative heat Combining a material having an expansion coefficient with a material having a positive thermal expansion coefficient that is almost equal to the absolute value, or combining a positive thermal expansion material and a negative thermal expansion material as a microstructure to form a nanocomposite, etc. Thus, materials configured to have a coefficient of thermal expansion of zero may be used in combination. In this way, it is possible to clearly distinguish the change in the electrical resistance value of the current path due to the deformation of the base material due to the external force and the change in the electrical resistance value of the current path due to the change in the environmental temperature.

  Furthermore, it is possible to arrange a piezoelectric element in a current path or on a base material that is different from the current path, or to provide a current path having a piezoelectric element structure. If an energizing path having a piezoelectric element or a piezoelectric element structure is provided in the energizing path, an external force applied to the energizing path having the piezoelectric element or the piezoelectric element structure is sensed, or a piezo current (electromotive force) generated with a pressure change is detected. It can be used for the operation of a current path or a circuit. For example, a current path having a piezoelectric element or a piezoelectric element structure is provided in a place where it can be sandwiched between a base material and an external member, and an electromotive force is generated in the piezoelectric element using a change in the sandwiching force (for example, vibration). Electric power can also be used as a power source for sensing the current path.

  Similarly, an energization path having a Peltier element or a Peltier element structure may be provided in the energization path or on a base material which is a place different from the energization path. If a current path having a Peltier element or a Peltier element structure is provided in the current path, a temperature difference can be generated in the base material or between the base material and the external member. For example, an energization path having a Peltier element or a Peltier element structure is provided in a place where a temperature change is likely to occur, and the temperature difference is forcibly eliminated by energizing the energization path having the Peltier element or the Peltier element structure. be able to. That is, in a place where a temperature difference occurs, a Peltier element or a heat absorption part of a current path having a Peltier element structure is provided on the high temperature side of the generated temperature difference, and a heat generating part is provided on the low temperature side to provide a Peltier element or Peltier element. The original high temperature side is cooled by supplying power to the energization path having the element structure, and at the same time, the low temperature side is heated to eliminate the temperature difference. However, when the high temperature side and the low temperature side are switched, the energization direction is reversed. By doing so, the heat absorption side and the heat generation side can be alternated. Therefore, if this alternation is controlled, it becomes possible to control the desired temperature by heating or cooling an appropriate part. Of course, the original high temperature side may be heated and the low temperature side may be cooled. Further, a heat sink can be provided in the heat generating portion of the energizing path having a Peltier element or a Peltier element structure to improve heat dissipation. In the energization path having the Peltier element structure, a PN junction composed of a P-type semiconductor and an N-type semiconductor is connected in series, and a region formed by a set of junctions in which the energization direction is N → P, and the energization direction is P → N. For example, an N → P junction is formed by appropriately stacking various conventionally known semiconductor materials of a P-type semiconductor and an N-type semiconductor in the region. It is also possible to configure by providing a conductive material such as metal or a semiconductor material in the lamination process in each of the part and the P → N junction.

  Next, some of the members to which the present invention can be applied, including the members presented as described above, are introduced from a morphological viewpoint. In addition, about an electricity supply path, the illustration of a detailed wiring structure is abbreviate | omitted by showing the detection direction of a stress with an arrow.

  A member with sensor structure 400A in FIG. 13A is configured such that a plurality of energization paths 92 are arranged in the circumferential direction and the axial direction with respect to a shaft member 410A having a square cross section, rhombus, trapezoid or the like. Specific examples of this aspect include screws, struts, rails, guide shafts, and wood. Of course, the sensor structure 500 shown in FIG. 1I or the like may be formed so as to spread over the entire surface around the sensor structure-equipped member 400A.

  The sensor structure-equipped member 400B in FIG. 13 (B) is configured such that a plurality of energization paths 92 are arranged in the circumferential direction and the axial direction with respect to a shaft member 410A having a cross-sectional circle or an elliptical shape. As specific examples of this aspect, various drive shafts including screws (seat surface, cylindrical portion, head peripheral surface, head surface, screw thread groove, etc.), ball screws, motor shafts, speed reducers and speed increasers Shaft members, propeller shafts, crank shafts, piston shafts, wheel shafts, various shaft elements, various wire rods such as shafts, rods and wires, rod-shaped woods, and the like.

  A member 400C with a sensor structure in FIG. 13C has a plurality of energization paths 92 arranged in the circumferential direction and the axial direction with respect to a rail member 410C having an I-shaped cross section. In such a long rail member, stress is generated due to bending or twisting during use, and there is a possibility of breakage or the like. Therefore, it is preferable to detect a change in state by the energizing path 92. Of course, the present invention is not limited to the case where the cross section is I-shaped, and can be applied to H-shaped steel, C-shaped steel, L-shaped steel, and the like. Of course, the sensor structure 500 shown in FIG. 1I or the like may be formed so as to spread over the entire side surface of the member 400C with sensor structure.

  The sensor structure-equipped member 500A shown in FIG. 14A has a plurality of current paths 92 arranged in the plane direction with respect to a plate-like plate material 510A spreading in the plane direction. Specific examples of this embodiment include wall materials including wallpaper, floor materials, ceiling materials, bodies, covers, cases, rims, containers, top plates, plate frames, tiles, boards made of wood and plaster, window glass, doors, etc. And hinge plates. Although not particularly shown here, a grating, punching metal, or the like in which an opening is formed in the plate material 510A can also be used as the sensor structure member. The outer shape of the plate material 510A is not particularly limited, and can be various shapes such as a square, a circle, an ellipse, an oval, and a trapezoid. In the case of a circle or the like, it can also be used as a valve body. It is also preferable to form a large number of energization paths 92 so as to be even or distributed over the entire surface. Of course, the sensor structure 500 shown in FIG. 1I or the like may be formed so as to spread over the entire surface of the member with sensor structure 500A.

  The sensor structure-equipped member 500B shown in FIG. 14B has a plurality of energization paths 92 arranged in the plane direction with respect to the strip-shaped plate material 510B spreading in the plane direction. As a specific example of this embodiment, a leaf spring, a shelf plate, and the like are listed in addition to those shown in FIG. Of course, the sensor structure 500 shown in FIG. 1I or the like may be formed so as to spread over the entire surface of the sensor structure-equipped member 500B.

  A member with sensor structure 500C in FIG. 14C has a plurality of energizing paths 92 arranged on an L-shaped plate material 510C obtained by bending a plate-like plate into an L-shaped cross section. In this case, it is also preferable to arrange the energizing path 92 so as to straddle the bending line of the L-shaped plate material 510C. Specific examples of this aspect include L-shaped steel, L-shaped brackets, L-shaped plates, stays, and the like. Of course, the sensor structure 500 shown in FIG. 1I or the like may be formed so as to spread over the entire surface of the sensor structure-equipped member 500C.

  A sensor structure-equipped member 500D in FIG. 14D has a plurality of energization paths 92 arranged on an L-shaped plate material 510C obtained by bending a plate-like plate. Specific examples of this aspect include piping and support fixtures, gutter fixtures, various stays, and the like. Of course, the sensor structure 500 shown in FIG. 1I or the like may be formed so as to spread over the entire surface of the member 500D with sensor structure.

  A member 600A with a sensor structure in FIG. 15A is configured such that a plurality of energization paths 92 are arranged on the inner peripheral side and / or the outer peripheral side with respect to the square cylindrical member 610A. Specific examples of this embodiment include round steel, square pipe, piping, and the like. Although not particularly shown here, a member having a U-shaped cross section in which a part of the member 610A is opened may be used. Specific examples include C-shaped steel, irrigation channels, drainage channels, and the like. Of course, although not particularly illustrated, the sensor structure 500 shown in FIG. 1I or the like may be formed so as to spread over the entire inner circumference or outer circumference of the sensor structure-equipped member 600A.

  A member 600B with a sensor structure in FIG. 15B has a plurality of energization paths 92 arranged on the inner peripheral side and / or the outer peripheral side with respect to the cylindrical member 610B. Here, in particular, a flange or a rim is formed, and an energization path 92 is also formed on this flange. Specific examples of this aspect include round pipes, piping (gas piping such as gas, liquid piping), pipelines, pressure vessels, female threads, sleeves, various hollow shafts, cylinders, bodies such as rockets, fuel tanks, gas tanks, tire wheels Etc. Of course, although not particularly illustrated, the sensor structure 500 shown in FIG. 1I or the like may be formed so as to spread over the entire inner periphery or outer periphery of the sensor structure-equipped member 600B.

  A member 700A with a sensor structure in FIG. 16A has a plurality of energization paths 92 arranged on the inner peripheral side and / or the outer peripheral side with respect to a substantially cubic, substantially cylindrical or substantially spherical member 710A which is hollow or solid. It has been done. Specific examples of this embodiment include various containers, cases, blocks, and the like including substantially cylindrical or substantially spherical shell pressure vessels. Of course, although not particularly illustrated, the sensor structure 500 shown in FIG. 1I or the like may be formed so as to spread over the entire outer periphery of the sensor structure-equipped member 700A.

  A member 700B with a sensor structure in FIG. 16B has a plurality of energization paths 92 arranged on the inner peripheral side and / or the outer peripheral side with respect to a hollow or solid spherical member 710B. In the case of the spherical member 710 </ b> B, it is preferable that the spherical member 710 </ b> B is arranged so that stress can be measured along the latitude direction and the longitude direction. Specific examples of this aspect include valve bodies, various balls, capsules, gas tanks, and the like. Of course, although not particularly illustrated, the sensor structure 500 shown in FIG. 1I or the like may be formed so as to spread over the entire surface of the sensor structure-equipped member 700B.

  A member with sensor structure 800A in FIG. 17A is a member in which a plurality of energization paths 92 are arranged with respect to a member 810A whose rigidity changes due to a change in cross-sectional area or the like. In this case, it is preferable to arrange the energizing path 92 at a location where the rigidity or the cross-sectional area changes, or at an ordinary inflection point where the rigidity or the cross-sectional area changes from decreasing to increasing or increasing to decreasing. Specific examples of this aspect include a vibrating horn, various stays, a support, a frame, and the like. Of course, although not particularly illustrated, the sensor structure 500 shown in FIG. 1I or the like may be formed so as to spread over the entire surface of the sensor structure-equipped member 800A.

