JP2018006736A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively arrange and connect a plurality of electronic components.SOLUTION: An electronic component 1 includes: a first electronic component 10; and a second electronic component 20 laminated for the first electronic component 10. A second electrode layer 12 of the first electronic component 10 is constructed by a plurality of divided electrode layers. A pair of electrodes of the second electronic component 20 is electrically connected to the electrode layers different from each other and included in the plurality of electric layers of the second electrode layer 12, respectively. A first electrode layer 11 of the first electronic component 10 is divided into a plural part in accordance with the electric layer which is included in the second electrode layer 12 and to which the pair of electrodes of the second electronic component 20 is electrically connected.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic component.

  There is a demand for improvement in signal quality for passive components used for electronic component built-in substrates. In this regard, for example, Patent Documents 1 and 2 describe a method for manufacturing a so-called thin film capacitor including a metal film, a dielectric layer, and a metal foil. The thin capacitors as described in Patent Documents 1 and 2 are known to be advantageous in reducing the equivalent series inductance (ESL) that affects the signal quality in the high frequency region as compared with the conventional capacitors. .

JP 2008-34417 A JP 2008-34418 A

  However, with the enhancement of functionality of electronic devices, further improvements are desired in the electronic components used in electronic devices in terms of achieving both higher capacity and improved signal quality in the high frequency region. In addition, as electronic devices become more sophisticated, cases in which a plurality of electronic components such as capacitors are used in combination are increasing. Accordingly, there is a demand for efficient arrangement and connection of these electronic components.

  The present invention has been made in view of the above, and an object thereof is to provide an electronic component capable of efficiently arranging and connecting a plurality of electronic components.

  In order to achieve the above object, an electronic component according to an aspect of the present invention includes a first functional layer, and a first electrode layer and a second electrode layer provided with the first functional layer interposed therebetween. An electronic component, and a second electronic component that is stacked on the first electronic component, and has a second functional part and at least a pair of electrodes provided across the second functional part, The second electrode layer of the first electronic component includes a plurality of divided electrode layers, and the pair of electrodes of the second electronic component are included in the plurality of electrode layers of the second electrode layer. Electrical connection is made to different electrode layers.

  According to the above electronic component, each of the pair of electrodes of the second electronic component is connected to different electrode layers included in the second electrode layer of the first electronic component, so that the two electronic components are A combined electronic component is formed. Therefore, according to said electronic component, it becomes possible to arrange | position and connect a some electronic component efficiently.

  An electronic component according to an aspect of the present invention includes a first electronic component having a dielectric layer, and a first electrode layer and a second electrode layer provided with the dielectric layer interposed therebetween, and the first electronic component. A second electronic component having a dielectric and a pair of electrodes provided across the dielectric, the second electrode layer of the first electronic component being stacked on the electronic component; A plurality of divided electrode layers, and the pair of electrodes of the second electronic component are electrically connected to different electrode layers included in the plurality of electrode layers of the second electrode layer, respectively. The first electrode layer of the first electronic component is divided into a plurality corresponding to an electrode layer included in the second electrode layer and electrically connected to a pair of electrodes of the second electronic component, The capacitance of the second electronic component is larger than the capacitance of the first electronic component, and the first electronic part Equivalent series inductance of the second electronic component than the equivalent series inductance is large.

  In the above-described electronic component, the second electronic component having the capacitance as the electronic component is connected to the first electronic component by stacking and connecting the second electronic component having a larger capacitance than the first electronic component. Therefore, it is possible to easily increase the capacity. In addition, an electrode layer constituting the second electrode layer of the first electronic component having a lower equivalent series inductance than the second electronic component is electrically connected to the pair of electrodes of the second electronic component, and these electrodes It can be connected to an external electronic component or the like through a first metal layer arranged corresponding to the layer and divided into a plurality of parts. The first electronic component has an equivalent series inductance lower than that of the second electronic component. In addition, since the magnetic field when current flows in the first electronic component and the second electronic component is canceled by the direction of current flow, the equivalent series inductance can be reduced. Therefore, according to the electronic component described above, it is possible to achieve both higher capacity and improved signal quality in the high frequency region.

  Here, in the first electrode layer, a part of a region corresponding to the electrode layer included in the second electrode layer and electrically connected to the pair of electrodes of the second electronic component is divided into a plurality of parts. It can be set as the aspect which is.

  As described above, a part of the region corresponding to the electrode layer that is included in the second electrode layer and electrically connected to the pair of electrodes of the second electronic component has a configuration that is divided into a plurality of parts. Since the equivalent series inductance of the electronic component can be further reduced, the signal quality in the high frequency region of the electronic component is further improved.

  Insulation that contacts the first electronic component and the second electronic component in a region different from the region electrically connected between the first electronic component and the second electronic component. It can be set as the aspect by which a property material is provided.

  As described above, the insulating material physically connects the first electronic component and the second electronic component by providing the insulating material between the first electronic component and the second electronic component. Since it becomes a structure, durability of an electronic component improves. Further, by providing the insulating material, the insulation reliability in the electronic component can be improved.

  Also, a conductive material is provided between the pair of electrodes of the second electronic component and the electrode layer included in the second electrode layer and electrically connected to the pair of electrodes of the second electronic component. It can be.

