JP2018018912A - Method for manufacturing light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a light emitting device which can easily suppress variations in position of a light transmitting member cut from a light emitting element.SOLUTION: The method for manufacturing a light emitting device includes steps of: preparing a sheet-shaped light-transmitting member; mounting a light emitting element on the light-transmitting member; cutting the light-transmitting member by punching to form an intermediate body including the light-emitting element; forming a covering member covering a side face of the intermediate body; and cutting the covering member into individual pieces.SELECTED DRAWING: Figure 3E

Description

  The present invention relates to a method for manufacturing a light emitting device.

  In recent years, light emitting diodes have been used in various forms in the general lighting field, the in-vehicle lighting field, and the like as the quality of the light emitting diodes has improved. For example, Patent Document 1 discloses a light emitting device in which an upper part of an LED die (light emitting element) is covered with a phosphor sheet, and a white reflecting member is provided on the side of the LED die and the phosphor sheet. This light emitting device has an LED die arranged on a large-sized phosphor sheet, and after bonding the large-sized phosphor sheet and the LED die, a blade is left so as to leave a bonded portion between the large-sized phosphor sheet and the LED die and its peripheral portion. Etc. are used to cut out the large-format phosphor sheet.

JP 2014-110333 A

  However, if the LED dies are not regularly arranged in the row and / or column direction on the large-format phosphor sheet, the LED die may not be arranged at the center of the phosphor sheet obtained by cutting. The phosphor sheet is a light-transmitting member that constitutes the light-emitting portion of the light-emitting device. If the position of the phosphor sheet varies, the light distribution characteristics may vary. For example, if the light distribution characteristics vary, luminance unevenness may occur when a backlight or a lighting device is configured using a plurality of light sources. Then, it aims at providing the manufacturing method of the light-emitting device which can suppress the dispersion | variation in the position of a LED die and a fluorescent substance sheet easily.

A method for manufacturing a light emitting device according to an embodiment of the present invention includes:
Preparing a sheet-like translucent member;
Placing a light emitting element on the translucent member;
Cutting the translucent member by punching to form an intermediate including the light emitting element;
Forming a covering member covering a side surface of the intermediate;
Cutting the covering member into individual pieces;
Is provided.

  According to one embodiment of the present invention, it is possible to provide a method of manufacturing a light emitting device that can easily suppress variations in the positions of the light emitting element and the cut light transmitting member.

FIG. 1A is a schematic cross-sectional view illustrating a process of preparing a translucent member according to Embodiment 1. FIG. 1B is a schematic cross-sectional view illustrating Modification 1 of the process of preparing the translucent member according to Embodiment 1. FIG. 1C is a schematic cross-sectional view illustrating Modification 2 of the step of preparing the translucent member according to Embodiment 1. FIG. 2A is a top view illustrating a process of placing the light emitting element on the translucent member according to the first embodiment. 2B is a schematic cross-sectional view taken along line AA in FIG. 2A. FIG. 3A is a schematic top view illustrating a process of forming the intermediate according to the first embodiment. FIG. 3B is a schematic bottom view illustrating the process of forming the intermediate according to the first embodiment. FIG. 3C is a schematic cross-sectional view along the line BB in FIG. 3A. FIG. 3D is a schematic cross-sectional view showing the step of forming the intermediate according to the first embodiment. FIG. 3E is a schematic cross-sectional view showing the step of forming the intermediate according to the first embodiment. FIG. 3F is a schematic cross-sectional view illustrating Modification 1 of the step of forming the intermediate according to Embodiment 1. FIG. 3G is a schematic cross-sectional view illustrating Modification 1 of the step of forming the intermediate according to the first embodiment. FIG. 3H is a schematic cross-sectional view illustrating Modification 2 of the step of forming the intermediate according to Embodiment 1. FIG. 4A is a schematic cross-sectional view showing the step of arranging the intermediate according to the first embodiment. FIG. 4B is a schematic cross-sectional view showing a modification of the step of arranging the intermediate according to the first embodiment. FIG. 5A is a schematic cross-sectional view illustrating a process of forming a covering member that covers the side surface of the intermediate body according to the first embodiment. FIG. 5B is a schematic cross-sectional view illustrating a modification of the step of forming the covering member that covers the side surface of the intermediate body according to the first embodiment. FIG. 5C is a schematic cross-sectional view illustrating a process of removing a part of the covering member according to the first embodiment. FIG. 6A is a schematic top view illustrating a process of cutting and covering the covering member according to the first embodiment. FIG. 6B is a schematic bottom view illustrating a process of cutting and covering the covering member according to the first embodiment. 6C is a schematic cross-sectional view taken along the line CC in FIG. 6A. FIG. 6D is a schematic cross-sectional view illustrating a process of cutting and covering the covering member according to the first embodiment. FIG. 6E is a schematic cross-sectional view illustrating a process of cutting and covering the covering member according to the first embodiment.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the following description, terms indicating specific directions and positions (for example, “upper”, “lower”, and other terms including those terms) are used as necessary. The use of these terms is to facilitate understanding of the invention with reference to the drawings, and the technical scope of the present invention is not limited by the meaning of these terms. Moreover, the part of the same code | symbol which appears in several drawing shows the same part or member.