  A member with sensor structure 800B in FIG. 17B, which is a specific example of FIG. 17A, has an energization path 92 arranged with respect to a member 810B whose cross-sectional area changes corresponding to the root of the blade in the impeller. Is. The root of the blade tends to cause stress concentration, and if it breaks, it leads to a serious accident. Therefore, maintenance is enabled by detecting the distortion state in advance. Of course, the sensor structure 500 shown in FIG. 1I or the like may be formed so as to spread over the entire surface of the blade of the sensor structure-equipped member 800B.

  The above specific example is a part of the present invention and can be applied to other members. For example, it has a seat surface for a male screw, a cylindrical portion, a head peripheral surface, a head surface, a thread groove, a female screw seat surface, an outer peripheral surface, a thread groove, a washer seat surface, and a single hole. One, multiple holes with multiple male screws fastened, one with long holes, hook, rebar, concrete, wood (columns, beams), stone (including marble, artificial marble), turbine (blade) ), Engine, rubber tube, silicon tube, blade surface of wind power generation or hydroelectric power generation, a rotating shaft, a support column, a reinforcement, a structural housing, and the like.

  In this embodiment, although the case where the stress of the member was measured by the electricity supply path 92 was illustrated, this invention is not limited to this. As long as the energization path 92 is changed together with the change of the member and can be detected by the electrical change of the energization path 92, it can be used for other measurement. Specifically, there are displacement (acceleration, rotation), temperature change, surface pressure change, and the like.

  Moreover, the material of the member with a sensor structure of the present invention can be variously selected besides metal. For example, it may be a plastic or a composite material (carbon fiber reinforced plastic, silica fiber reinforced plastic, etc.).

<Specific examples of current paths>
Next, another configuration of the current path formed on the member surface and the sensor structure will be further described. When detecting strain in a plurality of directions, a first energizing path 93 extending so as to reciprocate in the first direction and a second energizing path 94 extending so as to reciprocate in the second direction are formed independently (separated) from each other. However, the present invention is not limited to this. For example, the energizing path 92 in FIGS. 18A and 18B is formed so that the first energizing path 93 and the second energizing path 94 overlap. An electrical insulating layer 91 is interposed between the first energizing path 93 and the second energizing path 94. If it does in this way, even if it is a narrow place, a plurality of energization paths or sensor structures of many directions can be formed in an overlapping manner.

  Further, as shown in FIG. 19A (A), a plurality of low-resistance portions are provided in a parallel region X having a parallel path portion that is disposed adjacently in the band width direction (lateral direction) with the base path 95P as a parallel circuit. An energizing section 95Q may be arranged. In this way, the detection sensitivity in the longitudinal direction of the parallel regions X can be increased. At this time, as in the sensor structure shown in FIG. 19A (B), only the vicinity of the parallel region X where the low-resistance partial energization section 95Q is formed is set as a base path 95P having a relatively high resistance value. It is also desirable to form the supply wiring 95R for supplying power to a good conductor (a material having a relatively low resistance value). In this way, since the resistance value fluctuation of the supply wiring 95R becomes small when the member 30 with sensor structure is deformed, it becomes possible to detect deformation only within the parallel region X and suppress noise of the detection signal. it can. In addition, when the place (range) which forms the parallel area | region X is restricted, as shown, for example to FIG. 19B, the parallel wiring part X can also be arrange | positioned along with a strip | belt longitudinal direction (vertical direction).

  Further, for example, as in the sensor structure shown in FIG. 19C, the low-resistance partial energization section 95Q may be a lower layer and the base path 95P may be an upper layer. That is, the low-resistance partial energization section 95Q can be formed on the back surface of the base path 95P.

  Further, as in the sensor structure shown in FIG. 19D, the upper-layer side energizing path 92T and the lower-layer side energizing path 92U may be laminated with the electrical insulating layer 91 interposed. In the upper-layer side energizing path 92T, the base path 95P is the lower layer, and the low-resistance partial energizing section 95Q is the upper layer. On the other hand, in the lower layer side energizing path 92U, the base path 95P is the upper layer, and the low resistance partial energizing section 95Q is the lower layer. In addition, although the case of the two-layer structure is illustrated here, a structure of three or more layers may be adopted.

  Further, as shown in FIGS. 19E (A) and 19 (B), the supply wiring 95R for supplying electric power to the energizing path 92 having the sensor structure is the same as the plane 30A on which the energizing path 92 of the sensor structure-equipped member 30 is disposed. It is preferably formed on a plane or parallel plane 30B. Although a low resistance material is used for the supply wiring 95R, when the sensor structure-equipped member 30 is deformed or displaced, some resistance value change may occur. Therefore, when configured as in this example, the behavior characteristics of the large resistance value change of the current path 92 of the member with sensor structure 30 and the fine change of the resistance value of the supply wiring 95R are approximated, so the fine resistance value of the supply wiring 95R The change is less likely to be a noise component for the detection signal of the energization path 92.

  As shown in FIG. 19F, the current paths 92 having the sensor structure are arranged in parallel, and the first rectifying means 95W for flowing current in one direction is connected in series to one current path 92, and the other It is also preferable to connect in series the second rectifying means 95V that allows current to flow in the other direction with respect to the energizing path 92. In this way, sensing by one energizing path 92 and sensing by the other energizing path 92 can be selected simply by switching the direction of the current flowing through the supply wiring 95R (positive / negative of applied voltage). For example, by applying an alternating current (alternating voltage) with a common power source or detection means, it is possible to obtain different detection results from the plurality of energization paths 92.

  As shown in FIG. 19G, it is also preferable to arrange the energizing paths 92 radially. Specifically, energizing paths 92 that reciprocate in the radial direction are provided at regular intervals in the circumferential direction, and are connected in series. When such a pattern is formed on a disk surface or a spherical surface that is a base material, it is possible to detect a deformation such that the disk or the like receives a pressure in a direction perpendicular to the surface and extends in the radial direction with high sensitivity. It becomes possible.

  Further, in the above embodiment, the case where the base path 95P is a belt-like wiring is illustrated, but the present invention is not limited to this. Like the energization path 92 shown in FIGS. 20A and 20B, a planar resistance wiring 95C is disposed as a base path, and electrodes 95A and 95B are disposed on both outer edges thereof. A plurality of low-resistance partial energization sections 95Q can be arranged on the surface of 95C. In the present embodiment, a plurality of squares (not necessarily rectangular) are provided on one surface of the planar resistance wiring 95C, and conductive portions 95D having relatively good resistance values are provided intermittently. The low-resistance partial energization sections 95Q may be arranged so as to spread in the plane direction (for example, in a matrix form or a honeycomb form) with a space therebetween. For example, the electrodes 95A and 95B can be arranged at a total of four locations such that there are a pair (A1, A2) in one direction and a pair (B1, B2) in the other direction.

  When a voltage is applied to each of the two pairs of electrodes 95A and 95B, as shown by the arrows in FIG. 20B, between the inside of the low resistance partial energization section 95Q and the low resistance partial energization section 95Q adjacent at a distance d0. Electrons move through one surface layer of the planar resistance wiring 95C and current flows. Therefore, the current can be made to flow with the current to one surface layer side of the planar resistance wiring 95C being dominant.

  Therefore, when the energization path 92 is curved in one direction so that one surface of the planar resistance wiring 95C extends as shown in FIG. 20C, the distance between the adjacent low resistance partial energization sections 95Q is increased from d0. d. As a result, the resistance value between the pair of (A1, A2) electrodes 95A, 95B in one direction increases, and the curved state can be detected. Although not particularly illustrated, when the planar resistance wiring 95C is bent in the other direction in the plane direction, the resistance value between the pair of (B1, B2) electrodes 95A and 95B in the other direction increases.

  In addition, although the case where the low-resistance partial energization section 95Q is a square is illustrated here, various shapes other than a polygon such as a triangle, a rectangle, a pentagon, a hexagon, and an octagon, a circle such as an ellipse, and a perfect circle are available. Can be adopted. For example, in the case of a hexagon, as shown in FIG. 21A, the low-resistance partial energization section 95Q may be arranged in a so-called honeycomb shape. In that case, three pairs (A1, A2) (B1, B2) (C1, C2) or more of electrodes may be arranged opposite to each other. Further, as shown in FIG. 21 (B), a pentagonal and hexagonal low-resistance partial current-carrying section 95Q can be combined on the surface of a spherical planar resistance wiring 95C as a so-called soccer ball. is there. It is also possible to detect a change in capacitance between the electrodes by using the planar resistance wiring 95C as a semiconductor or an insulator.

  Further, the present invention can add other functions in addition to realizing a sensor structure for detecting stress in the current path 92. For example, as shown in FIG. 22, a first partial current path 92X having a first resistivity value (or work function value) and a second partial current path having a second resistivity value (or work function value). By connecting both ends of 92Y, one connection point can be a hot junction T1, and the other connection point can be a cold junction T2. In this case, an electromotive force can be obtained. This is to make the resistivity values different, that is, to make the materials of the first partial conducting path 92X having the first resistivity and the second partial conducting path 92Y having the second resistivity value different. This can be easily realized. When a temperature difference occurs between the hot junction T1 and the cold junction T2, a voltage V is generated between the hot junction T1 and the cold junction T2 due to a so-called Seebeck effect, and a current flows. Therefore, if the sensor structure described above is formed for the energization path 92, it is possible to detect a temperature change occurring in the member with the sensor structure or to obtain an electromotive force for the sensor structure by itself.

  Next, in the present embodiment, a configuration of an energization circuit when forming a plurality of energization paths 92 (a plurality of sensor structures) will be described with reference to FIGS.

