JP2018001217A5 - - Google Patents
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Claims (17)
前記レーザ光発生部から出射されたレーザ光を、走査可能な領域である加工領域にて二次元で走査するレーザ光走査部と、
前記レーザ光走査部の加工領域に対応付けられた設定面を表示する表示部と、
前記表示部で表示された設定面上に、加工対象物の加工対象面上でレーザ光により加工される加工パターンを設定する加工パターン設定部と、
前記加工パターン設定部で設定された加工パターンに基づいて、前記加工対象面にてレーザ光が辿る第一軌跡を規定する加工線分データと、前記レーザ光発生部から出射されるレーザ光の出射タイミングを規定する出射タイミングデータとを含む展開データを生成する展開データ生成部と、
レーザ光が外部に出射されない状態で、前記展開データ生成部により生成された展開データに含まれる加工線分データに基づいて前記レーザ光走査部を制御するレーザ光制御部と、
前記レーザ光制御部により制御された前記レーザ光走査部の走査角度を検出する走査角度検出部と、
前記走査角度検出部で検出された前記レーザ光走査部の走査角度と、レーザ光の出射タイミングとに基づいて、実際のレーザ加工時にレーザ光が辿ると想定される第二軌跡を示す軌跡データを生成する軌跡データ生成部と、
前記軌跡データ生成部により生成された軌跡データに基づいて、前記第二軌跡における複数の加工パターンの基準位置を算出する基準位置算出部と、
前記基準位置算出部で算出された複数の加工パターンの基準位置が一定方向に揃うように前記加工線分データを補正する加工線分データ補正部と
を備えるレーザ加工装置。 A laser beam generation unit that generates a laser beam;
A laser beam scanning unit configured to scan the laser beam emitted from the laser beam generation unit in a two-dimensional manner in a processing region which is a scannable region;
A display unit for displaying a setting surface associated with the processing area of the laser beam scanning unit;
A processing pattern setting unit configured to set a processing pattern to be processed by a laser beam on the processing target surface of the processing target on the setting surface displayed by the display unit;
Based on the processing pattern set by the processing pattern setting unit, processing line segment data defining a first locus followed by the laser light on the processing target surface, and emission of laser light emitted from the laser light generation unit A development data generation unit that generates development data including emission timing data that defines timing;
A laser light control unit that controls the laser light scanning unit based on processed line segment data included in the expanded data generated by the expanded data generation unit, in a state where the laser light is not emitted to the outside;
A scanning angle detection unit that detects a scanning angle of the laser light scanning unit controlled by the laser light control unit;
Based on the scanning angle of the laser beam scanning unit detected by the scanning angle detection unit and the emission timing of the laser beam, locus data indicating a second locus assumed to be followed by the laser beam at the time of actual laser processing A trajectory data generation unit to generate;
A reference position calculation unit that calculates reference positions of a plurality of processing patterns in the second trajectory based on the trajectory data generated by the trajectory data generation unit;
And a processing line segment data correction unit configured to correct the processing line segment data such that the reference positions of the plurality of processing patterns calculated by the reference position calculation unit are aligned in a predetermined direction.
前記加工線分データ補正部は、前記複数の加工パターンの基準位置として、各加工パターンの重心位置が一定方向に揃うよう、加工線分データを補正してなるレーザ加工装置。 The laser processing apparatus according to claim 1, wherein
The processing line segment data correction unit corrects the processing line segment data as a reference position of the plurality of processing patterns so that the barycentric positions of the respective processing patterns are aligned in a predetermined direction.
前記加工線分データ補正部は、前記複数の加工パターンの基準位置として、各加工パターンの重心位置が、各加工パターンが並ぶ方向に平行な直線上に揃うよう、加工線分データを補正してなるレーザ加工装置。 The laser processing apparatus according to claim 2, wherein
The processing line segment data correction unit corrects the processing line segment data as a reference position of the plurality of processing patterns so that the barycentric positions of the processing patterns are aligned on a straight line parallel to the direction in which the processing patterns are arranged. Laser processing equipment.
