JP2018022525A - 熱容量管理 - Google Patents
熱容量管理 Download PDFInfo
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- JP2018022525A JP2018022525A JP2017205075A JP2017205075A JP2018022525A JP 2018022525 A JP2018022525 A JP 2018022525A JP 2017205075 A JP2017205075 A JP 2017205075A JP 2017205075 A JP2017205075 A JP 2017205075A JP 2018022525 A JP2018022525 A JP 2018022525A
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- Prior art keywords
- temperature
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- cooling capacity
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Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1917—Control of temperature characterised by the use of electric means using digital means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/206—Cooling means comprising thermal management
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20836—Thermal management, e.g. server temperature control
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Abstract
Description
Claims (16)
- データセンター内の冷却能力を管理する方法をコンピュータに実行させるために記憶された命令のシーケンスを含む非一時的なコンピュータ可読記憶媒体であって、前記方法は、
複数の筐体それぞれから筐体の情報を収集し、前記筐体情報は入口温度、最大許容筐体温度、及び給気温度を含み、
前記複数の筐体の積算電力量を収集し、
前記複数の筐体の総冷却能力を収集し、
前記複数の筐体の残余の冷却能力を導出し、
前記複数の筐体それぞれについてθ値を計算し、前記計算されたθ値のそれぞれは、それぞれ収集された前記筐体情報から少なくとも部分的に計算され、そして、
前記計算されたθ値それぞれについて、前記複数の筐体の前記入口温度のいずれかが前記それぞれの最大許容筐体温度以下であるか、最大許容筐体温度であるか、それ以上であるかのうちの少なくとも1つであるかどうかを判定し、
もし前記入口温度のいずれか1つが前記それぞれの最大許容筐体温度であるかそれ以上のうちの少なくとも1つであれば第一のアラームを発し、
前記入口温度のすべてが前記それぞれの最大許容筐体温度以下であれば、前記計算されたθ値の各々がユーザ定義のθ値以下であるか、θ値であるか、それ以上であるかのうちの少なくとも1つであるかどうかを判定し、
もし前記計算されたθ値のいずれか1つが前記ユーザ定義のθ値であるか、それ以上のうちの少なくとも1つであれば第二のアラームを発し、そして、
もし前記計算されたθ値のすべてが前記ユーザ定義のθ値以下であれば
前記複数の筐体すべてに亘って残余の冷却能力を分配する、
ことから成る方法。 - 前記複数の筐体すべてに亘って残余の冷却能力を分配することは、前記複数の筐体すべてに亘って均等に残余の冷却能力を分配することを含む、請求項1記載の非一時的なコンピュータ可読媒体。
- ユーザ定義のθ値は信頼率に相当する、請求項1に記載の非一時的なコンピュータ可読媒体。
- 前記信頼率は、前記複数の筐体すべてに亘っての残余の冷却能力の分配が前記データセンターの予測された状態を満たすであろう信頼レベルに対応する、請求項3に記載の非一時的なコンピュータ可読媒体。
- 前記ユーザ定義のθ値が図2に示すような前記信頼率に対応する、請求項3に記載の非一時的なコンピュータ可読媒体。
- 前記複数の筐体の前記積算電力量を収集するステップは、前記複数の筐体の電源コンセント部を監視することを含む、請求項1に記載の非一時的なコンピュータ可読媒体。
- 前記複数の筐体のそれぞれの前記入口温度を収集するステップは、前記複数の筐体のそれぞれのための少なくとも1つの温度センサを監視することを含む、請求項1に記載の非一時的なコンピュータ可読媒体。
- θの値の各々は、次式を介して計算される、請求項1に記載の非一時的なコンピュータ可読媒体:
Tmax,iは、前記それぞれの入口温度あり、
TSATは、前記それぞれの給気温度であり、及び
TAllowable は、前記それぞれの最大許容筐体温度である。 - データセンター内の冷却能力を管理するためのシステムであって、前記システムは、
少なくとも1つのプロセッサ、及び