  FIG. 23 shows an energization circuit 201 formed on the sensor structure-provided member 202. The energization circuit 201 is configured by connecting a plurality of energization paths 92 serving as electric resistances in parallel (see FIG. 23A). Thus, for example, when the sensor structure member 202 has a desired wide area such as wallpaper or plate material, a large number of current paths 92 can be dispersedly arranged, so that a strain or the like in the vicinity of each current path 92 can be detected. Is possible. In addition, since a voltage is applied from a pair (or a plurality of pairs) of good conductors serving as the common terminal A and terminal B to all the energization paths 92, the circuit configuration of the energization circuit 201 can be simplified.

  At this time, each energization path 92 is set to a resistance value R1, R2, R3, R4, and both ends of these four energization paths 92 are connected to the terminals A and B via good conductors. . The number of energization paths 92 is not limited to four and may be any number. The number of terminals that can measure resistance is not limited to two. The resistance values R1, R2, R3, and R4 are set to different resistance values, and the difference between the resistance values R1, R2, R3, and R4 is determined when each current path 92 senses a distortion or the like within the standard. Is set to be larger than the maximum resistance value change amount (δR1, δR2, δR3, δR4) that can occur in the above.

  The energizing circuit 201 is directly formed on the sensor structure-equipped member 202. As a method for forming the current path 92, application, transfer, lithography, cutting, vapor deposition, printing, semiconductor process, and the like can be considered. A portion having electrical resistance may be made of a conductive paint or paste having a high resistivity, or a thin metal film having a high resistivity such as nichrome may be formed as the current path 92. As a good conductor, it is conceivable to form a metal thin film having a low resistivity such as copper or aluminum. When the sensor structure member 202 is an electric conductor, it is desirable to form the energization circuit 201 after applying an insulator as a base. As the base, for example, polymethyl methacrylate resin (PMMA) can be considered.

  In the case of FIG. 23A, the combined resistance R between the terminal A and the terminal B is in a steady state without any trouble in the sensor structure-provided member 202. When all the circuit patterns are connected, 1 / The relationship of R = 1 / R1 + 1 / R2 + 1 / R3 + 1 / R4 is established and can be obtained by calculation.

  In addition, when deformation or temperature change occurs in the sensor structure-equipped member 202, it is possible to sense the change by changing the resistance value of the energization path 92 or the like. For example, when the energization path 92 having the resistance value R1 is deformed due to strain or the like and the resistance value is increased by δR1, the relationship 1 / R = 1 / (R1 + δR1) + 1 / R2 + 1 / R3 + 1 / R4 is established. Various phenomena or changes in the physical state can be sensed by the change in the combined resistance R.

  On the other hand, assuming that the sensor structure member 202 is damaged due to vibration, aging deterioration, or the like, and a cut portion 203 is generated as shown in FIG. 23B, the combined resistance R between the terminals A and B is assumed. 1 / R ′ = 1 / R2 + 1 / R3 + 1 / R4, and it is understood that the resistance between the terminal A and the terminal B is hindered in the sensor structure member 202. Furthermore, since R1 to R4 have different resistance values, it can be detected by measuring the electrical resistance between the terminal A and the terminal B which one of the energization paths 92 is hindered. As the present embodiment, the configuration in which the electric resistances are simply arranged in parallel is shown, but the energization circuit 201 may have a structure in which the electric resistances are connected in series, and the series connection and the parallel connection are mixed. It may be a structure.

  FIG. 24 shows an example of a two-dimensional matrix energization circuit 204 which is a modification of the energization circuit 201 shown in FIG. The two-dimensional matrix energization circuit 204 in FIG. 24A is configured by interconnecting a plurality of energization paths 92 serving as electric resistances in a mesh shape (lattice shape). The current path 92 and the current path 92 are connected by a circuit pattern formed of a good conductor. The energization circuit 204 includes a terminal A, a terminal B, a terminal C, and a terminal D for measuring electrical resistance. For example, by measuring the resistance between the terminal A and the terminal C, the sensor structure-equipped member 202 is provided. Change can be sensed.

  Moreover, even if all the current paths 92 have the same electrical resistance, if any of the plurality of current paths 92 is broken or broken, it is roughly determined whether one connection has been disconnected or two or more connections have been disconnected. Failure information can be easily obtained. Further, each of the energization paths 92 has a resistance value that is different in units of kilohms, for example, a resistance value of a prime number, that is, an electric resistance having different values such as 2 kilohms, 3 kilohms, and 5 kilohms, the energization paths 92 are formed. It can be estimated by measuring the resistance between the terminals in which part of the sensor-structured member 202 that has been damaged such as breakage occurs. For example, if all resistance values are set to prime numbers, the disconnected resistance value can be estimated from the factorization (uniqueness) of the prime product included in the combined resistance value in the parallel circuit. The location of the energization path 205 can be specified.

  FIG. 24B shows a further modification of the energization circuit 204 having a two-dimensional matrix shape. In the energization circuit 204, energization paths 92 arranged in a matrix are connected in series with each other. In the case of this series circuit, if disconnection occurs somewhere, the entire energization circuit 204 cannot be sensed, so that it is possible to detect an abnormality by disconnection. On the other hand, the energization circuit including the parallel connection shown in FIG. 23 (a) and FIG. 24 (a) can be sensed in the remaining part even if a part is disconnected, and is suitable for measurement applications over a long period of time. Become.

  In FIG. 24B, only the terminal A and the terminal B are illustrated, but by providing a terminal for measuring each of the current paths 92 (or a specific group of a plurality of current paths 92), the position of the structure can be increased. It may be possible to determine after the fact whether damage has occurred. Therefore, in periodic sensing, the safety of the entire sensor structure member 202 can be easily checked by measuring the resistance between the terminal A and the terminal B, and after detecting any abnormality or suddenly such as an earthquake. At the time of the detailed inspection after the event, it is possible to specify which part of the sensor structure-attached member 202 is damaged by individually measuring between the energization paths 92.

  As shown in FIGS. 23 and 24, in the energization circuit in which the energization path 92 spreads in a two-dimensional plane, the electrical resistance changes as the length, thinness, thickness, and the like change. Therefore, by embedding the sheet-form or mesh-form energization path forming member on which this energization circuit is formed in a building such as a road, a floor, a wall, etc., distortion occurring after curing during curing of asphalt, concrete, etc. Real-time sensing is possible. In addition, as an application for the use of embedding or pasting such sheet-like members, analysis of construction processes of large structures such as dams, airport runways, harbors, high-rise buildings, water and sewage networks, highways, railway viaducts, breakdowns, etc. It is particularly suitable for analysis and the like. In addition, if memory is placed in a part of each energizing circuit and the sensing history data is stored, the history of vibration phenomena, etc. that occur during the construction process can be stored accurately, and subsequent data alteration Etc. can be prevented.

  Moreover, in the case of the said FIG.23 and FIG.24, distortion etc. of the member with a sensor structure are normally detected. Furthermore, when a cutting site occurs in the energization circuit, the position can be easily specified. On the other hand, it can also be used for the purpose of limitedly detecting the cutting phenomenon of the member with sensor structure (that is, the disconnection phenomenon of the energization circuit).

  Furthermore, although FIG. 24 illustrates the case where a plurality of current paths 92 are interconnected in a two-dimensional matrix, they may be interconnected in a three-dimensional matrix (three-dimensional). It is suitable when the member with sensor structure is a three-dimensional structure.

  Further, in order to directly provide a plurality of energization paths 92 having different resistance values as shown in FIGS. 23 and 24 in the member with sensor structure, it is necessary to design the circuit pattern in advance. At this time, a plurality of basic pattern information having a predetermined resistance value is prepared in a memory such as a computer, and circuit data is generated by combining these pattern information by a circuit generation program executed by the computer. Then, this circuit data is transmitted to a printing machine or semiconductor film-forming device to apply and print conductive paint or metal paste, or to draw a resist film for the semiconductor process to form an actual energizing circuit. The technique of doing is preferable. An example of this type of design process is shown in FIG.

  FIG. 25A shows a reference frame having a certain area such as a square (not limited to a square, for example, a regular triangle, a rectangle, a rhombus, a regular hexagon, or other appropriate geometric shape). Pattern information 206a having a pair of terminals 207 arranged and a unit resistor 208 arranged between the pair of terminals 207 is shown. The unit resistor 208 is set to a reference resistance value of, for example, 1 kilohm. As a result, the print pattern information 206a becomes a 1 kilohm pattern.

  The pattern information 206b in FIG. 25B is a 2 kilohm pattern because two unit resistors 208 are directly arranged between the pair of terminals 207. The pattern information 206c in FIG. 25C is a 3 kilo-ohm pattern, the pattern information 206d in FIG. 25D is a 5 kilo-ohm pattern, and the pattern information 206e in FIG. 25E is a 7 kilo-ohm pattern.

  Further, in the pattern information 206f in FIG. 25 (f), a total of four terminals 207 are arranged at the center of each of the four sides of the square reference frame, and the unit resistor 208 is located at a position where all the terminals 207 are connected. Be placed. In this way, a resistance of 1 kilohm can be obtained by using any two terminals 207 out of a total of four terminals 207. In addition, it is preferable to prepare a connection pattern of only good conductors as in the pattern information 206g, 206h, and 206i of FIGS. 25 (g), (h), and (i). By storing these pattern information 206a to 206i in a memory of a computer and combining them on a program, pattern information (circuit information) of a desired resistance value can be easily generated. In addition, although the case where a terminal continuous with the adjacent pattern is arranged at the center of each side of the square reference frame is illustrated here, a terminal continuous with the adjacent pattern is arranged at each corner of the square reference frame. May be.

  FIG. 26 depicts circuit information generated by combining 15 pieces of pattern information. Here, a 4 kOhm energization circuit, a 13 kOhm energization circuit, and a 14 kOhm energization circuit in which a plurality of pattern information are arranged in series are connected in parallel to each other. For example, the circuit information may be input to the coating device, and the coating device may apply the good conductor paste or the resistor paste to the member with the sensor structure to form an energization circuit. Further, a desired energization circuit may be formed by a film forming process such as a semiconductor or vapor deposition by drawing and masking the same pattern on the sensor structure member with a photoresist or the like.