前記加工線分データ補正部は、前記複数の加工パターンの基準位置として、特定の加工パターンの中央を通る直線上に揃うよう、加工線分データを補正してなるレーザ加工装置。 The laser processing apparatus according to any one of claims 1 to 3, wherein
The processing line data correction unit corrects the processing line data so as to align on a straight line passing through the center of a specific processing pattern as a reference position of the plurality of processing patterns.
前記加工線分データ補正部は、前記複数の加工パターンの基準位置として、特定の加工パターンの端縁を通る直線上に揃うよう、加工線分データを補正してなるレーザ加工装置。 The laser processing apparatus according to any one of claims 1 to 3, wherein
The processing line data correction unit corrects the processing line data so as to align on a straight line passing through an edge of a specific processing pattern as a reference position of the plurality of processing patterns.
前記加工線分データ補正部は、前記複数の加工パターンの基準位置として、水平方向に並べられた特定の加工パターンの上端又は下端を通る直線上に揃うよう、加工線分データを補正してなるレーザ加工装置。 The laser processing apparatus according to claim 5, wherein
The processing line segment data correction unit corrects the processing line segment data so as to align on a straight line passing through the upper end or the lower end of a specific processing pattern arranged in the horizontal direction as a reference position of the plurality of processing patterns. Laser processing equipment.
前記加工線分データ補正部は、前記複数の加工パターンの基準位置として、垂直方向に並べられた特定の加工パターンの上端又は下端を通る直線上に揃うよう、加工線分データを補正してなるレーザ加工装置。 The laser processing apparatus according to claim 5, wherein
The processing line segment data correction unit corrects the processing line segment data so as to align on a straight line passing through the upper end or the lower end of the specific processing pattern aligned in the vertical direction as the reference position of the plurality of processing patterns Laser processing equipment.
前記加工線分データ補正部で補正された加工線分データに基づいて、前記表示部に第二軌跡の表示制御を行うレーザ加工装置。 The laser processing apparatus according to any one of claims 1 to 7, wherein
The laser processing apparatus which performs display control of a 2nd locus | trajectory to the said display part based on the processing line segment data correct | amended by the said processing line segment data correction | amendment part.
前記表示部に第二軌跡が表示された状態で、各加工パターンの基準位置が一方向に揃っていない場合に、加工線分データの追加補正を指示する補正指示部を備え、
前記加工線分データ補正部は、前記補正指示部の指示に従って、加工線分データを追加補正するよう構成してなるレーザ加工装置。 The laser processing apparatus according to claim 8, further comprising:
The display unit further includes a correction instruction unit that instructs additional correction of the processed line segment data when the reference position of each processing pattern is not aligned in one direction in a state where the second locus is displayed on the display unit.
The processing line segment data correction unit is configured to additionally correct processing line segment data in accordance with an instruction from the correction instruction section.
前記加工パターン設定部は、複数の加工パターンを含む加工ブロックを設定し、設定面上で加工ブロックを選択する加工ブロック選択部を備え、
前記加工線分データ補正部は、前記加工ブロック選択部で選択された加工ブロックに含まれる加工パターンについて、加工線分データを補正してなるレーザ加工装置。 The laser processing apparatus according to any one of claims 1 to 9, further comprising:
The processing pattern setting unit includes a processing block selection unit that sets a processing block including a plurality of processing patterns and selects a processing block on a setting surface,
The processing line segment data correction unit is a laser processing apparatus in which processing line segment data is corrected for a processing pattern included in a processing block selected by the processing block selection section.
前記軌跡データ生成部で生成された軌跡データに基づいて、前記表示部に第二軌跡の表示制御を行う軌跡表示制御部を備えるレーザ加工装置。 The laser processing apparatus according to any one of claims 1 to 10, further comprising:
A laser processing apparatus comprising: a locus display control unit that performs display control of a second locus on the display unit based on the locus data generated by the locus data generation unit.
前記加工線分データ補正部が、補正した加工線分データの候補群を選択可能に表示させてなるレーザ加工装置。 The laser processing apparatus according to any one of claims 1 to 11, wherein
The laser processing apparatus according to claim 1, wherein the processing line segment data correction unit selectively displays the corrected group of processing line segment data.