Embodiment 1
A method for manufacturing a light transmissive member according to Embodiment 1 will be described with reference to FIGS. 1A to 6E.

The manufacturing method of the light-emitting device of Embodiment 1 includes a step of preparing a sheet-like translucent member, a step of placing a light-emitting element on the translucent member, and cutting the translucent member by punching. A step of forming an intermediate including the light emitting element, a step of forming a covering member that covers a side surface of the intermediate, and a step of cutting the covering member into pieces.
Hereinafter, each step will be described in detail.

Step 1. Preparation of sheet-like translucent member As shown in FIGS. 1A to 1C, a sheet-like translucent member 10 is prepared. As shown in FIG. 1A, a translucent resin member 11 can be used as the translucent member 10. As shown in FIG. 1B, the translucent member 10 may contain a wavelength conversion member 12 and / or a light diffusing material 13 in a translucent resin member 11. The wavelength conversion member 12 is a member that converts the wavelength of light having a first peak wavelength emitted from a light emitting element to be described later into light having a second peak wavelength that is different from the first peak wavelength. The wavelength conversion member 12 is, for example, in the form of particles, and may be unevenly distributed on the upper surface side or the lower surface side of the translucent member 10. The light diffusing material 13 is a member that suppresses color unevenness and luminance unevenness in the translucent member 10 by diffusing light from a light emitting element described later in the translucent member 10.

  As shown in FIG. 1C, the translucent member 10 may be formed by laminating a first translucent layer 15 and a second translucent layer 16 different from the first translucent layer. The first light transmissive layer 15 and the second light transmissive layer 16 may each contain a wavelength conversion member and / or a light diffusing material. For the first light-transmitting layer 15 and the second light-transmitting layer 16, a light-transmitting resin member can be used. You may set suitably the number of lamination | stacking of a translucent member.

Step 2. Placement of Light Emitting Elements on Translucent Member As shown in FIGS. 2A and 2B, a plurality of light emitting elements 20 are placed on the translucent member 10. Even when the plurality of light emitting elements 20 are placed on the translucent member 10 at different intervals, the variation in the positions of the light emitting elements and the translucent member cut off can be easily suppressed. The light emitting element 20 includes a semiconductor stacked body 22 on a light transmitting substrate 21 such as a sapphire substrate, and a pair of electrodes 23 and 24 on the upper surface of the semiconductor stacked body 22. Each of the two electrodes 23 and 24 constituting the pair of electrodes can have an arbitrary shape. In this specification, the electrode formation surface 201 of the light emitting element 20 refers to the surface of the light emitting element 20 in a state where the electrodes 23 and 24 are not included. The light-emitting element 20 is positioned between an electrode formation surface 201 having a pair of electrodes, a light extraction surface 202 that is a surface opposite to the electrode formation surface 201, and the electrode formation surface 201 and the light extraction surface 202. Side surface 203. In the present embodiment, the electrode formation surface 201 coincides with the upper surface of the semiconductor stacked body 22, and the light extraction surface 202 coincides with the lower surface of the translucent substrate 21.