  Next, a usage example of the sensor structure-attached member will be described with reference to FIGS. FIG. 27A is a conceptual diagram when a sensor structure (an energization circuit) is formed on a columnar structure such as a bridge. The energization circuit 213 is formed on the column 212 (bridge pier). At this time, it is conceivable to directly print an organic conductive material as the energization circuit 213. In this way, an active electric circuit can be easily formed on the pillar 212. Specifically, in addition to the sensor structure already described, an antenna structure, a resonance circuit, an amplifier circuit, a control circuit, a modulation circuit, a transmission / reception interface, and the like can be further printed. When a physical phenomenon such as distortion, deformation, expansion / contraction, or cracking occurs in the column 212, for example, the antenna structure formed on the surface of the column may be displaced or damaged, and the resonance frequency may change. Normally, the energization circuit 213, which was capable of responding, can no longer respond fully, and thereby a physical phenomenon can be detected. Further, when the column 212 expands, it is expected that a phenomenon such as an increase in the area of the antenna and a decrease in the resonance frequency occurs, and quantitative information on the physical change of the column 212 can be obtained by the frequency change.

  FIG. 27B shows a cross-sectional view of AA ′ in FIG. The energization circuit 213 preferably has a circuit pattern layer 215 having a sensor structure formed on the surface of the column 212 with an insulating base 214 and covered with a waterproof protective layer 216. However, when the sensor structure-attached member to be detected is an insulator, such as a concrete column 212, the base 214 may be omitted. In particular, in the case of an object that will go through both the process of the manufacturing factory such as precast concrete and precut timber and the subsequent site construction process, it becomes possible to perform patterning by the patterning process at the manufacturing factory, Workability on site can be greatly improved. Of course, it is also conceivable to use an existing electronic circuit (IC chip) for the circuit and directly print only the sensor structure for detecting a physical phenomenon on the member with the sensor structure such as the column 212. You may form by using semiconductor processes, such as photolithography, or etching after forming a metal film like the case where a printed circuit board is created.

  Next, with reference to FIG. 28, a case where the sensor 217 and the member to be measured (structure 212) are separate members will be described. The sensor 217 of the present embodiment is a band-shaped material containing a plurality of sensor structures (conduction circuits). This sensor 217 is a so-called smart bandage. As shown in FIG. 28 (a), the sensor 217 is spirally wound around a columnar structure 212 such as a bridge pier to reinforce the structure 212 and at the same time, after its reinforcement. A physical phenomenon is detected by deformation or the like. The printing method of the energization circuit to the sensor 217 may be transfer, etching, coating, semiconductor process, or the like. The material of the sensor 217 is various, such as fiber reinforced synthetic resin including various reinforcing fibers such as cloth, nonwoven fabric, resin, carbon fiber, metal fiber, silicon fiber, and glass fiber, paper, rubber, and silicone. The material of the current path may be aluminum, copper, an organic conductor, or other electrical conductor. In the energization circuit 213 that individually realizes the sensor structure, an ID signal transmission circuit is formed, and an independent individual ID can be transmitted. This ID signal transmission circuit may be arranged by pasting an IC chip or the like. As a result, it is possible to grasp (identify) in advance where each energization circuit 213 is located in the entire sensor 217. For example, after reinforcement using this smart bandage, as shown in FIG. 28B, the wireless access means 218 receives individual IDs from all the energizing circuits 213, and in which location of the structure 212 which individual ID It is confirmed whether (the energization circuit 213) is arranged and stored as data. Thereafter, when deformation or abnormality occurs in the column 212, the amount of deformation can be detected by a change in the resistance value of each energization circuit 213. Further, for example, when the pillar 212 is cracked, a part of the antenna structure of each energization circuit 213 is destroyed. The energization circuit 213 that was accessible becomes inaccessible, or the resonance frequency of a specific antenna changes. By collecting the individual ID from the energization circuit 213 together with the information on the inaccessibility or frequency change, it is possible to detect which part of the pillar 212 has trouble without peeling or removing the reinforcing material. It can also be configured. In addition, although the case where individual ID is provided for every energization circuit 213 is illustrated here, for example, a partial ID may be assigned for each sensor 217 serving as a smart bandage, or ID may be assigned according to other rules. Is also possible.

  In addition, as a current path forming member, various electric wires such as high-voltage, medium-pressure, and low-voltage transmission lines, various pipes for water supply, sewerage, gas, steam, various chemicals, oil, etc. It is also possible to employ various members of a joint for piping.

<Other points of view>
In addition to the above, the present invention can be applied to various machine parts. For example, linear motion parts include linear shaft, shaft holder, set collar, linear bush, ball guide, spline, oil-free bush / washer, oil-free bush, oil-free washer, oil-free material (round bar / pipe), no Oil supply plate / guide rail, oil-free plate, oil-free guide rail, oil-free material (plate), linear guide, cable carrier, ball screw, support unit, trapezoidal screw / slide screw, trapezoidal screw nut, slide screw, cross roller , Cross roller table, cross roller ring, linear ball slide, linear rail, actuator, index table, power cylinder / jack, bellows, etc. Examples of the rotating component include a bearing, a bearing holder, a cam follower, a roller follower, a rotating shaft, and a driving shaft. Examples of connection / link mechanism components include fulcrum stepped screws, hinge pins, hinge bases, hinge bolts, links, rod end bearings, connection rods, link cables, link wires, and the like. In addition, examples of transmission parts include coupling shaft joints such as rigid, universal joints, chain couplings, and flanges, timing belts, round belts, V belts, pulleys, chains, sprockets, chain bolts, turn buckles, and tensioners. Gears such as spur gears, bevel gears, helical gears, screw gears, worm gears, rack gears, internal gears, ratchets, ring rail gears, and the like. As power sources, in addition to engines such as internal combustion engines and external combustion engines, motors including small AC motors, stepping motors, servo motors, brushless motors, brushed DC motors, general-purpose motors, gear motors, etc., clutches and brakes Transmissions and reduction gears including In addition, examples include conveyor parts including conveyors and rollers, table lifters, elevators including air lifts, and transporters. Further, as stage parts, there are movable stages such as X-axis, Z-axis, XY-axis, XYZ-axis, rotation, gonio, tilt, multi-axis, etc., including manual or automatic stages. Examples of pneumatic equipment include cylinders, actuators, valves, regulators, lubricators, pneumatic solenoid valves, fluid solenoid valves, air operated valves, piping joints, and the like. Examples of the vacuum component include a vacuum pipe, a vacuum pump, a vacuum generator, an ejector, a vacuum valve, a vacuum filter, a vacuum pressure regulating valve, a suction pad, a vacuum tank, and a chamber. Examples of hydraulic equipment include hydraulic actuators, hydraulic pumps, oil filters, hydraulic cylinders, hydraulic rotary actuators, hydraulic clamps, hydraulic pumps, oil filters, hydraulic valves, hydraulic hoses, oil caps, and the like. Examples of piping parts include steel pipes, copper pipes / stainless steel pipes, and resin pipes. Joints include screwed joints, screwed flanges, hose joints, stainless steel pipe joints, copper pipe joints, steel pipe joints, Welded joints, welded flanges, rotary joints, swivel joints, mechanical pipe joints, resin pipe joints, expansion joints, joints for PVC pipes, coupler joints, one-touch joints, etc. Needle valves, fluid check valves, gate valves, globe valves, butterfly valves, diaphragm valves, pinch valves, air operation valves, safety valves, adjustment valves, etc. Vertical pipe fittings, floor penetration fittings, floor bands, U-shaped fittings, saddle vans , Brackets and the like, examples of clamps for piping include manifolds, block manifolds, rotary manifolds, brackets with joints, manifolds with magnets, etc., and resin hoses such as resin hoses, Hose bands, hose reels, duct hoses, etc., and duct piping parts include duct pipes, flexible hoses, sanitary piping, sanitary valves, sanitary pipes, sanitary fittings, clamps, gaskets, etc. Can include O-rings, oil seals, gaskets, seal washers, seal caps, packing, etc., and drainage-related parts include drainage mass, rainwater mass, lid, protective lid, groove lid, decylinder, etc. I can do it. Examples of the shelf-related parts include a shelf, a shelf holder, a shelf column, and a shelf board. The hinge may be, for example, a pivot type, a rotary type, a leaf type, etc., and examples thereof include a flat hinge, a flag hinge, a free hinge, a back hinge, a hidden hinge, a spring hinge, and a glass hinge. Examples of fastening members include screws, bolts, washers, nuts, etc., for example, micro screws, fine screws, washers built-in screws, tapping screws / tap tight / high-tech screws, drill screws, tamper-proof screws, Hex bolt, hexagon socket head cap screw (cap bolt), low head bolt, small diameter bolt, through hole bolt, hexagon socket button bolt, hexagon socket countersunk bolt, unified screw, inch screw, wit screw, set screw, full screw, Stud bolts, butterfly bolts, thumbscrews, cosmetic screws, square bolts, round bolts, resin screws, ceramic screws, captive screws, shoulder bolts, eye bolts, den bolts, piping U bolts, wood screws, coach screws, course threads, Onimei Nut, light screw, universal screw, joint connector, connecting bracket bolt, Other woodworking screws, other concrete screws, other plasterboard screws, corrugated plate screws, nails, steel plate screws, stud fastening screws, washers, screw washers, plain washers, spring washers, toothed washers (chrysanthemums) ), Rosette washers, single and double tongue washers, tapered washers, spherical washers, cosmetic screw washers, and the like. The present invention also includes a power plant, a mixing plant, a grinding plant, a separation plant, a casting plant, a metal processing plant, a woodworking plant, a nuclear power plant, a steam generation plant, a steam power plant, a solar power plant, a heat storage plant, a cooling plant, and a liquefaction. It can be applied to appropriate parts of various plants such as plants, electrolytic coating plants, petrochemical plants, gas plants, water supply plants, sewage treatment plants, waste treatment plants, resin plants, metal plants, concrete plants, asphalt plants, etc. . One type of plant is a nuclear power plant, for example, a reactor vessel (reactor pressure vessel), coolant piping (recirculation piping), coolant pump (recirculation pump), steam generator, turbine, etc. In addition to the mechanical equipment, electrical / instrumentation equipment such as generators, transformers and cables, concrete structures such as reactor buildings and turbine mounts, and the like can be mentioned. Other types of plants include hydropower plants, wind power plants, tidal power plants, geothermal power plants, solar thermal power plants, ocean thermal power plants, thermal power plants, nuclear power plants, nuclear fission plants and nuclear fusion. Type plants, solar power plants, fuel cell power plants and the like. The present invention can be applied to various vehicles (components thereof), such as wheelchairs, strollers, ropeways, lifts, gondola, elevators, escalators, bicycles, automobiles, industrial machinery, construction machinery, agricultural machinery, Motorcycles, snow, amphibious vehicles, military vehicles such as tanks and armored vehicles, railway vehicles, passenger ships, cargo ships, fishing boats, yachts, boats, water bikes, racing boats, ships, submarines, gliders, balloons, airplanes, vertical take-off and landing aircraft, helicopters , Auto gyro, rocket, artificial satellite and so on. Examples of wheelchairs include frames, main wheels, casters, seats, back supports, foot supports, arm supports, brakes, handles, and tipping levers. Examples of application to ropeways, lifts, gondola, and the like include ropes, carriers, struts, and the like. Examples of the application as an elevator include a control panel, a hoisting machine, a speed governor, a main rope, a governor rope, a car, a tail cord, and a governor tensioner. Applications for escalators include treads, risers, step chains, drive rollers, follower rollers, drive rails, follower rails, wheelchair-specific steps, skirt guards, comb plates, drive units, drive chains, handrail drive rollers, handrail chains, additional A pressure roller, a handrail guide rail, an inlet, etc. can be mentioned. Examples of the application as a bicycle include a frame and a wheel. As applications for vehicles such as buses, trucks, passenger cars, motorcycles, in addition to chassis and frames, body structures such as reinforcements and bodies, motors, power transmission devices, steering devices, braking and restraint devices, driving devices, tire wheels, A cargo bed, a suspension, etc. can be mentioned. As an application as a railway vehicle, for example, underframe, side structure, wife structure, roof structure, driver's cab, door, window, seat, lighting, air conditioner, toilet, coupler, through passage, wheel, axle, bearing, Axle box support device, bogie frame, vehicle body support device, drive device, braking device, power mechanism, pantograph and the like can be mentioned. Application as a ship includes, for example, deck, engine, motor, screw, rudder, anchor, anchor chain, radar, antenna, chimney, fuel tank, ballast tank, sail, sail column, ship bottom, anchor, bridge, etc. . Applications for airplanes include, for example, radomes, wheels, galleys, passenger seats, main wings, horizontal tails, vertical tails, flaps, spoilers, jet engines, navigation lights, fuel tanks, ailerons, elevators, ladders, main enclosures, longitudinals Wood, cowling, main wing girder, wing end plate, fuselage outer plate, enclosure, horizontal stabilizer, pressure bulkhead, vertical stabilizer, canard, window, door, restroom, cargo compartment, emergency equipment, propeller, stack discharger And Pitot tube. In addition, as various mechanical devices, refrigerator, belt conveyor, filling machine, oven, storage, stirrer, frother, kettle, pressure kettle, freezer, fryer, dryer, sorting Machine, cutting machine, smoker, bottling machine, canning machine, washing machine, shaving machine, juicer, pulverizer (mill), fermenter, burner, steamer, sprayer, squeezing machine, stretcher, spinning machine, loom, knitting Machine, sewing machine, dyeing machine, chemical fiber machine, preparation machine (thread splicer), polishing machine, winder, printer, lumber machine, rotary lace (log wig peeler), hot press, wood dryer, chip making machine , Raw wood sorting device, raw wood feeder, band saw, ripper, kanna board, chisel board, milling machine, mortise machine, drilling machine, dander, pressing machine and the like. In addition, examples of applications of the present invention include baseball bats, gloves, mitts, balls and soccer shoes, balls, goals, kendo armor, bamboo swords, tennis rackets, and other sports equipment. In addition, musical instruments including pianos, electric tones, various wind instruments, and stringed instruments are also preferred as objects of the present invention.