  As described above, when the first electronic component and the second electronic component are electrically connected via the conductive material, the conductive material physically connects the first electronic component and the second electronic component. As a result, the durability of the electronic component is improved.

  According to the present invention, an electronic component capable of efficiently arranging and connecting a plurality of electronic components is provided.

It is a schematic sectional drawing explaining the electronic component which concerns on one form of this invention. It is a figure explaining the manufacturing method of an electronic component. It is a figure explaining the manufacturing method of an electronic component. It is a figure explaining the modification of the manufacturing method of an electronic component. It is a schematic sectional drawing explaining the electronic component which concerns on a modification. It is a schematic sectional drawing explaining the electronic component which concerns on a modification. It is a schematic sectional drawing explaining the electronic component which concerns on a modification.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant description is omitted.

  FIG. 1 is a schematic cross-sectional view illustrating an electronic component according to an embodiment of the present invention. The electronic component 1 shown in FIG. 1 functions as a capacitor that is a kind of passive component that can be used in electronic devices such as communication terminals.

  As shown in FIG. 1, the electronic component 1 includes a first electronic component 10 and a second electronic component 20. The first electronic component 10 and the second electronic component 20 are stacked in the vertical direction in the figure, and are connected by conductive materials 31 and 32 having conductivity.

  The first electronic component 10 includes a pair of electrode layers composed of a first electrode layer 11 and a second electrode layer 12, and a dielectric layer 13 as a first functional layer provided between the pair of electrode layers. It is a thin capacitor. In the present embodiment, the first electronic component 10 is a so-called TFC (Thin Film Capacitor) in which the first electrode layer 11 is made of a metal film and the dielectric layer 13 is made of a dielectric film. explain. The total thickness of the first electronic component 10 is about 5 μm to 650 μm, the thickness of the first electrode layer 11 is about 0.1 μm to 50 μm, and the thickness of the dielectric layer 13 is about 0.05 μm to 100 μm. The thickness of the second electrode layer 12 can be about 0.1 μm to 500 μm.

  The first electrode layer 11 and the second electrode layer 12 are each divided into a plurality. In the example shown in FIG. 1, the first electrode layer 11 is divided into four electrode layers 111 to 114. The second electrode layer 12 is divided into two electrode layers 121 and 122. In addition, the electrode layers 111 and 111 constituting the first electrode layer 11 and the electrode layer 121 constituting the second electrode layer 12 are arranged to face each other with the dielectric layer 13 interposed therebetween, and the electrode layers 111 and 112, The electrode layer 121 and the dielectric layer 13 between these electrode layers function as one capacitor 10A. Similarly, the electrode layers 113 and 114 constituting the first electrode layer 11 and the electrode layer 122 constituting the second electrode layer 12 are arranged to face each other with the dielectric layer 13 interposed therebetween, and the electrode layers 113 and 114 are disposed. The electrode layer 122 and the dielectric layer 13 between these electrode layers function as one capacitor 10B. Thus, the first electrode layer 11 is also divided into a plurality of parts corresponding to the electrode layers 121 and 122 divided into two. Accordingly, it can be said that the first electronic component 10 is integrally formed with capacitors 10A and 10B using one dielectric layer 13.

  The second electrode layer 12 is a layer used for electrical connection with the second electronic component 20. Therefore, how to divide the second electrode layer 12 can be appropriately changed depending on the shape of the electrode of the second electronic component 20 described later.

  As materials of the first electrode layer 11 and the second electrode layer 12 in the first electronic component 10, the main components include nickel (Ni), copper (Cu), aluminum (Al), platinum (Pt), and these metals. A material that is an alloy or an intermetallic compound is preferably used. However, the material of the 1st electrode layer 11 and the 2nd electrode layer 12 will not be specifically limited if it is an electroconductive material. In the present embodiment, a case will be described in which the first electrode layer 11 (electrode layers 111 to 114) has copper as a main component and the second electrode layer 12 (electrode layers 121 and 122) has nickel as a main component. The term “main component” means that the proportion of the component is 50% by mass or more. Moreover, as an aspect of the 1st electrode layer 11 and the 2nd electrode layer 12, the case where it is the laminated structure which consists of 2 or more types is included besides the case where an alloy and an intermetallic compound are formed. For example, the electrode layer may be formed as a two-layer structure in which a Cu thin film is provided on a Ni thin film. Further, when pure Ni is used as the first electrode layer 11 and / or the second electrode layer 12, the purity of the Ni is preferably 99.99% or more. Further, in the case of an alloy containing Ni, metals included as metals other than Ni are platinum (Pt), palladium (Pd), iridium (Ir), rhodium (Rh), ruthenium (Ru), osmium (Os), It is preferable to use at least one selected from the group consisting of rhenium (Re), tungsten (W), chromium (Cr), tantalum (Ta), silver (Ag), and copper (Cu).

