JP2018023054A - Data processing system, data processing method, and program - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to integrate flaw data with no unnecessary dummy flaw pixels remaining, without requiring such a process as developing, in an absolute position (coordinate position), positional information resulting from a relative distance.SOLUTION: An integration target selecting section (205) uses, as integration target flaw data (206), post-flaw data (203) and a step flaw data (204), each of which expresses the position of a flaw pixel by use of a finite relative distance between flaw pixels. In a case where the integration target flaw data (206) is dummy flaw data, an unnecessary dummy flaw determination section (207) determines whether to integrate the dummy flaw data with integration flaw data (109), on the basis of the relative distance of the dummy flaw data and the relative distance of flaw data integrated with the integration data 109 immediately before. In a case where it is determined not to carry out the integration, the dummy flaw data is excluded from the integration target flaw data.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a data processing device, a data processing method, and a program.

  Among a plurality of pixels arranged in an imaging sensor such as a digital camera, there is a pixel that has become a defective pixel (hereinafter referred to as a scratch pixel) that cannot correctly generate pixel data for various reasons. This scratch pixel is an initial scratch pixel (hereinafter, referred to as a process scratch pixel) generated in a manufacturing process or the like, and a late scratch pixel (hereinafter, referred to as a post-scratch pixel) generated after product shipment. And divided into When correcting the image data of these flaw pixels, image processing using flaw data including information indicating the position of the flaw pixel is performed. The position of the scratch pixel included in the scratch data can be expressed by a relative distance between the scratch pixels. However, the number of bits representing the distance value is limited. Therefore, when there is no scratch pixel within the maximum relative distance that can be expressed by the number of bits, a pseudo scratch pixel (hereinafter referred to as a dummy scratch pixel) is sandwiched between the dummy scratch pixel and the scratch pixel. The position of the flawed pixel is represented by the relative distance.

  In addition, the two defect data of the process defect pixel and the subsequent defect pixel may be integrated and handled as one defect data. When two flaw data are integrated into one flaw data, even if the flaw pixel position information (relative distance) included in the flaw data after integration is within the maximum relative distance, the flaw data after integration In some cases, flaw data of dummy flaw pixels before integration may remain in the. To deal with this problem, for example, in the technique described in Patent Document 1, position information based on relative distance is temporarily developed and superimposed on an absolute position (coordinate position), and then converted into position information based on relative distance, thereby eliminating unnecessary dummy scratches. Is not left after integration.

JP 2011-82634 A

  However, in the method described in Patent Document 1, in order to prevent unnecessary dummy scratches from being left after integration, position information represented by a relative distance is temporarily displayed on the pixel array in the image sensor when integrating scratch data. It is necessary to convert to absolute position (coordinate position) information. For this reason, a RAM for holding information expansion at the time of the position information conversion and data after the expansion is necessary.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to make it possible to integrate flaw data without leaving unnecessary dummy flaw pixels without requiring processing for expanding position information based on relative distances to absolute positions (coordinate positions). .

  The present invention provides an integration processing means for integrating first and second flaw data, each representing the position of a defective pixel with a finite relative distance between defective pixels, as the third flaw data, and the third flaw data. When the data is dummy scratch data inserted to relay between defective pixels, based on the relative distance of the dummy scratch data and the relative distance of the third scratch data integrated immediately before, It is determined whether or not dummy scratch data is integrated as the third scratch data, and when it is determined that the dummy scratch data is not integrated, there is an exclusion unit that excludes the dummy scratch data from the third scratch data. And

  According to the present invention, it is possible to integrate flaw data without leaving unnecessary dummy flaw pixels without requiring processing for expanding position information based on relative distances to absolute positions (coordinate positions).

It is a figure which shows the example of schematic structure of the imaging device of this embodiment. It is a figure which shows the structural example of the crack data integration part which concerns on 1st Embodiment. 3 is a flowchart of scratch data integration processing according to the first embodiment. It is a figure which shows the flaw arrangement | positioning before and after integration and the example of flaw data which concern on 1st Embodiment. It is a figure used for description of the flaw data before and behind integration concerning a 1st embodiment. It is a figure which shows the structural example of the crack data integration part which concerns on 2nd Embodiment. It is a flowchart of the flaw data integration process which concerns on 2nd Embodiment. It is a figure which shows the flaw arrangement | positioning before and behind integration and the example of flaw data which concern on 2nd Embodiment. It is a figure used for description of the flaw data before and behind integration concerning a 2nd embodiment.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
<First Embodiment>
FIG. 1 is a diagram illustrating a schematic internal configuration example of an imaging apparatus as an example to which the data processing apparatus of the present invention is applied. The imaging apparatus of the present embodiment can be applied to digital cameras, digital video cameras, various portable terminals such as smartphones and tablet terminals having camera functions, industrial cameras, in-vehicle cameras, medical cameras, and the like.

  In FIG. 1, the imaging apparatus according to the present embodiment includes a lens 101, an image sensor 102, an A / D converter 103, a scratch data generation unit 105, a process scratch data holding unit 111, a scratch data integration unit 108, and an integrated scratch data storage unit. 112 and an image processing unit 110.