  When the light emitting element 20 is placed on the translucent member 10, the upper surface of the translucent member 10 and the light extraction surface 202 are placed facing each other. The light emitting element 20 can be fixed on the translucent member 10 by the translucent bonding member 30.

  The bonding member 30 bonds the light extraction surface 202 of the light emitting element and the translucent member 10. The bonding member 30 may cover only the light extraction surface 202 of the light emitting element, or may cover the light extraction surface 202 of the light emitting element to the side surface 203 of the light emitting element. The bonding member 30 is preferably covered from the light extraction surface 202 of the light emitting element to the side surface 203 of the light emitting element. Since the bonding member 30 covers the side surface 203 of the light emitting element, the adhesive force between the light emitting element and the translucent member can be improved. In the case where the bonding member 30 has a higher light transmittance from the light emitting element than a covering member described later, it is particularly preferable that the bonding member 30 covers the side surfaces of the translucent substrate 21 and the semiconductor stacked body 22. By doing so, it becomes easy to take out light from the light emitting element 20 to the outside of the light emitting element 20 through the bonding member 30.

Step 3. When the translucent member is cut by punching to form an intermediate body including a light emitting element, the upper and lower surfaces of the translucent member 10 and the first upper surface holding member 61 are cut as shown in FIG. 3C. And the first lower surface holding member 62. As shown in FIG. 3A, the first upper surface holding member 61 includes a through hole 611 at a position overlapping with the light emitting element in a top view. As shown in FIG. 3B, the first lower surface holding member 62 includes a through hole 621 at a position overlapping the light emitting element when viewed from the lower surface.

  As shown in FIG. 3D, the translucent member 10 is held by sandwiching the upper surface of the first upper surface holding member 61 and the lower surface of the first lower surface holding member 62 between the first presser 51 and the first lower mold 52. Hold. As shown in FIG. 3E, the translucent member 10 is cut by driving the first upper mold 53 downward while holding the translucent member 10. Thereby, the intermediate body 40 including the translucent member cut by punching, the light emitting element 20, and the bonding member 30 is formed. The intermediate body 40 is placed on the first receiving material 90 by arranging the first receiving material 90 on the lower side of the translucent member 10. Since the periphery of the translucent member 10 cut by punching is held by the first upper surface holding member 61 and the first lower surface holding member 62, the translucent member is prevented from warping. The upper mold 53 makes it easy to cut the translucent member 10.

  The translucent member cut by punching may be referred to as a translucent member piece 17. The cut surface of the translucent member piece 17 is substantially parallel to the direction in which the first upper mold 53 is punched. In addition, the number of light emitting elements included in the intermediate may include not only one but also a plurality of light emitting elements.

  The magnitude | size and thickness of the translucent member piece 17 are not specifically limited, It can adjust suitably. For example, the size of the translucent member piece 17 is about 0.2 mm × 0.2 mm to 5 mm × 5 mm. For example, the thickness of the translucent member piece 17 is about 0.1 mm to 3 mm.

  The size of the first upper mold 53 in the top view is larger than that of the light emitting element 20. By doing in this way, only the translucent member 10 can be cut | disconnected. Further, by cutting the translucent member 10 by punching, the shape of the translucent member piece in a top view becomes substantially similar to the shape of the first upper mold.