The dielectric layer 13 is made of a perovskite-based dielectric material. Here, as the perovskite-based dielectric material in the present embodiment, BaTiO ₃ (barium titanate), (Ba _1-X Sr _X ) TiO ₃ (barium strontium titanate), (Ba _1-X Ca _X ) TiO 3. ₃ , PbTiO ₃ , Pb (Zr _X Ti _1-X ) O _{3 and} other (strong) dielectric materials having a perovskite structure, and composites represented by Pb (Mg _1/3 Nb _2/3 ) O ₃ Perovskite relaxor type ferroelectric materials and the like are included. Here, in the above-described perovskite structure and perovskite relaxor type ferroelectric material, the ratio of A site to B site is usually an integer ratio, but may be intentionally shifted from the integer ratio in order to improve characteristics. In order to control the characteristics of the dielectric layer 13, the dielectric layer 13 may appropriately contain an additive substance as a subcomponent.

  The total thickness of the first electronic component 10 is about 5 μm to 200 μm, the thickness of the first electrode layer 11 and the second electrode layer 12 is about 2 μm to 50 μm, respectively, and the thickness of the dielectric layer 13 is The thickness may be about 1 μm to 100 μm.

  The second electronic component 20 is a capacitor including at least a pair of electrodes and a dielectric layer as a second functional unit provided between at least the pair of electrodes, and is disposed so as to be stacked on the first electronic component 10. Is done. The stacking direction of the first electronic component 10 and the second electronic component 20 is the same as the stacking direction of the first electrode layer 11, the dielectric layer 13, and the second electrode layer 12 constituting the first electronic component 10. . In the present embodiment, the case where the second electronic component 20 has a pair of electrodes will be described, but the number of electrodes may be large.

  In the present embodiment, a case where the second electronic component 20 is an MLCC (Multi-Layer Ceramic Capacitor) will be described. The second electronic component 20 is provided between the pair of connection electrodes 21A and 21B and the pair of connection electrodes 21A and 21B, and is formed into a substantially rectangular parallelepiped shape by stacking and integrating a plurality of plate-shaped ceramic green sheets. And an element body 25 configured. The element body 25 is a pair of end faces 25a, 25b facing the longitudinal direction of the element body 25 and parallel to each other, and a pair of main faces 25c, 25d extending so as to connect the pair of end faces 25a, 25b and facing each other. And a pair of side surfaces (not shown) extending so as to connect the pair of main surfaces 25c, 25d and facing each other. The extending direction of the pair of main surfaces 25 c and 25 d is the same as the extending direction of the first electrode layer 11, the second electrode layer 12, and the dielectric layer 13 of the first electronic component 10. The extending directions of the end faces 25 a and 25 b are the same as the stacking direction of the first electrode layer 11, the second electrode layer 12, and the dielectric layer 13 of the first electronic component 10.

  The connection electrode 21A is formed so as to cover one end surface 25a and a part of each edge of the two main surfaces 25c, 25d orthogonal to the end surface 25a. Further, the connection electrode 21B is formed so as to cover a part of each of the edge portions of the other end surface 25b and the two main surfaces 25c, 25d orthogonal to the end surface 25b. For example, the second electronic component 20 is set to have a length of about 0.2 mm to 2.2 mm, a width of about 0.1 mm to 1.3 mm, and a thickness of about 0.1 mm to 1.3 mm. ing.

  The element body 25 is configured as a laminated body in which a plurality of rectangular plate-like dielectric layers 22 (dielectric: second functional unit), a plurality of internal electrodes 23A, and internal electrodes 23B are stacked. The internal electrodes 23 </ b> A and the internal electrodes 23 </ b> B are arranged one by one along the stacking direction of the dielectric layers 22 in the element body 25. The internal electrode 23A and the internal electrode 23B are disposed to face each other with at least one dielectric layer 22 interposed therebetween. The plurality of dielectric layers 22 are integrated to such an extent that their boundaries cannot be visually recognized. In addition, a dielectric layer 22 is provided outside a region where a plurality of internal electrodes 23A, 23B and dielectric layers 22 are alternately stacked so as to sandwich the region in the stacking direction.

  The internal electrodes 23 </ b> A and 23 </ b> B are made of the same conductive material as the first electrode layer 11 and the second electrode layer 12 in the first electronic component 10. The thickness of the internal electrodes 23A and 23B is, for example, about 1 μm to 5 μm. The shape of the internal electrodes 23A and 23B is not particularly limited as long as the internal electrodes 23A and 23B have a shape that overlaps each other when viewed from the stacking direction, and may be a rectangular shape, for example. The internal electrode 23A is electrically connected to the connection electrode 21A, and the internal electrode 23B is electrically connected to the connection electrode 21B.

  The dielectric layer 22 is made of a perovskite-based dielectric material, like the dielectric layer 13 of the first electronic component 10. The thickness of the dielectric layer 22 is, for example, about 1 μm to 5 μm.

  The connection electrodes 21A and 21B have a U-shaped cross section. The connection electrodes 21 </ b> A and 21 </ b> B have a predetermined temperature after attaching a conductive paste mainly composed of copper (Cu), nickel (Ni), silver (Ag), or palladium (Pd) to the outer surface of the element body 25. It is formed by baking (for example, about 700 ° C.) and further electroplating. For electroplating, copper (Cu), nickel (Ni), tin (Sn), or the like can be used.