  The lens 101 is a lens of an imaging optical system, and forms an optical image of a subject or the like on the imaging sensor of the imaging element 102. The image sensor 102 includes an image sensor composed of a CCD, a CMOS, or the like and its peripheral circuit. The image sensor 102 converts an optical image formed on the image sensor by the lens 101 into an electrical signal (image signal). Output to the A / D converter 103. The A / D converter 103 converts the imaging signal acquired and supplied by the imaging element 102 into digital image data (hereinafter referred to as image data 104). The image data 104 output from the A / D converter 103 is sent to the image processing unit 110 and the flaw data generation unit 105.

  Here, a plurality of pixels are two-dimensionally arranged in the image sensor of the image sensor 102, and some of these pixels are defective pixels (scratch pixels) that cannot generate pixel data correctly. is there. The scratch pixel includes, for example, a first scratch pixel (post-scratch pixel) that occurs later due to external factors such as cosmic rays and electrostatic breakdown after shipment of the product and a change with time, a manufacturing process of the image sensor, and the like. There is a second scratch pixel (process scratch pixel) generated in the initial stage. Further, since the process defect pixel is a defect pixel generated in the manufacturing process or the like, the position of the defect pixel, the state and type of the defect pixel, and the like are known in advance by inspection before shipping the product.

  The flaw data generation unit 105 generates first flaw data (hereinafter, referred to as rear flaw data 106) that is flaw data of a rear flaw pixel from the image data 104. Specifically, the scratch data generation unit 105 is a pixel whose signal level is significantly different from the surrounding pixels (for example, the signal level difference between the surrounding pixels exceeds the threshold) in each pixel data of the image data 104. Are detected as post-scratch pixels. Then, the scratch data generation unit 105 generates post-scratch data 106 corresponding to the detected post-scratch pixel.

  The post-scratch data 106 is data including information such as the position and type of the scratch pixel, parameters such as ISO sensitivity, shutter speed, and temperature in addition to the position information of the scratch pixel in the image sensor. In the present embodiment, the position information of a scratch pixel is expressed by a relative distance between defective pixels (between scratch pixels). Further, the relative distance between the scratch pixels is information corresponding to the number of read pixels when each pixel data is read from the imaging sensor in a predetermined direction and order such as a raster scan order. That is, among the pixels that are sequentially read out from the imaging sensor in the raster scan order, the number of pixels between a certain scratch pixel and the next scratch pixel is information indicating the relative distance between the scratch pixels. However, in actuality, the number of bits used to represent the value of the relative distance (number of pixels) is limited, and therefore, the relative distance between flaw pixels can also represent only a finite distance. For example, when the distance is represented by 16-bit data, the range that can be represented by the 16-bit is a finite range of “0 to 65535”, and the relative distance can be represented only within the finite range. Therefore, when the relative distance between scratch pixels exceeds a finite range, for example, a dummy scratch pixel serving as a relay point is inserted between the scratch pixels so that the relative distance between the scratch pixels exceeds the finite range. I am trying not to. Hereinafter, the defect data of the dummy defect pixel is referred to as dummy defect data. The flaw data generation unit 105 sends the flaw data 106 generated as described above (including dummy flaw data if it is inserted) to the flaw data integration unit 108.

  The process flaw data holding unit 111 is made of, for example, a nonvolatile memory, and holds second flaw data (hereinafter referred to as process flaw data 107) that is flaw data of known process flaw pixels generated in a manufacturing process or the like. doing. In the process scratch data 107, as in the case of the post-scratch data 106 described above, the position of the scratch pixel is expressed as a relative distance corresponding to the number of pixels between the scratch pixels. Also, in the process scratch data 107, as in the case of the post-scratch data 106, when the relative distance between the scratch pixels exceeds a finite range, a dummy scratch pixel serving as a relay point is inserted between the scratch pixels, The relative distance between flawed pixels is set within a finite range. The process flaw data holding unit 111 holds process flaw data 107 (including dummy flaw data when it is inserted) including the position (relative distance information) of the process flaw pixels.

  The flaw data integration unit 108 is supplied with the post-flaw data 106 output from the flaw data generation unit 105 and the process flaw data 107 read from the process flaw data holding unit 111. Then, the flaw data integration unit 108 integrates (merges) the subsequent flaw data 106 and the process flaw data 107 to generate third flaw data (hereinafter referred to as integrated flaw data 109). Note that flaw data integration (merging) in the present embodiment is to generate flaw data that combines both the flaw data 106 and the process flaw data 107. However, in the case of this embodiment, although details will be described later, the scratch data integration unit 108, when the scratch data to be integrated is dummy scratch data, dummy scratch data that does not require the dummy scratch data. It is determined whether or not. If the flaw data integration unit 108 determines that the dummy flaw data is unnecessary dummy flaw data, the flaw data integration unit 108 excludes the dummy flaw data from the objects to be integrated as the integrated flaw data 109. A more detailed configuration and operation of the scratch data integration unit 108 will be described later. The integrated flaw data 109 generated by the flaw data integration unit 108 in this way is sent to the integrated flaw data holding unit 112 and held therein.