  Next, a case where the base material itself in the sensor structure-equipped member 30 also serves as the base path 95P of the energization path 92 of the sensor structure is illustrated. The member 30 with sensor structure shown in FIG. 29A is a conductive material in which the surface 32A itself of the base material 32 that is the object to be detected has a higher electrical resistivity and electrical resistance value than the low-resistance partial energization section 95Q. A plurality of low-resistance partial energization sections 95Q that are good conductors having a relatively low electrical resistivity and electrical resistance value are directly formed on the surface 32A at intervals from each other. As a result, the surface 32A itself can be used as the base path 95P. In this case, on the surface 32A, if a voltage is applied to both outer sides (see the electrodes 32X and 32Y) sandwiching the low-resistance partial energization section 95P and a current is passed through the surface 32A, resistance against deformation of the surface 32A, etc. The value (current value) can be changed with high sensitivity.

  Furthermore, as shown in FIG. 29B, a plurality of low-resistance partial energization sections 95Q may be arranged on the surface 32A so as to expand in the plane direction (for example, in a matrix). By applying a voltage to each of the counter electrodes 32X and 32Y of one good conductor sandwiching the low-resistance partial energization section 95Q from one direction and the counter electrodes 32V and 32AW of the other good conductor sandwiching from multiple directions, bidirectional Deformation can be detected.

  Next, a patterning method for forming the sensor structure shown in FIG. 1B on the surface of the base material (object to be measured) 32 of the sensor structure-equipped member 30 will be described with reference to FIG.

  First, in the base road masking layer forming step shown in FIG. 30 (A), the base road masking layer 95Pm covering the periphery of the base road formation planned area 95Pf with respect to the surface of the base material having the base road formation planned area 95Pf. Form. As a result, only the base path formation scheduled region 95Pf is exposed on the surface of the base material.

  Next, in the base road conductive layer forming step shown in FIG. 30B, the base road conductive layer is formed on the surface of the base material in the range including the base path formation planned region 95Pf using the base road conductive material. 95Pd is formed.

  Thereafter, in the base road masking layer removing step shown in FIG. 30C, the base road masking layer 95Pm is removed. As a result, the base path conductive layer 95Pd remains in the range of the base path formation planned region 95Pf, thereby forming the base path 95P.

  Further, in the low resistance partial energization zone masking layer forming step shown in FIG. 30D, a base path conductive layer 95Pd (a plurality of low resistance partial energization zone formation regions 95Qf within the base path formation planned region 95Pf). Here, on the surface of the completed base path 95P), a masking layer 95Qm for low-resistance partial energization zones that covers the periphery of the plurality of low-resistance partial energization zone formation planned areas 95Qf is formed. As a result, only the plurality of low-resistance partial energization zone formation planned areas 95Qf are exposed. A part of the low-resistance partial energization zone formation planned area 95Qf may protrude from the completed base path 95P (base path formation planned area 95Pf).

  Next, in the conductive layer forming step for low resistance partial energization zone shown in FIG. 30 (E), the conductive material for low resistance partial energization zone is applied to the surface in the range including the plurality of low resistance partial energization zone formation planned areas 95Qf. Using this, the conductive layer 95Qd for the low-resistance partial conducting region is formed.

  Thereafter, in the masking layer removal step for low resistance partial energization zone shown in FIG. 30 (F), the masking layer 95Qm for low resistance partial energization zone is removed. As a result, the low-resistance partial energization region conductive layer 95Qd remains in the range of the low-resistance partial energization region formation scheduled region 95Qf, thereby forming a plurality of low-resistance partial energization regions 95Q. The sensor structure is completed through the above steps.

  In the above patterning method, if an insulating layer is required in the lower layer of the sensor structure, an insulating layer forming step is executed before the base path conductive layer forming step to form a base path on the surface of the base material. An insulating layer may be formed for the region 95Pf. In the patterning method, the case where the base layer masking layer removing step is performed before the low resistance partial energization region masking layer forming step is illustrated, but the present invention is not limited to this. The masking layer removal step for the base road may be executed after the masking layer forming step for the resistance partial energization zone or after the masking layer removal step for the low resistance partial energization zone is executed.

  Further, in the base road masking layer forming step, the base path formation planned area 95Pf has a high resistance partial conductive area formation planned area where a high resistance partial conductive section 95T (see FIG. 1B) is formed. That is, in the base road masking layer forming step, a masking layer for high-resistance partial energization zone is formed so as to cover at least the high-resistance partial energization zone formation planned area. It can be defined as “step”. Similarly, the base path conductive layer forming step is defined as a “high resistance partial conducting region conductive layer forming step” in which a high resistance partial conducting region conductive layer is formed using a high resistance partial conducting region conductive material. be able to. Similarly, the masking layer removal step for base road is defined as a “masking layer removal step for high-resistance partial energization zone” that removes the masking layer for high-resistance partial energization zone to complete the high-resistance partial energization zone 95T. Can do. This redefinition is the same in the following description.

  Next, with reference to FIG. 31, a patterning method for forming the sensor structure shown in FIG. 1E on the surface of the base material (object to be measured) 32 of the member 30 with sensor structure will be described.

  First, in the masking layer forming step for the low resistance partial energization zone shown in FIG. 31A, a plurality of low resistance partial energization zones are scheduled to be formed on the surface of the base material having the plurality of low resistance partial energization zone formation regions 95Qf. A masking layer 95Qm for the low-resistance partial energization region that covers the periphery of the region 95Qf is formed. As a result, only the plurality of low-resistance partial energization zone formation planned areas 95Qf are exposed.

  Next, in the conductive layer forming step for low resistance partial energization zone shown in FIG. 31B, the conductive material for low resistance partial energization zone is applied to the surface in the range including the plurality of low resistance partial energization zone formation regions 95Qf. Using this, the conductive layer 95Qd for the low-resistance partial conducting region is formed.

  Thereafter, in the step of removing the masking layer for low resistance partial energization zone shown in FIG. 31C, the masking layer 95Qm for low resistance partial energization zone is removed. As a result, the low-resistance partial energization region conductive layer 95Qd remains in the range of the low-resistance partial energization region formation scheduled region 95Qf, thereby forming a plurality of low-resistance partial energization regions 95Q.