  The first electronic component 10 and the second electronic component 20 are electrically connected via conductive materials 31 and 32. The first electronic component 10 and the second electronic component 20 are stacked such that one main surface 25c of the element body 25 of the second electronic component 20 and the second electrode layer 12 of the first electronic component 10 face each other. The The electrode layer 12 </ b> A on one side of the second electrode layer 12 of the first electronic component 10 and the connection electrode 21 </ b> A on one side of the second electronic component 20 are connected via a conductive material 31. Thereby, the pair of electrodes (the internal electrode 23A and the connection electrode 21A, the internal electrode 23B and the connection electrode 21B) constituting the second electronic component 20 are different from each other in the electrode layers 121 of the second electrode layer 12 in the first electronic component 10. , 122 are electrically connected to each other.

  The conductive material 31 includes a lower surface (surface opposite to the dielectric layer 13 side) of the electrode layer 12A constituting the second electrode layer 12 of the first electronic component 10, and an outer surface on the main surface 25c side of the connection electrode 21A. And so as to be connected to each other. In addition, one electrode layer 12 </ b> B of the second electrode layer 12 of the first electronic component 10 and the one connection electrode 21 </ b> B of the second electronic component 20 are connected via a conductive material 32. The conductive material 32 includes a lower surface (surface opposite to the dielectric layer 13 side) of the electrode layer 12B constituting the second electrode layer 12 of the first electronic component 10, and an outer surface on the main surface 25c side of the connection electrode 21B. And so as to be connected to each other.

  The material of the conductive materials 31 and 32 is not particularly limited as long as the material has conductivity. For example, the main component is nickel (Ni), copper (Cu), silver (Ag), gold (Au). , Platinum (Pt), alloys containing these metals, or materials that are intermetallic compounds are preferably used. A solder alloy or the like can also be used. In the electronic component 1 of the present embodiment, the conductive materials 31 and 32 also have a function of physically connecting the first electronic component 10 and the second electronic component 20. Therefore, the conductive materials 31 and 32 are preferably materials whose hardness changes. The solder alloy is also preferably used as the conductive materials 31 and 32 from the above viewpoint. Further, when the cured conductive materials 31 and 32 have a hardness lower than that of the second electrode layer 12 and the connection electrodes 21A and 21B, the deformation of the second electrode layer 12 and the connection electrodes 21A and 21B due to an external force or the like. Or damage etc. can be prevented.

  In the electronic component 1, an insulating material 40 is provided between the conductive materials 31 and 32 and between the first electronic component 10 and the second electronic component 20. The insulating material 40 includes the dielectric layer 13 of the first electronic component 10, the electrode layers 121 and 122 of the second electrode layer 12, the main surface 25c of the element body 25 of the second electronic component 20, the connection electrodes 21A and 21B, and It is provided so as to be in contact with the conductive materials 31 and 32. The material of the insulating material 40 is not particularly limited as long as it is an insulating material. For example, a resin material used as a sealing resin, such as a non-conductive resin (NCP), is preferably used. The insulating material 40 is preferably provided in contact with the first electronic component 10, the second electronic component 20, and the conductive materials 31 and 32. With such a configuration, these members and the insulating material 40 can be physically connected and integrated. In particular, it is preferable that the insulating material 40 is disposed so as to fill a space formed by being surrounded by the first electronic component 10, the second electronic component 20, and the conductive materials 31 and 32. In this case, the state in which the members are integrated by the insulating material 40 can be suitably maintained.

  As described above, the insulating material 40 includes the conductive region on the electrode layer 121, the conductive material 31, and the connection electrode 21A side, and the conductive region on the electrode layer 122, the conductive material 32, and the connection electrode 21B side. The first electronic component 10 and the second electronic component 20 are physically connected together in addition to the function of ensuring the insulation. Therefore, the insulating material 40 is preferably a material that can be integrated with each of the above components by changing the hardness. For example, a thermoplastic resin or a thermosetting resin is preferably used. .

  In the electronic component 1 described above, the electrode layers 111 to 114 constituting the first electrode layer 11 of the first electronic component 10 function as terminal electrodes connected to external electronic components and the like. In addition, the electrode layers 121 and 122 constituting the second electrode layer 12 of the first electronic component 10 are electrically connected to the connection electrodes 21A and 21B of the second electronic component 20.

  The first electronic component 10 and the second electronic component 20 of the electronic component 1 satisfy the relationship that the second electronic component 20 is larger than the first electronic component 10 in terms of capacitance. ESL (Equivalent Series Inductance) also satisfies the relationship that the second electronic component 20 is larger than the first electronic component 10. As a result, the electronic component 1 as a whole can realize a high capacity and a low ESL. This point will be described later.

  Next, a method for manufacturing the electronic component 1 will be described with reference to FIGS. In this embodiment, the procedure for attaching the second electronic component 20 after laminating the layers corresponding to the first electronic component 10 will be described, but the present invention is not limited to this procedure.