前記加工線分データ補正部が、前記基準位置算出部で算出された基準位置が一定方向に揃うように、前記加工線分データを自動的に補正するよう構成してなるレーザ加工装置。 The laser processing apparatus according to any one of claims 1 to 12, wherein
The laser processing apparatus, wherein the processing line segment data correction unit is configured to automatically correct the processing line segment data so that the reference position calculated by the reference position calculation unit is aligned in a predetermined direction.
前記レーザ光走査部の加工領域に対応付けられた設定面を表示する表示部と、
前記表示部で表示された設定面上に、加工対象物の加工対象面上でレーザ光により加工される加工パターンを設定する加工パターン設定部と、
前記加工パターン設定部で設定された加工パターンに基づいて、前記加工対象面にてレーザ光が辿る第一軌跡を規定する加工線分データと、前記レーザ光発生部から出射されるレーザ光の出射タイミングを規定する出射タイミングデータとを含む展開データを生成する展開データ生成部と、
レーザ光が外部に出射されない状態で、前記展開データ生成部により生成された展開データに含まれる加工線分データに基づいて、前記レーザ光制御部により制御されたレーザ光走査部の、前記走査角度検出部で検出された前記レーザ光走査部の走査角度と、レーザ光の出射タイミングとに基づいて、実際のレーザ加工時にレーザ光が辿ると想定される第二軌跡を示す軌跡データを生成する軌跡データ生成部と、
前記軌跡データ生成部により生成された軌跡データに基づいて、前記第二軌跡における複数の加工パターンの基準位置を算出する基準位置算出部と、
前記基準位置算出部で算出された複数の加工パターンの基準位置が一定方向に揃うように前記加工線分データを補正する加工線分データ補正部と
を備えるレーザ加工データ設定装置。 A laser beam scanning unit configured to scan a laser beam generated by a laser beam generation unit with respect to a processing target surface of a processing object disposed in a working region in a two-dimensional manner in a processing region which can be scanned A laser light control unit that controls ON / OFF of the laser light generation unit; and a scanning angle detection unit that detects a scanning angle of the laser light scanning unit controlled by the laser light control unit; A laser processing data setting apparatus for setting processing data based on a desired processing pattern for a laser processing apparatus capable of processing a desired processing pattern by irradiating a laser beam in a scanning unit,
A display unit for displaying a setting surface associated with the processing area of the laser beam scanning unit;
A processing pattern setting unit configured to set a processing pattern to be processed by a laser beam on the processing target surface of the processing target on the setting surface displayed by the display unit;
Based on the processing pattern set by the processing pattern setting unit, processing line segment data defining a first locus followed by the laser light on the processing target surface, and emission of laser light emitted from the laser light generation unit A development data generation unit that generates development data including emission timing data that defines timing;
The scanning angle of the laser light scanning unit controlled by the laser light control unit based on the processed line segment data included in the expanded data generated by the expanded data generation unit in a state where the laser light is not emitted to the outside A locus that generates locus data indicating a second locus assumed to be followed by laser light during actual laser processing based on the scanning angle of the laser light scanning part detected by the detection part and the emission timing of the laser light A data generation unit,
A reference position calculation unit that calculates reference positions of a plurality of processing patterns in the second trajectory based on the trajectory data generated by the trajectory data generation unit;
And a processing line data correction unit configured to correct the processing line segment data such that the reference positions of the plurality of processing patterns calculated by the reference position calculation unit are aligned in a predetermined direction.