In response to a request from the image processing unit 110, the integrated scratch data holding unit 112 reads the stored integrated scratch data 109 and supplies it to the image processing unit 110.
The image processing unit 110 uses the integrated defect data 109 read from the integrated defect data holding unit 112 to perform a defect correction process on the defect pixels of the image data 104. Specifically, the image processing unit 110 determines the position of the scratch pixel (pixel data of the scratch pixel in the image data 104) based on the position information (relative distance information) included in the integrated scratch data 109. Identify. Further, the image processing unit 110 uses the information on parameters such as the state and type of the scratch pixel, ISO sensitivity, shutter speed, and temperature included in the integrated scratch data 109 to perform scratch interpolation processing on the scratch pixel. Determine whether to do it. When the image processing unit 110 determines to perform the scratch interpolation process on the specified scratch pixel, the image processing unit 110 performs a scratch correction process on the pixel data of the scratch pixel. Specifically, the image processing unit 110 uses pixel data of pixels around the flaw pixel (pixel data of normal pixels around the flaw pixel) among the pixels two-dimensionally arranged in the imaging sensor. Then, a defect correction process is performed so as to interpolate the defect pixel. The image data that has been subjected to image processing such as flaw correction by the image processing unit 110 in this way is sent to a display unit, encoding unit, recording unit, and the like (not shown). The description of the display unit, encoding unit, recording unit, etc. will be omitted.

FIG. 2 is a diagram showing a detailed configuration example of the scratch data integration unit 108 in FIG.
The flaw data integration unit 108 includes a distance update unit 201, a distance comparison unit 202, an integration target selection unit 205, and an unnecessary dummy flaw determination unit 207.

  The distance update unit 201 receives the post-scratch data 106 generated by the above-described scratch data generation unit 105 and the process scratch data 107 read from the process scratch data holding unit 111. Although details will be described later, the distance update unit 201 determines whether the relative distance included in the post-scratch data 106 or the relative distance included in the process scratch data 107 is based on the relative distance comparison result by the distance comparison unit 202. The update process is performed for it. Details of the relative distance information update processing in the distance update unit 201 will be described later. After any one of the relative distances is updated by the distance update unit 201, the scratch data 203 and the process scratch data 204 are sent to the integration target selection unit 205 and the distance comparison unit 202.

  The distance comparison unit 202 compares the relative distance included in the post-scratch data 203 supplied from the distance update unit 201 with the relative distance included in the process scratch data 204. Details of the relative distance comparison processing in the distance comparison unit 202 will be described later. The distance comparison unit 202 sends information on the comparison results of the relative distances to the integration target selection unit 205 and the unnecessary dummy scratch determination unit 207, and feeds back the information to the distance update unit 201.

  The integration target selection unit 205 appropriately selects the post-scratch data 203 and the process scratch data 204 supplied from the distance update unit 201 based on the information of the comparison result from the distance comparison unit 202 and outputs it as the integration target scratch data 206. To do. In the present embodiment, the integration target selection unit 205 corresponds to an integration processing unit, and the integrated scratch data 109 output from the scratch data integration unit 108 is generated by the integration target scratch data 206 selected by the integration target selection unit 205. Will be. However, in the case of this embodiment, when the integration target scratch data 206 selected from the integration target selection unit 205 is dummy scratch data, an unnecessary dummy scratch determination unit 207 to be described later uses the dummy scratch data that does not require the dummy scratch data. It is determined whether it is data. Details of the selection process of the integration target scratch data 206 in the integration target selection unit 205 will be described later. The integration target scratch data 206 selected by the integration target selection unit 205 is sent to the unnecessary dummy scratch determination unit 207.

  The unnecessary dummy scratch determination unit 207, after the integration target scratch data 206 is integrated based on the information of the comparison result by the distance comparison unit 202 and the information included in the integration target scratch data 206 selected by the integration target selection unit 205. It is determined whether the data is unnecessary dummy scratch data. When the unnecessary dummy flaw determination unit 207 determines that the integration target flaw data 206 is unnecessary dummy flaw data, the unnecessary dummy flaw data 206 excludes the integration target flaw data 206 (dummy flaw data) from the integration target flaw data. Details of the determination process in the unnecessary dummy defect determination unit 207 and the process of excluding unnecessary dummy defect data will be described later. All the integration target flaw data that has not been excluded by the unnecessary dummy flaw determination unit 207 is output from the flaw data integration unit 108 in FIG. 2 as the integrated flaw data 109 and held in the integrated flaw data holding unit 112 in FIG. .

  FIG. 3 is a flowchart of processing performed by the scratch data integration unit 108 shown in FIG. The processing illustrated in the flowchart of FIG. 3 may be realized by, for example, the CPU executing the program according to the present embodiment. The program according to the present embodiment may be prepared in advance in a ROM (not shown), for example, or read from an external storage medium (not shown) or downloaded from a network such as the Internet (not shown). You may load to RAM etc. which are not illustrated. The same applies to other flowcharts described later. Note that steps S301 to S314 of each process in FIG. 3 are abbreviated as S301 to S314. In the following description, the back scratch data 106 (203) is the scratch data A, the relative distance is the relative distance a, the process scratch data 107 (204) is the scratch data B, the distance information is the relative distance b, and the integrated scratch. The data 109 is set as scratch data M.

  When the scratch data A (post-scratch data 106) and the scratch data B (process scratch data 107) are input in S301, the scratch data integration unit 108 receives the scratch data A and B via the distance update unit 201. The data is sent to the distance comparison unit 202. After S301, the scratch data integration unit 108 proceeds to S302.