  First, as shown in FIG. 2A, a base material 50 for laminating layers corresponding to the first electronic component 10 is prepared. The base material 50 is used as a support member for laminating layers corresponding to the first electronic component 10, and the material is not particularly limited. Next, as shown in FIG. 2B, a metal layer that becomes the first electrode layer 11, a dielectric layer 13, and a metal layer that becomes the second electrode layer 12 are laminated on the base material 50 in this order. Thereafter, as shown in FIG. 2C, processing corresponding to the shape of the second electrode layer 12 of the first electronic component 10 is performed by patterning. As a result, the electrode layers 121 and 122 are formed similarly to the first electronic component 10 shown in FIG. The process of dividing the first electrode layer 11 into a plurality of electrode layers may be performed before the dielectric layer 13 and the second electrode layer 12 are stacked, or may be performed after the second electronic component 20 is attached. Good.

  Next, as illustrated in FIG. 3A, the conductive material 31 is provided over the electrode layer 121 of the second electrode layer 12, and the conductive material 32 is provided over the electrode layer 122. FIG. 3A shows a state in which the conductive materials 31 and 32 are solder alloys and have fluidity. Next, in a state where the conductive materials 31 and 32 have fluidity, the second electronic component 20 is stacked above the conductive materials 31 and 32 as shown in FIG. More specifically, in a state where the main surface 25c on one side of the element body 25 of the second electronic component 20 faces the second electrode layer 12, the connection electrode 21A contacts the conductive material 31, and the connection electrode 21B The second electronic component 20 is brought close to each layer side to be the first electronic component 10 so as to come into contact with the conductive material 32. When the conductive materials 31 and 32 are cured in this state, the second electronic component 20 can be integrated with the stacked body in which the layers that become the first electronic component 10 are stacked by the conductive materials 31 and 32. it can.

  The second electronic component 20 can be manufactured by a known method. The second electronic component 20 is formed by, for example, forming the element body 25 in which the dielectric layers 22 and the internal electrodes 23A and 23B are alternately stacked, and then attaching the connection electrodes 21 and 22B. The general procedure is not particularly limited.

  As shown in FIG. 3C, the second electron is connected to the first electrode layer 11, the dielectric layer 13, and the second electrode layer 12 corresponding to the first electronic component 10 via the conductive materials 31 and 32. After the component 20 is attached, the insulating material 40 is provided between the main surface 25 c and the second electrode layer 12 and the dielectric layer 13. Specifically, a liquid insulating material is impregnated between the main surface 25c and the second electrode layer 12 and the dielectric layer 13, and is cured. Then, while removing the base material 50 and patterning the 1st electrode layer 11 as needed, the electronic component 1 shown in FIG. 1 is obtained.

  In the above description, the method of providing the insulating material 40 after the second electronic component 20 is attached to the first electronic component 10 has been described. However, the insulating material 40 is formed by laminating layers that become the first electronic component 10. The laminated body and the second electronic component 20 may be formed before being integrated. Specifically, as shown in FIG. 4A, an insulating material 40 is provided between the conductive materials 31 and 32. In FIG. 4A, the insulating material 40 has a fluidity. In the example shown in FIG. 4A, an electrode layer (metal layer) different from the electrode layers 121 and 122 is covered with the insulating material 40, but depending on the shape of the second electrode layer 12, FIG. As shown in FIG. 3, the metal layer is not present in the region covered with the insulating material 40. Since the metal layer covered with the insulating material is a layer that does not function as an electrode, it may be removed. In this way, in a state where the conductive materials 31 and 32 and the insulating material 40 have fluidity, the conductive materials 31 and 32 and the insulating material 40 are located above the conductive materials 31 and 32 and the insulating material 40 as shown in FIG. The second electronic component 20 is stacked. Thereafter, the conductive material 31, 32 and the insulating material 40 are cured, so that the stacked body in which the layers to be the first electronic component 10 are stacked and the second electronic component 20 are integrated. In this way, the same state as that shown in FIG. 3C can be obtained.

  Since the electronic component 1 has the configuration described above, it is possible to achieve both higher capacity and improved signal quality in the high frequency region as compared with a conventional thin capacitor.

  The conventional thin capacitor has a structure in which the thickness of the dielectric layer 13 is reduced as in the first electronic component 10. In this case, since the transmission path can be shortened, low ESL can be realized. ESL is an inductance component derived from the internal electrode of the capacitor. The capacitor increases in impedance depending on ESL in a high frequency region. Therefore, it is important to reduce the ESL of the capacitor in order to improve the signal quality in the high frequency region. Thin capacitors are known to be advantageous for low ESL due to their structure.

  However, it is difficult to increase the capacitance of the thin capacitor. In order to increase the capacity of a conventional thin capacitor, it was necessary to improve the dielectric constant of the dielectric layer, to increase the area of the electrode, or to reduce the thickness of the dielectric, but none of them are easy to improve. .

  On the other hand, in the electronic component 1, the second electronic component 20 having a larger capacitance than the first electronic component 10 is stacked and connected to the first electronic component 10, thereby increasing the capacity and reducing the capacity. It is possible to achieve both ESL. Specifically, by adopting a high-capacity electronic component as the second electronic component 20, the capacitance of the electronic component 1 can be covered by the capacitance of the second electronic component 20. Can be easily realized.