  Next, in the base road masking layer forming step shown in FIG. 31D, the base road masking layer 95Pm covering the periphery of the base road formation planned area 95Pf with respect to the surface of the base material having the base road formation planned area 95Pf. Form. As a result, only the base path formation scheduled region 95Pf is exposed on the surface of the base material. A plurality of low resistance partial energization sections 95Q are located in the base path formation planned area 95Pf. Of course, some of the plurality of low-resistance partial energization sections 95Q may protrude from the base path formation scheduled area 95Pf.

  Thereafter, in the base road conductive layer forming step shown in FIG. 31 (E), the base road conductive layer is formed on the surface of the base material in the range including the base path formation scheduled region 95Pf using the base road conductive material. 95Pd is formed.

  Further, in the base road masking layer removing step shown in FIG. 31F, the base road masking layer 95Pm is removed. As a result, the base path conductive layer 95Pd remains in the range of the base path formation planned region 95Pf, thereby forming the base path 95P. The sensor structure is completed through the above steps.

  In the above patterning method, if an insulating layer is required in the lower layer of the sensor structure, an insulating layer forming step is executed prior to the low resistance partial conducting area masking layer forming step, and the base on the surface of the base material is An insulating layer may be formed for the path formation planned region 95Pf.

  Next, a patterning method for forming the sensor structure shown in FIG. 29A on the surface of the base material (object to be measured) of the member 30 with sensor structure will be described with reference to FIG.

  First, in the masking layer forming step for low resistance partial energization zones shown in FIG. 32A, a plurality of low resistance partial energization zones are scheduled to be formed on the surface of the base material having a plurality of low resistance partial energization zone formation regions 95Qf. A masking layer 95Qm for the low-resistance partial energization region that covers the periphery of the region 95Qf is formed. As a result, only the plurality of low-resistance partial energization zone formation planned areas 95Qf are exposed.

  Next, in the conductive layer forming step for low resistance partial energization zone shown in FIG. 32 (B), the conductive material for low resistance partial energization zone is applied to the surface in the range including the plurality of low resistance partial energization zone formation regions 95Qf. Using this, the conductive layer 95Qd for the low-resistance partial conducting region is formed.

  Thereafter, in the masking layer removal step for low resistance partial energization zone shown in FIG. 32C, the masking layer 95Qm for low resistance partial energization zone is removed. As a result, the low-resistance partial energization region conductive layer 95Qd remains in the range of the low-resistance partial energization region formation scheduled region 95Qf, thereby forming a plurality of low-resistance partial energization regions 95Q. The sensor structure is completed through the above steps.

  In the above patterning method, the masking layer, the conductive layer, the insulating layer, and the like may be formed by, for example, a vapor deposition method, a liquid phase deposition method, a heating oxide film formation method, a printing method, a coating method, or a foil stamping method. Various techniques such as transfer, etching, etc. can be employed. For example, spray coating (including inkjet), spray coating (including gun spray, air brush, etc.), electrodeposition coating, roller coating, brush coating, and the like can be applied. If roller coating or brush coating is used, the sensor structure can be formed at the construction site.

  Next, referring to FIG. 33, the sensor structure shown in FIG. 1B is formed on the surface of base material (object to be measured) 32 of member 30 with sensor structure using a technique used in a semiconductor process, a MEMS process, or the like. A patterning method to be performed will be described.

  First, in the base path conductive layer forming step shown in FIG. 33A, the base path conductive material is used on the surface of the base material 32 in the range including the base path formation region 95Pf. Layer 95Pd is formed. For this, various vapor deposition methods, coating methods, and the like can be used.

  Next, in the base path masking layer forming step shown in FIG. 33B, a base path masking layer 95Pm that covers only the base path formation planned region 95Pf is formed on the base path conductive layer 95Pd. As a result, the base material surface is exposed to a region other than the base path formation scheduled region 95Pf. This process is so-called photolithography.

  Next, in the base path conductive material removing step shown in FIG. 33C, the base path conductive layer 95Pd in the region other than the base path formation scheduled region 95Pf is removed, thereby forming the base path 95P. This process is so-called etching.

  Thereafter, in the base road masking layer removing step shown in FIG. 33D, the base road masking layer 95Pm to be the photoresist is removed. As a result, the base path 95P is exposed. When the photoresist agent itself has conductivity, the base path masking layer 95Pm may be left as it is.

  Further, in the conductive layer forming step for the low resistance partial energization zone shown in FIG. 33E, the low resistance partial energization is applied to the surface in the range including the plurality of low resistance partial energization zone formation scheduled areas 95Qf overlapping the base path 95P. The conductive layer 95Qd for the low resistance partial energizing section is formed using the section conductive material. For this, various vapor deposition methods, coating methods, and the like can be used.

  Next, in the low resistance partial energization zone masking layer forming step shown in FIG. 33 (F), the low resistance portion covering only the plurality of low resistance partial energization zone formation regions 95Qf with respect to the low resistance partial energization zone conductive layer 95Qd. An energizing zone masking layer 95Qm is formed. As a result, the surface of the conductive layer 95Qd for the low-resistance partial energization zone is exposed to a region other than the plurality of low-resistance partial energization zone formation planned areas 95Qf. A part of the low resistance partial energization zone formation planned area 95Qf may protrude from the base path 95P (base path formation planned area 95Pf). This process is so-called photolithography.

  Thereafter, in the conductive material removing step for low resistance partial energization zone shown in FIG. 33 (G), regions other than the low resistance partial energization zone formation planned area 95Qf in the low resistance partial energization zone conductive layer 95Qd are removed. As a result, a low-resistance partial energization section 95Q is formed. This process is so-called etching. Finally, as shown in FIG. 33 (H), the low-resistance partial conducting area masking layer 95Qm is removed as necessary to expose the low-resistance partial conducting area 95Q. The sensor structure is completed through the above steps.

  Next, referring to FIG. 34, the sensor structure shown in FIG. 1E is formed on the surface of the base material (object to be measured) 32 of sensor-equipped member 30 by using a technique used in a semiconductor process, a MEMS process, or the like. A patterning method will be described.

  First, in the conductive layer forming step for the low resistance partial energization zone shown in FIG. 34A, the surface of the base material in the range including the plurality of low resistance partial energization zone formation regions 95Qf is used. A conductive layer 95Qd for low resistance partial energization region is formed using a conductive material. For this, various vapor deposition methods, coating methods, and the like can be used.

  Next, in the low-resistance partial energization area masking layer forming step shown in FIG. 34B, the low-resistance partial energization area masking layer covering only the energization area formation planned region 95Qf with respect to the low-resistance partial energization area conductive layer 95Qd. Layer 95Qm is formed. As a result, the base material surface is exposed to a region other than the energization zone formation planned region 95Qf. This process is so-called photolithography.

  Next, in the conductive material removal step for the low resistance partial energization region shown in FIG. 34C, the low resistance partial energization region conductive layer 95Qd in the region other than the energization region formation planned region 95Qf is removed, Resistive partial energizing section 95Q is formed. This process is so-called etching.

  Thereafter, in the masking layer removal step for the low resistance partial energization region shown in FIG. 34D, the masking layer 95Qm for the low resistance partial energization region serving as the photoresist is removed. As a result, the low-resistance partial energization section 95Q is exposed. In addition, when the photoresist agent itself has conductivity, the masking layer 95Qm for the low-resistance partial conducting region may be left as it is.

  Further, in the base path conductive layer forming step shown in FIG. 34 (E), the base path conductive material is used for the surface in the range including the base path formation scheduled area 95Pf overlapping the low-resistance partial energization section 95. A base path conductive layer 95Pd is formed. For this, various vapor deposition methods, coating methods, and the like can be used.

  Next, in the base road masking layer forming step shown in FIG. 34F, a base road masking layer 95Pm that covers only the base road formation planned region 95Pf is formed on the base road conductive layer 95Pd. As a result, the area other than the base path formation scheduled area 95Pf is exposed on the surface of the base path conductive layer 95Pd. Note that the low-resistance partial energization region 95Q may protrude from a part of the base path formation scheduled region 95QP. This process is so-called photolithography.

  Thereafter, in the base path conductive material removing step shown in FIG. 34G, the area other than the base path formation planned area 95Pf in the base path conductive layer 95Pd is removed. As a result, the base path 95P is formed. This process is so-called etching. Finally, as shown in FIG. 34H, the base path masking layer 95Pm is removed as necessary to expose the base path 95P. The sensor structure is completed through the above steps.

  Next, referring to FIG. 35, the sensor structure shown in FIG. 29A is replaced with the surface of the base material (object to be measured) of member 30 with sensor structure by using a technique used in a semiconductor process, a MEMS process, or the like. A patterning method to be formed will be described.

  First, in the conductive layer forming step for the low resistance partial energization zone shown in FIG. 35A, the conductive material for the low resistance partial energization zone is applied to the surface of the range including the plurality of low resistance partial energization zone formation regions 95Qf. Using this, the conductive layer 95Qd for the low-resistance partial conducting region is formed.

  Next, in the low resistance partial energization zone masking layer forming step shown in FIG. 35B, the low resistance partial energization zone conductive layer 95Qd is covered with only a plurality of low resistance partial energization zone formation regions 95Qf. A partial energization zone masking layer 95Qm is formed. As a result, regions other than the plurality of low-resistance partial energization zone formation planned regions 95Qf are exposed. This process is so-called photolithography.

  Next, in the conductive material removal step for the low resistance partial conducting region shown in FIG. 35C, the low resistance partial conducting region conductive layer 95Qd in the region other than the conductive region formation planned region 95Qf is removed, thereby reducing the Resistive partial energizing section 95Q is formed. This process is so-called etching.

  Finally, as shown in FIG. 35 (D), the low-resistance partial energization area masking layer 95Qm is removed as necessary to expose the low-resistance partial energization area 95Q. The sensor structure is completed through the above steps.