  In S302, the distance comparison unit 202 compares the relative distance a of the scratch data A with the relative distance b of the scratch data B, and determines whether the relative distance a is equal to or less than the relative distance b. When the distance comparison unit 202 determines that the relative distance a is equal to or less than the relative distance b (Yes), the process of the scratch data integration unit 108 proceeds to S303. On the other hand, when the distance comparison unit 202 determines that the relative distance a is greater than the relative distance b (No), the process of the scratch data integration unit 108 proceeds to S304. S 303 and S 304 are processes performed by the integration target selection unit 205.

  In S303, the integration target selection unit 205 selects the scratch data A as the integration target scratch data, while in S304, the integration target selection unit 205 selects the scratch data B as the integration target scratch data. After these S303 and S304, the scratch data integration unit 108 proceeds to S305. S305 is processing performed by the unnecessary dummy scratch determination unit 207.

  In S305, the unnecessary dummy scratch determination unit 207 determines whether the comparison result by the distance comparison unit 202 is the same distance (the same distance) between the relative distance a and the relative distance b. If the relative distance a and the relative distance b are equal (Yes), the unnecessary dummy scratch determination unit 207 advances the process to S308. On the other hand, if the relative distance a and the relative distance b are different (No), the unnecessary dummy scratch determination unit 207 advances the process to S306.

  In S306, the unnecessary dummy scratch determination unit 207 determines whether or not the integration target scratch data selected in S303 or S304 is dummy scratch data. The unnecessary dummy scratch determination unit 207 proceeds to S307 when the integration target scratch data is dummy scratch data (Yes), and proceeds to S308 when it is not dummy scratch data (No).

  In S307, the unnecessary dummy scratch determination unit 207 discards the integration target scratch data selected in S303 or S304 (that is, dummy scratch data) without outputting the integration target scratch data. After S307, the scratch data integration unit 108 advances the process to S309.

  In S308, the unnecessary dummy flaw determination unit 207 outputs the integration target flaw data selected in S303 or S304 (that is, flaw data that is not dummy flaw data) while leaving it as integration target flaw data. After S308, the scratch data integration unit 108 advances the process to S309.

  In S309, the scratch data integration unit 108 determines whether the integration processing for all the scratch data A and B is completed. If the scratch data integration unit 108 determines that the integration processing for all the scratch data A and B has been completed (Yes), the processing of the flowchart of FIG. 3 ends. On the other hand, if the flaw data integration unit 108 determines that the integration process for all the flaw data A and B has not been completed (no flaw data still remains) (No), the process proceeds to S310. S310 is a process performed by the distance update unit 201.

  In S310, the distance update unit 201 determines whether the relative distance a is equal to or less than the relative distance b based on the comparison result by the distance comparison unit 202. If the relative distance a is equal to or less than the relative distance b (Yes), the distance update unit 201 advances the process to S311. On the other hand, if the relative distance a is greater than the relative distance b (No), the distance update unit 201 advances the process to S313.

  In S <b> 311, the distance update unit 201 updates the relative distance of the scratch data that has not been selected as the integration target in S <b> 302 to S <b> 304 by a value obtained by subtracting the relative distance of the scratch data selected as the integration target. That is, when the process proceeds to S311, the flaw data that is not selected as the integration target because the relative distance is large is the flaw data B, while the integration target flaw data that is selected because the relative distance is small is the flaw data A. It is. Accordingly, the distance updating unit 201 in this case updates the value of the relative distance b of the scratch data B by a value obtained by subtracting the value of the relative distance a of the scratch data A. After S311, the scratch data integration unit 108 advances the process to S312. In S <b> 312, the scratch data integration unit 108 receives the next scratch data (in this case, the next scratch data A), and sends the scratch data A to the distance comparison unit 202 via the distance update unit 201. After S312, the scratch data integration unit 108 returns to the process of S302.

  In S313, the distance update unit 201 updates the relative distance of the scratch data that has not been selected as the integration target in S302 to S304 with a value obtained by subtracting the relative distance of the scratch data selected as the integration target. That is, when the process proceeds to S313, it is the scratch data A that has not been selected as the integration target, and the selected integration target scratch data is the scratch data B. Accordingly, the distance update unit 201 in this case updates the value of the relative distance a of the scratch data A by a value obtained by subtracting the relative distance b of the scratch data B. After S313, the scratch data integration unit 108 advances the process to S314. In S <b> 314, the scratch data integration unit 108 receives the next scratch data (in this case, the next scratch data B), and sends the scratch data B to the distance comparison unit 202 via the distance update unit 201. After S314, the scratch data integration unit 108 returns to the process of S302.

  Note that the processes of S305 and S306 may be interchanged. In this case, in S305, it is determined whether the integration target scratch data is dummy scratch data, and in S306, it is determined whether the relative distance a and the relative distance b are equal. In S305, if it is determined that the integration target scratch data is dummy scratch data, the process proceeds to S306. On the other hand, if it is determined that the integration target scratch data is not dummy scratch data, the process proceeds to S308. If the relative distance a and the relative distance b are equal in S306, the process proceeds to S308, and if they are not equal (different), the process proceeds to S307.

4A and 4B are diagrams illustrating an example of the state of scratch data before and after the integration process performed by the scratch data integration unit 108. FIG.
4A shows the position of the scratch pixel xA of the scratch data A, the position of the scratch pixel xB of the scratch data B, and the integrated scratch of the integrated scratch data M in a state corresponding to the two-dimensional pixel arrangement of the image sensor. An example of the positions of the pixels xA and xB is shown. In addition, the example of FIG. 4A includes the position of the dummy defect pixel d of the dummy defect data.