  Note that the capacitance of the second electronic component 20 is preferably about several times that of the first electronic component 10. If the capacitance of the second electronic component 20 is too large compared to the first electronic component 10, it is considered that anti-resonance occurs.

  Further, the electrode layers 121 and 122 constituting the second electrode layer 12 of the first electronic component 10 are connected to the connection electrodes 21A and 21B of the second electronic component 20 through the conductive materials 31 and 32, respectively. Capacitors 10A and 10B formed by the first electronic component 10 are arranged so as to sandwich the second electronic component 20, and externally connected via the electrode layers 111 to 114 of the first electrode layer 11 of the first electronic component 10 Connected with electronic components. The first electronic component 10 has a lower ESL than the second electronic component 20. Conventionally, an MLCC such as the second electronic component 20 has been known as a high-capacitance capacitor. However, according to the electronic component 1 having the above-described configuration, an ESL lower than that of the conventional MLCC can be realized.

  In addition, it is preferable that ESL of the 2nd electronic component 20 with respect to ESL of the 1st electronic component 10 is 10 times or more. If it is such a relationship, the effect of low ESL by the structure of the electronic component 1 will improve significantly.

  Moreover, in the electronic component 1, since the first electronic component 10 and the second electronic component 20 are stacked, the current path between the first electronic component 10 and the second electronic component 20 is further shortened. be able to. When connecting a plurality of capacitors, a configuration in which capacitors arranged on a plane are connected by a conductor or the like is common. However, in this case, the current path becomes long, and the ESL becomes high when viewed from the whole connected capacitor. On the other hand, in the electronic component 1, by reducing the current path between the first electronic component 10 and the second electronic component 20, the reduction in ESL of the electronic component 1 as a whole is further promoted. The

  As described above, the electronic component 1 according to the present embodiment can realize higher capacity and lower ESL compared to the conventional thin capacitor, and thus can improve signal quality in a high frequency region. Can be realized.

  In the electronic component 1 of the present embodiment, the electrode layers 111 to 114 constituting the first electrode layer 11 of the first electronic component 10 that functions as a terminal electrode connected to an external electronic component or the like are divided into four. Has been. In order for the first electronic component 10 to function as the two capacitors 10A and 10B, it is only necessary that the two electrode layers are provided to face the electrode layers 121 and 122 of the second electrode layer. On the other hand, in the electronic component 1, the electrode layers 111 and 112 face the electrode layer 121 of the second electrode layer, and the electrode layers 113 and 114 face the electrode layer 122 of the second electrode layer. . By having such a configuration, the electronic component 1 can be further reduced in ESL, and the signal quality in the high frequency region of the electronic component 1 is further improved. In addition, although this embodiment demonstrated the case where the electrode layer was divided | segmented into four (2x2), the division | segmentation number can be changed suitably.

  In the electronic component 1 of the present embodiment, the insulating material 40 is provided between the first electronic component 10 and the second electronic component 20 (and between the conductive materials 31 and 32). By setting it as such a structure, since the insulating material 40 becomes a structure which connects the 1st electronic component 10 and the 2nd electronic component 20 physically, durability of the electronic component 1 improves. Further, the insulating material 40 insulates the conductive region on the electrode layer 121, the conductive material 31, and the connection electrode 21A side from the conductive region on the electrode layer 122, the conductive material 32, and the connection electrode 21B side. Therefore, the insulation reliability is improved.

  In the electronic component 1 of the present embodiment, the first electronic component 10 and the second electronic component 20 are connected by the conductive materials 31 and 32. In this case, since the conductive materials 31 and 32 physically connect the first electronic component 10 and the second electronic component 20, durability as the electronic component 1 is improved. Further, when the conductive materials 31 and 32 have a hardness lower than that of the second electrode layer 12 and the connection electrodes 21A and 21B, the second electrode layer 12 and the connection electrodes 21A and 21B are deformed or damaged by a force received from the outside. Can be prevented. Further, when the first electronic component 10 and the second electronic component 20 are connected via the conductive materials 31 and 32 that are cured by heat or the like, the first electronic component 10 and the second electronic component 10 are cured by the curing of the conductive materials 31 and 32. Since the second electronic component 20 can be suitably supported, the durability and connection reliability of the electronic component 1 are improved.

  5 and 6 show an electronic component according to a modification of the electronic component 1 according to the present embodiment. The electronic component 2 shown in FIG. 5 is not provided with the insulating material 40 as compared with the electronic component 1 shown in FIG. As described above, even when the insulating material 40 is not provided, the electrode layers 121 and 122 constituting the second electrode layer 12 of the first electronic component 10 and the connection electrodes 21A and 21B of the second electronic component 20 Are connected through the conductive materials 31 and 32, so that they are integrated as an electronic component. Therefore, the electronic component 2 can also achieve high capacity and low ESL, so that signal quality in the high frequency region can be improved.