  When the light-transmitting member is cut using a blade as in the prior art, if the positions of the light emitting elements placed on the light-transmitting member are not regularly arranged in the row and / or column direction, the cutting is performed. In some cases, the light-emitting element is not arranged at the center of the translucent member piece obtained in this way. If variations occur in the positions of the translucent member piece and the light emitting element, the light distribution characteristics may vary. In addition, if the position of the blade that cuts the light-transmitting member is adjusted by the amount that the position of the light-emitting element on the light-transmitting member is shifted, variation in the positions of the light-transmitting member piece and the light-emitting element can be suppressed. It takes time and effort to adjust the cutting positions on all sides of the optical member piece. For example, if the translucent member piece has a quadrangular shape when viewed from the top, it is necessary to adjust all four sides, which are cut portions, for each light emitting element, which is troublesome. Further, since the four sides are cut, the shape of the translucent member piece is likely to vary.

  By cutting the translucent member by punching as in this embodiment, even if the light emitting elements placed on the translucent member are not regularly arranged in the row and / or column direction, the first upper After adjusting the position of the mold by the amount that the position of the light emitting element on the translucent member is shifted, the translucent member is punched and cut with the first upper mold, so that the translucent member piece and the light emitting element are The position variation can be suppressed. For this reason, since it is only necessary to adjust the position of the first upper mold, it is possible to easily suppress variations in the positions of the translucent member piece and the light emitting element. Moreover, since the outer edge of a translucent member piece can be cut | disconnected at once by punching and cut | disconnecting a translucent member with a 1st upper metal mold | work, work efficiency is good and the variation in the shape of a translucent member piece can be suppressed.

  The position of the light emitting element placed on the translucent member is the surface side of the translucent member on which the light emitting element is placed and / or the face on which the light emitting element of the translucent member is placed. It can be recognized by a camera or the like located on the opposite surface side. When the light-transmitting member has transparency and the light-emitting element can be recognized from the surface opposite to the surface on which the light-emitting element is mounted, the light-emitting element of the light-transmitting member is mounted. You may recognize the position of a light emitting element with the camera etc. which are located in the surface opposite to a surface. Moreover, you may perform separately the process of recognizing the position of a light emitting element, and the process of cut | disconnecting a translucent member by punching and forming the intermediate body containing a light emitting element. For example, a step of recognizing the positions of a plurality of light emitting elements on the translucent member may be performed before the step of forming the intermediate. By doing in this way, since the intermediate body can be formed by punching out the position of the light emitting element recognized in advance by the first upper mold, the working efficiency is improved.

  As shown in FIGS. 3F and 3G, when the translucent member 10 includes the wavelength converting member 12, the translucent member 10 is translucent by punching from the surface 101 side where the wavelength converting member 12 is not unevenly distributed. It is preferable to cut the sex member 10. In other words, it is preferable to cut the translucent member 10 by punching from the surface 101 side opposite to the surface 102 where the wavelength conversion member 12 of the translucent member 10 is unevenly distributed.

  When force is applied to the wavelength conversion member 12, the wavelength conversion member 12 may be damaged, and the particle size of the wavelength conversion member 12 may be reduced. If the particle size of the wavelength conversion member 12 is small, light from the light emitting element is likely to be scattered, and the luminance of the light emitting device may be reduced. By cutting by punching from the surface 101 side of the translucent member 10 where the wavelength conversion member 12 is not unevenly distributed, the resin member 11 acts as a buffer material and the force applied to the wavelength conversion member 12 can be reduced. . Thereby, since the breakage of the wavelength conversion member 12 can be suppressed, it is possible to suppress a decrease in luminance of the light emitting device.

  When the translucent member is formed by laminating a translucent layer containing the wavelength converting member and a translucent layer substantially not containing the wavelength converting member, the wavelength converting member is substantially It is preferable to cut the translucent member by punching from the side of the translucent layer not contained. The light-transmitting layer substantially not containing the wavelength conversion member acts as a buffer material, and the force applied to the wavelength conversion member can be reduced. Thereby, since the breakage of the wavelength conversion member can be suppressed, it is possible to suppress a decrease in the luminance of the light emitting device.