  Next, a patterning method for forming the sensor structure shown in FIG. 1A on the surface of the base material (object to be measured) 32 of the sensor structure-attached member 30 will be described with reference to FIG. For convenience of explanation, a case where the base material 32 has a narrow surface area is illustrated, but in practice, the base material 32 can be applied to a large area such as wallpaper, a plate material, an inner wall of a tunnel, a bridge girder of a bridge, and the like.

  In the base path forming step shown in FIG. 36A, the base path 95P is formed on the surface of the base material 32 by applying a base path conductive material or the like. Thus, when the base path 95P is formed over the entire base material 32 or in a wide range, the base path masking layer need not be formed.

  Next, in the step of forming a masking layer for low resistance partial energization zones shown in FIG. 36B, a plurality of low resistance partial energization zones are formed on the surface of the base path 95P having the plurality of low resistance partial energization zone formation regions 95Qf. A masking layer 95Qm for the low-resistance partial energization region that covers the periphery of the formation planned region 95Qf is formed. As a result, only the plurality of low-resistance partial energization zone formation planned areas 95Qf are exposed.

  Next, in the conductive layer forming step for low resistance partial energization zone shown in FIG. 36C, the conductive material for low resistance partial energization zone is applied to the surface in the range including the plurality of low resistance partial energization zone formation regions 95Qf. Using this, the conductive layer 95Qd for the low-resistance partial conducting region is formed.

  Thereafter, in the masking layer removal step for low resistance partial energization zone shown in FIG. 36D, the masking layer 95Qm for low resistance partial energization zone is removed. As a result, the low-resistance partial energization region conductive layer 95Qd remains in the range of the low-resistance partial energization region formation scheduled region 95Qf, thereby forming a plurality of low-resistance partial energization regions 95Q. The sensor structure is completed through the above steps.

  With reference to FIG. 37, a patterning method for forming the sensor structure shown in FIG. 1F (C) on the surface of the base material (object to be measured) 32 of the member 30 with sensor structure will be described.

  In the conductive layer forming step for high resistance partial energization zone shown in FIG. 37A, a masking layer 95Tm for high resistance partial energization zone covering the periphery is formed so that a plurality of high resistance partial energization zone formation planned areas 95Tf are exposed. Form.

  Next, in the conductive layer forming step for the high resistance partial energization zone shown in FIG. 37B, the conductive material for the high resistance partial energization zone is used for the range including the plurality of high resistance partial energization zone formation regions 95Tf. To form a conductive layer 95Td for the high-resistance partial energizing section.

  Thereafter, in the masking layer removal step for high resistance partial energization zone shown in FIG. 37C, the masking layer 95Tm for high resistance partial energization zone is removed, and a part of the conductive layer 95Td for high resistance partial energization zone remains. Thus, a plurality of high resistance partial energization sections 95T are formed.

  Next, in the low resistance partial energization zone masking layer forming step shown in FIG. 37 (D), a low resistance partial energization zone masking layer 95Qm covering the periphery of the plurality of low resistance partial energization zone formation regions 95Qf is formed, A plurality of low-resistance partial energization zone formation planned areas 95Qf are exposed. The masking layer 95Qm for the low-resistance partial energization zone also serves as the masking layer 95Tm for the high-resistance partial energization zone, and its location is shifted by a half phase from the arrangement period of the high-resistance partial energization zone 95T. good. In this way, the low-resistance partial energization zone formation planned region 95Qf is positioned so as to suspend the paired high-resistance partial energization zone 95T.

  Next, in the conductive layer forming step for low resistance partial energization zone shown in FIG. 37E, the conductive material for low resistance partial energization zone is used for the range including the plurality of low resistance partial energization zone forming regions 95Qf. Thus, the conductive layer 95Qd for the low resistance partial energizing section is formed.

  Finally, in the masking layer removal step for the low resistance partial energization region shown in FIG. 37 (F), the masking layer 95Qm for the low resistance partial energization region is removed, and a part of the conductive layer 95Qd for the low resistance partial energization region remains. Thus, a plurality of low resistance partial energization sections 95Q are formed. As a result, the high resistance partial energization section 95T and the low resistance partial energization section 95Q can be formed so as to overlap each other.

  Next, with reference to FIG. 38, a method for patterning a sensor structure 500 as shown in FIG. 1B on a base material 32 as a material at a construction site or a construction site will be described.

  In the base road masking layer forming step shown in FIG. 38 (A), for example, a base road masking layer 95Pm covering the periphery of the base path formation planned region 95Pf having a meandering shape is formed on the surface of the base material 32 serving as a wall material. Form. The base road masking layer 95Pm is preferably a peelable seal material. As a result, only the base path formation scheduled region 95Pf is exposed on the surface of the base material.

  Next, in the base road conductive layer forming step shown in FIG. 38 (B), the base road conductive material in a liquid or paste form is applied to the surface of the base material in the range including the base path formation scheduled region 95Pf. The base path conductive layer 95Pd is formed by painting using a brush, a coating roller, spray, ink jet, or the like.

  Thereafter, in the base road masking layer removing step shown in FIG. 38C, the base road masking layer 95Pm is peeled and removed. As a result, the base path conductive layer 95Pd remains in the range of the base path formation planned region 95Pf, thereby forming the base path 95P.

  Further, in the low resistance partial energization zone masking layer forming step shown in FIG. 38 (D), a base path conductive layer 95Pd (a plurality of low resistance partial energization zone formation regions 95Qf within the range of the base path formation planned region 95Pf). Here, on the surface of the completed base path 95P), a masking layer 95Qm for low-resistance partial energization zones that covers the periphery of the plurality of low-resistance partial energization zone formation planned areas 95Qf is formed. It is desirable that the masking layer 95Qm for the low-resistance partial energization zone is also a peelable sealing material. As a result, only the plurality of low-resistance partial energization zone formation planned areas 95Qf are exposed along the base path 95P. In addition, for the sake of simplicity of positioning, a part of the low-resistance partial energization zone formation planned area 95Qf is actively protruded from the completed base path 95P.

  Next, in the conductive layer forming step for the low resistance partial energization zone shown in FIG. 38E, the liquid or paste-like low resistance partial energization zone is applied to the surface in the range including the plurality of low resistance partial energization zone formation regions 95Qf. A conductive layer 95Qd for a low resistance partial conducting region is formed by applying the conductive material using a brush, a coating roller, a spray, an ink jet, or the like.

  Thereafter, in the masking layer removal step for the low resistance partial energization zone shown in FIG. 38 (F), the masking layer 95Qm for the low resistance partial energization zone is removed. As a result, the low-resistance partial energization region conductive layer 95Qd remains in the range of the low-resistance partial energization region formation scheduled region 95Qf, thereby forming a plurality of low-resistance partial energization regions 95Q. The sensor structure 500 is completed through the above steps.

  The embodiments of the present invention are not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

DESCRIPTION OF SYMBOLS 1 Measurement system 10 Building 12 Structure 14 Beam 30 Sensor structure member 32 Base material 40 Male screw body 42 Head 44 Shaft 50 Washer 54 Substrate 91 Electrical insulation layer 92 Current path 92T Upper layer side current path 92U Lower layer side current path 92X First partial energization path 92Y Second partial energization path 95P Base path 95Q Low resistance partial energization section 95T High resistance partial energization section 95U Auxiliary energization section 100 Information collecting device 400A Sensor structure member 400B Sensor structure member 400C Sensor structure member 410A Axis Member 410C Rail member 500 Sensor structure

Claims (11)