  FIG. 4B shows an example of scratch data corresponding to each of the scratch pixels xA, xB, and d of the scratch data A, the scratch data B, and the integrated scratch data M. For example, in the scratch data “03_A” in FIG. 4B, the type of the scratch pixel is a post-scratch pixel, and the relative distance a is the number of pixels between the scratch pixel read immediately before in the raster scan order described above. The distance is equivalent to 3 ″. Similarly, for example, the scratch data “01_B” in FIG. 4B has a scratch pixel type of process scratch pixel and a relative distance b between the scratch pixel read immediately before in the raster scan order described above. This indicates a distance corresponding to the number of pixels “1”. For example, in the scratch data “15_D” in FIG. 4B, the scratch pixel type is a dummy scratch pixel, and the relative distance is the number of pixels “15” with respect to the scratch pixel read immediately before in the raster scan order. The distance is equivalent to. The same applies to the other scratch data. Note that the relative distance of the first scratch pixel in the raster scan order described above is represented by the distance from the first pixel (the pixel of the start point coordinate) read in the raster scan order.

  As shown in FIGS. 4A and 4B, the flaw pixels xA, xB, and d of the integrated flaw data M are a flaw pixel xA of the flaw data A, a flaw pixel xB of the flaw data B, and a dummy. The dummy defect pixel d of the defect data is integrated.

5 (a) to 5 (c) show examples of the flaw data shown in FIG. 4 (a) and FIG. 4 (b), and the relative distance information update processing performed by the flaw data integration unit 108 is illustrated. It is a figure used for description of an example.
5A is an example of scratch data corresponding to each scratch pixel of the scratch data A, FIG. 5B is a scratch data example corresponding to each process scratch pixel of the scratch data B, and FIG. 5C is an integration. An example of scratch data corresponding to each integrated scratch pixel of the scratch data M is shown. Each flaw data includes flaw data corresponding to the dummy flaw pixel of the dummy flaw data. The order of arrangement of the flaw data in FIGS. 5A to 5C corresponds to the raster scan order described above. For example, the scratch data “03_A”, “01_B”, “15_D”, and the like in FIGS. 5A to 5C are the same as those described with reference to FIG.

  In the scratch data integration unit 108, first, the distance comparison unit 202 compares the relative distance of the scratch data 501 at the head of the scratch data A and the relative distance of the scratch data 502 at the head of the scratch data B. Then, as a result of the comparison by the distance comparison unit 202, the scratch data integration unit 108 selects the scratch data having a smaller (shorter) relative distance as the integration target scratch data by the integration target selection unit 205. In the examples of FIGS. 4A, 4B, and 5A to 5C, the scratch data 501 (03_A) at the head of the scratch data A has a relative distance value of “03” ( Distance corresponding to the number of pixels “3”). On the other hand, the first scratch data 502 (01_B) of the scratch data B has a relative distance value of “01” (a distance corresponding to the number of pixels “1”). When these relative distances are compared, the scratch data 502 (01_B) has the smaller relative distance. Therefore, in the scratch data integration unit 108, the integration target selection unit 205 selects the scratch data 502 (01_B) of the scratch data B as the integration target scratch data. Further, the scratch data 502 selected as the integration target scratch data is the scratch data B and not the dummy scratch data. For this reason, the unnecessary dummy scratch determination unit 207 outputs the scratch data 502 as the integrated scratch data M. Thereby, the first flaw data of the integrated flaw data M becomes flaw data 502 (01_B).

  Next, the flaw data integration unit 108 reads the next flaw data in the raster scan order for the side selected as the integration target (in this case, the flaw data B side). That is, in the example of FIGS. 4A, 4B, and 5B, the next scratch data 504 in the raster scan order in the scratch data B selected as the integration target is the scratch data “05_B”. Become. On the other hand, the scratch data integration unit 108 calculates the difference value between the relative distance of the scratch data on the side not selected as the integration target (in this case, the scratch data A side) and the relative distance of the scratch data selected as the integration target. Update with In this example, the flaw data 501 (03_A) of the flaw data A that is not selected as the integration target has a relative distance value of “03”, and the flaw data 502 (01_B) of the flaw data B that is selected as the integration target is relative. The distance value is “01”. The difference between the relative distance value “03” of the scratch data 501 (03_A) and the relative distance value “01” of the scratch data 502 (01_B) is “03” − “01” = “02”. . Therefore, in the scratch data A on the side not selected as the integration target, the next scratch data 503 in the raster scan order is updated to the scratch data “02_A”.

  Thereafter, the same processing is repeated, and for example, the process proceeds to a stage where the relative distance of the scratch data 505 (13_A) of the scratch data A and the relative distance of the scratch data 506 (00_D) of the scratch data B is compared by the distance comparison unit 202. Suppose. In the example of FIGS. 5A and 5B, the relative distance value of the scratch data 505 (13_A) is “13”, and the relative distance value of the scratch data 506 (00_D) is “00”. Therefore, the integration target selection unit 205 selects the scratch data 506 (00_D) as the integration target scratch data. The relative distance values of the scratch data 505 (13_A) and the scratch data 506 (00_D) are “13” and “00”, which are not equal. However, the scratch data 506 is dummy scratch data “00_D” although it is selected as the integration target scratch data by the integration target selection unit 205. Therefore, in this case, the unnecessary dummy scratch determination unit 207 discards the dummy scratch data “00_D” without integrating them, and sets the output 507 as “no output”.