  The electronic component 3 shown in FIG. 6 is not provided with the conductive materials 31 and 32 as compared with the electronic component 1 shown in FIG. That is, the first electronic component 10 and the second electronic component 20 are directly connected. Thus, as a method of directly connecting the electrode layers 121 and 122 of the first electronic component 10 and the connection electrodes 21A and 21B of the second electronic component 20, for example, welding or the like can be mentioned. There is no particular limitation. In the case where the first electronic component 10 and the second electronic component 20 are directly connected as in the electronic component 3, the first electronic component 10 and the second electronic component 20 than the electronic component 1 shown in FIG. The distance between is shortened. That is, the current path in the electronic component 1 can be further shortened. Therefore, a higher effect than that of the electronic component 1 can be obtained from the viewpoint of low ESL. Note that the electronic component 3 can also be configured such that the insulating material 40 is not provided, as with the electronic component 2.

  As mentioned above, although embodiment of this invention has been described, this invention is not necessarily limited to embodiment mentioned above, A various change is possible in the range which does not deviate from the summary.

  For example, in the above-described embodiment, an example in which one second electronic component 20 is connected to one first electronic component 10 has been described, but a plurality of second electronic components 10 are connected to one first electronic component 10. The structure to which the electronic component 20 is connected may be sufficient. In this case, the second electrode layer 12 of the first electronic component 10 may be divided into at least two similarly to the above-described embodiment, or may be divided corresponding to the electrodes of the plurality of second electronic components 20. It may be. Similar to the electronic component 1, the first electrode layer 11 is also divided into the same number or more according to the shape of the division of the second electrode layer 12. When the plurality of second electronic components 20 are combined with the first electronic component 10, it is possible to further improve the capacitance as the electronic component and realize high performance as the electronic component. it can.

  Moreover, although the said embodiment demonstrated the case where the 1st electronic component 10 was TFCP and the 2nd electronic component 20 was MLCC, the 1st electronic component 10 and the 2nd electronic component 20 are said specific kind. It is not limited to a capacitor and can be changed as appropriate. Further, the shape and arrangement of the plurality of electrode layers included in the second electrode layer 12 of the first electronic component 10 can be changed according to the shape and arrangement of the electrode of the second electronic component 20. Further, the shape and arrangement of the plurality of electrode layers included in the first electrode layer 11 can be changed according to the shape and arrangement of the plurality of electrode layers.

(Combination of other electronic components)
In the electronic components 1 to 3, the first electronic component 10 is TFCP and the second electronic component 20 is MLCC. However, the combination of two electronic components constituting the electronic component according to one embodiment of the present invention is not limited to the above. Below, the example of a change of the combination of two electronic components is demonstrated.

Examples of the so-called thin film-like first electronic component included in the electronic component according to one embodiment of the present invention include a configuration of an inductor, a resistor, a fuse, and a capacitor + resistance in addition to the capacitor described in the above embodiment. When the first electronic component is configured as an inductor, the first functional layer sandwiched between the first electrode layer 11 and the second electrode layer 12 is not a dielectric layer but, for example, FeNi (permalloy) or CoTaZr soft magnetic layer Can be used. When the first electronic component is configured as a resistor, the first functional layer sandwiched between the first electrode layer 11 and the second electrode layer 12 is, for example, a Ni—Cr based resistance material such as NiCrTa, TaN, Ta— SiO ₂ or the like can be used. When the first electronic component is configured as a thermistor, the first functional layer sandwiched between the first electrode layer 11 and the second electrode layer 12 is composed of, for example, Mn, Co, Ni, Fe, or the like. A composite compound or the like can be used. When the first electronic component is configured as a fuse, for example, BaTiO ₃ can be used as the first functional layer sandwiched between the first electrode layer 11 and the second electrode layer 12.

  On the other hand, examples of the so-called chip-like second electronic component included in the electronic component according to one embodiment of the present invention include configurations of an inductor, a resistor, and a fuse in addition to the capacitor described in the above embodiment. When the second electronic component is configured as an inductor, resistor, or fuse, the material of the second functional unit sandwiched between at least a pair of metals is used when the first electronic component is configured as an inductor, resistor, or fuse. It is the same as the material used as the first functional layer.

  Note that the combination of the types (configurations) of the first electronic component and the second electronic component in the electronic component according to an embodiment of the present invention is not particularly limited. However, in order for the electronic component to exhibit a desired function, the first electronic component The combination of the component and the second electronic component is limited to a specific one. For example, when the first electronic component is a capacitor, a capacitor (electronic components 1 to 3 described in the above embodiment), an inductor, or a fuse can be combined as the second electronic component. As described in the above embodiment, when the first component is a capacitor and the second component is a capacitor, the electronic component has a function of reducing ESL. Further, when the first component is a capacitor and the second component is an inductor, the electronic component has a function of reducing resistance in the circuit. In addition, when the first component is a capacitor and the second component is a fuse, the electronic component functions as a filter.

  When the first electronic component is an inductor, a capacitor can be combined as the second electronic component. When the first electronic component is an inductor and the second electronic component is a capacitor, the electronic component functions as a filter.

  When the first electronic component is a resistor, a capacitor or a thermistor can be combined as the second electronic component. When the first electronic component is a resistor and the second electronic component is a capacitor, the electronic component has a function of reducing resistance in the circuit. Further, when the first electronic component is a resistor and the second electronic component is a thermistor, the electronic component has a function of adjusting a resistance value according to temperature.

  When the first electronic component is a thermistor, a resistor can be combined as the second electronic component. When the first electronic component is a resistor and the second electronic component is a thermistor, the electronic component has a function of reducing resistance in the circuit.