A sensor structure having a plurality of high resistance partial energization zones arranged at intervals and a plurality of low resistance partial energization zones arranged to connect the high resistance partial energization zones on the surface of the object to be measured. A patterning method for forming and measuring the object to be measured itself by combining the object to be measured and the sensor structure,
A masking layer forming step for high-resistance partial energization zones that forms a masking layer for high-resistance partial energization zones covering the periphery so that at least a plurality of high-resistance partial energization zone formation planned areas are exposed;
It is executed in a later process than the masking layer forming step for the high resistance partial energization zone, and a high resistance partial energization region conductive material is used for a range including a plurality of the high resistance partial energization zone formation planned areas. A conductive layer forming step for high-resistance partial current-carrying regions that forms a conductive layer for resistance-partial current-carrying regions;
Forming a masking layer for a low-resistance partial energization zone to expose a plurality of low-resistance partial energization zone formation areas by forming a masking layer for a low-resistance partial energization zone covering the periphery of a plurality of low-resistance partial energization zone formation scheduled areas Steps,
It is executed in a later process than the masking layer forming step for the low-resistance partial current-carrying region, and the low-resistance partial current-carrying conductive material is reduced with respect to a range including a plurality of low-resistance partial current-carrying region formation regions. A conductive layer forming step for low-resistance partial energization zone for forming a conductive layer for resistance partial energization zone;
A plurality of high-resistance partial energizations are performed by the high-resistance partial current-carrying conductive layer by removing the masking layer for the high-resistance partial current-carrying region, which is executed after the high-resistance partial current-carrying conductive layer forming step. A masking layer removal step for the high-resistance partial energized section forming the section,
A plurality of the low-resistance partial energizations are performed by the low-resistance partial current-carrying conductive layer by removing the masking layer for the low-resistance partial current-carrying region, which is executed after the low-resistance partial current-carrying conductive layer forming step. A masking layer removal step for the low-resistance partial current-carrying zone forming the zone;
A method for patterning a sensor structure, comprising: The high resistance partial energization zone and the low resistance partial energization zone are formed so as to overlap each other,
The method for patterning a sensor structure according to claim 1. A sensor structure having a base path and a plurality of low-resistance partial energization zones arranged so as to be in contact with the base path is formed on the surface of the object to be measured, and the object to be measured and the sensor structure are combined. A patterning method for converting the object to be measured itself into a sensor,
A base path forming step for forming a base path using a base path conductive material on the surface of the object to be measured;
A low resistance portion that is executed in a later process than the base path forming step and covers the periphery of the plurality of low resistance partial energization zone formation areas with respect to the base path having a plurality of low resistance partial energization zone formation areas. A masking layer forming step for forming a low-resistance partial current-carrying zone by forming a masking layer for the current-carrying region and exposing a plurality of the low-resistance partial current-carrying region formation planned areas;
Conductive material for low-resistance partial energization zone is applied to the base path in a range including a plurality of low-resistance partial energization zone forming regions, which is executed after the low-resistance partial energization zone masking layer forming step. A conductive layer forming step for low-resistance partial energized areas using the step of forming a conductive layer for low-resistance partial energized areas;
A plurality of the low-resistance partial energizations are performed by the low-resistance partial current-carrying conductive layer by removing the masking layer for the low-resistance partial current-carrying region, which is executed after the low-resistance partial current-carrying conductive layer forming step. A masking layer removal step for the low-resistance partial current-carrying zone forming the zone;
A method for patterning a sensor structure, comprising: A sensor structure having a base path and a plurality of low-resistance partial energization zones arranged so as to be in contact with the base path is formed on the surface of the object to be measured, and the object to be measured and the sensor structure are combined. A patterning method for converting the object to be measured itself into a sensor,
For a base path that exposes the base path formation planned area by forming a base path masking layer covering the periphery of the base path formation planned area on the surface of the object to be measured having the base path formation planned area A masking layer forming step;
Conductive layer for base path using a base path conductive material for the surface of the object to be measured in a range including the base path formation scheduled area, which is executed in a process subsequent to the base path masking layer forming step. Forming a conductive layer for base path to form
The base path conductive layer forming step is performed in a later process than the base path conductive layer forming step, and the base path conductive layer having a plurality of low-resistance partial energization zone forming areas within the range of the base path forming planned area Low resistance partial energization zone masking layer forming step of forming a low resistance partial energization zone masking layer covering the low resistance partial energization zone formation planned area and exposing a plurality of the low resistance partial energization zone formation areas When,
The low-resistance partial energization zone is applied to the base-layer conductive layer in a range including a plurality of low-resistance partial energization zone formation regions that are executed after the low-resistance partial energization zone masking layer forming step. A conductive layer forming step for low-resistance partial current-carrying regions that forms a conductive layer for low-resistance partial current-carrying regions using a conductive material;
A base road masking layer removing step that is executed in a later process than the base road conductive layer forming step, and removing the base road masking layer to form the base road by the base road conductive layer;
A plurality of the low-resistance partial energizations are performed by the low-resistance partial current-carrying conductive layer by removing the masking layer for the low-resistance partial current-carrying region, which is executed after the low-resistance partial current-carrying conductive layer forming step. A masking layer removal step for the low-resistance partial current-carrying zone forming the zone;
A method for patterning a sensor structure, comprising:   The insulating layer forming step of forming an insulating layer in a region where the base path is to be formed with respect to the surface of the object to be measured, which is executed before the base path conductive layer forming step. 5. A method for patterning a sensor structure according to 4. A sensor structure having a base path and a plurality of low-resistance partial energization zones arranged so as to be in contact with the base path is formed on the surface of the object to be measured, and the object to be measured and the sensor structure are combined. A patterning method for converting the object to be measured itself into a sensor,
On the surface of the object to be measured having a plurality of low-resistance partial energization zone formation planned areas, a low-resistance partial energization zone masking layer covering the periphery of the plurality of low-resistance partial energization zone formation areas is formed, A step of forming a masking layer for low-resistance partial energization zones to expose a plurality of low-resistance partial energization zone formation planned areas;
The low resistance portion is applied to the surface of the surface of the object to be measured in a range including a plurality of regions where the low resistance partial energization zones are to be formed, which is executed in a later process than the masking layer forming step for the low resistance partial energization zones. A conductive layer forming step for low-resistance partial current-carrying regions that forms a conductive layer for low-resistance partial current-carrying regions using a conductive material for current-carrying regions;
A plurality of the low-resistance partial energizations are performed by the low-resistance partial current-carrying conductive layer by removing the masking layer for the low-resistance partial current-carrying region, which is executed after the low-resistance partial current-carrying conductive layer forming step. A masking layer removal step for the low-resistance partial current-carrying zone forming the zone;
For the surface of the object to be measured having a base path formation scheduled area that is executed in a later process than the masking layer removal step for the low resistance partial conduction area and overlaps with the plurality of low resistance partial conduction area formation planned areas, A base road masking layer forming step of forming a base road masking layer covering the base road formation planned area and exposing the base road formation planned area;
Conductive layer for base path using a base path conductive material for the surface of the object to be measured in a range including the base path formation scheduled area, which is executed in a process subsequent to the base path masking layer forming step. Forming a conductive layer for base path to form
A base road masking layer removing step that is executed in a later process than the base road conductive layer forming step, and removing the base road masking layer to form the base road by the base road conductive layer;
A method for patterning a sensor structure, comprising: An insulating layer forming step is performed in a process preceding the masking layer forming step for the low-resistance partial energization region, and an insulating layer forming step is performed to form an insulating layer in the base path formation scheduled region with respect to the surface of the object to be measured. ,
The method for patterning a sensor structure according to claim 6. A sensor structure having a base path and a plurality of low-resistance partial energization zones arranged so as to be in contact with the base path is formed on the surface of the object to be measured, and the object to be measured and the sensor structure are combined. A patterning method for converting the object to be measured itself into a sensor,
A plurality of low-resistance partial energization zones are formed on the surface of the object to be measured that also serves as the base path by forming a low-resistance partial energization zone masking layer that covers the periphery of the plurality of low-resistance partial energization zone formation planned areas. A masking layer forming step for the low-resistance partial energized section that exposes the section formation planned area;
A low-resistance partial energization zone is applied to the surface of the object to be measured in a range including a plurality of low-resistance partial energization zone formation regions that are executed after the masking layer forming step for the low-resistance partial energization zone. A conductive layer forming step for low-resistance partial energization zone using the conductive material for forming a conductive layer for low-resistance partial energization zone;
A plurality of the low-resistance partial energizations are performed by the low-resistance partial current-carrying conductive layer by removing the masking layer for the low-resistance partial current-carrying region, which is executed after the low-resistance partial current-carrying conductive layer forming step. A masking layer removal step for the low-resistance partial current-carrying zone forming the zone;
A method for patterning a sensor structure, comprising: A sensor structure having a base path and a plurality of low-resistance partial energization zones arranged so as to be in contact with the base path is formed on the surface of the object to be measured, and the object to be measured and the sensor structure are combined. A patterning method for converting the object to be measured itself into a sensor,
A base path conductive layer forming step of forming a base path conductive layer using a base path conductive material on the surface of the object to be measured in a range including a base path formation scheduled area;
A base path masking layer forming step for forming a base path masking layer covering the base path formation planned area and exposing a region other than the base path formation planned area with respect to the base path conductive layer;
By removing regions other than the base path formation planned region in the base path conductive layer, a base path conductive material removing step for forming the base path; and
Conductive material for low-resistance partial current-carrying region, in a range including a plurality of low-resistance partial current-carrying region formation regions that are executed after the base-path conductive material removal step and overlap with the base path A conductive layer forming step for low-resistance partial energized areas using the step of forming a conductive layer for low-resistance partial energized areas;
A plurality of low-resistance partial current-carrying region formation areas are formed by forming a low-resistance partial current-carrying region masking layer that covers a plurality of low-resistance partial current-carrying region formation regions for the low-resistance partial current-carrying conductive layer. A step of forming a masking layer for a low-resistance partial energization zone that exposes a region other than
Conductive material removal step for low-resistance partial energization zones that forms a plurality of the low-resistance partial energization zones by removing regions other than the low-resistance partial energization zone formation scheduled areas in the conductive layer for the low-resistance partial energization zones When,
A method for patterning a sensor structure, comprising: A sensor structure having a base path and a plurality of low-resistance partial energization zones arranged so as to be in contact with the base path is formed on the surface of the object to be measured, and the object to be measured and the sensor structure are combined. A patterning method for converting the object to be measured itself into a sensor,
A low-resistance partial current-carrying region in which a conductive layer for a low-resistance partial current-carrying region is formed on the surface of the object to be measured in a range including a region where a low-resistance partial current-carrying region is planned to be formed Conductive layer forming step,
A plurality of low-resistance partial current-carrying region formation areas are formed by forming a low-resistance partial current-carrying region masking layer that covers a plurality of low-resistance partial current-carrying region formation regions for the low-resistance partial current-carrying conductive layer. A step of forming a masking layer for a low-resistance partial energization zone that exposes a region other than
Conductive material removal step for low-resistance partial energization zones that forms a plurality of the low-resistance partial energization zones by removing regions other than the low-resistance partial energization zone formation scheduled areas in the conductive layer for the low-resistance partial energization zones When,
The base path conductive material is used for a range including a base path formation scheduled region that is executed in a later process than the low resistance partial current-carrying conductive material removing step and overlaps with the plurality of low-resistance partial current-carrying areas. A base path conductive layer forming step for forming a base path conductive layer;
A base path masking layer forming step for forming a base path masking layer covering the base path formation planned area and exposing a region other than the base path formation planned area with respect to the base path conductive layer;
By removing regions other than the base path formation planned region in the base path conductive layer, a base path conductive material removing step for forming the base path; and
A method for patterning a sensor structure, comprising: A sensor structure having a base path and a plurality of low-resistance partial energization zones arranged so as to be in contact with the base path is formed on the surface of the object to be measured, and the object to be measured and the sensor structure are combined. A patterning method for converting the object to be measured itself into a sensor,
A conductive layer for a low-resistance partial energization zone is formed on the surface of the object to be measured that also serves as the base path by using a conductive material for a low-resistance partial energization zone so as to include a region where a low-resistance partial energization zone is to be formed. A conductive layer forming step for the low-resistance partial energization zone;
A plurality of low-resistance partial current-carrying region formation areas are formed by forming a low-resistance partial current-carrying region masking layer that covers a plurality of low-resistance partial current-carrying region formation regions for the low-resistance partial current-carrying conductive layer. A step of forming a masking layer for a low-resistance partial energization zone that exposes a region other than
Conductive material removal step for low-resistance partial energization zones that forms a plurality of the low-resistance partial energization zones by removing regions other than the low-resistance partial energization zone formation scheduled areas in the conductive layer for the low-resistance partial energization zones When,
A method for patterning a sensor structure, comprising:

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