  Thereafter, as described above, the flaw data integration unit 108 reads the next flaw data in the raster scan order for the side not selected as the integration target (in this case, the flaw data B side). In other words, in the flaw data B on the side selected as the integration target, the next flaw data 509 in the raster scan order becomes flaw data “15_B”. On the other hand, the scratch data integration unit 108 determines that the scratch data 508 of the scratch data A that has not been selected as the integration target is a difference from the relative distance value “00” of the scratch data 506 (00_D) on the side selected as the integration target. (13−00 = 13) is used as updated data. In this example, the value of the relative distance of the scratch data 505 of the scratch data A not selected as the integration target is “13”, and the value of the relative distance of the scratch data 506 of the scratch data B selected as the integration target is “ 00 ". Therefore, in the scratch data A on the side not selected as the integration target, the next scratch data 508 in the raster scan order becomes the scratch data “13_A”. Since the subsequent steps are the same as described above, the description thereof is omitted.

  As described above, in the first embodiment, the flaw pixel position of the image sensor is represented by the relative distance between the flaw pixels, and when the relative distance between the flaw pixels exceeds a finite range that can be represented by a predetermined number of bits, A dummy scratch pixel that can be expressed by a relative distance within a finite range is inserted. Further, the imaging apparatus of the present embodiment selects the integration target scratch data based on the comparison result of the relative distance between the scratch data A and the scratch data B, and further determines whether the integration target scratch data is dummy scratch data. The imaging apparatus according to the present embodiment does not integrate the dummy scratch data as the integrated scratch data M when the relative distance between the scratch data A and the scratch data B is not equal and the integration target scratch data is dummy scratch data. I am trying to destroy it. As a result, in the imaging apparatus of the present embodiment, for example, it is possible to integrate defect data without leaving unnecessary dummy defect pixels without requiring processing that expands position information based on relative distances to absolute positions (coordinate positions). It has become.

<Second Embodiment>
Hereinafter, the second embodiment will be described. Note that, in the second embodiment, the schematic configuration of the imaging apparatus is the same as that in FIG. 1, and a description thereof will be omitted.
In the second embodiment, when the dummy scratch data is discarded, the relative distance information is updated based on the scratch pixel position immediately before the dummy scratch data is discarded, which is different from the first embodiment. .

  FIG. 6 is a diagram illustrating a detailed configuration example of the flaw data integration unit 108 in the case of the second embodiment. In FIG. 6, the same reference numerals as those in FIG. 2 are assigned to components that are substantially the same as those in FIG. For example, the distance update unit 201, the distance comparison unit 202, the integration target selection unit 205, the unnecessary dummy scratch determination unit 207, the post-scratch data 106 and 203, the process scratch data 107 and 204, the integration scratch data 206, and the integrated scratch data 109 are This is the same as the example of FIG.

  In the example of FIG. 6, when the unnecessary dummy scratch determination unit 207 determines that the integration target scratch data 206 is unnecessary dummy scratch data and is discarded, the distance information holding unit 601 deletes the integration target scratch data 206 (dummy scratch data). Data) contains relative distance information.

  The distance adjustment unit 602 uses the relative distance information held in the distance information holding unit 601 (the information on the relative distance of the dummy flaw data discarded by the unnecessary dummy flaw determination unit 207) to determine the relative of the integration target flaw data 206. Adjust the distance. Specifically, the distance adjustment unit 602 compares the relative distance value of the integration target scratch data 206 with respect to the relative distance value (that is, the dummy scratch data of the dummy scratch data stored in the distance information storage unit 601 in the previous integration process). Adjustment processing is performed such that the value of the relative distance is added. Here, although the adjustment process of adding the value of the relative distance of the scratch data discarded immediately before is given as an example, other adjustment methods may be used. In the case of the second embodiment, the integration target scratch data 603 after the relative distance is adjusted by the distance adjustment unit 602 is supplied to the unnecessary dummy scratch determination unit 207.

  FIG. 7 is a flowchart of processing performed by the flaw data integration unit 108 according to the second embodiment. In the flowchart of FIG. 7, the processes of S301 to S314 are the same as the processes of S301 to S314 of the flowchart of FIG.

  In the case of the second embodiment, the unnecessary dummy scratch determination unit 207 determines in S306 that the integration target scratch data is dummy scratch data. If the dummy scratch data is discarded in S307, the process proceeds to S701. In step S <b> 701, the unnecessary dummy scratch determination unit 207 causes the distance information holding unit 601 to hold information on the relative distance of the dummy scratch data.

  In the scratch data integration unit 108 of the second embodiment, after S303 and S304, the process proceeds to S702. The process of S702 is a process performed in the distance adjustment unit 602. In step S <b> 702, the distance adjusting unit 602 has made no output (no output 507 as illustrated in FIG. 5C above) in the previous integration process based on the information held in the distance information holding unit 601. Judge whether or not. That is, if relative distance information is held in the distance information holding unit 601, it can be determined that the previous integration process has not been output. Then, the distance adjustment unit 602 advances the process to S703 when the previous integration process is no output (Yes). On the other hand, when there is an output (No), the process of the scratch data integration unit 108 proceeds to the process of S305 described above.