前記表示部で表示された設定面上に、加工対象物の加工対象面上でレーザ光により加工される加工パターンを設定する工程と、
前記設定された加工パターンに基づいて、前記加工対象面にてレーザ光が辿る第一軌跡を規定する加工線分データと、前記レーザ光発生部から出射されるレーザ光の出射タイミングを規定する出射タイミングデータとを含む展開データを生成する工程と、
レーザ光を外部に出射させない状態で、前記生成された展開データに含まれる加工線分データに基づいて前記レーザ光走査部を制御し、前記走査角度検出部で前記レーザ光走査部の走査角度を検出し、該検出された走査角度と、レーザ光の出射タイミングとに基づいて、実際のレーザ加工時にレーザ光が辿ると想定される第二軌跡を示す軌跡データを生成する工程と、
前記生成された軌跡データに基づいて、前記第二軌跡における複数の加工パターンの基準位置を算出する工程と、
前記算出された複数の加工パターンの基準位置が一定方向に揃うように前記加工線分データを補正する工程と
を含むレーザ加工装置の設定方法。 A laser beam generation unit for generating a laser beam, a laser beam scanning unit for two-dimensionally scanning a laser beam emitted from the laser beam generation unit in a processing area which is a scannable area, and the laser beam generation unit A laser beam control unit for controlling ON / OFF of the laser beam, a display unit for displaying a setting surface associated with a processing area of the laser beam scanning unit controlled by the laser beam control unit, and It is a setting method of a laser processing apparatus provided with the scanning angle detection part which detects a scanning angle,
Setting a processing pattern to be processed by a laser beam on the processing target surface of the processing object on the setting surface displayed by the display unit;
Based on the set processing pattern, processing line segment data defining the first locus followed by the laser beam on the processing target surface, and emission timing defining the emission timing of the laser beam emitted from the laser light generation unit Generating deployment data including timing data;
The laser beam scanning unit is controlled based on the processed line segment data included in the generated expansion data while the laser beam is not emitted to the outside, and the scanning angle of the laser beam scanning unit is determined by the scanning angle detection unit. Generating locus data indicating a second locus assumed to be traced by the laser beam during actual laser processing based on the detected scanning angle and the emission timing of the laser beam;
Calculating reference positions of a plurality of processing patterns in the second trajectory based on the generated trajectory data;
And correcting the processing line segment data so that the calculated reference positions of the plurality of processing patterns are aligned in a predetermined direction.
前記表示部で表示された設定面上に、加工対象物の加工対象面上でレーザ光により加工される加工パターンを設定する機能と、
前記設定された加工パターンに基づいて、前記加工対象面にてレーザ光が辿る第一軌跡を規定する加工線分データと、前記レーザ光発生部から出射されるレーザ光の出射タイミングを規定する出射タイミングデータとを含む展開データを生成する機能と、
レーザ光を外部に出射させない状態で、前記生成された展開データに含まれる加工線分データに基づいて前記レーザ光走査部を制御し、前記走査角度検出部で前記レーザ光走査部の走査角度を検出し、該検出された走査角度と、レーザ光の出射タイミングとに基づいて、実際のレーザ加工時にレーザ光が辿ると想定される第二軌跡を示す軌跡データを生成する機能と、
前記生成された軌跡データに基づいて、前記第二軌跡における複数の加工パターンの基準位置を算出する機能と、
前記算出された複数の加工パターンの基準位置が一定方向に揃うように前記加工線分データを補正する機能とをコンピュータに実現させるレーザ加工条件設定プログラム。 A laser beam generation unit for generating a laser beam, a laser beam scanning unit for two-dimensionally scanning a laser beam emitted from the laser beam generation unit in a processing area which is a scannable area, and the laser beam generation unit A laser beam control unit for controlling ON / OFF of the laser beam, a display unit for displaying a setting surface associated with a processing area of the laser beam scanning unit controlled by the laser beam control unit, and A laser processing condition setting program comprising: a scanning angle detection unit that detects a scanning angle;
A function of setting a processing pattern to be processed by a laser beam on the processing target surface of the processing object on the setting surface displayed by the display unit;
Based on the set processing pattern, processing line segment data defining the first locus followed by the laser beam on the processing target surface, and emission timing defining the emission timing of the laser beam emitted from the laser light generation unit The ability to generate deployment data including timing data;
The laser beam scanning unit is controlled based on the processed line segment data included in the generated expansion data while the laser beam is not emitted to the outside, and the scanning angle of the laser beam scanning unit is determined by the scanning angle detection unit. A function of generating locus data indicating a second locus assumed to be followed by laser light during actual laser processing based on the detected scanning angle and emission timing of the laser light;
A function of calculating reference positions of a plurality of processing patterns in the second trajectory based on the generated trajectory data;
A laser processing condition setting program which causes a computer to realize a function of correcting the processing line segment data so that the calculated reference positions of the plurality of processing patterns are aligned in a predetermined direction.
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| CN113941784B (en) * | 2021-11-26 | 2022-09-02 | 苏州艾沃意特汽车设备有限公司 | Pipe laser cutting machine and application thereof |
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