前記少なくとも1つのプロセッサに接続された非一時的なコンピュータ可読媒体を備え、前記非一時的なコンピュータ可読媒体は、
複数の筐体それぞれから筐体の情報を収集し、前記筐体情報は入口温度、最大許容筐体温度、及び給気温度を含み、
前記複数の筐体の積算電力量を収集し、
前記複数の筐体の総冷却能力を収集し、
前記複数の筐体の残余の冷却能力を導出し、
前記複数の筐体それぞれについてθ値を計算し、前記計算されたθ値のそれぞれは、それぞれ収集された前記筐体情報から少なくとも部分的に計算され、そして、
前記計算されたθ値のそれぞれについて、前記複数の筐体の前記入口温度のいずれかが前記それぞれの最大許容筐体温度以下であるか、最大許容筐体温度であるか、それ以上であるかのうちの少なくとも1つであるかどうかを判定し、
もし前記入口温度のいずれか1つが前記それぞれの最大許容筐体温度であるかそれ以上のうちの少なくとも1つであれば第一のアラームを発し、
前記入口温度のすべてが前記それぞれの最大許容筐体温度以下であれば、前記計算されたθ値の各々がユーザ定義のθ値以下であるか、θ値であるか、それ以上であるかのうちの少なくとも1つであるかどうかを判定し、
もし前記計算されたθ値のいずれか1つが前記ユーザ定義のθ値であるか、それ以上のうちの少なくとも1つであれば第二のアラームを発し、そして、
もし前記計算されたθ値のすべてが前記ユーザ定義のθ値以下であれば
前記複数の筐体すべてに亘って残余の冷却能力を分配する、
ための命令を含むシステム。 - 前記複数の筐体すべてに亘って残余の冷却能力を分配することは、前記複数の筐体すべてに亘って均等に残余の冷却能力を分配することから成る、請求請求項9に記載のシステム。
- 前記ユーザ定義のθ値が信頼率に対応する、請求項9に記載のシステム。
- 前記信頼率は、前記複数の筐体すべてに亘っての残余の冷却能力の分配が前記データセンターの予測された状態を満たすであろう信頼レベルに対応する、請求項11に記載のシステム。
- 前記ユーザ定義のθ値が図2に示すような前記信頼率に対応する、請求項11に記載のシステム。
- 前記複数の筐体の前記積算電力量の前記収集は、前記複数の筐体それぞれの電源コンセント部を監視することを含む、請求項9に記載のシステム。
- 前記複数の筐体それぞれの前記入口温度の前記収集は、前記複数の筐体それぞれのための少なくとも1つの温度センサを監視することを含む、請求項9に記載のシステム。
- θの値の各々は、次式を介して計算される、請求項9に記載のシステム:
Tmax,iは、前記それぞれの入口温度あり、
TSATは、前記それぞれの給気温度であり、及び
TAllowable は、前記それぞれの最大許容筐体温度である。
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US201361873632P | 2013-09-04 | 2013-09-04 | |
US61/873,632 | 2013-09-04 | ||
US14/474,496 | 2014-09-02 | ||
US14/474,496 US9851726B2 (en) | 2013-09-04 | 2014-09-02 | Thermal capacity management |
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JP2016540323A Division JP6235149B2 (ja) | 2013-09-04 | 2014-09-03 | 熱容量管理 |
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JP2018022525A true JP2018022525A (ja) | 2018-02-08 |
JP6469199B2 JP6469199B2 (ja) | 2019-02-13 |
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JP2017205075A Expired - Fee Related JP6469199B2 (ja) | 2013-09-04 | 2017-10-24 | 熱容量管理 |
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US (2) | US9851726B2 (ja) |
EP (1) | EP3042259B1 (ja) |
JP (2) | JP6235149B2 (ja) |
WO (1) | WO2015034859A1 (ja) |
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US20150066219A1 (en) | 2015-03-05 |
EP3042259B1 (en) | 2020-02-05 |
JP2016532220A (ja) | 2016-10-13 |
WO2015034859A1 (en) | 2015-03-12 |
US9851726B2 (en) | 2017-12-26 |
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US20180088608A1 (en) | 2018-03-29 |
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