  In S703, the distance adjustment unit 602 adds the relative distance value held in the distance information holding unit 601 to the relative distance of the integration target scratch data, and then advances the process to S308. The subsequent processing is the same as that of the flowchart of FIG.

  FIGS. 8A and 8B are diagrams illustrating an example of the state of scratch data before and after the integration process performed by the scratch data integration unit 108 in the second embodiment. FIG. 8A shows the scratch pixel xA of the scratch data A, the scratch pixel xB of the scratch data B, the integrated scratch pixels xA and xB of the integrated scratch data M, and the dummy scratch data, as in FIG. 4A. An example of the position of the dummy scratch pixel d is shown. FIG. 8B shows an example of scratch data corresponding to each of the scratch pixels xA, xB, and d of the scratch data A, the scratch data B, and the integrated scratch data M, as in FIG. 4B. Yes.

  Also in the second embodiment, the scratch pixels xA, xB, and d of the integrated scratch data M shown in FIGS. 8A and 8B are the scratch pixel xA and the scratch data of the scratch data A as described above. The B flaw pixel xB and the dummy flaw pixel d of the dummy flaw data are integrated. Since each flaw pixel xA, xB, d and each flaw data are the same as those described with reference to FIGS. 4A and 4B, detailed description thereof is omitted.

  FIG. 9A to FIG. 9C show the relative distances performed by the flaw data integration unit 108 of the second embodiment in the flaw data example shown in FIG. 8A and FIG. 8B. It is a figure used for description of an example of an adjustment process and an update process. FIG. 9A shows an example of scratch data corresponding to each scratch pixel of the scratch data A, similarly to the above-described FIG. 9B shows an example of scratch data corresponding to each process scratch pixel of the scratch data B, as in FIG. 5B, and FIG. 9C shows a scratch data example similar to FIG. An example of flaw data corresponding to each integrated flaw pixel of the integrated flaw data M is shown. Each flaw data includes flaw data corresponding to the dummy flaw pixel of the dummy flaw data.

  In the example of FIGS. 9A to 9C, for example, the relative distance of the scratch data 901 (13_D) of the scratch data A and the relative distance of the scratch data 902 (15_D) of the scratch data B by the distance comparison unit 202. It is assumed that the process has been advanced to the stage where the comparison is made. In this example, the scratch data 901 (13_D) of the scratch data A and the scratch data 902 (15_D) of the scratch data B are both dummy scratch data. In this example, since the relative distance value of the scratch data 901 (13_D) is “13” and the relative distance value of the scratch data 902 (15_D) is “15”, the integration target selection unit 205 selects the scratch. Data 901 (13_D) is selected as integration target scratch data. However, the scratch data 901 (13_D) is dummy scratch data, and the relative distance of the scratch data 901 (13_D) is different from the relative distance of the scratch data 902 (15_D). For this reason, in the unnecessary dummy scratch determination unit 207, the scratch data 901 (13_D) is discarded and no output 903 is set. Here, in the case of the second embodiment, the unnecessary dummy scratch determination unit 207 sends the information of the relative distance value “13” of the discarded dummy scratch data (scratch data 901 (13_D)) to the distance information holding unit 601. Hold.

  As the next integration process, the scratch data integration unit 108 compares the relative distance of the scratch data 904 (04_A) of the scratch data A with the relative distance of the scratch data 905 (02_D) of the scratch data B by the distance comparison unit 202. Done. In this case, since the relative distance value of the scratch data 904 (04_A) is “04” and the relative distance value of the scratch data 905 (02_D) is “02”, the integration target selection unit 205 selects the scratch data 905 ( 02_D) is selected as the integration target scratch data. However, in this case, the flaw data is discarded in the immediately preceding integration process, and no output 903 is obtained. Therefore, the distance adjustment unit 602 compares the relative distance value “13” of the scratch data 901 (13_D) held in the distance information holding unit 601 immediately before the relative distance value “02” of the scratch data 905 (02_D). The value obtained by adding “15” is used as information on the relative distance. Thereby, the new scratch data “15_D” in which the relative distance of the scratch data 905 (02_D) is adjusted to the value “15” is sent from the distance adjustment unit 602 to the unnecessary dummy scratch determination unit 207 as the integration target scratch data. . The unnecessary dummy scratch determination unit 207 at this time outputs the integration target scratch data 906 (15_D) after the relative distance is adjusted by the distance adjustment unit 602 as the integrated scratch data M.

  Thereafter, it is assumed that the distance comparison unit 202 has advanced to a stage where the relative distance between the scratch data 907 (12_A) of the scratch data A and the relative distance of the scratch data 908 (13_D) of the scratch data B is compared. In the immediately preceding integration process, the scratch data is discarded and no output is output, and the distance information holding unit 601 holds, for example, the value “02” of the scratch data 909 (02_D) as the previous distance information. And In this example, since the relative distance of the scratch data 907 (12_A) is “12” and the relative distance of the scratch data 908 (13_D) is “13”, the integration target selection unit 205 selects the scratch data 907 (12_A). Are selected as integration target scratch data. In the case of this example, the flaw data is discarded in the previous integration process, and no output is made. Therefore, the distance adjustment unit 602 compares the relative distance value “12” of the scratch data 907 (12_A) with respect to the relative distance value “02” of the scratch data 909 (02_D) held in the distance information holding unit 601 immediately before. The value obtained by adding “14” is used as information on the relative distance. Thereby, the new scratch data “14_A” in which the relative distance of the scratch data 907 (12_A) is adjusted to the value “14” is sent from the distance adjustment unit 602 to the unnecessary dummy scratch determination unit 207 as the integration target scratch data. . The unnecessary dummy scratch determination unit 207 at this time outputs the integration target scratch data 910 (14_A) after the relative distance adjustment by the distance adjustment unit 602 is performed as the integrated scratch data M. The description after this is omitted.