  As the shape of the first upper mold for punching the translucent member, a cylinder or a prism such as a triangular prism and a quadrangular prism can be used. Depending on the shape of the translucent member piece, the shape of the surface through which the translucent member of the first upper mold is punched in a top view is appropriately set. Moreover, the surface which punches out the translucent member of a 1st upper metal mold | die may be flat, and may be provided with the recessed part or the through-hole. If the surface of the first upper mold for punching the translucent member is flat, the area where the first upper mold and the translucent member come into contact increases, so the first upper mold is less likely to wear. If the concave surface or the through hole is provided on the surface of the first upper mold for punching the translucent member, the contact area between the first upper mold and the translucent member is reduced, and the first upper mold is punched. Since the force applied to the translucent member sometimes concentrates, it becomes easy to cut the translucent member. When the first upper mold has a recess or a through-hole, not only the part of the translucent member that contacts the first upper mold, but also the part of the translucent member located in the recess or the through-hole. Can also be punched. Further, the hardness of the first upper mold is higher than the hardness of the translucent member. As a material of the first upper mold, a known material such as a cemented carbide used for punching can be used.

  When the translucent member is punched with the first upper mold, it is preferable that the first upper mold and the light emitting element are separated from each other. By doing so, the force applied to the light-emitting element can be reduced, so that damage to the light-emitting element can be suppressed. The translucent member may be punched with a first upper mold from the surface on which the light emitting element is placed. For example, as shown in FIG. 3H, when the translucent member is punched out from the surface on which the light emitting element is placed with the first upper mold, the light emitting element is placed in the recess provided in the first upper mold. By positioning it, the first upper mold and the light emitting element can be separated. In addition, when the translucent member is punched out from the surface on which the light emitting element is placed with the first upper mold, the light emitting element is positioned in the through hole provided in the first upper mold. The upper mold and the light emitting element can be separated.

Step 4. Prepare support member A support member made of a heat-resistant sheet or the like is prepared.

Step 5. The intermediate body is placed on the support member. The intermediate body is placed on the support member. As shown in FIG. 4A, the electrodes 23 and 24 of the light emitting element may be placed on the support member 70 so as to be in contact with each other. Further, as shown in FIG. 4B, the light transmissive member piece 17 may be placed on the support member 70 so as to be in contact therewith.

Step 6. Forming a covering member covering the side surface of the intermediate body As shown in FIGS. 5A and 5B, a covering member 80 covering the side surface of the intermediate body 40 is formed. That is, the covering member 80 that covers the side surface of the light emitting element 20, the bonding member 30, and the side surface of the translucent member piece 17 is formed. The side surface of the light emitting element 20 may be covered with the covering member 80 via the bonding member 30. Further, a portion of the electrode forming surface 201 of the light emitting element 20 where the electrodes 23 and 24 are not formed may be covered with the covering member 80.

  As shown in FIG. 5A, when the electrodes 23 and 24 of the light emitting element are placed on the support member 70 so as to be in contact with each other, the upper surface of the translucent member piece 17 is exposed from the covering member 80. The thickness (dimension in the z direction) may be adjusted. Moreover, after forming the covering member having a thickness for embedding the upper surface of the translucent member piece, a part of the covering member may be removed to expose the upper surface of the translucent member piece from the covering member.