  When the first electronic component is a fuse, a capacitor can be combined as the second electronic component. When the first electronic component is a fuse and the second electronic component is a capacitor, even if the capacitor is short-circuited by a large current, the capacitor is cut off by the fuse, and safety is ensured.

  Furthermore, when the first electronic component is a capacitor + resistance, a capacitor can be combined as the second electronic component. When the first electronic component is a capacitor + resistor and the second electronic component is a capacitor, this electronic component can achieve a reduction in ESL while adjusting the anti-resonance of the impedance.

  When the first electronic component is a capacitor + resistance, an inductor can be combined as the second electronic component. When the first electronic component is a capacitor + resistor and the second electronic component is an inductor, the resistor functions as a damping resistor.

  As described above, regardless of the combination of the first electronic component and the second electronic component of the electronic component, at least a pair of the second electronic component with respect to different electrode layers included in the second electrode layer of the first electronic component. By connecting each of the electrodes, an electronic component in which two electronic components are combined can be obtained. As a result, when it is required to use a plurality of electronic components in combination, the plurality of electronic components can be efficiently arranged and connected. In recent years, there are cases where it is required to arrange a plurality of electronic components on a substrate or the like in accordance with the enhancement of functions or applications of electronic devices, etc., but if a large number of electronic components are arranged on a substrate, the electronic components are not formed on the substrate. It is conceivable that the ratio of the occupied area increases. On the other hand, when chip-shaped electronic components are stacked vertically on a substrate, it is required to secure a sufficient height for arranging the electronic components, and wiring for the electronic components may be complicated. . On the other hand, like the electronic component of the present embodiment, the first electronic component is combined with the second electronic component as a thin film component including the first electrode layer, the second electrode layer, and the first functional layer, Compared with the conventional arrangement and connection of electronic components, two electronic components can be efficiently arranged and connected.

  In the above-described embodiment, the case where the second electronic component is chip-shaped has been described. However, the second electronic component may be thin-film like the first electronic component. FIG. 7 is a diagram illustrating the electronic component 4 when the second electronic component is in a thin film shape. In the electronic component 4 shown in FIG. 7, the second electronic component 60 includes a pair of electrode layers 61A and 61B and a dielectric layer 62 as a second functional unit. In addition, the electrode layer 61 </ b> A is electrically connected to the electrode layer 121 of the second electrode layer 12 of the first electronic component 10 through the conductive material 31. Similarly, the electrode layer 61B is electrically connected to the electrode layer 122 of the second electrode layers 12 of the first electronic component 10 via the conductive material 32. As described above, when the second electronic component 60 is also configured as a thin film component, it is possible to achieve a further reduction in height as an electronic component. Further, even when both the first electronic component 10 and the second electronic component 60 are configured as thin film components like the electronic component 4, they are integrated by providing the insulating material 40 between them. The maintained state can be suitably maintained.

  1, 2, 3, 4 ... Electronic component, 10 ... First electronic component, 11 ... First electrode layer, 12 ... Second electrode layer, 13 ... Dielectric layer, 20, 60 ... Second electronic component, 21A, 21B Connection electrode, 22 Dielectric layer, 23A, 23B Internal electrode, 111-114, 121, 122 Electrode layer.

Claims (5)

A first electronic component having a first functional layer, and a first electrode layer and a second electrode layer provided across the first functional layer;
A second electronic component that is stacked on the first electronic component and has a second functional part and at least a pair of electrodes provided across the second functional part;
Have
The second electrode layer of the first electronic component is composed of a plurality of divided electrode layers,
The pair of electrodes of the second electronic component is an electronic component that is electrically connected to different electrode layers included in the plurality of electrode layers of the second electrode layer. A first electronic component having a dielectric layer, and a first electrode layer and a second electrode layer provided across the dielectric layer;
A second electronic component laminated on the first electronic component and having a dielectric and a pair of electrodes provided with the dielectric interposed therebetween;
Have
The second electrode layer of the first electronic component is composed of a plurality of divided electrode layers,
The pair of electrodes of the second electronic component are respectively electrically connected to different electrode layers included in the plurality of electrode layers of the second electrode layer,
The first electrode layer of the first electronic component is divided into a plurality corresponding to an electrode layer included in the second electrode layer and electrically connected to a pair of electrodes of the second electronic component,
The capacitance of the second electronic component is larger than the capacitance of the first electronic component,
An electronic component in which an equivalent series inductance of the second electronic component is larger than an equivalent series inductance of the first electronic component.   The part of the region corresponding to the electrode layer included in the second electrode layer and electrically connected to the pair of electrodes of the second electronic component in the first electrode layer is divided into a plurality of parts. 2. The electronic component according to 2.   Insulating material that contacts the first electronic component and the second electronic component in a region that is different from the region that is electrically connected between the first electronic component and the second electronic component The electronic component according to claim 1, wherein the electronic component is provided.   The conductive material is provided between the pair of electrodes of the second electronic component and the electrode layer included in the second electrode layer and electrically connected to the pair of electrodes of the second electronic component. Electronic component as described in any one of -4.

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