  As described above, in the second embodiment, when the dummy scratch data is discarded during the integration process, the information on the relative distance of the dummy kiss data is retained, and the retained information is used. Next, the information on the relative distance of the selected integration target scratch data is adjusted. As a result, according to the second embodiment, not only the defect data can be integrated without leaving unnecessary dummy defect pixels, but also the integrated defect data can be generated in consideration of the relative distance of the discarded dummy defect data. It becomes possible.

<Other embodiments>
The present invention supplies a program that realizes one or more functions of the above-described embodiments to a system or apparatus via a network or a storage medium, and one or more processors in a computer of the system or apparatus read and execute the program This process can be realized. It can also be realized by a circuit (for example, ASIC) that realizes one or more functions.

  The above-described embodiments are merely examples of implementation in carrying out the present invention, and the technical scope of the present invention should not be construed as being limited thereto. That is, the present invention can be implemented in various forms without departing from the technical idea or the main features thereof.

  102 Image sensor, 105 Scratch data generation unit, 108 Scratch data integration unit, 110 Image processing unit, 201 Distance update unit, 202 Distance comparison unit, 205 Integration target selection unit, 207 Unnecessary dummy scratch determination unit, 601 Distance information holding unit, 602 Distance adjustment unit

Claims (13)

Integrated processing means for integrating the first and second flaw data, each representing the position of the defective pixel with a finite relative distance between the defective pixels, as third flaw data;
When the third flaw data is dummy flaw data inserted to relay between defective pixels, the relative distance of the dummy flaw data and the relative distance of the third flaw data integrated immediately before And determining whether to integrate the dummy flaw data as the third flaw data, and if it is determined not to integrate, an excluding means for excluding the dummy flaw data from the third flaw data;
A data processing apparatus comprising: The first flaw data is flaw data in which the position of a defective pixel detected from an image input from an image sensor is represented by the relative distance.
The data processing apparatus according to claim 1, wherein the second flaw data is flaw data in which a position of a known defective pixel is represented by the relative distance. Comparing means for comparing the relative distance of the first scratch data and the relative distance of the second scratch data;
The integrated processing means selects, based on the comparison result, the scratch data having the smaller relative distance value from the first scratch data and the second scratch data, and the third scratch data. The data processing apparatus according to claim 1, wherein:   If the relative distance of the first flaw data is equal to the relative distance of the second flaw data as a result of the comparison, the exclusion unit determines that the selected flaw data is the dummy flaw data. Even so, it is not excluded from the third flaw data.   When the relative distance of the first scratch data is different from the relative distance of the second scratch data, the exclusion means is the third scratch if the selected scratch data is the dummy scratch data. 5. The data processing apparatus according to claim 3, wherein the data processing apparatus is excluded from data.   Of the first flaw data and the second flaw data, the value of the relative distance of the flaw data that is not integrated as the third flaw data is the one integrated as the third flaw data. 6. The data processing apparatus according to claim 3, further comprising updating means for updating based on the value of the relative distance of scratch data.   The comparison means compares the relative distance of the flaw data next to the flaw data integrated as the third flaw data and the relative distance of the flaw data with the updated value. The data processing apparatus according to claim 6.   The updating means, as the update, from the relative distance value of the scratch data integrated as the third scratch data, the relative distance of the scratch data not integrated as the third scratch data. The data processing apparatus according to claim 6, wherein a value of the value is subtracted.   Adjusting means for adjusting the relative distance of the next flaw data of the flaw data integrated as the third flaw data according to the value of the relative distance of the dummy flaw data excluded from the third flaw data; The data processing apparatus according to claim 1, wherein the data processing apparatus has a data processing apparatus.   The adjustment means, as the adjustment, for the value of the relative distance of the next flaw data after the flaw data integrated as the third flaw data, the dummy flaws excluded from the third flaw data. The data processing apparatus according to claim 9, wherein a value of a relative distance of data is added.   The image processing means for specifying the position of the defective pixel in the image input from the image sensor based on the third flaw data and correcting the defective pixel data. The data processing apparatus according to any one of 1 to 10. Integrating the first and second flaw data, each representing the position of the defective pixel with a finite relative distance between the defective pixels, as third flaw data;
When the third flaw data is dummy flaw data inserted to relay between defective pixels, the relative distance of the dummy flaw data and the relative distance of the third flaw data integrated immediately before And determining whether to integrate the dummy flaw data as the third flaw data, and if not determined to integrate, excluding the dummy flaw data from the third flaw data;
A data processing method for a data processing apparatus, comprising:   The program for functioning a computer as each means of the data processor of any one of Claims 1 thru | or 11.

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