  When a part of the covering member is removed, a part of the translucent member piece may also be removed. By removing a part of the translucent member piece, the thickness of the light emitting device can be reduced. As shown in FIG. 5C, when the wavelength conversion member is unevenly distributed on the light transmitting member piece, the surface on the side where the wavelength conversion member 12 of the light transmitting member piece 17 located above the Ct-Ct broken line is unevenly distributed. It is preferable to remove the surface 172 side opposite to 171. By doing so, even if the translucent member piece 17 is removed, the change in the amount of the wavelength conversion member 12 contained in the translucent member piece 17 is reduced, so that the color variation of the light emitting device can be suppressed. Moreover, also when removing the translucent member piece which consists of a several layer, it is preferable to remove the layer which does not contain a wavelength conversion member substantially. Even if it does in this way, even if it removes a translucent member piece, since the change of the quantity of the wavelength conversion member contained in the translucent member piece becomes small, the color variation of a light-emitting device can be suppressed. When removing the covering member and / or the translucent member piece, any method known in the art may be used. Examples include etching, cutting, grinding, polishing, blasting and the like.

  As shown in FIG. 5B, when the transparent member piece 17 is placed on the support member 70 so as to be in contact therewith, the thickness of the covering member 80 is such that the electrodes 23 and 24 of the light emitting element are exposed from the covering member 80. (Dimension in the z direction) may be adjusted. Further, after forming the covering member having a thickness for embedding the electrode, a part of the covering member may be removed to expose the electrode. Any method known in the art may be used to remove the covering member. Examples include etching, cutting, grinding, polishing, blasting and the like. Moreover, after exposing the electrode of a light emitting element from a coating | coated member, you may remove a translucent member piece and / or a coating | coated member.

Step 7. Cutting the covering member into pieces to separate the light emitting device into pieces by cutting the covering member. The covering member cut when it is separated into pieces may be referred to as a covering member piece. As a method for cutting the covering member, it is conceivable to cut the covering member positioned in the middle of the adjacent light emitting elements with a dicer or the like, or to cut the covering member by punching. In particular, it is preferable to cut the covering member by punching. By cutting the covering member by punching, even if the positions of the intermediate bodies placed on the support member are not regularly arranged in the row and / or column direction, the position of the intermediate body is displaced. By adjusting only the amount, the positional deviation between the intermediate body and the covering member piece can be easily suppressed. By suppressing the displacement between the intermediate body and the covering member piece, it is possible to suppress the lateral thickness of the covering member piece from being reduced due to the displacement between the intermediate body and the covering member piece. If the thickness of the covering member piece in the lateral direction is reduced, the light of the light emitting element may escape from the thinned portion. However, by suppressing the displacement between the intermediate member and the covering member piece, Light can be prevented from being lost.

  When cutting by punching, as shown in FIG. 6C, the upper and lower surfaces of the covering member 80 are sandwiched between the second upper surface holding member 65 and the second lower surface holding member 66. As shown in FIG. 6A, the second upper surface holding member 65 includes a through hole 651 at a position overlapping the light transmissive member piece 17 in a top view. As shown in FIG. 6B, the second lower surface holding member 66 includes a through hole 661 at a position overlapping the light transmissive member piece 17 when viewed from the lower surface.

  As shown in FIG. 6D, the covering member 80 is held by sandwiching the upper surface of the second upper surface holding member 65 and the lower surface of the second lower surface holding member 66 between the second presser 55 and the second lower mold 56. . As shown in FIG. 6E, the covering member 80 is cut by driving the second upper mold 57 downward while holding the covering member 80. Thereby, the light emitting device 1000 including the covering member cut by punching, the light emitting element 20, the bonding member 30, and the light transmitting member piece 17 is separated into pieces. The light emitting device 1000 is placed on the second receiving material 91 by arranging the second receiving material 91 below the covering member. Since the periphery of the covering member 80 cut by punching is held by the second upper surface holding member 65 and the second lower surface holding member 66, the covering member is prevented from warping. This makes it easier to cut the covering member 80. The cut surface of the covering member is substantially parallel to the direction in which the second upper mold 57 is punched. Moreover, the intermediate body contained in a light-emitting device may contain not only one but a several intermediate body.

  The size of the second upper mold 57 in the top view is larger than that of the intermediate body 40. By doing in this way, only the coating | coated member 80 can be cut | disconnected. Further, by cutting the covering member by punching, the shape of the light emitting device 1000 in a top view becomes substantially similar to the shape of the second upper mold 57. The hardness of the second upper mold is higher than the hardness of the covering member. As a material of the second upper mold, a known material such as a cemented carbide used for punching can be used.

  Hereinafter, materials suitable for each component of the light emitting device of Embodiment 1 will be described.

(Translucent member 10)
As a material of the light transmissive member, a resin member 11 having a light transmissive property can be used. As the material of the resin member 11, a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin, or a thermoplastic resin such as a polycarbonate resin, an acrylic resin, a methylpentene resin, or a polynorbornene resin can be used. . In particular, a silicone resin excellent in light resistance and heat resistance is suitable. Here, the translucency means that the transmittance at the emission peak wavelength of the light emitting element is 60% or more. Further, the transmittance of the resin member is preferably high, and the transmittance at the emission peak wavelength of the light emitting element is more preferably 65% or more, and further preferably 70% or more.

(Wavelength conversion member 12)
The translucent member 10 may contain a wavelength conversion member 12. For the wavelength conversion member 12, particles that can be excited by light emission from the light emitting element are used. For example, phosphors that can be excited by blue light-emitting elements or ultraviolet light-emitting elements include yttrium-aluminum-garnet phosphors (YAG: Ce) activated with cerium, and lutetium-aluminum-garnet-based phosphors activated with cerium. (LAG: Ce), nitrogen-containing calcium aluminosilicate phosphors activated with europium and / or chromium (CaO—Al ₂ O ₃ —SiO ₂ : Eu, Cr), silicate phosphors activated with europium (( Sr, Ba) ₂ SiO ₄ : Eu), β sialon phosphor, CASN phosphor, SCASN phosphor, etc .; fluoride fluorides such as KSF phosphor; sulfide phosphors And chloride-based phosphors, silicate-based phosphors, phosphate-based phosphors, and quantum dot phosphors. By combining these phosphors with a blue light emitting element or an ultraviolet light emitting element, light emitting devices having various wavelengths can be manufactured.

  As the wavelength conversion member 12, a phosphor weak against moisture may be used. Examples of moisture-sensitive phosphors include fluoride-based phosphors, sulfide-based phosphors, chloride-based phosphors, silicate-based phosphors, and phosphate-based phosphors. For example, when a translucent member is cut with a blade as in the prior art, water is often used for the purpose of lowering the heat at the time of cutting or washing away the cutting waste generated at the time of cutting. However, in the case of cutting with water, there is a possibility that a phosphor weak against moisture may deteriorate. When the translucent member is excised by punching, it is not necessary to use water, and therefore a phosphor that is weak against moisture can be used.

(Light diffusing material 13)
The translucent member 10 may contain a light diffusing material 13 for improving luminance unevenness and color unevenness. As a material for the light diffusing material, titanium oxide, zirconium oxide, aluminum oxide, silicon oxide, or the like can be used. In particular, titanium oxide is preferable because it is relatively stable with respect to moisture and has a high refractive index.

(Light emitting element 20)
As the light emitting element, a known semiconductor element composed of a nitride semiconductor or the like can be applied. The emission wavelength of the light-emitting element can be selected from the ultraviolet region to the infrared region including the visible region (380 to 780 nm). For example, a nitride semiconductor can be used as a light emitting element having a peak wavelength of 430 to 490 nm. As the nitride _{semiconductor, In X Al Y Ga 1-} X-Y N (0 ≦ X, 0 ≦ Y, X + Y ≦ 1) , or the like can be used. The light emitting element includes a translucent substrate 21, a semiconductor laminate 22 formed thereon, and electrodes 23 and 24.

(Translucent substrate 21)
For the light-transmitting substrate of the light-emitting element, for example, a light-transmitting insulating material such as sapphire (Al ₂ O ₃ ) or a semiconductor material that transmits light emitted from the semiconductor stacked body (for example, a nitride-based semiconductor material) Can be used.

(Jointing member 30)
The joining member can be made of a translucent resin. As the material of the light-transmitting resin, thermosetting resins such as silicone resins, silicone-modified resins, epoxy resins, and phenol resins are preferable. Since the joining member is in contact with the light emitting element, it is easily affected by the heat generated in the light emitting element during lighting. Thermosetting resins are suitable for bonding members because they are excellent in heat resistance. Note that the bonding member preferably has high transmittance of light from the light emitting element.

(Holding member 60)
As a material of the holding member, metal, resin, or the like can be used. In particular, it is preferable to use a metal as the material of the holding member. This is because metal is less likely to deteriorate than resin and can be used repeatedly.

(Coating member 80)
The covering member can be made of a light reflecting resin. The light-reflective resin means a resin having a high reflectance with respect to light from the light emitting element, for example, a reflectance of 70% or more. As the light-reflective resin, for example, a light-transmissive resin in which a light-reflective substance is dispersed can be used. As the light reflective substance, for example, titanium oxide, aluminum oxide, zirconium oxide, magnesium oxide, or the like can be used. The light-reflective material can be granular, fibrous, thin plate-like, or the like. In particular, a fibrous light-reflective material is preferable because the coefficient of thermal expansion of the covering member can be lowered, for example, the difference in coefficient of thermal expansion from the light emitting element can be reduced. The resin material contained in the light reflective resin is preferably a thermosetting resin such as a silicone resin, a silicone-modified resin, an epoxy resin, or a phenol resin. In particular, a silicone resin excellent in light resistance and heat resistance is suitable.

  As mentioned above, although some embodiment which concerns on this invention was illustrated, this invention is not limited to embodiment mentioned above, It cannot be overemphasized that it can be made arbitrary, unless it deviates from the summary of this invention. .

DESCRIPTION OF SYMBOLS 10 Translucent member 11 Resin member 12 Wavelength conversion member 13 Light diffusing material 15 1st translucent layer 16 2nd translucent layer 17 Translucent member piece 20 Light emitting element 21 Translucent substrate 22 Semiconductor laminated body 23, 24 Electrode 30 Joining member 40 Intermediate 51 First pressing 52 First lower mold 53 First upper mold 55 Second pressing 56 Second lower mold 57 Second upper mold 61 First upper surface holding member 62 First lower surface holding member 65 Second upper surface holding member 66 Second lower surface holding member 611, 621, 651, 661 Through hole 70 Support member 80 Cover member 81 Cover member piece 90 First receiving member 91 Second receiving member 201 Electrode forming surface 202 Light extraction surface

Claims (5)

Preparing a sheet-like translucent member;
Placing a light emitting element on the translucent member;
Cutting the translucent member by punching to form an intermediate including the light emitting element;
Forming a covering member covering a side surface of the intermediate;
Cutting the covering member into individual pieces;
A method for manufacturing a light emitting device.   The manufacturing method of the light-emitting device according to claim 1, wherein in the step of dividing into pieces, the covering member is cut by punching.   The manufacturing method of the light-emitting device according to claim 1, wherein the translucent member contains a wavelength conversion member.   The light-emitting device according to claim 3, wherein in the step of forming the intermediate body, the translucent member is cut by punching from a surface side of the translucent member opposite to a surface on which the wavelength conversion member is unevenly distributed. Manufacturing method.   In the step of forming the intermediate body, the upper surface and the lower surface of the translucent member are sandwiched between the first upper surface holding member and the first lower surface holding member, and the first upper surface holding member and the first lower surface are viewed from above. The method for manufacturing a light-emitting device according to claim 1, wherein the holding member includes a through hole at a position overlapping the light-emitting element.

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